TW200919761A - Production line module for forming multiple sized photovoltaic devices - Google Patents

Abstract

The present invention generally relates to a sectioning module positioned within an automated solar cell device fabrication system. The solar cell device fabrication system is adapted to receive a single large substrate and form multiple silicon thin film solar cell devices from the single large substrate.

Description

200919761 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION Embodiments of the present invention generally relate to a production line module for forming solar cell components of various sizes. [Prior Art] Photovoltaic (PV) components or solar cells are components that convert sunlight into DC C DC electrical power. A typical thin film PV element or thin film solar cell has one or more p-i-n junctions. Each p-i-n junction includes a p-type layer, an intrinsic layer, and an n-type layer. When the ρ-i-η junction of a solar cell is exposed to sunlight (consisting of the energy of a photon), sunlight is converted into electricity by the PV effect. Solar cells can be embedded in larger solar arrays. Solar arrays can be fabricated by attaching a large number of solar cells and bonding them to a panel with specific frames and connectors. Generally, a thin film solar cell includes an active region or a photoelectric conversion unit, and a transparent conductive oxide (TCO) film provided as a front electrode and/or a back electrode. The photoelectric conversion unit includes a 石-type 夕 layer, an η-type fragment layer, and an intrinsic type (i-type) sap layer between the p-type and the η-type sap. Several types of ruthenium films, including microcrystalline silicon film (pc-Si), amorphous australis (α-Si), and polycrystalline cation (po) y-Si, can be used to form P-type, n-type, and/or i-type layers of the photoelectric conversion unit. The backside electrode can contain one or more conductive layers. There is a need for an improved process for forming a solar cell that has good interface contact, low contact resistance, and provides high overall performance. As traditional energy prices rise, there is a need for a low-cost way to generate electricity using low-cost solar cells. Conventional solar cell systems. The process is labor intensive and has a variety of interferences that can affect line production, solar cell cost, and component yield. For example, for a particular application, a particular solar cell component size is required. Conventional solar cell production lines can only manufacture single-sized solar cell components, or require significant downtime to manually convert the solar cell production line process to fit different substrate sizes and fabricate solar cell components of different sizes. Therefore, there is a need for a manufacturing process capable of implementing all stages to produce a production line of solar cell components of a plurality of sizes from a single large substrate. SUMMARY OF THE INVENTION In an embodiment of the invention, a module for dividing a solar cell component includes an inlet conveyor, a scribing mechanism, a first placement mechanism, and a first actuator, the inlet The transmitter is configured to receive an instruction from a system controller and to transmit a solar cell component to a scribe line of the module, the scribe mechanism being configured to receive an instruction from the control unit and a pattern is drawn into a first surface of the solar cell component, the first placement mechanism is configured to receive an instruction from the system controller and accurately position the lined solar cell component in a first crack Above the mechanism, and the first actuator is configured to receive an instruction from the system controller and raise the first rupture machine 9 200919761. In another embodiment of the present invention, a method for dividing a partially processed solar cell component, comprising: receiving a substrate having a processing surface; forming a germanium layer on the processing surface; After forming the germanium layer, the substrate is divided into first and second blocks; and the first block is transferred to the next station for further processing. In another embodiment of the present invention, a system for manufacturing a solar cell component includes a substrate receiving module, a combination tool, a back contact deposition chamber, a substrate dividing module, and a system controller, the substrate receiving The module is adapted to receive a substrate, the combination tool having a processing chamber adapted to deposit a germanium-containing layer on a surface of the substrate, the back contact deposition chamber being configured to deposit a back contact layer on the surface of the substrate, the substrate The partitioning module is constructed to divide the substrate into two or more blocks, and the system controller is used for controlling and coordinating the substrate receiving module, the combination tool, the processing chamber, the back contact deposition chamber, and the substrate dividing module. Various functions. In still another embodiment of the present invention, a method of processing a solar cell component includes cleaning a substrate to remove one or more contaminants from a surface of the substrate; depositing a light absorbing layer on the surface of the substrate; Removing an area of at least a portion of the light absorbing layer; depositing a back contact layer on the surface of the substrate; dividing the substrate into two or more blocks; performing a surface on one of the blocks An edge removal process; bonding a back glass substrate to a surface of one of the blocks to form a composite structure; and attaching a junction box to the composite structure. 10 200919761 [Embodiment] Embodiments of the present invention generally relate to a system for forming a solar cell element using a processing module suitable for performing one or more processes in forming a solar cell element. In one embodiment, the system is adapted to form a thin film solar cell component by receiving a large unprocessed substrate and performing multiple deposition, material removal, cleaning, partitioning, bonding, and testing processes to form multiple A completed, functional, and tested solar cell component can now be loaded and transported to an end user for installation at the desired location to generate electricity. In one embodiment, the system is capable of receiving a single large unprocessed substrate and fabricating a plurality of smaller solar cell components. In one embodiment, the system is capable of varying the size of solar cell components fabricated from a single large substrate without the need to manually move or change any of the system modules. Although the following discussion primarily describes the formation of tantalum thin film solar cell components, the apparatus and methods described herein can also be used to form, test, and analyze other types of solar cell components such as melon-V solar cells, thin film submerged compounds. (chalcogenide) solar cells (eg C1GS, CdTe cells), amorphous or nanocrystalline solar cells, photochemical solar cells (eg dye-sensitized), wafer solar cells, organic solar cells or other similar Solar cell components are therefore not intended to limit the scope of the invention. The system is typically used to form automated processing modules and automation equipment for solar cells that are interconnected by an automated material handling system. In one embodiment, the system is a fully automated solar cell component production line designed to reduce and/or eliminate the need for human interaction and/or labor intensive steps to improve component reliability and process repeatability. Sexuality and the operating costs of forming a process. In one configuration, the system is adapted to form a plurality of tantalum thin film solar cell elements from a single large substrate, and generally includes: a substrate receiving module adapted to receive the incoming substrate, one or more having at least one suitable for processing in the substrate An absorbing layer deposition assembly tool for depositing a processing chamber containing a ruthenium layer on the surface, one or more back contact deposition chambers adapted to deposit a back contact layer on the processing surface of the substrate, one or more suitable for processing the surface from each substrate a material removal chamber for removing material, one or more partitioning modules for dividing the processed substrate into a plurality of smaller processed substrates, a solar cell packaging device suitable for heating and exposing the composite solar cell structure to a relatively high pressure A hot-pressed (aut 〇c 1 ave ) module under pressure, a junction box attachment area for attaching a connecting element that enables the solar cell to be connected to an external component, and one or more suitable for testing Each fully formed solar cell component demonstrates its qualified quality assurance module. The one or more quality assurance modules typically include a solar energy simulator, a parametric test module, and a shunt fault (s h u n t b u s t) and a qualification module. Figure 1 shows an embodiment of a processing sequence 100 comprising a plurality of steps (i.e., steps 1 0 2 - 1 4 2 ), each step for using the novel solar cell production line 20 described herein. 0 forms a solar cell element. The structure, the number of processing steps, and the order of processing steps in the processing sequence 1000 are not intended to limit the scope of the invention described herein. 