TW200840466A - Computer heat-dissipating system, non-fan heat-dissipating device and heat-dissipating method - Google Patents

Abstract

This invention discloses a low-noise computer heat-dissipating system, non-fan heat-dissipating device and heat-dissipating method, suitable for using in related electric products. This device includes a casing, fans, non-fan heat-dissipating device. That non-fan heat-dissipating device has two end openings and one circumferentially sealed air passageway; the air passageway runs through the heat-dissipating part of non-fan heat-dissipating device, with one end linked to air outside the casing and the other end linked to the inner of casing. The vent holes of the fan and the air passageway are provided on that casing. There are one or more fans can exhaust air out of or blow air into the casing so as to create the pressure difference between the inside and outside of the casing. Under the pressure difference, the air current flows through the air passageway and its vent holes.

Description

200840466 IX. Description of the invention: [Technical field to which the invention pertains] t-fabrication is a method of dissipating heat of an electronic product, which is particularly related to a kind of scorpion scorpion/,,, clothing, and government and heat dissipation methods. Political system and heat sink in the field of books and magazines [Prior Art]

The depth of the sub-products has come to the forefront of the social production and life of the individual L i r money performance t user experience is directly related to social production efficiency. The second-two computer, the sub-product field occupies an important position, the electric yak will generate heat when it is running, and the high-powered electric power must be 2 pieces, and the heat-dissipating device is installed so that its 4 temperature county is in the allowable range t ' Too high a working temperature can cause its performance to deteriorate or even be new. Existing computer hot, hot electronic components mainly include * installed on the motherboard, one, processing $ (CPU 'Central processing unit), installed on the J card _ processor (10) ' graphic pressing unit) two installation, Gu (10) power Electronic components, etc., where the motherboard, display card, and power supply are components. Sometimes, parts such as electric hard drives that require large heat sinks also need to dissipate heat. 1 Existing electronic components or components that require heat dissipation are generally cooled by a heat sink. A fan heat sink consists primarily of a heat sink mounted on a computer electronic component or component that requires = underheating and a cooling fan mounted on the heat sink. The heat sink absorbs heat from the high heat generating electronic component. The heat radiating fan supplies air to the heat sink and carries away heat from the heat sink. The cooling fan here achieves the effect of enhancing heat dissipation. Generally, in addition to the power supply, each of the fan heat sinks basically discharges heat directly into the electric 5 V-200840466 brain casing. In order to dispose of each fan in the casing and discharge it to the outside of the casing, you can install a computer with a general configuration on the computer case, and more often take the right fan. For the fan outside the casing, the fan of the power supply is turned to the == part, all; = flat electricity = ... positive * work 'heat dissipation effect even better than the organic shell. As is well known, the fan generates noise, the number of which is equal to 4 = the CPU, the GPU, and the heat sink in the power supply. The heat sink is generally installed with fan noise. Noise harms the health of the human body and reduces people's work efficiency.疋τ, worries = how this i can minimize the heat dissipation of the computer while cooling the heat effect =,, First, ^ has become the direction of the computer industry. Since the low-speed t-H-sounding fan is not only capable of Wei noise, but also satisfies, people have designed and produced a variety of silent (10) heat sinks with a larger aperture, and a mute display. Mute,. At present, the cooling fan port on the computer power supply =, the stem reaches 120 mm (mm), some manufacturers even reached 1 mm 'fan special structure on the fan device can also reach 12 〇: 'But most manufacturers The cooling fan diameter on the CPU heat sink is at or around 90nun; the diameter of the display card fan is limited to 6Gmm due to the space it is in; the fan diameter on the case is 8 () face, 9 leg σ mm There are; hard disk heat sinking usually has two 6〇_ wind 200840466 fans, which fan heats the surface of the hard disk. % Increase the fan diameter on each heat sink and reduce its speed at the same time. The 1 can reduce the electric age sound. However, due to the large number of fans and the large and small caliber, the noise reduction is very large. Limited, so 'the noise of the computer is still solved by the electric world. Irmr In recent years, a home theater PC with remote control function (^Ϊ6Γ PerS〇nal has a tendency to smash, no doubt, the entertainment function of HTPC is in conflict with the computer’s ^曰^, and the existing dew There is no unique solution to the two steps: sang catches the computer cooling system (4) 曰 requirements, he has the electronic components of the hot electronic components - how to meet the heat dissipation requirements at the same time [invention content] 埶备日 (10) aims to provide - The kind of scatter and the application of the system, the grading of the age and the transposition _ good level can be significantly lower than the existing computer ^ and 2 have I material i invented another purpose is to provide - kind of divergence Method, the library uses the following technical solutions to achieve the object of the invention. A computer cooling system, including machine debris, white set; said non-equal release device fan and heat fan cooling ramp 'the air duct One end is connected to the said; the closed wind is said to be connected to the internal environment of the casing, and the other end is connected to the heat dissipating portion of the device; the casing is 7 94040466, the ventilation hole of the wind; the fan The number is one More than one, 士:, 通, the fan vents exhausting air to the outside of the casing or to the inner blast 'from (four) into the casing material, the pressure difference, under the pressure difference The airflow flows through the air duct and the air vent thereof. In the Bayesian mode, the fanless heat sink includes a diffuser, and the air duct is directly disposed on the heat sink. In an embodiment, the fanless heat dissipating device comprises a diffuser and a cover, and the cover is formed by the cover to form a plurality of the air passages, and the air passage is dispersed in the air. The fanless heat sink further includes a wind guide cylinder; the end of the air duct is in communication with the air duct, and the other end is in communication with air outside the casing; the air duct forms another Preferably, the end of the air guiding tube communicating with the air outside the casing has a flange, the flange is filled with a sponge, and a soft rubber (four) material. The big end of the cone Preferably, the air guiding cylinder is in air communication outside the cone casing.

Preferably, the air passage is connected to the air outside the casing with a flexible material such as sponge or soft rubber. In an embodiment, the heat sink includes a base, a substrate, and a heat dissipation fin; the base is in the shape of a cone or a cylinder; the substrate is symmetrically disposed on a tapered surface of the base or The cylinder surface is an "X" shape when viewed from the top of the pedestal; the heat dissipation fins are distributed on the pedestal and the substrate, and are parallel to the angle bisector of the angle between the substrates on both sides of the heat dissipation fin; The cover is sleeved on the outside of the heat sink along the central axis of the base, and the outermost edge of the heat sink is attached. In one embodiment, the heat sink includes a substrate, a heat pipe, and 8 200840466 political fins; the cover includes two sub-ducts, and the sub-ducts are embedded between the sub-ducts a heat sink; the heat sink fin is parallel to the substrate; a section of the heat pipe is embedded on the substrate, and another section passes through the heat sink fin; ... the sub wind guide is close to the substrate One end of the cover is closed, and an opening adjacent to the outer edge of the heat sink is provided with an opening, and the number of the openings gradually decreases in a direction away from the substrate by the sub-duct. In one embodiment, the heat sink includes a substrate, a heat pipe and a heat dissipation fin; the heat dissipation fin has a window in between; the heat dissipation fin is parallel to the substrate; and a section of the heat pipe is embedded in The other two sections of the substrate pass through the heat dissipating fins; the cover object is embedded in the window of the heat dissipating fins, and the cover object is not provided with an opening, and the number of the openings is along The cover gradually decreases in a direction away from the substrate. In an embodiment, the cover is a cover plate, and the heat dissipation tab is disposed on the substrate; the cover is disposed on the heat dissipation fin and opposite to the substrate; the substrate, the heat dissipation fin, and The cover plate forms a plurality of said air ducts = In one embodiment, the base plate is a housing of a power source. In the embodiment, the cover is a housing of a power source, the heat sink is disposed on the wall of the electromagnet body, and the diffuser is disposed on the substrate. The substrate is opposite to the housing. . In an embodiment, the heat sink is a heat dissipation plate; the heat dissipation plate is provided with an elongated through hole, and the through hole is the air passage. In the embodiment, the fanless heat sink further includes an air duct; the end of the air duct is in communication with the air duct, and the air is connected to the outside of the casing; the air duct Forming another bribe, in the embodiment, the fanless heat sink comprises a hard disk heat sink heat dissipating device; the hard disk fanless recording is set as a rectangular box, 9 200840466 phase::; The upper and lower surfaces of the rectangular box and the hard disk are formed on the side surface, and the fan of the hard disk is made of a fan. =, the fan has a diameter of 80 mm or more. The case

