200905968 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種微帶分段可變衰減器，尤其涉及一種可用於各種 微波電路的微帶分段可變衰減器。它適合與通信、雷達、測試等領域。 【先前技術】 在電子部件家族裏，可變衰減器是電路和系統中常用的基本部件 之一。可變衰減器的存在，使電路製作和系統的調試變得更加靈活， 方便。在幾百MHz以下的電路和系統中，可變衰減器已得到廣泛地 應用。如在微波電路系統中，用於測試，調節電平，增加隔離等等。 可是當使用頻率在較高頻帶時，現有結構由接觸簧片，滑塊，絲杆等 製成的立體結構的可變衰減器，其寄生參數大，高頻特性較差。 取疋尽甲睛人於2004年10月13日和2〇〇6年n月n日分別提 交了關於可_各種及微波電路的可變衰減器的專利巾請，專利200905968 IX. INSTRUCTIONS: FIELD OF THE INVENTION The present invention relates to a microstrip segmented variable attenuator, and more particularly to a microstrip segmented variable attenuator that can be used in various microwave circuits. It is suitable for communication, radar, testing and other fields. [Prior Art] In the family of electronic components, variable attenuators are one of the basic components commonly used in circuits and systems. The presence of variable attenuators makes circuit fabrication and system debugging more flexible and convenient. Variable attenuators have been widely used in circuits and systems below a few hundred MHz. As in microwave circuit systems, for testing, adjusting levels, increasing isolation, and more. However, when the frequency of use is in a higher frequency band, the variable attenuator of the three-dimensional structure in which the existing structure is made of a contact spring, a slider, a screw, or the like has a large parasitic parameter and a low frequency characteristic. The patented person, the patent, on the variable attenuators of various microwave circuits can be submitted on October 13th, 2004 and the second day of the second month of the year.
號分卿ZL2_〇〇5驗9和2_贿24 3;台灣專利號:職〇6 和脱侧，發明名稱分別為可變衰減器和微帶可變衰減器，在該專 利域甲公開了-種可變衰減器，其可用於高頻及微波電路，其包括 紐，其特徵在於㈣包括位於該絲上财―則電_連制 ==阻兩端的輸入端和輸出端;該第一膜片電阻的兩端還分 ^與第二則铜-黻細__— ^第四膜片電阻的另一端分別與第二膜片電阻的-端相^ 第二则驗辦1與舰她銳接；柯難絲观括能分 5 200905968 別與第-膜片電畔第二膜片電_電接觸並分別用來改變第一膜片 電阻、。第二膜片電阻的阻抗大小的第—導電片和第二導電片；該可變 衰減器還包括絕緣物，該第一_、第二_固定在絕緣物上。 μ然而上述的可變衰減器只能在給定的範圍内對輯器進行連續調 即，而在實際應用的場合中有時也會有只需使用幾個固定衰減器值的 辆，而此時若採用上述的可變衰減器則卿起來比較費時，而且比 較難控制得到所需的衰減器值。 另外，現有的分段衰減器，它是採用將阻性材料推離主回路秘路 的方式’即先開路’然後触路的方式，這樣做的問題是，將該分段 农減器接入主回路時，在推_性材料的一瞬間，主回路處於開路狀 、'衰減器的輸讀齢號的反射係數會很大，理論上最壞時是全反 射，會對主回路造成很大的問題，將這樣的分段衰減器接入系統時， 經常會燒壞系統。 【發明内容】 κ本發明所魏決的技躺題在概供—齡段定量可觸微帶分 4可變衣減器’其應用在只需改變幾個固定衰減量的場合中時，調節 更體積小、接入系、統容易、不會對,系統造成衝擊、精度高。 慨為解決上述技術問題，本發日月所採用的技術方案是：提供一種微 心段可變衰減器’其包括：基體、共同接細、信號輸入端、信號 ’其特徵在於··所述微帶分段可變衰減|§還包括在所絲體上 的至少-個無翻絲減I!，所述無测絲減觸齡號端通過信 200905968 號微帶線辨聯’树獅成__定衰減獅兩信號端分別與所 述信號輸入端和信號輸出端相連接，所述的各無麵定衰減器的接地 端分別與共同接_相接地，所述微帶分段可變衰減器還包括至少一 控制所述無源固定衰減器的兩信號端連接以鑛述無源固定衰減器短 路的導電#賴來移舰導電錄置嘯動開關。 上述技術方案的進一步改進在於:該微帶分段可變衰減器可製作 在同軸連接ϋ内’該撥動開關製作在該同軸連接器的外部。 所述基體可岐乡絲體’所述無麵綠顧製作在基體的表 層或内層’所述導電片和所述撥動開關製作在基體的表層，所述無源 固定衰減器的兩信號端連接到所述導電片所在基體的表層。 在與導電片相接觸的所述基體的另外一表面有一個絕緣襯片或絕 緣概底。 該無賴疋衰減$也可以是具冑溫度補償功麟無测定衰減 器。 為解決上述技術問題’本發明所採用的另一技術方案是：提供一 種微帶分段可變衰減器，其包括：基體、共同接_、信號輸入端、 信號輸出端，其特徵在於：所述微帶分段可變衰減器還包括在所述基 體上的至少一個無源固定衰減器，所述無源固定衰減器的兩信號端通 過^號微帶線相串聯’相串聯形成的串聯無源固定衰減器的兩信號端 分別與所述信號輸入端和信號輸出端相連接，所述的各無源固定衰減 器的接地端分別與共同接地端相接地’所述微帶分段可變衰減器還包 200905968 括至少-控制所述無源固定衰減器的兩信號端連接以使所述無源固定 衰減器短路的電控開關。 上述技術方案的進-步改進在於：所述電控開關位於所述基體的 表層或_ ’所移她_定與職電細義於所述基體 的同-層或不同層，若所述電控開關與所述無源固定衰減器不同層， 則所述無源固定衰減器的兩端連接到所述電控開關所在的層。 —测定衰減ϋ也可以是具有溫麵償功能的無_定衰減 器。 本發明的有纽絲：纟於本發嘱微帶分段可錄減器具有一 個或多個無麵定衰·，通過導電片或電控開關將所述無测定衰 減器分段無效掉，從而實職較段可魏減辟減量齡段定量可 調，不會對被接入系統產生開路衝擊。將微帶分段可變衰減器與連接 器相結合，將該微帶分段可變衰減器製作在連接器内，大大降低了製 作成林體積；另外，由於本發明的微帶分段可變衰減獅多個無源 固定衰減器可以位於所述基體的不同層，因此可大大節省固定衰減器 所佔用的電路板面積和實現衰減器量均勻分段調節；導電片是與無源 固定衰減器的埠相連接’而不與微細特殊材料製成的無源固定衰減器 直接摩擦接觸，從而提高了器件的可靠性。 因此本發明具有以下優點： a.不會發生開路狀態，可避免接入系統時，對系統產生的反射衝 200905968 b.可製作在連接器内，使用方便，體積小，成本低。 、C·短路片與無源固定衰減器可製作在不同層，可減小體積，還可 避免導電片與無源固定衰減器阻抗材料的直接摩擦。 d由於可以是多層分段式可調，在相同的調節範圍内，本發明的 分段可變衰減的表面積大大減小。 e·將溫度補償衰減器引入可變衰減器，可改善系統的溫度特性。 f. 在高頻及微_段實現了無職着的分奴量精密可調；由 感構，其使雌補目_;可叫 廣細實現信號的可冑_。 胃 g. 本發明構造鮮，與用有源器件製作的衰減器相比，成摊低。 h·無源固定衰減器不齡是分立元件衰減器，也可以是薄膜或厚 膜工藝製作的衰減器。 i·適用於各種衰減電路。 j·適用於各種隔離電路。 k.適用於要求衰減精度高的情況。 L可作為試驗室的研究開發用的調整，測試設備。 【實施方式】 請參閱圖1，本發明第一實施方式的微帶分段可變衰減器，包括 基體9、共同接_ 3、信號輸入端卜信號輸出端2，該微帶分段可 變衰減器還包括在所述基體上的三個無源固定衰減器1〇，所述無源固 定衰減器的兩信號端4、5通過信號微帶線8相串聯，相串聯形成的串 200905968 聯固定衰減器的兩信號端分別與所述信號輸入端i和信號輸出端2相 連接’各無源固定衰減器的接軸分別與共同接_ 3相接地，該微 帶分段可魏減魏包括三她餘轉無源岐織H _信號端 4、5連接以使所述無源固定衰減器短路的導電片6。該微帶分段可變 衰減器還包括棘移動所述導電片位置的撥動開關7，該撥動開關7 的材料是絕緣材料。該撥動開關7與所述導電片6的一面相鄰接，所 述導電片的另-面與基體表層相鄰接。該導電片6的作用是用來短路 所述無源固疋氣咸器10 ’以此達到衰減器的分段可變。這裏要說明的 是’信號微帶線8是用於傳輸射頻信號的，它的寬度尺寸與信號頻率 有關，導電片6的寬度尺寸與信號微帶線8的寬度相同為佳。 所述無源蚊親H也可以翻具核麵償魏的無源固定衰 減器。可對系統起到溫度穩定的作用。 請參_ 2，它是圖1的等效電路圖。各個無賴定衰減器10的 哀減1分別為Μ卜M2和M3。串聯起來的衰減量為各個無源固定衰 減器10的衰減量的總合。 明參閱圖3，它是本發明第一實施方式的微帶分段可變衰減器無 效掉-個無测定韻㈣的示意圖。通舣麵細關7的位置， 使導電片6將第—個無翻定衰減|| 1()的兩端信號端4、$短路使 、源固定衰減器1〇無效掉；同樣，反向移動撥動開關7，可使其恢 復原有的衰減量。 