TW200934894A - Aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, process and apparatus for producing the same - Google Patents

Aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, process and apparatus for producing the same Download PDF

Info

Publication number
TW200934894A
TW200934894A TW97104673A TW97104673A TW200934894A TW 200934894 A TW200934894 A TW 200934894A TW 97104673 A TW97104673 A TW 97104673A TW 97104673 A TW97104673 A TW 97104673A TW 200934894 A TW200934894 A TW 200934894A
Authority
TW
Taiwan
Prior art keywords
aqueous solution
copper
copper sulfate
sulfate
anode
Prior art date
Application number
TW97104673A
Other languages
Chinese (zh)
Inventor
Toshiyuki Takashima
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200934894A publication Critical patent/TW200934894A/en

Links

Landscapes

  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

An aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, and a process and apparatus for producing the same, in which a copper ion can be eluted effectively and an aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate can be obtained at a high level of production efficiency, is provided. An ion generating cell is divided into an anode part and a cathode part by a hydrogen ion-exchange membrane. In the cathode part, hydrogen gas is evolved from the surface of a cathode. In the anode part where an aqueous solution of dilute sulfuric acid or dilute iron sulfate is provided, a copper ion is eluted from an anode which comprises pure copperplate or a highly-pure copperplate of 6N or more to the anode part, and then, an aqueous solution of copper sulfate or copper sulfate including iron sulfate is produced in the anode part.

Description

200934894 九、發明說明 【發明所屬之技術領域】 本發明係關於高純度硫酸銅水溶液或含硫酸鐵之硫酸 銅水溶液的製造方法及製造裝置、以及高純度硫酸銅水溶 液或含硫酸鐵之硫酸銅水溶液。 【先前技術】 傳統上,進行鍍銅時,爲得到必須的銅離子,使用溶 解硫酸銅水合物之水溶液作爲電鍍液,但含有銅以外之雜 質時,有電鍍層之膜特性降低之問題。 另外,近年來因使用6N( 99.9 9 99% )純度以上之銅 素材作爲陽極(Anode )素材之高純度製品被製品化,對 於作爲鏟金浴基底液原料之硫酸銅,要求高純度。 如上述之電鍍液多供應於溶解性陽極法,此時爲供給 銅離子於電鍍液中,使用銅磷合金之塑性加工品(銅板、 銅片、銅球等)爲陽極,溶出銅離子。 使用銅之硫酸銅浴溶解性陽極法時,以延遲陽極之鈍 態化,或由岐化(disproportion)反應抑制銅粉發生爲目 的,使於陽極表面產生稱爲黑膜(black film)的膜。雖 考慮如此黑膜爲合金銅中之磷、氧化物、氫氧化物、氯化 物等之複合物,但因爲於適當正確的條件下係健全進行產 生機能的膜,嚴密地維持產生健全的薄膜係困難的。因 此,黑膜係於實際的工業操作中,重複若干的滑落及產生 所形成的膜,但此時滑落的膜係成爲黏糊狀或析出粉末等 -4- 200934894 之顆粒,污染電鍍液,而有產生鍍瘤(nodule )等於成膜 面之造成不良影響之問題。 於印刷電路板領域中,盛行使用銅之溶解性陽極法, 於新興領域之模組基板領域中,因微細化要求更加嚴格, 所以起因於滑落顆粒之不良狀況成爲不能忽視之問題。因 此,於此等領域中,要求由溶解性陽極法,改變成不能形 * 成黑膜之不溶解性陽極法。 || 但是,一般不溶解性陽極法中,即使電鍍溶液中之銅 被消耗,仍不能補充銅離子單體,並且因於陽極產生的強 烈氧化反應,添加劑分解或變質,所以有長時間安定作業 係不可能之問題。 爲解決如此問題,例如提出於放入含3價鐵離子溶液 之溶解槽中,設置收納銅材之收納體之製造裝置(例如專 利文獻1 )。 專利文獻1記載之製造裝置係由上述構成,抑制陽極 Q 銅材氧化,同時可供給銅離子於溶液中,可由不溶解性陽 極法長時間作業者。因此,進而於工業的作業中,不僅含 ' 有高純度銅離子之稀硫酸水溶液,逐漸要求高純度之硫酸 ' 銅水溶液或含硫酸鐵之硫酸銅水溶液。 另外,於半導體元件領域中,最高級(high-end )製 品之多層電路之電路材料係由A1轉換爲Cu,電路形成步 驟亦由傳統之RIE法(反應性離子触刻法,Reactive Ion Etching)逐漸轉換爲雙重鑲嵌(dual damascene)法,但 現所使用之銅雙重鑲嵌步驟中’因包含銅之電解銨金步 -5- 200934894 驟,所以現況係硫酸銅浴溶解性陽極法仍占爲主流。 然而,於硫酸銅浴溶解性陽極法中,膜質的純度或健 全性等絕不充足,要求如專利文獻1記載之製造裝置之硫 酸銅浴不溶解性陽極法之適用或鍍金浴及銅離子發生材料 之高純度化等。200934894 IX. Description of the Invention [Technical Field] The present invention relates to a method and a device for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution, and a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution. . [Prior Art] Conventionally, in the case of performing copper plating, an aqueous solution of copper sulfate hydrate is used as a plating solution in order to obtain necessary copper ions. However, when impurities other than copper are contained, the film properties of the plating layer are lowered. In addition, in recent years, a high-purity product using a copper material having a purity of 6 N (99.99 99%) or more as an anode (Anode) material has been produced, and high purity has been required for copper sulfate which is a raw material for a base bath of a shovel gold bath. As described above, the plating solution is supplied to the soluble anode method. In this case, copper ions are supplied to the plating solution, and a copper-phosphorus alloy (a copper plate, a copper plate, a copper ball or the like) is used as an anode to dissolve copper ions. When a copper copper sulfate bath-soluble anode method is used, a film called a black film is generated on the surface of the anode for the purpose of delaying the inactivation of the anode or suppressing the occurrence of copper powder by a disproportion reaction. In view of the fact that such a black film is a composite of phosphorus, an oxide, a hydroxide, a chloride, or the like in the alloy copper, it is possible to maintain a sound film system while maintaining a functional film under appropriate and appropriate conditions. difficult. Therefore, the black film is in actual industrial operation, repeating a number of slips and producing a formed film, but at this time, the film that has fallen off becomes a paste or a powder of a powder, such as a powder, which contaminates the plating solution, and has The occurrence of nodule is equal to the problem of adverse effects of the film formation surface. In the field of printed circuit boards, the soluble anode method using copper is prevalent. In the field of module substrates in the emerging field, the demand for micronization is more stringent, so the problem of sliding particles is a problem that cannot be ignored. Therefore, in such fields, it is required to change from an insoluble anode method to an insoluble anode method which cannot form a black film. || However, in the general insoluble anode method, even if the copper in the plating solution is consumed, the copper ion monomer cannot be replenished, and the additive is decomposed or deteriorated due to the strong oxidation reaction generated by the anode, so that there is a long-term stabilization operation. It is impossible. In order to solve such a problem, for example, it is proposed to provide a storage device for accommodating a storage material of a copper material in a dissolution tank containing a trivalent iron ion solution (for example, Patent Document 1). According to the manufacturing apparatus described in Patent Document 1, the oxidation of the anode Q copper material is suppressed, and copper ions can be supplied to the solution, and the insoluble anode method can be used for a long period of time. Therefore, in industrial operations, not only a dilute sulfuric acid aqueous solution having high-purity copper ions but also a high-purity sulfuric acid 'copper aqueous solution or an iron sulfate-containing copper sulfate aqueous solution is required. In addition, in the field of semiconductor devices, the circuit material of the multilayer circuit of the high-end product is converted from A1 to Cu, and the circuit formation step is also performed by the conventional RIE method (Reactive Ion Etching). Gradually converted to the dual damascene method, but in the copper double damascene step used now, 'the copper silicate bath is still dominated by the copper silicate bath step-5-200934894. . However, in the copper sulphate bath-soluble anode method, the purity or soundness of the membrane quality is not sufficient, and the application of the copper sulfate bath insoluble anode method in the production apparatus described in Patent Document 1 or the gold plating bath and copper ion generation are required. High purity of materials, etc.

另外,因爲封裝技術之多樣化,於凸塊(bump )結構 * 中等採用銅接線柱(post ),另外,檢討適用銅於MEMS 0 (微機電系統)領域之結構中等,於微細鑛金領域中銅的 採用逐漸擴大,因此,鍍金浴、供給及發生銅離子之材料 之高純度化等之要求升高。 有鑑於如上述要求,爲使有效率地產生銅離子,得到 雜質少之硫酸銅,以氫離子交換膜區劃離子產生槽成陽極 室及陰極室,於上述陰極室,自陰極附近釋出氫氣,並且 於上述陽極室中,由導體籠及原料銅所形成之陽極,溶出 銅離子於上述陽極室內之組成之製造方法及製造裝置(例 〇 如專利文獻2)。 [專利文獻1]特開2002 - 206 1 99號公報 [專利文獻2]特開2003— 328198號公報 【發明內容】 發明之揭示 發明所欲解決之課題 依據專利文獻2記載之製造方法及製造裝置,由上述 構成,可容易產生銅離子,可安定地得到硫酸銅。 -6- 200934894 然而,專利文獻2記載之製造方法及製造裝置,由鈦 等所形成之導體籠所放入之原料銅,銅離子溶出於稀硫酸 水溶液之組成,因電阻增加等’銅離子變得不易有效率地 溶於水溶液,並且自導體籠素材溶出雜質,即使少量,亦 有使硫酸銅水溶液之純度降低之虞。 介由鈦等所形成之導體籠溶解原料銅時,因導體籠素 * 材本身之低導電度,不能避免電阻上升,並且亦自籠本身 g 發生漏電流於電解液。另外,原料銅本身的通電亦成爲與 籠材之接觸通電,在此亦發生接觸電阻,與直接通電於板 片之裝置等相比較,電阻變大,發生焦耳熱,能量被消耗 而變得無效率,電力消耗變高等之缺點。另外,籠內所收 納之銅材料片係因爲宏觀上不具有作爲電極之均勻面,所 以成爲不均勻電流分佈,不安定。此結果係使電解效率降 低,生產效率降低。 另外,專利文獻2中,爲形成含有特定範圍之銅份之 0 硫酸銅水溶液作爲電鏟浴基底液製品,加熱乾燥已產生的 硫酸銅水溶液,使銅濃度成爲物理上一定範圍內之五水合 ' 鹽後,計算而求出必須添加量,以稀硫酸水溶液溶解該 ' 鹽,形成電鍍浴基底液之步驟係必要的,所以有產生溶液 後之各步驟中,增加污染的機會,使製品之純度降低,並 且製造成本上升之問題。 本發明係有鑑於上述情況所實施者,提供有效率地溶 出銅離子,可以高製造效率得到高純度硫酸銅水溶液或含 硫酸鐵之硫酸銅水溶液之高純度硫酸銅水溶液或含硫酸鐵 200934894 之硫酸銅水溶液的製造方法及製造裝置、以及高純度硫酸 銅水溶液或含硫酸鐵之硫酸銅水溶液爲目的。 課題之解決手段 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造方法係以氫離子交換膜區劃離子產生槽成陽極 * 室及陰極室,於上述陰極室,自陰極表面釋出氫氣,並且 $ 於供給稀硫酸水溶液或稀硫酸鐵水溶液之上述陽極室中, 自純銅銅板、或6N以上之高純度銅板所形成之陽極,溶 出銅離子於上述陽極室內,於上述陽極室內,產生硫酸銅 水溶液或含硫酸鐵之硫酸銅水溶液。 依據上述組成之製造方法,因爲使自純銅銅板、或 6N ( 99.9999% )以上之高純度銅板直接溶出銅離子於稀硫 酸水溶液或稀硫酸鐵水溶液,所以溶出效率升高。所謂純 銅銅板係指具有4N ( 99.99% )純度以上之組成之銅板。 Q 另外,對陽極表面給予電解液(稀硫酸水溶液或稀硫酸鐵 水溶液)之攪拌流時,因界面的氧化及擴散活性化,所以 " 銅離子溶出時,可使陽極表面平坦地腐蝕(Erosion)。另 ' 外,藉由使用純銅銅板、或6N以上之高純度銅板於陽極 時,因陽極表面之鈍態化耐性升高,可使用外加電流比使 用一般4N( 99.99%)程度的銅板所形成之電極時爲更高 電流,所以更加提升銅離子對稀硫酸水溶液或稀硫酸鐵水 溶液之溶出效率。藉此可產生高品質,並且純度特別高之 硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液。 200934894 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造方法係於上述離子產生槽,上述陽極室及上述 陰極室之容積區劃比率及電極間比率範圍爲4: 3〜5: 1 之組成。 另外’本發明之高純度硫酸銅水溶液或含硫酸鐵之硫 酸銅水溶液的製造方法係於上述離子產生槽,上述陽極室 及上述陰極室之容積區劃比率及電極間比率爲2: 1。 0 若依據上述組成之製造方法,藉由成爲陰極室容積小 於陽極室容積之容積區劃比率,可減低陰極室側之電解液 量’並且因通電距離縮短而電阻減低。藉此,即使減低對 電極之外加電壓,仍可效率良好地溶出銅離子,並且提高 對電極之外加電壓時,可效率更良好地溶出銅離子。 另外,銅離子所溶出之陽極室之容量比陰極室大,所 以硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液之製造量係比 陰極室液量大。 G 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造方法係具備取出上述陽極室內之水溶液之水溶 液取水步驟、依據該水溶液取水步驟,測定自上述陽極室 ' 內所取出之水溶液之銅離子濃度之濃度測定步驟、及將該 濃度測定步驟中銅濃度經測定之水溶液,放回上述陽極室 內之水溶液回流步驟,基於上述濃度測定步驟中之銅離子 濃度之測定値,控制對上述陽極及陰極之外加電壓、及/ 或外加電流。 依據上述組成之製造方法,因爲即時(Real_Time ) 200934894 直接測定陽極室內之水溶液之銅離子濃度’所以不需要將 產生後的水溶液加熱乾燥,製作成爲製品之建浴基底液之 建浴用鹽等之步驟。另外,因爲濃度測定所使用之水溶液 直接送回陽極室,所以不使水溶液量耗損。 另外,基於銅離子濃度之測定値,可控制對各電極之 外加電壓或電流,使銅離子溶出成爲最適合狀態’所以於 ' 維持高效率之最適合狀態,可產生硫酸銅水溶液或含硫酸 $ 鐵之硫酸銅水溶液。 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造裝置係具備離子產生槽、區劃該離子產生槽內 部成陽極室及陰極室之氫離子交換膜、上述陰極室內所設 有之經通電而自表面釋出氫氣之陰極、供給稀硫酸水溶液 或稀硫酸鐵水溶液之上述陽極室所設有之經通電而溶出銅 離子於上述陽極室內之由純銅銅板、或6N以上之高純度 銅板所形成之陽極而成。In addition, due to the diversification of packaging technology, copper posts (post) are used in the bump structure*. In addition, the review is applicable to the structure of copper in the field of MEMS 0 (Micro-Electro-Mechanical Systems), in the field of fine mineral gold. The use of copper is gradually increasing, and therefore, the demand for gold plating bath, supply, and high purity of a material that generates copper ions is increased. In view of the above requirements, in order to efficiently generate copper ions, copper sulfate having a small amount of impurities is obtained, and a hydrogen ion exchange membrane partitions ions to form a tank into an anode chamber and a cathode chamber, and in the cathode chamber, hydrogen gas is released from the vicinity of the cathode. Further, in the anode chamber, a cathode formed of a conductor cage and a raw material copper, and a method for producing a composition in which copper ions are eluted in the anode chamber (for example, Patent Document 2). [Problem to be Solved by the Invention] The manufacturing method and manufacturing apparatus described in Patent Document 2 are based on the problem of the invention to be solved by the above-mentioned Japanese Patent Laid-Open Publication No. JP-A-2003- No. According to the above configuration, copper ions can be easily generated, and copper sulfate can be obtained stably. -6-200934894 However, in the manufacturing method and manufacturing apparatus described in Patent Document 2, the raw material copper contained in the conductor cage formed of titanium or the like is dissolved in the composition of the dilute sulfuric acid aqueous solution, and the copper ion is changed due to an increase in electric resistance. It is not easy to dissolve in an aqueous solution efficiently, and impurities are eluted from the conductor cage material. Even in a small amount, the purity of the aqueous copper sulfate solution is lowered. When the raw material copper is dissolved in a conductor cage formed of titanium or the like, the resistance of the conductor itself cannot be prevented due to the low electrical conductivity of the material, and leakage current is generated from the cage itself. In addition, the electric current of the raw material copper itself is also energized in contact with the cage material, and the contact resistance also occurs here. As compared with the device directly energized to the plate, the electric resistance is increased, Joule heat is generated, and energy is consumed and becomes no. The disadvantages of efficiency, high power consumption, etc. In addition, since the copper material sheet received in the cage does not have a uniform surface as an electrode on a macroscopic scale, it is uneven current distribution and is unstable. This result is that the electrolysis efficiency is lowered and the production efficiency is lowered. Further, in Patent Document 2, in order to form a copper sulfate aqueous solution containing a specific range of copper as an electric scoop bath base liquid product, the generated copper sulfate aqueous solution is heated and dried to make the copper concentration into a physically limited range of pentahydrate'. After the salt is calculated, it is necessary to calculate the required amount, and it is necessary to dissolve the 'salt in a dilute sulfuric acid aqueous solution to form a plating bath base liquid. Therefore, in each step after the solution is generated, the chance of contamination is increased, and the purity of the product is made. Reduced, and the problem of rising manufacturing costs. The present invention provides a high-purity copper sulfate aqueous solution or a high-purity copper sulfate aqueous solution containing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution or a sulfuric acid containing iron sulfate 200934894, which can efficiently obtain copper ions efficiently in view of the above circumstances. A method for producing a copper aqueous solution, a production apparatus, and a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution are used. The method for producing the high-purity copper sulfate aqueous solution or the iron sulfate-containing copper sulfate aqueous solution of the present invention is characterized in that the hydrogen ion exchange membrane partitions the ion generating tank into an anode* chamber and a cathode chamber, and the cathode chamber is released from the cathode surface. And extracting copper ions into the anode chamber in the anode chamber, and extracting copper ions from the anode formed by the pure copper copper plate or the high-purity copper plate of 6N or more. An aqueous solution of copper sulfate or an aqueous solution of copper sulfate containing iron sulfate is produced. According to the manufacturing method of the above composition, since the copper ion is directly eluted from the pure copper copper plate or the high-purity copper plate of 6N (99.9999%) or more in the dilute sulfuric acid aqueous solution or the dilute aqueous iron sulfate solution, the elution efficiency is increased. The so-called pure copper copper plate refers to a copper plate having a composition of 4N (99.99%) or more. Q In addition, when the stirring flow of the electrolyte (dilute sulfuric acid aqueous solution or dilute aqueous iron sulfate solution) is applied to the surface of the anode, the oxidation and diffusion of the interface are activated, so that the copper surface can be flatly corroded when the copper ions are eluted (Erosion ). In addition, by using a pure copper copper plate or a high-purity copper plate of 6N or more at the anode, the passivation resistance of the anode surface is increased, and the applied current can be formed by using a copper plate of a general 4N (99.99%) degree. The electrode has a higher current, so the dissolution efficiency of the copper ion to the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution is further improved. Thereby, an aqueous solution of copper sulfate having high quality and particularly high purity or an aqueous solution of copper sulfate containing iron sulfate can be produced. 200934894 The method for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention is the ion generating tank, wherein the volume division ratio and the inter-electrode ratio of the anode chamber and the cathode chamber are in a range of 4:3 to 5: The composition of 1. Further, the method for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention is the ion generating tank, and the volume division ratio and the interelectrode ratio of the anode chamber and the cathode chamber are 2:1. According to the manufacturing method of the above composition, by making the volume ratio of the cathode chamber smaller than the volume of the anode chamber, the amount of the electrolyte on the cathode chamber side can be reduced and the electric resistance can be shortened due to the shortening of the energization distance. Thereby, even if the voltage is applied to the electrode, the copper ions can be efficiently eluted, and when the voltage is applied to the counter electrode, the copper ions can be more efficiently eluted. Further, the capacity of the anode chamber in which copper ions are eluted is larger than that in the cathode chamber, so that the production amount of the aqueous copper sulfate solution or the aqueous solution of copper sulfate containing iron sulfate is larger than that of the cathode chamber. G. The method for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention includes a water extraction step of taking out an aqueous solution in the anode chamber, and a water extraction step according to the aqueous solution, and measuring the aqueous solution taken out from the anode chamber The concentration measurement step of the copper ion concentration and the aqueous solution having the copper concentration measured in the concentration measurement step are returned to the aqueous solution reflux step in the anode chamber, and the measurement is based on the measurement of the copper ion concentration in the concentration measurement step. A voltage, and/or an applied current is applied to the anode and cathode. According to the manufacturing method of the above composition, since the copper ion concentration of the aqueous solution in the anode chamber is directly measured by Real_Time 200934894, it is not necessary to heat and dry the produced aqueous solution to prepare a bath salt for the base bath of the product. . Further, since the aqueous solution used for the concentration measurement is directly returned to the anode chamber, the amount of the aqueous solution is not depleted. In addition, based on the measurement of the copper ion concentration, it is possible to control the application of a voltage or a current to each electrode to dissolve the copper ions to the most suitable state. Therefore, in the most suitable state for maintaining high efficiency, an aqueous solution of copper sulfate or sulfuric acid can be produced. Aqueous copper sulfate solution of iron. The apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention includes an ion generating tank, a hydrogen ion exchange membrane that partitions the inside of the ion generating tank into an anode chamber and a cathode chamber, and the cathode chamber. a pure copper copper plate or a high-purity copper plate of 6N or more which is provided in the anode chamber by electrification to discharge copper ions from the cathode which is supplied with hydrogen gas from the surface and supplied with a dilute sulfuric acid aqueous solution or a dilute aqueous solution of iron sulfate. The formed anode is formed.

