200949475 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種半導體製造的電腦整合製造，且 特別是有關於〜種偵測設備自動化系統（ΕΑΡ)與設備（Tool) 間連線異常的方法。 【先前技術】 隨著積體電路（IC)設計的複雜度增加，半導體製程的 複雜度也隨之増加。因此，必須運用大量自動化設備來輔 助各種製造流程的順利進行。 電腦整合製造（Computer Integrated Manufacturing， CIM )即是一種將製造生產中所需的控制整合於電腦中進 行。在半導體製造廠中，已經廣泛使用電腦整合製造的技 術。電腦整合製造系統是整合許多的子系統，如設備自動 化系統（Equipment Automation Program，ΕΑΡ)、製造執行 系統（Manufacture Executing System，MES)、先進製程控 制技術（Advance Process Control ’ APC)等。這些系統透過 網路連線，如乙太網路（TCP/IP)與各種設備（Tool)間連線， 以進行控制設備、收集設備資料等工作。 SECS(SEMI Equipment Communication Standard)為 SEMI ( Semiconductor Equipment and Materials Internationa卜半導體設備與材料國際連盟）所制訂的一種 半導體設備通訊標準。透過這個標準所提供對外的通訊介 面，使ΕΑΡ與設備間建立連線。 200949475 高速 SECS 訊息服務（High Speed Message Services， HSMS)為SECS標準中，一種提供高速傳輸速率的通訊協 定之一，亦為目前設備連線作業中，主要使用的通訊協定 --- 在現有的半導體設備網路架構中，主要是透過設備自 動化系統（ΕΑΡ)與設備連線，設備自動化系統再與後端系 統如製造執行系統（MES)、先進製程控制技術（APC)等連 線。設備自動化系統與設備間是藉由交換器（Switch)連 接。此外，基於維修、操作方便性、系統穩定性的考量， 在現有的半導體設備網路架構中會設計有兩套設備自動 化系統，這兩套設備自動化系統會被配置於廠區中的不同 位置或樓層。 設備自動化系統會與骨幹交換器（Core Switch)連接， 骨幹交換器再與複數週邊交換器（Edge Switch)連接，週邊 交換器再與設備連接，以建立網路連線。一般的情形下， 僅會由其中的一套設備自動化系統進行運作，另一套設備 自動化系統則為待命狀態（Standby)。一旦運作中的設備自 動化系統發生異常，或是其他需求，可立即透過交換器的 切換，使待命狀態中的設備自動化系統進行運作，以防止 整個系統的停擺。 然而，此一對設備自動化系統切換的過程，會造成網 路瞬斷，設備自動化系統與設備間的連線可能因此造成斷 線（Disconnect)，必須以手動方式重新進行連線，可能造成 製程上的影響與半成品的損失。以手動方式重新進行連線 200949475 也造成人力的增加與作業的不方便。 此外，設備自動化系統與設備 因產生斷線，此時 其他原 新進行連線的卫作，靠手動方式進行檢測以及重 作，同樣產生前述的問題。 因此，有必要提出—種新的半導體製造設備 :方：’以解決或克服現有半導體製 ； 法的問題，來提升生產效率。 堤深的皿測方 ❹ 【發明内容】 本發明的目的是在提供—種半導體製造設備連線的 監測方法，用以降低因設備連線異常或斷線，所造成對製 程的影響程度。 、依照本發明之—種半導體製造設備連線的監測方 法包含使用【控模組分別與設備自動化系統（ΕΑΡ)連 線’其中设備自動化系統分別與設備(τ〇〇1)連線，兩者間 並具有-連線狀態以及—斷線狀態。同時使用監控模組收 集斷線狀態的設備數量’並判斷收集到的斷線狀態的設備 數®是否超出一預定條件，如是，則監控模組主動發出一 自我檢查命令給所有的設備自動化系統。各設備自動化系 統於收到該自我檢查命令後，進行其以及與其連線設備間 的自動連線的作業。 其中’預定條件可包含一預定期間以及一預定數量的 斷線狀態。預定期間可為3秒，而預定數量可為70個斷 線狀ill的設備。 200949475 當設備自動化系統於收到該自我檢查命令後，進行其 與該些設備間的自動連線的作業的步驟包含：向各該設備 發出一網路訊息回應偵測命令。若設備自動化系統未收到 或逾時收到各該設備的回應，則設備自動化系統進入一再 勒始化程序。再初始化程序係為設備自動化系統關閉與各 忒叹備的通訊埠後，再重新開啟與各該設備的通訊埠，以 重新建立其與各該設備的連線。 ❸ 其中s亥網路訊息回應偵測命令係使用HSMS下的 S1F1 指令，即 Stream L —n i( Are You There Request) 指令 本發明所能達成的功效在於： 透過監控模組監控設備自動化系統與設備間的連線 狀態，當斷線數量達到預定條件時’即由監控模組主動觸 發。又備自動化系統進行自動重新連線的作業，可以節省人 工手動自動重新連線作業的時間與成本。 參 θ日夺，自冑t新連線的#業可以減少因設備斷線所造 成的對製造程序的影響，可以提高生產效率。 【實施方式】 凊參照第1圖，半導體製造的電腦整合製造系統中， 包s製造執行系統（MES)l〇〇、複數設備自動化系統 (EAP)110以及複數設備12〇。其中製造執行系統1〇〇分別 與設備自動化系統i! 0連線，而設備自動化系统i i 〇再八 別與設備12G連線。-般來說，設備m的數量約在^ 8 200949475 σ以上。攻備自動化系統110與設備120分別具有一連線 狀態以及一斷線狀態。 凊進一步參照第2圖，本發明一實施例之半導體製造 设備連線的檢測方法，係使用一監控模組140，監控模組 14〇分別與設備自動化系統110連線，透過設備自動化系 統110可以進行設備120連線狀態的監測作業。 由於設備自動化系統110與設備120間若產生斷線， H 可由設備自動化系統no得知。依照本發明之檢測方法， 係利用監控模組140收集設備120斷線狀態的數量，如步 驟210所示。當設備120斷線狀態的數量超出一預定條件 時，如步驟220所示，則監控模組14〇發出一自我檢查命 令給所有的設備自動化系統丨丨〇，如步驟23 〇所示。當設 備自動化系統11 〇收到此一自我檢查命令後，即進行自動 連線的作業，自動建立其與設備i 2〇之間的連線。 在一實施例中，若以800台設備120為例子來作說 藝明，則會有800個連線存在設備自動化系統11 〇與設備12〇 間。而預定條件則設為在3秒内，若監控模組ι4〇須測到 有超過70個設備120斷線狀態，監控模組1々Ο即向所有 的狄備自動化糸統110發出自我檢查命令，使每一設備自 動化系統110與設備120(在本實施例中為8〇〇台）確認連線 狀態或是重新連線。 請參照第3圖’當設備自動化系統1丨〇收到自我檢查 命令，會向設備120發出一網路訊息回應偵測命令，如使 用 HSMS 下的 S1F1 (Stream 1 Function 1 : Are You There 200949475200949475 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a computer integrated manufacturing of semiconductor manufacturing, and in particular to a connection abnormality between a detection device automation system (ΕΑΡ) and a device (Tool) Methods. [Prior Art] As the complexity of integrated circuit (IC) design increases, the complexity of semiconductor processes increases. Therefore, a large number of automated equipment must be used to assist in the smooth implementation of various manufacturing processes. Computer Integrated Manufacturing (CIM) is a process that integrates the controls required for manufacturing into a computer. In semiconductor manufacturing plants, technology for computer integrated manufacturing has been widely used. The computer integrated manufacturing system integrates many subsystems, such as the Equipment Automation Program (ΕΑΡ), the Manufacturing Executing System (MES), and the Advance Process Control (APC). These systems are connected via a network connection, such as Ethernet/TCP (TCP/IP), to various devices (Tools) for controlling devices and collecting device data. SECS (SEMI Equipment Communication Standard) is a semiconductor device communication standard developed by SEMI (Semiconductor Equipment and Materials Internationa). Through this standard, the external communication interface is provided to establish a connection between the device and the device. 200949475 High-speed SECS (High Speed Message Services, HSMS) is one of the communication protocols that provide high-speed transmission rate in the SECS standard. It is also the communication protocol used in current device connection operations---in existing semiconductors. In the equipment network architecture, the equipment automation system (ΕΑΡ) is connected to the equipment, and the equipment automation system is connected with the back-end systems such as Manufacturing Execution System (MES) and Advanced Process Control Technology (APC). The equipment automation system is connected to the equipment through a switch. In addition, based on the considerations of maintenance, ease of operation, and system stability, two sets of equipment automation systems will be designed in the existing semiconductor equipment network architecture. The two equipment automation systems will be deployed at different locations or floors in the plant. . The equipment automation system is connected to the Core Switch, and the backbone switch is connected to a plurality of Edge Switches. The peripheral switches are connected to the devices to establish network connections. Under normal circumstances, only one set of equipment automation systems will operate, and the other equipment automation system will be standby (Standby). Once an abnormality in the operating system of the device is in operation, or other requirements, the switching of the switch can be immediately performed to operate the device automation system in the standby state to prevent the entire system from stalling. However, the process of switching the pair of equipment automation systems will cause the network to be disconnected. The connection between the equipment automation system and the equipment may cause disconnection. The connection must be re-wired manually, which may cause the process to be disconnected. The impact of the loss of semi-finished products. Manually reconnecting 200949475 also caused an increase in manpower and inconvenience in operations. In addition, equipment automation systems and equipment are disconnected. At this time, other newly-connected guards are manually detected and re-worked, which also causes the aforementioned problems. Therefore, it is necessary to propose a new type of semiconductor manufacturing equipment: to solve or overcome the problems of existing semiconductor systems; to improve production efficiency. BACKGROUND OF THE INVENTION The object of the present invention is to provide a