TW201004764A - Break tool - Google Patents

Break tool Download PDF

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Publication number
TW201004764A
TW201004764A TW97128897A TW97128897A TW201004764A TW 201004764 A TW201004764 A TW 201004764A TW 97128897 A TW97128897 A TW 97128897A TW 97128897 A TW97128897 A TW 97128897A TW 201004764 A TW201004764 A TW 201004764A
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TW
Taiwan
Prior art keywords
splitting
splitting device
head
passage
width
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TW97128897A
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Chinese (zh)
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TWI346035B (en
Inventor
Hung-Lin Tsai
Pao-Lang Lee
Chiang-Ming Chen
Liang-Jui Chang
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Au Optronics Corp
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Priority to TW097128897A priority Critical patent/TWI346035B/en
Publication of TW201004764A publication Critical patent/TW201004764A/en
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Publication of TWI346035B publication Critical patent/TWI346035B/en

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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The break device includes a linking component and a presser. The presser is a pillar and the presser has a channel through the pillar. The channel is along the longitudinal of the presser. At least a part of the linking component is inside the channel. The bottom of the pillar is gradually narrowed into a strip-shape contact area. By pushing the scribe line with the presser, the abandoning material can be cut smoothly.

Description

201004764 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種裂片裝置與裂片治具,特別是指 應用於切割後具切割痕的基板的一種裂片裝置與裂片治 具。 【先前技術】 I 在玻璃基板的製作過程中,先用切割刀於基板留下切 參 割痕,再透過一裂片治具以裂片分離基板上的廢材,以得 到符合不同設計規格大小的玻璃基板。習知的點狀裂片治 具,如第1圖所示,藉由點狀推擠具(point pusher) 1來推擠 玻璃基板300的廢材。裂片時,由於玻璃基板300上的受 力面積為點狀,因此會造成在玻璃基板300受到點狀推擠 具1推擠時應力分佈不均的問題,而且因玻璃基板300本 身的材料彈性,使得點狀受力面積的週圍產生撓曲變形, 讓廢材無法完全分離,甚至影響到欲保留的目標正片,導 致玻璃基板300會有碎裂(chipping)的情形。因此,基板的 裁切製程中,常因裂片治具的點狀推擠具推擠的應力分佈 不均,造成玻璃基板碎裂的問題,而無法達成完美製程要 求。 【發明内容】 有鑑於此,本發明係提出一種裂片裝置與裂片治具來 分離基板上的廢材,應用於切割後具有切割痕的任何種類 201004764 的基板,如玻璃基板、印刷電路板、雙層接合的玻璃基板 、等。本發明主要係利用裂片裝置來活動調整其裂片壓頭的 位置,藉由馬達裝置平行推進各個連接件,均勻施力於裂 片屋頭’以裂片壓頭下方的接觸平面推擠切割痕,以達到 平整地裁切廢材之目的。 本發明之裂片裝置係由連接件及裂片壓頭所組成。裂 片壓頭係為長柱體,且裂片壓頭具有貫穿長柱體之通道, φ 通道係平行裂片壓頭之長軸,且至少部分的連接件位於通 道中,並且長柱體底部係逐漸内縮為呈條狀的接觸平面。 本發明之裂片治具包含兩個裂片裝置。每一裂片裝置包含 連接件與裂片壓頭。裂片壓頭係為一長柱體,且具有貫穿 長柱體之通道,通道係平行裂片壓頭之長軸,且至少部分 的連接件位於通道中,並且長柱體底部係逐漸内縮為呈條 狀的一接觸平面 藉由本發明之技術,可將推擠下壓的應力,均勻的分 ❸ 布在切割痕,達到穩定裂片的要求,並且可降低如以習知 的點狀裂片治具裂片時,所造成的裂片應力不均導致廢材 無法斷開,或導致廢材碎裂而影響到欲裁切的目標正片的 缺失。 【實施方式】 本發明之裂片裝置與裂片治具,應用於切割後具有切 割痕的任何種類的基板,如玻璃基板、印刷電路板(pcB)、 雙層接合的玻璃基板等,來分離基板上的一廢材。本發明 201004764 並不限制用於何種基板,以達到裁切基板的廢材之目的。 為使本發明更淺顯易懂,以下將以應用本發明技術之較佳 實施例,配合圖式範例予以詳細說明。此圖式及詳細說明 並非用以限定本發明所揭露之技術及各種更動與潤飾。 第2圖係為本發明之裂片裝置之一實施例示意圖。如 圖所示,本發明之裂片裝置10係由連接件100及裂片壓頭 200所組成。裂片壓頭200為長柱體,此長柱體底部逐漸内 縮為呈條狀的接觸平面240。換言之,長柱體底部係為楔形 凸起210,楔形凸起210的底面為接觸平面240。裂片壓頭 200中平行長轴201的方向,設有一通道220。裂片壓頭200 頂面可具有一槽狀開口 230。槽狀開口 230與通道220可彼 此連通。 連接件100可包含短柱110、圓形連桿130以及底座 140。圓形連桿130位於短柱110下方。底座140係固接至 圓形連桿130。連接件100之一端係可連接於馬達裝置(未 圖示),而連接件1〇〇另一端的底座140可活動套入裂片壓 頭200的通道220中,能自由滑行於通道220内,並使連 接件100之圓形連桿130通過槽狀開口 230,以供調整連接 件100於裂片壓頭200上的適當位置。藉此,可由馬達裝 置推進連接件100,以施力於裂片壓頭200,以裂片壓頭200 之楔形凸起210推擠對應的切割痕,而使廢材與欲保留的 目標正片分離。 配合參照第3A圖與第3B圖,係為本發明之裂片裝置 的連接件之組成構件示意圖。如第3A圖與第3B圖所示, 201004764 本發明之裂片裝置之連接件1 〇〇,係由短柱11 ο、調整螺絲 120、圓形連桿130、及底座140所組成。短柱110外表面 上可具有外螺紋1Η ’且調整螺絲120亦可具有與外螺紋 111契合之螺紋121,以供旋轉調整螺絲12〇於短柱11()上 的位置(如第3C圖所示),可提供調整連接件ι〇〇接於馬達 裝置上的高低位差,來調整裂片裝置相距基板的位置。