TW200834239A - Stamp for imprint lithography and imprint lithography method using the same - Google Patents
Stamp for imprint lithography and imprint lithography method using the sameInfo
- Publication number
- TW200834239A TW200834239A TW096144560A TW96144560A TW200834239A TW 200834239 A TW200834239 A TW 200834239A TW 096144560 A TW096144560 A TW 096144560A TW 96144560 A TW96144560 A TW 96144560A TW 200834239 A TW200834239 A TW 200834239A
- Authority
- TW
- Taiwan
- Prior art keywords
- imprint lithography
- stamp
- polymer resin
- same
- pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
- B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
- B41K3/02—Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Atmospheric Sciences (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
This invention provides a stamp for imprint lithography and an imprint lithography method using the same. When a polymer resin stamp is used to form a pattern, the inner surface of the polymer resin stamp having pattern is processed with vapor deposition and a conductor-containing high transmittance conductive layer is used as a backside support body to inhibit occurrence of static electricity. The imprint lithography using molded article manufacturing process of the polymer resin mold is used to prevent foreign object adhesion and damage to the lower portion pattern caused by occurrence of static electricity to provide patterns with good quality on substrates. Therefore, this invention relates to a mold for imprint lithography and an imprint lithography method using the same. Particularly, the stamp for imprint lithography is formed on one side with concave convex shaped polymer resin mold for forming patterns, and a backside support body with light transmittance and conductivity is formed on the other side with respect to the side adhered with the polymer resin mold.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060116764A KR101322133B1 (en) | 2006-11-24 | 2006-11-24 | Stamp for imprint lithography and imprint lithography method using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200834239A true TW200834239A (en) | 2008-08-16 |
TWI440974B TWI440974B (en) | 2014-06-11 |
Family
ID=39480219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096144560A TWI440974B (en) | 2006-11-24 | 2007-11-23 | Stamp for imprint lithography and imprint lithography method using the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101322133B1 (en) |
CN (1) | CN101187777A (en) |
TW (1) | TWI440974B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI761597B (en) * | 2017-09-29 | 2022-04-21 | 日商佳能股份有限公司 | Forming device, manufacturing method of semiconductor device, and manufacturing method of article |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4542167B2 (en) * | 2008-03-31 | 2010-09-08 | 株式会社日立ハイテクノロジーズ | Microstructure transfer device |
KR101603222B1 (en) * | 2009-07-28 | 2016-03-15 | 엘지디스플레이 주식회사 | Method for Forming Pattern in Flat Panel Display and Apparatus for Forming pattern with Using the Same |
CN102508410A (en) * | 2011-10-27 | 2012-06-20 | 南京大学 | Composite nanometer impressing mold plate with sandwich structure and preparation method of composite nanometer impressing mold plate |
CN102361013B (en) * | 2011-11-08 | 2015-05-20 | 无锡瑞威光电科技有限公司 | Method for manufacturing gold salient points on wafer-level flip chip |
KR101515180B1 (en) * | 2012-05-18 | 2015-04-24 | 주식회사 휴템 | Substrates bonding apparatus unsing fluid pressure and substrates bonding method |
KR101399440B1 (en) | 2012-06-20 | 2014-05-28 | 한국기계연구원 | Method for making stamp for plasmonic nano lithography apparatus plasmonic nano lithography apparatus |
CN103360709A (en) * | 2013-06-25 | 2013-10-23 | 辅讯光电工业(苏州)有限公司 | Multifunctional optical film and composite thereof, as well as multifunctional optical plate and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990010876A (en) * | 1997-07-18 | 1999-02-18 | 김영귀 | Vehicle console box switchgear |
AU2002368430A1 (en) * | 2001-05-16 | 2004-08-10 | Board Of Regents, The University Of Texas System | Method and system for fabricating nanoscale patterns in light curable compositions using an electric field |
KR100943561B1 (en) * | 2003-06-03 | 2010-02-22 | 엘지전자 주식회사 | A method of making a wavelength filter |
KR100601263B1 (en) * | 2003-09-18 | 2006-07-14 | 주식회사 미뉴타텍 | Method for forming micro-pattern by using rapid thermal nano-molding |
-
2006
- 2006-11-24 KR KR1020060116764A patent/KR101322133B1/en active IP Right Grant
-
2007
- 2007-11-23 CN CNA200710187100XA patent/CN101187777A/en active Pending
- 2007-11-23 TW TW096144560A patent/TWI440974B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI761597B (en) * | 2017-09-29 | 2022-04-21 | 日商佳能股份有限公司 | Forming device, manufacturing method of semiconductor device, and manufacturing method of article |
US11904522B2 (en) | 2017-09-29 | 2024-02-20 | Canon Kabushiki Kaisha | Imprint apparatus and method for manufacturing article |
Also Published As
Publication number | Publication date |
---|---|
KR101322133B1 (en) | 2013-10-25 |
CN101187777A (en) | 2008-05-28 |
TWI440974B (en) | 2014-06-11 |
KR20080046986A (en) | 2008-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |