TW200907822A - Dual bus expresscard peripheral device and method of using the same - Google Patents

Abstract

A peripheral device is disclosed having two associated memory modules, and which is configured to fit within the ExpressCard slot. One memory module communicates with a host over the PCIe bus interface of the ExpressCard slot, while the other memory module communicates with the host over the USB interface of the ExpressCard slot.

Description

200907822 IX. Description of the Invention: [Technical Field] The present invention relates to a peripheral device for using a dual bus interface in a high-speed transmission card slot and a method of using the same. Cross-reference the following application and incorporate it in its entirety by reference:

Jonathan Hubert et al., "Method of Adapting an Express Card Slot for Smaller Form Factor Memory Compatibility", US Patent Application No. _ No. [Agent file number SAND- 01268US0], apply on the same day as this case.

Jonathan Hubert et al., US Patent Application No. _ [Agent File Number SAND-01268US1] for the Adapter for an Express Card Slot, is the same as this case. Apply for the day.

Jonathan Hubert et al., "Memory Card for an Express Card Slot", US Patent Application No. _ [Agent File Number SAND-01269US0], on the same day as the case Application.

Jonathan Hubert et al., "Method of Adapting an Express Card Slot for Use with Portable Memory Cards", US Patent Application No. _ The file number SAND_01270US0] was applied on the same day as the case. 132485.doc 200907822

Jonathan Hubert et al., "Adapter System for Use with an Express Card Slot", US Patent Application No. - [Agent File Number SAND-01270US1] The case was filed on the same day.

Jonathan Hubert et al., "Method of Using the Dual Bus Interface in ' an Express Card Slot", US Patent Application No. __ [Agent The file number SAND-01271US0] was applied on the same day as the case. 〇 [Prior Art] The strong growth in demand for portable consumer electronic devices has driven the need for high-capacity storage devices. Non-volatile semiconductor S memory devices such as flash memory memory cards are increasingly being used to meet the growing demand for digital information storage and exchange. The portability, versatility and robust design of such non-volatile semiconductor memory devices, along with their high reliability and large storage capacity, have made such memory devices ideal for use in, for example, digital cameras, digital music players, Various electronic devices such as video game consoles, pDA and cellular phones. One popular type of flash memory device is the CompactFlash® memory card manufactured by SanDisk Corporation (Milpitas, California). While used in a variety of applications, CompactFlash memory cards have been adopted as the de facto standard in the professional and consumer imaging markets. Although there are several reasons for this situation, including large storage capacity and low cost per megabyte, the compact size of the CompactFlash memory card has proven to be a significant contribution. At a size of 43 mm x 36 mm, the card is large enough to be easily operated while being small enough to be transported and used in current high resolution digital cameras. Professionals and consumers are very satisfied with this size of memory card and have become accustomed to this size of memory card. Some years ago, members of the Personal Computer Memory Card International Association (Pcmcia) jointly developed the 五 ( (5) 9 peripheral devices as a new standard for PC card technology. Figure 1 shows the 'high-speed transfer card memory cards 2' and 22 according to the dimensions of two standard high-speed transfer cards. The transmission card module (4) has a length of 175 mm and a maximum width of 54 mm. The high speed transmission card module 22 has a length (75 mm and a width of 34 mm. Both specifications are 5 mm thick. The module 20 is configured according to the standard to be housed in the high speed transmission card slot 24. The module 22 is configured To be received in the slot 24 or the narrower slot 26. The slot μ in detail includes an introducer 28 to introduce the module 22 into the correct position to ensure accurate fit of the module 22 when inserted into the wider slot 24. One of the advantages of high-speed transmission card specifications over older PC card specifications is the improved data transfer speed due to the use of higher performance serial data interfaces rather than parallel busses. High speed transfer card technology is simpler to use. The connector and J eliminate the card bus (CardBus) controller in the PC card application by using the direct connection to the PC! High Speed Transmission (PCIe) and USB port in the host platform 30. This reduces the host platform. The cost of implementation of the slot. However, in order to comply with the high-speed transmission card standard, one requirement is that the host platform 30 must support both PCIe and USB interfaces. This includes 25 Gbps at baseline in each direction as defined by the PCI_SIGiPCI High-Speed Transmission Baseline Specification 1.0a. Next operation A single PCIe channel (XI), which is incorporated herein by reference in its entirety. The host interface must also support the USB Implementers Forum (USB Implementers 132485.doc 200907822)

