TW200940349A - Method of attaching printhead integrated circuits to an ink manifold using adhesive film - Google Patents

Method of attaching printhead integrated circuits to an ink manifold using adhesive film Download PDF

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Publication number
TW200940349A
TW200940349A TW097116828A TW97116828A TW200940349A TW 200940349 A TW200940349 A TW 200940349A TW 097116828 A TW097116828 A TW 097116828A TW 97116828 A TW97116828 A TW 97116828A TW 200940349 A TW200940349 A TW 200940349A
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Taiwan
Prior art keywords
ink
ink supply
print head
film
adhesive layer
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Application number
TW097116828A
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Chinese (zh)
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TWI444300B (en
Inventor
Sarkis Minas Keshishian
Susan Williams
Paul Andrew Papworth
Kia Silverbrook
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Silverbrook Res Pty Ltd
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Publication of TW200940349A publication Critical patent/TW200940349A/en
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Publication of TWI444300B publication Critical patent/TWI444300B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1632Manufacturing processes machining
    • B41J2/1634Manufacturing processes machining laser machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/18Ink recirculation systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/02Framework
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14362Assembling elements of heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14419Manifold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14491Electrical connection
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/20Modules

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Ink Jet (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20 DEG C less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.

Description

‘200940349 九、發明說明 【發明所屬之技術領域】 本發明係關於列印機,而且特別係關於噴墨式列ep _ 【先前技術】 本案申請人已經發展出範圍寬廣之列印機,其胃 0 寬列印頭,並非傳統式往復列印頭設計。當列印頭並未來 回地橫越紙頁以留下一條影像線時,頁寬設計會增加列印 速度。當頁寬列印頭以高速通過時,其僅將墨水留在媒體 上。這種列印頭係能以近於每分鐘60頁之速度進行全彩 1 6 0 0 dp i之列印,這種速度爲習知噴墨式列印機所無法達 成者。 以這些速度列印會很快地消耗墨水,而且對於供應歹IJ 印頭充分墨水會產生問題。不僅僅流動速率較高,且相較 Q 於饋入墨水至較小之往復列印頭’頁寬列印頭且沿著頁寬 列印頭整體長度分配墨水係較複雜。 列印頭積體電路一般係以黏著薄膜而附著於墨水歧管 。必須提供一種薄膜,其將附著程序最佳化,以提供最小 墨水洩漏之列印頭組件。 【發明內容】 於第一態樣中,本發明提供疊層薄膜,用於將一或更 多之列印頭積體電路附著於墨水供應歧管,該薄膜具有界 -5- .200940349 定於其中之複數個墨水供應孔,該疊層薄膜包含: 中央聚合薄膜; 第一黏著層,用於將該薄膜之第一側接合至該墨水供 應歧管;以及 第二黏著層,用於將該薄膜之第二側接合至該一或更 多之列印頭積體電路,該中央聚合薄膜係夾於該第一及第 二黏著層之間, Q 其中該第一黏著層之第一融化溫度係比該第二黏著層 之第二融化溫度至少低1 0 °c。 選擇性地,該第一融化溫度係比該第二融化溫度至少 低 2(TC。 選擇性地,該中央聚合薄膜係聚醯亞胺薄膜。 選擇性地,該第一及第二黏著層係環氧薄膜。 選擇性地,該薄膜之總厚度之範圍爲40至200微米 〇 Θ 選擇性地’該中央聚合薄膜之厚度之範圍爲20至1〇〇 微米。 選擇性地’該第一及第二黏著層各層之厚度之範圍爲 10至50微米。 選擇性地’每一墨水供應孔之長度之範圍爲5 〇至5 0 0 微米,且寬度之範圍爲50至500微米。 於另一態樣中,本發明提供薄膜封裝,包含: 中央聚合薄膜; 第一黏著層,用於將該薄膜之第一側接合至該墨水供 -6 - .200940349 應歧管;以及 第二黏著層,用於將該薄膜之第二側接合至該一或更 多之列印頭積體電路,該中央聚合薄膜係夾於該第一及第 二黏著層之間, 其中該第一黏著層之第一融化溫度係比該第二黏著層 之第二融化溫度至少低1 0 °c ;以及 第一及第二保護襯墊,每一該櫬墊係可移除地附著於 0 各別黏著層。 選擇性地,每一保護襯墊係聚酯薄膜。 於另一態樣中,本發明提供列印頭組件,包含: 墨水歧管,具有界定於歧管接合表面中之複數個墨水 出口; 一或更多之列印頭積體電路,每一列印頭積體電路具 有界定於列印頭接合表面中之複數個墨水入口 :以及 疊層薄膜,夾於該歧管接合表面及該一或更多列印頭 〇 接合表面之間,該薄膜具有界定於其中之複數個墨水供應 孔’每一墨水供應孔係與各別墨水出口及墨水入口對齊, 該疊層薄膜包含: 中央聚合薄膜; 第一黏著層,接合至該歧管接合表面;以及 第二黏著層,接合至該一或更多之列印頭接合表面, 該中央聚合薄膜係夾於該第一及第二黏著層之間, 其中該第一黏著層之第一融化溫度係比該第二黏著層 之第二融化溫度至少低10 °c。 .200940349 選擇性地,每一墨水供應孔係實質上無任何黏著物。 選擇性地’該第一及第二黏著層各層具有沿著該列印 頭組件之縱長範圍之均勻厚度。 選擇性地’該第一黏著層之第一接合表面及該第二黏 著層之第二接合表面沿著該列印頭組件之縱長範圍而均勻 地平坦。 選擇性地’該列印頭組件包含沿著該墨水供應歧管之 Ο 縱長範圍而端對端接合之複數個列印頭積體電路。 選擇性地,該複數個列印頭積體電路界定具有均勻平 坦噴墨面之列印頭。 選擇性地,當該列印頭組件於10 kPa充氣時,該列 印頭組件之洩漏率係小於每分鐘5 mm3,於9 0 °C將該列印 頭組件浸泡於墨水中爲期一個星期之後,測量該洩漏率。 選擇性地’複數個墨水入口係由沿著列印頭接合表面 縱長方向延伸之墨水供應溝道所界定,其中複數個墨水供 〇 應孔係與一個墨水供應溝道對齊,每一個該複數個墨水供 應孔係沿著該墨水供應溝道於縱長方向隔開。 選擇性地,該墨水供應歧管係液晶聚合體(LCP )鑄 造物。 於另一態樣中,本發明提供包含靜止列印頭組件之頁 寬列印機,該靜止列印頭組件包含: 墨水歧管,具有界定於歧管接合表面中之複數個墨水 出口; 一或更多之列印頭積體電路,每一列印頭積體電路具 -8 - -200940349 有界定於列印頭接合表面中之複數個墨水入口;以及 疊層薄膜,夾於該歧管接合表面及該一或更多列印頭 接合表面之間,該薄膜具有界定於其中之複數個墨水供應 孔’每~墨水供應孔係與各別墨水出口及墨水入口對齊, 該疊層薄膜包含: 中央聚合薄膜; 第一黏著層,接合至該歧管接合表面;以及 〇 第二黏著層,接合至該一或更多之列印頭接合表面, 該中央聚合薄膜係夾於該第一及第二黏著層之間, 其中該第一黏著層之第一融化溫度係比該第二黏著層 之第二融化溫度至少低1 0 °c。 於第二態樣中,本發明提供一種將一或更多之列印頭 積體電路附著於墨水供應歧管之方法,該方法包含下列步 驟: (a)提供疊層薄膜,其具有界定於其中之複數個墨 〇 水供應孔,該疊層薄膜包含夾於第一及第二黏著層之間之 中央聚合薄膜,其中該第一黏著層之第一融化溫度係比該 第二黏著層之第二融化溫度至少低1 (TC ; (b )將該薄膜對齊該墨水供應歧管,使每一墨水供 應孔對齊界定於該墨水供應歧管之歧管接合表面中之各別 墨水出口; (b )藉由施加熱及壓力於該薄膜之相反側,而將該 第一黏著層接合至該歧管接合表面; (c)將該一或更多之列印頭積體電路對齊該薄膜’ -9- .200940349 使每一墨水供應孔對齊界定於每一列印頭積體電路之列印 頭接合表面中之墨水入口;以及 (d)將該一或更多之列印頭積體電路接合至該第二 黏著層。 選擇性地,於步驟(b)中,該第二黏著層係由可移 除保護襯墊保護。 選擇性地,於步驟(c )之前,移除該保護襯墊。 ❹ 選擇性地,於步驟(b )中,該第一黏著層到達其融 化溫度,且該第二黏著層未到達其融化溫度。 選擇性地,該第一融化溫度係比該第二融化溫度至少 低 20〇C。 選擇性地,於步驟(b )中,該施加之熱對應於該第 一融化溫度。 選擇性地,於至少步驟(b )期間,實質上無黏著物 流入該墨水供應孔中。 〇 選擇性地’步驟(C)包括之步驟爲:以光學方式找 出每一墨水供應孔中心之位置,其中係藉由該墨水供應孔 無黏著物而促進該找出位置之步驟。 選擇性地,每一墨水供應孔之長度之範圍爲50至500 微米,且寬度之範圍爲50至500微米。 選擇性地’於步驟(b)之後,該疊層薄膜係維持其 結構完整性,以使該第二黏著層沿著其縱長範圍維持均勻 之厚度。 選擇性地’於步驟(b)之後,該疊層薄膜係維持其 -10- .200940349 結構完整性,以使由該第二黏著層所界定之第二接合表面 沿著其縱長範圍維持其均勻平坦性。 選擇性地,步驟(d )包含加熱每一列印頭積體電路 及定位每一該加熱之列印頭積體電路於該第二接合表面上 〇 選擇性地,於步驟(d)中,由於該第二接合表面之 該均勻平坦性,黏著接合時間係小於2秒。 φ 選擇性地,複數個列印頭積體電路係分別對齊並接合 於該第二黏著層,該複數個列印頭積體電路係被定位,以 使其沿著該墨水供應歧管之縱長範圍而端對端接合在一起 〇 選擇性地,複數個墨水入口係由沿著該列印頭接合表 面以縱長方向延伸之墨水供應溝道所界定,而且其中複數 個墨水供應孔係與一個墨水供應溝道對齊,該複數個墨水 供應孔之每一個係沿墨水供應溝道於縱長方向間隔分開。 Q 選擇性地,該中央聚合薄膜係聚醯亞胺薄膜。 選擇性地,該第一及第二黏著層係環氧薄膜。 選擇性地,該薄膜之總厚度之範圍爲40至200微米 〇 選擇性地,該中央聚合薄膜之厚度之範圍爲20至100 微米。 選擇性地,該第一及第二黏著層各層之厚度之範圍爲 10至50微米。 於第三態樣中,本發明係提供列印頭組件,包含: -11 - 200940349 墨水歧管,具有界定於歧管接合表面中之複數個墨水 出口; 一或更多之列印頭積體電路,每一列印頭積體電路具 有界定於列印頭接合表面中之複數個墨水入口;以及 黏著薄膜,夾於該歧管接合表面及該一或更多列印頭 接合表面之間,該薄膜具有界定於其中之複數個墨水供應 孔,每一墨水供應孔係與墨水出口及墨水入口對齊, 〇 其中,當該列印頭組件於1 〇 kPa充氣時,該列印頭 組件之洩漏率係小於每分鐘l〇mm3,於90°C將該列印頭組 件浸泡於墨水中爲期一個星期之後,測量該洩漏率。 選擇性地,該列印頭組件之洩漏率係小於每分鐘1 mm3 ° 選擇性地,該列印頭組件之洩漏率係小於每分鐘0.2 mm3 = 選擇性地,每一墨水供應孔係實質上無任何黏著物。 φ 選擇性地,每一墨水供應孔之長度之範圍爲50至500 微米,且寬度之範圍爲50至500微米。 選擇性地,該黏著薄膜之總厚度之範圍爲40至200 微米。 選擇性地,該墨水供應歧管係液晶聚合體(LCP )鑄 造物。 於另一態樣中,本發明提供該列印頭組件,包含沿著 該墨水供應歧管之縱長範圍而端對端接合之複數個列印頭 積體電路。 -12- 200940349 選擇性地,複數個墨水入口係由沿著列印頭接合表面 縱長方向延伸之墨水供應溝道所界定’其中複數個墨水供 應孔係與一個墨水供應溝道對齊’每一個該複數個墨水供 應孔係沿著該墨水供應溝道於縱長方向隔開。 選擇性地,每一列印頭接合表面具有界定於其內之複 數個墨水供應溝道,每一墨水供應溝道係界定複數個墨水 入口。 Q 選擇性地,該黏著薄膜係疊層薄膜,包含: 中央聚合薄膜; 第一黏著層,接合至該歧管接合表面;以及 第二黏著層,接合至該一或更多之列印頭接合表面, 該中央聚合膜板係夾於該第一及第二黏著層之間。 選擇性地’該第一黏著層之第一融化溫度係比該第二 黏著層之第二融化溫度至少低1 0 °c。 選擇性地,該第一及第二黏著層各層具有沿著該列印 G 頭組件之縱長範圍之均勻厚度。 選擇性地’該第一黏著層之第一接合表面及該第二黏 著層之第二接合表面沿著該列印頭組件之縱長範圍而均勻 地平坦。 選擇性地,該中央聚合薄膜係聚醯亞胺薄膜。 選擇性地,該第一及第二黏著層係環氧薄膜。 選擇性地’該中央聚合薄膜之厚度之範圍爲20至100 微米。 選擇性地’該第一及第二黏著層各層之厚度之範圍爲 -13- 200940349 1 〇至50微米。 於另一態樣中,本發明提供該列印頭組件,其爲頁寬 列印頭組件。 於另一態樣中,本發明提供包含靜止列印頭組件之頁 寬列印機,該靜止列印頭組件包含: 墨水歧管,具有界定於歧管接合表面中之複數個墨水 出口; 〇 一或更多之列印頭積體電路,每一列印頭積體電路具 有界定於列印頭接合表面中之複數個墨水入口;以及 黏著薄膜,夾於該歧管接合表面及該一或更多列印頭 接合表面之間,該薄膜具有界定於其中之複數個墨水供應 孔,每一墨水供應孔係與墨水出口及墨水入口對齊, 其中,當該列印頭組件於1 〇 kPa充氣時,該列印頭 組件之洩漏率係小於每分鐘1 〇 mm3 ’於9 0 °C將該列印頭 組件浸泡於墨水中爲期一個星期之後,測量該洩漏率。 ❹ 【實施方式】 槪觀 第1圖表示實施本發明之列印機2。列印機之主體4 支撐後方之媒體饋送盤14及前方之樞轉面6。第1圖表示 樞轉面6關閉,以使顯示螢幕8處於其直立觀看位置。控 制鈕1 0由螢幕8之側邊延伸,便於操作者觀看螢幕時輸 入。若要列印,單一紙張係由饋送盤14中之媒體堆疊12 抽取,並饋送經過列印頭(隱藏於列印機中)。經列印之 -14- 200940349 紙張1 6係傳送經過經列印媒體出口槽1 8。 第2圖表示樞轉面6打開,以顯現列印機2之內部 打開列印機之前面係將安裝於其中之列印頭匣96暴露 來。列印頭匣96係藉由匣接合凸輪20而固定定位,匣 合凸輪20係將其往下推,以確保墨水耦合件(將說明 後)完全接合,且列印頭1C (將說明於後)正確地定位 紙張饋送路徑附近。藉由釋放桿24而手動作動凸輪20 〇 樞轉面6將不會關閉,因此列印機將不運作,直到釋放 24被往下推以完全接合凸輪爲止。關閉樞轉面6會使列 機接觸點22與匣接觸點104接合。 第3圖表示列印機之樞轉面6打開且列印頭匣9 6 移除。由於樞轉面6向前傾斜,使用者將匣釋放桿24 上拉,以脫離凸輪20。這使得匣96上之把手26被緊抓 向上拉。上游及下游墨水耦合件1 1 2 A及1 1 2 B脫離列印 導管142。這將於下文做較詳細之說明。若要安裝新匣 ® 程序會相反。新匣在運送及銷售時係未注入墨水。爲了 列印機就緒用於列印,主動流體系統(將說明於後)係 用下游幫浦來使匣及列印頭注入墨水。 於第4圖中,列印機2之外殼已經被移除,以顯現 部。大型墨水槽60具有各別之貯器,用於所有4種不 樣墨水。墨水槽60本身是可替換匣,其耦合至關斷閥 (參看第6圖)之列印機上游。亦有一箱體92,用於藉 幫浦62將墨水自匣96抽出。將會參考第6圖來詳細說 列印機流體系統。簡言之,來自槽6 0之墨水流經上游 出 接 於 於 〇 桿 印 被 向 且 機 使 使 內 66 由 明 墨 -15- 200940349 水線84至關斷閥66,並上至列印機導管142。如第5圖 所示,當安裝匣96時,幫浦62 (由馬達196驅動)能將 墨水抽取至LCP鑄造物64內(參見第6圖及17至20圖 ),以藉由毛細管作用使列印頭1C 68 (同樣地,參見第 6圖及17至20圖)注入墨水。被幫浦62抽取之過多墨水 係饋入以墨水槽60罩護之箱體92。 因爲所使用之數個接觸點,匣接觸點104與列印機接 H 觸點22之間之總連接力相當大。於所示之實施例中,總 接觸力爲45牛頓。這種負荷足以使匣彎曲並變形。於第 30圖中,表示機架鑄造物1〇〇之內部結構。第3圖所示之 支撐表面28係示意性地表示於第30圖中。匣接觸點104 上之列印機接觸點之壓縮負荷係以箭頭表示。於支撐表面 28之作用力同樣地以箭頭表示。爲了維持匣96之結構完 整性,機架鑄造物1〇〇具有延伸於連接力平面之結構構件 30。爲了保持連接力作用於連接力平面中,機架亦具有接 0 觸肋32,其支撐抵靠支撐表面28。這使結構構件30上之 負荷完全可壓縮,以使匣之堅硬度最大,使任何彎曲程度 最小。 列印引擎管線 列印引擎管線係有關於從外部來源所接收及輸出至列 印頭用於列印之列印資料之列印機處理。列印引擎管線係 詳述於在20 04年12月20日申請之USSN 11/0 14769( RRC001US)中,在此以引用方式納入其揭示內容。 -16- 200940349 流體系統 傳統列印機係仰賴列印頭、匣、墨水線內之結構及元 件以避免流體問題。一些共同之流體問題爲未注入墨水或 乾噴嘴、氣體外出氣泡餘留及交互污染之顏色混合。對於 流體控制而言,使列印機元件設計最佳化以避免這些問題 係一種被動之方法。一般而言,用於改正這些問題之主動 © 元件是噴嘴作動器本身。然而,這通常是不足的,並會浪 費很多墨水在改正這些問題的工作上。於頁寬列印頭中, 因爲供應給列印頭1C之墨水導管之長度及複雜度,其問 題會加重。 本案申請人已發展出用於列印機之主動流體系統而解 決了此問題。一些這種問題係說明於USSN 1 1/677049 ( 我們的檔案SBF00 6US)中,在此以引用方式納入其揭示 內容。第6圖表示主動流體系統之單一幫浦實施方式其中 © 之~,該主動流體系統係適於與本案說明書所述之列印頭 配合使用。 第6圖所示之流體架構係僅用於一種顏色之單一墨水 線。彩色列印機將具有用於每一種顏色之分別的墨水線( 及分別的墨水槽60)。如第6圖所示,該架構於LCP鑄 造物64下游處具有單一幫浦62及於LCP鑄造物上游處具 有關斷閥66。LCP鑄造物經由黏著1C附著膜174支撐列 印頭IC 6 8。每當列印機電源關閉時,關斷閥6 6便將墨水 槽60中之墨水與列印頭1C 68隔離。這使得在不運作期 -17- 200940349 間之列印頭IC 68處之色彩混合避免到達墨水槽60。這些 問題係進一步詳述於交互參照之說明書USSN 1 1/677049 (我們的檔案SBF006US)中。 墨水槽60具有通氣氣泡點壓力調節器72,用於在噴 嘴處之墨水中維持相當固定之負靜水壓力。在墨水貯器中 之氣泡點壓力調節器係詳述於共同待決之 USSN 11/640355 (我們的檔案RMC007US)中,在此倂入參考。 Q 然而,爲了說明’所示之調節器72有氣泡出口 74,其沉 入墨水槽60之墨水中’且經由延伸至空氣入口 78之密封 導管76而通氣至大氣。當列印頭ic 68消耗墨水時,墨 水槽60中之壓力下降,直到氣泡出口 74處之壓力差將空 氣吸入槽中爲止。該空氣於墨水中形成氣泡,上升至槽之 頂部空間。這種壓力差是氣泡點壓力,且與氣泡出口 74 之直徑(或最小尺寸)與出口處之墨水凹凸面之Laplace 壓力有絕對關係,其防止空氣進入。 〇 氣泡點壓力調節器使用所需之氣泡點壓力而在下沉之 氣泡出口 74處產生氣泡,以便在出口處保持靜水壓力實 質上不變(當空氣之鼓起凹凸面形成氣泡並上升至墨水槽 之頂部空間時,會有稍許變動)。如果出口處之靜水壓力 是在氣泡點,則不論墨水槽已消耗了多少墨水,墨水槽中 之靜水壓力廓形亦是已知。當墨水水平下降至出口,墨水 槽中之墨水表面之壓力會朝氣泡點壓力下降。當然,一旦 出口 74暴露出來,頂部空間便通氣到大氣,且負壓力會 消失。如果墨水水平到達氣泡出口 74,墨水槽應該要再補 -18- 200940349 充墨水或替換(如果是匣體)。 墨水槽60可爲能補充墨水之固定式貯器、可 或(揭示於RRC001US中,在此倂入參考)可補充 了防止粒子污塞,墨水槽60之出口 80具有粗過濾^ 該系統在耦合至列印頭匣處亦使用了細過瀘器。因 器使用壽命有限,簡易地以更換墨水匣或列印頭匣 舊的過濾器,對於使用者而言是特別方便。假如過 〇 各別的消耗品,就需依賴使用者勤勞地定期更換。 當氣泡出口 74之是在氣泡點壓力,而且關斷關 開啓的,則噴嘴處之靜水壓力亦會是固定不變且小 壓力。然而如果關斷閥66已被關閉一段時間,則 出之氣泡可能會形成於LCP鑄造物64中或列印頭 中,改變了噴嘴處之壓力。同樣地,每曰氣溫變動 氣泡膨脹或收縮會改變關斷閥66下游處墨水線84 力。同樣地,由於溶解氣體跑出溶液,於不運作期 〇 水槽中之壓力會變化。 從LCP鑄造物64到幫浦62之下游墨水線86 連結至電子控制器90用於幫浦之墨水感測器88。 8 8感測下游墨水線8 6中之墨水存在或不存在。替 該系統可不使用感測器88,且幫浦62能設置成其 一個不同之操作而運作一段適當時間。因爲所增加 浪費,這可能會不利地影響到操作成本。 幫浦62饋入至箱體92中(當以向前方向抽取 箱體92係實體定位於列印機中’以使其低於列印頭 替換匣 匣。爲 器82 〇 爲過濾 來更換 濾器是 丨66是 於大氣 氣體外 1C 68 所造成 中之壓 間,墨 可包括 感測器 代地, 針對每 之墨水 時)。 1C 68 -19- 200940349 。這允許下游墨水線8 6中之墨水行於代命期間 LCP鑄造物64,藉以於列印頭1C 68產生負靜水 嘴處之負壓力將墨水凹凸面向內拉並避免顏色混 ,蠕動幫浦62需停止於開啓狀況’以使LCP鑄矣 幫浦92中之墨水出口之間有液體連通。 不同顏色之墨水線之間之壓力差會產生於不 。此外,噴嘴盤上之紙張灰塵或其它粒子會損壞 0 之墨水。由每一墨水線之間之輕微壓力差所驅動 合會發生於列印機不運作期間。關斷閥66使墨;^ 離列印頭IC 6 8之噴嘴,以防止顏色混合延伸上 60。一旦墨水槽中之墨水污染了不同顏色,便無 必須被更換。 蓋器94係列印頭維護站,其於待命期間隱 以避免列印頭1C 68脫水,並使噴嘴盤阻隔紙張 它粒子。蓋器94亦設置成用於清理噴嘴盤,以 〇 水及其它污染物。當墨水溶劑(一般是水)蒸發 墨水黏度時,便會產生列印頭1C 68脫水現象。 黏度太高,噴墨作動器便無法噴出墨水滴。假如 器密封,則當於關機或待命期間之後再度作動列 水之噴嘴會是個問題。 於列印機使用壽命期間,以上所列之種種問 常見,而且可利用第6圖所示之相當簡易之流體 有效修正。其亦允許使用者最初將列印機注入墨 動列印機前不注入墨水、或使用簡易之故障檢查 「掛於」 壓力。噴 合。當然 I物64與 運作期間 各個噴嘴 之顏色混 、槽6 0隔 至墨水槽 法回復且 藏噴嘴, 灰塵或其 去除乾墨 並增加了 假如墨水 犧牲了蓋 印機,脫 題並非不 架構給予 水、於移 協定將列 -20- 200940349'200940349 IX. OBJECTS OF THE INVENTION [Technical Field] The present invention relates to a printing machine, and in particular to an ink jet type ep _ [Prior Art] The applicant has developed a wide range of printing machines, the stomach thereof 0 Wide print head, not a traditional reciprocating print head design. The page width design increases the printing speed when the print head is printed and the image is traversed in the future to leave an image line. When the page-wide printhead passes at high speed, it only leaves ink on the media. This type of print head can print at full speed of 60 pages per minute at a speed of 60 pages per minute, which is not possible with conventional inkjet printers. Printing at these speeds quickly consumes ink, and there is a problem with supplying enough ink to the 歹IJ printhead. Not only is the flow rate high, but the ink distribution is more complicated than the Q to feed the ink to the smaller reciprocating printhead' page width printhead and along the page width printhead overall length. The print head integrated circuit is typically attached to the ink manifold by an adhesive film. A film must be provided that optimizes the attachment process to provide a printhead assembly with minimal ink leakage. SUMMARY OF THE INVENTION In a first aspect, the present invention provides a laminate film for attaching one or more printhead integrated circuits to an ink supply manifold having a boundary of -5 - 200940349 a plurality of ink supply holes, the laminated film comprising: a central polymeric film; a first adhesive layer for bonding the first side of the film to the ink supply manifold; and a second adhesive layer for a second side of the film is bonded to the one or more printhead integrated circuits, the central polymeric film is sandwiched between the first and second adhesive layers, Q wherein the first adhesive layer has a first melting temperature It is at least 10 ° C lower than the second melting temperature of the second adhesive layer. Optionally, the first melting temperature is at least 2 (TC) lower than the second melting temperature. Optionally, the central polymeric film is a polyimide film. Optionally, the first and second adhesive layers are Epoxy film. Optionally, the total thickness of the film ranges from 40 to 200 microns. 选择性 Selectively, the thickness of the central polymeric film ranges from 20 to 1 micron. Selectively The thickness of each layer of the second adhesive layer ranges from 10 to 50 microns. Optionally, each ink supply aperture has a length in the range of 5 Å to 500 μm and a width in the range of 50 to 500 μm. In one aspect, the present invention provides a thin film package comprising: a central polymeric film; a first adhesive layer for bonding the first side of the film to the ink for the -6 - .200940349; and a second adhesive layer, For bonding the second side of the film to the one or more printhead integrated circuits, the central polymeric film is sandwiched between the first and second adhesive layers, wherein the first adhesive layer is a melting temperature is the second melting of the second adhesive layer The temperature is at least 10 ° C lower; and the first and second protective liners, each of which is removably attached to each of the 0 adhesive layers. Optionally, each protective liner is a polyester film. In another aspect, the present invention provides a printhead assembly comprising: an ink manifold having a plurality of ink outlets defined in a manifold engagement surface; one or more printhead integrated circuits, each printed The header integrated circuit has a plurality of ink inlets defined in the bonding surface of the printhead: and a laminate film sandwiched between the manifold engagement surface and the one or more print head nip surfaces, the film having a defined a plurality of ink supply holes each aligned with a respective ink outlet and an ink inlet, the laminated film comprising: a central polymeric film; a first adhesive layer bonded to the manifold bonding surface; a second adhesive layer bonded to the one or more print head bonding surfaces, the central polymeric film is sandwiched between the first and second adhesive layers, wherein the first adhesive layer has a first melting temperature ratio Second adhesive layer The second melting temperature is at least 10 ° C lower. . . . 