TW200909518A - Insulating resin composition - Google Patents

Abstract

Disclosed is an insulating resin composition to be arranged on a base of a flexible printed wiring board, which contains a urethane (X), an epoxy resin (B) and a filler (C). This insulating resin composition is characterized in that the urethane (X) is a polyurethane-polyurea resin (A), a hydroxy group-containing urethane prepolymer (f), or a mixture of the polyurethane-polyurea resin (A) and the hydroxy group-containing urethane prepolymer (f). The polyurethane-polyurea resin (A) is obtained by reacting a polyamino compound (e) with an isocyanate group-containing urethane prepolymer (d) which is prepared by reacting a polyol compound (a),anorganic diisocyanate (b) and a carboxyl group-containing diol compound (c).; The hydroxy group-containing urethane prepolymer (f) is obtained by reacting an polyol compound (a), an organic diisocyanate (b) and a carboxyl group-containing diol compound (c). The insulating resin composition is further characterized in that the filler (C) is an organic resin filler and the base is a thermoplastic resin base. This insulating resin composition exhibits good adhesion to the base as well as low warping property, flexural property, blocking resistance and flame retardancy.

Description

[Numerical Field of the Invention] The present invention relates to an insulating resin composition using an insulating layer as a printed wiring board. More specifically, an insulating resin composition used for a flexible printed wiring board or the like using a thermoplastic resin as a substrate, and a flexible printed wiring board comprising the resin composition. [Prior Art] In recent years, printed wiring boards have used various forms in accordance with required final products, environments, and costs, and their characteristics have required high standards in order to increase functionality. Among them, the use of a flexible substrate has been increasing in recent years, and the printed wiring board included in various diversified products is classified into a polyimide-based substrate according to the use, performance, and the like. Polyester is a substrate or the like. In the structure of the sigma-like flexible wiring board, the base layer, the conductor layer, and the insulating layer are sequentially laminated, and the density θ of the wiring is increased in recent years, and the insulating layer is further formed. A multilayer construction of the conductor layer is provided. In this case, the insulating layer covered with the conductor layer is responsible for the damage of the conductor or the protective conductor body to various environmental damages, and is an important function of the printed wiring base = a constituent element. Further, the above-mentioned insulating layer is required to have a flame retardancy function in most cases from the viewpoint of the final product. Eight characteristics still require high flexibility, insulation reliability, and tamper resistance. For example, with polyterephthalic acid? u & 一 曰 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 可 971 971 971 971 971 971 971 971 971 971 971 971 971 971 971 971 971 971 The characteristics of the material are also excellent, so it is the best use. However, in recent years, the material of the insulating material from the environmental protection has gradually developed toward the direction of not using the tooth, and the two sexes can be satisfied without using the element. _ Sex, and = Insulation material that is still incompetent. ' * 兼 兼 其他 其他 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 158 In the case of providing a material that is not used (4), it exhibits high flame retardancy, and is flexible, and has excellent insulating properties to the substrate, and excellent in blocking resistance. And a flexible printed wiring board using the composition. (Means for Solving the Problem) The insulating resin composition according to the present invention contains ethyl urethane (X) and epoxy resin (B). And fillers ( And an insulating resin composition for the base material of the flexible printed wiring board, wherein the urethane (X) is a polyol compound (a) or an organic diisocyanate ( b) Polyisocyanate prepared by reacting an isocyanate group-containing ethyl urethane prepolymer (d) prepared by reacting a carboxyl group-containing diol compound (c) with a polyamine compound (e) Acid ester polyurea resin (A); or hydroxyl group-containing amino decanoate prepared by reacting polyol compound (a), organic diisocyanate (b) and thiol group-containing diol compound (c) 97120194 7 200909518 Polymer (f); or a mixture of the above polyurethane polyurea resin (A) and the above hydroxyl group-containing ethyl carbamate prepolymer (f); 1 the above filler (C) The base material is a thermoplastic resin base material, and the insulating resin composition according to the present invention has a weight of 1 相对 based on the total weight of the urethane (x). %, containing epoxy resin (B) 3 to 200% by weight. In the above-mentioned insulating resin composition, the organic resin filler (c) is contained in an amount of 100% by weight based on the total weight of the above-mentioned urethane (χ) and the epoxy resin (B). In the above-mentioned insulating resin composition according to the present invention, the organic resin filler (C) is derived from a urea resin system, a melamine resin system, a urethane resin system, and a benzoguanamine. In the above-mentioned insulating resin composition according to the present invention, the polyol compound (a) is at least p-citric acid and/or isophthalic acid. A polyglycol polyol prepared by reacting a diol with an acid component. Further, the insulating resin composition described above further contains a wax (D) of 40 ° C or more and i8 〇〇 c or less. Further, in relation to the above insulating resin composition, the fiber (D) is n, and ethyl-bis-stearylamine is extended. Further, in the flexible printed wiring board according to the present invention, the insulating layer provided on the conductor layer is formed of the insulating resin composition, and the 97102194 200909518 conductor layer is provided on the flexible printed wiring board. On at least one surface of the thermoplastic resin substrate. (Effect of the Invention) According to the present invention, it is possible to provide a high flame retardancy without using a halogen-containing material, and to provide flexibility to a substrate having no surface treatment, and the substrate is thermoplastic. An insulating resin composition for a flexible printed wiring board of a resin or a flexible printed wiring board using the above insulating resin composition can be provided. <Embodiment of the Invention First, the insulating resin composition of the present invention will be described. The insulating resin composition of the present invention contains the specific urethane (S) (X), the epoxy resin (B) and the organic resin filler (c) as described above. The above amino decanoic acid ethyl ester (X) is a polyurethane polyurea resin (A), an amino decanoic acid ethyl ester prepolymer (f) or a polyurethane