TW200921882A - Fiexible wiring board for tape carrier package - Google Patents

Abstract

A flexible wiring board for a tape carrier package with reduced tackiness and a tape carrier package formed by using the flexible wiring board is disclosed. The flexible wiring board for a tape carrier package has an insulating film 1, a wiring pattern 3 formed on a surface of the insulating film, and an overcoat layer 9 containing a resin cured material and a porous fine particle, and protecting at least a region of said wiring pattern.

Description

200921882 IX. Description of the invention: [Technical field to which the invention pertains] Body. Layer delivery: a conveyor with a reduced adhesiveness "Package: Dip board" and a wheeled tape package using the flexible circuit board shaft. [Prior Art] Transfer tape package, semiconductor wafer, etc. ^ Tape Aut〇mated Bond.ng^ is mounted on the flexible circuit (pQn im) circuit pattern for the conveyor tape package, except for the inner lead or the external lead, and the circuit pattern is protected by the insulation coating. The surface other than the connection portion of the lead 4 is formed of a resin composition, a resin composition j, a polyamic imine resin composition, or the like, which is formed by a surface coating, and is disclosed in a special article. The composition of the amine vinegar resin is disclosed as Patent Document 2, which discloses that the composition of the polyimine resin is used as a composition for the modification of Μ醢π 乍 as a surface coating composition, Patent Document 5 Amine The resin composition is used as a surface coating composition. Flexibility: Crystal parts are usually continuously mounted on a wheeled tape package. Two=Yes: The r-feed tape package is transported from a winding tape by a pull-up circuit board. Flexible circuit handle or photocurable resin composition for package" ^ti consists of a thermosetting surface adhesive that is sturdy and sturdy, but often because of the direct coating of the surface coating & 7), if the conveyor tape package is wound directly on the reel with a flexible circuit board In the case of the overlapping part of the limbs (7), the vengeance of the vengeful king is as follows: [Patent Document 1] Japanese Laid-Open Patent Publication No. H-6-A No. 200921882 [Patent Document 2] Japanese Patent Laid-Open No. Hei 2-7-39673 [Patent Document 3] Japanese Patent Laid-Open Publication No. Hei 11-125GG (Patent Document 4) Japanese Patent Laid-Open No. 21-leg No. [Patent Document 5] Japanese Patent Laid-Open Publication No. Hei 2-6 No. 7183 [Patent Document 6] [Patent Document 7] Japanese Laid-Open Patent Publication No. H06-63297 [Patent Document 8] Japanese Patent Publication No. 13 No. [Abstract] (Problems to be Solved by the Invention) Chitai is the most popular in the transport tape sealing I body circuit board reel winding, in order to reduce the cost, it is required not to use a PET film such as a peeling film roll. In the case of the flexible circuit board for the low-transmission tape package, the customer has formed a sales and marketing grease _ money (four)'. If it is thermally hardened, it is easier to change at a lower temperature and a shorter time. The conveying material seals the 峨 峨 于 于 于 崎 崎 崎 崎 崎 崎 崎 崎 崎. The viscosity of the other board will often become higher (the adhesion of the adhesive becomes worse): == ί low loss: with the package board / and the flexible circuit (the way to solve the problem) The present invention relates to the following 1. A flexible circuit board for the transmission tape package, special. Contains: , insulating film; circuit pattern, formed on the surface of the insulating film. And the case ί 5! Department Ϊ "" 曰 hardening And porous particles, and protect the above circuit diagram 200921882 2. The adhesion of the coating tape coating as described above 1. Satisfy the condition of 14Q. ^ Body, Wei, the towel, the conditions of the above surface imine. Adhered to SUS And ah does not stick to ^ 3 · such as the above 1 · or 2 · wheel * This is a description of the porous particles, compared to the front of the flexible circuit board, where the ratio of the former mass parts. In the above-mentioned 1. to 3., the above-mentioned porous microchips have a large number of flat tape package-based circuit boards. *The center portion of the thickness direction of the surface coating layer is On the surface 5. As in the above 1.~4, the flexible circuit board for the flat package of the above-mentioned porous fine particles, 2" mVg or more. The granules are 30_ or less and the specific surface area is 6. 1. The above-mentioned 1.~5 towel/work^ wherein the porous microparticles are fine-hole 1 容胶 = flexible circuit board for the package, K 5101^3-, 姆月之,聚轻财状; poly (4) milk, heteroamine, and at least one kind of resin, hard = tree day and group of 贝 醯 卿 卿 卿 卿The above 〗 〖Q /; ~,., the external line heat treatment and hardened. Extreme, # / .. 