200846685 九、發明說明： 【發明所屬之技術領域】 本發明係一種無線射頻模組測試裝置，尤指一種構 造簡單，同時可屏蔽、過濾電磁干擾之無線射頻模組测 試裝置。 【先前技術】200846685 IX. Description of the Invention: [Technical Field] The present invention relates to a radio frequency module test device, and more particularly to a radio frequency module test device which is simple in construction and can shield and filter electromagnetic interference. [Prior Art]
在現今的生活中，眾多科技產品已給人們很多使用 上的便利性，而具有「無線」功能的產品已儼然成為科 技現階段的象徵，如具有無線上網功能的筆記型電腦， 或具有全球定位系統(Global Positioning System，GPS)的 個人數位助理(Personal Digital Assistant, PDA)等等都具 有無線射頻模組的元件或模組。然而，所有電器和電子 設備工作時都會有間歇或連續性電壓電流變化，有時變 化速率還相當快，這樣會導致在不同頻率内或一個頻帶 間產生電磁能量，而相應的電路則會將這種能量發射到 周圍的環境中，此即為電磁干擾（Electr〇magneticIn today's life, many technology products have given people a lot of convenience, and products with "wireless" capabilities have become a symbol of the current stage of technology, such as notebooks with wireless Internet access, or global positioning. The Global Positioning System (GPS) Personal Digital Assistant (PDA) and the like all have components or modules of the radio frequency module. However, all electrical and electronic equipment will have intermittent or continuous voltage and current changes, sometimes at a relatively fast rate, which will result in electromagnetic energy being generated at different frequencies or between one frequency band, and the corresponding circuit will The energy is emitted into the surrounding environment, which is electromagnetic interference (Electr〇magnetic
Interference，EMI)的來源。電磁干擾(EMI)有兩條途徑離 開或進入一個電路：輻射和傳導。信號輻射是藉由外粗 的缝、槽、開孔或其他缺口泄漏出去；而信號傳導二 由耦合到電源、信號和控制線上離開外殼，在放'、= 間中自由輻射，從而產生干擾。 幵的空 然而在生產與測試無線射頻模組的過程中 故EMi 路設計人員 磁干擾(EMI)—直是工程師努力降低與避免的 抑制性、隔離性和低敏感性應該作為所有電' ^ 的目標。 '路 6 200846685 很多電磁干擾(EMI)抑制都採用外殼屏蔽和缝隙屏 蔽，即形成一個法拉第箱Farady Cage之結合的方式來實 現，大多數時候下面這些簡單原則可以有助於實現電磁 干擾(EMI)之屏蔽：從源頭處降低干擾；藉由屏蔽、過濾 或接地將干擾產生電路隔離以及增強敏感電路的抗干擾 能力等。對設計工程師而言，採用屏蔽材料是一種有二 降低電磁干擾(EMI)的方法。 > 習知電磁干擾的抑制都採用外殼屏蔽和缝隙屏蔽結Source of Interference, EMI). Electromagnetic interference (EMI) has two ways to leave or enter a circuit: radiation and conduction. Signal radiation is leaked through the outer thick slits, slots, openings or other notches; and signal conduction is separated from the outer casing by the coupling to the power supply, signal and control lines, and radiates freely between the ', ', causing interference. However, in the process of producing and testing wireless RF modules, the electromagnetic interference (EMI) of the EMi road designer is straightforward. Engineers strive to reduce and avoid the suppression, isolation and low sensitivity should be used as all electric '^ aims. '路6 200846685 Many electromagnetic interference (EMI) suppression is achieved by a combination of casing shielding and gap shielding, which forms a Faraday Cage. Most of the following simple principles can help achieve electromagnetic interference (EMI). Shielding: reducing interference from the source; shielding, filtering or grounding to isolate the circuit and enhance the anti-jamming capability of the sensitive circuit. For design engineers, the use of shielding materials is one way to reduce electromagnetic interference (EMI). > Conventional electromagnetic interference suppression uses shell shielding and gap shielding junction
合的方式來實現，如今已有多種外殼屏蔽材料得到廣^ 使用，從金屬罐、薄金屬片和箔帶到在導電織物或卷帶 上喷射塗層及鍍層（如導電漆及鋅線噴塗）等等，將待測試 之無線射頻模組置放入一個封閉的金屬箱子内，形1二 個法拉第箱（Farady Cage)，這雖笨重的方法很汽^ : 助於實現電磁干擾的屏蔽，係一種從源頭處降^捧= 方法，而若將該金屬箱子接地财增強敏感路二 擾能力與效果。 _的抗干 凊參考第五圖’係顯示習知無線射頻模 之立體不意圖。在測試具有無線射頻模組知二 路板50時人會將該習知印刷電路* 5〇置放於 之金屬屏蔽相51内，該金屬屏蔽箱51係耳—二_衣 好之空間，可供該習知印刷電路板5Q連 52,用以測試該具有無線射頻模組之習知印台 50,同時’該金屬屏蔽箱51即如同前 板 (Famdy Cage)，可以屏蔽、過濾電磁干擾 $弟箱 成。然而’運魏種方法來輯具有無軸2 = #以 知印刷電路板5G，不但耗費時間且光是笨重的金屬^ 7 200846685 可以同產’故目前實在須要一種 且可對應Si數:試順利完成，並 的無線射頻模組職裝置線射頻模組之印刷電路板 【發明内容】 無線二一種結構簡單、成本較低之 空間以二::置，在一測試平台上形成金屬屏蔽 產化作無㈣顧組測，並且亦可對應測試量 it ^下多數個具有無線射頻模組之印刷電路板。 置，述目的與功效之一種無線射頻模組測試裝 人$ =3了具有金屬材質之測試平台，前述測試平台包 &測試單元，前述測試單元形成—容置空間，前 二=工間係由一第一平面及其側壁所界定成形；以及 h =反，具有一導電之第一表面；其中，前述印刷電路 於二放於蝻述容置空間，藉由前述壓板之第一表面壓附 二:述=刷電路板上，俾使前述無線射頻模組包覆於一 曰該各置空間及第一表面所形成之密閉空間内。 較佳地，前述測試平台設有接地處理。 ^ 較佳地’前述測試平台設有定位插銷，該定位插銷 定位前述印刷電路板置放於前述容置空間。 較佳地，前述測試單元具有至少一貫通孔，該貫通 孔用以配合該定位插銷。 較佳地，前述测試平台下方設有一彈性裝置，該彈 置賦予前述測試平台反應該壓板的壓附。 $ 200846685Achieved in a way that is now available in a variety of housing shielding materials, from metal cans, thin metal sheets and foil strips to spray coatings and coatings on conductive fabrics or tapes (eg conductive paint and zinc wire coating) Etc., put the radio frequency module to be tested into a closed metal box, and shape two Farady Cages. This cumbersome method is very steamy: to help shield electromagnetic interference. A method of reducing the holding from the source, and if the metal box is grounded, the ability and effect of the two channels are enhanced. The anti-drying of _ refers to the fifth figure' which shows the stereoscopic intention of the conventional radio frequency module. When testing the wireless radio frequency module, the second printed circuit board 50 will place the conventional printed circuit board 5 in the metal shielding phase 51, and the metal shielding box 51 is a space for the ear-two clothes. The conventional printed circuit board 5Q connection 52 is used to test the conventional printing pad 50 having a radio frequency module, and the metal shielding box 51 is like a front panel (Famdy Cage), which can shield and filter electromagnetic interference. Box into. However, the method of "Wei Wei method has a shaftless 2 = # knowing that the printed circuit board 5G is not only time-consuming but also bulky metal ^ 7 200846685 can be produced together. Therefore, it is necessary to have one kind and can correspond to Si number: try smoothly Completion, and the printed circuit board of the radio frequency module of the radio frequency module device device [invention content] Wireless, a simple structure, low cost space to create a metal shielding production on a test platform Do not (4) test group, and can also correspond to the test volume it ^ under a number of printed circuit boards with wireless RF modules. A radio frequency module test with a stated purpose and effect is loaded with a test platform with a metal material, the aforementioned test platform package & test unit, the aforementioned test unit forms a housing space, and the first two = the inter-work system Formed by a first plane and a sidewall thereof; and h = inverted, having a first surface that is electrically conductive; wherein the printed circuit is placed in the accommodating space, and is adhered by the first surface of the pressure plate II: Description = Brush circuit board, the wireless RF module is wrapped in a sealed space formed by the space and the first surface. Preferably, the aforementioned test platform is provided with a grounding process. ^ Preferably, the aforementioned test platform is provided with a positioning pin that positions the printed circuit board to be placed in the accommodating space. Preferably, the test unit has at least one through hole for engaging the positioning pin. Preferably, an elastic device is disposed under the test platform, and the spring imparts a pressure to the test platform to react the pressure plate. $ 200846685