monitoring method for connecting semiconductor manufacturing equipment to reduce the degree of influence on the process caused by abnormal wiring or disconnection of equipment. The monitoring method for connecting a semiconductor manufacturing equipment according to the present invention includes using a [control module separately connected with a device automation system (ΕΑΡ), wherein the device automation system is separately connected to the device (τ〇〇1), two There is also a - connected state and a disconnected state. At the same time, the monitoring module collects the number of devices in the disconnected state and determines whether the number of devices in the disconnected state is exceeded by a predetermined condition. If so, the monitoring module actively issues a self-checking command to all device automation systems. After receiving the self-checking command, each equipment automation system performs an automatic connection between it and its connected equipment. Wherein the predetermined condition may include a predetermined period and a predetermined number of disconnected states. The predetermined period may be 3 seconds, and the predetermined number may be 70 broken ill devices. 200949475 When the device automation system receives the self-check command, the step of performing an automatic connection operation with the devices includes: sending a network message response detection command to each device. If the equipment automation system does not receive or receives a response from each of the equipment, the equipment automation system enters a re-rendering procedure. The reinitialization process is to restart the communication with each device after the device automation system closes the communication with each device to re-establish its connection with each device. ❸ The shai network message response detection command uses the S1F1 command under the HSMS, that is, the Stream L —ni ( Are You There Request) command. The effect of the invention is: monitoring the device automation system and device through the monitoring module The connection state between the two, when the number of disconnection reaches the predetermined condition, is triggered by the monitoring module. In addition, the automatic system is automatically reconnected, which saves the time and cost of manual manual reconnection. In the θ 日 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , [Embodiment] Referring to Fig. 1, in a computer integrated manufacturing system for semiconductor manufacturing, a package manufacturing execution system (MES), a plurality of device automation systems (EAP) 110, and a plurality of devices 12 are incorporated. The manufacturing execution system 1 is connected to the equipment automation system i! 0, respectively, and the equipment automation system i i is connected to the equipment 12G. In general, the number of devices m is approximately above ^ 8 200949475 σ. The attack automation system 110 and the device 120 have a wired state and a disconnected state, respectively. Further, referring to FIG. 2, a method for detecting a connection of a semiconductor manufacturing device according to an embodiment of the present invention uses a monitoring module 140, which is respectively connected to the device automation system 110, and through the device automation system 110. The monitoring operation of the device 120 connection state can be performed. Since a disconnection occurs between the device