200940349 Optionally, each ink supply aperture is substantially free of any adhesive. Optionally, the first and second adhesive layer layers have along the printhead assembly a uniform thickness of the longitudinal extent. Optionally, the first bonding surface of the first adhesive layer and the second bonding surface of the second adhesive layer are uniformly flat along the length of the printhead assembly. Optionally, the printhead assembly includes a plurality of printhead integrated circuits that are joined end to end along a longitudinal extent of the ink supply manifold. Optionally, the plurality of printhead integrated circuits are defined A printhead having a uniform flat inkjet surface. Optionally, when the printhead assembly is inflated at 10 kPa, the printhead assembly has a leak rate of less than 5 mm3 per minute at 90 °C. The leak rate was measured after the print head assembly was immersed in the ink for one week. Optionally, the plurality of ink inlets are defined by an ink supply channel extending along a longitudinal direction of the printhead bonding surface, wherein the plurality of ink supply apertures are aligned with an ink supply channel, each of the plurality The ink supply holes are spaced apart in the longitudinal direction along the ink supply channel. Optionally, the ink supply manifold is a liquid crystal polymer (LCP) casting. In another aspect, the present invention provides a pagewidth printer comprising a stationary printhead assembly, the stationary printhead assembly comprising: an ink manifold having a plurality of ink outlets defined in a manifold engagement surface; Or more print head integrated circuits, each of the print head integrated circuits -8 - - 200940349 having a plurality of ink inlets defined in the bonding surface of the print head; and a laminated film sandwiched by the manifold Between the surface and the one or more printhead engaging surfaces, the film has a plurality of ink supply apertures defined therein, each ink supply aperture being aligned with a respective ink outlet and an ink inlet, the laminate film comprising: a central polymeric film; a first adhesive layer bonded to the manifold bonding surface; and a second adhesive layer bonded to the one or more printhead bonding surfaces, the central polymeric film being sandwiched between the first and the first Between the two adhesive layers, wherein the first melting temperature of the first adhesive layer is at least 10 ° C lower than the second melting temperature of the second adhesive layer. In a second aspect, the present invention provides a method of attaching one or more printhead integrated circuits to an ink supply manifold, the method comprising the steps of: (a) providing a laminated film having a a plurality of ink water supply holes, the laminated film comprising a central polymeric film sandwiched between the first and second adhesive layers, wherein the first adhesive layer has a first melting temperature that is greater than the second adhesive layer The second melting temperature is at least 1 lower (TC; (b) aligning the film to the ink supply manifold such that each ink supply aperture is aligned with a respective ink outlet defined in the manifold engagement surface of the ink supply manifold; b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to the opposite side of the film; (c) aligning the one or more printed head integrated circuits with the film' -9-.200940349 aligning each ink supply aperture with an ink inlet defined in a printhead engagement surface of each of the printhead integrated circuits; and (d) splicing the one or more printhead integrated circuits To the second adhesive layer. Optionally, in step (b) The second adhesive layer is protected by a removable protective liner. Optionally, prior to step (c), the protective liner is removed. 选择性 Optionally, in step (b), the first An adhesive layer reaches its melting temperature, and the second adhesive layer does not reach its melting temperature. Optionally, the first melting temperature is at least 20 ° C lower than the second melting temperature. Optionally, in step (b) The applied heat corresponds to the first melting temperature. Optionally, during at least step (b), substantially no adhesive flows into the ink supply aperture. 〇 selectively 'step (C) includes The step is: optically finding the position of the center of each ink supply hole, wherein the step of finding the position is promoted by the ink supply hole without the adhesive. Optionally, the range of the length of each ink supply hole 50 to 500 microns and a width in the range of 50 to 500 microns. Selectively after step (b), the laminated film maintains its structural integrity such that the second adhesive layer is along its length The range maintains a uniform thickness. After step (b), the laminated film maintains its structural integrity of -10-200940349 such that the second bonding surface defined by the second adhesive layer maintains its uniform flatness along its longitudinal extent Optionally, step (d) comprises heating each of the print head integrated circuits and positioning each of the heated print head integrated circuits on the second joint surface, optionally in step (d) Due to the uniform flatness of the second bonding surface, the adhesive bonding time is less than 2 seconds. φ Optionally, a plurality of print head integrated circuits are respectively aligned and bonded to the second adhesive layer, the plurality of columns The print integrated circuit is positioned such that it is joined end to end along the lengthwise extent of the ink supply manifold. Optionally, a plurality of ink inlets are formed along the print head engagement surface. The longitudinally extending ink supply channel is defined, and wherein the plurality of ink supply apertures are aligned with an ink supply channel, each of the plurality of ink supply apertures being spaced apart along the lengthwise direction of the ink supply channel. Q Optionally, the central polymeric film is a polyimide film. Optionally, the first and second adhesive layers are epoxy films. Optionally, the total thickness of the film ranges from 40 to 200 microns. 选择性 Optionally, the thickness of the central polymeric film ranges from 20 to 100 microns. Optionally, the thickness of each of the first and second adhesive layers ranges from 10 to 50 microns. In a third aspect, the present invention provides a printhead assembly comprising: -11 - 200940349 an ink manifold having a plurality of ink outlets defined in a manifold engagement surface; one or more printhead assemblies a circuit, each of the print head integrated circuits having a plurality of ink inlets defined in the bonding surface of the printhead; and an adhesive film sandwiched between the manifold engagement surface and the one or more print head engagement surfaces, The film has a plurality of ink supply apertures defined therein, each ink supply aperture being aligned with the ink outlet and the ink inlet, wherein the leakage rate of the printhead assembly is when the printhead assembly is inflated at 1 kPa The leak rate was measured after immersing the print head assembly in the ink for one week at 90 ° C for less than 1 mm3 per minute. Optionally, the print head assembly has a leak rate of less than 1 mm 3 ° per minute. Optionally, the print head assembly has a leak rate of less than 0.2 mm 3 per minute. Optionally, each ink supply hole is substantially No adhesive. φ Optionally, each ink supply aperture has a length in the range of 50 to 500 microns and a width in the range of 50 to 500 microns. Optionally, the total thickness of the adhesive film ranges from 40 to 200 microns. Optionally, the ink supply manifold is a liquid crystal polymer (LCP) casting. In another aspect, the present invention provides the printhead assembly including a plurality of print head assemblies that are joined end to end along the length of the ink supply manifold. -12- 200940349 Optionally, a plurality of ink inlets are defined by an ink supply channel extending along a longitudinal direction of the printhead bonding surface 'where a plurality of ink supply apertures are aligned with an ink supply channel' The plurality of ink supply apertures are spaced apart along the lengthwise direction of the ink supply channel. Optionally, each of the print head engaging surfaces has a plurality of ink supply channels defined therein, each ink supply channel defining a plurality of ink inlets. Q. Optionally, the adhesive film is a laminated film comprising: a central polymeric film; a first adhesive layer bonded to the manifold bonding surface; and a second adhesive layer bonded to the one or more printheads The surface, the central polymeric film sheet is sandwiched between the first and second adhesive layers. Optionally, the first melting temperature of the first adhesive layer is at least 10 ° C lower than the second melting temperature of the second adhesive layer. Optionally, the first and second layers of the adhesive layer have a uniform thickness along the length of the printhead assembly. Optionally, the first bonding surface of the first adhesive layer and the second bonding surface of the second adhesive layer are uniformly flat along the length of the printhead assembly. Optionally, the central polymeric film is a polyimide film. Optionally, the first and second adhesive layers are epoxy films. Optionally, the thickness of the central polymeric film ranges from 20 to 100 microns. Optionally, the thickness of each of the first and second adhesive layers ranges from -13 to 200940349 1 〇 to 50 microns. In another aspect, the invention provides the printhead assembly which is a pagewidth printhead assembly. In another aspect, the present invention provides a pagewidth printer comprising a stationary printhead assembly, the stationary printhead assembly comprising: an ink manifold having a plurality of ink outlets defined in a manifold engagement surface; One or more print head integrated circuits, each of the print head integrated circuits having a plurality of ink inlets defined in the print head engagement surface; and an adhesive film sandwiched between the manifold engagement surfaces and the one or more Between the plurality of printhead engaging surfaces, the film has a plurality of ink supply apertures defined therein, each ink supply aperture being aligned with the ink outlet and the ink inlet, wherein the printhead assembly is inflated at 1 kPa The leak rate of the print head assembly is less than 1 〇mm3 per minute. The leak rate is measured after immersing the print head assembly in the ink for one week at 90 °C.实施 [Embodiment] Fig. 1 shows a printer 2 embodying the present invention. The main body 4 of the printer supports the rear media feed tray 14 and the front pivot surface 6. Figure 1 shows the pivoting face 6 closed so that the display screen 8 is in its upright viewing position. The control button 10 is extended from the side of the screen 8 to allow the operator to enter while viewing the screen. To print, a single sheet of paper is drawn from the media stack 12 in the feed tray 14 and fed through the printhead (hidden in the printer). Printed -14- 200940349 Paper 1 6 is conveyed through the print media exit slot 18. Fig. 2 shows that the pivoting face 6 is opened to reveal the inside of the printer 2. The face of the printer is exposed before the printer is opened. The print head cartridge 96 is fixedly positioned by the weir engagement cam 20, which is pushed down to ensure that the ink coupling member (to be explained) is fully engaged, and the print head 1C (described later) ) Position the paper feed path correctly. By the release lever 24, the hand motion cam 20 〇 pivoting surface 6 will not close, so the printer will not operate until the release 24 is pushed down to fully engage the cam. Closing the pivot face 6 causes the machine contact point 22 to engage the 匣 contact point 104. Figure 3 shows that the pivoting face 6 of the printer is open and the printhead 匣9 6 is removed. Since the pivoting face 6 is tilted forward, the user pulls up the tweezer release lever 24 to disengage the cam 20. This causes the handle 26 on the cymbal 96 to be gripped and pulled up. The upstream and downstream ink coupling members 1 1 2 A and 1 1 2 B are separated from the print conduit 142. This will be explained in more detail below. The opposite is true if you want to install the new 匣 ® program. Xinyi did not inject ink when it was shipped and sold. In order for the printer to be ready for printing, the active fluid system (described later) uses a downstream pump to inject the ink and print head into the ink. In Figure 4, the outer casing of the printer 2 has been removed to reveal the portion. The large ink tank 60 has separate reservoirs for all four different types of ink. The ink reservoir 60 itself is a replaceable cartridge that is coupled upstream of the printer that shuts off the valve (see Figure 6). There is also a box 92 for pumping ink from the raft 96 by the pump 62. The printer fluid system will be described in detail with reference to Figure 6. In short, the ink from the slot 60 flows out upstream of the mast and is moved to the inner 66 from the ink fountain 95-200940349 water line 84 to the shut-off valve 66 and up to the printer Catheter 142. As shown in Figure 5, when the crucible 96 is installed, the pump 62 (driven by the motor 196) can draw ink into the LCP casting 64 (see Figures 6 and 17 to 20) to enable capillary action. The print head 1C 68 (again, see Fig. 6 and Figs. 17-20) injects ink. The excess ink drawn by the pump 62 is fed into the casing 92 covered by the ink tank 60. Because of the number of contact points used, the total connection force between the contact point 104 and the printer H-contact 22 is quite large. In the illustrated embodiment, the total contact force is 45 Newtons. This load is sufficient to bend and deform the crucible. In Fig. 30, the internal structure of the frame casting is shown. The support surface 28 shown in Fig. 3 is schematically shown in Fig. 30. The compressive load at the printer contact point on the contact point 104 is indicated by an arrow. The force on the