200917389 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種凸塊植入方法’尤指—種適用於植 入固態凸塊於覆晶載板表面之方法。 【先前技術】 隨著電子產業的蓬勃發展’電子產品亦逐漸邁入具有 多功能、高性能之發展趨勢。為滿足半導體封裝件高積集 ( 度（integration)及微型化（miniaturization)的封裝需求，以^ 1〇 更夕主被動元件及線路載接，半導體封裝基板亦逐漸由雙 層演變成多層（multi-layer)，俾在有限的空間下運用層間 連接技術（interlayer connection)以擴大半導體封裝基板上 可供利用的線路佈局面積，藉此配合高線路密度之積體電 路（integrated circuit)需要，降低封裝基板的厚度，以在相 15 同基板單位體積中容納更多數量的線路及電子元件。 一般半導體裝置之製程，首先係由晶片載板製造業者 ij 生產適用於該半導體裝置之晶片載板，如基板或導線架。 之後再將該些晶片載板交由半導體封裝業者進行置晶、打 線、封膠以及植球等封裝製程。又一般半導體封裝是將半 20導體晶片背面黏貼於封裝基板頂面進行打線接合㈣代 —ding) ’或者將半導體晶片之作用面以覆晶接合⑼p a⑻ 弋-、封裝基板接合，再於基板之背面植以焊料凸塊以供 與其他電子裝置進行電性連接。 200917389 一般而言，習用形成焊料凸塊於封裝基板上之常見方 法係採模板印刷法。如圖1A所示，提供一完成線路佈局之 封裝基板10，此封裝基板1〇表面具有複數電性連接墊丨〇5 ^ 接著，如圖1B所示’先於封裝基板1〇表面置放一鋼板21， 5此鋼板21具有複數開孔21a對應封裝基板1〇之電性連接墊 105。而後，將錫膏14置於鋼板21表面，再以刮刀22刮過塗 佈於鋼板21上之錫膏14，使錫膏丨4填入鋼板21之開孔21a 内。再如圖1C所示，將鋼板21移開封裝基板1〇之表面，使 :1 鋼板21之開孔21&内之錫膏14附著於封裝基板1〇上，再過迴 10焊爐使錫膏14固化而與封裝基板10之電性連接墊1〇5結合。 然而，使用刮刀22將錫膏14填入鋼板21開孔21a之方 式，會造成開孔21a内之錫膏14含量不均。且鋼板21脫離 後，部分錫膏14會連帶黏著於鋼板21而被移除，也會造成 封裝基板10之電性連接墊105上之錫膏14含量不均。另外， 15近年來在現代電子產品逐漸迷你化之趨勢下，封裝基板上 焊料凸塊相互間之間距及焊料凸塊的體積也要求愈來愈 〇 小，未符合此需求，勢必將鋼板21上開孔21a之孔徑與間距 縮】如此會&成錫膏14之填入量變異加大，因此有礙於 更丨、凸塊間距之產品良率。由此可知，習用形成焊料凸塊 20於封裝基板上之方法，以無法滿足近來半導體封裝件高積 集度及微型化的封裝需求，所以亟需找尋並開發出其他方 式以達到更商之產品良率。 【發明内容】 200917389 發月之主要目的係在提供一種凸塊植入方法，尤適 用於植入固態凸塊於覆晶封裝基板表面，俾能改善習知模 p刷法中各個電性連接墊表面錫膏量不—致之缺點，提 鬼尺寸均勻性，增加產品良率，達到更佳之封裝效果。 為^成上述目的，本發明提供一種凸塊植入方法，其 ·提供—具有複數開孔之治具，係藉由抽氣之吸力以 〜吸附设數凸塊於該治具之開孔内，並藉由排氣之吹力 =移出该些凸塊，且令該些凸塊對應配置於-封裝基板表 面之複數電性連接墊上。 10 15 上迹之凸塊植人方法中，該治具具有—承載單元，可 第—表面、相對之—第二表面以及貫穿第-表面及BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump implant method, and more particularly to a method for implanting solid bumps on a surface of a flip chip. [Prior Art] With the booming of the electronics industry, electronic products have gradually entered a trend of multi-functionality and high performance. In order to meet the high-integration (integration and miniaturization) packaging requirements of semiconductor packages, the semiconductor package substrate has gradually evolved from a double layer to a multilayer (multi-layer). -layer), using interlayer connection in a limited space to expand the available layout area on the semiconductor package substrate, thereby reducing the package requirements for high circuit density integrated circuits. The thickness of the substrate is such that a larger number of lines and electronic components are accommodated in the unit volume of the substrate. The general semiconductor device process is firstly produced by the wafer carrier manufacturer ij to produce a wafer carrier suitable for the semiconductor device, such as Substrate or lead frame. The wafer carrier is then transferred to a semiconductor package for packaging, wire bonding, encapsulation, and ball implantation. In general, the semiconductor package is bonded to the top surface of the package substrate. Wire bonding (four) generation - ding) 'Or the working surface of the semiconductor wafer with flip chip bonding (9)p a(8) 弋-, the package substrate is bonded, and solder bumps are implanted on the back surface of the substrate for electrical connection with other electronic devices. 