TW200907727A - Method for adapting schematics for different manufacturing processes and different operating specifications - Google Patents
Method for adapting schematics for different manufacturing processes and different operating specifications Download PDFInfo
- Publication number
- TW200907727A TW200907727A TW096131444A TW96131444A TW200907727A TW 200907727 A TW200907727 A TW 200907727A TW 096131444 A TW096131444 A TW 096131444A TW 96131444 A TW96131444 A TW 96131444A TW 200907727 A TW200907727 A TW 200907727A
- Authority
- TW
- Taiwan
- Prior art keywords
- data
- simulation
- circuit
- design
- specifications
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/327—Logic synthesis; Behaviour synthesis, e.g. mapping logic, HDL to netlist, high-level language to RTL or netlist
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
200907727 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用於提供— 見擁;上. ,、電子電路之一線路圖之系統及方 μ 則於提供-包含至少-電子組件之雷 子电路之一線路圖之系統及方法。 開發本發明之主要目的仫 的係用以於無線射頻(radio freqUency)及 類比電㈣確定電子組件之規格,Μ下文中將來昭 «應用來說明本發明。“,應瞭解,本發明並非僅限於_ 疋應用領域,而是亦滴用於甘从 、用於其他電子電路並適用於除規格以 參數之確定及最佳化。 【先前技術】 找明㈣篇中對切技術所作之論述決不應被視為認可此種 先則技術已廣為人知或者構成本領域中常用—般知識之—部分。200907727 IX. Description of the Invention: [Technical Field] The present invention relates to a system for providing a circuit diagram of a circuit, an electronic circuit, and a method for providing - including at least - an electronic component A system and method for a circuit diagram of a lightning circuit. The main purpose of the present invention is to determine the specifications of electronic components for radio frequency (radio freqUency) and analog power (4), and the present invention will be described hereinafter. "It should be understood that the present invention is not limited to the field of application, but is also used for the use of other electronic circuits and for the determination and optimization of parameters in addition to specifications. [Prior Art] Finding (4) The discussion of cutting techniques in the article should in no way be regarded as an endorsement of the fact that such prior art is well known or constitutes a common knowledge in the field.
電子電路之設計通常涉及到形成一系列電路線路圖,該等電路 線路圖係根據-規範、—操作條件範圍、以及—製程其中之一'或 多者加以定製。—電路之習知線路圖係由一系列電路組件組成, 該等電路組件係由使用者(通常係為一電路設計者)定義,其包 含組件類型、各組件間之連接性'以及該等組件之其他佈局資訊〇 故些其他佈局資訊包含由電路設計者直接提供或者藉助簡單公式 而計算出之規格資訊。然後,以此線路圖作為基礎,使用模擬軟 體來模擬電路之效能,例如使用吾人所知之商標為「spicE (Simulation Program with Integrated Circuit Emphasis)」之模擬軟 體。此種模擬軟體複製電路效能及電路之操作點,並隨後提供模 200907727 擬結果。設計者因應該等結果來修改組件類型、各組件間之 性、以及各組件之其他佈局#訊其中之—或多者。重複進行 模擬及修改,直至設計者評定已提供—最佳電路為止。尤 更複狀電路,重複次數會㈣大,並細設計者大量之時間。、 儘管上述迭代性模擬及修改過程可最終得到—最佳電路及具有 最佳規格之組件,已發現線路圖會因具體操作條件及製程而異, 且若期望使線路適詩其他具體條件或製程,通常需要完成—單 獨之模擬及修改過程來相應地定製線路圖。 【發明内容】 本發明之-目的係克服或至少改善先前技術之至少一種缺陷或 者提供一種適用之替代方案。 整體而言,於-態樣中,本說明書描述一種用於提供—類比電 包含一第一資料、一第二資料 ^弘路之I格化線路圖之方法,該類比電子電路具有—或多個 電子組件。該方法包含以下步驟:提供—設計目標,該設計目標 第三資料及一第四資料,該第 —貢料用以指示該等組件之組件類型及連接性資訊,該第二資料 用以指示該電子電路之一或多個規範;該第三資料用以定義二系 CinSt—) (script) ''且件之進-步規视’該第四資料用以指示該電子電路之—或多個 製造規範及該電子電路之—或多個操作規範。該方法允許—使用 者選擇性地◎所有該等資料;以及處理該設計目標,以提供由 +規格化線路聽叙―第五資料。該規格化線㈣包含該電子 電路之該料件之㈣尺寸及連接性。魏減祕圖可用於產 7 200907727 5、系為罔表’式網表可用於該電子電路之電路效能之模擬 以及佈局之構造。 於一特定實施態樣中,-種方法允許改變該等設計目標之第四 貧料丄並隨後處理該等設計目標,以獲得適料該第四資料中之 新,粑之新規格化線路圖。該第四資料包含如下製造規範:該電 兒路之衣&謂組件之製造商以及製造地點、關於所製造裝 :之匹配特性及變化之統計資料、能夠由該製程製造之所有該等 裝置之裝置型號、以及該等裝置型號之準確度。該第四資料亦可 匕3如下知作規乾:供電電壓規範、操作溫度範圍以及由其他設 計目標作為—部分的—更高層次設計目標之規範。 於該設計目標中,該第二資料係指示該設計目標所要產生之該 規格化線路圖之所期望效能或規範,且其可引用該設計目標之其 :資料或者其他設計目標之資料;該第三f料係由―系列指令或 才曰7批久標組成,該系列指令或指令批次播指示如何將該第一、 第二及第四資料考量在内,來確定該等組件之規格。該第三資料 包含-系列指令或指令批次檔,該系列指令或指令批次標規定對 —單一組件或—組件集合之模擬之效能、以及規定該或該等組件 之所期望模擬特性。 —該方法包含如下步驟:確^組件之規格,使其所模擬特性與該 弟三資料中之規範相匹配,藉以導出該規格化線路圖。 於-特定實施態樣中’該第三資料規定DC操作點參數及電壓以 及電晶體之匹配特性,藉以確定其規格。 於另-實施態樣中,該設計目標之第五資料亦由該電路之至少 200907727 一效能參數構成,並由該設計目標之第_。 设樹之第二或第三資料弓I用。該等或:另— 下之群組:電流消耗、雜訊指數、增益' 數係、自—包含如 力、頻寬、以輸人為參考之三階载、輸出驅動能 斷點、以輪出為參考之三階截斷點、以=為茶考之二階戴 三次譜波失真、二次諧波失真、輸 4考之二階截斷點、 角落、過激勵、偏流、及顫抖雜訊密度、相=偏移:顫抖雜訊 電源抑制以及基板雜訊抑制。 sfl、定時抖動、 整體而言,於另一態樣令,本說明書描述 供類比電子電路之規格化線路圖之方法執:―種用於提 议且古—斗-0 二、、’光’ s亥寺類比電子雷 夕個電子組件’其中該系統包含提供-設計目伊之牛 驟,該設計目標包含:一第一資料,用以指示該等組件之^件;; 型及連接性資訊;-第二:#料 之、、且件類 規範.-n 用4不该電子電路之-或多個 規粑,H料’用以定義一系列指令或指令批次標,以指干 該-或多個組件之進—步規範;以及—第四資料,用以指示_ 子電路之-或多個製造規範及該電子電路之—或多個操作規範二 该乐統允許-使用者選擇性地定義所有該等資料;以及處理該設 計目標’以提供由—規格化線路圖組成之—第五資料。該規格化 線路圖包含該電子電路之料輯之實體尺找賴性。該規格 化線路圖亦可用於產生或者係為—網表,該網表可用於該電子電 路之電路效能之模擬以及佈局之構造。 次該系統包含:-介面’用以使-使用者選擇性地定義所有該等 貝料’以及-處理器,適以處理該設計目標,以提供由—規格化 200907727 線路圖組成之一第五資料。 。亥系 ''先所產生之该規格化線路圖包含該線路圖之該等組件之實 -寸及連接f生’並可用於產生_網表,該網表可用於該電子電 路之電路效能之模擬以及佈局之構造。 於一特定實施態樣中,-種系統允許改變該等設計目標之第四 資料三並隨後處理該等設計目標,以獲得適應於該第四資料中之 新=犯之新規格化線路圖。該第四資料包含如下製造規^:該電 子电路之f程、該等組件之製造商以及製造地點'關於所製造裝 置之匹配特性及變化之統計資料、能夠由該製程製造之所有該等 農置之U型號、以及該等裝置型號之準確度。該第四資料亦可 已3如下&作規.電源規範、操作溫 計目標作為-料的-更高層次設計目標之規範。H ;於該系統中’該第三資料係由一系列指令或指令批次檔組成, ⑽列指令或指令批次播指示如何將該第―、第二及第四資料考 置在内來確:t該等組件之規格。該第三資料用以規定對―單—组 件或一組件集合之模擬之效能、以及規定該或該等組件之所期望 模擬特性。該系、統包含如下步驟:確1组件之規格,使其所模擬 特性與該第三資料中之規範相匹配。 於特疋實施悲' 樣中’模擬類型可包含靜態分析;DC模擬;暫 態模擬;諧波平衡模擬;週期性穩態模擬;準週期性穩態模擬; S/參數模擬;AC模擬;轉移函數模擬;極點-零點模擬^訊模 擬以及相位雜訊模擬。 —既定設計目 本發明之實施態樣包含如下之一種或多種優點 200907727 ,可根據不同情形之製程、效能參數、操作範圍等而用於形料 夕不同之規格化線路圖。設計者最初並非更關注組件規格,而: 更關注各該組件在電路總體效能環境中之實際功能。設計: 有效地獲得設計者之意圖及考量因素。 ^ ^除非上T文明確要求外,本說明及權利要求書通篇中所用之措 =包含(_咖及comprising)」及類似用語應被視為具有^ 含性意義’而非排他性或窮盡性意義;換言之,具有 限於」之意義。 不 【實施方式】 參見第1圖及第2圖,其例示一用於為各具有一或多個電子組 件之各個類比電子電路提供複數個規格化線路圖2之系統卜系統 匕3 °己隱體’心憶體作為—用於儲存規格化線路圖2之結構化 貧料,3及—用於儲存複數個設計目標5之結構化資料庫4之用。 如於弟2圖中所最佳地顯示,各設計目標5包含第—資料第一 資料6係為複數個用以指示該等組件各自之規範之資料記錄7。該 等設計目標亦包含第二資料8,第二資料8係為複數心指示該電 子電路之各個規範之資料記錄9。第三資料1〇包含-最佳化指令 :人才田11 ’用以指不該等組件之進一步規範。一作為-電腦終端 機13之介面容許一使用者(即一電路設計者14)選擇性地界定所 有該等資料。—處理器(即作為中央伺服器15之用)執行指令批 次檔11並提供一各自之規格化線路圖2。 設計者14能夠選擇性地定義資料,即所有該等資料皆能由設計 者定義、或者某些資料由設計者定義、抑或所有資料皆不由設計 11 200907727 πa +丨而1:1,貝料庫4包含複數個模板設計目標(未顯示), 中it#選取。偶若—模板與該設計者之確切要求相 匹配,則第一、第二或第二: 乂弟—貝科白不需要進一步定義。然而,通 石僅對於常用或簡單雷 疋玉路才會如此。一般地,第一、第二、及 第三資料至少並中之—益山 ' 係由s又計者選擇性地定義,且更一般地, 次P由❼f者4擇性地定義。於某些情形中,第―、第二及第三 資料全部由設計者定義。 〜在本實施例中’第—m資料全部可由設計者存取及 :義°然而’在其他實施例巾’對料資料之存取縣例如根據 。又。十者之題或經驗而選擇性地提供,並藉由設計者之登錄權限 進行管理。在某些實施财,僅第三㈣可供設計者存取。 應瞭解,每-規格化線路圖2皆係用於—具有許多組件之電路, 且各自之設計目標包含用於為每—組件界定參數之資料6及資料 10、以及該電路之資料8及資料1〇。 、 1 在其他實施例中,存在用於具有成百上千個組件或不足十個組 件之電路之線路圖。在某些情形中…電路將僅具有-個組件。 •I而。第3圖中所不意性顯示之電子電路即實施於其中一個 設計目標5中。 ’、 儘官第1圖僅明確例示三個規格化線路圖2及三個設計目枳$ 然而應瞭解’此僅係為了清楚起見且資料庫3及4分別包含成百 上千個規格化線路圖及設計目標。 系I包含一更進—步結構化之資料庫16,用於储存第四資料 孑5之’貝料17係指示欲以目標5所提供線路圖進行製造之 12 200907727 貫=路之規範。料規範稱作全域參數,其表示在所選製 二1…:體電路之所需操作條件(例如操作溫度範圍、電源電 波動或其他操作條件)下電子組件或擬定電路 /本貫施例中,該等全域參數亦包含:該等組件之裝置 電二ζΓ電晶體、雙極接面電晶體(阶)、場效電晶體、 进容差:、電感益、變容器、二極體等之型號;組件之製 —…組件之匹配特性之統計資料;及型號準確性。在复 他貫施例中,則使用額冰+接 料1?。貝1使用頟外或替代之全域參數來提供設計目標之資The design of an electronic circuit typically involves the formation of a series of circuit traces that are tailored to one or more of the specifications, the range of operating conditions, and the process. - The conventional circuit diagram of a circuit consists of a series of circuit components defined by the user (usually a circuit designer) that includes the component type, the connectivity between the components, and the components. Other layout information, so other layout information includes specification information that is directly provided by the circuit designer or calculated by a simple formula. Then, based on this circuit diagram, the simulation software is used to simulate the performance of the circuit, for example, using the simulation software "spicE (Simulation Program with Integrated Circuit Emphasis)" which is known by the trademark. This analog software replicates the performance of the circuit and the operating point of the circuit, and then provides the results of the modulo 200907727. The designer should modify the component type, the nature of each component, and other layouts of each component as well as the results. Repeat the simulation and modification until the designer has provided the best circuit. Especially for complex circuits, the number of repetitions will be (4) large, and the designer will spend a lot of time. Although the above iterative simulation and modification process can be finally obtained - the best circuit and the components with the best specifications, it has been found that the circuit diagram will vary depending on the specific operating conditions and process, and if it is desired to make the line suitable for other specific conditions or processes It usually needs to be done - a separate simulation and modification process to customize the wiring diagram accordingly. SUMMARY OF THE INVENTION It is an object of the present invention to overcome or at least ameliorate at least one of the disadvantages of the prior art or to provide a suitable alternative. In general, in the aspect, the present specification describes a method for providing an I-like circuit diagram in which an analog-like electrical power includes a first data and a second data, and the analog electronic circuit has - or more Electronic components. The method includes the following steps: providing a design target, the design target third data and a fourth data, the first tribute is used to indicate component type and connectivity information of the components, and the second data is used to indicate the One or more specifications of the electronic circuit; the third data is used to define a second-line CinSt-) (script) '' and the step-by-step specification' is used to indicate the electronic circuit - or more Manufacturing specifications and - or operating specifications of the electronic circuit. The method allows the user to selectively ◎ all of the data; and to process the design goal to provide the fifth material from the + normalized line. The normalization line (4) includes (4) dimensions and connectivity of the material of the electronic circuit. Wei's secret map can be used for production. 