❹ 依據上述組成之製造裝置,因爲自純銅銅板、或6N 以上之高純度銅板,銅離子直接溶出於稀硫酸水溶液或稀 硫酸鐵水溶液,所以溶出效率升高。另外,對陽極表面給 ' 予電解液之攪拌流時,因界面的氧化及擴散活性化,所以 銅離子溶出時,可使陽極表面平坦地腐蝕(Erosion)。另 外,藉由使用6N以上之高純度銅板於陽極時,因陽極表 面難以鈍態化,可使外加電流爲高電流,所以更加提升銅 離子對稀硫酸水溶液或稀硫酸鐵水溶液之溶出效率。藉此 可產生筒品質’並且純度高之硫酸銅水溶液或含硫酸鐵之 -10- 200934894 硫酸銅水溶液。 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造裝置係具有取出上述陽極室內之水溶液之水溶 液取水手段、依據該水溶液取水手段,測定自上述陽極室 內所取出之水溶液之銅離子濃度之濃度測定手段、及將該 濃度測定手段中銅濃度經測定之水溶液,放回上述陽極室 ' 內之水溶液回流手段,具備基於上述濃度測定手段中銅離 & 子濃度之測定値,控制對上述陽極及陰極之外加電壓、及 /或外加電流之濃度控制手段。 依據上述組成之製造裝置,因爲即時(Real-Time ) 直接測定陽極室內之水溶液之銅離子濃度,所以不需要將 產生後之水溶液加熱乾燥,製作成爲製品之建浴基底液之 建浴用鹽等之步驟。另外,因爲濃度測定所使用之水溶液 直接放回陽極室,所以不使水溶液量耗損。 另外,基於銅離子濃度之測定値,可控制對各電極之 Q 外加電壓或電流,使銅離子溶出成爲最適合狀態,所以於 維持高效率之最適合狀態,可產生硫酸銅水溶液或含硫酸 * 鐵之硫酸銅水溶液。 * 本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造裝置係可於上述離子產生槽,形成上述陽極室 及上述陰極室之容積區劃比率及電極間比率範圍爲4: 3〜 5 : 1之組成。 另外,本發明之高純度硫酸銅水溶液或含硫酸鐵之硫 酸銅水溶液的製造裝置係可於上述離子產生槽,形成上述 -11 - 200934894 陽極室及上述陰極室之容積區劃比率及電極間 之組成。 若依據上述構成之裝置,藉由成爲陰極室 極室容積之容積區劃比率,可減低陰極室側之 並且,因通電距離縮短而電阻減低,即使減低 加電壓,仍可效率良好地溶出銅離子,並且提 ' 外加電壓時,可效率更良好地溶出銅離子。 & 另外,銅離子所溶出之陽極室之容量比陰 以硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液之 陰極室液量大。 本發明之高純度硫酸銅水溶液或含硫酸鐵 溶液係以上述製造方法所製造。 另外,高純度硫酸銅水溶液或含硫酸鐵之 液係以上述製造裝置所製造。 本發明之高純度硫酸銅水溶液或含硫酸鐵 φ 溶液係由上述製造方法、或以製造裝置所製造 品質且高純度之鍍金浴基底液製品。 本發明之高純度硫酸銅水溶液或含硫酸鐵 * 溶液之製造方法及製造裝置係使用純銅銅板、 之高純度銅板所形成之板狀陽極,電阻少,可 壓,不進行特別操作,有提高陽極室中之溶存 之趨勢,所以結果係氧與游離氫之再鍵結,亦 率地產生水,電解液之濃縮作用小。 另外,因爲陽極之有效電解面積大致一定 :匕率爲2 : 1 容積小於陽 電解液量。 對電極之外 高對電極之 極室大,所 製造量係比 之硫酸銅水 硫酸銅水溶 之硫酸銅水 ,可形成高 之硫酸銅水 或6N以上 壓低電解電 氧量至極限 即,可有效 ’稀硫酸水 -12- 200934894 溶液或稀硫酸鐵水溶液中之水份減少量的變動少,有效地 管理水溶液中之硫酸離子。 另外,陽極界面中之氧化性高,擴散亦快速,所以 Cu2 +離子的產生或游離降低,可延緩陽極表面產生鈍態化 層,可減低因岐化反應之銅粉產生。 . 發明之功效 $ 依據本發明之高純度硫酸銅水溶液或含硫酸鐵之硫酸 銅水溶液之製造方法及製造裝置,由上述組成及作用,可 高製造效率地產生高品質,且純度高之硫酸銅水溶液或含 硫酸鐵之硫酸銅水溶液,並且可由減少步驟次數而減低混 入雜質之機會,可同時達成提升品質、縮短產生時間及成 本損耗。 用以實施發明之最佳型態 φ 以下係關於高純度硫酸銅水溶液或含硫酸鐵之硫酸銅 水溶液的製造方法及製造裝置之實施型態,參考圖式下進 * 行說明。 ' 本實施型態之高純度硫酸銅水溶液或含硫酸鐵之硫酸 銅水溶液的製造方法係使用圖1〜3中任一種所示之製造 裝置’可製造硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液。 [第1實施型態] 以下係關於有關本發明之高純度硫酸銅水溶液或含硫 -13- 200934894 酸鐵之硫酸銅水溶液的製造方法及製造裝置之第1實施型 態,參考圖1進行說明。 「硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液的製造裝置」 本實施型態之硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造裝置(以下簡稱爲製造裝置)1係具備離子產生 槽2、區劃該離子產生槽2內部成陽極室21及陰極室22 之氫離子交換膜23、該陰極室22內所設有之經通電而自 表面釋出氫氣之陰極24、供給稀硫酸水溶液或稀硫酸鐵水 溶液之陽極室21、經通電而溶出銅離子於陽極室21內之 由純銅銅板、或6N ( 99.9999% )以上之高純度銅板所形 成之陽極25之槪略組成。 關於本實施型態之製造裝置1之組成係詳細地說明如 下。 離子產生槽2係上方有開口的箱狀,於內部貯存規定 的稀硫酸水溶液或稀硫酸鐵水溶液。另外,離子產生槽2 係於後述陽極室21之位置,於底部附近之側壁連接圖式 省略的配管,可送出陽極21所產生的含有銅離子之稀硫 酸水溶液或稀硫酸鐵水溶液於外部。 本實施型態中,作爲離子產生槽2所貯存之稀硫酸水 溶液,可使用例如30〜220g/l (電離度爲1之〇·9〜 2.2N )程度之稀硫酸水溶液H2S04、或於其中含有2價鐵 離子Fe2+、或3價鐵離子Fe3 +者。 氫離子交換膜23係該端部分別密合連接於離子產生 -14- 200934894 槽2之互向側壁及底部,分離離子產生槽2成陽極室21 及陰極室22,圖1表示的例係垂設於離子產生槽2之略中 央附近。 氫離子交換膜23係選擇性地透過氳離子H+,作爲如 半透膜之運作者,雖透過水分子及氫離子H+,但不透過 鐵離子Fe2+、Fe3 +或後述之銅離子Cu2 +等之金屬離子、及 硫酸離子S042_等之負離子。 0 另外,氫離子交換膜23係可選擇地透過氫離子H +者 即可,可使用市售之陽離子樹脂、氫離子選擇透過膜等。 陽極室21內,設有陽極25。 陽極25係連接於直流電流供給裝置(參考圖3符號 40)之正極側之板狀電極,於圖示例中,於陽極室21 內,配置與氫離子交換膜23成對向之側壁附近(圖1的 左側)。 本發明之陽極25係由純銅銅板、或6N以上之高純度 〇 銅板所形成,溶出銅離子Cu2 +於該陽極室21內所貯存之 稀硫酸水溶液或稀硫酸鐵水溶液。作爲陽極25係可適當 選擇例如6N8 ( 99.99998%)高純度銅板等使用。 " 陽極25係如圖示例,以形成板狀爲宜。 藉由純銅銅板、或6N以上之高純度銅板所形成之板 狀電極作爲陽極25,可有效率地溶出銅離子Cu2 +於稀硫 酸鐵水溶液。尤其藉由使用6N以上之高純度銅板作爲陽 極,因陽極表面難以鈍態化,可使外加電流成高電流,所 以更提升銅離子對硫酸鐵溶液之溶出效率。另外,對陽極 -15- 200934894 25表面給予電解液(稀硫酸水溶液或稀硫酸鐵水溶液)之 攪拌流時,因界面的氧化及擴散活性化,所以銅離子溶出 時,可使陽極表面平坦地腐蝕(Erosion ),可防止陽極 25於稀硫酸水溶液或稀硫酸鐵水溶液之液面附近優先溶 解。 另外,使用純度未滿6N之銅板作爲陽極25時,即使 ' 外加電解電流爲低電流,因銅中的雜質,陽極表面快速鈍 $ 態化,並且有難以效率良好地使銅離子Cu2 +溶出於稀硫酸 鐵水溶液之虞。 爲提高銅離子之溶出效率,陽極25之形狀及尺寸, 以儘可能使表面積大之形狀及尺寸爲宜。另外,陽極25 之形狀及尺寸係考慮離子產生槽2及陽極室21之容積或 形狀、製造效率等,可適當決定。 藉由使用本發明之陽極25,於陽極室21中,可產生 高品質且純度高之硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 ❹ 液。 於陰極室22內設有陰極24。 ' 陰極24係連接於未圖示之直流電流供給裝置之負極 * 側之電極’於圖示例中形成板狀,於陰極室22內,配置 與氫離子交換膜23成對向之側壁附近(圖1的右側)。 陰極24之形狀及尺寸,爲提高離子產生槽2內之反 應性,以儘可能使表面積大之形狀及尺寸爲宜。 另外,作爲陰極24之材質係與稀硫酸水溶液或稀硫 酸鐵水溶液之反應性低者,使用導電率優異,而且對氫之 -16- 200934894 脆化反應性低者即可,例如可使用純銅、銅合金、Pt、 Au、Ag等。另外,亦可使用於Cu、Ti、C、Pb材質等之 表面,被覆Ir、Ru等之鉑族氧化物結構之電極等。 [硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液的製造方法] 本實施型態之含有銅離子之硫酸銅水溶液或含硫酸鐵 ' 之硫酸銅水溶液的製造方法係以氫離子交換膜23區劃離 $ 子產生槽2成陽極室21及陰極室22,於該陰極室22,自 陰極24表面釋出氫氣,並且於供給稀硫酸水溶液或稀硫 酸鐵水溶液之陽極室21中,自純銅銅板、或6N之高純度 銅板所形成之陽極25,溶出銅離子於陽極室21內,於該 陽極室21內中,產生硫酸銅水溶液或含硫酸鐵之硫酸銅 水溶液之方法所槪略組成。 關於使用本實施型態之製造裝置1,硫酸銅水溶液或 含硫酸鐵之硫酸銅水溶液的製造方法,詳細說明如下。 Q 製造硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液時,首 先於離子產生槽2內部裝滿稀硫酸水溶液或稀硫酸鐵水溶 液。於此狀態中,於陰極室22內係存在水分子、硫酸離 * 子S042·、氫氧離子OH—、{鐵離子Fe2 + (Fe3 + )}、未解離硫 酸分子、及氫離子H+,於陽極室21內’存在水分子、硫 酸離子 S042_、氫離子 H+、氫氧離子 〇『、{鐵離子 Fe2 + (Fe3 + )}、未解離硫酸分子、及微量銅離子Cu2+。另 外,關於上述鐵離子Fe2 + (Fe3 + ),僅於使用稀硫酸鐵水溶 液時存在。 -17- 200934894 其次,由直流電流供給裝置(參考圖3之符號40)外 加2〜15 A/dm2電解電流於陽極25及陰極24。 若外加電解電流於各電極時,於陰極24之表面附 近,陰極室22中之氫離子H +係以氫氣H2釋出。此時, 爲保持陰極室22之電氣中性,正離子必須自陽極室21移 動至陰極室22,但因兩室21、22間以氫離子交換膜23區 ' 劃,所以僅陽極室21內部的氫離子H +移動至陰極室22。 $ 此時,銅離子Cu2 +及鐵離子Fe2 + (Fe3 + )係不能透過氫離子 交換膜23,成爲停留陽極室21內之狀態。 在此,外加於各電極之電解電壓之上限係依陽極室21 內之水溶液之攪拌條件、或溫度及濃度等而改變,但設定 於陽極25表面不發生氧氣泡程度之範圍即可。 接著,由上述作用,陽極室21之氫離子濃度減低。 亦即,陽極室2 1內之陽離子減低。 於陽極25,外加電解電流於構成該陽極25之純銅銅 Q 板、或6N高純度銅板。 於陽極室21內之陽離子(氫離子H+)減低之狀態, 藉由通電於陽極室21之陽極25,銅離子Cu2+自陽極25 ' 溶出於陽極室21內貯存之稀硫酸水溶液或稀硫酸鐵水溶 液,至通電前初期狀態之陽離子濃度,維持陽極室21內 之電氣中性。此時,陽極25所外加之電解電流的大小與 自陽極25溶出的銅離子Cu2 +量成比例。 於此狀態,藉由對陽極25及陰極24繼續通電’由陰 極連續地產生氫氣H2,連續地減低陰極室22中之氫離子 -18- 200934894 濃度。因此,藉由氫離子交換膜23,僅陽極室21內部的 氫離子H +連續移動至陰極室22’減低陽極室21內部的氫 離子H+,亦即陽離子濃度。 此結果係自純銅銅板、或6N以上之高純度銅板所形 成之板狀陽極25’連續地溶出高濃度之銅離子Cu2 +於陽 極室21所貯存之稀硫酸水溶液或稀硫酸鐵水溶液。 ' 藉此,可效率良好地製造高品質而且純度高之含有銅 & 離子Cu2 +之稀硫酸水溶液或稀硫酸鐵水溶液。 所製造之含有銅離子Cu2 +之稀硫酸水溶液或稀硫酸鐵 水溶液係亦可經由連接於陽極室21所設有之圖式省略之 配管取出,另外,亦可爲自陽極室21之開口處以批式取 出之方法。 另外,所製造之水溶液自陽極室21取出後,藉由供 給稀硫酸水溶液或稀硫酸鐵水溶液於離子產生槽2,可連 續地製造含有銅離子Cu2 +之稀硫酸水溶液或稀硫酸鐵水溶 Q 液。 如上述說明,依據本實施型態之硫酸銅水溶液或含硫 酸鐵之硫酸銅水溶液的製造方法及製造裝置,自陽極室21 ' 內所設置之純銅銅板、或6N高純度銅板所形成之陽極 25,使直接溶出銅離子於稀硫酸水溶液或稀硫酸鐵水溶 液,可效率良好地溶出高濃度銅離子。另外,對陽極25 表面給予電解液之攪拌流時,因界面的氧化及擴散活性 化,所以銅離子溶出時,可使陽極25表面平坦地腐蝕。 另外,藉由使用6N以上之高純度銅板於陽極時,因陽極 -19-❹ According to the manufacturing apparatus of the above composition, since copper ions are directly dissolved in a dilute sulfuric acid aqueous solution or a dilute aqueous solution of ferric sulfate from a pure copper copper plate or a high-purity copper plate of 6 N or more, the elution efficiency is increased. Further, when the agitating flow of the electrolyte is applied to the surface of the anode, the oxidation and diffusion of the interface are activated, so that when the copper ions are eluted, the surface of the anode can be flatly corroded (Erosion). Further, when a high-purity copper plate of 6 N or more is used for the anode, since the surface of the anode is difficult to passivate, the applied current can be made to be a high current, so that the elution efficiency of the copper ion to the dilute sulfuric acid aqueous solution or the dilute aqueous iron sulfate solution is further enhanced. Thereby, an aqueous solution of copper sulfate having a high quality of the cartridge and a high-purity aqueous solution of copper sulfate containing -10-200934894 can be produced. The apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention has an aqueous solution water extraction means for taking out an aqueous solution in the anode chamber, and a copper ion for measuring an aqueous solution taken out from the anode chamber according to the aqueous solution water extraction means. The concentration concentration measuring means and the aqueous solution reflux means for returning the aqueous solution having the copper concentration measured in the concentration measuring means back to the anode chamber are provided, and the measurement of the copper separation & concentration in the concentration measuring means is performed, and the control is performed. A concentration control means for applying a voltage and/or an applied current to the anode and the cathode. According to the manufacturing apparatus of the above composition, since the copper ion concentration of the aqueous solution in the anode chamber is directly measured by Real-Time, it is not necessary to heat and dry the aqueous solution after the production, and the salt for building the base bath of the product is prepared. step. Further, since the aqueous solution used for the concentration measurement is directly returned to the anode chamber, the amount of the aqueous solution is not depleted. In addition, based on the measurement of the copper ion concentration, it is possible to control the voltage or current applied to the Q of each electrode to make the copper ion elution optimal, so that an aqueous solution of copper sulfate or sulfuric acid can be produced in an optimum state for maintaining high efficiency. Aqueous copper sulfate solution of iron. * The apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention may be characterized in that the volume division ratio and the inter-electrode ratio of the anode chamber and the cathode chamber in the ion generation tank are 4: 3~ 5: The composition of 1 . Further, the apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention may be used in the ion generating tank to form a volume division ratio of the anode chamber and the cathode chamber of the above -11 - 200934894 and a composition between the electrodes. . According to the apparatus having the above configuration, by reducing the volume division ratio of the volume of the cathode chamber, the cathode chamber side can be reduced, and the electric resistance can be reduced by shortening the energization distance, and the copper ions can be efficiently eluted even if the voltage is applied. And when the voltage is applied, the copper ions can be eluted more efficiently. In addition, the capacity of the anode chamber in which copper ions are eluted is larger than that in the cathode chamber of the aqueous solution of copper sulfate or copper sulfate containing copper sulfate. The high-purity copper sulfate aqueous solution or the iron sulfate-containing solution of the present invention is produced by the above production method. Further, a high-purity copper sulfate aqueous solution or a ferric sulfate-containing liquid is produced by the above-described production apparatus. The high-purity copper sulfate aqueous solution or the iron sulfate-containing φ solution of the present invention is a gold-plated bath base liquid product of the above-described production method or high-purity quality produced by the production apparatus. The method for producing high-purity copper sulfate aqueous solution or the iron sulfate-containing solution of the present invention and the manufacturing apparatus thereof are plate-shaped anodes formed of a pure copper copper plate and a high-purity copper plate, which have low electric resistance, can be pressed, and do not perform special operations, and have an improved anode. The tendency of dissolution in the chamber is such that oxygen and free hydrogen are re-bonded, and water is also produced in a concentrated manner, and the concentration of the electrolyte is small. In addition, since the effective electrolytic area of the anode is substantially constant: the enthalpy ratio is 2:1 and the volume is smaller than the amount of cation electrolyte. The electrode chamber of the high counter electrode outside the electrode is large, and the amount produced is higher than that of copper sulfate water-soluble copper sulfate water, which can form high copper sulfate water or 6N or more to reduce the electrolytic oxygen amount to the limit, which is effective. 