w position cover and right side cover; == solid denomination and right weave (four) central part Preferably, the casing is further provided with other ventilation holes. - „装置“ includes a heat-dissipating portion of the fanless heat-dissipating device having two ends open, surrounded by a closed air, and the wind-free light-heating device includes a heat sink The air duct is directly disposed. The windless heat sink includes a heat sink, ten, and two: the heat sink includes a heat sink Korean film; the heat sink and the mask In the embodiment, the fanless heat sink further includes a guide; the end of the air duct and the wind The air duct forms another duct. Preferably, the air duct has a flange at one end away from the heat sink, and the flange is affixed with a flexible material such as sponge or soft rubber. Preferably, the air guiding cylinder is a cone, and the small end of the cone is in communication with the air duct. 200840466 Preferably, one end of the air duct is affixed with a soft material such as sea brocade and soft rubber. In an embodiment, the heat sink includes a base, a substrate, and a heat dissipation fin; a substrate or a cylinder; the substrate is crossed by a pair of cloths, and on the pedestal_face or cylinder surface, viewed from the pedestal portion, "X gas"; the heat dissipation fins are distributed And the pedestal on the base and the substrate parallel to the angle between the two sides of the substrate of the political fin; the cover is sleeved on the outside of the heat sink along the central axis of the base, and $ The outermost edge of the heat sink is attached. In one embodiment, the heat sink is composed of a substrate, a heat pipe, and a heat dissipation sheet; the cover includes two sub-ducts, and the heat sink is embedded between the sub-tubes; The heat dissipation fin is parallel to the substrate; a section of the thermal guide is embedded on the substrate, and another section passes through the 埶 fin; ” the sub-duct is closed near one end of the substrate, and An opening adjacent to an outer edge of the heat sink is provided with an opening, the number of the opening gradually decreasing along a direction in which the sub-duct is away from the substrate. In an embodiment, the heat sink comprises a substrate, a heat pipe and a heat dissipating fin; a window is opened in the middle of the heat dissipating fin; the heat dissipating fin is parallel to the substrate; a section of the heat pipe is embedded in the other side of the substrate a heat dissipating fin; the cover object is embedded in a window of the heat dissipating fin, the cover is provided with an opening, and the number of the opening gradually decreases along a direction in which the cover retreats from the substrate In one embodiment, the cover is a cover plate, and the heat dissipation fin Arranging on the substrate; the cover is disposed on the heat dissipation fin and opposite to the substrate; the substrate, the heat dissipation fin and the cover plate form a plurality of the air channels. In an embodiment, the substrate The housing of the power supply. 11 200840466 In the embodiment, the cover is a housing of a power supply, the inner wall of the power supply housing, the heat dissipation fins are disposed on the substrate In the second embodiment, the heat sink is a heat sink, and the heat sink has a long through hole, and the through hole is the air passage. The heat fan heat dissipating device further includes a guide 2: the end of the air duct is connected to the air duct. The guide air duct includes a hard disc having no thickness, and the:: moment ί The opposite side is opened higher than the hard disk; the upper and lower surfaces of the dissimilar box form a heat dissipation with the hard disk surface; =^ shape =:= is disposed through the heat sink, the body; The airflow flows through the air duct. (4) The observation on the 11th passage: (=) The law includes: - the heat sink is all two = body closed The method of the casing is: in the end of the pass, the fan passes through the hurricane or is 8 mm or more than 80 mm outside the non-completely sealed non-completely closed casing. The diameter of the fan 12 200840466 can be seen in the case of the present invention. The computer of the present invention includes a machine or a component, and is provided with two air communicating ends of the other end and the outer casing of the casing, π & The internal environment of the casing is connected and passes through the heat dissipating portion of the heat dissipating device. The ventilation hole of the 5=ί=jin? air duct is opened on the casing and is basically maintained at other positions. Exhaust air, or all the way to the machine to rectify, when it exhausts air outside the casing i so that the air pressure inside the casing is lower than the air pressure outside the casing == the ventilating hole flows into the fanless heat sink: wind 1 wind... The _ inside the casing is higher than the _ outside the casing, and the air inside the casing flows into the air duct of the fanless heat sink and is exchanged, and then turned outside the casing. At the same time, due to the high degree of airtightness of the air casing, the fan in the computer heat dissipation system of the present invention is a common fan of all the heat fan heat sinks, and The number can be less than the heat sink seam * will affect the heat dissipation effect. Because according to the thermal design theory of electricity, the total heat dissipated by forced air cooling is proportional; proportional to the scatter (four) health _, proportional to the heat dissipation temperature and the air temperature; in the present invention, multiple heat dissipation Although the number of cooling fans sharing a small number of devices is reduced by the flow rate of a single air-dissipating device, the heat-dissipating area of one device can be made large, and the gas-distribution through the heat-dissipating I is further controlled. Outside φ, the heat dissipation 9 of the brewing computer of the present invention can be equivalent to the use of a single-lying fan for each heat-dissipating device, ',,, and, and it can be seen that the computer-distributed system in the computer cooling system of the present invention constitutes a financial machine. Light body, the three are very good; Heng Guanguang can obtain i talent, culvert, first dip between the heat dissipation effect and the (four) sound, the less the other vents on the casing, the less the flow The higher the ratio, the more fans you need. Only one large, Omm silent fan is installed in a highly sealed enclosure, which greatly reduces the noise level of the computer. The heat dissipation method of the present invention is not directly blown out by the fan, and the fan forms a gas pressure inside and outside the casing, and the airflow inside and outside the casing flows, and the airflow flows through the fan heat dissipation device. Air ducts and heat exchange. - The heat dissipation method described in the invention can not only heat the computer system, but also heat the other electronic products and the surface products, and the heat dissipation effect is good and the noise is low. DETAILED DESCRIPTION OF THE INVENTION The present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. The above is for reference only and is not intended to limit the invention. In the embodiments of the present invention, the same reference numerals indicate the same or similar components. The computer cooling system and the heat dissipating device provided by the present invention do not directly use the airflow blown by the fan to dissipate heat, but use a fan to exhaust air outside the casing or blast into the casing to generate a difference in air pressure inside and outside the casing. Under the action of the air pressure difference, the wind of the inside and outside of the communicating case of the fanless heat sink is the same as the air flow 14 200840466 higher flow 'where the air pressure difference is closed by the v