7 200907727 5. It is a type of net meter that can be used to simulate the circuit performance of the electronic circuit and the layout of the layout. In a particular embodiment, the method allows for the change of the fourth lean material of the design goals and subsequent processing of the design goals to obtain a new normalized circuit diagram that is suitable for the fourth material. . The fourth document contains the following manufacturing specifications: the manufacturer and manufacturing location of the clothing and the component of the electric device, the statistical information on the matching characteristics and changes of the manufactured device, and all such devices that can be manufactured by the process. The model number of the device and the accuracy of the device type. The fourth data can also be as follows: the specification of the supply voltage specification, the operating temperature range, and the higher-level design goals that are part of the other design goals. In the design goal, the second data indicates the desired performance or specification of the normalized circuit diagram to be generated by the design target, and the reference to the design target: data or other design goals; The three f-materials consist of a series of instructions or only seven batches of long-term indicators. The series of instructions or instructions broadcast instructions on how to determine the specifications of the components, including the first, second and fourth data. The third data contains a series of instructions or instruction batches that specify the performance of the simulation of a single component or a collection of components, and the desired analog characteristics of the component or components. - The method comprises the steps of: determining the specification of the component, matching the simulated characteristic with the specification in the third data, thereby deriving the normalized circuit diagram. In the specific embodiment, the third data specifies DC operating point parameters and voltages and matching characteristics of the transistors to determine their specifications. In another embodiment, the fifth information of the design goal is also composed of at least 200907727 a performance parameter of the circuit, and is the _th of the design goal. Set the second or third data of the tree to use. The other group: the current group, the current consumption, the noise index, the gain 'number system, the self-including the force, the bandwidth, the third-order load with the input of the input, the output drive breakpoint, and the round For reference, the third-order intercept point, the second-order third-order spectral distortion, the second harmonic distortion, the second-order intercept point, the corner, the over-excitation, the bias current, and the trembling noise density, phase = Offset: tremor noise power supply rejection and substrate noise suppression. Sfl, timing jitter, overall, in another aspect, this specification describes the method for the normalized circuit diagram of the analog electronic circuit: "species for the proposal and the ancient - bucket -2, 'light' s Hai Temple analog electronic ray 个 electronic components 'where the system contains the provision - design of the goal, the design objectives include: a first data to indicate the components of the components;; type and connectivity information; -Second: #料的,和零件类规格.-n Use 4 or not the electronic circuit - or multiple specifications, H material 'to define a series of instructions or instruction batch mark to refer to - Or a step-by-step specification of a plurality of components; and - a fourth data indicating - or a plurality of manufacturing specifications of the _ sub-circuit and the electronic circuit - or a plurality of operating specifications Define all such information; and process the design objective 'to provide a fifth-form composed of - normalized circuit diagrams. The normalized circuit diagram contains the physical scale of the electronic circuit. The normalized circuit diagram can also be used to generate or be a netlist that can be used to simulate the circuit performance of the electronic circuit and to construct the layout. The system includes: - an interface 'for the user to selectively define all of the bedding' and a processor adapted to handle the design goal to provide a fifth of the - normalized 200907727 circuit diagram data. . The normalized circuit diagram generated by the Hai's first generation includes the real-inch and connection of the components of the circuit diagram and can be used to generate a network table, which can be used for the circuit performance of the electronic circuit. Simulation and layout construction. In a particular embodiment, the system allows for the change of the fourth data of the design goals and subsequent processing of the design goals to obtain a new normalized circuit map adapted to the new data in the fourth material. The fourth document includes the following manufacturing rules: the manufacturer of the electronic circuit, the manufacturer of the components, and the manufacturing location, statistics on the matching characteristics and changes of the manufactured device, and all such agricultural products that can be manufactured by the process. The U model and the accuracy of these device models. The fourth data may also be as follows: the specifications of the power supply specification, the operating temperature specification, and the higher-level design goals. H; in the system, 'the third data consists of a series of instructions or instruction batch files, (10) the list of instructions or instructions for the batch broadcast instructions how to determine the first, second and fourth data. :t Specifications for these components. The third data is used to specify the performance of the simulation of the "single-component" or a collection of components, and to specify the desired simulated characteristics of the component or components. The system includes the following steps: The specification of the component is determined such that the simulated characteristic matches the specification in the third data. In the implementation of sorrows, the simulation type can include static analysis; DC simulation; transient simulation; harmonic balance simulation; periodic steady-state simulation; quasi-periodic steady-state simulation; S/parameter simulation; AC simulation; Function simulation; pole-zero analog simulation and phase noise simulation. - The intended design The embodiment of the present invention includes one or more of the following advantages: 200907727, which can be used for different standardized circuit diagrams according to different processes, performance parameters, operating ranges, and the like. Designers initially did not pay more attention to component specifications, but: Pay more attention to the actual functionality of each component in the overall performance environment of the circuit. Design: Effectively obtain the designer's intentions and considerations. ^ ^ Unless otherwise expressly required by the above T, the measures used in this specification and the claims include: (_咖和comprising) and similar terms shall be deemed to have a meaning of 'inclusive' rather than exclusive or exhaustive. Meaning; in other words, has the meaning of being limited. [Embodiment] Referring to FIG. 1 and FIG. 2, a method for providing a plurality of normalized circuits for each analog electronic circuit having one or more electronic components is shown in FIG. The body 'heart recall body' is used to store the structured lean material of the normalized circuit diagram 2, 3 and - for storing a plurality of structural objects 4 of the design target 5. As best shown in Figure 2, each design objective 5 contains a first data first data 6 is a plurality of data records 7 indicating the specifications of the respective components. The design goals also include a second material 8, which is a data record 9 indicating the various specifications of the electronic circuit. The third document 1 contains the -instruction directive: Talent Field 11' is used to refer to further specifications for such components. An interface as a computer terminal 13 allows a user (i.e., a circuit designer 14) to selectively define all of the data. - The processor (i.e., used as the central server 15) executes the command batch file 11 and provides a respective normalized circuit diagram 2. The designer 14 can selectively define the data, that is, all of the data can be defined by the designer, or some of the data can be defined by the designer, or all the data can not be designed. 2009 20092727 πa +丨 and 1:1, the library 4 contains a number of template design goals (not shown), which is selected in it#. Even if the template matches the exact requirements of the designer, then the first, second or second: The younger brother - Beca white does not need further definition. However, the stone is only available for the usual or simple Thunder Road. Generally, the first, second, and third data are at least in the middle - Yishan' is selectively defined by the s, and more generally, the secondary P is defined selectively by the 4f4. In some cases, the first, second, and third materials are all defined by the designer. In the present embodiment, the 'mth-m data is all accessible by the designer and is: 'in other embodiments, the access to the material of the material is based on, for example. also. The ten questions or experiences are selectively provided and managed by the designer's login privileges. In some implementations, only the third (four) is accessible to the designer. It should be understood that each of the normalized circuit diagrams 2 is for a circuit having a plurality of components, and each of the design goals includes information 6 and data 10 for defining parameters for each component, and data 8 and information of the circuit. 