請參閱圖4，它是圖3的等效電路圖。 200905968 清參閱圖5，它是本發明第一實施方式的微帶分段可變衰減器無 效掉兩個無源固定衰減器10的示意圖。 請參閱圖6是圖5的等效電路圖。 請參閱圖7，它是本發明第一實施方式的微帶分段可變衰減器無 效掉三個無_定錢H 1G的示意圖。 請參閱圖8是圖7的等效電路圖。 從圖3到圖8可以看出，若將該微帶分段可變衰減器接入到某個 f /系統中使用’該微帶分段可變衰減器的可變調節過程中，從被接入的 系統來看’沒有系、統完全開路狀態，不會產生輸入信號的全反射，不 會對被接入系統產生衝擊破壞。 明參閱圖9、圖1〇和圖^，它是本發明第二實施方式的微帶分段 可變衰減器的組合示意圖。基體9是一個6mn^1〇mm的陶面 細’陶瓷基體的厚度為㈣細。圖9是三個無源固定衰減器1〇相 ，互串聯製作在基體9的底面的示意圖。各個無源固定衰減器的兩信號 ( 端4 ’ 5通過射頻過孔，分別連接到另基體的另一面（正面）。圖10 是在基體9的正面有導電片6、猶開關7的示意圖。射頻過孔可製 作成實心過孔，這樣可耐摩擦。為了便於導電片的移動，在導電片處 於開路狀態’即導電片沒有與無賴定親器的兩信號端4，5相接觸 的狀態時’在導電片與基體9間加入阻焊漆u，該阻焊漆不覆蓋無源 固定秦咸器的兩端4，5，該阻焊漆的目的是抬高導電片的位置，使導 電片向無源固定衰減器的兩端4，5移動時，保持平順。通過撥動導電 11 200905968 片曰6，可使無源固定衰減器的兩信號端4，5短路或開路。這裏要強調 的疋4裏所獅開路或短路是指對無源固定衰減器兩信號端4，$ 的開路或短路，不是對被接入系統的開路或短路。 _該導割6可轉作在單層pcB板上，該概減基體接觸的 那-面（底面）有姆莫，該金屬模起到導電片的作用。該板的 形狀與導電片的形狀相同。該PCB板的表面，沒有金屬模，與該撥動 開關7相連接’該撥動開關7固定在該啦板上，該撥動開關7帶動 k PCB板移動。該基體9製作在—個殼體13内，撥動開關7的一部 份伸出到該殼體13外，便於手動操作。在該pcB板的表層與該殼體 13的内頂層之間可製作一個彈片或彈簧’目的是讓該PCB底面板上 的導電片與該無测定衰減器的兩端信號端4，5穩定接觸。在該PCB 板的表面與殼體13間還製作有一個導軌，該撥動開關7沿導娜動， 的疋在撥動PCB板時’使該PCB底面板上的導電片只能處於兩個 位置即該PCB底面板上的導電片完全與該無源固定衰減器的兩信號 端4 ’ 5穩定接觸的位置或該pcB底面板上的導電片完全脫離該無源 固定城器兩信號端4，5的位置。此段級有圖示。 本實施例巾’基體9選聊懿_伽是耐高溫，薄膜工藝一 般選用陶綱鶴體，通過薄膜工藝，可將無源固定韻器直i製 作麵絲體上’陶絲體的射鱗雜好。棚鮮賴，陶竟基 體的厚度要求_，8GHz以下—般翻_ 厚度_究基體。 但陶瓷基體易破碎’為了防止移動撥動_ 7時，壓碎贼基體，在 200905968 峨麟糾_祖_—鱗齡纖襯底12，該 絕緣觀底12辦有齡拠魏爾襯底，細-是為了防 =碎該峨^她嶋軸，肖靡基體底面的 該無测絲減轴销临娜_錄綱。此段雜述 圖示n ^ 二土體9也可選用射頻啦板比如聚四氣乙稀^叔，聚四 乙烯的優點是不易破碎，但不耐高溫。 月參晒11匕疋第二實施例的整體外觀圖。它可以直接安震在 所需系統中’雜號輸人端1、信纖端2、制接地端3表露在％ ϋ接焊接在所詠财，該絕緣襯底i2 底既起到絕緣作用’又起到保護該陶瓷基體的作用，還有固定殼體 的作用。該撥動開關7表殼體外部，便於調節。 另外^湖多層製作工藝，將無源固定衰絲製作在多層基體的 不同層上，比如用薄膜工藝’將無源固定泰咸器製作在不同層上，所 述無源固定衰減ϋ位於所聰體的表層或内層；當所述無賴定衰減 器位於所述基體内層，所述無源固定衰減器的兩信翻4、5連接到所 述導電>{所在基體絲層；冑職無源狀顧_鮮則不在同一 表層時，所述無源固疋哀減器的兩信號端連接到所述導電片所在基體 的表層；這樣可小型化，同時可防止鱗電片與無源固定衰減器的阻 性材料的直接摩擦，可避免影響無测定賴獅性能。此段雜述 $^有圖示。 13 200905968 請參酬12、圖13、圖14和圖15，它是本發明第三實施方式的 微帶分段可變衰減器的組合示意圖。該微帶分段可變衰減器可製作在 同軸連接器内’該機開關7製作延伸到該同軸連接器的外部。連接 器可選用SMA型、N型或BNC型等連接器。 請參閱圖I2 ’它是將類似於圖9和圖1〇所示的基體9製作在一 個經過設計改造的SMA型連接器14内的示意圖。將該_型連接 ,11的同軸信號線切開，在該SMA型連接器14内部設計一個可插入該 ' 基體9大小的空間’該SMA連接器的信號輸入端與該串聯固定衰減 器的信號輸入端1相連接、經該串聯固定衰減器信號輪出端子2無 SMA型連接器#號輸出端相連接，該共同接地端3與動^型連接器 的外殼相連接。 凊參麵13 ’它是基體9下面加有絕緣襯底12的示意圖。在製 作有無源固定衰減器的該基體9的那一面加有一個絕緣概底η，然後 用-個金屬套將其固定’該金屬套與該共同接地端3相連接。 I 請參酬14 ’它是在基體9的正面有_ 6、撥動開關7的示 思圖。它與圖10的描述相類似。No.1, ZL2_〇〇5, 9 and 2_Bai 24 3; Taiwan Patent No.: 〇6 and detached, the names of the invention are variable attenuators and microstrip variable attenuators, respectively. - a variable attenuator, which can be used in a high frequency and microwave circuit, comprising a button, characterized in that (4) comprises an input end and an output end on the wire at the ends of the wire - the electricity = connection = = resistance; The two ends of a diaphragm resistor are further divided into the second copper-黻 ___ ^ the other end of the fourth diaphragm resistor and the second end of the second diaphragm resistor respectively She is sharply connected; Ke Diansi can be divided into 5 200905968 and the second diaphragm of the first diaphragm is electrically contacted and used to change the resistance of the first diaphragm. The first conductive sheet and the second conductive sheet of the impedance of the second diaphragm resistor; the variable attenuator further includes an insulator, and the first and second sheets are fixed on the insulator. However, the variable attenuator described above can only continuously adjust the register within a given range, and in practical applications, there are sometimes vehicles that only need to use several fixed attenuator values. If the above variable attenuator is used, it is time consuming and difficult to control to obtain the desired attenuator value. In addition, the existing segmented attenuator, which adopts the method of pushing the resistive material away from the main circuit secret road, that is, the method of opening the road first and then touching the road, the problem is that the segmental agricultural reducer is connected. In the main circuit, at the moment of pushing the material, the main circuit is in an open circuit, and the reflection coefficient of the attenuator's transmission nickname will be large. In theory, the worst reflection is total reflection, which will cause great damage to the main circuit. The problem is that when such a segmented attenuator is connected to the system, the system is often burned out. SUMMARY OF THE INVENTION κ 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本It is smaller in size, easy to access, and will not be right. The system will cause