TW200938599A - Curable high dielectric constant ink composition and high dielectric film - Google Patents

Abstract

The invention discloses a curable ink composition which comprises about 1-10 parts by weight of a curable epoxy resin system, about 1-30 parts by weight of ferroelectric ceramic powders, about 0.1-10 parts by weight of a polymeric dispersant, and about 50-96 parts by weight of a solvent. The ink composition is suitable for forming a high dielectric film by inkjet printing for built-in capacitors.

Description

200938599 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to ink compositions, and more particularly to hardened crosslinked high dielectric ink compositions. Kind

[Previous Technology J Recently, the demand for high-quality and high-performance electronic products has been booming in the printed circuit board industry. At the same time, the electronic products are moving toward a high-speed, short, small, diversified and signal transmission. Frequency, because: light, the ratio of the number of passive components and active components on the circuit board is also greatly improved. In order to improve the application of passive components on the printed circuit board, it will be reduced by _σ, which can greatly reduce the board area, and Utilizing the advantages of miniaturization technology 2, embedding thin passive components in a circuit board to increase the density of the elementary enamel has become a trend. In the case of an embedded capacitor, the process is to use the inner layer process of the multi-layer board, and the capacitor is directly fabricated on the inner layer board by etching or screen printing, or used as a backing copper foil. The layered method, after each pressing into a multi-layer board, can replace the electric power required for assembly on the panel. The built-in capacitor technology can be directly applied to the Rigid PCB process at this stage. From the current trend of electronic products, high-frequency, multi-functional and portable is an indispensable condition. There is no shortage of printed circuit boards in these products. In order to shrink and high-functionality, the thickness of the dielectric layer is thin. Increasing the capacitance value will also become a trend. How to form an ultra-thin (several micron or less) same-gate substrate instead of a surface-mount (SMD) decoupling capacitor has become an issue for the printing industry of 200938599 circuit board (PCB) industry. At this stage, the method of fabricating a high-capacitance material layer is not easy to produce a dielectric layer having a majority of m2 or more, and the dielectric constant of the organic resin in the high dielectric material of the existing PCB process is not high enough to be reduced by thickness. In order to achieve high capacitance density requirements above nFW, when the film thickness is only 17 due to 1 ^ dielectric strength will determine whether the material is applicable (4) 2 technical way to directly print high dielectric ink on the substrate 'It is easy to achieve the ultra-thin demand with the previous knowledge of using the residual or screen printing method to make the embedded ===^化', which is a good method for low ^ (&lt;200C) to reach f capacity (four). Only limited by At the operating temperature, it must be less than == ink to achieve low viscosity requirements, but this also causes the ink to be "+good" or even the heat resistance and chemical resistance of the resulting dielectric layer is less than one. Printing (Inkjet _ti (10) process _; making ultra-thin South capacitor material applied to the embedded capacitor substrate, strengthening the high = use (4) ink can be low purification and silk, and the formation of dielectric θ resistance and heat resistance Sex will be more important. Structure === more exposed capacitance production The method and its various layers of inorganic pottery are mixed and simply described. Fresh: The attack has a film with super-capacitance and large capacitance. On 5162977, a buried capacitor structure is disclosed, in which the material is mentioned, "When the method of obtaining a high dielectric material is mentioned" Epoxy tree added Tao 6 200938599: Powder = technology 'does not focus on the key technology of the material formula. The month is also not considered for the printing ink design. Similarly, the US patent US 5800575 and US 587〇274 two The patent content also focuses on structural design. 〃 US Pat. No. 5,739,193 discloses a polymeric dielectric composition, which refers to the mixing of thermoplastic resins and powders, mainly for use in hot melt injection molding of electronic products. U.S. Patent US 66 〇876〇B2 mainly uses thermosetting resin and high dielectric powder to form dielectric substrate. In addition, us ❹6905757 emphasizes the manufacturing method of buried capacitor layer in printed circuit board, which refers to resin, bismuth and powder. The characteristics 'but there is no material in the specification that can be produced by printing. The high dielectric material formulations mentioned in the above patents have a large viscosity ( &gt;1 OOcps), the larger ^ true charged powder particles (&gt; 5〇〇nm), and can not make ultra-thin capacitors with the printing process, the formulation with high printability and high dielectric properties is by no means The conventional organic-inorganic hybrid high-dielectric material formulation technology can be easily learned. In the past, a patent for the production of a dielectric film by a printing technique was disclosed in US Pat. No. 2,050,137, 281, the disclosure of which is incorporated herein by reference. 3 dielectric ceramic powder to achieve the purpose of printing high dielectric constant ink, however, such simple ethylene copolymer system dielectric materials have poor heat resistance and chemical resistance, and the application will be limited. It is known that there is a need for a formulation of a printable hardened dielectric ink composition material, which makes the ultra-thin high dielectric layer material have high heat and chemical resistance. 7 200938599 SUMMARY OF THE INVENTION The main object of the present invention is to provide a hardenable cross-linking type high dielectric ink composition, which is particularly suitable for use in a printing process to obtain an ultra-thin capacitor layer, and at the same time has excellent heat and chemical resistance. . For the above and other purposes, the hardenable crosslinked high dielectric ink composition of the present invention mainly comprises: about 1 to 10 parts by weight of an epoxy resin system; and about 1 to 30 parts by weight of a strong dielectric ceramic powder. About 0.1 to 10 parts by weight of the polymeric dispersant; and, about 50 to 96 parts by weight of the solvent, having a boiling point of not lower than 10 °C. The present invention further includes providing a high dielectric film formed by crosslinking and curing the above ink composition. The above and other objects, features, and advantages of the present invention will become more apparent from the aspects of the appended claims < The inkjet-type hardened high-dielectric ink composition material formulation technology makes the ultra-thin high-dielectric layer material have high heat resistance and chemical resistance, and is particularly suitable as a capacitor dielectric layer of a built-in capacitor substrate. . The hardenable crosslinked high dielectric ink composition of the present invention mainly comprises: (A) an epoxy resin system, (B) a ferroelectric ceramic powder, (C) a polymer type dispersant, and (D) a solvent. . The components will be described in detail below. (A) Epoxy Resin System The high dielectric ink composition of the present invention comprises about 1 to 1 part by weight, preferably 8 to 200938599, about 1 to 5 parts by weight of an epoxy resin system (100 parts by weight of the ink composition is The epoxy resin used in the reference includes a monomer having an epoxy group, an oligomer, and a polymer. Specific examples include: (8) Double-type epoxy resin such as DiglyCidyl ether of bisphenol A epoxy &gt; Tetrabromo bisphenol A diglycidyl ether epoxy; (b) Bisphenol-F type epoxy resin ❹ (c) Bisphenol S type Epoxy resin such as dicyclopentadiene epoxy (d) cycloaliphatic epoxy resin resin (e) naphthalene ring epoxy resin (f) bisphenyl epoxy resin ❹ (g) novolac epoxy resin (h) 曱 varnish ring Gas resin (i) polyfunctional ring oxime

