201006148 九、發明說明： 【發明所屬之技術領域】 本發明係提供一種光電元件’尤其是指一種光纖通訊 用之光收發元件及具有該光收發元件之雙向光次模組。 【先前技術】 雙向光通訊系統之系統端或使用者端各具有一雙向光 次模組（bidirectional optical subassembly ; B0SA)，各別 ❹經由光纖相互發射及接收光訊號，藉以實現雙向光通訊。 習知雙向光次模組大致包括一傾斜地面對光纖之一端 面的分光片、一經過該分光片接收光纖傳送的光線的檢光 元件、一經過該分光片朝光纖發射雷射光線的雷射元件， 以及一用以固定上述各構件之殼體。 由於上述的雷射元件以及檢光元件皆是各別以一金屬 罐（T0-Can)進行封裝，造成整體雙向光次模組之體積較 大，伴隨之材料成本也較高。因此，如何縮小體積並降低 ®製作成本，成為各業者一重要的開發方向。 此外，在組裝上述雙向光次模組時’需以主動對準 (active alignment)方式，在雷射光線的辅助下，校正分光 片、檢光元件，以及雷射元件等各構件之間的相對位置， 操作繁複且耗時較長，不利大量生產。 【發明内容】 本發明之一目的，在於提供一種光收發元件，可使具 有該光收發元件之光接收次模組具有較小的體積，以及較 低的製作成本，並且不需以主動對準校正各構件之間的相 5 201006148 對位置。 本發明之另-目的，在於提供—種具有上述光收發元 件之雙向光次模組，可有較小的體積，以及較低的製作成 本，並且不需以主動對準校正各構件之間的相對位置。 為達上述目的，本發明提供一種光收發元件，包含一 基座、-檢光晶片、-内蓋、一雷射晶片、一外蓋，以及 一分光片。該檢光晶^置於該基座±。如蓋蓋設於該 ❹基座上並容置該檢光晶片，該内蓋具有一位於該檢光晶片 上方之通孔。該雷射晶片設置於該内蓋上。該外蓋蓋設於 該内蓋上並容置該雷射晶片，該外蓋具有一位於該通孔上 方之透鏡。該分光片設於該内蓋之通孔上方，其中，該檢 光晶片透過該通孔、該分光片及該透鏡接收一第一雷射光 線，該雷射晶片則藉由該分光片之反射朝該透鏡發射一第 一雷射光線。[Technical Field] The present invention provides a photovoltaic element', particularly an optical transceiver component for optical fiber communication and a bidirectional optical sub-module having the optical transceiver component. [Prior Art] The system side or the user end of the two-way optical communication system each have a bidirectional optical subassembly (B0SA), and each of them transmits and receives optical signals via optical fibers to realize two-way optical communication. The conventional bidirectional optical sub-module generally includes a beam splitter that obliquely faces one end face of the optical fiber, a light detecting component that passes the light transmitted by the optical fiber of the splitter, and a laser that emits laser light through the splitter toward the optical fiber. An element, and a housing for fixing the above components. Since the above-mentioned laser element and the light detecting element are each packaged by a metal can (T0-Can), the volume of the overall two-way optical sub-module is large, and the material cost is also high. Therefore, how to reduce the volume and reduce the cost of production has become an important development direction for all players. In addition, when assembling the above-mentioned two-way optical sub-module, the relative alignment between the components such as the beam splitter, the photodetecting element, and the laser element should be corrected by the active alignment method with the aid of the laser light. The location, the operation is complicated and takes a long time, which is unfavorable for mass production. SUMMARY OF THE INVENTION An object of the present invention is to provide an optical transceiver component that can have a light receiving sub-module having the optical transceiver component with a small volume and a low manufacturing cost, and does not require active alignment. Correct the phase between the components 5 201006148 to the position. Another object of the present invention is to provide a bidirectional optical sub-module having the above optical transceiving element, which can have a small volume and a low manufacturing cost, and does not require active alignment to correct between components. relative position. To achieve the above object, the present invention provides an optical transceiver component comprising a susceptor, a