Brain dilated hurricane. Therefore, the fanless heat sink in the electric pole of the present invention can use the common fan to reduce the number of fans used, and achieve the first embodiment of the computer cooling system for reducing computer noise. Embodiments - including cpu fanless scatter, display card wearable clothing, hard disk fanless heat sink, power supply fanless diffuser device, wind wire. In the invention of U Zhenghe 3, the embodiment of the cpu fanless heat sink includes three kinds of implementations of the implementation of the fanless heat sink embodiment. See Fig. mi, the fanless heat sink includes heat dissipation. 11 wind, air duct 122 and sea, cotton 13. The radiator u is (10) = the heat dissipation part of the fan-hot clothing. The heat sink n is composed of a base lu, a substrate, and a hot fin 113 of the port 1. The three are a whole; the shape of the base ^ is a cone or a cylinder (a cone in the figure) 埶 = the base m is relatively In the cylindrical base, both the conduction heat is transmitted along the same direction of the second direction, and the weight of the heat sink 11 can be reduced; the substrate 112 is symmetrically arranged on the tapered surface or the cylindrical surface of the base. The heat sink fins 113 are symmetrically distributed on the base and the substrate, and are parallel to the angle bisector of the angle between the substrates on both sides of the heat dissipation fins. The heat sink should be high enough, typically about twice the height of a similar fan heat sink. The cover body 121 has the same outer shape as the heat sink 1 , and is sleeved on the outside of the heat sink U along the central axis of the heat sink u and is attached to the outer surface thereof, while the lower half of the heat sink 11 is exposed to the height 1/ 4~1/3 or so; heat dissipation 15 200840466 The grooves 114 between the fins 113 and the cover 121 form a duct of the cpu fan cooling device. The air guiding cylinder 122 is a cone cylinder, wherein the cover m is reduced, and the other end is close to the inner wall of the casing, and ==^ near the inner wall of the casing has a flange 123; the air guiding cylinder 122 forms another_ _ Duanfeng this. The air guiding cylinder 122 adopts a cone shape to facilitate airflow through the section of the air passage. This section of the wind is connected to the air outside the casing through the ventilation holes of the air duct. 〇 13 (4) The county can be placed. _13 posted on the person 1 in the CPU fanless heat sink and the inner wall of the case, 5 ′ P cattle lower the air conditioning « 122 and the chassis between the requirements. Sponge = can also be replaced with other flexible _, such as soft riding materials. The cover 121 and the air guide 122 can be used as the cover; the end of the cover is placed on the cover core. The independent air guide means the end of the independent air guide is placed on the outer side of the radiator u. The clothing is attached, and the other end is close to the inner wall of the casing and the outer casing of the heat sink 11 is shown in the figure for the Intel LGA775 series CPU. See the second diagram for the η section view. In the second figure, two heats: shape two = hot chips, and 111 is the base. The schematic diagram of the combination of the embodiment of the device shown in the figure is shown in the third figure. The ΐI machine heat sink 1G wire is only on the motherboard 15 of the motherboard 15 _!3 = 妇^ (Figure 4) The flat plate has a duct 14, a duct ^ knife. C heat fan heat sink 1 inside is divided into i segments, - H ends ^ mouth, surrounded by. a plurality of air passages formed by the plurality of slots 122 formed by the air ducts of the air ducts 14 and the radiators 11 and the heat sinks 11; The plurality of strips are between heat dissipation fins. ′,, • I. Invented the CPU fanless heat sink embodiment of the second embodiment of the exploded view. The following is a description of the difference between the second embodiment of the CPU fanless heat sink and the fan heat management device embodiment. The same or similar parts are described in the first embodiment of the CPU fanless heat sink. f In the fourth figure, the CPU fanless heat sink includes a heat sink 1M, a cover, a wind guide 122-1, and a sponge 13-1. The heat sink 1M is a cpu-free • heat sink part of the fan heat sink. The heat sink 1M is composed of a substrate (not shown), a thermal guide n2-1, and a heat sink fin 113-1. The substrate is located at the bottom of the fourth heat exchanger 11-1, and its area is smaller than the heat sink fins. Not visible in the figure. The heat sink fins 3-1 are parallel to the substrate, the heat pipe 丨 = one segment is embedded on the substrate, and the other segment is passed through the heat dissipation fins. The cover object includes two sub-ducts 124, The side of the air guiding tube 124 adjacent to the outer edge of the heat sink ^-1 is provided with an opening 125, and the number of the opening holes 125 is gradually reduced from low to high in the direction away from the substrate; the sub-guide tube The top surface of the 124 is open and communicates with the air guiding cylinder; the sub air duct 124 • the one end of the substrate is closed; the heat sink H-1 is embedded between the sub air ducts 124. The heat sink fins 113-1 are The slit 114-1 and the sub-guide tube 124 form a section of the air duct of the cpu fanless heat dissipating device, and the air guiding tube 122_丨 forms another section of the air duct of the CPU fanless heat dissipating device. For the combination diagram, see the fifth diagram. As shown in Fig. 5, the air duct 14 of the CPU fanless heat sink 10-1 is a plurality of air ducts 11-1. The air duct 122 is one at a time. ^ In the fourth and fifth embodiments, the fanless fanless heat sink for installing the CPU is not illustrated. The exploded view of the third embodiment of the CPU fanless heat sink of the present invention is shown in Fig. 17 200840466. Only the part of the CPU fanless heat sink embodiment is distinguished from the CPU fanless heat sink embodiment 1. The same or similar parts are described in the first embodiment of the CPU fanless heat sink. In the sixth figure, The CPU fanless heat sink comprises a heat sink 11-2, a cover 121-2, a wind guide 122-2 and a sponge 13-2. The heat sink u-2 is a heat radiating part of the CPU heat fan heat sink. 2 is composed of a substrate, a conduit 112-2, and a heat dissipation fin 113-2. The heat dissipation fin 113-2 is parallel to the substrate, and a window 115 is opened in the middle of the heat dissipation fin 113-2. One segment is embedded on the substrate, and the other segment passes through the heat-dissipating fins, 113-2. The cover 121-2 is embedded in the window of the heat-dissipating fins 113-2. The cover 121-2 is provided with an opening 125, which is opened. The number of holes 125 gradually decreases along the direction in which the cover 121-2 is away from the substrate. The shape of the cylinder 122-2 is a cone, and the small end thereof is in contact with the cover 121-2. The gap 114_2 between the 埶铐^13-2 and the cover 121-2 forms a wind of cpu^fan=device The substrate in the other section of the CPU heat fan heat sink of the air duct 2 is not shown in the figure, and the substrate in the second embodiment of the fanless fanless heat sink is the same. Description of the fan heat sink in the second embodiment. = Combination diagram of fanless immersive 阙 阙 参见 参见 See the seventh figure. The air duct w of the CPU without a fan is placed at 1G-2, and there are a plurality of air ducts at one position, and one at the air duct 122. $, 图, and 7 are not illustrated in the installation (10) fanless heat sink, the display card fanless heat sink embodiment includes three kinds of real = Ming card card fanless heat sink embodiment - decomposition diagram / map The figure also shows the card body of the display card and the baffle 25 of the display card without fan cooling 200840466 device. In the eighth figure, - a has a heat sink 21 * cover 221 . Diffusion 21 = Fan heat sink includes the heat sink of the unit. The heat dissipation H 21 ^ 21 = is composed of the heat dissipation fins 212 on the fanless heat dissipation, the cover plate is placed on the substrate 211 opposite to the substrate 211, and the plurality of winds 4 of the fanless heat dissipation device are stuck on the substrate 211 and the dispersion 212. The venting holes 25 are provided with the venting holes 251 = the positions of the grooves 213 between the latching plates 25 and 212 are disposed opposite to the heat dissipating chip display card fanless heat sink embodiment. In the ninth figure, the display card is fanless, the tea is seen in the ninth overheating device 21, the air duct is between the air ducts and the air duct 24 is placed in the air duct 24, and the display card is provided with a fanless heat sink. Embodiment 2: FIG. The display card has no fan cooling device implementation;:: If the part is similar, see the display card without wind coding device. "= The direction of the card carrier 25 is directly opened with the card fanless heat sink. The wind-shaped through hole 21M is the display. Schematic diagram of the structural combination of the example-two is referred to the air duct L Gila - the figure shows the fanless fanless heat sink 2 (M η, 24 is directly disposed on the heat sink as a heat sink. The decomposition diagram of the three is involved in the frequency of the second embodiment of the non-fan fanless heat sink embodiment III, ..., the card I fan thermal device embodiment of the difference between the two parts, the two phase 19 200840466 part of the display card _ heat sink Part I of the first embodiment. The heat dissipation component of the _ 21 secret board is placed. The wind guide (4) at the end of the heat sink 212 cover 221 is covered in the dimly crying money 22 bu guide 22 display card fanless heat conduction 3 = -: Use the end of the wind ^ wind to form another section of the air duct. Display card benefit=1; press:, the film 212 and the display card playing board 25 are flat _ sea, ^3 is not stuck. The rectangular end face of the air guiding tube 22 is affixed with the combination diagram of the third embodiment. The tenth ===== set, the wind of 2 sees the first Ϊρ!:, the decomposition diagram of the embodiment of the hard rock heat fan cooling device. The t-picture of the reference 31 is a rectangular disk fanless heat sink is a rectangular box 31. The side surface of the window 311, 20 200840466 has no opening on the lower surface, and the upper and lower surfaces of the rectangular box 31 and the hard disk 34 such as a human air disk 33 of the fanless fanless heat sink. Sponge 32 It is attached to the end surface of the rectangle 1 31 which has the window 312. Further, the combination of the heat sink embodiment is shown in the fifteenth figure, and the air passage 33 of the (four) face fan heat sink 30 is respectively used as the hard disk of the Ma Zheng hot part. The upper and lower surfaces of the outer casing pass through. The embodiment of the present invention includes two kinds of implementations. The schematic diagram of the first embodiment is shown in the figure 10. The figure shows the entire power supply. In the figure, the power supply fanless device includes a substrate 411 as a part of the power supply case,散埶趣片419<& /0 弘愿" another bottle 412 you W force Amw Γ and seesaw 42' heat sink divergence: set 4H t plate 411 role and display card fanless _ _ m counter 21 i The heat sink composed of the same production and fins 412 is the power source i wind 2 and the moon. The cover plate 42 is covered in the scattered film 4 dead:: f heat radiating plate 411, and the bulk μ μ μ poor substrate 411 is opposite The multiple air ducts of the base form a combination diagram of the power supply fanless heat sink power supply fanless heat sink embodiment. In the seventeenth figure, the power supply fanless heat dissipation 1 is more common. The seventeenth power supply fanless heat sink is more common. The heat dissipation portion, the air passage 43 of the ^, is inserted through the fins. Between the Feng and the 43 is the heat dissipation of the present invention. The second embodiment of the present invention is basically the same. The difference is that the heat sink of the heat sink of the original fan is arranged outside the power supply housing. ^, the substrate of the power supply no wind radiator; and in the second embodiment, the power supply casing wall of the power supply is a heat device disposed on the inner wall of the power supply housing, and the heat dissipation = the dissipation of the two fan heat sinks On the substrate 21 200840466 _ '(4) Jixian power supply without fan In the present invention, a schematic diagram of the fan embodiment is shown in the nineteenth diagram. The number of the divergent wind fans 60 may be one or more, and is ^. The diameter of the cooling fan 60 is δ0 mm or more, and the diameter of the cooling fan 60 is 12 mm in this embodiment. Attached to or through the air duct of the wind vent. - In the present invention, an exploded perspective view of the first embodiment of the casing is shown in FIG. 2, and the casing is a vertical casing including a casing 71, a left side cover 72, and a right side cover. And a front cover 73, wherein the right side cover is not shown. The rear panel of the housing 71 is provided with a venting hole 7ΐ of the cooling fan. The W panel of the housing 71 is provided with a venting hole Ή2 of the hard disk fanless heat dissipating device, and the CPU 无 cover 72 is provided with a CPU fanless loose wire. The vent hole 72 is provided with a vent (not shown) at the bottom of the front sill 73. The display card and the power supply have special installation positions and special vents on the computer case, at least one of which can be in contact with the air outside the case, so there is no need for the display card fanless heat sink on the case and The power supply fanless device is equipped with a special ventilation hole.

