201004273 九、發明說明： 【發明所層之技術領域】 本發明是有關於一種通訊裝置，且特別是有關於一種 無線通訊裝置。 【先前技術】 目前行動通訊裝置之使用係相當地普遍。為了使用上 的方便’行動通訊產品必需具有輕薄短小、結構堅固、收 訊良好之功能，才能在市場上佔得一席之地。其中，天線 的配置方式是影響收訊品質的主要因素之一。 然而，目前的天線配置方式會有使通訊裝置之殼體之 鏤空區域過多，而降低殼體的結構堅固性的問題。或者， 有些天線的配置方式係受限於殼體之内部空間結構，而無 法達到良好的效率。因此，如何在不提高所佔用之體積的 前提之下，使配置於通訊裝置内之天線具有良好的效率， 並且兼顧殼體結構之堅固性，乃業界所致力的課題之一。 \ 【發明内容】 本發明係有關於一種無線通訊裝置，可以達到良好的 天線收發效率，又可以減少第一外殼的鏤空區來提高第一 外殼的強度，以增加產品良率與產品使用壽命。 本發明提出一種無線通訊裝置，包括一主板、一承載 件、一第一外殼、及一天線。承載件耦接於主板上。第一 外殼覆蓋主板及至少部分之承載件，承載件設置於主板與 5 201004273 第一外殼之間。天線電性連接至主板。天線包括一第一部 份及一第二部份。第一部份接觸承載件，第一部份係位於 第一外殼及承載件之間。第二部份接觸第一外殼，係位於 第一外殼之一外表面上。 本發明更提出一種無線通訊裝置，包括一主板、一承 載件、一第一外殼、一第二外殼以及一天線。承載件耦接 於主板上。第一外殼具有一第一開孔設置於鄰近第一外殼 之一侧邊。第二外殼與第一外殼形成一容置空間用以容納 :: 主板與承載件。天線具有一第一部份與一第二部份。第一 部份接觸承載件，第二部份連接第一部份，並經由第一開 孔露出於第一外殼外，且接觸第一外殼之一外表面上。 為讓本發明之上述内容能更明顯易懂，下文特舉較佳 實施例，並配合所附圖式，作詳細說明如下： 【實施方式】 本發明係提出一種無線通訊裝置，包括主板、承載 I 件、第一外殼及天線。承載件係耦接於主板上。第一外殼 係覆蓋主板及至少部分之承載件，承載件設置於主板與第 一外殼之間。天線則電性連接至主板。此天線包括第一部 份及第二部份。第一部份接觸承載件，且第一部份係位於 第一外殼及承載件之間。第二部份接觸第一外殼，並位於 第一外殼之一外表面上。兹舉一實施例說明如下。 請參照第1圖，其所繪示乃本發明一實施例之無線通 訊裝置之爆炸圖。無線通訊裝置10包括主板20、承載件 6 201004273 λ νν*-ίυυ^ι /-ν 30、第一外殼40、天線50、第二外殼60及上蓋70。承載 件30係耦接於主板20上。第一外殼40係覆蓋主板20及 至少部分之承載件30。承載件30設置於主板20與第一外 殼40之間。天線50則電性連接至主板20。此天線50包 括第一部份502及第二部份504。第一部份502接觸承載 件30,且第一部份502係位於第一外殼40及承載件30之 間。第二部份504接觸第一外殼40，並位於第一外殼40 之一外表面402上。 : 請參照第2至4圖，第2圖繪示乃第1圖之天線50、 承載件30、及部份之第一外殼40之放大圖，第3圖及第 4圖乃將第1圖之天線50、承載件30、及第一外殼40結 合後之無線通訊裝置10之示意圖。第4圖與第3圖之差 別在於，第4圖係將天線50被隱藏的部份用虛線繪製的 方式表現出來。第一外殼40更包括一第二開孔404，用於 容納承載件30之一部份，並使部分之承載件30係外露於 第一外殼40。第一外殼40具有一主殼面406、一頂面408 、 及一底面410。頂面408及底面410分別位於主殼面406 相對之兩側。承載件30係以鄰近底面410的方式設置於 主殼面406及主板20之間。 承載件30具有一上表面306及一底表面308。上表 面306係與第一外殼40之主殼面406相鄰，底表面308 係與第一外殼40之底面410相鄰。天線50之第一部份502 係貼覆於承載件30之底表面308上。 而第一外殼40具有一第一開孔，設置於鄰近第一外 7 201004273 殼40之一側邊416。天線50之第二部份504係經由第一 開孔露出於第一外殼40外，且接觸第一外殼40之外表面 402上。舉例來說，第一開孔係包括開口 412與414，位 於第一外殼40於主殼面420及底面410交接之處。天線 50較佳地係為一可撓天線，天線50例如是使用軟性電路 板來達成。無線通訊裝置10係為一雙頻無線通訊裝置， 天線50係為一雙頻天線。天線50之第二部份504包括一 高頻部506與一低頻部508。高頻部506連接至第一部份 : 504。高頻部506係於開口 412處轉折，以貼覆於主殼面 406上。低頻部508連接至第一部份502。低頻部508係 通過開口 414並於開口 414處轉折，以貼覆於主殼面406 上。高頻部506例如具有第一 L外型，低頻部508例如具 有一第二L外型。 無線通訊裝置10更具有一彈性件80。彈性件80例 如係以可伸縮之連接器來達成。天線50更包括一饋入部 510。饋入部510之一端具有一饋入端512。饋入部510係 ( 連接至第二部份504。彈性件80係連接主板20及饋入端 512。彈性件80用以使天線50經由饋入端512電性連接 至主板20。 第一外殼40更具有開口 416，承載件30更具有開口 310。饋入部510於第一外殼40之開口 416處轉折，以經 由開口 310及承載件30之開口 416與彈性件80電性連 接。第二外殼60係與第一外殼40對組以形成一容置空間 602。主板20、承載件30及天線50之第一部份502係容 8 置於此容置空間602中。 於本實施例中，承載件30例如是一揚聲模組。揚聲 模組30包括一發聲單體302及一共振腔體304。發聲單體 302係電性連接至主板20。天線50之第一部份502係貼 覆於共振腔體304之底表面308。開口 310係位於共振腔 體304上。 茲將天線50組裝於無線通訊裝置10的組裝流程說明 如下。請參照第6A〜6C圖，其繪示乃將第1圖之無線通 ( 訊裝置10之各部件進行組裝時之組裝流程圖。當進行組 裝時，天線50之第一部份502先配置於承載件30之底表 面308上，例如是使用黏貼的方式配置於共振腔體304之 底表面308上，如第6A圖所示。然後，將天線50之第二 部分504穿過開口 412及414。例如，第二部分504之高 頻部506與饋入部510穿過開口 412，而低頻部508則穿 過開口 414，如第6B圖所示。 之後，將揚聲模組30固定於第一外殼40下方，例如 ( 是用卡接的方式固定。發聲單體302係外露於第一外殼40 外。然後，使饋入部510穿過第一外殼40之開口 416，並 容置於共振腔體304之開口 310中。之後，將天線50之 第二部份504固定於第一外殼40之主殼面406上，例如 是以黏貼的方式固定。接著，將主板20固定於第一外殼 40中，以使天線50之饋入端512經由彈性件80與主板 20電性連接。接著，使第二外殼60與第一外殼40對組以 形成容置空間602，如第6C圖所示。之後，將上蓋70覆 9 201004273 蓋於第一外殼40上。 藉由開口 412與414的使用，可以讓天線50的第一 部份502與第二部份504分別配置於不同物件的不同表面 上，亦即上述之承載件30之底表面307與第一外殼40之 主殼面406。茲與將天線50之第一部份502與第二部份 504分別配置於承載件30之底表面308與上表面306之作 法相較，此種作法必需增加第一外殼40之鏤空區，以使 配置於上表面306之第二部份504外露於第一外殼40之 I 外。然，本實施例藉由使第二部份502配置第一外殼40 之主殼面406上，可以不需增加第一外殼40之鏤空區域， 而可增加第一外殼40的結構強度，以減少第一外殼40受 到外力撞擊而產生破裂之機會。 此外，請同時參考第1圖及第5圖，第5圖繪示乃第 1圖之天線50之第一部分502與主板20之上視圖。主板 20包括主體部202與延伸部204。