200841050 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種濾光片之製作方法，尤其是藉由阻 抗材料以避免晝素區域底部在疏墨性電漿處理時降低底 部的親墨性，進而改善色料薄膜之平坦性。 一 【先前技術】200841050 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a filter, in particular, by using an impedance material to prevent the bottom of the halogen region from being inked at the bottom of the ink-repellent plasma treatment. To improve the flatness of the pigment film. [Prior Art]
隨著各種資訊科技的進展，目前大多的影像訊號皆已 由類比改為數位傳輸的方式，使得傳統的陰極射線顯示器 已被新一代的平面顯示器所取代，例如液晶顯示器、電漿 顯示器、發光二極體顯示器等。液晶顯示器由於成本與性 能上的各項優點，而成為平面顯示器當中相當重要的產 品。而液晶顯示器當中通常係使用彩色渡光片來達成彩色 化的顯示效果。彩色濾光片通常係架構於—透明玻璃基板 上，此透明玻璃基板上主要配置有用以遮光之里矩陣 (mack Matrix, _，以及對應於各㈣素排狀彩色 入晝㈣ 由於色料噴入的過程中，必須控制適當的色料量，否 則可能產生色料跨過黑鱗 中。因此在習知的製程中，通常會藉 矩 電漿處理’以使黑矩陣具有•墨性。^ 區域内的基板同時也會暴露在電漿虚 二* 8寸，畫素 區域内基板的親墨性會遭到破壞％境’使得畫素 區域後較不易附著至基板表面，而容f色料被滴入畫素 向谷易產生色料無法完整 4ADT/07002TW ； AU0609081 200841050 填滿晝素區域的缺點，進而會影響濾光片的色彩表現。 ^有鑑於此’實有必要提供一種新的濾光片製作方法， 以簡單且低成本的方式改善濾光片的品質。 【發明内容】 本發明一方面在於提供一種彩色濾光片之製作方 法，以改善色料薄膜之平坦性。 本發明另一方面在於提供一種彩色濾光片之製作方 法，藉由滴入阻抗材料至晝素區域中以避免底部在疏墨性 電漿處理時降低底部的親墨性，進而改善色料於晝素區域 之填滿狀況。 本發明一方面揭示一種形成彩色濾光片之方法，包含 下列步驟：提供一基板；形成一黑矩陣(Black Matrix，BM) 於基板上，以定義出至少一晝素(pixel)區域；滴入阻抗材 料於至少一畫素區域中；進行電漿處理，將黑矩陣之頂表 面改變為具有疏墨性質(lyophobic);去除阻抗材料，以暴 露出基板；滴入色料(coloring agent)於至少一晝素區域 中；以及固化色料，以產生平坦之色料薄膜(c〇1〇r film)。 在本發明的另一實施例中，更包含下列步驟：控制滴 入之阻抗材料於一預定量，使得阻抗材料得以完全覆蓋晝 素區域内之基板。 -6- 4ADT/07002TW ； AU0609081 200841050 在本發明的又一實施例φ，里 抗材料之預定量更進1牛^1 啤具有―側壁，且阻 更進步使付阻抗材料得以覆蓋望矩陣 之侧壁之至少一部份。 復皿”、、矩|早 附著ί:實施例中，疏墨性質使得色料不易 内t美材^而阻抗材料係用以保護晝素區域 内之基材不叉電漿處理之影響 (iy〇phiHc)>^^With the development of various information technologies, most of the current video signals have been changed from analog to digital transmission, making traditional cathode ray displays replaced by new generation flat-panel displays, such as liquid crystal displays, plasma displays, and light-emitting displays. Polar body display, etc. Due to the advantages of cost and performance, liquid crystal displays have become quite important products in flat panel displays. In the liquid crystal display, a color light-emitting sheet is usually used to achieve a color display effect. The color filter is usually constructed on a transparent glass substrate. The transparent glass substrate is mainly provided with a matrix for shielding the light (mack matrix, _, and corresponding to each (four) of the color-like color input 四 (4) due to the color ink injection In the process, the appropriate amount of color must be controlled, otherwise the color material may be generated across the black scale. Therefore, in the conventional process, the photoresist is usually processed by the moment to make the black matrix have ink. The substrate inside will also be exposed to the plasma virtual two 8 inch, the ink affinity of the substrate in the pixel area will be destroyed. The environment is less likely to adhere to the surface of the substrate after the pixel area, and the color material is Dropping in the pixels to the valley easy to produce color can not be complete 4ADT/07002TW; AU0609081 200841050 fills the shortcomings of the halogen region, which in turn affects the color performance of the filter. ^ In view of this, it is necessary to provide a new filter The manufacturing method improves the quality of the filter in a simple and low-cost manner. SUMMARY OF THE INVENTION An aspect of the present invention provides a method of fabricating a color filter to improve the flatness