200917389 In general, the common method of forming solder bumps on a package substrate is stencil printing. As shown in FIG. 1A, a package substrate 10 having a circuit layout is provided. The surface of the package substrate 1 has a plurality of electrical connection pads. 5 ^ Next, as shown in FIG. 1B, a surface is placed before the surface of the package substrate 1 The steel plate 21, 5 has a plurality of openings 21a corresponding to the electrical connection pads 105 of the package substrate 1A. Then, the solder paste 14 is placed on the surface of the steel sheet 21, and the solder paste 14 coated on the steel sheet 21 is scraped by the doctor blade 22 to fill the solder paste 4 into the opening 21a of the steel sheet 21. Further, as shown in FIG. 1C, the steel sheet 21 is removed from the surface of the package substrate 1 so that the solder paste 14 in the opening 21 & 1 of the steel sheet 21 is attached to the package substrate 1 and then passed back to the 10 soldering furnace to make the tin. The paste 14 is cured to be bonded to the electrical connection pads 1〇5 of the package substrate 10. However, the filling of the solder paste 14 into the opening 21a of the steel sheet 21 by using the doctor blade 22 causes the content of the solder paste 14 in the opening 21a to be uneven. After the steel sheet 21 is detached, part of the solder paste 14 is adhered to the steel sheet 21 to be removed, and the content of the solder paste 14 on the electrical connection pad 105 of the package substrate 10 is also uneven. In addition, in recent years, under the trend of miniaturization of modern electronic products, the distance between the solder bumps on the package substrate and the volume of the solder bumps are also required to be smaller and smaller, which does not meet this demand, and is bound to be on the steel plate 21. The aperture and the pitch of the opening 21a are reduced, so that the variation of the filling amount of the solder paste 14 is increased, thereby hindering the product yield of the more uneven and bump pitch. Therefore, it is known that the conventional method of forming the solder bumps 20 on the package substrate cannot meet the recent high integration and miniaturization of the semiconductor package, so it is urgent to find and develop other ways to achieve a more favorable product. Yield. SUMMARY OF THE INVENTION The main purpose of the 200917389 month is to provide a bump implantation method, which is particularly suitable for implanting solid bumps on the surface of a flip chip package substrate, and can improve the surface tin of each electrical connection pad in the conventional mold p brush method. The amount of paste is not-caused, the uniformity of the ghost size, the product yield, and better packaging effect. In order to achieve the above object, the present invention provides a bump implanting method, which provides a jig having a plurality of openings, which is formed by the suction of the suction force to absorb the number of protrusions in the opening of the fixture. And, by the blowing force of the exhaust gas, the bumps are removed, and the bumps are correspondingly disposed on the plurality of electrical connection pads on the surface of the package substrate. 10 15 In the method of implanting a bump, the fixture has a load bearing unit, the first surface, the opposite second surface, and the first surface and