urethane resin (A) and A mixture of the amino decanoic acid ethyl ester prepolymer (f). The insulating resin composition contains the polyamino phthalate polyurea resin (A) as the above-mentioned ethyl urethane (X), which is an ethyl urethane prepolymer (d) having an isocyanate group, The polyamine compound (e) and, if necessary, a reaction terminator are reacted and obtained. The isocyanate group-containing amino phthalate prepolymer (d) is prepared by reacting a polyol compound (a), an organic diisocyanate (b)', and a carboxyl group-containing diol compound (c). In the insulating resin composition, the ethyl urethane prepolymer (f) contained in the above-described amino decanoic acid ethyl ester (X) is a polyol compound (a) or an organic diisocyanate (b). And the diol compound (c) having a carboxyl group is reacted in the state of 97120194 9 200909518, and is obtained in the state in which a terminal group is present at the terminal. It is generally known that the polyol compound (a) is a polyol component constituting a polyamino phthalate resin, and various polyether polyols, polyester polyols, polycarbonate polyols, polybutadienes, and the like can be used. Alcohols or mixtures of these, and the like. The polyether polyols may, for example, be a polymer or a copolymer of ethylene oxide, propylene oxide, tetrahydrofuran or the like. Examples of the poly-based polyols include ethylene glycol, hydrazine, 2-propylene glycol, 1,3-propanediol, 1,3-butylene glycol, 1,4-butanediol, neopentyl glycol, and pentanediol. , 3 - mercapto-1,5-pentanol, hexanediol, octanediol, iota, 4-butanediol, diethylene glycol, triethylene glycol, dipropylene glycol or dimer diol And unsaturated low molecular weight diols; and alkyl epoxidized propyl ethers of n-butyl epoxypropyl ether ' 2 -ethylhexyl epoxypropyl ether, or propyl propyl versamate (glycidyl Versatate) and other monocarboxylic acid glycidyl esters, with adipic acid, citric acid, isophthalic acid, citric acid, maleic acid, fumaric acid, succinic acid, oxalic acid, propylene a polyester polyol obtained by dehydration condensation of a dicarboxylic acid such as acid, glutaric acid, pime Hcacid, suberic acid, sebacic acid or sebacic acid or the like A polyester polyol obtained by subjecting a cyclic ester compound to ring-opening polymerization. 'Polycarbonate can be a reaction of an n-diol or a double-carbonic acid carbonate; and 2) a reaction of a diol or a bisphenol with phosgene in the presence of a base. Examples of the carbonate include dinonyl carbonate, diethyl carbonate, diphenyl carbonate, ethylene carbonate or propylene carbonate. In addition, the diol system is as follows: ruthenium glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, butanol, 3-mercapto-1,5-pentanediol, 2-mercapto-one U-octanediol, 3, 3, _ 97120194 10 200909518 - by mercapto, polyoxyethylene glycol, polyoxypropylene glycol, propylene glycol, 1'3-butanediol, 1'4-butanediol, 15 _Pentanediol, 16 hexanediol, 14_ monomethylol%: hexane, 1,9-nonanediol, neopentyl glycol, octanediol, butyl ethyl pentanediol, 2-ethyl- 1,3-hexanediol, cyclohexanediol, 3,9-bis(1,1-methyl 2 1ethyl or 2,2,8-tetra-tetraoxone [5.5] eleven or the like. Further, the double (four) may be, for example, a bis, a material F, or a bisphenol obtained by adding an alkylene oxide group such as ethylene oxide or propylene oxide to the like. The number of the above polyol compound (a) The average molecular weight (Mn) is determined by factors such as heat resistance, mechanical properties, and/or solubility of the polyurethane urethane polyurea resin (A) and/or urethane prepolymer (f) obtained. After appropriate decision, usually it is best to be in the range of 5〇〇~8〇〇〇, especially 1 000 5000. If the Mn is less than 5 Å, the excessive bonding of the urethane in the polyurethane urethane (1) and/or the urethane prepolymer (1) results in a decrease in the flexibility of the polymer skeleton. When the Mn exceeds 8 Å, the molecular weight between the crosslinking points becomes large, and the heat resistance tends to decrease. The polyol compound (a) can be used alone or in combination. Two or more kinds may be used in combination. Further, the above polyol compound (a) is not lost in the range of the properties of the polyurethane polyurea resin (A) & / or the urethane prepolymer (f). A part of the low molecular diols, for example, the various low molecular diols used in the preparation of the above polyol compounds (polyols belonging to the starting materials of the above polyester polyols and polycarbonate diols) can also be used. In particular, when the above polyol compound (a) is a polyester polyol, as a dicarboxylic acid component which reacts with a diol, a molecular structure of 97120194 11 200909518 having an aromatic ring and a phthalic acid and/or a different one is used. Polyester sterol with a large amount of citric acid Thereby, the toughness and viscosity of the polyurethane polyurea resin (A) and/or the ethyl urethane prepolymer (f) can be enhanced, and the coating composed of the insulating resin composition can be improved. The hardness and viscosity of the film layer are particularly excellent. Further, by using only the carboxylic acid and/or isophthalic acid, the dicarboxylic acid component is reacted with the diol, and the prepared polyester is used. The alcohol can greatly improve the bending property of the coating film, and thus is particularly excellent. The organic diisocyanate compound (b) can be an aromatic diisocyanate, an aliphatic diisocyanate, an alicyclic isocyanate or the like. The mixture 'is particularly preferably isophorone diisocyanate. Examples of the aromatic diisocyanate include hydrazine, 5'-diisocyanato-naphthyl ester, 4,4-monophenylmethane diisocyanate, and 4,4,-diphenyldimethyl decane diisocyanate. 4,4,-Benzyl isocyanate, dialkyldiphenylnonane diisocyanate, tetraalkyldiphenyldecane diisocyanate, hydrazine, 3_diisocyanate, benzoquinone, 1 '4-diiso Cyanate phenyl ester, diisocyanate phenyl ester or diterpene diisocyanate S. The ruthenium di-isocyanate may, for example, be butane-丨, 4-diisocyanate, /, fluorenylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate or diazonic acid diisocyanate. . The ruthenium-based di-isocyanate may, for example, be cyclohexane-ruthenium, ruthenium 4-diisocyanate, isophorone diisocyanate, methyl norcapine diisocyanate or bis(4-isocyanate cyclohexyl) fluorene. Alkane, hydrazine, 3-bis(isocyanate decyl)cyclohexane or methylcyclohexane diisocyanate. 97120194 12 200909518 3 The alcohol compound (C) having one carboxyl group may, for example, be a dimethylol alkanoic acid such as dimethylolacetic acid, dihydroxymethylpropionic acid, dihydroxymethylbutyric acid or dimethylolvaleric acid. Or dihydroxysuccinic acid, dihydroxybenzoic acid. In particular, it is preferably di-methylpropionic acid or di-methylbutyric acid from the viewpoint of reactivity and solubility. A condition in which the polyol compound (a), the organic diisocyanate (b), and the carboxyl group-containing diol compound (C) are reacted to obtain an amino phthalate ethyl ester prepolymer (d) having an isocyanate group, except Excessive isocyanate groups,

