200909078 九、發明說明： 【發明所屬之技術領域】 特別是關於 丰發明係關於一種高頻振動機構之設計 一種具嵌入式高頻振動薄板之高頻振動機構。 【先前技術】 —查，現今高頻振動機構已被廣泛運用於各種 術、日常生活中’其習知之高頻振動技術係將一振動源直 至一薄板結構，以達到使薄板產生振動之 二：習知之黏著技術’係以一種高分子接著劑， 二克力_MA)、環氧樹脂(Ep〇xy)、聚氨脂(pu) 薄Γ結構黏著於振動源上，藉由振動源… 在、頻=:，進而應用到不同之結構上。然而， 板結構黏著固定於振讀無法有效且可靠地將薄 圖，第參Π二 =_頻_板結構之示意 =原=頻振動_100主要包括有一薄板結構，: 其係將振動源機構2直接撞擊薄板結構1， 得薄板;源機構2:產生之振動能量，而使 液態、粉之應用’錯由振動而使其標的物(如 狀寻之材料）產生霧化之效果。 200909078 【發明内容】 本發明所欲解決之技術問題 然而，習用之將薄板結構黏著於振動源機構方 振動源機構直接撞擊薄板結構使其產生振動之:/ 容易因長期受撞擊而造成薄板結❺^ ’ 板結構使用之壽命。 U減少薄 本發明之主要目的是提供—種具嵌人式高頻振動 薄板結構以一水平方向嵌立_ 動之二直方向中段位置處’用以限定薄板結構產生振 機構—目的是提供—難隔薄板結構與振動源 用==係設置於薄板結構與振動源機構之間， 槿山動源機構與薄板結構，並將薄板結構與厚板处 構以嵌入式固定忐或留^ ^ 成為早—結構’當振動源機構振動時，_ 由厚板結構傳導振動能量了猎 生振動之應用。 ，專板結構，進而使溥板結構產 結構，目的是提供—種包括有數個貫孔之薄板 产的物Q 4反結構之巾央位置處開設有數個貫孔，使兑 U物(如液態、粉狀等之材料)經由貫孔送出。 ， 本發明解決問題之技術手段 ㈣：::：解決習知技術之問題所採用之技術手段，乃 將，專板結構與環形振動 板結構係以-水平2叫構間設置有一厚板結構，而薄 α ·β欠立於厚板結構一垂直方向之中段 200909078 位置處’且薄板結構之振動區恰對應於厚板結構之中央 口，’用以限定薄板結構產生振動之範圍，並以嵌入式之制 ^定於厚板結構上，使其成為—單—結構。並在薄板= ㈣區開設數個貫孔。環形振動源機構產生振動並 子板結構’驗由厚板結制振動的振動能量傳導 ’板、”。構上’使薄板結構能產生振動之應用目的，藉由 :動而使其標的物(如液態、粉狀等之材料)產生霧化：效 广嵌入式之製程以避免薄板結構與環形振動源機構 止薄板結構被環形振動源機構撞擊造成破裂 :&明方法可以延長薄板使用壽命，本發明之嵌 結構能夠藉由模具成型之製程加以 陶磁或金屬材料之結構，同時並在同-批次之模且 程使得薄板嵌人厚板結構。 1成以 本發明對照先前技術之功效 C明:!用之技術手段，將薄板結構與厚板結 厚板姓構而薄板結構係以一水平方向嵌立於 振動向之中段位置處，可限定薄板結構產生 源機構之撞擊1=使得薄板結構不會直接受到環形振動 產生厚板結構料料振動源機構所 且構，減少薄板結構產生破損或毀壞， 知用不同之焊接結構’增加緩衝減少撞擊避 並;=編接碰撞，延長薄板結構之使用壽; 曰由在/專板結構之一游叙F p日 苒之振紅開设數個貫孔，使其標的物 200909078 (如液態、粉狀等之材料）經由貫孔送出。 本％明所採用的具體實施例，將藉由以下之實施例及 附呈圖式作進一步之說明。 【實施方式】 參閱第3圖和第4圖所示，第3圖係本發明具嵌入式 高頻振動薄板之高頻振動機構第一實施例之立體解圖，第 4圖係本發明具鼓人式高頻振動薄板第—實施例之高頻振 動機構之斷面圖。高頻振動機構扇係包括有一薄板結構 3、一厚板結構4、一環型振動源機構5。 薄板結構3係為一盤狀結構，具有一振動區^和一 ^定㈣L2，薄板結構3係設置於厚板結構4之選定位 f處。厚板結構4係'為—環狀結構，其中央區域形成有一 :央開口 4〇。厚板結構4係選自於塑膠、石夕膠、橡膠、陶 β、金屬材料之—所製成者，以塑㈣出成型、 壓、射出成型、陶磁、金屬粉末高溫燒結之 ：： :衣成广型振動源機構5係為一高頻振動機 :產生;振動能量，環型振動源機構 構4下方，並_板結構；= 生振動板、，、。構3,用以產生高頻振動以使㈣ 其中，薄板結構3係以一水平方 4之一垂直方向Η之_段位置〆°敗置於厚板結構 宏…… 置處，亦即薄板結構3 h係以水平方向1嵌置於厚板結構4之内環:二 200909078 使薄板結構3之振動區L|位在該厚板結構之中央開 且缚板結構3之振動區M合對應於厚板之口 用以限㈣板結構3產生振動之範^ 中央開口 薄板結構3之振動區Li係開設有數個貫孔 振動源機構5之中央位、 衣型 之中央貫穿孔5。”= 1穿其頂面和底面 舡㈣d 穿 之孔徑大小恰對肩於戶 =之中央開口 40,藉由環型振動源機構5之中：子 ==標的物於薄板結構3，再將標的物(如液-^之材料)經由薄板結構3之貫孔3〇送出。’、 奸板結構3細“之製㈣合於厚板結構4，再 時衣s、動源機構5結合’且環型振動源機構5產生振動 二:!:Γ源機構5係經由厚板結構4傳送振動能量至 錢、構曰3，而薄板結構3接受環形振動源機構$ ’會使薄板結構3之振動區L|達到振動之庫 液態、粉狀等之材料）產生霧化之效果。且，厚如 設計更使得薄板結 :板4 4之 士 ί避免W成缚板結構3本身之破裂損壞’以延長使用 哥命、減少耗材之產生。 、長使用 參閱第5圖所示，其係、顯示本發明第二實 :槿ΪΓ明ί嵌入式高頻振動薄板之高頻振動機構3〇〇之 、Γ :相¥述第—實施例大致相同，故相同之構件乃$ 件…資對應。其差異在於薄= "°° 係王下凹狀，且環形振動源機構5之高度較 200909078 前述第-實施例為短 振動源機構5之直彳a。 、、’。構4之直徑係相同於環形 薄板結構3 a之振動p· τ 標的物之霧化效果，亦凹狀設計係可用以增強 經由厚板結構4傳送振二M動源機構5產生振動並 3a接受環形捃動、周她：月匕里至薄板結構3a，而薄板結構 放於振動所產生之振動能量後，會使得置 構3™貫二成6^?通過薄板結 ，…進，振動源係 >心6圖所示’其軸*本發三 圖，本發明具嵌入式高頻振 -貝苑例之斷面 結構設計與前述第一 ^板之^頻振動機構彻之 Μ相同之元件= ==-之構_ 之振動區U係呈上凸狀。、在於缚板結構3b 同樣地’缚板結構3b之振動區l丨之 用以增強標的物之霧化效果，亦即當環型振動^十= 生振動亚、㈣厚板結構4傳送振動能量 盖 薄板結構3 Μ妾受環形振動源機構5所產生^^ =而 會使得置放於振動區^之標的物6(盆為、夜能又此里後， 薄板結構3b之貫孔3〇b而成為液滴61，液⑽材料):過 之方式進入環型振動源機構5之争央貫穿孔％。系以水敛 結構設計與前;第=::=，一 故相同之構件乃標 200909078 示以相同之元件編號，以資對 機構5係設置於厚板結構4上^。"異在於壤型振動源 機構5產生振動並經由厚板結構4傳送 = = 而薄板結構3,環形振動源 機構5所產生之振動能量後，會使得置放於振動區 的物其為㈣之材料)通過薄板結構〜 1 ^ 為液滴01，液滴61係擴 、0c而成 央開口 40滴出。Η擴政狀之方式由厚板結構4之中 參閱第8圖所示，宜在月 圖，本發㈣五實施例之斷面 -構=二二振動薄板之高頻振動機構6。。之 、.“冓❸十與則述弟四實施例 示以相同之元件編號， 门^相同之構件乃標 之振動區U係呈上凸狀。、對應在於薄板結構％ 振動:==，動並㈣厚板結構， 機構5所產^接受環形振動源 臭 ^使知置放於振動區L少 A (其為液態之材料)通過薄板結構3d之貫孔3⑽而: 為液滴6〗，液滴61係 成 開口 40滴出。 手〜链之方式由厚板結構4之中央 參閱第9圖所示，发位站_ |々 圖，本發明㈣六實_之斷面 樣包括呈右… 板之向頻振動機構7〇〇同 k括具有中央開σ 40之厚板結構 」 呈下凹狀之薄板結構3e。 匕括-其振動區 本實施例與前述實施例之差異在於前述之環型振動源 200909078 . 機構5係由一振動源機構5a所取代。