中任 - Item of the conveyor belt sealing body with the thunder & The team I and the circuit board are equipped with a package, and the flexible circuit board for the release body is used by using the above-mentioned L to 10. The 铷k 12'-type surface-coated hardenable resin The composition is characterized in that: when the surface of the porous micro-200921882 is relatively == after 'there is no such porous fine particle, the hardening shows that after hardening, the viscosity is sticky. The 60 c does not adhere to the polyimine. The conditional f-modifying resin comprises a selected material, wherein, according to the present invention, the viscosity is reduced, and the flexibility of the transporting tape package body formed by using the same is provided. The circuit board package uses a flexible circuit board to feed the gold material, and the '° fruit, which can reduce the manufacturing process of the flexible circuit board for transporting the tape package, and lift the film on the conveyor belt package. The wire H of the substrate and the lifting of the wheel are carried out. [Embodiment] (The best shape energy for implementing the invention) Also, there is no effect in Japan. ίΐttJJ^ f «^(Pyrethr01f) ^ ^ ΪΙ J Emulsified tantalum gel for printed circuit boards /, Kawasaki 4. Axis, phenol-resistant insulating layer (substrate), etc. Rigid printing electric system for the paper-benzene package for the circuit board substrate No. 7 (Special Dissemination 7), an insulating resin film is formed from a resin composition of LT pin 2m to 63297, and 2 is a low-rate agent. In addition, the 吸 特 特 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ . First of all, referring to the figure, the stickiness of the 'Tai Brigade'-surface layer is unknown. The tape of the present invention solves the structure of the flexible circuit board of S =. Figure 1 shows a schematic top view of the H of Figure 1, the line ^ example, and Figure 2 shows the layer 2, with the circuit diagram stuck? Knife ^ 々 map. On the surface of the insulating film 1, an adhesive, for example, a bent_slit '=== yuan thin_ inner lead outer lead 3b. In the inner 彳丨唆 \ + , and σ 卩 forms a slit 5 which is useful for connecting with other parts, the horizontal direction ==^'3\bump 丄 connects the semiconductor crystal U. Further, in the case where the bent resin layer 8' is formed, the solid metal 3* region in which the protective lead wire 3a or the outer lead 3b is formed is formed in addition to the inner lead to protect the circuit pattern. In addition, the inside of the disk is surrounded by ζ 'formed with a surface coating (resistance tan layer) 9 body seal tree money seal fine 7, with semi-conductive holes) 1 test pad (circuit pattern) 3c ^ clothing body and set There are perforated holes (deduction gears, in addition, the conveyor tape package of the present invention, v in Figs. 1, 2, showing curved slits at two places and two figures: l shows a specific example. To form at one place or in multiple places Forming: 堇: The slit of the curved pattern can be patterned on one side (back) with flexible resin layer covering = slit cross-cutting circuit surface, which can be double-sided with flexible layer covering I* "' can make up In the single-side table, Figure 3 shows the use of the C0F technology, and the figure shows that Figure BB shows the BB of Figure 3. The outline of the line represents the structure of the top view of the adhesive with the circuit along with 13. The circuit edge film 12 a surface, an inner lead 13a for connecting the semiconductor wafer 15 to the other zero-connected semiconductor wafer by the bump 14. The formed inner lead 13a' is formed by dividing the inner lead 13a or the outer bow line The surface layer (solder resist layer) 16 protects the main surface of the circuit J, and the semiconductor wafer 15 is formed by the underfill material 17 The dense picture seal ^ is again; ^ lead gamma connection is guaranteed. At the package end, there is 200921882 perforated ff chain gear hole) 18, test pad (circuit diagram 荦) 13c In the present invention, the flexible tape package for the wheeled package a board in which a conductive tape seal is used to refer to a flexible part or to protect such electronic parts. ^. Conductor crystals;; etc. The surface of the electronic insulating film is formed with a circuit pattern, and the front surface is formed before the formation And the insulating cover is protected. That is, at least part of the electricity is used and provided in the tape for sealing the user's tape, the plate is to have a layer of adhesive or scratch Resin ίίίί Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ The electronic components such as wafers are removed, and semi-conductive tin treatment is performed to form a transfer tape. If necessary, the flexible circuit board for the aging body is sealed by the solder tape, and the winding is not only supplied by the medium. Go to the reel, pick the secret lang ^ ^ the transfer belt package is also the same And the dielectric tangential small, heat-resistant 'mesh, =, ' 彖Μ, preferably by the insulation damage strong, heat shrinkage rate is small and for the two t-type and moderately rigid, resistant film composed. The heat-resistant polymer aromatic polyester film excellent in the material group, in particular, the aromatic scented polyami oxime imide film, the Ube sei product, and the like. Specifically, preferred examples Yes: Available, etc. Also, it is better. The copper box can be a rolled copper box or a metal such as copper fl or (four), etc. It is used for 2~10〇_. The road is copper. The thickness of the circuit pattern is preferably 2 〇-300, m, ^fBlF^^5〇〇^ 5^500,,, The field of the film and circuit pattern sometimes m is especially about 2 〇 ~ side eggs. Rich layer. The adhesive layer is preferably = (3), but sometimes the female is separated by an adhesive layer, the insulation is recordable, the heat resistance and the resistance to 200921882 are excellent, and the warpage is small after the hardening, and the flatness is ^; ^2° 20#8200 ' #86〇° Also, the thickness of the transfer glue in the TM mode. Insulation reliability, good adhesion to the substrate, good adhesion to the substrate, and excellent after hardening, even if the slit portion I: is resistant to: good quality, small warpage, softness of the flat surface, or The flexible f does not peel or break, and it is sufficient to say that, for example, the polyamine core is preferably formed on the private composition. Specifically, the amine resin composition; the diimine poly _ «Asian Ministry of Industry and Technology Co., Ltd.