of a toner film. Another aspect of the invention provides a method for fabricating a color filter by dropping an impedance material into a halogen region to prevent the bottom from being ink-repellent during the treatment of the ink-repellent plasma, thereby improving the coloring of the color. A filling condition of a prime region. One aspect of the invention discloses a method of forming a color filter, comprising the steps of: providing a substrate; forming a black matrix (BM) on the substrate to define at least one halogen (pixel) region; dropping the impedance material into at least one pixel region; performing plasma treatment to change the top surface of the black matrix to have lyophobic properties; removing the impedance material to expose the substrate; dropping color a coloring agent in at least one of the halogen regions; and curing the colorant to produce a flat color film (c〇1〇r film). In another embodiment of the present invention, the method further comprises the following steps: controlling The infiltrated impedance material is at a predetermined amount so that the resistive material completely covers the substrate in the halogen region. -6-4ADT/07002TW; AU0609081 200841050 In another embodiment of the present invention, φ, 耐材The predetermined amount of material is further increased to 1 牛 ^1. The beer has a "side wall, and the resistance is further improved so that the auxiliary impedance material can cover at least a part of the side wall of the matrix. "Complete dish", moment | early adhesion ί: in the embodiment The nature of the ink repellent makes the color material difficult to be inside the material and the impedance material is used to protect the substrate from the plasma in the halogen region (iy〇phiHc)>^^
電漿處理之步驟進一步包 面’而此薄層具有疏墨性 在本發明的再一實施例中， 含形成一薄層於黑矩陣之頂表 質。 、 【實施方式】 以下5兒明依據本發明的其中一種實施例，首先提供基 板100並形成黑矩陣12〇於基板1〇〇上，如圖ία所示即 為本實施例之基板100的俯視圖。圖1B則為圖1A中基 板100延AA’線的侧向剖面圖。在本發明的圖式中，黑矩 陣120疋義出二個晝素區域122、I24、及1；26，分別為作 為彩色濾光片的三種顏色的晝素。然而在此必需注意的 是，圖式中僅顯示三個晝素區域是為了說明方便起見，而 熟此技藝者當知道本發明的黑矩陣120可以有較多數量或 較少數量的畫素區域，而並不會影響本發明的實施。黑矩 陣120具有頂表面128與側壁129，而黑矩陣120所定義 的畫素區域122、124、及126則分別暴露出基板1〇〇的表 面 102、104、及 106。The step of plasma treatment further envelops' and the thin layer has ink repellency. In yet another embodiment of the invention, a top surface is formed which forms a thin layer on the black matrix. [Embodiment] According to one embodiment of the present invention, a substrate 100 is first provided and a black matrix 12 is formed on the substrate 1A. The top view of the substrate 100 of the present embodiment is shown in FIG. . Figure 1B is a side cross-sectional view of the substrate 100 of Figure 1A taken along the line AA'. In the drawings of the present invention, the black matrix 120 defines two halogen regions 122, I24, and 1; 26, which are three color halogens as color filters, respectively. However, it must be noted here that only three halogen regions are shown in the drawings for convenience of explanation, and those skilled in the art know that the black matrix 120 of the present invention can have a larger number or a smaller number of pixels. The area does not affect the implementation of the present invention. The black matrix 120 has a top surface 128 and sidewalls 129, and the pixel regions 122, 124, and 126 defined by the black matrix 120 expose the surfaces 102, 104, and 106 of the substrate 1 respectively.
