TW200906609A - Electromagnetic shielding material - Google Patents

Electromagnetic shielding material Download PDF

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Publication number
TW200906609A
TW200906609A TW97117804A TW97117804A TW200906609A TW 200906609 A TW200906609 A TW 200906609A TW 97117804 A TW97117804 A TW 97117804A TW 97117804 A TW97117804 A TW 97117804A TW 200906609 A TW200906609 A TW 200906609A
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Taiwan
Prior art keywords
electromagnetic shielding
shielding material
film
paper
conductive material
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TW97117804A
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Chinese (zh)
Inventor
Jonathan Bowden
Bradlee W Gustavesen
Harold James Klei
James E Lordi
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Chase Corp
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Publication of TW200906609A publication Critical patent/TW200906609A/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07318Means for preventing undesired reading or writing from or onto record carriers by hindering electromagnetic reading or writing
    • G06K19/07327Passive means, e.g. Faraday cages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00Layered products comprising a layer of paper or cardboard

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Security & Cryptography (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

An electromagnetic shielding material includes a paper web and a conductive layer adhered to an adjacently positioned surface of the paper web. This arrangement defines a laminate structure that, when interposed between a receiving antenna of an RFID smart chip and a transmitting antenna of a signal generator, prevents the reading of the chip. A security device capable of electromagnetically shielding an RFID smart chip includes an electromagnetic shielding material having at least one conductive layer and at least one adjacently positioned substrate. A method of electromagnetically shielding an RFID smart chip includes providing and placing an electromagnetic shielding material proximate an RFID smart chip and preferably between the RFID smart chip and a transmitting antenna of an RFID signal generator.

Description

200906609 九、發明說明: 【發明所屬之技術領域】 本發明廣泛針對一種電磁不透明材料,更特別針對一 種能對可讀取電磁頻率的裝置(諸如,無線射頻識別裝置 (RFID))提供電磁遮蔽之材料。 【先前技術】 合併RFID技術的系統典型包含可使用任何合適的讀 取裝置來讀取之RFID”條(tag)”。此條包含一或多片電腦晶 片(“智慧晶片”)及允許將已編碼到智慧晶片上之訊息傳送 至讀取裝置的相關天線。因爲所使用的智慧晶片變得愈來 愈小,倂入RF ID技術的裝置(特別關於消費性產業)數目增 加。再者,因爲RFID技術對需要維持、分配及追踪庫存的 不同商業型式來說變得越來越有成本效益,RFID系統在每 天生活上變得越來越流行。 無線射頻識別技術亦逐漸使用在人們的追踪及識別 上。其成果據宣稱將RFID條倂入護照、身份證、金融卡及 通行證中,以便當人們旅行通過港口時能更有效率地幫助 其辦理事項。事實上,在機場內,即使尙未使用特別的金 融卡來購買機票,現在對即將來臨的飛行之報到已藉由在 航空自動報到亭處揮過信用卡而完成。 典型來說,RFID系統的“效率”亦伴隨著敏感訊息的弄 錯、誤用或甚至公然偷竊。當簡單地藉由在背後配置有 RFID讀取裝置之表面上搖動含智慧晶片的卡片或棒(wand) 來對金融卡帳戶進行收費時,當使用者不慎地讓其錢包或 -5- 200906609 皮夾離此表面太近時,錯誤讀取的可能性增加。同樣地, 當使用一張金融卡來授權收費時,亦可能(故意或意外地) 讀取另一張含智慧晶片的金融卡,因此對單一次購買產生 多於一次的收費。 再者’當考慮到讀取裝置的數目及於此之易受影響度 時’無恥之人可在卡片所有人不確知的情況下讀取於含智 慧晶片的卡片中之敏感訊息。例如,已熟知可在自動櫃員 機(ATM)處使用微型照相機來捕捉輸入PIN碼的人士之影 像。可類似地設置微型讀取器來捕捉已編碼到晶片上的訊 息。特別提供的是,事實上大部分人會面對ATM並打開及 觀看其錢包或皮夾,以便防止在其背後的人士看進其錢包 或皮夾裏面;但是,當吾人想要可靠地保護財產不被窺視 時’不引人注目地設置在ATM上或在其之上且經遠端操作 的讀取裝置卻能允許直接及容易地讀取未遮蔽的編碼訊 息。 所需要者爲一種允許使用者可控制地中斷或防止使用 RFID技術來讀取編碼晶片的訊息之裝置。 【發明内容】 在一個觀點中’本發明係有關一種電磁遮蔽材料。此 材料包括第一紙膜及黏附至第一紙膜(paper web)之fflth連配 置的表面之導電層。聚合膜可黏附至導電層之毗連配置的 表面。此安排定義出一積層結構,當將其插入RFID智慧晶 片的接收天線與RFID信號產生器的傳送天線之間時,其可 防止RFID智慧晶片之讀取。 -6- 200906609 在另一個觀點中,本發明係有關一種電磁遮蔽材料, 其包含% -*及第一紙膜且在其中間夾有一金屬化聚合膜而 形成一積層物。再次’當將此積層物插入RFID智慧晶片的 接收天線與RFID信號產生器的傳送天線之間時,其可防止 R F ID智慧晶片之讀取。 在另一個觀點中’本發明係有關一種呈積層形式的電 磁遮蔽材料。這些積層物爲紙、聚合膜及/或導電材料的組 合’其防止RFID智慧晶片之讀取。在此觀點中和在本發明 的全部其它觀點中,此紙可使用任何合適手段來印刷,包 括(但不限於)雷射印刷裝置、噴墨印刷機、平版印刷機、 數位印刷機、柔性版印刷機及藉由手使用手寫用具。 在又另一個觀點中’本發明係有關一種能電磁遮蔽 RFID智慧晶片的防護裝置。此防護裝置包括—電磁遮蔽材 料,其具有至少一層導電層及至少一層毗連配置的基材。 此裝置可爲包膜、支架、護套、套筒、紙片或卡片紙、壁 紙或其類似物。此裝置亦可倂入攜帶裝置中,諸如皮夾、 錢包、手提包、行李、電腦提袋、口袋防護套或其類似物。 當將電磁遮蔽材料插入RFID智慧晶片的接收天線與RFID 信號產生器的傳送天線之間時,此電磁遮蔽材料能防止 RFID智慧晶片之讀取。 在又另一個觀點中’本發明係有關一種電磁遮蔽RFID 智慧晶片的方法。在此方法中,提供一包含至少一種導電 材料的電磁遮蔽材料且將其放置在靠近RFID智慧晶片 處’較佳在RFID智慧晶片與RFID信號產生器的傳送天線 200906609 之間。藉由如此,電磁遮蔽材料可中斷、阻礙或 號產生器至R F ID智慧晶片之接收天線的R f ID信 電磁遮蔽RFID智慧晶片。 本發明的一個優點爲已編碼至可經由RFID 置(例如’ RFID智慧晶片)中之私人訊息,其沒有 之所有人的批准就無法讀取。特別是,電磁遮蔽 智慧晶片會對平面波場傳播信號之傳輸及接收造 干擾’而使讀取器查明包含在智慧晶片中的訊息 由讓此能力無效,能讓攜帶已倂入RFID智慧晶 (例如’護照、身份證、信用卡、過境卡或儲値通 品卡或其類似物)之人士能夠自信地感覺到其可 權地讀取其已編碼到裝置上之訊息的能力。沒有 明確允許無法讀取密碼或訊息。 在智慧晶片位於可由人攜帶的小型裝置(例如 形式)中之具體實例中,本發明的電磁遮蔽材料可 文書夾、套筒或能撐住具有RFID智慧晶片的裝置 產物形式。此外,或替代方案,此電磁遮蔽材料 形式且保持在智慧晶片鄰近。在任何具體實例中 文書夾、套筒或其類似物之紙可經印刷、壓花、 割' 打孔及/或以任何組態折疊。此紙亦可經塗佈 佈。提供紙的輕重量本質,大部分的紙皆合適於 發明中。在電磁材料.使用於包膜或其它文件支撐 實例中,可對其它文件支撐物之包膜倂入透明或 口以允許文件可手動讀取或沒有觸摸而觀看。 抵消從信 號,因此 讀取的裝 私人訊息 材料鄰近 成足夠的 無效。藉 片的裝置 行證、禮 阻撓未授 使用者的 ,以文件 爲包膜、 之類似紙 可爲薄片 ,包膜、 呈色、切 或未經塗 使用在本 物的具體 半透明窗 -8- 200906609 在智慧晶片位於相當大或不容易移動的裝置中之具體 實例中’本發明的電磁遮蔽材料可使用來遮蔽包裝或甚至 整個房間。特別關於電腦硬碟、電腦媒體及其它型式的電 子設備’其包裝可內襯著、塗佈以或其它方面倂入電磁遮 蔽材料。此包裝包括(但不限於)電腦機殼、碟片盒、箱子 及其類似物。其它包裝可包括鼓、手提袋、托盤包裝裝置、 貨物容器及其類似物。此電磁遮蔽材料甚至可爲壁紙或絕 緣體或其它可使用來襯裏天花板及地板的紙形式。 【實施方式】 發明之詳細說明 篸照第1圖’通常以10顯示出電磁遮蔽材料的一個具 體實例。電磁遮蔽材料10爲一 4層積層材料,其包含第一 紙膜12、聚合膜14、導電層16及第二紙膜18。第一紙膜 12、聚合膜14、導電層16及第二紙膜18每層毗連配置的 表面使用黏著劑2 0彼此黏附。 第一紙膜12及第二紙膜18二者包含纖維狀膜片材料 (fibrous web material)。在一個具體實例中,此膜片材料以 (但不限於)一或更多種天然纖維(諸如棉花)、合成纖維及/ 或再循環纖維來配製。同樣地,此些膜片材料包括合適於 提供至少某些想要的不透明度之充塡劑。可如想要般將色 素加入至第一紙膜12及第二紙膜18之一或二者。此紙亦 可爲合成或人造紙或其類似物。此紙可經塗佈或未經塗佈。 聚合膜14包括任何合適的聚合材料。可使用於聚合膜 14的典型材料包括(但不限於)聚乳酸(聚交酯(p〇ly -9- 200906609 lactide))(從玉米右旋糖(corn dextrose)製得的聚合物及已 知爲PL A)、聚酯類、聚丙烯類、前述之組合及其類似物。. 某些紙膜及聚合膜的材料描述在羅帝(Lordi)的美國專 利案號6,673,465及羅帝的美國專利案號6,926,968中’此 二者其全文於此以參考方式倂入本文。 導電層16包含任何合適的導電材料。在一個具體實例 中,導電層16包含一金屬箔,其中該箔片之厚度合適於造 成鄰近那裏的無線電訊號中斷、干擾或阻抗。金屬箔亦對 ί 電磁遮蔽材料1〇授予某些程度的不透明度。在此具體實例 中,所使用之金屬爲鋁,然而其它金屬(例如,銅、銀、鎳 及其呈元素或合金形式的類似物)亦在本發明之範圍內。使 用箔形式的金屬允許電磁遮蔽材料1 0較好地適應折疊組 態。 在另一個具體實例中,導電層16可包含已沉積到聚合 膜14及第二紙膜18之一或多個上的金屬顆粒。此金屬顆 粒可爲鋁(例如,元素鋁)、鋁合金或含鋁化合物’或它們 ί」 可包含其它金屬(例如,銅、銀、鎳及其類似物)。在仍然 另一個具體實例中’導電層16可爲金屬之編織或不織股。 在更另一個具體實例中,導電層16可包含非金屬材 料,諸如碳、負載碳的基質材料、石墨、前述之組合及其 類似物。亦可使用單壁形式或雙壁形式的碳奈米管。在使 用碳奈米管作爲導電層16的具體實例中’碳奈米管可使用 任何合適的技術(諸如,化學氣相沉積或其類似方法)沉積 以獲得精確控制的導電層厚度。 -10- 200906609 在更另一個具體實例中,黏著劑20可自身導電。在此 具體實例中,黏著劑包括在其中混合的合適導電材料。此 元素包括(但不限於)呈顆粒、粉末、微粒、小珠形式的金 屬、前述之組合及其類似物。此金屬可爲鋁(例如’元素 鋁)、鋁合金或含鋁化合物,或它們可爲其它金屬(例如’ 銅、銀、鎳及其類似物)。 使用來將第一紙膜12、聚合膜14、導電層16及第二 紙膜1 8黏附成積層形式的黏著劑2 0可爲1 0 0 %的固體黏著 f 劑。本發明不限於此觀點,如其它黏著劑亦在本發明之範 圍內。特別是,黏著劑2 0可以溶劑爲基礎、以水爲基礎、 熱熔融物、紫外光輻射可硬化、電子束可硬化、前述之組 合及其類似物。 當在積層第一紙膜12、聚合膜14、導電層16及第二 紙膜1 8時使用1 00%的固體黏著劑時’在紙膜與聚合膜間 會產生破壞性黏合(destructive bond)。破壞性黏合指爲紙 膜與聚合膜在硬化後,於T剝除黏附力試驗下,將不允許 I 在紙保持完整下讓紙膜與聚合膜分離。 當使用1 〇〇%的固體黏著劑時,此黏著劑爲低溫(在約 1 00°F的室溫下可流動)二成分黏著劑。或者,此黏著劑可 爲熱溫(在室溫下凝膠,加熱其以准許流動)單成分黏著 劑。或者,根據所使用的紙膜之黏著劑滲透性及抵抗性 (holdout)(保留黏著劑的能力)來選擇黏著劑。通常來說, 若關心紙的滲透性及抵抗性時,使用熱溫黏著劑;當滲透 性及抵抗性較少爭議時,使用低溫黏著劑。當使用1 〇〇%的 200906609 固體黏者劑時,通常使用檩準積層技術來達成積層。 ί 現在參照第2圖’通常以11〇顯示出電磁遮蔽材料的 另一個具體實例。電磁遮蔽材料11〇爲—包含第一紙膜 112、聚合膜114、導電材料116及第二紙膜U8的積層材 料。第一紙膜112及聚合膜114毗連配置且使用黏著劑12〇 彼此黏附。導電材料116滲入或其它方面倂入聚合膜I” 中以定義出一金屬化聚合膜,其因此除去將導電材料黏附 至聚合膜的需求。使用黏著齊"2〇將第二紙膜i ( 8黏附至 聚合膜1 1 4 (倂入導電材料丨丨6)。 在電磁遮蔽材料110中,第—紙膜112及第二紙膜ii8 二者包含纖維狀膜片材料(類似於先前具體實例),及聚合 膜1 1 4爲具有足夠的尺寸穩定性、收縮特徵 '平衡 '黏附 至紙膜材料的能力及耐熱性之聚酯、聚丙烯或其類似物。 但是,在電磁遮蔽材料110中之導電材料110包含呈 粉末形式的合適導電材料顆粒,諸如鋁、銅、銀、鎳、其 合金或其類似物。亦可使用非金屬材料,—諸如碳、負載碳 的基質材料、石墨、碳奈米管、前述之組自、前述與金屬 之組合及其類似物。在此具體實例中,導電材肖116可遍 及聚合膜II4均勻地分散(如顯示在第3圖中),或其可沿 著聚合膜的一個表面集中(如顯示在第4圖中 現在參照第5圖,通常以210顯示出電磁遮蔽材料的 另一個具體實例。電磁遮蔽材料210爲〜包含紙膜 聚合膜214及導電材料216的三層積層材料。導電材料 夾在紙膜2 1 2與聚合膜2 1 4中間。佃垦,+ 但疋本發明不限於此 -12- 200906609 觀點,如紙膜212或_ 料216可夾在宜它二層由戸弓 使用黏著劑來將三靥m 〃 中間。 電磁遮蔽材料21〇黏附在-起。導電 材料2 1 6可爲鋁、銅 導 載碳 繰、前述之合金、前述之細合 或其類似物。導電材料216 組口 亦可爲碳、碳奈米管、售 的基質材料、石墨、苴細a 一、 、,、〇、其與金屬之組合或其類似物 現在參照第6及7圖,、潘a 一 ^吊以310顯示出電磁遮蔽材 料的另一個具體實例。此雷 此電磁遮蔽材料31〇爲一 ^層 材料,其包含一夾在第一導雷# μ —200906609 IX. INSTRUCTIONS: TECHNICAL FIELD OF THE INVENTION The present invention is broadly directed to an electromagnetically opaque material, and more particularly to an electromagnetic shielding device capable of providing electromagnetic frequency shielding devices, such as radio frequency identification devices (RFID). material. [Prior Art] A system incorporating RFID technology typically includes an RFID "tag" that can be read using any suitable reading device. This strip contains one or more computer crystals ("Smart Wafers") and associated antennas that allow the transmission of messages encoded onto the smart wafer to the reading device. As the smart chips used have become smaller and smaller, the number of devices incorporating RF ID technology (especially with regard to the consumer industry) has increased. Furthermore, because RFID technology is becoming more cost-effective for different business types that need to maintain, distribute, and track inventory, RFID systems are becoming more popular every day. Radio frequency identification technology is also being used in people's tracking and identification. The results are claimed to include RFID tags in passports, ID cards, financial cards and passes so that people can help them more efficiently when they travel through the port. In fact, at the airport, even if you did not use a special financial card to purchase the ticket, the registration of the upcoming flight has now been completed by swiping the credit card at the airline automatic check-in kiosk. Typically, the “efficiency” of RFID systems is accompanied by mistakes, misuse, or even flagrant theft of sensitive information. When a financial card account is charged simply by shaking a card or wand containing a smart chip on the surface of the RFID reading device behind it, when the user accidentally makes his wallet or -5-200906609 When the wallet is too close to the surface, the possibility of erroneous reading increases. Similarly, when a financial card is used to authorize a charge, it is also possible (intentionally or accidentally) to read another financial card containing the smart chip, thus generating more than one charge for a single purchase. Furthermore, when considering the number of reading devices and the degree of vulnerability thereto, the shameless person can read sensitive information in the card containing the smart chip without the knowledge of the card owner. For example, images of people who can use a miniature camera at an automated teller machine (ATM) to capture an incoming PIN code are well known. A micro reader can similarly be provided to capture the information encoded onto the wafer. In particular, most people actually face the ATM and open and watch their wallets or wallets to prevent people behind them from looking into their wallets or wallets; however, when I want to reliably protect the property A read device that is unobtrusively placed on or above the ATM and remotely operated while not being peeped allows direct and easy reading of unmasked encoded messages. What is needed is a device that allows the user to controllably interrupt or prevent the use of RFID technology to read the encoded wafer. SUMMARY OF THE INVENTION In one aspect, the present invention relates to an electromagnetic shielding material. This material includes a first paper film and a conductive layer adhered to the surface of the first paper web. The polymeric film can be