Forum's USB 2.0 specification defines low-speed, full-speed, and high-speed data rates, which are also incorporated herein by reference. Due to space and cost constraints, the host computing platform 3〇 typically only includes a single high speed transfer card slot. In a platform with only a single high speed transfer card slot, when the high speed transport card module 20/22 is inserted into the slot, the slot is no longer available for performing any other functions. This is true even if the interface has two independent busses - a high performance PCIe bus and a more general USB interface. Today, there are no known peripheral devices that make full use of the two bus bars in the same high speed transmission card slot. SUMMARY OF THE INVENTION Broadly described, embodiments of the present invention are directed to a peripheral device having two associated memory modules and configured to fit within a high speed transmission card slot. A memory module communicates with a host via a pcie bus interface of the high speed transmission card slot, and another memory module communicates with the host via a USB interface of the high speed transmission card slot. The first embodiment of the peripheral device includes an internal memory, and a card reader for accepting a memory card and an interface for connecting the peripheral device to the high speed transmission card slot. In an embodiment, the memory module can communicate with the host device via the pcie interface, and the memory card can communicate with the host device through the card reader via the USB interface. Because such communications use a separate and independent path through the peripheral device interface, such communications via the PCIe & USB interface can occur in parallel. In another embodiment of the present invention, instead of having an integrated module, the peripheral device can be inserted into the high speed transmission by the first & second memory module form A ', and the high speed transmission can be performed. The card slots are removed and they can also be attached to each other or separated from each other. The individual memory modules can use separate and independent paths through the peripheral device interface such that communication via 1> (: 16 and 1; 88 interfaces can occur in parallel. Other embodiments of the invention can include a pair of mating And operating in conjunction with each other to allow various different non-customized (〇 ff_the_shelf) memory cards to be used in high speed transmission slots. [Embodiment] Embodiments will now be described with reference to FIGS. 2 to 15 for use in one The peripheral device of the dual bus interface in the high speed transmission card slot and its method of use should be understood that the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In fact, such embodiments are provided. The present invention will be fully described and will be fully conveyed to those skilled in the art. In fact, the present invention is intended to cover alternatives and equivalents of such embodiments. The invention is defined by the scope and spirit of the invention as defined by the appended claims. In addition, in the following embodiments of the invention, various specific details are set forth to provide a thorough understanding of the invention. It should be apparent to those skilled in the art that the present invention may be practiced without such specific details. Referring now to the top, front and rear views of Figures 2 through 4, the display is == such as prior art In the standard high-speed transmission card slot shown in Figure 1: edge f Generally, the peripheral device 1 includes an internal memory for receiving the memory card to enable internal memory / and subsequent 4 cards via high speed Dual bus interface of the transmission card slot 132485.doc 10. 200907822 Parallel data exchange. Each of these features is explained in more detail below. Peripheral device 100 may have the dimensions of a standard high speed transmission card / 34 module That is, the length is 75 mm, the width is 34 mm, and the height is 5 mm. It should be understood that in an alternative embodiment, the peripheral device 100 may have the dimensions or other dimensions of a standard high speed transmission card/54 module. As can be seen in the view of line 3_3, the peripheral portion of the peripheral device includes a front interface 110 that includes a female electrical connector for engaging a pin in a standard high speed transmission card slot. Used, The front part of the peripheral device refers to the portion of the device that is inserted into the high-speed transmission card slot and is located at the back of the slot when inserted; the "rear" of the peripheral device refers to the slot of the device when the device is inserted The portion of the previous opening. In an embodiment, the interface UO will be configured to engage a standard, 26-pin "beam-on blade" type connector for use in high speed transfer card slots. As explained below, peripheral devices are contemplated 1GG can be used in other types of card slots. In alternative embodiments, other types of card slots, such as '4, can include other types of interface connectors located in front of the adapter. Referring now to Figures 2 through 6, the peripheral device is just The rear end may include a slot (1) as best seen in the view of Fig. 4 taken along line 4_4 in Fig. 2. The slot U2 is configured to receive the memory card 13〇, which can be any of various memory card standards such as an SD card, a smart media card, a mini sd card, a haw memory card, a memory, a stick, a business card type (four) card ( Pic〇card), MMC card or RS_MMC card. Other memory modules are expected. As explained below, the rear portion of the peripheral device 100 can include a memory card reader for transferring data to and from the memory card 130. 132485.doc 200907822 Peripheral device 100 can further include side rails 116a and 116b along both edges of device 100. The side rails 116a, 116b serve at least four functions. First, the side rails 116a, 116b engage in passages provided in the high speed transfer card slot to provide a firm and precise feel to the user inserting the peripheral device 10 into the card slot and from the slot removal device 1'. The side rails 116a, 116b also prevent the device from being inserted upside down into the high speed transport card slot. Third, the side rails U6a and 丨丨讣 make the passage frictionally engage in the high-speed transmission card slot, so that the peripheral device is removed.

All of the time when the peripheral device 100 is intentionally removed is securely fastened in the high speed transfer card slot. The fourth function of the 'π side rail 116am6b is to abolish the exit mechanism that is conventionally provided in all of the ancient transmission card slots. In particular, it is known to provide a conventional ejector mechanism for exiting a memory card in a high speed transmission: slot. Xiao et al. mechanism includes the exclusive exiter that is usually used for the old PC card slot t and the so-called "push-push" mechanism. In the "push-push" mechanism, the end of the push mode can be The module is fastened in the high-speed transmission card slot, and once it is tightened, it is pushed again to release the die " slot. The function of the retreat (4) mechanism may be incompatible with the peripheral devices of the embodiment of the tree. ―Enable::: Position the peripheral device in the high-speed transmission and leave it there when inserting and removing it from the peripheral device 1G (4).) Push the " Push-push back (4) sample (the exit device may not only exit the memory card, but also exit the peripheral device 100. Inconveniently, according to the embodiment, the embodiment of the present invention provides "printing functionality" to the peripheral device. (:and_—^ The user can insert the peripheral 132485.doc 12 200907822 device 100 into the high-speed transmission card slot, and then the user can insert and remove the memory card without the user having to the peripheral device! 〇 Do any additional action or attention. This functionality is provided by the side rail 116a U6b provides that it is set to deactivate the ejector mechanism provided in the high-speed transmission card slot (ie, make it invalid). In order to disable the high-speed transmission card slot ejector mechanism 'side rails, (10) is sufficient to allow sturdiness Insertion and removal and the length of the friction with the high-speed transmission card slot, but also terminate without reaching the front part of the device 1,, as can be seen, for example, in Figure 2, the side rails 116a, _ Peripheral device (10): The rear portion extends but terminates without reaching the front end of the device 1. The conventional ejector mechanism operates by engaging the meshing portion of the front portion of the card memory card. By terminating the side rails 116a, 116b Before the device 1 is reached, the peripheral device does not have the part that can be engaged by the conventional high-speed transmission card slot. Because some high-speed transmission card slots can have their exit mechanism on the left side and some on the right side. Therefore, both of the side rails 116aA116b terminate before the peripheral device = the front portion of the device, regardless of whether the ejector mechanism is located on the left side of the card slot or the right side white abolition eliminator mechanism. However, for example, in the peripheral device 1 Where it is to be used in a card slot that always has an ejector mechanism on the same side, in an alternative embodiment, the side rails on the other side may terminate without reaching the front of the device, and the side on the opposite side It can extend all the way to the front of the device. In an embodiment, the side effect can be achieved by terminating from the front end of the peripheral device 1 mm to 15 mm. It should be understood that in alternative embodiments the side rail 116a and 116b can be terminated at a greater or shorter distance from the front end. 132485.doc •13· 200907822

Referring now to Figure 7, there is shown a high level block diagram of a peripheral device 1A connected to the host computing platform 134 via a high speed transport card (4). As can be seen in Figure 7, the internal peripheral device UH) includes an integrated memory module UG capable of transmitting data to and from the host computing platform 134 via a high speed transfer card slot. The internal device of the peripheral device includes a reader 142 capable of receiving the memory card 120. The reader 142 is capable of transferring data between the host computing platform m and the card i2Q via the USB bus interface of the high speed transfer card slot. As used herein, the term "memory module" may refer to an integrated semiconductor memory, such as in the case of a module 14, or a tape-type semiconductor memory, such as in the case of a memory card 12. (10) may be any one of various known memory card standards having a size that can be assembled in the reader 142. The peripheral device 100 is attached to the host computing platform 134 via the interface 110 described above, which may be 26 pin connectors. The first set of pins is dedicated to the PCIe bus interface, and the second set of pins in the interface 11 is dedicated to the USB interface. Therefore, the peripheral device allows data to pass through the high speed. The dual bus interface of the transmission card slot is exchanged between the host computing platform 134 and the memory 2 module 140 and the host computing platform 134 and the memory card 12A. In an embodiment, the memory module 14A can be via: The 16 interface communicates with the host device, and the memory card 120 can communicate with the host device via the USB interface. Because these communications use separate and independent paths through the interface 110, such communication via the PCIe and USB interfaces can be paralleled The integrated memory module 140 can be positioned adjacent to the interface! , and electrically connected to the interface 11 专用 adjacent to its location dedicated to 1 > (: 16 bus interface interface. Conversely, the reader 142 may be located at the rear end of the peripheral device. The interface of the interface 132485.doc 200907822 110 dedicated to the USB bus can be passed through the peripheral device, between the interface 110 and the reader 142, and through the memory. The electrical leads of the module 140 are electrically coupled to the reader 142.

A more detailed block diagram of peripheral device 100 is shown in FIG. As shown in Fig. 8, the peripheral device 100 includes a memory module 140 and a card reader 142, both of which are integrated in the peripheral device 100. As is known in the art, the memory module 140 can include a controller such as a Aye with a microprocessor, RAM, ROM, and a flash memory interface for communicating with non-volatile flash memory. A PCIe interface for connecting to the pcie bus interface as shown may be further included. As is known in the art, the reader 142 can include a memory card & face that is designed to interface with the type of memory card that the reader is configured to use. The data can be transferred between the memory card interface and the USB interface in the reader 142, and the USB interface is then coupled to the USB dedicated portion of the interface 11 via electrical leads through the peripheral device. It should be understood that the peripheral device 1 can be configured to operate via a USB interface in accordance with the USB 2.0 specification, the USB 3.0 specification, or any other version available today or thereafter. The memory card 120 can operate in a manner similar to the memory module M〇. As is known in the art, card 120 can include a controller such as a microprocessor with RAM as a RAM, ROM and a flash memory interface for communicating with non-volatile flash memory. The controller can further include an interface for interfacing with the a memory card reader 142 as shown. In the embodiment described above, the peripheral device 100 includes an integrated memory module 140 for translating data with the host computing device 134 via the two bus bars provided by the high speed transmission card standard 132485.doc -15-200907822 And integrated card reader 142. In another embodiment of the present invention, instead of having an integrated module, the peripheral device 1〇〇17 is formed by the first and the first 5 memory modules, both of which can be inserted into the high-speed transmission card slot and the high-speed transmission card slot. Removed and they may also be attached to each other or separated from each other. This alternative embodiment is described below with reference to Figures 9-13. In the embodiment of Figures 9 through 13, the peripheral device 1A includes a memory module assembly 150 and a memory card 13A. The memory module assembly 15 can be incorporated in the U.S. Patent Application Serial No. (the Adapter for an Express Card for the High Speed Transmission Card Slot) (previously incorporated by reference) The adapter assembly 100 disclosed herein is identical, with one exception. That is, the adapter assembly of the incorporated application includes an adapter 102 which is simply a conduit for electrical leads connecting the front interface to the rear interface. In the embodiment of Figures 9 through 13 of the present invention, the adapter 102 of the incorporated application is replaced by a memory module 152 that is similar in operation to the memory module 14A described above. The memory module 152 can include a front interface 154 similar to the interface 110 described above, and side rails 156a and 156b that are functionally similar to the side rails 116a and 116b described above. The memory module; 152 can have a length of 45 mm, a width of 34 mm, and a height of 5 mm to thereby fit snugly into the rear end of the high speed transfer card slot. The delta recall module assembly 150 further includes a rear end interface 158 that includes a male connector for engaging and electrically coupled to one of a variety of memory card formats. In an embodiment, the interface! 58 can be configured to engage with the **Resident card 130 having dimensions of 45 mm long, 34 mm wide and 4 mm thick as explained below. For this application, interface j 5 8 can utilize the standard 132485.doc 16 200907822 connector, such as the connector used in high speed transfer card slots for 5 mm thick memory cards, but it has been modified to be thinner to fit 4 mm The thick card works together. The interface 158 is similar to a standard 5 mm connector in all other aspects, such as the number and type of contact contacts and the contact force established by the contact contacts. In an alternative embodiment, the memory module assembly 15 according to the present invention can operate with a memory card other than the memory card 13 such as a CompactFlash memory card, a secure digital memory card ("(3)" memory card), or various other Standard card. In such embodiments, interface 158 can be a standard connector for connection to such card interfaces. The memory module assembly 150 further includes a tab 164 attached to the memory module 152. The tab 164 may be formed of a rigid material such as metal, plastic or other polymer, and may be the same or a different material than the material of the outer casing 114. In an embodiment, the tab 164 can have a length of 45 millimeters to extend from the memory module 152 to the front of the high speed transport card slot. Therefore, the memory module 15 2 and the tabs 16 4 together extend the entire length of the standard high-speed transfer card slot by 7 $ mm. The width of the tab 