impact and high precision. In order to solve the above technical problems, the technical solution adopted by the present invention is to provide a micro-center variable attenuator which includes: a base body, a common connection, a signal input end, and a signal 'characterized by ··· Microstrip section variable attenuation|§ Also includes at least one no-wire reduction I! on the filament, the no-measurement minus the dying end is identified by the micro-band line of the letter 200905968 __ fixed attenuation lion two signal ends are respectively connected with the signal input end and the signal output end, and the grounding ends of the respective non-surface fixed attenuators are respectively grounded with the common connection _, the microstrip segment can be The variable attenuator further includes at least one electrically conductive # 来 移 导电 导电 导电 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A further improvement of the above technical solution is that the microstrip segmented variable attenuator can be fabricated in a coaxial connector. The toggle switch is fabricated on the outside of the coaxial connector. The substrate can be made in the surface layer or the inner layer of the substrate. The conductive sheet and the toggle switch are formed on the surface layer of the substrate, and the two signal ends of the passive fixed attenuator Connected to the surface layer of the substrate where the conductive sheet is located. An insulating liner or an insulating substrate is provided on the other surface of the substrate in contact with the conductive sheet. The rogue 疋 attenuation $ can also be a temperature-compensated gong-lin measurement-free attenuator. In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a microstrip section variable attenuator, which includes: a base body, a common connection _, a signal input end, and a signal output end, which are characterized by: The microstrip segmented variable attenuator further includes at least one passive fixed attenuator on the substrate, wherein the two signal terminals of the passive fixed attenuator are connected in series by a series connection of the microstrip lines The two signal terminals of the passive fixed attenuator are respectively connected to the signal input end and the signal output end, and the ground ends of the passive fixed attenuators are respectively grounded to the common ground end. The variable attenuator also includes 200905968 including at least an electronically controlled switch that controls the connection of the two signal terminals of the passive fixed attenuator to short the passive fixed attenuator. A further improvement of the above technical solution is that the electronically controlled switch is located on the surface layer of the substrate or the same or different layers of the substrate, if the electricity The control switch is different from the passive fixed attenuator, and both ends of the passive fixed attenuator are connected to a layer where the electronically controlled switch is located. - The measured attenuation ϋ can also be a non-determining attenuator with a temperature compensation function. The invention has the invention that the microstrip segmentable recordable reducer has one or more surfaceless decays, and the segment of the non-measured attenuator is invalidated by the conductive sheet or the electronically controlled switch. Therefore, the actual position can be adjusted quantitatively and can reduce the impact on the connected system. Combining the microstrip segmented variable attenuator with the connector, the microstrip segmented variable attenuator is fabricated in the connector, which greatly reduces the volume of the forested structure; in addition, the microstrip segment of the present invention can be The variable attenuation lion multiple passive fixed attenuators can be located in different layers of the base body, thereby greatly saving the board area occupied by the fixed attenuator and achieving uniform segmentation adjustment of the attenuator amount; the conductive sheet is a passive fixed attenuator The 埠 phase connection ' does not directly contact the passive fixed attenuator made of fine special materials, thus improving the reliability of the device. Therefore, the present invention has the following advantages: a. The open circuit state does not occur, and the reflection of the system can be avoided when the system is accessed. 