'Dilute sulfuric acid water-12- 200934894 The change in the amount of water reduction in the solution or the aqueous solution of dilute iron sulfate is small, and the sulfate ion in the aqueous solution is effectively managed. In addition, the oxidizing property in the anode interface is high, and the diffusion is also rapid. Therefore, the generation or liberation of Cu2 + ions can reduce the occurrence of a passivation layer on the surface of the anode, and can reduce the generation of copper powder due to the deuteration reaction. EFFECTS OF THE INVENTION According to the method and apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention, high-quality and high-purity copper sulfate can be produced with high productivity by the above-described composition and action. An aqueous solution or an aqueous solution of copper sulfate containing iron sulfate can reduce the chance of mixing impurities by reducing the number of steps, thereby achieving simultaneous improvement in quality, shortening of production time, and cost. The best mode for carrying out the invention φ The following describes an embodiment of a method for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution and a manufacturing apparatus thereof, which will be described with reference to the drawings. The method for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution according to the present embodiment can produce a copper sulfate aqueous solution or an aqueous solution containing copper sulfate or the like using the manufacturing apparatus shown in any one of Figs. . [First Embodiment] The following is a first embodiment of a method for producing a high-purity copper sulfate aqueous solution or a sulfuric acid-containing copper sulfate aqueous solution containing sulfur-13-200934894 in accordance with the present invention, and will be described with reference to Fig. 1 . . "Manufacturing Apparatus of Copper Sulfate Aqueous Solution or Ferric Sulfate-Containing Copper Sulfate Aqueous Solution" The apparatus for producing copper sulfate aqueous solution or iron sulfate-containing copper sulfate aqueous solution of the present embodiment (hereinafter simply referred to as a manufacturing apparatus) 1 is provided with an ion generating tank 2. The hydrogen ion exchange membrane 23 of the anode chamber 21 and the cathode chamber 22 is partitioned inside the ion generating tank 2, the cathode 24 provided in the cathode chamber 22, which is energized to release hydrogen gas from the surface, and the dilute sulfuric acid aqueous solution or dilute sulfuric acid is supplied. The anode chamber 21 of the iron aqueous solution is composed of a pure copper copper plate or an anode 25 formed of a high-purity copper plate of 6N (99.9999%) or more, which is eluted with copper ions in the anode chamber 21. The composition of the manufacturing apparatus 1 of the present embodiment will be described in detail below. The ion generating tank 2 has an open box shape above the inside, and stores a predetermined dilute sulfuric acid aqueous solution or a dilute iron sulfate aqueous solution therein. Further, the ion generating tank 2 is placed at a position of an anode chamber 21 to be described later, and a pipe omitted in the drawing is connected to a side wall near the bottom portion, and a dilute sulfuric acid aqueous solution containing copper ions or an aqueous solution of dilute ferric sulfate produced by the anode 21 can be sent outside. In the present embodiment, as the dilute sulfuric acid aqueous solution stored in the ion generating tank 2, for example, a dilute sulfuric acid aqueous solution H2S04 of a degree of 30 to 220 g/l (degree of ionization of 1 to 9 to 2.2 N) may be used or contained therein. Bivalent iron ion Fe2+, or trivalent iron ion Fe3 +. The hydrogen ion exchange membrane 23 is closely connected to the opposite side walls and the bottom of the ion generating-14-200934894 tank 2, and the ion generating tank 2 is separated into the anode chamber 21 and the cathode chamber 22, and the example shown in FIG. It is provided near the center of the ion generating tank 2. The hydrogen ion exchange membrane 23 selectively permeates the cesium ion H+. As a semi-permeable membrane, the water ion and the hydrogen ion H+ pass through the iron ion, but do not transmit the iron ion Fe2+, Fe3+ or the copper ion Cu2+ described later. Negative ions of metal ions and sulfate ions S042_. Further, the hydrogen ion exchange membrane 23 may selectively pass through the hydrogen ion H + , and a commercially available cationic resin or a hydrogen ion selective permeable membrane may be used. An anode 25 is provided in the anode chamber 21. The anode 25 is connected to a plate electrode on the positive electrode side of a direct current current supply device (refer to reference numeral 40 in Fig. 3). In the example of the drawing, in the anode chamber 21, a side wall opposite to the hydrogen ion exchange membrane 23 is disposed ( The left side of Figure 1). The anode 25 of the present invention is formed of a pure copper copper plate or a high purity bismuth copper plate of 6 N or more, and elutes a dilute sulfuric acid aqueous solution or a dilute iron sulfate aqueous solution stored in the anode chamber 21 with copper ions Cu2 + . As the anode 25, for example, a 6N8 (99.999998%) high-purity copper plate or the like can be suitably used. " The anode 25 is as shown in the figure, and it is preferable to form a plate shape. The plate-shaped electrode formed of a pure copper copper plate or a high-purity copper plate of 6N or more is used as the anode 25, and the copper ion Cu2+ is efficiently eluted into the aqueous solution of the dilute sulfuric acid. In particular, by using a high-purity copper plate of 6 N or more as an anode, since the surface of the anode is difficult to passivate, the applied current can be made to a high current, so that the dissolution efficiency of the copper ion to the iron sulfate solution is further enhanced. In addition, when the agitating flow of the electrolyte (dilute sulfuric acid aqueous solution or dilute iron sulfate aqueous solution) is applied to the surface of the anode-15-200934894 25, the oxidation and diffusion of the interface are activated, so that when the copper ions are eluted, the anode surface can be flatly corroded. (Erosion) prevents the anode 25 from being preferentially dissolved in the vicinity of the liquid surface of the dilute sulfuric acid aqueous solution or the dilute aqueous iron sulfate solution. Further, when a copper plate having a purity of less than 6 N is used as the anode 25, even if the external electrolytic current is a low current, the surface of the anode is rapidly blunt due to impurities in the copper, and it is difficult to efficiently dissolve the copper ion Cu2+. The solution of dilute aqueous solution of ferric sulfate. In order to improve the elution efficiency of copper ions, the shape and size of the anode 25 are preferably as large as possible in the shape and size of the surface area. Further, the shape and size of the anode 25 are appropriately determined in consideration of the volume or shape of the ion generating tank 2 and the anode chamber 21, the manufacturing efficiency, and the like. By using the anode 25 of the present invention, a high-quality and high-purity copper sulfate aqueous solution or a ferric sulfate-containing copper sulfate aqueous solution can be produced in the anode chamber 21. A cathode 24 is provided in the cathode chamber 22. The cathode 24 is connected to a negative electrode* electrode of a DC current supply device (not shown). The electrode is formed in a plate shape in the example of the drawing, and is disposed in the cathode chamber 22 in the vicinity of the side wall facing the hydrogen ion exchange membrane 23 ( The right side of Figure 1). The shape and size of the cathode 24 are preferably such that the shape and size of the surface area are as large as possible in order to increase the reactivity in the ion generating tank 2. In addition, as the material of the cathode 24, the reactivity with the dilute sulfuric acid aqueous solution or the dilute ferric sulfate aqueous solution is low, and the conductivity is excellent, and the embrittlement reactivity to hydrogen-16-200934894 may be low. For example, pure copper may be used. Copper alloy, Pt, Au, Ag, etc. Further, it may be applied to a surface of a Cu, Ti, C, or Pb material or the like, and may be coated with an electrode of a platinum group oxide structure such as Ir or Ru. [Manufacturing Method of Copper Sulfate Aqueous Solution or Ferric Sulfate-Containing Copper Sulfate Aqueous Solution] The method for producing a copper sulfate aqueous solution containing copper ions or a copper sulfate aqueous solution containing iron sulfate in the present embodiment is distinguished from the hydrogen ion exchange membrane 23 by $ The sub-groove 2 is formed into an anode chamber 21 and a cathode chamber 22, in which hydrogen gas is released from the surface of the cathode 24, and in an anode chamber 21 supplied with a dilute sulfuric acid aqueous solution or a dilute aqueous solution of ferric sulfate, from a pure copper copper plate, or 6N The anode 25 formed of the high-purity copper plate dissolves copper ions in the anode chamber 21, and in the anode chamber 21, a method of producing a copper sulfate aqueous solution or a copper sulfate aqueous solution containing iron sulfate is used. The production method of the copper sulfate aqueous solution or the iron sulfate-containing copper sulfate aqueous solution using the production apparatus 1 of the present embodiment will be described in detail below. Q When a copper sulfate aqueous solution or a copper sulfate aqueous solution containing iron sulfate is produced, the inside of the ion generating tank 2 is first filled with a dilute sulfuric acid aqueous solution or a dilute aqueous iron sulfate solution. In this state, water molecules, sulfuric acid ion S042·, hydroxide ion OH—, {iron ion Fe 2 + (Fe 3 + )}, undissociated sulfuric acid molecules, and hydrogen ions H+ are present in the cathode chamber 22, In the anode chamber 21, there are water molecules, sulfuric acid ions S042_, hydrogen ions H+, hydroxide ions, "iron ions Fe2 + (Fe3 + )}, undissociated sulfuric acid molecules, and trace copper ions Cu2+. Further, the above-mentioned iron ion Fe2 + (Fe3 + ) is present only when a dilute aqueous solution of ferric sulfate is used. -17- 200934894 Next, an electrolysis current of 2 to 15 A/dm2 is applied to the anode 25 and the cathode 24 by a direct current current supply means (refer to reference numeral 40 in Fig. 3). When an electrolysis current is applied to each electrode, near the surface of the cathode 24, the hydrogen ions H + in the cathode chamber 22 are released as hydrogen gas H2. At this time, in order to maintain the electrical neutrality of the cathode chamber 22, the positive ions must move from the anode chamber 21 to the cathode chamber 22, but since the hydrogen ion exchange membrane 23 is zoned between the two chambers 21, 22, only the anode chamber 21 is internally The hydrogen ions H + move to the cathode chamber 22. In this case, the copper ion Cu2 + and the iron ion Fe2 + (Fe3 + ) are not allowed to permeate through the hydrogen ion exchange membrane 23, and remain in the state in the anode chamber 21. Here, the upper limit of the electrolysis voltage applied to each electrode is changed depending on the stirring condition of the aqueous solution in the anode chamber 21, the temperature, the concentration, and the like, but may be set to a range in which the degree of oxygen bubbles does not occur on the surface of the anode 25. Next, by the above action, the hydrogen ion concentration of the anode chamber 21 is lowered. That is, the cations in the anode chamber 21 are reduced. At the anode 25, an electrolytic current is applied to a pure copper copper Q plate constituting the anode 25, or a 6N high purity copper plate. In a state where the cation (hydrogen ion H+) in the anode chamber 21 is lowered, the copper ion Cu2+ is dissolved from the anode 25' from the anode 25' to the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution stored in the anode chamber 21 by being energized at the anode 25 of the anode chamber 21. The cation concentration in the initial state before the energization maintains the electrical neutrality in the anode chamber 21. At this time, the magnitude of the electrolysis current applied to the anode 25 is proportional to the amount of copper ion Cu2+ eluted from the anode 25. In this state, by continuously energizing the anode 25 and the cathode 24, "hydrogen gas H2 is continuously generated from the cathode, and the concentration of hydrogen ions -18 - 200934894 in the cathode chamber 22 is continuously reduced. Therefore, by the hydrogen ion exchange membrane 23, only the hydrogen ions H + inside the anode chamber 21 are continuously moved to the cathode chamber 22' to reduce the hydrogen ion H+ inside the anode chamber 21, that is, the cation concentration. As a result, a plate-shaped anode 25' formed of a pure copper copper plate or a high-purity copper plate of 6 N or more continuously dissolves a high-concentration copper ion Cu2 + aqueous solution of dilute sulfuric acid or an aqueous solution of dilute ferric sulfate stored in the anode chamber 21. By this, it is possible to efficiently produce a high-quality and high-purity aqueous solution of dilute sulfuric acid containing copper & ionic Cu2+ or an aqueous solution of dilute ferric sulfate. The produced dilute sulfuric acid aqueous solution containing copper ion Cu2+ or the aqueous solution of dilute ferric sulfate may be taken out through a pipe which is omitted from the pattern provided in the anode chamber 21, or may be a batch from the opening of the anode chamber 21. The method of taking out. Further, after the produced aqueous solution is taken out from the anode chamber 21, the dilute sulfuric acid aqueous solution containing the copper ion Cu2 + or the dilute sulfuric acid aqueous solution Q liquid can be continuously produced by supplying the dilute sulfuric acid aqueous solution or the dilute aqueous sulfuric acid solution to the ion generating tank 2. . As described above, according to the copper sulphate aqueous solution or the ferric sulphate-containing copper sulphate aqueous solution manufacturing method and manufacturing apparatus of the present embodiment, the pure copper copper plate provided in the anode chamber 21' or the anode formed by the 6N high-purity copper plate is used. In order to directly dissolve copper ions in a dilute sulfuric acid aqueous solution or a dilute aqueous solution of ferric sulfate, high-concentration copper ions can be efficiently eluted. Further, when a stirring flow of the electrolytic solution is applied to the surface of the anode 25, oxidation and diffusion of the interface are activated, so that when the copper ions are eluted, the surface of the anode 25 can be flatly corroded. In addition, by using a high-purity copper plate of 6N or more at the anode, due to the anode -19-