短 柱110下方設有圓形連桿130以插置於底座140。圓形連桿 φ 130可分別藉由其上端的螺紋131螺合鎖固於短柱11〇下方 的短柱凹孔112的内螺紋113中,並可藉由圓形連桿130 下端的螺紋132螺合鎖固於底座14〇上的底座凹孔141的 螺紋142中,以使短柱11〇、圓形連桿13〇與底座14〇三者 結合成一體。連接件1〇〇的設計在此僅是舉例,相關技藝 人士亦可依實際需求,調整其結構、形狀與尺度。 另外,參照第3C圖,欲裂片之基板5〇〇具有一切割痕, 切割痕長度係為L。斜線部份表示欲分離之廢材。在較佳實 _ 施例中,本發明之裂片壓頭2〇〇的長度Α至少為基板500 上之切割痕長度L的三分之一;裂片壓頭2〇〇的頂面寬度 ΒΛ於或等於基板500的廢材寬度l,;裂片壓頭200的楔 形凸起210底面的接觸平面24〇的寬度b,小於裂片壓頭 200的頂面寬度B的二分之一;裂片壓頭2〇〇的高度c至 少為基板500厚度Η的十倍。切割痕的數目與位置,在此 僅是舉例’相關技藝人士可依實際情況對應調整裂片裝置 的位置、高度、分布與比例。 201004764 第4A圖至第4D圖係為本發明之裂片裝置之其他實施 例示意圖。如圖所示,根據本發明之裂片裝置,可將連接 件100的底座分別設計成平板底座140a、三角柱底座 140b、半圓柱底座140c或梯形柱底座140d,並於裂片壓頭 200中分別設置相對應的矩形通道220a、三角形通道 220b、半圓形通道220c或梯形通道220d。連接件100的平 板狀底座140a可自由滑行於裂片壓頭200的矩形通道220a 中,以供調整連接件100於裂片壓頭200上的適當位置, 其餘形狀底座之概念相近,可以此類推。可由馬達裝置(未 圖示)推進連接件1〇〇,以施力於裂片壓頭200,以裂片壓 頭200之楔形凸起210推擠切割痕,而使廢材與欲保留的 目標正片分離。另外,底座與通道的形狀與比例不限於此, 亦可依實際需求調整變化。 參照第2圖與第4A圖至第4D圖,而槽狀開口 230的 寬度可大於或等於連接件100的圓形連桿130直徑,以供 圓形連桿130能通過槽狀開口 230,而槽狀開口 230的寬度 可小於通道220之頂面寬度,以使連接件100之底座140、 140a、140b、140c、140d 能於通道 220、220a' 220b、220c、 220d内調整移動而不至脫落。惟本發明不限於此,亦可依 實際需求調整其設計。另外,本發明之連接件1〇〇的材質 可包含硬質金屬或其合金,例如:短柱、圓形連桿或底座 可為不鏽鋼材質。裂片壓頭200的材質可包含高分子聚合 物材質,如聚氯乙烯(PVC)、聚氨基甲酸酯(PU)、聚對苯二 201004764 甲酸乙二酵醋(PET)、聚碳酸酯(pc)或其組合。但本發明不 限於此’相關技藝人士亦可依實際需求調整材料。 第5圖與第6圖係為應用本發明之裂片治具之裂片示 意圖。本發明之裂片治具6〇〇包含至少一裂片裝置ι〇β如 第5圖所示,裂片治具6〇〇具有複數個裂片裝置1〇,以裂 片壓頭200下方的楔形凸起210的底面,接觸於待裁切的 下方基板500。由於楔形凸起210與下方的基板5〇〇的接觸 ❹ 面積遠大於點狀裂片治具(如第1圖)的接觸面積,可提供均 勻分佈的裂片力量’且裂片壓頭200可沿長軸方向排列成 一串,裂片裝置10可分別沿長轴軸向調整位置,使裂片治 具更具有彈性與方便性,也可因應基板尺寸與切割痕長度 做調整。第6圖所示之裂片治具600可將複數個裂片裝置 10如著裂片壓頭200的長軸201方向(如第2圖所示)平行 排列成至少兩串,以提供均勻分佈的力量推擠下方的廢材 與增加調整彈性。如此,當馬達裝置平行推進各個連接件 φ 1〇〇以進行裁切時,可透過施力於本發明的裂片壓頭200, 以均勻的力量推擠下方的切割痕,達到平整地裁切廢材之 目的。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作各種之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 201004764 第1圖係為習知的點狀裂片治具之裂片示意圖。 第2圖係為本發明之裂片裝置之一實施例示意圖。 第3A圖與第3B圖係為本發明之裂片裝置的連接件之 組成構件示意圖。 第3C圖係為本發明之裂片裝置之組成構件示意囷。 第4A圖至第4D圖係為本發明之裂片裝置之另一實施 例示意圖。 ❹ 第5圖係為應用本發明之裂片治具之裂片示意圖。 第6圖係為應用本發明之另一裂片治具之裂片示意圖。 【主要元件符號說明】 1 :點狀推擠具 201 :長軸 10 :裂片裝置 210 :楔形凸起 100 :連接件 220、220a、220b、220c 110 :短柱 220d :通道 111 :外螺紋 230 :槽狀開口 112 :短柱凹孔 240 :接觸平面 113 :内螺紋 300 :玻璃基板 120 :調整螺絲 500 :基板 121 :螺紋. 600 :裂片治具 130 :圓形連桿 A:裂片壓頭的長度 131、132 :螺紋 B:裂片壓頭的頂面寬度 140 ' 140a、140b ' 140c ' B’ :接觸平面的寬度 140d :底座 C:裂片壓頭的高度 201004764 141 : 底座凹孔 Η : 142 : 螺紋 L : 200 : 裂片壓頭 L’ 基板厚度 切割痕長度 :基板廢材的寬度 參201004764 IX. Description of the Invention: [Technical Field] The present invention relates to a splitting device and a splitting jig, and more particularly to a splitting device and a splitting tool for a substrate having a cut mark after cutting. [Prior Art] I In the process of fabricating a glass substrate, a cutting blade is used to leave a cut mark on the substrate, and a waste material on the substrate is separated by a splitting piece through a splitting jig to obtain a glass substrate conforming to different design specifications. . A conventional point-like splitting tool, as shown in Fig. 1, pushes the waste material of the glass substrate 300 by a point pusher 1. In the case of the lobes, since the force receiving area on the glass substrate 300 is a dot shape, there is a problem that the glass substrate 300 is unevenly distributed when the dot substrate pusher 1 is pushed, and the material elasticity of the glass substrate 300 itself is caused. The flexural deformation is caused around the point-like force-receiving area, so that the waste material cannot be completely separated, and even the target positive film to be retained is affected, resulting in a