1〇. In other embodiments, there are circuit diagrams for circuits having hundreds or thousands of components or fewer than ten components. In some cases... the circuit will have only one component. • I and. The electronic circuit not shown in Fig. 3 is implemented in one of the design objectives 5. ', the official figure 1 only exemplifies three normalized circuit diagrams 2 and three design goals. However, it should be understood that 'this is only for the sake of clarity and the database 3 and 4 respectively contain hundreds of normalizations. Road map and design goals. The system I includes a further progressive structured database 16 for storing the fourth data 孑5's 'Beet 17' indicating the specification of the 2009 20092727 road that is to be manufactured with the route map provided by the target 5. The material specification is referred to as the global parameter, which represents the electronic component or the proposed circuit/in the case of the selected operating conditions (eg, operating temperature range, power supply fluctuations, or other operating conditions) of the selected system. These global parameters also include: the device's electrical diode, bipolar junction transistor (step), field effect transistor, tolerance: inductance, varactor, diode, etc. Model; component system—...statistics of matching characteristics of components; and model accuracy. In the case of repeated applications, the amount of ice + material 1 is used. Bay 1 uses external or alternative global parameters to provide design goals
在本實施例中,資料17 (即全域參數)係指示電子電路之製程 及木作規扼二者。資料17係被指令批次槽n 批次檔u日夺即提供線路圖2。 執仃I 匕在本說明書之上下文中,應瞭解,術語「規格化線路圖」 才曰代一電路線路圖或雷技他 曰 “子… 佈局之一貫例’其已由系統1或-類似 =予以私化或進行過其他處理。在第丨圖所示實施例中,規 α化線路圖將包含為定義各個電路之佈局以及該電 =之所f規格資訊及其他資訊。換言之,規格化線路_ = 罔表相表能夠用於以一適宜之電路模擬器來模擬電路之" 為。在某些實施例中,該規格化線關將被進—步處 订 網表。 ”座生一 電路線路圖」— 電路線路圖」係 示的一擬定或實 上文所述之規格化線路圖不同於「電路」或「 其中電路與電路線路圖二者可通用,「電路」或「 使用包3於电路内之電子組件之習知符號進行表 13 Γ、 i 200907727 際電路之線路圖表 路中各組件之連接二。二^ 圖在Γ上下文明確指明外,所提及之電路皆非實際之實兒 體電Γ 在較佳實施例中所述之「設計目標」係為如下之、J路二 路線路圖(即第—資料6)、+ 、· σ •—電 、 )电子電路之規範(即第二資料8)以 及一扎々批次檔(即第三資 包含電子雷跋夕制、π、)。在某些實施例中’設計目標亦 &造規範及/或操作規範(即第四資料17)。秋而 更通常地,設計目標將涉及相關 用、 參數之記錄。 I…“使用哪些 該等設計目標各界定一資料集合,該資料集 細性及預定輸入資料並由系統丨加以處理,以針對= ^、料路之效能參數、該電路之操作範圍等進行最佳化。該等 4例之=優點在於’不必由設計者直接進行各組件之規格化。 更確切地$ ’⑦計者能夠在形成_線路圖之前,在除組件規格以 外之其他方面在設計目標内定義至少第三資料10。此使得: •設計者最初並錢_組件規格之確定,而是更關注在電路 總體效能(由資料8定義)環境中各組件之實際功能(由資料6 及腳本11定義)。 •-既心5:計目標可被用來根據不同情形之製程、效能參數、 操作範圍等,形成許彡不収規格化線路圖。 Ό十目可有效地獲得設計者之意圖及考量因素。舉例而 言,在設計電路時,能夠使用某—電晶體之參數來定義電晶體之 規袼,以及该4參數係如何導出的。 14 200907727 在每規格化線路圖2形成期間或之後,處理器μ亦產生第五 :料18 ,、包3用w指示該電路之―或多個效能參數! 9之複數個 :料^錄換°之’在形成線路圖2之後,飼服器15提取已根據 第一資料6、第二資料s哲一— 、8 '第二貢料丨〇及第四資料丨7得到最佳化 之佈局及/或組件規格之特有電路之效能參數Μ。參數b能夠隨 後用於對錢格化線路圖或包含該規格化線路圖的—電路集合執 H、他類1之㈣’例如:靜態分析、諸波平衡模擬 態模擬、準週期性籍能 ’心'心板擬、S-參數模擬、AC模擬、轉移函數模 擬、極點-零點分析、雜 、 雜讯刀析以及相位雜訊分析模擬、以及苴他 模擬。 ” 藉由提取該等效能參數19 · 雨 卞耆便月匕夠,進—步評估擬定 乱路之效此,使用該等效能來數來建立巨隹P彳 數不建立巨集杈型,其係以數學方 式換擬该規格化線路圖 ....a,a . ^ U及使用料越錄作為其他 Γ π之規蚊—部分。儘2圖巾僅㈣二效能來數, 然而應瞭解,在其他實施例及其他設““數 量之效能參數。 目仏中’係可使用不同數 在本實施例中,效能參數丨 等組件或該電路”一或夕個如下參數:該 弘峪、'心収之屯流蝻耗、雜訊指數 益 輸出驅動能力、賴宫、,& 輪入負載、 老夕 U、以輸入為參考之三階截斷點、以輸出為夂In the present embodiment, the data 17 (i.e., the global parameter) indicates both the manufacturing process of the electronic circuit and the woodwork specification. The data 17 is provided by the command batch slot n batch file u. In the context of this specification, it should be understood that the term "normalized circuit diagram" is used to replace a circuit circuit diagram or a radar technology. "Sub...the consistent example of layout" has been made by system 1 or -similar = It is privateized or otherwise processed. In the embodiment shown in Figure ,, the specification of the circuit diagram will include the definition of the layout of each circuit and the information of the specification and other information. In other words, the normalized line _ = The 相 phase table can be used to simulate a circuit with a suitable circuit simulator. In some embodiments, the normalization line will be stepped into the net list. The schematic diagram of the circuit diagram "circuit diagram" is different from the "circuit" or "where the circuit and circuit diagram are common, "circuit" or "use package" 3 The conventional symbols of the electronic components in the circuit are connected to the components of the circuit diagrams in Table 13 Γ, i 200907727. The circuit is not practical except that it is clearly indicated in the context. Real body electrophoresis The "design target" described in the preferred embodiment is as follows: the specification of the J-channel two-way circuit diagram (ie, the first data 6), the +, · σ • electricity, and the electronic circuit (ie, the second data 8) And a batch of batches (ie, the third asset contains electronic Thunder, π,). In some embodiments, the design goals are also & specifications and/or operational specifications (i.e., fourth material 17). Autumn and more generally, the design goals will involve the recording of relevant uses and parameters. I... "Which of these design goals are used to define a data set, the data set is fine and the input data is scheduled and processed by the system to perform the most for = ^, the performance parameters of the material path, the operating range of the circuit, etc. The advantages of these 4 cases are that 'there is no need for the designer to directly normalize the components. More precisely, the $7 meter can be designed in other aspects than the component specifications before forming the _roadmap. The goal defines at least a third data 10. This makes it possible for: • The designer initially determines the actual specification of the components in the overall performance of the circuit (defined by Data 8) (by data 6 and Script 11 is defined.) • Center 5: The target can be used to form a standardized circuit diagram according to different conditions of the process, performance parameters, operating range, etc. Ό10 mesh can effectively obtain the designer's Intentions and considerations. For example, when designing a circuit, the parameters of a certain transistor can be used to define the specification of the transistor and how the 4-parameter is derived. 14 200907727 During or after the formation of each normalized circuit diagram 2, the processor μ also generates a fifth: material 18, and the package 3 indicates the "or multiple performance parameters" of the circuit with w! 9 of a plurality of: After forming the circuit diagram 2, the feeder 15 extracts the layout that has been optimized according to the first data 6, the second data szhe-1, the 8' second tribute, and the fourth data 丨7. The performance parameter of the specific circuit of the component specification. The parameter b can then be used to hold the H-characterized circuit diagram or the circuit set containing the normalized circuit diagram, and the class 1 (4) 'for example: static analysis, wave balance Analog state simulation, quasi-periodic activity, 'heart' simulation, S-parameter simulation, AC simulation, transfer function simulation, pole-zero analysis, miscellaneous, noise analysis and phase noise analysis simulation, and 苴 other simulation By extracting the equivalent energy parameter 19 · Rainy sputum is enough, and further evaluating the effect of the proposed chaotic path, using the equivalent energy to establish the number of giant 隹 P彳 does not establish a macro 杈 type, It is mathematically replaced with the normalized circuit diagram....a, a . ^ U and materials used Recorded as other regulations of mosquito Γ π - section. Do as much as 2 (2) two performances, however, it should be understood that in other embodiments and other settings "" the number of performance parameters. In the eyes of the system, you can use different numbers in the present embodiment, the performance parameters, etc., or the circuit. One or the following parameters: the Hongsheng, the heart-breaking turbulence, the noise index, and the output driver. Ability, Lai Gong,, & wheel load, old U, third-order truncation point with input as reference, output as
Sr,八為參考之,斷點、以輸= 歐r)、Μ輸人偏移、輸出偏移、顫抖雜訊Μ (触er麟 屬IT (_dnve)鬚、w㈣彻賴驗 se power spectral d it )、 白雜.力率,晋密度(whitendsep〇wer 15 200907727 spectral density)、一次諧波失真(sec〇nd harm〇nic恤如丨⑽)、三次諧 波失真(thud harm0nic distorti〇n )、總諧波失真(恤】如咖毗 distortion)、相位雜訊(phase n〇ise)、定時抖動(u她g j]㈣、電源 抑制(power supply rejecti〇n )、以及基板雜訊抑制(純咖e⑽脱 reject)。在其他實_巾,賴取麟«狀效能參數。 效能參數19係作為各個規格化線路圖2之—部分儲存於資料庫 3中。在其他實施例中,該等效能參數則儲存於資料庫16中或其 他位置。 一Sr, eight for reference, breakpoint, to lose = ohm r), Μ input offset, output offset, tremor noise Μ (contact erlin IT (_dnve) must, w (four) thoroughly test se power spectral d It ), white hybrid, force rate, gold density (whitendsep〇wer 15 200907727 spectral density), first harmonic distortion (sec〇nd harm〇nic shirt such as 丨 (10)), third harmonic distortion (thud harm0nic distorti〇n), Total harmonic distortion (shirt), phase noise, phase jitter (u shegj) (four), power supply rejection (power supply rejecti〇n), and substrate noise suppression (pure coffee) e(10) 脱reject). In other real hoods, the plucking factor is used. The performance parameter 19 is stored as part of each normalized circuit diagram in the database 3. In other embodiments, the equivalent energy parameter Then stored in the database 16 or other location.
各設計目標5皆包含第三資料10,第三資料10係呈-最佳化指 令批次檔11形式或-通往_如下指令批次標之鏈接形式:該指^ 批次標包含多個可執行指令,用於選擇性地使該設計目標内之一 或多個組件或-組件組合之規格最佳化。藉由如下方式執行該指 令批讀而達«定各組件线定:對每—組件或_集合執行 相關換擬’並根據該等模擬之結果以—狀方式確定該或該等組 規格m其特性如在料指令中所確切定義的—樣。在該 貫知例中,該指令批讀亦產生效能參數19。在當前所述之實施 ,中取k化指令批次檔u係儲存為分別相關之設計目標5之一 部分。在其他實施例中’該等指令批次標n,儘管係、與各自設叶 目標5相關’則係分別儲存於(舉例而言)資料庫丨6中。❼ 除了由資料6所提供之該等規範外,指令批次擋U亦能使—十 =14選擇性地定義該等組件之規範。舉例而言,—Μ電路之% 二規定將-第-雙極電晶體之—基極(^)連接至—第二雙極 電曰曰體之發射極(emitter)’並將該第—電晶體之發射極連接至〆 16 200907727 電阻器,而該電阻器之另一端則連接至接地軌條(earth rail)。設 計者14由此能夠藉由例如將第一電晶體之發射極電流(及因而第 二電晶體之基極電流)定義為一預定大小,而進一步地定義該二 電晶體間之關係。 該指令批次檔中之指令係以一種設計語言進行編寫,該設計語 言容許在提供MOS裝置型號規範、裝置類型規範、面積規範、增 益規範及電壓規範之適宜組合時,調用一確定MOS電晶體規格之 命令。 MOS電晶體之一面積規範係定義為在寬廣之操作條件範圍内主 要與溝道寬度及溝道長度以及指狀部數量之乘積相關或負相關之 規範。面積規範通常係選自包含如下之群組:閘極電容、源極電 容、閘極-源極電容、閘極面積、臨限電壓失配(mismatch )量、 電流失配量、顫抖雜訊角落、通道寬度、以及通道長度。然而, 在其他實施例中,亦可具有額外或替代之面積規範。 增益參數係定義為一在寬廣之操作條件範圍内主要與MOS電晶 體之跨導(transconductance)相關或負相關之參數。MOS電晶體之 一增益參數通常係選自包含如下之群組:過激勵電壓、偏流、跨 導、輸出阻抗、通道長度、通道寬度、以及白雜訊電流。然而, 在其他實施例中,亦可具有額外或替代之面積規範。 在確定MOS電晶體規格時所用之M0S電晶體電壓規範有效集 合之實例包含: • 規定閘極、汲極及基板電壓,且源極電壓要最佳化; • 規定源極、汲極及基板電壓,且閘極電壓要最佳化; 17 200907727 • 規定閘極及汲極電壓,且源極與基板電壓相等並要最佳化; • 規定源極及基板電壓,且閘極與汲極電壓相等並要最佳化; • 規定源極及基板電壓,且閘極與汲極電壓係藉由一明確定義 之關係彼此相關且要最佳化;以及 • 規定所有該等電壓。 用以編寫指令批次檔中指令之該設計語言亦容許在提供如下規 範之適宜組合時,調用一確定雙極接面電晶體規格之命令:雙極 接面電晶體裝置型號、裝置類型、面積參數、增益參數及有效電 壓規範。 對於雙極接面電晶體,其面積參數係定義為一在寬廣之操作條 件範圍内主要與總發射極面積之乘積相關或負相關之參數。此包 含但不限於:電流密度、截止頻率、基極對集電極增益比、基極 接面電容、集電極接面電容、以及電晶體失配量。 對於雙極接面電晶體,其增益參數係定義為一在寬廣之操作條 件範圍内主要與電晶體之跨導相關或負相關之參數。增益參數之 實例包含但不限於:集電極電流、基極電流、發射極電流、以及 跨導。 在以一增益參數及一面積參數確定雙極接面電晶體規格時所用 之雙極接面電晶體電壓規範有效集合之實例包含但不限於: • 規定基極、集電極及基板電壓,且發射極電壓要最佳化; • 規定發射極、集電極及基板電壓,且基極電壓要最佳化; • 規定基極及集電極電壓,且發射極與基板電壓相等並要最佳 化; 18 200907727 化; 規定發射極及基板電壓,且基極與集電 極電壓相等並要最佳 •規定發射極及基板電壓,且基 一至 、卞电位屯壓係猎由一明確 疋義之關係彼此相關且要最佳化;以及 • 規定所有該等電壓。 執行規格確定指令(即運行指令批 ,,^ 田1以形成線路圖2 )之 ^果將形成具有固定'已知規格f 一广 曰體而且,此前「未知」 之電壓亦將得以計算出並包含於各自線路圖2内。 當各電路組件之規格已得到確定時 1叉寸屯日日體之所有DC極作 於相關線路圖2内’並可經由終端機η提供給設計者 14。在该貫施例中,該等Dc操 ,A 下怿件係以身料記錄25儲存於各 自線路圖2中,而在豆伸眚^ ^ "在其他貫她例中’貨料記錄則儲存於一盥線路 圖2分離之單獨檔案中。 /、線路 入^而言,對於—廳電晶體M1,設計者Η能夠藉由運行-I: I如Μ,)而存取閑極刪^ 可,疋義貝科1〇。在該實施例中,Each design goal 5 includes a third material 10, and the third data 10 is in the form of an -optimized instruction batch file 11 or - to _ the following instruction batch label link form: the finger ^ batch number contains multiple Executable instructions for selectively optimizing specifications of one or more components or combinations of components within the design target. Performing the instruction batch reading in the following manner: determining each component line: performing a related conversion for each component or group of _ and determining the group specification m in a manner based on the results of the simulations The characteristics are exactly as defined in the material instructions. In this example, the instruction read also produces a performance parameter 19. In the current implementation, the k-command batch file u is stored as part of the associated design target 5, respectively. In other embodiments, the instruction batches n, although associated with the respective leaf target 5, are stored in, for example, the database 丨6. ❼ In addition to the specifications provided by Data 6, the command batch U can also define -10 = 14 to selectively define the specifications of such components. For example, the % of the circuit 规定 specifies that the base of the -dipolar transistor is connected to the emitter of the second bipolar electrode and the first The emitter of the crystal is connected to the 〆16 200907727 resistor, and the other end of the resistor is connected to the earth rail. The designer 14 can thereby further define the relationship between the two transistors by, for example, defining the emitter current of the first transistor (and thus the base current of the second transistor) to a predetermined size. The instructions in the batch of instructions are written in a design language that allows for the determination of a MOS transistor when providing a suitable combination of MOS device model specifications, device type specifications, area specifications, gain specifications, and voltage specifications. Specifications of the order. One of the area specifications of a MOS transistor is defined as a specification that is primarily or negatively correlated with the product of the channel width and channel length and the number of fingers over a wide range of operating conditions. The area specification is usually selected from the group consisting of: gate capacitance, source capacitance, gate-source capacitance, gate area, threshold voltage mismatch, current mismatch, and dithering noise corners. , channel width, and channel length. However, in other embodiments, there may be additional or alternative area specifications. The gain parameter is defined as a parameter that is primarily or negatively correlated with the transconductance of the MOS transistor over a wide range of operating conditions. A gain parameter of the MOS transistor is typically selected from the group consisting of overdrive voltage, bias current, transconductance, output impedance, channel length, channel width, and white noise current. However, in other embodiments, there may be additional or alternative area specifications. Examples of valid sets of MOS transistor voltage specifications used in determining MOS transistor specifications include: • Specifying gate, drain, and substrate voltages, and source voltage optimization; • Specifying source, drain, and substrate voltages And the gate voltage should be optimized; 17 200907727 • The gate and drain voltages are specified, and the source and substrate voltages are equal and optimized; • The source and substrate voltages are specified, and the gate and drain voltages are equal. And optimized; • The source and substrate voltages are specified, and the gate and drain voltages are related to each other and optimized by a well-defined relationship; and • all of these voltages are specified. The design language used to program the instructions in the batch file also allows a command to determine the bipolar junction transistor specification to be made when providing the appropriate combination of specifications: bipolar junction transistor device type, device type, area Parameters, gain parameters and effective voltage specifications. For a bipolar junction transistor, the area parameter is defined as a parameter that is related or negatively related to the product of the total emitter area over a wide range of operating conditions. This includes, but is not limited to, current density, cutoff frequency, base-to-collector gain ratio, base junction capacitance, collector junction capacitance, and transistor mismatch. For a bipolar junction transistor, the gain parameter is defined as a parameter that is primarily or negatively correlated with the transconductance of the transistor over a wide range of operating conditions. Examples of gain parameters include, but are not limited to, collector current, base current, emitter current, and transconductance. Examples of effective sets of bipolar junction transistor voltage specifications used in determining a bipolar junction transistor specification with a gain parameter and an area parameter include, but are not limited to: • specifying the base, collector, and substrate voltages, and transmitting The pole voltage is optimized; • The emitter, collector and substrate voltages are specified and the base voltage is optimized; • The base and collector voltages are specified and the emitter and substrate voltages are equal and optimized; 18 200907727; The emitter and substrate voltages are specified, and the base and collector voltages are equal and optimal. • The emitter and substrate voltages are specified, and the base-to-one, zeta potential squeezing is related to each other by a clear relationship. Optimize; and • specify all such voltages. Execution of the specification determination command (ie, running the instruction batch, ^田1 to form the circuit diagram 2) will result in a fixed-known specification f-wide body, and the previous "unknown" voltage will also be calculated and Included in Figure 2 of the respective line. When the specifications of the respective circuit components have been determined, all of the DC poles of the 1-day-inch Japanese body are made in the relevant circuit diagram 2 and can be supplied to the designer 14 via the terminal η. In the embodiment, the D pieces are stored in the body line record 25 in the respective line drawing 2, and in the bean 眚 ^ ^ " in other examples, the item records are Stored in a separate file in Figure 2 separated by a line. /, line into the ^, for the hall hall M1, the designer can access the idle pole by running -I: I, such as Μ,), 疋义贝科1〇. In this embodiment,
J t' 5又汁者14利用之特性句今· A R m行往。3 .在BSIM版本33m〇J t' 5 and the juicer 14 uses the characteristics of the sentence · A R m line. 3. In BSIM version 33m〇
