200952188 六、發明說明： 【發明所屬之技術領域】 本發明一般關於一種光電裝置之固定。尤其，本發明 係關於一種用以固定一光電裝置之裝設系統’其中此裝設 系統亦被設計成能使光電裝置成為非破壞性地可分開的。 【先前技術】 對於電能之產生而言，安裝光電裝置至商業與住宅結 構之上，近來已變得更可負擔且受歡迎的。此外，光電I 置設計已進化到變得較不龐大及麻煩以安裝至這些構造 上。舉例而言，現在可以一卷彈性薄膜的型式提供—種光 電裝置，此彈性薄膜可被展開並安裝至一構造表面之上， 此構造表面可具有實質上平坦的區域、由結構構件、粒子 或一塗層形成之大致平面配置，或者順應安裝光電巢置之 操作之曲率（curvature)。 理想上是可以一種簡單與快速方式來安裝光電裝 置。某些光電裝置安裝涉及一剛性構架，其係與光電裝置 結合’或另外用以將光電裝置裝設至一結構（譬如建築物 或房子之屋頂）之上。一般而言，此構架係藉由貫穿此結 構(例如鑽孔）而被固定，所以此構架被閂鎖或螺鎖至此結 構。在其他應用中，光電裝置本身可能被設計成以使其一 部分直接螺鎖或閂鎖至此結構。 這些型式之安裝可允許進入例如水、昆蟲、風等之環 200952188 境要素之結構。此外，這些安裝一般需 一 光電裳置蚊至此結構，此增加了安裝光電mil此 上連所討論的光钱置安㈣可能_ 作二其乃因為它們在拆開期間更可能經歷損壞。 除貝穿此結構而m定之光電裝置將可 Ο ❹ 及細構之修理。舉例而言，可能使; t移除n屋頂表面之—區段之材料 巷 會嚴重損壞此材料且可輯致屋縣面之_=那個輕 光電裝置之安裝配置亦可由特定結構之配置、於此社 構下之環境條件、及/或特·於此結構之位置之建築& 範所指定。多數商業與住宅建築規範要求那種結構1及 裝設於此結構上之物件（例如光置），抵抗例如重量、 風與振動負載(例如由地震所導致的)之預定負載， 對於此結構與其他附近的財產或人有不利的影響。 因此’本案發明人於此已認知一將光電裝置曰固定至結 構之裝設线之需求’其巾裝m域料成能使光電 裝置隨後可非破壞性地與此結構分離，且在不需要修理光 電裝置的情況下可以再次被安裝並操作。 【發明内容】 依據-例示實施例，提供-種用^卜光電裝置固定 至-表面之裝m此裝設系統包含—裝設構件，用以 將此光電裝置之—非活㈣域固定1此表面。此裝設構件 係被設計成鎌此非活性輯可非，㈣與此表面分 200952188 開，且此光電裝置不會由於此分開過程而變成不能操作。 依據另一例示實施例，提供一種用以將一光電裝置固 定至一表面之裝設系統。此裝設系統包含安置在此光電裝 置之一非活性區域上之複數個隔開的壓載(ballast)構件。 這些壓載構件迫使此非活性區域靠著此表面。這些壓载構 件可非破壞性地與此非活性區域分開，且此光電裝置不會 由於此分開過程而變成不能操作。 依據另一個例示實施例，提供一種用以將一光電裝置 固定至一表面之方法。此方法包含沿著一基板之一未露出 側安置一裝設構件，此基板具有固定至此基板之一露出側 之此光電裝置。此方法更包含將此裝設構件固定至此表 面此裝a又構件係被設計成能使此基板可非破壞性地與此 表面分開，且此光電裝置不會由於前述分開過程而變成不 能操作。 【實施方式】 於此所揭露的係為一種用以固定一光電裝置緊靠著 一結構之一表面之裝設系統之數個實施例。於此所考庹= 結構包含各種Μ的住宅，例如居住住宅、商#建築^與 寓所。此外’驗非人類棲息地_途並設計成用以容^ 一光電裝置安裝之結獅被考慮在本發明之_内 但不限於儲存槽、水槽、攜帶式結構與絲物。 ° 如於此所考慮的結構之表面可具有一大致平垣的 面配置、例如-波狀面板之—不規則表面、由像石、 礫，泥土之複數個顆粒狀粒子所形成之一表面，或者 200952188 經的塗饰表面’其排列遍及一區域以形成一大致水平平 面’而光電裝置係緊靠著裝設於此水平平面。於此吾人考 慮到’上面裝設有光電裝置之表面包含沙礫、地面（例如 泥地、石地或草地），其中一基板係安置在此表面上面並 在光電装置之下。在某些應用中，光電裝置係裝設於一表 面’其具有容納光電裝置之操作之一曲率半徑。於此所考 慮的非限制表面材料係為木材、金屬 、沙礫、污垢或土壤、 © 各種塗層以及聚合材料等。 ^ 於此所揭露的這些實施例，係針對一種設計成能利用 =少的安裝工具或不用安裝工具，以將光電裝置裝設緊靠 著此表面之裂設系統。裝設系統亦被設計成以一種非破壞 座的方式與此表面分離，俾能在不需要修理光電裝置之需 求之下’使光電裝置可接著被裝設與操作。依此方式，對 於—個想要移除一光電裝置而接著於另一位置裝設並操 $它而不會使得光電裝置由於分開過程而不能操作之住 © 宅與商業應用而言’此光電裝置裝設系統係很理想的。對 於譬如一光電裝置可能被重新設置以產生供通訊裝置用 之電肖b之商業或軍事應用而言，一種非破壞性地可分開的 光電装置亦可能是受歡迎的。 裝設系統係更進一步被設計成用以使光電裝置維持 緊靠著受到一預定負載條件之一結構之表面。在數個實施 例中，裝設系統可被利用以供具有一水平或非水平方向之 光電裝置安裝。裝設系統可被設計成用以在包含像強風、 暴風、地震等之極端氣候條件之環境條件期間，使光電裝 200952188 置維持緊靠著此結構。在其他實施例中，裝設系統係被設 計成用以固定一光電裝置緊靠著具有一斜坡之一表面，以 使光電裝置安裴不會由於重力之影響而移走。吾人亦考慮 到裝設系統之數個實施例可被設計成以一種非破壞性的 方式，來可分離地固定多樣化的光電裝置，包含已經構架 (framed)與尚未構架（unframed)之光電構造。 在一例示實施例中，裝設系統包含沿著一基板之一未 露出側或光電裝置之一非活性區域安置之至少一裝設構0 件，其中裝設構件利用一種能夠重複囉合之可分開的干涉 配合式固定件。舉例而言，裝設構件係為一按扣配合按鍵 式固定件(snap-fit button type fastener)。在另一個實例中， 裝設構件沿著基板之一長度延伸，且裝設構件係為一延長 公部分(male portion)，其在嚅合時以干涉配合的方式韻合 一互補的凹槽部分。 在其他實施例中’吾人考慮到裝設系統具有裝設構件 之一獨特配置，用以固定受到一預定負載條件之光電裝 置。舉例而言，在一光電安裝之一個實施例中，相較於未〇 經歷相同的負載條件之其餘的裝設構件，此些農設構件之 一部分係在一某個負載條件期間，沿著光電裝置被設計並 安置以維持光電裝置之一區域緊靠著此表面。 八於此吾人考慮到用以固定光電裝置之非破壞性地可 分開的骏設系統之獨特配置，對於多樣化 f件係為可能的。又，可修改於此所考慮之1些裝設系 、、先或置換震設系統之配置以配合裝置設計、負載條件、現 200952188 場或光電安裝方向之改變。舉例而言，當光電安裝係從高 負荷之位置被移除並被裝設於較低負荷之另一個位置 時，較少數目或另一方面縮小配置之裝設構件可置換先前 的裝设系統配置，其乃因為此裝設系統是可以非破壞性地 分開的。 在某些實施例中，於此所揭露之裝設系統可能在光電 裝置與表面之間不需要任何中介材料的情況下，被利用以 固定光電裝置緊靠著此表面。在其他實施例中，在另一介 ° 自或中間層係布署於光電t置與表面之間或布署於光電 裝置與#活性區域或基板之間的情況下，這些裝設系統可 被設計成用以固定光電裝置緊靠著此表面。在其他實施例 中，光電裝置係被固定至緊靠著一中間層、基板或薄膜（其 係可分離地被固定至此表面）。在光電裝置之某些實施例 中，一基板或薄膜係被視為光電裝置之一非活性區域與一 整合部分。在其他實施例中，例如一塗層之一中間層係被 固定至此表面’且當光電裝置被移除時不打算移除此中間 © 層。在數個例示實施例中，作為非限制例之一介面層、中 間層、薄膜、塗層或其他構件，可被利用以作為一絕緣層、 一陴障層或一結構構件。 以下’裝設系統之各種例示實施例係使用光電裝置安 裝之各種實施例來作說明。所參考之附圖所顯示之元件與 構件煎未按比例綠製’且本身係為了清楚的目的而顯示， 但未意圖傳達例如形狀、方向、尺寸、重量等之限制資訊。 參見圖1與2 ’依據本發明之一例示實施例說明一種 9 200952188 光電安裝系統10。安裝系統10包含固定至一基板14之複 數個隔開的光電裝置12a、12b、12c與12d，以及一裝設’ 系統16。基板14可以包含適合特定應用（包含環境、光電 裝置之型式以及其上安裝有此些裝置之結構之配置）之任 何材料。 舉例而言，在一個實施例中，此基板係為一薄膜，例 如商業上可購得且被列為標準RubbergUard EPDM II之具 有0.045至0.060吋之厚度之一固化的乙烯丙烯二烯系單 體(C-EPDM)橡勝薄膜。在另一個實施例中，此薄膜係為❹ 商業上可購得且被列出為Sarnafii S327，G410，Johns Manville SR50之具有〇 048至0.050时之厚度之一聚氣乙 烯(pvc);或商業上可購得且被列為GenflexWhite之具有 0.045至0.060吋之厚度之一熱塑性聚鏈烯烴(τρ〇);以及 具有平坦及/或顆粒狀表面紋理之一苯乙烯丁二烯苯乙烯 (SBS)改良瀝青的多層合板等等。在其他實施例中，此基 板可包含一強化材料，例如但並未受限於聚酯、玻璃纖維 或者其他材料或其組合。 〇 裳設系統16係被設計成用以將此些光電裝置與此基 板固疋至表面18,如圖2所示。於本實施例中，裝設系 統16包含安置繞於基板14之周邊之一黏著部分2〇，如圖 1所示。黏著部分20係被利用來將基板14固定地固定至 18。黏著部分2〇係更進一步被設計成能使基板之一 部分可非破壞性地與表面18分開，且這些光電裝置不會 由於刀開過程而變成不能操作。舉例而言，黏著部分20 200952188 係為一雙面膠帶，其被黏敷至基板14之下表面與表面 18，用以可分離地將這兩個固定在一起。在一替代實施例 中，係利用一熱焊接製程以接合在基板與表面之間的黏著 部分。在一例示實施例中，黏著部分2〇係為一塗膠 (rubberized)或丁基成分。這種黏接劑之一例係在商業 上可購自密西根州之Madison Heights之Sika公司之名稱 為 SikaLastomer®_68 者。 ❹ 黏著部分係被設計成能使其可以利用一種非破壞性 的方式來與基板、中間層，或與光電裝置之一非活性區域 分離，且不會使此些光電裝置由於分開過程成為無法操作 的。於一貫施例中，當熱被施加至基板之露出侧之區域（一 般而言在黏著部分的對面）時，黏著部分係被設計成為會 退化，俾能使基板可以非破壞性地與表面分離。舉例而 言，藉由加熱基板之露出側之一部分至1〇〇〇c持續大約五 分鐘以使黏著部分退化，可將基板非破壞性地與表面分 ❹ 離，所以接著可利用大約五磅之力量而非破壞性地將基板 或整個基板之一部分與此表面分離。 在另一個實施例中，露出基板之一區域係譬如利用乾 冰而被冷卻至實質上寒冷的溫度，用以使黏著部分退化， 所以基板之一部分可非破壞性地與此表面分開，而不會使 得光電裝置由於分開過程而不能操作。在又另一實施例 中，黏著部分係被設計成用以在使一溶液與黏著部分接觸 時退化，所以基板之一部分可非破壞性地與此表面分開， 而不會使得光電裝置由於分開過程而不能操作。 η 200952188 、於這些實施例中’基板、介面層、中間層或非活性區 域係可非破壞性地分開，舉例而言，於此它們並未被切斷 或刺孔以便從此表面分開它們。在其他實施例中，基板、 ^或非活性區域之輕微退化可能在從此表面分開它們時 电生°譬如剝離或龜裂之基板退化，並未到達一種使光電 裝置成為無法操作的程度。 、▲在某些實施例中，一旦基板被移離此表面，則黏著部 分就會被設計成能使殘留黏著劑接著可實質上從此基板 上被移除。黏著劑之退化與移除可採用例如剝離、刮除，〇 或’谷劑或其他溶液之施加、加熱、冷卻或其組合之這樣 =製程。在某些實施例中，黏著劑之成分及/或使黏著部 刀退化之手段’將是使基板在被利用以使黏著劑退化以分 開基板與此表面之製程之後，將不需要更進一步的處理以 從基板上移除黏著劑。在其他實施例中，在使黏著劑退化 以分開基板與此表面之後，對黏著劑之基板區域進行類似 用砂紙磨、摩擦等等之一刻紋(texturing)製程，以利於後 來的黏著劑之施加。 〇 在另一個例示實施例中，黏著部分具有兩部配置，於 此它們的結構狀態/成分改變用以控制在此些部分之間之 黏著劑接合何時會產生。黏著劑之一第一部分係被塗敷至 基板（或光電裝置之非活性區域)之一下侧（或未露出側）， 其中，於那個時點，黏著劑之第一部分係被設計成用以不 會黏著成與某個材料接觸，譬如，黏著至外殼(skin)或某 個封裝材料。於光電裝置之安裝中，黏著劑之第二部分係 12 200952188 被塗敷至結構之表面，而基板（或非活性區域)將被固定矣 此處。於一實施例中’當基板被布署在此表面之上時’黏 著劑之第一與第二部分係被設計成用以在接觸上與彼此 父互作用，以使它們確實地接合在一起以將基板固定炱此 表面，藉以固定光電裝置緊靠著此表面。在另一實施例 中，黏著劑之第一及/或第二部分包含微膠囊（包含一黏著 劑或其之一部分）之一配置，以在基板被布署在結構上面 © 俾能將第一與第二黏著部分夾在它們之間時，使黏著劑微 膠囊破裂，所以其内容成分係以一種將基板接合至此結構 之方式被活化。黏著劑微膠囊可含在布署在基板或此表面 上面的一塗層中，以使在微膠囊之内的此些内容成分與此 塗層父互作用以形成接合黏著劑，或者塗層可被設計成用 以只含有此些微膠囊，並允許此些微膠囊之内的此些内容 成分在此些微膠囊破裂、溶解之時，將基板接合至此表 面。在其他實施例中，包含微膠囊（如果期望的話)之黏著 © 部分可被使用在光電裝置與基板之部分之間。 在另一實施例中，黏著劑之第一與第二部分係被活 化，用以在將能量施加至通常於黏著部分或靠近黏著部分 之區域時接合在一起。所施加的能量可以是熱能，例如於 此區域施加熱或冷卻此區域，例如像上述所討論的例子。 在另-個實例中’此安震係被設計成以使電能被施加至此 區域以活化黏著劑之第一與第二部分以接合在一起。在又 另-種例子中，-化學劑係被施加至此區域以活化黏著劑 之第-與第二部分以接合在一起。吾人可注意到黏著劑之 13 200952188 =第-與第二部分亦被設計成用以譬如藉由利用 所的上述方法而成為可非破壞性分開的。 在另-個例示實施例中’請參見圖3，其顯示一光電 = 30。安裝系統30包含固定至一介面|34之一個或多 個先電裝置32a、32b、32c與32d、一基板％以及一裂設 糸統38。於本實施例中，介面層34係布署於此些光電巢 置與基板36之間。裝設系統38可能_於光電安裝 之裝設系統2〇’並結合上述所討論之替代實施例。 在某些實施例中，介面層有助於管理光電安裝之一特❹ 徵，譬如熱、化學、電氣、可燃性、昆蟲控制等。例如， 介面層提供在光電裝置與此表面之間之熱障（thermal barrier)。地域性(locality)可具有對於結構之建築規範需 求’以具有最小量之熱阻(R值）。相較於具有較低R值之 一層’具有高R值之介面層更能絕緣。在另一實施例中， 一聚氨酯介面層係布署於基板與此表面之間。 在另一個實施例中，介面層可能被設計成用以保護此 表面及/或此基板與此些光電裝置免受濕氣。在另一實例ϋ 中，介面層可能被設計成用以提供免受蟲害之保護。又在 又另一種實施例中，介面層可能被設計成用以提供在此些 光電裝置與此表面之間的具有一抗火等級或火災分類之 火焰屏障（flame-barrier)，以使火焰變慢或避免橫越此屏 障。 在另一實施例中，此介面層係為被施加至此表面之一 塗層，其中，非活性區域或基板係可分離地被固定至此塗 200952188 層。在又另一實施例中’介面層係為被塗敷至非活性區域 之未露出侧、基板或中間層之一塗層，其中此些黏著部分 接著被黏至此塗層。在這樣的實施例中，黏著部分是可移 除的，但塗層之一部分亦可從非活性區域、基板或中間層 被移除，而不會使此些光電裝置退化以使得它們變成無法 操作。 ❹200952188 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to the fixing of an optoelectronic device. More particularly, the present invention relates to a mounting system for securing an optoelectronic device wherein the mounting system is also designed to enable the optoelectronic device to be non-destructively separable. [Prior Art] For the generation of electric energy, the installation of optoelectronic devices to commercial and residential structures has recently become more affordable and popular. In addition, optoelectronic I placement designs have evolved to become less bulky and cumbersome to install on these configurations. For example, it is now possible to provide a photovoltaic device in the form of a roll of elastic film that can be unrolled and mounted onto a construction surface that can have a substantially flat area, by structural members, particles or A coating is formed in a substantially planar configuration or conforms to the curvature of the operation of mounting the optoelectronic nest. Ideally, the optoelectronic device can be installed in a simple and fast manner. Some optoelectronic installations involve a rigid frame that is combined with the optoelectronic device or otherwise used to mount the optoelectronic device onto a structure such as the roof of a building or house. In general, the frame is secured by this structure (e.g., drilling) so that the frame is latched or screwed to the structure. In other applications, the optoelectronic device itself may be designed such that a portion thereof is directly threaded or latched to the structure. These types of installations allow access to structures such as water, insects, wind, etc. 200952188. In addition, these installations generally require a solar-powered mosquito to the structure, which adds to the installation of the optoelectronic mil. The above discussion may be due to the fact that they are more likely to experience damage during disassembly. In addition to the shell wearing this structure, the photoelectric device will be repaired. For example, it may be possible to remove the n-surface of the roof - the material lane of the section will seriously damage the material and can be used to make the roof of the house. The installation configuration of the light-optic device can also be configured by a specific structure. The environmental conditions under this community, and/or the architecture and location of the location of this structure are specified. Most commercial and residential building codes require that structure 1 and objects mounted on the structure (eg, light) to resist predetermined loads such as weight, wind and vibration loads (eg, caused by earthquakes) for this structure and Other nearby property or people have adverse effects. Therefore, the inventor of the present invention has recognized the need to fix the photovoltaic device to the mounting line of the structure. The material of the tissue is such that the photovoltaic device can be subsequently non-destructively separated from the structure, and is not required. In the case of repairing the optoelectronic device, it can be installed and operated again. SUMMARY OF THE INVENTION According to an exemplary embodiment, there is provided an apparatus for mounting to a surface with a photovoltaic device. The mounting system includes a mounting member for fixing the non-active (four) domain of the photovoltaic device. surface. The mounting member is designed to be inactive, (4) and the surface is opened 200952188, and the photovoltaic device does not become inoperable due to the separation process. In accordance with another illustrative embodiment, a mounting system for securing an optoelectronic device to a surface is provided. The mounting system includes a plurality of spaced ballast members disposed on an inactive area of the optoelectronic device. These ballast members urge this inactive area against this surface. These ballast members can be non-destructively separated from the inactive area and the optoelectronic device does not become inoperable due to this separation process. According to another illustrative embodiment, a method for securing an optoelectronic device to a surface is provided. The method includes disposing a mounting member along an unexposed side of a substrate having the optoelectronic device secured to an exposed side of the substrate. The method further includes securing the mounting member to the surface. The assembly is designed to enable the substrate to be non-destructively separated from the surface, and the optoelectronic device does not become inoperable due to the aforementioned separation process. [Embodiment] Disclosed herein is a plurality of embodiments for mounting a photovoltaic device in close proximity to a surface of a structure. Considered here = The structure contains various kinds of dwellings, such as residential houses, commercial buildings, and apartments. In addition, the lions that are designed to accommodate non-human habitats and are designed to accommodate the installation of an optoelectronic device are contemplated in the present invention, but are not limited to storage tanks, sinks, portable structures and filaments. ° The surface of the structure as contemplated herein may have a substantially planar surface configuration, such as a corrugated panel-irregular surface, a surface formed by a plurality of particulate particles of stone, gravel, or mud, or 200952188 The finished surface is 'arranged throughout an area to form a substantially horizontal plane' and the optoelectronic device is mounted against the horizontal plane. Here, we consider that the surface on which the photovoltaic device is mounted contains gravel, ground (e.g., mud, stone, or grass), one of which is placed over the surface and under the photovoltaic device. In some applications, the optoelectronic device is mounted on a surface having a radius of curvature of operation for accommodating the optoelectronic device. The non-limiting surface materials considered herein are wood, metal, gravel, dirt or soil, various coatings, and polymeric materials. The embodiments disclosed herein are directed to a rupturing system that is designed to utilize a low or no mounting tool to mount the optoelectronic device against the surface. The mounting system is also designed to be separated from the surface in a non-destructive manner so that the optoelectronic device can be subsequently installed and operated without the need to repair the optoelectronic device. In this way, for a house that is intended to remove an optoelectronic device and then install and operate at another location without causing the optoelectronic device to be inoperable due to the separation process, The device installation system is ideal. A non-destructively separable optoelectronic device may also be desirable for commercial or military applications where a photovoltaic device may be reconfigured to produce an electrical circuit for communication devices. The mounting system is further designed to maintain the optoelectronic device in close proximity to the surface of one of the structures subjected to a predetermined load condition. In several embodiments, the mounting system can be utilized for optoelectronic installations having a horizontal or non-horizontal orientation. The installation system can be designed to maintain the photovoltaic installation 200952188 in close proximity to the structure during environmental conditions that include extreme weather conditions such as strong winds, storms, earthquakes, and the like. In other embodiments, the mounting system is designed to secure an optoelectronic device against a surface having a ramp such that the optoelectronic device is not removed by gravity. It is also contemplated that several embodiments of the mounting system can be designed to detachably secure a variety of optoelectronic devices in a non-destructive manner, including already framed and unframed optoelectronic structures. . In an exemplary embodiment, the mounting system includes at least one mounting member disposed along an unexposed side of one of the substrates or an inactive area of the optoelectronic device, wherein the mounting