chipping of the glass substrate 300. Therefore, in the cutting process of the substrate, the uneven stress distribution pushed by the spot-shaped pusher of the split jig often causes the problem of chipping of the glass substrate, and the perfect process requirement cannot be achieved. SUMMARY OF THE INVENTION In view of the above, the present invention provides a splitting device and a splitting jig for separating waste materials on a substrate, and applying to any type of 201004764 substrate having a cut mark after cutting, such as a glass substrate, a printed circuit board, and a double Layer bonded glass substrate, etc. The invention mainly utilizes a splitting device to adjust the position of the splitting head of the flap, and the respective connecting members are pushed in parallel by the motor device, and the force is applied to the splitting head to push the cutting mark with the contact plane below the splitting head to achieve the The purpose of cutting waste materials flatly. The splitting device of the present invention consists of a connector and a splitting head. The splitting head is a long cylinder, and the splitting head has a passage through the long cylinder, the φ passage is a long axis of the parallel splitting indenter, and at least a part of the connecting piece is located in the passage, and the bottom of the long cylinder is gradually Shrink into a strip-shaped contact plane. The splitter fixture of the present invention comprises two splitting devices. Each split device includes a connector and a splitting head. The splitting head is a long cylinder and has a passage through the long cylinder, the passage is parallel to the long axis of the splitting head, and at least part of the connecting member is located in the passage, and the bottom of the long cylinder is gradually retracted to The strip-shaped contact plane can be used to push the pressed stress, the uniform splitting on the cutting mark, to achieve the requirement of stabilizing the splitting piece, and can reduce the lobes of the point-like splitting device. When the uneven stress of the splitting is caused, the waste material cannot be broken, or the waste material is broken and the missing of the target positive film to be cut is affected. [Embodiment] The splitting device and the splitting jig of the present invention are applied to any type of substrate having a cut mark after cutting, such as a glass substrate, a printed circuit board (pcB), a double-layer bonded glass substrate, or the like, to separate the substrate. a waste material. The present invention 201004764 does not limit which substrate is used for the purpose of cutting the waste material of the substrate. In order to make the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. This drawing and the detailed description are not intended to limit the technology and various changes and modifications disclosed herein. Figure 2 is a schematic view of one embodiment of the splitting device of the present invention. As shown, the splitting device 10 of the present invention is comprised of a connector 100 and a splitting ram 200. The split ram 200 is a long cylinder whose bottom portion is gradually retracted into a strip-shaped contact plane 240. In other words, the bottom of the long cylinder is a wedge-shaped projection 210, and the bottom surface of the wedge-shaped projection 210 is a contact plane 240. In the direction of the parallel long axis 201 in the split ram 200, a passage 220 is provided. The