200905968 b. It can be fabricated in the connector, is convenient to use, small in size, and low in cost. The C. shorting pad and the passive fixed attenuator can be fabricated in different layers to reduce the volume and avoid direct friction between the conductive piece and the passive fixed attenuator impedance material. Because the multilayer segmentation can be adjustable, the surface area of the segmented variable attenuation of the present invention is greatly reduced over the same range of adjustment. e· Introducing a temperature-compensated attenuator into the variable attenuator improves the temperature characteristics of the system. f. In the high frequency and micro_segment, the amount of slaveless slaves is precisely adjustable; by the sense structure, it makes the female _; can be called the measurable signal _. Stomach g. The present invention is constructed to be less developed than an attenuator made with active devices. h· Passive fixed attenuators are either discrete component attenuators or attenuators made by thin film or thick film processes. i·Applicable to various attenuation circuits. j·Applicable to various isolation circuits. k. Applicable to situations where high attenuation accuracy is required. L can be used as an adjustment and test equipment for research and development of laboratories. [Embodiment] Referring to FIG. 1, a microstrip section variable attenuator according to a first embodiment of the present invention includes a base body 9, a common connection _3, and a signal input terminal signal output terminal 2, and the microstrip section is variable. The attenuator further comprises three passive fixed attenuators 1 在 on the base body, the two signal terminals 4, 5 of the passive fixed attenuator are connected in series through the signal microstrip line 8 and are connected in series to form a string 200905968 The two signal terminals of the fixed attenuator are respectively connected with the signal input terminal i and the signal output terminal 2, and the connecting shafts of the passive fixed attenuators are respectively grounded to the common connection _ 3 , and the microstrip segment can be reduced. Wei includes three conductive strips 6 that are connected to the passive woven H _ signal terminals 4, 5 to short the passive fixed attenuator. The microstrip segmented variable attenuator further includes a toggle switch 7 that moves the position of the conductive strip with a spine, the material of which is an insulating material. The toggle switch 7 is adjacent to one surface of the conductive sheet 6, and the other surface of the conductive sheet is adjacent to the surface layer of the substrate. The conductive sheet 6 functions to short-circuit the passive solid damper 10' to achieve variable segmentation of the attenuator. It is to be noted that the 'signal microstrip line 8 is for transmitting a radio frequency signal, and its width dimension is related to the signal frequency. The width dimension of the conductive strip 6 is preferably the same as the width of the signal microstrip line 8. The passive mosquito H can also be turned into a passive fixed attenuator with a nuclear surface. It can stabilize the temperature of the system. Please refer to _ 2, which is the equivalent circuit diagram of Figure 1. The sorrow of each of the rogue fixed attenuators 10 is ΜM2 and M3, respectively. The amount of attenuation in series is the sum of the attenuation amounts of the respective passive fixed attenuators 10. Referring to Fig. 3, it is a schematic diagram of the microstrip section variable attenuator of the first embodiment of the present invention having no effect (4). By means of the position of the fine-grained surface 7, the conductive sheet 6 will be the first signal-free terminal 4, the short-circuiting of the signal terminals 4, $1, and the source fixed attenuator 1〇; Move the toggle switch 7 to restore the original attenuation. Please refer to FIG. 4, which is an equivalent circuit diagram of FIG. 200905968 Referring to Fig. 5, it is a schematic diagram of the microstrip segmented variable attenuator of the first embodiment of the present invention ineffectively disabling two passive fixed attenuators 10. Please refer to FIG. 6 which is an equivalent circuit diagram of FIG. 5. Please refer to FIG. 7, which is a schematic diagram of the microstrip segmented variable attenuator of the first embodiment of the present invention having no effect