illuminating wafer, an inner cover, a laser wafer, an outer cover, and a beam splitter. The photodetecting crystal is placed on the susceptor ±. If the cover is disposed on the susceptor base and accommodates the illuminating wafer, the inner cover has a through hole above the illuminating wafer. The laser wafer is disposed on the inner cover. The cover is disposed on the inner cover and houses the laser wafer, and the outer cover has a lens above the through hole. The beam splitter is disposed above the through hole of the inner cover, wherein the light detecting chip transmits the first laser beam through the through hole, the beam splitter and the lens, and the laser chip is reflected by the beam splitter A first laser beam is emitted toward the lens.
為達上述目的，本發明更提供一種雙向光次模組，光 學連接於-域，該雙向光讀組包含—綠發元件以及 :連接器。該綠發元件包含—基座一檢光晶片…内 2-雷射晶片、一外蓋，以及一分光片。該檢光晶片設 置於该基座上。該内蓋蓋設於該基座上並容置該檢光晶 2且具有—位於該檢光晶片上方之通孔。該雷射晶片設 置於该内蓋上。該外蓋蓋設於該内蓋上並容置該雷射晶 片’且具有-位於該通孔上方之透鏡。該分光片傾斜地設 =該内蓋之通孔上方，其中，該檢光晶片透過該通孔、該 刀光片及该透鏡接收一第一雷射光線，該雷射晶片則藉由 6 201006148 該分光片之反射朝該透鏡發射一第二雷射光線。該連接器 用以固定該光收發元件與該光纖之相對位置，使該光收發 元件之透鏡光學連接於該光纖。 本發明藉由將該分光片設置於該内蓋上，可使該檢光 晶片透過該濾光片、該通孔、該分光片，以及該透鏡而接 收一第一雷射光線，並使該雷射晶片可藉由該分光片之反 射朝該透鏡發射一第二雷射光線，以將檢光晶片及雷射晶 ❹片整合於一封裝之中’並可縮小整體雙向光次模組之體 積。 【實施方式】 有關本發明之技術内容，在以下配合參考圖式之較佳 實施例中，將可清楚地說明： 如第一圖及第二圖所示，本發明之光收發元件之一較 佳實施例，該光收發元件10主要包含一基座11、一設於該 基座丨1上之第一次基座12、一設於該第一次基座12上之檢 光晶片13、一對應蓋設於該基座η之内蓋15、一設於該内 蓋15上之第二次基座16、一設於第二次基座上16之雷射晶 片17、一傾斜地設於該内蓋15上之分光片18、一設於該内 蓋15下方之濾光片19 ’以及一對應蓋設於該内蓋15上之外 蓋20。 該基座11具有一座體110以及複數由該座體110朝該 内蓋15延伸之電極引腳ηι 、112。在本實施例中，該基 座11為一 T046型式之TO基座（TO header)，實際實施時則不 以此限。 7 201006148 第一次基座12設於該基座11上，用以調整該檢光晶片 13位在該基座11上的高度。第一次基座12可為絕緣或導電 材質所製成。 該檢光晶片13藉著該第一次基座12設置於該基座11 上’可接收一第一雷射光線130並將其轉換為一電訊號。 該檢光晶片13可為半導體材質所製成之一 pin二極體檢光 晶片或一 APD二極體檢光晶片。 ❹ 此外，在實際應用時，更會於該基座11上設置一與該 檢光晶片13電連接的一轉阻放大器（Trans-impec[ance amplifier)14，用以放大該檢光晶片13所轉換之電訊號。 該内蓋15與該基座11配合容置該第一次基座12、該檢 光晶片13及該轉阻放大器14，該内蓋15具有一位於該檢光 晶片13上方之通孔15〇，供該檢光晶片13經由該通孔15〇 接收光線。並且，該内蓋15具有複數分別供電極引腳112 穿過之穿孔153。此外，該内蓋15之上表面形成一供該通 β孔150通過的傾斜設置面151 ，以及一由該傾斜設置面 151下緣向上突伸之止擋部m2。 第二次基座16設於該内蓋15上並抵靠於該止檔部152 之一側，用以調整該雷射晶片17位在該内蓋15上的高度。 第二次基座16可為絕緣或導電材質所製成。藉由止擋部 152供第二次基座16抵靠，可增加第二次基座⑺的安裝便 利性。 该雷射晶片17藉著該第二次基座16設置於該内蓋11 上。该雷射晶片17藉由複數條銲線（圖未示）與該些穿過 201006148 穿孔153之電極引腳112電連接。該雷射晶片17可為半導 體材質製成之邊射型雷射，且用以發射一波長不同於第一 雷射光線130之第二雷射光線17〇。 該分光片18設於該傾斜設置面151之通孔15〇上方並 受該止擋部152配合固定。藉此，該分光片18具有分別傾 斜地面對該檢光晶片13及該雷射晶片17的二相反表面。在 本實施例中，該分光片18之二相反表面大致分別以45度傾 ❹斜面對該檢光晶片13及該雷射晶片。該分光片18可為低 通濾光片或高通濾光片，可視第一雷射光線13〇及第二雷 射光線170之波長而定。 該濾光片19大致水平地設於該内蓋15之通孔15〇下 方，並且位於該檢光晶片13與該分光片18之間。該濾光片 19可為帶通濾光片，供該檢光晶片13所接收之第一雷射光 線通過’並過遽掉其他波長之光線。 參 該外蓋20與該内蓋15上配合容置該第二次基座16、該 雷射晶片17及該分光片18 ’該外蓋20具有一位於該通孔 150上方之透鏡21。在本實施例中，該外蓋2〇為一 τ〇46型 式之TO封蓋（TO cap)，實際實施時則不以此限。 藉由上述配置，使該檢光晶片13可依序透過該濾光片 19、該通孔150、該分光片18 ’以及該透鏡21而接收一第 一雷射光線130 ，該雷射晶片17則可藉由該分光片18之反 射朝該透鏡21發射一第二雷射光線170。並且，藉由預先 没計該傾斜設置面151與該止擋部152之位置及傾斜角 度’使該分光片18可輕易地安裝於該内蓋15上的預定位 201006148 置’不需採取以雷射光線輔助之主動對準方式，可簡化操 作步驟且節省操作時間，有利於大量生產。 如第三圖所示，為本發明之雙向光次模組的一較佳實 施例，光學連接於一光纖30，該光纖30之一端具有一套管 5〇，該雙向光次模組包含一上述本發明之光收發元件1〇， 以及一用以固定該光收發元件1〇與該光纖3〇之套管5〇的相 對位置的殼體40，使該光收發元件1〇之透鏡21可穩固地光 ❹學連接於該光纖3〇。其中，該光收發元件1〇之構造已於前 述詳細說明，不於此處重複。 练上所述，本發明藉由將該分光片18設置於該内蓋π 上，可使該檢光晶片13透過該濾光片19、該通孔15()、該 为光片18，以及該透鏡21而接收一第一雷射光線13〇 ,並 使該雷射晶片17可藉由該分光片18之反射朝該透鏡汾發射 一第二雷射光線170 ，以將檢光晶片13及雷射晶片17整合 _於一 TO封裝之中，並可縮小整體雙向光次模組之體積。 