adhered to the adjacent surface of the conductive layer. This arrangement defines a layered structure that prevents the reading of the RFID smart chip when it is inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the RFID signal generator. -6- 200906609 In another aspect, the present invention is directed to an electromagnetic shielding material comprising % -* and a first paper film and having a metallized polymeric film interposed therebetween to form a laminate. Again, when the laminate is inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the RFID signal generator, it prevents reading of the R F ID smart chip. In another aspect, the present invention relates to an electromagnetic shielding material in the form of a laminate. These laminates are a combination of paper, polymeric film and/or conductive material that prevents the reading of RFID smart wafers. In this regard and in all other aspects of the invention, the paper may be printed using any suitable means including, but not limited to, laser printing devices, ink jet printers, lithographic printers, digital printers, flexographic plates. Printing presses and handwriting tools by hand. In yet another aspect, the present invention relates to a guard that electromagnetically shields an RFID smart wafer. The guard comprises an electromagnetic shielding material having at least one electrically conductive layer and at least one substrate in adjoining configuration. The device can be an envelope, a stent, a sheath, a sleeve, a sheet of paper or card stock, a wall paper or the like. The device can also be incorporated into a carrying device such as a wallet, wallet, handbag, luggage, computer bag, pocket cover or the like. The electromagnetic shielding material prevents reading of the RFID smart chip when the electromagnetic shielding material is inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the RFID signal generator. In yet another aspect, the present invention relates to a method of electromagnetically shielding an RFID smart wafer. In this method, an electromagnetic masking material comprising at least one electrically conductive material is provided and placed adjacent to the RFID smart chip, preferably between the RFID smart chip and the transmit antenna 200906609 of the RFID signal generator. By doing so, the electromagnetic shielding material can interrupt, block or generate the Rf ID signal to the RFID antenna of the receiving antenna of the R F ID smart chip. One advantage of the present invention is that it has been encoded into a private message that can be placed via an RFID (e.g., 'RFID Smart Wafer), which cannot be read without the approval of the owner. In particular, the electromagnetic shielding smart chip will interfere with the transmission and reception of the plane wave field propagation signal, and the reader can find out that the information contained in the smart chip is invalid, so that the portable RFID chip can be inserted. A person such as a 'passport, ID card, credit card, transit card or Chuantong card or the like) can confidently feel the ability to read the information it has encoded on the device. Passwords or messages cannot be read without explicit permission. In a specific example where the smart wafer is located in a small device (e.g., a form) that can be carried by a person, the electromagnetic shielding material of the present invention can be in the form of a clip, a sleeve, or a device product capable of holding an RFID smart wafer. In addition, or in the alternative, the electromagnetic shielding material is in the form and remains adjacent to the smart wafer. In any particular example, the paper clip, sleeve or the like may be printed, embossed, cut & punctured and/or folded in any configuration. This paper can also be coated. Providing the light weight nature of paper, most of the paper is suitable for use in the invention. In the case of electromagnetic materials, used in envelopes or other document support, the envelopes of other document supports can be cut into a transparent or mouth to allow the document to be viewed manually or without touch. Offset from the signal, so the read of the private message material adjacent is enough to be invalid. If the device is used for the purpose of permitting the device, the document is the envelope, and the similar paper may be a thin film, coated, colored, cut or uncoated. 200906609 In the specific example where the smart wafer is located in a relatively large or not easily mobile device, the electromagnetic shielding material of the present invention can be used to shield the package or even the entire room. In particular, computer hard drives, computer media, and other types of electronic devices' packages can be lined, coated, or otherwise incorporated into electromagnetic shielding materials. This package includes, but is not limited to, computer cases, disc cases, cases, and the like. Other packages may include drums, tote bags, tray packaging devices, cargo containers, and the like. This electromagnetic shielding material can even be a wallpaper or insulation or other paper form that can be used to line the ceiling and floor. [Embodiment] DETAILED DESCRIPTION OF THE INVENTION A specific example of an electromagnetic shielding material is shown generally at 10'. The electromagnetic shielding material 10 is a four-layer laminated material comprising a first paper film 12, a polymeric film 14, a conductive layer 16, and a second paper film 18. The surface of each of the first paper film 12, the polymer film 14, the conductive layer 16, and the second paper film 18 adjacent to each other is adhered to each other using the adhesive 20. Both the first paper film 12 and the second paper film 18 comprise a fibrous web material. In one embodiment, the membrane material is formulated with, but is not limited to, one or more natural fibers (such as cotton), synthetic fibers, and/or recycled fibers. As such, such membrane materials include a sputum suitable to provide at least some of the desired opacity. The colorant may be added to one or both of the first paper film 12 and the second paper film 18 as desired. The paper may also be synthetic or human paper or the like. This paper can be coated or uncoated. Polymer film 14 includes any suitable polymeric material. Typical materials that can be used for the polymeric film 14 include, but are not limited to, polylactic acid (polylactic acid (p〇ly -9-200906609 lactide)) (a polymer made from corn dextrose and known) It is PL A), polyesters, polypropylenes, combinations of the foregoing, and the like. The material of the paper film and the polymeric film is described in U.S. Patent No. 6,673,465 to the name of the entire disclosure of U.S. Patent No. 6,926,. Conductive layer 16 comprises any suitable electrically conductive material. In one embodiment, the conductive layer 16 comprises a metal foil, wherein the thickness of the foil is adapted to cause radio signal interruption, interference or impedance adjacent thereto. The metal foil also imparts some degree of opacity to the ί electromagnetic shielding material. In this embodiment, the metal used is aluminum, although other metals (e.g., copper, silver, nickel, and the like in the form of elements or alloys) are also within the scope of the invention. The use of a metal in the form of a foil allows the electromagnetic shielding material 10 to better accommodate the folded configuration. In another embodiment, conductive layer 16 can comprise metal particles that have been deposited onto one or more of polymeric film 14 and second paper film 18. The metal particles may be aluminum (e.g., elemental aluminum), aluminum alloy or aluminum-containing compound 'or they may contain other metals (e.g., copper, silver, nickel, and the like). In still another embodiment, the conductive layer 16 can be a metal woven or non-woven strand. In still another embodiment, conductive layer 16 can comprise a non-metallic material such as carbon, a carbon-loaded host material, graphite, combinations of the foregoing, and the like. Carbon nanotubes in single wall or double wall form can also be used. In a specific example in which a carbon nanotube is used as the conductive layer 16, the carbon nanotube can be deposited using any suitable technique such as chemical vapor deposition or the like to obtain a precisely controlled thickness of the conductive layer. -10- 200906609 In still another embodiment, the adhesive 20 can conduct itself. In this particular example, the adhesive includes a suitable electrically conductive material that is mixed therein. Such elements include, but are not limited to, metals in the form of granules, powders, granules, beads, combinations of the foregoing, and the like. The metal may be aluminum (e.g., 'elemental aluminum), aluminum alloy or aluminum-containing compound, or they may be other metals (e.g., 'copper, silver, nickel, and the like). The adhesive 20 used to adhere the first paper film 12, the polymer film 14, the conductive layer 16, and the second paper film 18 to a laminate form may be a solid adhesive agent of 100%. The invention is not limited to this point of view, as other adhesives are also within the scope of the invention. In particular, the adhesive 20 can be solvent based, water based, hot melt, UV radiation hardenable, electron beam hardenable, combinations of the foregoing, and the like. When 100% of the solid adhesive is used in laminating the first paper film 12, the polymer film 14, the conductive layer 16, and the second paper film 18, 'destructive bond is generated between the paper film and the polymer film. . Destructive bonding means that after the paper film and the polymeric film are hardened, under the T stripping adhesion test, I will not allow I to separate the paper film from the polymeric film while the paper remains intact. When a solid binder of 1% is used, the adhesive is a low-temperature (flowable at room temperature of about 100 °F) two-component adhesive. Alternatively, the adhesive can be a one-component adhesive that is hot (gel at room temperature, heated to permit flow). Alternatively, the adhesive may be selected depending on the adhesive permeability and holdout of the paper film to be used (the ability to retain the adhesive). Generally, if the paper is concerned with the permeability and resistance of the paper, a hot-temperature adhesive is used; when the permeability and resistance are less controversial, a low-temperature adhesive is used. When using 1%% of the 200906609 solid adhesive, the 檩-layering technique is usually used to achieve the build-up. ί Referring now to Figure 2, another specific example of an electromagnetic shielding material is shown generally at 11 inches. The electromagnetic shielding material 11 is a laminated material including the first paper film 112, the polymer film 114, the conductive material 116, and the