164 can be the width of the high speed transfer card slot, for example, 34 mm. It should be understood that the width of the tab 164 need not extend beyond the entire width of the high speed transport card slot' and in other embodiments may be less than 34 millimeters. The thickness of the tongue piece I64 can be, for example, 1 mm. As explained below, the memory card 130 is received in the high speed transfer card slot at the top of the tab 164. Therefore, the combined thickness of the tab 164 and the memory card 130 must be less than or equal to the height of the high speed transport card slot, for example, 5 mm. In embodiments in which the memory card 130 having a thickness of less than 4 mm is provided, the tongue 164 may have a thickness greater than 1 mm. Alternatively, it will be appreciated that in alternative embodiments the tab 164 may have a thickness less than 丨 mm, which is 132485.doc • 17- 200907822 with the condition that the tab 1 64 is sufficiently rigid to transmit the insertion force applied to the handle 166 as explained below. The finger handle 1 66 is attached to the tab 1 64 and protrudes from the opening of the memory card slot when the memory module assembly 15 5 is fully inserted into the slot. A handle 166 is provided for removal of the memory module assembly 150 and insertion of the memory module assembly 150 in some embodiments. Memory module components! 5〇 can be a "set to " device that does not move when the memory card is inserted or removed. However, when desired by the user, the user can remove the memory module assembly 150 from the high speed transfer card slot by grasping the finger handle i 66 and manually pulling the memory module assembly 150 out of the slot. Again, as explained above, the handle ι 66 can be held by the user to insert the memory module assembly 150 into the fully engaged position within the high speed transfer card slot. The memory card 130 can be specifically adapted to fit within a high speed transfer card slot, attached thereto. The rear end of the hidden module 152. Figure π is a perspective view showing the memory module assembly 15A positioned adjacent to the slot 160 of the host device 134. The figure further shows the memory card 13〇 adjacent to the memory module assembly 15〇. When assembled together, the 'memory module assembly 15' and the card n〇 form a peripheral device 1〇〇. The delta recall module assembly 150 can be inserted into the slot 6 独自 alone, and thereafter the card 130 is inserted into the slot 160. Alternatively, the memory card 13 can be first coupled to the memory module assembly 150 and then inserted into the high speed transfer card slot 16 together with the memory module assembly i 5〇 and the memory card 3丨. The operation of the memory module assembly 15 and the memory card 130 will now be described with reference to the high level block diagram of FIG. When the memory module assembly 15 and the memory card 13 are inserted into the speed transfer card slot 6 , as described above with respect to the integrated memory 132485.doc 200907822 memory module 140, the memory module 152 can exchange data with the host platform 134 via the p(:Ie bus interface interface. 5 The memory card 13 0 communicates with the host platform 13 4 via the memory module component 1 。. In detail, the memory card 130 is connected to the component 15 The interface 158 has a pin dedicated to the USB interface and coupled to the uSB of the host platform 134 via electrical leads extending between the interface 158 and the interface 154 at the front of the component 15 . The electrical leads extend through the contacts. The outer casing 162 (FIG. 9) around the memory module i 52. Therefore, when operating together with the memory module assembly 15 , the memory card 130 can use the USB interface of the high-speed transmission card slot via the memory module assembly uo In the first embodiment described above, a peripheral device 100 including an integrated memory module 140 and an integrated card reader i42 for accommodating a memory card has been described. The second implementation described above In an example, the peripheral device may include the first and second Memory modules that can be assembled to each other and removably inserted into the high speed transfer card slot. In yet another alternative embodiment of the invention (not shown), the peripheral device 100 can include permanent First integrated memory module attached to peripheral device 100 and second integrated memory module permanently attached to peripheral device. In this embodiment, first and second integrated memory The body module can communicate with the host platform 134 in parallel via the respective PCIe & USB interfaces as explained above. The present invention discloses an embodiment in which the memory card 130 operates with the memory module 152 to utilize two bus bars of the high speed transfer card slot. In this example, the memory card 130 uses a USB interface. However, it is also contemplated that the memory card 13 can operate in the high speed transfer card slot 16 without the memory module 152. In detail, 132485.doc - 19· 200907822 Memory card 130 can be operated with adapter assembly 2〇〇 (Fig. 14 to Fig. 15)