St面之複數開孔，該些開孔位於第-表面的孔徑大於 可=二表面的孔徑。其中’該承載單元可為-鋼板，亦 二門2 =用之金屬板。且於該承載單元同一側表面的該 二開孔，其尺寸較佳為大小一致。 此外，該些凸塊係於該承載單元的第一表面上滾動。 ^置《凸塊於封裝基板表面前，先行形成 Π電輯耗其巾，該些凸狀尺寸較佳為大 且材質可為焊料凸塊’亦可為其他適用之焊料凸 於第卜’該些凸塊可利用搖動該承載單㈣方式以使其 :!二滾動。亦可提供一氣室配置於承載單元之第 =面側，且連接-抽氣/排氣端針對該氣室進行抽氣，以 力進入每一開孔，並受吸力暫時固定於該 开 更可提供-I力計與該氣室連通，並藉由塵力 20 200917389 计偵測氣室之氣壓變化以判斷承載單元之承載凸塊狀況是 否為滿載。 並且，上述之凸塊植入方法中，亦可透過該壓力計偵 測仔知該承載單元之承載凸塊狀況為滿載後，使該承載單 元之第一表面面對該封裝基板表面，且該些開孔對應於該 些電性連接墊，然後對該氣室進行排氣，以使該些凸塊受 吹力自該些開孔内移出，並配置於所對應之該些電性連接 墊上此外，也可將該些凸塊配置於所對應之該些電性連 接墊上後，移開該治具，並將該些凸塊進行迴焊以黏接該 些電性連接墊。 由上述可知，本發明使用一具有複數開 15The plurality of openings of the St face, the openings having a pore diameter at the first surface greater than the pore diameter of the second surface. Wherein the carrying unit can be a steel plate, and also a two-door 2 = metal plate for use. The two openings on the same side surface of the carrying unit preferably have the same size. In addition, the bumps roll on the first surface of the carrying unit. ^ "Before the bumps on the surface of the package substrate, the first generation of the Π 辑 耗 耗 , , , , , , , , , , , , , , , , , , 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该The bumps can be shaken by the carrier single (four) way to make it: ! An air chamber may be disposed on the first surface side of the carrying unit, and the connection-exhaust/exhaust end is pumped for the air chamber to force into each opening, and is temporarily fixed to the opening by suction. The -I force meter is connected to the air chamber, and the air pressure change of the air chamber is detected by the dust force 20 200917389 to determine whether the bearing bump condition of the carrying unit is full. In addition, in the above-mentioned bump implantation method, the pressure gauge can be used to detect that the bearing bump of the carrying unit is fully loaded, and the first surface of the carrying unit faces the surface of the package substrate, and the The openings correspond to the electrical connection pads, and then the air chamber is exhausted, so that the bumps are removed from the openings by the blowing force, and are disposed on the corresponding electrical connection pads. In addition, after the bumps are disposed on the corresponding electrical connection pads, the fixtures are removed, and the bumps are reflowed to bond the electrical connection pads. As can be seen from the above, the present invention uses a plurality of openings 15
中導入體積近乎相等之凸塊，以抽氣體之方式，引導凸塊 進：冶具之開孔並受吸力暫時固定於其中，並且同時可透 =壓。十1測壓力值而得知是否冶具中是否已載滿凸塊。 :將載滿焊料凸塊之治具翻轉並將凸塊與封裝基板之電 '^塾進行對位’並排氣體產生正壓，使得焊料凸塊被 附於封裝基板上的助焊劑。待治具脫離後，進行迴 合。因Γ Γ化後再次固化而與封裝基板之電性連接塾結 佳，lit2電性連接塾表面之凸塊質量與尺寸均勾性 凸塊分布、發明之方法，可達到更小間距及更小體積之 布進而提昇產品良率，改善封裝效果。 【實施方式】 具體實施例言兒明本發明之實施方 以下係藉由特定的 20 200917389 式’熟習此技藝之人士可由本說明書所揭示之内容輕易地 了解本發明之其他優點與功效。本發明亦可藉由其他不同 的具體實施例加以施行或應用，本說明書中的各項細節亦 可基於不同觀點與應用’在不脖離本發明之精神下進行各 5 種修飾與變更。 實施例 參考圖2A至2D，其為本實施例凸塊植入方法之流程示 意剖面圖。 10 首先，如圖2A所示，提供一具有複數開孔4U之治具 40。此治具40具有一承載單元41，係具有一第一表面412、 相對之一第二表面413及貫穿第一表面412及第二表面 之複數開孔41a。並且，開孔41a位於第一表面412的孔徑d 係大於位於第二表面413的孔徑d。於本實施例中，承載單 15兀41為一鋼板，但亦可為其他適用之金屬板。