second paper film U8. The first paper film 112 and the polymer film 114 are disposed adjacent to each other and adhere to each other using the adhesive 12〇. The conductive material 116 penetrates or otherwise penetrates into the polymeric film I" to define a metallized polymeric film that removes the need to adhere the conductive material to the polymeric film. The second paper film i is used ("adhesive" 8 adheres to the polymeric film 1 1 4 (into the conductive material 丨丨 6). In the electromagnetic shielding material 110, both the first paper film 112 and the second paper film ii8 comprise a fibrous film material (similar to the previous specific example) And the polymeric film 141 is a polyester, polypropylene or the like having sufficient dimensional stability, shrinking characteristics to 'balance' the ability to adhere to the paper film material and heat resistance. However, in the electromagnetic shielding material 110 The electrically conductive material 110 comprises particles of suitable electrically conductive material in the form of a powder, such as aluminum, copper, silver, nickel, alloys thereof or the like. Non-metallic materials such as carbon, carbon-loaded matrix materials, graphite, carbon may also be used. a nanotube, a combination of the foregoing, a combination of the foregoing with a metal, and the like. In this embodiment, the conductive material shawl 116 may be uniformly dispersed throughout the polymeric film II4 (as shown in FIG. 3), or it may be Along the aggregation One surface of the film is concentrated (as shown in Fig. 4, now referring to Fig. 5, another specific example of an electromagnetic shielding material is generally shown at 210. The electromagnetic shielding material 210 is a film comprising a paper film polymeric film 214 and a conductive material 216. A three-layer laminate material. The conductive material is sandwiched between the paper film 2 1 2 and the polymer film 2 1 4 . 佃垦, + 疋 疋 疋 疋 -12 -12 -12 -12 -12-12 200906609, such as paper film 212 or 216 can be sandwiched It should be used in the second layer by the yoke bow to use the adhesive to make the middle of the 靥m 〃. The electromagnetic shielding material 21 〇 is adhered to. The conductive material 2 16 can be aluminum, copper-conducting carbon 缲, the aforementioned alloy, the aforementioned fine Or the like. The conductive material 216 can also be carbon, carbon nanotubes, sold matrix materials, graphite, ruthenium a, ,, ruthenium, its combination with metals or the like. 6 and 7 are shown in Fig. 6 and Fig. 1 and Fig. 31 shows another specific example of the electromagnetic shielding material. The electromagnetic shielding material 31 is a layer of material, which comprises a sandwiched first guiding device #μ-

導電材枓316與第二導電材料317 中間的聚合膜314。在電磁遮蔽材料31G巾,第—導電材 料川及第二導電材料317 :者爲鋁箱。但是,本發明不 限於此觀點’如製造第—導電材料3 Μ及第二導電材料317 二者之材料可爲呈粉末形式的任何導電材料,諸如鋁銅、 銀、鎳、其合金或其類似物。亦可使用非金屬材料,諸如 碳、負載碳的基質材料、石墨、碳奈米管、前述之組合及 其類似物。在電磁遮蔽材料310中,第—導電材料316及 第二導電材料317二者可黏附至聚合膜”4之相對表面(如 顯示在第6圖中),或它們可直接倂入聚合膜中且實質上沿 著其面對的表面集中(如顯示在第7圖中)。 現在參照第8圖,通常以40顯示出rfid幅射的電磁 遮蔽材料10之遮蔽效用。雖然此電磁遮蔽材料顯示出如爲 4層積層材料(包含聚合膜及覆盖在紙膜中的導電層),本發 明不限於此觀點,如可使用於本文所揭示的任何其它電磁 遮蔽材料與所指示之裝置。 爲了提供有效的遮蔽’將電磁遮蔽材料10插入傳送天 -13- 200906609 線4 2與接收天線4 4間。信號產生器4 6在分立頻率下輸出 未模組化的正弦RF信號進入功率放大器4 8中。信號產生 器46在輸入功率放大器48中具有預定振幅的分立頻率 (13.56 MHz)下且經由傳送天線42增幅。所產生的平面波 信號場傳播進入電磁遮蔽材料中。依倂入電磁遮蔽材料 1 0的裝置之精確組態而定,所傳播的信號不由接附至RF ID 接收部分50(其包含設置在晶片中的前置放大器52及分析 器54)之接收天線44接收較佳。 現在參照第9及10圖,通常以60顯示出倂入本發明 之電磁遮蔽材料10的防護裝置。在第9圖中,此防護裝置 60可爲包膜(例如,安全郵件包膜、完成郵件處理器 (fulfillment mailer)或其類似物)、保護套筒、護套 '支摟 物、壁紙、RFID機器可掃描的卡片(例如,金融卡、過境 卡、電話卡或其類似物)、醫療包裝或其類似物。當此防護 裝置6 0爲包膜、保護套筒、支撐物等等時,其可從經切割、 折疊及合適地膠合的電磁遮蔽材料10片來製造。 除了電磁遮蔽材料1 0外,此防護裝置包括毗連配置的 基材62。此基材62可爲包含或遮蔽RFID系統的智慧晶片 66之包膜、套筒、護套、支撐物、壁紙或其類似物的紙、 硬紙板、聚合物或其它材料。當此防護裝置60爲壁紙時, 此壁紙可以乙烯基塑膠或其類似物裱褙。 在另一個具體實例中(如顯示在第10圖),此基材62 可爲直接合倂RFID系統的智慧晶片66之RFID機器可掃 描的卡片或其類似物。在任何具體實例中,此基材62可倂 -14- 200906609 入另一個物件70的結構中。此物件70可爲皮夾、錢包、 手提包、口袋防護套、織物物件、手提箱或電腦包。此物 件70亦可爲房間或整體建築物。亦在任何具體實例中的 是,電磁遮蔽材料10鄰近智慧晶片66提供智慧晶片有效 的遮蔽。 實例:電磁遮蔽材料架構及效用 建構及測試多種紙膜材料、聚合膜及金屬(呈箔形式或 倂入聚合膜中)安排之遮蔽效用。 樣品 架構 金屬厚度 (英吋) 使用手握式讀取器/ 偵測器讀取(可讀取/ 不可讀取) 根據IEEE-299遮蔽 效用讀取(分貝) (13.56MHz測試頻 率) 1 紙/薄膜/紙(3層) 可讀取 未測試 2 紙/塗佈A1的薄膜(2層) 3M0·7 可讀取 未測試 3 紙/A1箔/薄膜/紙(4層) 3.5X104 不可讀取 43 4 紙/A1箔/薄膜(3層) lxlO3 不可讀取 48.67 5 A1箔/薄膜/A1箔(3層) 3_5χ1〇-4, 3.5x10" 不可讀取 61 6 紙/Cu箔/薄膜(3層) 7χ1〇-4 不可讀取 43 雖然本發明已經顯示及描述出其相關的詳細具體實 例’但將由熟習該項技術者了解的是可製得多種改變且可 以同等物取代其元件而沒有離開本發明之範圍。此外,可 製得改質以讓特別的狀況或材料適應本發明之教導而沒有 離開其基本範圍。因此’想要本發明不由在上述詳細說明 中所揭示之特別具體實例所限制,而是本發明將包括落在 所附加的申請專利範圍之範圍內的全部具體實例。 【圖式簡單說明】 -15- 200906609 第1圖爲本發明之電磁遮蔽材料的分解立體圖式。 第2圖爲本發明之電磁遮蔽材料的另一個具體實例之 分解立體圖式。 第3圖爲第2圖之電磁遮蔽材料的另一個具體實例之 側截面圖。 第4圖爲第2圖之電磁遮蔽材料的另一個具體實例之 側截面圖。 第5圖爲本發明之電磁遮蔽材料的另一個具體實例之 乂體圖式。 第ό圖爲一聚合膜夾在導電材料層中間的3層電磁遮 $材料之側視圖。 第7圖爲第6圖之電fe遮蔽材料的側視圖,其中導電 #料倂入聚合膜的相反表面中以形成三β。 