on three undefined money H 1G. Please refer to FIG. 8 which is an equivalent circuit diagram of FIG. 7. It can be seen from Fig. 3 to Fig. 8 that if the microstrip segmented variable attenuator is connected to a certain f/system using the variable adjustment process of the microstrip segmented variable attenuator, The system that is connected sees that there is no system, the system is completely open, and it does not generate total reflection of the input signal, and will not cause impact damage to the system being accessed. Referring to Figure 9, Figure 1 and Figure 2, there is shown a combined schematic diagram of a microstrip segmented variable attenuator in accordance with a second embodiment of the present invention. The base 9 is a 6 mn ^ 1 〇 mm ceramic surface. The thickness of the ceramic substrate is (4) thin. Figure 9 is a schematic illustration of three passive fixed attenuators, one phase, fabricated in series on the bottom surface of the substrate 9. The two signals of the respective passive fixed attenuators (ends 4' 5 are connected to the other side (front side) of the other substrate through the RF via holes. Fig. 10 is a schematic view showing the conductive sheet 6, the switch 7 on the front side of the substrate 9. The RF via can be made into a solid via, which is resistant to friction. In order to facilitate the movement of the conductive sheet, when the conductive sheet is in an open state, that is, when the conductive sheet is not in contact with the two signal terminals 4, 5 of the rogue fixer, 'A solder resist paint u is added between the conductive sheet and the substrate 9, and the solder resist paint does not cover both ends 4, 5 of the passive fixed Qin saltifier. The purpose of the solder resist paint is to raise the position of the conductive sheet to make the conductive sheet Keep moving smoothly when moving to the ends 4, 5 of the passive fixed attenuator. By twisting the conductive 11 200905968, the two signal terminals 4, 5 of the passive fixed attenuator can be short-circuited or open. The open or short circuit of the lion in the 疋4 means that the open or short circuit of the two signal terminals 4, $ of the passive fixed attenuator is not an open circuit or short circuit to the connected system. _ The guided cut 6 can be converted into a single layer pcB On the board, the surface-to-surface (bottom surface) of the reduced substrate contact is The metal mold functions as a conductive sheet. The shape of the board is the same as that of the conductive sheet. The surface of the PCB board has no metal mold and is connected to the toggle switch 7. The toggle switch 7 is fixed to the board. The toggle switch 7 drives the k PCB to move. The base 9 is formed in a housing 13 and a portion of the toggle switch 7 projects out of the housing 13 for manual operation. A spring or spring may be formed between the surface layer and the inner top layer of the casing 13 for the purpose of stably contacting the conductive sheets on the bottom surface of the PCB with the signal terminals 4, 5 of the non-measuring attenuator. A guide rail is further formed between the surface of the board and the housing 13. The toggle switch 7 is moved along the guide, and the conductive sheet of the bottom surface of the PCB can only be in two positions when the PCB is pulled. The conductive sheet on the bottom surface of the PCB is completely in contact with the two signal terminals 4' 5 of the passive fixed attenuator or the conductive sheet on the bottom plate of the pcB is completely separated from the two signal terminals 4, 5 of the passive fixed city. Position. This paragraph has a diagram. This embodiment of the towel 'base 9 selected chat _ gamma is high temperature The film process is generally selected from the pottery body of the pottery. Through the film process, the passive fixed rhyme can be made directly on the surface of the silk body. The scale of the pottery body is good. The thickness of the pot is required, _, below 8GHz. Generally turn _ thickness _ study base. But ceramic matrix is easy to break 'to prevent movement _ 7 when crushing thief base, in 200905968 峨 纠 _ 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖 祖The ageing 拠Weil substrate, fine - is to prevent the 峨 ^ 嶋 ^ her axis, the bottom of the base of the Xiao 靡 减 减 减 减 减 减 无 无 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The body 9 can also be used with a radio frequency board such as polytetrafluoroethylene, which has the advantage that it is not easily broken, but is not resistant to high temperature. The overall appearance of the second embodiment of the moon is 11 。. It can directly oscillate in the required system. 