top surface of the split ram 200 can have a slotted opening 230. The slotted opening 230 and the channel 220 can be in communication with each other. The connector 100 can include a stub 110, a circular link 130, and a base 140. The circular link 130 is located below the stub 110. The base 140 is secured to the circular link 130. One end of the connecting member 100 can be connected to a motor device (not shown), and the base 140 at the other end of the connecting member 1 can be movably inserted into the channel 220 of the splitting ram 200, and can slide freely in the channel 220, and The circular link 130 of the connector 100 is passed through the slotted opening 230 for adjusting the position of the connector 100 on the splitter ram 200. Thereby, the connecting member 100 can be advanced by the motor means to apply force to the splitting ram 200, and the wedge-shaped projection 210 of the splitting ram 200 pushes the corresponding cutting mark to separate the waste material from the target positive piece to be retained. Referring to Figures 3A and 3B, it is a schematic diagram of the components of the connector of the splitting device of the present invention. As shown in Figs. 3A and 3B, 201004764, the connector 1 of the splitting device of the present invention is composed of a short post 11, a adjusting screw 120, a circular link 130, and a base 140. The outer surface of the short post 110 may have an external thread 1 ′′ and the adjusting screw 120 may have a thread 121 matching the external thread 111 for rotating the adjusting screw 12 to the position of the short stud 11 ( ) as shown in FIG. 3C Illustrated), the height difference between the connecting piece and the motor device can be adjusted to adjust the position of the splitting device from the substrate. A circular link 130 is disposed below the stub 110 to be inserted into the base 140. The circular connecting rod φ 130 can be screwed into the internal thread 113 of the short cylindrical recess 112 below the short post 11〇 by the thread 131 of the upper end thereof, and can be threaded by the lower end of the circular connecting rod 130. The screw is locked in the thread 142 of the base recess 141 of the base 14 , so that the short post 11〇, the circular link 13 〇 and the base 14 结合 are integrated into one body. The design of the connecting member 1 is merely an example here, and the related art can adjust the structure, shape and scale according to actual needs. Further, referring to Fig. 3C, the substrate 5〇〇 to be split has a cut mark, and the length of the cut mark is L. The slashed part indicates the waste material to be separated. In a preferred embodiment, the length Α of the splitting ram 2 of the present invention is at least one third of the length L of the cutting mark on the substrate 500; the top width of the splitting head 2 is less than or Equal to the waste material width l of the substrate 500; the width b of the contact plane 24〇 of the bottom surface of the wedge-shaped protrusion 210 of the splitting head 200 is less than one-half of the top surface width B of the splitting head 200; the splitting head 2〇 The height c of the crucible is at least ten times the thickness 基板 of the substrate 500. The number and position of the cut marks are merely examples here. The relevant artisan can adjust the position, height, distribution and proportion of the splitting device according to the actual situation. 