200934894 25表面難以鈍態化,外加電流可爲高電济 銅離子對硫酸鐵水溶液之溶出效率。 藉此可以高製造效率產生高品質且斜 溶液或含硫酸鐵之硫酸銅水溶液,並且司 而減低混入雜質之機會,可同時達成提 本° 另外,將到達目標銅離子濃度之陽榧 液,藉由迅速地由圖式省略之配管送出於 電解液,可連續地進行製造硫酸銅水溶液 酸銅水溶液。 另外,藉由將連接於陽極室21所設 配管,連接於電鍍槽等,將製造之銅離子 鍍槽等規定位置迅速地供給。 [第2實施型態] 〇 以下係關於有關本發明之高純度硫酸 酸鐵之硫酸銅水溶液的製造方法及製造裝 態,參考圖2進行說明。 ' 另外,於下述說明中,賦予相同的符 型態相同的組成,並且省略該詳細說明。 「製造裝置」 本實施型態之硫酸銅水溶液或含硫_ 液的製造裝置10係具備離子產生槽2A、 :,所以更加提升 度高之硫酸銅水 由減少步驟次數 升品質及降低成 室21內之水溶 外部,補充新的 或含硫酸鐵之硫 有之圖式省略之 Cu2+,向上述電 銅水溶液或含硫 置之第2實施型 號於與第1實施 鐵之硫酸銅水溶 區劃該離子產生 -20- 200934894 槽2A內部成陽極室21A及陰極室22A之氫離子交換膜 23、陰極室22A內所設有之經通電而自表面釋出氫氣之陰 極24、供給硫酸鐵水溶液之陽極室21A內所設有之經通 電而溶出銅離子於陽極室21A內之由6N高純度銅板所形 成之陽極25,於離子產生槽2中,以藉由氫離子交換膜 23之比率,使陰極室22A之容積比陽極室21A之容積小 之容積區劃比率,並且陰極室22A側之極間比陽極室21A 側之極間短之電極間比率所槪略組成,如圖2所示之例, 陽極室21A及陰極室22A之容積區劃比率及電極間比率 爲 2 : 1。 本實施型態之製造裝置10係於離子產生槽2A中,以 藉由氫離子交換膜23之比率,使陰極室22A之容積比陽 極室21A之容積小之容積區劃比率,可減低陰極室22 A 側之電解液量,並且陰極室22A側之極間比陽極室2 1 A 側之極間短之電極間比率,與通常之1 : 1之槽設定相比 較,電極間距離縮短,可減低電阻。藉此,即使減低對各 電極24、25之外加電壓,仍可有效率地溶出銅離子。另 外,提高對各電極24、25之外加電壓,可效率更佳地溶 出銅離子。 另外,銅離子所溶出之陽極室21A之容量比陰極室 22A大,所以與陰極室液量相比較,可使硫酸銅水溶液或 含硫酸鐵之硫酸銅水溶液的製造量增大。 本實施型態之製造裝置10係於離子產生槽2A中,陽 極室21及陰極室22之容積區劃比率及電極間比率於1: 3 -21 - 200934894 〜5: 1之範圍可產生,作業效率上係以4: 3〜5: 1之範 圍爲宜。 陽極室21A及陰極室22 A之容積區劃比率及電極間 比率若比4: 3之陽極室21A側變小之比率時,因上述電 極間距離縮短而不能得到充分的提升製造效率等之效果。 陽極室21A及陰極室22A之容積區劃比率及電極間 ' 比率若比5 : 1之陽極室2 1A側變大之比率時,陰極室 || 22A內之氫離子量明顯增加,並且陰極室22A側之極室空 間變得過窄,因來自陰極24之反應氣泡等而有發生電解 液溢出或通電面異常減少及異常放電之虞。 另外,於離子產生槽2A中,陽極室21及陰極室22 之容積區劃比率及電極間比率,就上述製造效率等之觀 點’以2 : 1最好。 「製造方法」 〇 本實施型態之製造方法中,如上所述,使用製造裝置 10,藉由製造硫酸銅水溶液或含硫酸鐵之硫酸銅水溶液, 可減低陰極室22A之電解液量,並且可減低電極間電阻。 ' 藉此,即使減低對陽極25及陰極24之外加電壓,仍 可效率良好地溶出銅離子。另外,提高對陽極25及陰極 24之外加電壓,可更有效地溶出銅離子。另外,銅離子所 溶出之陽極室21A之容量比陰極室22A大,所以與陰極 室液量相比較,可使硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液的製造量增大。 -22- 200934894 [第3實施型態] 以下係關於有關本發明之高純度硫酸銅水溶液或含硫 酸鐵之硫酸銅水溶液的製造方法及製造裝置之第3實施型 態,參考圖3進行說明。 另外,於下述說明中,賦予相同的符號於與第1實施 ' 型態相同的組成,並且省略該詳細說明。 「製造裝置」 本實施型態之硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造裝置11係具備離子產生槽2、區劃該離子產生槽 2內部成陽極室21及陰極室22之氫離子交換膜23、陰極 室22內所設有之經通電而自表面釋出氫氣之陰極24、供 給硫酸鐵水溶液之陽極室21內所設有之經通電而溶出銅 離子於陽極室21內之由高純度銅板、或6N以上之高純度 〇 銅板所形成之陽極25之製造裝置,具有取出陽極室21內 之水溶液之水溶液取水手段3 1、依據該水溶液取水手段 3 1,測定自陽極室2 1內所取出之水溶液之銅離子濃度之 ' 濃度測定手段3 2、及將該濃度測定手段32中銅離子濃度 經測定之水溶液,放回上述陽極室21內之水溶液回流手 段33,具備基於上述濃度測定手段32中銅離子濃度之測 定値,控制由直流電流供給裝置40對陽極25及陰極24 所供給之直流電流之外加電壓、及/或外加電流之濃度控 制手段34所槪略組成。 -23- 200934894 水溶液取水手段31係於離子產生槽2中,於陽極室 21側所設置之取水口,汲取於陽極室21內所貯存、所產 生、或產生過程之稀硫酸水溶液或稀硫酸鐵水溶液,經由 取水配管,成爲用以送出於後述之濃度測定手段32之入 □。 水溶液取水手段3 1係如圖3所示例,形成管狀,設 ' 置成自陽極室21開口部份進入陽極室21內,但並不侷限 g 於此,例如可成爲連接於陽極室21側壁之配管組成,可 適當採用。 濃度測定手段3 2係測定由水溶液取水手段31自陽極 室2 1內取水,經由取水配管所送入之水溶液之銅離子濃 度、或鐵離子濃度者,例如由吸光度計等所形成。 本實施型態之濃度測定手段3 2係設有用以送出銅離 子濃度之測定數據於後述之濃度控制手段34之圖式省略 之連接部份。 ❿ 另外,濃度測定手段32亦可爲設有由例如顯示器等 所形成之測定數據顯示部份之組成。 水溶液回流手段3 3係將由水溶液取水手段31自陽極 ' 室2 1內取水,經由取水配管所送入於濃度測定手段3 2之 濃度經測定之水溶液,放回該陽極室21者,如圖3所示 例,於陽極室21開口部份之略上方配有返回口。 在此,可將陽極室21內所貯存之稀硫酸水溶液或稀 硫酸鐵水溶液之取水及回流用之圖式省略之唧筒手段,設 置於如上述稀硫酸水溶液或稀硫酸鐵水溶液通路中任一個 -24- 200934894 位置。 另外,啷筒手段亦可爲內藏於濃度測定手段 成。 另外,濃度控制手段34係基於濃度測定手長 銅離子濃度之測定,控制對陽極25及陰極24 壓、及/或外加電流者,設有自濃度測定手段32 濃度測定數據所輸入之圖式省略之輸入部份及送 號於後述之直流電流供給手段40用圖式省略 份。 另外,濃度控制手段34可爲設有例如顯示 成之銅離子濃度測定數據顯示部份之組成。 直流電流供給手段40係供給電解電流於陽ί 極24用之電源,具備用以控制供給各電極之電 壓値之圖式省略之控制調整手段。 另外,直流電流供給手段40不僅供給電解 極25及陰極24,亦可作爲例如對濃度測定手段 控制手段34、及圖式省略之唧筒手段之電流供 用。 使用本實施型態之製造裝置11,製造硫酸銅 含硫酸鐵之硫酸銅水溶液時之基本操作係與第1 說明之方法相同,進而,以例如下述說明之方法 離子濃度測定、及各電極24、25所供給之電解 制。 本實施型態之製造裝置11,於硫酸銅水溶液 3 2之組 之32中之 之外加電 之銅離子 出控制訊 之送出部 器等所形 I 25及陰 流値及電 電流於陽 3 2、濃度 給手段使 水溶液或 實施型態 ,進行銅 電流之控 或含硫酸 -25- 200934894 鐵之硫酸銅水溶液之產生過程,將離子產生槽2之陽極室 2 1所貯存之稀硫酸水溶液或稀硫酸鐵水溶液,以水溶液取 水手段3 1取水,經由取水配管,送入濃度測定手段32。 濃度測定手段3 2係測定稀硫酸水溶液或稀硫酸鐵水 溶液之銅離子濃度,對濃度控制手段3 4,送出此測定數 據,另外,濃度測定手段32中之銅離子濃度經測定結束 ' 之稀硫酸水溶液或稀硫酸鐵水溶液係經由水溶液回流手段 0 33,再次返回該陽極室21。 接著,濃度控制手段3 4係基於濃度測定手段3 2所送 出之銅離子濃度數據,產生中之稀硫酸水溶液或稀硫酸鐵 水溶液之銅離子濃度超過閾値時,對直流電流供給手段40 送出指示對陽極25及陰極24之外加電壓、及/或外加電 流停止之控制訊號,銅離子濃度低於閥値時,對直流電流 供給手段40送出指示對陽極25及陰極24之外加電壓、 及/或外加電流繼續之控制訊號。 Q 直流電流供給手段40係基於自濃度控制手段34所送 出之控制訊號,控制對陽極25及陰極24之外加電壓、及 /或外加電流。亦即,取水自陽極室21內之稀硫酸水溶液 或稀硫酸鐵水溶液中之銅離子濃度高時,補充電解液於陽 極室21A及陰極室21B,降低濃度、或停止外加電流於各 電極24、25。另外,自陽極室21內取水之稀硫酸水溶液 或稀硫酸鐵水溶液中之銅離子濃度低時,繼續外加電流於 各電極24、25。 藉由如此地控制外加電壓、及/或外加電流,本實施 -26- 200934894 型態之製造裝置11,產生中之稀硫酸水溶液或稀硫酸鐵水 溶液中之銅離子濃度高至目標値時,停止銅離子溶出。銅 離子濃度到達目標値時,已產生完畢之稀硫酸水溶液或稀 硫酸鐵水溶液係經由圖式省略之配管,自陽極室21取 出,或自陽極室21之開口部份取出。此時,如上所述, 藉由於濃度測定手段32、或濃度控制手段34,設有圖式 省略之測定數據表示部份、及感應部份之組成,作業者可 目視確認、或機械感應硫酸銅水溶液或含硫酸鐵之硫酸銅 水溶液產生完畢。因此,可將產生完畢之稀硫酸水溶液或 稀硫酸鐵水溶液,以手動或自動自陽極室21迅速取出, 立即可貯存下次產生用之新穎稀硫酸水溶液或稀硫酸鐵水 溶液於陽極室21內,提升製造效率。 另外,產生中之稀硫酸水溶液或稀硫酸鐵水溶液中之 銅離子濃度未升高時,將可繼續溶出銅離子,使銅離子濃 度達到目標値。 如上述說明,依據本實施型態之製造裝置11時,因 以即時(Real-Time)直接測定陽極室21內水溶液之銅離 子濃度、或鐵離子濃度,所以不需要如傳統之加熱乾燥產 生中之水溶液,製作建浴鹽等之步驟,可減少步驟及維持 品質。另外,濃度測定所使用之水溶液係不因分析變質, 直接放回陽極室2 1,水溶液不因分析而污染、損耗。 另外,因爲基於銅離子濃度之測定値,可控制對各電 極24、25之外加電壓或電流,使成爲最適合銅離子溶出 之狀態,所以於維持高效率之最適合狀態,可產生硫酸銅 -27- 200934894 水溶液或含硫酸鐵之硫酸銅水溶液’而且亦可達成作業上 自動化。 另外,本實施型態之製造裝置11,藉由於連接陽極室 21所設有之圖式省略之配管,設置電磁閥等之組成’稀硫 酸水溶液或稀硫酸鐵水溶液中之銅離子濃度到達目標値, 停止自直流電流供給手段40外加電解電流於陽極25及陰 ’ 極24後,上述電磁閥作爲開放狀態,供出產生完畢之稀 φ 硫酸水溶液或稀硫酸鐵水溶液於陽極室21外部。 藉此,可更加提升含有銅離子之稀硫酸水溶液或稀硫 酸鐵水溶液之製造效果。 【實施方式】 [實施例] 以下係表示實施例,更詳細地說明本發明之硫酸銅水 溶液或含硫酸鐵之硫酸銅水溶液的製造方法及製造裝置, Q 但本發明並非偈限於此實施例者。 本實施例中,製作如圖1〜3所示之製造裝置1 (試驗 例1 ) 、1 〇 (試驗例2) 、1 1 (試驗例3 ),產生含銅離子 ' 之稀硫酸鐵水溶液,進行試驗。 [製造裝置] 首先,使用壓克力板,製作如圖1及圖3所示之由容 積爲2L之陽極室21及陰極室22所形成之離子產生槽2 (試驗例1、3 )。 -28- 200934894200934894 25 The surface is difficult to passivate, and the applied current can be the dissolution efficiency of high-electrode copper ion to the aqueous solution of iron sulfate. Thereby, a high-quality and oblique solution or an aqueous solution of copper sulfate containing iron sulfate can be produced with high manufacturing efficiency, and the opportunity for mixing impurities can be reduced, and the present invention can be simultaneously obtained. In addition, the impotence solution reaching the target copper ion concentration can be borrowed. The electrolyte solution is quickly supplied from the piping omitted from the drawing, and the aqueous copper acid solution of the copper sulfate aqueous solution can be continuously produced. In addition, a pipe connected to the anode chamber 21 is connected to a plating tank or the like, and a predetermined position such as a copper ion plating tank to be produced is quickly supplied. [Second embodiment] The following is a description of a method for producing a copper sulfate aqueous solution of high-purity iron sulfate according to the present invention and a manufacturing apparatus thereof, which will be described with reference to Fig. 2 . In the following description, the same configurations are given to the same configurations, and the detailed description is omitted. "Manufacturing device" The copper sulfate aqueous solution or the sulfur-containing liquid production device 10 of the present embodiment includes the ion generating tanks 2A and 2, so that the copper sulfate water having a higher degree of lift is reduced in quality by the number of steps and the chamber 21 is lowered. The water-soluble outside is supplemented with Cu2+, which is omitted from the new or sulfuric acid-containing sulphur, and the second embodiment of the above-mentioned electro-copper aqueous solution or sulfur-containing solution is used to dissolve the ion in the water-soluble zone of the first embodiment of the copper sulphate. -20- 200934894 The hydrogen ion exchange membrane 23 in the anode chamber 21A and the cathode chamber 22A in the tank 2A, the cathode 24 in the cathode chamber 22A which is energized to release hydrogen gas from the surface, and the anode chamber 21A in which the ferric sulfate aqueous solution is supplied An anode 25 formed of a 6N high-purity copper plate which is supplied with copper ions in the anode chamber 21A by electric current, is provided in the ion generating tank 2, and the cathode chamber 22A is made by the ratio of the hydrogen ion exchange membrane 23 The volume ratio is smaller than the volume of the anode chamber 21A, and the ratio between the electrodes on the cathode chamber 22A side is shorter than the ratio between the electrodes on the anode chamber 21A side, as shown in Fig. 2, the anode chamber. 21A and Division ratio and the electrode chamber volume between the electrodes 22A of the ratio is 2: 1. The manufacturing apparatus 10 of the present embodiment is incorporated in the ion generating tank 2A so that the ratio of the volume of the cathode chamber 22A is smaller than the volume of the anode chamber 21A by the ratio of the hydrogen ion exchange membrane 23, and the cathode chamber 22 can be reduced. The amount of electrolyte on the A side, and the ratio of the electrodes between the poles on the cathode chamber 22A side to the poles on the anode side 2 1 A side is shorter than the usual 1:1 groove setting, and the distance between the electrodes is shortened, which can be reduced. resistance. Thereby, even if the voltage is applied to each of the electrodes 24 and 25, the copper ions can be efficiently eluted. Further, by applying a voltage to each of the electrodes 24 and 25, copper ions can be efficiently eluted. Further, since the capacity of the anode chamber 21A in which copper ions are eluted is larger than that in the cathode chamber 22A, the amount of production of the aqueous copper sulfate solution or the aqueous solution of copper sulfate containing copper sulfate can be increased as compared with the amount of the cathode chamber. The manufacturing apparatus 10 of the present embodiment is incorporated in the ion generating tank 2A, and the volume division ratio and the inter-electrode ratio of the anode chamber 21 and the cathode chamber 22 are generated in the range of 1:3 -21 - 200934894 to 5:1, and the work efficiency is obtained. The upper range is preferably 4:3~5:1. When the volume division ratio and the inter-electrode ratio of the anode chamber 21A and the cathode chamber 22A are smaller than the ratio of the anode chamber 21A side of 4:3, the effect of improving the production efficiency and the like cannot be obtained because the distance between the electrodes is shortened. When the volume division ratio of the anode chamber 21A and the cathode chamber 22A and the ratio between the electrodes are larger than the ratio of the anode chamber 2 1A side of 5:1, the amount of hydrogen ions in the cathode chamber || 22A is significantly increased, and the cathode chamber 22A The polar chamber space on the side is too narrow, and there is a possibility that the electrolyte overflows or the conduction surface abnormally decreases and the abnormal discharge occurs due to reaction bubbles or the like from the cathode 24. Further, in the ion generating tank 2A, the volume division ratio of the anode chamber 21 and the cathode chamber 22 and the ratio between the electrodes are preferably 2:1 in terms of the above-mentioned manufacturing efficiency and the like. "Manufacturing Method" In the manufacturing method of the present embodiment, as described above, by using the manufacturing apparatus 10, the amount of the electrolytic solution of the cathode chamber 22A can be reduced by producing an aqueous solution of copper sulfate or an aqueous solution of copper sulfate containing iron sulfate. Reduce the resistance between the electrodes. Thus, even if the voltage is applied to the anode 25 and the cathode 24, the copper ions can be efficiently eluted. Further, by applying a voltage to the anode 25 and the cathode 24, copper ions can be more efficiently eluted. Further, since the capacity of the anode chamber 21A in which copper ions are eluted is larger than that in the cathode chamber 22A, the amount of production of the aqueous copper sulfate solution or the aqueous solution of copper sulfate containing copper sulfate can be increased as compared with the amount of the cathode chamber. -22-200934894 [Third embodiment] The third embodiment of the method and apparatus for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the present invention will be described below with reference to Fig. 3 . In the following description, the same reference numerals are given to the same components as in the first embodiment, and the detailed description is omitted. "Manufacturing device" The apparatus for producing 11 of a copper sulfate aqueous solution or a copper sulfate aqueous solution containing iron sulfate according to the present embodiment includes an ion generating tank 2, and hydrogen ion exchange for arranging the anode chamber 21 and the cathode chamber 22 inside the ion generating tank 2 The membrane 23, the cathode 24 provided in the cathode chamber 22, and the cathode 24 which discharges hydrogen gas from the surface, and the anode chamber 21 supplied with the aqueous solution of ferric sulfate are energized to dissolve copper ions in the anode chamber 21. A manufacturing apparatus for an anode 25 formed of a purity copper plate or a high-purity copper-plated copper plate of 6 N or more, having an aqueous solution taking water 31 of an aqueous solution taken out in the anode chamber 21, and measuring from the anode chamber 2 1 according to the aqueous solution taking unit 31 The concentration measuring means 3 2 of the extracted copper ion concentration of the aqueous solution and the aqueous solution having the measured copper ion concentration in the concentration measuring means 32 are returned to the aqueous solution reflux means 33 in the anode chamber 21, and the concentration is measured based on the concentration. The measurement of the copper ion concentration in the means 32 controls the direct current supplied from the direct current supply device 40 to the anode 25 and the cathode 24 to apply a voltage, and/or Means for controlling the concentration of the applied current slightly Coming to 34 components. -23- 200934894 The aqueous solution water taking means 31 is in the ion generating tank 2, and the water inlet port provided on the anode chamber 21 side is taken from the dilute sulfuric acid aqueous solution or the dilute ferric sulfate which is stored, produced, or produced in the anode chamber 21. The aqueous solution is supplied to the concentration measuring means 32 to be described later via the water taking pipe. The aqueous solution water taking means 31 is exemplified in Fig. 3, and is formed into a tubular shape so as to be disposed from the opening portion of the anode chamber 21 into the anode chamber 21, but is not limited thereto, and may be connected to the side wall of the anode chamber 21, for example. The piping composition can be suitably used. The concentration measuring means 3 2 measures the copper ion concentration or the iron ion concentration of the aqueous solution fed from the anode chamber 2 1 by the aqueous solution taking means 31, and is formed, for example, by an absorbance meter or the like. The concentration measuring means 32 of the present embodiment is provided with a connection portion for omitting the measurement data of the copper ion concentration to the concentration control means 34 which will be described later. Further, the concentration measuring means 32 may be composed of a measurement data display portion formed of, for example, a display or the like. The aqueous solution reflux means 3 3 is obtained by taking the water from the anode ' chamber 2 1 by the aqueous solution taking means 31, and feeding it to the anode chamber 21 by the aqueous solution having the concentration measured by the concentration measuring means 3 2 through the water taking pipe, as shown in FIG. In the illustrated example, a return port is provided slightly above the open portion of the anode chamber 21. Here, the dilute sulfuric acid aqueous solution or the dilute ferric sulfate aqueous solution stored in the anode chamber 21 may be disposed in any one of the above-mentioned dilute sulfuric acid aqueous solution or dilute ferric sulfate aqueous solution passage. 24- 200934894 Location. In addition, the cartridge means may be built into the concentration measuring means. Further, the concentration control means 34 is based on the measurement of the concentration measurement of the copper ion concentration of the hand, and the control of the pressure applied to the anode 25 and the cathode 24, and/or the application of the current, is omitted from the pattern input from the concentration measuring means 32. The input portion and the direct current current supply means 40, which will be described later, are omitted in the drawings. Further, the concentration control means 34 may be provided with, for example, a display portion of the copper ion concentration measurement data displayed. The DC current supply means 40 is a power supply for supplying an electrolysis current to the anode 24, and includes a control adjustment means for controlling the voltage 供给 supplied to each electrode. Further, the DC current supply means 40 supplies not only the electrolytic electrode 25 and the cathode 24 but also the current for the concentration measuring means control means 34 and the squeezing means omitted. The basic operation system for producing a copper sulfate-containing copper sulfate-containing copper sulfate aqueous solution using the manufacturing apparatus 11 of the present embodiment is the same as the method described in the first aspect, and further, for example, the ion concentration measurement and the respective electrodes 24 are described below. 25 electrolytic systems supplied. In the manufacturing apparatus 11 of the present embodiment, the copper ion which is energized outside the group 32 of the copper sulfate aqueous solution 32 is outputted by the control unit, and the cathode current and the electric current are in the anode 3 2 . The concentration is given to the aqueous solution or the implementation mode, and the copper current is controlled or the sulfuric acid 25-200934894 iron-containing copper sulfate aqueous solution is produced, and the dilute sulfuric acid aqueous solution stored in the anode chamber 21 of the ion generating tank 2 is diluted or diluted. The aqueous solution of iron sulfate is taken up by the aqueous solution taking unit 31, and sent to the concentration measuring means 32 via the water taking pipe. The concentration measuring means 3 2 measures the copper ion concentration of the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution, and sends the measurement data to the concentration control means 34, and the copper ion concentration in the concentration measuring means 32 is measured to end the diluted sulfuric acid. The aqueous solution or the dilute aqueous solution of ferric sulfate is returned to the anode chamber 21 again via the aqueous solution reflux means 0 33. Next, the concentration control means 34 is based on the copper ion concentration data sent from the concentration measuring means 32, and when the copper ion concentration of the dilute sulfuric acid aqueous solution or the dilute ferric sulfate aqueous solution exceeds the threshold ,, the DC current supply means 40 sends an instruction pair. When the anode 25 and the cathode 24 are applied with a voltage, and/or a control signal for stopping the current, when the copper ion concentration is lower than the valve, the DC current supply means 40 sends an indication to the anode 25 and the cathode 24 to apply a voltage, and/or The current continues to control the signal. The Q DC current supply means 40 controls the application of a voltage and/or an applied current to the anode 25 and the cathode 24 based on the control signal sent from the concentration control means 34. That is, when the concentration of copper ions in the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution in the anode chamber 21 is high, the electrolyte is replenished in the anode chamber 21A and the cathode chamber 21B to lower the concentration or stop the application of current to the electrodes 24, 25. Further, when the concentration of copper ions in the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution from which the water is taken in the anode chamber 21 is low, the current is continuously applied to the respective electrodes 24 and 25. By controlling the applied voltage and/or the applied current in this manner, the manufacturing apparatus 11 of the present embodiment -26-200934894 stops when the concentration of copper ions in the aqueous solution of dilute sulfuric acid or the aqueous solution of dilute ferric sulfate is as high as the target enthalpy Copper ions are dissolved. When the copper ion concentration reaches the target enthalpy, the diluted aqueous solution of dilute sulfuric acid or the aqueous solution of dilute ferric sulphate is taken out from the anode chamber 21 or taken out from the opening portion of the anode chamber 21 via a piping omitted from the drawing. At this time, as described above, the concentration measuring means 32 or the concentration control means 34 is provided with the measurement data indicating portion and the sensing portion which are omitted from the drawing, and the operator can visually confirm or mechanically induce copper sulfate. An aqueous solution or an aqueous solution of copper sulfate containing iron sulfate is produced. Therefore, the diluted aqueous solution of dilute sulfuric acid or the aqueous solution of dilute ferric sulfate can be quickly taken out from the anode chamber 21 manually or automatically, and the fresh dilute sulfuric acid aqueous solution or the aqueous solution of dilute ferric sulfate for the next generation can be immediately stored in the anode chamber 21. Improve manufacturing efficiency. Further, when the concentration of copper ions in the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution which is produced is not increased, the copper ions can be further eluted so that the copper ion concentration reaches the target enthalpy. As described above, according to the manufacturing apparatus 11 of the present embodiment, since the copper ion concentration or the iron ion concentration of the aqueous solution in the anode chamber 21 is directly measured by Real-Time, it is not required to be heated as in the conventional heat drying. The aqueous solution, the steps of making the bath salt, etc., can reduce the steps and maintain the quality. In addition, the aqueous solution used for the concentration measurement is not directly deteriorated by analysis, and is directly returned to the anode chamber 2, and the aqueous solution is not contaminated or lost due to analysis. In addition, since the voltage or current is applied to each of the electrodes 24 and 25 based on the measurement of the copper ion concentration, the copper ion is most suitable for elution. Therefore, copper sulfate can be produced in an optimum state for maintaining high efficiency. 27- 200934894 Aqueous solution or aqueous solution of copper sulphate containing ferric sulphate' can also be automated in operation. Further, in the manufacturing apparatus 11 of the present embodiment, the copper ion concentration in the dilute sulfuric acid aqueous solution or the dilute iron sulfate aqueous solution is set to reach the target by the connection of the piping omitted from the pattern provided in the anode chamber 21. After the application of the electrolysis current to the anode 25 and the cathode electrode 24 from the DC current supply means 40, the solenoid valve is opened, and the produced dilute φ sulfuric acid aqueous solution or dilute iron sulfate aqueous solution is supplied outside the anode chamber 21. Thereby, the production effect of the dilute sulfuric acid aqueous solution containing copper ions or the aqueous solution of the dilute sulfuric acid can be further enhanced. [Embodiment] [Examples] Hereinafter, examples of the copper sulfate aqueous solution or the iron sulfate-containing copper sulfate aqueous solution of the present invention and a production apparatus thereof will be described in more detail, but the present invention is not limited to the embodiment. . In the present embodiment, the manufacturing apparatus 1 (test example 1), 1 〇 (test example 2), and 1 1 (test example 3) shown in Figs. 1 to 3 were produced, and a molten iron sulfate aqueous solution containing copper ions was produced. experimenting. [Manufacturing Apparatus] First, an ion generating tank 2 formed of an anode chamber 21 and a cathode chamber 22 having a volume of 2 L as shown in Figs. 1 and 3 was produced using an acrylic plate (Test Examples 1 and 3). -28- 200934894