振動源機構5a包括 有-彈性隔膜5卜設置於厚板結構4下方，並在彈性隔膜 51與薄板結構3e之間定義形成—液體容置槽7，—電致動 振動板52嵌置在彈性隔膜S1内部，且經由一對導線兄對 外連接於—振動信號產生電路板54，藉由振動信號產生電 路板54產生之電信號驅動電致動振動板52產生振動。並 且振^源機構5a之選定位置係開設有一液體補充入口 , t振動信號產生電路板54產生之電信號驅動電致動 振動板52產生振動時，即會使電致動振動板52以一垂直 振動方向hi產生振動’跟著帶動彈性隔膜51依垂直振動 2 III進行上下振動（本圖僅顯示其向上振動時之狀態）， 並藉由厚板結構4傳送振動能量至薄板結構3e，而薄板結 構3e接乂振動源機構5a之電信號驅動電致動振動板^所 產生之振動能量後，會使得置放於液體容置槽7之標的物 6(其為液態之材料）通過薄板結構^之貫孔·而成 滴6】’液滴6ί係以聚敛之方式由厚板結…之中央開口仙 滴出。 參閱第10圖所示，其係顯示本發明第七實施例之斷 面圖:本實施例與上述第六實施例之結構設計大致相同， 故相同之構件乃標示以相同之元件編號，以資對應。其差 :、在；柄明具肷人式高頻振動薄板之高頻振 係包其振動區呈上凸狀之薄板結構3f。 當振動信號產生電路板54產生之電信號驅動電 振動板52產生振動時，即會使電致動振動板52以—垂直 -12 - 200909078 動方向III產生振動，跟著帶動彈性隔 方向m進行上下振動(本圖僅顯 择依垂直振動 並藉由厚板結構4傳送㈣能量至薄 ^ 52 „ 二:使得置放於液體容置槽7之標的物200909078 IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to the design of a high-frequency vibration mechanism. A high-frequency vibration mechanism with an embedded high-frequency vibration thin plate. [Prior Art] - Check that today's high-frequency vibration mechanisms have been widely used in various techniques and daily life. 'The well-known high-frequency vibration technology system uses a vibration source up to a thin plate structure to achieve the vibration of the thin plate: The conventional adhesive technology is attached to the vibration source by a polymer adhesive, two-gram _MA, epoxy resin (Ep〇xy), and polyurethane (pu), by vibration source... , frequency =:, and then applied to different structures. However, the plate structure is fixed to the vibration reading, and the thin picture cannot be effectively and reliably. The indication of the first parameter = the original frequency vibration _100 mainly includes a thin plate structure, which is a vibration source mechanism. 2 Directly impacting the thin plate structure 1 to obtain a thin plate; the source mechanism 2: the vibration energy generated, and the liquid and powder application is caused by the vibration to cause the object (such as the material to be found) to produce an atomization effect. 200909078 [Description of the Invention] The technical problem to be solved by the present invention However, the conventional method is to adhere the thin plate structure to the vibration source mechanism. The vibration source mechanism directly impacts the thin plate structure to cause vibration: / It is easy to cause thin plate crusting due to long-term impact. ^ 'The life of the board structure used. U reduction thin The main purpose of the invention is to provide a built-in high-frequency vibrating thin-plate structure to be embedded in a horizontal direction _ moving in the direction of the middle of the straight direction to define the thin plate structure to generate the vibrating mechanism - the purpose is to provide - The structure of the difficult-to-separate sheet and the vibration source are set between the thin plate structure and the vibration source mechanism, the dynamic mechanism of the mountain and the thin plate structure, and the thin plate structure and the thick plate are embedded in the fixed structure or left. Early-Structure' When the vibration source mechanism vibrates, the application of vibration energy to the hunting vibration by the thick plate structure. The structure of the special plate, and then the structure of the raft structure, the purpose is to provide a thin plate produced by a plurality of through-holes. The Q 4 anti-structure of the towel is provided with a plurality of through holes at the central