2 is a plan view of one embodiment of a production line 200, which is intended to illustrate some typical processing modules and process flows through the system, as well as other related aspects of system design, 12 200919761 and thus without limitation The scope of the invention. In summary, system controller 290 can be used to control one or more components in solar cell production line 200. The system controller 290 is typically designed to facilitate control and automation of the entire solar cell production line 200, and typically includes a central processing unit (CPU) (not shown), memory (not shown), and Support circuit (or 1/0) (not shown). The CPU can be one of any type of computer processor used in industrial devices for controlling various system functions, substrate movement, chamber processing, and supporting hardware (eg, sensors, robots, motors, lights) Etc.), and monitor programs (such as substrate support temperature, power supply variables, room processing time, I / O signals, etc.). The memory is connected to the CPU and can be one or more readily available memory such as regional or remote random access memory (RAM), read only memory (ROM), floppy disk, hard drive or any other Form of digital memory. Software instructions and information can be encoded and stored in memory to indicate C P U. The support circuit is also connected to the CPU for supporting the processor in a conventional manner. The support circuit can include a cache, a power supply, a clock circuit, an input/output circuit, a subsystem, and the like. • The program (or computer command) readable by the System Controller 290 determines which task is performed on the base unit. Preferably, the program is a software readable by the system controller 2000, which includes code to perform tasks related to monitoring, performing, and controlling the movement, support, and/or placement of the substrate, and in the solar cell production line 2 Various processing method tasks and various chamber processing method steps implemented in 0 0. In one embodiment, the system controller 900 also includes a plurality of programmable logic controllers (PCLs) for locally controlling one or more modules in solar cell production, and processing the entire tera 13 200919761 A high-end strategy for moving, scheduling, and operating material handling system controllers (such as PLCs or standard computers) on the solar cell production line. Examples of system controllers, distribution control structures, and other system control structures for one or more of the embodiments described herein can be found in U.S. Provisional Patent Application Serial No. 60/9, 6, 077, incorporated herein by reference. . The solar cell 300 shown in the processing sequence shown in Fig. 1 and the components shown in the solar cell production line 2000 are shown in Figs. 3A-3E. Figure 3A is a simplified schematic of a single junction amorphous or microcrystalline solar cell 300 that can be formed and analyzed in the system described below. As shown in Fig. 3A, the single junction amorphous or microcrystalline solar cell 300 is oriented toward the source or solar radiation 310. The solar cell 300 typically includes a substrate 302 such as a glass substrate, a polymer substrate, a metal substrate, or other suitable substrate having a thin film formed thereon. In one embodiment, substrate 302 is a glass substrate having a size of approximately 2200 mm X 2600 mm x 3 mm. The solar cell 300 further includes a first transparent conducting oxide (TCO) layer 3 10 (eg, zinc oxide (ZnO), tin oxide (SnO)) formed over the substrate 302, formed over the first TCO layer 310. A first pin bond 320, a second TCO layer 340 formed on the first pin bond 320, and a back contact layer 350 formed on the second TCO layer 300. In order to enhance light absorption by enhancing light trapping, the substrate and/or one or more of the films formed thereon may alternatively be formed into a particular structure by moisture 'plasma, ion and/or mechanical processing. For example, in the embodiment illustrated in Figure 3A, the first TCO layer 310 is constructed and the subsequent film deposited thereon generally employs a surface configuration thereunder. In a structure of 14 200919761, the first pin bond 320 may include a p-type amorphous germanium layer 322, an intrinsic amorphous germanium layer 324 formed on the p-type amorphous germanium layer 322, and an intrinsic amorphous rock eve An n-type microcrystalline layer 326 on layer 324. In one example, the germanium-type amorphous germanium layer 32 can be formed to a thickness of between about 60 Å and about 30,000 A, and the intrinsic amorphous germanium layer 324 can be formed to be about 1,500 Å and about 3 5 The thickness between 0 0 A, and the n-type microcrystalline semiconductor layer 3 2 6 may be formed to a thickness of between about 100 Å and about 4,000 Å. The back contact layer 350 may include, but is not limited to, a material selected from the group consisting of Al, Ag, Ti, Cr, Au, Cu, Pt, alloys thereof, and combinations thereof. Figure 3B is a schematic illustration of an embodiment of a solar cell 300 that is a multi-juction solar cell oriented toward light or solar radiation 301. The solar cell 300 includes a substrate 306 having a thin film formed thereon, such as a glass substrate, a polymer substrate, a metal substrate, or other suitable substrate. The solar cell 300 further includes a first transparent conductive oxide (TCO) layer 310 formed over the substrate 302, a first pin bond 320 formed on the first TC0 layer 310, and a second pin formed on the first pin bond 320. Bonding 330' forms a second TCO layer 340 on the second pin bond 330, and a back contact layer 350 on the second TC0 layer 340. In the embodiment illustrated in Figure 3B, the first T C 0 layer 3 10 is constructed and the subsequent film deposited thereon generally follows the surface configuration beneath it. The first p - i - η junction 3 2 0 includes a p-type amorphous germanium layer 3 2 2, an intrinsic amorphous germanium layer 3 2 4 formed on the p-type amorphous germanium layer 32 2, and is formed in an intrinsic type The n-type microcrystalline germanium layer on the amorphous germanium layer 3 2 4 is 3 2 6 . In one example, the p-type amorphous germanium layer 32 2 can be formed to a thickness of between about 30,000 Å and about 15 2009 1976, and the intrinsic amorphous germanium layer 3 24 can be formed to be about 1,500 Å and about The thickness between 3500A, and the n-type microcrystalline semiconductor layer 326 may be formed to a thickness of between about 100 Å and about 400 Å. The second pin bonding 3 30 may include a p-type microcrystalline germanium layer 3 3 2, an intrinsic microcrystalline germanium layer 3 3 4 formed on the p-type microcrystalline germanium layer 3 3 2 , and an intrinsic microcrystalline germanium formed thereon. The n-type amorphous slab layer 3 3 6 on layer 3 3 4 . In an example, the p-type microcrystalline layer 3 3 2 may be formed to a thickness between 100 Å and about 4,000 Å, and the intrinsic microcrystalline 3 layer 3 3 4 may be formed to be about 1 0 0 0 The thickness between 0 A and about 3 0 0 0 A, and the n-type amorphous germanium layer 3 3 6 may be formed to a thickness of between about 100 Å and about 5,000 Å. The back contact layer 350 can include, but is not limited to, a material selected from the group consisting of Al, Ag, Ti, Cr, Au, Cu, Pt, alloys thereof, and combinations thereof. Fig. 3C is a plan view schematically showing the back surface of the solar cell 300 which has been fabricated in the production line 200. Figure 3D is a side cross-sectional view of a portion of the solar cell 300 shown in Figure 3C (see section A-A). Although Figure 3D shows a cross section of a single junction cell similar to that described in Figure 3A, it is not intended to limit the scope of the invention as described herein. As shown in Figures 3C and 3D, solar cell 300 can include substrate 302, solar cell component components (e.g., component symbols 3 1 0-3 50 ), one or more internal electrical connections (eg, side buss 3 ) 5 5. Cross buss 356), bonding material layer 360, back glass substrate 361, and junction box 370. The junction box 370 generally has two connection points 3 7 1 , 3 7 2 which are electrically connected to the partial solar cell 300 via the side busbars 355 and the crossbars 3 5 6 , which are in contact with the back contact layer 3 5 0 and active area communication of solar cell 300. In the following discussion, in order to avoid confusion, the related operations specifically performed on the substrate 301 of 200919761 will typically have one or more deposited layers (eg, component symbols 3 1 0 - 3 5 0 ) and/or one or more internal The substrate 3 0 2 on which the connection (for example, the side bus bar 3 5 5 and the cross bus bar 3 5 6 ) is disposed is referred to as an element substrate 303. Similarly, the element substrate 303 which has been bonded to the back glass substrate 361 by the bonding layer 3 60 is referred to as a composite solar cell structure 304. Figure 3E is a schematic cross-sectional view of solar cell 300 showing the different scribed regions used to form individual cells 382A-382B in solar cell 300. As shown in Fig. 3E, the solar cell 300 includes a transparent substrate 302, a first TCO layer 310, a first p-i-n junction 320, and a back contact layer 350. Three laser scribing steps are performed to create trenches 3 8 1 A, 381B, and 381C, which are typically required to form high efficiency solar cell components. Although formed together on the substrate 302, the individual cells 382A and 382B are isolated from each other by the insulating trenches 38 1 C formed in the back contact layer 350 and the first p-i-n junction 320. Further, a trench 3 8 1 B is formed in the first p-i-n junction 320 to electrically contact the back contact layer 350 with the first TC O layer 310. In one embodiment, the insulating trenches 38 1 A are formed by removing a portion of the first TC0 layer 310 by laser scribing prior to depositing the first p-i-n bond 320 and the back contact layer 350. Similarly, in one embodiment, the trench 3 is removed in the first p - i - η junction 3 2 0 by removing a portion of the first pin bond 3 2 0 before depositing the back contact layer 350 8 1 B. Although a single junction solar cell is shown in Figure 3, this configuration is not intended to limit the scope of the invention as described. 