主板20例如是多層結 構之印刷電路板。印刷電路板之最上層為電路配置層，而 、 印刷電路板之多層結構中之其中一層為接地層。主體部 202具有位於接地層之接地面206及位於電路配置層之一 配置區208,無線通訊裝置10相關之控制電路或訊號處理 電路（未繪示）係配置於配置區208上。延伸部204連接至 主體部202。彈性件80配置於延伸部204上，並且連接延 伸部204及饋入端512，以使天線50與上述電路電性連 接。與主板20電性連接之天線50的第一部份502係與接 地面206相距一距離D。 對於天線50而言，此距離D越遠，天線50的無線 訊號之收發效率越好。由於第一外殼40形狀上設計之考 量，且受限於容置空間602的有限空間，傳統作法中要讓 天線50盡量遠離的第一部份502係與接地面206是不容 易達成的。本實施例藉由使天線50之第一部份502配置 於承載件30之底表面308，而能夠讓天線50之第一部份 502盡量靠近第一外殼40之底面410，以使第一部份502 盡量遠離主板20之接地面206。如此，與傳統作法相較， ( 本實施例具有較大的距離D，而達到良好的天線效率。 本發明上述之無線通訊裝置，藉由第一外殼上之開口 的使用，可以天線的第一部份與第二部份分別配置於承載 件之底表面與第一外殼之主殼面上，不但可以達到良好的 天線收發效率，又可以減少第一外殼的鏤空區來提高第一 外殼的強度，以增加產品良率與產品使用壽命。 綜上所述，雖然本發明已以較佳實施例揭露如上，然 其並非用以限定本發明。本發明所屬技術領域中具有通常 ^ 知識者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾。因此，本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 【圖式簡單說明】 第1圖繪示乃本發明一實施例之無線通訊裝置之爆 炸圖。 第2圖繪示乃第1圖之天線、承載件、及部份之第一 11 201004273. 外殼之放大圖。 第3圖及第4圖乃將第1圖之天線、承載件、及第一 外殼結合後之無線通訊裝置之示意圖。 第5圖繪示乃第1圖之天線之第一部分與主板之上視 圖。 第6A〜6C圖繪示乃將第1圖之無線通訊裝置之各部 件進行組裝時之組裝流程圖。 主要元件符號說明】 10 :無線通訊裝置 20 :主板 202 :主體部 206 :接地面 30 :承載件 302 :發聲單體 308 :底表面 310 :開口 40 :第一外殼 402 :外表面 406 :主殼面 410 :底面 50 :天線 502 :第一部份 506 :高頻部 204 :延伸部 208 :配置區 304 :共振腔體 306 :上表面 404 :第二開孔 408 :頂面 412 、 414 、 416 :開口 504 :第二部份 510 :饋入部 12 201004273 508 :低頻部 512 60 :第二外殼 602 70 :上蓋 80 ： :饋入端 :容置空間 彈性件 13201004273 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a communication device, and more particularly to a wireless communication device. [Prior Art] The use of mobile communication devices is currently quite common. In order to be convenient for use, mobile communication products must have the functions of being light and thin, strong in structure, and good in reception, so that they can gain a place in the market. Among them, the configuration of the antenna is one of the main factors affecting the quality of the reception. However, current antenna configurations have the problem of reducing the hollowness of the housing of the communication device and reducing the structural robustness of the housing. Alternatively, some antennas are configured in a manner that is limited by the internal space structure of the housing and does not achieve good efficiency. Therefore, how to make the antenna disposed in the communication device have good efficiency and to take into consideration the robustness of the housing structure without increasing the occupied volume is one of the problems of the industry. SUMMARY OF THE INVENTION The present invention relates to a wireless communication device that can achieve good antenna transmission and reception efficiency, and can reduce the hollow area of the first casing to increase the strength of the first casing to increase product yield and product service life. The invention provides a wireless communication device comprising a main board, a carrier, a first housing, and an antenna. The carrier is coupled to the motherboard. The first housing covers the main board and at least a portion of the carrier, and the carrier is disposed between the main board and the first housing of 5 201004273. The antenna is electrically connected to the main board. The antenna includes a first portion and a second portion. The first portion contacts the carrier and the first portion is located between the first housing and the carrier. The second portion contacts the first outer casing and is located on an outer surface of one