200840060 九、發明說明： 【發明所屬之技術領域】 本案係為一種影像感測元件，尤指一種 透明封裝蓋具有複數個微聚焦透鏡之影像感 測元件。 【先前技術】 隨著多媒體數位時代的來臨，影像輸入 f 裝置需求大幅成長，而影像輸入裝置所需之 影像感測器（i m a g e s e n s 〇 r )，因其為具高密 度晝素（pixel)，高解析度（Resolution)及 高靈敏度（ sensitivity)之諸多優良特性，使 . 得它倍受矚目，因此正逐漸取代傳統攝像 管，成為市場的主流。 • 請參閱第一圖，其係習知影像感測器之 結構示意圖，傳統的影像感測器（如電荷耦 合裝置（CCD)及互補式金屬氧化半導體感 測器（C Μ Ο S S e n s 〇 r s ))其係包含複數個畫素 I (pixel) 10、微聚焦透鏡 11、透明蓋 12及 ^ 封裝主體1 3。從影像感測器所欲攝像之物體 所發射之光訊號1 4或反射之光訊號1 4，其主 要由透明蓋1 2入射至影像感測器内部，再由 複數個晝素1 〇接收並進行光電轉換，將光訊 號轉換成影像訊號後，再經由接腳1 5將轉換 所得之影像訊號輸出至後續電路。 為了增加影像感測器之靈敏度及解析 度，通常在每一個畫素 10上使用旋塗玻璃 (spin on glass)或是透明有機複合物（如聚 亞醯胺（Ρ ο 1 y i m i d e s ))製作微聚焦透鏡 1 1，使 5 200840060 入射之光訊號聚焦於晝素1 〇上，用以增加光 的亮度，使每個晝素1 〇收到的光訊號較大， 而光訊號經由畫素1 0轉換後所產生之電荷訊 號亦較大，就可增加感測影像之靈敏度及解 析度。 透明蓋12主要用來防止水氣進入，並需 於透明蓋1 2與微聚焦透鏡1 1注入折射係數 小於微聚焦透鏡1 1折射率的透明膠（如環氧 化紫外光膠（Epoxy UV Curing ))，用以保護 畫素1 〇。 雖然傳統之影像感測器結構可達到感測 影像之功效，但是，要在每個畫素（pixel) 上製作微聚焦透鏡1 1其製程方法相當麻煩及 複雜，會增加生產成本，且上述微聚焦透鏡 1 1之製作材料容易吸收水氣，會增加晝素1 0 損壞之速率。 職是之故，申請人鑑於傳統影像感測器 製程方式麻煩及複雜，且需較多成本之缺 失，乃經悉心試驗與研究，並一本鍥而不捨 之精神，終研發出本案之『影像感測元件』。 【發明内容】 本案之主要目的係為提供一種影像感測 元件，用以感測一物體之光訊號，其係包含： 一透明封裝蓋，其内側可具有複數個實質上 弧狀之凹陷結構，用以使該物體之光訊號由 該透明封裝蓋入射至該影像感測元件内部， 並藉由該複數個實質上弧狀之凹陷結構使該 光訊號形成一聚集態樣；影像感測晶片，其 係置於該透明封裝基板之下方，用以接收聚 集之該光訊號，並將該光訊號轉換成一影像 6 200840060 訊號；複數支接腳，電連接於該影像感測晶 片，用以輸出該影像訊號；一封裝主體，用 以使該影像感測晶片與外界隔離。 根據上述構想，影像感測元件中該透明 封裝蓋與該影像感測晶片之間可包含一透明 膠層。 根據上述構想，影像感測元件中該透明 膠層之折射係數係高於該透明封裝蓋材料之 折射係數。 根據上述構想，影像感測元件中該透明 f 膠層之材料係為一有機複合材料或是一無機 材料其中之一。 根據上述構想，影像感測元件中該有機 複合材料可為聚亞醯胺（Polyimides)、壓克力 或環氧樹脂（Epoxy)其中之一。 根據上述構想，影像感測元件中該無機 - 材料可為二氧化鈦（Ti02)、氮化矽（SiNx)或氧 化钽（TaOx )其中之一。 根據上述構想，影像感測元件中該光訊 號可為該物體之反射光或是發射光。 , 根據上述構想，影像感測元件中該實質 t 上弧狀之凹陷結構係為一微聚焦透鏡結構。 根據上述構想，影像感測元件中該影像 感測晶片具有複數個畫素（p i X e 1 )結構。 根據上述構想，影像感測元件中該封裝 主體之材料係為環氧樹脂（Ε ρ ο X y )。 根據上述構想，影像感測元件中該透明 封裝蓋之材料係為玻璃。 根據上述構想，影像感測元件中該透明 封裝蓋内側之該複數個實質上弧狀之凹陷結 構之形成方法係為：提供一透明玻璃基板； 7 200840060 於該透明玻璃基板之上方提供一光阻層 (P R )，並對該光阻層定義複數個開口 ；將相 對於該複數個開口之透明玻璃基板進行一蝕 刻步驟，進而使該透明玻璃基板形成複數個 實質上弧狀之凹陷結構；以及去除，該光阻層。 根據上述構想，影像感測元件中該餘刻 方式可為濕式蝕刻或是乾式蝕刻其中之一。 根據上述構想，其中該影像感測元件之 封裝步驟係為：提供該影像感測晶片；使該 影像感測晶片與該複數支接腳電性連接；於 ( 該影像感測晶片之上方提供該透明封裝蓋； 於該影像感測晶片與該透明封裝蓋之間注入 液態之二氧化鈦（Ti〇2);於周圍覆蓋上具熱 度之環氧樹脂（Ε ρ ο X y )，進而形成該封裝主 體；藉由一紫外光燈由透明封裝蓋照射該液 態之二氧化鈦（Ti02 )，進而使該二氧化鈦 - (Ti02 )硬化。 【實施方式】 本案之影像感測元件，將可由以下的實 ί ^ 施例說明而得到充份的了解，使得熟習本技 藝之人士可據以完成之，然本案之實施並非 可由下列實施例而被限制其實施型態。 請參閱第二圖，本案所提出之影像感測 元件，可用來感測一物體所發射之光訊號或 反射之光訊號，其可由一透明封裝蓋2 0、影 像感測晶片2 1、複數支接腳2 2、一封裝主體 23及一透明膠層24所構成。 該透明封裝蓋2 0可為一透明玻璃基板， 其内側具有複數個呈現圓弧狀之微聚焦透鏡 結構2 0 1，該透明封裝基板可以使該物體之光 8 200840060 訊號 25經由該透明封裝蓋 20入射至該影像 感測元件的内部，並可藉由該複數個微聚焦 透鏡結構2 0 1將原本分散之該光訊號2 5聚集 在一起。其中該影像感測晶片2 1具有複數個 晝素（p i X e 1 )結構 2 1 1，其必須置於該透明 封裝蓋2 0之下方，用來接收由該複數個微聚 焦透鏡結構 2 0 1所聚集之光訊號，並經由内 部之電路將所接收之光訊號轉換成一影像訊 號。 該複數支接腳22之一端係電連接於該影 f 像感測晶片 2 1，而另一端則與外界接觸，用 來將該影像訊號輸出。至於封裝主體2 3主要 由環氧樹脂（Ε ρ ο X y )所構成，可使該影像感 測晶片2 1與外界隔離，避免外界之水氣與該 影像感測晶片2 1產生氧化反應。 至於夾在該透明封裝蓋2 0與該影像感測 - 晶片2 1之間之透明膠層2 4，其折射係數必須 高於該透明封裝蓋材料之折射係數，才能使 入射之光訊號產生聚焦。其中該透明膠層之 材料係為一有機複合材料（如聚亞醯胺 【 （Polyimides)、壓克力或環氧樹脂（Epoxy)) 或是一無機材料（如二氧化鈦（Ti02)、氮化矽 (SiNx)或氧化鈕（TaOx ))。 本案所發明之影像感測元件中透明封裝 蓋2 0與晝素2 1 1兩者之間可發展出二個較佳 實施例，請參閱第三圖（a )及（b )，其係分 別代表一較佳實施例。 