support surface 28 is likewise indicated by an arrow. In order to maintain the structural integrity of the crucible 96, the frame casting 1 has a structural member 30 extending from the plane of the joining force. In order to maintain the connection force acting in the plane of the connection force, the frame also has a contact rib 32 that bears against the support surface 28. This allows the load on the structural member 30 to be fully compressible to maximize the stiffness of the crucible and minimize any bending. Print Engine Pipeline The print engine pipeline has printer processing for printing data that is received from an external source and output to the printhead for printing. The printing engine pipeline is described in detail in USSN 11/0 14769 ( RRC 001 US) filed on Dec. 20, 2004, the disclosure of which is hereby incorporated by reference. -16- 200940349 Fluid Systems Traditional printers rely on structures and components within the printheads, cartridges, and ink lines to avoid fluid problems. Some common fluid problems are color mixing of unfilled ink or dry nozzles, gas egress bubbles, and cross-contamination. For fluid control, optimizing the design of the printer components to avoid these problems is a passive approach. In general, the active component used to correct these problems is the nozzle actuator itself. However, this is usually insufficient and will waste a lot of ink on the work of correcting these problems. In the page width print head, the problem is exacerbated by the length and complexity of the ink supply tube supplied to the print head 1C. The applicant of the present invention has developed an active fluid system for a printing machine to solve this problem. Some of these problems are described in US Ser. No. 1 1/677,049, the disclosure of which is incorporated herein by reference. Figure 6 shows a single pump embodiment of an active fluid system wherein the active fluid system is adapted for use with the printhead described in the present specification. The fluid architecture shown in Figure 6 is for a single ink line of only one color. The color printer will have separate ink lines (and separate ink reservoirs 60) for each color. As shown in Figure 6, the architecture has a single pump 62 downstream of the LCP casting 64 and a shut-off valve 66 upstream of the LCP casting. The LCP casting supports the print head IC 6 8 via the adhesive 1C adhesion film 174. The shut-off valve 66 isolates the ink in the ink tank 60 from the print head 1C 68 whenever the printer power is turned off. This allows color mixing at the print head IC 68 between periods -17-200940349 to avoid reaching the ink tank 60. These issues are further detailed in the cross-referenced specification USSN 1 1/677049 (our file SBF006US). The ink reservoir 60 has a venting bubble point pressure regulator 72 for maintaining a relatively constant negative hydrostatic pressure in the ink at the nozzle. The bubble point pressure regulator in the ink reservoir is described in detail in co-pending USSN 11/640,355, filed on Jan. Q, however, the regulator 72 is shown to have a bubble outlet 74 that sinks into the ink in the ink reservoir 60 and is vented to the atmosphere via a sealed conduit 76 that extends to the air inlet 78. When the print head ic 68 consumes ink, the pressure in the ink tank 60 drops until the pressure difference at the bubble outlet 74 draws air into the tank. The air forms bubbles in the ink and rises to the headspace of the trough. This pressure difference is the bubble point pressure and has an absolute relationship with the diameter (or minimum dimension) of the bubble outlet 74 and the Laplace pressure of the ink relief surface at the outlet, which prevents air from entering. The bubble point pressure regulator uses the required bubble point pressure to generate bubbles at the sinking bubble outlet 74 so that the hydrostatic pressure remains substantially constant at the outlet (when the air bulges to form a bubble and rises to the ink) There will be a slight change in the space at the top of the sink). If the hydrostatic pressure at the outlet is at the bubble point, the hydrostatic pressure profile in the ink reservoir is known regardless of how much ink has been consumed by the ink reservoir. When the ink level drops to the outlet, the pressure on the surface of the ink in the ink tank drops toward the bubble point pressure. Of course, once the outlet 74 is exposed, the headspace is vented to the atmosphere and the negative pressure will disappear. If the ink level reaches the bubble exit 74, the ink reservoir should be replenished -18-200940349 to fill or replace (if it is a carcass). The ink tank 60 can be a fixed reservoir capable of replenishing ink, or can be disclosed (disclosed in RRC001US, incorporated herein by reference) to prevent particle contamination, and the outlet 80 of the ink tank 60 has a coarse filter. A fine filter is also used at the print head. It is especially convenient for the user to replace the ink cartridge or print the old filter with a limited life. If you have to use individual consumables, you will have to rely on the hard-working and regular replacement of the user. When the bubble outlet 74 is at the bubble point pressure and is turned off, the hydrostatic pressure at the nozzle is also fixed and small. However, if the shut-off valve 66 has been closed for a period of time, bubbles may form in the LCP casting 64 or in the print head, changing the pressure at the nozzle. Similarly, each time the temperature changes, the expansion or contraction of the bubble changes the force of the ink line 84 downstream of the shut-off valve 66. Similarly, as the dissolved gas runs out of the solution, the pressure in the tank will change during the non-operating period. From the LCP casting 64 to the downstream ink line 86 of the pump 62 is coupled to the electronic controller 90 for the ink sensor 88 of the pump. 8 8 senses the presence or absence of ink in the downstream ink line 86. The sensor 88 can be omitted for the system, and the pump 62 can be set to operate for a different period of time for a different operation. This can adversely affect operating costs because of increased waste. The pump 62 is fed into the tank 92 (when the box 92 is physically positioned in the forward direction to be positioned in the printer to replace it below the print head.) 82 is filtered to replace the filter It is 丨66 is the pressure between the outside of the atmospheric gas 1C 68, the ink can include the sensor on behalf of the ground, for each ink). 1C 68 -19- 200940349. This allows the ink in the downstream ink line 86 to travel during the life of the LCP casting 64, whereby the print head 1C 68 produces a negative pressure at the negative hydrostatic nozzle that pulls the ink relief inwardly and avoids color mixing, the creeping pump 62 needs to be stopped in the open condition 'to allow liquid communication between the ink outlets in the LCP casting pump 92. The pressure difference between the ink lines of different colors will not occur. In addition, paper dust or other particles on the nozzle plate can damage the ink of 0. Driven by a slight pressure differential between each ink line occurs during periods when the printer is not operating. The shut-off valve 66 causes the ink to exit the nozzle of the print head IC 66 to prevent color mixing from extending over 60. Once the ink in the ink tank is contaminated with different colors, it does not have to be replaced. The cover 94 series print head maintenance station is hidden during standby to avoid dehydration of the print head 1C 68 and to block the nozzle from the paper particles. A cover 94 is also provided for cleaning the nozzle plate to remove water and other contaminants. When the ink solvent (usually water) evaporates the viscosity of the ink, dehydration of the print head 1C 68 occurs. If the viscosity is too high, the inkjet actuator will not be able to eject ink drops. If the device is sealed, it may be a problem to re-operate the nozzle after the shutdown or standby period. The various items listed above are common during the life of the printer and can be effectively corrected using the relatively simple fluid shown in Figure 6. It also allows the user to initially inject the ink into the inkjet printer without injecting ink or using a simple fault check to "hang" the pressure. Spray. Of course, the object 64 is mixed with the color of each nozzle during operation, the slot 60 is separated by the ink tank method and the nozzle is hidden, and the dust or the dry ink is removed and the ink is sacrificed if the ink is sacrificed. , the transfer agreement will be listed -20- 200940349

印機回復至已知列印就緒狀態。數個這些情況的範例係詳 述於以上參照之USSN 1 1 /677049 (我們的檔案SBF006US )中。 列印頭匣 列印頭匣96係表示於第7至16A圖中。第7圖係表 示組裝完整之列印頭匣96。匣體係安裝於匣機架1〇〇及機 〇 架蓋102之內。機架100之視窗暴露出匣接觸點104,其 接收來自列印機中列印引擎控制器之資料。 第8及9圖表示匣96,其按扣係在保護蓋98之上。 保護蓋98係防止損壞與電接觸點104及列印頭1C 68之 接觸(參見第10圖)。使用者可固持匣96之頂部並於安 裝於列印機內之前立刻移除保護蓋98。 第1 〇圖表示列印頭匣96之底側及「後面」(相對於 紙張饋送方向)。列印頭接觸點1 04係爲在撓性印刷電路 ❹ 板上之導電墊,撓性印刷電路板1 08係纏繞著彎曲支 擦表面(將於以下關於LCP禱造物之說明中討論)而至位 於列印頭1C 68之一側之一行接線接合處1 1 0。列印頭IC 68之另一側則爲紙張遮蔽件丨06,用以防止直接與媒體基 板接觸。 第11圖表示列印頭匣96之底側及「前面」。該匣之 前面有兩個墨水耦合件Η 2A與11 2B在任一端處。每—墨 水耦合件具有四個匣閥U 4。當匣安裝於列印機中時,墨 水親合件112A與1 ι2Β接合互補墨水供應介面(以下將更 -21 - .200940349 詳細說明)。墨水供應介面具有列印機導管丨42,其接合 並打開匣閥114。墨水耦合件n2A其中之一係上游墨水 耦合件’其它則是下游墨水耦合件1 i 2 B。上游墨水稱合 件1 12A於列印頭1C 68及墨水槽6〇之間建立了液體連通 (參見第6圖)’而且下游墨水親合件112B連接至箱體 92 (同樣地參見第6圖)。 第1 2圖表示列印頭匣9 6之各種視圖。列印頭匣9 6 〇 之平面圖亦表示第14、15及16圖之剖面圖之位置。 第13圖是列印頭匣90之分解立體圖。LCP鑄造物64 附著至匣機架100之底側。然後,撓性PCB 108附著於 LCP鑄造物64之底側並纏繞一邊以暴露出列印頭接觸點 104。入口歧管及過濾器116經由彈性連接器120連接至 L C P入口 1 2 2。同樣地,L C P出口 1 2 4經由另一組彈性連 接器120連接至出口歧管118。機架蓋1〇2由頂部將入口 及出口歧管裝入機架1〇〇之內,而且可移除保護蓋98快 〇 速蓋於底部上,以保護接觸點1 0 4及列印頭IC (參見第 1 1 圖)。 入口及過濾器歧管 第14圖係沿第12圖線14-14而取之放大剖面圖,其 表示經由上游耦合件1 12A之匣閥1 14其中之一而至LCP 鑄造物64之流體路徑。匣閥114具有彈性套管126,其被 偏置成與固定閥構件128密封接合。藉由壓縮彈性套管 126,使列印機導管142打開匣閥1 14 (參見第16圖)’ -22- 200940349 致使其由固定閥構件128開啓並允許墨水沿著入口及過濾 器歧管1 1 6之頂部向上流至頂溝道1 3 8。頂溝道1 3 8通至 上游過濾器室132,上游過濾器室132之一壁係由過濾器 隔膜1 3 0所界定。墨水流經過濾器隔膜1 3 0進入下游過濾 器室134並流出至LCP入口 122。從該處,經過濾之墨水 沿著L C P主溝道1 3 6流動,以饋入列印頭IC (圖未示) 〇 〇 入口及過濾器歧管116之特點及優點現在將參考第15 圖而說明。第15圖分解立體圖非常明確地說明了入口及 過濾器歧管1 1 6之精巧設計。該設計之一些特點有助於精 巧形式。首先,匣閥係靠近相隔。這與傳統自行密封墨水 閥架構是不一樣的。先前之設計係使用被偏置成與固定構 件密封接合之彈性構件。然而,彈性構件是墨水流動繞過 之固體形狀,要不然就是墨水流動穿過之膜片形式。 於匣耦合件中’在安裝時,匣閥很方便地自動開啓。 Ο 這可藉由耦合件而以輕易且成本低之方式來達成,其中一 個閥具有彈性構件’該彈性構件係在其他閥上被堅硬構件 接合。假如彈性構件是膜片形式,則其通常於張力情況下 將本身固持抵住中央堅硬構件。這提供了有效密封及需要 相當低之容差。然而’其亦需要彈性構件有寬廣之周邊安 裝。彈性構件之寬度將會是所需耦合力、密封完整性與所 使用彈性構件之材料特性之間的取捨。 如第1 6圖所明確表示,本發明之匣閥丨〗4使用彈性 套管126’其於殘留壓縮情況下密封抵住固定閥構件ι28 -23- .200940349 。當匣安裝於列印機中時,閥1 1 4會打開,列印機閥1 42 之導管148之末端進一步壓縮套管126。軸環146由固定 閥構件128開啓,以經由上游耦合件112A及下游耦合件 1 12B連接LCP鑄造物64進入列印機流體系統(參見第6 圖)。套管之側壁係設計成向外鼓起,因爲向內下陷會造 成流動阻礙。如第16圖所示,套管126有一行較弱處繞 其中間部份,其增強並引導彎曲。這會降低將匣接合至列 φ 印機所需之力,並確保套管向外彎曲。 耦合件係用於使匣以「無水滴」脫離列印機。當匣由 列印機向上拉時,彈性套管1 26推軸環1 46,以密封抵住 固定閥構件1 2 8。一旦彈性套管1 2 6密封抵住固定閥構件 1 2 8 (因此密封耦合件之匣側),密封軸環1 46與匣一起 升高。如此會由導管148之末端開啓軸環146。當密封破 裂,墨水凹凸面會形成通過介於軸環與導管148之末端間 之間隙。固定閥構件128之末端形狀會引導凹凸面朝向其 Φ 底部表面中間行進,而非穿過一點。於固定閥構件128之 圓形底部中間處,凹凸面被驅動以使本身脫離幾乎水平之 底部表面。爲了達到最低可能之能量狀態,表面張力驅使 凹凸面脫離固定閥構件128。將凹凸面表面積最小化之偏 置作用是強的,致使在脫離後僅有很少墨水(如果有)殘 留於匣閥114之上。在處理匣之前,任何殘留墨水並不足 以成爲會滴下及造成污染之一滴墨水。 當新匣安裝於列印機內時,導管150內之空氣會進入 墨水流體152內並被匣所吸收。有鑑於此,入口歧管及過 -24- 200940349 濾器組件具有高的氣泡容差。參見第1 5圖’墨水流經固 定閥構件128之頂部並進入頂溝道138。因爲頂溝道是入 口歧管1 1 6之最高點,頂溝道可補獲氣泡。然而’氣泡仍 有可能流入過濾器入口 158中。在這種情況中’過濾器組 件本身係可容許氣泡。 過濾器構件1 3 〇之上游側上之氣泡會影響流動速率’ 它們有效地降低過濾器構件1 3 0骯髒側上之濡濕表面積。 © 過濾器隔膜具有長矩形,致使即使少許之氣泡被吸到過濾 器骯髒側中,濡濕表面積仍然會大的足以所需流動速率過 濾墨水。這對於本發明所提供之高速操作而言是重要的。 當上游過濾器室132中之氣泡無法越過過濾器隔膜 130,氣體外出之氣泡可能會產生氣泡於下游過濾器室134 中。過濾器出口 156係定位於下游過濾器室134之底部處 並斜對著上游過濾器室132中之入口 158,以便在該流動 速率下將任一室中之氣泡效應降到最低。 © 用於每一種顏色之過濾器130係並列垂直地靠近堆疊 。隔間壁1 62係部份地於一側界定上游過濾器室1 32,且 部份地於另一側界定相鄰顏色之下游過濾器室1 3 4。因爲 過濾器室係如此之薄(用於精巧設計),過濾器隔膜1 3 〇 可被推抵下游過濾器室1 3 4之相對壁。這有效地降低了過 濾器隔膜130之表面積。因此使流動速率達最大是有害的 。爲了避免這種情況,下游過濾器室1 3 4之相對壁具有一 連串之間隔肋160,以維持隔膜130與壁分開。 將過濾器入口及出口定位於斜向對角亦有助於在系統 -25- 200940349 初始注入墨水期間清洗空氣系統。 爲了降低列印頭粒子污染風險,於下一個隔間壁1 62 焊接至第一隔間壁前,過濾器隔膜1 3 0係焊接至第一隔間 壁之下游側。如此,於焊接過程之任何斷裂之小片過濾器 隔膜1 3 0將會在過濾器1 3 0「骯髒」側上。The printer returns to the known print ready state. An example of several of these cases is detailed in USSN 1 1 /677049 (our file SBF006US) referenced above. The print head 匣 print head 匣 96 is shown in Figures 7 to 16A. Figure 7 shows the assembled print head 96. The crucible system is mounted within the crucible frame 1 and the frame cover 102. The window of the rack 100 exposes a contact point 104 that receives information from the print engine controller in the printer. Figures 8 and 9 show the cymbal 96 with the snaps attached over the protective cover 98. The protective cover 98 prevents damage from contact with the electrical contact 104 and the print head 1C 68 (see Figure 10). The user can hold the top of the cassette 96 and remove the protective cover 98 immediately prior to installation in the printer. The first figure shows the bottom side of the print head 匣 96 and the "back" (relative to the paper feed direction). The print head contact 104 is a conductive pad on a flexible printed circuit board, and the flexible printed circuit board 108 is wrapped around a curved wipe surface (discussed below in the description of the LCP Prayer). One of the row wiring junctions 1 1 0 on one side of the print head 1C 68. The other side of the printhead IC 68 is a paper cover 丨06 to prevent direct contact with the media substrate. Figure 11 shows the bottom side and "front" of the print head 96. There are two ink coupling members Η 2A and 11 2B at either end in front of the cymbal. Each of the ink couplings has four helium valves U 4 . When the crucible is mounted in the printer, the ink affinity members 112A and 1⁄2 are joined to the complementary ink supply interface (described in more detail below - 21 - . 