並且，藉由該傾斜設置面151與該止擋部152的設 計，不需以主動對準方式來安裴該分光片18，可簡化操作 步驟且節省操作時間，有利於大量生產。 以上所述者僅為本發明之較佳實施例，並非用以限定 本發明之實施範圍。凡依本發明申請專利範圍所作之等效 變化與修飾，皆仍屬本發明專利所涵蓋範圍之内。 【圖式簡單說明】 第一圖為本發明光收發元件之較佳實施例的立體分解 圖； 201006148 第二圖為第一圖之光收發元件的剖視圖. Μ，及 的剖視 第三圖為本發明雙向光次模組之較佳實施 【主要元件符號說明】To achieve the above object, the present invention further provides a bidirectional optical sub-module optically coupled to a domain, the bidirectional optical reading set comprising: a green hair component and a connector. The green hair element comprises a base-lighting wafer, an inner 2-ray wafer, an outer cover, and a beam splitter. The photodetecting wafer is disposed on the susceptor. The inner cover is disposed on the base and houses the light detecting crystal 2 and has a through hole above the light detecting wafer. The laser wafer is placed on the inner cover. The cover is disposed on the inner cover and houses the laser wafer and has a lens located above the through hole. The beam splitter is disposed obliquely above the through hole of the inner cover, wherein the light detecting chip transmits the first laser beam through the through hole, the knife blade and the lens, and the laser chip is provided by 6 201006148 The reflection of the beam splitter emits a second laser beam toward the lens. The connector is configured to fix the relative position of the optical transceiver component to the optical fiber, and optically connect the lens of the optical transceiver component to the optical fiber. According to the present invention, the photodetecting sheet is disposed on the inner cover, and the photodetecting wafer can receive a first laser beam through the filter, the through hole, the beam splitter, and the lens, and the The laser wafer can emit a second laser light to the lens by the reflection of the beam splitter to integrate the light detecting chip and the laser wafer into a package, and can reduce the overall two-way optical sub-module volume. [Embodiment] The technical content of the present invention will be clearly explained in the following preferred embodiments with reference to the following drawings: As shown in the first and second figures, one of the optical transceiver components of the present invention is more In a preferred embodiment, the optical transceiver component 10 mainly includes a susceptor 11 , a first pedestal 12 disposed on the pedestal 丨 1 , and a photodetecting chip 13 disposed on the first sub pedestal 12 . An inner cover 15 disposed on the base η, a second base 16 disposed on the inner cover 15, and a laser wafer 17 disposed on the second base 16 are disposed obliquely The beam splitter 18 on the inner cover 15 , a filter 19 ′ disposed under the inner cover 15 , and a cover 20 correspondingly disposed on the inner cover 15 . The susceptor 11 has a body 110 and a plurality of electrode pins η, 112 extending from the base 110 toward the inner cover 15. In the present embodiment, the base 11 is a TO-type TO header, which is not limited in practice. 