請參閱第三圖（a )，本實施例所採用之 方式係為每個晝素 2 1 1之上方都準確對應到 一微聚焦透鏡201，該透明封裝蓋20與畫素 2 1 1兩者間需進行對位的動作，即由透明封裝 9200840060 IX. Description of the Invention: [Technical Field of the Invention] The present invention is an image sensing component, and more particularly, an image sensing component having a plurality of microfocus lenses in a transparent package cover. [Prior Art] With the advent of the multimedia digital era, the demand for image input f devices has grown substantially, and the image sensor (imagesens 〇r) required for image input devices is high in density (pixel). The excellent characteristics of resolution and sensitivity make it attract a lot of attention, so it is gradually replacing the traditional camera tube and becoming the mainstream of the market. • Please refer to the first figure, which is a schematic diagram of a conventional image sensor, such as a charge coupled device (CCD) and a complementary metal oxide semiconductor sensor (C Μ Ο SS ens 〇rs )) comprising a plurality of pixels I (pixel) 10, a microfocus lens 11, a transparent cover 12, and a package body 13. The optical signal 14 or the reflected optical signal 14 emitted from the object to be imaged by the image sensor is mainly incident on the inside of the image sensor by the transparent cover 12, and then received by a plurality of pixels 1 After the photoelectric conversion is performed, the optical signal is converted into an image signal, and then the converted image signal is output to the subsequent circuit via the pin 15. In order to increase the sensitivity and resolution of the image sensor, spin on glass or transparent organic composites (such as poly (i. y y yimides)) are usually used on each pixel 10 to make micro Focusing lens 1 1 causes 5 200840060 incident light signals to be focused on the pixel 1 , to increase the brightness of the light, so that each element receives a larger optical signal, and the optical signal passes through the pixel 10 The charge signal generated after the conversion is also large, which can increase the sensitivity and resolution of the sensing image. The transparent cover 12 is mainly used to prevent moisture from entering, and a transparent adhesive (such as Epoxy UV Curing) having a refractive index smaller than that of the microfocus lens 11 is injected into the transparent cover 12 and the microfocus lens 11. ) to protect the pixels 1 〇. Although the conventional image sensor structure can achieve the effect of sensing images, it is quite troublesome and complicated to manufacture the microfocus lens 1 on each pixel, which increases the production cost, and the above micro The material of the focusing lens 1 1 is easy to absorb moisture, which increases the rate of damage of the halogen 10 . For the sake of the job, the applicant has developed the image sensing method of the case in view of the trouble and complexity of the traditional image sensor manufacturing process and the need for more cost, which is carefully tested and researched, and the spirit of perseverance. element". SUMMARY OF THE INVENTION The main purpose of the present invention is to provide an image sensing component for sensing an optical signal of an object, comprising: a transparent encapsulation cover having a