較佳地，前述測試平台下方具有至少一剛試匯流排 接腳，前述測試匯流排接腳在前述壓板下壓該測試^台 時接觸該印刷電路板的電路系統，以進行測式。 Q 較佳地，前述壓板由一加壓裝置控制，以壓附於吁 述印刷電路板上。 、則 較佳地，前述壓板之第一表面設有一緩衝層。 較佳地，前述第一表面係一導電膠層。 ^ ，佳地，前述印刷電路板，包括一第一面及一相Preferably, the test platform has at least one test bus stop pin under the test platform, and the test bus bar contacts the circuit system of the printed circuit board when the test plate presses the test board to perform the test. Q Preferably, the pressure plate is controlled by a pressing device to be attached to the printed circuit board. Preferably, the first surface of the pressure plate is provided with a buffer layer. Preferably, the first surface is a conductive adhesive layer. ^ , preferably, the aforementioned printed circuit board includes a first side and a phase
Η述第一面之一第二面，前述第一面形成包園該無鉍 頻模組之一第一導電迴路，前述第二面具有一第二 ，且前述第一導電迴路及前述第二導電％路:;二 、 較佳地，前述無線射頻模組測試裝置，其中該#一 S電迴路與第二導電迴路為印刷電路板之電路系統=接 一較佳地，前述印刷電路板置放於前述容置空間 第一導電迴路對應接觸該容置空間之侧壁邊緣。、， 較佳地，前述壓板之第一表面壓附於前述印 板時，第二導電迴路接觸該導電之第一表面。 包路 如此，本發明提供之一種無線射頻模組測試 具有結構簡單且成本低廉之優點外，本發明亦可徂1 ^無線射頻模組時，屏蔽、過濾電磁干擾使測試順= 成；更重要的是，本發明亦具有可對應_量產化= 下，多數個無線射頻模組印刷電路板同時測試的優點。-、 200846685 一本發明之前述目的麵徵，將依顧_式 細況明’惟綱瞭的是，後_式及所舉之例/傲 為說明而非在限制或縮限本發明。 讯疋做 【實施方式】 戈予有本發明較佳實施例之所附圖 式Hi 在此描述之前應瞭解熟悉本行之人 士可0改本文中所描述之發明，同時獲致本發 效。因此，須瞭解以下之描述對熟悉本行技藝之 = 言為1泛^揭示’且其内容不在於限制本發明。 請爹閲第-圖，係顯示本發明無線射頻模 置之侧視示㈣。本發明無騎麵_試裝置bit 了-測試系統Η)及-壓板2卜測試系統1G内具有= 屬材質所製叙具有接地處理之賴平台u， 的；t 早ι 12詳細說明，待後續篇幅 有；數個測試單元12之測試平台η是如何實施式 =上之，單元12形成一容置空間13，容置= L『5 ^ ; 4及在該第-平面14四週環繞之侧 Γο 形’如第—®所示；故制試印刷電路板 二…:線射頻模、链43可以在測試時，完全放入容置空 Γ曰J丄·^ Τ 〇 d 卜’測試平s11上設有複數個貫通孔18，用以套 ^又目、、μ之疋位插銷17，而定位插銷17用以放置印刷電 路ϊ 4〇^_平台η上時，定位該印刷電路板 40置放 於爾u容置空間13内並减得職平台11可沿定位插 鎖17上下的滑動；而測試平台11下方設有若干如彈簧 200846685 之彈性裝置19與至少一測試匯流排接腳3〇，彈性裝置 19賦予測試平台η在沿定位插銷17上下的滑動具有恢 復至原來初使位置之功能；而測試匯流排接腳在壓板 21下壓測試平台13時接觸該印刷電路板4〇的電路系統 46，以進行測式。 /、' 本發明壓板21主要係與容置空間13形成_如法拉 第箱（Farady Cage)之測試環境。壓板21具有一導電之第 一表面，該第一表面實際上為一導電膠層23，且|板21 • 的夾層具有一緩衝層24,當印刷電路板40置玫於^置空 間13時，藉由壓板21之第一表面壓附於印刷電路板4〇 上，使無線射頻模組43包覆於一藉由容置空間13及第 一表面所形成之密閉空間内，並形成一如法拉第箱 (FaradyCage)之測試環境，而緩衝層24可以緩衝在壓= 時之衝擊力。值得一提的是，壓板21可由一加壓裝置2〇 控制’以壓附於前述印刷電路板40上。 二芩閱第二A至第二C圖並輔以參考第一圖，第二 A至第二c·圖係顯示本發明無線射頻模組之俯視圖、仰 視圖及侧視圖。本發明具有無線射頻模組之印刷電路板 40,包括一第一面41及一相對前述第一面41之一第二 =42,亦即第一及第二面分為印刷電路板之兩面，第 二面具有若干無線射頻模組43及電子元件，第一面41 成包圍該無線射頻模組Μ之一第一導電迴路料，如 第=A圖所示，而第二面42具有一第二導電迴路45, 所示，且第一導電迴路44及第二導電迴路 $二糸，、氣；通，如第二C圖所示；其中第一導電迴路44 弟二導電迴路45為印刷電路板40之電路系統46的接 11 200846685 地，當印刷電路板40置访於义、+.六 導電迴路44對應接觸誃二二二工間13時’第〆 壓板21之第-表面_= I13之侧壁15邊緣，而 迴路45 _該導電之^於，電路板40時，第二導電 外，印刷電路板40周二亦即導電膠層23。此 洞47,用以放置時可錢應定位插銷17之定位孔 觸該容置空間13之側^ —導電迴路44精準地對應接 請參閱第三A至第：5 模組測試裝置及無料ς”，鋪林發明無線射頻 電路板40放置在測以二具有，_ 容置办13肉/早兀12上且無線射頻模組43位於 套言^ ^ ！彻印刷電路板4 G上之定位孔洞4 7 接立、7上，將第一導電迴路44精準地對應 接觸“各置空間13之侧壁15，如第三A圖及第三B圖 =不。當使用者驅動加壓裝置2〇使得壓板21往下，而 壓板21之第一表面壓附於印刷電路板4〇時，第二導電 迴路45接觸該導電之第一表面，亦即導電膠層23，該第 一表面猶如一導電面而將第二導電迴路45封閉，如第三 c圖所示，其中，值得一提的是，當第二導電迴路45 = 觸該導電之第一表面時，把待測的無線射頻模組43將包 覆於-金屬屏蔽空間25，即-如法拉第箱(Farady Cage) 之測試環境，而再驅動加壓裝置20往下移動，可使得印 刷電路板40之電路系統46與測試平台13下方之測^匯 k排接腳30接觸並測試，如第三d圖所示。 、 請參閱第四圖，係顯示本發明無線射頻模组測試裝 置另一實施例之立體示意圖。本發明對應量產時多數^ 12 200846685 具有無線射頻模組之印刷電路板4〇的無線射頻模組们 時，將壓板21及測試平台u的配置加以調整，如第四 圖所示，而其他對應的元件與幾合關係，皆與本發明上 述内容相同，故在此不在贅述。測試平台n上具有 個測試單元I2,用以對應複數個印刷電路板—而該壓 板21之大小亦對應測試平台^，使驅動加壓裝置2 得壓板21往下，而壓板21之第一表面壓附於複數個印 刷電路板40時，每-第二導電迴路45接觸導電膠層 • 亚把無線射頻模組43包覆於一密閉空間25,即一如法拉 第箱（Farady Cage)之測試環境。如此，本發明提供之一 種無線射頻模組測試裝置丨，優點係結構簡單且成本低 廉二可供使用，任意的組裝搭配，亦可提供測試無線射 頻权組時，屏蔽、過濾電磁干擾使測試順利完成之功效， 更重要的是，本發明調整壓板21與測試平台n的配置， 亦具有可對應測試量產化作業下，多數個無線射頻模組 印刷電路板40同時測試的優點。 在詳細說明本發明的較佳實施例之後，熟悉該項技 術人士可清楚的瞭解，在不脫離下述申請專利範圍與精 神下可進行各種變化與改變，且本發明亦不受限於說明 書中所舉實施例的實施方式。 13 200846685 【圖式簡單說明】 音圖Y圖員示本發明無線射頻模級測試裝置之侧視示 圖顯林發明無線射頻模組之俯視圖。 # 一 Β圖顯示本發明無線射頻模組之仰視圖。 圖顯示本發明無線射頻模組之侧視圖。 第二A圖至第三^圖顯示本發明無線射頻模組測試 裝置，無線射頻模組之侧視作動示意圖。 _ 第四圖顯示本發明無線射頻模組測試裝置另一實施 例之立體示意圖。 第五圖顯示習知無線射頻模組測試裝置之立體示意 圖。 