版本4.0 MOS模型及FKV婼荆士 bIM 導於ψ ^EKVfe型中所述聰裝置之所有電容、跨 偏流、過激勵電壓、失配量、裝置尺寸、截止頻 錢。在其陳_巾,亦可向設計者提供其之 額外或替代之特性。 心 在另-實例中,對於-已標記為 令「壯啊或「m.gpi」•由在^曰體,能夠使用命 即」次糟由在現有文獻中常用之命名法來存 19 200907727 取基極-發射極電容及電導。在該實施例中,儲存於線路圖2中, 且可提供給設計者丨4之雙極電晶體之特性包含:在Gummel-Poon 模型中所述之所有接面電容及接面電導、跨導、輸出阻抗、偏流、 失配量、裝置尺寸、截止頻率及雜訊效能。在其他實施例中,亦 則可具有其他模型之額外或替代之特性。 當系統1係用於大電路時,其包含並利用方程式求解能力。乃 因對於大電路’更常使一給定電晶體之資料10—且特別是指令批 次檔11一參照另一電晶體之指令批次檔11加以定義。 在其他實施例中,該等設計目標首先引用資料17—即全域參數 一來估計擬定電路之最小預期選路寄生效應。由於此係在完成佈 局之前進行’因而其能夠更精確地估計組件及電路對寄生現象敏 感之效能參數。此等參數之實例包含頻寬及Q因數。由於此係在 設計階段之早期且在形成佈局之前進行,已發現此能減少設計者 達成一最終規格化線路圖2所需之迭代次數。 在其他實施例中,係利用其他模擬形式進行組件規格之確定。 舉例而言,在一具體實施例中,執行指令批次檔11之結果係調用 另一模擬器來模擬該電路、該電路之一部分抑或另一相關電路之 效能。然後,使用自該模擬所獲得之資訊來輔助形成規格化線路 圖。此等模擬之實例包含但不限於:AC模擬(AC simulation)、雜 訊模擬(noise simulation )、證波平衡模擬(harmonic balance simulation)、暫態模擬(transient simulation)、週期性穩態模擬(periodic steady state simulation )、循環靜態雜訊模擬(cyclostationary noise simulation)、相位雜訊模擬(phase noise simulations )、轉移函數模擬 20 200907727 (transfer ftmction simulation )、極點-零點分析(p〇ie zer〇 咖卜也)及準 靜態週期性穩態模擬(quasi-static periodic steady state simulati⑽)。 在彼等其中一第一設計目標包含一進一步設計目標、且各节設 計目標包含一最佳化指令批次檔之實施例中,能夠藉由該第—設 計目標之指令批次檔啟動該進一步設計目標之最佳化。更具體而 &,6玄第一设計目標之指令批次標在執行時亦會執行第二$叶目 標之指令批次槽。 在執行指令批次檔11時,引用設計目標5中之資料6、8及1〇、 連同資料4 16中之資料17 ’以形成-規格化線路圖2,該規格化 線路圖2已不僅在-組件層次上、且亦已在—電路層次上、並在 全域參數層次上得到最佳彳^如上所述,至少在某些情形中,引 用其他设计目標或線路圖。 除資料丨8以外,線路圖2亦包含複數個記錄h形式之規格確 定貧料1在本實施财,該等記錄不僅指示連接性及組件資訊, 且亦指示為定義一網表所需之所有規格確定資訊。Version 4.0 MOS model and FKV 婼 士 bIM Guide 所有 All capacitances, trans-bias, over-excitation voltage, mismatch, device size, cut-off frequency of the Cong device in the EKVfe type. In addition, the designer can also provide the designer with additional or alternative features. In the other-instance, for - has been marked as "strong or "m.gpi" • by the body, can use the life", the second bad is stored in the existing literature commonly used nomenclature 19 200907727 Base-emitter capacitance and conductance. In this embodiment, the characteristics of the bipolar transistor stored in circuit diagram 2 and available to the designer 丨4 include: all junction capacitances and junction conductance, transconductance described in the Gummel-Poon model. Output impedance, bias current, mismatch, device size, cutoff frequency, and noise performance. In other embodiments, there may be additional or alternative features of other models. When System 1 is used in large circuits, it contains and utilizes equation solving capabilities. It is because the large circuit 'more often defines the data 10 of a given transistor - and in particular the command batch 11 - with reference to the command batch 11 of the other transistor. In other embodiments, the design goals first reference the data 17 - the global parameter one - to estimate the minimum expected routing parasitics of the proposed circuit. Since this is done before the layout is completed, it is able to more accurately estimate the performance parameters of the components and circuits that are sensitive to parasitic phenomena. Examples of such parameters include bandwidth and Q factor. Since this was done early in the design phase and prior to the layout, it has been found to reduce the number of iterations required by the designer to achieve a final normalized circuit diagram 2. In other embodiments, the determination of component specifications is made using other analog forms. For example, in one embodiment, the result of executing the instruction batch file 11 is to invoke another simulator to simulate the performance of the circuit, a portion of the circuit, or another associated circuit. The information obtained from the simulation is then used to aid in the formation of a normalized circuit diagram. Examples of such simulations include, but are not limited to, AC simulation, noise simulation, harmonic balance simulation, transient simulation, periodic steady state simulation (periodic) Steady state simulation ), cyclostationary noise simulation, phase noise simulations, transfer function simulation 20 200907727 (transfer ftmction simulation ), pole-zero analysis (p〇ie zer〇 And quasi-static periodic steady state simulati (10). In embodiments in which one of the first design goals includes a further design goal and each of the design goals includes an optimized instruction batch file, the further step can be initiated by the instruction batch file of the first design goal. Optimization of design goals. More specifically, &, 6 Xuan first design target instruction batch mark will also execute the second $ leaf target instruction batch slot when executed. When executing the instruction batch file 11, reference the data 6, 8 and 1 in the design objective 5, together with the data 17' in the data 4 16 to form a normalized circuit diagram 2, which is not only in the normalized circuit diagram 2 - At the component level, and also at the circuit level, and at the global parameter level, as described above, at least in some cases, other design goals or circuit diagrams are referenced. In addition to the data 丨8, the circuit diagram 2 also includes a plurality of records in the form of h. The specification determines the poor material 1 in this implementation. The records not only indicate connectivity and component information, but also indicate all that is required to define a netlist. Specification determines information.
記錄7係關於電路中之各個組件,且因此,在目標5中存在斑 組件-樣多之記錄7。在其他實施例,,當於一單個記錄中規定多 於一個組件時,各記錄係指示少 件之所有規範◦整體 而吕由貧料6所指示且詳言之由印 擬定1肉❹ °錄7所札不之該等規範係關於 楗疋电路内所要使用之各單獨組 , 性貝及類型、以及用於界定 邊电路之彼等組件間之連接性。 ,§ 仕而要日守’此夠規定該等組件之 、。,且對該等規格及網絡加 f ^ ^ ^ ^ ^ ^ 術者將瞼紘⑽ ^己以供^後引用。熟習此項技 何贫將瞭解,記錄7與習知 線路圖間之—顯著區別在於,記錄7 21 200907727 並不規;t組件類型及/或—或多個組件規格衫尺寸,且在形成各 自之規格化料® 2 _其進行最純。換言之,儘管設計者μ 可定義-或多個該等組件之規格—或至少其中之—規格尺寸,然 而較佳係應留下至少'组件之至少—規格尺寸為未定義。更通常 地;,所有裝置之所有規格確定尺寸皆不由設計者14加^義,乃 因該等組件之未定義特性係由處理器15予以最佳化。 如上文所述,資料8及記錄9係指示電路之規範。此通常包含 该電路之一或多個最低效能參數,無論係頻寬、輸入阻抗、輪出 阻抗、電流容量、㈣m线範、顫抖要:卜線性度要求 方面抑或其他方面之效能參數。該等規範係關於電路之總體功 能,而非電路内所用各單獨組件之功能。’然而,應瞭解,第—次 料6能夠根據資料8加^義,乃因設計者14能夠根據電路之: 體規範來定義-給定組件之一或多個規範。舉例而言,若資料8 =一總體增益效能’且其中之-組件係為-用於為另—電晶體 M、- DC偏壓之雙極電晶體’則可將該雙極電晶體之基極電壓及 偏流規定為與總體增益相關。 亦應瞭解,一個電路之眘料s % — 电峪之貝# 8月匕夠自另-設計目標之資料8及, 或資料18導出。舉例而士,产 墙 ^ 一一 例而5在一弟-電路中’希望使輸出阻抗盥 一弟—電路之以叫相匹配,以雜料電關之功率傳遞曰 佳。相應地’在執行指令批次仙時,第—電路之設計目標在= 生各自之規格化線路圖2時自資料庫4中引用第二電路之設 I之貝料8。在某些情形中,指令批次標η則並非自第二電路之 設計目標中引用資料8或資料18,而是引用已由設計目標5使用 22 200907727 同一第四資料】7所產生之線路圖2。 另-實例係為一諸如供電電塵調節器之電路 -第二電路(比如—RF放大器)…十用於調郎 包/原•電壓)。該供雷带两% μ 器之第二資料8引用該放大器 W屋㈣ #得产干料目心5或規格化線路圖2,以 又于才日不對泫放大态供電所需之所 、s# ω 4 Ζ电壓及輸出電流之資料。 通书,供電電壓調節器之資料 、Ή 用α亥放大态之線路圖2之一 或多個效能參數19。Record 7 relates to the various components in the circuit, and therefore, there is a plaque component-like record 7 in the target 5. In other embodiments, when more than one component is specified in a single record, each record indicates that all of the specifications of the small pieces are indicated by the poor material 6 and are in detail printed by the meat. The specifications of the seven systems are related to the individual groups to be used in the circuit, the type and type, and the connectivity between the components used to define the edge circuits. , § Shi and the day to keep 'this is enough to stipulate these components. And the specification and network plus f ^ ^ ^ ^ ^ ^ will be 睑纮 (10) ^ for reference. If you are familiar with this technology, you will understand that the difference between record 7 and the conventional circuit diagram is that the record 7 21 200907727 is irregular; t component type and / or - or multiple component size, and in the formation of their respective Specification Material® 2 _ It is the purest. In other words, although the designer μ may define - or a plurality of specifications of the components - or at least - the size of the components, it is preferred to leave at least the at least 'components - the size of the specification is undefined. More generally; all specifications of all devices are not sized by the designer 14 because the undefined characteristics of the components are optimized by the processor 15. As mentioned above, Data 8 and Record 9 are specifications for the circuit. This typically includes one or more of the lowest performance parameters of the circuit, regardless of bandwidth, input impedance, wheel-out impedance, current capacity, (d) m-line range, trembling: linearity requirements, or other performance parameters. These specifications relate to the overall functionality of the circuit and not to the functions of the individual components used in the circuit. 'However, it should be understood that the first-order material 6 can be added according to the data 8, because the designer 14 can define one or more specifications of a given component according to the body: body specification. For example, if the data 8 = an overall gain performance 'and the component is - the bipolar transistor used to bias the other transistor M, - DC, then the base of the bipolar transistor can be used. The pole voltage and bias current are specified to be related to the overall gain. It should also be understood that the cautiousness of a circuit s % — 峪 峪 # # August is enough for the other - design target information 8 and, or data 18 derived. For example, the production of walls ^ one case and 5 in a younger-circuit 'hope to make the output impedance 盥 a brother - the circuit is called to match, the power transmission of the miscellaneous power is better. Correspondingly, when the instruction batch is executed, the design of the first circuit is to refer to the material 8 of the second circuit from the database 4 when the respective normalized circuit diagram 2 is generated. In some cases, the instruction batch η does not reference the material 8 or the data 18 from the design target of the second circuit, but refers to the circuit diagram generated by the design target 5 using 22 200907727 the same fourth data 7 2. Another example is a circuit such as a power supply dust regulator - a second circuit (such as - RF amplifier) ... ten for the package / original / voltage). The second data 8 of the lightning supply with two % μ refers to the amplifier W house (four) #得产干料心心5 or normalized circuit diagram 2, in order to supply power to the enlarged state # ω 4 Ζ Voltage and output current data. Tongshu, the data of the power supply voltage regulator, 之一 one of the circuit diagrams of the alpha-amplified state, or one of the performance parameters 19.