17 200919761 General solar cell formation process sequence Referring to Figures 1 and 2, the process sequence 1 0 0 usually begins in step 1 0 2, 'In this step, the substrate 3 0 2 is loaded into the solar cell production line 2000. Loading In module 202. In one embodiment, the substrate 3 0 2 is received in a "raw" state in which the edge, overall size and/or cleaning (c 1 e a η 1 i n e s s ) of the substrate 302 are not well controlled. Receiving the "raw" substrate 3 0 2 reduces the cost of preparing and storing the substrate 3 0 2 before forming the solar element, and thereby reducing the cost of the solar cell element, the cost of the device, and the manufacturing cost of the finally formed solar cell element. But 'generally' receives a layer of transparent conductive oxide (TC Ο ) already deposited on the surface of substrate 302 (eg, first TC layer 3 1 0 ) before the "raw" substrate is received into the system in step 102. The "raw" substrate 300 is advantageous. If a conductive layer (such as a TCO layer) is not deposited on the "original" substrate surface, then a front contact deposition step (step 107), which will be discussed below, is performed on the surface of the substrate 306. In one embodiment, the substrate 302 or 03 is loaded into the solar cell production line 200 in a sequential manner, and thus the wafer loading system in the form of a wafer cassette or batch is not used. Before moving to the next step in the process sequence, the substrate is unloaded from the boat box, processed, and then returned to the wafer cassette form and/or batch loading type of the system, which is time consuming and ' Reduced production of solar cell production lines. The use of batch processing is detrimental to certain embodiments of the invention, such as fabricating a plurality of solar cell elements from a single substrate. In addition, the use of batch form processing sequences generally hinders the use of asynchronous flow through the substrate of the production line' while the non-synchronous flow of the base 18 200919761 plate is considered during steady state processing, and when one or more modes Improved substrate yield can be provided when the group is shut down for repair or due to fault conditions. Typically, when one or more processing modules are shut down due to maintenance 'or even during normal operation, there is a significant additional time required to sort and load the substrate', so batch or wafer box-based solutions cannot achieve this. The production line of the production line. The surface of the substrate 302 was prepared in the next step (step 104) to prevent yield problems in a later process. In one embodiment of step 1 〇 4, the substrate is inserted into the front end substrate assembly module 204 for preparing the edge of the substrate 302 or 303 to reduce damage, such as the possibility of cracking or particle formation during subsequent processing. Damage to the substrate 03 or 03 can affect component yield and the cost of manufacturing available solar cell components. In the embodiment, the front end joint module 220 is used for rounding or beveling (b e v e丨) the edge of the substrate 3 0 2 or 300. In one embodiment, a diamond impregnated belt or disk is used for the edge abrasive material from the substrate 03 or 03. In another embodiment, a grinding wheel, sand blasting or laser ablation technique is used to remove material from the edge of the substrate 03 or 300. Next, substrate 302 or 303 is transferred to cleaning module 206, where step 106 or substrate cleaning steps are performed on substrate 302 or 303 to remove any contaminants found on its surface. Typical contaminants can include materials deposited on substrate 302 or 303 during substrate formation processes (e.g., glass manufacturing processes), and/or during shipment or storage of substrate 302 or 303. Typically, the cleaning module 206 uses a wet chemical washing and washing step to remove any unwanted contaminants. 19 200919761 In one illustration, the following process of cleaning the substrate 032 or 303 can be performed. First, the substrate 302 or 303 enters the contaminant removal zone of the cleaning module 206 from the transfer station or robot 281. Typically, the system controller 290 sets the timing for each of the substrates 3 0 2 that enter the cleaning module 2 〇 6 . The stain removal zone utilizes a dry cylindrical brush in combination with the vacuum system to remove and extract contaminants from the surface of the substrate 302. Next, the conveyor in the cleaning module 206 transfers the substrate 3 0 2 or 3 0 3 to the pre-cleaning zone where it is sprayed (t sprinkling the temperature, for example, 50 ° C of hot DI water from DI The water heater is applied to the surface of the substrate 03 or 303. Typically, since the element substrate 303 has a TCO layer disposed thereon, and since the TCO layer is typically an electron absorbing material, DI water is used to avoid possible contaminants. Any traces and ionization of the TCO layer. Next, the cleaned substrate 3 0 2, 3 0 3 enters the rinse zone. In the rinse zone 'substrate 3 0 2 or 3 0 3 with a brush (eg Belon) and hot water Wet cleaning. In some cases, detergents (such as AlconoxTM, Citrajet D, DetojetTM, TranseneTM, and Basic HTM), surfactants, pH regulators, and other cleaning chemistries can be used to remove the substrate from the surface of the substrate; Clean and remove unwanted contaminants and particles. The water recirculation system recycles the hot water stream. Next, in the final cleaning zone of the cleaning module 206, the substrate is washed with water at ambient temperature for 3 0 2 or 3 0 3 To remove any traces of contaminants. Finally, at In the dry zone, 'Using a blower to dry the substrate with hot air" 03 or 03. In one configuration, after the drying process is completed, a deionization bar is used to remove the charge from the substrate 3〇2 or 303. In the next step, or step 1 〇8, individual cells are electrically isolated from each other by scribing. Stain on TCO surface and/or bare glass surface 200919761 Dye particles can interfere with scribing procedures. In the line, for example, if a laser beam passes through the particle, it cannot draw a continuous line and will cause a short circuit between the cells. Furthermore, a scribe line pattern and/or TCO present in the battery after scribing Any particle fragments on it can cause shunting and non-uniformity between the layers. Therefore, a well-defined and well-maintained process is often required to ensure that contaminants are removed throughout the manufacturing process. In one embodiment, the cleaning die Group 206 is available from the Energy and Environmental Solutions department of Applied Materials, Inc., located in Santa Clara, Calif. Referring to Figures 1 and 2, in one embodiment, steps are taken Prior to 1 0 8 , the substrate 302 is transferred to a front end processing module (not shown in FIG. 2), wherein a front contact forming process or step 107 is performed on the substrate 302. In one embodiment, the front end processing module and The processing module 2 1 8 discussed below is similar. In step 107, one or more substrate front contact formation steps include one or more fabrication, etching, and/or material deposition steps for use in a bare solar cell substrate The front contact area is formed on 312. In one embodiment, step 107 generally includes one or more PVD steps for forming a front contact area on the surface of the substrate 306. In one embodiment, the front contact region contains a transparent conductive oxide (TCO) layer, which may contain a group selected from the group consisting of zinc (Zn), Ilu (A1), indium (In), and tin (Sn). Set of metal elements. In one example, zinc oxide (ZnO) is used to form at least a portion of the front contact layer. In one embodiment, the front end processing module is an ATONtm PVD 5.7 tool available from Applied Materials, Inc. of Santa Clara, Calif., in which one or more processing steps are performed to form a step prior to deposition. In another embodiment, one or more of the 21 200919761 CVD steps are used to form a front contact area on the surface of the substrate 302. Next, the element substrate 303 is transferred to the scribing module 2 〇 8, and the step 1 〇 8 or the front contact isolation step is performed on the element substrate 309 to electrically isolate different regions of the element substrate 303 from each other. The material is removed from the surface of the substrate 303 by using a material removal step such as a laser ablation treatment in the step 〇8. The success criteria for step 108 is to achieve battery-battery and battery-edge isolation of Liangye while minimizing the scribe line & embodiment using '鈥: citrate (Nd: YV〇4) laser source from 1 The dry substrate 303 surface is ablated to form a line that electrically isolates a region of the element substrate 3〇3 from a region. In one embodiment, the laser scribing process used in step i uses a pulse laser of 1 〇 6 4 nm wavelength to pattern the material deposited on the substrate 302 to isolate each individual cell constituting the solar cell. (For example, refer to batteries 3 82A and 3 82B). In one embodiment, a 57 7 m2 substrate laser scribing module obtained from Applied Materials, Inc., located in Santa Clara, Calif., is used to provide simple and reliable optical components and substrate motion for precise electrically isolating component substrates. 