f. , , I % is not particularly limited, and it is preferable to set the equivalent ratio of isocyanate group/hydroxy group to be in the range of 1.05/1 to 3/1. Especially 12/1~2/1 is better. Further, the reaction is usually carried out at a temperature of from room to temperature (15 °C), and is preferably carried out between 6 〇 and 12 (in terms of production time and side reaction control). The polyol compound (a) and the organic diisocyanate are used. b) The reaction is carried out with the carboxyl group-containing diol compound (c) to obtain a hydroxyl group-containing amino decanoic acid ethyl ester prepolymer (f), except that the hydroxyl group is made excessive, and A special limitation 'preferably, the isocyanate group/hydroxy group equivalent ratio is in the range of 0.8/1 to 0.99/1. Further, the reaction is usually carried out at a normal temperature of ~15 〇〇c, from the viewpoint of production time and side reaction control. Preferably, it is carried out at 60 to 120 ° C. 1 Amino acetal polyurea resin (A) is as described above, and an amino decanoic acid ethyl ester prepolymer (d) having an isocyanate group is polymerized. The amine compound (e) is obtained by a reaction. The polyamine compound (e) has a chain extender action, except for ethylenediamine, propanamine, hexamethylenediamine, diethylenetriamine, and triethylenetetramine. Isophorone 97120194 13 200909518 Amine-% hexylmethane-4,4-diamine or nordanediamine Using 2-(2-aminoethylamino)ethanol, 2-ethylethyldi-, 2-ethylethyldiamine, di-2-ethylethyldiamine or di-2-aminopropane A group of amines such as ethylenediamine, among which, it is preferred to use isophora-diamine.

When the polyamino phthalate polyurea resin (a) is synthesized by reacting an aminocyanate ethyl ester prepolymer (d) having an isocyanate group with a polyamine earth or a substance (e), the adjustment is obtained. The molecular weight of the polyamino phthalate polyurea resin (A) may be a combination of a reaction terminator. As the reaction terminator, dialkylamines such as di-n-butylamine, dialkanolamines such as diethanolamine, and alcohols such as ethanol or isopropanol can be used. The conditions for reacting the ethyl carbamate prepolymer having an isocyanate group ((1) with the polyaminolated δ (e) and optionally the reaction terminator are not particularly limited, when it is to be in the amine When the free isocyanate group present at the both ends of the ethyl urethane prepolymer (d) is oxime equivalent, it is preferred to set the total equivalent weight of the amine group in the polyamine compound (e) and the reaction terminator to 〇. Within the range of ~1. 3, especially in the range of 0.8 to 〇.995. When the total of the amine groups is

When the amount is less than 0_5, the molecular weight of the polyurethane urea resin cannot be sufficiently increased. When it exceeds 1·3', the polyamine compound (e) and the reaction terminator may remain in a large amount in an unreacted state, and the epoxy resin (B) in the insulating resin composition may directly react with the unreacted amine group, or The unreacted amine group in the insulating resin composition exhibits catalytic activity, resulting in a decrease in the usable time of the insulating resin composition. The weight average molecular weight (Mw) of the polyurethane polyurea resin (A) is preferably in the range of 5,000 to 200,000. The weight average molecular weight of the amino group-based ethyl decanoate prepolymer (f) having a mercapto group is 97120194 14 200909518 (Mw), preferably in the range of 5,000 to 100,000. Further, the acid value of the polyurethane polyurea resin (A) and/or the urethane prepolymer (f) is preferably in the range of 80 mgKOH/g. Further, the "acid value" means an acid value calculated based on a carboxyl group, and is a solid content relative to the polyamino phthalate polyurea resin (A) and/or the amino decanoic acid ethyl ester prepolymer (f). When the acid value of the polyamino phthalate polyurea resin (A) and/or the urethane prepolymer (f) is less than 1 mg K 〇 H / g ', the epoxy resin contained in the insulating resin composition The cross-linking of (B) becomes insufficient, resulting in a decrease in hardenability and an increase in viscosity, which does not exhibit a solvent property. On the other hand, if the acid value is more than 8 〇mgKOH/g, the epoxy resin (B) contained in the insulating resin composition is excessively crosslinked, and the adhesion strength to the substrate of the adherend is lowered, and the curing shrinkage is caused by hardening. The cause of the warpage of the adherend. Moreover, when it is used as an insulating layer of a flexible wiring board, in terms of flame retardancy, when the above-mentioned insulating material is excessively crosslinked, it may be burned by hindering the drips of the substrate. This leads to a situation where the flame retardancy is lowered and is therefore best avoided. (In the synthesis of the urethane urea resin (A) and/or the urethane prepolymer (f), it can be used from an ester solvent, a ketone solvent, a glycol ether, or an aliphatic The solvent, the aromatic solvent, the alcohol solvent, the carbonated vinegar-based agent, or the water may be used alone or in combination of two or more. The 匕-曰系岭知丨] may be, for example, ethyl acetate Ester, isopropyl acetate, n-butyl butyl acetate, amyl acetate or ethyl lactate, etc. (4) The solvent system may, for example, be propylene, methyl ethane, methyl isobutyl benzene, di/ , butanone, diacetone alcohol, isophorone or cyclohexanone, etc. 97120194 15 200909518 The monoether ether bath can be exemplified by, for example, rs ^ ether, ethylene glycol monobutyl (tetra) oxime, early ether, and ethylene glycol. Acetyl-rc times ° Hai 4 early screaming class of acetate; diethylene glycol dimethyl diethylene glycol monoethyl-, diethylene glycol monobutyl ether, propyl ^ 知 早 early, two - domain ^ ^ f an ether or an acetate of such monoethers, etc.