member utilizes a reproducible combination Separate interference fit fasteners. For example, the mounting member is a snap-fit button type fastener. In another example, the mounting member extends along a length of the substrate, and the mounting member is an elongated male portion that blends a complementary recess portion in an interference fit during twisting. . In other embodiments, it has been considered that the mounting system has a unique configuration of mounting members for securing the optoelectronic device subjected to a predetermined load condition. For example, in one embodiment of an optoelectronic mounting, one of the agricultural components is part of a certain load condition, along the optoelectronics, compared to the remaining mounting members that have not experienced the same load conditions. The device is designed and positioned to maintain a region of the optoelectronic device against the surface. VIII This is a possible configuration for a variety of non-destructively separable systems that are used to secure optoelectronic devices. Further, the configuration of the mounting system, the first or the replacement seismic system considered herein may be modified to match the device design, the load conditions, the current 200952188 field or the photoelectric installation direction. For example, when the optoelectronic mounting system is removed from a high load position and installed at another location of lower load, a smaller number of mounting members on the other hand can be replaced with the previous mounting system. Configuration, because this installation system can be non-destructively separated. In some embodiments, the mounting system disclosed herein may be utilized to secure the optoelectronic device against the surface without the need for any intervening material between the optoelectronic device and the surface. In other embodiments, these mounting systems can be designed with another dielectric or intermediate layer deployed between the optoelectronic device and the surface or between the optoelectronic device and the active region or substrate. The fixing optoelectronic device is placed against the surface. In other embodiments, the optoelectronic device is secured against an intermediate layer, substrate or film that is detachably secured to the surface. In some embodiments of the optoelectronic device, a substrate or film is considered to be one of the inactive regions of the optoelectronic device and an integral portion. In other embodiments, for example, an intermediate layer of a coating is affixed to the surface' and the intermediate layer is not intended to be removed when the photovoltaic device is removed. In several exemplary embodiments, an interface layer, an intermediate layer, a film, a coating or other member, which is a non-limiting example, may be utilized as an insulating layer, a barrier layer or a structural member. Various exemplary embodiments of the following mounting system are described using various embodiments of optoelectronic device mounting. The elements and components shown in the drawings are not to scale, and are shown for clarity, but are not intended to convey limiting information such as shape, orientation, size, weight, and the like. Referring to Figures 1 and 2', a 9 200952188 optoelectronic mounting system 10 is illustrated in accordance with an illustrative embodiment of the present invention. Mounting system 10 includes a plurality of spaced apart optoelectronic devices 12a, 12b, 12c and 12d, and a mounting system 16 secured to a substrate 14. Substrate 14 can comprise any material suitable for a particular application, including the environment, the type of optoelectronic device, and the configuration on which the devices are mounted. For example, in one embodiment, the substrate is a film, such as a commercially available ethylene propylene diene monomer having a thickness of from 0.045 to 0.060 Å, which is commercially available and listed as standard Rubberg Uard EPDM II. (C-EPDM) Rubber Film. In another embodiment, the film is commercially available and listed as Sarnafii S327, G410, Johns Manville SR50 having a thickness of 〇048 to 0.050, one of the thickness of polyethylene (pvc); or commercial a thermoplastic polyalkene (τρ〇) commercially available and classified as GenflexWhite having a thickness of 0.045 to 0.060 Å; and a styrene butadiene styrene (SBS) having a flat and/or granular surface texture Modified asphalt laminates and so on. In other embodiments, the substrate may comprise a reinforcing material such as, but not limited to, polyester, fiberglass or other materials or combinations thereof. The skirting system 16 is designed to secure the photovoltaic device to the substrate 18 as shown in FIG. In the present embodiment, the mounting system 16 includes an adhesive portion 2 that is disposed around the periphery of the substrate 14, as shown in FIG. Adhesive portion 20 is utilized to securely secure substrate 14 to 18. The adhesive portion 2 is further designed to enable a portion of the substrate to be non-destructively separated from the surface 18, and these optoelectronic devices do not become inoperable due to the knife opening process. For example, the adhesive portion 20 200952188 is a double-sided tape that is adhered to the lower surface and surface 18 of the substrate 14 for detachably securing the two together. In an alternate embodiment, a thermal soldering process is utilized to bond the adhesive portion between the substrate and the surface. In an exemplary embodiment, the adhesive portion 2 is a rubberized or butyl component. One such adhesive is exemplified by Sika Corporation, which is commercially available from Madison Heights, Michigan, under the name SikaLastomer® _68.黏 The adhesive portion is designed such that it can be separated from the substrate, the intermediate layer, or one of the inactive areas of the optoelectronic device in a non-destructive manner, and does not render such optoelectronic devices inoperable due to the separation process. of. In a consistent embodiment, when heat is applied to the exposed side of the substrate (generally opposite the adhesive portion), the adhesive portion is designed to degrade and the substrate can be non-destructively separated from the surface. . For example, by heating a portion of the exposed side of the substrate to 1 〇〇〇c for about five minutes to degrade the adhesive portion, the substrate can be non-destructively separated from the surface, so that approximately five pounds can then be utilized. The force, rather than destructively, separates a portion of the substrate or the entire substrate from the surface. In another embodiment, a region of the exposed substrate is cooled to a substantially cold temperature, such as with dry ice, to degrade the adhesive portion so that a portion of the substrate can be non-destructively separated from the surface without The optoelectronic device is rendered inoperable due to the separation process. In still another embodiment, the adhesive portion is designed to degrade when a solution is brought into contact with the adhesive portion, so that a portion of the substrate can be non-destructively separated from the surface without causing the photovoltaic device to separate due to the separation process. It can't be operated. η 200952188 In these embodiments the 'substrate, interface layer, intermediate layer or inactive area may be