200843677 九、發明說明： 【發明所屬之技術領域】 本發明有關於一種耐熱玻璃壺之結構方式及其電 . 熱方法，其於耐熱玻璃壺乃設計成無底部開口狀結構， 並將其上鍍有半導體發熱薄膜之底板以矽膠黏合於玻 璃壺底部，據以提供製造加工容易之玻璃壺結構及良好 電熱傳導效果之玻璃壺電熱方法。 ®【先前技術】 自古以來人們一依賴液體飲料以補充體内水份所 須，而部份飲料若能適當加溫或保持溫熱，除了具有暖 活感及補充人體所須熱能外，並能提昇熱飲料如中國 茶、咖啡、薑茶、牛奶飲料之風味及香氣。 通常以「電熱透明玻璃壺」作為承裝上述中國茶、 薑茶或咖啡等各類熱飲之容器，廣受多數現代人喜愛， φ 主因其具有透明、美觀、潔淨、易清理及安全保溫和加 熱等特性，而該電熱玻璃壺係以耐熱玻璃材質製成，其 . 上並附有電子加熱元件之基座。 ^ 傳統電熱保溫及加熱玻璃壺之結構，係屬耐熱玻璃 壺與電熱器分離結構方式，即直接將本身無加熱源之耐 熱玻璃壺置於内設電熱管之加熱基座上，經由耐熱玻璃 壺底部與加熱基座之金屬加熱板接觸而導熱。 該傳統運用接觸導熱方式主要包含有：導熱效果欠 佳、電熱板易導致燙傷、開放電熱板易滴入水滴而發出 5 200843677 底部老化、脆化等 咬咬作響及因受熱不句而產生玻璃壺 缺點。 為此本U人$研發完成前申請在案第的5133〇〇8 =「耐熱玻璃壺電熱方法」創作，其原理係將半導 體=電阻薄賴於—耐熱玻璃板或陶Μ等絕緣體 以材料㈣在該耐熱麵壺底部，據 =熱源傳遞至耐熱坡璃壺，能獲得良好保溫及加熱之200843677 IX. Description of the Invention: [Technical Field] The present invention relates to a structure of a heat-resistant glass pot and an electric and thermal method thereof, which are designed in a heat-resistant glass pot without a bottom opening structure and plated thereon The bottom plate of the semiconductor heat-generating film is bonded to the bottom of the glass pot with silicone rubber, thereby providing a glass pot electric heating method for manufacturing a glass pot structure with good processing and good electric heat conduction effect. ® [Prior Art] Since ancient times, people have relied on liquid beverages to supplement the body's water content, and some beverages can be warmed or warmed, in addition to warmth and replenishing the body's heat energy. Enhance the flavor and aroma of hot beverages such as Chinese tea, coffee, ginger tea, and milk beverages. Usually, the "electric transparent glass pot" is used as a container for all kinds of hot drinks such as Chinese tea, ginger tea or coffee. It is widely loved by most modern people. φ is mainly because it is transparent, beautiful, clean, easy to clean and safely insulated and heated. The electric glass pot is made of heat-resistant glass, and the base of the electronic heating element is attached. ^ The structure of traditional electric heat insulation and heating glass pot is a separate structure of heat-resistant glass pot and electric heater, that is, the heat-resistant glass pot without its own heating source is directly placed on the heating base of the electric heating tube, through the heat-resistant glass pot The bottom is in contact with the metal heating plate of the heating base to conduct heat. The traditional use of contact heat conduction methods mainly includes: poor heat conduction effect, hot plate is easy to cause burns, open electric heating plate is easy to drip into water droplets and emit 5 200843677 bottom aging, embrittlement and other biting sounds and glass due to heat Pot shortcomings. For this purpose, the U people applied for the application of the 5133〇〇8 = "heat-resistant glass pot electric heating method" before the completion of the research and development. The principle is that the semiconductor = electric resistance depends on the heat-resistant glass plate or ceramic insulator and other materials (4) At the bottom of the heat-resistant surface pot, according to the heat source transferred to the heat-resistant glass pot, good heat preservation and heating can be obtained.