'Miscellaneous input terminal 1, signal fiber terminal 2, system ground terminal 3 are exposed at % ϋ 焊接 soldering in the fortune, the insulating substrate i2 bottom serves as insulation only' It also functions to protect the ceramic substrate and also to fix the housing. The toggle switch 7 is external to the watch case for easy adjustment. In addition, the multi-layer manufacturing process of the lake makes the passive fixed fading wire on different layers of the multi-layer substrate, for example, using a thin film process to make passive fixed squid on different layers. a surface layer or an inner layer; when the rogue fixed attenuator is located in the inner layer of the substrate, the two signals 4, 5 of the passive fixed attenuator are connected to the conductive layer; When the same is not in the same surface layer, the two signal ends of the passive solid-state device are connected to the surface layer of the substrate where the conductive sheet is located; this can be miniaturized, and at the same time, the scaled film and the passive fixed attenuation can be prevented. The direct friction of the resistive material of the device can avoid affecting the performance of the lion without measurement. This paragraph is mixed with $^. 13 200905968 Please refer to FIG. 13, FIG. 13, FIG. 14 and FIG. 15, which are schematic diagrams of the combination of the microstrip section variable attenuator of the third embodiment of the present invention. The microstrip segmented variable attenuator can be fabricated in a coaxial connector. The switch 7 is made to extend outside of the coaxial connector. Connectors such as SMA type, N type or BNC type can be used as the connector. Referring to Figure I2', a schematic view of a substrate 9 similar to that shown in Figures 9 and 1B is fabricated in a modified SMA type connector 14. The _ type connection, 11 coaxial signal line is cut, and a signal space input into the 'base 9 size' can be inserted into the SMA type connector 14 and the signal input end of the SMA connector and the serial fixed attenuator signal input The terminal 1 is connected, and the serial fixed attenuator signal output terminal 2 is connected without the SMA type connector # number output terminal, and the common ground terminal 3 is connected to the outer casing of the movable connector. The crucible surface 13' is a schematic view in which the insulating substrate 12 is applied under the substrate 9. An insulating base η is applied to the side of the base body 9 on which the passive fixed attenuator is formed, and then fixed by a metal sleeve. The metal sleeve is connected to the common ground terminal 3. I Please pay 14 ’. It is a diagram with _ 6 on the front of the base 9 and the toggle switch 7. It is similar to the description of FIG.
同樣，可以將導電片製作在單層pcB板上，該撥動開關7固定在 該PCB板上，該撥動卿7帶動該pcB板移動，撥動開關7的一部 絲露到該SMA型連接n 14的殼體外，便於手動操作。在該卿 板的表層觸殼體财製作—轉#或彈簧，目岐讓該pcB底面板 上的導電片與該無源固定衰減器的兩信號端4,5穩定接觸；在該PCB 200905968 板的表面與該殼體間還製作有一個導軌，該撥動開關7沿導_動， 目的是在撥動PCB板時，使該PCB底面板上的導電片只能處於兩個 位置’即該PCB底面板上的導電片完全與該無源固定衰減器的兩信號 端4 ’ 5穩定接觸的位置或該PCB底面板上的導電片完全脫離該無源 固疋衰減器兩信號端4，5的位置。此段落沒有圖示。 、 祕酬15，它是驗魏接n的微帶分段可魏減器的外觀 圖。該撥動開關7的-部分表露在SMA型連接的外部，便於調節， 圖中有三個撥動開關。該無源固定衰減器的衰減量可自由組合。^過 選擇不同絲量的無麵絲減ϋ ’可财便_槪帶分段可變衰 減器的衰減範圍和步進精度。 另外，也可以將機開關7製作成旋轉式撥動開關，比如通過外 部旋轉螺帽或螺杆帶動撥動開關動作，起到改變衰減量的作用。此段 落沒有圖示。 還可以在連接獅外部加人散姑，可製作岐姑型的大功率 的微帶分段可變衰減器。此段落沒有圖示。 請參閱圖16、它是本發明第四實施方式的微帶分段可變衰減器的 示意圖。圖16顯示了三個無源固定衰減器1〇相互串聯在一起，虛線 顯示了 一個由PCB板製成的有導電片功能的圓形pcB板，該咖板 與該無源固定衰減器的兩信號端4，5相接觸的那一面刻制有導電片， 通過旋轉PCB板’可無效掉無源固定衰減器。為了防止過度旋轉，在 該PCB的邊緣設置有限位頭15。 15 200905968 請參閱圖17，它是將圖16安裝在一個殼體内的微帶分段可變衰 減器的外觀圖。撥動開關7延伸到該殼體的外部，便於調節。 請參閱圖18 ’它是微帶分段可變衰減器衰減量變化的理論曲線 圖。通過選擇不同衰減量的無源固定衰減器，可很方便地選擇微帶分 段可變衰減器的衰減範圍和步進精度。