A support is provided at a position corresponding to a central portion of the left side cover 72 and the right side cover of the casing, and a central portion of the left side cover 72 and the right side cover is fixed to the support. The left side cover and the right side cover of the casing 7 are large in area, and their thickness is thin. If the left and right side covers are fixed on the casing, it is easy to generate resonance and emit "嗡嗡". The shackles that support the left side cover 72 and the center portion of the right side cover can significantly eliminate such noise due to resonance. See Figure 21 for a schematic diagram of the combination of the casing embodiment 1. In the twenty-first figure, the casing 70 is explained. 22 200840466 In the assembly of the Shi Maoming towel '4 heat secret embodiment' * intended to see the electric = heat example - the installation steps and the ordinary clothing step Yalin quality. First of all, the fanless households: the corresponding computer electronic components or components that need to be dissipated. ==The fan heat sink includes a fanless heat sink. Continued: ‘ίίΐίϊη! °, _ fanless heat sink 3 〇 and power supply 4 〇. After that, the motherboard, the display card, the hard disk j, the fan 60, and the like are respectively fixed at the corresponding positions of the casing 7〇, and the user can make the cooling fan 60 exhaust the air to the outside of the casing 7g, which is also intended to be When the CPU fanless heat sink 1 is installed, the heat exchanger is fixed on the cpu. Finally, the air guide cylinder is placed on the heat sink before the left panel 72 of the casing is closed. The monthly airflow direction of the heat dissipation system in the first embodiment of the heat dissipation system is shown in Fig. 25, and the front side of the left side cover of the casing is shown in Fig. 2. In the figure, the CPU fanless heat sink 10, the device 2〇, the hard charm county device 3G: 忒=set 4G and the cooling fan 6G are respectively installed in the machine money, and the political heat fan 6 should be turned to the casing 7〇 Exhaust air, Figure = flow direction of the cooling airflow, ❿CPU fanless heat sink in the ^ also indicates that the cooling airflow from the outside of the casing 70 into the CPU without fan loose ^ installation invented the computer aging system example - the cooling fan 7 〇, See the twenty-sixth figure for the schematic diagram of the airflow direction; = 3 brother - the fifteenth figure is different in that 'the cooling fan 60 should be made to the casing 7, and the black solid circle in the middle of the cpu fanless heat sink 1〇 23 200840466 Point indicates that the a mi is not windy Wei _ (4) ^ Twenty: the other undescribed parts and the twenty-fifth;; the structure and installation location are the same. Heart = - fifteen figure and twenty-sixth figure, the working principle of the computer dilation system: CPU fanless cooling set 1 〇, display track set 20, hard county winds freshly set - hiding no money The department passes through the air duct of the heat dissipating part, and the venting holes of the air duct are respectively opened on the vertical position, the air outside the machine L70 is connected, and the other end is arranged with the thin t ff fan 6G to the machine (4) Wind, or to the casing = ϊ =; f ^ 7G material to form a pressure difference; when the cooling fan machine (4) pressure lower than the air pressure outside the casing through the air vents of the air duct into the air duct = the machine fan The ventilator's vents are exhausted to do 70; when the heat is dissipated, the machine's 2nd day's defensive's air pressure inside the casing is higher than the air vent outside the casing: first: after the heat dissipation wind 60 is blown into the casing 70 , respectively, the flow of the wind is forced to 'touch the air passage of the air passage to turn the casing 70. , == 3 of the fanless heat sink radiator can be made very high to be equipped with the bottom of the radiator can not get good heat dissipation, because of the pressure difference of the air cylinder, inside the casing inside and outside the gas heat device The fan must have a high enough speed to “kick the difference to the bottom of the political heat.” The concept of relative quantity, the large volume of air can take away the more large branch, the π household η > send the wind to a farther place. In other words, the wind pressure of the fan with a large 'high rotation speed is large. The air pressure difference between the inside and the outside of the electric moon enclosure of the present invention depends on the cooling fan ^ 24 200840466