Cyclohexane or ethylcyclohexane. Examples of the hexane % hexane T aryl solvent include toluene or xylene. Examples of the alcohol solvent include methanol, ^ (butanol or cyclohexanol, etc. Examples of the ethylidene, 1-propanol, 2-propanol, and butyl carbonate-based solvents include di-n-butyl carbonate and the like. - methyl ester, ethyl methyl carbonate or, further, the insulating tree of the present invention has an epoxy group-containing compound, and the epoxy tree gambling contained in the second (B: the above epoxy group. Epoxy resin or ring of epoxy propyl π-amine type epoxy resin, epoxy eucalyptus eucalyptus, % oxypropylene (alicyclic epoxy resin), etc. Aliphatic epoxy propyl ether type epoxy tree sputum; ... epoxy resin, double s-type epoxy oxygen tree wax, tree wax 1 year old type epoxy tree wax, (10) type epoxy age polymer Epoxy propyl bond (Japan, biphenyl, bicyclononadiene, phenol I into the house) a 3 system. NC~3〇〇〇, etc., system: XD~1000, etc.) Tachibana (Japan Chemical Pharmaceutical Co., Ltd. 97120194) Nai (four) road type epoxy tree wax, double W type powder 16 200909518 Oxygen tree ^ Lithium pentylene type epoxy tree, biphenyl type epoxy resin: (% propyl propyl phenyl, oxime (epoxy Propyloxyphenyl)ethene, etc. The 'oxypropylamine type epoxy resin may, for example, be a tetraglycidyl propyl diamine, a benzyl group, a triepoxypropyl group, an amino group, a triepoxypropyl amino phenol or Tetra-glycidyl-m-xylylenediamine, etc. The anthracene-dioxy propyl aceton type epoxy resin may, for example, be decanoic acid propylene oxide = hydrazine/hydrogen o-benzoic acid diepoxypropyl group.酉 或 or tetrahydrofurfuric acid diepoxypropyl group: =1 fat _ family (month-day type) soil oxygen resin may be, for example, epoxycyclohexylmethyl-coating ring hexose carboxylic acid hydrazine or double (Epoxycyclohexyl) hexamethylene or the like. The oxyresin may be used alone or in combination of two or more. Epoxy wax (8) is from the viewpoint of high adhesion and/or heat, most::: Double: Α-type epoxy resin, akisaki type epoxy resin '(tetra)-based (epoxypropyloxyphenyl)-methyl or oxime (epoxy acrylate) In the insulating resin composition of the invention, the above-mentioned urethane The epoxy resin composition (8) is preferably blended (4) with respect to 100 parts by weight of the above-mentioned amine "antimony ethyl ester (x), preferably 3 to 200 parts by weight of the cyclic resin (B), particularly preferably 5 to 1 part by weight. If epoxy (B) Less than 5 θ Γο 17 ^ ^ ", f± ^^ ( b") J ^ ZOO Heavy 1 injury, there is a tendency to reduce the adhesion of the substrate. The insulating resin composition is composed of organic resin Filling 钊α) can improve the flame retardant 97120194 17 200909518 without adding a known known flame retardant. In addition, when the adhesion between f is evaluated, the fluidity, viscosity and/or base are required. The material is maintained or upgraded higher than the desired level:: it is upgraded to be inflammable, and the physical properties of the material can also be filled (the system is filled with the organic resin (8), compared to the one: two of the above amino-based acid Ethylene ketone (1) is refractory to dioxin used in epoxy tree cutting, talc or body remainder. This effect is related to the inorganic filler, which has been found to be greatly improved. It is considered that it has not been found in the field of I in the case of burning, but it can be filled in the inorganic system; the second and seventh fillings are not burned and remain. Between the agents, it is easy to pass the flammable substance and burn it. The blush filler (c) is a granular filler filled with an organic resin or the like. The urea resin-based filler and the melamine resin-based filler are used. The acid ethyl resin-based filler or the benzoguanamine resin-based filler = true = fat filler (C) is commercially available, for example, urea resin / 1.. albemarle /AV51t^ rpERG0PAK ^ sweet". Further, the melamine resin-based filler may, for example, be "Epostar M30" manufactured by Sakamoto Catalyst Co., Ltd. The urethane resin 糸 糸 糸 ART ART ART ART ART 。 。 ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART ART The benzoguanamine resin-based filler may, for example, be "Ep〇star Secret, Milk" manufactured by Sakamoto Catalyst Co., Ltd., or the like. The resin-based fillers are, for example, "PR-RES-5" manufactured by Sumitomo Bakelite Co., Ltd., and "Shonol 8PMB-1010" manufactured by Showa Takatsuki Co., Ltd. Acrylic resin-filled J-type system, for example, 97120194 18 200909518, manufactured by Sekisui Kogyo Seisakusho Co., Ltd. "Techpolymer® MBX series, towering. 7 ratios, for example, the accumulation of finished products: = as a filler" m version of the injury company