303 surface area. tV ϋ , ^ , In another embodiment, the water jet cutting tool or the metal enamel is used to isolate the respective regions on the surface of the element substrate 303. In the same way, it is hoped that by using the effective temperature to control the hard-hull and the pieces, it is guaranteed to enter the stencil die 9HQ - '. The temperature of the component substrate 310 is a temperature between about 2 约 and about 2 6 C. The temperature control hardware component contains an electrical resistance heater and/or a ^β " 1 ρ component (for example) Heat exchanger 'thermoelectric element'. In one embodiment, sand is prepared. Listening to control the temperature of the element substrate 303 to about 25 + / _ 〇 5 22 200919761 Next, the element substrate 303 is transferred to the cleaning module 2 1 〇, in which the battery isolation step is performed (step 108) Thereafter, a step 1 1 〇 or a pre-deposit substrate cleaning step is performed on the element substrate 303 to remove any contaminants found on the surface of the element substrate 310. Typically, after the battery isolation step, the cleaning module 210 uses a wet chemical washing and cleaning step to remove any unwanted contaminants found on the surface of the element substrate 310. In one embodiment, a cleaning process similar to that described in the above step 106 is performed on the element substrate 3 〇 3 to remove any contaminants on the surface of the element substrate 3 〇 3 . Next, the element substrate 303 is transferred to the process module 2丨2, in which step U2 including one or more photoabsorber deposition steps is performed on the element substrate 303. In step 112, the one or more light absorber deposition steps can include one or more fabrication, etching, and/or material deposition steps that can be used to form various regions of the solar cell component. Step 112 typically includes a series of sub-processing steps for forming one or more PM-n junctions. In one embodiment, the one or more p_i_n junctions comprise an amorphous germanium and/or microcrystalline germanium material. Typically, one or more processing steps are taken from the processing module 212 by one or more combination tools (eg, combination tool 2 1 2 A - 2 1 2 D ) that are known to be Φ push > J The middle portion is formed to form one or more layers of the solar cell element formed on the element substrate 303. In one embodiment, the element substrate 3 0 3 is transmitted to & The accumulator 2 1 2A component that is fed into the combination tool 212A-212D is formed to include a plurality of junctions (the one or more of the tandem junctions before 'transfer to the reservoir in one embodiment' if the solar cell junction 'A stacked type 23 200919761 solar cell 300 shown in FIG. 3B, then the combination tool 2 1 2 A in the processing module 2 1 2 is adapted to form a first p-ί-η junction 320, and the combination The tools 212B-212D are constructed to form a second pin bond 330. Information regarding the hardware and processing methods used to deposit one or more layers of the pin bond is disclosed in U.S. Patent Application Serial No. 12, filed on Jul. 23, 2008. /178,289[Agent Case #APPM 11709.P3] and July 9, 2008 Further description is provided in U.S. Patent Application Serial No. 12/170,387, the entire disclosure of which is incorporated herein by reference. After step 1 1 2 is performed, a cooling step or step 113 is performed. The cooling step is generally used to stabilize the temperature of the element substrate 310 to ensure that the processing conditions experienced by each of the element substrates 300 in the subsequent processing steps are Reproducible. Typically, the temperature of the component substrate 303 exiting the processing module 212 can vary somewhat in degrees Celsius and exceed the temperature of 50. (: This causes subsequent processing steps and changes in solar cell performance. In one or more of the substrate support positions in the embodiment, a cooling step 进行13 is performed. In one structure of the production line, as shown in Fig. 2, the processed element substrate 303 is disposed in one of the reservoirs 211B. A period of time is required to control the temperature of the component substrate 303. In one embodiment, the system controller 290 is used to store by continuing the downstream step through the production line. The device controls the placement, timing, and movement of the element substrate 303 to control the temperature of the element substrate 303. Next, the element substrate 303 is transferred to the scribe line module 214, which is in the element substrate substrate 3 0 in 2009 200919761. 3 by using material 3 03 surface removal. (Nd:YV〇4) cation battery and under-application material shares for precise inter-laser deposition in the component cell 300 00 single pass using laser 3 8 1 B . In another line 'is isolated, it is desirable to use the temperature in the base of the component of 2 1 4, but the components (for example, the component substrate is in a solid scribing module 2 1 4 reservoir 2 1 1 C 1 to 2 1 8 And/or closing or failing to perform step 114 or interconnect forming steps to electrically isolate the various regions of the surface from each other. In the cow run 114, the removal step (such as a laser ablation process), you _ w夂疋 基 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The company obtained a 5.7m2 substrate laser scribing module 攸 scribing process. In one embodiment, the name is also a long-term step 108 process using a 532nm wavelength pulsed laser to pattern the material on the substrate 03. Thereby constituting the solar battery. As shown in the fourth embodiment, the scribe process forms a groove in the first pin bond.

In the examples, various areas on the surface of the water jet cutter S Dan or diamond solar cells are used. ^ In one aspect, the effective temperature control hardware component, the temperature of the capture of the beer into the scribing module plate 03 is in the range of from about 2 〇t to about 26 VII. The temperature control hardware component contains Resistance heater and two heat exchangers, thermoelectric elements). In one embodiment, the temperature of the Hz 3 is controlled to about 2 5 + / _ 〇 . In the embodiment, the '1 solar battery production line 200' has at least one reservoir 2U disposed thereafter. During manufacture, T is used to provide a prepared substrate to the contact deposition to provide a gathering area, in which the smear is smothered in the morning. 'If the contact deposition chamber 2 I 8 is followed by the scribing module 2 1 4 ίΛ too, The summer of the bucket can store the substrate from the 25 200919761 module 2 1 2 . In one embodiment, it is generally desirable to monitor and/or actively control the substrate temperature exiting reservoir 2 11 C to ensure that the results of back contact formation step 20 are repeatable. In the aspect, it is desirable to ensure that the temperature of the substrate exiting the reservoir 211C or reaching the contact deposition chamber 218 is a temperature ranging from about 2 〇 C to about 26 C. In one embodiment, it is desirable to control the substrate temperature to about 25 + / - 〇.5. (: In one embodiment, it is desirable to provide one or more reservoirs 2c that can retain at least about 80 substrates. Next, the workpiece substrate 300 is transferred to the processing module 2丨8, One or more substrate #contact forming steps are performed on the element substrate 303: or step " 8. In step u", one or more substrate back contact forming steps may be included for forming the back of the solar cell element One or more preparation, etching, and/or material deposition steps of the contact area. In one embodiment, 'step 118 generally includes one or more pVD steps for forming a back contact layer 350 on the surface of element substrate 303. In one embodiment, one or more PVD steps may be used to form a composition selected from the group consisting of zinc (Μ, tin (W, Ming (A1), steel (CU), silver (Ag), nickel (Ni), and The back contact area of the metal layer of a group consisting of hunger V. In one example, zinc oxide (Zn〇) + # Α Λ or nickel vanadium alloy (mv) is used to form at least — := contact layer 3〇 5. In one embodiment, obtained from Applied Materials, Inc., located in Ara, California The resulting ATNOtm P:D-V tool performs one or more processing steps. In another embodiment, one or more CVD steps can be used to form the back contact layer 350. In one embodiment, the solar cell production line 2〇〇 has at least one reservoir 2丨丨 disposed after processing 26 200919761 module 2 1 8 . In the production gate, the reservoir 21 1D can be used to supply the prepared substrate to the scribing group 22〇, And/or providing a collection area where the substrate from the processing module 2! 8 can be stored if the scribing module 22 is closed or cannot follow the yield of the processing module 2! 8. In one embodiment, it is generally desirable Monitoring and/or effective control of exiting the substrate temperature of the reservoir 2UD to ensure that the results of the back contact formation step 120 are repeatable. In one aspect, it is desirable to ensure that the substrate temperature exiting the reservoir or reaching the scribing module 220 is from about a temperature in the range between 2 〇t and about 26 。 