plurality of substantially arc-shaped recessed structures on the inner side thereof; The light signal of the object is incident on the inside of the image sensing element from the transparent package cover, and the light signal is formed into a concentrated state by the plurality of substantially arc-shaped recess structures; the image sensing chip, The device is disposed under the transparent package substrate for receiving the collected optical signal and converting the optical signal into an image 6 200840060 signal; a plurality of pins are electrically connected to the image sensing chip for outputting the An image signal; a package body for isolating the image sensing chip from the outside. According to the above concept, a transparent adhesive layer may be included between the transparent package cover and the image sensing wafer in the image sensing device. According to the above concept, the refractive index of the transparent adhesive layer in the image sensing element is higher than the refractive index of the transparent cover material. According to the above concept, the material of the transparent f-glue layer in the image sensing element is one of an organic composite material or an inorganic material. According to the above concept, the organic composite material in the image sensing element may be one of Polyimides, Acrylic or Epoxy. According to the above concept, the inorganic-material in the image sensing element may be one of titanium dioxide (Ti02), tantalum nitride (SiNx) or tantalum oxide (TaOx). According to the above concept, the optical signal in the image sensing element can be reflected light or emitted light of the object. According to the above concept, the concave structure of the arc in the image sensing element is a microfocus lens structure. According to the above concept, the image sensing wafer in the image sensing element has a plurality of pixel (p i X e 1 ) structures. According to the above concept, the material of the package body in the image sensing element is epoxy resin (Ε ρ ο X y ). According to the above concept, the material of the transparent package cover in the image sensing element is glass. According to the above concept, the plurality of substantially arc-shaped recessed structures on the inner side of the transparent package cover in the image sensing device are formed by: providing a transparent glass substrate; 7 200840060 providing a photoresist above the transparent glass substrate a layer (PR), and defining a plurality of openings for the photoresist layer; performing an etching step on the transparent glass substrate opposite to the plurality of openings, thereby forming the transparent glass substrate into a plurality of substantially arc-shaped recess structures; The photoresist layer is removed. According to the above concept, the residual mode in the image sensing element can be one of wet etching or dry etching. According to the above concept, the image sensing component is packaged by: providing the image sensing chip; electrically connecting the image sensing chip to the plurality of pins; and