〜在其他實施例中,伺服器15係利用經由終端機^設計者Μ 付到之輸入。在上文所給出之供電電壓調節器設計目標實例中, 伺,器15請求設計者Μ規定-供電《或電流,或者規定由該 _器供電之該或料電路之設計目標。 " 現在參見圖3,其係為一 Ν型M〇s (NM〇s)電晶體共用間極 放大器23之一電路線路圖。該電路線路圖係為一擬定電路之—圖 形表不形式’该電路線路圖包含各種組件之標記符號及使各組件 彼此相關之連接性資訊以及例如終端機、電麼電源軌條、接地執 k等其他參考點。在某些實施例中,設計者有權更改電路線路圖 亦即,邊電路線路圖係為資料6之一部分並儲存於複數個記錄7 中。然而’在其他實施例中,電路設計者無權更改電路線路圖。 设計者14能夠定義放大器23中各組件之資料10。此係藉由設 4者在終端機丨3中針對一或多個該等組件輸入或更改指令批次標 11來達成。在本實施例中’指令批次檔丨丨係以一種語言(例如上 文所述之6吾& )編寫而成,該語言容許設計者14選擇性地定義或 根本不定義要儲存於資料8或資料1 〇中之如下可變參數: 23 200907727 •各裝置之處理類型一亦即,從由全域參數所定義之可用模型 列表中選擇相關裝置模型。 •電源電壓一表示為VDDA。 •輸入阻抗一表示為Rin。 經由終端機13,設計者14按照例如下面所示之可變參數或關係 式來定義用於確定Ml規格之指令,該等指令儲存於指令批次檔 11中:In other embodiments, the server 15 utilizes input that is passed through the terminal device designer. In the power supply voltage regulator design target example given above, the servo 15 requests the designer to specify a "power supply" or a design target for the circuit to be powered by the _ device. " Referring now to Fig. 3, it is a circuit diagram of a 〇-type M〇s (NM〇s) transistor sharing interpole amplifier 23. The circuit circuit diagram is a schematic circuit - the graphic form is not in the form of the circuit diagram. The circuit circuit diagram includes the marking symbols of various components and the connection information for making the components related to each other and, for example, the terminal, the power supply rail, the grounding k And other reference points. In some embodiments, the designer has the right to change the circuit diagram, i.e., the side circuit diagram is part of the data 6 and is stored in a plurality of records 7. However, in other embodiments, the circuit designer has no right to change the circuit diagram. The designer 14 is able to define the data 10 for each component in the amplifier 23. This is accomplished by setting or changing the command batch number 11 for one or more of the components in terminal block 3. In this embodiment, the 'instruction batch file' is written in a language (such as 6 & described above), which allows the designer 14 to selectively define or not define the data to be stored at all. 8 or the following variable parameters in the data 1 :: 23 200907727 • The processing type of each device, that is, the relevant device model is selected from the list of available models defined by the global parameters. • The supply voltage is expressed as VDDA. • Input impedance one is expressed as Rin. Via the terminal 13, the designer 14 defines the instructions for determining the M1 specification in accordance with, for example, the variable parameters or relationships shown below, which are stored in the command batch file 11:
Size[Ml=NMOS,substrate=0,source=VDDA*0.2,gate?, Γ · · drain=VDDAx〇.4 , GmPlusGmbs=l/RiN , length=minimum , widthclOu] 未由設計者14藉由該等可變參數加以定義之參數則留待在執行 指令批次檔11之後進行最佳化。 一旦指令批次檔11得到執行,其將會形成電晶體Ml的一特定 規格及已知閘極電壓。熟習此項技術者應瞭解,上述可變參數要 求向電晶體之源極節點參考之輸入阻抗等於Rin之阻抗,以達成良 好之匹配並因而提供較佳之功率傳遞。 為對Μ1之閘極電壓施加偏壓,需要相應地定義電晶體M2。為 提供該偏壓,設計者14經由終端機13調節或輸入M2之可變參 數。該等可變參數係與Ml之可變參數包含於同一設計目標内。 詳言之,設計者14為M2定義以下可變參數: 規格[M2=NMOS,substrate=0,source^O,gate=Ml.gate,drain= Ml. gate 1 current=Ml .current/4 » length^minimum] 一旦執行該設計目標之指令批次檔11,M2之規格便會被確定 24 200907727 成,當以一等於電晶體Ml之電流的1/4的電流對M2施加偏流時, M2將為電晶體Ml之閘極產生正確之偏壓。偏流IB2係表示為: Ib2 二 M2 .current 為對電晶體Μ 2施加偏流’設計者14在Μ1之源極處形成·電 流鏡Μ3/Μ4。期望使該電流鏡具有一適宜之過激勵電壓以及一小 於1%之失配量。相應地,設計者14界定以下可變參數:Size[Ml=NMOS,substrate=0,source=VDDA*0.2,gate?, Γ · · drain=VDDAx〇.4 , GmPlusGmbs=l/RiN , length=minimum , widthclOu] not by the designer 14 The parameters defined by the variable parameters are left to be optimized after executing the command batch file 11. Once the command batch file 11 is executed, it will form a specific specification of the transistor M1 and a known gate voltage. Those skilled in the art will appreciate that the above variable parameters require that the input impedance referenced to the source node of the transistor be equal to the impedance of Rin to achieve a good match and thus provide better power transfer. In order to bias the gate voltage of Μ1, it is necessary to define the transistor M2 accordingly. To provide this bias, the designer 14 adjusts or inputs the variable parameters of M2 via the terminal 13. The variable parameters are included in the same design target as the variable parameters of M1. In detail, the designer 14 defines the following variable parameters for M2: Specification [M2=NMOS,substrate=0,source^O,gate=Ml.gate,drain= Ml. gate 1 current=Ml .current/4 » length ^minimum] Once the design target batch file 11 is executed, the specification of M2 will be determined 24 200907727. When a current equal to 1/4 of the current of the transistor M1 is applied to the bias current of M2, M2 will be The gate of transistor M1 produces the correct bias. The bias current IB2 is expressed as: Ib2, M2. current is a bias current applied to the transistor ’2, and the designer 14 forms a current mirror Μ3/Μ4 at the source of the Μ1. It is desirable to have the current mirror have a suitable overdrive voltage and a mismatch of less than 1%. Accordingly, designer 14 defines the following variable parameters:
Size[M3=NMOS ’ substrate = 0 > source = 0 , gate?, drain=M 1 .source > overdrive=VDDA/l0 j mismatch <1 Pt)] Recalculate[M4=M3,drain 二M3,gate] current 設計者14之下一步驟係為Ml輸出端處之電阻器R1定義一或 多個可變參數。此係藉由在設計目標5中包含/更改R1之可變參 數(資料10)來達成: R] = VDDA/2/M1 .current 此後,設計者14提供電容器Cl以下可變參數:Size[M3=NMOS 'substrate = 0 > source = 0 , gate?, drain=M 1 .source > overdrive=VDDA/l0 j mismatch <1 Pt)] Recalculate[M4=M3,drain two M3,gate The next step in current designer 14 defines one or more variable parameters for resistor R1 at the output of M1. This is achieved by including/changing the variable parameter of R1 in Design Objective 5 (Material 10): R] = VDDA/2/M1 .current Thereafter, Designer 14 provides the following variable parameters for capacitor Cl:
C1 = 10*M1.CGG 一旦設計者14已定義完所有所需之使用者自定義可變參數一亦 即資料10,便將設計目標5提交給伺服器15,以便能夠執行指令 批次檔11。伺服器1 5運行最佳化指令批次標11,其中該指令批 次檔尤其可因應於用於形成一線路圖2之可變參數一亦即第三資 料。 如上文所述,在伺服器15運行指令批次檔11後,所得之線路 圖2包含一給定電路以及該電路中所有組件之所有所需規格確定 25 200907727 資訊。該線路_㈣存於f料庫3内,並包含詩指示規格確 定資訊、電路線路圖、連接性資訊、裝置或組件類型、製程等之 記錄21。 線路圖2係為基於若干個輸入之最佳化電路實例,該等輸 含: •對各單獨組件之任何要求; •總體電路效能; •全域參數;以及 •週圍電路之要求。 然後,使用線路圖2 4+ B S* M h π 針對具體1及隶終應用而達成該電路設 計之最終佈局及製造。甚欲w — π η制Y , 不同$L程(例如更小之最小特徵 尺寸)製造同一電路,或者芒爭蚁 - 右取〜應用不同(例如操作溫度範圍 更廣)m可使用同-設計目標來設計該電路之另—實例。詳言 之,伺服器15運行指今血卜+ ρ , 、,π α ?日7批-人檔U,亚因應資料ό、8及10 (其皆 保持不變)以及針對新劐鞀;^掩从作μ ’、 丁啊衣及#作條件而選自資料庫丨6之新全域 參數。由此提供另-線路圖2,該另2係實施設計目標 之一最佳化實例’但係於伺服器15因應獨特輸入之情況下實施。 相應地’能夠重複使用單個設計目標來達成最佳化規格確定, 而非必須由設計者製定籠格並隨後以迭㈣式使其最佳化。 在該實施例中,設計者亦可改進各可變參數並重新執行指令抵 次檔Π,以提供另一規格化線路圖。 指令批次檔U細—種設計語言編“成,紐計語言依據雨 路之規範(即資料8)並根據預期製程及操作條件(即資料⑺电 26 200907727 :〇 :、且件之規格。指令批次檔11之其中一個角色係表達資料 〆並合。午°又6十者14定義該組件與一或多個週圍組件之功能關 %路規粑以及全域參數。在下文中以—電晶體及一雙極 電晶體來提供此一語言之特徵之一實例。然而,應瞭解,該語言 亦適用於積體電路内所包含之其他組件。 、端機13 4设計者14提供一圖形使用者介面(⑽)%。該介 2係為—線路圖輸人介面,可於其t以圖形方式察看各單獨組 认〜以便易於識別其類型及其與組件之連接性。藉由雙擊一 、七定組件,GUI會下翻曼裳„ 贫_ > — 夠六 ’ 、弟—及第三資料,並使設計者能 夂“:改該資料之參考點或者只是人工地重新定義某些資 旦设計者對一給定組件或對整個電路之規範作出更改,設 之任:Γ動更新,以重新計算在執行指令批次槽11之前所固定 之任何電壓或電流。 電者Γ解’隨著設計者逐漸提供單獨組件或整個 化_逐_、。 二==:::rr …據— 路之所要求功能 ““夠更加關注電 隹瓦先必須忙於最佳規格確定。 •在形成—設計目標後,能夠進―步改進該設計目標。 •在形成-設計目標後,能夠 而多次執行最 κ預爲作條件或製程 制 日々批次檔。相應地,設計者益需在面料 製程時「從頭開始」。 η而在面對—新 27 200907727 •為设什者提供一可在如下基礎上,指示裝置之某些參數規範 之設計語言:在彼等參數得到規定時,該語言能夠達成該組件之 規格確定。 •為設計者提供一可獲取設計者設計電路之意圖及關鍵設計思 路之设计浯言,該等關鍵設計思路包含組件規格之確定次序以及 使用哪些參數來確定組件規格。 隶仏化‘々批夂標此夠根據一或多個其他設計目標或根據一 或多個規格化線路圖來定義組件。 •最佳化指令批次檔亦可用於計算電路之效能參數,例如總體 以及雜訊效能,以便可使用該 電路頻率響應、頻寬、增益、IIP3、以及 等參數建立電路之巨集模型。 或「電子組件」。熟習 電子電路之各單獨元件一般稱作「組件 此項技術者將瞭解,亦可使用其他術語作為等效術語,例如「裝 置」或「電子裝置」或「元件」抑或「電子元件」。 除非根據下文說明很明顯地另外明確聲明外,應瞭解,在本說C1 = 10*M1.CGG Once the designer 14 has defined all the required user-defined variable parameters, ie the data 10, the design target 5 is submitted to the server 15 in order to be able to execute the command batch file. 11. The server 15 runs an optimization command batch number 11, wherein the command batch level is particularly responsive to the variable parameter, i.e., the third item, used to form a circuit diagram 2. As described above, after the server 15 runs the command batch file 11, the resulting circuit diagram 2 contains all of the required specifications for a given circuit and all components of the circuit. The line _(4) is stored in the f-bank 3 and contains records 21 indicating the specification information, circuit diagrams, connectivity information, device or component type, process, etc. Circuit diagram 2 is an example of an optimized circuit based on a number of inputs, including: • any requirements for individual components; • overall circuit performance; • global parameters; and • requirements for surrounding circuits. The final layout and fabrication of the circuit design is then achieved using the circuit diagram 2 4+ B S* M h π for the specific 1 and the end-of-life application. It is desirable to make w - π η Y, different $L process (such as smaller minimum feature size) to make the same circuit, or ant ant - right to ~ different application (such as wider operating temperature range) m can use the same - design The goal is to design another example of the circuit. In particular, the server 15 runs the blood of the blood + ρ, ,, π α? 7 batches - the person U, the Aynthesis data 