In one embodiment, it is desirable to control the substrate temperature to about 25 + / - 〇 .5 ° C » In one embodiment, it is desirable to reserve at least about (10) One or more reservoirs of the substrate 2 11 C. Next, the element substrate 303 is transferred to the processing module 22, in which the step 12 or back contact isolation step is performed on the element substrate 303 to electrically isolate the plurality of solar cells contained on the surface of the substrate from each other. The material is removed from the surface of the substrate using a material removal step, such as a laser ablation process, in step 1200. In one embodiment, a smear:Nd:YV〇4 laser source is used from the element substrate 303. The surface is stripped of material to form a line that electrically isolates one solar cell from the next. In one embodiment, 'using a 5.7 m2 substrate laser scribing module obtained from Applied Materials, Inc. to accurately scribe the element substrate 3 0 3 required area. In one embodiment, the laser scribing process performed during step 120 uses a 532 nm wavelength pulsed laser to pattern the material disposed on the element substrate 3 〇 3 to isolate the individual cells that make up the solar cell 300. As shown in Fig. 3E, in one embodiment, trenches 27 200919761 381C are formed in first p-i-n junction 320 and back contact layer 350 by using a laser scribing process. In the aspect, it is desirable to ensure that the temperature of the component substrate entering the wire module 220 is a temperature within a range of about 20 ° C to about 26 ° C by using an effective temperature control hardware component, which controls the hard The body assembly contains an electrical resistance heater and/or a cold member (eg, a heat exchanger, a thermoelectric element). In one embodiment, the substrate temperature is controlled to be about 25 + / - 0.5 °C. Next, the component substrate 310 is transferred to the quality assurance module 2 2 2 in which the step 1 2 2 or the quality assurance and/or the shunt removal step are performed on the component substrate 310 to ensure The components formed on the surface of the substrate meet the desired quality criteria and, in some cases, the defects in the formed components. In step 122, the probe element is used to test the quality and material properties of the formed solar device by contacting one or more substrates with the probe. In one embodiment, the quality assurance module 222 emits low intensity light at the p-i-n junction of the solar cell and uses one or more probes to test the battery output to determine the electrical characteristics of the formed solar cell elements. If the module detects a defect in the formed component, it takes corrective action to repair the defect in the solar cell formed on the component substrate 300. In one embodiment, if a short or other phase defect is found, it is desirable to create a reverse bias between the regions on the surface of the substrate to control and/or correct one or more defective forming H domains of the solar cell component. During the calibration process, the reverse bias typically transmits a voltage high enough to correct defects in the solar cell. In one example, if a short circuit is found between the areas where the element substrate 310 should be isolated, the strength of the reverse voltage is raised to cause the conductive elements to be drawn in the area between the isolated areas, but the fractal pool is expected to be used. The electric-electricity-like bias causes 28 200919761 to change the phase, decompose, or change in some way to eliminate the strength of the electrical short circuit. In one embodiment of the process sequence 100, the module 222 is used with a factory automation system to address the quality found in the formed component substrate 310 during the test, the component substrate 03 Returned to the processing sequence to allow one or more fabrications (eg, back contact isolation steps (step 1 2 0)) to be performed again on the component substrate 303 to correct one or more quality issues by passing the substrate 310 . Next, the element substrate 303 is selectively transferred to the substrate group 2 2 4, wherein the substrate substrate is cut into a plurality of smaller element substrates 305 using the substrate dividing step 142 to form a plurality of smaller Solar component. In one embodiment of step 124, component substrate 303 is incorporated into substrate partitioning module 224, which uses a CNC glass cutter j to cut and divide component substrate 303 to form a sized cell component of the desired size. In one embodiment, the 'element substrate 300' is inserted into the group 2 2 4, which uses a glass scribing tool to accurately scribe the surface of the element base. The element substrate 303 is then broken along the line drawn to form the desired size and number of portions required for the solar cell component. In one embodiment, the solar cell production line 200 is suitable (step 1〇2) and processes the substrate 032 or plate 303 of 5.7 m2 or greater. In one embodiment, during step 124, the substrates 302 are partially processed and then divided into four 1.4 m2 substrates 300. In one embodiment, the system is designed to handle large plates 303 (eg TCO coated 2200mm x 2600mm x 3mm or to reduce quality and quality assurance issues. Upstream, step component division mode 3 0 3 cut energy cells are inserted t to precise solar energy Cutting die plate 303, which produces a glass element based on a large area of the receiving element base. 29 200919761 and produces solar cell elements of various sizes without the need for additional devices or processing steps. Currently, amorphous germanium (β-S丨) thin film factories must have a production line for each of the different sizes of solar cell components. In the present invention, the manufacturing line can be quickly converted to manufacture solar cell elements of different sizes. In one aspect of the invention, a 'manufacturing line can provide high solar cell component yield by forming a solar cell element on a single large substrate and then dividing the substrate to form a more preferred size solar cell, which is typically 10,000 watts per year. In one embodiment of the production line 200, the 'front end of the line (FEOL) (eg, steps 102-2 22) is designed to process a large area element substrate 303 (eg, 220 〇 mm x 2000 mm), the back end of the line The back end of the line (BEOL) is designed to further process the large-area element substrate 303 or the plurality of smaller element substrates 303 formed by using the dividing process. In this configuration, the remaining manufacturing lines receive and further process various sizes. The flexibility of having a single input at the output is unique in the solar film industry and provides significant savings in capital expenditures. Since solar cell component manufacturers can purchase a larger number of single glass sizes to make modules of various sizes, the material cost for input glass is also lower. In one embodiment, step 1 〇2 -1 2 2 can be constructed using a device adapted to perform a processing step on a large component substrate 03 (such as a 2200 mm x 2600 mm x 3 mm glass element substrate 303) and a previous step 1 2 4 can be adapted to manufacture a variety of smaller size solar cell components without the need for additional equipment. In another embodiment, step 1 2 4 is set in the process sequence 200 before step 1 2 2 so that the original large-element substrate 303 can be divided, and a plurality of individual solar cells are formed at 30 200919761, one at a time. The ground or group (ie two or more at a time) is tested and characterized. In this case, step 102-1 1 is constructed to use a device suitable for performing the process steps on the large component substrate 303 (such as 2200 mm x 2600 mm x 3 mm broken @ substrate), and the preceding steps 124 and 122 are suitable for manufacturing various smaller steps. Dimensional modules without additional equipment. A more detailed description of the / / exemplary substrate division module 2 2 4 will be presented in the section titled "Substrate Dividing Modules and Processes". Referring back to Figures 1 and 2, component substrate 303 is next transferred to a sealer/edge removal module 226 where substrate surface and edge preparation step 126 is used to prepare different surfaces of component substrate 303. Prevent productivity problems in the process later. In an embodiment of the step 126, the element substrate 303 is inserted into the sealer/edge elimination module 2 26 to prepare the edge of the element substrate 303, thereby shaping and preparing the edge of the element substrate 303. Damage to the edge of the component substrate 3 03 affects component yield and the cost of manufacturing available solar cell components. In another embodiment, the sealer/edge removal module 226 is used to remove deposited material from the edge of the component substrate 03 (eg, 1 〇mm) to provide for use on the component substrate 300 and the backside glass. A region that forms a reliable seal (ie, steps 1 3 4 -1 3 6 discussed below). Removal of material from the edge of the component substrate 310 also facilitates prevention of electrical shorts in the resulting solar cell. In one embodiment, a diamond doped ribbon is used to grind the deposited material from the edge regions of the component substrate 303. In another embodiment, a grinding wheel is used to grind the deposited material from the edge region of the component substrate 300. In another embodiment 31 200919761, the 'double grinding wheel' is used to remove the deposited material from the edge of the element substrate 300. In yet another embodiment, sandblasting or laser ablation techniques can be used to remove deposited material from the edge of the component substrate 300. In one aspect, the sealer/edge is eliminated. The module 226 is used to round or chamfer the edge of the component substrate 3 通过 3 by using a shaped grinding wheel, a slanted and aligned belt sander and/or a grinding wheel. Next, the component substrate 303 is transferred to a pre-screen module 228 where an optional pre-screening step f is performed on the component substrate 303 to ensure that the components formed on the surface of the substrate meet the requirements. Quality standards. In step 128, the illuminating light source and probe element are used to test the output of the formed solar cell element by using one or more substrate