第8圖爲本發明之電磁遮蔽材料的RFID讀取之圖式表A polymeric film 314 intermediate the conductive material 316 and the second conductive material 317. In the electromagnetic shielding material 31G, the first conductive material and the second conductive material 317 are aluminum cases. However, the present invention is not limited thereto. The material such as the first conductive material 3 Μ and the second conductive material 317 may be any conductive material in the form of a powder such as aluminum copper, silver, nickel, an alloy thereof or the like. Things. Non-metallic materials such as carbon, carbon-loaded matrix materials, graphite, carbon nanotubes, combinations of the foregoing, and the like can also be used. In the electromagnetic shielding material 310, both the first conductive material 316 and the second conductive material 317 may adhere to the opposite surfaces of the polymeric film "4" (as shown in FIG. 6), or they may be directly immersed in the polymeric film and The surface is substantially concentrated along its face (as shown in Figure 7). Referring now to Figure 8, the shielding effect of the rfid-radiated electromagnetic shielding material 10 is generally shown at 40. Although the electromagnetic shielding material is shown In the case of a 4-layer laminate material comprising a polymeric film and a conductive layer overlying the paper film, the invention is not limited thereto, as may be used with any of the other electromagnetic shielding materials disclosed herein and the device indicated. The shielding 'inserts the electromagnetic shielding material 10 into the transmission day-13-200906609 line 4 2 and the receiving antenna 44. The signal generator 46 outputs the unmodulated sinusoidal RF signal into the power amplifier 48 at a discrete frequency. The signal generator 46 is amplified at a discrete frequency (13.56 MHz) having a predetermined amplitude in the input power amplifier 48 and amplified via the transmitting antenna 42. The generated plane wave signal field propagates into the electromagnetic shielding material. Depending on the precise configuration of the device that is inserted into the electromagnetic shielding material 10, the propagated signal is not received by the RF ID receiving portion 50 (which includes the preamplifier 52 and the analyzer 54 disposed in the wafer). Antenna 44 is preferably received. Referring now to Figures 9 and 10, a guard that breaks into the electromagnetic shielding material 10 of the present invention is generally shown at 60. In Figure 9, the guard 60 can be an envelope (e.g., secure). Mail envelope, fulfillment mailer or the like), protective sleeve, sheath 'support, wallpaper, RFID machine scanable card (eg, financial card, transit card, calling card or the like) When the protective device 60 is a film, a protective sleeve, a support or the like, it can be manufactured from 10 pieces of electromagnetic shielding material which are cut, folded and suitably glued. In addition to the electromagnetic shielding material 10, the guard includes a substrate 62 that is contiguously disposed. The substrate 62 can be a cover, sleeve, sheath, support, wallpaper, or the like of the smart wafer 66 that contains or shields the RFID system. Analog paper , cardboard, polymer or other material. When the guard 60 is a wallpaper, the wallpaper may be vinyl or the like. In another embodiment (as shown in Figure 10), the substrate 62 The RFID machine scanable card or the like of the smart wafer 66 of the RFID system can be directly incorporated. In any particular example, the substrate 62 can be incorporated into the structure of another article 70. 70 can be a wallet, wallet, handbag, pocket cover, fabric item, suitcase or computer bag. This item 70 can also be a room or an integral building. Also in any particular example, the electromagnetic shielding material 10 is adjacent The smart wafer 66 provides effective masking of the smart wafer. Example: Electromagnetic Masking Material Architecture and Utility Construct and test the shielding effectiveness of a variety of paper film materials, polymeric films and metals (in foil form or into polymeric films). Sample Structure Metal Thickness (English) Read with Handheld Reader / Detector (Read/Unreadable) Read according to IEEE-299 Shielding Utility (dB) (13.56MHz test frequency) 1 Paper / Film/Paper (3 layers) Read untested 2 paper/coated A1 film (2 layers) 3M0·7 Readable untested 3 paper/A1 foil/film/paper (4 layers) 3.5X104 Unreadable 43 4 Paper/A1 foil/film (3 layers) lxlO3 Unreadable 48.67 5 A1 foil/film/A1 foil (3 layers) 3_5χ1〇-4, 3.5x10" Unreadable 61 6 paper/Cu foil/film (3 Layer) 7χ1〇-4 Unreadable 43 Although the present invention has shown and described its detailed detailed examples, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted without leaving. The scope of the invention. In addition, modifications may be made to adapt a particular condition or material to the teachings of the invention without departing from the basic scope. Therefore, it is intended that the invention not be limited to the specific embodiments disclosed herein BRIEF DESCRIPTION OF THE DRAWINGS -15- 200906609 Fig. 1 is an exploded perspective view of the electromagnetic shielding material of the present invention. Fig. 2 is an exploded perspective view showing another specific example of the electromagnetic shielding material of the present invention. Fig. 3 is a side sectional view showing another specific example of the electromagnetic shielding material of Fig. 2. Fig. 4 is a side sectional view showing another specific example of the electromagnetic shielding material of Fig. 2. Fig. 5 is a perspective view showing another embodiment of the electromagnetic shielding material of the present invention. The figure is a side view of a three-layer electromagnetic shielding material sandwiched between layers of a conductive material. Figure 7 is a side elevational view of the electrical fe masking material of Figure 6, wherein the conductive material is drawn into the opposite surface of the polymeric film to form a triple beta. Figure 8 is a diagram of the RFID reading of the electromagnetic shielding material of the present invention.