【主要元件符號對照說明】 1 -…無線射頻模組測試裝置 ίο—測試系統 〜測試平台 ⑩ 12…測試單元 13…容置空間 14…第一平面 側壁 16〜接地處理 17…定位插銷 18…貫通孔 19〜彈性裝置 20…加壓裝置 21〜壓板 200846685 23…導電膠層 24…緩衝層 25…密閉空間 30—測試匯流排接腳 40—印刷電路板 41一第一面 42…第二面 43…無線射頻模組 44…第一導電迴路 45— -第二導電迴路 46- --電路糸統（電氣接腳) 47…定位孔洞 50 —習知印刷電路板 51— 金屬屏敝箱 52— -測試機台Having a second side of the first side, the first surface forms a first conductive loop of the 铋 铋 frequency module, the second mask has a second, and the first conductive loop and the second Conductive % Road: Second, preferably, the aforementioned radio frequency module testing device, wherein the #1 S electric circuit and the second conductive circuit are circuit circuits of the printed circuit board = preferably, the printed circuit board is placed The first conductive loop disposed in the accommodating space correspondingly contacts the edge of the sidewall of the accommodating space. Preferably, when the first surface of the pressing plate is pressed against the printing plate, the second conductive loop contacts the first surface of the conductive. In addition, the wireless radio frequency module test provided by the present invention has the advantages of simple structure and low cost, and the present invention can also shield and filter electromagnetic interference to make the test smooth and more important when the radio frequency module is used. Therefore, the present invention also has the advantages of being able to simultaneously test a plurality of radio frequency module printed circuit boards corresponding to mass production. -, 200846685 The above-mentioned object of the present invention will be described in detail, and the following examples are intended to be illustrative and not limiting or limiting the invention. EMBODIMENT EMBODIMENT The present invention has been described in the context of the preferred embodiment of the present invention. It should be understood that the person skilled in the art can change the invention described herein while achieving the present invention. Therefore, it is to be understood that the following description is not intended to limit the invention. Please refer to the first figure for a side view (4) of the radio frequency module of the present invention. The invention has no riding surface _ test device bit-test system Η) and - pressure plate 2 test system 1G has a genus material for the grounding treatment of the platform u,; t early ι 12 detailed description, to be followed The length of the test platform η of the plurality of test units 12 is implemented. The unit 12 forms an accommodating space 13, and the accommodation = L 『5 ^ ; 4 and the side surrounded by the first plane 14 Γ ο The shape is as shown in the first -®; therefore, the test printed circuit board 2...: the line RF mode, the chain 43 can be completely placed in the space when testing, J丄·^ Τ 〇d 卜' test flat s11 A plurality of through holes 18 are provided for locating the pin 17 of the mesh and the μ, and the positioning pin 17 is used for positioning the printed circuit board 40 when the positioning pin 17 is placed on the printed circuit board η. In the housing space 13 of the housing, the sliding platform 17 can be slid up and down along the positioning latch 17; and the elastic platform 19 such as the spring 200846685 and the at least one testing busbar pin 3 are disposed under the testing platform 11. The elastic device 19 gives the test platform η a sliding back and forth along the positioning pin 17 to return to the original initial position. Function; and the test circuitry in the bus pin 21 pressing the pressure plate 13 is in