position of the towel to make the U-like material (such as a liquid A material such as powder or the like is sent through a through hole. The technical means for solving the problem of the present invention (4):::: The technical means adopted to solve the problem of the conventional technology is that the structure of the special plate and the structure of the ring-shaped vibrating plate are arranged with a thick plate structure at a level of 2 levels. The thin α · β is not standing at the position of the vertical plate section 200909078 in the vertical direction and the vibration zone of the thin plate structure corresponds to the central opening of the thick plate structure, 'to limit the range of vibration generated by the thin plate structure, and to embed The formula is fixed on the thick plate structure to make it a single-structure. And open several holes in the thin plate = (four) area. The ring vibration source mechanism generates vibration and the sub-plate structure 'tests the vibration energy conduction plate of the thick plate to vibrate the 'plate,'. The purpose of the structure is to enable the vibration of the thin plate structure, by moving the object ( Such as liquid, powder, etc.) to produce atomization: a process that is widely embedded to avoid cracking of the thin plate structure and the annular vibration source mechanism of the thin plate structure by the ring vibration source mechanism: & the method can extend the service life of the thin plate, The embedded structure of the present invention can be used to mold the structure of the ceramic or metal material by the molding process of the mold, and at the same time and in the same batch process, the thin plate is embedded in the thick plate structure. The effect of the present invention against the prior art C Ming:! With the technical means, the thin plate structure and the thick plate are thick and the plate structure is embedded in the horizontal direction in a horizontal direction, which can limit the impact of the thin plate structure to generate the source mechanism. The structure is not directly affected by the ring vibration to generate the vibration source mechanism of the thick plate structure material, which reduces the damage or destruction of the thin plate structure, and knows the use of different welding structures. Add buffer to reduce impact avoidance; = splicing collision, extending the life of the thin plate structure; 曰 by the one of the / special structure of the wandering F p 苒 苒 开设 开设 开设 开设 开设 开设 开设 开设 开设 开设 2009 2009 2009 2009 2009 2009 2009 The materials, such as liquid, powder, etc., are sent through the through-holes. The specific examples used in the present specification will be further illustrated by the following examples and accompanying drawings. [Embodiment] Referring to Figure 3 and 4 is a perspective view of a first embodiment of a high-frequency vibration mechanism of the present invention having an embedded high-frequency vibration thin plate, and FIG. 4 is a first embodiment of the present invention having a drum-type high-frequency vibration thin plate. A cross-sectional view of a high-frequency vibration mechanism. The high-frequency vibration mechanism fan system includes a thin plate structure 3, a thick plate structure 4, and a ring-shaped vibration source mechanism 5. The thin plate structure 3 is a disk-like structure having a vibration zone. ^和一定(四)L2, the thin plate structure 3 is arranged at the selected position f of the thick plate structure 4. The thick plate structure 4 is a ring-shaped structure, and the central portion thereof is formed with a central opening 4〇. It is selected from plastic, stone, rubber, ceramic, and metal materials. Producer, plastic (4) molding, pressing, injection molding, ceramic, metal powder high-temperature sintering::: clothing into a wide-type vibration source mechanism 5 series for a high-frequency vibration machine: production; vibration energy, ring vibration source Below the mechanism 4, and _ plate structure; = raw vibrating plate,,, structure 3, used to generate high-frequency vibration to make (4) where the thin plate structure 3 is in a vertical direction of one of the horizontal sides 4 〆° defeated in the thick plate structure macro... Placement, that is, the thin plate structure 3 h is embedded in the inner ring of the thick plate structure 4 in the horizontal direction 1: 2200909078 The vibration zone L| of the thin plate structure 3 is located in the The central part of the thick plate structure and the vibration zone M of the binding plate structure 3 correspond to the mouth of the thick plate for limiting (4) the vibration of the plate structure 3 ^ The vibration zone of the central open thin plate structure 3 is provided with several through-hole vibrations The central position of the source mechanism 5 and the central through hole 5 of the garment type. ” 1 wears its top and bottom 舡 (4) d The diameter of the hole is just opposite to the central opening 40 of the household, with the ring-shaped vibration source mechanism 5: sub == target in the thin plate structure 3, and then the target The material (such as the material of the liquid-^) is sent through the through hole 3 of the thin plate structure 3. ', the sturdy structure 3 is fine (the fourth) is combined with the thick plate structure 4, and then the clothing s, the dynamic source mechanism 5 is combined with The ring type vibration source mechanism 5 generates vibration two:!: the source mechanism 5 transmits vibration energy to the money and structure 3 via the thick plate structure 4, and the thin plate structure 3 receives the ring vibration source mechanism $' to cause vibration of the thin plate structure 3. The zone L|reaches the material of the liquid pool, powder, etc. of the vibration) to produce an atomization effect. Moreover, the thickness is as thin as the design: the plate 4 4 ί avoids the rupture damage of the W-bonded plate structure 3 itself to extend the use of life and reduce the generation of consumables. For the long use, as shown in Fig. 5, the second embodiment of the present invention is shown: 高频明ί embedded high-frequency vibrating thin plate high-frequency vibration mechanism 3〇〇, Γ: phase: the first embodiment The same, the same components are the corresponding ones. The difference is that the thin = "°° is a concave shape, and the height of the annular vibration source mechanism 5 is higher than that of the short-vibration source mechanism 5 of the above-mentioned first embodiment. ,,’. The diameter of the structure 4 is the same as the atomization effect of the vibration p· τ of the annular thin plate structure 3 a, and the concave design can also be used to enhance the vibration generated by the transmission mechanism 2 through the thick plate structure 4 and 3a accept Ring-shaped swaying, Zhou she: the moon 匕 到 至 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄 薄>Heart 6 shows the 'the axis* the three figures of the present invention, the cross-sectional structure design of the present invention with the embedded high-frequency vibration-Beiyuan example is the same as the above-mentioned first-plate frequency vibration mechanism. The vibration zone U of the structure of =- is convex upward. In the same manner, the vibrational zone of the binding plate structure 3b is used to enhance the atomization effect of the target object, that is, when the ring-shaped vibration is used, the vibrational energy is transmitted, and (4) the thick plate structure 4 transmits the vibration energy. The cover sheet structure 3 Μ妾 is generated by the ring vibration source mechanism 5 and causes the object 6 placed in the vibration zone ^ (the basin is, the night can be here again, the through hole 3b of the thin plate structure 3b) In the case of the droplets 61, the liquid (10) material: the medium-sized through-holes of the annular vibration source mechanism 5 are passed. The design is the same as the front of the water; the first =::=, the same component is the standard 200909078, the same component number is shown, and the mechanism 5 is set on the thick plate structure 4. " The difference is that the vibration source mechanism 5 generates vibration and transmits through the thick plate structure == and the thin plate structure 3, the vibration energy generated by the ring vibration source mechanism 5, causes the object placed in the vibration region to be (4) The material is passed through the thin plate structure ~ 1 ^ for the droplet 01, the droplet 61 is expanded, and the 0c is formed into the central opening 40. The method of expanding the government is made up of the thick plate structure 4. Referring to Fig. 8, it is preferable to use the high-frequency vibration mechanism 6 of the cross section of the embodiment of the present invention (4). . "The tenth and the fourth embodiment of the brothers are shown with the same component number, and the member with the same door is the convex U-shaped system. The corresponding is the thin plate structure% vibration: ==, move (4) Thick plate structure, the mechanism 5 receives the ring vibration source odor ^ so that it is placed in the vibration zone L less A (which is a liquid material) through the thin plate structure 3d through the hole 3 (10): for the droplet 6〗, liquid Drop 61 is made into the opening 40. The method of the hand-chain is from the center of the thick plate structure 4, as shown in Fig. 9, the position station _ | map, the invention (four) six real _ the section includes the right... The plate-to-frequency vibration mechanism 7 includes a thick plate structure having a central opening σ 40 and a thin plate structure 3e having a concave shape.匕 - - its vibration zone The difference between this embodiment and the foregoing embodiment lies in the aforementioned ring type vibration source 200909078. The mechanism 5 is replaced by a vibration source mechanism 5a. The vibration source mechanism 5a includes an elastic diaphragm 5 disposed under the thick plate structure 4, and defines a liquid receiving groove 7 between the elastic diaphragm 51 and the thin plate structure 3e, and the electrically actuated vibration plate 52 is embedded in the elastic The inside of the diaphragm S1 is externally connected to the vibration signal generating circuit board 54 via a pair of wire brothers, and the electric signal generated by the vibration signal generating circuit board 54 drives the electrically actuated vibration plate 52 to generate vibration. And the selected position of the vibration source mechanism 5a is provided with a liquid replenishing inlet. When the electric signal generated by the vibration signal generating circuit board 54 drives the electrically actuated vibrating plate 52 to generate vibration, the electrically actuated vibrating plate 52 is caused to be vertical. The vibration direction hi generates vibration 'following the elastic diaphragm 51 to vibrate up and down according to the vertical vibration 2 III (this figure only shows the state when it vibrates upward), and transmits the vibration energy to the thin plate structure 3e by the thick plate structure 4, and the thin plate structure 3e, after the electric signal of the vibration source mechanism 5a drives the vibration energy generated by the electrically actuated vibration plate, the object 6 placed in the liquid receiving groove 7 (which is a liquid material) passes through the thin plate structure. The through hole · the drop 6] 'drop 6 系 is in the form of agglomeration by the thick plate knot ... the central opening fairy drops. Referring to Fig. 10, there is shown a cross-sectional view of a seventh embodiment of the present invention. This embodiment is substantially identical in design to the sixth embodiment, so that the same components are labeled with the same component number. correspond. The difference is: in the high-frequency vibration of the high-frequency vibrating thin plate of the stalk-shaped high-frequency vibrating plate, which has a convex plate-like structure 3f. When the electric signal generated by the vibration signal generating circuit board 54 drives the electric vibrating plate 52 to generate vibration, the electric actuating vibrating plate 52 is vibrated by the vertical direction -12 - 200909078 moving direction III, and then the upper and lower sides of the elastic blocking direction m are carried out. Vibration (This figure only shows the vibration according to vertical and transmitted by the thick plate structure 4 (4) energy to thin ^ 52 „ 2: the object placed in the liquid receiving groove 7
St )通過薄板結構3f之貫孔箫而成為液滴 液滴…糸以擴散狀之方式由厚板結構4之中央開口 4〇 結構2㈣此技藝者皆能輕易得知，在本發明中，薄板 ^板結構4結合之位置係可位於厚板結構4之垂 °任—位置處’當然亦可位於厚板結構4之垂直方向 之中央位置處。 由以上之實施例可知，本發明所提供之具截人式高頻 専板之高頻振動機構確具產業上之利用價值，故本發 月業已符合於專利之要件。惟以上之敘述僅為本發明之較 佳實^m明，凡精於此·藝者#可依據上述之說明而 作其匕種種之改良，惟這些改變仍屬於本發明之發明精神 及以下所界定之專利範圍中。 【圖式簡單說明】 ，1圖係、習用高頻振動薄板結構之示意圖； =2圖係習用高頻振㈣板結構之斷面圖； 第3圖係本發明具嵌人式高頻振動薄板之高頻振動機構第 一實施例之立體圖； 200909078 第4圖係本發明具嵌入式高頻振動薄板之高頻振動機構第 一實施例之斷面圖； 第5圖係本發日月絲人式高頻振動薄板之高頻振動機構第 二實施例之斷面圖， 第6圖係本發明具礙入式高頻振動薄板之高頻振動機構第 三實施例之斷面圖； 第7圖係本發明具敌入式高頻振動薄板之高頻振動機構第 四實施例之斷面圖； 第8圖係本發明具嵌入式高頻振動薄板之高頻振動機構第 五實施例之斷面圖； 第9圖係本發明具欲入式高頻振動薄板之高頻振動機構第 六貫施例之斷面圖； 第ίο圖係本發日m人式高頻振㈣板之高頻振動機 七實施例之斷面圊。 