200917183 九、發明說明： 【發明所屬之技術領域】 本發明是相關於一種整合光學像素。 【先前技術】 :對娛樂、建築和廣告目的的顯示器單元一般地由許 =元件所構成，舉例來說1置在平垣嵌板的發光二 極體（LED )或白熱燈。針對新 一 _ T5T新聞或疋美學的目的，發光 一極體元件可以選擇性地開或 _ 』*關以產生圖案、圖形以及影 像的顯示。由磚型或是大型嵌板而組成這些顯示器是為熟 ^的’、其^型或是大型嵌板是為了特定娛樂表演或事件或 疋葛成建築或廣告顯示器，而奘舶户、态木& 而裝配在適當的位置。此類系 統的範例揭示在美國專利第6 8 1 1 δ U a t 〜罘 ¢),813,853、ό，704,989 以及 6，3 1 4，6 6 9 號。 使用在廣告、運動和其他大眾影像應用的大型室外影 像顯示器典型地使用塑膠外罩和設置電路板結構構件之結 合所裝配，其電路板含有Iφ β ^ ^ u + 占,贫光一極體、配電和驅動電子系 統0此類裝配是熟知且可得的 ,m J侍的，如同Y〇lsza等人在美國專 利第 5,410,328 號（圖]A、/ 丨 β J·. m i A )的靶例所述之單一像素’和200917183 Nine, invention description: [Technical field to which the invention pertains] The present invention relates to an integrated optical pixel. [Prior Art]: A display unit for entertainment, construction, and advertising purposes is generally composed of a component, for example, a light-emitting diode (LED) or a white heat lamp placed in a flat panel. For the purpose of the new _T5T news or aesthetics, the illuminating element can be selectively turned on or _"* off to produce patterns, graphics, and images. These displays are made up of bricks or large panels. They are either 'cooked' or large panels for specific entertainment performances or events or smashing into architectural or advertising displays. & and assembled in the appropriate location. Examples of such systems are disclosed in U.S. Patent Nos. 6 8 1 1 δ U a t 罘 ¢ ,), 813, 853, ό, 704, 989 and 6, 3 1 4, 669. Large outdoor image displays used in advertising, sports, and other popular imaging applications are typically assembled using a combination of a plastic cover and a set of circuit board structural members, the circuit board containing Iφ β ^ ^ u + occupies, lean light, power distribution, and Such an assembly of the drive electronics system 0 is well known and available, as described by the target of U.S. Patent No. 5,410,328 (Fig. A, / 丨β J.. mi A ) by Y〇lsza et al. Single pixel' and
Masanobu Miura在美國奎立“蚀声 你呆回專利第5,268,828號（圖1B)範例 所揭示之複數個像素條紋，及Matsumura等人在美國專利 第 5,7 8 5,41 5 號（圖 ic& / , _ 1 Λ ^ ^ L夕靶例所述之多像素模組。這些基 本設計的修改或是改進是熟知且可以包含用於通孔發射器 的表面架置發射器和構件之替代物。 200917183 在包入進已完成的led顯示器之前，在如上述模組之 基本的構件中經受高度的處理、裝配及再封裝。舉例來說， LED晶粒是裝配至封裝内，驅動晶粒是已封裝的，且電路 板（其電路板上架置著led封幻必須包含第二構件以調 整驅動電壓和處理資料訊號。 圖1A顯不單一像素系統的先前技術，如同Y〇lsza等 人在美國專利第5,410,328號所述。發光二極體（LED) 22 ^ 憑藉電子插座42連接至分離的驅動板。 圖1B顯示複數個像素條紋系統的先前技術，如同 Masanobu Miura 在美國專利第 5 268 828 號所述。LED 1〇3a 連接至有電線的基板2，其依次地連接至分離的遠端驅動 板。 圖lc顯示多像素模組系統的先前技術，如同 Matsumura等人在美國專利第5 785，415號所述。複數個 放配在基薄板之上’其基薄板裝有密封且防水的包裝。 I LED驅動器是分離的’因此不能藉由這些密封而加以保護。 【發明内容】 本敛述系統揭示針對影像顯示器的led封裝之設計’ 其影像顯示器整合發光材料、驅動電子系統和光學系統。 藉由在LED封裝内包含驅動功能，此類lED顯示器的製 造和功能可以被簡化。 【實施方式】 6 200917183 在單-高度整合封裝中，敘述在本揭示之 合光學單元(ί〇υ)封袭會包含…構件所選出之元:整 * LED晶粒或其他發光元件 干. LED驅動電子系統或針對1仙政， 子系統 十對其他發光元件的驅動電 參 # Φ 機械的裁體 熱管理系統 Φ 光電二極體或其他針對明視度 測元件 和色度回饋的光感 • 針對環境防護的密封劑 * 適合架置的表面 如本文所述，發光元件可以是單一的顏色 色或f任何顏色的組合。再者，密封劑可以是錢脂或? 其他岔封物，如所熟知的技術。 $疋 圖2 “發明揭示實施例的圖式，其顯示所 的剖面透視圖。發氺-拉；μ , λ 冢常 …。， 體2〇1可以晶粒接合至基板202。 " ^封人至石夕樹脂載體2G3，接著，其可 =_ _樹脂凝膠填滿。㈣賴膠 石夕樹脂載體203的折射率相稱。 