的裝置之另一 第10圖爲倂入本發明之電磁趫蔽材料 個具體實例的圖式表示。 【主要元件符號說明】 ^,110,210,310 電磁遮蔽材料 ^,112 ^,114,214,314 1 6 第一紙膜 聚合膜 導電層 -16- 200906609 18,118 20,120 40 42 44 46 48 50 r 52 54 60 62 66 70 116,216 212 316 3 17 第二紙膜 黏著劑 RFID輻射的電磁遮蔽材料之遮蔽效用 傳送天線 接收天線 信號產生器 功率放大器 R FID接收部分 前置放大器 分析器 防護裝置 基材 智慧晶片 物件 導電材料 紙膜 第一導電材料 第二導電材料 -17-Another Fig. 10 is a schematic representation of a specific example of the electromagnetic shielding material of the present invention. [Main component symbol description] ^,110,210,310 Electromagnetic shielding material ^,112 ^,114,214,314 1 6 First paper film polymeric film conductive layer-16- 200906609 18,118 20,120 40 42 44 46 48 50 r 52 54 60 62 66 70 116,216 212 316 3 17 Second paper film adhesive RFID shielding electromagnetic shielding material shielding effect transmitting antenna receiving antenna signal generator power amplifier R FID receiving part preamplifier analyzer protective device substrate wisdom wafer object conductive material paper film first conductive material Second conductive material-17-

Claims (1)

200906609 十、申請專利範圍: 1. 一種電磁遮蔽材料,其包含: 一第一紙膜;及 一導電層,其黏附至該第一紙膜之毗連配置的表面。 2 ·如申請專利範圍第1項之電磁遮蔽材料,更包括將一聚 合膜黏附至該導電層之毗連配置的表面; 其中該第一紙膜、該導電層及該聚合膜形成一積層物 ’當將其插入RFID智慧晶片的接收天線與rfID信號產 生器的傳送天線之間時,能防止該RFID智慧晶片之讀取 〇 3 ·如申請專利範圍第2項之電磁遮蔽材料,更包含一黏著 劑’其使用來將該導電層黏附至該第一紙膜及將該聚合 膜黏附至該導電層。 4.如申請專利範圍第3項之電磁遮蔽材料,其中該黏著劑 選自於由下列所組成之群· 1 0 0 %的固體黏著劑、以溶劑 爲基礎的黏著劑、以水爲基礎的黏著劑、熱溶融物黏著 劑、紫外光輻射可硬化的黏著劑、電子束可硬化的黏著 劑及前述之組合。 5 .如申請專利範圍第3項之電磁遮蔽材料,其中該黏著劑 包含導電材料。 6 .如申請專利範圍第1項之電磁遮蔽材料,其中該第—紙 膜包含一選自於由下列所組成之群的纖維狀膜片材料: 天然纖維、合成纖維及再循環纖維。 7.如申請專利範圍第2項之電磁遮蔽材料,其中該聚合膜 -18- 200906609 包含一選自於由下列所組成之群的材料:聚乳酸、聚酯 、聚丙烯及前述之組合。 8. 如申請專利範圍第1項之電磁遮蔽材料,其中該導電層 包含一選自於由下列所組成之群的材料:金屬箔、金屬 顆粒、碳、碳奈米管及前述之組合。 9. 如申請專利範圍第8項之電磁遮蔽材料,其中該金屬箔 及該金屬顆粒之至少一種的金屬選自於由下列所組成之 群:鋁、銅、銀、鎳、前述之合金及前述之組合。 f 10.如申請專利範圍第2項之電磁遮蔽材料,更包含一配置 在該聚合膜之毗連配置的表面上之第二紙膜。 11. 一種電磁遮蔽材料,其包含: 一第一紙膜; 一金屬化聚合膜,其黏附至該第一紙膜之毗連配置的 表面;及 一第二紙膜,其黏附至該金屬化聚合膜之毗連配置的 表面; ί, 其中該第—紙膜、該金屬化聚合膜及該第二紙膜形成 一積層物,當將其插入RFID智慧晶片的接收天線與RFID 信號產生器的傳送天線之間時,能防止該RFID智慧晶片 之讀取。 i 2 .如申請專利範圍第1 1項之電磁遮蔽材料,其中該金屬化 聚合膜使用一黏著劑黏附至該第一紙膜及該第二紙膜。 13.如申請專利範圍第11項之電磁遮蔽材料,其中該黏著劑 係導電。 200906609 14. 如申請專利範圍第11項之電磁遮蔽材料,宜Λ /、甲該金屬化 聚合膜包含已滲入聚合膜中的導電材料_ &。 15. 如申請專利範圍第12項之電磁遮蔽材料,宜 〜平該導電材 料顆粒選自於由下列所組成之群:鋁、_ 规、鎳、前 述之合金及前述之組合。 16. —種電磁遮蔽材料,其包含: 一紙膜; 一聚合膜;及 f 一夾在該紙膜與該聚合膜中間之導電材料; 其中該紙膜、該聚合膜及該導電材料形成 價層物, 當將其插入RFID智慧晶片的接收天線與rFid _ & 號產生 器的傳送天線之間時,能防止該RFID智慧晶片 h <讀取。 1 7 ·如申請專利範圍第1 6項之電磁遮蔽材料,更包枯 _ _ 匕垴一黏著 劑,其使用來將該紙膜、該聚合膜及該導電材挝叫— 粘附在 一起。 1 8 ·如申請專利範圍第1 7項之電磁遮蔽材料,其中該黏著;气 ί 包含導電材料。 19_如申請專利範圍第16項之電磁遮蔽材料,其中該導電材 料選自於由下列所組成之群:鋁、銅、銀、鎳、前述之 合金及前述之組合。 20.—種電磁遮蔽材料,其包含·· 一第一導電材料; 一第一導電材料;及 一夾在該第一導電材料與該第二導電材料中間的聚合 -20- 200906609 膜; 其中該第一導電材料、該第二導電材料及該聚合膜形 成積層物’當將其插入RFID智慧晶片的接收天線與 RFID iS號產生器的傳送天線之間時,能防止該RFID智 慧晶片之讀取。 2 1.如申g靑專利範圍第2〇項之電磁遮蔽材料,其中該第一導 電材料與該第二導電材料之至少一種選自於由下列所組 成之群:鋁、銅、銀 '鎳、其合金及前述之組合。 (22 _如申請專利範圍第20項之電磁遮蔽材料,其泞該第一導 電材料與該第二導電材料之至少一種選自於由下列所組 成之群:碳、負載碳的基質材料、石墨、碳奈米管及前 述之組合。 23·如申請專利範圍第20項之電磁遮蔽材料,其中該第一導 電材料與該第二導電材料之至少一種黏附至該聚合膜。 24·如申請專利範圍第20項之電磁遮蔽材料,其中該第一導 電材料與該第二導電材料之至少一種倂入該聚合膜表面 〇 。 2 5 ·—種能電磁遮蔽RFID智慧晶片的防護裝置,該防護裝置 包含: 〜具有至少一層導電層的電磁遮蔽材料;及 至少一個毗連配置的基材; 其中當該電磁遮蔽材料插入該RFID智慧晶片的接收 天線與RFID信號產生器的傳送天線之間時,該電磁遮蔽 材料能防止該RFID智慧晶片之讀取。 -21- 200906609 26. 如申請專利範圍第25項之防護裝置’更包含一選自於由 下列所組成之群的非導電層:紙、聚合物及前述之組合 〇 27. 如申請專利範圍第25項之防護裝置,其中該至少一層導 電層包含一選自於由下列所組成之群的材料:鋁、銅、 銀、鎳、其合金、碳、負載碳的基質材料、石墨、碳奈 米管及前述之組合。 2 8 ·如申請專利範圍第2 5項之防護裝置,其中該至少一個毗 ( 連配置的基材爲可嵌入該RFID智慧晶片之包膜、套筒、 護套、支撐物或文書夾的紙。 29.如申請專利範圍第25項之防護裝置,其中該至少一個毗 連配置的基材爲壁紙。 3 0 .如申請專利範圍第2 5項之防護裝置,其中該基材合倂至 皮夾、錢包、手提包、口袋防護套、物件織物、手提箱 或電腦包之結構中。 3 1.—種電磁遮蔽RFID智慧晶片的方法,該方法包括步驟: (; 提供一包含至少一種導電材料的電磁遮蔽材料; 將該電磁遮蔽材料放置在鄰近RFID智慧晶片處;及 將該電磁遮蔽材料插入該RFID智慧晶片與RFID信號 產生器的傳送天線之間。 32.如申請專利範圍第31項之方法,其中該電磁遮蔽材料包 含一積層物,其更包含至少一層紙膜及至少一層聚合膜 〇 3 3.如申請專利範圍第31項之方法,其中該提供電磁遮蔽材 -22- 200906609 料的步驟包括將該電磁遮蔽材料倂入一使用來包含一包 含該RFID智慧晶片的文件之裝置中。 3 4 .如申請專利範圍第3 3項之方法,其中該使用來包含文件 的裝置選自於由下列所組成之群:包膜、保護套筒、文 書夾、皮夾、錢包、手提袋及房間。 $ -23-200906609 X. Patent Application Range: 1. An electromagnetic shielding material comprising: a first paper film; and a conductive layer adhered to the adjacent surface of the first paper film. 2. The electromagnetic shielding material of claim 1, further comprising: adhering a polymeric film to a surface of the conductive layer adjacent to the configuration; wherein the first paper film, the conductive layer and the polymeric film form a laminate] When it is inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the rfID signal generator, the reading of the RFID smart chip can be prevented. 3. The electromagnetic shielding material of the second application of the patent scope includes an adhesive. The agent 'is used to adhere the conductive layer to the first paper film and to adhere the polymeric film to the conductive layer. 4. The electromagnetic shielding material of claim 3, wherein the adhesive is selected from the group consisting of: 100% solid adhesive, solvent based adhesive, water based Adhesives, hot melt adhesives, UV radiation hardenable adhesives, electron beam hardenable adhesives, and combinations of the foregoing. 5. The electromagnetic shielding material of claim 3, wherein the adhesive comprises a conductive material. 6. The electromagnetic shielding material of claim 1, wherein the first paper film comprises a fibrous film material selected from the group consisting of natural fibers, synthetic fibers, and recycled fibers. 7. The electromagnetic shielding material of claim 2, wherein the polymeric film -18-200906609 comprises a material selected from the group consisting of polylactic acid, polyester, polypropylene, and combinations thereof. 8. The electromagnetic shielding material of claim 1, wherein the electrically conductive layer comprises a material selected from the group consisting of metal foil, metal particles, carbon, carbon nanotubes, and combinations thereof. 9. The electromagnetic shielding material of claim 8, wherein the metal foil and the metal of at least one of the metal particles are selected from the group consisting of aluminum, copper, silver, nickel, alloys, and the foregoing The combination. f 10. The electromagnetic shielding material of claim 2, further comprising a second paper film disposed on a surface of the polymeric film adjacent to the configuration. 