【主要元件符號說明】： 100 高頻振動機構 200、300、400、具嵌入式高頻振動薄板之高頻振 500、600、700、動機構 800 1 薄板結構 2 振動源機構 3、3a、3b、3c、薄板結構 3d、3e、3f -14 - 200909078 30、30a、30b、 貫孔 30c、30d、30e、 30f 4 厚板結構 40 中央開口 5 環型振動源機構 50 中央貫穿孔 51 彈性隔膜 52 電致動振動板 53 導線 54 振動信號產生電路板 55 液體補充入口 5a 振動源機構 6 標的物 61 液滴 7 液體容置槽 L, 振動區 l2 嵌_入定位區 I 水平方向 II 垂直方向 III 垂直振動方向St) is a liquid droplet by the through hole of the thin plate structure 3f. The central opening 4 of the thick plate structure 4 is formed in a diffused manner. The structure 2 (4) can be easily known by the skilled person. In the present invention, the thin plate The position at which the plate structure 4 is combined may be located at any position of the slab structure 4, and may of course be located at a central position in the vertical direction of the slab structure 4. It can be seen from the above embodiments that the high-frequency vibration mechanism with the intercepting type high-frequency slab provided by the present invention has industrial utilization value, and therefore the present invention has been in conformity with the requirements of the patent. However, the above description is only the preferred embodiment of the present invention, and the above-mentioned art can be improved according to the above description, but these changes still belong to the inventive spirit of the present invention and the following Within the scope of the defined patent. [Simple diagram of the diagram], 1 diagram, schematic diagram of the structure of the high-frequency vibration thin plate; =2 diagram of the high-frequency vibration (four) plate structure; Figure 3 is the height of the embedded high-frequency vibration plate of the invention 3D perspective view of a first embodiment of a frequency vibration mechanism; 200909078 Fig. 4 is a cross-sectional view showing a first embodiment of a high frequency vibration mechanism of the present invention with an embedded high frequency vibration thin plate; Fig. 5 is a vertical view of the present invention A cross-sectional view of a second embodiment of a high-frequency vibration mechanism of a frequency vibration thin plate, and a sixth sectional view showing a third embodiment of a high-frequency vibration mechanism of a high-frequency vibration thin plate of the present invention; A cross-sectional view of a fourth embodiment of a high-frequency vibration mechanism having a high-frequency vibrating thin plate; and a cross-sectional view of a fifth embodiment of the high-frequency vibration mechanism of the present invention having an embedded high-frequency vibration thin plate; Figure 9 is a cross-sectional view showing a sixth embodiment of the high-frequency vibration mechanism of the high-frequency vibration thin plate of the present invention; the first embodiment of the present invention is a high-frequency vibration machine of the high-frequency vibration (four) plate of the present invention. The section is 圊. [Main component symbol description]: 100 high-frequency vibration mechanism 200, 300, 400, high-frequency vibration 500, 600, 700 with embedded high-frequency vibration thin plate, moving mechanism 800 1 thin plate structure 2 vibration source mechanism 3, 3a, 3b, 3c Thin plate structure 3d, 3e, 3f - 14 - 200909078 30, 30a, 30b, through hole 30c, 30d, 30e, 30f 4 thick plate structure 40 central opening 5 ring type vibration source mechanism 50 central through hole 51 elastic diaphragm 52 electro Vibrating plate 53 Conductor 54 Vibration signal generating circuit board 55 Liquid replenishing inlet 5a Vibrating source mechanism 6 Target 61 Droplet 7 Liquid receiving groove L, Vibrating area l2 Embedding into positioning area I Horizontal direction II Vertical direction III Vertical vibration direction