= Therefore, it should be a large-ton, low-speed fan to meet the requirements of divergence, fruit and low noise. At the time, the _ lack of shots is installed in any position on the side of the casing that is not on the side of the 'I must install the I device. It can be directly installed on the vent hole of the casing and installed to the casing through the air duct (not shown). On the vents. For example, according to Zhao Γ=:=:, the arrangement position in the shell, the rear panel of the casing is cut into a fan with a diameter of about 12Qram, and the top of the casing can easily install a fan with a diameter of 16Gmm. When the fan speed of 120mm is below i50〇rpm, the π喿 sound is not large. The plug of the cooling fan 6G is inserted into the fan socket of the computer motherboard, so that the fan monitoring function of the motherboard can be used to monitor the fan 60. Operation, and can alarm or turn off the computer when it is damaged: The cooling fan 60 has a speed regulating device, and the speed regulating device includes a voltage-adjustable circuit for changing the power supply of the heat-dissipating wind (9) The speed of the cooling fan 60, thereby adjusting the airflow 砸:, the size of the air pressure difference between the inside and outside of the casing 70 to fit the computer to make 4 匕. Referring to the twenty-fourth®, in addition to the venting holes of the air duct and the holes, a small amount of other venting holes may be formed in the casing 70, and the venting holes should be opened away from or with the heat dissipation. The corresponding position of the fan 6 = = and the formed heat dissipation airflow is passed through the entire casing 7 as much as possible. ^, seeking beans his vents take into account the heat dissipation of other parts of the computer, but reduce the m# of the flow of thermal devices, so the number is relatively small, depending on the number of electric stages and the number of fans and their consideration. Referring to the twenty-second diagram, the front cover 73 is further provided with an adjustable ventilation device of a ventilating amount. The right second block of the adjustable ventilation device is mounted on a movable or rotating panel on the casing 70, and the panel and the corresponding position of the casing at the bottom of the box are opened at a position and number of ventilation holes. Two = the relative position of the whole panel and the casing, so that the ventilation holes on the panel can be staggered to a fixed position, thereby adjusting the pass H. , /], ° adjustable ventilation device is also to verify the ΐϊϊΐϊΐΐ experiment of other parts of the computer. In the experiment, 'cpu fanless cooling fan CPU cooling device's "x" type sun flower cooling: L·two dry together, the two radiators are coated with a gap between the two sides. Fan power is a reference to the Republic of China The first option is to delete the commercially available rated power of 3 sides of the fan power supply for the second wind: a commercially available ❺120mm caliber, the speed can be adjusted low \ H ▲ speed is 1200rpm ~ 2200', corresponding嗓音匕二?; The casing is a commercially available ordinary casing, and the ventilation holes on it are all sealed with tape in addition to the eve of the night, and the left side cover power consumption TDP 2 ventilation hole is expanded; (10) is Pentium D 820, its thermal design, biLENT, hard disk for Seagate ST3160812 160G, said W,. / 'ΛHelp cooling measures; memory is 2χ512Μ Κίη_η earn 2 #用座/ϋtemperature 28 C 'fan speed 15〇〇rpm, computer CPU of the Japanese m in the following conditions, when the fan 60 is outside the casing 70 Exhaust air = about 55t 'the motherboard temperature rises, the hard disk temperature 70 is the temperature of the gasshield power supply at 4〇C> C; when the fan 60 is toward the casing handle 'fPU temperature is caught around, the domain plate temperature is 43 Degree 46 C, the temperature of the fanless power supply is around π. It can be seen that in the two ways of using the fan to form a difference, the heat dissipation effect of the secondary wind forming a negative pressure in the casing is formed in the interior of the casing 5 The positive pressure has a good heat dissipation effect. This is because the heat dissipation airflow entering the casing under the action of the negative pressure 26 200840466 first flows through the high temperature, no wind, and the heat dissipation device', and enters the casing under the action of positive pressure. The flow reduction first, =, the motherboard's contribution '(four)' has flowed through the fanless device, and the temperature of the turbulence has increased. However, whether it is exhausted outside the casing, it is also inside the casing. Blowing, the heat dissipation effect of the computer cooling system meets the requirements for use, and the electricity is significantly reduced. The noise level of the brain heat dissipation system. The following is the second embodiment of the computer heat dissipation system of the present invention. The second embodiment of the computer heat dissipation line is compared with the computer cooling system implementation dream = in the second embodiment of the computer cooling system, the fan is used ^ $ Generation of fanless power supply, and canceled the cooling system of the computer cooling system embodiment ^ and the special cooling fan on the chassis ^.