Similarly, the conductive sheet can be fabricated on a single-layer pcB board, the toggle switch 7 is fixed on the PCB board, and the dialing 7 drives the pcB board to move, and a portion of the switch 7 is pulled to the SMA type. It is connected to the outside of the housing of n 14 for manual operation. In the surface of the board, the surface of the board is made of a spring or a spring, and the conductive sheet on the bottom plate of the pcB is stably in contact with the two signal terminals 4, 5 of the passive fixed attenuator; in the PCB 200905968 board A guide rail is further formed between the surface and the housing, and the toggle switch 7 is guided along the guide, so that the conductive sheet on the bottom surface of the PCB can only be in two positions when the PCB board is toggled. The conductive sheet on the bottom surface of the PCB is completely separated from the two signal terminals 4' 5 of the passive fixed attenuator or the conductive sheet on the bottom surface of the PCB is completely separated from the two signal terminals 4, 5 of the passive solid attenuator. s position. This paragraph is not shown. , the secret 15 , it is the appearance of the Wei Wei n micro-segment segmentable Wei reducer. The - part of the toggle switch 7 is exposed on the outside of the SMA type connection for easy adjustment. There are three toggle switches in the figure. The attenuation of the passive fixed attenuator can be freely combined. ^Over Selecting the different amount of silk without the amount of silk reduction 可 财 槪 槪 衰减 衰减 分段 分段 可变 可变 可变 可变 可变 可变 可变 可变 。 衰减 衰减 衰减 衰减 衰减 衰减 衰减 衰减Alternatively, the machine switch 7 may be formed as a rotary toggle switch, for example, by an external rotating nut or a screw to actuate the toggle switch to change the amount of attenuation. This paragraph is not shown. It is also possible to add a large-power microstrip section variable attenuator to the lion's type. This paragraph is not shown. Referring to Figure 16, there is shown a schematic diagram of a microstrip segmented variable attenuator in accordance with a fourth embodiment of the present invention. Figure 16 shows three passive fixed attenuators 1〇 connected in series with each other. The dashed line shows a circular pcB board made of PCB board with conductive sheet function. The coffee board and the passive fixed attenuator are two. The side on which the signal terminals 4, 5 are in contact is engraved with a conductive sheet, and the passive fixed attenuator can be eliminated by rotating the PCB board'. To prevent excessive rotation, a limit head 15 is placed at the edge of the PCB. 15 200905968 Please refer to Fig. 17, which is an external view of the microstrip section variable attenuator in which Fig. 16 is mounted in a housing. The toggle switch 7 extends to the outside of the housing for ease of adjustment. See Figure 18' which is a theoretical plot of the attenuation of the microstrip segmented variable attenuator. The attenuation range and step accuracy of the microstrip segmented variable attenuator can be easily selected by selecting passive fixed attenuators with different attenuation levels.
請參閱圖19 ’它是本發明第五實施方式的微帶分段可變衰減器的 示意圖。它與第-實施方式的區別在於，用高速電控開關代替了導電 片6和撥動_ 7。電控開關需要外部的控繼絲控愼控開關的 開與關’以此來改變該微帶分段可變衰_的衰減量。電控開關可以 選用微波高it開關管（比如pin管）或場_管（pET)作開關管。 在設計該電控開關時要考慮到各電控_間開關觸發信號(控制信號) 的相互隔離，可以在電控開綱加人藕合t容，_____ 射頻微波信號通過，阻簡關觸發信號通過。開關觸發信號一般是頻 率較低的信號。在開關觸發信號與電控開關間加入高阻抗線，其作用 是阻礙射頻微波信號從開關觸發信號處漏出。 所述無賴綠減馳可简料紐度砸魏的無源固定衰 減器。可對系統起到溫度穩定的作用。 述基體的表層或内層，所述多個無 同樣，可利用多層製作工藝，將無测定衰減器製作在多層其體 ^同層上’比如用薄膜工藝，在不同層上製作細定衰減^所 :職備位於所縣體的表層或内層；所述電觸關位於所 源固定衰減器與所述電控開關位於 200905968 所述基體_-層或不同層’若所舰控_與所述無賴定衰減器 不同層’則所述無源固定衰減器的兩信號端4、5連接到所述電控開關 所在基伽職。此段紐有圖示。 以上所述’僅為本發明的較佳實施例而已，並非用於限定本發明 的保護圍’凡在本發明的精神和原則之内所做的任何修改、等同替 換、改進等，均應包含在本伽的倾範圍之内。 17 200905968 【圖式簡單說明】 圖1:是本發明第一實施方式的微帶分段可變衰減器的示意圖。 圖2:是本發明第一實施方式的微帶分段可變衰減器的等效電路圖。 圖3 :是本發明第一實施方式的微帶分段可變衰減器無效掉—個 源固定衰減器的示意圖。 、’、 圖4 :是圖3的等效電路圖。 圖5 .疋本發明第一實施方式的微帶分段可變衰減器無效掉兩盔 源固定衣減器的示意圖。 、 圖6 :是圖5的等效電路圖。 圖7 :是本發明第一實施方式的微帶分段可變衰減器無效掉三個無 源固定衰減器的示意圖。 圖8 :是圖7的等效電路圖。 圖9:^三個無源固定氣咸器1〇相互串聯製作在基體9的底面的示意 圖。 圖10 :是在基體9的正面有導電片6、撥動開關7的示意圖。 圖11:它是第二實施例的整體外觀圖。 圖12:它是將類似於圖9和圖10所示的基體9製作在一個經過設計改 造的SMA型連接器内的示意圖。 圖13 :它是基體底面加有一個絕緣觀底的示意圖。 圖14 .匕疋在基體9的正面有導電片6、撥動開關7的示意圖。 18 200905968 圖15 :它是SMA型連接器的微帶分段可變衰減器的外觀圖。 圖16.匕是本發明第四實施方式的微帶分段可變衰減器的示意圖。 圖17 :它是將圖16安裝在一個體内的微帶分段可變衰減器的外 觀圓。 圖18 :它是微帶分段可變衰減器衰減量變化的理論曲線圖。 C、 圖19:它是本發明第五實施方式的微帶分段可變衰減器的示意圖。 