non-destructively separated, for example, where they are not severed or puncture to separate them from this surface. In other embodiments, slight degradation of the substrate, ^ or inactive areas may degrade the substrate, such as peeling or cracking, when separating them from the surface, without reaching an extent that renders the photovoltaic device inoperable. ▲ In some embodiments, once the substrate is removed from the surface, the adhesive portion is designed such that the residual adhesive can then be substantially removed from the substrate. Degradation and removal of the adhesive may be carried out, for example, by stripping, scraping, rubbing, or application of a granule or other solution, heating, cooling, or a combination thereof. In some embodiments, the composition of the adhesive and/or the means of degrading the adhesive knife will be such that after the substrate is utilized to degrade the adhesive to separate the substrate from the surface, no further processing is required. Processing to remove the adhesive from the substrate. In other embodiments, after the adhesive is degraded to separate the substrate from the surface, the substrate region of the adhesive is subjected to a texturing process similar to sanding, rubbing, etc., to facilitate subsequent application of the adhesive. .另一个 In another illustrative embodiment, the adhesive portion has a two-part configuration whereby their structural state/component changes are used to control when adhesive bonding between such portions occurs. The first portion of one of the adhesives is applied to the underside (or the unexposed side) of one of the substrates (or inactive areas of the optoelectronic device), wherein at that point, the first portion of the adhesive is designed to not Adhesive to contact with a material, such as a skin or a packaging material. In the installation of the optoelectronic device, the second portion of the adhesive 12 200952188 is applied to the surface of the structure, and the substrate (or inactive area) will be fixed thereto. In one embodiment, 'when the substrate is deployed over the surface, the first and second portions of the adhesive are designed to interact with each other in contact so that they are positively joined together. The substrate is fixed to the surface to secure the photovoltaic device against the surface. In another embodiment, the first and/or second portion of the adhesive comprises one of the microcapsules (including an adhesive or a portion thereof) disposed on the substrate to be deployed on the structure. When the second adhesive portion is sandwiched between them, the adhesive microcapsules are broken, so that the content thereof is activated in such a manner as to bond the substrate to the structure. The adhesive microcapsules may be contained in a coating disposed on the substrate or on the surface such that the content components within the microcapsules interact with the coating parent to form a bonding adhesive, or the coating may It is designed to contain only such microcapsules and to allow such content components within such microcapsules to bond the substrate to the surface when the microcapsules are broken and dissolved. In other embodiments, an adhesive © portion comprising microcapsules (if desired) can be used between the optoelectronic device and portions of the substrate. In another embodiment, the first and second portions of the adhesive are activated for bonding together when energy is applied to a region that is generally at or near the adhesive portion. The applied energy can be thermal energy, such as applying heat to or cooling this region, such as the example discussed above. In another example, the shock system is designed such that electrical energy is applied to the region to activate the first and second portions of the adhesive to bond together. In yet another example, a chemical agent is applied to the region to activate the first and second portions of the adhesive to bond together. We may note that the adhesive 13 200952188 = the first and the second part are also designed to be non-destructively separable, for example by utilizing the above described method. In another exemplary embodiment, please refer to Figure 3, which shows a photoelectric = 30. Mounting system 30 includes one or more electrical devices 32a, 32b, 32c and 32d, a substrate %, and a splitting system 38 secured to an interface |34. In this embodiment, the interface layer 34 is disposed between the optoelectronic nest and the substrate 36. The mounting system 38 may be coupled to the optoelectronically mounted mounting system 2' and in conjunction with the alternative embodiments discussed above. In some embodiments, the interface layer facilitates management of one of the features of photovoltaic installation, such as thermal, chemical, electrical, flammability, insect control, and the like. For example, the interface layer provides a thermal barrier between the optoelectronic device and the surface. The locality may have a building specification requirement for the structure to have a minimum amount of thermal resistance (R value). It is more insulating than an interface layer having a higher R value than a layer having a lower R value. In another embodiment, a polyurethane interface layer is disposed between the substrate and the surface. In another embodiment, the interface layer may be designed to protect the surface and/or the substrate from such optoelectronic devices from moisture. In another example, the interface layer may be designed to provide protection from pests. In still another embodiment, the interface layer may be designed to provide a flame-barrier between the photovoltaic device and the surface having a fire rating or fire classification to cause the flame to change. Slow or avoid crossing this barrier. In another embodiment, the interface layer is a coating applied to one of the surfaces, wherein the inactive area or substrate is detachably secured to the layer of coating 200952188. In yet another embodiment, the interface layer is a coating applied to one of the unexposed side, substrate or intermediate layer of the inactive area, wherein the adhesive portions are then adhered to the coating. In such an embodiment, the adhesive portion is removable, but a portion of the coating may also be removed from the inactive area, substrate or intermediate layer without degrading such optoelectronic devices such that they become inoperable . ❹