7 201006148 The first pedestal 12 is disposed on the pedestal 11 for adjusting the height of the photodetecting wafer 13 on the pedestal 11. The first pedestal 12 can be made of an insulating or electrically conductive material. The illuminating wafer 13 is disposed on the pedestal 11 by the first pedestal 12 to receive a first laser ray 130 and convert it into an electrical signal. The photodetecting wafer 13 can be a pin diode photodetector wafer or an APD diode photodetector wafer made of a semiconductor material. In addition, in a practical application, a trans-impedance amplifier (Trans-impec [ance amplifier] 14 electrically connected to the photodetecting wafer 13 is disposed on the susceptor 11 for amplifying the photodetecting wafer 13 The converted electrical signal. The inner cover 15 and the base 11 cooperate to receive the first sub-base 12, the photodetecting chip 13 and the transimpedance amplifier 14. The inner cover 15 has a through hole 15 located above the photodetecting wafer 13 The light detecting wafer 13 receives light through the through hole 15 . Moreover, the inner cover 15 has a plurality of through holes 153 through which the electrode pins 112 are respectively passed. Further, the upper surface of the inner cover 15 is formed with an inclined setting surface 151 through which the through hole 150 passes, and a stopper portion m2 projecting upward from the lower edge of the inclined setting surface 151. The second base 16 is disposed on the inner cover 15 and abuts against one side of the stop portion 152 for adjusting the height of the laser wafer 17 on the inner cover 15. The second pedestal 16 can be made of an insulating or electrically conductive material. By the stopper portion 152 for the second base 16 to abut, the installation convenience of the second base (7) can be increased. The laser wafer 17 is disposed on the inner cover 11 by the second submount 16. The laser wafer 17 is electrically connected to the electrode pins 112 that pass through the through holes 153 of 201006148 by a plurality of bonding wires (not shown). The laser wafer 17 can be a side-emitting laser made of a semiconductor material and emits a second laser beam 17 of a wavelength different from the first laser beam 130. The beam splitter 18 is disposed above the through hole 15A of the inclined setting surface 151 and is fixed by the stopper portion 152. Thereby, the beam splitter 18 has two opposite surfaces facing the light detecting wafer 13 and the laser wafer 17, respectively. In this embodiment, the opposite surfaces of the beam splitter 18 are substantially obliquely inclined at 45 degrees to face the photodetecting wafer 13 and the laser wafer. The beam splitter 18 can be a low pass filter or a high pass filter, depending on the wavelength of the first laser beam 13 〇 and the second laser ray 170. The filter 19 is disposed substantially horizontally below the through hole 15 of the inner cover 15 and between the photodetecting wafer 13 and the beam splitter 18. The filter 19 can be a band pass filter for the first laser light received by the photodetecting wafer 13 to pass through and scatter light of other wavelengths. The outer cover 20 and the inner cover 15 cooperate to receive the second sub-base 16, the laser wafer 17 and the beam splitter 18'. The outer cover 20 has a lens 21 above the through hole 150. In the present embodiment, the outer cover 2 is a TO cap of the type τ〇46, which is not limited in practice. With the above configuration, the