4ADT/07002TW ； AU060908I 200841050 接著藉由喷頭140將阻抗材料142滴入至圖1B中所 示基板100的晝素區域122、124、及126中，如圖2所示。 圖2中僅繪示滴入一滴阻抗材料142至晝素區域122中係 說明方便起見，而本發明在滴入阻抗材料142上並未作任 何限制，例如可以任何順序將阻抗材料142分別滴入晝素 區域122、124、及126中，或在另一實施例中亦可使用多 個噴頭140來加速滴入的程序，或者在又另一實施例中， 依實際設計情形而亦可選擇性不滴入阻抗材料〗42至其中 的幾個晝素區域中。在本實施例中，阻抗材料142包括一 親墨材料與一散佈劑，而在其它實施例中，阻抗材料142 亦可以使用其它具有類似性質的物質。阻抗材料142中所 使用的親墨材料可包括氧化鈦或二氧化矽或其它類似 物，阻抗材料142中所使用的散佈劑則可包括水或乙醇或 其它類似物。 圖3A顯示一種依照本發明實施例之電漿處理的示意 圖。如圖3A所示，圖2中所滴入之阻抗材料142分別形 成阻抗材料薄膜152、154、及156於晝素區域122、124〔 及126中，並完全覆蓋晝素區域122、124、及126内之基 板表面102、104、及106。電漿處理裝置ι6〇係用於對基 板loo進行電漿處理，而電漿處理為一疏墨性改質技術"; 在圖式中僅為一示意方塊而未繪示詳細的元件，然其並不 影響本發明之實施。藉由此電漿處理，黑矩陣12〇 ^頂表 面128會被改變為具有疏墨性質，然而同時藉由阻抗材^ 薄膜152、154、及156，分別可以保護晝素區域122、124、 4ADT/07002TW ； AU0609081 200841050 及126中原本暴露的基板表面1〇2、i〇4、及106。因此， 在將黑矩陣120的頂表面變更為具有疏墨性質的同時，藉 由阻抗材料薄膜152、154、及156的保護，又得以維持基 板表面102、104、及106的親墨性質。 本餐明貝可以有§午多不同的貫施方式，而非限定在本 文中所敘述的特定實施方式。例如圖3B顯示另一種依照 本發明實施例之電漿處理的示意圖。圖3B與圖3A不同 之處在於控制所滴入的阻抗材料142於適當的量，使得阻 抗材料薄膜153、155、及157得以覆蓋黑矩陣12〇之側壁 129。因此，阻抗材料薄膜153、155、及157除了保護^ 板表面102、104、及106之外，更可以進一步保護黑矩陣 120之側壁129。當然，視實際實施本發明時的不同狀況， 阻抗材142的量可以做適度的調整，而僅覆蓋黑矩陣12〇 之侧壁129的一部分。 … 圖4顯示為圖3A之基板1〇〇完成電漿處理的示意 圖。此時藉由電漿處理而會在黑矩陣12〇的頂表面128 ^ 形成疏墨性質薄層17〇。在此必需注意岐，本發明的圖 式僅為示意圖，以便容易而清楚地說明本發明，亦即圖式 中的各元件並未按照比例繪製。接著，去除阻抗材料薄膜 52 154及156 ’以恭露出基板表面1〇2、1〇4、及1〇6。 此步驟可以使用水或其它溶劑將阻抗材料薄膜152、154、 及去除，使得本發明得容易地實施而不需使用複雜的 製程或附加昂責的設備。 4ADT/07002TW ； AU0609081 200841050 在去除阻抗材料薄膜152、154、及156並暴露出基板 表面102、104、及106之後，藉由喷頭182、184、及186 而滴入色料183、185、及187至圖4中所示基板100的畫 素區域122、124、及126之中，如圖5所示。晝素區域 122、124、126區分為至少三組顏色區域(例如是藍色、綠 色與紅色），色料183、185、及187使用對應的三原色色 料的其中之一，分別填入對應的顏色區域，以形成彩色濾 光片。疏墨性質薄層170使得色料不易附著於黑矩陣120 之頂表面128，同時基板表面102、104、及106仍保持著 親墨性質，使得色料183、185、及187易於附著於基板表 面102、104、及106,而不會產生色料覆蓋不完全或不均 勻的問題，如圖6所示之色料分佈192、194、及196。 最後’固化色料183、185、及187，以產生平坦之色 料薄膜202、204、及206，如圖7所示。如前所述，色料 完全地覆蓋基板表面102、104、及1〇6，使得固化後的色 料薄膜202、204、及206會具有平坦且均勻的良好性質。 在本實施例中，固化步驟係使用乾燥製程，使得色料由液 悲轉化為固態，而在其它實施例中，固化步驟亦可以視色 料性質的不同而使用不同的方式。 二上述之實施例係用以描述本發明，然本發明技術仍可 有4多之修改浦彳b。因此，本翻並不限於以上特定實 施例的描述，本發明㈣請專利範圍係欲包含所有此類^ 改與變化，以能真正符合本發明之精神與範圍。一 4ADT/07002TW ； AU0609081 -10- 200841050 【圖式簡單說明】 圖1A顯示-種依照本發明實施例之基板的俯視圖； 圖1B為圖1A中基板的側向剖面圖； 圖2顯示滴入阻抗材料至圖1B中所示基板的晝素區 域； 圖3A顯示一種依照本發明實施例之電漿處理的示意 圖， 圖3B顯示另一種依照本發明實施例之電漿處理的示 意圖， 圖4顯示為圖3A之基板完成電漿處理的示意圖； 圖5顯示滴入色料至圖4中所示基板的晝素區域； 圖6顯示色料於基板中的分佈圖；以及 圖7顯示固化色料而形成色料薄膜的示意圖。 【主要元件符號說明】 100基板 102、104、106基板表面 120 黑矩陣 122、124、126晝素區域 128 黑矩陣頂表面 129 黑矩陣側壁 140 喷頭 142 阻抗材料 152、154、156阻抗材料薄膜 153 - 155 - 157阻抗材料薄膜 160電漿處理裝置 4ADT/07002TW ； AU0609081 -11 - 2008410504ADT/07002TW; AU060908I 200841050 Next, the resistive material 142 is dropped into the pixel regions 122, 124, and 126 of the substrate 100 shown in FIG. 1B by the showerhead 140, as shown in FIG. FIG. 2 only shows that dropping a drop of the impedance material 142 into the halogen region 122 is convenient. However, the present invention does not impose any limitation on the dropping impedance material 142. For example, the impedance material 142 may be dropped in any order. In the pixel regions 122, 124, and 126, or in another embodiment, a plurality of nozzles 140 may be used to accelerate the instillation process, or in still another embodiment, depending on the actual design situation, Sex does not drip into the impedance material 〖42 to several of the halogen regions. In the present embodiment, the resistive material 142 includes an ink receptive material and a dispersing agent, while in other embodiments, the resistive