11. An electromagnetic shielding material comprising: a first paper film; a metalized polymeric film adhered to an adjacent surface of the first paper film; and a second paper film adhered to the metallized polymerization a surface of the film adjacent to the surface; ί, wherein the first paper film, the metallized polymer film, and the second paper film form a laminate, when inserted into a receiving antenna of the RFID smart chip and a transmitting antenna of the RFID signal generator In the meantime, the reading of the RFID smart chip can be prevented. The electromagnetic shielding material of claim 11, wherein the metalized polymeric film is adhered to the first paper film and the second paper film using an adhesive. 13. The electromagnetic shielding material of claim 11, wherein the adhesive is electrically conductive. 200906609 14. As in the electromagnetic shielding material of claim 11 of the patent scope, the metallized polymeric film comprises a conductive material _ & which has penetrated into the polymeric film. 15. The electromagnetic shielding material of claim 12, wherein the conductive material particles are selected from the group consisting of aluminum, _ gauge, nickel, the foregoing alloys, and combinations thereof. 16. An electromagnetic shielding material comprising: a paper film; a polymeric film; and f a conductive material sandwiched between the paper film and the polymeric film; wherein the paper film, the polymeric film, and the conductive material form a price The layer, when inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the rFid_ & generator, can prevent the RFID smart chip h < reading. 1 7 · If the electromagnetic shielding material of claim 16 is applied, the adhesive _ _ _ an adhesive is used to adhere the paper film, the polymeric film and the conductive material together. 1 8 · The electromagnetic shielding material of claim 17 of the patent application, wherein the adhesive; the gas ί comprises a conductive material. The electromagnetic shielding material of claim 16, wherein the electrically conductive material is selected from the group consisting of aluminum, copper, silver, nickel, alloys of the foregoing, and combinations of the foregoing. 20. An electromagnetic shielding material comprising: a first conductive material; a first conductive material; and a polymerization -20-200906609 film sandwiched between the first conductive material and the second conductive material; The first conductive material, the second conductive material, and the polymeric film form a laminate. When inserted between the receiving antenna of the RFID smart chip and the transmitting antenna of the RFID iS generator, the RFID smart chip can be prevented from being read. . 2. The electromagnetic shielding material of claim 2, wherein at least one of the first conductive material and the second conductive material is selected from the group consisting of aluminum, copper, silver 'nickel , its alloys and combinations of the foregoing. (22) The electromagnetic shielding material of claim 20, wherein at least one of the first conductive material and the second conductive material is selected from the group consisting of carbon, a carbon-loaded matrix material, and graphite The carbon shielding tube and the combination of the foregoing. The electromagnetic shielding material according to claim 20, wherein at least one of the first conductive material and the second conductive material adheres to the polymeric film. The electromagnetic shielding material of claim 20, wherein at least one of the first conductive material and the second conductive material breaks into a surface of the polymeric film. 2 5 - a protective device capable of electromagnetically shielding an RFID smart chip, the protective device The method includes: an electromagnetic shielding material having at least one conductive layer; and at least one substrate in an adjacent configuration; wherein the electromagnetic shielding material is inserted between a receiving antenna of the RFID smart chip and a transmitting antenna of the RFID signal generator, the electromagnetic The masking material can prevent the reading of the RFID smart chip. -21- 200906609 26. The protective device of claim 25 of the patent scope includes one more The non-conductive layer of the group consisting of: a paper, a polymer, and a combination of the foregoing. The protective device of claim 25, wherein the at least one conductive layer comprises one selected from the group consisting of Materials of the group: aluminum, copper, silver, nickel, alloys thereof, carbon, carbon-loaded matrix materials, graphite, carbon nanotubes, and combinations thereof. 2 8 · The protective device of claim 25, Wherein the at least one contiguous substrate is a paper that can be embedded in the envelope, sleeve, sheath, support or paper clip of the RFID smart chip. 29. The protective device of claim 25, wherein The substrate of the at least one contiguous configuration is a wallpaper. The protective device of claim 25, wherein the substrate is combined to a wallet, wallet, handbag, pocket cover, article fabric, suitcase Or in the structure of a computer bag. 3 1. A method for electromagnetically shielding an RFID smart chip, the method comprising the steps of: (providing: providing an electromagnetic shielding material comprising at least one conductive material; placing the electromagnetic shielding material Adjacent to the RFID smart chip; and inserting the electromagnetic shielding material between the RFID smart chip and the transmitting antenna of the RFID signal generator. The method of claim 31, wherein the electromagnetic shielding material comprises a laminate, The method further comprises at least one layer of paper film and at least one layer of polymeric film 〇3. 3. The method of claim 31, wherein the step of providing the electromagnetic shielding material-22-200906609 comprises injecting the electromagnetic shielding material into a use. A device comprising a file of the RFID smart chip. The method of claim 3, wherein the device for containing the file is selected from the group consisting of: a film, a protective cover Cartridges, paper clips, wallets, wallets, handbags and rooms. $ -23-
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