providing the image sensing chip a transparent encapsulating cover; injecting liquid titanium dioxide (Ti〇2) between the image sensing wafer and the transparent encapsulating cover; and covering the heat-containing epoxy resin (Ε ρ ο X y ) to form the package body The liquid titanium dioxide (Ti02) is irradiated by a transparent lamp cover by a transparent lamp cover to further harden the titanium dioxide (Ti02). [Embodiment] The image sensing element of the present invention can be made by the following examples. The description is fully understood, so that those skilled in the art can do so, but the implementation of the present invention is not limited to the implementation of the following embodiments. Please refer to the second figure, the image sensing proposed in the present case The component can be used to sense an optical signal or a reflected optical signal emitted by an object, which can be a transparent package cover 20, an image sensing chip 2, and a plurality of pins 2, 2 The transparent package cover 20 is a transparent glass substrate, and the inner side thereof has a plurality of micro-focus lens structures 20 in an arc shape, and the transparent package substrate can make the object The light source 8 is incident on the inside of the image sensing element via the transparent package cover 20, and the optical signals 25 that are originally dispersed can be gathered together by the plurality of microfocus lens structures 201. The image sensing wafer 2 1 has a plurality of pi X e 1 structures 2 1 1 , which must be placed under the transparent package cover 20 for receiving the plurality of microfocus lens structures 2 0 1 The collected optical signals are converted into an image signal by an internal circuit. One end of the plurality of pins 22 is electrically connected to the image sensing chip 2 1 and the other end is connected to the outside Contacting, for outputting the image signal. As for the package body 23 is mainly composed of an epoxy resin (Ε ρ ο X y ), the image sensing wafer 21 can be isolated from the outside to avoid external moisture and the Image sensing crystal The sheet 2 1 generates an oxidation reaction. As for the transparent adhesive layer 24 sandwiched between the transparent package cover 20 and the image sensing-wafer 2 1 , the refractive index must be higher than the refractive index of the transparent cover material. The incident optical signal is focused, wherein the material of the transparent adhesive layer is an organic composite material (such as Polyimides, Acrylic or Epoxy) or an inorganic material (such as Titanium dioxide (Ti02), tantalum nitride (SiNx) or oxide oxide (TaOx). In the image sensing device of the present invention, two better ones can be developed between the transparent encapsulation cover 20 and the halogen 2 1 1 . For the embodiments, please refer to the third figures (a) and (b), which respectively represent a preferred embodiment. Referring to the third figure (a), the embodiment adopts a method in which each of the elements 2 1 1 accurately corresponds to a microfocus lens 201, and the transparent package cover 20 and the pixel 2 1 1 Inter-positional action is required, that is, by transparent packaging 9