8, 8 and 10 (all of which remain unchanged) and for the new 劐鼗; Covered as a new global parameter of the database μ6 for the conditions of μ ', Ding ah and #. Thus, another circuit diagram 2 is provided which implements one of the design goals of the optimization example' but is implemented by the server 15 in response to a unique input. Accordingly, a single design goal can be reused to achieve an optimized specification, rather than having to be caged by the designer and then optimized by the stack. In this embodiment, the designer can also modify the variable parameters and re-execute the command-in-time file to provide another normalized circuit diagram. The command batch file U is fine--the design language is edited, and the New York language is based on the specification of the rainway (ie, data 8) and according to the expected process and operating conditions (ie, data (7) electricity 26 200907727: 〇:, and the specifications of the parts. One of the roles of the command batch file 11 is a combination of expression data. The noon and the sixteenth person define the function of the component and one or more surrounding components, and the global parameters. In the following, the transistor is And a bipolar transistor to provide an example of the characteristics of the language. However, it should be understood that the language is also applicable to other components included in the integrated circuit. The end user 13 4 provides a graphic use Interface ((10))%. The 2 is the line diagram input interface, which can be viewed graphically in each t to make it easy to identify its type and its connectivity to the component. The seven components, the GUI will turn down the man „ _ _ > — enough six ', brother - and third information, and enable the designer to 夂 ": change the reference point of the data or just manually redefine certain resources Once the designer is on a given component or on the whole The specification of the circuit is changed, and it is set to: Renew the update to recalculate any voltage or current fixed before the execution of the instruction batch slot 11. The electrician understands that as the designer gradually provides separate components or integration _ _ _, 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Design goals • After the formation-design goal, the most κ pre-conditions or process recipes can be executed multiple times. Accordingly, the designer needs to “start from the beginning” in the fabric process.对—新27 200907727 • Provides a design language for the setters to indicate certain parameter specifications of the device on the basis that, when these parameters are specified, the language can achieve the specification of the component. Provides a design rumor that captures the designer's design intent and key design ideas, including the order in which the component specifications are determined and which parameters are used to determine the component. The 仏 仏 ' 々 々 々 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 够 • • • • • • • • • • • , for example, overall and noise performance, so that the circuit's frequency response, bandwidth, gain, IIP3, and other parameters can be used to build a macro model of the circuit. Or "electronic components." The individual components of an electronic circuit are generally referred to as " It will be understood by those skilled in the art that other terms may be used as equivalent terms, such as "devices" or "electronic devices" or "components" or "electronic components" unless explicitly stated otherwise in the following description. Understand, in this book
之任何裝置或一裝置之任何部分 及/或記 or」可4曰代用於處理電子資料 其處理例如來自暫存器記 28 200907727 憶體之電子n以將該電子資料變換成其他電子詩,所述其 他電子資料可例如儲存於暫存器及/或記憶體中。「電腦 (computer)」或「計算機器(_师—職仙〇」抑或「叶曾平 臺(C〇mputlngpIatf〇rm)」可包含一或多個處理器。 - 本文所ι4各4方法之—實施例係為—種電腦可讀承 體之形式’其承載-組用於在—或多個處理器上執行之指令,例 如-電腦程式。舉例而言,呈伺服器15形式之處理器係為—用於 提供電子f料_之系狀—料。㈣,熟f此項技術者將 本發明之實施例可實施為—種方法、-種設備-例如專用 f種諸如貝料處理系統設備、或者一種電腦可讀承载媒^ 一例如—«腦料產品。該電料讀承載承載電腦^ 碼’該電料讀碼包含—組齡,如指令當在—❹個處判 上執仃時,會使—或多個處理器執行—種方法。相應地,本發明 之各態樣可呈一種方法、一完全硬體式實施例、一完全軟體式實 施例或-將軟體與硬體態樣相結合之實施例形I此外,本發明 亦可呈承載媒體(例如—電腦可讀儲存媒體上之電腦程式產品) 形式,其承載實施於該媒體中之電腦可讀程式碼。 應瞭解’在-實施例中’所述各方法之步驟係由一處理系統— 即-執行儲存於儲存器中之指令(即電腦可讀碼)之電腦系統一 中之-或多個適當之處理器執行。亦應瞭解,本發明並非僅限於 任何特行施態樣或程式化技術,且本發明可使用任何適於構建 本文所述魏之技術來難。本發明並非僅限於任域定程式化 語言或作業系統。 29 200907727 本說明書通篇中所提及之「一實施例(_ _〇翻伽)」或「— 實施例…embodiment)」意指結合該實施例所述之特定特徵、社 構或特性包含於本發明之至卜實_巾。因此,在本說明^ 篇中之各處所出現之片語「在一實施例中(⑴隊_〇細咖)」 或「在—實施例中(inanemb〇diment)」未必皆指代同—實施例。 此外,在-❹彳目實關巾,該料料徵、結構或純可按此 項技射—般技術者根據本揭㈣料⑼之任意適當方式相組 合。 同樣地,應瞭解,在上文對本發明實例性實施例之說明中 便卿匕本揭示内容並有助於理解_或多個不同之發明性態樣, 2時將本發明之錢特徵—同組合於單個實施例中或者其說明 。然而,不應將此種所揭示之方法解釋為本發明所需之特徵多 於在.請求射㈣確表叙特徵。而應解料,如下文申言主 專利範圍所反映,各發明,能掙产 月 找 Μ跟⑮樣存在於單個上文所揭示實施例之 僅一部分特徵中。因此,「营 實%方式」後面之「申請專利範圍 此明確地併人本「實施方式、 电丄* τ兵τ母—4求項自身即代 表本杳明之一單獨實施例。 —卜Us本文所述之某些實施例係包含某些特徵而不立 他霄施例所包含之特徵 - 例之牯料少,人 …白此項技術者將理解,不同實施 亦被認定包含於本發明之範圍内,並形成不同之 二’在;::言’如熟習此項技術者根據本文之教示内容所將 :在下文申請專利範圍中,任何所主張之實 組合形式使用D 任思 30 200907727 此外’本文將Μ實施湘料—财 έ A -M- -T- , 4 種方法之各要辛 之、、且&,其可由—電腦系統之1㈣或由 ' m ±. m ,, 〜他貝知邊功能之裝 置執f,-具有為實施此—方法或—種方法之 指令之處理器即形f實施該方法或—種方法之要素= 置。此外’此處所述-設備或系統實 '、、 70仵即係一用於實 施由該要素為實施本發明而執行之功能之裝置。 、 在本文所提供之說明中,陳述了諸多具體細節。然而,庫瞭解, 本發明之實施财可在不存在該等具體細節之情況下實施。在並 他情形中,為避免淡㈣本說明之理解,未詳細顯4所習知^ 方法、結構及技術。 Μ另外蚊外,本文中用於描述—公共目標之順序性形容詞 第-」、「第一」、「第三」等僅表示其指代相㈤對象之不同實例, 而非想要隱含著如此所述之對象必須呈—給定順序—無論係 順序、空間順序、等級順序抑或任何其他方式。 ” 在下文申請專利範圍及本文之說明中,任一用語「包含 (_,_)」、「由…構成(_ρ⑽“〇」或「其包含(:二 comprises)」皆係為-開放式用語,其意味著至少包含後面所跟之 元件/特徵’但不排除其他元件/特徵。因此,當在申請專利範圍中 使用「包含(c⑽pdsing)」這一用語時,不應將其解釋為僅限於 其後所列之裝置或元件或步驟。舉例而言,「一裝置包含A及B( & deVlce comprismg A and B )」這一表述之範圍不應限定為僅由元件 A及B組成之裝置。本文所用之任一用語「包括(mc丨uding)」或 「其包括(which include)」抑或「包括(that indudes)」亦係為 31 200907727 -開放式用語,其亦意味著 妯咚兗从-从 匕3後面所跟之元件/特徵,作不 排除其他几件/特徵。因此 仁不 ( · ·、 匕枯(lncluding )」係盥「句令 (―认同義並意指「包含㈣)」。〜 項==7述據信為本發明之較佳實施例,然而熟習此 一=知:亦可在不背離本發明之精神下對卿^ 圍二::而變及修改亦被認定在本發明所主張的權利範 〇 i文所給出之任何公式皆僅代表可使用之程序。 4在本Γ中添加或從中刪除功能,並可互換各功能塊之功能。 1本|明_内對所述方法添加或從中刪除步驟。 儘管上文係參照一具體實 末本發月,然而熟習此項技術 者將瞭解’其亦可實施騎多其他形式。 【圖式簡單說明】 上文係僅以舉例方式參照附圖來說明本發明之一較 附圖中·· 、 / 1圖係不意性地例示—種用於根據設計目標來為各具有一或 多個電子組件之各個電子電路提供複數個規格化線路圖之系統; 第2圖係概念性地例示包含於設計目標及第丨圖所示規格化線 $圖t之資料;以及 第3圖係為一共閘極放大器之電路線路圖,其設計目標係由第1 圖所示系統提供。 【主要元件符號說明】 :系統 :結構化資料庫 2:規格化線路圖 4:結構化資料庫 32 200907727Any device or any portion of a device and/or device can be used to process electronic data, such as from an electronic device n of the memory device to convert the electronic material into other electronic musical articles. Other electronic materials may be stored, for example, in a register and/or memory. "Computer" or "computer" (_师师职仙〇) or "叶曾平台(C〇mputlngpIatf〇rm)" may contain one or more processors. - An example is a form of computer readable body that carries a set of instructions for execution on - or a plurality of processors, such as a computer program. For example, a processor in the form of a server 15 is - a system for providing electronic materials. (d), skilled in the art, embodiments of the invention may be implemented as a method, a device - for example, a special f such as a bedding processing system equipment, Or a computer readable carrier medium, for example, a "brain product. The electric material read carrier carries a computer code". The electric material reading code includes - group age, if the instruction is executed at - one place, The method may be performed by a plurality of processors. Accordingly, aspects of the invention may be embodied as a method, a fully hardware embodiment, a fully software embodiment, or a combination of a soft body and a hard body. Embodiment I In addition, the present invention can also be carried as a carrier medium (for example - A computer program product on a readable storage medium, in the form of a computer readable program code embodied in the medium. It should be understood that the steps of the methods described in the 'in the embodiment' are performed by a processing system - ie - Execution of one of the computer systems (ie, computer readable code) stored in the memory - or a plurality of appropriate processors. It should also be understood that the invention is not limited to any particular embodiment or stylization technique. And the present invention may be difficult to use using any of the techniques described herein. The present invention is not limited to any localized programming language or operating system. 29 200907727 "One embodiment" (referred to throughout the specification) _ _ 〇 〇 ) ) 」 」 」 」 embo 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Therefore, the phrase "in one embodiment ((1) Team_〇细咖)" or "in the case of (inanemb〇diment)" does not necessarily mean the same as in the embodiment. example. In addition, in the case of the ❹彳 实 实 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , As such, it will be appreciated that in the foregoing description of the exemplary embodiments of the invention, Combinations are made in a single embodiment or are described. However, such a method disclosed should not be construed as requiring that the features of the invention are more than that required. However, it should be explained that, as reflected in the main patent scope of the following claims, each invention can be found in only a part of the features of the single disclosed embodiment. Therefore, the "patent application scope" following the "% of the practice method" is clearly defined by the "implementation method, the implementation method, the electric power * τ 兵 母 mother - 4 item itself represents a separate embodiment of this 。 