Oxygen resin, for example, (1) aliphatic chain type epoxy resin, 〇CH.-C 十 Hr0CH "-, CHyO-GH^CH-Oi, 八,叫-CH-CH? CH 广CH-〇V〇-CH2-qCHJ r CHr O-OVCH-CH, ,0, , cVcH-〇V〇, CH heart [ 〇, CHr'CH-cHi 〇〇Λ , CH?-CH-CHr-0-C-CM-C-0-CH ^€H-CH7 ? 9 200938599 ch-o-(ch^h^-CK_cAH! I ^ cH-o-iavcH,,』, 〇0-CH,-CH-CH, ii di-OC-TOrCH^CH- CHi-CH-lCH^-CK, I 〇O-CHrCH-CH,

I

I

CH-oc-iCHA-CH^CH-CH.-O-MCH^-CHj ! 〇O-CH-Of-CH, i S i Cli-OC-TOrCH-CH-CH^CH-tC^-CH Oxygen resins can be used singly or in combination, and are appropriately selected and formulated depending on the processing and properties required. According to the present invention, the epoxy used herein has the meaning of (4) on I5 (four), and more preferably 18G. The above glass transition temperature provides better heat resistance. In addition to epoxy resin, it is also possible to add one or more thermoplastic polymers, such as polyvinyl butyral, acrylic resin, polyamido-imine, etc., to regulate high dielectric. The physical properties of the film are such as flexibility. In addition to the resin component, the epoxy resin system may further include a hardener and a catalyst. The amount of the hardener added is about 5 to 40 parts by weight based on 1 part by weight of the epoxy resin. Preferred hardeners include: (a) Diamine: H2N-R]-NH2