contact with the test platform of the printed circuit board 46 4〇 to perform test type. /, 'The pressure plate 21 of the present invention mainly forms a test environment with the accommodating space 13 such as a Farady Cage. The pressure plate 21 has a first surface electrically conductive, the first surface is actually a conductive adhesive layer 23, and the interlayer of the plate 21 has a buffer layer 24, when the printed circuit board 40 is placed on the space 13, The first surface of the pressing plate 21 is pressed onto the printed circuit board 4, so that the radio frequency module 43 is wrapped in a sealed space formed by the accommodating space 13 and the first surface, and forms a Faraday. The test environment of the box (FaradyCage), and the buffer layer 24 can buffer the impact force at pressure =. It is worth mentioning that the pressure plate 21 can be controlled by a pressing device 2 to be attached to the aforementioned printed circuit board 40. 2A to 2C and supplemented by reference to the first figure, the second A to the second c. show the top view, the bottom view and the side view of the radio frequency module of the present invention. The printed circuit board 40 of the present invention has a first surface 41 and a second side 42 opposite to the first surface 41, that is, the first and second sides are divided into two sides of the printed circuit board. The second side has a plurality of radio frequency modules 43 and electronic components, and the first surface 41 surrounds one of the first conductive circuit materials of the radio frequency module ,, as shown in FIG. a second conductive circuit 45, as shown, and a first conductive circuit 44 and a second conductive circuit, which are shown in FIG. 2C; wherein the first conductive circuit 44 is a printed circuit The circuit board 46 of the board 40 is connected to the terminal 11 200846685. When the printed circuit board 40 is in contact with the +, six conductive loop 44 corresponding to the contact 2222, the first surface of the second pressing plate 21 is _= I13 The edge of the side wall 15 and the circuit 45 are electrically conductive to the circuit board 40, and the second conductive layer, the printed circuit board 40 is also the conductive adhesive layer 23 on Tuesday. The hole 47 is used to place the positioning hole of the latch 17 to the side of the accommodating space 13. The conductive circuit 44 is accurately matched. Please refer to the third A to the 5th module test device and the materialless device. ", the paving invention of the radio frequency circuit board 40 is placed in the test and has the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 7 Connected, 7, the first conductive circuit 44 accurately corresponds to the "side wall 15 of each space 13, as shown in the third A picture and the third B picture = no. When the user drives the pressing device 2 such that the pressing plate 21 is downward, and the first surface of the pressing plate 21 is pressed against the printed circuit board 4, the second conductive circuit 45 contacts the first surface of the conductive, that is, the conductive adhesive layer. 