200921343 -九、發明說明： -【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係一種具有較佳散熱性 能且成本較低之散熱裝置。 【先前技術】 眾所周知，中央處理器等電子元件在運行過程中產生 大量熱量。為防止該電子元件因熱量累積導致其溫度升高 :從而導致其運行不穩定，該電子元件通常需加裝一散熱裝 置以輔助其散熱。 習知之散熱裝置包括貼設於電子元件之一散熱器及安 裝於散熱器一侧之一風扇。該散熱器具有複數間隔設置之 散熱片。該風扇通過風扇固定架安裝到散熱器上，其產生 之氣流吹向散熱器之散熱片，以便聚集在散熱器上之熱量 散發到外界環境中。惟，散熱片之氣密性差，風扇產生之 氣流只有部分通過散熱片，聚集在散熱器上之熱量無法有 效之排除，導致散熱器之散熱性能較差；若添加導風罩罩 設於散熱器上，又使散熱裝置之成本上升。 【發明内容】 一種散熱裝置，用於對電路板上之一電子元件散熱， 包括貼設於電子元件上之散熱器及安裝於散熱器一側之一 風扇，還包括設置於散熱器相對兩侧之複數熱管，該散熱 器包括一與電子元件貼設之基板及安裝於基板上方、兩端 貫穿並設有開口之導熱體，複數散熱片形成於該導熱體 6 200921343 • . ώ " .、、、片間隔設置且相鄰二散埶片門 •軋〜通道，該等散熱片整體沿時斜古;;、形成有連通之 於該導熱體一開口外側。 、' 傾斜，該風扇安裝 與習知技術相比，本發明散熱 兩端開口之導熱體内且春 熱片設置於- I於導熱體-開口之外側，風扇產生架而直接安 口流入’流經散熱片後自另一開口二“由導熱體-開 κ在確保散熱效率之同時有效控制了成本風罩引* 【實施方式】 柘閱圖1及圖2 ’本發明散熱褒置用以對安裏於兩路 板（圖未示)上之-電子元件（圖未示）散埶 置包括貼設於電子元件上散埶哭 …、μ政…、裝 相對二側面之複數埶管2 〇及Γ：；；/設置於散熱器10 1 及女裝於散熱器10另-側面之 f f L u4G安裝於散熱114G下方，以將散埶 裝置固定於電路板上。 狀… 該母-熱管20呈!^形’包括一水平放置之蒸發段2 及—豎直之冷凝段24。本實施例中，設置於散熱器扨一側 之熱官20為二根’在不同實施例中可根據實際需要而選 擇，也可將熱管設置為！；形，以加強散熱裝置之散熱效果。 該散熱器ίο包括一貼設於該電子元件之基板12及安 裝於基板12上方之導熱體14。 該基板12大致呈矩形，由導熱性能良好之金屬如銅、 鋁等材料製成。基板12之底面（圖未標）用於與電子元件 接觸，以吸收熱量，其上表面12〇中部連續開設有四並排、 200921343 且平行之凹槽122用以收容熱管20之蒸發段22。該基板 12下部相對兩侧分別形成有一缺口 124。該等缺口 124用 以與固定架40配合。 請同時參閱圖3,該導熱體14為前後兩端貫通並設有 開口之筒狀體，其橫截面為正方形。導熱體14靠近風扇30 一側之開口為進風口，與進風口相對之開口為出風口。該 導熱體14由一底板143、與底板143相對之一頂板141及 垂直連接底板143與頂板141相對兩侧之二侧板145圍設 而成，複數散熱片160形成於導熱體14内。 該導熱體14之頂板141、底板143及側板145均為具 有一定厚度之板體。該底板143之下部中間設有四連續且 平行之凹槽1430，該等凹槽1430與基板12之凹槽122對 應。基板12通過焊接或粘接與底板143固定連接，使底板 143之凹槽1430與基板12之凹槽122 —同形成四圓形通 槽，以收容熱管20之蒸發段22。分別位於散熱器10兩側 之四熱管20之四蒸發段22交錯設置於凹槽1430、122形 成之通槽中。二侧板145中部向外凸伸有一垂直於頂板145 之凸塊1451，四連續且平行之凹槽1453分別設置於每一凸 塊1451上。散熱器10每一側熱管20之二冷凝段24間隔 收容於該侧側板145之凹槽1453中。 散熱片160包括自側板145内表面延伸之複數第一散 熱片161、自另一侧板145内表面延伸之複數第三散熱片 165、自頂板141内表面延伸之複數第二散熱片163及自底 板143内表面延伸之複數第四散熱片167。每一散熱片160 8 200921343 自進風口一端延伸至屮 角傾斜設置。自進風口二:：且與其所在之内表面成銳 順時針方向傾斜設置。散熱片 —板片:=沿 設置，且相鄰二散埶片^n y 、 板體上均勻間隔 未標）。第一'第Γ 有連通之氣流通道（圖 16職導熱體…熱“1，，' 相互平行且長度均不等，：對：：母-第二散熱片⑹ 長度均不等。每熱片167相互平行且 ⑹。第一、第二二 平行於每一第四散熱片 直第二、第㈣：…、片161、165相互平行且分別大致垂 160圍-成η’:片163、167。導熱體14之中心由散熱片 圍5又成一因形通孔_，用以引導風扇30產生之氣 流。導熱體14進風口之四角上分別設置有四螺紋孔180 用以與螺釘80配合而將風扇固定於導熱體U前側。該導 熱體14及散熱片160為一體擠壓成型。 風扇30 $彳形結構，在其四角上分別設有一安裝孔 32。四螺釘80分別穿過該等安裝孔％並與導熱體μ :之 螺^孔180旋合，而將風扇30固定至導熱體14進風口處。 此日守風扇30之中心部分，即低風壓區對應導熱體14.之 通孔議，風Λ 3G之扇葉部分，即高風壓區對應散熱片 160。風A 30之扇葉沿逆時針方向設置，與其對應之散熱 月160之整體傾斜方向相反，以便扇葉旋轉產生之氣流由 導熱體14前側之開口吹至後側之開口，肖日夺氣流強制吹向 導熱體14較高溫處之頂板141、底板143及側板145，更 好地帶走導熱體14之熱量。 200921343 每一固定架40為一彎折金屬片體，包括收容於基板12 .缺口 124内之鎖止部42、由鎖止部42相對兩端向外彎折延 伸开> 成之二延伸部（圖未標）及由每一延伸部末端向下、 向外延伸形成之固定部44。該鎖止部42為一水平片體，其 上間隔開設有二固定孔420，二螺釘9〇分別穿過二固定孔 420並與基板12配合而將固定架固定至基板12上。每 一固定部44中部開設有一通孔44〇，螺杆件1〇〇穿過通孔 。40並與龟子元件兩側之電路板配合而將固定架4〇鎖固於 電路板上。此時，散熱裝置固定於電路板上。 、 請同時參閱圖3及圖4,使用時，基板12吸收電子元 件之熱量，然後經基板12及熱管2G將熱量傳導至導熱體 之頂板Ml、底板1C及側板145，再傳至導熱體q内 部之散熱片160。同時’風扇3〇產生之氣流由導熱體η 進風口進入導熱體14内部，流經散熱片16 14出風口流出，帶走導熱體 ：：體 :二性能。因風扇3G直接固定至導熱體η 使用風扇固定架，降低了散熱裝置之成本； 二兩熱體14内，且導熱 氣流有效地為散熱片⑽散熱，:需mi產生之 保散熱器散熱效率之同時有效控制了成:。4軍’在確 利申請综=’=符合發明專利要件，爰依法提出專 熟悉本案技藝之人 幸乂佺只苑例，舉凡 在发依本發明精神所作之等效修饰 10 200921343 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體組裝圖。 圖2係圖1中散熱裝置之立體分解圖。 圖3係圖2中散熱裝置之部分組合及氣流走勢圖。 圖4係圖2中散熱裝置之熱量導向圖。 【主要元件符號說明】 散熱器 10 基板 12 導熱體 14 執管 <、、、 20 蒸發段 22 冷凝段 24 風扇 30 安裝孔 32 固定架 40 鎖止部 42 固定部 44 螺釘 80、90 螺杆件 100 上表面 120 凹槽 122 缺口 124 頂板 141 底板 143 侧板 145 散熱片 160 第一散熱片 161 第二散熱片 163 第三散熱片 165 第四散熱片 167 螺紋孔 180 固定子L 420 通孔 440、 1600凹槽 1430 > 1453 凸塊 1451 11200921343 - IX. DESCRIPTION OF THE INVENTION: - TECHNICAL FIELD The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having better heat dissipation performance and lower cost. [Prior Art] It is known that electronic components such as a central processing unit generate a large amount of heat during operation. In order to prevent the electronic component from increasing its temperature due to heat accumulation: resulting in