另外，承載 單元41第一表面412的開孔之尺寸一致，第二表面413的開 孔之尺寸亦-致。此外，此冶具2G亦包含一氣室43配置於 承載單元41之第二表面413,且連接一抽氣/排氣端…針對 氣室43進行抽排氣。並於氣室a之抽氣/排氣端…連接—壓 20力计（圖中未不）’藉由壓力計偵測氣室43之氣堡變化。 接著’如圖2B所示，將複數凸塊34置於承載單元41之 第一表面412上，藉由氣室43之抽氣/排氣端仏進行抽氣之 ，力（其氣體之流向為圖中箭頭所示），而吸附凸塊Μ於承載 早純之開孔4U内。由於凸塊34係以先行製備成大小近 25 —致之球形’因此其置於承載單元41的第—表面M2時，可 200917389 错：：動、震動或滾動而於第一表面4i2上移動，且來自上 述氣室43之抽氣/排氣端43a吸力引導，使得凸塊％更順利移 動，入承載單元41之開孔化内。此外，因為開孔41a位於 第表面412的孔徑D大於位於第二表面413.的孔徑^，戶斤以 .查二：又吸力暫時固定於開孔…中。透過承載期間觀察 連接亂室43抽氣/排氣端4蚊廢力計上顯示之㈣變化，可 了解當負麈值達—最低穩定數值時，即代表冶具4〇之開孔 41a内已载滿凸塊34。 而後’如圖2C所’提供表面形成有—助焊劑33之封 裝基板^’此助焊劑33有助㈣定凸塊34於封裝基板观 將别步驟已載滿凸塊34之冶具4Q翻轉’使立承载單 元41之第-表面41a面對封裝基板3Q表面，且冶具做開孔 裝基板3°之電性連接墊305。期間，抽氣/排氣 15 g t仍持續針對氣室43進行抽氣，以防止翻轉時開孔4U 内之凸塊34掉落。 a接續參考圖2D所示，抽氣/排氣端仏對氣室43進行排 自開孔41補’峨置於所對應 ，如圖2E所示，移開治具4〇，並於後續 進订迴焊以黏接於電性連接墊3〇5。 本發明所 而非僅限 上述實施例僅係為了方便說明而舉例而已 主張之權利範圍自應以中請專利範圍所述為準 於上述實施例。 20 200917389 【圖式簡單說明】 圖1A〜1C係習知模板印刷法製作焊料凸塊之流程示意剖面 5 圖。 圖2A〜2E係本發明較佳實施例凸塊植入方法之流程示意剖 面圖。。 【主要元件符號說明】 10 封裝基板 14 錫膏 21a 開孔 40 治具 41a 開孔 413 第二表面 43 氣室 34 凸塊 30 封裝基板 105 21 22 電性連接塾 鋼板 刮刀 41 412D，d 43a 33 305 承載單元 第一表面 孔徑 抽氣/排氣端 助焊劑 電性連接墊 10 11Introducing the bumps of nearly equal volume, and guiding the bumps by means of gas extraction: the openings of the tool are temporarily fixed by the suction force, and at the same time, the pressure can be passed through. The pressure value is measured at ten and it is known whether the jig has been filled with bumps. : The fixture carrying the solder bumps is turned over and the bumps are aligned with the package substrate and the discharge body is positively pressed so that the solder bumps are attached to the flux on the package substrate. After the refusal is removed, the round is carried out. Because of the re-solidification after deuteration, the electrical connection with the package substrate is good, and the quality and size of the bumps on the surface of the lit2 electrical connection are distributed, and the method of the invention can achieve smaller pitch and smaller. The volume of cloth further enhances product yield and improves packaging. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be readily understood by those skilled in the art from this disclosure. The present invention may be embodied or applied in various other specific embodiments. The details of the present invention can be modified and changed in various ways without departing from the spirit and scope of the invention. Embodiments Referring to Figures 2A to 2D, there are shown schematic cross-sectional views of a bump implantation method of the present embodiment. 10 First, as shown in Fig. 2A, a jig 40 having a plurality of openings 4U is provided. The fixture 40 has a carrying unit 41 having a first surface 412, a second surface 413 opposite thereto, and a plurality of openings 41a extending through the first surface 412 and the second surface. Also, the aperture d of the opening 41a at the first surface 412 is greater than the aperture d of the second surface 413. In this embodiment, the carrier sheet 15兀41 is a steel plate, but may be other suitable metal plates. In addition, the size of the opening of the first surface 412 of the carrying unit 41 is uniform, and the size of the opening of the second