automation system 110 and the device 120, H can be known by the device automation system no. In accordance with the detection method of the present invention, the monitoring module 140 is utilized to collect the number of disconnected states of the device 120, as shown in step 210. When the number of disconnected states of the device 120 exceeds a predetermined condition, as shown in step 220, the monitoring module 14 issues a self-check command to all of the device automation systems, as shown in step 23. When the device automation system 11 receives this self-check command, it automatically performs the connection and automatically establishes its connection with the device i 2〇. In one embodiment, if 800 devices 120 are used as an example, there will be 800 connections between the device automation system 11 and the device 12. The predetermined condition is set to be within 3 seconds. If the monitoring module ι4 does not need to detect more than 70 devices 120 disconnected state, the monitoring module 1 will issue a self-checking command to all Difu automation systems 110. Each device automation system 110 and device 120 (in this embodiment, 8 stations) are confirmed to be connected or reconnected. Referring to Figure 3, when the device automation system receives a self-check command, it sends a network message response detection command to the device 120, such as using S1F1 under HSMS (Stream 1 Function 1 : Are You There 200949475
Request)指令，如步驟241以及步驟M2所示。再 否枚到回應（Aeknc)wIedge)，如步驟加所示。若於預定= 間内，設備自動化系統110收到設備12〇的回應，則表干 連線j ’此時無須進行重新連線，如步驟244所示。反 之右-又備自動化系 '统11〇未收到或逾時收 回應:則設備自動化系統n。進入一再初：二 (Re-mitialize)，如步驟 245 所示。The Request) command is as shown in step 241 and step M2. Then no response to the response (Aeknc) wIedge), as shown in the step plus. If the device automation system 110 receives a response from the device 12 within the predetermined =, the table connection j' does not need to be reconnected at this time, as shown in step 244. The right-and-automatic system is not received or overdue. Response: Device automation system n. Enter Re-mitialize, as shown in step 245.
設備自動化系、统110會先關閉與設備120的通訊埠 (P〇n)，如步驟246所示。#通訊琿關閉後，設備⑶會向 設備自動H统11G發出斷線訊號，由於為區分在再初始 化程序時以及在正常狀態斷線時的斷線訊號，可於再初始 化程序中，關閉與設備12〇的通訊埠的指令中加入旗標 (Flag)以作區別。 設備自動化系統110重新開啟與設備12〇的通訊埠 (Port)，如步驟247所示。在收到設備12〇的回應後，並對 設備120進行初始化的工作，如步驟248所示，並藉由設 備120的回應中的旗標判斷是否為再初始化程序下的初始 化的工作，如步驟249所示。若是，則紀錄初始化成功與 否的資料（如步驟250所示）：繼續判斷初始化的工作是否 成功’並分別將初始化的工作成功資料與初始化的工作不 成功資料記錄下來，如步驟251以及步驟252所示。若否， 則因其非再初始化程序下的初始化的工作，所以並不紀錄 其初始化成功與否的資料。 凊參照第4圖所示，由於設備120於正常狀態下斷 200949475 線’設備自動化系統110會收到斷線訊號後，並對設備i2〇 進行清除批:欠資料的玉作。而在再初始化程序下的重新連 線卩關閉以及重新開啟通訊埠’也會產生斷線訊號。因 此’认備自動化系& 11G會收到斷線訊號後，會先判斷是 否為再初始化程序下的重新連線的斷線訊號(即關閉通訊 阜後）此步驟可藉由於指令加入旗標以作區別，如步驟 260以及步驟261所示。若是，則不進行清除批次資料的 ^作。若否，則進行清除批次資料的工作，如步驟262所 不。如此’監控模、组14〇可與現有之製造執行系統⑽相 容。 在實施例中，設備自動化系統110與設備12〇之間The device automation system 110 will first close the communication with the device 120 (P〇n), as shown in step 246. #通讯珲 When the device is turned off, the device (3) will send a disconnection signal to the device automatic H system 11G. In order to distinguish the disconnection signal during the reinitialization process and the normal state disconnection, the device can be turned off in the reinitialization procedure. A flag is added to the 12-inch communication command to make a difference. The device automation system 110 reopens the port of communication with the device 12, as shown in step 247. After receiving the response from the device 12, and