參見圖4，依據本發明之另一例示實施例顯示—種光 電安裝系統40。安裝系統40包含固定至一基板44之隔開 的光電裝置、42b、42c與42d，以及一裝設系統46。 於本實施例中，裝設系統46包含複數個隔開的黏著部分 其中此些黏著部分將基板44固定至一結構之一表面。 每個黏著部分係被設計成能使基板之—部分可非破壞性 ^與此表面賴，且這些光絲置不會由於分開過 成不能握作。 & ϋ及它們的排列可被設計成用以滿足- 特別關於位置、負_#& J桌，要求’用以緊靠著此表面固定此些 寻 施财’此麵著部分具㈣特配置 = 例而言，於—實施例緊㈣此表面。灣 =有實質上相同的表二 =二==基板與此些光電裝置 與此些光電裝置緊麵此▲相較於被仙以維持基柄 面之其餘的黏著部分，某一象 200952188 目之黏著部分具有—獨特成分，具有基板之接觸表面積， 及/或相對於光電安裝與結構之方向。在另一實施例中， 雙列之黏著部分係沿著基板而被安置於一個或多個位 置，用以將基板與此些光電裝置固定緊靠著此表面。 在一實施例中 .如禾音人確定或一建築規範規定強風 盛行來自一偏北方向，則相較於被利用以將基板固定至此 表面之其餘轉著部分’較多數之黏著部分可被安置於靠 近北方之，裝之那個部分。此外，相較於其餘的黏著部 分’-黏著部分之次組（subset)亦可具有較高強度成分、 在黏著部分之間的不關距、及/或安置靠近較高負載之 位置=較大的接觸表面積。在另—實施例中，雙列之隔開 的黏著部分係被安置魏高貞荷之位置，祕基板與此表 面之間的其他安裝區域利用—單列之隔_黏著部分。當 然在另>ί固實化例中，在於此安裝之其他内部位置具有或 =具有黏著部分的情況下，至少—制之黏著部分係 地繞著光電裝置安襞之周邊被使用。 在另-替代實施财，基板44包含複數個隔開的 =部分(cut〇m)5〇 ’如圖4所示。舉例而言，當此安裳受 ^的風負載條件時，這些切除部分可協助以減少易於從 ，取下光電裝置輕之壓力。在另—個應用中，此些 ^分可助於在1祕件㈣，減少由 ― 二導:於過度拉伸基板之一部分)之基板退化。在力另( 中’此些切除部分可助於減少由於在安裝之後產 材料應力（譬如，導因於熱循環)之基板退化。當然， 16 200952188 利用的切除部分之數目將取決於被設計之此安裝所順應 之特定環境、安裴配置、負載條件等。又在又另一種替^ 實施例中，此安裝系統可結合薄膜(壓力等化閥）用以彌補 與風淨力負載條件相關的不利影響。 當然，安裝系統40之替代實施例相對於圖丨之安妒 糸統10，可包含上述所討論的基板或薄膜材料，且相對於 圖3之安裝系統30亦可利用如所討論的—介面層。此外， 〇 在其他實施例中，基板、非活化層或其他中間層可包含在 結構上被強化或另外被修正之數個部分，以容納數個裝設 構件(像是此些黏著部分）、電氣元件、固定元件、閥^及 其他系統元件。 在其他光電裝置安裝中，吾人可能期望利用一種包含 數個可分開的裝設構件或壓載構件之裝設系統，以固定光 電裝置緊靠著此表面。這些壓載構件及它們的排列可被設 計成用以滿足一特定環境、結構之配置，特別關於位置、 ❹ 負載條件等之一建築規範要求，用以緊靠著此表面固定此 光電裝置。舉例而言，一壓載構件可具有一種配置，其具 有一獨特材料、形狀、尺寸與一質量以適合此應用。某些 非限制例係為：低延長輪廓的高質量構件、圓形形狀、障 礙物、具有一較低質量部分（相較於高質量部分）之兩件 式構件以及有開孔構件。 在某些實施例中，裝設系統利用數個壓载構件，其被 設計成用以緊靠著具有一實質上水平方向或一斜坡之一 表面來固定一光電裴置，俾能使光電裝置安裝或其之一元 200952188 件不會由於重力之影響而移走。 參見圖5 ’依據本發明之一例示實施例顯示一光電安 裝系統60。安裝系統6〇包含一光電裝置62與一裝設系統 64。於本實施例中，裝設系統64包含複數個隔開的壓載 構件66。這些壓載構件係被設計成用以可分離地固定光電 裝置62緊靠著—表面68’如圖6所示。此表面可以譬如 疋像一屋頂表面之一建築表面或供一結構用之一遮蓋 物，如以上所討論的。 於本實施例中，光電裝置62包含結合在一起之一活 性區域70與一非活性區域72。活性區域係為設計成用以 將光轉換成電力之光電裝置之區域。舉例而言，活性區域 70可包含一薄膜雙接面或三接面太陽能電池構造。非活性 區域72係為並未被利用以將光轉換成電力之光電裝置之 區域。在i示實施例中’光電裝置係被製造成能使非活 性區域並非是分離構件，但為從活性區域延伸之整人 分。 σ 於-實施例中，非活性區蜮具有朝遠離活性區域之方 向延伸之類似材料之薄膜構造。在另—實施例中，非活性 區域係由與活性區域不同之材料所建構。在另—實_ 中，#活性區域具有不同於活他區域之厚度。在其他實施 例中，非活性區域之數個，分係在⑽冓上被強化或相反被 修正以容納此些壓载構件或用來可分離地固定這些壓載 構件之蚊元件。此外’在某些實施例中，相對於圖4之 安裝系統4G’非活性區域可Μ如上述所討論的複數個切 18 200952188 除部分。 這些壓載構件66係被設計成用以被快速地且確定地 固定至光電裝置之非活性區域，用以迫使非活性區域（以 及光電裝置之結合的活性區域）緊靠著此表面。此外，這 些壓载構件係被設計成能使它們可以以一種非破壞性的 方式决速地且谷易地與非活性區域分離，且此光電裝置不 會由於分開過程而變成無法操作的。在數個例示實施例 中，這些壓載構件與非活性區域係被設計成能利用一最小 數目之工具，以供此些壓載構件與非活性區域之裝配或移 除。 於一實施例中，此些壓載構件與此非活性區域係被設 計成能不需要工具而將這兩個固定在一起，或用以非破壞 性地從非活性區域分開這些壓載構件。在某些實施例中， 光電裝置可緊罪者此表面被固定’隨後以一種非破壞性的 方式與此表面分離，俾能不使非活性區域退化。在其他實 例中，非活性區域之一部分、基板或中間層可由於—壓載 構件之分離退化’但不應退化至使光電裝置於下一個安裝 時，由於分開過程而變成無法操作的程度。這些壓載構件 與它們的固定配置，係能使這些壓載構件之分離將不需要 切斷或刺孔非活性區域、基板或中間層。 於一實施例中，這些壓載構件66之至少一個係藉由 例如冷接合黏著劑之一黏著劑而可分離地固定至該非，、舌 性區域72。在一替代實施例中，此些壓載構件之至少一個 係利用一黏扣（hook an looP)固定裝置而可分離地固定至 19 200952188 非活性區域。在另—替代實施例巾，此 一個係利用一切古破从 一芏戰稱忏惑主夕 ^。與y , 有螺紋之固定件而被固定至非活性區 拭β σ，此固定件可能是一種具有安置於非活性區 :八延：、Γ露出側)之一平頭之螺*，於此，螺栓之螺紋 二=過非活性區域材料之厚度，並進入或通過布署 區域之露出側上之壓載構件。 在某些實_中’選擇壓載構件之數目、它們的配置 及/或排列’以於光電裝置絲之位置抵抗某些條件，例 如仁並未X限於風貞載、振轉動以及環境元素。例如， 在某些實_巾’這些壓載構件具有—獨特配置以在單一 預定的貞_件顧_光電裝置緊#著此表面。 舉例而§且於一實施例中，一定數目之壓載構件(每 個具有—實質上類似的配置）係沿著非活性區域被排列， 以在一預定風浮力條件期間，於一地理位置，維持非活性 區域與光電裝置緊靠著此表面。在另一實施例中，相較於 被利用以維持光電裝置之非活性區域緊靠著此表面之其 餘的壓載構件，一定數目之壓載構件具有獨特配置及/或 具有非活性區域之接觸表面積，或相對於光電裝置安裝與 結構之方向。在另一個實施例中，雙列或更多列之隔開的 壓载構件係被安置靠近高負荷之位置，而單一列之隔開的 壓載構件可能於此安裝之另一個其他區域被利用，而此安 裝之另一個其他區域可能不會經歷像雙列之壓載構件所 位於之區域之高負荷。 在另一實施例中’接觸非活性區域之壓載構件之一表 20 200952188 面包含-紋理’以使壓载 載構件被置於緊靠著非活性區域時在壓 施例中，非活性區域之_ # ^目^到阻礙。又在另一實 觸的壓載構件沿著非活：：：一：理，其阻礙-接 非活性區域兩者域之移動。當然，壓载構件與 沿著非活㈣域之=制缺理表面，㈣礙壓載構件 在另一例示實施例中，請參見圖7,其顯示—光電 統8〇。安裝系統80包含被固定至-介面層84之-光電裝 置82、—基板86以及具有複數個關的安I或壓載構件 之一裝设系統88。於本實施例中，介面層84係布署於光 電裝置82與基板86之間。介面層84係實質上類似於圖3 ❹Referring to Figure 4, a photovoltaic mounting system 40 is shown in accordance with another illustrative embodiment of the present invention. Mounting system 40 includes spaced optoelectronic devices, 42b, 42c and 42d, and a mounting system 46 that are secured to a substrate 44. In the present embodiment, the mounting system 46 includes a plurality of spaced apart adhesive portions, wherein the adhesive portions secure the substrate 44 to a surface of a structure. Each of the adhesive portions is designed such that the portion of the substrate is non-destructive and conforms to the surface, and the filaments are not allowed to be gripped by separation. & and their arrangement can be designed to be used - especially with regard to position, negative _#& J table, requiring 'to fix this kind of quest for money close to this surface' Configuration = For example, the embodiment is tight (4) for this surface. Bay = has substantially the same table 2 = two = = substrate and these optoelectronic devices and these optoelectronic devices close to this ▲ compared to the other to maintain the remaining part of the base of the adhesive surface, some like 200952188 The adhesive portion has a unique composition with a contact surface area of the substrate and/or a direction relative to the optoelectronic mounting and structure. In another embodiment, the adhesive portions of the double rows are disposed along the substrate in one or more locations for holding the substrate and the photovoltaic devices against the surface. In an embodiment, such as a singer or a building code stipulates that a strong wind prevails from a northerly direction, a greater number of adhesive portions can be placed than the remaining turning portions that are utilized to secure the substrate to the surface. In the vicinity of the north, the part that is loaded. In addition, the sub-set of the adhesive portion may have a higher strength component, a non-close distance between the adhesive portions, and/or a position closer to a higher load than the remaining adhesive portion. Contact surface area. In another embodiment, the spaced apart portions of the double rows are placed in the position of the Wei Gao 贞 load, and the other mounting areas between the secret substrate and the surface are utilized - a single row of _ adhesive portions. Of course, in another embodiment, in the case where the other internal position of the mounting has or has an adhesive portion, at least the adhesive portion is used around the periphery of the photovoltaic device ampoule. In another alternative implementation, the substrate 44 includes a plurality of spaced = portions (cut 〇 m) 5 〇 ' as shown in FIG. For example, these cut-outs can assist in reducing the light pressure of the optoelectronic device when it is subjected to wind load conditions. In another application, these points can be used to reduce substrate degradation in the 1st part (4) by reducing the "two-conductor: one part of the overstretched substrate". In the force of (the 'cutting part can help reduce substrate degradation due to material stress after installation (for example, due to thermal cycling). Of course, the number of cut-off parts utilized by 16 200952188 will depend on the design This installation conforms to the specific environment, ampere configuration, load conditions, etc. In yet another alternative embodiment, the mounting system can be combined with a membrane (pressure equalization valve) to compensate for wind load conditions. Adverse effects. Of course, an alternative embodiment of the mounting system 40 may include the substrate or film material discussed above with respect to the ampule 10 of the figure, and the mounting system 30 relative to FIG. 3 may also utilize - an interface layer. Further, in other embodiments, the substrate, the non-activated layer or other intermediate layer may comprise a plurality of portions that are structurally strengthened or otherwise modified to accommodate a plurality of mounting members (such as this) Adhesive parts), electrical components, fixed components, valves, and other system components. In other optoelectronic device installations, we may wish to utilize a device that includes several separable components. A ballast member mounting system for holding the optoelectronic device against the surface. The ballast members and their arrangement can be designed to meet a particular environment, configuration of the structure, particularly with respect to position, load conditions, etc. A building code requires that the optoelectronic device be secured against the surface. For example, a ballast member can have a configuration that has a unique material, shape, size, and mass to suit the application. Limitations are: high profile members with low profile, circular shapes, obstacles, two-piece members with a lower mass portion (compared to high quality portions), and apertured members. The mounting system utilizes a plurality of ballast members that are designed to hold a photovoltaic device against a surface having a substantially horizontal direction or a slope to enable the photovoltaic device to be mounted or one of its elements. 200952188 pieces will not be removed due to the influence of gravity. Referring to Figure 5, an optoelectronic mounting system 60 is shown in accordance with an exemplary embodiment of the present invention. The mounting system 6 includes a light Apparatus 62 and a mounting system 64. In the present embodiment, mounting system 64 includes a plurality of spaced ballast members 66. These ballast members are designed to detachably secure optoelectronic device 62 against - surface 68' is shown in Figure 6. This surface may be, for example, a building surface of a roof surface or a cover for a structure, as discussed above. In this embodiment, optoelectronic device 62 includes a bond. One active region 70 and one inactive region 72. The active region is a region of a photovoltaic device designed to convert light into electricity. For example, the active region 70 may comprise a thin film double junction or triple junction Surface solar cell construction. The inactive region 72 is a region of an optoelectronic device that is not utilized to convert light into electricity. In the illustrated embodiment, the optoelectronic device is fabricated such that the inactive region is not a separate member. But for the whole person extending from the active area. σ In the embodiment, the inactive zone 蜮 has a film construction of a similar material extending away from the active zone. In another embodiment, the inactive region is constructed from a different material than the active region. In the other, the #active region has a different thickness from the living region. In other embodiments, a plurality of inactive regions, the sub-systems are reinforced on (10) 或 or otherwise modified to accommodate such ballast members or mosquito elements for detachably securing the ballast members. Further, in some embodiments, the inactive area of the mounting system 4G' relative to Figure 4 can be as described in the above-described plurality of cuts 18 200952188. These ballast members 66 are designed to be fast and surely secured to the inactive regions of the optoelectronic device for forcing the inactive regions (and the active regions of the combined optoelectronic devices) to abut against the surface. Moreover, these ballast members are designed such that they can be separated from the inactive area in a non-destructive manner and quickly and inadvertently, and the optoelectronic device does not become inoperable due to the separation process. In several exemplary embodiments, the ballast members and inactive regions are designed to utilize a minimum number of tools for assembly or removal of the ballast members from the inactive regions. In one embodiment, the ballast members and the inactive regions are designed to secure the two together without the need for tools or to non-destructively separate the ballast members from the inactive regions. In some embodiments, the optoelectronic device can be tightly sinned that the surface is fixed' subsequently separated from the surface in a non-destructive manner that does not degrade the inactive area. In other embodiments, a portion of the inactive area, the substrate or the intermediate layer may be degraded by the separation of the ballast member, but should not degrade to the extent that the optoelectronic device becomes inoperable due to the separation process when the next installation. These ballast members are fixedly disposed such that separation of the ballast members will eliminate the need to cut or puncture the inactive areas, substrate or intermediate layer. In one embodiment, at least one of the ballast members 66 is detachably secured to the non-, lingual region 72 by an adhesive such as a cold bond adhesive. In an alternate embodiment, at least one of the ballast members is detachably secured to the inactive area of 19 200952188 using a hook an looP fixture. In another-alternative embodiment of the towel, this one department utilizes all the ancient breaks from the slap of the battle to confuse the main eve ^. And y, a threaded fixing member is fixed to the inactive area wipe β σ, and the fixing member may be a screw having a flat head disposed in the inactive area: eight extensions: Γ exposed side), here, The thread of the bolt 2 = the thickness of the material in the inactive area and enters or passes through the ballast member on the exposed side of the deployment area. The number of ballast members, their configuration and/or arrangement' is selected in some real-modes to resist certain conditions at the location of the optoelectronic filaments, e.g., the kernel is not limited to wind load, vibrational rotation, and environmental elements. For example, in some real-purposes, these ballast members have a unique configuration to hold the surface in a single predetermined condition. By way of example and in an embodiment, a certain number of ballast members (each having a substantially similar configuration) are arranged along the inactive area to be in a geographic location during a predetermined wind buoyancy condition, The inactive area and the optoelectronic device are maintained against the surface. In another embodiment, a certain number of ballast members have unique configurations and/or contacts with inactive areas as compared to the remaining ballast members utilized to maintain the inactive regions of the photovoltaic device against the surface. Surface area, or relative to the orientation of the optoelectronic device mounting and structure. In another embodiment, two or more spaced apart ballast members are placed in close proximity to a high load position, and a single row of spaced ballast members may be utilized in another area of the installation. While another area of the installation may not experience high loads in areas where the double-column ballast members are located. In another embodiment, one of the ballast members contacting the inactive region, Table 20 200952188, includes a texture, such that the ballast carrier member is placed in close proximity to the inactive region, in the embodiment, the inactive region _ # ^目^ to the obstacle. In another, the ballast member of the actual contact is moved along the non-active:::, the barrier-to-inactive region. Of course, the ballast member is along with the non-active (four) domain, and the fourth is the ballast member. In another exemplary embodiment, see Fig. 7, which shows the photovoltaic system 8〇. The mounting system 80 includes an optoelectronic device 82 that is secured to the interface layer 84, a substrate 86, and an mounting system 88 having a plurality of I or ballast members. In this embodiment, the interface layer 84 is disposed between the photo-electric device 82 and the substrate 86. Interface layer 84 is substantially similar to Figure 3 ❹