The Techpolymer® SBX series, 笙 _ ^ , J is made of an organic resin filler (c) such as a single m-injection, which is formed by the organic resin formed by the polymerization of the early body, so that the resin is in the main chain and/or Or the cross-linking or any-structure between the main chains can still show the flame retardant lifting effect, but it is best to belong to the cross-linking bismuth: solvent resistance. These organic resin fillers (c) can be used alone or in combination. The average particle diameter of the organic resin filler (6) is not particularly limited, and can be selected in accordance with the final material structure and required characteristics. From the viewpoint of greatly improving flame retardancy, it is preferable to use an organic compound having a nitrogen atom in a molecular structure. Resin filler. Specifically, the 'Special County' contains a urea-based filler containing a urea bond, a urethane-containing urethane-based urethane-based filler, and a melamine resin-based filler which is an amine-based compound. Or a benzoguanamine resin-based filler. The amount of the organic resin filler (c) is preferably 100 parts by weight, more preferably 〇. uoo parts by weight, based on 100 parts by weight of the above-mentioned urethane (X) and epoxy resin (B). In the following, it is preferable to avoid the case where it is difficult to exhibit a flame retardancy effect. On the other hand, when it exceeds 200 parts by weight, the fluidity control of the insulating composition tends to be difficult, or mechanical properties such as flexibility. In the case of deterioration, it is preferable to avoid it. In order to achieve both the flame retardancy effect and the mechanical property, it is preferably 3 to 30 parts by weight. In the insulating resin composition of the present invention, the polyamine phthalate is promoted. The urea resin (A) and/or the ethyl urethane prepolymer (f), the reaction with the epoxy resin (B) 97120194 19 200909518, and the reaction between the epoxy resin (B) may still contain A hardening accelerator and/or a hardening agent. The hardening accelerator of the epoxy resin (B) may be, for example, a cyclized compound, a phosphine compound or a sulphur compound, and the curing agent may be, for example, dicyandiamide or carboxylic acid hydrazine. , an acid anhydride, etc., or an aliphatic or aromatic private methyl urea, etc. Further, since the aminoester prepolymer (f) contains a hydroxyl group, it can be crosslinked by a conventionally known isocyanate or blocked isocyanate. (The hardening accelerator is for the tertiary amine compound, for example, triethyl An amine, a benzylamine, a 1,8-diazabicyclo(5.4) myrcene-7 or a u5-diaza-f ring (4.3.3.0) decene _5, etc., and the like. The phosphine compound may be, for example, triphenylphosphine or tributylphosphine, etc. The imidazole compound may, for example, be a 2-methylmethane, a 2-ethyl-4-methylsulfonate, or a 2-phenylmethylhydrazine. An imidazole compound such as saliva, 2, 4' dimethylimidazole or 2-phenylimidazole, and a form in which the solvent is insolubilized by reacting the oxidized epoxy resin is preferably a compound of the compound. The form of the capsule is modified, and the latent hardening accelerator for preserving stability is preserved. The modifier for the bismuth citrate may be, for example, a station:: etc. Further, the acid (four) may, for example, be hexachlorophthalic acid: 'The amount of addition is 30 parts by weight. ^ These hardening accelerators and hardeners can be used in combination of two or more kinds, and the epoxy resin (8) is preferably the same. It is set in the range of U. · It is not allowed to bond to the substrate, and the insulating resin composition of the present invention can be blended into the resin within the range of deterioration of properties. 97120194 20 200909518 Agents, coloring pigments, dyes, tackifying resins, plasticizers, UV absorbers, defoamers and/or leveling agents, etc. By using a heat stabilizer, it is possible to impart better solder resistance. As the agent, a hindered phenol type, a phosphorus (phosphate) type, a lactone type, a hydroxylamine type, or a sulfur type can be used, and particularly a hindered phenol type heat resistant stabilizer is most effective. The insulating resin composition of the present invention The purpose is to further increase the resistance when applying high temperature and high load while maintaining the resistance, such as bendability, adhesion and/or flame retardancy, by further containing wax (D). Adhesion (the purpose is to reduce surface stickiness). The melting point of the wax (D) is 4 (TC or more and 1801 or less, and from the viewpoint of improving the blocking resistance, it is preferably at a temperature of 40 degrees or higher. The wax (D) is a normal hydroxyethyl-12- The base stearylamine, and the N, n, _ exoethyl-bis-oleylamine, N, N, - ethyl-bis-ricinolein, n, n, _ Base bis-octadecanthate, azlactone, j\|, ν'_extended ethyl-bis-i2-peri-based hard amide, N,N,-extended ethyl-bis-stearylamine, n,N,_hexamethylene-bis- castor oil decylamine, N,M,-hexamethylene-bis-12-hydroxystearylamine or Ν'Ν'-extension xylene-bis-12-hydroxyl It is preferable to use N, from the viewpoint that the anti-blocking property is excellent when the load of 1 〇kg/cm2 or more is applied at a temperature of 80 degrees or more under a temperature of 80 degrees or more. N, - ethyl-bis-stearylamine. The amount of the wax (D) to be added is preferably 1% or more and 1% by weight or less based on the solid content of the insulating resin composition. If it is not, it will not show the effect of improving the blocking resistance. On the contrary, if it exceeds 10%, it will damage the performance of the insulating resin composition. 97120194 21 200909518 Condition.卞Because the insulating resin composition of the present invention contains the organic resin filled back J (c) and thus exhibits a greatly improved flame retardancy, the known flame retardancy level may be added as known. Flame retardant. The type of the flame retardant is particularly specific to the linseous system, for example, a polysulfate member, a phosphine or a phosphazene. The surface of the polyphosphate is coated with guanidinium, which is most suitable for the use of the rim of the present invention because of its low water absorption. In addition, since phosphines and phosphorus-nitrogen compounds are less susceptible to hydrolysis, they are preferably used for insulating materials. Phosphates can be used, in particular, $1'2 bis(monophenylphosphine)ethane, hydrazine, 3-bis(diphenylphosphino)propane, bis(diphenylphosphine)butane# 1,5-double (two In the case of phenylphosphine, pentane or the like, the ratio of the scaly atom in the structure is high, and a large amount of scaly atoms can be added to the insulating resin composition in a small amount, which is a particularly preferable state. In the insulating resin composition, from the viewpoint of the promotion of the anti-blocking property, it is also preferable to further contain the modified organic polyoxo oxy- smolder as an anti-adhesion agent. The modified organic polyoxymethane is, for example, substituted with a polydimethyl oxy-oxygen group, and substituted with a polyfluorene group, a polyester group, a burnt group, an aryl group, and/or other organic groups. "βΥΚ_310" manufactured by BYK_Chemie Co., Ltd., "Silaplane® fm_4411, fm_〇41i" manufactured by Shin-Etsuka Co., Ltd., "KF-410, X-22-4039, CHISS0", ·^·