surface 413 is also uniform. In addition, the tooling 2G also includes a gas chamber 43 disposed on the second surface 413 of the carrying unit 41, and connected to an exhaust/exhaust end to evacuate the gas chamber 43. At the pumping/exhaust end of the air chamber a, the pressure gauge is used to detect the change of the gas chamber 43 by the pressure gauge. Then, as shown in FIG. 2B, the plurality of bumps 34 are placed on the first surface 412 of the carrying unit 41, and the air is exhausted by the suction/exhaust port of the air chamber 43. The arrow in the figure is shown, and the adsorption bump is placed in the opening 4U carrying the early purity. Since the bump 34 is first prepared to have a spherical shape that is nearly 25 in size, so that it is placed on the first surface M2 of the carrying unit 41, it can move on the first surface 4i2 by moving, vibrating or rolling. The suction/exhaust end 43a from the air chamber 43 is suction-guided so that the bump % moves more smoothly into the opening of the carrying unit 41. In addition, since the aperture D of the opening 41a at the first surface 412 is larger than the aperture of the second surface 413., the suction is temporarily fixed in the opening. Observing the change in (4) shown on the mosquito waste meter of the exhaust/exhaust end of the connection chamber 43 during the load-bearing period, it can be understood that when the negative 麈 value reaches the lowest stable value, the opening 41a of the tool 4 已 is full. Bump 34. Then, as shown in FIG. 2C, a package substrate having a surface formed with a flux 33 is provided. This flux 33 helps the (four) fixed bumps 34 to flip the mold 4Q of the bumps 34 on the package substrate. The first surface 41a of the vertical carrying unit 41 faces the surface of the package substrate 3Q, and the metallurgy is made of an electrical connection pad 305 of the substrate. During this period, the pumping/exhaust 15 g t continues to pump the air chamber 43 to prevent the bump 34 in the opening 4U from falling when the turning is performed. a. Referring to FIG. 2D, the air/exhaust end 仏 is arranged in the air chamber 43 from the opening 41, as shown in FIG. 2E, and the fixture is removed, and then The reflow is ordered to adhere to the electrical connection pad 3〇5. The present invention is not limited to the above-described embodiments, but is merely exemplified for the convenience of the description, and the scope of the claims is as defined in the above-mentioned embodiments. 20 200917389 [Simplified Schematic Description] Figs. 1A to 1C are schematic cross-sectional views showing a process of fabricating solder bumps by a conventional stencil printing method. 2A to 2E are schematic cross-sectional views showing the flow of a bump implanting method according to a preferred embodiment of the present invention. . [Main component symbol description] 10 Package substrate 14 Solder paste 21a Opening 40 Fixture 41a Opening 413 Second surface 43 Gas chamber 34 Bump 30 Package substrate 105 21 22 Electrical connection 塾 steel scraper 41 412D, d 43a 33 305 Carrying unit first surface aperture suction/exhaust end flux electrical connection pad 10 11