200940349). The ink supply interface has a printer conduit 42 that engages and opens the helium valve 114. One of the ink coupling members n2A is the upstream ink coupling member' and the other is the downstream ink coupling member 1 i 2 B. The upstream ink weighing member 1 12A establishes liquid communication between the printing head 1C 68 and the ink tank 6〇 (see FIG. 6) and the downstream ink affinity member 112B is coupled to the housing 92 (see also Figure 6). ). Figure 1 2 shows various views of the print head 匣 96. The plan of the print head 匣 9 6 亦 also indicates the position of the cross-sectional views of Figures 14, 15 and 16. Figure 13 is an exploded perspective view of the print head cartridge 90. The LCP casting 64 is attached to the bottom side of the crucible frame 100. The flexible PCB 108 is then attached to the bottom side of the LCP casting 64 and wrapped around to expose the printhead contact 104. The inlet manifold and filter 116 are connected to the L C P inlet 1 22 via a resilient connector 120. Likewise, the L C P outlet 1 2 4 is coupled to the outlet manifold 118 via another set of resilient connectors 120. The frame cover 1〇2 is installed into the frame 1〇〇 from the top, and the removable cover 98 is quickly slid on the bottom to protect the contact point 104 and the print head. IC (see Figure 1 1). Inlet and filter manifold Figure 14 is an enlarged cross-sectional view taken along line 12-14 of Figure 12, showing the fluid path to the LCP casting 64 via one of the helium valves 1 14 of the upstream coupling member 1 12A. . The helium valve 114 has an elastomeric sleeve 126 that is biased into sealing engagement with the fixed valve member 128. By compressing the elastomeric sleeve 126, the printer conduit 142 is opened by the helium valve 1 14 (see Figure 16) '-22- 200940349 such that it is opened by the fixed valve member 128 and allows ink along the inlet and filter manifold 1 The top of 1 6 flows upward to the top channel 1 3 8 . The top channel 1 3 8 leads to the upstream filter chamber 132 and one of the walls of the upstream filter chamber 132 is defined by the filter membrane 130. The ink flows through the filter membrane 130 into the downstream filter chamber 134 and out to the LCP inlet 122. From there, the filtered ink flows along the LCP main channel 136 to feed the printhead IC (not shown). The features and advantages of the inlet and filter manifold 116 will now be referenced to Figure 15. And the explanation. The exploded perspective view of Fig. 15 illustrates very clearly the delicate design of the inlet and filter manifolds 116. Some of the features of this design contribute to the fine form. First, the valve system is close to each other. This is not the same as the traditional self-sealing ink valve architecture. Previous designs used elastic members that were biased into sealing engagement with the stationary members. However, the elastic member is a solid shape in which the ink flows around, or else in the form of a diaphragm through which the ink flows. In the 匣 coupling part, the 匣 valve is automatically opened automatically during installation. Ο This can be achieved in an easy and cost-effective manner by means of a coupling, one of which has an elastic member' which is joined to the other valve by a rigid member. If the elastic member is in the form of a diaphragm, it will normally hold itself against the central rigid member under tension. This provides an effective seal and requires a relatively low tolerance. However, it also requires flexible peripheral members to have a wide peripheral installation. The width of the resilient member will be a trade-off between the desired coupling force, the integrity of the seal, and the material properties of the resilient member used. As clearly shown in Fig. 16, the 匣 valve 丨 4 of the present invention uses an elastic sleeve 126' which seals against the fixed valve member ι28-23-.200940349 under residual compression. When the crucible is installed in the printer, the valve 1 14 will open and the end of the conduit 148 of the printer valve 1 42 will further compress the sleeve 126. The collar 146 is opened by the fixed valve member 128 to connect the LCP casting 64 to the printer fluid system via the upstream coupling 112A and the downstream coupling 1 12B (see Figure 6). The side walls of the casing are designed to bulge outwardly as the inward depression can create flow obstructions. As shown in Fig. 16, the sleeve 126 has a weaker portion around its intermediate portion which reinforces and guides the bend. This reduces the force required to join the 匣 to the column φ printer and ensures that the sleeve bends outward. The coupling member is used to disengage the crucible from the printer with "no water droplets". When the cassette is pulled up by the printer, the elastomeric sleeve 1 26 pushes the collar 1 46 to seal against the fixed valve member 1 28 . Once the elastomeric sleeve 1 2 6 seals against the fixed valve member 1 2 8 (and thus the heel side of the seal coupling), the seal collar 1 46 rises with the weir. The collar 146 is thus opened by the end of the conduit 148. When the seal breaks, the ink relief surface will form a gap through the gap between the collar and the end of the conduit 148. The shape of the end of the fixed valve member 128 guides the concavo-convex surface toward the middle of its Φ bottom surface rather than passing through it. At the middle of the circular bottom of the fixed valve member 128, the relief surface is driven to disengage itself from the nearly horizontal bottom surface. In order to achieve the lowest possible energy state, the surface tension drives the relief surface away from the fixed valve member 128. The biasing effect of minimizing the surface area of the relief surface is strong such that little ink, if any, remains on the helium valve 114 after detachment. Before the crucible is processed, any residual ink is not enough to be one of the drops that will drip and cause contamination. When the new cartridge is installed in the printer, air within the conduit 150 will enter the ink fluid 152 and be absorbed by the crucible. In view of this, the inlet manifold and the -24-200940349 filter assembly have high bubble tolerances. Referring to Figure 15, the ink flows through the top of the fixed valve member 128 and into the top channel 138. Since the top channel is the highest point of the inlet manifold 1 16 , the top channel can replenish bubbles. However, it is still possible for the bubble to flow into the filter inlet 158. In this case the 'filter assembly itself is tolerate air bubbles. The bubbles on the upstream side of the filter member 13 3 affect the flow rate'. They effectively reduce the wetted surface area on the dirty side of the filter member 130. © The filter diaphragm has a long rectangular shape so that even a small amount of air bubbles are drawn into the dirty side of the filter, and the wetted surface area is still large enough to filter the ink at the desired flow rate. This is important for the high speed operation provided by the present invention. When bubbles in the upstream filter chamber 132 cannot pass over the filter membrane 130, bubbles emerging from the gas may create bubbles in the downstream filter chamber 134. A filter outlet 156 is positioned at the bottom of the downstream filter chamber 134 and obliquely opposite the inlet 158 in the upstream filter chamber 132 to minimize bubble effects in either chamber at this flow rate. © Filters 130 for each color are juxtaposed vertically adjacent to the stack. The compartment wall 1 62 partially defines an upstream filter chamber 1 32 on one side and a downstream filter chamber 1 34 that defines an adjacent color on the other side. Because the filter chamber is so thin (for delicate design), the filter membrane 13 〇 can be pushed against the opposite wall of the downstream filter chamber 134. This effectively reduces the surface area of the filter membrane 130. It is therefore harmful to maximize the flow rate. To avoid this, the opposing walls of the downstream filter chamber 134 have a series of spaced ribs 160 to maintain the diaphragm 130 separate from the wall. Positioning the filter inlet and outlet diagonally diagonally also helps to clean the air system during initial injection of ink from the system -25- 200940349. In order to reduce the risk of contamination of the print head particles, the filter membrane 130 is welded to the downstream side of the first compartment wall before the next compartment wall 1 62 is welded to the first compartment wall. Thus, any broken plate filter diaphragm 130 in the welding process will be on the "dirty" side of the filter 130.

LCP鑄造物/撓性PCB/列印頭1C 〇 L c P鑄造物6 4,撓性P C B 1 0 8以及列印頭IC 6 8組件 係表示於第17至33圖。第17圖係LCP鑄造物64之底面 立體圖,其中附著有撓性PCB及列印頭1C 68。LCP鑄造 物6 4係經由埋頭孔1 6 6及1 6 8固定於匣機架1 0 〇。孔1 6 6 是反圓孔,用以不需使LCP彎曲便可接納熱膨脹係數( CTE)不匹配狀況。列印頭1C 68係於LCP鑄造物64縱 長方向向下以端對端之方式排成一線。撓性PCB 108在一 邊緣以接線接合至列印頭IC 6 8。撓性P C B 1 0 8亦在列印 © 頭1C邊緣及匣接觸點104邊緣固定至LCP鑄造物64。在 兩個邊緣固定撓性PCB使其緊緊地固持於彎曲支撐表面 170(參見第19圖)。這樣可確保撓性PCB不會彎曲成比 設定最小値還緊之半徑,藉以降低經過撓性P C B之導電線 跡破碎之風險。 第18圖係第17圖中之插入物A之放大圖,其表示沿 著撓性PCB 108側邊之接線接合接觸點164排及列印頭 1C 68 排。 第19圖係LCP/撓性PCB/列印頭1C組件之分解立體 -26- 200940349 圖,表示各元件之底側。第20圖係另一分解立體圖 示各元件頂側。LCP鑄造物64具有密封至其底側之 溝道鑄造物176。列印頭1C 68係藉由黏著1C附著膜 附著至溝道鑄造物176之底側。:LCP主溝道184係在 溝道鑄造物176之頂側。於LCP鑄造物64中’ LCP 道184係開放給墨水入口 122及墨水出口 124。通到 頭1C 68之一連串之墨水供應通路182係在LCP主 © 184之底部。黏著1C附著膜174具有一連串之雷射鑽 應孔1 8 6,使得每一列印頭IC 6 8之附著側與墨水供 路182液體連通。以下將參考第31至33圖詳細說明 1C附著膜。LCP鑄造物64具有凹部178用以接納 PCB 108上之驅動電路中之電子元件180。爲了達到 電氣效率與操作,PCB 108上之匣接觸點104應靠近 頭1C 68。然而,爲了保持鄰近列印頭之紙張路徑是 ,而非彎曲或有角度,匣接觸點104需要在匣96之 〇 。撓性PCB中之導電路徑稱爲線跡。因爲撓性PCB 彎曲轉角,線跡可能會使連接處裂開及斷裂。爲了克 種情況,可於彎曲前使線跡分叉,然後於彎曲後使線 合而爲一。如果分叉段之一個分支裂開了,則其它分 持連接。不幸地,使線跡一分爲二,然後在將其接在 ,這會造成電磁干擾問題,而會於電路中產生雜訊。 使線跡變寬並非有效之解決方案,因爲較寬之線 於防止裂開並不顯著。一旦線跡中已開始裂開,其會 快且容易地傳遍整個寬度。比起將撓性PCB中經過彎 ,表 LCP 174 LCP 主溝 列印 溝道 孔供 應通 黏者 撓性 最佳 列印 直的 側邊 必須 服這 跡在 支維 —起 跡對 相當 曲之 -27- 200940349 線跡之數目減少到最小程度,要使線跡裂開程度減到最小 ,小心地控制彎曲半徑會較爲有效。 頁寬列印頭呈現額外之複雜性,因爲大的噴嘴陣列必 須於相當短時間發射。立刻使許多噴嘴發射會使系統承受 很大電流負載。這會在電路產生高位準電感,進而造成電 壓驟降,而不利於操作。爲了避免這種情況,撓性PCB具 有串接電容器,其於噴嘴依序發射時放電,以減輕其餘電 ❹ 路上之負載。因爲需要保持經過列印頭1C之紙張路徑爲 直的,電容器一般係附著於靠近匣側邊上之接觸點的撓性 PCB。不幸地,它們產生了額外之線跡,而使撓性PCB之 彎曲段有裂開的風險。 這個問題解決之方法爲:安裝電容器180 (參見第20 圖)緊鄰列印頭1C 68,以降低線跡裂開的機會。藉由將 電容器及其它元件隱藏於LCP鑄造物64內,使紙張路徑 維持線性。 〇 列印頭1C 68之下游之撓性PCB 108之相當平坦之表 面及安裝於匣96「前面」(關於饋送方向)之紙張遮蔽件 172使塞紙之風險降至最低。 將接觸點與撓性PCB之其餘元件隔離可將延伸經過彎 曲段之線跡之數目減到最小。這樣能有較大之可靠度’因 爲裂開之機會降低了。將電路元件放在列印頭1C旁邊意 謂匣需要以最低限度加寬,這不利於精巧設計。然而,這 種架構具有之優點卻超過了任何稍爲較寬之匣之缺點。首 先,接觸點會較大,因爲沒有來自於元件之線跡存在於接 -28- 200940349 可之 較側 會機 接印 違歹 , 與 占 占 類黑 觸觸 接接 之匣 大於 較度 了確 有準 。 不 圍之 周上 點造 觸製 接服 及克 間能 之更 點且 觸靠 間。於這種情況中,這點尤其重要,接合接觸點仰賴使用 者準確地插入匣。 第二,接線接合至列印頭1C側邊之撓性PCB之邊緣 並非在殘餘應力之下且試著要脫離彎曲半徑。撓性PCB可 在電容器其其它元件處被固定於支撐結構,使得於製造期 〇 間接合至列印頭1C之接線較易於形成,且較不會裂開, 因爲其並非也要用於固定撓性PCB。 第三,電容器尤其更靠近列印頭1C之噴嘴,使得放 電電容器所產生之電磁干擾降到最低程度。 第2 1圖係列印頭匣之底面之放大圖,其表示撓性 PCB 108及歹丨J印頭1C 68。撓性PCB 108之接線接合接觸點 164係與黏著1C附著膜174底側上之列印頭1C 68之接觸 墊平行配置。第22圖表示第21圖中將列印頭1C 68及撓 ® 性PCB移除以顯露供應孔1 86之放大圖。該等孔係排列成 四個縱長列。每一列傳送一種特殊顏色之墨水,而且每一 列對齊於每一列印頭1C 68後側之單一溝道。 第23圖表示LCP溝道鑄造物176之底側圖,其中已 移除黏著1C附著膜174。這顯露出墨水供應通路182,其 連接至形成於溝道鑄造物176其它側中之LCP主溝道184 (參見第20圖)。可以知道,當黏著1C附著膜174被黏 住時,其部份界定墨水供應通路1 82。可以知道,附著薄 膜必須被準確地定位,因爲各別墨水供應通路1 82必須對 -29- 200940349 齊於經由膜174而雷射鑽孔之供應孔186。 第24圖表示LCP鑄造物之底側圖,其中已移 溝道鑄造物。這顯露出盲洞200陣列,當匣注入墨 盲洞200含有空氣,以便減弱任何壓力脈波。這將 進一步詳細討論。 列印頭1C附著薄膜 〇 雷射燒蝕薄膜 參考第31圖至33圖,將更詳細說明黏著1C 膜。膜174可受雷射鑽孔並捲於捲輪198上,便於 印頭匣96。爲了處理與儲存,膜174具有兩個保護 —般爲PET襯墊)於任一側上。其中之一爲現 188B,其於雷射鑽孔前已經附著至薄膜上。另一襯 換襯墊192,其於鑽孔操作後替換現用襯墊188A。 第32圖所示之雷射鑽孔膜174之部份具有已 〇 用以暴露供應孔186之一些現用襯墊188B。在薄 側上之替換襯墊192於供應孔186受雷射鑽孔後替 襯墊1 88 A。 第33 A至33C圖詳細表示膜174如何以雷射燒 。第33A圖詳細表示雷射鑽孔前薄膜之疊層結構。 板190 —般係爲聚醯亞胺薄瞑並提供該疊層所需之 膜板190夾於第一黏著層194A及第二黏著層194B 其一般爲環氧層。第一黏著層194A係用於接合至 道鑄造物176。第二黏著層194B係用於接合至列ί 除LCP 水時, 於以下LCP Casting/Flexible PCB/Printing Head 1C 〇 L c P casting 6 4, flexible P C B 1 0 8 and print head IC 6 8 components are shown in Figures 17 to 33. Figure 17 is a perspective view of the underside of the LCP casting 64 with the flexible PCB and print head 1C 68 attached. The LCP castings 6 4 are fixed to the crucible frame 10 经由 via countersunk holes 166 and 168. Hole 1 6 6 is an anti-circular hole for accepting a coefficient of thermal expansion (CTE) mismatch without bending the LCP. The print head 1C 68 is lined up end-to-end in the longitudinal direction of the LCP casting 64. The flexible PCB 108 is wire bonded to the printhead IC 6 8 at one edge. The flexible P C B 1 0 8 is also secured to the LCP casting 64 at the edge of the print 1 © 1C edge and the 匣 contact 104. The flexible PCB is held at both edges to hold it tightly to the curved support surface 170 (see Figure 19). This ensures that the flexible PCB does not bend to a radius that is tighter than the minimum set of turns, thereby reducing the risk of breakage of the conductive traces through the flexible P C B . Figure 18 is an enlarged view of the insert A in Figure 17, showing the rows of wire bond contacts 164 and the rows of print heads 1C 68 along the sides of the flexible PCB 108. Figure 19 is an exploded perspective of the LCP/flex PCB/print head 1C assembly. -26- 200940349 Figure showing the bottom side of each component. Figure 20 is another exploded perspective view of the top side of each component. The LCP casting 64 has a channel casting 176 sealed to its bottom side. The print head 1C 68 is attached to the bottom side of the channel casting 176 by adhering the 1C adhesion film. The LCP main channel 184 is attached to the top side of the channel casting 176. The LCP channel 184 is open to the ink inlet 122 and the ink outlet 124 in the LCP casting 64. A series of ink supply passages 182 leading to one of the heads 1C 68 are attached to the bottom of the LCP main © 184. The adhesive 1C attachment film 174 has a series of laser drill holes 186 such that the attachment side of each of the print head ICs 6 8 is in fluid communication with the ink supply path 182. The 1C adhering film will be described in detail below with reference to Figs. 31 to 33. The LCP casting 64 has a recess 178 for receiving the electronic component 180 in the drive circuitry on the PCB 108. In order to achieve electrical efficiency and operation, the contact point 104 on the PCB 108 should be close to the head 1C 68. However, in order to keep the paper path adjacent to the print head, rather than being curved or angled, the contact point 104 needs to be at 匣96. The conductive path in a flexible PCB is called a stitch. Because of the curved corners of the flexible PCB, the stitches may crack and break the joint. In order to overcome the situation, the stitches can be bifurcated before bending, and then the threads are combined to be one after bending. If one branch of the bifurcation segment is split, the other connections are connected. Unfortunately, splitting the stitches into two, and then connecting them, can cause electromagnetic interference problems and generate noise in the circuit. Widening the stitch is not an effective solution because the wider line is not significant to prevent cracking. Once the stitching has begun to crack, it will spread throughout the width quickly and easily. Compared to the bending of the flexible PCB, the LCP 174 LCP main groove prints the channel hole to supply the flexible side of the best printable side. This trace must be served in the support - the trace pair is quite curved - 27- 200940349 The number of stitches is minimized. To minimize the cracking of the stitches, it is more effective to carefully control the bend radius. The page width printhead presents additional complexity because the large nozzle array must be launched in a relatively short time. Immediately firing many nozzles will expose the system to large current loads. This creates a high level of inductance in the circuit, which in turn causes a voltage dip that is not conducive to operation. To avoid this, the flexible PCB has a series capacitor that discharges when the nozzles are sequentially fired to relieve the load on the remaining electrical circuits. Since it is necessary to keep the paper path through the print head 1C straight, the capacitor is typically attached to the flexible PCB near the contact point on the side of the crucible. Unfortunately, they create additional stitches that expose the curved section of the flexible PCB to the risk of cracking. The solution to this problem is to install capacitor 180 (see Figure 20) next to printhead 1C 68 to reduce the chance of stitch cracking. The paper path is maintained linear by hiding capacitors and other components within the LCP casting 64.