unstable operation, the electronic component usually needs to be equipped with a heat dissipating device to assist in heat dissipation. The conventional heat sink includes a heat sink attached to one of the electronic components and a fan mounted on the side of the heat sink. The heat sink has a plurality of fins disposed at intervals. The fan is mounted to the heat sink through a fan holder, and the generated airflow is blown to the heat sink of the heat sink so that the heat accumulated on the heat sink is radiated to the outside environment. However, the airtightness of the heat sink is poor, and the airflow generated by the fan only partially passes through the heat sink, and the heat accumulated on the heat sink cannot be effectively eliminated, resulting in poor heat dissipation performance of the heat sink; if the air guide cover is added to the heat sink Moreover, the cost of the heat sink is increased. SUMMARY OF THE INVENTION A heat dissipating device is configured to dissipate heat from an electronic component on a circuit board, including a heat sink attached to the electronic component and a fan mounted on one side of the heat sink, and further disposed on opposite sides of the heat sink. The plurality of heat pipes include a substrate attached to the electronic component and a heat conductor mounted on the substrate and having openings at both ends thereof, and the plurality of heat sinks are formed on the heat conductor 6 200921343 • . And the spacers are arranged at intervals and adjacent to the two dice gates, the rolling and the channel, and the fins are integrally inclined along the time; and are formed to be connected to the outside of the opening of the heat conductor. Compared with the prior art, the fan is installed in the heat-conducting body with the two ends of the heat-dissipating body and the spring heat sheet is disposed on the outer side of the heat-conducting body-opening, and the fan generates a frame and directly flows into the flow. After the heat sink, from the other opening 2, "the heat conductor - open κ effectively controls the cost of the windshield while ensuring the heat dissipation efficiency." [Embodiment] Referring to Figures 1 and 2, the heat dissipation device of the present invention is used for On the two-way board (not shown) - the electronic components (not shown) are placed on the electronic components, and they are placed on the electronic components, and they are cried..., the government, and the opposite sides of the two sides. And Γ:;; / set on the radiator 10 1 and women's on the other side of the radiator 10 ff L u4G is installed under the heat sink 114G to fix the heat sink device on the circuit board. Shape... The mother-heat pipe 20 The shape of the ^^' includes a horizontally placed evaporation section 2 and a vertical condensation section 24. In this embodiment, the thermal officer 20 disposed on one side of the radiator is two 'in different embodiments, according to the actual If you need to choose, you can also set the heat pipe to a shape to enhance the heat dissipation of the heat sink. The heat sink ίο includes a substrate 12 attached to the electronic component and a heat conductor 14 mounted on the substrate 12. The substrate 12 is substantially rectangular and is made of a material having good thermal conductivity such as copper or aluminum. The bottom surface of the substrate 12 (not labeled) is used for contacting the electronic component to absorb heat, and the upper surface 12 is continuously opened in the middle of the upper surface, and the parallel grooves 122 are used to receive the evaporation section 22 of the heat pipe 20. A notch 124 is formed on opposite sides of the lower portion of the substrate 