早了以與 在此’雖然石夕樹脂被用成且插述成密封材 亚并如此限制，且# ^ ^ 更進—艾地，實施例可以使用其他透明 …”密封材料，如所熟知的技術。 所揭=素是:：明揭示之更進-步實施例的圖式，其顯示 ’、、。面圖。發光二極體3〇1可以晶粒接合至基 200917183 板302。包含驅動電路之更進一步的石夕基板3i〇可以接合 至第-基板302的背面且可以熱獨立自發光二極體3〇1。 基板302和基板310的裝配可以裝配至石夕樹脂載體32〇, 其可以更it #地以發樹脂凝膠填滿。石夕樹脂凝膠的折射 率可以與梦樹脂載體320的折射率相稱。 圖4是顯示本發明揭示實施例的單一像素正視圖之圖 式。描繪了 LED晶粒40 ! a_4〇】j和石夕樹月旨填充料孔穴4〇4。 LED 401a-401j 可以是相 π β τ。 J j以疋相冋或疋不同的顏色。在實施例所 圖示中，401c 和 401e 县 έτ Α ^ 疋紅色，401b和401f是藍色，4〇la 和4〇lg是綠色，偏和4〇lj是青綠色和侧是橘色。 然而，本發明並不限於這些顏色的組合，且其他的組合可Masanobu Miura is in the United States of America, "There are a number of pixel stripes as disclosed in the example of Patent No. 5,268,828 (Fig. 1B), and Matsumura et al., U.S. Patent No. 5,7 8 5,41 5 (Figure ic & / , _ 1 Λ ^ ^ The multi-pixel module described in the example of the target. These basic design modifications or improvements are well known and may include alternatives to surface mount emitters and components for through-hole emitters. 200917183 Before being packaged into a completed led display, it is subjected to a high degree of processing, assembly and repackaging in the basic components of the module as described above. For example, the LED die is assembled into the package and the drive die is already The packaged, and circuit board (the board mounted with a LED block must contain a second component to adjust the drive voltage and process the data signal. Figure 1A shows the prior art of a single pixel system, as in the US patent of Y〇lsza et al. No. 5,410,328. Light Emitting Diode (LED) 22 ^ is connected to a separate driver board by means of an electronic socket 42. Figure 1B shows a prior art of a plurality of pixel stripe systems, as in Masanobu Miura, US Patent No. 5 268 828. The LEDs 1〇3a are connected to a wired substrate 2, which in turn is connected to a separate remote drive board. Figure lc shows the prior art of a multi-pixel module system, as in Matsumura et al. 5 785, 415. A plurality of matings are placed on the base sheet. The base sheet is sealed and waterproof. The I-LED driver is separate and therefore cannot be protected by these seals. The splicing system reveals the design of a led package for an image display. The image display incorporates a luminescent material, a driving electronic system, and an optical system. By including a driving function in the LED package, the manufacture and function of such an lED display can be simplified. [Embodiment] 6 200917183 In the single-height integrated package, it is described that the optical unit (〇υ) in the present disclosure will contain the components selected by the component: the whole * LED die or other light-emitting components. LED Drive electronic system or for 1 Xianzheng, subsystem 10 pairs of other light-emitting elements drive electrical parameters # Φ mechanical cut-off thermal management system Φ photodiode or other target Light perception of optometry elements and chromatic feedback • Sealant for environmental protection* Suitable for mounting surfaces As described