相对 The relatively flat surface of the flexible PCB 108 downstream of the printhead 1C 68 and the paper shield 172 mounted on the front of the 匣96 (in relation to the feed direction) minimizes the risk of paper jam. Isolating the contact points from the rest of the flexible PCB minimizes the number of stitches that extend through the curved section. This can be more reliable' because the chance of cracking is reduced. Placing the circuit components alongside the print head 1C means that the need to be widened at a minimum is not conducive to a delicate design. However, the advantages of this architecture outweigh the shortcomings of any slightly wider one. First of all, the contact point will be larger, because there is no trace from the component in the -28-200940349, but the opposite side of the machine will be printed illegally, and the connection with the occupied black touch is greater than the accuracy. There is a standard. Do not make a touch on the circumference of the week to make the touch and the gap between the gram and the energy. This is especially important in situations where the joint contact point relies on the user to accurately insert the defect. Second, the edges of the flexible PCB that are wired to the sides of the printhead 1C are not under residual stress and try to break away from the bend radius. The flexible PCB can be fixed to the support structure at other components of the capacitor, so that the wiring that is bonded to the print head 1C during the manufacturing period is easier to form and less cracked because it is not used for fixed scratching. Sexual PCB. Third, the capacitor is especially closer to the nozzle of the print head 1C, so that the electromagnetic interference generated by the discharge capacitor is minimized. An enlarged view of the bottom surface of the print head of Figure 2 shows a flexible PCB 108 and a 歹丨J print head 1C 68. The wiring bonding contact point 164 of the flexible PCB 108 is arranged in parallel with the contact pads of the printing head 1C 68 on the bottom side of the adhesion 1C adhesion film 174. Fig. 22 shows an enlarged view of the print head 1C 68 and the flexible PCB removed in Fig. 21 to reveal the supply holes 186. The holes are arranged in four lengthwise columns. Each column carries a special color of ink, and each column is aligned to a single channel on the back side of each of the print heads 1C 68. Fig. 23 shows a bottom side view of the LCP channel casting 176 in which the adhesion 1C adhesion film 174 has been removed. This reveals an ink supply path 182 that is connected to the LCP main channel 184 formed in the other side of the channel casting 176 (see Figure 20). It will be appreciated that when the adhesive 1C attachment film 174 is adhered, it partially defines the ink supply path 182. It will be appreciated that the attachment film must be accurately positioned because the respective ink supply passages 1 82 must be aligned with the supply holes 186 for laser drilling through the membrane 174 to -29-200940349. Figure 24 shows a bottom side view of the LCP casting in which the channel casting has been removed. This reveals an array of blind holes 200 that are filled with ink into the ink blind hole 200 containing air to attenuate any pressure pulse waves. This will be discussed in further detail. Print head 1C attached film 〇 Laser ablation film Refer to Figures 31 to 33 for more details on the adhesion of the 1C film. Membrane 174 can be laser drilled and wound onto reel 198 to facilitate printhead 96. For processing and storage, film 174 has two protections, typically PET liners, on either side. One of them is now 188B, which has been attached to the film prior to laser drilling. Another liner 192 is substituted for the active liner 188A after the drilling operation. Portions of the laser-drilled film 174 shown in Fig. 32 have some of the active pads 188B that have been used to expose the supply holes 186. The replacement liner 192 on the thin side is replaced by a pad 1 88 A after the laser is drilled into the supply aperture 186. Figures 33A through 33C show in detail how the film 174 is fired by laser. Fig. 33A shows in detail the laminated structure of the film before laser drilling. The plate 190 is typically a polyimide film and the film sheet 190 required to provide the laminate is sandwiched between a first adhesive layer 194A and a second adhesive layer 194B which is typically an epoxy layer. The first adhesive layer 194A is for bonding to the track casting 176. The second adhesive layer 194B is used to bond to the column ί when the LCP water is used,

附著薄 倂入列 襯墊( 用襯墊 墊爲替 被移除 膜另一 換現用 蝕製造 中央膜 強度。 之間, LCP溝 P頭1C -30- 200940349 68。根據本發明,第一黏著層194A之融化溫度係比第二 黏著層194B之融化溫度至少低1(TC。如以下所詳細說明 ,這種融化溫度之差異大大地改善了列印頭IC附著製程 之控制,進而改善了使用中之膜174之效能。 爲了薄膜處理與儲存,每一第一黏著層194A及第二 黏著層194B係覆蓋著各別襯墊188A及188B。中央膜板 190 —般厚度爲20至100微米(通常約爲50微米)。每 〇 —第一黏著層194A及第二黏著層194B —般厚度爲10至 50微米(通常約爲25微米)。 參考第33B圖,從由襯墊188A所界定之薄膜之側進 行雷射鑽孔。透過第一襯墊1 88A、環氧層1 94A及1 94B 及膜板190對孔186進行鑽孔。孔186止於襯墊188B某 處,使得襯墊188B可較襯墊188A爲厚(例如,襯墊 188A可爲10至20微米厚;襯墊188B可爲30至100微 米厚)。 ❹ 然後移除在雷射進入側上之有小孔襯墊1 88A並以替 換襯墊192取代之,以提供第33C圖所示之薄膜封裝。然 後將這種薄膜封裝捲繞於捲輪198上(參見第31圖)用 於在附著前之處理與儲存。當組裝列印頭匣時,由捲輪 198取出適當長度、移除襯墊、以及將膜174黏著於LCP 溝道鑄造物1 76之底側,使得孔1 86對準正確之墨水供應 通路182 (參見第25圖)。 雷射鑽孔是用於界定聚合薄膜中之孔之標準方法。然 而,雷射鑽孔存在之問題爲:其會沉積含碳煤灰197於鑽 -31 - 200940349 孔位置中及周圍(參見第33B及33C圖)。在保護襯墊周 圍之媒灰可能易於處理,因爲其通常在雷射鑽孔後會換掉 。然而,沉積於實際供應孔1 86中及周圍之煤灰1 97是一 潛在問題。當於接合期間將薄膜壓縮於LCP溝道鑄造物 1 76及列印頭1C 68之間時,煤灰可能會被逐出。被逐出 之煤灰1 97代表了粒子可能會進入墨水供應系統及有可能 阻塞於列印頭1C 68內。此外,煤灰速度非常快且無法以 〇 習知之超音波及/或IPA清洗技術移除。 藉由雷射鑽孔之膜174分析,本案申請人已觀察到: 煤灰1 97 —般存在於膜1 74之雷射進入側上(亦即,環氧 層194A及膜板190),但通常不會存在於膜174之雷射 離開側上(亦即,環氧層1 94B )。 雙重雷射燒鈾薄膜 本案申請人驚人地發現到:雙重雷射燒蝕墨水供應孔 〇 186可消除大部份之煤灰沉積197,包括存在於薄膜之雷 射進入側上之煤灰。雷射燒鈾薄膜之起始點是第3 3 A圖所 示之薄膜。 於第一步驟中,從由襯墊188A所界定之薄膜之側對 第一孔185進行雷射鑽孔。透過襯墊188A、環氧層194A 及194B及中央膜板190對孔185進行鑽孔。孔185止於 襯墊188B某處。第一孔185之大小係小於想要的墨水供 應孔186之大小。一·般而言’*第一孔185之每一長度及寬 度約比想要的墨水供應孔1 8 6之長度及寬度小1 〇微米。 -32- 200940349 由第3 4A圖可知,第一孔185具有煤灰197沉積於第一襯 墊188A、第一環氧層194A及中央膜板190之上。 於第二步驟中,藉由進一步雷射鑽孔而擴大第一孔 1 85,以便提供具有所需尺寸之墨水供應孔1 86。該擴大程 序產生非常小的煤灰,因此所形成之墨水供應孔〗86具有 如第34B圖所示之乾淨側壁。 最後,參考第34C圖,以替換襯墊192取代第一襯墊 0 188A,以提供薄膜封裝,其係就緒被捲繞於捲輪198上並 隨後被用於將列印頭1C 68附著至LCP溝道鑄造物176。 假如有需要,第二襯墊188B在此階段亦可被取代。 比較第33 C與34C圖中所示之薄膜,雙重雷射燒蝕方 法提供之膜1 74具有之墨水供應孔1 86比單純雷射燒蝕乾 淨得多。因此該薄膜係非常適用於將列印頭1C 68附著至 LCP溝道鑄造物1 76,並且不會使墨水污染到不想要之煤 灰沉積。 ❹ 列印頭1C附著程序 參考第19圖及第20圖,吾人皆明瞭,列印頭1C附 著程序是列印頭製造重要階段。於1C附著程序中,雷射 鑽孔膜174之第一黏著表面係首先接合至LCP溝道鑄造物 176之底側,隨後列印頭1C 68便接合至膜174之相對第 二黏著表面。膜174於每一側具有環氧-黏著層194A及 1 94B,其於施加熱及壓力下融化及接合。 由於LCP溝道鑄造物176具有非常不好之熱傳導性, -33- 200940349 必須經由膜174之第二表面來於每一接合程序期間施加熱 ,該第二表面並不接觸LCP溝道鑄造物。 就每一列印頭1C 68之定位及供應墨水至列印頭1C 68而言,爲了達到最佳列印頭效能,接合程序之控制非常 重要。使用先前技術之膜174 (如美國公開2007/0206056 所說明)之列印頭1C附著步驟之典型順序係以縱剖面示 意地表示於第35A至35D圖。參考第35A圖,膜174首 〇 先對齊LCP溝道鑄造物176,使墨水供應孔186準確地對 準界定於歧管接合表面175之墨水出口。如上所述,該墨 水出口係與墨水供應通路1 8 2形狀配合。第一黏著層 1 94A面對歧管接合表面1 75,同時薄膜之相對側係以保護 襯墊188B保護。 參考第35B圖,藉由施加來自加熱塊302之熱及壓力 ’進行將膜174接合至歧管接合表面175。矽橡膠墊300 將加熱塊3 02與薄膜襯墊18 8B分開,以防止於接合期間 G 對膜174造成任何損害。於接合期間,第一環氧層194A 係加熱至其融化溫度並接合至LCP溝道鑄造物176之接合 表面1 75。 如第35C圖所示,然後將襯墊188B由膜174剝離, 以顯現第二環氧層194B。接下來,列印頭1C 68與膜174 對齊,準備用於第二接合步驟。第35C圖說明存在於第一 接合步驟的幾個問題。由於環氧層194A及194B係與先前 技術薄膜相同’這兩個層於第一接合步驟期間融化。基於 許多原因,第二環氧層194B之融化會產生問題。首先, -34- 200940349 部份環氧黏著物199從第二環氧層194B被擠出,且使雷 射鑽孔之墨水供應孔1 86起皺紋。這會減少墨水供應孔 1 86之面積,進而增加整個列印頭組件之墨水流動阻力。 於一些情況中,墨水供應孔186可能會於接合過程中完全 阻塞,這是極不當的。 第3 6B圖表示遭遇環氧「擠出」之問題之墨水供應孔 186其中之一之實際相片。外圍壁310表示雷射鑽孔之孔 〇 1 8 6之原始尺寸大小。外圍壁3 1 0內之低著色材料3 1 2是 黏著性的,其於接合至LCP溝道鑄造物1 76期間已經擠壓 進入墨水供應孔186之內。最後,由外圍壁314所界定之 中心暗區表示於接合之後之墨水供應孔1 86之有效剖面面 積。於此範例中,原始雷射鑽孔之墨水供應孔1 86之尺寸 爲400微米xl30微米。於接合及環氧「擠出」後,這些尺 寸減少至340微米x80微米。儘管存在墨水流動阻力增加 之顯著問題,但第二接合步驟亦存在墨水供應孔1 86邊緣 Q 污染之問題,因爲列印頭1C 6 8必須準確地對準墨水供應 孔186。於自動化之列印頭製造中,特製之對準裝置使用 光學裝置來找出每一墨水供應孔1 8 6之中心。當每一墨水 供應孔1 86之邊緣被擠出之環氧所污染,要找出每一中心 之光學位置會較爲困難。因此,對準誤失之可能性高。 第二環氧層194B融化之第二個問題在於:膜174失 去其整個結構完整性之部份。因此,膜174傾向於鼓起或 下垂進入LCP溝道鑄造物176所界定之墨水供應通路182 中。第35C圖表示於第一接合步驟後之膜174之下垂部份 -35- 200940349 1 98。本案申請人係使用用語「帳蓬蓋住」來說明這現象 。「帳蓬蓋住」確實是個問題,因爲第二黏著層194B之 接合表面195失去其平坦性。由於環氧「擠出」之問題, 第二黏著層194B厚度之變動進一步使失去平坦性惡化。 「帳蓬蓋住」與第二黏著層194B厚度變動這兩個問題組 合降低了接合表面195之接觸面積,並導至第二接合步驟 中之問題。 0 於第二接合步驟中,如第35D圖所示,每一列印頭 1C 68被加熱至約250 °C,然後準確第定位於第二黏著層 194B上。列印頭1C 68與膜174準確地對齊確保墨水供應 溝道2 1 8 (與噴嘴69液體連通)係設置於其對應之墨水供 應孔1 8 6上。一個墨水供應溝道2 1 8之縱剖面係表示於第 3 5D圖中,雖然從第25圖會希望,每一列印頭1C 68可具 有數列墨水供應溝道。 . 因爲環氧「擠出」,原始厚度約爲25微米之第二黏 〇 著層194B之厚度於某些區域可能會降低至5到10微米。 第二黏著層194B這種顯著厚度之變動會導致斜斜放置列 印頭1C,其中列印頭1C 68之一端係較另一端高。這顯然 是不好的且會影響到列印品質。非平坦接合表面1 95之另 一問題在於:通長會需要約5秒之較長接合時間,且每一 列印頭1C 68需被壓入第二黏著層194B內相當深。 與列印頭組件相關之最顯著問題係發生於黏著膜1 74 之「帳蓬蓋住」,其問題在於:薄膜所提供之密封可能有 缺陷。本發明申請人已經發展出洩漏測試以決定列印頭組 -36- 200940349 件中膜1 74所提供密封之有效性。於該測試中,開始在90 °C下將列印頭組件浸泡在墨水中爲期一星期。在墨水浸泡 及沖洗後,使列印頭組件之—個顏色溝道於1 okPa下充氣 ,並測量從該顏色溝道之空氣洩漏率。空氣洩漏可能是空 氣轉移到列印頭中其它顏色溝道(經由膜174)或空氣直 接洩漏至大氣所引起的。於該測試中’利用IC附著膜( 說明於美國公告2007/020605 6中)所製造之典型列印頭 Q 組件具有約每分鐘30mm3或更大之洩漏率。 鑑於上述問題,本發明提供一種改良式列印頭1C附 著製程,其可將這些問題減少至最小程度。該改良式列印 頭1C附著製程基本上遵循與以上所述有關於第35A至 3 5D圖之相同步驟。然而,膜174之設計減少了相關於第 一接合步驟之問題,且同樣重要地,減少了相關於第二接 合步驟之後續問題。於本發明中,膜174仍然包含中央聚 醯亞胺膜板190,其夾於該第一及第二黏著層194 A及 ❹ 194B之間。(爲了便於說明,膜174之對應部份具有與 前面說明之相同標式)。然而,與先前薄膜設計有差異的 是,於薄膜中,本發明之第一及第二環氧層194 A及194B 是不一樣的。尤其是,環氧層194A之融化溫度比第二環 氧層194B之融化溫度至少低1(rC。一般而言,融化溫度 差至少爲20°C或30°C。舉例而言,第一環氧層194A可具 有範圍爲80 °C至130 °C之融化溫度,而第二環氧層1940 可具有範圍爲1 4 0 °C至1 8 0 t之融化溫度。熟悉本項技術 之人士完全能夠選擇符合本發明標準之黏著膜(例如環氣 -37- 200940349 膜)。適用於疊層膜174之黏著膜爲Hitachi DF-XL9環氧 膜(具有約120°C之融化溫度)以及Hitachi DF-470環氧 膜(具有約160°C之融化溫度)。 利用本發明之薄膜,第一接合步驟(說明於第35B圖 )可受控制,使得於將第一黏著層194A接合至LCP溝道 鑄造物176之接合表面195期間,第二黏著層194B不會 融化。一般而言,加熱塊302之溫度匹配第一黏著層 0 194A之融化溫度。因此,第一黏著層之「擠出」會減至 最小程度或整個消除。此外,於接合程序期間,「帳蓬蓋 住」會減至最小程度或不會發生。 參考第3 7A圖,其表示使用根據本發明膜174之已接 合LCP/薄膜組件。與第35C圖所示之組件不同的是,膜 174並無「帳蓬蓋住」,而且第二黏著層194B具有均勻 之平坦度及厚度。第36A圖係實際之相片,表示使用本發 明之膜174於接合至LCP溝道鑄造物176之後之墨水供應 ❹ 孔1 86其中之一。與第36B圖之墨水供應孔相比較,墨水 供應孔186之定義爲一種充分改良之墨水供應孔186,且 無環氧「擠出」之現象。因此,經過第36A圖之孔之墨水 流動阻力不會增加,且可以最小之誤差找出孔中心之光學 位置。 此外,因爲與第一接合步驟相關之問題減到最少,與 第二接合步驟相關之問題亦減到最少。如第3 7 A圖所示, 第二黏著層194 B具有平坦之接合表面195,而且具有最 少之厚度變動。因此,列印頭1C之放置及接合係明顯改 -38- 200940349 善了,導致可使用約1秒之相當短之接合時間。第37A圖 所示之平坦之接合表面1 95亦代表列印頭1C 68不需深深 壓入第二黏著層194B中,以提供足夠之接合力,而且附 著過程後也比較不會產生歪斜的列印頭1c 68。 參考第3 7 B圖,改良之列印頭IC附著製程所形成之 列印頭組件具有優良之密封於每一墨水供應孔1 86周圍, 其係因爲沒有「帳蓬蓋住」及環氧「擠出」。與第35D圖 0 之列印頭相較之下’於上述本案申請人之洩漏測試中,第 3 7B圖中之列印頭組件(利用本發明之膜1 74所製造)具 有優良之3000倍改善效果。在90 °C下將第37B圖中之列 印頭組件浸泡在墨水中爲期—星期’然後於1 〇kPa下使該 列印頭組件充氣,所測量得到之空氣洩漏率約爲每分鐘 0.1mm3。與例如說明於美國公告2007/0206056中之列印 頭組件相較之下,該洩漏測試顯現出本發明之顯著優點。 G 改善之墨水供應至列印頭1C端 第25圖表示列印頭1C 68,其經由黏著1C附著膜74 重疊於墨水供應孔186上’接著重疊於LCP溝道鑄造物 176底側中之墨水供應通路182上。相鄰之列印頭1C 68 係以端對端方式經由附著膜1 74定位於LCP溝道鑄造物 1 7 6之底部。於相鄰之列印頭I c 6 8之間之接面處’列印 頭1C 68其中之一具有噴嘴之「水滴三角形」206部份於 列中,其側向偏移於其餘噴嘴陣列2 2 0之對應列。如此使 得從一個列印頭IC之列印邊緣接續著相鄰列印頭Ϊ C之列 -39 - .200940349 印。藉由偏移噴嘴之水滴三角形2 06,不論是否噴嘴是在 相同1C或不同1C上之接面任一側,相鄰噴嘴間之間隔( 在垂直於媒體饋送方向)仍維持不變。這需要相鄰之列印 頭1C 68之精確相對定位,而且使用基準標示204來達到 此目的。這種過程會消耗時間,但卻避免於列印影像上留 下暇疵。 不幸地,相對於陣列220之其它部份中之整體噴嘴, Φ 於列印頭IC 6 8之末端之一些噴嘴會缺乏墨水。例如,可 由兩個墨水供應孔供應墨水給噴嘴222。墨水供應孔224 最爲靠近。然而,如果由噴嘴到墨水供應孔224之左側有 阻礙或特別大之需求,供應孔226亦會靠近噴嘴222,導 致因缺乏墨水而使墨水未注入這些噴嘴之機會非常小。 相較之下,如果不是爲了置放於相鄰列印頭1C 68之 間之接面處之「額外」墨水供應孔210,列印頭1C 68末 端處之噴嘴214僅會與墨水供應孔216液體連通。具有「 〇 額外」墨水供應孔2 1 0代表沒有任何噴嘴會距離墨水供應 孔如此遠以致有墨水缺乏之風險。 墨水供應孔208及210兩者皆由共用墨水供應通路 212饋入墨水。墨水供應通路212具有供應兩個孔之容量 ,因爲墨水供應孔2 0 8僅有噴嘴在其左側,墨水供應孔 2 1 0僅有噴嘴在其右側。因此,經過墨水供應通路2 1 2之 總流動速率大約等於經過僅饋入一個孔之供應通路。 第25圖重點表示列印頭1C 68中之墨水供應之溝道 (顏色)之數目一4個溝道與5個溝道218之間之差異。 -40- ,200940349 列印頭IC 68之後側中之第3個及第4個溝道21 8係由相 同之墨水供應孔1 8 6饋入墨水。這些墨水供應孔有點擴大 以跨越兩個溝道218。 這種做法之原因在於’列印頭1C 68係製造用於寬廣 範圍之列印機及列印頭架構。這些可有5種顏色溝道· CMYK及IR (紅外線)-但其它列印機(這種設計)可能 僅爲4溝道列印機,其它仍然可能是3通道(CC、MM及 0 Y)。有鑑於此,單一顏色溝道可饋至列印頭1C溝道其中 兩個。列印引擎控制器(PEC )微處理器能輕易地將此納 入傳送至列印頭1C之列印資料中。此外,供應相同顏色 給1C中之兩個噴嘴列提供了某程度之噴嘴備份,而可用 於死噴嘴補償。 壓力脈波 當流至列印頭之墨水突然停止,會產生墨水壓力尖波 〇 。這會發生於列印工作或頁之結束時。本案受讓人之高速 頁寬列印頭於操作期間需要高流動速率之供應墨水。因此 ,墨水線中供應至噴嘴之墨水之質量相當大且以少許速率 移動。 突然結束列印工作或剛好在列印頁結束,這需要流動 相當快之相當大之墨水量立刻停止。然而,突然停止墨水 動量會於墨水線中引起震波。當墨水線之墨水要停止時, LCP鑄造物64 (參見第19圖)係特別堅硬並且幾乎無撓 性。由於墨水線無任何相容性,震波會超過Laplace壓力 -41 - .200940349 (於噴嘴開口處之墨水表面張力所產生之壓力,其用以維 持噴嘴室中之墨水)並湧到列印頭1C 6 8之前表面。如果 噴嘴漲滿墨水,墨水可能無法噴出,就會有暇疵出現於列 印中。 當噴嘴發射率匹配墨水線之共振頻率時,於墨水中會 產生共振脈波。同樣地,因爲墨水線之堅硬結構,用於一 種顏色之同時發射之佔大比例的噴嘴可產生駐波或共振脈 0 波。這會造成噴嘴漲滿墨水,或是假如超過Laplace壓力 ,因爲突然降壓,反而使噴嘴未注入墨水。 爲解決此問題,LCP鑄造物64係倂入了脈波阻尼器 ,以自墨水線移除壓力尖波。脈波阻尼器可爲能被墨水壓 縮之封閉之氣體容積。或者脈波阻尼器可爲能彈性撓曲及 吸收壓力脈波之墨水線相容部份。 爲了使設計複雜度減到最小程度並維持精巧形式,本 發明使用可壓縮之氣體容積以減弱壓力脈波。利用氣體壓 〇 縮以減弱壓力脈波可以小氣體容積來完成。如此便能保持 精巧設計,同時又可避免因爲墨水壓力中暫態尖波造成之 任何噴嘴漲滿。 如第24圖及第26圖所示,由於墨水中之脈波,脈波 阻尼器並非單一壓縮氣體容積。該脈波阻尼器係凹洞200 陣列,其沿著LCP鑄造物64長度分佈。移動通過延長列 印頭(諸如頁寬列印頭)之壓力脈波可於墨水流體排中之 任何點被減弱。然而,當脈波通過列印頭積體電路中之噴 嘴時,脈波會使噴嘴脹滿墨水,不論脈波隨後是否會消失 -42- .200940349 於阻尼器。藉由於緊鄰噴嘴陣列之墨水供應導管 些脈波阻尼器,任何壓力尖波會被減弱於原本會 之漲滿墨水之位置。 如第26圖所示,空氣阻尼凹洞200係配置 每一列凹洞直接置放於LCP溝道鑄造物176中: 溝道184之上方。任何於中主溝道184中之墨水 脈波直接作用於凹洞200中之空氣,並很快地消: 〇 列印頭注入墨水 以下將特別參考第27圖所示之LCP溝道鑄 來說明使匣注入墨水。藉由從流體系統之幫浦( 圖)施加於主溝道出口 232之吸力,使LCP溝 176注入墨水。使主溝道184充塡墨水,然後藉 作用使墨水供應通路1 82及列印頭1C自行注入墨 主溝道1 84相當長及細。此外,如果空氣凹 〇 要用於減弱墨水中之壓力脈波,則其必須維持未 。對於墨水注入程序而言,這會是個問題,其會 由毛細管作用塡充凹洞200,或者因爲有空氣陷 溝道184無法完全注入墨水。 爲了確保LCP溝道鑄造物176全注入墨水 184於出口 232之前之下游端處具有堰228。 LCP鑄造物64中之空氣凹洞200不會注入墨水 開口,其中上游邊緣之形狀係做成可由向凹洞壁 進來引導墨水凹凸面。 中倂入一 造成不利 成4列。 之LCP主 內之壓力 造物1 7 6 參見第6 道鑄造物 由毛細管 水。 洞200需 注入墨水 輕易地藉 入而使主 ,主溝道 爲了確保 ,其具有 之上方前 -43- 200940349 匣之這些態樣係參考第28A、28B及29A至29C圖而 說明。這些圖式示意性地說明墨水注入程序。第28A及 28B圖表示如果於主溝道中沒有堰會產生之問題,而第 29A至29C圖表示堰228之功能。 第28A及28B圖係LCP溝道鑄造物176之主溝道184 其中之一及溝道頂部中之空氣凹洞200列之示意性剖面圖 。墨水23 8係抽引經過入口 230並沿主溝道184底面流動 Q 。請特別注意,前進之凹凸面具有與主溝道184接觸之較 陡峭之接觸角度。這使得墨水流體23 8之前部具有稍成氣 泡之形狀。當墨水抵達主溝道1 84之末端,墨水水平會上 升,且於墨水流動停止之前,氣泡狀之前部接觸溝道頂部 。如第28B圖所示,溝道184係已無法完全注入墨水,且 現在有空氣陷入。這種空氣袋會持續並干擾到列印頭之運 作。墨水阻尼特性被改變,且空氣會成爲墨水之阻礙。 於第29A至29C圖中,溝道184於下游端處具有堰 〇 228。如第29A圖所示,墨水流體23 8於堰228之後形成 池狀,並朝溝道頂部上升。堰22 8於頂部具有尖銳邊緣 240,以做爲凹凸面固定點。前進之凹凸面固定於該固定 邊緣240,使得當墨水水平超過頂部邊緣時,墨水不會輕 易地流過堪228。 如第29B圖所示,鼓起之凹凸面使得墨水上升,直到 其塡充溝道1 84到頂部爲止。由於墨水密封凹洞200成爲 分離之空氣袋,於堰228處之鼓起墨水凹凸面從尖銳頂部 邊緣24 0破裂,並塡充於溝道184之末端及出口 232(參 -44 - .200940349 見第29C圖)。尖銳頂部邊緣240係精確地定位,使得墨 水凹凸面會鼓起,直到墨水充塡至溝道184之頂部爲止, 但不會允許墨水鼓起太多以使其接觸到末端空氣凹洞242 。如果凹凸面接觸並固定於末端空氣凹洞242之內部,其 可能會注入墨水。因此,堰之高度及其於凹洞之下之位置 係受到準確控制。