23, the first surface is like a conductive surface to close the second conductive loop 45, as shown in the third c, wherein it is worth mentioning that when the second conductive loop 45 = touches the first surface of the conductive The radio frequency module 43 to be tested will be wrapped in the metal shielding space 25, that is, in a test environment such as a Farady Cage, and then the driving device 20 is moved downward to make the printed circuit board 40 The circuit system 46 is in contact with and tested with the test pin 30 of the test platform 13 as shown in the third d. Please refer to the fourth figure for a perspective view of another embodiment of the radio frequency module test apparatus of the present invention. The present invention corresponds to the mass production of the majority of the 12 12,466,685 wireless radio frequency module with the radio frequency module of the printed circuit board 4, the configuration of the pressure plate 21 and the test platform u is adjusted, as shown in the fourth figure, and other Corresponding elements and combinations are the same as those described above, and therefore are not described herein. The test platform n has a test unit I2 for corresponding to a plurality of printed circuit boards - and the size of the pressure plate 21 corresponds to the test platform ^, so that the pressing plate 21 is driven downward, and the first surface of the pressure plate 21 is pressed. When pressed against a plurality of printed circuit boards 40, each of the second conductive loops 45 contacts the conductive adhesive layer. The sub-radio RF module 43 is wrapped in a sealed space 25, that is, in a test environment such as a Farady Cage. . Therefore, the wireless radio frequency module testing device provided by the present invention has the advantages of simple structure and low cost, and can be used in any assembly and matching, and can also provide shielding and filtering electromagnetic interference to make the test smooth when testing the radio frequency right group. The effect of the completion, more importantly, the adjustment of the configuration of the pressure plate 21 and the test platform n of the present invention also has the advantage that the plurality of radio frequency module printed circuit boards 40 can be simultaneously tested under the test production. Various changes and modifications can be made without departing from the scope of the invention, and the invention is not limited by the description. Embodiments of the illustrated embodiments. 13 200846685 [Simple description of the diagram] The sound map Y diagram shows the side view of the radio frequency module test device of the present invention. #一Β图 shows a bottom view of the radio frequency module of the present invention. The figure shows a side view of the radio frequency module of the present invention. The second to third figures show the side view actuation diagram of the radio frequency module test device and the radio frequency module of the present invention. The fourth figure shows a perspective view of another embodiment of the radio frequency module test apparatus of the present invention. The fifth figure shows a perspective view of a conventional radio frequency module test device. [Main component symbol comparison description] 1 -... Radio frequency module test device ίο—Test system~Test platform 10 12...Test unit 13...Accommodation space 14...First plane side wall 16~Grounding process 17...Positioning pin 18...through Hole 19~elastic device 20...pressurizing device 21~pressing plate 200846685 23...conductive adhesive layer 24...buffer layer 25...enclosed space 30—test busbar pin 40—printed circuit board 41—first face 42...second face 43 ...the radio frequency module 44...the first conductive circuit 45--the second conductive circuit 46--the circuit system (electrical pin) 47...the positioning hole 50-the conventional printed circuit board 51-metal screen box 52- Test machine
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