herein, illuminating elements can be a single color or a combination of any color. Furthermore, the sealant can It is a grease or other enamel seal, as is well known in the art. Fig. 2 "Inventively discloses a diagram of an embodiment showing a cross-sectional perspective view. Hairpin-pull; μ, λ 冢 often... The body 2〇1 may be die bonded to the substrate 202. " ^ Sealed to the Shi Xi resin carrier 2G3, and then it can be filled with =_ _ resin gel. (4) Laijiao The refractive index of Shishi resin carrier 203 is commensurate. As early as and here, although the Shishi resin is used and interposed as a sealing material and is so limited, and #^^ is further advanced, the embodiment may use other transparent..." sealing materials, as is well known. The technique is as follows: a diagram showing a further embodiment of the invention, which shows a ',., a plan view. The light-emitting diode 3〇1 can be die bonded to the base 200917183 plate 302. Further, the circuit substrate 3i can be bonded to the back surface of the first substrate 302 and can be thermally independent from the self-luminous diode 3〇1. The assembly of the substrate 302 and the substrate 310 can be assembled to the lithographic resin carrier 32〇, It may be filled with a resin gel. The refractive index of the Shixi resin gel may be commensurate with the refractive index of the dream resin carrier 320. Fig. 4 is a view showing a single pixel front view of the disclosed embodiment of the present invention. The LED dies 40 ! a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the figure, 401c and 401e counts έτ Α ^ 疋 red, 401b and 401f are blue , 4〇la 4〇lg and green, and 4〇lj are partial side are cyan and orange. However, the present invention is not limited to the combination of these colors, and other combinations may be
以使用在更進一步的實施例中。在本實施例中，九個LED 以叫顯示於方形網格陣射。更進_步的實施例可以 是所熟知的技術之任何形狀，舉例來說（但不限於此）， 方形、長方形或是圓形。 圖5是本發明揭示實施例的圖式，其顯示所揭示像素 封裝的後視圖。電子墊54。可以針對電力及/或 連接至像素。對於個別LED每—者之驅動電壓 上^^ k供的’其中LED藉由切基板5Η) =驅動:路來封裝。此實施例闊明了複數個發 以僅以六個接頭來控制。顯示在本實施例的 在-個實施例中，… f 而來控制像素。 以及4^。包含三個次像素；紅色、綠色 孤 更進一步的實施例中’驅動電路510可以架 200917183 有紅色、綠色、冑色、青綠色、橘色以及白色 有像素。在發基板510上的咖驅動電路可以具 1驅動電路移除熱之專用的熱墊541。 ^本發明揭示實施例的圖式，其顯示具有微陰影 =代性實施例之側視圖。…〇1可以具有一系列的 丢p 650 ’其陰影嵌入至矽樹脂的前表面。接著，陰影 ㈣可以為LED中的像素6〇1遮蔽太陽光或是環境光^ 亚改善觀察對比度和顯示器的表面亮度。 圖7是本發明揭示實施例的圖式，其顯示内部载體結 構的替代性實施例之橫截面圖。⑪樹脂載冑7G2背面的像 、1可以延伸至背面760，以容納針對無表面黏著版本 的像素之連接器（未顯示）。 圖8疋本發明揭示實施例的圖式，其顯示替代性微陰 870的正視圖。在本實施例中，微陰影包含複數個 薄的角度結構，且可以使用來最小化週遭光源的影響。更 進乂地，微陰影870的前表面和後表面（或其至少一部 伤）可以包含抗反射塗層，舉例來說，Petrwci-hmija等 人在期刊論文所述之抗反射塗層，標題為〇ptn〇nTM Anti-Used in a further embodiment. In this embodiment, nine LEDs are displayed in a square grid array. Further embodiments may be of any shape known in the art, such as, but not limited to, square, rectangular or circular. Figure 5 is a drawing of an embodiment of the present invention showing a rear view of the disclosed pixel package. Electronic pad 54. It can be for power and/or connected to pixels. For each of the