There are no special restrictions on "54ADDniVE, 85〇3ADDinvE" manufactured by Dow Corning. Among these, in particular, modified organic polysecond oxygen burning having a reactive functional group such as a base group, a carboxyl group or a cyclic emulsion group reacts with a component in the insulating grease-hanging composition, and is chemically fixed to the coating film. Surface 97120194 22 200909518 The above is the result of the anti-adhesion continuity and the non-polluting nature of the manufacturing line. The modified organic polyoxo-oxygen system having such a reactive functional group may, for example, be BYK_Chemie & "37 龄, ΒΥΚ-375, BYK-377", Shin-Etsu #利光公司", KF-6001 'X ~99 47/11 Into 22-4741, X-22_3701Ε, χ_22-4〇39, X 22 162C, X-22-163C, Χ-22-4952, Χ-22-170ΒΧ, 2 173DX”, CHISS0 company Siiapiane® 丄, FM-0411”, etc. " The insulating layer composed of the insulating resin composition of the present invention is formed by at least one surface of each of the f materials by a conventionally known method (for example, screen printing, knife coating, die coating, and knife coating) Cloth, roller coating, curtain coating, bar coating, gravure printing, rubber plate rotary printing, dip coating, spray coating or spin coating, etc.), after applying the above insulating resin composition, usually according to 40~160 〇C can be formed by drying. Further, the dry film thickness of the insulating layer is preferably from 〇 to 500 μπι, particularly preferably from 10#m to 1〇〇#m, from the viewpoint of exhibiting various performances and ease of handling. Next, a flexible printed wiring board using the insulating resin composition of the present invention will be described. The flexible printed wiring board is used on a flexible resin substrate having flexibility and insulation, and the insulating resin of the present invention is applied to a flexible printed wiring board having a body pattern formed by a printing technique. The composition is an insulating layer and is coated, and dried and hardened to be fixed. The flexible printed wiring board of the simplest structure is provided with a conductor layer on at least one surface of the thermoplastic resin substrate, and an insulating layer formed of the insulating resin composition of the present invention is provided on the conductor layer. Further, the printable substrate 97112194 23 200909518 is provided with a conductor layer 'on at least one surface of the thermoplastic resin substrate and an insulating layer formed of the insulating resin composition of the present invention on the conductor layer. It is also possible to have a structure in which a conductor layer is laminated on the insulating layer. The thermoplastic resin substrate is a VTM-2 grade or higher in a combustion test according to the UL94 vertical combustion method, and a known material which will drip from the substrate can be used. The Hi substrate may be exemplified by polyethylene terephthalate or polycarbonate. [Examples] The present invention is described in more detail below by way of examples, but the following examples are not intended to limit the scope of the invention. In addition, "parts" and "%" in the examples mean "parts by weight" and "% by weight". [Synthesis Example 1] In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, a drip device, and a nitrogen inlet, the mixture was filled with p-butyric acid, adipic acid, and 3-methyl-indole, 5-pentane. Polyester polyol obtained from diol [Kuraray P〇ly〇i p_2〇11, manufactured by KURARAY Co., Ltd., Mn=2011] 454.6 parts, dimethylolbutane owing 16.5 parts, isophorone diisocyanate 105 .q parts and 曱 140 140 parts of 'under nitrogen environment' were reacted at 9 ° C for 3 hours, and 360 parts of toluene was added thereto to obtain an amino phthalate ethyl ester prepolymer solution having an isocyanate group. Then, in the mixture of 19.3 parts of isophoronediamine, 2.2 parts of di-n-butylamine, 29.4 parts of 2-propanol and 335 parts of toluene, the obtained isocyanate group is added. The urethane prepolymer solution 968. 5 parts 'reaction at 50 ° C for 3 hours, then at 7 (TC under 2 small 97120194 24 200909518 when the reaction 'reuse 1-2 parts and 2- propyl 54 parts of alcohol was diluted to obtain a polyamino phthalate polyurea resin solution A_1 (solid content: 30%) having Mw = 57,000 and an acid value: ^OmgKOH/g. [Synthesis Example 2] A thermometer, a reflux condenser, a drip device, and a nitrogen-introducing reactor are filled with a polyester polyol obtained from g-acid, adipic acid, and 3-mercapto-1,5-pentanediol. [Kuraray Polyol ρ_2〇ΐΐ" by KURARAY Co., Ltd., Μη=2011]345·3 parts, dihydroxy oxime keidine & 10_7 wound, isophorone diisocyanate 51.1 parts and carbitol acetate _ 94. 5 parts, under nitrogen atmosphere, at 9 ° ° c for 3 hours, adding carbitol acetate vinegar 31 〇. 5 parts to obtain Mw = 30, 000, acid price = i 〇mgK〇H/g A hydroxyl group-containing amino decanoic acid ethyl ester prepolymer solution fl (solid content: 50.1%) [Synthesis Example 3] A reaction vessel equipped with a scrambler, a thermometer, a reflux condenser, a drip device, and a nitrogen U-introduction tube Medium filled with polyester polyol obtained from isophthalic acid and 3-methyl-15-pentanediol [Kuraray Kuraray

份。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Next, the reaction was carried out for 3 hours at 9 ° C, and 575 parts of carbitol acetate was added to the reaction product to obtain hydroxy group-containing citric acid having a MW of 30,000 and an acid value of 10.5 mg K0H/g. Ethyl ester prepolymer solution f-2 (solids: 50.5%). [Synthesis Example 4] 97120194 25 200909518 A reaction vessel equipped with a stirrer, a thermometer, a reflux condenser, a drip device, and a nitrogen introduction tube was charged with adipic acid and 3-methyl-1,5-pentanediol. Polyester polyol obtained [Kuraray Co., Ltd."