In the patent application of the two transmission card slot 160 "Slot for high speed transmission card slot"

In the case of internal operations, the exchange of data between the host computing platform 134 and the memory card 13A can occur via the PCIe bus interface. In an embodiment, the memory card 130 can include a controller that can identify when it is attached to the interface 158 of the memory module 152 or when it is instead attached to the adapter assembly 2A. When the controller senses that the memory card 130 is attached to the memory module 152, the controller can affect the exchange of data via the USB interface. Conversely, when the controller of the memory card 13 senses that the card 130 is attached to the adapter assembly 200, the controller can affect the exchange of data via the PCIe bus interface. A more detailed description of the memory module 152 and the memory card 13A will now be described with reference to the block diagram of FIG. The memory module 152 can include components as are known in the art and described above with respect to the memory component 140 of FIG. Primarily, the 5 memory module 152 can include a controller such as an ASIC having a microprocessor, RAM, ROM, and a flash memory interface for communicating with non-volatile flash memory. The controller can further include a PCIe interface for connecting to the pcie bus interface as shown. The memory card 130 can have components similar to the memory card 12A described above with respect to FIG. However, in an embodiment of the present invention, a difference is whether the memory card 130 is operated by the memory card 13 〇 with the memory module 152 or with the adapter assembly 200 via the pcie bus or USB bus. 132485.doc -20- 200907822 Host platform 134 communicates. Thus, memory card 130 can include a USB interface for communicating with the USB port of host device 134 and a PCIe interface for PCIe port communication with host 134. The controller, as indicated above, which is included as part of the memory card 13, determines whether the communication occurs via the USB interface or via the PCIe interface. Referring now to Figures 14 and 15', embodiments of the present invention may include operation in conjunction with one another to permit the use of a variety of different standard memory cards for a pair of adapters in the high speed transfer slot 16'. In particular, in the embodiments described above with respect to Figures 9-13, the memory card 130 may be via the memory module assembly or via the adapter described in the adapter patent application as hereinbefore incorporated by reference. The components are used in the high speed transfer card slot 160. In the embodiment of Figs. 14 and 15, as explained below, the memory card 130 can be replaced by the adapter 180. Figure 14 shows the first adapter, adapter assembly 2〇〇. The adapter assembly 2 is identical to the adapter assembly 1 揭示 disclosed in the adapter patent application referenced above. Instead of the adapter assembly 200, a memory module assembly 15A as described above can be used. The drawings indicate this using the reference numeral "15〇/2〇〇", which indicates that the component shown may be the memory module assembly 15 or the adapter assembly 200. Figure 14 further shows a second adapter, adapter 180. The adapter 180 can have the same external dimensions and external features as the memory card 130. That is, the adapter 180 can have a length of approximately 45 millimeters, a width of approximately 34 millimeters, and a height of approximately 4 millimeters. The adapter 180 can include a front interface 182 that can be engaged with the rear interface of the memory module assembly 150/adapter assembly 200 (hereinafter "adapter 1 50/200"). The adapter 180 can further include a slot 1 84 for receiving a memory card, such as the memory card 120 described above in 132485.doc -21 - 200907822. A lip 184 can also be provided on the adapter 180. The function of the lip 184 is similar to the lip 132 of the adapter patent application referenced above to prevent improper positioning of the adapter 18 in the high speed transfer slot 160 without the adapter 2〇〇. (get 1〇st). Referring now to Figure 1, a memory card 120 can be inserted into the adapter 18. Although not shown, the interface at the front of the slot 184 can be electrically coupled to the interface 182 of the adapter 18 to communicate the signal from the memory card 120 to the rear interface of the component 150/200. Component 150/200 can then transmit these signals to host computing platform 134. In Fig. 15, the memory card 12A is shown inserted into the adapter 18A before the adapter 18 is inserted into the assembly 150/2 of the high speed transfer card slot 160. In an alternate mode of use, the adapter 18 can be inserted into the high speed transfer card slot and engaged with the assembly 150/200. Thereafter, the memory card 12 can be inserted into the slot 1 84 when the adapter 180 is positioned within the speed transfer card slot. The memory card 120 can be formed according to any of various standard card configurations, including, for example, an SD card, a smart media card, a mini SD card, a Transflash memory card or a memory stick, a business card type flash card (Pic〇 card), MMC. Card and RS_MMC card. Other devices are also contemplated. In an alternate mode of operation, the adapter 180 can be coupled to the assembly 15〇/2〇〇 when the assembly 150/200 is external to the A-speed transfer card slot 16〇. The component connected to σ can then be inserted into the high speed transfer card slot. In this embodiment the memory card 12A can be attached to the adapter 18 8 before or after the adapter 180 is attached to the assembly 150/200. In the embodiment where the component used is the memory module component 150, the 5 memory module 152 of the component 150 can be accessed via 〇^ Bus interface communication, and note 132485.doc .22· 200907822 Memory card 120 can communicate via USB interface. In embodiments where the component used is the adapter assembly 200 (or some other adapter is used to allow the memory card 12 to be used in a high speed transmission card slot), the memory card 12 can be connected via the pcie bus interface The host platform 134 communicates. The memory card 12A can have a controller for determining when the memory module component uses the PCIe bus interface, and thus direct communication via the USB interface. In the event that the controller determines that no other memory modules are present and the PCIe bus is not in use, the controller can cause communication to occur via the P CI e bus interface. Moreover, in the embodiments described above, any of a variety of non-customized (〇 ff_the shelf) memory cards can be used in the high speed transfer card slot. In an alternate embodiment of the present invention, it should be further appreciated that the adapter 18 can be used in a different size than the high speed transmission card slot to accommodate the adapter i without any of the components ISO or 200. 8 〇 in the card slot. The foregoing detailed description of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Rong teaches above, and many modifications and changes are possible. The described embodiments are chosen to best explain the principles of the invention and the application of the embodiments of the invention in the embodiments of the invention. The invention is utilized. The scope of the invention is intended to be defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic representation of a conventional high speed transmission card standard memory card system. Circle 2 is a top view of a peripheral device in accordance with an embodiment of the present invention. 3 is a front end view of a peripheral skirt in accordance with an embodiment of the present invention. 132485.doc -23- 200907822 Circle 4 is a rear end view of a group C*L 彳 hard 根据 according to an embodiment of the present invention. Figure 5 is a top plan view of a memory card retained therein in accordance with an embodiment of the present invention. The memory card is attached to the memory card according to the embodiment of the present invention. The top view circle of the skirt is shown in FIG. 7 as a high-order square that is lightly placed according to an embodiment of the present invention. Figure 8 is a detailed block diagram of a peripheral device in accordance with an embodiment of the present invention.