The example-phase difference is explained, and the rest of the computer is related to the content in the first embodiment. Can be included in the shame of enthusiasm, computer cooling, real-life supplements, including CPU no-distribution, 'fan cooling device, hard disk, no wind, green, and fan power:: In the second embodiment of the computer cooling system, CPU fanless card Fanless cooling package Dong and hard disk fanless cooling ^= System example - CPU fanless heat sink, = month = hot flashing and hard disk fanless heat sink in structure, function; == respectively correspond to the same. In the position of the clothes, in the second example of the 4th hot system, there is a fan power supply instead of the system example - the money source of the towel. Note: See the eighteenth figure for the schematic diagram of the exotherm. In the eighteenth figure, there is a 51 fan in the fan power supply, and the position = wind, power supply, ° ^ ΜΛ 51 27 200840466 should have a fan power supply 50 in the loyalty fan 51 can be to the machine 1 fan The side of 51 faces T; the wind is windy. ^^Shake the exhaust, you can also push the drum inside the case in the computer cooling system to implement you | > . The casing of the second embodiment of the casing is hidden from the casing of the f. The casing of the casing is the second embodiment of the casing and the twelfth of the twentieth tea. Referring to the second embodiment of the second brain cooling system embodiment - the second and the middle of the casing and the electrical system, the second embodiment is: in the computer cooling hole. ^ The combination of the special (10) fan reduction fan on the wheel and the second embodiment of the casing is shown in the figure, which shows the casing 70-1. A picture. In the assembly diagram of the second embodiment of the younger brother's heat system, see the second + back to the seventeenth figure, the CPU fanless heat sink 1〇, sea-book> fan heat sink 2G, hard disk fanless埶 device (4) = card heat 50 is installed in the corresponding position in the casing 7〇-ι. 72 is the left cover of the ==. The Hummer set 70-1 in the second embodiment of the airflow when the fan is exhausted to the outside. The arrow indicates the cooling airflow Π (9) The middle of the heat fan heat sink 10 + the vehicle receives the heat - the airflow flows from the outside of the casing. CPU fanless heat sink 1〇. = Figure 18 shows the direction of the airflow in the opposite direction ^ = : cooling system when the fan is moving to the casing 7 (M inside the blast === computer cooling system example 2 of the principle of the maintenance and computer cooling system example one The working principle is basically the same, the only difference is that in the second embodiment, the air pressure difference between the inside and the outside of the casing 7G-1 is exhausted from the outside of the casing 70-1 by the fan 51 having the fan electric power or To the case of the case 〇 丨 丨 鼓 成 成 成 成 28 28 28 28 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 Know, but the test is very quiet, and taped to block the ventilation holes of the special cooling fan in the first example. In ϋϋί贝, the fan speed is 150_, and the computer is idle, (10) degrees 28 C, wind, when there is fan power 50 fan 51 == Feng Wei f under the condition of warm sound too. ^ 丄 13 1 machine set 70 outside the exhaust, CPu, degree at 59 C, motherboard temperature 42 ΐ, hard: ru have fans The temperature of the power supply is around; the more than 45 C '51 to the casing 7 (when blasting inside the M, (10) 'two = the fan plate temperature of the source 50 44., the hard disk temperature 47 There are 2 two belts, C or so 'main. The machine effect 2 is not as good as the computer scattered age, the implementation of the second middle of the 'air flow in turn through the two-year wind; 疋 because in this embodiment, the fanless scatter dream: Fan Zheng The heat sinking, which obviously reflects the flow of the heat sink with less flow last time, is when the airflow is lower than the heat of the electric vehicle of the present invention. Computer cooling system embodiment: first 4:: three : 'The difference lies in the computer divergence, ^^ money, the age of the eye, the computer system, the fan, the computer, the fan, the fan, the fan, the fan, the fan, the computer ^7,, the related content of the first part of the brain cooling system. For details, please refer to the computer cooling system embodiment one. 29 200840466 ίΞίΐίϊϊ Example 3 includes cpu fanless heat sink, Leica, fan power and chassis. ... set, special (10) political fan example three, CPU fanless heat sink, display dry, display card fanless heat sink, hard disk without fan thermal shock cooling fan and chassis in the structure, role to ^, special The same. In the third example of the turtle fine thermal system, the fanless power supply in the embodiment of the thermal system is used. The following: j: household: c see Figure 18, the structure and installation method is shown in the second example. Fan power supply compilation and installation method Lai Wei unified computer cooling line example of the third embodiment of the test ^ twenty-nine map and twenty-fourth figure shown in the dream brother - nineteen. First, with fan power 50 replaces the installation of the ^ Γ Γ 的 的 的 的 的 的 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 区别 无 无 无The number can be one, and the political style. Specialized special cooling fan 60's pen position ¥ " ^ is a plurality, for a number of caused cases of the casing π upper hole and the relevant description in the wire example 1. In this ^M private brain political system is the number of one. In the present example, a special cooling fan (10) computer cooling system is used in the third embodiment. In the thirty-fifth diagram, the airflow direction of the wind is shown in the fanless heat sink 10; === the airflow flows from the outside of the casing into the CPU fanless heat sink 30 200840466, which is the reverse of the arrow, which becomes the computer of this embodiment.糸, 、, first * fan to the machine as blasting air flow diagram. The principle of c 1 β and the implementation of computer cooling system are as follows: 7n meat ice; Guang, 'Shanmu Tong, the only difference is that in this embodiment, the machine I π / βη gas coating is poor by fan 51 with fan power supply 50 and special All of the isi exhausted to the outside of the casing 70 or all of the above-mentioned schemes in the casing 7 passed the experimental verification. The experimental conditions, the experimental conditions are basically the same, only = power is said to have a fan power supply, the amount of the feathers to k 1500rpm, and the computer is idle, the CPU uses the low parent condition, when there is a fan power 5G When the fan 51 and the special fan and fan 60 are exhausted to the outside of the casing 70, the temperature of the CPU is 5 〇 'the motherboard temperature 33. (3, hard disk Wen Geng seven work in ί There is a fan power supply temperature f 60 to fine inside the blast when the CPU temperature is in politics = = degree 4 =, hard disk temperature paper, there is fan power temperature in the 』 : Ϊ统 ;;: Example = good results, and the corresponding voice and computer scattered, the system of the system - compared with the second example, there is no fan _ increase - used fan power fan and special scattered A low-noise fan with a caliber and a low rotation speed. In the present embodiment, the fan is used to form a gas pressure difference in two ways. To some extent, there is also a flow of air flowing through two fanless fans in succession: The way in which the exhaust air forms a negative pressure takes a good listening effect, and the heat dissipation effect generated by the way to the inside of the casing is only exhausted to the outside of the casing with a fan in the computer cooling system <Example 1 31 200840466 The heat dissipation effect is equivalent. The following is an embodiment of the heat dissipation method of the present invention. This will give the financial method, the financial method mainly includes four steps to see the twenty-one figure of the younger brother. V 3101, the heat dissipation of the Han through the heat sink Part of the wind tunnel.

Simple around. The heat dissipating portion is generally made of a heat dissipating material, such as 11 pieces of heat dissipating material; the heat dissipating portion may also be j, , , and a target material shell; the dissipating heat dissipating portion may include a wind guide tube The air duct guides the air outside the casing into the U-wind, or directs the airflow in the air duct to the outside of the casing. At step 3102, a non-fully sealed housing is formed. A plurality of vent holes are formed in the completely dense housing to form the housing that is not completely poor. It can be seen that the incomplete (four) casing does not require a, i, and the plates are tightly seamed. • The ventilated face is made to allow airflow through the wind. = Step 3103: The electronic component to be cooled by the towel and its heat sink together with the wind are placed in the incompletely sealed housing. The sub-element to be dissipated is mounted at a corresponding position of the non-fully sealed housing, and the (four)-aged wire is passed through the vent at the end of the electronic component Communicating with the outside of the housing i the other end is in communication with the internal environment of the housing. The corresponding locations have different standards and installation habits for different manufactured products. For example, in the computer field, motherboards, power supplies, and hard drives have their corresponding ampoules. The corresponding position may also be determined by the user of the heat dissipation method of the present invention. The electronic components that require heat dissipation may be electronic components, wafers, components, and the like. The heat dissipating portion may also be an outer casing of the electronic component, and the air passage is directly integrated on the electronic component. 32 200840466 Step 3104' achieves airflow within and outside of the incompletely sealed housing, and the airflow flows through the air duct. The fan is mounted directly or through the air duct on the venting opening of the non-fully enclosed housing. The number of the fans is one or more, and the caliber is 80 mm or more than 80 «m, and the fan is all directed to the non-completely sealed outer wind or all of the non-completely dense inner casing. Wind, shape air pressure difference 'from * inside and outside the housing to achieve airflow, brigade;: == a venting hole - part of the venting hole into the housing: = 斤 夕 个 k k k air hole another part of the venting hole flows outside the housing . In the heat dissipation method according to the embodiment, as long as the execution sequence is not limited, and the step _4 can be executed, the above implementation _ experimental results are practically implemented, and the residual heat dissipation is performed. The computer only has its noise level _ lower than the existing computer. I, good 'and outside the ' '' The computer cooling system of the present invention, by sharing the same cooling fan, reducing ..., fan political hot clothes, which reduces the computer noise level: easy ^ mechanical fan number plate On the fan socket, the second power plug is inserted in the computer host to ensure the (four) control function, and the computer cooling system has a low =. The casing is 4 inches because of the high degree of airtightness. First, the punching process. Secondly, although there is no shortage of production time, the materials used are much more, and the heat sinks of the heat sinks of the radiators are reduced by the number of fans: 'But because of their Low cost. The second 33 200840466, the fanless loose wire material is displayed in the Xianxian thief, and the soft material is used to realize the manufacturing process of the casing and the step-down air guiding cylinder. The computer cooling system of the present invention is a cost-effective, low-noise computer cooling solution. The shape of the CPU in the heat-free μ fanless heat-dissipating shape, etc., the divergence of the heat sink is perpendicular to the shape of the electronic component and the air-guiding cylinder that can be flattened. , _, polygons, etc. open ^, only = c / lii device towel has a wind channel and * silk fan can be ^ speed machine is also rare in the above implementation and _ given, = ^ or other The shape of the casing, as long as the machine drum is open; the venting holes of the air duct and the fan venting holes, that is, the fan, the installation and installation position, see the above embodiments and the drawings, may be one or more 'when When installing a fan, in the case of a shell, use the cooling fan to form the air pressure difference between the inside and outside of the casing. ?:; Use: ί to: wind = type if there is no special need 'should; ===: this\ = 3 2 to minus (four), when the money - seems to get better heat dissipation. The equivalent structural transformation made by the content of the above-mentioned 34 200840466, or directly or indirectly applied to other related technical fields, is included in the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is an exploded view of a first embodiment of a CPU fanless heat sink according to the present invention. The second figure is a combination diagram of the first embodiment of the CPU fanless heat sink of the present invention. The fourth figure is an exploded schematic view of the second embodiment of the CPU fanless heat sink of the present invention. The fifth figure is a combination diagram of the second embodiment of the CPU fanless heat sink of the present invention. Figure 6 is an exploded perspective view of the third embodiment of the CPU fanless heat sink of the present invention. The seventh figure is a combination diagram of the third embodiment of the CPU fanless heat sink of the present invention. ,