material 142 may also use other materials having similar properties. The ink receptive material used in the resistive material 142 may include titanium oxide or ceria or the like, and the dispersing agent used in the resistive material 142 may include water or ethanol or the like. Figure 3A shows a schematic of a plasma treatment in accordance with an embodiment of the present invention. As shown in FIG. 3A, the impedance material 142 dropped in FIG. 2 forms the resistive material films 152, 154, and 156 in the halogen regions 122, 124 [and 126, respectively, and completely covers the halogen regions 122, 124, and Substrate surfaces 102, 104, and 106 within 126. The plasma processing device ι6 is used for plasma treatment of the substrate loo, and the plasma treatment is an ink repellent modification technology; in the drawings, only a schematic block is not shown, and detailed components are not shown. It does not affect the implementation of the invention. By this plasma treatment, the black matrix 12 top surface 128 is changed to have ink repellent properties, but at the same time, the resist regions 122, 124, and 4ADT can be protected by the resist material films 152, 154, and 156, respectively. /07002TW ; AU0609081 200841050 and 126 originally exposed substrate surfaces 1, 2, i 〇 4, and 106. Therefore, while the top surface of the black matrix 120 is changed to have ink repellent properties, the ink receptive properties of the substrate surfaces 102, 104, and 106 are maintained by the protection of the resistive material films 152, 154, and 156. This meal may have a different implementation of § noon, and is not limited to the specific embodiments described herein. For example, Figure 3B shows another schematic diagram of plasma processing in accordance with an embodiment of the present invention. 3B differs from FIG. 3A in that the dropped impedance material 142 is controlled to an appropriate amount such that the resistive material films 153, 155, and 157 are covered by the sidewalls 129 of the black matrix 12''. Therefore, the resistive material films 153, 155, and 157 further protect the sidewalls 129 of the black matrix 120 in addition to the protective board surfaces 102, 104, and 106. Of course, depending on the actual situation in which the present invention is actually implemented, the amount of the resistive material 142 can be moderately adjusted to cover only a portion of the sidewall 129 of the black matrix 12A. Fig. 4 is a view showing the completion of the plasma treatment for the substrate 1 of Fig. 3A. At this time, by the plasma treatment, a thin layer 17 of the ink-repellent property is formed on the top surface 128 of the black matrix 12 . It is to be noted that the drawings of the present invention are only a schematic representation of the present invention, and that the elements in the drawings are not drawn to scale. Next, the resistive material films 52 154 and 156 ' are removed to expose the substrate surfaces 1〇2, 1〇4, and 1〇6. This step can use the water or other solvent to remove the resistive material films 152, 154, and the like, so that the present invention can be easily implemented without the use of complicated processes or additional equipment. 