。 。. Some of the embodiments described above contain certain features and do not include the features contained in the embodiments. The examples are less, and the person skilled in the art will understand that different implementations are also considered to be included in the present invention. Within the scope of the invention, and the formation of the difference between the two: 'This article will implement the Hunan-Finance A-M--T-, the four methods of the various, and &,; can be - computer system 1 (four) or by 'm ±. m,, ~ he The device of the function of the Bianbian function, the processor having the instructions for implementing the method or method, or the element of the method = set. Further, the device or system described herein实,, 70仵 is used to implement the present invention In the description provided herein, numerous specific details are set forth. However, the library understands that the implementation of the present invention may be implemented without the specific details. In order to avoid the understanding of this description, 4 well-known methods, structures and techniques have not been shown in detail. ΜIn addition to mosquitoes, this article describes the sequential adjectives -", "first", "Third" and the like merely refer to different instances of the object (5), rather than implying that the objects so described must be in a given order - regardless of order, spatial order, hierarchical order, or any other manner. In the scope of the patent application below and the description herein, any term "comprising (_,_)", "consisting of (_ρ(10)"〇" or "including (comp.)" is an open term. It is intended to include at least the elements/features that follow, but does not exclude other elements/features. Therefore, when the term "including (c(10)pdsing)" is used in the scope of the patent application, it should not be construed as limited to The device or component or step listed thereafter. For example, the expression "a device containing A and B (& deVlce comprismg A and B)" should not be limited to a device consisting only of components A and B. Any of the terms used in this article "including (mc丨uding)" or "which includes" or "including indudes" is also 31 200907727 - open language, which also means - From the elements/features that follow the 匕3, do not exclude other pieces/features. Therefore, 仁 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ~ item ==7 is said to be preferred for the present invention </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The formulas are only representative of the programs that can be used. 4 Add or remove functions from this section, and interchange the functions of each function block. 1This method adds or removes steps from the method. A specific implementation of the present month, however, those skilled in the art will understand that 'it is also possible to carry out many other forms of riding. [Simplified illustration of the drawings] The above description is by way of example only with reference to the accompanying drawings In the drawings, the /1 diagram is an unintentional illustration of a system for providing a plurality of normalized circuit diagrams for each electronic circuit having one or more electronic components according to a design goal; The data is included in the design target and the data of the normalized line $Fig. shown in the figure; and the third figure is the circuit diagram of a common gate amplifier, the design target of which is provided by the system shown in Figure 1. Main component symbol description]: System: Structured Database 2: normalizing circuit 4: Structured Database 32200907727
5 :設計目標 7:資料記錄 9 ·貢料記錄 11 :最佳化指令批次檔 14 :電路設計者 16 :結構化資料庫 1 8 ··第五資料 21 :記錄 23 : N 型 MOS ( NMOS) 25 :資料記錄 Ml : MOS電晶體 R1 :電阻器 6 :第一資料 8 :第二資料 10 :第三資料 13 :電腦終端機 15 :中央伺服器 17 :資料 19 :效能參數 電晶體共用閘極放大器 26 :圖形使用者介面 M2 :電晶體 C1 :電容器 335: Design goal 7: data record 9 · tribute record 11 : optimization instruction batch file 14 : circuit designer 16 : structured database 1 8 · · fifth data 21 : record 23 : N type MOS ( NMOS 25: Data record Ml: MOS transistor R1: Resistor 6: First data 8: Second data 10: Third data 13: Computer terminal 15: Central server 17: Data 19: Performance parameter transistor common gate Pole amplifier 26: Graphical user interface M2: Transistor C1: Capacitor 33
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2007/000237 WO2009020431A1 (en) | 2007-08-06 | 2007-08-06 | Method for adapting schematics for different manufacturing processes and different operating specifications |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200907727A true TW200907727A (en) | 2009-02-16 |
Family
ID=40341537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096131444A TW200907727A (en) | 2007-08-06 | 2007-08-24 | Method for adapting schematics for different manufacturing processes and different operating specifications |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200907727A (en) |
WO (1) | WO2009020431A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200410153A1 (en) | 2019-05-30 | 2020-12-31 | Celera, Inc. | Automated circuit generation |
CN112507538B (en) * | 2020-11-27 | 2022-11-25 | 山东航天电子技术研究所 | Design method of solid-state power controller based on field-circuit coupling |
CN112579680B (en) * | 2020-12-15 | 2024-02-06 | 北京动力机械研究所 | Data bus and data integration device and method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5111413A (en) * | 1989-03-24 | 1992-05-05 | Vantage Analysis Systems, Inc. | Computer-aided engineering |
US6980211B2 (en) * | 2002-06-04 | 2005-12-27 | Springsoft, Inc. | Automatic schematic diagram generation using topology information |
US20060150136A1 (en) * | 2004-12-21 | 2006-07-06 | John Bratt | Systems and methods for designing integrated circuits |
US7386823B2 (en) * | 2005-07-20 | 2008-06-10 | Springsoft, Inc. | Rule-based schematic diagram generator |
-
2007
- 2007-08-06 WO PCT/SG2007/000237 patent/WO2009020431A1/en active Application Filing
- 2007-08-24 TW TW096131444A patent/TW200907727A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2009020431A1 (en) | 2009-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102139425B1 (en) | Reuse of extracted layout-dependent effects for circuit design using circuit stencils | |
US12079555B2 (en) | Automated circuit generation | |
US7448003B2 (en) | Signal flow driven circuit analysis and partitioning technique | |
US20130338991A1 (en) | Integrated circuit simulation using analog power domain in analog block mixed signal | |
US20190042684A1 (en) | Schematic Driven Analog Circuit Layout Automation | |
US20090164963A1 (en) | System and method for routing connections | |
US8099270B2 (en) | Simulation model for transistors | |
KR100398850B1 (en) | Power model for emi simulation to semiconductor integrated circuit, method of designing the power model, emi simulator, and storage medium storing the same as well as power model design support system | |
US20110265051A1 (en) | Method for Substrate Noise Analysis | |
Liao et al. | An LDE-Aware g m/I D-Based Hybrid Sizing Method for Analog Integrated Circuits | |
KR20020079320A (en) | Method, apparatus and program for preparing a simulation model for semiconductor integrated circuit at power supply terminal for simulation electromagnatic interference | |
TW200907727A (en) | Method for adapting schematics for different manufacturing processes and different operating specifications | |
US8392867B2 (en) | System, method and program storage device for developing condensed netlists representative of groups of active devices in an integrated circuit and for modeling the performance of the integrated circuit based on the condensed netlists | |
US20130159958A1 (en) | Equation based transient circuit optimization | |
Hashemian | Local Biasing and the Use of Nullator‐Norator Pairs in Analog Circuits Designs | |
Hellwege et al. | An aging-aware transistor sizing tool regarding BTI and HCD degradation modes | |
US20170083638A1 (en) | Method and apparatus for providing rule patterns on grids | |
Lourenço et al. | AIDA-CMK: Multi-Algorithm Optimization Kernel Applied to Analog IC Sizing | |
Kaplan | Tools I/Design techniques: Computer-aided design: No longer a mere infant, CAD now offers more sophisticated programs with Monte Carlo computations and tolerance assignment | |
US20030195736A1 (en) | Method of storing cross-hierarchy coupling data in a hierarchical circuit model | |
Feng et al. | Algorithms for automatic model topology formulation | |
US20090024377A1 (en) | System and Method for Modeling Semiconductor Devices Using Pre-Processing | |
Ramadan | Compact Model Council's standard circuit simulator interface for reliability modeling | |
Weber et al. | Circuit Design: Anticipate, Analyze, Exploit Variations | |
US20230205971A1 (en) | Method for designing semiconductor integrated circuit, circuit design system, and control program |