Figure t is an exploded view of the first embodiment of the fanless heat sink of the present invention. The first is a combination of the first embodiment of the fanless fan heat sink of the present invention. The second embodiment of the second embodiment of the present invention is a fanless fanless heat sink according to the second embodiment of the present invention. Solution diagram. Figure 13 is a schematic diagram showing the combination of the third embodiment of the fanless heat sink of the display card of the present invention. Fig. 14 is an exploded perspective view showing the embodiment of the hard disk fanless heat sink of the present invention. Fig. 15 is a schematic view showing the combination of the embodiment of the hard disk fanless heat sink of the present invention. Figure 16 is a schematic exploded view of the first embodiment of the power supply fanless heat sink of the present invention. Figure 17 is a schematic diagram showing the combination of the first embodiment of the power supply fanless heat sink of the present invention. Figure 18 is a schematic view showing an embodiment of a fan power supply of the present invention. Figure 19 is a schematic view of an embodiment of a fan of the present invention. Figure 20 is an exploded perspective view showing the first embodiment of the casing of the present invention. Figure 21 is a schematic view showing the combination of the first embodiment of the casing of the present invention. The twenty-second figure is an exploded schematic view of the second embodiment of the casing of the present invention. Figure 23 is a schematic view showing the combination of the second embodiment of the casing of the present invention. The twenty-fourth embodiment is an assembly diagram of the first embodiment of the computer cooling system of the present invention. Figure 25 is a schematic view showing the airflow direction of the fan in the first embodiment of the computer cooling system of the present invention. Figure 26 is a schematic view showing the flow direction of the fan in the first embodiment of the computer cooling system of the present invention. Figure 27 is a schematic view showing the assembly of the second embodiment of the computer cooling system of the present invention

W figure. Figure 28 is a schematic view showing the airflow direction of the fan in the second embodiment of the computer cooling system according to the present invention. Figure 29 is a schematic view showing the assembly of the third embodiment of the computer heat dissipation system of the present invention. Figure 30 is a schematic view showing the airflow direction when the fan is exhausted to the outside in the third embodiment of the computer cooling system of the present invention. A thirty-first drawing is a schematic flow chart of an embodiment of a heat dissipation method of the present invention. [Main component symbol description] CPU fanless heat sink 10 Heat sink 11, 11-1, 11-2 Base 111 Base plate 112 Heat pipes 112-1, 112-2 Heat sink fins 113, 113-1, 113-2 Groove Slot 114 Slit 114-1, 114-2 Window 115 Cover 121, 121-1, 121-2 Air guide tube 122, 122-1, 122-2 Flange 123 Sub-window 124 Opening 125 Sponge 13, 13 -1, 13-2 Air duct 14, Main board 15 37 200840466 Display card fanless heat sink 20, 20-1, 20-2 Heat sink 21, 21-1 ~ Substrate 211. Through hole 211-1 Heat sink fin 212 Groove 213 Cover 221 Air duct 22 • Sponge 23 Air duct 24 Baffle 25 Ventilation hole 251 Hard disk fanless heat sink 30 Rectangular box 31 Window 3Π, 312 Sponge 32 φ Air duct 33 Hard disk 34 Power supply fanless heat sink 40 Substrate 411 Heat sink fin 412 Cover 42 Air duct 43. Fan power supply 50 Fan 51 38 200840466 Cooling fan 60 Enclosure 70, 70-1 Housing 71 Ventilation hole 711 Ventilation holes 712, 721 Left side cover 72 Front cover Step 73, step 3101, a duct step 3102 is provided through the heat dissipating portion of the heat sink to form a non-fully sealed housing step 3103, which will require heat dissipating electronic components. The heat dissipation device which is disposed together with said non-completely closed the air duct housing step 3104, gas flow communication to achieve said inner and outer housing in non-completely closed, and the flow of air through the air duct 39

Claims (1)