之安裝系統30之介面層34,且相對於介面層34可具有如 上述所討論的替代形式。當然，在數個替代實施例中，相 對於圖1之安裝系統1〇之基板14’基板86可具有如上述 所討論的替代形式。裝設系統88可能類似於光電安裝60 之裝設系統64及/或結合以上所討論的替代實施例。 參見圖8，其顯示依據又另一例示實施例之一光電安 裝系統100。安裝系統100包含複數個隔開的光電裝置 102a、102b、102c與l〇2d ’ 一基板104以及一裝設系統 106。於本實施例中，裝設系統1〇6包含複數個隔開的壓 載構件108。這些壓載構件係被設計成用以固定基板 1〇4(具有固定至此處之此些光電裝置）緊靠著一表面。這些 壓載構件係更進一步被設計成用以可非破壞性地與基板 分開，且這些光電裝置並不會由於分開過程而變成無法操 21 200952188 作。於本實施例中，基板1〇4亦包含複數個隔開的切除 分110，其目的係實質上類似於如上述所討論的圖4之ς 裝系統40之此些切除部分50。 在具他替代實施例中 〜二比什你刊用一爆恭 件遮蓋物而固定至光電裝置之非活性區域或固定至— 間層或基板。錢樣的實蘭中，此賴鶴件 ^非活性區域或基板之—露出區域，且可經由遮蓋物而 为離地被m定於適當位置。此遮蓋物 板接觸之壓載構件上面。在某些實關ΐ =係為4被布署在壓㈣件上面且可分離地 性？域或固定至基板之分離元件。在-替代實施=非: 遮盍物係為非活性區域或基板之整合部分。、1 ^ 定構壓載構件輕物包含—遮蓋物固 板之-互補固定構件。在某些應 次絲 壓載構件之獨特配^適合-特相對於㈣部分與 利用複數個固定構件之懕生、兄及/或負载條件， 置，以適合類似於以上討排:可具有-獨特配 中，當此些壓载構件可^在一個例示實施例 稱件了靶貫質上類似時，相#一 裝之另-條置之聽的壓 ^於位於此= 物/固定構件可具有-較高強度的配置τ之此些遮蓋 構件岐於受到較高域之心將數撼載 在於此所考慮之數 各種配置，例如&彳中，此些固定構件可具有 了降解的/可移除的黏著劑、黏扣固定件 22 200952188 (hook and loop fasteners)、按扣配合元件或滑扣（slide and lock)式機構。黏扣固定件包含金屬，塑膠式機械元件或如 由新罕布夏州總部設在曼徹斯特之Velcr〇 USA公司所供 應之Velcro產品。在其他實施例中，中間層、非活性區域^ 基板或介面層包含數個部分，其在結構上被強化或另外被 修正以容納此些固定構件於一位置。 在又另一替代實施例中，此些壓載構件本身可具有一 ❹ 配置，於此一壓载固定構件係為壓載構件之一整合部分， 其被設計成用以可分離地固定至非活性區域或基板之一 互補固定構件。例如，此些壓載構件可具有數個完整的固 定構件，例如黏著劑、黏扣固定裝置、按扣配合元件或滑 扣式機構。在另一替代實施例中，一壓載固定構件係為一 遮蓋物，其具有屬合一互補基板固定構件之一遮蓋物固定 構件。 在另例中 壓載構件包含強迫韻洽—互補式母部 ❹ 一按扣配合公部分，藉以可分離地固定此壓載構件緊 罪著此基板。在另一例中，接合至壓載固定構件之一元件 係可滑動地售合-互補式基板固定構件，並結合可分離地 固定此壓載固定構件之一餐合鎖與此基板固定構件，用以 可分離地固定此壓栽構件緊靠著此基板。在某些實施例 中，可分開的嚅合鎖住機構以一種類似於一座位安全帶帶 扣之方式運作。在數個替代實施例中，除了數個固定構件 以外’可使用一麗戴構件遮蓋物以將壓載構件固定至非活 性區域或固定至此基板。 23 200952188 吾人亦考慮到在某些應用中，一裝設系統包含黏著部 分與壓載構件之一組合，其被利用以可分離地將一光電裝 置固定至-表面。又’在光電裝置係從—個位置遷移至另( 一個具有一不同環境條件及/或結構之位置之1他應用 中，吾人可能期望將習知裝設系統改變成—不同;^裝言;系 統以容納新的安裝。於此，打算使此些黏著部分配置與壓 載構=配置之某些實施例，能可非破壞性地被移除離開此 些黏者7G件，所以裝設祕之—新配置可與此些遷移的光 電裝置一起被利用以適合新安I。 逢2亦考慮在另-實施例中，光電裝置麵破壞性地 黏者在基板上面此基板係布署在不酬的表面，例如 但並未受限於像㈣、泥地、草地等之上面。這些黏著方 述關於黏著劑及/或壓載構件之應用所;論之那 _在/進—步的替代實施例中，複數個關的壓載構件 =上面’用以迫使光電裴置緊靠著此表面。於本實： 未被固定至非活性wf?的緣故，此些壓載構件並 被口疋至非雜&域，但迫使非活 表面。在-例示實施例中，此 β冢罪者此女装 譬如受制於風負載之表面積，;j構㈣被開孔以縮小 性區域或基板維持著緊靠著1丨些壓麟件能使非活 氣體力學地被料成=====亦可以 構件。舉例而言，壓能移走此些壓戴 匕έ 圓形部分或一錐面部 24 200952188 分等等，以降低壓載構件由於風負載被移走之機會。在另 -替代實施例中，這些隔開的壓载構件可與延伸經由此些 開孔部分之例如_或桿之—連接構件一起被連接。財 實施例中’任何—個壓載構件係相對於其他壓載構件（當 它們受到-強風負載時)較不可能移動—段長距離。 在又另-替代實施例中’此些壓載構件亦具有用以插 入與移除—壓載材料之—手段。舉例而言，此些壓載構件 ❹ 彳具有-裝填Π與-排茂口’或—可分開部分，用以填滿 並隨後移除此壓載材料。具有此種配置之數健載構件在 選擇與改顏載材料上，可具有利用性與彈性以適合待裝 設有光電裝置之-特定環境及/或負載條件。剛剛所討論 之數個壓載構件之配置在不必傳送重的壓載構件上亦提 供好處。 在某些實施例中，可將此些自由隔開的㈣構件設計 成能使此些壓載構件之一第一部分之設計與安置，能用以 纟例如-強風負载或—振動負載之—環境條件期間，維持 光電裝置之-部分緊靠著此表面。此些廢載構件之一第二 部分具有不同的配置與定位，用以在不同於壓載構件經歷 之第一部分之一負載條件期間，將光電裝置之另一個部分 維持緊靠著此表面。當然，利用數個自由隔開的壓載構件 之-光电裳置安裝，係可包含如上述所討論的一層或多 層，例如一中間層、薄臈或一介面層。 口人更進一步考慮到於此所討論之數個實施例亦町 被設計成用以遵循由例如Underwriters Laboratory或 25 200952188The interface layer 34 of the mounting system 30 can have an alternative form as discussed above with respect to the interface layer 34. Of course, in a number of alternative embodiments, the substrate 14' substrate 86 relative to the mounting system 1 of Figure 1 may have an alternative form as discussed above. Mounting system 88 may be similar to mounting system 64 of optoelectronic mounting 60 and/or in combination with the alternative embodiments discussed above. Referring to Figure 8, there is shown an optoelectronic mounting system 100 in accordance with yet another illustrative embodiment. Mounting system 100 includes a plurality of spaced apart optoelectronic devices 102a, 102b, 102c and a substrate 102 and a mounting system 106. In the present embodiment, the mounting system 1 6 includes a plurality of spaced apart ballast members 108. These ballast members are designed to hold the substrate 1〇4 (having such optoelectronic devices fixed thereto) against a surface. These ballast members are further designed to be non-destructively separable from the substrate, and these optoelectronic devices are not rendered inoperable by the separation process. In the present embodiment, substrate 1 〇 4 also includes a plurality of spaced apart cut-out portions 110 that are substantially similar to such cut-away portions 50 of mounting system 40 of Figure 4 as discussed above. In an alternative embodiment, it is fixed to the inactive area of the optoelectronic device or to the interlayer or substrate using a blaster cover. In the solid sample of the money sample, the inactive area or the substrate-exposed area can be positioned at an appropriate position for the grounding by the covering. This cover plate contacts the top of the ballast member. In some cases ΐ = is 4 being deployed on the pressure (four) pieces and separable? Domain or separate component that is fixed to the substrate. In-Alternative Implementation = Non: The concealer is an inactive area or an integral part of the substrate. , 1 ^ The structure of the ballast member light object comprises - a complementary fixing member of the covering solid plate. In some of the secondary ball ballast members, the unique fit is appropriate to the (four) part and the use of a plurality of fixed members of the twin, brother and / or load conditions, so as to fit similar to the above: may have - In a unique match, when the ballast members can be similar in the target quality of an exemplary embodiment, the pressure of the phase-loading is located at the object/fixing member. Such covering members having a higher-strength configuration τ are placed in a variety of configurations as contemplated by the higher-domain, such as &彳, which may have degradation/ Removable adhesive, fastener holder 22 200952188 (hook and loop fasteners), snap fit component or slide and lock mechanism. The fasteners are made of metal, plastic mechanical components or Velcro products supplied by Velcr〇 USA, headquartered in Manchester, New Hampshire. In other embodiments, the intermediate layer, inactive area substrate or interface layer comprises a plurality of portions that are structurally reinforced or otherwise modified to accommodate such fixed members in one location. In still another alternative embodiment, the ballast members may themselves have a ❹ configuration, where the ballast fixed member is an integral part of the ballast member that is designed to be detachably secured to the One of the active regions or the substrate is a complementary fixing member. For example, such ballast members can have a plurality of integral securing members, such as adhesives, fastener fasteners, snap fit elements, or snap-on mechanisms. In another alternative embodiment, a ballast securing member is a covering having a covering securing member that is a complementary substrate securing member. In another example, the ballast member includes a forced-mechanical-complementary female ❹ a snap fit with the male portion whereby the ballast member is detachably secured against the substrate. In another example, the component bonded to one of the ballast fixing members is slidably sold-complementary substrate fixing member, and detachably fixes one of the ballast fixing members and the substrate fixing member, The platen member is detachably fixed to abut against the substrate. In some embodiments, the detachable twist-lock mechanism operates in a manner similar to a seat belt buckle. In a number of alternative embodiments, a lacing member cover can be used in addition to a plurality of securing members to secure the ballast member to the inactive region or to the substrate. 