Figure 9 is a perspective view of an alternate embodiment of a memory module assembly in accordance with an embodiment of the present invention. Figure 10 is a side elevational view of the memory module assembly shown in Figure 9. Figure U is a perspective view of the adjacent memory module according to Figure 9 adjacent to the host device and housing the second memory module. Figure 12 is a high level block diagram of the bonded memory module shown in Figure U'. 13 is a detailed block diagram showing the bonded memory module of FIG. Figure 14 is a cross-sectional side view of a host assembly including an adapter assembly for insertion into a high speed transfer card slot and a second adapter for receiving a memory card. Figure 15 is a cross-sectional side view of the host computing device including the adapter assembly and the second adapter of Figure 14, the middle - memory card is located in the second adapter [main component symbol description] 20 high speed transmission card Memory Card / High Speed Transmission Card Module 22 High Speed Transmission Card Memory Card / High Speed Transmission Card Module 24 High Speed Transmission Card Slot 26 Slot 28 Introducer 132485.doc 200907822

30 Host platform 100 Peripheral device 110 Front interface 112 Slot 116a Side rail 116b Side rail 120 Memory card 130 Memory card 132 Lip 134 Host computing platform 140 Memory module 142 Reader 150 Memory module component 152 Memory module 154 Front interface 156a Side rail 156b Side rail 158 Rear end interface 160 High speed transfer card slot 164 Tab 166 Finger handle 180 Adapter 182 Front interface 184 Lip 200 Adapter assembly 132485.doc -25-

Claims (1)

200907822 X. Patent Application Range: 1. A method for connecting a first memory card to a first memory card associated with a host device, comprising the following steps: (a) configuring a peripheral device Coupling in a card slot having first and second bus bars; Ο configuring the peripheral device to utilize the first bus bar in the host device • with a first semiconductor memory associated with the peripheral device Transmitting signals between the bodies; and (c) configuring the peripheral device to utilize the second bus bar to transmit signals between the host farm and a second semiconductor memory associated with the peripheral device. 2. The method of claim 1 wherein the peripheral device is configured to utilize the first bus to transmit a signal between the host device and a first semiconductor memory associated with the peripheral device (b) Included: the step of configuring the peripheral device to transmit signals via a PCIe bus interface. 3. The method of claim 2, wherein the step of configuring the peripheral device to utilize the second bus bar to transmit a signal between the host device and a second semiconductor memory associated with the peripheral device comprises: : The step of configuring the peripheral device to transmit signals via a USB interface. 4. The method of claim 1, wherein the step (8) of configuring the peripheral device to transmit signals between the host device and the first semiconductor memory associated with the peripheral device using the first bus bar comprises: The peripheral device is placed in a state where the "first" body memory is integrated into the device of the week. 132485.doc 200907822 5 - The method of claim 4, the bus is arranged in the host device / the peripheral device is configured to utilize the first conductor memory to pass the inverse;:: correlation: the first semiconductor of the peripheral device The device is electrically connected to the special: two; the step (b) comprises: the first-half. Step 6 of the electrical conductor dedicated to the first flow row. The peripheral device is configured in the method 1 to utilize the second conductor and the second semiconductor S-resonant associated with the peripheral device. The value 4 ^ Ο 装置 means that the step (4) by means of the - (9) card comprises: "the peripheral - the reader uses - the step of attaching to the -+ conductor of the peripheral device for operation. 7 · If the eye of the item 6 is square, * m ^ where the peripheral device is configured to utilize the second bus bar to transmit the detailed product between the host device and a related conductor memory. The step (4) includes electrically coupling the second semiconductor device to the step. 8. The method of claim 3, wherein the bus is placed in the host* and the peripheral device is associated with the peripheral device by using the first conductor memory The step (9) of inserting the first half of the ground into the fifth number includes: a method of including: - shifting the memory of the portable semiconductor memory in the card memory slot, I:::8, wherein the peripheral device is configured to utilize the Secondly, the step (4) of transmitting a signal between the host device and a second semiconductor: memory element associated with the device includes: including a second portable type removably inserted into the C memory card slot Semiconductor memory step 132485.doc 200907822. Card slot 1 〇. As in the method of claim 1, step (d) of the device-step-exit mechanism. π. — A peripheral device capable of operating a hidden card slot associated with a master „ ^ , 设置 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The first semiconductor semiconductor memory of the door device can be connected to the peripheral device and the second semiconductor through the first body of the first bus and the first bus. The semiconductor memory can pass through the hidden body, and the first bus is connected to the host device. 12. If the peripheral device of claim 11 is included, the step of connecting in the card slot includes a step for The memory includes a first set of electrical contacts dedicated to the first confluence money stolen package and a second set of electrical contacts of the second special bus bar. It is used exclusively for the 13.罟, 甘丄μ接έ Γ 中(四)—The semiconductor memory system is electrically connected to the first set of electrical contacts. The second semiconductor memory system is electrically charged, wherein the first semiconductor memory system is integrated. 14. The peripheral device is connected to the second set of electrical contacts 15. The peripheral device of claim 11 is connected to the peripheral device. 16. If the surrounding device is installed, the second semiconductor is connected to a peripherally integrated A card reader in the device. 17♦ If the peripheral device of claim 15 is installed, the second semiconductor memory system is integrated into the peripheral device. 1 8. The peripheral device of claim 11, wherein The first semiconductor memory system is removably inserted into the card slot. 19. The peripheral device of claim 18, wherein the second semiconductor memory system is removably inserted into the card slot. 132485.doc