…、得導效果。 /經研究前發明結構及加熱方法尚有改良空間，經研 發後獲此「耐熱玻璃壺結構及其電熱方法」發明，爱依 專利法申請發明專利。 Χ 【發明内容】 本發明「耐熱麵壺結構及其電熱方法」，係將财 熱玻璃壺底部設計成呈開口狀結構，並將其底面上鍍有 ^導體發熱電阻薄膜之底板以矽膠黏合於玻璃壺底 部’據以提供製造加工容易及熱傳導效I良好之電熱方 ^上述底板包含耐熱玻璃板、陶瓷板或任何可將半導 肢發熱電阻薄膜鍍在其上之板狀體。 另外，其底面上锻有半導體發熱電阻薄膜之底板， 其可直接將其黏合於玻璃壺底部或在其上加上隔離板 —併黏合於玻璃壺底部，其中所稱之隔離板（4) 包含.耐熱玻璃板、陶瓷板或任何可與底板（2)接合 6 200843677 之板狀體。 【實施方式】 參第一圖及第三圖所示，本發明Γ耐熱玻璃壺結 構及其電熱方法」，主要係將耐熱玻璃壺（3 )底部設 計成無底部之開口狀結構，並將其底面上鍍有半導體發 熱電阻薄膜（1 )之底板（2 )以矽膠黏合於玻璃壺（3 ) 底部。 本發明之底板（2)包含：耐熱玻璃板、陶瓷板或 任何可將半導體發熱電阻薄膜（1 )鍍在其上之板狀體。 芩第二圖及第四圖所示，其底面上鍵有半導體發熱 電阻薄膜（1 )之底板（2 )，其可直接將其黏合於玻 璃亞（3)底部或在其上加上隔離板（4)後再一併黏 合於玻璃壺底部，據以提供製造加工容易之玻璃壺結構 及獲得良好熱傳導效果之電熱方法。 上述隔離板（4)包含：耐熱玻璃板、陶瓷板、金 屬板或任何可與底板（2)接合之板狀體。 本發明「耐熱玻璃壺結構及其電熱方法」，除了本 案主要耐熱玻璃壺（3 )、底板（2 )、半導體發熱電阻 薄膜（1)及隔離板（4)外，其實施時當然尚包含於 财熱玻璃壺（3)底方之框體及基座，但其不包含本發 明範®壽在此不予贅言。 當半導體發熱電阻薄膜（1)之導電端（1 1 )、（ 1 2)電性連接電源後，即可適當加熱予耐熱玻璃壺（3 ) 7 200843677 ^之底板（2 )，並直接且均勻地導熱於耐熱玻璃壺 3)底邛或經隔離板（4)間接加熱，據以獲得安全 及良好之加熱及保溫效果。 【圖式簡單說明】 第一圖為本發明分解立體面。 第二圖為本發明實施施加上隔離板分解立體圖。 弟二圖為本發明第一圖之剖視圖。 第四圖為本發明第二圖之剖視圖。 【主要元件符號說明】 半導體發熱電阻薄膜（1 ) 導電端（1 1 )、（ 1 2 ) 底板（2 ) 耐熱玻璃壺（3) 隔離板（4)..., the effect is guided. / The invention structure and heating method have been improved before the research. After the research and development, the "heat-resistant glass pot structure and its electric heating method" was invented, and the Aiyi patent law applied for an invention patent. Χ 发明 发明 本 「 「 「 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热 耐热The bottom of the glass jug is provided to provide an electric heating method which is easy to manufacture and process and has good thermal conductivity. The bottom plate comprises a heat-resistant glass plate, a ceramic plate or any plate-like body on which a semi-ductive heat-generating resistive film can be plated. In addition, the bottom surface is forged with a bottom plate of a semiconductor heat-generating resistive film, which can be directly bonded to the bottom of the glass pot or a spacer plate is attached thereto - and bonded to the bottom of the glass pot, wherein the so-called partition plate (4) contains Heat-resistant glass plate, ceramic plate or any plate-like body that can be joined to the base plate (2) 6 200843677. [Embodiment] Referring to the first and third figures, the structure of the heat-resistant glass jug of the present invention and the electrothermal method thereof mainly design the bottom of the heat-resistant glass pot (3) as an open structure without a bottom, and The bottom plate (2) on which the semiconductor heating resistor film (1) is plated is bonded to the bottom of the glass jug (3) with silicone. The base plate (2) of the present invention comprises: a heat-resistant glass plate, a ceramic plate or any plate-like body on which the semiconductor heat-generating resistive film (1) can be plated.芩In the second and fourth figures, the bottom surface is provided with a bottom plate (2) of the semiconductor heating resistor film (1), which can be directly bonded to the bottom of the glass sub- (3) or to the isolation plate. (4) After that, it is bonded to the bottom of the glass pot together, thereby providing an electrothermal method for manufacturing a glass pot structure which is easy to process and a good heat conduction effect. The above-mentioned separator (4) comprises: a heat-resistant glass plate, a ceramic plate, a metal plate or any plate-like body engageable with the bottom plate (2). The "heat-resistant glass pot structure and electrothermal method thereof" of the present invention is of course included in the implementation of the main heat-resistant glass pot (3), the bottom plate (2), the semiconductor heat-generating resistive film (1) and the separator (4). The frame and base of the bottom of the solar glass pot (3), but it does not contain the invention. When the conductive ends (1 1 ) and (12) of the semiconductor heating resistor film (1) are electrically connected to the power source, they can be appropriately heated to the bottom plate (2) of the heat-resistant glass pot (3) 7 200843677 ^, and directly and uniformly The ground heat is heated in the heat-resistant glass pot 3) or indirectly through the insulation board (4) to obtain safe and good heating and heat preservation effects. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded perspective of the present invention. The second figure is an exploded perspective view of the application of the upper insulation plate in accordance with the implementation of the present invention. The second figure is a cross-sectional view of the first figure of the present invention. The fourth figure is a cross-sectional view of the second drawing of the present invention. [Description of main component symbols] Semiconductor heating resistor film (1) Conductive end (1 1 ), (1 2 ) Base plate (2) Heat-resistant glass pot (3) Isolation board (4)