另外,同樣地使用壓克力板,製作如圖2所示之容積 爲2L (電解液容積爲1〇〇 mmxlOO mmx200 mm)之陽極室 21A、及容積爲 1L(電解液容積爲 lOOmmxlOOmmxlOO mm )之陰極室 22A所形成之離子產生槽2A (試驗例 2 ) ° 另外,區劃陽極室及陰極室之氫離子交換膜係使用市 售之陽離子交換膜。 接著,作爲陽極25,使用6N以上(相當於6N8 :銅 純度爲99.99998%)之高純度銅所形成,大小爲100 mmx 200 mmx20 mm (接觸水面積:100 mmxlOO mm)之銅 板,如圖1〜3所示,於離子產生槽2、2A之陽極室21、 2 1 A內,配置於與氫離子交換膜23成對向之側壁側(圖1 〜3中左側)。 另外,作爲陰極 24,由相當 4N8 (銅純度爲 99.998%)之純銅所形成,大小爲100 mmx200 mmx20 mm (接觸水面積:100 mmxlOO mm)之板材,如圖1〜3所 示,於離子產生槽2、2A之陰極室22、22 A內,配置於 與氫離子交換膜23成對向之側壁側(圖1〜3中右側)之 組成,如圖1所示之製造裝置1(試驗例1:使用離子產 生槽2)、及如圖2所示之製造裝置1〇(試驗例2:使用 離子產生槽2A)。 另外,於使用上述離子產生槽2之製造裝置,如圖3 所示,配置鐵氟龍(註冊商標)管所形成之水溶液取水手 段31,插入該先端部份於陽極室21、21A內,由鐵氟龍 -29- 200934894 (註冊商標)管所形成之取水配管’連接內藏唧筒之 測定手段32 ( Atotech Japan股份有限公司製:銅、 子即時分析裝置)之入水側。於濃度測定手段32之 側,連接由鐵氟龍(註冊商標)管所形成之水溶液回 段33,配置該先端部份於陽極室2開口部份之略上方 成可放回銅離子濃度測定後之稀硫酸鐵水溶液於陽 2 1、2 1 A內之組成。 接著,連接濃度測定手段32之測定數據輸 (Output Port)於個人電腦(IBM 社製:ThinkPad) 成之濃度控制手段34,連接個人電腦(濃度控制 34)之外部通訊介面於直流電流供給手段40 (山本鍍 驗機社製:晶圓用精密鍍金電YPP— 15100)之外部 介面,形成如圖3所示之製造裝置1 1 (試驗例3 :使 子產生槽2 )。 φ [試驗例1] 於圖1所示之製造裝置1中,連接如圖3所示之 液取水手段3 1、濃度測定手段32、水溶液回流手段 ' 可即時測定銅離子濃度之組成。 接著,作爲電解液係使用添加特級試藥硫酸於電 爲18.2ΜΩ之超純水,S04量成180 g/L之稀硫酸 液’計量添加、溶解市售之高純度電解鐵成爲13 g/L 到稀硫酸鐵水溶液。接著,供給稀硫酸水溶液於各陽 21及陰極室22,使各貯存2L。 濃度 鐵離 出水 流手 ,形 極室 出埠 所形 手段 金試 通訊 用離 水溶 33 > 阻値 水溶 ,得 極室 -30- 200934894 另外,對陽極25及陰極24之電解電流係外加陰極24 側之電流密度成8.5 A/dm2,通電時間爲5小時。 [試驗例2] 於圖2所示之製造裝置10,連接如圖3所示之水溶液 取水手段3 1、濃度測定手段3 2、水溶液回流手段3 3,可 即時測定銅離子濃度之組成。 接著,作爲電解液係使用添加特級試藥硫酸於電阻値 爲18.2ΜΩ之超純水,使S〇4量成180 g/L,計量添加、 溶解市售之高純度電解鐵成爲13 g/L,產生的稀硫酸鐵水 溶液,分別供給稀硫酸水溶液,陽極室21A貯存2L,陰 極室22A貯存1 L。 另外,對陽極25及陰極24之電解電流係外加陰極24 側之電流密度成8.5 A/dm2,通電時間爲5小時。 上述試驗例1及試驗例2之評估結果係如圖4及表1 所示。 [表1] 電壓[mV] 試驗例1(6N 1:1槽) 試驗例2(6N 2:1槽) 差 最大(MAX.) 7,290 mV 5,500 mV 1,790 最小(MIN·) 6,610 mV 5,110 mV 1,500 (最大-最小差) 680 390 290 平均(AVE·) 6,838 mV 5,220 mV 1,619 如圖4的圖及表1所示,外加電解電流,使陰極24 -31 - 200934894 側之電流密度成8.5 A/dm2時,2:1槽(陽極21:陰極 11)之試驗例2與1: 1槽(陽極21:陰極21)之試驗例 1比較’顯示外加電壓低。以積算平均値比較此外加電壓 時’相對於試驗例1爲6.8V,試驗例2外加5.2V之低的 電壓即可,顯示電極間電阻低。 另外,如圖4的圖所示之電解電壓上升,通常積算外 加電壓愈高,陽極界面之鈍態化容易持續,上升曲線雖變 g 得陡峭,但使用6N以上之高純度銅板於陽極時,因耐電 流密度性變高,試驗例1及試驗例2皆描繪相同弧度的曲 線。 然而,若觀察外加電壓之最大値及最小値的差,相對 於試驗例1之680 mV之變動幅度,試驗例2爲390 mV, 2 : 1槽之試驗例2與1 : 1槽之試驗例1比較,顯示電壓 變動幅度變小、安定。認爲外加電壓愈低位愈安定,可延 長至鈍態化之電解時間,此以平均電壓値(Ave.) -最小 〇 電壓値(Min.)表現時,試驗例1係68 3 8 — 66 1 0 = 228, 試驗例2係522 0 - 5110=110。此時亦顯示2: 1槽之試驗 例2爲低位且安定。 ' 由上述結果可判斷,本發明之硫酸銅水溶液或含硫酸 鐵之硫酸銅水溶液的製造方法及製造裝置,就工業生產的 觀點,如試驗例2之2 : 1槽比如試驗例1之1 : 1槽適合 作業。 另外,關於電解效率(以電氣當量X電極面積X電流値 X時間所求出之理論電解値及實際電解量之比),雙方皆 -32- 200934894 爲100%程度(試驗例1 : 102%,試驗例2 : 99.8%) ’之 理想値,未見有大的差異。 [試驗例3] 使用圖3所示之製造裝置11,進行硫酸銅水溶液或含 硫酸鐵之硫酸銅水溶液之連續產生試驗。 ' 作爲電解液係使用添加特級試藥硫酸於電阻値爲 g 18.2ΜΩ之超純水,使S04量成180 g/L,計量添加、溶解 市售之高純度電解鐵成爲13 g/L,產生的稀硫酸鐵水溶 液,供給稀硫酸水溶液於各陽極室2 1及陰極室22,使各 貯存2 L。 接著,藉由濃度控制手段3 4及直流電流供給裝置 4〇,使電流値自500 mA至10A階段改變,同時供給電解 電流於陽極25及陰極24,觀察成爲於陽極表面不鈍態化 範圍之高電流密度。另外,銅離子之目標濃度爲35 g/L程 ❹ 度。 於上述試驗例3,成分組成之測定結果如表2所示。 [表2] 成分組成 Ag Cu Fe Na Pb S04 濃度 <l(mR/l) 34·2_ 0.05(mg/l) <l(mg/l) 190(g/l) 以約3 0分鐘間隔進行觀察經過,外加電流爲9a以 下’雖觀察到因岐化反應而自陽極產生銅粉,但未見有鈍 -33- 200934894 態化,然而,外加電流若超過9A時,自陽極產生岐化銅 粉更加明顯,於1 0 A,2小時程度認爲有鈍態化。因此可 結論使用本發明之硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造方法及製造裝置,進行作業時之適當正確的外加 電流密度爲8.5 A/dm2。 另外,至銅離子濃度成35 g/L程度之通電時間(每1 批之作業時間)係由銅離子濃縮之進行間隔、及電氣化學 計算,算出約7小時。 相對於傳統的製造方法及製造裝置,每1批約花費3 週( 320小時)程度,本發明之製造方法及製造裝置可以 約1/45的時間製造具有相同程度之銅離子濃度之稀硫酸 鐵水溶液,顯示製造效率優異。 另外,如表2所示,銅離子濃度成爲3 4.2 g/L時之稀 硫酸鐵水溶液中之Ag、Pb濃度未滿1 mg/L,Na濃度爲 0.0 5 mg/L,爲雜質非常少之測定結果。 [試驗例4] 本試驗例中,分別使用6N (相當於6N8 )之高純度 銅、及市售之4N (相當於4N8 )之純銅所形成之銅板作 爲陽極25。接著,於圖2所示之製造裝置10,連接如圖3 所示之水溶液取水手段3 1、濃度測定手段3 2、水溶液回 流手段3 3,藉由可即時測定銅離子濃度之組成,進行試 驗,進行使用純度相異之銅板爲陽極25時之比較評估。 接著,作爲電解液係使用添加特級試藥硫酸於電阻値 -34- 200934894 爲18.2ΜΩ之超純水,使S04量成180g/L,計量添加、 溶解市售之高純度電解鐵成爲13.5 g/L而產生的稀硫酸鐵 水溶液,分別供給稀硫酸水溶液’陽極室2 1 A貯存2L, 陰極室22A貯存1L。 另外,對陽極25及陰極24之電解電流係外加陰極24 側之電流密度成9 A/dm2,通電時間爲6.5小時。 e 另外,使用4N程度之純銅作爲陽極25時,因焦耳熱 而電解液溫超過5(TC,有破壞離子產生槽2及氫離子交換 膜23之虞,本試驗例中,使用冷卻器及特殊玻璃冷卻 管,配置該冷卻管於離子產生槽2,施以冷卻稀硫酸鐵水 溶液之對策。藉此抑制稀硫酸鐵水溶液之液溫上升至40°C 之條件下進行試驗。 上述試驗例4中,使用6N(相當於6N8 )之高純度 銅、及4N (相當於4N8 )之純銅之各個評估結果係如圖5 及表3所示。 ❹ [表3] 銅板 溶液中之委 睹質(mg/1) Ag As Pb Zn 6N <0.01 0.02 0.007 0.08 4N 0.05 0.04 0.04 0.1Further, similarly, using an acrylic plate, an anode chamber 21A having a volume of 2 L (electrolyte volume of 1 mm×100 mm×200 mm) and a volume of 1 L (electrolyte volume of 100 mm×100 mm×100 mm) were produced as shown in FIG. 2 . Ion generating tank 2A formed in the cathode chamber 22A (Test Example 2) ° Further, a commercially available cation exchange membrane was used for the hydrogen ion exchange membrane which partitioned the anode chamber and the cathode chamber. Next, as the anode 25, a copper plate having a size of 100 mm x 200 mm x 20 mm (contact water area: 100 mm x 100 mm) is formed using high purity copper of 6 N or more (corresponding to 6N8: copper purity of 99.99998%), as shown in Fig. 1 As shown in FIG. 3, in the anode chambers 21 and 2 1 A of the ion generating tanks 2 and 2A, they are disposed on the side wall side (the left side in FIGS. 1 to 3) facing the hydrogen ion exchange membrane 23. In addition, as the cathode 24, a plate of a size of 100 mm x 200 mm x 20 mm (contact water area: 100 mm x 100 mm) is formed of pure copper equivalent to 4N8 (copper purity: 99.998%), as shown in Figs. The cathode chambers 22 and 22A of the tanks 2 and 2A are disposed on the side wall side (the right side in FIGS. 1 to 3) facing the hydrogen ion exchange membrane 23, and the manufacturing apparatus 1 shown in FIG. 1 (test example) 1: The ion generating tank 2) and the manufacturing apparatus 1A shown in Fig. 2 were used (Test Example 2: using the ion generating tank 2A). Further, in the manufacturing apparatus using the ion generating tank 2, as shown in Fig. 3, an aqueous solution water taking means 31 formed by a Teflon (registered trademark) tube is disposed, and the tip end portion is inserted into the anode chambers 21, 21A. Teflon -29- 200934894 (registered trademark) The water intake pipe formed by the tube is connected to the water inlet side of the measuring means 32 (made by Atotech Japan Co., Ltd.: copper, sub-instant analysis device). On the side of the concentration measuring means 32, an aqueous solution return section 33 formed of a Teflon (registered trademark) tube is connected, and the tip end portion is disposed slightly above the opening portion of the anode chamber 2 to be returned to the copper ion concentration after measurement. The composition of the dilute aqueous solution of ferric sulfate in the cation 2 1 , 2 1 A. Then, the measurement data output (Measure Port) of the concentration measuring means 32 is connected to a concentration control means 34 of a personal computer (ThinkPad manufactured by IBM Corporation), and the external communication interface of the personal computer (concentration control 34) is connected to the DC current supply means 40. The external interface of the Yamato plating machine: the precision gold-plated YPP-15100 for wafers was formed into a manufacturing apparatus 1 1 as shown in Fig. 3 (Test Example 3: sub-groove 2). φ [Test Example 1] In the manufacturing apparatus 1 shown in Fig. 1, the composition of the copper ion concentration can be measured in real time by connecting the liquid water taking means 31, the concentration measuring means 32, and the aqueous solution reflux means as shown in Fig. 3. Next, as a solution, a super-pure water containing 18.2 Μ Ω of a special-grade reagent sulfuric acid was added, and a dilute sulfuric acid solution of 180 g/L was measured by S04. The commercially available high-purity electrolytic iron became 13 g/L. To a dilute aqueous solution of ferric sulfate. Next, a dilute sulfuric acid aqueous solution was supplied to each of the anode 21 and the cathode chamber 22, and each was stored at 2 L. The concentration of iron is separated from the water flow hand, the shape of the chamber is out of the shape of the means of gold test communication with water soluble 33 > blocking water soluble, the pole chamber -30- 200934894 In addition, the electrolytic current of the anode 25 and cathode 24 plus the cathode 24 The current density on the side is 8.5 A/dm2 and the energization time is 5 hours. [Test Example 2] The manufacturing apparatus 10 shown in Fig. 2 was connected to the aqueous solution taking unit 31, the concentration measuring means 3, and the aqueous solution reflux means 3 3 as shown in Fig. 3, and the composition of the copper ion concentration was measured immediately. Next, as the electrolytic solution, ultra-pure water containing a special-grade reagent sulfuric acid of 18.2 ΜΩ was added to make the amount of S〇4 180 g/L, and the commercially available high-purity electrolytic iron was measured and dissolved to become 13 g/L. The resulting dilute aqueous solution of ferric sulfate was supplied to a dilute sulfuric acid aqueous solution, the anode chamber 21A was stored 2 L, and the cathode chamber 22A was stored at 1 L. Further, the current density of the electrolysis current to the anode 25 and the cathode 24 was 8.5 A/dm 2 on the side of the cathode 24, and the energization time was 5 hours. The evaluation results of Test Example 1 and Test Example 2 above are shown in Fig. 4 and Table 1. [Table 1] Voltage [mV] Test Example 1 (6N 1:1 tank) Test Example 2 (6N 2:1 tank) Maximum difference (MAX.) 7,290 mV 5,500 mV 1,790 Minimum (MIN·) 6,610 mV 5,110 mV 1,500 ( Maximum-minimum difference) 680 390 290 Average (AVE·) 6,838 mV 5,220 mV 1,619 As shown in the diagram of Figure 4 and Table 1, the electrolysis current is applied so that the current density on the side of the cathode 24-31 - 200934894 is 8.5 A/dm2. Test Example 2 of 2:1 tank (anode 21: cathode 11) Comparison with Test Example 1 of 1:1 tank (anode 21: cathode 21) showed that the applied voltage was low. The integrated average 値 is compared with the case where the voltage is applied, which is 6.8 V with respect to Test Example 1, and the test Example 2 is applied with a voltage lower than 5.2 V, and the resistance between the electrodes is low. Further, as shown in the graph of FIG. 4, the electrolysis voltage rises, and generally, the higher the applied voltage is, the passivation of the anode interface is likely to continue, and the rising curve becomes steep, but when a high-purity copper plate of 6 N or more is used at the anode, In Test Example 1 and Test Example 2, the curves of the same curvature were drawn because the current density resistance became high. However, when observing the difference between the maximum enthalpy and the minimum enthalpy of the applied voltage, the variation range of 680 mV in Test Example 1 was 390 mV in Test Example 2, and the test example 2 and 1:1 groove of 2:1 groove were tested. 1 comparison shows that the voltage fluctuation range becomes smaller and stable. It is considered that the lower the applied voltage is, the more stable it is, and the longer the electrolysis time can be extended to the passivation. When the average voltage A(Ave.) - the minimum 〇 voltage 値 (Min.) is expressed, the test example 1 is 68 3 8 - 66 1 0 = 228, Test Example 2 is 522 0 - 5110 = 110. At this time, the test of 2:1 groove is also shown. Example 2 is low and stable. From the above results, it can be judged that the method for producing copper sulfate aqueous solution or the aqueous solution of copper sulfate containing copper sulfate according to the present invention and the manufacturing apparatus thereof are as in the viewpoint of industrial production, as in Test Example 2, 2: 1 tank, for example, Test Example 1: 1 slot is suitable for operation. In addition, regarding the electrolysis efficiency (the ratio of the theoretical electrolysis enthalpy and the actual electrolysis amount obtained by the electric equivalent X electrode area X current 値X time), both sides are -100-200934894 to 100% (Test Example 1: 102%, Test Example 2: 99.8%) 'The ideal 値, no big difference was observed. [Test Example 3] Using the production apparatus 11 shown in Fig. 3, a continuous production test of an aqueous copper sulfate solution or an aqueous solution of copper sulfate containing iron sulfate was carried out. As an electrolyte, a super-purified water containing a special grade of sulfuric acid and a resistive yttrium of g 18.2 Μ Ω is used, and the amount of S04 is 180 g/L, and the commercially available high-purity electrolytic iron is measured and dissolved to become 13 g/L. An aqueous solution of dilute sulfuric acid was supplied to each of the anode chamber 21 and the cathode chamber 22 to store 2 L each. Then, by the concentration control means 34 and the DC current supply means 4, the current is changed from the stage of 500 mA to 10A, and the electrolysis current is supplied to the anode 25 and the cathode 24, and the observation is made that the surface of the anode is not passive. High current density. In addition, the target concentration of copper ions is 35 g/L. In the above Test Example 3, the measurement results of the component compositions are shown in Table 2. [Table 2] Composition of Ag Cu Fe Na Pb S04 Concentration <l(mR/l) 34·2_ 0.05 (mg/l) <l(mg/l) 190 (g/l) At intervals of about 30 minutes After the observation, the applied current was 9a or less. 'Although copper powder was generated from the anode due to the deuteration reaction, but no blunt-33-200934894 was observed. However, if the applied current exceeds 9 A, the deuteration is generated from the anode. Copper powder is more obvious, and it is considered to be passivated at 10 A, 2 hours. Therefore, it can be concluded that the method and apparatus for producing copper sulfate aqueous solution or copper sulfate-containing aqueous solution of the present invention have an appropriate correct current density of 8.5 A/dm2 during operation. In addition, the energization time to the copper ion concentration of 35 g/L (working time per batch) was calculated by the interval between copper ion concentration and electro-chemical calculation, and was calculated to be about 7 hours. Compared with the conventional manufacturing method and manufacturing apparatus, the manufacturing method and the manufacturing apparatus of the present invention can produce the ferric sulphate having the same degree of copper ion concentration in about 1/45 of the time in the range of about 3 weeks (320 hours) per batch. The aqueous solution showed excellent manufacturing efficiency. In addition, as shown in Table 2, the concentration of Ag and Pb in the dilute aqueous solution of iron sulfate at a copper ion concentration of 3 4.2 g/L is less than 1 mg/L, and the concentration of Na is 0.05 mg/L, which is very rare. The measurement results. [Test Example 4] In this test example, a copper plate formed of 6N (corresponding to 6N8) of high-purity copper and a commercially available 4N (corresponding to 4N8) of pure copper was used as the anode 25. Next, in the manufacturing apparatus 10 shown in FIG. 2, an aqueous solution water taking means 31, a concentration measuring means 3, an aqueous solution reflux means 3 3 as shown in FIG. 3 are connected, and the composition of the copper ion concentration can be measured immediately, and the test is carried out. A comparative evaluation was made when a copper plate having a different purity was used as the anode 25. Next, as the electrolytic solution, ultra-pure water of 18.2 ΜΩ was added to the resistor 硫酸-34-200934894, and the amount of S04 was 180 g/L. The commercially available high-purity electrolytic iron was metered and dissolved to 13.5 g/ The dilute aqueous solution of ferric sulfate produced by L was separately supplied to the dilute sulfuric acid aqueous solution 'anode chamber 2 1 A for storage 2 L, and the cathode chamber 22A for 1 L. Further, the current density of the electrolysis current to the anode 25 and the cathode 24 was 9 A/dm 2 on the side of the cathode 24, and the energization time was 6.5 hours. e In addition, when pure copper of 4N is used as the anode 25, the electrolyte temperature exceeds 5 (TC, and the ion generation tank 2 and the hydrogen ion exchange membrane 23 are destroyed by Joule heat. In this test example, the cooler and the special are used. In the glass cooling pipe, the cooling pipe was placed in the ion generating tank 2, and a solution for cooling the aqueous solution of the dilute ferric sulfate was placed. The test was carried out under the condition that the liquid temperature of the dilute aqueous solution of the molten iron sulfate was raised to 40 ° C. The evaluation results using 6N (equivalent to 6N8) of high-purity copper and 4N (equivalent to 4N8) of pure copper are shown in Figure 5 and Table 3. ❹ [Table 3] Euphemism in copper solution (mg) /1) Ag As Pb Zn 6N <0.01 0.02 0.007 0.08 4N 0.05 0.04 0.04 0.1