FS^IOOL. In addition, the _ material furnace is a UPICOAT-made of the lactane tree, and the composition is more preferably about 5 to 5G_ thickness 5 «, especially good 1 to 100 surface coating (solder layer) In order to apply a method such as covering the surface of the circuit pattern region including the space with the mask of the circuit pattern, and then drying, it is preferably formed of a wax-grade product. The surface coating layer requires her, ,, =, and = hardened hardening trees. The circuit pattern has good adhesion, excellent surface quality, excellent insulation properties with insulating film or tin resistance, chemical resistance, and solvent resistance. J heat resistance, plating resistance, bending property (no peeling or bending, even if it is bent) has good adhesion and other characteristics. ; 山封树月曰 (still contains the bottom filler in the state of the second semiconductor, but the existence of the child in the women's clothing has the electronic delivery of the "transport tape sealing agricultural body" 200921882 ΐ ΐ sticky J when 1 is a problem For the purpose of the stickiness, it is possible to apply the makeup to the electronic components such as semiconductor wafers without the mounting of the semiconductor parts 1 to 50« (the material will be described later). It is 1 to 100 M, more preferably about the wafer i: the bottom After the conductor wafer is used to protect the semiconductor, it is too respectful. The 裱 裱 通 吊 裱 裱 裱 裱 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 包含 。 It can be maintained or improved by reducing the characteristics. It will be reduced as a center of the surface coating requirements; the surface coating of Linke is better than the majority of the surface. From the second interface, the surface is formed: 匕/ And as the two cases of the surface coating are reduced, the viscosity is reduced, that is, it is not particularly special and can make the surface coating requirements 仏 仏 绝 绝 绝 绝 更 更 更 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 001 More preferably, 005~L, and the average thickness of the layer is preferably smaller than the thickness of the surface layer, and more preferably Using non-porous particles, but using a large amount, or using a field, it is possible to change the mechanical strength of each of the 12, 2009,882, 低 each, low (for example, the surface of the porous particles, for the opening or whitening), so can not be used. Active material = cover === 咖 矽, glass, alumina, brown Z: Bu Bu Xi Li I raw u grain material%, such as calcium citrate such as calcium citrate, calcium phosphate, = Ming, etc. Hydrogen knitting ^ (〇1(8) and other magnesium (tetra) salt carbon gorge and other carbonates, sepiolite urethane resin, chitosan f-propyl 5 resin, polyimine resin, acid fiber resin, etc., and these The complex liquid body, the poly-stone oxygen burning resin, the stone smoke rubber, and the composition of the B are fluid, so it is more ί. More, ΐί is ideal for controlling the hydrophilicity of the resin, but it is squeaky and sturdy. Granules, whose surface energy can be maintained at the same time, as long as they can only be used, and many other workmanships, such as horses, agents, or titanium coupling agents, are hydrophobic. In the case of porosity, in the present invention, chemical reactions are therefore poor. · Reduce, or with the resin component produced in the present invention, the porous microparticles are 200-1000 mVg 250 ^ 1 ΒΕΤ 〇〇mvt Ϊίίί!# ' ^ Or the material is placed on the table, and the pore volume of the porous particles is converted to the oil absorption S measured by the refined linseed oil method of Wenguo = -13-1. \5101, l/g, more preferably 0·3~Twisting, can be in the surface of the ^^ 〇.lml/g~ distribution $ translocation on the surface of the surface coating, reducing the viscosity of the effect is high ^<More Southern Density In this book, the porous particles are made of porous oxidized stone, which has an ideal specific surface area or pore volume (oil absorption). Ventilation fossils, = mourning on the surface of the surface coating The layer has a higher density ", or the surface of the ft layer. Χ, the hardening step of the resin composition or the female clothing of the transmission is stable, and does not cause adverse effects on the insulating properties, etc., without causing the surface of the package. 200921882 The properties of the layers of the machine are reduced. It is also good because it has good characteristics. The reduction effect of f is large and is used as a surface coating. Porous particles, especially porous yttrium oxide, phase, hardened material (surface coating), phase 1 乂 in the absence of porous fine particles, the surface hardness is increased and the surface hardness is improved. If the injury is also improved, L; the same reduction, the ease of operation, the productivity of the manufacturing process, and the transportability of the conveyor belt. The mounting step of the I-cylinder to the circuit board is further denser to the porous structure, and the surface layer of the surface layer is easily formed as a whole, and the flexible coating of the silk coating layer is obtained, for example, Fuji. —Silysia