contact probes. If the module 2 28 detects a defect in the formed component, it can take corrective action or discard the solar cell in multiple sentences. Next, 'the component substrate 303 is transferred to the cleaning module 2 3 〇, after performing step 122·128, 'the step 130 or the pre-laminated substrate cleaning step is performed on the element substrate 303, To remove any contaminants found on the surface of the substrate 303. Typically, after all of the cell isolation steps are performed, the cleaning module 230 uses a wet chemical washing and cleaning step to remove any unwanted contaminants found on the surface of the substrate. In the embodiment, a cleaning process similar to that described in step 丨06 is performed on the substrate 303 to remove any contaminants on the surface of the substrate 303. Next, the substrate 303 is transferred to the bonding wire attaching module 23 i where the step 131 or the bonding wire attaching step is performed on the substrate 3〇3. Step 13 1 is for attaching each lead/wire required to connect each external electrical component to the formed solar cell component. In general, the bond wire add-on module 32 200919761 2 3 1 is an automated wire bonding tool that facilitates the formation of numerous interconnects reliably and quickly, often requiring interconnections to form in the production line 2000. Large solar cells. In one embodiment, the bond wire attaching module 231 is configured to form a side busbar 3 5 5 (FIG. 3C) and a crossbar busbar 3 5 6 on the formed back contact region (step 1 1 8) ). In this configuration, the side busbars 355 may be electrically conductive materials that may be fixed, bonded and/or fused to the back contact layer 350 found in the back contact region to form a good electrical contact. In one embodiment, the side busbars 455 and the crossbars 365 each comprise a metal strip, such as a copper strip, a nickel coated silver strip, a silver coated nickel strip, a tin coated copper strip. The nickel coated copper strip may carry currents transmitted by the solar cells or other conductive materials that are reliably bonded to the metal layer in the back contact region. In one embodiment, the metal bandwidth is between about 2 m and about 10 m, and the thickness is between about 1 m and about 3 m. The cross busbars 3 5 6 electrically connected to the side busbars 3 5 5 at the junction can be electrically isolated from the back contact layer of the solar cell by using an insulating material 3 5 7 such as an insulating tape. The ends of each of the crossbars 3 5 6 typically have one or more wires for connecting the side bus bars 35 5 and the cross wires 356 to the electrical connections found in the junction box 3 70 for use. The formed solar cell is connected to other external electrical components. Other information on welding busbars to thin film solar modules is disclosed in U.S. Provisional Patent Application Serial No. 60/967,077, U.S. Provisional Patent Application Serial No. 6 1 /0 2 3,8 1 0 and US Provisional Patent Application It is disclosed in the Serial No. 61/032,005, which is incorporated herein by reference. In the next step, step 133, a bonding material 306 (33th 200919761 3D) and a back glass substrate 316 are prepared for transmission to the solar cell forming process (ie, process sequence i 〇〇) The preparation process is usually carried out in the glass storage module 232. This typically includes a material preparation module 23 2A, a glass loading module 2 3 2 B, and a glass cleaning module 2 3 2 C. The back glass substrate 3 6 1 It is bonded to the element substrate 303 formed in the above-described step 1〇2_step 130 by using a lamination process (step 134 discussed below). Generally, the step 132 needs to be prepared to be disposed on the back glass substrate 361 and the element substrate 3. The polymeric material 'between/small layer 〇3 to form a hermetic seal to prevent environmental damage to the solar cell during its lifetime. Referring to Figure 2, step 133 typically includes a series of sub-steps ' The bonding material 36 is prepared in the material preparation module 2 3 2 A. At this time, the bonding material 36 is disposed above the element substrate 303. The back glass substrate 361 is loaded into the loading module 232B, and the L uses the β cleaning module. 2 3 2 C while flushing' The back glass substrate 361 is disposed above the bonding material 360 and the element substrate 303. In one embodiment, the 'material preparation module 232' is adapted to receive the sheet form of the enthusiasm. Λ (recovery material 枓 3 60, And one or more cutting operations are performed to provide a bonding material such as polyvinyl butyral (PVB) "ethylene vinyl acetate (EVA), the size of which is 4乍#The glass is formed between the solar cells formed on the element substrate 3〇3, and can be formed as I κ 1 & ί. Generally, when the bonding material 360 of the polymer is used, it is desirable; f* & The temperature of the solar cell production line of the two-system solar cell (for example, 16-1.8 ° C) and the relative thirst... (for example, RH20-22%), the solar cell production line 200 will be stored in the cellar*

The composite material 306 is integrated into the solar cell component to ensure that the bonding properties formed in the gutta-X supply module 243 are repeatable, and 34 200919761 The size of the polymeric material is stable. It is often desirable to store the bonding material prior to use in temperature and humidity controlled areas (e.g., T = 6-8 ° C, RH 20-22%) t. When forming a large solar cell, the overlap of the components in the joint element (step 134) is a problem. Therefore, it is necessary to precisely control the joint material characteristics and the cutting process tolerance to ensure a reliable hermetic seal is formed. In one embodiment 'Using PVB for UV stability, moisture resistance, thermal loop, good US fire rating, consistency with Inti Building Code, low cost and reusable thermoplastic properties, PVB is used It is beneficial. In a portion of step 132, the bonding material 360 is transported using an automated mechanical device and placed on the back contact layer 350' of the element substrate 303's side busbar 355 (FIG. 3C), and the crossbar 356 ( Figure 3C) Above the component. The element substrate 303 and the bonding material 306 are then placed to receive the back glass substrate 361, which can be placed thereon by using the same robotic mechanism or second robot as the bonding material 610. . In one embodiment, one or more preparation steps are performed on the back glass substrate 36 prior to placing the back glass substrate 36 on top of the bonding material 360 to ensure subsequent sealing processes and formation as needed. The last solar product. In one case, the back-breaking substrate 3 6 i is received in the "raw" state. The "original" state does not adequately control the edge, overall size, and/or cleaning of the substrate 36 . Receiving the "original" substrate reduces the formation

Prior to the glass substrate cleaning step, in one embodiment of the 133, the surface and edges of the back glass substrate 361 are prepared in a backing bonding module (e.g., a sealing machine 205) 35 200919761. In the next sub-step of step 232, the back glass substrate 361 is transferred to the cleaning module 2 3 2 B ' in which the substrate cleaning step is performed on the substrate 361 to remove any contaminants found on the surface of the substrate 361. . The general contaminant material is deposited on the substrate 316 during the substrate forming process (e.g., glass manufacturing process) and/or during the shipping substrate 361. Typically, the cleaning module 2 3 2 B uses a wet chemical washing or rinsing step to remove any unwanted contaminants as described above. The prepared back glass substrate 361 is now disposed over the bonding material and a portion of the element substrate 303 by using an automated mechanical device. Next, the material 360 is passed through a layer of steps to form the element in the polyethylene backside glass substrate and bonded to the structure to form the substrate 3 6 1 and 3〇4 (the 3D active region. Partially and in a future step (area making electricity), the element substrate 303, the back glass substrate 361, and the bonding glass are transferred to the bonding module 234, in which step 134 or the stacked back glass substrate 316 is bonded to the above step 1 2 _ 丨 3 on the substrate. In step 134, a bonding material 306 (such as (PVB) or ethylene vinyl acetate (EVA)) is sandwiched between the board 361 and the element substrate 3 〇3 Using the other elements found in the various heating element modules 234, heat and pressure are applied as bonded and sealed components. The element substrate 3〇3, the back glass bonding material 360 thus forms a composite solar cell structure diagram) In a single embodiment in which the solar cell element is at least partially sealed, the over-bonding material 360 formed in the back-grain substrate 361 remains at least partially uncovered to allow the busbar 365 or side-side confluence Row 3 55 remains exposed to step 1 3 8) These connections to the solar cell structure 3 〇4. 