initializing the device 120, as shown in step 248, and determining whether the initialization operation under the reinitialization procedure is performed by the flag in the response of the device 120, such as the step. 249 is shown. If yes, record the success or failure of the data (as shown in step 250): continue to determine whether the initial work is successful 'and separately record the initial work success data and the initial work unsuccessful data, as in step 251 and step 252 Shown. If not, the data is not recorded because of the initialization work under the non-reinitialization procedure. Referring to Figure 4, since the device 120 is disconnected under normal conditions, the 200949475 line 'equipment automation system 110 will receive the disconnection signal, and the device i2〇 will be cleared. The reconnection in the reinitialization procedure, the reconnection, and the reconnection of the communication port will also generate a disconnection signal. Therefore, after the "Automation System & 11G will receive the disconnection signal, it will first determine whether it is the rewired disconnection signal under the reinitialization procedure (ie, after the communication is closed). This step can be added to the flag by the instruction. To make a difference, as shown in step 260 and step 261. If yes, the batch data will not be cleared. If not, the work of clearing the batch data is performed, as in step 262. Thus, the "monitoring module, group 14" can be compatible with the existing manufacturing execution system (10). In an embodiment, between the device automation system 110 and the device 12〇
的通訊協定’是採用SECS通訊標準，如HSMS、SECS-I 等。 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明’任何熟習此技藝者，在不脫離本發明之精 神和範_，當可作各種之更動與㈣，因此本發明之保 護範圍當視後附之巾請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示應用本發明一較佳實施例的-種半導體 製造設備連線的監測方法的系統的示意方塊圖。 200949475 第2圖係繪示本發明一較佳實施例的一種半導體製造 設備連線的監測方法的流程圖。 第3圖係繪示第2圖中的半導體製造設備連線的監測 方法，其中重新連線步驟的流程圖。 第4圖係繪示第2圖中的半導體製造設備連線的監測 方法，其中判斷清除批次資料步驟的流程圖。The protocol "is based on SECS communication standards such as HSMS, SECS-I, etc." While the present invention has been described above in terms of a preferred embodiment, it is not intended to limit the invention, and the invention may be practiced otherwise without departing from the spirit and scope of the invention. The scope of protection shall be subject to the definition of the scope of the patent attached to the attached towel. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic block diagram of a system for monitoring a method of wiring a semiconductor manufacturing device. 200949475 FIG. 2 is a flow chart showing a method of monitoring a connection of a semiconductor manufacturing device according to a preferred embodiment of the present invention. Fig. 3 is a flow chart showing the method of monitoring the wiring of the semiconductor manufacturing equipment in Fig. 2, in which the rewiring step. Fig. 4 is a view showing the monitoring method of the wiring of the semiconductor manufacturing equipment in Fig. 2, in which the flow chart of the step of clearing the batch data is judged.
210〜240 :步驟 241〜249 :步驟 250〜252 :步驟 260〜262 :步驟 【主要元件符號說明】 100 :製造執行系統 110 :設備自動化系統 120 :設備 140 :監控模組210~240: Steps 241~249: Steps 250~252: Steps 260~262: Steps [Major component symbol description] 100: Manufacturing execution system 110: Equipment automation system 120: Equipment 140: Monitoring module
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