如圖5的圖形所示,使用6N (相當於6N8 )之高純 度銅爲陽極25時,電壓極平順地改變,並且,於陽極25 表面亦無明顯的變色,亦認爲完全不產生銅粉。使用6N -35- 200934894 (相當於6N8 )之高純度銅之陽極25係於陰極24側之 流密度爲9 A/dm2,通電時間爲6.5小時之作業條件下 可毫無問題地使用。 另一方面,使用4N(相當於4N8)之純銅爲陽極 時,如圖5所示,通電開始後約2 0分鐘,電極界面發 明顯之電阻不全及鈍態化,即使此鈍態化消除後,電壓 ' 動幅度仍激烈,陽極25表面變色或產生粗糙,並且產 0 大量銅粉。 水溶液中之銅離子濃度係使用6N高純度銅及4N 銅中任一種爲陽極25時,皆約爲35 g/L,雖不遜色, 因外加積算電壓係使用4N純銅爲陽極25者變高,所以 因此,銅離子之溶解效率變低。另外,自配有使用4N 銅之陽極25之陽極室21內之水溶液中,簡單地過濾採 之銅粉殘渣量爲1.73g程度,非常多。另外,使用6N 純度銅爲陽極25時’不能檢出銅粉殘渣量,結果約 ❹ 零。 由此結果顯示使用6N(相當於6N8)之高純度銅 ' 陽極2 5時,可得到高純度之硫酸銅水溶液,並且,即 • 使用含鐵離子(硫酸鐵)之電解液時,可進行高效率的 解。 另外,如上所述,使用4N純銅爲陽極25時,因電 效率低或產生銅粉殘渣’並且焦耳熱產生量高’所以必 施以電解液之冷卻對策。 另外,於表3所示之雜質分析結果,使用6N之高 電 25 生 變 生 純 但 僅 純 取 局 爲 爲 使 電 解 須 純 -36- 200934894 度銅爲陽極25時,與使用4N純銅相比較,Ag、 Zn之各雜質量變得非常少。 本試驗例中,因爲使用高純度電解鐵,添加鐵 電解液,雖然添加純鐵中所含之雜質,使背景數値 升’但作爲陽極25,使用6N之高純度銅時及使用 銅時,顯示於雜質量產生大的差異。 ' 由以上結果顯示本發明之高純度硫酸銅水溶液 0 酸鐵之硫酸銅水溶液的製造方法及製造裝置具有高 率’並且,由此製造方法及製造裝置所製造之水溶 質少,具有高銅離子濃度,水溶液特性優異。 產業上利用性 依據本發明之高純度硫酸銅水溶液或含硫酸鐵 銅水溶液的製造方法及製造裝置,可以高製造效率 品質且純度高之硫酸銅水溶液或含硫酸鐵之硫酸 Q 液’並且藉由減少步驟次數而可減低混入雜質之機 同時地達成提升品質、縮短產生時間及降低成本。 於產業上係極爲有效的。 【圖式簡單說明】 [圖1]說明有關本發明之高純度硫酸銅水溶液 酸鐵之硫酸銅水溶液之製造裝置之一例之槪略圖。 [圖2]說明有關本發明之高純度硫酸銅水溶液 酸鐵之硫酸銅水溶液之製造裝置之其他例之槪略圖As shown in the graph of Fig. 5, when 6N (corresponding to 6N8) of high-purity copper is used as the anode 25, the voltage changes extremely smoothly, and there is no significant discoloration on the surface of the anode 25, and it is considered that no copper powder is produced at all. . The anode 25 of high-purity copper using 6N - 35 - 200934894 (corresponding to 6N8) is used at a flow density of 9 A/dm 2 on the cathode 24 side, and can be used without any problem under an operating condition of 6.5 hours. On the other hand, when 4N (corresponding to 4N8) pure copper is used as the anode, as shown in FIG. 5, about 20 minutes after the start of energization, the electrode interface is invented to exhibit incomplete resistance and passivation, even after the passivation is eliminated. The voltage 'movement amplitude is still intense, the surface of the anode 25 is discolored or rough, and a large amount of copper powder is produced. The concentration of copper ions in the aqueous solution is about 35 g/L when any of 6N high-purity copper and 4N copper is used as the anode 25, although it is not inferior, since the applied voltage is increased by using 4N pure copper as the anode 25, Therefore, the dissolution efficiency of copper ions becomes low. Further, in the aqueous solution in the anode chamber 21 in which the anode 25 of the 4N copper was used, the amount of the copper powder residue which was simply filtered was about 1.73 g, which was very large. Further, when 6N-purity copper was used as the anode 25, the amount of copper powder residue could not be detected, and the result was about ❹ zero. From this result, it is shown that when a high-purity copper 'anode 25 of 6N (corresponding to 6N8) is used, a high-purity copper sulfate aqueous solution can be obtained, and even when an electrolyte containing iron ions (iron sulfate) is used, it can be made high. The solution to efficiency. Further, as described above, when 4N pure copper is used as the anode 25, countermeasures against cooling of the electrolytic solution are required because of low electric efficiency or generation of copper powder residue 'and high Joule heat generation amount'. In addition, in the impurity analysis results shown in Table 3, the use of 6N high-voltage 25-generation pure pure but purely purely for the electrolysis of pure-36-200934894 copper as the anode 25, compared with the use of 4N pure copper, The mass of each of Ag and Zn becomes very small. In this test example, the use of high-purity electrolytic iron, the addition of the iron electrolyte, the addition of the impurities contained in the pure iron, so that the background number is increased, but when the high-purity copper of 6N is used as the anode 25, and when copper is used, The difference shown in the mass produced is large. From the above results, the method for producing and producing a copper sulfate aqueous solution of the high-purity copper sulfate aqueous solution of the present invention has a high rate, and the water solute produced by the production method and the production apparatus is small, and has high copper ion. The concentration is excellent in the characteristics of the aqueous solution. INDUSTRIAL APPLICABILITY According to the method for producing and producing a high-purity copper sulfate aqueous solution or an aqueous solution containing copper iron sulfate according to the present invention, it is possible to efficiently produce a copper sulfate aqueous solution or a sulfuric acid-containing sulfuric acid Q liquid with high purity and purity. By reducing the number of steps, it is possible to reduce the amount of impurities mixed into the machine to achieve improved quality, shortened production time and reduced cost. It is extremely effective in the industry. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A schematic diagram showing an example of a device for producing a copper sulfate aqueous solution of a high-purity copper sulfate aqueous solution of the present invention. Fig. 2 is a schematic view showing another example of the apparatus for producing a copper sulfate aqueous solution of high-purity copper sulfate aqueous solution of the present invention;