堰228之彎曲下游表面可確保沒有更多 之固定點,如果有這些固定點可能會允許墨水凹凸面橋接 Q 空隙至凹洞242。 LCP所使用以保持凹洞不注入墨水之另一方式爲凹洞 開口上游及下游邊緣之形狀。如第28 A、28B及2 9A至 29C圖所示,所有上游邊緣具有彎曲過渡表面234,然而 下游邊緣是尖銳狀。沿著溝道184之頂部前進之墨水凹凸 面可固定於尖銳上游邊緣並隨後藉由毛細管作用向上移動 進入凹洞。過渡表面以及特別是在上游邊緣處之彎曲過渡 表面234係移除了尖銳邊緣提供之強固定點。 φ 同樣地,本案申請人之工作有所發現:如果凹洞200 不慎塡充了一些墨水,則尖銳下游邊緣236會加強不注入 墨水。若列印機受碰撞、震動或傾斜,或如果流體系統因 爲某種原因而必須逆流,則凹洞2 0 0可能會完全或部份注 入墨水。當墨水再次以其正常方向流動時,則尖銳下游邊 緣23 6有助於將墨水凹凸面拉引回到自然固定點(亦即, 尖銳轉角)。如此,墨水凹凸面移動經過LCP溝道鑄造物 176之管控便是用以正確地使匣注入墨水之方式。 本說明書已僅藉由實例而說明本發明。熟悉本領域之 -45- .200940349 人士會認同於不背離本發明寬廣之發明理念之精神及範疇 前提下,可進行許多變化及修改。因此,圖式中所說明及 表示之實施例係僅在於說明,並不在於限制本發明。 【圖式簡單說明】 本發明實施例係藉由僅參考圖式之範例而說明之。 第1圖係實施本發明之列印機之前視及側視立體圖。 Q 第2圖表示第1圖之列印機,其前表面係於打開位置 〇 第3圖表示第2圖之列印機,其列印頭匣係被移除。 第4圖表示第3圖之列印機,其外殼係被移除。 第5圖表示第3圖之列印機,其外殼係被移除且印頭 匣係被安裝。 第6圖係列印機之流體系統之示意圖。 第7圖係列印頭匣之俯視及前視立體圖。 φ 第8圖係列印頭匣在其保護蓋內之俯視及前視立體圖 〇 第9圖係列印頭匣由其保護蓋移除之俯視及前視立體 圖。 第1 0圖係列印頭匣之仰視及前視立體圖。 第1 1圖係列印頭匣之仰視及後視立體圖。 第1 2圖表示列印頭匣之所有側之視圖。 第1 3圖係列印頭匣之分解立體圖。 第1 4圖係列印頭匣之墨水耦合件之橫剖面圖。 -46- .200940349 第15圖係墨水入口及過濾器組件之分解立體圖。 第1 6圖係匣閥接合著列印機閥之剖面圖。 第17圖係LCP鑄造物及撓性PCB之立體圖。 第18圖係第17圖中之插入物A之放大圖。 第19圖係LCP/撓性PCB/列印頭1C組件之分解仰視 立體圖。 第20圖係LCP/撓性PCB/列印頭1C組件之分解俯視 φ 立體圖。 第21圖係LCP/撓性PCB/列印頭1C組件之底面之放 大圖。 第22圖表示第21圖中將列印頭1C及撓性PCB移除 之放大圖。 第23圖表示第22圖中將列印頭1C附著膜移除之放 大圖。 第24圖表示第23圖中將LCP溝道鑄造物移除之放大 ❹ 圖。 第25圖表示列印頭1C,其中後溝道及噴嘴係重疊於 墨水供應通路之上。 第26圖係LCP/撓性PCB/列印頭1C組件之放大橫剖 面立體圖。 第27圖係LCP溝道鑄造物之平面圖。 第28A及28B圖係LCP溝道鑄造物注入墨水且無堰 之示意性剖面圖。 第29A、29B及29C圖係LCP溝道鑄造物注入墨水且 -47- .200940349 有堰之示意性剖面圖。 第30圖係LCP鑄造物之放大橫剖面立體圖,其中表 示接觸力及作用力之位置。 第31圖表示1C附著膜之捲輪。 第3 2圖表示介於襯墊之間之1C附著膜之剖面。 第3 3 A至3 3 C圖係部份剖面圖,表示傳統附著膜雷射 鑽孔之各種不同階段。 Q 第3 4 A至3 4C圖係部份剖面圖,表示雙重附著膜雷射 鑽孔之各種不同階段。 第35 A至35D圖係示意性列印頭1C附著程序之縱剖 面圖。 第3 6A圖及第36B圖係相片,表示於第一接合步驟後 兩個不同附著膜之墨水供應孔。 第3 7 A圖及第3 7B圖係根據本發明之示意性列印頭 1C附著程序之縱剖面圖。 〇 【主要元件符號說明】 2 :列印機 4 :主體 6 =樞轉面 8 :螢幕 1 〇 :控制鈕 · 12 :媒體堆疊 14 :饋送盤 -48- .200940349 〇 :紙張 :出口槽 =凸輪 :接觸點 :釋放桿 :把手 :支撐表面 :墨水槽 =幫浦 :LCP鑄造物 :關斷閥 :列印頭1C :噴嘴 :壓力調節器 :氣泡出口 :密封導管 :空氣入口 :出口 •’粗過濾器 :墨水線 -墨水線 :感測器 :電子控制器 :箱體 -49 200940349 94 :蓋器 9 6 :列印頭匣 98 :保護蓋 100 :機架 102 :機架蓋 1 0 4 :接觸點 106 :紙張遮蔽件 0 108 :撓性印刷電路板 1 1 0 ·接線接合處 1 12A :墨水耦合件 112B :墨水耦合件 1 1 4 :匣閥 116:入口及過濾器歧管 1 1 8 :出口歧管 1 2 0 :連接器 ❿ 122 :入口 124 :出口 126 :彈性套管 128 :固定閥構件 1 3 0 :隔膜 1 3 2 :過濾器室 1 3 4 :過濾器室 136 : LCP主溝道 1 3 8 :頂溝道 -50 200940349 1 1 1 1 1 1 1 Ο 1 1 1 1 1 1 1 1 ❹ 1 1 1 1 1 1 1 1 列印機導管 軸環 導管 導管 墨水流體 過濾器出口 過濾器入口 間隔肋 隔間壁 接線接合接觸點 埋頭孔 埋頭孔 支撐表面 紙張遮蔽件 附著膜 歧管接合表面 LCP溝道鑄造物 凹部 電子元件 墨水供應通路 溝道 第一孔 墨水供應孔 襯墊 1 200940349 188B :襯墊 190 :膜板 1 9 2 :替換襯墊 194A :第一黏著層 194B :第二黏著層 195 :接合表面 1 9 6 :馬達 0 197 :煤灰 1 98 :捲輪 1 9 9 :黏著物 2 0 0 :凹洞 2 0 4 :基準標示 206 :水滴三角形 20 8 :墨水供應孔 2 1 0 :墨水供應孔 Q 2 1 2 :墨水供應通路 2 1 4 :噴嘴 2 1 6 :墨水供應孔 2 1 8 :墨水供應溝道 2 2 0 :噴嘴陣列 222 :噴嘴 224 :墨水供應孔 226 :供應孔 228 :堰 .200940349 :入口 :出口 :彎曲過渡表面 :尖銳下游邊緣 :墨水流體 :邊緣 :凹洞 :矽橡膠墊 :加熱塊 :外圍壁 :低著色材料 :外圍壁Adhesion of the thin liner into the column (using a pad pad for the removal of the film to create a central film strength. Between the LCP groove P head 1C -30- 200940349 68. According to the invention, the first adhesive layer The melting temperature of 194A is at least 1 lower than the melting temperature of the second adhesive layer 194B. As explained in detail below, the difference in melting temperature greatly improves the control of the printing process of the print head IC, thereby improving the use. The effectiveness of the film 174. For film processing and storage, each of the first adhesive layer 194A and the second adhesive layer 194B are covered with respective pads 188A and 188B. The central film plate 190 is generally 20 to 100 microns thick (usually Approximately 50 microns. Each of the first and second adhesive layers 194A and 194B has a thickness of 10 to 50 microns (typically about 25 microns). Referring to Figure 33B, the film defined by liner 188A The side of the laser is drilled. The hole 186 is drilled through the first pad 1 88A, the epoxy layers 1 94A and 1 94B, and the diaphragm 190. The hole 186 terminates somewhere on the pad 188B, so that the pad 188B can Thicker than liner 188A (eg, liner 188A can be 10 to 20 microns Pad 188B can be 30 to 100 microns thick.) ❹ Then remove the small hole pad 1 88A on the laser entry side and replace it with replacement pad 192 to provide the thin film package shown in Figure 33C. The film package is then wound onto a reel 198 (see Figure 31) for handling and storage prior to attachment. When the print head is assembled, the appropriate length is removed by the reel 198, and the liner is removed. And attaching the film 174 to the bottom side of the LCP channel casting 1 76 such that the holes 1 86 are aligned with the correct ink supply path 182 (see Figure 25). Laser drilling is used to define the holes in the polymeric film. The standard method. However, the problem with laser drilling is that it deposits carbon-bearing coal 197 in and around the hole -31 - 200940349 (see Figures 33B and 33C). Ash may be easy to handle because it is usually replaced after laser drilling. However, the deposition of coal ash 97 in and around the actual supply hole 186 is a potential problem when compressing the film into the LCP groove during bonding. When the casting material 1 76 and the printing head 1C 68 are between, the coal ash may be taken The ejected coal ash 1 97 represents that the particles may enter the ink supply system and may be blocked in the print head 1C 68. In addition, the coal ash is very fast and cannot be cleaned by conventional ultrasonic and/or IPA. Technical removal. By the analysis of the membrane 174 of the laser drilled hole, the applicant has observed that: coal ash is generally present on the laser entry side of the membrane 1 74 (ie, the epoxy layer 194A and the membrane sheet). 190), but typically does not exist on the laser exit side of film 174 (i.e., epoxy layer 1 94B). Double Laser Burning Uranium Film The Applicant has surprisingly discovered that the dual laser ablative ink supply port 186 eliminates most of the coal ash deposits 197, including the soot present on the laser entry side of the film. The starting point of the laser-fired uranium film is the film shown in Figure 3 3 A. In a first step, the first aperture 185 is laser drilled from the side of the film defined by the liner 188A. Hole 185 is drilled through liner 188A, epoxy layers 194A and 194B, and central diaphragm 190. Hole 185 terminates somewhere on pad 188B. The first aperture 185 is sized smaller than the desired ink supply aperture 186. Generally speaking, each length and width of the first hole 185 is about 1 μm smaller than the length and width of the desired ink supply hole 186. -32- 200940349 As seen from Figure 3A, the first aperture 185 has coal ash 197 deposited on the first liner 188A, the first epoxy layer 194A, and the central membrane sheet 190. In a second step, the first aperture 1 85 is enlarged by further laser drilling to provide an ink supply aperture 186 having a desired size. This expansion process produces very small coal ash, so that the formed ink supply port 86 has a clean side wall as shown in Fig. 34B. Finally, referring to Figure 34C, the first pad 0 188A is replaced with a replacement pad 192 to provide a film package that is ready to be wound onto the reel 198 and subsequently used to attach the print head 1C 68 to the LCP. Channel casting 176. The second pad 188B can also be replaced at this stage if needed. Comparing the films shown in Figures 33C and 34C, the double laser ablation method provides a film 1 74 with ink supply holes 186 that are much cleaner than pure laser ablation. The film is therefore very suitable for attaching the print head 1C 68 to the LCP channel casting 1 76 without contaminating the ink to unwanted soot deposition. ❹ Print head 1C attachment procedure Referring to Figures 19 and 20, it is clear to us that the print head 1C attachment procedure is an important stage in the manufacture of the print head. In the 1C attachment procedure, the first adhesive surface of the laser drilled film 174 is first bonded to the bottom side of the LCP trench casting 176, and then the print head 1C 68 is bonded to the opposite second adhesive surface of the film 174. Film 174 has epoxy-adhesive layers 194A and 194B on each side that melt and bond under application of heat and pressure. Since the LCP channel casting 176 has very poor thermal conductivity, -33-200940349 must apply heat through each of the bonding processes via the second surface of the film 174 that does not contact the LCP channel casting. For the positioning of each print head 1C 68 and the supply of ink to the print head 1C 68, the control of the bonding process is very important in order to achieve optimum print head performance. A typical sequence of the print head 1C attachment steps using the prior art film 174 (as described in U.S. Publication No. 2007/0206056) is schematically shown in the longitudinal section in Figures 35A through 35D. Referring to Figure 35A, the film 174 is first aligned with the LCP channel casting 176 such that the ink supply aperture 186 is accurately aligned to the ink outlet defined by the manifold engaging surface 175. As described above, the ink outlet is shaped to match the ink supply path 182. The first adhesive layer 1 94A faces the manifold engaging surface 175 while the opposite sides of the film are protected by a protective liner 188B. Referring to Figure 35B, the film 174 is bonded to the manifold engaging surface 175 by applying heat and pressure from the heating block 302. The rubber pad 300 separates the heating block 302 from the film liner 18 8B to prevent any damage to the film 174 during the bonding. During bonding, the first epoxy layer 194A is heated to its melting temperature and bonded to the bonding surface 175 of the LCP trench casting 176. As shown in Fig. 35C, the liner 188B is then peeled off from the film 174 to reveal the second epoxy layer 194B. Next, print head 1C 68 is aligned with film 174, ready for the second joining step. Figure 35C illustrates several problems that exist in the first joining step. Since the epoxy layers 194A and 194B are identical to the prior art film, the two layers melt during the first bonding step. Melting of the second epoxy layer 194B can cause problems for a number of reasons. First, -34-200940349 part of the epoxy adhesive 199 is extruded from the second epoxy layer 194B and wrinkles the laser-drilled ink supply holes 186. This reduces the area of the ink supply apertures 186, which in turn increases the ink flow resistance of the entire printhead assembly. In some cases, the ink supply aperture 186 may be completely blocked during the engagement process, which is highly undesirable. Figure 3B shows an actual photograph of one of the ink supply apertures 186 that is subject to the problem of "extrusion" of the epoxy. The peripheral wall 310 represents the original size of the hole 〇 1 8 6 of the laser drilled hole. The low coloring material 3 1 2 in the peripheral wall 310 is adhesive which has been squeezed into the ink supply aperture 186 during bonding to the LCP channel casting 176. Finally, the central dark area defined by the peripheral wall 314 represents the effective cross-sectional area of the ink supply aperture 186 after bonding. In this example, the original laser drilled ink supply port 186 has a size of 400 microns x 30 microns. These dimensions are reduced to 340 microns x 80 microns after bonding and epoxy "extrusion". Despite the significant problem of increased ink flow resistance, the second bonding step also suffers from contamination of the edge Q of the ink supply aperture 186 because the print head 1C 6 8 must be accurately aligned with the ink supply aperture 186. In automated print head manufacturing, special alignment devices use optical devices to find the center of each ink supply port 186. When the edge of each ink supply port 186 is contaminated by the extruded epoxy, it can be difficult to find the optical position of each center. Therefore, the possibility of misalignment is high. A second problem with the melting of the second epoxy layer 194B is that the film 174 loses part of its overall structural integrity. Thus, the membrane 174 tends to bulge or sag into the ink supply passage 182 defined by the LCP channel casting 176. Figure 35C shows the drooping portion of the film 174 after the first joining step -35- 200940349 1 98. The applicant in this case used the term “coverage” to explain this phenomenon. The "canopy cover" is indeed a problem because the joint surface 195 of the second adhesive layer 194B loses its flatness. Due to the problem of "extrusion" of the epoxy, the variation in the thickness of the second adhesive layer 194B further deteriorates the loss of flatness. The combination of the "tack cover" and the thickness variation of the second adhesive layer 194B reduces the contact area of the joint surface 195 and leads to the problem in the second joining step. 0 In the second bonding step, as shown in Fig. 35D, each of the print heads 1C 68 is heated to about 250 ° C and then accurately positioned on the second adhesive layer 194B. The print head 1C 68 is accurately aligned with the film 174 to ensure that the ink supply channel 2 18 (in fluid communication with the nozzle 69) is disposed on its corresponding ink supply port 186. A longitudinal section of an ink supply channel 2 18 is shown in Figure 35D, although it is contemplated from Figure 25 that each of the print heads 1C 68 may have a plurality of columns of ink supply channels. Because of the "extrusion" of the epoxy, the thickness of the second adhesive layer 194B having an original thickness of about 25 microns may be reduced to 5 to 10 microns in some areas. This significant thickness variation of the second adhesive layer 194B causes the print head 1C to be placed obliquely, with one end of the print head 1C 68 being higher than the other end. This is obviously not good and will affect the print quality. Another problem with the non-flat joint surface 1 95 is that the length of the joint will require a relatively long joint time of about 5 seconds, and each print head 1C 68 needs to be pressed deep into the second adhesive layer 194B. The most significant problem associated with the printhead assembly occurs in the "canopy cover" of the adhesive film 1 74. The problem is that the seal provided by the film may be defective. The applicant of the present invention has developed a leak test to determine the effectiveness of the seal provided by film 1 74 in the print head set -36-200940349. In this test, the print head assembly was initially immersed in ink at 90 °C for one week. After the ink is soaked and rinsed, the color channel of the printhead assembly is inflated at 1 okPa and the air leak rate from the