23 200952188 We also consider that in some applications, a mounting system includes a combination of an adhesive portion and a ballast member that is utilized to detachably secure an optoelectronic device to the surface. In addition, in the application of the photovoltaic device from one location to another (a location with a different environmental condition and / or structure, we may wish to change the conventional installation system to - different; ^ word; The system is intended to accommodate a new installation. Here, it is intended that such an adhesive portion configuration and ballast configuration = some embodiments of the configuration can be removed non-destructively away from the 7G pieces of the adhesive, so the installation secret The new configuration can be utilized with such migrated optoelectronic devices to suit Xin'an I. Also considered in another embodiment, the photovoltaic device is destructively adhered to the substrate and the substrate is deployed. Surfaces, for example, but not limited to, on top of (4), mud, grass, etc. These adhesions describe the application of adhesives and/or ballast members; In the example, a plurality of closed ballast members = above 'used to force the photovoltaic device to abut against the surface. In the present: not fixed to the inactive wf?, the ballast members are smashed to Non-hetero&domain, but forcing non-active surfaces. In the exemplified embodiment The β 冢 者 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此==== It is also possible to construct components. For example, the pressure energy can remove such a press-fit 圆形 circular portion or a tapered surface portion 24 200952188 minutes, etc., to reduce the chance that the ballast member will be removed due to wind load. In an alternative embodiment, the spaced ballast members may be coupled with a connecting member such as a rod extending through the aperture portions. In the embodiment, 'any one ballast member is relative to the other Ballast members (when they are subjected to a strong wind load) are less likely to move - long distances. In yet another alternative embodiment, 'the ballast members also have means for inserting and removing - ballast material" By way of example, the ballast members have a -filling and draining port or a separable portion for filling and subsequently removing the ballast material. It can be used and used in the selection and modification of the material. To suit the particular environment and/or load conditions in which the optoelectronic device is to be installed. The configuration of the several ballast members just discussed also provides benefits in ballast members that do not have to carry heavy weight. In some embodiments, The freely spaced (four) members are designed such that the first portion of one of the ballast members can be designed and positioned for use in, for example, a strong wind load or a vibration load during an environmental condition to maintain the optoelectronic device - Partially abutting the surface. The second portion of one of the waste-carrying members has a different configuration and positioning for maintaining another portion of the photovoltaic device during a load condition different from the first portion of the ballast member experienced Adjacent to this surface, of course, the use of a plurality of freely spaced ballast members may include one or more layers as discussed above, such as an intermediate layer, a thin layer or an interfacial layer. The mouth further considers that the several embodiments discussed herein are also designed to be followed by, for example, Underwriters Laboratory or 25 200952188.
Factory Mutual(UL/FM)之一組織所設定之規格。舉例而 言’包含一非破壞性可分開的裝設系統之光電襞置安裝滿 足針對材料、尺寸、重量、強度、電氣、火/火焰、昆蟲、 。齧齒動物等規格之某些組織需求。 雖然上述說明已針對利用用以固定光電裝置之非破 壞性可分開的裝設系統之光電裝置安裝之某些實施例 本發明之原理係適用於於此未揭露之光電裝 ~The specifications set by one of Factory Mutual (UL/FM). For example, the installation of a photovoltaic device comprising a non-destructive and detachable mounting system is sufficient for material, size, weight, strength, electrical, fire/flame, insects. Certain organizational needs such as rodents. Although the above description has been directed to certain embodiments of optoelectronic device mounting using a non-destructive detachable mounting system for securing optoelectronic devices, the principles of the present invention are applicable to such unexposed photovoltaic devices.
=^例。鑒於於此所提供之教導，熟f本者^ 白本發明之其他修改與變化。前文 :者將明 明，但並不打算成為其實行上之_。’以下=例之說 範嘴之包含所㈣效糾之申請專利範圍。為I疋本發明=^ Example. In view of the teachings provided herein, other modifications and variations of the invention are apparent. The above: The person will be clear, but it is not intended to be implemented. ‘The following=examples】 The scope of the patent application for the inclusion of the mouth of the mouth (4). For the present invention
26 200952188 【圖式簡單說明】 圖1係為一光電裝置安裝系統之平面視圖，其顯示依 據本發明之一例示實施例之用以將光電裝置固定至一表 面之一裝設系統； 圖2係為沿著圖1之視線2-2之光電裝置安裝系統之 剖面圖； 圖3係為依據本發明之一替代例示實施例之一光電裝 置安裝系統之剖面圖； 圖4係為一光電裝置安裝系統之平面視圖，其顯示依 據本發明之另一例示實施例之用以將光電裝置固定至一 表面之一替代裝設系統； 圖5係為一光電裝置安裝系統之平面視圖，其顯示依 據本發明之另一例示實施例之用以將光電裝置固定至一 表面之另一個替代裝設系統； 圖6係為沿著圖5之視線6-6之光電裝置安裝系統之 剖面圖； 圖7係為依據本發明之另一替代例示實施例之一光電 裝置安裝系統之剖面圖；以及 圖8係為一光電裝置安裝系統之平面視圖，其顯示依 據本發明之另一個例示實施例之用以將光電裝置固定至 一表面之另一種替代裝設系統。 27 200952188 【主要元件符號說明】 ίο:光電安裝系統 12a、12b、12c、12d :光電裝置 14 :基板 16 :裝設系統 18 :表面 20 :黏著部分/裝設系統 30 :光電系統/安裝系統 32a、32b、32c、32d :光電裝置 34 :介面層 36 :基板 38 :裝設系統 40 :光電安裝系統 42a、42b、42c、42d :光電裝置 44 ··基板 46 :裝設系統 48 :黏著部分 50 :切除部分 60 :光電安裝系統 62 :光電裝置 64 :裝設系統 66 :壓載構件 68 :表面 70 :活性區域 28 200952188 72 :非活性區域 80 :光電系統/安裝系統 82 :光電裝置 84 :介面層 86 :基板 88 :裝設系統 100 :光電安裝系統 102a、102b、102c、102d :光電裝置 104 :基板 106 :裝設系統 108 :壓載構件 110 :切除部分 Ο 2926 200952188 [Simplified illustration of the drawings] Figure 1 is a plan view of a photovoltaic device mounting system showing a mounting system for securing a photovoltaic device to a surface in accordance with an exemplary embodiment of the present invention; 1 is a cross-sectional view of a photovoltaic device mounting system along line 2-2 of FIG. 1; FIG. 3 is a cross-sectional view of a photovoltaic device mounting system in accordance with an alternative embodiment of the present invention; FIG. 4 is a photovoltaic device mounting A plan view of the system showing an alternative mounting system for securing an optoelectronic device to a surface in accordance with another exemplary embodiment of the present invention; FIG. 5 is a plan view of a photovoltaic device mounting system, shown in accordance with the present disclosure Another alternative embodiment of the invention for securing the optoelectronic device to a surface; Figure 6 is a cross-sectional view of the optoelectronic device mounting system along line 6-6 of Figure 5; A cross-sectional view of a photovoltaic device mounting system in accordance with another alternative embodiment of the present invention; and FIG. 8 is a plan view of a photovoltaic device mounting system, shown in accordance with the present invention The embodiment to another exemplary embodiment of the photovoltaic device secured to a surface of another alternative mounting system. 27 200952188 [Description of main component symbols] ίο: Photoelectric mounting system 12a, 12b, 12c, 12d: Optoelectronic device 14: Substrate 16: Mounting system 18: Surface 20: Adhesive part / Mounting system 30: Photoelectric system / mounting system 32a 32b, 32c, 32d: optoelectronic device 34: interface layer 36: substrate 38: mounting system 40: optoelectronic mounting system 42a, 42b, 42c, 42d: optoelectronic device 44 · substrate 46: mounting system 48: adhesive portion 50 : Cut-out portion 60: Photoelectric mounting system 62: Optoelectronic device 64: Mounting system 66: Ballast member 68: Surface 70: Active region 28 200952188 72: Inactive region 80: Photovoltaic system / Mounting system 82: Optoelectronic device 84: Interface Layer 86: Substrate 88: Mounting System 100: Photovoltaic mounting system 102a, 102b, 102c, 102d: Optoelectronic device 104: Substrate 106: Mounting system 108: Ballast member 110: Cut-away portion Ο 29