Pb、及 離子於 些微上 4N純 或含硫 製造效 液,雜 之硫酸 產生高 銅水溶 會,可 因此, 或含硫 或含硫 -37- 200934894 [圖3 ]說明有關本發明之高純度硫酸銅水溶液或含硫 酸鐵之硫酸銅水溶液之製造裝置之其他例之槪略圖。 [圖4]有關本發明之高純度硫酸銅水溶液或含硫酸鐵 之硫酸銅水溶液的製造方法及製造裝置實施例之說明圖。 [圖5]有關本發明之高純度硫酸銅水溶液或含硫酸鐵 之硫酸銅水溶液的製造方法及製造裝置實施例之說明圖。 0 【主要元件符號說明】 1、10、11 :高純度硫酸銅水溶液或含硫酸鐵之硫酸 銅水溶液之製造裝置(製造裝置)、2:離子產生槽、 21:陽極室、22:陰極室、23:氫離子交換膜、24:陰 極、2 5 :陽極、3 1 :水溶液取水手段、3 2 :濃度測定手 段、33 :水溶液回流手段、34 :濃度控制手段、4〇 :直流 電流供給手段 ❹ -38-Pb, and ions on a slightly 4N pure or sulfur-containing effect liquid, mixed sulfuric acid to produce high copper water soluble, can therefore, or sulfur or sulfur -37-200934894 [Figure 3] to explain the high purity sulfuric acid of the present invention A schematic diagram of another example of a copper aqueous solution or a device for producing a copper sulfate aqueous solution containing iron sulfate. Fig. 4 is an explanatory view showing an embodiment of a method for producing a high-purity copper sulfate aqueous solution or an aqueous solution containing copper sulfate having a ferric sulfate according to the present invention. Fig. 5 is an explanatory view showing an embodiment of a method for producing a high-purity copper sulfate aqueous solution or an aqueous solution containing copper sulfate having a ferric sulfate according to the present invention. 0 [Description of main component symbols] 1, 10, 11: manufacturing equipment (manufacturing device) of high-purity copper sulfate aqueous solution or iron sulfate-containing copper sulfate aqueous solution, 2: ion generating tank, 21: anode chamber, 22: cathode chamber, 23: hydrogen ion exchange membrane, 24: cathode, 25: anode, 3 1 : aqueous solution, 3 2: concentration measurement means, 33: aqueous solution reflux means, 34: concentration control means, 4: DC current supply means -38-

