TW200951443A - Probe device - Google Patents

Probe device

Info

Publication number
TW200951443A
TW200951443A TW098111988A TW98111988A TW200951443A TW 200951443 A TW200951443 A TW 200951443A TW 098111988 A TW098111988 A TW 098111988A TW 98111988 A TW98111988 A TW 98111988A TW 200951443 A TW200951443 A TW 200951443A
Authority
TW
Taiwan
Prior art keywords
space
card
probe
performance board
probe device
Prior art date
Application number
TW098111988A
Other languages
Chinese (zh)
Other versions
TWI386648B (en
Inventor
Kenichi Washio
Masashi Hasegawa
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW200951443A publication Critical patent/TW200951443A/en
Application granted granted Critical
Publication of TWI386648B publication Critical patent/TWI386648B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A kind of probe device is disclosed to prevent eccentric load acting on between electrodes and contact terminals so as to achieve accurate test. In this probe device, a first and second sealing members are used to maintain air-tight status from outside for a first space between chuck top and a probe card supported by a card platform, as well as the second space between the probe card and a performance board supported by the card platform, and to make the first space and second space exhaust through a first and second exhaust path, respectively. An intermediate plate disposed underneath the performance board abuts against both the probe card and the performance board.
TW098111988A 2008-06-03 2009-04-10 Probe device TWI386648B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008146053A JP5258395B2 (en) 2008-06-03 2008-06-03 Probing device

Publications (2)

Publication Number Publication Date
TW200951443A true TW200951443A (en) 2009-12-16
TWI386648B TWI386648B (en) 2013-02-21

Family

ID=41543635

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098111988A TWI386648B (en) 2008-06-03 2009-04-10 Probe device

Country Status (3)

Country Link
JP (1) JP5258395B2 (en)
KR (1) KR101034980B1 (en)
TW (1) TWI386648B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583963B (en) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 Probe card
TWI583975B (en) * 2011-12-08 2017-05-21 Tokyo Electron Ltd Wafer inspection interface and wafer inspection device
TWI667484B (en) * 2018-08-03 2019-08-01 矽品精密工業股份有限公司 Testing device
CN114072682A (en) * 2019-03-20 2022-02-18 塞莱敦体系股份有限公司 Portable probe card assembly

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5448675B2 (en) * 2009-09-25 2014-03-19 パナソニック株式会社 Probe card and semiconductor wafer inspection method using the same
JPWO2012023180A1 (en) * 2010-08-17 2013-10-28 株式会社アドバンテスト Connection apparatus, semiconductor wafer test apparatus including the same, and connection method
JP5675239B2 (en) 2010-09-15 2015-02-25 東京エレクトロン株式会社 Wafer inspection interface and wafer inspection apparatus
US8405414B2 (en) * 2010-09-28 2013-03-26 Advanced Inquiry Systems, Inc. Wafer testing systems and associated methods of use and manufacture
JP2012163529A (en) * 2011-02-09 2012-08-30 Micronics Japan Co Ltd Contactor and inspection device
KR101227547B1 (en) * 2011-07-15 2013-01-31 주식회사 세디콘 Probe card
JP5926954B2 (en) * 2011-12-28 2016-05-25 株式会社日本マイクロニクス Probe card parallel confirmation method, parallel confirmation apparatus, probe card and test head
JP5629723B2 (en) * 2012-04-12 2014-11-26 株式会社アドバンテスト Semiconductor wafer testing method
JP6031292B2 (en) 2012-07-31 2016-11-24 東京エレクトロン株式会社 Board contact method to probe card
JP5993649B2 (en) * 2012-07-31 2016-09-14 東京エレクトロン株式会社 Substrate abutting device to probe card, substrate inspection device provided with substrate abutting device, and substrate abutting method to probe card
JP6084882B2 (en) * 2013-04-04 2017-02-22 株式会社日本マイクロニクス Probe assembly and probe board
JP6289962B2 (en) * 2013-07-11 2018-03-07 東京エレクトロン株式会社 Probe device
CN116534299A (en) 2014-03-13 2023-08-04 多韧系统有限责任公司 Unmanned aerial vehicle configuration and battery augmentation for unmanned aerial vehicle internal combustion engines, and related systems and methods
KR101688989B1 (en) * 2015-10-30 2016-12-22 스테코 주식회사 Ic separation equipment
JP2023102503A (en) * 2022-01-12 2023-07-25 株式会社日本マイクロニクス Probe card and inspection system

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3172760B2 (en) * 1997-03-07 2001-06-04 東京エレクトロン株式会社 Vacuum contactor
JP3467394B2 (en) * 1997-10-31 2003-11-17 松下電器産業株式会社 Burn-in wafer cassette and probe card manufacturing method
JPH11183522A (en) 1997-12-22 1999-07-09 Tokyo Cathode Laboratory Co Ltd Method and device for cleaning probe card
JPH10321686A (en) * 1998-04-28 1998-12-04 Tokyo Electron Ltd Burn-in device
JP3497748B2 (en) * 1998-11-13 2004-02-16 松下電器産業株式会社 Inspection method for semiconductor integrated circuit
JP4346752B2 (en) * 1999-01-29 2009-10-21 東京エレクトロン株式会社 Contactor holding mechanism and contactor automatic changing mechanism
EP1183604A2 (en) * 1999-05-27 2002-03-06 Nanonexus, Inc. Test interface for electronic circuirts
JP3857871B2 (en) * 2000-11-06 2006-12-13 オリオン機械株式会社 Semiconductor wafer inspection equipment
JP2003188217A (en) 2001-12-18 2003-07-04 Seiko Epson Corp Chip for needle, semiconductor wafer having the same, probe card and manufacturing method thereof, and probe apparatus and inspecting method using them
JP4037726B2 (en) 2002-10-02 2008-01-23 東京エレクトロン株式会社 Vacuum probe apparatus and vacuum probe method
JP4563700B2 (en) * 2004-03-16 2010-10-13 東京エレクトロン株式会社 Vacuum probe apparatus and vacuum probe method
JP4066265B2 (en) 2004-03-24 2008-03-26 横河電機株式会社 Contact ring of semiconductor test equipment
JP2006032593A (en) * 2004-07-15 2006-02-02 Renesas Technology Corp Probe cassette, semiconductor tester and method for manufacturing semiconductor device
TWI466205B (en) * 2006-06-06 2014-12-21 Advanced Inquiry Systems Inc Methods and apparatus for bimodal wafer testing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583975B (en) * 2011-12-08 2017-05-21 Tokyo Electron Ltd Wafer inspection interface and wafer inspection device
TWI583963B (en) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 Probe card
TWI667484B (en) * 2018-08-03 2019-08-01 矽品精密工業股份有限公司 Testing device
CN110794176A (en) * 2018-08-03 2020-02-14 矽品精密工业股份有限公司 Detection device
CN110794176B (en) * 2018-08-03 2022-05-31 矽品精密工业股份有限公司 Detection device
CN114072682A (en) * 2019-03-20 2022-02-18 塞莱敦体系股份有限公司 Portable probe card assembly

Also Published As

Publication number Publication date
JP2009295686A (en) 2009-12-17
KR20090126179A (en) 2009-12-08
TWI386648B (en) 2013-02-21
JP5258395B2 (en) 2013-08-07
KR101034980B1 (en) 2011-05-17

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