Ri may be an aromatic group, a fat group, a cycloaliphatic group or a decane-containing aliphatic group or the like. 〇 (b) anhydride such as hexahydrophthalic anhydride (tetra), tetrahydrophthalic anhydride (ΤΗΡΑ), methyl tetrahydrophthalic anhydride (methyl tetrahydrophthalic anhydride; ΜΤΗΡΑ), methyl hexahydrophthalic anhydride (MHHPA), and the like. (c) phenol resins such as Phenol based resins, Naphthol based resins, Terpene phenol resins, Dicyclopentadiene resins, 10 200938599 4, 4', 4''-Ethylidene trisphenol, Tetraphenylol ethane, Tetraxylenol ethane, Tetracresolol ethane, and the like. The catalyst is added in an amount of about 0.1 to 5 parts by weight based on 100 parts by weight of the epoxy resin. Preferred catalysts include: (a) Cationic catalysts Boron trifluoride precursors such as RNH2 · BF3, R2NH · BF3, R3N · BF3 and the like (wherein R represents an alkyl group). (b) Anionic catalyzers, tertiary amines, metal hydroxides, monoepoxide coordination anion catalysts, such as R3N (R stands for alkyl), tetramethylguanidine (TMG), NCH2C-C(NH)_N ( CH3) 2 and so on. (c) Imidazole 1-mercaptoimidazole, 1,2-dimercaptoimidazole, 2-heptadecylimidazole, 2-ethyl-4-indolizole, and the like. (B) Ferroelectric Ceramic Powder® The high dielectric ink composition of the present invention comprises about 1 to 30 parts by weight, preferably about 5 to 20 parts by weight, of a ferroelectric ceramic powder (in terms of 100 parts by weight) The ink composition is the basis). The ferroelectric ceramic powder used, for example, BaTi03, and BaTi03, Ba(Sr)TiO3 ceramic powder implanted with metal ions such as Ca, Zr, Mg, and the like. The ferroelectric ceramic powder (or high dielectric powder) contained in the high dielectric inkjet ink of the present invention is capable of fabricating and improving the density of the dielectric layer film by inkjet process. The constituent particles have an average particle diameter ranging from 10 to 400 nm, and more preferably less than 250 nm. If the average particle size of 200938599 is greater than 500 nm, it is difficult to print the pattern during the printing of high dielectric ink. In the present invention, two or more ceramic powders having different particle diameters may be used to increase the bulk density of the ceramic powder to increase the capacitance. ° (C) Dispersant The high dielectric ink composition of the present invention comprises about 0.1 to 1 part by weight, preferably about 1 to 5 parts by weight of a dispersant (based on 100 parts by weight of the ink composition). In order to allow the ferroelectric ceramic powder particles to be stably dispersed in the ink containing the crosslinkable hardening epoxy resin for a long period of time, a suitable dispersing agent should be used to disperse and stabilize the dielectric powder particles to avoid long-term use of the ink. In the Inkunene, problems such as particle collection, settling, and excessive viscosity are generated to maintain the variation of ink droplet size, ink droplet velocity, and ink droplet printing direction variation during the inkjet process. In order to achieve the above requirements, the present invention uses a polymer type dispersant which has good adhesion to inorganic powders and has excellent compatibility with organic resins (may also be reactive with organic resins). Significantly improve the heat resistance and reliability of high-tech® films. Preferred polymer type dispersing agents include polyesters, polyamines, polyamino acid esters, polyphosphoric esters, or the above-mentioned copolymers, which may be used alone or in combination of two or more. The oily molecular dispersing agent is preferred, but an amphoteric polymer dispersing agent can also be used. Commercially available polymeric dispersants suitable for the present invention include, but are not limited to, BYK-9010 (BYK Chemie), KD series (Uniqema), ADO 1 (Air products), and the like. 12 200938599 (D) Solvent The south dielectric ink composition of the present invention comprises from about 5 to about 96 parts by weight, preferably from about 55 to about 85 parts by weight of the solvent (based on 1 part by weight of the ink composition). The present invention uses a boiling point of not less than 1 Torr. The solvent is used to avoid the ink from being steamed and the pressure is too low, resulting in poor printing. Solvents suitable for the present invention include: acid esters, alcohols, guanamines, or combinations of the foregoing. Specific examples include, but are not limited to, ethyl lactate, butyl acetate, carbitol acetate, toluene, diphenyl, butanol, ethylene glycol, propylene glycol, decyloxypropylene glycol, ethoxy; © monol, dimethylacetamide, or a combination of the foregoing. It should be noted that 'the present invention may use a single solvent system or a multi-solvent system'. Therefore, in addition to the above-mentioned solvent of not less than fresh c, a cosolvent having a boiling point of less than 100 ° C, such as ethanol or propanol, may be included. Ethyl acetate (E) Other additives ❹ In addition to the above components, the high dielectric ink composition of the present invention may also be packaged. Other conventional additives commonly used in ink compositions or dielectric films, such as adhesives, materials Mixtures, boundary (four) agents, etc., not: inkjet properties and dielectric properties are preferred. In the middle of the 矽 警 警 警 警 警 警 警 警 警 、 、 、 、 、 、. The 増 adhesive is, for example, 虱 vir^l ' where h repeats the number of monomers, respectively. Up to 100 cps The viscosity of the high dielectric ink composition of the present invention is about! 200938599 * The operating temperature of the visible inkjet machine and the size of the inkjet head are appropriately adjusted. The surface tension of the ink composition is between about 20 and 60 Dyne/cm, and can also be adjusted depending on the hydrophilicity of the substrate surface to improve the adhesion of the ink. The high dielectric ink composition of the present invention not only has good ink storage properties and ink jet properties, but also imparts good heat resistance and chemical resistance to the dielectric layer after heat hardening and crosslinking. Further, the high dielectric value characteristic of the dielectric film formed by the high dielectric ink composition is particularly suitable for producing an ultrathin (thickness less than 5 ❹ #m) buried capacitor material by an ink jet method. In the preferred embodiment, an ultra-thin high dielectric layer having a dielectric constant (1 MHz) greater than 10 can be fabricated. It should be noted that the heat-curable high-dielectric ink composition disclosed in the present invention can be rotated coating, blade coating, or the like by Gravure coating, in addition to the printing method. High dielectric films are prepared by Letterpress, Flexography, etc. to achieve ultra-thin high dielectric substrates. In addition, the formed high dielectric film is not limited to the use of a built-in capacitor substrate. On the contrary, those skilled in the art can apply it to various electronic components such as transistors, diodes, resistors, etc. . [Example 1] &lt;South dielectric powder dispersion> 100 g of BaTi〇3 (Inframat Advanced Materials 'BT-1) having an average particle diameter of about 100 nm was added to 20 g of a polymeric dispersant BYK-9010 (BYK) Chemie supplied, acid group-containing copolymer acid group 14 200938599 copolymer dispersant A), and added 760 g of grinding media wrong beads and 150 g of ethyl lactate solvent, followed by wet grinding with a sand mill for 2 hours for dispersion treatment, Thereafter, the beads are separated by filtration to obtain a high dielectric powder dispersion. &lt;Resin Adhesive System&gt; 10.50 g of bisphenol-A diglycidyl ether (188EL, Changchun Resin Co., Ltd., Taiwan), 7.70 g of tetrabromobisphenol-A epoxy resin (tetrabromo disphenol) -A diglcidyl ether) (BEB-350, Changchun, Taiwan), 2.70 g of cycloaliphatic epoxy® eyclo aliphatic epoxy (HP-7200, DIC, Japan), 3.70 g of polyfunctional epoxy resin (Multifunctional epoxy) (EPPON502H, 曰本化药) system and 460g of ethyl lactate solvent, heated in a reaction flask to 90 ° C, mixed and dissolved for about 30 minutes, after cooling, it is epoxy resin Adhesive-1, followed by 5.60 g of mercaptohexahydrophthalic anhydride cross-linking hardener (ACROS, USA) and 〇. 8 g of 2-ethyl-4-mercaptoimidazole catalyst (ACROS' USA), The resin binder was completed by stirring at 2000 rpm for 10 minutes in a high speed mixer. ® &lt;High Dielectric Ink System> 2.5 g of the above high dielectric powder dispersion was added to a gram of resin binder, and after 30 minutes of scramble, a hardenable dielectric ink was prepared. Then, the above ink was used to load the Dimatix printer (DMCLCP-11610) ink cartridge, and the liquid droplet forming sharp ink meter was built in the Dimatix printer (DMP2800) ink jet machine to observe the printing result. The ink was printed on a copper foil substrate and passed through 180. (: After baking for 2.5 hours, it can be cross-linked and hardened on the copper foil to form a high dielectric film layer. 