of the first outer casings. The invention further provides a wireless communication device comprising a main board, a carrier, a first housing, a second housing and an antenna. The carrier is coupled to the motherboard. The first housing has a first opening disposed adjacent one of the sides of the first housing. The second outer casing and the first outer casing form an accommodating space for accommodating the following: the main board and the carrier. The antenna has a first portion and a second portion. The first portion contacts the carrier and the second portion connects the first portion and is exposed outside the first housing via the first opening and contacts an outer surface of one of the first housings. In order to make the above-mentioned contents of the present invention more comprehensible, the following description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] The present invention provides a wireless communication device, including a motherboard and a carrier. I piece, first case and antenna. The carrier is coupled to the motherboard. The first housing covers the main board and at least a portion of the carrier, and the carrier is disposed between the main board and the first housing. The antenna is electrically connected to the main board. The antenna includes a first portion and a second portion. The first portion contacts the carrier and the first portion is positioned between the first housing and the carrier. The second portion contacts the first outer casing and is located on an outer surface of one of the first outer casings. An embodiment will be described below. Referring to Fig. 1, there is shown an exploded view of a wireless communication device in accordance with an embodiment of the present invention. The wireless communication device 10 includes a main board 20, a carrier 6 201004273 λ νν*-ίυυ^ι /-ν 30, a first housing 40, an antenna 50, a second housing 60, and an upper cover 70. The carrier 30 is coupled to the main board 20. The first housing 40 covers the main board 20 and at least a portion of the carrier 30. The carrier 30 is disposed between the main board 20 and the first outer case 40. The antenna 50 is electrically connected to the main board 20. The antenna 50 includes a first portion 502 and a second portion 504. The first portion 502 contacts the carrier 30 and the first portion 502 is located between the first housing 40 and the carrier 30. The second portion 504 contacts the first outer casing 40 and is located on an outer surface 402 of the first outer casing 40. Please refer to the second to fourth figures. FIG. 2 is an enlarged view of the antenna 50, the carrier 30, and a portion of the first outer casing 40 of FIG. 1. FIG. 3 and FIG. A schematic diagram of the wireless communication device 10 in which the antenna 50, the carrier 30, and the first housing 40 are combined. The difference between Fig. 4 and Fig. 3 is that Fig. 4 shows the hidden portion of the antenna 50 in a dotted line. The first outer casing 40 further includes a second opening 404 for receiving a portion of the carrier member 30 and exposing a portion of the carrier member 30 to the first outer casing 40. The first outer casing 40 has a main casing surface 406, a top surface 408, and a bottom surface 410. The top surface 408 and the bottom surface 410 are respectively located on