individual LEDs, the driving voltage is supplied by ^^k, where the LED is packaged by the substrate: 5: drive: way. This embodiment contemplates that a plurality of shots are controlled with only six joints. In the embodiment of the present embodiment, ... f is shown to control the pixels. And 4^. Three sub-pixels are included; red, green, and so on. The drive circuit 510 can be mounted in 200917183 with red, green, ochre, cyan, orange, and white pixels. The coffee driving circuit on the hair substrate 510 can have a dedicated thermal pad 541 for removing heat from the driving circuit. A diagram of an embodiment of the invention is shown showing a side view of a micro-shaded embodiment. ...〇1 can have a series of lost p 650 'shade embedded in the front surface of the resin. Then, the shadow (4) can block the sunlight or the ambient light for the pixel 6〇1 in the LED to improve the viewing contrast and the surface brightness of the display. Figure 7 is a drawing of an embodiment of the present invention showing a cross-sectional view of an alternative embodiment of an internal carrier structure. The 11 resin-loaded image of the back of the 7G2, 1 can be extended to the back side 760 to accommodate a connector (not shown) for a surface-free version of the pixel. Figure 8 is a diagram of an embodiment of the present invention showing a front view of an alternative negative shade 870. In this embodiment, the micro-shadows comprise a plurality of thin angular structures and can be used to minimize the effects of surrounding light sources. More specifically, the front and back surfaces of the micro-shadow 870 (or at least one of its injuries) may comprise an anti-reflective coating, for example, the anti-reflective coating described by Petrwci-hmija et al. in the journal article, title For 〇ptn〇nTM Anti-
Reflective Optical Coatings for Front Surface of Flat Panel Displays，其呈現在 2007 年 Society for Information Display 研討會。更進一步地，微陰影87〇可以包含非常小的特徵， 舉例來說，Kim等人在期刊論文所述之Thin Film CoatingS that Reflect Virtuaily N〇 Ught，其併於此當成參考資料。 抗反射塗層（類似於Kim等人所述）可塗在較堅硬的頂部 200917183 防護塗層的下方’且可幫助優化總内反射（t〇tal internal reflection; TIR)的像素顏色混合部份之光提取性能。更進 一步地’每一個抗反射塗層（如petrucci_Samija和Kim 等人所述）可以聯合使用，舉例來說，在微陰影870的前 表面之上使用Petrucci-Samija抗反射塗層’並且在微陰影 870的别表面之上使用Kim抗反射塗層。再者，藉由使用 比起所揭示的Petrucci-Samija和Kim之較大特徵，微陰 影870也可以用來反射紅外光，舉例來說，熱鏡。 圖9是本發明揭示實施例的圖式，其顯示光接收器的 細節。矽樹脂載體902可以含有光管970，其引導至光接 收器。光接收器可以架置在驅動電路矽基板上或是可以架 置在LED基板上。光管97〇和聯合的光接收器可以從靠近 像素中心取出光的樣本，以測量像素的顏色、亮度和白平 衡。光管970和聯合的光接收器也可以用來接收來自於遠 端控制器之編碼的光訊號資料。光接收器可以是所熟知任 何技術之適合的受體，舉例來說，光電二極體、光電晶體 官、電荷耦合元件（Charge-Coupled Device ; CCD)或是 另一個光敏整合電路或裝配。雖然單一光管97〇和光接收 器已在本文加以解釋，更進一步的實施例可以具有複數個 光管970且可以有複數個個光接收器。更進—步地，由於 來自於發光元件中像素所發射之光的顏色混合光接收器 和光管970 T以用來測量每一個像素的特徵或是特性，舉 例來說，均質的色度和每—個像素的明視度。 圖10是本發明揭示實施例的圖式，其顯示具有超模麼 200917183 陰影之揭示的複數個LED封裝之視圖。像素群組i〇〇la_ 1001c可以適合於超模的矽樹脂前方遮蓋物i〇〇2a。前方遮 蓋物1〇〇2a的頂部1003a充當為大的陰影，以改善表面亮 度和顯不s對比度’且更進—步地可以防護像素免於被飛 行的殘骸直接擊中。更進—步地，像素群组丨⑼1 & ^謝f 也可以適合於遮蓋物10〇2b和陰影1〇〇3b。 