15 200938599 [Example 2] The preparation procedure is the same as in the first embodiment, but the high dielectric powder is changed to the average particle size. About 300 nm of BaTi〇3 (Prosperity Dielectrics Co., BT-2), the addition amount of each component is shown in Table 1. [Example 3] The preparation procedure is the same as that in the first embodiment, but the dispersant is changed to another lipophilic property. Molecular dispersant KD-1 (Uniqema, Hypermer dispersant C), the addition amount of each component is shown in Table 1. [Example 4] The preparation procedure is the same as in the first embodiment, but the high dielectric powder is changed to BT- 1 is mixed with BT-2, and the addition amount of each component is shown in Table 1. [Example 5] The preparation procedure is the same as that in the first embodiment, but the resin binder system is added to the polyethylene butyric acid (1&gt;〇13^11171131 ^))), formulated as follows: ® 9.20 grams of bisphenol-A diglycidyl ether (188EL, Changchun Resin, Taiwan), 6.50 grams of bisphenol bisphenol oxime epoxy resin ( Tetrabromo disphenol-A diglcidyl ether)(BEB-350, Changchun Company, Taiwan) 1.60 g of cycloaliphatic epoxy resin (HP-7200, DIC, Japan), 2.40 g of polyfunctional epoxy (EPPON 502H, 曰本化药) system and 4.91 g Poly (vinyl butyral) (PVB, Changchun Resin Co., Ltd., Taiwan) and 460 g of ethyl lactate solvent, heated to 90 ° C in a reaction bottle of 16 200938599, dissolved and heated for about 30 minutes, after cooling Epoxy Resin Adhesive-2, followed by 5.60 g of mercaptohexahydrophthalic anhydride cross-linking hardener (ACROS, USA) with 0.08 g of 2-ethyl-4-mercaptoimidazole catalyst (ACROS, USA), The resin binder was completed by stirring at 2000 rpm for 10 minutes in a high speed mixer. [Example 6] @ The preparation procedure is the same as in the first embodiment, but the high dielectric ink system is configured to add 1.0 g of a high dielectric powder dispersion to 3.8 g of a resin binder and 15 g of ethyl lactate, and stir 30 After a minute, the hardenable dielectric ink 0 is prepared. [Example 7] The preparation procedure is the same as in the first embodiment, but the ethyl lactate solvent content in the resin binder system is changed to 40 g, and the high dielectric ink system is additionally used. The 2.8 g high dielectric powder dispersion was placed in a 1.02 g resin binder and stirred for 30 minutes to form a hardenable dielectric ink. [Comparative Example 1] The preparation procedure was the same as in Example 1, except that the dispersant was changed to the hydrophilic dispersant BYK-112 (available from BYK Chemie, Dispersant B). [Comparative Example 2] The preparation procedure was the same as in Example 1, except that the solvent was changed to acetophenone. [Comparative Example 3] The preparation procedure was the same as in Example 1, except that the high dielectric powder was changed to ΒΤ_2, and the solvent was changed to isopropyl alcohol. The addition amount of each component is shown in Table 1. [Comparative Example 4] The preparation procedure was the same as in Example 1, except that no epoxy resin binder was added, and the amounts of the components were as shown in Table 1. Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 High Dielectric Powder Dispersion BT-1 100.0 95.7 0 80.0 100.0 0 100.0 20.0 100.0 100.0 120.0 BT-2 0 0 90.4 0 0 100 0 80.0 0 0 0 Agent A 0 19.5 16.7 0 20.0 20.0 0 20.0 20.0 20.0 40.0 Green Agent B 20.0 0 0 0 0 0 Bu 0 0 0 Bu 0 0 Green Agent C 0 0 0 10.1 0 0 20.0 0 0 0 0 High dielectric powder solvent (solvent: ethyl lactate) 150.0 0 0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 150.0 High dielectric powder solvent (solvent: acetophenone) 0 150.7 0 0 0 0 0 0 0 0 0 High dielectric powder solvent (ί: isopropyl alcohol) 0 0 150.6 0 0 0 0 0 0 0 0 Resin binder epoxy resin binder-1 (Solvent: lactate B S) 486.4 0 0 0 484.6 486.5 486.0 485.6 0 484.6 64.6 Ring lion adhesive-2 (Solvent: ethyl lactate) 0 0 0 0 0 0 0 0 484.7 0 0 Epoxy adhesive-3 (ί容:曱乙酮酮) 0 486.5 0 0 0 0 0 0 0 0 0 18 200938599 乳乳树脂胶剂_4 Medium: isopropanol) 0 0 487.0 0 0 0 0 0 0 0 0 Hardener 5.60 5.62 5.53 0 5.60 5.58 5.59 5.61 5.60 5.60 5.61 Catalyst 0.08 0.08 0.07 0 0.08 0.08 0.08 0.08 0.08 0.08 0.08 Table 2 Characteristics Comparison Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Example 1 Implementation Example 2 Embodiment 3 Embodiment 4 Embodiment 5 Embodiment 6 Embodiment 7 Inkjet printing is poor (plug hole) Poor (plug hole) Poor (plug hole) Jia Jia Jia Jia Jia Jia Jia Gao Jie Electro-ink viscosity cps 12.0 7.8 6.9 9.2 9.9 9.8 8.8 8.9 10.6 3.2 12.8 High dielectric ink surface tension (dyne/cm) 30.7 242 21.4 30.5 30.8 31.3 30.6 30.8 30.2 30.5 30.9 Dielectric constant (1MHz) 13.33 12.26 8.70 79.2 18.32 25.34 20.15 19.20 18.61 11.2 13.3 Glass transition temperature Tg (°C) 174 175 178 105 183 184 187 182 180 181 182 Dielectric material thickness μηι 1.8 2.3 2.8 27 3.5 4.2 3.5 3.8 3.3 1.2 4.5 Qualification* Passing through the pass failure By passing the passage of * resistance according to ASTM D5402-93 (Reapproved 1999) specification (find 10 times with MEK solvent)