Syl〇Ph〇blc, Syl〇sphere, T〇kus^[:], Asahi Glass Sl-tech (share) company Sunsphere, MS GEL, Sunlovely, Mizusawa Chemical Industry Co., Ltd. (4) This product can be considered as a trademark. / Name of the mouth to be found In the present invention, the porous fine particles are contained in the curable resin composition and formed of a coating layer. 2〜30质量份。 The hardening resin composition, the content of the porous microparticles: 100 parts by mass of the fat solid component is 0. ^ 50 parts by mass, preferably 0. U quality _1 injury 'more preferably 0. 2~30 parts by mass. When the content exceeds 5 parts by mass, the surface curvature increases, or the mechanical strength, particularly the elongation, disappears, and peeling or cracking occurs during bending, or whitening occurs, which is not preferable. Moreover, if it is less than 〇·1 part by mass, the effect of improving the viscosity is small. In the present invention, the curable resin composition forming the surface layer is not particularly limited. In addition to the above-mentioned porous fine particles, a curable resin composition which is generally used for surface coating (solder resistance) can be used. The curable resin composition may be thermosetting or photocurable, or may be a resin composition having both thermosetting properties and photocurability. The thermosetting resin composition, for example, is exemplified as the present specification - part 14 200921882 ΐ the product, or (4) the linalt composition ί hardening component. Photocurable tree test substance == Photoacid (ester) or methyl acetoacetate (vinegar), etc. Photosensitive ΐΐ ΐΐ ΐΐ ΐΐ 之 之 之 之 之 之 之 之 之 之 之 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化 硬化n fine and fine ^ after hardening, usually a solution composition. The concentration of the solid content of the resin in the f is preferably from about 2 g to 8 g% by mass of the bath composition, and the solution viscosity thereof is not particularly limited. Xuan 2 5 ^ 100 〇 Pa - s 1 〇 M 〇〇 Pa . s , !6〇〇=: workability or solution property, and the solvent of the solution composition obtained by the hardened insulating film, preferably: a nitrogen-containing solvent such as N,N-dimethyletheneamine, N, N-Diethylethylamine, N,N-monodecylamine, n,N-diethylformamide, N-methyl-2-pyrrolidone, 1'3-dimercapto-one 2 - imidazolidinone, N-decyl caprolactam, etc.; solvent containing sulfur atom, such as dimethyl hydrazine, diethyl sorbite, dimethyl stone, diethyl sulfone, hexamethylene sulfonate Amidoxime or the like; an oxygen-containing solvent, such as a phenolic solvent, cresol, phenol, dinonylphenol, etc.; a glycol diglyme-based solvent, diethylene glycol dimethyl _ (diglyme), three Triglyme, tetraglyme, tetraglyme, etc.; ketone-based solvent, acetophenone, phenylpropanol, hexamethylene ketone, rivierol Ether solvent, ethylene glycol, Oral bentane, tetrahydrofuran, etc.;, lactone-based solvent, r-butyrolactone, etc. In particular, it is preferred to use N-fluorenyl- 2 - hydrazine, n, N-dimethyl sulfoxide, Ν, Ν-dimercaptomethylamine, N,N-diethyl decylamine, N,N-dimercaptoamine, N,N-diethylacetamide, τ-butyrolactone, Triethylene glycol dimethyl group or the like. Further, the 'curable resin composition may contain a pigment such as a hot-melt pigment such as a coating agent, an anti-recording agent or an ion trapping agent, which is composed of a conventional curable resin. Foaming agent or coating is about 1~100_ thick, ^ field, _ thickness is about 0.5~200_, especially about ~21〇t, preferably; ^〇〇 printing with ~,.=.= etc. The coating is followed by heat treatment for 6 minutes or H12Q minutes, preferably about 1 to 1. The heat treatment is performed by heating, hardening, and the like. In addition to heating, it is also possible to use a far-infrared surface coating to make the circuit pattern Q elastic coefficient of about 10~1200μρ well buried, and a sufficient level of electrical insulation at the beginning of 25〇C (:, ==1Q~1 The flexibility of the surface is good, and it is preferably 103⁄4 • (10) or more. The resistance of the product is _ • (10) or more, which is smaller than the curve, plane _, and touch. More preferably, it is a chemical agent, it is resistant to minerals, it is long-lasting, and it is resistant to dissolution and can reduce viscosity. The surface coating has good characteristics as described above. The carrier tape of the present invention has a viscosity of a coating layer of ±* ' _ not adhered to the surface layer of the sus raw circuit board, and can be used by ^, s 1 0〇 is not taken from polyimine. Such a special type of porous particles is used to select the characteristics and quantity of the porous particles, and the flexible circuit board for a conveyor tape package of the invention is particularly concentrated; (10) Polymerization ★: (4). As a result, the transfer of the surface-reducing 16 200921882 and the use of the flexible circuit board to form a flexible circuit board using a flexible circuit board release film are wound around the reel. Also, make ^, Yuan body. As a result, it is possible to seal the wheel by the tape which is attached without the road plate, and the flexible tape for the tape package of the second to the second, and the transfer tape of the present invention is not separated by the release film. Winding the reel. When the curable resin composition is applied and the surface layer is formed in the hard board, the heat treatment of the far-infrared ray irradiation is simple: it is easy to use for a short period of time. Further, the wheeling of the present invention can improve the rotatory property in the mounting step of production (embodiment). Further, in the following examples of the present invention, the measurement and evaluation were carried out by the following method. [Resistance to SUS (thermosetting)] The composition for the surface coating is applied to abundance (UPILEX35SGA), and heat treatment is carried out at 8 (rc for H production in a poly-imine film for 90 minutes to form/produce ^ ^加,处理' Followed by _ Intake 膻 太 太 + + + + + + + + + + m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m m Place it upside down to 14〇〇C;, 'With 7 义月美4曰r',, 4U L hot plate, place SUS hammer on it (500g in bottom area cm f) 30 When the second is not lifted, it is set to 〇 when it is not adhered ( 〇: it is x (bad) when it is not _. [Adhesion resistance with polyimine (thermosetting)] Coating the surface coating composition Ube Industries Co., Ltd. produced a polyimine film (ILEX35SGA) and heat treated at 8 (TC for 3 minutes, followed by i2 (Tc heat treatment for 90 minutes to form a film for evaluation of thickness about i〇Mm thick. The film sample was cut into a width of 2.5 cm and a length of 5 cm to prepare a sample. The sample was placed with the coating film facing up on a hot plate heated to 6 (TC), and the polyimine film of Ube Industries was superimposed thereon. (UPILEX35SGA area lc Mx5cm), after the weight of the copper component of the running component for 30 seconds, 17 200921882 is not sticky, it is set to 〇 (gQQd) in the time of Yalai, and x (bad) in fine time. [Adhesion resistance with SUS (far infrared) Hardening)] The layer composition was applied to the film for evaluation of the thickness of the polytheneimine film made by Ube Industries Co., Ltd. The evaluation was used for the opening of the mouth, and the SUS clock was placed thereon (bottom area 2_cm Ϊ Jx(bj) When ν, θ starts, when it is not adhered, it is determined to be 〇(g〇〇d). When it is adhered, it is determined to be [adhesive with polyimine (far-infrared hardening)]. The imine film reported a in 吏 heat treatment at 16 ° C for 10 minutes, and the evaluation of 2' and thickness (4). The film sample for evaluation was cut into a width.