鑒於本發明已經描述了有關於限定數量的實施例，擅 長此技術的人（擁有本發明的優勢）將會了解可以設計其 他實施例而不背離本發明在本文揭示的範疇。因此，本發 明的料應該只被所附之中請專利範圍和他們的相等物而 限制。 【圖式簡單說明】 圖1A顯不先前技術系統一針對大規模LED顯示器之 可置換的智慧型像素模組。 ° 圖1B顯示另—個先前技術系統—發光顯示器元件。 圖1C顯示另一個先前技術系統一LED顯示器元件及 其裝配結構。 圖2是本發明揭示實施例的圖式，丨顯示所揭示像素 的剖面透視圖。 ” 圖3疋本發明揭示實施例的圖式；其顯示所揭示 的剖面圖。 斤、 圖4是顯示本發明揭示實施例的正視圖之圖式。 圖5是本發明揭示實施例的圖式，其顯示所揭示像素 11 .〆Reflective Optical Coatings for Front Surface of Flat Panel Displays, presented at the 2007 Society for Information Display Symposium. Further, the micro-shadow 87〇 can contain very small features, for example, by Thin et al. in the journal paper, Thin Film CoatingS that Reflect Virtuaily N〇 Ught, which is hereby incorporated by reference. An anti-reflective coating (similar to that described by Kim et al.) can be applied beneath the harder top 200917183 protective coating' and can help optimize the pixel color mixing portion of total internal reflection (TIR) Light extraction performance. Further, 'each anti-reflective coating (as described by petrucci_Samija and Kim et al.) can be used in combination, for example, using a Petrucci-Samija anti-reflective coating on top of the micro-shadow 870' and in a micro-shadow Use a Kim anti-reflective coating on top of the 870. Moreover, the micro-shadow 870 can also be used to reflect infrared light, for example, a heat mirror, by using a larger feature than the disclosed Petrucci-Samija and Kim. Figure 9 is a diagram of an embodiment of the present invention showing details of an optical receiver. The resin carrier 902 can contain a light pipe 970 that is directed to the light receiver. The optical receiver can be mounted on the drive circuit 矽 substrate or can be mounted on the LED substrate. The light pipe 97〇 and the combined light receiver can take samples of light from near the center of the pixel to measure the color, brightness, and white balance of the pixel. Light pipe 970 and a combined optical receiver can also be used to receive the encoded optical signal data from the remote controller. The optical receiver can be a suitable receptor for any of the well-known techniques, for example, a photodiode, a photonic crystal, a Charge-Coupled Device (CCD), or another photosensitive integrated circuit or assembly. While a single light pipe 97 and an optical receiver have been explained herein, a further embodiment may have a plurality of light pipes 970 and may have a plurality of light receivers. Further, the color receiver and the light pipe 970 T are mixed by the color from the light emitted by the pixels in the light-emitting element to measure the characteristics or characteristics of each pixel, for example, homogeneous chromaticity and per - the brightness of a pixel. Figure 10 is a diagram of an embodiment of the present invention showing a view of a plurality of LED packages having a super-mode 200917183 shadow disclosure. The pixel group i〇〇la_ 1001c may be suitable for the overmolded resin front cover i〇〇2a. The top 1003a of the front cover 1〇〇2a