Claims (1)

200934894 十、申請專利範圍 1 · 一種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造方法,其特徵爲, 以氫離子交換膜區劃離子產生槽成陽極室及陰極室, 於該陰極室,自陰極表面釋出氫氣,並且 於供給稀硫酸水溶液或稀硫酸鐵水溶液之該陽極室 中’自純銅銅板、或6N以上之高純度銅板所形成之陽 0 極,溶出銅離子於該陽極室內, 於該陽極室內,產生硫酸銅水溶液或含硫酸鐵之硫酸 銅水溶液。 2. 如申請專利範圍第1項之高純度硫酸銅水溶液或含 硫酸鐵之硫酸銅水溶液的製造方法,其中於該離子產生 槽,該陽極室及該陰極室之容積區劃比率及電極間比率範 圍爲4 : 3〜5 : 1。 3. 如申請專利範圍第1項之高純度硫酸銅水溶液或含 ❹ 硫酸鐵之硫酸銅水溶液的製造方法,其中於該離子產生 槽,該陽極室及該陰極室之容積區劃比率及電極間比率爲 2:1° " 4.一種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造方法,其係申請專利範圍第1項之硫酸銅水溶液 或含硫酸鐵之硫酸銅水溶液的製造方法,其特徵爲具備 取出該陽極室內之水溶液之水溶液取水步驟、 依據該水溶液取水步驟,測定自該陽極室內所取出之 水溶液之銅離子濃度之濃度測定步驟、及 -39- 200934894 將該濃度測定步驟中銅濃度經測定之水溶液,放回該 陽極室內之水溶液回流步驟, 基於該濃度測定步驟中之銅離子濃度之測定値,控制 對該陽極及陰極之外加電壓、及/或外加電流。 5 . —種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液的製造裝置,其特徵爲具備 離子產生槽、 φ 區劃該離子產生槽內部成陽極室及陰極室之氫離子交 換膜、 該陰極室內所設有之經通電而自表面釋出氫氣之陰 極、 供給稀硫酸水溶液或稀硫酸鐵水溶液之該陽極室所設 有之經通電而溶出銅離子於該陽極室內之由純銅銅板、或 6N以上之高純度銅板所形成之陽極而成。 6. —種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 Q 液的製造裝置,其係申請專利範圍第5項之高純度硫酸銅 水溶液或含硫酸鐵之硫酸銅水溶液的製造裝置,其特徵爲 具備 取出該陽極室內之水溶液之水溶液取水手段、 依據該水溶液取水手段,測定自該陽極室內所取出之 水溶液之銅離子濃度之濃度測定手段、及 將該濃度測定手段中銅濃度經測定之水溶液,放回該 陽極室內之水溶液回流手段、及基於該濃度測定手段中銅 離子濃度之測定値,控制對該陽極及陰極之外加電壓、及 -40- 200934894 /或外加電流之濃度控制手段而成。 7_如申請專利範圍第5項之高純度硫酸銅水溶液或含 硫酸鐵之硫酸銅水溶液的製造裝置,其中於該離子產生 槽’該陽極室及該陰極室之容積區劃比率及電極間比率範 圍爲4 : 3〜5 : 1。 . 8 .如申請專利範圍第5項之高純度硫酸銅水溶液或含 ^ 硫酸鐵之硫酸銅水溶液的製造方法,其中於該離子產生 6 槽,該陽極室及該陰極室之容積區劃比率及電極間比率爲 2:1° 9. 一種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水溶 液,其特徵爲由申請專利範圍第1項至第4項中任一項之 製造方法所製造。 10. —種高純度硫酸銅水溶液或含硫酸鐵之硫酸銅水 溶液,其特徵爲由申請專利範圍第5項至第8項中任一項 之製造裝置所製造。 〇 -41 -200934894 X. Patent Application No. 1 · A method for producing a high-purity copper sulfate aqueous solution or a ferric sulfate-containing copper sulfate aqueous solution, characterized in that a hydrogen ion exchange membrane partitions an ion generating tank into an anode chamber and a cathode chamber, and the cathode chamber Hydrogen is released from the surface of the cathode, and in the anode chamber of the dilute sulfuric acid aqueous solution or the aqueous solution of dilute ferric sulfate, the anode is formed from a pure copper copper plate or a high-purity copper plate of 6 N or more, and copper ions are eluted in the anode chamber. In the anode chamber, an aqueous solution of copper sulfate or an aqueous solution of copper sulfate containing iron sulfate is produced. 2. The method for producing a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to the first aspect of the patent application, wherein a volume division ratio and an inter-electrode ratio range of the anode chamber and the cathode chamber are used in the ion generation tank For 4: 3 to 5: 1. 3. The method for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution according to the first aspect of the patent application, wherein the ion generation tank, the volume division ratio of the anode chamber and the cathode chamber, and the ratio between electrodes 2:1° " 4. A method for producing a high-purity copper sulfate aqueous solution or a ferric sulfate-containing copper sulfate aqueous solution, which is a method for producing a copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to claim 1 The present invention is characterized in that it comprises a water extraction step of taking out an aqueous solution in the anode chamber, a water extraction step according to the aqueous solution, a concentration measuring step of measuring a copper ion concentration of the aqueous solution taken out from the anode chamber, and -39-200934894, the concentration measuring step The aqueous solution having a measured copper concentration is returned to the aqueous solution refluxing step in the anode chamber, and based on the measurement of the copper ion concentration in the concentration measuring step, a voltage is applied to the anode and the cathode, and/or an applied current is applied. An apparatus for producing a high-purity copper sulfate aqueous solution or a ferric sulfate-containing copper sulfate aqueous solution, comprising: an ion generating tank; and a hydrogen ion exchange membrane φ partitioning the inside of the ion generating tank into an anode chamber and a cathode chamber, the cathode a cathode provided in the chamber, which is supplied with hydrogen from the surface, a dilute sulfuric acid aqueous solution or a dilute aqueous solution of ferric sulfate, and is supplied with a copper copper plate or 6N by electrification to dissolve copper ions in the anode chamber. The anode formed by the above high-purity copper plate is formed. 6. A device for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution Q solution, which is a manufacturing device of a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to claim 5 of the patent application scope, An aqueous solution water taking means for taking out an aqueous solution in the anode chamber, a concentration measuring means for measuring a copper ion concentration of the aqueous solution taken out from the anode chamber according to the aqueous water collecting means, and a copper concentration in the concentration measuring means are measured The aqueous solution, the aqueous solution reflux means returned to the anode chamber, and the measurement of the copper ion concentration in the concentration measuring means, controlling the voltage applied to the anode and the cathode, and the concentration control means of -40-200934894 / or the applied current to make. 7_ Manufactured as a high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution according to claim 5, wherein a volume division ratio and an inter-electrode ratio range of the anode chamber and the cathode chamber in the ion generation tank For 4: 3 to 5: 1. 8. The method for producing a high-purity copper sulfate aqueous solution or a copper sulfate-containing copper sulfate aqueous solution according to claim 5, wherein the ion generating 6-slot, the anode chamber and the cathode chamber have a volume division ratio and an electrode The ratio of the ratio is 2:1°. 9. A high-purity copper sulfate aqueous solution or an iron sulfate-containing copper sulfate aqueous solution, which is produced by the production method according to any one of claims 1 to 4. A high-purity aqueous copper sulfate solution or a copper sulfate aqueous solution containing iron sulfate, which is produced by the production apparatus according to any one of claims 5 to 8. 〇 -41 -
TW97104673A 2006-08-08 2008-02-05 Aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, process and apparatus for producing the same TW200934894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006215568A JP2008038213A (en) 2006-08-08 2006-08-08 Method and apparatus for preparing particularly high purity copper sulfate aqueous solution or copper sulfate aqueous solution containing iron sulfate, and particularly high purity copper sulfate aqueous solution or copper sulfate aqueous solution containing iron sulfate

Publications (1)

Publication Number Publication Date
TW200934894A true TW200934894A (en) 2009-08-16

Family

ID=39173586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97104673A TW200934894A (en) 2006-08-08 2008-02-05 Aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, process and apparatus for producing the same

Country Status (2)

Country Link
JP (1) JP2008038213A (en)
TW (1) TW200934894A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114016047A (en) * 2021-12-03 2022-02-08 江苏艾森半导体材料股份有限公司 Copper sulfate pentahydrate crystal and preparation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009098756A1 (en) * 2008-02-05 2009-08-13 Mitsubishi Materials Corporation Process and apparatus for producing high-purity aqueous copper sulfate solution or aqueous copper sulfate solution containing iron sulfate, and high-purity aqueous copper sulfate solution or aqueous copper sulfate solution containing iron sulfate
JP6703661B2 (en) * 2016-03-31 2020-06-03 国立大学法人秋田大学 Method and apparatus for producing copper ion-containing aqueous solution

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003328199A (en) * 2002-05-10 2003-11-19 Mitsubishi Materials Corp Copper plating method and apparatus therefor, method of producing copper and apparatus therefor, metal plating method and apparatus therefor, and method of producing metal and apparatus therefor
JP4295032B2 (en) * 2003-07-22 2009-07-15 大日本スクリーン製造株式会社 Plating equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114016047A (en) * 2021-12-03 2022-02-08 江苏艾森半导体材料股份有限公司 Copper sulfate pentahydrate crystal and preparation method thereof

Also Published As

Publication number Publication date
JP2008038213A (en) 2008-02-21

Similar Documents

Publication Publication Date Title
CN112714803B (en) Plating solution production and regeneration process and device for insoluble anode acid copper electroplating
AU2019203950A1 (en) Method and system to maintain electrolyte stability for all-iron redox flow batteries
TWI648435B (en) Acidic copper plating process using infused anode and its equipment
KR101529373B1 (en) Method and arrangement for producing metal powder
CN113818055B (en) Component adjusting method and device for acid copper electroplating plating solution or electroplating replenishment solution of insoluble anode
CN110301060B (en) Electrolyte for iron flow battery
CN104928720B (en) A kind of electrolytic method of titanium soluble anode
TW200934894A (en) Aqueous solution of highly-pure copper sulfate or copper sulfate including iron sulfate, process and apparatus for producing the same
JP2016186115A (en) Method for electrolytic extraction of metal
WO2009098756A1 (en) Process and apparatus for producing high-purity aqueous copper sulfate solution or aqueous copper sulfate solution containing iron sulfate, and high-purity aqueous copper sulfate solution or aqueous copper sulfate solution containing iron sulfate
JP2010084195A (en) Copper plating system and copper plating method, and method of manufacturing electroplating liquid
JP3903120B2 (en) Copper sulfate plating method
JP6162554B2 (en) Electrolytic purification apparatus for Ag and method for electrolytic purification of Ag using the apparatus
CN116783331A (en) Metal-filled microstructure and method for producing metal-filled microstructure
JP6386625B2 (en) Ag electrorefining equipment
JP2003328199A (en) Copper plating method and apparatus therefor, method of producing copper and apparatus therefor, metal plating method and apparatus therefor, and method of producing metal and apparatus therefor
WO2024078627A1 (en) Electrolytic copper dissolution-integrated insoluble anode copper plating process optimization method and apparatus
CN219470244U (en) Acidic copper plating and dissolving device
JP2003105581A (en) Method and apparatus for electrolytic deposition of tin alloy
JP7188239B2 (en) Method for producing electrolytic cell and acid solution
CN217378033U (en) Chlorine-free gas-electricity regeneration PCB acid cycle etching system
CN219059125U (en) Etching solution circulation regeneration and copper recovery device
CN117483781B (en) Silver powder preparation method
JP7207024B2 (en) Method for producing sulfuric acid solution
TWI477659B (en) Conductive anode structure in water