200840466 X. Application for patents: and unbiased, fine-breasted, including the casing (4), with air connections outside the inner two casings of the air duct casings with open ends and closed sides, and the other end The heat dissipating portion communicates with the air passage passing through the fanless heat dissipating device; or the portion 2 has no heat dissipating device to install the money to be dissipated _ the computer electronic component ventilator is provided with the fan and the wind hole and the The number of said fans of the air passage is one or one of the rafts arranged in the wind or the drums in the casing are 'wind = 〖 and 1 =:: private' in the (four) lag of the set air flow through the levy The object is connected to the age, and its special setting includes a radiator. The radiator is on the computer cooling system as described in item 1 of the 5th scope of the application. The air duct includes a wind guide cylinder. The heat fan county device further 40 200840466 and the other end of the air duct of the casing communicates with the air duct, and the outside air communicates; The air duct forms another air duct. The needle 1, as disclosed in the fourth application of the patent scope, is characterized by a sponge, a soft rubber, etc. attached to the flange of the air-connecting edge of the guide orchid and the outer shell of the rhyme. Flexible material. Convex The material is as in the computer cooling system described in claim 5, and the special air-conducting air duct is a cone. The large end of the cone and the machine & The computer system disclosed in Section 2 or 3 of the scope is characterized in that the __ end of the air passage communicating with the air outside the casing is affixed with a flexible material such as sponge or rubber. Μ 8. The computer of the invention of claim 4, wherein the heat sink comprises a base, a substrate and a heat dissipating fin; the shape of the base is a cone or a cylinder; The substrate is disposed symmetrically on the tapered surface or the cylindrical surface of the pedestal, and the political fins are distributed on the pedestal and the substrate as viewed from the top of the pedestal. And parallel to the angle of the angle between the two sides of the heat dissipation fins; the cover object is sleeved on the outside of the heat sink along the central axis of the base, and is attached to the outermost edge of the heat sink The computer heat dissipation system of claim 4, wherein the heat sink comprises a substrate, a heat pipe and a heat dissipation fin; the cover includes two sub-wind guides. a heat sink fin is embedded in the heat sink; the heat sink fin is parallel to the substrate; a section of the heat pipe is embedded on the substrate, and another section passes through the heat 41 200840466 Fin; 3==tube# near the end of the wire-end paste, and away from the heat-dissipating air duct The direction of the silk plate is reduced. The sub-meter 1Γ Γ+Please use the electric service _ system described in the 4th item, the special ΐ ΐ 2 heat exchanger includes the remaining plate, the heat pipe and the heat dissipation fin; a window is opened in the middle of the sheet; the political scale is parallel to the substrate; the hot-spotted tube is touched on the silk plate, and the other is scattered into the window of the heat sink. The direction of the cover is gradually reduced. The computer heat dissipation system described in item 3 of the patent application is characterized in that the cover is a cover plate, and the heat dissipation fins are arranged on the substrate. The raft is disposed on the heat dissipating fin and opposite to the substrate; the substrate, the heat dissipating fin and the cover plate form a plurality of the air ducts. The needle IT is the computer cooling system according to the second item of the patent scope. The basin is characterized in that the heat sink is a heat sink; /, a bucket channel. The heat sink is provided with a long strip shape, and the through hole is the wind 13 as claimed in the patent scope 11 or application ==的' is characterized by one or two = the end of the air duct is in communication with the air outside the air passage; The air guide cylinder of the casing 42 200840466 forms another air passage. 14. The computer heat dissipation system according to claim n, wherein the substrate is a power supply housing. The computer heat dissipation system according to claim 3, wherein the cover is a housing of a power source, the heat sink is disposed in a _ of the power supply housing, and the heat dissipation fin is disposed at On the substrate, the substrate is opposite to the housing. The computer cooling system according to claim 1, wherein the fanless filament device comprises a hard disk fanless heat sink. The hard disk heat fan is disposed in a rectangular box, the upper and lower surfaces of the rectangular box are thermally open, the opposite sides are provided with a window corresponding to the size of the hard disk, and the other two opposite sides are opened. a window of the thickness of the hard disk; " the upper and lower surfaces of the rectangular compartment form the air passage with the surface of the hard disk. The computer cooling system of claim 1, wherein the fan comprises a fan having a fan power supply. For example, the computer cooling system according to the scope of the patent application is characterized in that the fan has a diameter of 80 mm or more. Acupuncture, such as the computer cooling system described in claim 1, wherein the wind thief _ air duct wire is in the ventilation department of the fan, as described in item 1 of the patent application scope The computer heat dissipation system has a left side cover and a right side cover, and the left side cover is supported at a position of a central portion of the iirif woven plate and the right side cover. And the central part of the right side cover is fixed in the computer cooling system according to item i of the patent application scope, and the special 43 200840466 is in the =, and the other casing is provided with other ventilation holes. The port and the four-two-week heat dissipating device are characterized in that the wind is forced by the air-dissipating portion at both ends. The fanless heat sink described in item 22 of the fanless heat sink, please turn down the fanless heat sink according to item 22 of the 22nd item. The heat pack includes the radiator and the cover. The cover member forms a plurality of the air ducts, and the air passage, the tenth, the tenth, the ί5, the ΐ ΐ 范围 第 或 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 23 One end of the fanless heat sink entering the air guiding duct is in communication with the air duct; the air guiding duct forms another air duct. 26. The invention as claimed in claim 25, characterized in that: the end of the air guiding cylinder away from the heat sink has H, and the flange is affixed with a flexible material such as sponge or soft rubber. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, - Lai Youhai, 纟帛, soft rubber 44 200840466 29, the fanless dispersion according to claim 25, wherein the heat sink comprises a base, a substrate and a heat sink; The shape of the seat is a cone or a cylinder; the substrate is disposed on the tapered surface or the cylindrical surface of the base, and is seen from the top of the base as an "X" shape; the heat sink fin The sheet is distributed on the base and the substrate, and the angle bisector of the angle between the two sides of the heat sink fin is parallel; I the cover covers the outer portion of the base along the central axis of the base and dissipates heat The outermost edge of the device fits. 30. The fanless diverging device of claim 25, wherein the heat sink comprises a substrate, a heat pipe and a sheet. The user ίίίί includes two sub-ducts, The heat-dissipating fins are inserted into the heat-dissipating fins; the heat-dissipating fins are parallel to the substrate; the --segmented-segment-remaining substrate, and the other section passes through the heat-dissipating,,,, The sub-ductor is closed near the end of the substrate, and the side adjacent to the divergent hole is provided with an opening, the number of the opening is along the direction; the wind gradually returns from the substrate cut back. The heat sink includes the substrate, the heat pipe and the heat dissipation tab; the heat fin has a window in the middle; the heat dissipation a fin is parallel to the substrate; a fin of the heat fin I is embedded in the wire plate, and another segment is inserted into the window of the heat sink fin through the cover The cover is provided with an opening, and the number of the openings gradually decreases along the direction in which the cover is away from the seesaw 45 200840466. 32. The fanless heat sink according to claim 24, wherein the fresh cover is a cover plate, and the loose chip is disposed on the substrate; the cover is disposed on the heat dissipation fin And facing the substrate; the substrate, the heat dissipation fin and the cover plate form a plurality of the air passages. 33. The fanless heat sink according to claim 23, wherein the heat sink is a heat sink; The heat dissipation plate has a plurality of elongated through holes; the through holes are the air passages. 34. The fan-type heat-dissipating device of claim 32, or the fan-free heat-dissipating device of the patent application scope, wherein the fanless heat sink further comprises an air guiding cylinder; One end is connected to the air duct; the air duct forms another air duct. 1H, as claimed in claim 32, the fanless heat sink according to item 32, wherein the substrate is a power supply housing 36. The fanless heat sink according to claim 24, wherein the cover is a power supply housing, and the heat sink, the arrangement is thin, and the heat dissipation is performed. Arranged on the substrate _ opposite to the housing. The base plate 1 is 特ηηΐ,? The fanless heat sink according to item 22, the h flag is that the speed fan fan heat sink includes (4) fanless heat sink ^The hard wire fan is set as a "rectangular box, and the lower surface of the hot opening" has two opposite sides with a window comparable to the size of the hard disk. 200840466 a '=The solid side is higher than the hurricane 3 households are transferred to the community, and the fine-grained county shape ^ < a fine passage through the heat dissipating portion of the heat sink; > forming a non-fully sealed housing; placing in the non-fully enclosed housing; and flowing in the housing (10) Flowing through the air duct. The method of dissipating the air passage from the air duct and the gas 39, as described in the patent claim 38, wherein the method of installing the air duct includes ·· The heat dissipating method according to claim 38, wherein the method of forming the non-fully sealed casing is: The method of dissipating a plurality of air vents according to the invention of claim 40, wherein the method for achieving airflow circulation comprises: a fan passing through the venting hole A portion of the venting opening vents to the outside of the non-fully sealed housing or blows into the non-fully sealed housing, the fan having a diameter of 80 mm or more.