12. The notches 124 are configured to cooperate with the fixing frame 40. Referring to FIG. 3 together, the heat conducting body 14 is a cylindrical body having an opening at the front and rear ends thereof and having an opening. The opening of the heat conductor 14 near the side of the fan 30 is an air inlet, and the opening opposite to the air inlet is an air outlet. The heat conductor 14 is composed of a bottom plate 143, a top plate 141 opposite to the bottom plate 143, and a vertical connection bottom plate 143. The two side plates 145 are formed on opposite sides of the top plate 141, and the plurality of heat sinks 160 are formed in the heat conductor 14. The top plate 141, the bottom plate 143 and the side plates 145 of the heat conductor 14 are all plate bodies having a certain thickness. A continuous and parallel groove 1430 is disposed in the lower portion of the bottom plate 143. The groove 1430 corresponds to the groove 122 of the substrate 12. The substrate 12 is fixedly connected to the bottom plate 143 by welding or bonding, so that the groove of the bottom plate 143 is fixed. 1430 and the groove 122 of the substrate 12 form a four-circular through groove to receive the evaporation section 22 of the heat pipe 20. The four evaporation sections 22 of the four heat pipes 20 respectively located on both sides of the heat sink 10 are alternately disposed in the grooves 1430, 122. In the through groove formed in the middle of the two side plates 145, a protrusion 1451 perpendicular to the top plate 145 is protruded outwardly, and four continuous and parallel grooves 1453 are respectively disposed on each of the protrusions 1451. The two condensation sections 24 of the heat pipes 20 on each side of the heat sink 10 are received in the grooves 1453 of the side side plates 145. The heat sink 160 includes a plurality of first heat sinks 161 extending from the inner surface of the side plate 145, a plurality of third heat sinks 165 extending from the inner surface of the other side plate 145, a plurality of second heat sinks 163 extending from the inner surface of the top plate 141, and A plurality of fourth fins 167 extending from the inner surface of the bottom plate 143. Each heat sink 160 8 200921343 extends from one end of the air inlet to the corner tilt setting. The air inlet 2:: and the inner surface of the air inlet is sharply inclined in a clockwise direction. Heat sink - plate: = along the setting, and the adjacent two pieces of the film ^n y, evenly spaced on the board is not marked). The first 'the third Γ has a connected airflow channel (Fig. 16 thermal conductors... heat "1,," are parallel to each other and the lengths are not equal, the pair: mother-second heat sink (6) are of different lengths. 167 are parallel to each other and (6). The first and second two are parallel to each of the fourth fins, the second, the fourth (4): ..., the sheets 161, 165 are parallel to each other and are substantially circumscribed by 160 - into η': sheets 163, 167 The center of the heat conductor 14 is formed by a heat sink 5 and a shape through hole _ for guiding the airflow generated by the fan 30. The four corners of the air inlet of the heat conductor 14 are respectively provided with four threaded holes 180 for engaging with the screw 80. The fan is fixed to the front side of the heat conductor U. The heat conductor 14 and the heat sink 160 are integrally extruded. The fan 30 has a dome-shaped structure, and a mounting hole 32 is respectively disposed at four corners thereof. The four screws 80 respectively pass through the mounting. The hole % is screwed with the screw hole 180 of the heat conductor μ: and the fan 30 is fixed to the air inlet of the heat conductor 14. The