Polyol P-2010"] 637. 1 part, 20.8 parts of dimethylol butyric acid, 95.9 parts of isophorone diisocyanate and 162.5 parts of carbitol acetate, under nitrogen environment at 90 °C The reaction was carried out for 3 hours, and 575 parts of carbitol acetate was added to the reaction product to obtain a urethane-based prepolymer solution having a hydroxyl group of Mw=30, hydrazine, acid value = 10·5 mg K0H/g. (f-3 (solid content: 50.5%). In addition, the weight average molecular weight (Mw) of the polyamino phthalate polyurea resin and the hydroxyl group-containing urethane prepolymer is determined by GPC measurement. GPC measurement conditions are as follows: Device: Shodex GPC System-21 [Showa Denko Co., Ltd.] Pipe column · Shodex KF-802, KF-803L, KF-805L [Showa Denko (share) system] A total of 3 joints are used. Solvent: tetrahydrofuran flow rate: 1. OmL/miη Temperature: 40 °C Sample concentration: 〇. 2% by weight Sample injection amount: lOOeL [Example] ' According to Table 1 The insulating resin compositions of Examples 丨 to 丨2 and Comparative Examples 1 to 5 were prepared in the formulations shown in Table 2, respectively. The coating was applied on the surface of the untreated polyethylene terephthalate film (manufactured by Toyobo Co., Ltd.: e51〇〇, 97120194 26 200909518, thickness 75/ζπι) in terms of the film thickness after drying. 8 (TC oven for a few minutes to dry ^ early in the morning. * In the 150 C hot air oven, 1 hour hardening, forming a test test piece 97120194 27 200909518 r'\ /% [5 examples are LO b 1 < 1 1 < LO inch · 100/100 Chang cr> XXI cracking I VTM-2 LO 1 Example 11 (Ν1 LO r-Η 卜 inch r-Η ι 1 LO 1 1 < 100/100 House CD 〇 〇No cracks and no cracks 1 V1M-2 1 Example 10 CO LO T—Η Bu inchΤ 11 < 1—^ τ—( LO r· H g ·ι·Η 〇> τ—H Sa CD 〇 〇 occurrence of crack VT1-2 inch 1 I example g <>3 LO t-Η 卜r < τ-Η LO inch · g 1 <<=) τ-H Ο Ο X dish no turtle Crack does not conform to 1 |Example 8| CO LO 1—Η ι Η LO 寸 _ g ι 1 <〇<'Ή 圏CD 〇X No cracks and no cracks: 1 § Real Example 7 OJ LO 卜τ—Η Τ"~< LO inch·§ ι—H 〇>1"<face<〇〇X no crack J does not conform to 1 CO Ίκ C<1 LO τ-Η卜Inch τ—Η τ~Η LO g ι1 1 <〇ι—H 〇〇X No cracking VTM-2 宕1 ιΛ Meal οα LO τ—Η [>- τ—Η LO inch· § 1 t Ό I'1 H 〇〇X No cracking<Μ e LO τ-Η 1 1 Example 4| Csi LO ι—Η ι—Η r 1 f LO — S τ—1 CD r-^ I 〇〇 X No cracking and cracking VTM-2 CO Η 1 ! Example ^ csl LO 1' 1 ) 卜 inch t Μ rH LO inch · Round 〇〇 X No cracking VTM-2 inch 1 Example 2| CO LO 1 —Η Τ Τ —Η rH LO 寸· | loo/ioo| 〇 〇 > X 1 Cracking οα ί 寸 1 | Example 1! CO LO CN1 ι—Η τ—Η rt | loo/ioo | 1 〇<] X disc 1 crack 1 VTM-2 inch 1 Τ-Η ι Η 1 <4-Η CXI S-ι CO JER1031S *1 Urea resin filler*2 Urethane resin Filler*3 melamine resin Filling agent*4 benzoguanamine resin filler aging acrylic resin filler wood 6 styrene resin filler*7 1? W i}mf σρ 姊夺碟CD 1-1 蘅颦m DICY-7 * 11 U-CAT SA102 ^12 MF-K60X *13 inch jM is 〇1 Adhesion evaluation of warpage evaluation; secret connection 1 evaluation of silk fibrosis 2 evaluation 3 Bay foldability 2 evaluation of flame retardancy evaluation from ignition (first time The time from the ignition to the ignition (seconds) The time from the ignition (1st time) until the flame reaches the marking line (seconds) m 筘-SZU6 200909518 Comparative example 5 LO 1 t Bu 1—Η Γ"'< LO 1 100/100 I 1 <Ζ5 XX 1 Cracking I 螬|Non-conformity | 1 CO Comparative Example 4 οα LO τ-H 卜τ-Η t-Η τ-^ LO 呀·100/100 i ο 〇 X No cracked disc|Not in conformity with 1 CO than car case 31 C<1 LTD Bu τ—Η τ—^ LO 1100/1001 ic=> 〇X No cracking disc I does not match 1 Comparative example 2 I CO LO卜τ—Η LO 100/100 i CD < X t no cracks do not meet 1 〇〇|Comparative example 1 CO LO Bu 1—^ 1 100/100 1 i CD < X No cracks Μ | Compliance | 1 LO Example 161 CV3 LO 〇〇 〇〇 Η Η ι Η LO inch · ι—H 1 loo/ioo 1 i <=> 〇〇 no cracked disc VTM-2 inch 1 Example 151 (N1 LO t-H卜卜^-Η ι 1 LO inch · rH I 100/100 ί Noodle no cracker m-2 1 Example 14 CO LO rH 〇〇 CM ι—Η τ—Η LO ι—H 1 loo/ Ioo 1 io 〇〇 no cracking cracking m-2 1 Example 13 CO LTD 卜卜r-Η τ—Η LO τ—H 1 loo/ioo 1 Sa CD 〇〇|No crack Μ 1 m-2 1 1 1 <4-H CNI Mh CO JER1031S *1 Urea resin filler*2 Aurethane resin filler*3 Melamine resin filler*4 Benzoamide resin filler*5 i ) ES i filled with styrene resin filler *7 resin filled filler *8 m ◦ W 姊颦DICY-7 *11 U-CATSA102 *12 MF-K60X *13 N,Ν'-extended ethyl-double醢 * 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 From ignition (first time) to fire Time to reach the mark (seconds) j Formulation evaluation 63 inch 6I0Z: U6 200909518 *1 . JER1031S. Four (cyclic lactopropyl phenyl) Ethylene (Japan Epoxy Resins (stock), epoxy equivalent = 180~220g /eq) *2 : Urea resin filler: PERGOPAK M5, average size (d50) = 3. 5~6. 0# m *3 : Crosslinked urethane resin filler: root Industrial Co., Ltd. ' ARTPEARL P-800T, average particle size = 7 #111 * 4 · Condensation type melamine resin-based filler: Japan Catalyst Co., Ltd. 'Epostar M30, average particle size = 2. 5~4. 0// m *5 : Condensed benzoguanamine resin-based filler: Epostar M05, manufactured by Nippon Shokubai Chemical Co., Ltd., average particle size = 4 to 6 / / m *6 : Crosslinked acrylic resin filler: water Manufactured by Manufactured Products Co., Ltd., Techpolymer® MBX-8, average particle size = 8// m *7. Parent styrene resin filler: Synthetic Product Co., Ltd., Techpolymer® SBX-6, average Particle size=6/zm *8 · Resin-based filler: Sumitomo Bakelite PR-RES-5