opposite sides of the main shell surface 406. The carrier 30 is disposed between the main casing surface 406 and the main plate 20 adjacent to the bottom surface 410. The carrier 30 has an upper surface 306 and a bottom surface 308. Upper surface 306 is adjacent to main casing surface 406 of first outer casing 40, and bottom surface 308 is adjacent to bottom surface 410 of first outer casing 40. The first portion 502 of the antenna 50 is attached to the bottom surface 308 of the carrier 30. The first outer casing 40 has a first opening disposed adjacent to one of the sides 416 of the first outer casing 7 201004273. The second portion 504 of the antenna 50 is exposed outside the first outer casing 40 via the first opening and contacts the outer surface 402 of the first outer casing 40. For example, the first aperture includes openings 412 and 414 located where the first housing 40 meets the main housing surface 420 and the bottom surface 410. Antenna 50 is preferably a flexible antenna, and antenna 50 is achieved, for example, using a flexible circuit board. The wireless communication device 10 is a dual-band wireless communication device, and the antenna 50 is a dual-frequency antenna. The second portion 504 of the antenna 50 includes a high frequency portion 506 and a low frequency portion 508. The high frequency portion 506 is connected to the first portion: 504. The high frequency portion 506 is turned over at the opening 412 to be attached to the main casing surface 406. The low frequency portion 508 is connected to the first portion 502. The low frequency portion 508 is passed through the opening 414 and turned over at the opening 414 to be applied to the main casing surface 406. The high frequency portion 506 has, for example, a first L outer shape, and the low frequency portion 508 has, for example, a second L outer shape. The wireless communication device 10 further has an elastic member 80. The elastic member 80 is achieved, for example, by a retractable connector. The antenna 50 further includes a feed portion 510. One end of the feed portion 510 has a feed end 512. The feeding portion 510 is connected to the second portion 504. The elastic member 80 is connected to the main board 20 and the feeding end 512. The elastic member 80 is used to electrically connect the antenna 50 to the main board 20 via the feeding end 512. The first housing 40 The opening 416 further has an opening 310. The feeding portion 510 is turned at the opening 416 of the first outer casing 40 to be electrically connected to the elastic member 80 via the opening 310 and the opening 416 of the carrier 30. The second outer casing 60 The first housing 40 is paired with the first housing 40 to form an accommodating space 602. The main board 20, the carrier 30, and the first portion 502 of the antenna 50 are placed in the accommodating space 602. In this embodiment, the bearing The speaker module 30 is, for example, a speaker module. The speaker module 30 includes a sounding unit 302 and a resonant cavity 304. The sounding unit 302 is electrically connected to the main board 20. The first part of the antenna 50 is 502. Covering the bottom surface 308 of the resonant cavity 304. The opening 310 is located on the resonant cavity 304. The assembly flow of assembling the antenna 50 to the wireless communication device 10 is described