light detecting chip 13 can sequentially receive the first laser beam 130 through the filter 19, the through hole 150, the beam splitter 18' and the lens 21, and the laser wafer 17 is received. A second laser beam 170 can be emitted toward the lens 21 by the reflection of the beam splitter 18. Moreover, by pre-empting the position and inclination angle of the inclined setting surface 151 and the stopping portion 152, the beam splitter 18 can be easily mounted on the inner cover 15 at a predetermined position 201006148. The light-assisted active alignment method simplifies the operation steps and saves operation time, which is beneficial to mass production. As shown in the third figure, a preferred embodiment of the bidirectional optical sub-module of the present invention is optically coupled to an optical fiber 30. One end of the optical fiber 30 has a sleeve 5〇, and the bidirectional optical submodule includes a The optical transceiver component 1 of the present invention, and a housing 40 for fixing the relative position of the optical transceiver component 1 and the sleeve 5 of the optical fiber 3, so that the lens 21 of the optical transceiver component 1 can be A stable optical connection is connected to the fiber. Here, the configuration of the optical transceiver element 1 is described in detail above and will not be repeated here. As described above, the present invention allows the photodetecting wafer 13 to pass through the filter 19, the through hole 15 (), the optical sheet 18, and the light collecting sheet 18 on the inner cover π. The lens 21 receives a first laser beam 13 〇, and the laser wafer 17 can emit a second laser beam 170 toward the lens 藉 by the reflection of the beam splitter 18 to The laser wafer 17 is integrated into a TO package and can reduce the volume of the overall two-way optical sub-module. Moreover, by the design of the inclined setting surface 151 and the stopper portion 152, the beam splitter 18 is not required to be mounted in an active alignment manner, which simplifies the operation steps and saves operation time, and is advantageous for mass production. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Equivalent changes and modifications made in accordance with the scope of the present invention remain within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective view of a preferred embodiment of an optical transceiver component of the present invention; 201006148 The second diagram is a cross-sectional view of the optical transceiver component of the first diagram. The preferred implementation of the bidirectional optical sub-module of the present invention [main component symbol description]
10光收發元件 110座體 112電極引腳 13檢光晶片 14轉阻放大器 150通孔 152止擋部 16第二次基座 170第二雷射光線 19濾光片 21透鏡 40殼體 11基座 111電極引腳 12第一次基座 130第一雷射光線 15内蓋 151傾斜設置面 153穿孔 Π雷射晶片 18分光片 20外蓋 30光纖 50套管10 optical transceiver component 110 body 112 electrode pin 13 optical inspection wafer 14 transimpedance amplifier 150 through hole 152 stop portion 16 second pedestal 170 second laser ray 19 filter 21 lens 40 housing 11 pedestal 111 electrode lead 12 first base 130 first laser light 15 inner cover 151 inclined setting surface 153 perforated laser wafer 18 beam splitter 20 cover 30 fiber 50 sleeve