R 200840060 蓋20之上方進行對位動作時，透明封裝 兩側之X符號必須能夠套合於影像感測 2 1兩側之Ο符號内，且透明封裝蓋材料 射係數n〇必須大於注入透明膠層材料的 係數η 1，至於該微聚焦透鏡2 0 1之焦距 必須滿足 d^f (上述之運算式係假設R>>h ) 其中R :係為微聚焦透鏡之半徑。 f:係為微聚焦透鏡之焦距。 h :係微聚焦透鏡之厚度。 d :係微聚焦透鏡頂端至晝素之距離 如透明封裝蓋之材料為玻璃，則其折 數 n〇 = 1.52，而透明膠層注入之材料為 或是 N i s s a n C h e m i c a 1 公司出產之二氧 (T i Ο 2 )，則其折射係數 n i = 2 · 1，而微 透鏡之半徑R係為0.5 // m，則焦聚f為 蓋20 晶片 的折 折射 (f) 射係 Tok 化鈦 聚焦R 200840060 When the alignment operation is performed on the top of the cover 20, the X symbols on both sides of the transparent package must be fit into the Ο symbol on both sides of the image sensing 2 1 , and the coefficient of the material of the transparent encapsulation cover must be greater than that of the injected transparent adhesive. The coefficient η of the layer material is such that the focal length of the microfocus lens 210 must satisfy d^f (the above equation is assumed to be R>>h) where R: is the radius of the microfocus lens. f: is the focal length of the microfocus lens. h : is the thickness of the microfocus lens. d: the distance from the top of the microfocus lens to the halogen. If the material of the transparent encapsulation cover is glass, the number of folds is n〇= 1.52, and the material injected into the transparent adhesive layer is the dioxygen produced by N issan C hemica 1 (T i Ο 2 ), then the refractive index ni = 2 · 1, and the radius R of the microlens is 0.5 // m, then the focal convergence f is the refractive index of the cover 20 wafer (f) the projection system Tok titanium focus
1.52 請再參閱第三圖（b )，此較佳實施例 用之方式係為每個晝素 2 1 1之上方係對 數個微聚焦透鏡2 0 1，則該透明封裝蓋 畫素2 1 1兩者間不需進行對位的動作。 請參閱第四圖（a)(b)(c)(d)，其係為 為聚焦透鏡結構之形成步驟。首先，提 所採 應複 20與 本案 供一 10 200840060 透明玻璃基板 40，並於該透明玻璃基板 40 之上方提供一光阻層 41(PR)。接著，對該 光阻層4 1定義複數個開口 4 2，然後，對該複 數個開口 4 2下方之透明玻璃基板4 0進行一 濕式蝕刻步驟或是乾式蝕刻步驟，可使該透 明玻璃基板 4 0形成複數個微聚焦透鏡之結 構，最後，去除該光阻層4 1，就可使透明玻 璃基板4 0具有複數個微聚焦透鏡之結構。 請參閱第五圖，其係本案影像感測元件 之封裝步驟。首先，提供具有複數個依陣列 f 形式排列晝素之該影像感測晶片，將該影像 感測晶片與該複數支接腳電性連接。接著， 於該影像感測晶片之上方提供該透明封裝 蓋。 , 然後，於該影像感測晶片與該透明封裝 蓋之間注入液態之二氧化鈦（T i Ο 2 )，於周圍 覆蓋上具熱度之環氧樹脂（Epoxy)，進而形 成整個封裝主體。最後，藉由一紫外光燈經 由透明封裝蓋照射該液態之二氧化鈦 (Ti02 )，使該二氡化鈦（Ti02 )硬化。 & 綜合上面所述，本發明能有效解決習知 技術需在每個晝素上形成微聚焦透鏡之問 題，本案只需使用簡單的製程步驟就可於透 明封裝蓋之内側製作微聚焦透鏡結構，可使 由透明封裝蓋入射之光訊號聚焦於晝素上， 進而達到增加靈敏度及解析度之功效，是故 具有產業價值性，進而達到發展本案之目的。 本案得由熟悉本技藝之人士任施匠思而 為諸般修飾，然皆不脫如附申請專利範圍所 欲保護者。 11 200840060 【圖式簡单說明】 第一圖：其係習知影像感測元件之結構示意 圖。 第二圖：其係本案影像感測元件之較佳實施 例結構示意圖。 第三圖（a ):其係本案第一較佳實施例之結 構示意圖。 第三圖（b ):其係本案第二較佳實施例之結 構不意圖。 第四圖（a)(b)(〇(d):其係為本案為聚焦透鏡 結構之形成步驟。 第五圖：其係本案影像感測元件之封裝步驟。 【主要元件符號說明】 10:畫素 11:微聚焦透鏡 12:透明蓋 13:封裝主體 2 0 :透明封裝蓋 2 0 1 :微聚焦透鏡 2 1 :影像感測晶片 2 1 1 :晝素 22:接腳 23:封裝主體 2 4 :透明膠層 2 5 :光訊號 4 0 :透明玻璃基板 4 1 :光阻層 42 ：開口 4 3 :微聚焦透鏡之結構 121.52 Please refer to the third figure (b). The preferred embodiment uses a pair of micro-focusing lenses 20 1 above each of the elements 2 1 1 , and the transparent encapsulating cover 2 1 1 There is no need for alignment between the two. Please refer to the fourth figure (a)(b)(c)(d), which is the step of forming the focusing lens structure. First, a transparent glass substrate 40 for