From the measurement results of Table 2, it was found that Comparative Example 1 used a hydrophilic dispersant for dispersion of a high dielectric powder, resulting in poor dispersion so that the ink was poorly printed during the printing process. In addition, the choice of solvent is also a key factor. It can be seen from Comparative Examples 2 and 3 that even if a suitable polymer type dispersant is used, the solvent vapor after dispersion is selected because the solvent selects low-boiling ethyl ketone and isopropyl alcohol. The pressure is too low, making the ink printing effect worse. Further, from Comparative Example 4, it was also found that the high dielectric layer formed by the addition of the hardenable crosslinked epoxy resin ink was inferior in heat resistance and chemical resistance. In contrast, in the first embodiment, a polymer type dispersant and a high-boiling ethyl lactate are used as a solvent to obtain a relatively good printing effect, and the dielectric constant can reach 18.32. Alternatively, a larger particle size of BaTi03 can be selected as in Example 19 200938599. The ceramic powder having a particle size of 300 nm is poured, and the addition of the dispersant and the choice of the solvent plus the good sanding dispersion can also be achieved. Good printing results and excellent electrical properties can reach 184 ° C at glass transition temperature. The fourth embodiment shows that the addition of ceramic powders of two different particle sizes can also be used to increase the bulk density of the ceramic powder to increase the capacitance value, the dielectric constant is 19.20, and the thickness after printing is also relatively uniform. According to the above embodiments, the crosslinkable and hardenable dielectric ink composition of the present invention can be heated to form an ultra-thin high-capacitance dielectric layer which is better for heat and chemical resistance, and the ink formulation has excellent ink-jet stability. It can be applied to the fabrication of buried capacitors. While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention, and it is intended to be The scope of protection of the present invention is defined by the scope of the appended claims. ❿ 20 200938599 [Simple description of the diagram] None. [Main component symbol description]