acts as a large shadow to improve surface brightness and display s contrast and further protects the pixel from being directly hit by the flying debris. Further, the pixel group 丨(9)1 & ^谢f can also be adapted to the cover 10〇2b and the shadow 1〇〇3b. The present invention has been described in terms of a limited number of embodiments, and those skilled in the art, having the advantages of the present invention, will appreciate that other embodiments can be devised without departing from the scope of the invention disclosed herein. Therefore, the materials of the present invention should be limited only by the scope of the patents attached to them and their equivalents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A shows a replaceable smart pixel module for a large-scale LED display. ° Figure 1B shows another prior art system - an illuminated display element. Figure 1C shows another prior art system - an LED display element and its assembly structure. Figure 2 is a diagram of an embodiment of the present invention showing a cross-sectional perspective view of the disclosed pixel. Fig. 3 is a cross-sectional view showing the disclosed embodiment of the present invention. Fig. 4 is a front view showing an embodiment of the present invention. Fig. 5 is a diagram showing an embodiment of the present invention. , which displays the revealed pixels 11 .
200917183 的後視圖。 圖6是本發明揭示實施例的圖式， 層的替代性實施例之側視圖。 圖7是本發明揭示實施例的圖式， 構的替代性實施例之橫截面圖。 圖8是本發明揭示實施例的圖式， 視圖。 圖9是本發明揭示實施例的圖式， 細節。 圖1 0是本發明揭示實施例的圖式， 陰影的複數個LED封裝之視圖。 其顯示具有微陰影 其顯示内部載體結 其顯示微陰影的正 其顯示光接收器的 其顯示具有超模壓 【主要元件符號說明】 201 發光二極體 202 基板 203 矽樹脂載體 204 孔穴 301 發光二極體 302 基板 310 基板 320 矽樹脂載體 401a-401j led 404 4夕樹脂填充料孔穴 510 基板 12 200917183 540 電子墊 541 熱墊 601 像素 650 陰影 701 像素 702 碎樹脂載體 760 背面 870 微陰影 902 石夕樹脂載體 970 光管 lOOla-lOOlf 像素群組 1002a、1002b 遮蓋物 1003a 頂部 1003b 陰影 13Rear view of 200917183. Figure 6 is a side elevational view of an alternate embodiment of the layers of the disclosed embodiment of the present invention. Figure 7 is a cross-sectional view of an alternative embodiment of the illustrated embodiment of the present invention. Figure 8 is a diagram, view of an embodiment of the present invention. Figure 9 is a drawing, detail of an embodiment of the present invention. Figure 10 is a diagram of a disclosed embodiment of the present invention, a view of a plurality of shaded LED packages. The display has a micro-shadow which shows the internal carrier junction and its display is slightly shaded. Its display has a super-molding of its display. [Main component symbol description] 201 LED 201 203 Resin carrier 204 Hole 301 LED Body 302 substrate 310 substrate 320 resin carrier 401a-401j led 404 4 eve resin filling hole 510 substrate 12 200917183 540 electronic pad 541 thermal pad 601 pixel 650 shadow 701 pixel 702 broken resin carrier 760 back 870 micro-shadow 902 Shi Xi resin carrier 970 light tube lOOla-lOOlf pixel group 1002a, 1002b cover 1003a top 1003b shadow 13