To foV two L (10)' f to work ί. The sample was placed on the coated surface with the surface facing up on the heating, R, , , ^, on the /' overlap on the U-imide production of the polyimide film (UPILEX35SGA Ξ ^% of the copper weight of 3Q seconds, not adhered to the poly The yoghurt is made of 亚 〇 (go〇d), and it is set as χ (_. against [surface hardness] electrolysis (4). 12 (rc heating at _min, forming a thickness such as 7_°, the _ price is evaluated by JIS κ 5600-5-4 scratch hardness (pencil method). ^ [Initial elastic coefficient] will be hard = thick minute ' Then, it was heat-treated at 12 Torr for 90 minutes, and the sheet sample was cut into a width (10), a length _, a head gap 5 (row = .5_, tena [solder heat resistance], and an electrolytic thickness of 35//m). The surface of the copper case coated with the surface coating layer was heat-treated at 200921882 Z for 30 minutes, and then heated to a thickness of about 1 G for the film. The film for evaluation was coated with ▼ riiii Mot: 11 ; SUNFLUX SF~270)^5 C ΜΙα 1G seconds. After observation, the sample shape g is 〇(g〇〇d), and the expansion and the illusion are represented by x(bad). City time 疋[翘•曲] „ !;ΐπΐ; ί!^δ^^Μ(υριTM5δ^ 丄 〇 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 80 〇 〇 〇 〇 〇 30 30 30 30 30 30 30 30 30 30 The film was etched into a film, and the hardened touch film was made 5Cmx5cm. When the height of the four corners was less than 1mm, it was determined by x(bad) when it was 1_. The compound used in each case was explained below. Epoxy resin, hard material, and porous fine particles. [tetracarboxylic acid] 2, 3' 3 , 4'-biphenyltetracarboxylic dianhydride (manufactured by Ube Industries, Ltd.) [Diamine compound] Fulcone diamine (made by Wako Pure Chemical Co., Ltd.)