【主要元件符號說明】 I- 信號輸入端 2_信號輸出端 3_共同接地端 4、5-信號端 6- 導電片 (, 7- 撥動開關 號微帶線 9- 基體 10- 無源固定衰減器 II- 阻焊 12- 絕緣襯底 13- 殼體 19 200905968 14- 連接器 15- 有限位頭Referring to Fig. 19', it is a schematic diagram of a microstrip section variable attenuator according to a fifth embodiment of the present invention. It differs from the first embodiment in that the conductive sheet 6 and the toggle _ 7 are replaced by a high-speed electronically controlled switch. The electronically controlled switch requires an external control to control the opening and closing of the wire control switch to change the amount of attenuation of the microstrip segmentation. The electric control switch can be a microwave high-it switch tube (such as a pin tube) or a field_tube (pET) as a switch tube. In designing the electronic control switch, it is necessary to take into account the mutual isolation of the electronic control_inter-switch trigger signal (control signal), which can be added to the electronic control system, and the _____ RF microwave signal passes through, and the simple trigger signal is blocked. by. The switch trigger signal is typically a lower frequency signal. A high-impedance line is added between the switch trigger signal and the electronically controlled switch to prevent the RF microwave signal from leaking from the switch trigger signal. The rogue green deduction can be a passive fixed attenuator of Neutrogen. It can stabilize the temperature of the system. The surface layer or the inner layer of the substrate, the plurality of which are not the same, can be fabricated on a plurality of layers of the same layer by using a multi-layer fabrication process, such as using a thin film process to make a fine attenuation on different layers. The job is located in the surface layer or the inner layer of the county body; the electrical contact is located at the source fixed attenuator and the electronic control switch is located at the base _-layer or different layer of the "200905968" if the ship control _ and the rogue The different layers of the attenuator are connected to the two signal terminals 4, 5 of the passive fixed attenuator connected to the base of the electronically controlled switch. This section has an icon. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modifications, equivalent substitutions, improvements, etc., which are made within the spirit and principles of the present invention, should be included. Within the scope of this gamma. 17 200905968 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a microstrip section variable attenuator according to a first embodiment of the present invention. 2 is an equivalent circuit diagram of a microstrip section variable attenuator according to a first embodiment of the present invention. Fig. 3 is a schematic view showing the microstrip section variable attenuator of the first embodiment of the present invention. , ', Figure 4: is the equivalent circuit diagram of Figure 3. Fig. 5 is a schematic view showing that the microstrip section variable attenuator of the first embodiment of the present invention invalidates the two helmet source fixed clothes reducer. Figure 6 is an equivalent circuit diagram of Figure 5. Fig. 7 is a schematic view showing that the microstrip section variable attenuator of the first embodiment of the present invention invalidates three passive fixed attenuators. Figure 8 is an equivalent circuit diagram of Figure 7. Fig. 9 is a schematic view showing the three passive fixed gas squirts 1 〇 fabricated in series on the bottom surface of the substrate 9. Fig. 10 is a schematic view showing a conductive sheet 6 and a toggle switch 7 on the front surface of the base 9. Figure 11: It is an overall appearance of the second embodiment. Fig. 12: It is a schematic view in which a substrate 9 similar to that shown in Figs. 9 and 10 is fabricated in a design-modified SMA type connector. Figure 13: It is a schematic view of the bottom of the substrate with an insulating bottom. Fig. 14 is a schematic view showing the conductive sheet 6 and the toggle switch 7 on the front surface of the base 9. 18 200905968 Figure 15: Appearance of the microstrip segmented variable attenuator of the SMA type connector. Figure 16 is a schematic illustration of a microstrip segmented variable attenuator in accordance with a fourth embodiment of the present invention. Figure 17: This is the outer circle of the microstrip segmented variable attenuator that mounts Figure 16 in one body. Figure 18: This is a theoretical plot of the attenuation of the microstrip segmented variable attenuator. C, Fig. 19: It is a schematic diagram of a microstrip section variable attenuator according to a fifth embodiment of the present invention. [Main component symbol description] I- Signal input terminal 2_Signal output terminal 3_Common ground terminal 4, 5-Signal terminal 6- Conductive sheet (, 7-Toggle switch No. Microstrip line 9-Base 10 - Passive fixed Attenuator II - Solder Mask 12 - Insulation Substrate 13 - Housing 19 200905968 14- Connector 15 - Limited Position Head