*9: Inorganic filler (cerium oxide): NIPSIL SS-50F: manufactured by TOSOH SILICA Co., Ltd., average particle size = 12/zm *ι〇. Inorganic filler (cerium oxide): manufactured by DEGUSSA, aer〇 Sil 'average particle size = 7nm heat hardener · DICY-7 : Japan Epoxy Resins (stock), micro-crushed dicyandiamide *12. Thermal hardener: u-cat SA1〇2 : SAN ApR〇 company, dinitrogen Octane-block isocyanate of heterobicyclolocene: MF-K60X: Asahi Kasei Chemical Co., Ltd. 97120194 30 200909518 System "4: 躐: N, N'-extended ethyl winter stearic acid amine [Evaluation item • Adhesion Evaluation: Checker tape peeling test according to jIS K5fi. ΓΓ带=棋会盘格100(ι〇χιο) (Maximum inspection system indicates density 2;: Number of checkerboards remaining after tearing • Warpage evaluation: Evaluation test month is 5cmx5cm ' at 25° r 40% constant temperature and humidity environment, placed in double sputum for 24 hours. The test piece is placed on a quiet sliding table, and the distance (mm) between the end face 盥A and the σ σ face is measured. • Anti-blocking property 1: The coated surface of the test alkali Α Α Α 评估 评估 , , , , , , 评估 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Evaluation: 完全: no stickiness (no stickiness) △: feel some micro-sticky feeling (micro-adhesive) X: strong feeling of stickiness (viscosity). • anti-adhesion 2: evaluation test piece The coated surfaces were bonded to each other, and after applying the I2 kg/cm2 load for 24 hours at 80 C, the degree of peeling between the coating films was evaluated in two stages. 〇: no cohesive failure between the coating films X. There is a condensed damage I fold f raw 1. The s flat evaluation test piece of the coating film faces inward, J times bending (10) degrees, visually confirm the crack of the coating film, etc. Bowing] · Health 2 . 5 Flatten the same place of the test piece, apply a 1-degree 180 degree bend to the inside of the film side and then apply the film side to the outside i times i 8 degrees 97120194 31 200909518 Bend and use this as a cycle Repeat the calculation of 10 cycles, visually break the crack of the coating film, etc. Yiyi visually • Flame retardant: The burning test is carried out according to the UL94 vertical burning method. The test is carried out for 5 samples. In addition, in this evaluation , also measured the average value of the time required to extinguish the ignition after the first ignition, and used as a comparison, '. In this case, the shorter the judgment time, the higher the flame retardancy. This; 乍 = after the second ignition, and Those who have not extinguished the flame and burned to the marking line will use the "flammability evaluation rod," in the table Z. For the non-payment &", the flame is extended to Delo, ... to compare the comparison. It is judged that the longer the burning time, the slower the burning speed, and the better the flame retardancy. ..., the evaluation results shown in Table 1 and Table 2 show that the solid resin composition has excellent adhesion, initiation, and anti-blocking. := Sex: Even if it is a formula without added flame retardant, it still shows excellent flame retardancy. It can be used as an important item for insulating materials for flexible wiring boards. 2 The use of the external flexible wiring board is also related to the use of anti-adhesive flexible II (such as the connector part). In this case, the flame retardancy is satisfied. Therefore, the insulating resin composition exemplified in the examples is also suitable for the application. On the other hand, the composition exemplified in the comparative example is difficult to ignite. It is difficult to use it as an insulating material for a flexible wiring board. (Industrial Applicability) The insulating resin composition of this month can be used for thermoplastic resin in a flexible printed wiring board. An insulating layer is formed on the conductor layer provided on at least one of the substrates. The above insulating resin composition has a bonding property with respect to the base material of the base material, and has a low flexibility and flame retardancy. , the bending property, the anti-blocking property, the above, for the present invention to follow the specific state and the operator to easily think about the deformation of the disk to explain the 'only familiar with this skill, & sentence' letter within the scope of the invention . 97120194 33

Claims (1)

200909518 X. Patent application scope: 1 · An insulating resin composition' contains urethane (X), epoxy resin (B) and filler (C), and is used for flexible printing. The substrate of the wiring board is characterized in that the amino ruthenate (X) is a reaction of a polyol compound (a), an organic diisocyanate (b), and a carboxyl group-containing diol compound (c). And the polyisocyanurate polyurea resin (A) prepared by reacting the prepared isocyanate group-containing amino ruthenium ruthenate prepolymer (d) ' with the polyamine compound (e); or a hydroxyl group-containing urethane prepolymer (f) prepared by reacting an alcohol compound (a), an organic diisocyanate (b) and a carboxyl group-containing diol compound (c); or the above polyamino phthalate a mixture of a polyurea resin (human) and a hydroxyl group-containing urethane prepolymer (f); the filler (C) is an organic resin filler; and the substrate is a thermoplastic resin substrate. The insulating resin composition of the first aspect of the invention, wherein the epoxy resin (B) is contained in an amount of from 3 to 200% by weight based on 100% by weight based on the total weight of the ethyl urethane (x). 3. The insulating resin composition of claim 1, wherein the organic resin filler (c) is contained in an amount of 1 gram based on the total weight of the urethane and oxime. 〇·丨~2〇〇% by weight. 4. The insulating resin composition according to the first aspect of the patent application, wherein the organic resin filler (C) is from a urea resin system, a melamine resin system, 97120194 34 200909518, an amine-based ethyl ester resin system, and a benzopyrene The amine resin is a filler selected from at least one selected from the group consisting of. 5. The insulating resin composition of claim 1, wherein the polyol compound (a) is prepared by reacting at least a phthalic acid and/or isophthalic acid as an acid component and reacting with the diol Polyester polyol. 6. The insulating resin composition of claim 1, further comprising a wax (D) having a melting point of 4 〇r or more and 18 (TC or less). 7. Insulation as in claim 6 a resin composition, wherein: butterfly (D) is Ν, Ν'-extended ethyl-bis-stearylamine. 8. A flexible printed wiring board characterized by an insulating layer provided on a conductor layer The insulating resin composition according to any one of the first to seventh aspects of the invention of the present invention, wherein the conductor layer is provided on at least one surface of the thermoplastic resin substrate of the flexible printed wiring board. 97120194 35 200909518 (1) The representative representative of the case is: No (2) The symbol of the symbol of the representative figure is simple: 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 97120194 5