201004764 Figures 4A through 4D are schematic views of other embodiments of the splitting device of the present invention. As shown in the figure, according to the splitting device of the present invention, the base of the connecting member 100 can be respectively designed as a flat base 140a, a triangular column base 140b, a semi-cylindrical base 140c or a trapezoidal column base 140d, and the phases are respectively disposed in the splitting head 200. Corresponding rectangular channel 220a, triangular channel 220b, semi-circular channel 220c or trapezoidal channel 220d. The flat base 140a of the connector 100 is free to slide in the rectangular passage 220a of the split ram 200 for adjusting the proper position of the connector 100 on the split ram 200. The concepts of the remaining shaped bases are similar, and so on. The connecting member 1A can be advanced by a motor device (not shown) to apply force to the splitting head 200 to push the cutting mark with the wedge-shaped projection 210 of the splitting head 200 to separate the waste material from the target positive film to be retained. . In addition, the shape and proportion of the base and the passage are not limited thereto, and the change can be adjusted according to actual needs. Referring to FIGS. 2 and 4A to 4D, the width of the slot-shaped opening 230 may be greater than or equal to the diameter of the circular link 130 of the connector 100 for the circular link 130 to pass through the slot-shaped opening 230. The width of the slot-shaped opening 230 can be smaller than the width of the top surface of the channel 220, so that the bases 140, 140a, 140b, 140c, 140d of the connector 100 can be adjusted to move within the channels 220, 220a' 220b, 220c, 220d without falling off. . However, the invention is not limited thereto, and the design can be adjusted according to actual needs. Further, the material of the connecting member 1 of the present invention may comprise a hard metal or an alloy thereof, for example, a short column, a circular connecting rod or a base may be made of stainless steel. The material of the splitting head 200 may include a polymer material such as polyvinyl chloride (PVC), polyurethane (PU), polyparaphenylene 201004764 formic acid vinegar (PET), polycarbonate (pc ) or a combination thereof. However, the present invention is not limited to this. The related art can also adjust the materials according to actual needs. Figures 5 and 6 are schematic illustrations of the splitting of the splitting fixture of the present invention. The splitting fixture 6 of the present invention comprises at least one splitting device ιβ as shown in Fig. 5, and the splitting fixture 6 has a plurality of splitting devices 1〇, with the wedge-shaped projection 210 below the splitting head 200 The bottom surface is in contact with the lower substrate 500 to be cut. Since the contact area of the wedge-shaped protrusion 210 with the lower substrate 5〇〇 is much larger than the contact area of the point-shaped splitter fixture (as shown in FIG. 1), a uniformly distributed splitting force can be provided and the splitting head 200 can be along the long axis. The directions are arranged in a series, and the splitting device 10 can adjust the position along the longitudinal axis of the long axis respectively, so that the splitting jig is more flexible and convenient, and can also be adjusted according to the size of the substrate and the length of the cutting mark. The splitting jig 600 shown in Fig. 6 can arrange a plurality of splitting devices 10 in