below. Please refer to Figures 6A to 6C, which will show The assembly process of the wireless communication device of Fig. 1 when assembling the components of the device 10 When assembled, the first portion 502 of the antenna 50 is first disposed on the bottom surface 308 of the carrier 30, for example, by being attached to the bottom surface 308 of the resonant cavity 304, as shown in FIG. 6A. Then, the second portion 504 of the antenna 50 passes through the openings 412 and 414. For example, the high frequency portion 506 of the second portion 504 and the feed portion 510 pass through the opening 412, and the low frequency portion 508 passes through the opening 414, as in the first 6B is shown. After that, the speaker module 30 is fixed under the first casing 40, for example, by being snap-fitted. The sounding unit 302 is exposed outside the first casing 40. Then, the feeding portion 510 is made Passing through the opening 416 of the first outer casing 40 and receiving it in the opening 310 of the resonant cavity 304. Thereafter, the second portion 504 of the antenna 50 is fixed to the main casing surface 406 of the first outer casing 40, for example The fixing method is fixed. Then, the main board 20 is fixed in the first housing 40 so that the feeding end 512 of the antenna 50 is electrically connected to the main board 20 via the elastic member 80. Then, the second housing 60 and the first housing 40 are made Pair the groups to form the accommodating space 602, as shown in Fig. 6C. After that, the upper cover will be The cover 70 is placed on the first outer casing 40. The first portion 502 and the second portion 504 of the antenna 50 are respectively disposed on different surfaces of different objects by using the openings 412 and 414, that is, the above The bottom surface 307 of the carrier 30 and the main surface 406 of the first housing 40. The first portion 502 and the second portion 504 of the antenna 50 are disposed on the bottom surface 308 and the upper surface 306 of the carrier 30, respectively. In contrast, it is necessary to increase the hollowed out area of the first outer casing 40 such that the second portion 504 disposed on the upper surface 306 is exposed outside the first outer casing 40. However, in this embodiment, by arranging the second portion 502 on the main surface 406 of the first outer casing 40, the structural strength of the first outer casing 40 can be increased without increasing the hollowed out area of the first outer casing 40, thereby reducing the structural strength of the first outer casing 40. The first outer casing 40 is subjected to an external force to cause a break. In addition, please refer to FIG. 1 and FIG. 5 at the same time. FIG. 5 is a top view of the first portion 502 of the antenna 50 of FIG. 1 and the main board 20. The main board 20 includes a main body portion 202 and an extension portion 204. The main board 20 is, for example, a printed circuit board of a multi-layer structure. The uppermost layer of the printed circuit board is a circuit configuration layer, and one of the multilayer structures of the printed circuit board is a ground layer. The body portion 202 has a ground plane 206 on the ground layer and a configuration area 208 in the circuit arrangement layer. The control circuit or signal processing circuit (not shown) associated with the wireless