36 200919761 Next, 'transfer the composite solar cell structure 304 into the autoclaving module 236' in which the composite solar cell structure 3〇4 is subjected to step 136 or a hot dust treatment step to remove the gas trapped in the bonded structure and Ensure a good bond formed during step 134. In step 丨34, the bonded solar cell structure 304 is inserted into the processing region of the autoclave module 'where heat and high pressure gas are transferred to reduce the amount of trapped gas, and the element substrate 3 〇 3, back glass is raised. Substrate bonding characteristics. The treatment performed in the autoclaving process is also used to ensure that the stresses in the glass and interface layers (ie, the PVB layer) are further controlled to prevent future seals from leaking due to stresses introduced during the bonding/lamination process or Glass failure. In one embodiment, it is desirable to heat the element substrate 3〇3, the back glass substrate 361, and the bonding material shawl 36. The temperature at which stress is released in one or more of the formed solar cell structures 3〇4. Next, the solar cell, the battery, and the 33 04 are transferred to the junction box connection module 2 3 8 where the junction box connection step I 3 8 is performed on the yoke energy battery structure 304. <Terminal, the junction box used in step 138 is connected to the pull group 238 for assembling the junction box on the solar cell formed by the part of the two sets of the container transport T (^ 3C ® ^ ) , with the junction box 3 7 0 with bamboo Luo; fish pull 丨 & into the outside of the solar cell, connected to the shape of the force network) and in the step i _ 'components (such as other solar cells or electricity room) Interfaces 371, 3 72 in an implementation of θ % of internal electrical connection points (such as wires), in the example 'junction box' 0 contains one or more connections to other external Zou - The solar cell battery can easily and subsequently transfer the electric power generated by the sun::2 to the component test module 37 200919761 240, in which component screening is performed on the solar cell structure 304. (device screening) and analysis step 140 to ensure that the components formed on the surface of the solar cell structure 304 meet the required quality standards. In one embodiment, the component test module 240 is a solar analog module. It is used to verify one or more The output forming the solar cell is qualified and tested. In step 140, the illumination source and probe element are used to test the output of the formed solar cell component by using one or more automated components, the automation component being suitable for Electrical contact is made with the terminals in the junction box 307. If the module detects a defect in the formed component, it can take corrective action or can discard the solar cell. Next, the solar cell structure 300 is transmitted. To the support structure module 241, wherein a support structure mounting step 141 is performed on the solar cell structure 304 to provide a completed solar cell component having one or more connections to the use of steps 102-1-40. The solar cell structure 3 04 mounts the components, thereby completing the solar cell components that can be easily installed and quickly assembled at the user's location. Next, the solar cell structure 300 is transferred to the unloading module 2 4 2, where it is performed on the substrate. Step 1 42 or component unloading step to remove the formed solar cell from the solar cell production line 200. In one embodiment of a solar cell production line 200, one or more of the zones in the production line are disposed in a clean room environment to reduce or prevent contaminants from affecting solar cell component yield and useful life. In the embodiment, as shown in FIG. 2, a clean room space 2 50 with a level of 1 0 0 0 0 is set around the module for performing steps 1 0 8 to 1 18 and step 38 200919761 130-134 The substrate dividing module and the processing of the substrate dividing module processing sequence performed during the substrate dividing step 14 are used to deposit one or more thin layers of the large, partially processed component substrate 3 〇 3 thereon. The substrate is divided into two element substrates 303 for further processing into solar modules. In the example, the substrate division module receives a 2300 mm x 2200 mm element 303 and divides it into two i300 mm x 2200 mm element bases for further processing. In one embodiment, the substrate dividing module is connected to the 2600 mm×2200 mm element substrate 303 and divided into two, 26 00 mm×1100 mm element substrates 303 for further processing. In the embodiment, the substrate dividing module receives the 2600 mm×2200 mm plate 303 and It is divided into four i300 mm x ll00 mm elements 303 for further processing. In one embodiment, the system controller 290 (Fig. 2) is the size of the block of the component substrate 3 〇 3 manufactured by the substrate dividing module 224. Therefore, all the downstream processing in the 'system controller 290 sends the instruction to the sequence 1 diagram' is used to coordinate the rectification of the downstream module's regardless of the size of the block being manufactured to accommodate the __ The block of the element substrate 3 〇 3 manufactured by the module is divided. 4A-4E is a top plan view showing the sequence of a real component substrate 310 of the substrate dividing module 224. Referring to the first inlet conveyor 4 10 , the element substrate 3 〇 3 is transferred to the scribe line 4 2 〇. In the embodiment, the 'element substrate 303 has a film deposited thereon 224 and (i.e., one or more of a real substrate plate 3〇3, received (i' in a component base substrate made up of number and 00 (1st. And the pacing process is shown in Fig. 4, in one; the side is 39 200919761, the scribing mechanism 424 reel. In one embodiment I:, such as laser scribing, should pay attention to the 'dash Any aiming on the processing surface of the device, and clearly in the lower line. Face up. The line is passed for scribing. On the element substrate 303 of the element substrate 303, the port transmitter 4 1 0 'Scratch! System Controller 290 (; Sequence 1 (1) 1 In one embodiment, such as mechanical stroke 424 is optical scribing: line device 424 is molded on component substrate 3 0 3 The portion of the surface of the square glass that has been scored by the scribe line is transferred to the cross-over system controller 290, which cooperates to properly illustrate the process according to the present invention 303. The reference frame is placed on the roller 426 on the roller 4 2 6 above. The lower surface of the substrate 303 is schematically depicted along the surface of the surface. The lined state 422 is drawn in the scribe line station 410, such as the first stylized division, and the pattern is drawn on the surface. The spring transmitter 422 and the picture, the figure of the figure 2) are controlled and the other operations are matched. It is a mechanical scribing device's scribing mechanism. It must be completely cut through the sinking plate 3 03 regardless of the stroke used. At this time, it is transmitted to the table 43 0 via the scribing table conveyor 422, as shown in Fig. 4C.吏 The first transfer station conveyor 423 is transported with the scribe line when the component substrate 303 is placed. 5A-5C is a schematic view of an embodiment for rupturing the scribe element substrate 4 C and 5 The scribed element substrate 3 〇3 square 'so that the line drawn along the X axis is directly set to the roller 4 2 6 is now raised and placed in contact with the element, as shown in Figure 5B As shown in FIG. 5C, the roller 426 is raised, and a component 20 placed in the plane of the element substrate 303 and perpendicular to the plane of the element substrate 303 is placed as shown in the figure of the element substrate 4β, according to the line mechanism 424. In the example, the 'line machine 1 slings 424 through the mutual cooperation, and with the shun 40 200919761 lifting force' caused along the The score line is completely broken. In one embodiment, the 'roller 426 is a cylindrical roller that fills the length of the element substrate 303. The roller 426 is raised by the actuator 428. In one embodiment The actuator 428 is an electric, hydraulic or pneumatic motor. In one embodiment, the actuator 428 can be a hydraulic or pneumatic cylinder. In one embodiment, the actuator 4 28 is controlled by the system. The controller 290 controls and regulates. Next, the first block 303A of the 'substrate element 3'3 as shown in Fig. 4D is completely loaded into the cross-transfer station 430 via the first transfer conveyor 432. Next, the second transport transmitter 434 is combined with the exit transmitter 440 to partially transfer the first block 3〇3a to the exit transmitter 440 as shown in Fig. 4E. The second transfer station transmitter 434 is coupled to the exit conveyor 440 via the system controller 290 to properly place the element substrate block 303A. Referring to Figures 4E and 5A, the underlined element substrate 3 0 3 A is placed over the roller 4 2 6 such that the line drawn along the Y axis is directly above the roller 4 26 . At this time, the roller shaft 426 is raised and placed in contact with the lower surface of the divided element substrate 303A as schematically shown in Fig. 5B. The 'upward roller 426' as schematically illustrated in Fig. 5C applies a lifting force to the lower surface of the element substrate block 303A along the line drawn and perpendicular to the plane of the element substrate block 303A. Causes complete rupture along the line drawn. Thus, the substrate block 3 0 3 A is divided into two smaller element substrate blocks 3 0 3 C and 3 0 3 D. At this time, each of the substrate blocks 3 0 3 C and 3 0 3 D is transferred to the subsequent modules via the second transfer conveyor 434 and the exit conveyor 440 for further processing. The above processing is repeated for the element substrate block 303B. Although the above embodiment shows a process and apparatus for dividing a single substrate element 3003 into four smaller blocks, it is apparent that the adjustment of the scribing mechanism 4 2 4 is only performed on the X-axis or the Y-axis. A single line, and only a single rupture process, can also accomplish the same example of dividing a single substrate element 030 into two smaller blocks. While the foregoing is directed to embodiments of the present invention, the invention may BRIEF DESCRIPTION OF THE DRAWINGS In the following, the above summary of the invention will be described in more detail with reference to the embodiments illustrated in the drawings. It is to be understood, however, that the invention is not limited to the embodiments of the invention