L bis-carboxy- 4-aminophenyl decane (4, 4, dicarboxyphenyl ketone) (manufactured by Wakayama Seiki Co., Ltd.) [monoamine with one alcoholic hydroxyl group] 3 — Aminopropanol (manufactured by Wako Pure Chemical Co., Ltd.) [Reactive polar group-containing diol] 2' 2 - bis(methyl)propionic acid (Guangrong Perstorp Co., Ltd.) [Polycarbonate Alcohol diol] Kuraray P〇iyol c — 2〇15 (manufactured by Kuraray Co., Ltd., average 2000) [Diisocyanate compound] ω-bis(3~~aminopropyl)polydidecyloxane Amine equivalent: 46, manufactured by Chemical Industry Co., Ltd.) 八15 Diamino- 3, 3' 19 200921882 4, 4'-diphenylmethane diisocyanate (manufactured by Japan Polyurethane Industry Co., Ltd.), [Organic solvent ] 7 —Dinger S ((Huangchun Lele Co., Ltd.) [Epoxy resin]

Epolead2021P (manufactured by Daicel Chemical Industry Co., Ltd.) Epicoat828EL (manufactured by Japan oxy resin Co., Ltd., epoxy equivalent: 184~194) [Block isocyanate]

Takenate B830 (manufactured by Mitsui Takeda Chemical Co., Ltd., NC〇 (wt%): 7. 0 duranateME20 - B80S (assembled by Asahi Kasei Chemicals Co., Ltd., NC〇 (wt%): 5.8) [hardening catalyst] DBU ( Aldrich Co., Ltd., 1,8-diazabicyclo[5,4,0]-7-undecene

Curezol2E4MZ (manufactured by Shikoku Chemical Industry Co., Ltd., 2~ethyl-1-4 曱 base mouth σ sit) [filling material]

Aerosi 1130 (specific surface area (BET method) manufactured by Japan Aerosil Co., Ltd.: 130m2/g)

Aerosil R972 (Specific surface area (BET method) manufactured by Japan Aerosil Co., Ltd.: 110 m2/g) [Phenol resin] Phenol·曱MmH-1 (manufactured by Mingwa Chemical Co., Ltd.) [Porous particles]

SylophobiclQO (hydrophobic cerium oxide gel FujKiiysia Chemical Co., Ltd.) Laser method average granules 2.7 / im specific surface area (BET method): 300m2 / g oil absorption: 240ml / 100g)

Fuji-Silysia Chemicals (S) il y s i a31 OP (Hydrophilic oxidized second gel 20 200921882 2.7#m Specific surface area (BET method): 300in2/g Average laser size by the system) Oil absorption: 310mV100g)

Fuji-Silysia Chemical (Share) Common Surface Area (BET Method)·· 700m2/g

Silysia 710 (Hydrophilic Oxidized Oxide Electroplating System, Laser Method, Average Particle Size, Oil Absorption: 100 ml/100 g) [Reference Example Alcoholic Hydroxy-Terminal Iminoimine Oligomer Solution Manufactured with a Nitrogen Introduction Tube, Dean-Stark Container , the capacity of the cooling tube is 5 liters ^ glass separable flask, adding 2,3,3',4, _biphenyltetracarboxylic acid di wild ijmg (5 m), ethanol 507 g (11 m) and 7 2-butyrolactone 2〇92g was scrambled at 90 C for 1 hour under a nitrogen mouse. Next, 3 -Aminopropanol 37_mol), 4.6 g (2.5 m) of isophorol and the same diamine were added, and under nitrogen atmosphere, i2 (rc plus 2 hours, 180 ft heating for 2 hours, The sufficiency of the polyamidization reaction is carried out by the blowing of the wire into the reaction liquid. The imine resin solution was produced in a glass-fired product having a capacity of 5 liters of a nitrogen gas introduction tube, and was added to Kuraray.