color channel is measured. Air leakage may be caused by air being transferred to other color channels in the printhead (via membrane 174) or by direct air leakage to the atmosphere. In this test, a typical print head Q assembly manufactured using an IC-attached film (described in U.S. Publication No. 2007/020605 6) has a leak rate of about 30 mm 3 or more per minute. In view of the above problems, the present invention provides an improved print head 1C attachment process which minimizes these problems. The improved print head 1C attachment process substantially follows the same steps as described above with respect to Figures 35A through 5D. However, the design of the membrane 174 reduces the problems associated with the first joining step and, as such, reduces subsequent problems associated with the second joining step. In the present invention, the film 174 still contains a central polyimide film panel 190 sandwiched between the first and second adhesive layers 194 A and 194B. (For convenience of explanation, the corresponding portion of the film 174 has the same standard as that described above). However, in contrast to previous film designs, the first and second epoxy layers 194 A and 194B of the present invention are different in the film. In particular, the melting temperature of the epoxy layer 194A is at least 1 lower than the melting temperature of the second epoxy layer 194B (rC. In general, the melting temperature difference is at least 20 ° C or 30 ° C. For example, the first ring The oxygen layer 194A may have a melting temperature ranging from 80 ° C to 130 ° C, and the second epoxy layer 1940 may have a melting temperature ranging from 140 ° C to 180 ° t. Those familiar with the technology are completely It is possible to select an adhesive film conforming to the standard of the present invention (for example, a ring-37-200940349 film). The adhesive film suitable for the laminated film 174 is a Hitachi DF-XL9 epoxy film (having a melting temperature of about 120 ° C) and Hitachi DF. -470 epoxy film (having a melting temperature of about 160 ° C.) With the film of the present invention, the first bonding step (described in Figure 35B) can be controlled such that the first adhesive layer 194A is bonded to the LCP channel During the bonding surface 195 of the casting 176, the second adhesive layer 194B does not melt. Generally, the temperature of the heating block 302 matches the melting temperature of the first adhesive layer 0 194 A. Therefore, the "extrusion" of the first adhesive layer Minimized or eliminated altogether. Also, during the bonding process The "canopy cover" may be minimized or may not occur. Referring to Figure 3A, there is shown a bonded LCP/thin film assembly using film 174 according to the present invention. Unlike the assembly shown in Figure 35C, The film 174 has no "tapping" and the second adhesive layer 194B has a uniform flatness and thickness. Figure 36A is an actual photograph showing the use of the film 174 of the present invention after bonding to the LCP channel casting 176. The ink supply port is one of the holes 186. The ink supply hole 186 is defined as a sufficiently modified ink supply hole 186 as compared with the ink supply hole of Fig. 36B, and has no epoxy "extrusion" phenomenon. The ink flow resistance through the hole of Fig. 36A does not increase, and the optical position of the center of the hole can be found with a minimum error. Furthermore, since the problem associated with the first bonding step is minimized, the second bonding step is associated with The problem is also minimized. As shown in Fig. 37A, the second adhesive layer 194B has a flat joint surface 195 with minimal thickness variation. Therefore, the placement and bonding of the print head 1C is significantly improved. - 2009 40349 is good, resulting in a relatively short bonding time of about 1 second. The flat bonding surface 1 95 shown in Figure 37A also means that the printing head 1C 68 does not need to be deeply pressed into the second adhesive layer 194B to Provide sufficient bonding force and less likely to produce skewed print head 1c 68 after attachment process. Referring to Figure 3 7 B, the improved print head IC attachment process has a print head assembly with excellent sealing Around each of the ink supply holes 186, there is no "canopy cover" and epoxy "extrusion". In comparison with the print head of Fig. 35D, the print head assembly of the 3rd 7B (manufactured by the film 1 74 of the present invention) has an excellent 3000 times in the leak test of the applicant of the present invention. Improve the effect. The print head assembly of Figure 37B is immersed in the ink at 90 ° C for a period of weeks - and then the print head assembly is inflated at 1 kPa, and the measured air leak rate is about 0.1 per minute. Mm3. This leak test exhibits significant advantages of the present invention as compared to, for example, the print head assembly illustrated in U.S. Publication No. 2007/0206056. G. Improved ink supply to the print head 1C end Fig. 25 shows the print head 1C 68 which is overlaid on the ink supply opening 186 via the adhesive 1C attachment film 74. Then the ink is superimposed on the bottom side of the LCP channel casting 176. Supply path 182. Adjacent print heads 1C 68 are positioned end-to-end via the attachment film 1 74 at the bottom of the LCP channel castings 176. At the junction between the adjacent print heads I c 6 8 , one of the print heads 1C 68 has a "droplet triangle" 206 portion of the nozzle in the column, which is laterally offset from the remaining nozzle array 2 The corresponding column of 2 0. This results in the printing of the edge of a print head IC from the adjacent print head Ϊ C -39 - .200940349. By offsetting the water droplets of the nozzles, the triangles 06, regardless of whether the nozzles are on either side of the junction of the same 1C or different 1C, the spacing between adjacent nozzles (in the direction perpendicular to the media feed direction) remains unchanged. This requires precise relative positioning of adjacent printheads 1C 68 and the use of fiducial markers 204 for this purpose. This process takes time, but it avoids leaving a flaw on the printed image. Unfortunately, some of the nozzles Φ at the end of the printhead IC 66 are deficient in ink relative to the integral nozzles in other portions of the array 220. For example, ink can be supplied to the nozzle 222 by two ink supply holes. The ink supply holes 224 are closest. However, if there is a hindrance or a particularly large demand from the nozzle to the left side of the ink supply hole 224, the supply hole 226 is also close to the nozzle 222, resulting in a very small chance that the ink is not injected into the nozzle due to lack of ink. In contrast, if it is not for the "extra" ink supply hole 210 placed at the junction between adjacent print heads 1C 68, the nozzle 214 at the end of the print head 1C 68 will only be associated with the ink supply opening 216. Liquid connection. Having an "〇 extra" ink supply port 2 1 0 means that there is no risk that any nozzle will be so far from the ink supply port that there is a lack of ink. Both ink supply apertures 208 and 210 are fed into the ink by a common ink supply path 212. The ink supply path 212 has a capacity to supply two holes because the ink supply port 20 8 has only the nozzle on the left side thereof, and the ink supply port 2 10 has only the nozzle on the right side thereof. Therefore, the total flow rate through the ink supply path 2 1 2 is approximately equal to the supply path through which only one hole is fed. Fig. 25 focuses on the difference between the number of channels (colors) of the ink supply in the print head 1C 68, the four channels, and the five channels 218. -40-, 200940349 The third and fourth channels 21 8 in the rear side of the print head IC 68 are fed with ink from the same ink supply holes 168. These ink supply holes are somewhat enlarged to span the two channels 218. The reason for this is that the 'print head 1C 68 series is manufactured for a wide range of printers and printhead architectures. These can have 5 color channels · CMYK and IR (infrared) - but other printers (this design) may only be 4-channel printers, others may still be 3 channels (CC, MM and 0 Y) . In view of this, a single color channel can be fed to two of the 1C channels of the print head. The print engine controller (PEC) microprocessor can easily transfer this input to the print data of print head 1C. In addition, supplying the same color provides a certain degree of nozzle backup for the two nozzle columns in 1C, which can be used for dead nozzle compensation. Pressure Pulses When the ink that flows to the print head suddenly stops, an ink pressure spike 〇 is generated. This can happen at the end of the print job or page. The high speed page width printhead of the assignee of this case requires a high flow rate supply of ink during operation. Therefore, the quality of the ink supplied to the nozzle in the ink line is quite large and moves at a small rate. Suddenly ending the print job or just ending at the print page, this requires a fairly fast flow of ink that stops quite quickly. However, a sudden stop of ink momentum causes a shock wave in the ink line. The LCP casting 64 (see Figure 19) is particularly hard and almost non-tacky when the ink line ink is to be stopped. Since the ink line does not have any compatibility, the shock wave will exceed the Laplace pressure -41 - .200940349 (the pressure generated by the surface tension of the ink at the nozzle opening, which is used to maintain the ink in the nozzle chamber) and rush to the print head 1C 6 8 before the surface. If the nozzle is full of ink and the ink may not be ejected, a flaw will appear in the print. When the nozzle emissivity matches the resonance frequency of the ink line, a resonance pulse wave is generated in the ink. Similarly, because of the rigid structure of the ink lines, a large proportion of nozzles for simultaneous emission of one color can generate standing waves or resonant zero waves. This can cause the nozzle to fill up with ink, or if the Laplace pressure is exceeded, because the pressure is suddenly reduced, the nozzle is not filled with ink. To solve this problem, the LCP casting 64 system incorporates a pulse damper to remove pressure spikes from the ink line. The pulse damper can be a closed gas volume that can be compressed by the ink. Alternatively, the pulse damper can be an ink line compatible portion that elastically deflects and absorbs pressure pulses. In order to minimize design complexity and maintain compact form, the present invention uses a compressible gas volume to attenuate pressure pulses. The use of gas pressure to reduce pressure pulse waves can be accomplished with a small gas volume. This maintains a sophisticated design while avoiding any nozzle fill due to transient spikes in ink pressure. As shown in Figs. 24 and 26, the pulse damper is not a single compressed gas volume due to the pulse wave in the ink. The pulse damper is an array of dimples 200 that are distributed along the length of the LCP casting 64. The pressure pulse moving through the extended print head (such as the page wide print head) can be attenuated at any point in the ink fluid row. However, when the pulse wave passes through the nozzle in the printhead integrated circuit, the pulse wave will cause the nozzle to swell with ink, regardless of whether the pulse wave will subsequently disappear -42-.200940349 in the damper. By virtue of the pulse dampers in the ink supply conduit adjacent to the nozzle array, any pressure spikes are attenuated by the position where the ink would otherwise be full. As shown in Fig. 26, the air damper recess 200 is arranged such that each row of cavities is placed directly in the LCP channel casting 176: above the channel 184. Any ink pulse in the middle main channel 184 acts directly on the air in the cavity 200 and quickly disappears: 〇Injecting ink into the print head will be described below with reference to the LCP channel cast shown in Figure 27 Inject the ink into the ink. The LCP trench 176 is implanted with ink by the suction applied to the main channel outlet 232 from the pump (Fig.) of the fluid system. The main channel 184 is filled with ink, and then the ink supply path 182 and the print head 1C are self-injected into the ink main channel 1 84 to be relatively long and thin. In addition, if the air pocket is to be used to weaken the pressure pulse in the ink, it must be maintained. This can be a problem for the ink injection process, which can fill the cavity 200 by capillary action, or because the air trap channel 184 cannot completely inject the ink. To ensure that the LCP trench casting 176 is fully injected, the ink 184 has a crucible 228 at the downstream end prior to the exit 232. The air cavity 200 in the LCP casting 64 does not inject an ink opening, wherein the upstream edge is shaped to guide the ink relief surface toward the wall of the cavity. The middle breaks into one and causes disadvantages into four columns. The pressure inside the LCP main body. Creation 1 7 6 See the sixth casting material by capillary water. The hole 200 needs to be infused with ink to easily borrow the main and main channels. To ensure that it has the upper front -43- 200940349, these patterns are described with reference to Figs. 28A, 28B and 29A to 29C. These figures schematically illustrate the ink injection procedure. Figures 28A and 28B show the problem if there is no flaw in the main channel, and the 29A to 29C diagram shows the function of the 堰228. 28A and 28B are schematic cross-sectional views of one of the main trenches 184 of the LCP trench casting 176 and the array of air recesses 200 in the top of the trench. Ink 23 8 is drawn through inlet 230 and flows Q along the bottom surface of main channel 184. It is important to note that the advancing embossed surface has a steeper contact angle with the main channel 184. This causes the front portion of the ink fluid 238 to have a slightly bubble shape. When the ink reaches the end of the main channel 184, the ink level rises and the bubble-like front contacts the top of the channel before the ink flow stops. As shown in Fig. 28B, the channel 184 is unable to completely inject the ink, and now there is air trapping. This air bag will continue to interfere with the operation of the print head. The ink damping characteristics are changed and air can become an obstacle to the ink. In Figures 29A-29C, channel 184 has 堰 228 at the downstream end. As shown in Fig. 29A, the ink fluid 23 8 is formed in a pool shape after the crucible 228 and rises toward the top of the channel.