Claims (1)

200938599 X. Patent application scope: 1. A hardenable cross-linking criminal 曰t-to-dielectric ink composition' includes: an epoxy resin system with about W0 reset parts; Powder; about 0.1 to 10 parts by weight of a polymeric dispersant; and a solvent of 50% by weight of the spoon, the point of which is not lower than the loot:. 2. In the case of the hardenable cross-linking type high dielectric 昼Jcf material mentioned in item 1 of the general specification, the epoxy resin system further includes a polythene condensate, a tree, a scorpion Imine, or a combination of the foregoing. The hard-hardenable high-dielectric soil, Jc, 'and (9), wherein the ferroelectric terrarium powder includes u, Ba(Sr)Tl03, both of which are mentioned in the above paragraph A ceramic powder formed by implanting other metal ions, or a combination thereof. 4. The hardenable crosslinked high dielectric ink composition as described in the 'f patent scope of the invention, wherein the ferroelectric ceramic powder has a particle size of between about W and 400 nm. ❹ 5. The hardenable cross-linking type high dielectric ink composition as described in claim </ RTI> wherein the polymer type dispersant comprises: poly-lysate, polyamine, polyamino acid S, Polyphosphorus g, the above copolymer, or a combination thereof. 6. The hardenable cross-linking type high dielectric ink composition according to claim 1, wherein the polymer type dispersant comprises: a lipophilic polymer type dispersant, an amphoteric type polymer type dispersant, Or a combination of the above. 7. The hardenable cross-linking according to the application of the patent model _i ^ 2009 20099999 Ink, and the solvent in the ## includes the acid vinegar, the alcohol, the amine, or a combination thereof. 8. The hardenable cross-linked St. High Dielectric Ink &amp; as described in the item 7 of the scope, wherein the solvent comprises: ethyl lactate, butyl acetate, carbitol, toluene, and Stupid, butanol, ethylene glycol, propylene glycol, methoxypropanyl [oxypropylene glycol, dimethylacetamide, or a combination of the foregoing 0 ❿ ❹ 9. Hardenable as described in claim 1 Cross-linked high dielectric ink composition' wherein the epoxy resin system comprises HA type epoxy tree moon, double age-F type epoxy resin, double s type epoxy resin, cycloaliphatic epoxy tree U epoxy resin, bisphenyl epoxy resin, acid clear = fat, varnish epoxy resin, polyfunctional epoxy resin, fat bond ^ epoxy resin, or a combination of the foregoing. The hardenable cross-linking type high dielectric earth water and water, as described in the above-mentioned patent scope, wherein the epoxy resin system further comprises a hardener. Black water: Π: The hardenable cross-linking type high dielectric 所述, and the composition described in the above item 1 includes the catalyst. 12. The hardenable cross-linking type high-intermediate soil-water composition as described in the scope of the patent application, further comprising: a co-solvent having a point below 1 G0 °C. Black 2, the hardenable cross-linking type high dielectric two' described in the first aspect of the patent, wherein the ink composition has a surface tension of about 2 (10) Dyne/cm. Master $ k . The hardenable cross-linking type high-intermediate ink composition described in the first aspect of the invention is wherein the viscosity of the ink composition is between β100=23 200938599. A high dielectric film obtained by crosslinking and hardening a hardenable crosslinked high dielectric ink composition according to any one of claims 1 to 14. 16. The high dielectric film of claim 15 which is a capacitor dielectric layer of a built-in capacitor substrate. The high dielectric film of claim 15, wherein the high dielectric film has a dielectric constant (1 MHz) greater than 10. 24 200938599 VII. Designation of Representative Representatives (1) The representative representative of the case is: None. (2) A brief description of the component symbols of this representative figure: No 0 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: ❿ No. 4