communication device 10 is disposed on the configuration area 208. The extension 204 is coupled to the body portion 202. The elastic member 80 is disposed on the extending portion 204 and connects the extending portion 204 and the feeding end 512 to electrically connect the antenna 50 to the circuit. The first portion 502 of the antenna 50 that is electrically coupled to the motherboard 20 is at a distance D from the ground 206. For the antenna 50, the farther the distance D is, the better the transmission and reception efficiency of the wireless signal of the antenna 50 is. Due to the design of the first outer casing 40 and the limited space of the accommodating space 602, it is not easy to achieve the first portion 502 of the antenna 50 as far as possible from the ground plane 206 in the conventional practice. In this embodiment, by disposing the first portion 502 of the antenna 50 on the bottom surface 308 of the carrier 30, the first portion 502 of the antenna 50 can be placed as close as possible to the bottom surface 410 of the first housing 40, so that the first portion Portion 502 is as far as possible from the ground plane 206 of the motherboard 20. Thus, compared with the conventional method, the present embodiment has a large distance D and achieves good antenna efficiency. The wireless communication device of the present invention can be used as the first antenna by the use of the opening on the first casing. The part and the second part are respectively disposed on the bottom surface of the carrier and the main surface of the first housing, which can not only achieve good antenna transmission and reception efficiency, but also reduce the hollow area of the first housing to improve the strength of the first housing. In order to increase the yield of the product and the service life of the product. In summary, although the invention has been disclosed above in the preferred embodiments, it is not intended to limit the invention. The scope of protection of the present invention is defined by the scope of the appended claims, and the scope of the invention is defined by the scope of the appended claims. FIG. 2 is an exploded view of the wireless communication device according to an embodiment of the present invention. FIG. 2 is a first view of the antenna, the carrier, and the portion of the first 11 201004273. 3 and 4 are schematic views of the wireless communication device in which the antenna, the carrier, and the first housing of FIG. 1 are combined. FIG. 5 is a top view of the first portion of the antenna and the motherboard of FIG. 6A to 6C are diagrams showing an assembly process when assembling the components of the wireless communication device of Fig. 1. Main component symbol description 10: Wireless communication device 20: Main board 202: Main body portion 206: Ground plane 30 : carrier 302: sounding unit 308: bottom surface 310: opening 40: first outer casing 402: outer surface 406: main shell surface 410: bottom surface 50: antenna 502: first portion 506: high frequency portion 204: extension 208: configuration area 304: resonant cavity 306: upper surface 404: second opening 408: top surface 412, 414, 416: opening 504: second portion 510: feed portion 12 201004273 508: low frequency portion 512 60: Two outer casing 602 70 : upper cover 80 : : feed end: accommodating space elastic member 13