Figure 1 illustrates a process sequence for forming a solar cell component in accordance with one embodiment described herein. Figure 2 shows a plan view of a solar cell production line in accordance with an embodiment of the invention. Figure 3A is a side cross-sectional view of a thin film solar cell element in accordance with an embodiment of the present invention. Figure 3B is a side cross-sectional view of a thin film solar cell element in accordance with one embodiment of the present invention. 42 200919761 Figure 3C is a plan view of a composite solar cell structure in accordance with an embodiment of the invention. Fig. 3D is a cross-sectional view of section A-A of Fig. 3C. Figure 3E is a side cross-sectional view of a thin film solar cell element in accordance with one embodiment of the present invention. 4A-4E are schematic plan views showing the sequence of division modules in accordance with one embodiment of the present invention. 5A-5C is a schematic side view showing a partial division module for dividing a substrate sequence according to an embodiment of the present invention. [Main. Element Symbol Description] 100 Processing Order 102 Step 104 Step 106 Step 107 Step 108 Step 110 Step 112 Step 113 Step 114 Step 118 Step 120 Step 122 Step 124 Step 126 Step 128 Step 130 Step 13 1 Step 132 Step 134 Step 136 Step 13 8 Step 140 Step 14 1 Step 43 200919761 1 4 2 Step 2 00 Production Line 2 0 2 Loading Module 2 0 4 Front End Substrate Engagement Module 2 0 6 Cleaning Module 2 0 8 Scribing Module 2 1 0 Cleaning Module 2 1 1 reservoir 2 1 1 A reservoir 2 1 1 B reservoir 21 1C reservoir 2 1 1 D reservoir 2 1 2 processing module 2 1 2 A combination tool 2 1 2 B combination tool 2 1 2 C combination tool 2 1 2 D combination tool 2 1 4 scribe module 2 1 8 contact deposition chamber 2 2 0 scribe module 2 2 2 quality assurance module 2 24 substrate division module 2 2 6 edge elimination module 2 2 8 pre-screening module 2 3 0 cleaning module 23 1 bonding lead additional module 232 glass storage module 232A material preparation module 232B glass loading module 2 3 2 C glass cleaning module 2 3 4 bonding module 2 3 6 hot pressing Module 2 3 8 junction box connection module 2 4 0 component test module 241 support structure module 2 4 2 unloading module 2 5 0 clean room space 281 automatic device 2 9 0 system controller 3 00 solar battery 3 0 1 Solar radiation 3 02 substrate 3 0 3 element substrate 3 03 A first block 3 0 3 B element substrate block 3 0 3 C element substrate block 3 0 3 D element substrate block 3 0 4 composite solar cell structure 44 200919761 3 10 First transparent conductive oxide layer 320 First pin bond 322 p-type amorphous germanium layer 324 intrinsic amorphous germanium layer 326 n-type microcrystalline germanium layer 330 second p-_i-n junction 332 p-type crystallite矽 layer 334 essential microcrystalline germanium layer 336 n-type amorphous germanium layer 340 second TCO layer 350 back contact layer 355 side bus bar 356 cross bus bar 357 insulating material 360 bonding material layer 361 back glass substrate 370 junction box 37 1 connection Point 372 Connection Point 381 A Trench 3 8 1 B Trench 381 C Groove 382A Battery 382 Β Battery 410 Inlet Transmitter 420 Scribe Table 422 Scribe Transmitter 424 Scribe Mechanism 426 Roller 428 Actuator 430 Cross Transmission Taiwan 432 first pass The second conveyor 434 exits the transfer station 440 transfer conveyor 45

Claims (1)

200919761 X. Patent Application Range: 1. A module for dividing a solar cell component, comprising an inlet conveyor configured to receive an instruction from a system controller and to transfer a solar cell component to the module a scribing station; a scribing mechanism configured to receive an instruction from the system controller and to map a pattern into a first surface of the solar cell component; a first placement mechanism, Constructed to receive instructions from the system controller and to accurately position the lined solar cell component over a first rupturing mechanism; and a first actuator configured to receive therefrom The system controller commands and raises the first rupture mechanism. 2. The module of claim 1, further comprising: a cross transfer station having a conveyor and a second placement mechanism, wherein the conveyor is configured to receive the first placement mechanism a block of solar cell elements, and wherein the second placement mechanism is configured to receive an instruction from the system controller and accurately place the block of the solar cell element over a second rupture mechanism; a second actuator configured to receive an instruction from the system controller and to raise the second rupturing mechanism; and an exit conveyor configured to receive the block of the solar cell component portion. 46 200919761 3. The module of claim 2, wherein the first and second rupturing mechanisms are elongated rollers. 4. The module of claim 3, wherein the first rupture mechanism extends along a first axis, and the second rupture mechanism extends along a second axis, and wherein the first and the The two axes are substantially perpendicular to each other. 5. The module of claim 1, wherein the scribing mechanism is a mechanical scribing wheel. 6. The module of claim 1, wherein the scribing mechanism is a laser scribing element. 7. A method of dividing a partially processed solar cell component, comprising: receiving a substrate having a processing surface; forming a layer on the processing surface; forming the layer on the processing surface, The substrate is divided into a first block and a second block; and the first block is transferred to the next station for further processing. 8. The method of claim 7, wherein the step of dividing the substrate comprises: after forming the layer on the processing surface, marking a first line into a surface of the 47 200919761 substrate; and starting a A rupture mechanism is used to rupture the substrate along the first line. 9. The method of claim 8 wherein the step of drawing a first line comprises completely traversing a line through the layer and into the treated surface. The method of claim 8, further comprising dividing a second line into the processing surface, wherein the second line is substantially perpendicular to the first line. 11. The method of claim 10, further comprising placing the first block of the substrate adjacent to a second rupture mechanism such that the second scribe line substantially corresponds to the second rupture mechanism One axis of the device is in line. 1 2 - The method of claim 11, further comprising activating the second breaking mechanism to rupture the first block along the second scribe line. The method of claim 11, wherein the treated surface has a surface area greater than about 1.4 m2. A system for manufacturing a solar cell component, comprising: a substrate receiving module adapted to receive a substrate; a combination tool having a processing chamber adapted to deposit a germanium-containing layer on a surface of the substrate; a back contact deposition chamber, which is constructed to sink on a surface of the substrate 48 200919761 a back contact layer; a substrate dividing module, the structure of which is divided into two or more blocks; A system controller for controlling and coordinating functions of the substrate receiving module, the combination tool, the processing chamber, the back contact deposition chamber, and the substrate dividing module. 1 5. The system of claim 14, wherein the substrate dividing module comprises a CNC glass cutter. 1 6. The system of claim 14 wherein the substrate dividing module comprises a scribing table, a rupture table, and a placement mechanism configured to divide a line into the substrate. In a surface, the rupture station is configured to rupture the substrate along the line, the placement mechanism for positioning the substrate such that the line drawn into the substrate is substantially aligned with the rupturing mechanism. 1. The system of claim 16 wherein the substrate dividing module further comprises a second placement mechanism for placing one of the blocks of the substrate to a second rupture The mechanical devices are adjacent such that the second rupturing mechanism is substantially aligned with a second line drawn into the substrate. 1 8. A method of processing a solar cell component, comprising: cleaning a substrate to remove one or more contaminants from a surface of the substrate; 49 200919761 depositing a light absorbing layer on a surface of the substrate; An area on a surface of the substrate removes at least a portion of the light absorbing layer; depositing a back contact layer on a surface of the substrate; dividing the substrate into two or more blocks, one of the blocks An edge removal process is performed on the surface; a back glass substrate is bonded to the surface of one of the blocks to form a composite structure; and a junction box is attached to the composite structure. The method of claim 18, wherein the step of dividing the substrate comprises cutting the substrate with a CNC glass cutter. 2. The method of claim 18, wherein the step of dividing the substrate comprises: lining a first line into the substrate, aligning the first line with a first rupturing mechanism, and along the A line ruptures the substrate. The method of claim 20, wherein the step of dividing the substrate further comprises dividing a second line into the substrate, aligning the second line with a second breaking mechanism, and along the The second line ruptures the substrate, wherein the first line is substantially perpendicular to the second line. 50