堰22 8 has a sharp edge 240 at the top to serve as a fixed point for the relief surface. The advancing concavo-convex surface is fixed to the fixed edge 240 such that when the ink level exceeds the top edge, the ink does not easily flow through the 228. As shown in Fig. 29B, the raised surface of the bulge causes the ink to rise until it fills the channel 184 to the top. Since the ink sealing cavity 200 becomes a separate air pocket, the bulging ink concavity surface at the crucible 228 is broken from the sharp top edge 204 and is filled at the end of the channel 184 and the outlet 232 (see -44 - .200940349 Figure 29C). The sharp top edge 240 is precisely positioned such that the ink-concave surface will bulge until the ink fills the top of the channel 184, but does not allow the ink to swell too much to contact the end air cavity 242. If the uneven surface contacts and is fixed inside the end air cavity 242, it may inject ink. Therefore, the height of the raft and its position under the cavity are accurately controlled. The curved downstream surface of 堰228 ensures that there are no more fixed points, and if these are fixed, the ink relief surface may be allowed to bridge the Q gap to the recess 242. Another way the LCP uses to keep the cavity from injecting ink is the shape of the upstream and downstream edges of the cavity opening. As shown in Figures 28A, 28B and 2A to 29C, all upstream edges have curved transition surfaces 234, while the downstream edges are sharp. The ink relief along the top of the channel 184 can be secured to the sharp upstream edge and then moved upwardly into the cavity by capillary action. The transition surface, and particularly the curved transition surface 234 at the upstream edge, removes the strong anchor points provided by the sharp edges. φ Similarly, the applicant's work has found that if the cavity 200 inadvertently fills up some of the ink, the sharp downstream edge 236 will enhance the infusion of ink. If the printer is bumped, vibrated, or tilted, or if the fluid system must flow back for some reason, the cavity 200 may be completely or partially filled with ink. When the ink again flows in its normal direction, the sharp downstream edge 23 6 helps pull the ink relief back to the natural fixed point (i.e., the sharp corner). Thus, the control of the movement of the ink-concave surface through the LCP channel casting 176 is a means for properly injecting the crucible into the ink. The present specification has been described by way of example only. A person skilled in the art will recognize that many variations and modifications can be made without departing from the spirit and scope of the broad inventive concept of the invention. Therefore, the embodiments illustrated and described in the drawings are merely illustrative and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS The embodiments of the present invention are described by way of example only with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front and side perspective view of a printer embodying the present invention. Q Figure 2 shows the printer of Figure 1, with the front surface in the open position. Figure 3 shows the printer in Figure 2, with the print head removed. Figure 4 shows the printer of Figure 3 with the outer casing removed. Fig. 5 shows the printer of Fig. 3, the outer casing of which is removed and the print head is mounted. Figure 6 is a schematic diagram of the fluid system of the printer. Figure 7 is a series of top and front perspective views of the print head. φ Fig. 8 is a top view and a front perspective view of the print head in its protective cover 〇 Fig. 9 is a top view and a front perspective view of the print head removed by its protective cover. The first and second pictures of the series of print heads and the front view. Figure 1 1 series of head and back view of the print head. Figure 12 shows a view of all sides of the print head. The exploded perspective view of the print head of the 1st and 3rd series. Figure 14 is a cross-sectional view of the ink coupling of the print head. -46- .200940349 Figure 15 is an exploded perspective view of the ink inlet and filter assembly. Figure 16 shows a cross-sectional view of the spool valve engaged with the printer valve. Figure 17 is a perspective view of an LCP casting and a flexible PCB. Figure 18 is an enlarged view of the insert A in Figure 17. Figure 19 is an exploded perspective view of the LCP/flex PCB/print head 1C assembly. Figure 20 is an exploded view of the LCP/flex PCB/print head 1C assembly. Figure 21 is an enlarged view of the underside of the LCP/Flexible PCB/Printhead 1C assembly. Fig. 22 is an enlarged view showing the removal of the print head 1C and the flexible PCB in Fig. 21. Fig. 23 is an enlarged view showing the removal of the adhering film of the printing head 1C in Fig. 22. Fig. 24 is an enlarged plan view showing the removal of the LCP channel casting in Fig. 23. Fig. 25 shows the print head 1C in which the rear channel and the nozzle are superposed on the ink supply path. Figure 26 is an enlarged cross-sectional perspective view of the LCP/flex PCB/print head 1C assembly. Figure 27 is a plan view of an LCP channel casting. Figures 28A and 28B are schematic cross-sectional views of an LCP channel casting in which ink is injected without flaws. Figures 29A, 29B, and 29C show an LCP channel casting injecting ink and a schematic cross-sectional view of -47-.200940349. Figure 30 is an enlarged cross-sectional perspective view of the LCP casting showing the position of the contact force and force. Fig. 31 shows a reel of the 1C attached film. Figure 3 2 shows a cross section of the 1C attached film between the pads. A partial cross-sectional view of the 3 3 A to 3 3 C system showing various stages of conventional attached film laser drilling. Q Section 3 4 A to 3 4C is a partial cross-sectional view showing the various stages of double-attached film laser drilling. Figures 35A through 35D are longitudinal cross-sectional views of the schematic print head 1C attachment procedure. Fig. 3A and Fig. 36B are photographs showing ink supply holes of two different adhering films after the first joining step. Figures 7A and 3B are longitudinal cross-sectional views of an exemplary printhead 1C attachment procedure in accordance with the present invention. 〇 [Main component symbol description] 2 : Printer 4 : Main body 6 = Pivoting surface 8 : Screen 1 〇: Control button · 12 : Media stack 14 : Feed tray -48- .200940349 〇: Paper: exit slot = cam : Contact point: Release lever: Handle: Support surface: Ink tank = Pump: LCP Cast: Shut-off valve: Print head 1C: Nozzle: Pressure regulator: Bubble outlet: Sealed conduit: Air inlet: Outlet • 'Coarse Filter: Ink line - Ink line: Sensor: Electronic controller: Box - 49 200940349 94 : Cover 9 6 : Print head 匣 98 : Protective cover 100 : Rack 102 : Rack cover 1 0 4 : contacts 106: the shield member 0108 paper: flexible printed circuit board 110 · wiring junction 1 12A: coupling member 112B ink: ink coupling member 114: cartridge valve 116: and a filter inlet manifold 118 : outlet manifold 120: connector ❿ 122: inlet 124: outlet 126: Flexible tube 128: fixing the valve member 130: diaphragm 132: filter chamber 134: filter chamber 136: LCP master Channel 1 3 8 : Top Channel - 50 200940349 1 1 1 1 1 1 1 Ο 1 1 1 1 1 1 1 1 ❹ 1 1 1 1 1 1 1 1 Printer catheter collar catheter catheter ink Fluid filter outlet filter inlet spacer rib partition wall wire joint contact point countersunk hole countersunk hole support surface paper shield attachment film manifold joint surface LCP channel casting recess electronic component ink supply passage channel first hole ink supply hole liner 1 200940349 188B: backing 190: diaphragm 192: 194A replacement liner: a first adhesive layer 194B: second adhesive layer 195: engagement surface 196: motor 0197: PFA 198: reel 1 9 9 : Adhesive 2 0 0 : Pit 2 0 4 : Reference mark 206 : Water drop triangle 20 8 : Ink supply hole 2 1 0 : Ink supply hole Q 2 1 2 : Ink supply path 2 1 4 : Nozzle 2 1 6: ink supply hole 218: ink supply channel 220: nozzle array 222: nozzle 224: ink supply hole 226: supply hole 228: weir .200940349: inlet: outlet: curved transition surface: sharp downstream edge: ink Fluid: Edge: Ditch: 矽 Rubber pad: Heating block: Peripheral wall: Low coloring material: Peripheral wall

Claims (1)

.200940349 十、申請專利範圍 1·—種將一或更多之列印頭積體電路附著於墨水供 應歧管之方法,該方法包含下列步驟: (a)提供疊層薄膜,其具有界定於其中之複數個墨 水供應孔,該疊層薄膜包含夾於第一及第二黏著層之間之 中央聚合薄膜,其中該第一黏著層之第一融化溫度係比該 第二黏著層之第二融化溫度至少低丨〇·=〇; 0 (b)將該薄膜對齊該墨水供應歧管,使每一墨水供 應孔對齊界定於該墨水供應歧管之歧管接合表面中之各別 墨水出口; (b )藉由施加熱及壓力於該薄膜之相反側,而將該 第一黏著層接合至該歧管接合表面; (c)將該一或更多之列印頭積體電路對齊該薄膜, 使每一墨水供應孔對齊界定於每一列印頭積體電路之列印 頭接合表面中之墨水入口;以及 ❹ (d)將該—或更多之列印頭積體電路接合至該第二 黏著層。 2 ·根據申請專利範圍第1項之方法,其中,於步驟 (b) 中’該第二黏著層係由可移除保護襯墊保護。 3.根據申請專利範圍第2項之方法,其中,於步驟 (c) 之前’移除該保護襯墊。 4 ·根據申請專利範圍第1項之方法,其中,於步驟 (b)中’該第一黏著層到達其融化溫度,且該第二黏著 層未到達其融化溫度。 -54- 200940349 5. 根據申請專利範圍第1項之方法,其中,該第一 融化溫度係比該第二融化溫度至少低20°C。 6. 根據申請專利範圍第1項之方法,其中,於步驟 (b )中,該施加之熱對應於該第一融化溫度。 7 ·根據申請專利範圍第1項之方法,其中,於至少 步驟(b )期間,實質上無黏著物流入該墨水供應孔中。 8. 根據申請專利範圍第7項之方法,其中,步驟(c )包括之步驟爲:以光學方式找出每一墨水供應孔中心之 位置,其中係藉由該墨水供應孔無黏著物而促進該找出位 置之步驟。 9. 根據申請專利範圍第1項之方法,其中,每一墨 水供應孔之長度之範圍爲50至500微米,且寬度之範圍 爲50至500微米。 10. 根據申請專利範圍第1項之方法,其中,於步驟 (b)之後,該疊層薄膜係維持其結構完整性,以使該第 二黏著層沿著其縱長範圍維持均勻之厚度。 11. 根據申請專利範圍第1項之方法,其中,於步驟 (b)之後,該疊層薄膜係維持其結構完整性,以使由該 第二黏著層所界定之第二接合表面沿著其縱長範圍維持其 均勻平坦性。 12·根據申請專利範圍第11項之方法,其中,步驟 (d)包含加熱每一列印頭積體電路及定位每一該加熱之 列印頭積體電路於該第二接合表面上。 13.根據申請專利範圍第12項之方法,其中,於步 -55- .200940349 驟(d)中,由於該第二接合表面之該均勻平坦性,黏著 接合時間係小於2秒。 14. 根據申請專利範圍第1項之方法,其中,複數個 列印頭積體電路係分別對齊並接合於該第二黏著層,該複 數個列印頭積體電路係被定位,以使其沿著該墨水供應歧 管之縱長範圍而端對端接合在一起。 15. 根據申請專利範圍第1項之方法,其中,複數個 0 墨水入口係由沿著該列印頭接合表面以縱長方向延伸之墨 水供應溝道所界定’而且其中複數個墨水供應孔係與一個 墨水供應溝道對齊,該複數個墨水供應孔之每一個係沿墨 水供應溝道於縱長方向間隔分開。 16. 根據申請專利範圍第1項之方法,其中,該中央 聚合薄膜係聚醯亞胺薄膜。 1 7 ·根據申請專利範圍第1項之方法,其中,該第— 及第二黏著層係環氧薄膜。 ^ 18.根據申請專利範圍第1項之方法,其中,該薄膜 之總厚度之範圍爲40至200微米。 19. 根據申請專利範圍第1項之方法,其中,該中央 聚合薄膜之厚度之範圍爲20至1〇〇微米。 20. 根據申請專利範圍第1項之方法,其中,該第— 及第二黏著層各層之厚度之範圍爲10至50微米。 -56-.200940349 X. Patent Application Scope 1 - A method of attaching one or more print head integrated circuits to an ink supply manifold, the method comprising the steps of: (a) providing a laminated film having a a plurality of ink supply holes, the laminated film comprising a central polymeric film sandwiched between the first and second adhesive layers, wherein the first adhesive layer has a first melting temperature that is second to the second adhesive layer Melting temperature is at least low 〇·=〇; 0 (b) aligning the film to the ink supply manifold such that each ink supply aperture is aligned with a respective ink outlet defined in a manifold engagement surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to the opposite side of the film; (c) aligning the one or more print head integrated circuits to the film Having each ink supply aperture aligned with an ink inlet defined in a print head engagement surface of each of the print head integrated circuits; and ❹ (d) joining the one or more print head integrated circuits to the first Two adhesive layers. 2. The method of claim 1, wherein in the step (b) the second adhesive layer is protected by a removable protective liner. 3. The method of claim 2, wherein the protective liner is removed prior to step (c). 4. The method of claim 1, wherein in step (b) the first adhesive layer reaches its melting temperature and the second adhesive layer does not reach its melting temperature. The method of claim 1, wherein the first melting temperature is at least 20 ° C lower than the second melting temperature. 6. The method of claim 1, wherein in step (b), the applied heat corresponds to the first melting temperature. The method of claim 1, wherein during at least step (b), substantially no adhesive flows into the ink supply port. 8. The method according to claim 7, wherein the step (c) comprises the step of optically finding the position of the center of each ink supply hole, wherein the ink supply hole is promoted by no adhesive. The step to find out the location. 9. The method according to claim 1, wherein each of the ink supply holes has a length ranging from 50 to 500 μm and a width ranging from 50 to 500 μm. 10. The method of claim 1, wherein after the step (b), the laminated film maintains its structural integrity such that the second adhesive layer maintains a uniform thickness along its length. 11. The method of claim 1, wherein after the step (b), the laminated film maintains its structural integrity such that the second bonding surface defined by the second adhesive layer follows The length of the length maintains its uniform flatness. 12. The method of claim 11, wherein the step (d) comprises heating each of the print head integrated circuits and positioning each of the heated print head integrated circuits on the second joint surface. 13. The method according to claim 12, wherein in step (55), in step (d), the adhesive bonding time is less than 2 seconds due to the uniform flatness of the second joint surface. 14. The method of claim 1, wherein the plurality of print head integrated circuits are respectively aligned and bonded to the second adhesive layer, the plurality of print head integrated circuits being positioned such that They are joined end to end along the length of the ink supply manifold. 15. The method of claim 1, wherein the plurality of zero ink inlets are defined by an ink supply channel extending longitudinally along the print head engagement surface and wherein the plurality of ink supply apertures In alignment with an ink supply channel, each of the plurality of ink supply apertures is spaced apart along the lengthwise direction of the ink supply channel. 16. The method of claim 1, wherein the central polymeric film is a polyimide film. The method of claim 1, wherein the first and second adhesive layers are epoxy films. The method of claim 1, wherein the total thickness of the film ranges from 40 to 200 microns. 19. The method of claim 1, wherein the central polymeric film has a thickness in the range of 20 to 1 micron. 20. The method of claim 1, wherein the thickness of each of the first and second adhesive layers ranges from 10 to 50 microns. -56-
TW097116828A 2008-03-17 2008-05-07 Method of attaching printhead integrated circuits to an ink manifold using adhesive film TWI444300B (en)

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WO2009114891A1 (en) 2009-09-24
TWI444299B (en) 2014-07-11
TW200940348A (en) 2009-10-01
TW200940350A (en) 2009-10-01
TWI444300B (en) 2014-07-11

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