Polyol C—2015N 600g (0.3 mol), 4,4,-diphenyldecane diisocyanate 188g (0.75 mol) and 7-butyrolactone 535g under nitrogen atmosphere It is stirred for 3 & hours. Next, 2,2-bis(4-pyridyl)propionic acid 40. 2g (0.3 mol,) 'Mike test 1 synthesized alcoholic hydroxy-terminal quinone imine oligomer solution 499g (〇. 3 Mole), r-butyrolactone 100 g, stirred at 8 Torr: 10 hours. The modified polyimine resin solution obtained was a solution having a polymer solid concentration of 55 wt% and a viscosity of 256 Pa·s. (Logarithmic viscosity β inh is 〇. 230) [Reference Example 3] Polyimine polyoxymethane resin solution was prepared in a glass flask of 500 ml capacity, and 2,3,3,4,4-biphenyltetracarboxylate was added. The acid dianhydride 47.1 (0.16 mol) and the solvent triglyme (hereinafter sometimes abbreviated as TG) l〇〇g were placed under a nitrogen atmosphere at 8 Torr. 〇 Heat and stir. α, ω-bis(3-aminopropyl)polydimethyloxane (amine equivalent 460) 125. lg (〇.136 mol), TG 40 g, at 18 °t: heating and stirring for 60 minutes. Then 21 200921882 anti-f liquid, force to relieve the base -4 ~ aminophenyl) crucible can be mixed with dirty heating = ^ (0.024 m) and ah, reaction solution, polymer solids concentration. Obtained == sub- oxime oxygenation The imidization rate is substantially 100%. In the Q 200 / Fen liquid.醯[Example 1] r, 容三璃2 Example 2 obtained polycarbonate modified polyamidene tree phase in polycarbonate § modified poly phthalimide resin (10) parts by mass, added % milk tree month Day (Ep〇lead2021P) l〇皙旦乂八山机^ ί k (takenateB830) 20 parts by mass, 栌俨|, and isoamyl ester B80S) 30 parts by mass, benzoquinone resin H-f 2X = ^ S Purpose — # ^ Curezol2E4MZ 0. 5 ^ ^ ^ 〇BU °' 5 f * parts, all scooped, smashed into $ X - 881 and 7 - vinegar 60 mass and then added 7 parts by mass for the filler In the case of porous microparticles, 'additional porosity ί 化 夕 夕 夕 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Membrane, evaluation and sus surface and polysilicon surface hardness, initial elastic modulus, solder heat resistance, and listening. In the W table [Examples 2 to 6], the pure particles of the above-mentioned Example 1 were added in the same manner as in the above, and the coating was carried out in the same manner as in Example 1, and the obtained powder was obtained in Reference Example 3. The amount of the imine stone oxygen burning resin solution, the hardening catalyst 2 round · 2 mass ΐ i: e ^ average _, mixed. Further, as a filler, 23 mericle Aer〇sl1130, porous yttrium (Silysia 31 〇 P) as a porous fine particle, and a mixture of three parts were used, and three kinds of light kneading were used to obtain a coating layer 22 200921882. . The composition for the surface coating layer was evaluated in the same manner as in Example 1. These results are shown in Table 1. [Comparative Example 1] The sheet was blended in the same manner as in Example 1 without adding porous cerium oxide to obtain a polycarbonate polyimide composition. The composition for the surface coating layer was the same as that of Example 1. The results such as S Hai are shown in Table i. The composition is hard-hardened or far-infrared hard film, and cannot satisfy the adhesion resistance to the SUS surface and the polyimide. [Comparative Example 2] Oxygenated cerium oxide was obtained in the same manner as in Example 3 to obtain a polyimide composition. The film composition was evaluated in the same manner as in Example 1 on the composition of the present invention. Not d. The price of the hybrid is obtained by heat hardening or far infrared ray hardening. Porous microparticles 'except for the addition of Table 1 for ^__ road base ^g can meet 200921882 Example 1 Polymer Reference Example 2 (parts by mass) 100 Multi-grain particles SyniophobiclOO (parts by mass) 2 Silysia 310P (parts by mass) - Silysia710 (mass份) The result of the evaluation and the adhesion of the SUS surface (thermosetting) Example 2 Reference Example 2 ΠοΓ Implementation Implementation Implementation Comparison Comparison Comparative Example 3 Example 4 Example 5 Example 6 Example 7 Example 1 Case 2 Example 3 Reference Reference 4 Reference Reference Reference Reference Example 2 Example 2 Example 2 Example 2 Example 3 Example 2 Example 3 Example 2 100 100 100 100 100 100 100 100 - 70 5 10 - 10 20 Adhesion resistance with polyimine (thermosetting) Adhesion resistance to SUS surface (far infrared ray hardening) and viscous viscosity of polystyrene (far infrared ray hardening) Surface hardness initial elastic modulus (MPa) Ping tin heat resistance 勉 ~ ~ ~ ~ ~ ~ ~ Η Η 2 2