4ADT/07002TW; AU0609081 200841050 After the resistive material films 152, 154, and 156 are removed and the substrate surfaces 102, 104, and 106 are exposed, the colorants 183, 185 are dropped by the shower heads 182, 184, and 186, and 187 to among the pixel regions 122, 124, and 126 of the substrate 100 shown in FIG. 4, as shown in FIG. The halogen regions 122, 124, and 126 are divided into at least three color regions (for example, blue, green, and red), and the toners 183, 185, and 187 use one of the corresponding three primary color materials, and are respectively filled in corresponding colors. The color area to form a color filter. The thin ink-repellent thin layer 170 makes it difficult for the toner to adhere to the top surface 128 of the black matrix 120, while the substrate surfaces 102, 104, and 106 still retain the ink-receptive properties, so that the toners 183, 185, and 187 are easily attached to the substrate surface. 102, 104, and 106, without the problem of incomplete or uneven color coverage, such as the toner distributions 192, 194, and 196 shown in FIG. Finally, the colorants 183, 185, and 187 are cured to produce flat color films 202, 204, and 206, as shown in FIG. As previously mentioned, the colorant completely covers the substrate surfaces 102, 104, and 1〇6 such that the cured color films 202, 204, and 206 will have flat and uniform good properties. In this embodiment, the curing step uses a drying process to cause the colorant to be converted from a liquid to a solid state, while in other embodiments, the curing step can also use a different manner depending on the nature of the color. The above embodiments are used to describe the present invention, but the present invention can still have more than four modifications. Therefore, the present invention is not limited to the description of the specific embodiments described above, and the invention is intended to cover all such modifications and changes to the true spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A is a plan view of a substrate according to an embodiment of the present invention; FIG. 1B is a side cross-sectional view of the substrate of FIG. 1A; FIG. 2 is a view showing a drop impedance of the substrate. The material is to the halogen region of the substrate shown in FIG. 1B; FIG. 3A shows a schematic diagram of plasma processing according to an embodiment of the present invention, and FIG. 3B shows another schematic diagram of plasma processing according to an embodiment of the present invention, and FIG. 4 shows Figure 3A is a schematic view showing the completion of the plasma treatment of the substrate; Figure 5 shows the halogen region dropped into the substrate shown in Figure 4; Figure 6 shows the distribution of the toner in the substrate; and Figure 7 shows the cured colorant. A schematic diagram of forming a colorant film. [Major component symbol description] 100 substrate 102, 104, 106 substrate surface 120 black matrix 122, 124, 126 halogen region 128 black matrix top surface 129 black matrix sidewall 140 nozzle 142 impedance material 152, 154, 156 impedance material film 153 - 155 - 157 impedance material film 160 plasma processing device 4ADT/07002TW; AU0609081 -11 - 200841050
170疏墨性質薄層 182、 184、186 喷頭 183、 185、187 色料 192、194、196 色料分佈 202、204、206 色料薄膜 -12 4ADT/07002TW ； AU0609081170 thin ink layer 182, 184, 186 nozzle 183, 185, 187 color material 192, 194, 196 color material distribution 202, 204, 206 color film -12 4ADT/07002TW; AU0609081