a 10200840060 is provided, and a photoresist layer 41 (PR) is provided above the transparent glass substrate 40. Next, a plurality of openings 4 2 are defined for the photoresist layer 4 1 , and then a transparent etching process or a dry etching step is performed on the transparent glass substrate 40 under the plurality of openings 4 2 to obtain the transparent glass substrate. The structure of the plurality of microfocus lenses is formed by 40, and finally, the photoresist layer 4 1 is removed, so that the transparent glass substrate 40 has a structure of a plurality of microfocus lenses. Please refer to the fifth figure, which is the packaging step of the image sensing component of the present invention. First, the image sensing wafer having a plurality of pixels arranged in an array f is provided, and the image sensing wafer is electrically connected to the plurality of pins. Then, the transparent package cover is provided above the image sensing wafer. Then, liquid titanium dioxide (T i Ο 2 ) is injected between the image sensing wafer and the transparent package cover, and the surrounding epoxy resin (Epoxy) is covered to form the entire package body. Finally, the titanium dioxide (Ti02) is hardened by irradiating the liquid titanium dioxide (Ti02) with a transparent cover by an ultraviolet lamp. In summary, the present invention can effectively solve the problem that the conventional technology needs to form a microfocus lens on each element. In this case, a microfocus lens structure can be fabricated on the inner side of the transparent package cover by using a simple process step. The optical signal incident from the transparent package cover can be focused on the halogen, thereby achieving the effect of increasing sensitivity and resolution, so that it has industrial value and thus achieves the purpose of developing the case. This case has been modified by those who are familiar with the art, and is not intended to be protected by the scope of the patent application. 11 200840060 [Simple description of the diagram] The first picture: It is a schematic diagram of the structure of the conventional image sensing element. The second figure is a schematic structural view of a preferred embodiment of the image sensing element of the present invention. Fig. 3(a) is a schematic view showing the structure of the first preferred embodiment of the present invention. Third Figure (b): It is not intended to be the structure of the second preferred embodiment of the present invention. The fourth figure (a) (b) (〇 (d): This is the formation step of the focusing lens structure for this case. The fifth picture: it is the packaging step of the image sensing element of the present case. [Main component symbol description] 10: Pixel 11: Microfocus lens 12: Transparent cover 13: Package body 2 0: Transparent package cover 2 0 1 : Microfocus lens 2 1 : Image sensing wafer 2 1 1 : Alizarin 22: Pin 23: Package body 2 4: transparent adhesive layer 2 5 : optical signal 40 : transparent glass substrate 4 1 : photoresist layer 42 : opening 4 3 : structure of microfocus lens 12