central portion of the fan 30, that is, the low wind pressure region corresponds to the heat conductor 14. Confucius, wind blade 3G blade part, that is, high wind pressure zone corresponding to heat sink 160. Fan A 30 blade edge The clockwise direction is opposite to the overall tilting direction of the corresponding heat dissipation month 160, so that the airflow generated by the rotation of the blade is blown from the opening on the front side of the heat conductor 14 to the opening on the rear side, and the airflow is forced to blow the hot body 14 to a higher temperature. The top plate 141, the bottom plate 143 and the side plate 145 further remove the heat of the heat conductor 14. 200921343 Each of the fixing frames 40 is a bent metal sheet body, and includes a locking portion 42 received in the substrate 12 and the notch 124. The second end portion (not shown) and the fixing portion 44 formed by extending downward and outward from the end of each extending portion are bent outwardly from opposite ends of the locking portion 42. The locking portion 42 is formed by extending downwardly and outwardly from the end of each extending portion. A horizontal plate body is provided with two fixing holes 420 spaced apart from each other, and the two screws 9 穿过 are respectively passed through the two fixing holes 420 and cooperate with the substrate 12 to fix the fixing frame to the substrate 12. Each of the fixing portions 44 has a central portion The through hole 44〇, the screw member 1〇〇 passes through the through hole. 40 and cooperates with the circuit board on both sides of the turtle element to fix the fixing frame 4〇 on the circuit board. At this time, the heat sink is fixed on the circuit board. Please refer to Figure 3 and Figure 4 at the same time. The board 12 absorbs the heat of the electronic component, and then transfers the heat to the top plate M1, the bottom plate 1C and the side plate 145 of the heat conductor via the substrate 12 and the heat pipe 2G, and then to the heat sink 160 inside the heat conductor q. At the same time, the fan 3 is generated. The airflow enters the heat conductor 14 from the air inlet of the heat conductor η, flows out through the air outlet of the heat sink 16 14 , and carries away the heat conductor: body: two performance. Since the fan 3G is directly fixed to the heat conductor η, the fan holder is used, which reduces The cost of the heat sink; within the two hot bodies 14, and the heat-conducting airflow effectively dissipates heat for the heat sink (10): the heat dissipation efficiency of the heat sink generated by the mi is effectively controlled. The 4th Army's application in the confirmation of profit = '= meets the requirements of the invention patent, and the person who is familiar with the skill of the case in accordance with the law is fortunate to have only the court, and the equivalent modification 10 200921343 or change in the spirit of the invention It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat sink of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Figure 3 is a partial combination of the heat sink and the flow chart of Figure 2. Figure 4 is a heat guide diagram of the heat sink of Figure 2. [Main component symbol description] Heat sink 10 Substrate 12 Thermal conductor 14 Tube control <,,, 20 Evaporation section 22 Condensation section 24 Fan 30 Mounting hole 32 Fixing bracket 40 Locking portion 42 Fixing portion 44 Screw 80, 90 Screw member 100 Upper surface 120 groove 122 notch 124 top plate 141 bottom plate 143 side plate 145 heat sink 160 first heat sink 161 second heat sink 163 third heat sink 165 fourth heat sink 167 threaded hole 180 fixed piece L 420 through hole 440, 1600 Groove 1430 > 1453 Bump 1451 11