parallel with the long axis 201 direction of the splitting ram 200 (as shown in Fig. 2) in at least two strings to provide a uniform distribution of force pushing. Squeeze the scrap material below and increase the flexibility of adjustment. In this way, when the motor device pushes the respective connecting members φ 1 平行 in parallel to perform cutting, the cleavage head 200 of the present invention can be applied to push the lower cutting marks with uniform force to achieve a flat cutting of the waste materials. The purpose. While the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. [Simple description of the drawing] 201004764 The first figure is a schematic diagram of a split of a conventional point-shaped splitting fixture. Figure 2 is a schematic view of one embodiment of the splitting device of the present invention. 3A and 3B are schematic views of the constituent members of the connecting member of the splitting device of the present invention. Figure 3C is a schematic representation of the components of the splitting device of the present invention. 4A to 4D are schematic views showing another embodiment of the splitting device of the present invention. ❹ Fig. 5 is a schematic view of a split of a splitting jig to which the present invention is applied. Figure 6 is a schematic view of a split of another splitting jig to which the present invention is applied. [Main component symbol description] 1 : Point pusher 201: Long axis 10: Split device 210: Wedge projection 100: Connector 220, 220a, 220b, 220c 110: Short post 220d: Channel 111: External thread 230: Groove opening 112: short post recess 240: contact plane 113: internal thread 300: glass substrate 120: adjusting screw 500: substrate 121: thread. 600: split jig 130: circular link A: length of the splitting head 131, 132: Thread B: Top surface width of the splitting head 140 '140a, 140b '140c 'B': width of the contact plane 140d: base C: height of the splitting head 201004764 141 : recessed hole of the base : 142 : thread L : 200 : Splitting head L' Substrate thickness Cutting length: The width of the substrate waste material

1212

Claims (1)

201004764 十、申請專利範圍: 1. 一種裂片裝置,用以沿一切割痕來分離一基板上的一 廢材,包含: 一連接件;以及 一裂片壓頭,係為一長柱體,且具有貫穿該長柱 體之一通道,該通道係平行該裂片壓頭之長軸,且至 少部分的該連接件位於該通道中,並且該長柱體底部 係逐漸内縮為呈條狀的一接觸平面。 2. 如申請專利範圍第丨項所述之裂片裝置,其中該連 接件包含一短柱、一圓形連桿與一底座,且該圓形連桿位 於該短柱下方以固接至該底座。 3·如申請專利範圍第2項所述之裂片裝置,其中該短 柱上設有一調整螺絲,以供調整該裂片裝置裂片時的高度。 4.如申請專利範圍第2項所述之裂片裝置,其中該底 座之截面形狀與該通道之截面形狀相契合。 5·如申請專利範圍第2項所述之裂片裝置,其中該底 座的形狀為圓柱、四角柱、三角柱或半圓柱。 13 201004764 6·如申請專利範圍第2項所述之裂片裝置,其中該裂 片壓頭之頂面具有一槽狀開口,該槽狀開口與該通道彼此 連通。 7_如申請專利範圍第6項所述之裂片裝置,其中該槽 狀開口寬度大於或等於該圓形連桿的直徑,以供該連接件 之該圓形連桿能通過該槽狀開口。 ❹ 8·如申請專利範圍第6項所述之裂片裝置,其中該槽 狀開口寬度小於該通道之頂面寬度,以使該連接件之該底 座能於該通道内調整移動而不至脫落。 9. 如申請專利範圍第1項所述之裂片裝置,其中讀裂 片壓頭的長度至少為該基板上之該切割痕長度的三分之 ——〇 10. 如申請專利範圍第!項所述之裂片裝置,其中該 裂片壓頭的頂面寬度大於或等於該廢材的寬度。 11. 如申請專利範圍第i項所述之裂片裝置,其中該 接觸平面的寬度小於該裂片壓頭的頂面寬度的二分之一。 12. 如申請專利範圍第1項所述之裂片裝置,其中該 裂片壓頭的高度至少為該基板厚度的十倍。 201004764 13 j •如申請專利範圍第i項所述之裂片裝置,其中 不鏽崎f。 、w 14·如中請專鄉μ丨項所述之裂片裝置其中該 壓頭係包含高分子聚合物材質。 I5.如申請專利範圍第1項所述之裂片裝置,其中該 裂片壓頭係包含聚氣乙烯(PVC)'聚氨基甲酸醋_、聚對 苯二甲酸乙二醇酯(PET)、聚碳酸酯(pC)或其組合。 6 種裂片治具,用以沿一切割痕來分離一基板上 的一廢材,包含: 兩個裂片裝置’每一該些裂片裝置包含: —連接件;以及 一裂片壓頭,係為一長柱體,且具有貫穿該長 柱體之一通道,該通道係平行該裂片壓頭之長軸, 且至少部分的該連接件位於該通道中,並且該長柱 體底部係逐漸内縮為呈條狀的一接觸平面。 17.如申請專利範圍第16項所述之裂片治具其中該 些裂片裝置係沿著該些裂片壓頭的長軸方向排列成一串。 15 201004764 18.如申請專利範圍第16項所述之裂片治具,其中談些 裂片裝置係沿著該些裂片壓頭的長軸方向平行排列成s至少 兩串。 ❹ 16201004764 X. Patent application scope: 1. A splitting device for separating a waste material on a substrate along a cutting mark, comprising: a connecting piece; and a splitting head, which is a long cylinder and has Passing through a passage of the long cylinder, the passage is parallel to the long axis of the split ram, and at least a portion of the connecting member is located in the passage, and the bottom of the long cylinder is gradually retracted into a strip-shaped contact flat. 2. The splitting device of claim 2, wherein the connecting member comprises a short post, a circular connecting rod and a base, and the circular connecting rod is located below the short post to be fixed to the base . 3. The splitting device of claim 2, wherein the stud is provided with an adjusting screw for adjusting the height of the splitting device split. 4. The splitting device of claim 2, wherein the cross-sectional shape of the base conforms to the cross-sectional shape of the passage. 5. The splitting device of claim 2, wherein the base is in the shape of a cylinder, a quadrangular prism, a triangular prism or a semi-cylindrical shape. The splitting device of claim 2, wherein the top mask of the splitting head has a slotted opening, the slotted opening and the channel being in communication with each other. The splitting device of claim 6, wherein the slotted opening width is greater than or equal to the diameter of the circular link for the circular link of the connector to pass through the slotted opening. The splitting device of claim 6, wherein the slot-shaped opening width is smaller than the top surface width of the channel, so that the base of the connecting member can be adjusted to move within the channel without falling off. 9. The splitting device of claim 1, wherein the length of the read splitting head is at least three-thirds of the length of the cut on the substrate - 〇 10. as claimed in the patent scope! The splitting device of the item, wherein a top surface width of the splitting ram is greater than or equal to a width of the waste material. 11. The splitting device of claim i, wherein the contact plane has a width that is less than one-half the width of the top surface of the splitting head. 12. The splitting device of claim 1, wherein the height of the splitting head is at least ten times the thickness of the substrate. 201004764 13 j • The splitting device as described in claim i, wherein stainless steel f. , w 14 · For example, please refer to the splitting device described in the special home, wherein the indenter comprises a polymer material. The splitting device of claim 1, wherein the splitting head comprises polyethylene (PVC) polyurethane, polyethylene terephthalate (PET), polycarbonate Ester (pC) or a combination thereof. 6 splitting fixtures for separating a waste material on a substrate along a cutting mark, comprising: two splitting devices 'each of the splitting devices comprising: - a connecting piece; and a splitting head, which is a a long cylinder having a passage through the long cylinder, the passage being parallel to the long axis of the split ram, and at least a portion of the connecting member being located in the passage, and the bottom of the long cylinder is gradually retracted to A contact plane in the form of a strip. 17. The splitter fixture of claim 16, wherein the splitting devices are arranged in a series along the long axis of the splitting rams. The disintegration device of claim 16, wherein the lobing device is arranged in parallel along the long axis direction of the lobes indenter to form at least two strings. ❹ 16
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