2Η ^290^ 〇〇〇 XX 〇〇〇〇 XX 〇〇〇〇 XX 〇〇〇〇 〇 H 2H 2H 2B Η 3Β — 320 950 470 210 400 — 〇0 〇〇〇0 〇〇〇〇〇X (Industry The utility model relates to the invention according to the invention, which can provide a crucible tape for sealing the crusted tape, and a conveying sealing circuit formed by using the flexible circuit board, and the conveying tape packaging flexible circuit The result of the board is 'can be used to cut the tape difficult thief (four) the board of the board (four) and the lifting of the line [four-dimensional description] representative part of the outline Figure 1 shows the transport tape package I # 24 of the present invention 200921882 view. Fig. 2 is a partial cross-sectional view showing the line A - A' of Fig. 1. Fig. 3 is a partially schematic plan view showing another representative example of the transfer tape package of the present invention. Fig. 4 is a partial cross-sectional view showing the line B - B' of Fig. 3. [Main component symbol description] 1 Insulating film 2 Adhesive layer 3 Circuit pattern 3a Inner lead (circuit pattern) 3b Outer lead (circuit pattern) 3c Test pad (circuit pattern) 4 Component hole 5 Curved slit 6 Bump 7 Semiconductor wafer 8 Flexible resin layer 9 Surface coating layer (solder resist layer) 10 Semiconductor sealing resin 11 Perforated hole (chain gear hole) 12 Insulating film 13 Circuit pattern 13a Inner lead (circuit pattern) 13b Outer lead (circuit pattern) 13c Test Pad (Circuit Pattern) 14 Bump 15 Semiconductor Wafer 16 Cover Layer (solder Mask) 25 200921882 17 Underfill 18 Perforated Hole (Buckle Gear Hole)

Claims (1)

200921882 X. Patent application scope: 1. A flexible circuit for a conveyor tape package, characterized in that: 'an insulating film; a circuit pattern' is formed on the surface of the insulating film. The surface coating layer contains a resin hardened material and a plurality of materials f At least part of the case. The mouth is uncle, and protects the above circuit. Figure 2. As claimed in the first paragraph of the patent application, the viscosity of the cover of the watch meets the requirements of the flexible circuit board in the 14: private: sealed body, adhered to the poly The conditions of the imine. It is not attached to SUS, and is not in the range of 0.1 to 50 parts by mass of the porous flexible circuit board. "(4) Hardened material_parts by mass, containing 4. The private circuit of the first application of the patent scope, the coffee machine, the flexible circuit board for the turntable package, the average particle size of the porous particles Most of the porous fine particles are in the thickness direction of the surface layer: 'The surface is present, and the porous flat 1 is provided with a flexible circuit board for a package, 200 mVg or more. Liao is 3〇/ζηι and has a specific surface area of 6. As claimed in the first paragraph of the patent application, the pore volume of the porous microparticles is 7, and the oil absorption of the refined linseed oil method is Q. ]ml々 above 5101-13-1 where the y tape package uses a pull-up circuit board, polyimine 27 272121 resin hardened. 9. If the towel is covered by the patented Gu Diyu, the transfer tape is slanted. t. The cured resin is hardened by far-infrared heat treatment. Plate, 10· The reel winding is carried out without the release film. The green circuit board, the 输送--type transfer tape package 'is formed using a flexible circuit board for the application of the package. - The surface is coated with a curable resin composition, a soy-forming resin, and after curing, the viscosity of the surface of the pre-porous compound is reduced. 1 When the stagnation is pulled, the hard 13 is as claimed. Among the items, 'hardened, it is presented in the brittle _ fat composition, the viscosity of its imine conditions. Na is not purchased in the 60 C. 14. As in the scope of patent application, the aforementioned hardening resin, It contains a modified resin composition, a fat, a styrene resin, a modified resin, a polyether-based imide resin, and at least one of the handles of the woven and (10) surface resin. XI. Schema: