TW200832839A - High heat electrical connectors - Google Patents

High heat electrical connectors Download PDF

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Publication number
TW200832839A
TW200832839A TW96103551A TW96103551A TW200832839A TW 200832839 A TW200832839 A TW 200832839A TW 96103551 A TW96103551 A TW 96103551A TW 96103551 A TW96103551 A TW 96103551A TW 200832839 A TW200832839 A TW 200832839A
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Taiwan
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electrical connector
group
bis
bond
aryl
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TW96103551A
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Chinese (zh)
Inventor
Roy Ray Odle
Kapil Chandrakant Sheth
Michael Stephen Donovan
Mark A Sanner
Rajendra Kashinath Singh
Robert Russell Gallucci
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Gen Electric
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Abstract

The present invention relates generally to the field of electrical connectors comprising either: (a) an immiscible blend of polymers having more than one glass transition temperature and one of the polymers has a glass transition temperature greater than 217 DEG Celsius; (b) a miscible blend of polymers having a single glass transition temperature greater than 180 DEG Celsius; or, (c) a single virgin polymer having a glass transition temperature of greater than 247 DEG Celsius,

Description

200832839 九、發明說明: 【發明所屬之技術領域】 本發明大體而言係關於電連接器之領域,該等電連接器 包含至少-插塞及至少一插孔及視情況包含一或多個殼層 部件,該或該等殼層部件包含以下各物中之一者:a)聚^ 物之不可混溶摻合物’該等聚合物具有—個以上玻璃轉移 溫度且聚合物中之一者具有一大於攝氏217度之玻璃轉移 溫度;b)聚合物之可混溶換合物,該等聚合物具有一大於 *攝氏i8G度之單—玻璃轉移溫度;或e)單-聚合物,其具有 一大於攝氏247度之玻璃轉移溫度。 【先前技術】 在工業中,在當到達預定事件或時間時(例如,衛星之釋 放或發射載具之多級分離後)可自彼此容易且快速分離之 兩個結構之間提供電、資料及/或功率連接常為必要的。此 連接通常採取稱作電連接器之兩部分連接總成之形式,其 。&amp;含-具有-或多個插塞之單元及一具有類似數目之插;: 的單元。藉由實例,一衛星可能需要發射載具之多級之間 (或在”堆疊”組態中至鄰接衛星)的41插腳連接直至釋放之 時刻為止。該連接器必須易於配合,在可能為(例如)嚴酷之 行進條件下處於適當位置,且接著在連接不再必要時易於 釋放。 、 存在具有大量不同設計及大小之電連接器,以服務於自 家庭電腦應用至航空應用之廣泛環境。在_些該等末端用 途中,電連接器會經受苛刻的效能要求,諸如過量§力、高 118322.doc -6- 200832839 熱%境及長期振動,此要求電連接器由高效能聚合物製 成。舉例而言,在一些航空應用中,在(例如)含有電連接器 之嘴氣式戰鬥機、飛彈或模擬器以高速執行急轉彎時,電 連接器可能經受高達100倍的重力。電連接器必須借助其設 計及材料而可在此等嚴酷情況下良好地工作。 類似地,當飛機或火箭在飛行中時,存在由於意外或在 軍用飛機敵方原因之情況下而起火的顯著風險。火可迅速 (、哭延且無法控制。聚合物在航空應用中以減重為目的之增 加的使用可加劇此問題,因為許多聚合物在高溫下失去本 貝效月b特性。因此在此項技術中存在對於由聚合物製成以 減重並將在高熱情況下保持其特性之電連接器的持續兩 要。 、而 此項技術中之另一問題在於電連接器傾向於在最初配合 時(例如’當將衛星安裝至發射載具時)不對準。因為兩㈣ 接器單元通常剛性附著至其各別部分(一者附著至發射載 〇 ^一者附著至衛星),所以難以將較小設備(在此實例中之 衛星)擺正位置而使插腳與插口準確嚙合。因此存在對於能 夠進行有限移動之連接器的持續需要以匹配另一連接器2 定向。-已使用之解決方案為使用彈菁負载的可調螺钉, 其可移動地將連接器安裝至結構。遺懷地,已發現此導致 許多問題。第-,使用者必須費力安裝設備且適當地 螺釘(若過緊則彈簣經如此壓縮以致不存在,,間隙,,)。第二/、, 其在空間有限之應用中佔據寶貴的空間(彈菁所需之^外 區隨著可調連接器之數目增長而幾何地增長卜第三,為了 118322.doc 200832839 避免電磁干擾,後軸常為必要的。遺憾地,為了准許使用 者接近以調整彈簧負载螺釘之彈簧,使用後軸為不切實際 的。 先河技術之另一問題在於若插塞相對於插孔即使是微小 地旋轉,設備亦將不適當配合或者插塞末端可能彎曲,引 起設備失效。 在此項技術中存在對於耐熱、阻燃、燃燒時幾乎不釋放 熱s、具有較高空間穩定性、在需要時將易於釋放且在嚴 酉套使用條件下將保持連接之電連接器的持續需要。 為了提供本改良連接器之背景,以下描述在(本連接器對 於其為有用的)應用中有用之電連接器之實例·· 2004年11月9日頒予peterson之美國專利第6,814,632號揭 示一具有電接點結構之電連接器系統,該電接點結構包 括:一導電接點,其具有一具有中空管狀部分之金屬接觸 本體,及一金屬接觸器,其自接觸本體延伸。一中空非金 I, 屬套筒連接至接觸本體之中空管狀部分且自其延伸。非金 屬套筒與中空管狀部分在中空管狀部分與非金屬套筒彼此 連接之區域中同軸。一導線被插入穿過非金屬套筒之内部 且進入接觸本體之中空管狀部分,且經壓接至中空管狀部 分。將電接點結構收納於電連接器本體中。 1986年10月28日頒予Robert Hawkings之美國專利第 4,619,490號描述一導引及保持設備,其包含··一外殼,其 具有一貫穿其之開口且具有第一及第二操作地互連之相對 且大體平行之壁,及至少一對晶圓保持部件,其定位於該 118322.doc 200832839 . 心内…部件可释放地連接至該第-相對壁且另一料 可釋放地連接至該第二壁,每一部件具有複數個導引部分 及保持部分,該等導引部分能夠將可以彼此堆疊關係插入 之導體晶圓導引至外殼中且保持部分能夠個別地可釋放地 將導體晶圓緊固於外殼内;其中保持部分中之每一者包含 : 向内突出之彈簧狀夾具。 3 : 1988年8月16日頒予Th〇mas Diclemente之美國專利第 〇 4,764,13G號揭示H保持部件之電連接II,該保持部 #具有-位於連接器外殼中之小孔中的橫向部分。保持部 件之前端折回於其自身上且裝配入連接器外殼中之一開口 中對保持接腳自橫向部分向外延伸以喝合連接器外殼 之内表面’此等保持接腳協同經折疊之部件起作用以將保 持部件固持於連接器外殼内之適當位置。另外,第二對保 持接腳向内延伸至連接器外殼通道中以將端子外殼保持於 連接器外殼内之適當位置。環繞端子外殼之金屬殼層(連接 Ο 器外殼)具有單件結構之構造,且與同樣由金屬形成之保持 部件組合使用,且經描述為由具有所要的彈簧特性之材料 (諸如不銹鋼)衝壓並成形。 1 990年5月22日頒予David Gmter之美國專利第4 號揭示電連接器之單件結構保護殼層,其包括黏附至保護 殼層之内部的夾緊部件,夾具之彈簧臂向外及向内延伸以 沿插入殼層之端子模組之面朝外的表面將橫肋閉鎖於後 部。每-夾具包括沿本體部分之橫向邊緣之一對向外指向 的大出部,且該等突出部向外插過殼層壁中之相關聯的縱 118322.doc 200832839 . 向狹縫且接著沿殼層之外表面彎曲,較佳地進入凹座以與 外嫒層表面齊平。沿上部内表面及沿下部内表面之一對該 等夾具合作以保持插入殼層之一對端子模組。 1992年6月30日頒予Bassler等人之美國專利第5,125,854 ^ it笔連接器總成,其包括遮罩及框架部件,其中其 至少邛刀導電。複數個模組化子總成安裝於該總成中。 提ί、閉鎖機構用於將每一模組化子總成可拆除地緊固至 。 料及框架部件。閉鎖機構包括一自遮罩及框架部件延伸 之突出部,其中該突出部具有裝配於模組化子總成上之突 出物上的狹槽。 1992年9月8日頒予Pastal等人之美國專利第5,i45,4ii號 描=藉由複數個閉鎖凸耳而保持於金屬殼層内之電連接器 之介電插入物,該等閉鎖凸耳與插入部件整體形成。該等 凸耳在插入部件之外表面之周邊周圍被隔開,且在插入殼 層部件期間,此等凸耳與沿金屬殼層之内表面而界定之相 f、 應終止表面喃合。 上文描述之許多電連接器在航空應用方面得到應用,且 特別用於信號及電傳輸應ϋ因於可靠效能之關鍵程 度,連接器必須⑧足嚴格要求。冑接器之外部(殼層)可為導 電的且可提供電磁遮蔽。連接器作為一整體受到關於機械 耐久性、耐化學及鹽霧性之測試。舉例而言,航空連接器 按軍用標準MIL·STD_ i 344受到關於抗振性之測試,該標準 要求在振動測試之後無損壞或電不連續性。 除對外部殼層之要求以外,連接器必須提供將端子模組 H8322.doc -10· 200832839 緊固於殼層内之構件。用於緊固模組之構件應不干擾將模 組插入殼層中,應不以可能引起緊固構件失效之方式而將 緊固構件暴露於外部環境,且應提供模組在殼層内之仔細 對準。此後者特徵確保連接器内之適當電嚙合。 不僅連接器必須滿足上文規定之技術要求,而且一如既 _ 往地,製造連接器之成本為重要考慮事項。 【發明内容】 〇 本發明係針對-種電連接器’其包含-具有至少一插塞 及或至7插孔之電模組,及(視情況)包含由下列各物組 成之群中選出之聚合物或聚合物之摻合物的一或多個殼層 4件.a)聚合物之不可混溶掺合物,該等聚合物具有一個 以上玻璃轉移溫度且聚合物中之一者具有一大於攝氏217 度之玻璃轉移溫度;b)聚合物之可混溶推合物,該等聚合 物,、有大於攝氏18〇度之單一玻璃轉移溫度;或〇)單一原 生聚合物,其具有—大於攝氏247度之玻璃轉移溫度。 〇 *發明亦係針對—如上之電連接器,其中聚醚醯亞胺具 有在、,勺0.4與0.85之間的氫原子⑻對碳原子(c)之比。 本發明亦係針對前述電連接器,其中聚賴亞胺本質上 無苯甲基質子。 ' 【貫施方式】 定義 ”電連接器”為包括可整合為一件之接觸模組及殼層模組 之插基及插孔連接器設備,其用於提供兩個或兩個以上物 件之間的可分離多通道資料/電連接。 118322.doc 200832839 &quot;插塞’’意謂公隆凸,其在插入插孔後即完成電、信號、 資料或功率連接。 Π插孔’’在用於本文中時意謂母凹入,一插塞裝配入其中。 ’’接點’’或’’端子模組,,指代實際電連接器,其在彼此接觸時 允許電、信號、資料或功率連接之傳輸。 術语”殼層部件”指代部分或完全環繞端子模組之製品。 出於本發明之目的,術語,,金屬化表面”意謂由包含一或 多種金屬之塗層覆蓋的表面。 組合物&quot;指代材料之分子構成,藉此具有不同分子組成 或結構之材料為不同組合物。 回Tg扣代具有180。或180。以上之玻璃轉移溫度的聚合 物。 苯甲基質子(benzylic proton)之定義在此項技術中為熟知 的,且根據本發明,其包含直接化學鍵結至諸如苯基環或 笨裒之至 &gt;、芳環之至少一脂族碳原子,《中該脂族碳原 子另外具有直接鍵結至其之至少一質子。 ▲在本發明之内容中,大體上或本質上無苯甲基質子意謂 諸如聚醯亞胺砜產物之聚合物具有小於約5莫耳%之衍生 結構單元,在一些實施例中小於約3莫耳%衍生結構單元且 在其他實施例中小於約丨莫耳%衍生結構單元,該等結構單 元含有苯甲基質子。無亦稱作苯甲基氫的苯曱基質子意謂 聚醚醯亞胺物品具有零莫耳%之含有笨甲基質子或苯甲基 的自早體衍生之結構單元及封端物。可藉由基於化學結構 的常規化學分析而判定苯甲基質子之量。 H8322.doc -12- 200832839 術語,,氫原子對碳原子之數值比&quot;為聚合物或組成聚合物 之早w單體)中氫原子之數目對碳原子之數目的比。 本么月亦針對包含具有為〇·45_〇 85或⑼或 0. = 0.75或之氫原子數目對碳原子數目的聚鍵酿 亞胺之成形物品。 Ο Ο 本發明亦針對包含本質上無苯甲基質子之—或多種聚醚 的成形物品。本發明之另一態樣為由聚醚醯亞胺或 =有=酿:胺之接合物製成之物品,其具有炼融處理所 :^ 使得在熔融及部分成形轉期間存在相對 子量改變。此要求聚合物無或大體上無將在溶融 …而改變分子量之鍵。㈣醯亞胺中苯甲基質子之 在通常加速熔融中改變分子量 、 夕m h 义刀于里之反應。歸因於生成聚合物 之相加的熔融穩定性,具有本質 一胺、芸# 、’不負上無本甲基質子的自芳族 一:庙 肝衍生之結構單元及封端劑之聚賴亞胺在 用了::涉及聚合後㈣^ 用)中可為較佳的。 = = 術語&quot;塗層&quot;意謂塗覆至稱作基板之 料賴或薄層。在本發明中,基板由—或多種聚合 工使;或聚合物之摻合物製成。塗層可包含熟練技 乍=基板上之塗層的任何材料,包括(但不限於) 合金二:多屬種:或多種黏著劑、一或多種漆、-或多種 :夕目體-液體懸浮液、-或多種聚合物(塗層中 Γ 少—者具有與聚合基板不同之組成)。 於本發明之目的’只要對於完成製品之所欲目的為必 118322.doc •13. 200832839 要’基板上可存在盡可能多的層之塗層。上文所使用之術 語’’薄’’意謂物品上之塗層在塗層最厚點處的厚度小於穿過 物品之重心且延伸至(但不越過)物品之最外邊界之直線的 最大長度。 可藉由熟練技工已知之任何塗覆方法塗覆塗層。舉例而 吕’可藉由電解、氣相沈積、真空蒸發、濺鍍或諸如刷塗 喷霧、壓延及滾塗之機械方法而塗覆塗層。 本發明係針對一種電連接器,其包含組成一電模組之至 少一插塞及至少一插孔,及(視情況)一包含由下列各物組成 之群中選出之聚合物或聚合物之摻合物的殼層部件:叻聚 合物之包括至少一聚醚醯亞胺之不可混溶摻合物,該等聚 a物具有一個以上玻璃轉移溫度且其中聚醚醯亞胺具有大 於攝氏2 1 7度之玻璃轉移溫度;…聚合物之包括至少一聚鱗 醯亞胺之可混溶摻合物,該等聚合物具有大於攝氏18〇度之 單一玻璃轉移溫度;或c)單一聚醚醯亞胺,其具有大於攝 氏247度之玻璃轉移溫度。 本發明亦針對包含具有為〇·45至0.85或0.50至〇·80或〇·55 至0.75或G.6G至G.7G之氫原子數目對碳原子數目的聚賴 亞胺之成形物品。 本發明亦針對包含本質上無苯甲基f子之—或多種聚喊 醯亞胺的成形物品。本發明之另一態樣為由聚醚醯亞胺或 含有聚醚醯亞胺之摻合物製成之物品,其具有熔融處理所 而之充刀i疋性使知在熔融及部分成形程序期間存在相對 較小的分子量改變。此要求聚合物無或大體上無將在溶融 118322.doc -14- 200832839 中反應而改變分子量之鍵。聚醚醯亞胺中苯曱基質子之存 在通常加速熔融中改變分子量之反應。歸因於生成聚合物 之增加的熔融穩定性,具有本質上無苯曱基質子的自芳族 二胺、芳族二酐衍生之結構單元及封端劑之聚醚醯亞胺在 一些應用(尤其涉及聚合後自炫融及炫融處理之隔離之應 用)中可為較佳的。 以下列出用於殼層部件中之基板材料的代表性實例: A·以硬為主之聚合物或摻合物;聚矽氧共聚物;及間苯 二驗衍生之聚芳基酯之較高Tg聚合物摻合物。 本文所揭示為包含一聚合物摻合物之電連接器,其中聚 合物摻合物之一表面之一些或全部由一覆蓋物塗覆,其中 覆蓋材料具有與聚合物摻合物不同之組成,且其中聚合物 摻合物包含:a)由聚砜(psu)、聚(醚砜)(PES)聚(伸苯基醚 硬)(poly(phenylene ether sulfone))(PPSU)之群中選出之第 一樹脂,其具有較高玻璃轉移溫度(Tg仝180。〇,b)一聚矽 氧共聚物’例如聚矽氧聚醯亞胺或聚矽氧聚碳酸酯;及視 情況,c)以間苯二酚為主之聚芳酯化合物,其中摻合物具 有極低之熱釋放值。 1. 摻合物之聚砜、聚醚砜及聚苯醚颯組份 在本文描述之物品中有用的聚砜、聚(醚砜)及聚(伸苯基 醚砜)為(例如)美國專利第3,634,355號、第4,008,203號、第 4,108,837號及第4,175,175號中所描述之熱塑樹脂。 聚石風、聚(鱗砜)及聚(伸苯基醚颯)為直鏈熱熱塑性聚合 物,其具有諸如耐高溫性、良好電學特性及良好水解穩定 118322.doc -15- 200832839 性之許多有吸引力的特徵。 聚颯包含具有式I之結構的重複單元: ί 9 1 ——R-S-- Γ 〇 J (I) 其中R為芳基,其包含碳碳單鍵、碳氧碳鍵或碳碳及碳氧碳 單鍵且該等單鍵形成聚合物主鏈之一部分。 聚(醚砜)包含如式π中所示具有聚合物之主鏈中的醚鍵 及颯鍵兩者之重複單元:200832839 IX. Description of the Invention: [Technical Field] The present invention generally relates to the field of electrical connectors comprising at least a plug and at least one jack and optionally one or more shells The layer component, the or the shell component comprising one of: a) an immiscible blend of the polymer 'the polymer having one or more glass transition temperatures and one of the polymers Having a glass transition temperature greater than 217 degrees Celsius; b) a miscible compound of a polymer having a single-glass transition temperature greater than *10 degrees Celsius; or e) a mono-polymer, It has a glass transition temperature greater than 247 degrees Celsius. [Prior Art] In the industry, electricity, data and data can be supplied between two structures that are easily and quickly separated from each other when a predetermined event or time is reached (for example, after the release of the satellite or the multi-stage separation of the launch vehicle). / or power connections are often necessary. This connection typically takes the form of a two-part connection assembly called an electrical connector. &amp; contains - a unit with - or multiple plugs and a unit with a similar number of plugs; By way of example, a satellite may need to transmit a 41-pin connection between multiple stages of the carrier (or in a "stacked" configuration to an adjacent satellite) until the moment of release. The connector must be easy to fit, in place, for example, under severe travel conditions, and then easily released when the connection is no longer necessary. There are a large number of electrical connectors of different designs and sizes to serve a wide range of environments from home computer applications to aerospace applications. In these end applications, electrical connectors are subject to demanding performance requirements, such as excessive force, high 118322.doc -6-200832839 thermal % and long-term vibration, which requires electrical connectors made of high performance polymers . For example, in some aerospace applications, electrical connectors may experience up to 100 times the weight of gravity when, for example, a mouth gas fighter, missile or simulator containing an electrical connector performs a sharp turn at high speed. Electrical connectors must work well under these harsh conditions with their design and materials. Similarly, when an aircraft or rocket is in flight, there is a significant risk of fire due to an accident or a military aircraft enemy. Fire can be rapid (and crying and uncontrollable. The increased use of polymers for weight reduction in aerospace applications can exacerbate this problem because many polymers lose their B-characteristics at high temperatures. There is a continuing need in the art for an electrical connector made of a polymer to reduce weight and maintain its characteristics under high heat conditions. Another problem in the art is that the electrical connector tends to be initially fitted. (eg 'when the satellite is mounted to the launch vehicle') misalignment. Because the two (four) connector units are usually rigidly attached to their respective parts (one attached to the launching carrier and attached to the satellite), it is difficult to compare The small device (the satellite in this example) is positioned to accurately engage the pin with the socket. There is therefore a continuing need for a connector capable of limited movement to match the orientation of the other connector 2. - The solution that has been used is An adjustable screw with an elastomeric load that movably mounts the connector to the structure. This has been found to cause many problems. - The user must laboriously install the device And appropriate screws (if too tight, the magazine is so compressed that it does not exist, gap,,). Second /,, it occupies valuable space in applications where space is limited (the outer area required for the elastic The number of adjustable connectors grows geometrically and grows third. For the avoidance of electromagnetic interference, the rear axle is often necessary. Unfortunately, in order to allow the user to approach the spring to adjust the spring-loaded screw, after use The axis is impractical. Another problem with the prior art is that if the plug is rotated slightly relative to the jack, the device will not fit properly or the end of the plug may bend, causing equipment failure. A continuing need for electrical connectors that are resistant to heat, flame retardant, hardly release heat when burned, have high dimensional stability, are easily released when needed, and will remain connected under severe sleeve conditions. The background of the connector, the following describes an example of an electrical connector useful in applications where the connector is useful. · The beauty of peterson was awarded on November 9, 2004. No. 6,814,632 discloses an electrical connector system having an electrical contact structure, the electrical contact structure comprising: a conductive contact having a metal contact body having a hollow tubular portion, and a metal contactor, The contact body extends. A hollow non-gold I, the sleeve is connected to and extends from the hollow tubular portion of the contact body. The non-metallic sleeve and the hollow tubular portion are coaxial in a region where the hollow tubular portion and the non-metallic sleeve are connected to each other. A wire is inserted through the interior of the non-metallic sleeve and into the hollow tubular portion of the contact body and is crimped to the hollow tubular portion. The electrical contact structure is received in the electrical connector body. October 28, 1986 A guide and holding device is described in US Pat. And at least one pair of wafer holding members positioned at the 118322.doc 200832839. The inner member is releasably coupled to the first opposing wall and the other material is releasable Connected to the second wall, each component having a plurality of guiding portions and holding portions capable of guiding conductor wafers that can be inserted into each other in a stacked relationship into the housing and the holding portions being individually releasably The conductor wafer is secured within the housing; wherein each of the retention portions comprises: a spring-like clamp that projects inwardly. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; . The front end of the retaining member is folded back onto itself and fits into one of the openings in the connector housing to extend the retaining pin outwardly from the lateral portion to engage the inner surface of the connector housing. Acting to hold the retaining member in place within the connector housing. Additionally, the second pair of retaining pins extend inwardly into the connector housing passage to retain the terminal housing in place within the connector housing. The metal shell (connector housing) surrounding the terminal housing has a one-piece construction and is used in combination with a retaining member also formed of metal and is described as being stamped from a material having a desired spring characteristic, such as stainless steel. Forming. U.S. Patent No. 4 to David Gmter, issued May 22, 1989, discloses a one-piece structural protective shell of an electrical connector comprising a clamping member adhered to the interior of the protective sheath, the spring arms of the clamp being outwardly and Extending inwardly to lock the transverse ribs to the rear along the outwardly facing surface of the terminal module inserted into the shell. Each of the clamps includes an outwardly directed louver along one of the lateral edges of the body portion, and the projections are inserted outwardly through the associated longitudinal direction in the shell wall 118322.doc 200832839. To the slit and then along The outer surface of the shell is curved, preferably into the recess to be flush with the surface of the outer layer. The clamps cooperate along one of the upper inner surface and along one of the lower inner surfaces to maintain one of the plug-in pairs of the terminal modules. U.S. Patent No. 5,125,854, the pen connector assembly of Bassler et al., which is incorporated herein by reference, which incorporates a mask and a frame member, wherein at least the file is electrically conductive. A plurality of modular subassemblies are installed in the assembly. A locking mechanism is used to removably fasten each modular subassembly. Material and frame parts. The latching mechanism includes a projection extending from the mask and the frame member, wherein the projection has a slot that fits over the projection on the modular subassembly. U.S. Patent No. 5, i45, 4ii, issued to Pastal, et al., which is incorporated herein by reference to the entire entire entire entire entire entire entire entire entire disclosure The lug is integrally formed with the insert member. The lugs are spaced around the periphery of the outer surface of the insert member, and during insertion of the shell member, the lugs and the phase defined along the inner surface of the metal shell are quarantined. Many of the electrical connectors described above are used in aerospace applications, and in particular for signal and electrical transmissions due to the critical degree of reliable performance, the connectors must be extremely rigid. The outer (shell) of the splicer can be electrically conductive and provide electromagnetic shielding. The connector as a whole is tested for mechanical durability, chemical resistance and salt spray. For example, the aerospace connector is tested for vibration resistance according to the military standard MIL·STD_i 344, which requires no damage or electrical discontinuity after the vibration test. In addition to the requirements for the outer casing, the connector must provide means for securing the terminal module H8322.doc -10· 200832839 to the casing. The member used to fasten the module shall not interfere with the insertion of the module into the shell. The fastening member shall not be exposed to the external environment in a manner that may cause the fastening member to fail, and the module shall be provided in the shell. Carefully align. The latter feature ensures proper electrical engagement within the connector. Not only must the connector meet the technical requirements specified above, but as always, the cost of manufacturing the connector is an important consideration. SUMMARY OF THE INVENTION The present invention is directed to an electrical connector that includes an electrical module having at least one plug and or seven jacks, and (as appropriate) a selected one of the following: One or more shell layers of a blend of polymers or polymers. a) immiscible blends of polymers having more than one glass transition temperature and one of the polymers having one a glass transition temperature greater than 217 degrees Celsius; b) a miscible polymer of a polymer having a single glass transition temperature greater than 18 degrees Celsius; or a single primary polymer having - Glass transition temperature greater than 247 degrees Celsius. 〇 * The invention is also directed to an electrical connector as described above, wherein the polyether oximine has a hydrogen atom (8) to carbon atom (c) ratio between 0.4 and 0.85. The invention is also directed to the aforementioned electrical connector wherein the polylysine is substantially free of benzylated protons. 'Performance mode' Definition "Electrical connector" is a plug-in and jack connector device that includes a contact module and a shell module that can be integrated into one piece, and is used to provide two or more objects. Separable multi-channel data/electrical connections. 118322.doc 200832839 &quot;plugs&apos; means a male protuberance that completes electrical, signal, data or power connections when inserted into a jack. The Π jack ’’, as used herein, means a female recess into which a plug fits. The 'contact' or ''terminal module,&quot; refers to actual electrical connectors that permit transmission of electrical, signal, data or power connections when in contact with each other. The term "shell component" refers to an article that partially or completely surrounds a terminal module. For the purposes of the present invention, the term "metallized surface" means a surface covered by a coating comprising one or more metals. The composition &quot; refers to the molecular composition of the material whereby materials having different molecular compositions or structures For different compositions. Back Tg deducts a polymer having a glass transition temperature of 180. or more. The definition of a benzylic proton is well known in the art and, according to the present invention, comprises Directly chemically bonded to at least one aliphatic carbon atom such as a phenyl ring or a ruthenium to an aromatic ring, wherein the aliphatic carbon atom additionally has at least one proton directly bonded thereto. ▲In the present invention In general, substantially or essentially no benzyl group proton means that the polymer such as the polyindenine sulfone product has less than about 5 mole percent of the derivatized structural unit, and in some embodiments less than about 3 mole percent of the derivatized structure. Units and in other embodiments less than about 丨 mol % derived structural units, the structural units containing benzylated protons. No phenylhydrazine protons, also known as benzyl hydrogen, means that the polyether oxime article has Zero molar % of self-early derived structural units and endblocks containing a stupid methyl proton or benzyl group. The amount of benzyl group protons can be determined by conventional chemical analysis based on chemical structure. H8322.doc - 12-200832839 The term, the ratio of the number of hydrogen atoms to carbon atoms &quot; is the ratio of the number of hydrogen atoms in the polymer or the early w monomer of the polymer to the number of carbon atoms. This month also has 〇·45_〇85 or (9) or 0. = 0.75 or a shaped article of the number of hydrogen atoms to the number of carbon atoms. Ο Ο The present invention is also directed to the inclusion of essentially no benzyl group protons. A shaped article of a polyether. Another aspect of the invention is an article made of a polyether quinone or a conjugate of a = amine: amine having a smelting treatment: ^ enabling melting and partial forming There is a change in the relative amount during the period. This requires that the polymer has no or substantially no bond that will change its molecular weight during melting. (4) The benzyl group proton in the quinone imine changes the molecular weight in the usual accelerated melting, and the mh Reaction due to the formation of polymer The addition of the melt stability, the nature of one amine, 芸 #, 'do not bear the free of the methyl proton of the self-aromatic one: the temple-derived structural unit and the capping agent of poly-imine in use:: It may be preferred to use (4) after polymerization. = = The term "coating" means applied to a substrate or a thin layer called a substrate. In the present invention, the substrate is made up of - or a plurality of polymerization workers. Or a blend of polymers. The coating may comprise any material that is skilled in the coating on the substrate, including but not limited to alloy 2: multiple species: or multiple adhesives, one or more paints , - or a plurality of: a liquid suspension - a liquid suspension, - or a plurality of polymers (a small amount in the coating - having a composition different from that of the polymeric substrate). For the purposes of the present invention 'as long as the desired purpose for the finished product is mandatory. 118322.doc • 13. 200832839 The coating may be present on as many layers as possible on the substrate. The term ''thin'' as used above means that the coating on the article has a thickness at the thickest point of the coating that is less than the maximum straight line that passes through the center of gravity of the article and extends to (but does not pass) the outermost boundary of the article. length. The coating can be applied by any coating method known to the skilled artisan. For example, the coating may be applied by electrolysis, vapor deposition, vacuum evaporation, sputtering or mechanical means such as brush spray, calendering and roll coating. The present invention is directed to an electrical connector comprising at least one plug and at least one receptacle forming an electrical module, and (as appropriate) a polymer or polymer selected from the group consisting of: Shell component of the blend: the bismuth polymer comprises at least one immiscible blend of polyetherimine having more than one glass transition temperature and wherein the polyether quinone has greater than 2 degrees Celsius a glass transition temperature of 17 degrees; the polymer comprises at least one miscible blend of polysinoin having a single glass transition temperature greater than 18 degrees Celsius; or c) a single polyether A quinone imine having a glass transition temperature greater than 247 degrees Celsius. The present invention is also directed to a shaped article comprising poly-imine having a number of hydrogen atoms of from 〇·45 to 0.85 or 0.50 to 80·80 or 〇·55 to 0.75 or G.6G to G.7G. The present invention is also directed to shaped articles comprising substantially no benzylidene f- or a plurality of polyacrylamides. Another aspect of the present invention is an article made of a polyether quinone imine or a blend containing a polyether quinone which has a melt treatment and is capable of melting and partially forming a process. There is a relatively small change in molecular weight during this period. This requires that the polymer be free or substantially free of bonds that will change in molecular weight in the reaction 118322.doc -14-200832839. The presence of a phenylhydrazine proton in a polyether oximine is a reaction that generally changes the molecular weight during accelerated melting. Due to the increased melt stability of the resulting polymer, the polyether quinone imines derived from aromatic diamines, aromatic dianhydride-derived structural units and capping agents having essentially no benzoquinone protons are useful in some applications ( In particular, it relates to applications in which the separation from the smelting and smelting treatments after polymerization is preferred. Representative examples of substrate materials for use in shell components are listed below: A. Harder-based polymers or blends; polyoxynoxy copolymers; and isophthalic acid-derived polyaryl esters. High Tg polymer blend. Disclosed herein is an electrical connector comprising a polymer blend, wherein some or all of one of the surfaces of the polymer blend is coated by a cover, wherein the cover material has a different composition than the polymer blend, And wherein the polymer blend comprises: a) selected from the group consisting of polysulfone (psu), poly(phenyl sulfone) (PES) poly(phenylene ether sulfone) (PPSU) a first resin having a higher glass transition temperature (Tg to 180. 〇, b) a polyoxyalkylene copolymer such as polyoxymethylene or polyoxyethylene polycarbonate; and optionally, c) A resorcinol-based polyarylate compound in which the blend has a very low heat release value. 1. Blend polysulfone, polyether sulfone and polyphenylene ether oxime component Polysulfone, poly(ether sulfone) and poly(phenylene ether sulfone) useful in the articles described herein are, for example, US patents Thermoplastic resins as described in Nos. 3,634,355, 4,008,203, 4,108,837 and 4,175,175. Polylithic wind, poly(sulfuron) and poly(phenylene ether) are linear thermal thermoplastic polymers with many properties such as high temperature resistance, good electrical properties and good hydrolysis stability 118322.doc -15- 200832839 Attractive features. Polyfluorene comprises a repeating unit having the structure of formula I: ί 9 1 - RS-- Γ 〇 J (I) wherein R is an aryl group containing a carbon-carbon single bond, a carbon-oxygen bond or a carbon-carbon and a carbon-oxygen carbon The single bond and the single bonds form part of the polymer backbone. The poly(ether sulfone) comprises a repeating unit having both an ether bond and a hydrazone bond in the main chain of the polymer as shown in the formula:

ϋ ί 9 1 --Ar-S-Ar·—〇-- L 〇 J (II) 其中Ar及Ar’為可相同或不同之芳基。Ar及Ar,可相同或不 同。¥ Ar及Ar1均為伸苯基時’聚合物稱作聚(伸苯基醚礙)。 當Ar及Ar’均為伸芳基時,聚合物稱作聚(伸芳基醚礙)。石風 鍵之數目與鱗鍵之數目可相同或不同。式(ΠΙ)中展示證明 砜鍵之數目何時不同於醚鍵之數目的例示性結構: 0 , -Ar-S-Ar1—O-Ar·,一0-ί ί 9 1 --Ar-S-Ar·—〇-- L 〇 J (II) wherein Ar and Ar' are aryl groups which may be the same or different. Ar and Ar may be the same or different. ¥ When Ar and Ar1 are both extended phenyl groups, the polymer is called poly(phenylene ether). When both Ar and Ar' are an aryl group, the polymer is referred to as a poly(exoaryl ether). The number of stone wind keys and the number of scale keys may be the same or different. An exemplary structure demonstrating when the number of sulfone bonds differs from the number of ether bonds is shown in formula (ΠΙ): 0 , -Ar-S-Ar1—O-Ar·, a 0-

II (III) 〇 - 其中Ar、Ar’及Ar,,為可相同或不同之芳基。Ar、Ar,及Arn 可相同或不同,例如,Ar&amp;Ar,可均為伸苯基且^,,可為雙 (1,4-伸苯基)異丙基。 多種聚砜及聚(醚砜)為市售,包括二羥基二苯砜與二氯二 苯颯之聚縮產物,及雙酚A及/或聯苯酚與二氯二苯砜之聚 縮產物。市售樹脂之實例包括可購自s〇Way有限公司之 RADEL R、RADEL A及UDEL,及可購自BASF公司之 118322.doc -16- 200832839 ULTRASON E。 製備聚砜及聚(醚砜)之方法廣泛已知且此項技術中已充 分描述若干合適製程。兩種方法,碳酸鹽方法及鹼金屬氫 氧化物方法對於熟練技工而言為已知的。在驗金屬氫氧化 物方法中,使二㈣之雙驗金屬鹽與二自苯型化合物在偶 極、非質子性溶劑存在之情況下在大體上無水之條件下接 觸。此項技術(例如美國專利第4,176,222號)中亦揭示碳酸 鹽方法,其中二經酚及二齒苯型化合物(例如)連同碳酸鈉或 重石厌酸鈉及第二鹼金屬碳酸鹽或重碳酸鹽被加熱。或者, 可藉由此項技術中已知的多種方法中之任—者製備聚硬及 聚(喊爾1 )。 聚砜或聚(醚砜)之分子量(如藉由諸如二氣甲烷、三氣甲 烷、N-甲基吼咯啶酮或其類似物之適當溶劑中的對比黏度 資料所指示)可大於或等於約〇·3 dl/g,或更特定言之,大於 或等於約0_4 dl/g且通常將不超過約15 dl/g。 在一些情況中,聚砜或聚(醚颯)重量平均分子量如藉由使 用ASTM方法D5296之凝膠滲透層析所判定而可為約/〇,〇〇〇 至約100,000。在一些情況中,聚砜及聚(醚砜)可具有約 180°C至約250°C之玻璃轉移溫度。當將聚砜、聚(醚砜)及聚 (伸苯基醚砜)與本文所述之樹脂摻合時,聚砜、聚(醚颯) 及聚(伸苯基醚砜)將具有大於或等於約18〇。〇之玻璃轉移溫 度(Tg)。關於砜塑膠之ASTM方法d6394標準規範中進一步 描述聚礙樹脂。 在一些情況中,聚砜、聚(醚颯)及聚(伸苯基醚砜)及其摻 118322.doc -17· 200832839 合物將具有小於或等於約U5之氫對碳的原子比(H/c)。不 受理論約束,具有相對於氫含量而言較高碳含量(即氫對碳 原子之較低比)的聚合物常展示改良之❿效能。此等聚合物 具有較低燃燒值且可在燃燒時釋放較少能量。其亦可铖由 在聚合燃料與火源之間形成絕緣焦化層之傾向而耐燃 獨立於行動之任何特定機制或模式,已觀測到具有較低H/c 比之該等聚合物具有優良耐燃性。在一些情況中,H/C比可 小於或等於0.75或小於〇·65。在其他情況中,大於或等於約 0.4之H/C比為較佳的卩給出具有《分可撓之鍵的聚合結構 從而達成熔融加工性。給定聚合物或共聚物之H/c比可由其 化學結構判定(藉由對碳原子及氫原子獨立於存在於化學 重複單元中的任何其他原子之計數)。 在聚合物摻合物十,聚砜、聚(醚砜)及聚(伸苯基醚砜) 及其摻合物可基於聚合物摻合物之總重量以約丨至約99重 ϊ百分比之量存在。在此範圍内,聚砜、聚(醚砜)及聚(伸 苯基喊砜)及其混合物之量可大於或等於約2〇重量百分 比’更特定言之大於或等於約50重量百分比,且更加特定 吕之大於或等於約7 0重量百分比。熟練技工將瞭解聚石風、 I (鱗艰)及聚(伸苯基醚礙)及其混合物可以總聚合物摻合 物之約1與約99重量百分比(且特定言之自1至7〇重量百分 比)之間的任一^實數之重量百分比存在。 2.摻合物之聚矽氧組份 聚矽氧共聚物包含對改良組合物之熱釋放效能有效之任 何矽氧烷共聚物。在一些情況中,可使用聚醚醯亞胺、聚 118322.doc •18- 200832839 醚醯亞胺碾、聚砜、聚(伸苯基醚砜)、聚(醚颯)或聚(伸苯 基醚)之矽氧烷共聚物。在一些情況中,矽氧烷聚醚醯亞胺 t物或石夕氧烧聚碳酸醋共聚物在減小熱釋放及改良流動 速率效此中可為有效的。亦涵蓋不同類型之石夕氧烧共聚物 之混合物。在一實施例中,矽氧烷共聚物相對於共聚物之 總重量包含約5至約70重量%之矽氧烷含量且在其他情況 中為2 0至約5 〇重量%之石夕氧烧含量。 〇 共聚物之矽氧烷片段之嵌段長度可具有任何有效長度。 在一些實例中,嵌段長度可為約2至約70個矽氧烷重複單 二。在其他情況中,矽氧烷嵌段長度可為約5至約5〇個重複 單70。在許多情況中,可使用二甲基矽氧烷。 矽氧烷聚醚醯亞胺共聚物為聚合物摻合物中可使用之矽 乳烷共聚物的特定實_。該等石夕氧烧聚_亞胺共聚物 之實例展不於美國專利第4,4〇4,35〇號、第號及第 4’690,997號中。在一情況中,可以類似於用於聚醚醯亞胺 ◎ 弋々方式來製備梦氧烧聚趟醯亞胺共聚物,除了有機 一胺反應物之σ卩分或全部由(例如)式Iv之胺端基有機矽氧 烧所替代之外,其中g為具有值1至約50,或更特定言之約5 至、々30之正數,且R,為具有2至約別個碳原子之芳基、烷基 或芳基烷基。 &amp; H2N- R1—Si-^〇Si-)〇Si—Ρ·~ΝΗ2II (III) 〇 - wherein Ar, Ar' and Ar, are the same or different aryl groups. Ar, Ar, and Arn may be the same or different. For example, Ar&amp;Ar may be a phenyl group and may be a bis(1,4-phenylene) isopropyl group. A variety of polysulfones and poly(ether sulfones) are commercially available, including polycondensation products of dihydroxydiphenyl sulfone and dichlorodiphenyl hydrazine, and polycondensation products of bisphenol A and/or biphenol and dichlorodiphenyl sulfone. Examples of commercially available resins include RADEL R, RADEL A, and UDEL, available from s〇 Way Co., Ltd., and 118322.doc -16-200832839 ULTRASON E, available from BASF Corporation. Methods for preparing polysulfones and poly(ether sulfones) are widely known and several suitable processes have been fully described in the art. Both methods, the carbonate process and the alkali metal hydroxide process are known to the skilled artisan. In the method of detecting a metal hydroxide, the double metal salt of the di(tetra) and the dibenzoyl compound are contacted under substantially anhydrous conditions in the presence of a dipolar, aprotic solvent. A carbonate process is also disclosed in the art, for example, in U.S. Patent No. 4,176,222, in which a phenolic and bidentate benzene type compound (for example) is combined with sodium carbonate or barium sulphate and a second alkali metal carbonate or heavy The carbonate is heated. Alternatively, polyhard and poly (Single 1) can be prepared by any of a variety of methods known in the art. The molecular weight of the polysulfone or poly(ether sulfone) (as indicated by the comparative viscosity data in a suitable solvent such as di-methane, tri-methane, N-methylpyrrolidone or the like) may be greater than or equal to About 3 dl/g, or more specifically, greater than or equal to about 0_4 dl/g and typically will not exceed about 15 dl/g. In some cases, the polysulfone or poly(ether oxime) weight average molecular weight may be from about 〇, 〇〇〇 to about 100,000 as determined by gel permeation chromatography using ASTM method D5296. In some cases, the polysulfone and poly(ether sulfone) can have a glass transition temperature of from about 180 °C to about 250 °C. When polysulfone, poly(ether sulfone) and poly(phenylene ether sulfone) are blended with the resins described herein, the polysulfone, poly(ether oxime) and poly(phenylene ether sulfone) will have greater than or It is equal to about 18 baht. The glass transition temperature (Tg) of bismuth. The barrier resin is further described in the ASTM method d6394 standard specification for sulfone plastics. In some cases, polysulfone, poly(ether oxime), and poly(phenylene ether sulfone) and their doping 118322.doc -17 200832839 will have an atomic ratio of hydrogen to carbon of less than or equal to about U5 (H) /c). Without being bound by theory, polymers having a higher carbon content (i.e., a lower ratio of hydrogen to carbon atoms) relative to the hydrogen content often exhibit improved enthalpy performance. These polymers have lower combustion values and can release less energy upon combustion. It can also be flammable and independent of any specific mechanism or mode of action that forms an insulating coking layer between the polymeric fuel and the source of ignition. It has been observed that these polymers have excellent flame resistance with a lower H/c ratio. . In some cases, the H/C ratio may be less than or equal to 0.75 or less than 〇·65. In other cases, a H/C ratio of greater than or equal to about 0.4 is preferred to give a polymeric structure having a "tough bond" to achieve melt processability. The H/c ratio of a given polymer or copolymer can be determined by its chemical structure (by counting the carbon and hydrogen atoms independently of any other atoms present in the chemical repeat unit). In polymer blends X, polysulfone, poly(ether sulfone) and poly(phenylene ether sulfone) and blends thereof may be present in a percentage of from about 丨 to about 99% by weight based on the total weight of the polymer blend. The quantity exists. Within this range, the amount of polysulfone, poly(ether sulfone), and poly(phenylene sulfone), and mixtures thereof, can be greater than or equal to about 2 weight percent 'more specifically, greater than or equal to about 50 weight percent, and More specific than Lu is greater than or equal to about 70 weight percent. The skilled artisan will know that the polylithic wind, I (scale) and poly(phenylene ether) and mixtures thereof may be from about 1 to about 99 weight percent of the total polymer blend (and in particular from 1 to 7 〇) The weight percentage of any real number between the weight percentages exists. 2. Polyoxymethane component of the blend The polyoxynoxy copolymer comprises any of the decane copolymers which are effective for improving the heat release performance of the composition. In some cases, it is possible to use polyetherimine, poly 118322.doc •18-200832839 ether oxime imide mill, polysulfone, poly(phenylene ether sulfone), poly(ether oxime) or poly(phenylene) An alkane copolymer of ether). In some cases, the decyl alkoxy polyether oxime imine or the diarrhea polycarbonate copolymer may be effective in reducing heat release and improving flow rate. Mixtures of different types of Zeolites are also covered. In one embodiment, the oxoxane copolymer comprises from about 5 to about 70% by weight of the decane content relative to the total weight of the copolymer and in other cases from 20 to about 5% by weight of the sulphur oxide content. The block length of the oxirane fragment of the ruthenium copolymer can have any effective length. In some examples, the block length can range from about 2 to about 70 decane repeats. In other instances, the oxetane block length can range from about 5 to about 5 repeat repeats 70. In many cases, dimethyloxane can be used. The decane polyether oxime copolymer is a specific conjugate of a ruthenium lactone copolymer which can be used in a polymer blend. Examples of such agglomerated oxygen-polyimine copolymers are shown in U.S. Patent Nos. 4,4,4,35, the entire disclosure of which is incorporated herein by reference. In one case, the oxyazepine polyamine copolymer can be prepared similarly to the polyether oxime oxime oxime, except for the σ 卩 of the organic monoamine reactant or all by, for example, the formula Iv In addition to the amine-terminated organic oxime, wherein g is a positive number from 1 to about 50, or more specifically about 5 to 々30, and R is a aryl having 2 to about another carbon atom Base, alkyl or arylalkyl. &amp; H2N- R1—Si-^〇Si-)〇Si—Ρ·~ΝΗ2

式IV 可精由熟習此項技術者所熟知之方法中之任—者來製備 118322.doc -19- 200832839 矽氧烧聚醚醯亞胺共聚物,包括式V之芳族雙(醚酐)與式 VII之有機二胺的反應Formula IV can be prepared by any of the methods well known to those skilled in the art. 118322.doc -19- 200832839 Anthraquinone polyether oxime copolymer, including aromatic bis(ether anhydride) of formula V Reaction with an organic diamine of formula VII

其中T為-〇-、-S-、-S〇2_或式-之基團,其中_〇_或 -0-Z-0-基團之二價鍵處於3,3’、3,4’、4,3,或4,4位置,且其 中Z包括(但不限於)經取代或未經取代之二價有機基,諸 如:(a)具有約6至約20個碳原子之芳族烴基及其鹵化衍生 物;(b)具有約2至約20個破原子之直鏈或分枝鏈伸烧基;(c) 具有約3至約20個碳原子之環伸烷基或(d)通式¥1之二價基Wherein T is a group of -〇-, -S-, -S〇2_ or formula-, wherein the divalent bond of the _〇_ or -0-Z-0- group is at 3,3', 3,4 ', 4, 3, or 4, 4 positions, and wherein Z includes, but is not limited to, a substituted or unsubstituted divalent organic group, such as: (a) an aromatic having from about 6 to about 20 carbon atoms a hydrocarbyl group and a halogenated derivative thereof; (b) a linear or branched chain alkyl group having from about 2 to about 20 broken atoms; (c) a cycloalkyl group having from about 3 to about 20 carbon atoms or (d) ) The divalent group of the formula:

(VI) 其中Q包括(但不限於)由下列各物組成之群中選出之二價 基:·0-、-S- 、-c(0)-、-S02-、-SO-、-CyH2y-(y為自 1至8 之整數)及其氟化衍生物,包括全氟伸烷基。 H2N-R1-NH2 (VII) 其中式VII中之基r1包括(但不限於)經取代或未經取代之二 價有機基,諸如:(a)具有約6至約24個碳原子之芳族烴基及 其鹵化衍生物;(b)具有約2至約20個碳原子之直鏈或分枝鏈 伸烷基;具有約3至約2〇個碳原子之環伸烷基或(句通式 VI之二價基。 (例如)在美國專利第3,972,9〇2號及第4,455,41〇號中揭示 特定芳族雙酐及有機二胺之實例。式(χιν)之芳族雙酐的說 118322.doc -20- 200832839 明性實例包括: 3,3-雙[4-(3,4-二羧基苯氧基)苯基]丙烷二酐; 4,4f-雙(3,4-二羧基苯氧基)二苯醚二酐; 4,4f-雙(3,4-二羧基苯氧基)二苯硫醚二酐; 4,4、雙(3,4-二羧基苯氧基)二苯甲酮二酐; 4,4’-雙(3,“二羧基苯氧基)二苯砜二酐; 2,2-雙[4-(2,3-二羧基苯氧基)苯基]丙烷二酐; 4,4f-雙(2,3-二幾基苯氧基)二苯醚二酐; 4,4f-雙(2,3-二羧基苯氧基)二苯硫醚二酐; 雙(2,3-二羧基苯氧基)二苯甲酮二酐; 4,4’-雙(2,3-二羧基苯氧基)二苯砜二酐; 4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二苯基'2_丙 烷二酐; 4-(2,3-一羧基苯氧基)~4,-(3,4-二羧基苯氧基)二苯醚二酐; 4-(2,3-二羧基苯氧基)_心(3,4_二羧基苯氧基)二苯硫醚二 酐; 4-(2,3-二羧基苯氧基)_4,_(3,‘二羧基苯氧基)二苯同二 酐;及, 4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二苯砜二酐以 及其混合物。 除了上文所述之矽氧烷二胺之外,合適二胺之實例包括 乙二胺、丙一胺、三亞甲基二胺、二伸乙基三胺、三伸乙 基四胺、己一胺、庚二胺、辛二胺、壬二胺、癸二胺、丨,12_ 十二炫二胺、1,18-十人燒二胺、3_曱基庚二胺、4,4_二甲基 118322.doc -21 - 200832839 Ο Ο 庚二胺、4_甲基壬二胺、5_甲基壬二胺、2,5·二甲基己二胺、 二甲基庚二胺、2,2-二甲基丙二胺、Ν_甲基*胺基 丙基)胺、3-甲氧基己二胺、U.雙(3_胺基丙氧基)乙烧、雙 (3-胺基丙基)硫化物、Μ_環己二胺、雙_(4_胺基環己基)甲 烧、間苯二胺、對苯二胺、2,4_二胺基甲苯、认二胺基甲 苯、間二甲苯二胺、對二甲苯二胺、2_甲基_4,6_二乙基# 伸苯基-二胺、5-甲基-4,6-二乙基],3_伸苯基_二胺、聯苯 胺、3,3’·二甲基聯苯胺、3,3,_二甲氧基聯苯胺、Μ·二胺基 萘、雙(4_絲苯基)曱烧、雙(214-胺基·3,5_二乙基苯基) 曱烧、雙(4-胺基苯基)丙烧、2,4_雙(胺基-第三丁基)甲苯、 雙(對-胺基-第三丁基苯基)鍵、雙(對_甲基-鄰_胺基苯基) 苯又(對甲基-鄰-胺基戊基)苯、13 —二胺基異丙苯、雙 (4-胺基苯基)硫化物、雙(4_胺基苯基)礙、雙(4_胺基苯基) 醚及包含前述各物中之兩者或兩者以上的組合。石夕氧烧二 胺之特定實例為1,3_雙(3_胺基丙基)四甲基二石夕氧烧。在一 實施例中’結切氧炫二胺使用之二胺基化合物為芳族二 胺,尤其為間苯二胺及對苯二胺、磺醯基雙苯胺及其混合 物0 一些矽氧烷聚醚醯亞胺共聚物可藉由式VII之有機二胺 或二胺之混合物與如上文所提的式以之胺端基有機矽氧烷 之反應而形成。二胺基組份可在與雙酐之反應之前經物理 混合,因此形成實質上隨機乏共聚物。或者可藉由乂11及IV 與二酐(例如,式V之二酐)之選擇性反應而形成嵌段或交替 共聚物以製成隨後共同反應之聚醯亞胺嵌段。在另一情況 118322.doc -22- 200832839 中,用以製備聚醚醯亞胺共聚物之矽氧烧可具有酐而非胺 官能性端基。 在一情況中,矽氧烷聚醚醯亞胺共聚物可具有式VIII, 其中T、R’及g為如上文所描述,b具有約5至約100之值且Ar1 為具有6至約36個碳之芳基或烷基芳基。(VI) wherein Q includes, but is not limited to, a divalent group selected from the group consisting of: -0-, -S-, -c(0)-, -S02-, -SO-, -CyH2y - (y is an integer from 1 to 8) and its fluorinated derivatives, including perfluoroalkylene. H2N-R1-NH2 (VII) wherein the group r1 in the formula VII includes, but is not limited to, a substituted or unsubstituted divalent organic group such as: (a) an aromatic having from about 6 to about 24 carbon atoms a hydrocarbyl group and a halogenated derivative thereof; (b) a linear or branched alkyl group having from about 2 to about 20 carbon atoms; a cycloalkyl group having from about 3 to about 2 carbon atoms or (sentence formula An example of a specific aromatic dianhydride and an organic diamine is disclosed in U.S. Patent Nos. 3,972,9,2 and 4,455,41, the entire disclosure of which is incorporated herein by reference. Said 118322.doc -20- 200832839 Examples of clarity include: 3,3-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride; 4,4f-bis (3,4-di Carboxyphenoxy)diphenyl ether dianhydride; 4,4f-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4,bis(3,4-dicarboxyphenoxy) Benzophenone dianhydride; 4,4'-bis(3,"dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl Propane dianhydride; 4,4f-bis(2,3-diylphenoxy)diphenyl ether dianhydride; 4,4f-bis(2,3-dicarboxyphenoxy)diphenyl sulfide Anhydride; bis(2,3-dicarboxyphenoxy)benzophenone dianhydride; 4,4'-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride; 4-(2,3 -dicarboxyphenoxy)_4,_(3,4-dicarboxyphenoxy)diphenyl'2-propane dianhydride; 4-(2,3-monocarboxyphenoxy)~4,-(3 , 4-dicarboxyphenoxy)diphenyl ether dianhydride; 4-(2,3-dicarboxyphenoxy)-heart (3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4- (2,3-dicarboxyphenoxy)_4,_(3,'dicarboxyphenoxy)diphenyl dianhydride; and, 4-(2,3-dicarboxyphenoxy)_4,_(3 , 4-dicarboxyphenoxy)diphenyl sulfone dianhydride, and mixtures thereof. In addition to the above-described oxirane diamines, examples of suitable diamines include ethylenediamine, propylamine, and trimethylene. Amine, di-ethyltriamine, tri-extension ethyltetramine, hexamethyleneamine, heptanediamine, octanediamine, decanediamine, decanediamine, hydrazine, 12_12 dans diamine, 1,18-ten Human diamine, 3_mercaptoheptane diamine, 4,4-dimethyl 118322.doc -21 - 200832839 Ο 庚 heptanediamine, 4-methylguanidine diamine, 5-methylindole diamine, 2 ,5· dimethylhexamethylenediamine, dimethylheptanediamine, 2,2- Methyl propylenediamine, Ν_methyl*aminopropyl)amine, 3-methoxyhexamethylenediamine, U.bis(3-aminopropyloxy)ethene, bis(3-aminopropyl) Sulfide, Μ_cyclohexanediamine, bis(4-aminocyclohexyl)methane, m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, diaminotoluene, and Xylene diamine, p-xylene diamine, 2-methyl- 4,6-diethyl #phenyl-diamine, 5-methyl-4,6-diethyl], 3-phenylene _Diamine, benzidine, 3,3'-dimethylbenzidine, 3,3,-dimethoxybenzidine, quinone diaminonaphthalene, bis(4-phenylene) oxime, double 214-amino-3,5-diethylphenyl) oxime, bis(4-aminophenyl)propane, 2,4-bis(amino-t-butyl)toluene, double (p- Amino-t-butylphenyl) bond, bis(p-methyl-o-aminophenyl)benzene (p-methyl-o-aminopentyl)benzene, 13-diaminoisopropylbenzene And bis(4-aminophenyl) sulfide, bis(4-aminophenyl), bis(4-aminophenyl)ether, and a combination comprising two or more of the foregoing. A specific example of the sulphur oxide diamine is 1,3_bis(3-aminopropyl)tetramethyldiazepine. In one embodiment, the diamine-based compound used in the oxydiamine is an aromatic diamine, especially m-phenylenediamine and p-phenylenediamine, sulfonyldiphenylamine, and mixtures thereof. The ether quinone imine copolymer can be formed by the reaction of a mixture of an organic diamine or a diamine of the formula VII with an amine-terminated organodecane which is as defined above. The diamine based component can be physically mixed prior to reaction with the dianhydride, thus forming a substantially random lack of copolymer. Alternatively, a block or alternating copolymer can be formed by selective reaction of hydrazine 11 and IV with a dianhydride (e.g., a dianhydride of formula V) to form a polyamidene block which is subsequently co-reacted. In another aspect, 118,322. doc -22-200832839, the oxime fire used to prepare the polyether oxime copolymer may have an anhydride rather than an amine functional end group. In one aspect, the oxoxane polyether oxime copolymer may have Formula VIII, wherein T, R', and g are as described above, b has a value from about 5 to about 100 and Ar1 has from 6 to about 36. a carbon aryl or alkylaryl group.

式 VIII Ο 在一些矽氧烷聚醚醯亞胺共聚物中,矽氧烷聚醚醯亞胺 共聚物之二胺組份可含有約20至50莫耳%之式…的胺端基 有機石夕氧烧及約50至80莫耳%之式VII的有機二胺。在一些 石夕氧燒共聚物中’矽氧烧組份衍生自約25至約4〇莫耳%之 胺或末端酸酐有機矽氧烷。 u 聚合物摻合物之聚矽氧共聚物組份可相對於聚合物摻合 物之總重量以約o.i至約40重量百分比或者自約〇1至約2〇 重量百分比之量而存在。在此㈣Μ,聚石夕氧共聚物亦可 以0.1至約10%,進一步自0 5至約50%之量而存在。 3·摻合物之以間苯二酚為主之聚芳酯化合物組份 以間苯二酚為主之聚芳酯化合物為包含芳基化聚酯結構 單元之聚合物’該等單元為二盼與芳族二賴之反應產 物。方基化聚S旨結構單元之至少—部分包含i,3 •二經基苯基 、式所D兄明)其在整個此說明書令通常被稱作間苯二酚 或間苯二酚基團。除非另行明確規定,否則間苯二酚或間 H8322.doc -23- 200832839 苯二酚基團在使用於本文中時應理解為包括未經取代之 1,3-二羥基苯及經取代之二羥基苯兩者。 i〇p^〇iFormula VIII Ο In some of the alkoxyalkyl polyether oxime copolymers, the diamine component of the decane polyether oxime copolymer may contain from about 20 to 50 mole % of the amine-terminated organic stone of the formula Oxygen fired and about 50 to 80 mole % of the organic diamine of formula VII. In some of the oxy-oxygenated copolymers, the &apos;oxygenated component is derived from about 25 to about 4 mole percent of the amine or terminal anhydride organooxane. The polyoxymethylene copolymer component of the polymer blend may be present in an amount from about 0.1 to about 40 weight percent, or from about 1 to about 2 weight percent, based on the total weight of the polymer blend. In the above (4), the polyoxo copolymer may also be present in an amount of from 0.1 to about 10%, further from from 0 5 to about 50%. 3. The resorcinol-based polyarylate compound component of the blend is a resorcinol-based polyarylate compound which is a polymer comprising an arylated polyester structural unit. Hope to react with the aromatics. The at least part of the structural unit of the geminal poly(S) comprises i,3 • di-based phenyl, the formula of the formula D), which is commonly referred to throughout the specification as a resorcinol or resorcinol group. . Unless otherwise specified, resorcinol or inter-H8322.doc -23-200832839 benzenediol groups are understood to include unsubstituted 1,3-dihydroxybenzene and substituted two as used herein. Both hydroxybenzene. I〇p^〇i

R2n 式 IX 在式IX中,R2在每次出現時獨立地為CM2烷基、丨_c“芳 基、c^c:24烷基芳基、烷氧基或鹵素,且11為〇_4。 在一實施例中,以間苯二酚為主之聚芳酯化合物樹脂包 〇 含大於或等於約50莫耳%之衍生自間苯二酚與芳基二羧酸 或適於芳基酯鍵之形成的芳基二羧酸衍生物(例如,羧酸鹵 化物、羧酸酯及羧酸鹽)之反應產物的單元。 合適二羧酸包括單環及多環芳族二羧酸。例示性單環二 羧酸包括間苯二甲酸、對苯二酸或間苯二甲酸與對苯二酸 之此&amp;物。多環二羧酸包括二苯基二致酸、二苯醚二羧酸 及萘二羧酸(例如,萘-2,6-二羧酸)。 因此,在一貫施例中,聚合物摻合物包含熱穩定聚合物, (J /、八有間苯一盼芳基化聚酯單元(如式χ所說明),其中R2及 η為如先前所定義:R2n Formula IX In Formula IX, R2 is independently CM2 alkyl, 丨_c "aryl, c^c:24 alkylaryl, alkoxy or halogen at each occurrence, and 11 is 〇_4 In one embodiment, the resorcinol-based polyarylate compound resin comprises greater than or equal to about 50 mole percent of resorcinol and aryl dicarboxylic acid or is suitable for aryl esters. A unit of the reaction product of an aryl dicarboxylic acid derivative (for example, a carboxylic acid halide, a carboxylic acid ester, and a carboxylate) formed by a bond. Suitable dicarboxylic acids include monocyclic and polycyclic aromatic dicarboxylic acids. The monocyclic dicarboxylic acid includes isophthalic acid, terephthalic acid or isophthalic acid and terephthalic acid. Polycyclic dicarboxylic acid includes diphenyl dicarboxylic acid and diphenyl ether dicarboxylate. Acid and naphthalene dicarboxylic acid (for example, naphthalene-2,6-dicarboxylic acid). Therefore, in a consistent application, the polymer blend contains a thermally stable polymer, (J /, 八有苯苯一盼芳a base polyester unit (as illustrated by the formula) wherein R2 and η are as previously defined:

可藉由界面聚合方法製造包含間苯二酚芳基化聚酯單元 之水合物。為了製備包含實質上無酸酐鍵之間苯二酚芳基 化聚g曰單元之聚合物,可使用一方法,其中第一步驟將間 苯二酚基團與觸媒組合於水與大體上與水不可混溶的有機 118322.doc -24- 200832839 溶劑之混合物中。合適間苯二酚化合物具有式XI: ΧίA hydrate comprising a resorcinol arylated polyester unit can be produced by an interfacial polymerization method. To prepare a polymer comprising a benzenediol arylated polyfluorene unit substantially free of anhydride linkages, a method can be used in which the first step combines the resorcinol group with the catalyst in water and substantially Water immiscible organic 118322.doc -24- 200832839 in a mixture of solvents. Suitable resorcinol compounds have the formula XI: Χί

R2n 式 XI 其中R2在每次出現時獨立地為Cm烷基、c6-c24芳基、 C7_C24烷基芳基、烷氧基或鹵素,且η為0-4。烷基(若存在) 通常為直鏈、分枝鏈或環狀烷基,且雖然涵蓋其他環位置, 但其最常位於兩個氧原子之鄰位。合適烷基包括(但不 (1 限於)甲基、乙基、正丙基、異丙基、丁基、異-丁基、第三 丁基、己基、環己基、壬基、癸基及芳基取代之烷基,包 括苯甲基。在特定實施例中,烷基為甲基。合適齒基為溴 基、氯基及就基。在各種實施例中^之值可為〇至3,在一此 實施例中為0至2,且在其他實施例中為〇至丨。在一實施例 中,間苯二酚基團為2_甲基間苯二酚。在另一實施例中, 間苯二酚基團為未經取代之間苯二酚基團,其中^為零。該 方法進一步包含將一觸媒與反應混合物組合。在各種實施 D 例中’該觸媒可基於酸氯化物基團之總莫耳量以〇·〇 1至i〇 莫耳%之總含量存在,且在一些實施例中以〇 2至6莫耳%之 總含ΐ存在。合適觸媒包含三級胺、四級胺鹽、四級鱗鹽、 六烷基胍鹽及其混合物。 合適二羧酸芳族二_化物可包含自單環部分衍生之芳族 二羧酸二氣化物,其說明性實例包括異酞醯基二氯化物、 對酞醯基二氯化物或異酞醯基與對酞醯基二氯化物之混合 物。合適二羧酸芳族二_化物亦可包含自多環部分衍生之 118322.doc -25- 200832839 =&amp;-羧m物’其說明性實例包括二苯基二幾酸二 乳化物、二苯越二幾酸二氯化物及萘二㈣二氯化物,尤 f為奈-2,6·二羧酸二氯化物;或來自單環及多環芳族二羧 酸二氯化物之混合物。在一實施例中,二羧酸二氯化物包 含異酞酿基及/或對酞醯基二氯化物之混合物(如通常於式 ΧΙΙ令所說明)。 〇 式™ 異酞醯基及對駄醯基二氯化物巾之一者或兩者可存在。 在些μ轭例中,二羧酸二氯化物包含異酞醯基與對酞醯 基二氣化物以異酞醯基與對酞醯基的約〇·25_4 〇:丨之莫耳 比之混合物;在其他實施例中該莫耳比為約〇·4_2·5:1 ;且 在其他實施例中該莫耳比為約0.67_15:1。 二羧酸齒化物僅提供一製備本文中所提之聚合物之方 法。亦涵蓋製造間苯二酚芳基化鍵之其他途徑,其使用(例 0 如)二羧酸、二羧酸酯(尤其活性酯)或二羧酸鹽或部分鹽。 亦可使用一鏈終止劑(在下文中有時亦稱作封端劑)。添加 鏈終止劑之目的為限制包含間苯二酚芳基化聚酯鏈成員之 聚合物的分子量,因此提供具有受控分子量及良好加工性 之聚合物。通常,在含間苯二酚芳基化物之聚合物無需具 有反應性端基以用於進一步應用時添加鏈終止劑。在無鏈 終止劑之情況下,含間苯二酚芳基化物之聚合物可用於溶 液中或自溶液中恢復以用於後續使用,諸如用於可能需要 118322.doc -26- 200832839 間苯二酚芳基化聚醋片段上之反應性端基(通常為羥基)之 存在的共聚物形成中。鏈終止劑可為單#化合物、單叛酸 氯化物、單氯甲酸酯或前述各物中之兩者或兩者以上的組 合。通常’鏈終止劑可基於間苯二酚(在單酚化合物之情況 下)及基於酸二氯化物(在單羧酸氯化物及/或單氯甲酸酯之 情況下)以0.05至10莫耳%之量存在。 合適單酚化合物包括單環酚,諸如酚、Ci_C22烷基取代之 酚、對-枯基苯酚、對·第三丁基酚、羥基二苯;二酚之單醚, 諸如對-甲氧基盼。如美國專利第4,334,〇53號中所描述,烷 基取代之酚包括具有分枝鏈烷基取代基之酚,該等取代基 具有8至9個碳原子。在一些實施例中,單酚鏈終止劑為酚、 對-枯基苯酚及間苯二酚單苯甲酸酯。 合適單羧酸氯化物包括單環單羧酸氯化物,諸如苯曱醯 氣化物、C〗-C22院基取代之苯甲醯氯化物、甲苯曱醯氯化 物、i素取代之苯甲醯氣化物、溴苯曱醯氯化物、桂皮醯 氣化物、4-财德亞胺基苯甲醯氯化物(‘nadimidobenzoyl chloride)及其混合物;多環單羧酸氣化物,諸如偏苯三酸 酐氯化物及萘甲醯氯化物;及單環與多環單羧酸氯化物之 混合物。具有高達22個碳原子之脂族單羧酸之氯化物亦為 合適的。脂族單羧酸之官能化氯化物(諸如丙烯醯氯化物及 曱基丙烯醯氣化物)亦為合適的。合適單氯曱酸酯包括單環 單氣曱酸酯,諸如苯基氣曱酸酯、烷基取代之苯基氯甲酸 酉旨、對-枯基苯基氣曱酸酯、甲苯氣甲酸酯及其混合物。 鏈終止劑可與間苯二酚一同組合,可含於二羧酸二氯化 118322.doc -27- 200832839 物之溶液中’或可在預縮合物之產生之後被添加至反應混 合物。若使用單羧酸氯化物及/或單氯曱酸酯作為鏈終止 劑’則其常與二羧酸二氣化物一同被引入。亦可在二羧酸 之氯化物已大體上反應或反應完成之時刻將此等鏈終止劑 添加至反應混合物。若將酚類化合物用作鏈終止劑,則在 一實施例中可在反應期間將其添加至反應混合物,或在另 一實施例中,可在間苯二酚與酸二氣化物之間的反應開始 之前將其添加至反應混合物。當製備含末端羥基間苯二酚 芳基化物之預縮合物或募聚物時,則鏈終止劑可不存在或 僅以少量存在以幫助對募聚物分子量之控制。 在另一實施例中,可包括分枝劑,諸如三官能或更高官 能羧酸氯化物及/或三官能或更高官能酚。該等分枝劑(若被 包括)通常可分別基於所用二羧酸二氯化物或間苯二酚以 0.005至1莫耳%之量而得以使用。合適分枝劑包括(例如)三 官能或更高官能羧酸氯化物,諸如對稱苯三甲酸三酸氣化 物、3,3’,4,4’-二苯甲酮四羧酸四氯化物、1,4,5,8_萘四羧酸 四氣化物或苯均四酸四氣化物,及三官能或更高官能酚, 諸如4,6-二甲基_2,4,6-三(4-羥苯基)-2-庚烯、4,6-二甲基 -2,4,6_三(4-羥苯基)_庚烷、H5-三(4-羥苯基苯、 三(4-羥苯基乙烷、三(4_羥苯基)_苯基甲烷、2,2_雙_[4,4_ 雙-(4-羥苯基)-環己基 &gt; 丙烷、2,4-雙-(4-羥苯基異丙基 盼、四-(4-羥苯基)_甲烷、2,6-雙-(2-羥基-5-甲苄基)-4_甲 盼、2-(4-羥苯基)_2-(2,4-二羥苯基)-丙烷、四-(‘[4-羥苯基 異丙基l·苯氧基l·甲烷、1,4-雙-[(4,4-二羥基三苯基)甲基卜 118322.doc -28- 200832839 苯。可首先引入紛分枝劑連同間苯二盼部分,而酸氯化物 分枝劑可與酸二氯化物一同引入。 在其實施例中之一者中,製品包含藉由所描述之方法製 造且實質上無鍵聯聚酯鏈之至少兩個基體的酸酐鍵之熱穩 疋間苯一酚芳基化聚酯。在特定實施例中,該等聚酯包含 自間苯一甲g夂及對苯二甲酸之混合物所衍生的二羧酸殘基 (如式XIII中所說明)··R2n Formula XI wherein R2 is independently Cm alkyl, c6-c24 aryl, C7_C24 alkylaryl, alkoxy or halogen at each occurrence, and η is 0-4. The alkyl group, if present, is typically a straight chain, a branched chain or a cyclic alkyl group, and although it encompasses other ring positions, it is most often ortho to the two oxygen atoms. Suitable alkyl groups include, but are not limited to, methyl, ethyl, n-propyl, isopropyl, butyl, iso-butyl, tert-butyl, hexyl, cyclohexyl, decyl, decyl and aryl The alkyl group substituted with a benzyl group. In a particular embodiment, the alkyl group is a methyl group. Suitable dentate groups are bromo, chloro and indenyl. In various embodiments, the value can be from 〇 to 3, In one embodiment, it is 0 to 2, and in other embodiments is 〇 to 丨. In one embodiment, the resorcinol group is 2-methyl resorcinol. In another embodiment The resorcinol group is an unsubstituted stilbene group wherein ^ is zero. The method further comprises combining a catalyst with a reaction mixture. In various embodiments D, the catalyst can be based on an acid The total molar amount of chloride groups is present in a total amount of 〇·〇1 to i〇mol%, and in some embodiments is present in total ΐ2 to 6 mol% 。. Suitable catalysts include three a primary amine, a quaternary amine salt, a quaternary phosphonium salt, a hexaalkylguanidinium salt, and mixtures thereof. Suitable dicarboxylic acid aromatic di-forms may comprise an aromatic dicarboxylic acid derived from a monocyclic moiety. Di-vapors, illustrative examples of which include isodecyl dichloride, p-nonyl dichloride or a mixture of isodecyl and p-nonyl dichloride. Suitable dicarboxylic acid aromatic di- 118322.doc -25-200832839 =&amp;-carboxym species' may be included as an illustrative example including diphenyldipic acid di-emulsifier, diphenyl succinic acid dichloride, and naphthalene (d) a dichloride, especially f is naphthalene-2,6.dicarboxylic acid dichloride; or a mixture of monocyclic and polycyclic aromatic dicarboxylic acid dichloride. In one embodiment, dicarboxylic acid dichloride The compound comprises a mixture of isomeric bases and/or p-nonyl dichlorides (as generally described in the formula). Oxime TM and iso-decyl and one or two of the antimony dichloride towels In some μ yoke cases, the dicarboxylic acid dichloride contains an isodecyl group and a p-fluorenyl di vapor with an isodecyl group and a p-fluorenyl group about 25·4 〇: 丨 莫The mixture of ear ratios; in other embodiments the molar ratio is about 4·4_2·5:1; and in other embodiments the molar ratio is about 0.67-15:1. The dentate provides only one method of preparing the polymers mentioned herein. It also encompasses other routes for the production of resorcinol arylate linkages using (eg, 0) dicarboxylic acids, dicarboxylic esters (especially active esters). Or a dicarboxylate or a partial salt. A chain terminator (also sometimes referred to as a capping agent hereinafter) may also be used. The purpose of adding a chain terminator is to limit the inclusion of a resorcinol arylated polyester chain member. The molecular weight of the polymer, thus providing a polymer with controlled molecular weight and good processability. Typically, the chain terminator is added when the resorcinol arylate-containing polymer does not require reactive end groups for further use. In the absence of a chain terminator, the resorcinol arylate-containing polymer can be used in solution or recovered from solution for subsequent use, such as for the possible use of 118322.doc -26- 200832839 benzene The copolymer in the presence of a reactive end group (usually a hydroxyl group) on the diphenol arylated polyester fraction is formed. The chain terminator may be a single compound, a monoterpic acid chloride, a monochloroformate or a combination of two or more of the foregoing. Usually the 'chain terminator can be based on resorcinol (in the case of monophenolic compounds) and based on acid dichloride (in the case of monocarboxylic acid chlorides and/or monochloroformates) from 0.05 to 10 moles The amount of ear % is present. Suitable monophenolic compounds include monocyclic phenols such as phenol, Ci_C22 alkyl substituted phenol, p-cumyl phenol, p-tert-butyl phenol, hydroxy diphenyl; monoethers of diphenols, such as p-methoxy . The alkyl-substituted phenols include phenols having a branched chain alkyl substituent having from 8 to 9 carbon atoms as described in U.S. Patent No. 4,334, the disclosure of which is incorporated herein. In some embodiments, the monophenolic chain terminators are phenol, p-cumylphenol, and resorcinol monobenzoate. Suitable monocarboxylic acid chlorides include monocyclic monocarboxylic acid chlorides such as benzoquinone gasification, C-C22-based substituted benzamidine chloride, toluene chloride, i-substituted benzamidine , bromophenyl hydrazine chloride, cinnabar hydrazine, 4-nadimidobenzoyl chloride and mixtures thereof; polycyclic monocarboxylic acid vapors such as trimellitic anhydride chloride and naphthyl醯 chloride; and a mixture of monocyclic and polycyclic monocarboxylic acid chlorides. Chlorides of aliphatic monocarboxylic acids having up to 22 carbon atoms are also suitable. Functionalized chlorides of aliphatic monocarboxylic acids such as propylene sulfonium chloride and mercapto propylene oxime are also suitable. Suitable monochlorophthalic acid esters include monocyclic monogas phthalates such as phenyl phthalate, alkyl substituted phenyl chloroformate, p-cumyl phenyl phthalate, toluene benzoate And mixtures thereof. The chain terminator may be combined with resorcinol and may be included in the solution of the dicarboxylic acid dichloride 118322.doc -27-200832839' or may be added to the reaction mixture after the precondensate is produced. If a monocarboxylic acid chloride and/or a monochlorophthalic acid ester is used as the chain terminator, it is often introduced together with the dicarboxylic acid dihydrate. The chain terminators may also be added to the reaction mixture at a time when the chloride of the dicarboxylic acid has been substantially reacted or the reaction is completed. If a phenolic compound is used as the chain terminator, it may be added to the reaction mixture during the reaction in one embodiment, or in another embodiment between resorcinol and the acid dihydrate. It was added to the reaction mixture before the start of the reaction. When preparing a precondensate or a condensate containing a terminal hydroxy resorcinol arylate, the chain terminator may be absent or present only in minor amounts to aid in controlling the molecular weight of the polymer. In another embodiment, a branching agent such as a trifunctional or higher functional carboxylic acid chloride and/or a trifunctional or higher functional phenol may be included. Such branching agents, if included, can generally be used in amounts of from 0.005 to 1 mol%, respectively, based on the dicarboxylic acid dichloride or resorcinol used. Suitable branching agents include, for example, trifunctional or higher functional carboxylic acid chlorides, such as symmetrical trimellitic acid triacids, 3,3',4,4'-benzophenone tetracarboxylic acid tetrachloride, 1,4,5,8-naphthalenetetracarboxylic acid tetravaporate or pyromellitic acid tetrahydrate, and trifunctional or higher functional phenol such as 4,6-dimethyl-2,4,6-tri ( 4-hydroxyphenyl)-2-heptene, 4,6-dimethyl-2,4,6-tris(4-hydroxyphenyl)-heptane, H5-tris(4-hydroxyphenylbenzene, three (4-Hydroxyphenylethane, tris(4-hydroxyphenyl)-phenylmethane, 2,2-bis-[4,4-bis-(4-hydroxyphenyl)-cyclohexyl] propane, 2, 4-bis-(4-hydroxyphenylisopropylpro, tetra-(4-hydroxyphenyl)-methane, 2,6-bis-(2-hydroxy-5-methylbenzyl)-4-methyl, 2-(4-Hydroxyphenyl)_2-(2,4-dihydroxyphenyl)-propane, tetra-('[4-hydroxyphenylisopropyl l-phenoxyl.methane, 1,4- Bis-[(4,4-dihydroxytriphenyl)methyl b 118322.doc -28- 200832839 benzene. It is possible to first introduce a branching agent together with a meta-phenylene moiety, while an acid chloride branching agent can be combined with an acid. Dichloride is introduced together. In one of its embodiments, the article comprises as described A thermally stable meta-phenylene phenol arylated polyester of an anhydride linkage of at least two substrates of a substantially unbonded polyester chain. In a particular embodiment, the polyester comprises from meta-phenylene a dicarboxylic acid residue derived from a mixture of hydrazine and terephthalic acid (as illustrated in formula XIII)··

=中R2在每以現日㈣立地為Cm成基、cvc^基、燒基 芳基、院氧基或鹵素,且n為〇_4,且瓜大於或等於約卜在 ^種實施例中’η為零且m為約1〇至約3〇〇。$苯二酸醋與對 苯二酸酯之莫耳比在一實施例中為約〇·25_4〇:ι,在另一實 施例中為約0·4-2.5:ι ’且在另一實施例中為約〇·67_ΐ 5:ι。 實質上無酸酐鍵意謂在約购9(rc之溫度對該聚合物加 熱五分鐘後’肖等聚,展示在—實施例中小於3〇%且在 另一實施例中小於1〇%之分子量的減小。 如共同擁有之美國專利第5,916,997號中所揭示,亦包括 包含間苯二㈣基化共聚醋之物品,該等共聚醋含軟欲段 片段。術肖軟嵌段在使用於本文中時指示聚合物之一些片 k由非方族單體單元構成。該等非芳族單體單元—般為脂 族且已知為向含軟嵌段之聚合物賦予可撓性。該等共聚物 118322.doc -29- 200832839 包括包含式IX、XIV及XV之結構單元的共聚物··= where R2 is Cm-based, cvc^-based, alkyl-aryl, alkoxy or halogen, and n is 〇_4, and the melon is greater than or equal to about 256 in each embodiment. 'η is zero and m is from about 1 〇 to about 3 〇〇. The molar ratio of benzene sulphate to terephthalate is about 〇 25_4 〇: ι in one embodiment, and about 0·4-2.5: ι ' in another embodiment and in another embodiment In the example, it is about 67·ΐ 5:ι. Substantially free of anhydride linkage means that after about five minutes of heating the polymer at about the temperature of rc, the mixture is shown in the embodiment, less than 3% by weight, and in another embodiment less than 10,000%. In addition, as disclosed in the commonly-owned U.S. Patent No. 5,916,997, the inclusion of an isophthalic (tetra)-based copolymerized vinegar, which contains a soft segment. The soft block is used in Some sheets k of the polymer are indicated herein to be composed of non-aromatic monomer units. These non-aromatic monomer units are generally aliphatic and are known to impart flexibility to polymers containing soft blocks. Copolymer 118322.doc -29- 200832839 A copolymer comprising structural units of formula IX, XIV and XV··

〇十〇十

式IX 〇 0 ΛΖΛEquation IX 〇 0 ΛΖΛ

式XIV ('、 &gt;^、R3/R〆、Formula XIV (', &gt;^, R3/R〆,

式XV 其中R及η為如先鈾所定義,Z1為二價芳基,r3為c3-2〇直鏈 伸烧基、Cm分枝鏈伸烧基或Chq環或雙環伸烧基,且R4 及R5各獨立表示 〇 或一ch2-〇一, 其中式XV向聚酯之|旨鍵貢獻約1至約4 5莫耳百分比。額外 Q 實施例提供組合物,其中式XV在各種實施例中向聚酯之酯 鍵貢獻約5至約40莫耳百分比,且在其他實施例中向聚酯之 酉旨鍵貢獻約5至約20莫耳百分比。另一實施例提供組合物, 其中在一實施例中R3表示Csa直鏈伸烷基或Cw環伸烷 基,且在另-實施例中R3表示C3心直鍵伸烧基或^_環伸烧 基。式XIV表示芳族二羧酸殘基。式則中之二價芳基,在 各種貝施例中可由如上文所定義之合適二羧酸殘基所衍 生,且在-些實施例中包含伸苯基、i,心伸苯基或认 伸萘基或前述各物中之兩者或兩者以上的組合。在各種實 118322.doc -30- 200832839 轭例中,ζ1包含大於或等於 在含軟嵌段鏈成員……耳百刀比之伸苯基。 為零。 的各種實施例中,式DC中之η 物^!施例之另—者中,以間苯二盼為主之聚芳醋化合 .、、、肷&amp;共U旨碳酸6旨,&amp;包含與有機碳酸酯喪段片段 ^合之含間苯二酚芳基化物的 .^ 妁甘入1又片奴。在該等共聚物中Wherein R and η are as defined by uranium, Z1 is a divalent aryl group, r3 is a c3-2〇 linear chain extension group, a Cm branch chain extension group or a Chq ring or a bicyclic extension group, and R4 And R5 each independently represent 〇 or a ch2-〇1, wherein Formula XV contributes from about 1 to about 45 mole percent to the polyester. Additional Q embodiments provide compositions wherein Formula XV contributes from about 5 to about 40 mole percent to the ester linkage of the polyester in various embodiments, and in other embodiments from about 5 to about 10 percent to the polyester bond of the polyester. 20 mole percentage. Another embodiment provides a composition wherein, in one embodiment, R3 represents a Csa linear alkyl or Cw cycloalkyl, and in another embodiment R3 represents a C3 straight bond or a ring extension. Burning base. Formula XIV represents an aromatic dicarboxylic acid residue. The divalent aryl group of the formula may be derived from a suitable dicarboxylic acid residue as defined above in various shell examples, and in some embodiments comprises a phenyl group, an i, a phenyl group or a phenyl group. A naphthyl group or a combination of two or more of the foregoing. In various examples of the yoke of 118322.doc -30-200832839, ζ1 contains greater than or equal to the phenyl group in the soft block chain member. Zero. In the various embodiments of the formula Δ, in the other embodiments of the formula, the poly- aryl acetonate, which is mainly composed of m-benzophenone, is a combination of a carbonic acid, a &amp; Containing a resorcinol arylate which is combined with an organic carbonate fragrant fragment. In the copolymers

C 間苯二酚芳基化物鏈成員之片段實質上無酸針鍵。實 貝上無酸酐鍵意謂在約28()韻。c之溫度對該共聚酷碳酸 酉旨加熱五分鐘後’料共㈣碳酸_即展示在—實施例中 小於10%且在另-實施例中小於5%之分子量的減小。 妷駄知肷段片段含有自雙酚與碳酸酯形成物質(諸如碳 醯氣)之反應所衍生之碳酸醋鍵,構成聚醋碳酸醋共聚物。 舉例而§,間苯二酚聚芳酯化合物碳酸酯共聚物可包含間 苯一甲酸及對苯二甲酸、間苯二酚及雙酚A與碳醯氯之反應 產物。間苯二酚聚酯碳酸酯共聚物可由一方式製成以使得 (例如)藉由使間苯二酚與二羧酸進行預反應以形成芳基聚 酯嵌段且接著使該嵌段與雙酚及碳酸酯反應以形成共聚物 之聚碳酸酯部分來最小化雙酚二羧酸酯鍵的數目。 為了得到最佳效應,間苯二酚聚酯碳酸酯中之間苯二酚 s旨含量(REC)應大於或等於自間苯二酚衍生之聚合物鍵的 約5 0莫耳%。在一些情況中,視應用而定,間苯二酚衍生 鍵之大於或等於約75莫耳%,或甚至高達約90或100莫耳% 的REC可為所要的。 嵌段共聚酯碳酸酯包括包含交替芳基化物嵌段與有機碳 118322.doc -31 - 200832839 酸酯嵌段之嵌段妓平祐山^ /、石反酸酯(如通常於式χνι中所說 明),装φ P 2 » Μ达,·The fragment of the C resorcinol arylate chain member is substantially free of acid needle bonds. The absence of an acid anhydride bond on the shell means that it is about 28 () rhyme. The temperature of c is heated for five minutes after the copolymerization of the carbonic acid carbonate, i.e., less than 10% in the embodiment and less than 5% in the other embodiment. It is known that the segment contains a carbonated vinegar bond derived from the reaction of bisphenol with a carbonate forming substance such as carbon helium to form a polyvinyl acetate copolymer. For example, §, the resorcinol polyarylate compound carbonate copolymer may comprise meta-benzoic acid and terephthalic acid, resorcinol and a reaction product of bisphenol A and carbonium chloride. The resorcinol polyestercarbonate copolymer can be made in a manner such that, for example, by reacting resorcin with a dicarboxylic acid to form an aryl polyester block and then subjecting the block to a double The phenol and carbonate react to form a polycarbonate portion of the copolymer to minimize the number of bisphenol dicarboxylate linkages. For best results, the resorcinol content (REC) in the resorcinol polyester carbonate should be greater than or equal to about 50 mole percent of the polymer bond derived from resorcin. In some cases, depending on the application, greater than or equal to about 75 mole percent of the resorcinol derived bond, or even up to about 90 or 100 mole percent of REC may be desirable. The block copolyestercarbonate comprises a block comprising an alternating arylate block and an organic carbon 118322.doc -31 - 200832839 acid ester block, 妓平佑山^ /, a stone acid ester (as is usually found in the formula χνι Illustrated), installed φ P 2 » Μ达,·

-〇-R6—〇-〇-R6—〇

方基化物肷段具有由瓜表示之聚合度⑴巧,其在一實施例 〇 〇 中=於或等於約4,在另—實施例中大於或等於約1〇,在另 實施例中大於或等於約2G且在又—實施例中為約30至約 :5〇。由P表*之有機碳酸g旨嵌段之训在—實施例中大於或 等於約2’在另—實施例中為約1〇至約20且在又-實施例中 為約2至約200。嵌段之分配可為如此以提供具有芳基化物 “又相對於奴g曼酯嵌段之任何所要的重量比例《共聚物。 敖而口 ’芳基化物嵌段之含量在一實施例中為相對於聚 合物之總重量的約10至約95重量%且在另一實施例中為約 50至約95重量%。 —雖然式XVI中言兒明間苯二酸酯與對苯二酸酯之混合物,但 芳基化物肷#又中之二羧酸殘基可由如上文所定義之任何合 適二羧酸殘基或合適二羧酸殘基之混合物所衍生,包括由 脂族二酸二氯化物(所謂”軟嵌段&quot;片段)所衍生之二羧酸殘 基。在各種實施例中,n為零且芳基化物嵌段包含間苯二甲 酸殘基與#苯二甲酸殘基之混合物所衍生之二羧酸殘基, 其中間苯二酸g旨與對苯二酸s旨之莫耳比在—實施例中為約 0·25-4·0:1,在另一實施例中為約0.4-2.5:1,且在另一實施 118322.doc -32- 200832839 例中為約0.67-1.5:1。 在有機碳酸酯嵌段中,每一 R6 俨古她I 在母—人出現時獨立地為二 :有聽。在各種實施财’該基包含二㈣取代之芳族 烴n合物中“之總數目的大於或 有 刀為月曰私、脂環族或芳基。合適r6基包括 間_伸苯基、對·伸苯基、W聯伸二苯、4,4,_二二二甲= 伸苯基、2,2-雙(;4_伸苯美Ί丙f 土 Ο ϋ 累一 [1Η-茚滿])及類似基,諸 羥基取代之芳族烴 (名無或式(通用或特定)揭示於美國專利第mm 之基。 :些實施例中,每一 R6為芳族有機基且在其他實施例 中為式χνπ之基: Α1— Υ— a2--The square-based moiety has a degree of polymerization (1) represented by melon, which in one embodiment is = or equal to about 4, in another embodiment greater than or equal to about 1 〇, in another embodiment greater than or Equal to about 2G and in still another embodiment from about 30 to about: 5 〇. The teachings of the organic carbonates of the P-sheets are in the embodiment - greater than or equal to about 2' in another embodiment from about 1 to about 20 and in still another embodiment from about 2 to about 200. . The partitioning of the blocks can be such as to provide the desired content of the copolymer having the aryl compound "and the desired weight ratio of the sulphate block." From about 10 to about 95% by weight, and in another embodiment from about 50 to about 95% by weight, based on the total weight of the polymer. -Although in the formula XVI, the isophthalate and the terephthalate are a mixture, but the aryl carboxylic acid residue may be derived from any suitable dicarboxylic acid residue as defined above or a mixture of suitable dicarboxylic acid residues, including aliphatic diacid dichloride. a dicarboxylic acid residue derived from a compound (so-called "soft block" fragment. In various embodiments, n is zero and the arylate block comprises a dicarboxylic acid residue derived from a mixture of an isophthalic acid residue and a #phthalic acid residue, wherein the isophthalic acid g is related to the para-benzene The diacid s is intended to be about 0. 25-4. 0:1 in the embodiment, about 0.4 to 2.5:1 in another embodiment, and 118322.doc -32 in another embodiment. In the case of 200832839, it is about 0.67-1.5:1. In the organic carbonate block, each R6 她 ancient she I is independently two when the mother-person appears: there is hearing. In various implementations, the base contains two (four) substituted aromatic hydrocarbon n compounds. "The total number of purposes is greater than or the knives are ruthenium, alicyclic or aryl. Suitable r6 groups include m-phenyl, ·Extension of phenyl, W-linked diphenyl, 4,4,_di-diethylene = phenyl, 2,2-bis (;4_Extension of phenylene fluorene f) ϋ 累 一[1Η-茚满] And a similar group, hydroxy-substituted aromatic hydrocarbons (named no or formula (general or specific) are disclosed in the US Patent No. mm. In some embodiments, each R6 is an aromatic organic group and in other embodiments The base of the formula χνπ: Α1—Υ—a2--

式 XVII 其中母-Α1及Α2為單環二價芳基且γ為橋基,其中一或兩個 碳原子分離Α1與Α2。式XVI1中之自由價鍵通常處於V及Α2 相對於Υ之間位或對位W在其中具有式χνπ之化合物為雙 酚’且為了簡潔’有時在本文中使用術語&quot;雙酚&quot;來表示二 规基取代之芳族烴。然而,應瞭解亦可適當地使用此類型 之非雙酚化合物。 在式XVII中’八1及八2通常表示未經取代之伸苯基或其經 取代之何生物,說明性取代基(一或多個)為烧基、烯基及鹵 素(尤其為漠)。在—實施例中,未經取代之伸苯基為較佳 勺 及Α兩者#為對-伸苯基,但兩者可均為鄰-或間-伸 118322.doc -33 - 200832839 苯基或一者為鄰-或間-伸苯基且另一者為對-伸苯基。 橋基¥為_,其中一或兩個原子將Α1自Α2分離。在一特 定實施例中,一原子將Αι自Α2分離。此類型之說明性基為 _〇_、、-s〇_或-S02-、亞甲基、環己基亞甲基、2_[2.21]_ 聯環庚基亞甲基、伸乙基、亞異丙基、亞新戊基、亞環己 基、亞環十五基、亞環十二烷基、亞金剛烷基及類似基。 Ο ϋ 在一些實施例中,孿-伸烷基(通常稱作”亞烷基”)為較佳 的。然而,亦包括不飽和基。在一些實施例中,雙酚為2,2_ 雙(4-羥苯基)丙烷(雙酚A*BPA),其中γ為亞異丙基且a1 及A各為對_伸笨基。視存在於反應混合物中之間苯二酚的 莫耳超額量而定,碳酸酯嵌段中之R6可至少部分包含間苯 二酚基團。換言之,在一些實施例中,式义之碳酸酯嵌段可 包含間苯二酚基團結合至少一其他二羥基取代之芳族烴。 包括一肷段、二嵌段及多嵌段共聚酯碳酸酯。包含間苯 二酚芳基化鏈成員之嵌段與包含有機碳酸酯鏈成員之嵌段 之間的化學鍵可包含以下之至少一者·· =芳基化物基之合適二μ酸殘基與有機碳酸醋基之 -〇-r6-〇-基之間的酯鍵(例如如通常於式χνιπ中所說明), 其中R6為如先前所定義: 〇Wherein, the parent-Α1 and Α2 are monocyclic divalent aryl groups and γ is a bridging group in which one or two carbon atoms separate Α1 and Α2. The free valence bond in formula XVI1 is usually in the position of V and Α2 relative to Υ or in the para position W. The compound having the formula χνπ therein is bisphenol 'and for the sake of brevity' is sometimes used herein in the term &quot;bisphenol&quot; To represent a dibasic substituted aromatic hydrocarbon. However, it should be understood that this type of non-bisphenol compound can also be suitably used. In the formula XVII, '8 and 8' generally denote unsubstituted phenyl or its substituted organism, and the illustrative substituent(s) are alkyl, alkenyl and halogen (especially indifferent). . In the examples, the unsubstituted phenyl group is preferably a spoon and the # two are p-phenyl, but both may be o- or m--extension 118322.doc -33 - 200832839 phenyl Or one is o- or m-phenyl and the other is p-phenyl. The bridge base is _, where one or two atoms separate Α1 from Α2. In a particular embodiment, one atom separates Α from Α2. Illustrative groups of this type are _〇_, , -s〇_ or -S02-, methylene, cyclohexylmethylene, 2_[2.21]_bicycloheptylmethylene, ethylidene, isoform A propyl group, a neopentyl group, a cyclohexylene group, a cyclopentylene group, a cyclocyclododecyl group, an adamantyl group, and the like. Ο ϋ In some embodiments, an oxime-alkyl group (commonly referred to as "alkylene") is preferred. However, unsaturated groups are also included. In some embodiments, the bisphenol is 2,2-bis(4-hydroxyphenyl)propane (bisphenol A*BPA), wherein gamma is isopropylidene and a1 and A are each a pair of phenyl groups. Depending on the molar excess of the hydroquinone present in the reaction mixture, R6 in the carbonate block may at least partially comprise a resorcinol group. In other words, in some embodiments, a carbonate block of the formula may comprise a resorcinol group in combination with at least one other dihydroxy substituted aromatic hydrocarbon. Includes one-stage, diblock, and multi-block copolyestercarbonates. The chemical bond between the block comprising the resorcinol arylate chain member and the block comprising the organic carbonate chain member may comprise at least one of the following: an appropriate bis-acid residue of the aryl group and the organic The ester bond between the - 6-r6-〇-yl group of the carbonate group (for example as described generally in the formula ννπ), wherein R6 is as defined previously: 〇

式 XVIII 及 (b)間苯二齡芳基化物 基之二酚殘基與有機碳酸酯基之 118322.doc -34- 200832839 4〇0) — 0—基之間的碳酸酯鍵(如式χιχ中所示),其中尺2及n 為如先前所定義: 〇a carbonate bond between the diphenic acid residue of the formula VIII and (b) the meta-phenyl aryl group aryl group and the organic carbonate group 118322.doc -34-200832839 4〇0) - 0- group (eg, χιχ) (shown in )), where scales 2 and n are as previously defined: 〇

式XIX 在一實施例中’共聚酯碳酸酯大體上包含二傲段共聚 物’其具有間苯二酚芳基化物嵌段與有機礙酸酯嵌段之間 的碳酸酯鍵。在另一實施例中,共聚酯碳酸酯大體上包含 三嵌段碳酸酯-酯-碳酸酯共聚物,其具有間苯二酚芳基化物 嵌段與有機碳酸酯末端嵌段之間的碳酸酯鍵。 具有熱穩定間苯二酚芳基化物嵌段與有機碳酸酯嵌段之 間的石反酸酯鍵之共聚酯碳酸酯通常由含間苯二酚芳基化物 且在一實施例中含有至少一且在另一實施例中含有至少兩 個羥基末端位點之募聚物製備。該等寡聚物通常具有在一 實施例中為約10,0⑸至約4〇,〇〇〇,且在另一實施例中為約 &quot; 15,000至約30,000之重量平均分子量。可藉由使該等含間苯 二酚芳基化物之寡聚物與碳醯氯、鏈終止劑及二羥基取代 之芳族烴在諸如三級胺之觸媒存在的情況下反應而製備熱 系s疋共聚醋碳酸g旨。 在一情況中,物品可包含由下列各物組成之群中選出之 樹脂的摻合物:聚砜、聚(醚砜)及聚(伸苯基醚颯)及其混合 物;聚矽氧共聚物及以間苯二酚為主之聚芳醋化合物^ 中大於或等於50莫耳%之芳基㈣旨鍵為間苯二紛所衍生^ 118322.doc -35- 200832839 方基醋鍵。 用於製造物品之聚合物摻合物令所使用之以間苯二酚為 主之聚芳醋化合物的量可視物品之最終用途而廣泛:變 化。舉例而言,當將物品用於熱釋放或至峰值熱釋放之增 ::時間為重要的最終用途中日寺’可最大化含間苯二酚酯: 聚合物之量以降低熱釋放且延長至峰值熱釋放之時間週 期。在-些情況中,以間苯二朌為主之聚芳g旨化合物可為 聚合物摻合物之約i至約50重量百分比一些重要組合物將 具有相對於聚合物摻合物之總重量為約1〇至約5〇重量百分 比之以間苯二酚為主之聚芳酯化合物。 在另一實施例中,涵蓋包含以下各物之聚合物摻合物的 物品: a) 約1至約99重量%之聚砜、聚(醚砜)及聚(伸苯基醚砜) 或其混合物; b) 約0.1至約30重量%之聚矽氧共聚物; C)約99至約i重量%之以間苯二酚為主之聚芳酯化合 物’其含有大於或等於約50莫耳%之間苯二酚衍生之鍵; d) 0至約20重量%之金屬氧化物, 其中重量百分比係相對於聚合物摻合物之總重量而言的。 在另一態樣中,涵蓋包含以下各物之聚合物摻合物的物 X3 · 口口 · a) 約50至約99重量%之聚砜、聚(醚硪)、聚(伸苯基醚砜) 或其混合物; b) 約0.1至約1〇重量%之聚矽氧共聚物; 118322.doc -36 - 200832839 0約1至約50重量%之以間苯二酚為主之聚芳酯化合物 樹脂,其含有大於或等於約50莫耳%之間苯二酚衍生之鍵; d) 0至約20重量%之金屬氧化物;及 e) 〇至約2重量%之含磷穩定劑。 Β·以下各物之高Tg摻合物:ΡΕΙ、Ρϊ、PEIS及其混合物; 聚矽氧共聚物;及以間苯二酚為主的芳基聚酯樹脂。 例如聚矽氧聚醚醯亞胺共聚物或聚矽氧聚碳酸酯共聚物 p 之聚矽氧共聚物與高玻璃轉移温度(Tg)聚醯亞胺(pi)、聚醚 醯亞胺(PEI)或聚醚醯亞胺砜(PEIS)樹脂,以及以間苯二酚 為主之聚芳酯化合物的組合具有極低熱釋放值及改良之耐 溶解性。 間苯二酚衍生之芳基聚酯亦可為含有以非間苯二酚為主 之鍵的共聚物,例如間苯二酚-雙酚A共聚酯碳酸酯。為了 得到最佳效應,間苯二酚酯含量(REC)應大於間苯二酚所衍 生之聚合物鍵的約50莫耳%。更高REC可為較佳的。在一此 I) 情況中,間苯二紛衍生鍵之大於75莫耳%,或甚至高達9〇 或100莫耳%的REC可為所要的。 阻燃摻合物中所使用之含間苯二酚酯之聚合物之量可使 用對於減小熱釋放、增加至峰值熱釋放之時間或改良耐、々 解性的任何有效ϊ而廣泛地變化。在'些情況中,人 ^ 含間苯 二S分酯之聚合物可為聚合物摻合物之約i重量%至約重 量%。一些重要組合物將具有1〇_5〇%之以間苯二紛為主的 聚酯。在其他情況中,聚醚醯亞胺或聚醚醯亞胺砜與高 共聚物之摻合物將具有約150至約21〇°C之單一玻璃轉移、 118322.doc -37- 200832839 度(Tg)。 、門本一酚為主之聚芳酯化合物樹脂應含有大於或等於 約50莫耳%之衍生自間苯二酚或官能化間苯二酚與芳基二 羧酸或適於芳基酯鍵之形成的二羧酸衍生物(例如,羧酸鹵 化物、羧酸酯及羧酸鹽)之反應產物的單元。 本文進一步詳述根據本發明可使用之以間苯二酚為主之 聚芳酯化合物用於其他聚合物摻合物。 具有熱疋間苯二酚芳基化物嵌段與有機碳酸酯嵌段之 間的至少一碳酸酯鍵之共聚酯碳酸酯通常由含間苯二酚芳 基化物之募聚物(藉由本發明之各種實施例而製備且在一 實施例中含有至少一且在另一實施例中含有至少兩個羥基 末端位點)製備。該等寡聚物通常具有在一實施例中為約 10,000至約40,000,且在另一實施例中為約15,〇〇〇至約 30,000之重量平均分子量。可藉由使該等含間苯二酚芳基 化物之寡聚物與碳醯氯、至少一鏈終止劑及至少一個二羥 〇 基取代之芳族烴在諸如三級胺之觸媒存在的情況下反應而 製備熱穩定共聚酯碳酸酯。 在一情況中,具有改良阻燃性之聚合物摻合物包含由聚 醯亞胺、聚醚醯亞胺、聚醚醯亞胺砜及其混合物組成之群 中選出之樹脂;聚矽氧共聚物及以間苯二酚為主的芳基聚 酯樹脂,其中大於或等於50莫耳%之芳基聚酯鍵為間苯二 酚所衍生之芳基酯鍵。將術語”聚合物鍵”或”一聚合物鍵,, 疋義為形成聚合物之至少兩個單體之反應產物。 在一些情況中,聚醯亞胺、聚醚醯亞胺、聚醚醯亞胺颯 118322.doc -38- 200832839 2混合物具有小於或等於約G85(重要)之氫原 =厂)。具有相對於氯含量而言較高碳含量(即: 的聚合物常展示改良之職能。此等 /、有較低燃燒值且可在燃燒時釋放較少能量。其亦 Ο Ο 燃料與火源之間形成絕緣焦化層之傾^耐燃 獨立於行狀任㈣定_或模式,已觀_具有 比之該等聚合物具有優良耐燃性。在-些情況中,H/c比可 :於0.85。在其他情況中’大於約〇4之跳比為較佳,盆可 得到具有充分可撓之鍵的聚合結構從而達成㈣加工:。 給定聚合物或共聚物之H/C比可由其化學結構判定(藉由對 兔原子及氫原子獨立於存在於化學重複單元中的任何其他 原子之計數)。 在-些情形巾,阻燃聚合物摻合物及Μ製成之物品將 具有小於約65 kW_min/m2i2分鐘的熱釋放。在其他情況 中’峰值熱釋放將小於約65 kW/m2e大於約2分鐘的至^值 熱釋放之時間亦為特定組合物及由其製成之物品之有益態 樣。在其他情況中,可達成大於約4分鐘的至峰值熱釋放時 間之時間。 在一些組合物中,含有大於或等於約50莫耳%之間苯二 酚衍生之鍵的聚醯亞胺、聚醚醯亞胺、聚醚醯亞胺礪及其 混合物與聚矽氧共聚物及芳I聚醋樹脂之摻合物將為透明 的。在一實施例中,摻合物具有大於約5〇%之透射百分率, 如藉由ASTM方法D1003於2毫米之厚度下量測。在其他情 況中’此等透明組合物之渾濁百分率(如藉由ASTM方法 118322.doc -39- 200832839 D1003所量測)將小於約25%。在其他實施例中,透射百分 率將大於約60%且渾濁百分率將小於約2〇%。在其他情: 中,組合物及由其製成之物品將具有大於約5〇%之透射率 及低於約25%之渾濁值,其具有小於或等於5〇 kw/m2之峰 值熱釋放。 在阻燃摻合物巾,聚醯亞胺、聚賴亞胺、聚咖亞胺 颯或其混合物可基於組合物之總重量以約i至約99重量百 p 刀比之里而存在。在此範圍内,聚醯亞胺、聚醚醯亞胺、 聚醚醯亞胺砜或其混合物之量可大於或等於約20,更特定 言之大於或等於約50,或更加特定言之大於或等於約7〇重 量百分比。 在另一實施例中,組合物包含以下各物之阻燃聚合物摻 合物: , a)約1至約99重量%之聚醚醯亞胺、聚醚醢亞胺颯及其混合 物, ◎ b)、力99至約1重置%之芳基聚醋樹脂,其含有大於或等於約 5〇莫耳%之間苯二酚衍生之鍵, c) 約0.1至約30重量%之聚矽氧共聚物, d) 約0至約20重量%之金屬氧化物, 其中重量百分比係相對於組合物之總重量而言的。 在其他態樣中,涵蓋包含以下各物之阻燃聚合物摻合物 的組合物: a) 为50至約99重量%之聚醚醯亞胺或聚醚醯亞胺颯樹脂, b) 約1至約5〇重量%之以間苯二酚為主之聚芳酯化合物,其 118322.doc -40- 200832839 含有大於或等於約50莫耳%之間苯二酚衍生之鍵 C)約0.1至約1〇重量%之聚矽氧共聚物, d) 約0至約2〇重量%之金屬氧化物,及 e) 0至約2重量%之含磷穩定劑。 聚醯亞胺具有通式(XX) 0 0Formula XIX In one embodiment, the &quot;copolyestercarbonate substantially comprises a bis-segmented copolymer' having a carbonate linkage between the resorcinol arylate block and the organobutate block. In another embodiment, the copolyestercarbonate substantially comprises a triblock carbonate-ester-carbonate copolymer having a carbonic acid between the resorcinol arylate block and the organic carbonate endblock Ester bond. The copolyestercarbonate having a sulphuric acid ester linkage between the thermally stable resorcinol arylate block and the organic carbonate block is typically comprised of a resorcinol arylate and in an embodiment at least A further preparation of a polymer containing at least two hydroxyl end sites in another embodiment. The oligomers typically have a weight average molecular weight of from about 10,0 (5) to about 4 Å, in one embodiment, and from about 15,000 to about 30,000 in another embodiment. The heat can be prepared by reacting the oligomers containing the resorcinol arylate with carbonium chloride, a chain terminator and a dihydroxy-substituted aromatic hydrocarbon in the presence of a catalyst such as a tertiary amine. It is the s 疋 疋 疋 vinegar carbonate g. In one case, the article may comprise a blend of resins selected from the group consisting of polysulfone, poly(ether sulfone), and poly(phenylene ether) and mixtures thereof; polyoxyloxy copolymer And the resorcinol-based polyaryl vinegar compound ^ is greater than or equal to 50 mol% of the aryl group (IV) is derived from the meta-benzene diene derivative ^ 118322.doc -35- 200832839 square vinegar bond. The polymer blend used to make the article is such that the amount of resorcinol-based polyaryl vinegar compound used can vary widely depending on the end use of the article: a change. For example, when the article is used for heat release or to the increase in peak heat release:: time is important for the end use. Nichiji's can maximize the resorcinol ester-containing: amount of polymer to reduce heat release and extend to The time period of peak heat release. In some cases, the meta-phenylene-based poly-aryl compound may be from about i to about 50 weight percent of the polymer blend. Some important compositions will have a total weight relative to the polymer blend. It is from about 1 Torr to about 5 Å by weight of a resorcinol-based polyarylate compound. In another embodiment, an article comprising a polymer blend comprising: a) from about 1 to about 99 weight percent polysulfone, poly(ether sulfone), and poly(phenylene ether sulfone) or a mixture; b) from about 0.1 to about 30% by weight of a polyoxyloxy copolymer; C) from about 99 to about 9% by weight of a resorcinol-based polyarylate compound containing greater than or equal to about 50 moles % succinol derived bond; d) 0 to about 20% by weight metal oxide, wherein the weight percentage is relative to the total weight of the polymer blend. In another aspect, it is contemplated that the polymer blend comprising the following materials X3 · mouth · a) from about 50 to about 99% by weight of polysulfone, poly(ether oxime), poly(phenylene ether) a sulfone) or a mixture thereof; b) from about 0.1 to about 1% by weight of a polyoxyloxy copolymer; 118322.doc -36 - 200832839 0 from about 1 to about 50% by weight of a resorcinol-based polyarylate a compound resin comprising greater than or equal to about 50 mole % of a benzenediol-derived linkage; d) from 0 to about 20 weight percent of a metal oxide; and e) from about 2 weight percent of a phosphorus-containing stabilizer. Β·High Tg blends of the following: lanthanum, cerium, PEIS and mixtures thereof; polyoxynized copolymers; and aryl polyester resins based on resorcinol. For example, a polyoxymethylene iodide copolymer or a polyoxymethylene polycarbonate copolymer p polyoxynoxy copolymer with high glass transition temperature (Tg) polyimine (pi), polyether sulfimine (PEI) The combination of a polyether oxime sulfone (PEIS) resin and a resorcinol-based polyarylate compound has an extremely low heat release value and improved solubility resistance. The resorcinol-derived aryl polyester may also be a copolymer containing a bond other than resorcinol, such as resorcinol-bisphenol A copolyestercarbonate. For best results, the resorcinol ester content (REC) should be greater than about 50 mole percent of the polymer bond derived from resorcinol. Higher REC may be preferred. In the case of I), an REC of more than 75 mol%, or even up to 9 或 or 100 mol%, of the meta-phenylene derivative bond may be desirable. The amount of the resorcinol-containing polymer used in the flame retardant blend can vary widely using any effective enthalpy for reducing heat release, increasing time to peak heat release, or improving resistance and decomposability. . In some cases, the polymer containing isophthalic acid S-stearate may be from about i% by weight to about weight percent of the polymer blend. Some important compositions will have between 1 and 5 % of the polystyrene-based polyester. In other cases, a blend of polyetherimide or polyetherimine sulfone with a high copolymer will have a single glass transfer of from about 150 to about 21 °C, 118322.doc -37 - 200832839 degrees (Tg ). The phenol-based polyarylate compound resin should contain greater than or equal to about 50 mole % derived from resorcinol or functionalized resorcinol and aryl dicarboxylic acid or suitable for aryl ester bonds. A unit of the reaction product of a dicarboxylic acid derivative (for example, a carboxylic acid halide, a carboxylic acid ester, and a carboxylate) formed. Further, resorcinol-based polyarylate compounds which can be used in accordance with the present invention are used in the context of other polymer blends. A copolyestercarbonate having at least one carbonate linkage between a retoxinic resin aralkylate block and an organic carbonate block is typically a polymer comprising a resorcinol arylate (by the present invention) Prepared by various embodiments and comprising at least one in one embodiment and at least two hydroxyl end sites in another embodiment. The oligomers typically have a weight average molecular weight of from about 10,000 to about 40,000 in one embodiment, and from about 15, from about 30,000 to about 30,000 in another embodiment. The presence of the resorcinol arylate-containing oligomer with carbon ruthenium chloride, at least one chain terminator, and at least one dihydroxy fluorenyl substituted aromatic hydrocarbon in a catalyst such as a tertiary amine The reaction is then carried out to prepare a thermally stable copolyestercarbonate. In one case, the polymer blend having improved flame retardancy comprises a resin selected from the group consisting of polyimine, polyether oxime, polyether sulfoxide, and mixtures thereof; polyoxyl copolymer And an aryl polyester resin mainly composed of resorcin, wherein the aryl polyester bond of 50 mol% or more is an aryl ester bond derived from resorcin. The term "polymer bond" or "a polymer bond" is defined as the reaction product of at least two monomers forming a polymer. In some cases, polyimine, polyetherimide, polyether oxime Imine 飒118322.doc -38- 200832839 2 The mixture has a hydrogen source of less than or equal to about G85 (important) = plant). It has a higher carbon content relative to the chlorine content (ie: the polymer often exhibits improved functions) These / have a lower combustion value and can release less energy when burning. It also Ο 形成 The formation of an insulating coking layer between the fuel and the fire source is independent of the line-like (four) fixed _ or mode, has been observed _ has better flame resistance than the polymers. In some cases, the H/c ratio can be: 0.85. In other cases, the ratio of 'greater than about 〇4 is better, and the pot can be obtained with sufficient The polymeric structure of the spun bond is thus achieved (iv) processing: The H/C ratio of a given polymer or copolymer can be determined by its chemical structure (by the rabbit atom and the hydrogen atom independent of any other atom present in the chemical repeat unit) Count). In some cases, flame retardant polymer blend Articles made of tantalum will have a heat release of less than about 65 kW_min/m2i for 2 minutes. In other cases, the peak heat release will be less than about 65 kW/m2e for more than about 2 minutes. And a beneficial aspect of the article made therefrom. In other cases, a time to peak heat release time of greater than about 4 minutes can be achieved. In some compositions, greater than or equal to about 50 mole percent of benzene is present. A blend of a diphenol-derived bond of a polyimine, a polyether quinone, a polyether oxime, and mixtures thereof with a polyoxyl copolymer and an aryl I polyester resin will be transparent. In one embodiment, the blend has a percent transmission greater than about 5%, as measured by ASTM method D1003 at a thickness of 2 mm. In other cases, the percentage of turbidity of such transparent compositions (eg, by ASTM method) 118322.doc -39- 200832839 measured by D1003 will be less than about 25%. In other embodiments, the percent transmission will be greater than about 60% and the percentage of turbidity will be less than about 2%. In other cases, the composition and Articles made therefrom will have a transparency of greater than about 5% a rate and a turbidity value of less than about 25% having a peak heat release of less than or equal to 5 〇 kw/m2. In a flame retardant blend towel, polyimine, polylysine, polyacetamid or The mixture may be present in a range of from about i to about 99 weight percent pp based on the total weight of the composition. Within this range, polyimine, polyether oximine, polyether sulfoxide or mixtures thereof The amount may be greater than or equal to about 20, more specifically greater than or equal to about 50, or more specifically greater than or equal to about 7 weight percent. In another embodiment, the composition comprises flame retardant polymerization of the following Blend: a) from about 1 to about 99% by weight of polyether oximine, polyether oxime imine and mixtures thereof, ◎ b), force 99 to about 1% by weight of aryl polyester resin And comprising from about 0.1 to about 30% by weight of the polyoxyalkylene copolymer, and from d to about 20% by weight of the metal oxide , wherein the weight percentage is relative to the total weight of the composition. In other aspects, a composition comprising a flame retardant polymer blend comprising: a) from 50 to about 99% by weight of a polyether quinone imine or a polyether quinone oxime resin, b) about 1 to about 5 % by weight of a resorcinol-based polyarylate compound having 118322.doc -40 - 200832839 containing greater than or equal to about 50 mole % of the benzenediol-derived bond C) about 0.1 To about 1% by weight of the polyoxyalkylene copolymer, d) from about 0 to about 2% by weight of the metal oxide, and e) from 0 to about 2% by weight of the phosphorus-containing stabilizer. Polyimine has the general formula (XX) 0 0

ΟΟ

U L 」a (式XX) 其中a大於1,通常為約1〇至約1〇〇〇或1〇〇〇以上,或更特定 言之為約10至約500;且其中v為不受限制之四價連接子, 只要該連接子不阻礙聚醯亞胺之合成或使用。合適連接子 包括(但不限於):(a)具有約5至約50個碳原子的經取代或未 經取代,飽和、不飽和或芳族單環及多環基團,(b)具有工 至約30個碳原子的經取代或未經取代,直鏈或分枝鏈,飽 和或不飽和烷基,或其組合。較佳連接子包括(但不限於) 式(XXI)之四價芳基,諸如 (式 XXI) 其中w為由下列各物組成之群中選出之二價基:_s -c(0)-、-S02-、_SO-、-CyH2y-(y為具有值丨至8之整數)及其 氟化衍生物,包括全氟伸烧基,或式-0-Z-0-之基,其中_w_ 或- 0- Z- 0-基之一價鍵位於3,3’、3,4’、4,3’或4,4’位置,且其 118322.doc -41 - 200832839 中Z為如上文所定義。2可包含式(χχπ)之例示性二價基 ΟUL ” (Formula XX) wherein a is greater than 1, typically from about 1 Torr to about 1 Torr or more, or more specifically from about 10 to about 500; and wherein v is unrestricted A tetravalent linker, as long as the linker does not hinder the synthesis or use of the polyimine. Suitable linkers include, but are not limited to, (a) substituted or unsubstituted, saturated, unsaturated or aromatic monocyclic and polycyclic groups having from about 5 to about 50 carbon atoms, (b) having Substituted or unsubstituted, straight or branched chain, saturated or unsaturated alkyl group to about 30 carbon atoms, or a combination thereof. Preferred linkers include, but are not limited to, a tetravalent aryl group of formula (XXI), such as (Formula XXI) wherein w is a divalent group selected from the group consisting of: _s -c(0)-, -S02-, _SO-, -CyH2y- (y is an integer having a value of 丨 to 8) and a fluorinated derivative thereof, including a perfluoroalkylene group, or a group of the formula -0-Z-0-, wherein _w_ Or - 0-Z- 0-based one of the valence bonds is located at the 3,3', 3,4', 4,3' or 4,4' position, and its 118322.doc -41 - 200832839 where Z is as above definition. 2 may include an exemplary divalent base of the formula (χχπ) Ο

(式 XXII)(Form XXII)

U 式(XX)中之R7包括(但不限於)經取代或未經取代之二價有機基’諸如:⑷具有約6至約24個碳原子之芳族烴基及: 函化衍生物;(b)具有約2至約2()個碳原子之直鏈或分二鍵; 烷基;(0具有約3至約24個碳原子之環伸烷基或(d)通式 之二價基The R7 in the formula (XX) includes, but is not limited to, a substituted or unsubstituted divalent organic group such as: (4) an aromatic hydrocarbon group having from about 6 to about 24 carbon atoms; and a functionalized derivative; b) a linear or sub-bond having from about 2 to about 2 (s) carbon atoms; an alkyl group; (0 having a cycloalkyl group having from about 3 to about 24 carbon atoms or (d) a divalent group of the formula

(式 VI) 其中Q為如上文所定義。 聚醯亞胺之一些類別包括聚醯胺亞胺'聚醚醯亞胺砜及 聚醚醯亞胺’尤其此項技術中已知的熔融可加工之彼等聚 醚醯亞胺,諸如其製備及性能描述於美國專利第3,803,085號 118322.doc -42- 200832839 及第3,905,942號中之聚醚醯亞胺。 聚醚醢亞胺樹脂可包含大於卜通常約10至約1000或1000 以上,或更特定言之約10至約500個式(ΧΧΠΙ)之結構單元 Ο Ο(Formula VI) wherein Q is as defined above. Some classes of polyimines include polyamidimide 'polyether sulfoximine sulfones and polyether quinones', especially the melt processable polyether oximines known in the art, such as their preparation. The properties are described in U.S. Patent Nos. 3,803,085 to 118,322, doc-42 to 200832,839, and to the polyether oximine. The polyetherimide resin may comprise from about 10 to about 1000 or more, or more specifically from about 10 to about 500, structural units of the formula (ΧΧΠΙ).

(式 XXIII) 其中Τ為-〇-或式-〇-Ζ·〇_之基團,其中或_〇_ζ_〇_基團之 Ο 二價鍵處於3,3’、3,4,、4,3,或4,4位置,且其中2在上文得以 定義。在一實施例令,聚醯亞胺、聚醚醯亞胺或聚醚醯亞 胺砜可為共聚物。亦可使用聚醯亞胺、聚醚醯亞胺或聚醚 酿亞胺硬之混合物。 可藉由熟習此項技術者所熟知之方法中之任一者來製備 聚醚醯亞胺,包括式(XVIII)之芳族雙(醚酐)與式(νπ)之有 機二胺的反應 Ο(Formula XXIII) wherein Τ is -〇- or a group of the formula -〇-Ζ·〇_, wherein the 〇_ζ_ζ_〇_ group is in the divalent bond at 3,3', 3,4, 4, 3, or 4, 4 positions, and 2 of which are defined above. In one embodiment, the polyimine, polyetherimide or polyether sulfoxide may be a copolymer. It is also possible to use a mixture of polyimine, polyetherimide or polyetherimide. The polyether quinone imine can be prepared by any of the methods well known to those skilled in the art, including the reaction of an aromatic bis(ether anhydride) of formula (XVIII) with an organic diamine of the formula (νπ).

(式V) H2N-RLnh2 (式 VII) 其中如上文所述而定義T及R1。 (例如)在美國專利第3,972,902號及第4,455,410號中揭示 特定芳族雙酐及有機二胺之實例。芳族雙酐之說明性實例 包括: 3,3_雙[4-(3,4-二羧基苯氧基)苯基]丙烷二酐; 118322.doc -43- 200832839 4,4f-雙(3,4-二羧基苯氧基)二苯醚二酐; 雙(3,4-二羧基苯氧基)二苯硫醚二酐; 4,^-雙(3,4-二羧基苯氧基)二苯甲酮二酐; 4,4、雙(3,4-二羧基苯氧基)二苯砜二酐; 2,2-雙[4-(2,3-二羧基苯氧基)苯基]丙烷二酐; 4,4-雙(2,3-二羧基苯氧基)二苯醚二針; 4,4^雙(2,3-二羧基苯氧基)二苯硫醚二酐; 4,4’_雙(2,3-二叛基苯氧基)二苯曱酮二酐;(Formula V) H2N-RLnh2 (Formula VII) wherein T and R1 are as defined above. Examples of specific aromatic dianhydrides and organic diamines are disclosed, for example, in U.S. Patent Nos. 3,972,902 and 4,455,410. Illustrative examples of aromatic dianhydrides include: 3,3_bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride; 118322.doc -43- 200832839 4,4f-double (3 , 4-dicarboxyphenoxy)diphenyl ether dianhydride; bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,^-bis(3,4-dicarboxyphenoxy) Benzophenone dianhydride; 4,4, bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride; 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl Propane dianhydride; 4,4-bis(2,3-dicarboxyphenoxy)diphenyl ether; 4,4^bis(2,3-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4'-bis(2,3-dioxaphenoxy)dibenzofluorone dianhydride;

Ο 4,4f-雙(2,3-二羧基苯氧基)二苯砜二酐; 4-(2,3_二羧基苯氧基)_4’_(3,‘二羧基苯氧基)二苯基_2,2_ 丙烷二酐; 4-(2,3-二叛基苯氧基)-4’-(3,4-二叛基苯氧基)二苯醚二酐; 4-(2,3-二羧基苯氧基)-4,-(3,4-二羧基苯氧基)二苯硫醚二 酐; 4-(2,3-二羧基苯氧基)-4f-(3,4-二羧基苯氧基)二苯甲酮二 酐;及, 4-(2,3-二羧基苯氧基)-4f-(3,4-二羧基苯氧基)二苯砜二酐 以及其各種混合物。 以上之式(XVIII)所包括之芳族雙(醚酐)之另一類別包括 (但不限於)其中T具有式(XXIV)且醚鍵(例如)較佳地位於 3,3’、3,4’、4,3’或4,4’位置的化合物及其混合物, (式 XXIV) 且其中Q為如上文所定義。 118322.doc -44- 200832839 可使用任何二胺基化合物。合適化合物之實例為乙二 胺、丙二胺、三亞甲基二胺、二伸乙基三胺、三伸乙基四 胺、己二胺、庚二胺、辛二胺、壬二胺、癸二胺、1,12_十 二烷二胺、1,18-十八烷二胺、3_甲基庚二胺、4,4-二甲基庚 Ο Ο 一胺、4-甲基壬二胺、5_甲基壬二胺、2,5_二甲基己二胺、 2,5-二甲基庚二胺、2,2_二甲基丙二胺、n-甲基-雙(3_胺基 丙基)胺、3-曱氧基己二胺、152_雙(3_胺基丙氧基)乙烷、雙 (3-胺基丙基)硫化物、匕扣環己二胺、雙胺基環己基)甲 烧、間苯二胺、對苯二胺、2,4_二胺基甲苯、2,6_二胺基甲 苯、間二甲苯二胺、對二甲苯二胺、2-甲基-4,6·二乙基-1,3-伸苯基-二胺、5-甲基_4,6_二乙基_丨,3_伸苯基-二胺、聯苯 胺、3,3’-二甲基聯苯胺、3,3,_二甲氧基聯苯胺、ι5_二胺基 奈、雙(4-胺基苯基)甲烷、雙氯_4_胺基_3,5•二乙基苯基) 甲烷、雙(4-胺基苯基)丙烷、2,4-雙(對_胺基-第三丁基)甲 苯、雙(對&quot;胺基-第三丁基苯基)醚、雙(對-甲基_鄰_胺基苯 基)苯、雙(對甲基♦胺基戊基)苯、1,3-二胺基·4_異丙苯、 雙+胺基苯基)硫化物、雙(4_胺基苯基)石風及雙(心胺其苯 基㈣。亦可使用此等化合物之混合物。較佳二胺基化:物 為方族二胺’尤其為間苯二胺及對苯二胺、伽基雙苯胺 及其混合物。 ^實施财,聚賴亞胺樹脂包含根據式(X別之結 構單元,其中每一 R獨立地為對 人物日T评本基切·伸苯基或其混 &amp;物且T為式(XXV)之二價基 118322.doc -45- 200832839 (式 XXV) 製造聚酿亞胺,尤其是聚醚醯亞胺之許多方法中包括美 國專利第3,847,867號、第3,852,242號、第3,803,085號、第 3,905,942號、第3,983,093號及第4,443,591號中所揭示之方 法。此等專利出於教示之目的(藉由說明之方式)提及製備聚 醯亞胺之通用及特定方法。Ο 4,4f-bis(2,3-dicarboxyphenoxy)diphenyl sulfone dianhydride; 4-(2,3-dicarboxyphenoxy)_4'-(3,'dicarboxyphenoxy) Phenyl 2,2-propane dianhydride; 4-(2,3-di-repentylphenoxy)-4'-(3,4-dioxaphenoxy)diphenyl ether dianhydride; 4-(2 ,3-dicarboxyphenoxy)-4,-(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4-(2,3-dicarboxyphenoxy)-4f-(3, 4-dicarboxyphenoxy)benzophenone dianhydride; and, 4-(2,3-dicarboxyphenoxy)-4f-(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride Its various mixtures. Another class of aromatic bis(ether anhydrides) encompassed by the above formula (XVIII) includes, but is not limited to, wherein T has the formula (XXIV) and the ether bond (for example) is preferably located at 3, 3', 3, Compounds of the 4', 4, 3' or 4, 4' position and mixtures thereof, (Formula XXIV) and wherein Q is as defined above. 118322.doc -44- 200832839 Any diamine compound can be used. Examples of suitable compounds are ethylenediamine, propylenediamine, trimethylenediamine, diethylidenetriamine, triethylidenetetramine, hexamethylenediamine, heptanediamine, octanediamine, decanediamine, hydrazine. Diamine, 1,12-dodecanediamine, 1,18-octadecanediamine, 3-methylheptanediamine, 4,4-dimethylglyoxime, monoamine, 4-methylindole Amine, 5-methylindolediamine, 2,5-dimethylhexamethylenediamine, 2,5-dimethylheptanediamine, 2,2-dimethylpropanediamine, n-methyl-bis ( 3_Aminopropyl)amine, 3-decyloxyhexanediamine, 152_bis(3-aminopropyloxy)ethane, bis(3-aminopropyl) sulfide, anthracene ring Amine, bis-aminocyclohexyl)methane, m-phenylenediamine, p-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, m-xylylenediamine, p-xylenediamine , 2-methyl-4,6·diethyl-1,3-phenylene-diamine, 5-methyl-4,6-diethyl-hydrazine, 3-phenylene-diamine, Aniline, 3,3'-dimethylbenzidine, 3,3,dimethoxybenzidine, ι5_diaminone, bis(4-aminophenyl)methane, bis(4-amino)amino _3,5•diethylphenyl)methane, bis(4-aminophenyl)propane , 2,4-bis(p-amino-t-butyl)toluene, bis(p- &quot;amino-t-butylphenyl)ether, bis(p-methyl-o-aminophenyl) Benzene, bis(p-methyl♦aminopentyl)benzene, 1,3-diamino-4-picobenzene, bis-aminophenyl) sulfide, bis(4-aminophenyl) stone And bis (cardamine) phenyl (tetra). Mixtures of these compounds may also be used. Preferred diamines: the compound is a diamine, especially m-phenylenediamine and p-phenylenediamine, gamma diphenylamine and a mixture thereof. ^The implementation of the poly-imine resin comprises a structural unit according to the formula (X), wherein each R is independently a pair of people, the base is cut, the phenyl group or its mixed &amp; Divalent groups of formula (XXV) 118322.doc -45- 200832839 (Formula XXV) A number of processes for making polyimine, especially polyetherimine, include U.S. Patent Nos. 3,847,867, 3,852,242, and 3,803,085. And the methods disclosed in U.S. Patent Nos. 3,905,942, 3,983,093, and 4,443,591. .

聚酿亞胺、聚醚醯亞胺及聚醚醯亞胺砜可具有約〇·丨至約 1 〇克母刀#里(g/min)之熔融指數,如使用6.6千克(kg)之重量 藉由美國材料試驗學會(ASTM)D 1238於340至約370°C所量 測。在一實施例中,聚醚醯亞胺樹脂具有約10,000至約 15〇,〇〇〇克每莫耳(g/mole)之重量平均分子量(Mw),如使用 聚苯乙烯標準藉由凝膠滲透層析而量測。在另一實施例 中來_醯亞胺具有20,000至60,000之Mw。該等聚醚醯亞 胺樹脂通常具有大於約〇·2分升每克((11/§),或更特定言之約 〇·35至約〇·7 dl/g之固有黏度,如於25。〇量測於間甲酚中。 在本文所描述之摻合物中有用的一些聚醚醯亞胺之實例列 於ASTM D5205”聚醚醯亞胺(PEI)材料之標準分類系統,,中。 共聚物之矽氧烷片段之嵌段長度可具有任何有效長度。 在一些實例中,其可為2至7〇個矽氧烷重複單元。在其他情 況中’矽氧烷嵌段長度可為約5至約3 〇個重複單元。在許多 情況中,可使用二甲基矽氧烷。 矽氧烷聚醚醯亞胺共聚物為可使用之矽氧烷共聚物的特 定實施例。該等矽氧烷聚醚醯亞胺之實例展示於美國專利 118322.doc -46- 200832839 第4,404,350號、第4,808,686號及第4,690,997號中。在一情 況中,可以類似於用於聚醚醯亞胺之方式的方式來製備聚 醚醯亞胺矽氧烷,除了有機二胺反應物之部分或全部由(例 如)式XXII之胺端基有機矽氧烷所替代之外,其中g為具有 值1至約50之整數,在一些其他情況中g可為約5至約30,且 R為具有約2至約20個碳原子之芳基、烧基或芳基烧基。 H2N- R'—Si-The polystyrene, polyetherimide and polyetherimine sulfone may have a melt index of from about 〇·丨 to about 1 gram of master knife (g/min), such as a weight of 6.6 kilograms (kg). Measured by the American Society for Testing and Materials (ASTM) D 1238 at 340 to about 370 °C. In one embodiment, the polyetherimide resin has a weight average molecular weight (Mw) of from about 10,000 to about 15 Å per gram of g/mole, such as by using a polystyrene standard by gel Oxidized by chromatography. In another embodiment, the imine has an Mw of 20,000 to 60,000. The polyetherimide resins generally have an intrinsic viscosity greater than about 〇·2 dl per gram ((11/§), or, more specifically, from about 〇35 to about 7 dl/g, as in 25 〇 is measured in m-cresol. Examples of some polyether quinones useful in the blends described herein are listed in ASTM D5205, Standard Classification System for Polyetherimide (PEI) Materials, The block length of the heptane fragment of the copolymer may have any effective length. In some examples, it may be from 2 to 7 oxime oxirane repeating units. In other cases, the 'nonoxyalkylene block length may be From about 5 to about 3 repeat units. In many cases, dimethyloxane can be used. The decane polyether oxime copolymer is a specific embodiment of a siloxane copolymer that can be used. An example of a polyoxyalkyleneimine is shown in U.S. Patent Nos. 1,182,322, doc-46-200832839, 4, 404,350, 4, 808, 686, and 4, 690, 997. In one case, Ways to prepare polyether oxime oxane, except for some or all of the organic diamine reactants For example, where an amine terminated organooxane of formula XXII is substituted, wherein g is an integer having a value from 1 to about 50, in some other instances g may be from about 5 to about 30, and R is from about 2 to An aryl, an alkyl or an aryl group of about 20 carbon atoms. H2N-R'-Si-

C _ono卜·-叫 (式 XXII) 〇 一些聚醚醯亞胺矽氧烷可藉由式XIX之有機二胺或二胺 之混合物與式XXII之胺端基有機矽氧烷與式XVIII之一或 多個二酐的反應而形成。二胺基組份可在與雙酐之反應之 前經物理混合,因此形成實質上隨機之共聚物。或者可藉 由XIX及XXII與二酐之選擇性反應而形成嵌段或交替共聚 物以製成隨後共同反應之聚醯亞胺嵌段。在另一情況中, (例如)如美國專利第4,404,350號中所描述,用以製備聚醚 醯亞胺共聚物之矽氧烷可具有酐而非胺官能性端基。 在一情況中,矽氧烷聚醚醯亞胺共聚物可具有式ΧΧΠΙ ’ 其中T、R,及g為如上文所描述,η具有約5至約100之值且Ar 為具有6至約36個碳之芳基或烷基芳基。C _ono 卜 - 叫 (Formula XXII) 〇 Some polyether oximine oxiranes may be obtained by a mixture of an organic diamine or a diamine of the formula XIX with an amine-terminated organic oxirane of the formula XXII and a formula XVIII Formed by the reaction of one or more dianhydrides. The diamine based component can be physically mixed prior to reaction with the dianhydride, thus forming a substantially random copolymer. Alternatively, a block or alternating copolymer may be formed by selective reaction of XIX and XXII with a dianhydride to form a polyamidene block which is subsequently co-reacted. In another case, the oxime used to prepare the polyether oxime copolymer may have an anhydride rather than an amine functional end group, as described in U.S. Patent No. 4,404,350. In one case, the oxoxane polyether oxime copolymer may have the formula ΧΧΠΙ ' wherein T, R, and g are as described above, η has a value of from about 5 to about 100 and Ar is from 6 to about 36 a carbon aryl or alkylaryl group.

(式 XXIII) 118322.doc -47- 200832839 在些矽氧烷聚醚醯亞胺中,矽氧烷聚醚醯亞胺共聚物 之一胺組伤可含有約2〇莫耳。/。至約5〇莫耳%之式χχπ的胺 端基有機矽氧烷及約50至約8〇莫耳%之式χιχ的有機二 胺在一些矽氧烷共聚物中,矽氧烷組份含有約25至約4〇 莫耳°/。之胺或末端酸酐有機矽氧烷。 C·高Tg相分離之聚合物摻合物。 本文亦揭示包含以下各物之混合物的相分離之聚合物摻 ά物· a)由下列各物組成之群中選出之聚芳醚酮(ρΑΕκ) ·· 聚芳醚酮、聚芳基酮、聚醚酮及聚醚醚酮;及其與…具有 大於或荨於50莫耳%之含芳硬基之鍵的聚醚醯亞胺石風 (Ρ ΕIS)之組合。 相分離意謂ΡΑΕΚ及卯18作為分離化學實體存在於混雜 物中,其可藉由使用例如顯微法、差示掃描熱量測定或動 態機械分析法之標準分析技術而區分以展示至少兩個不同 聚合相(其一者包含ΡΑΕΚ樹脂且一者包含PEIS樹脂)。在一 些情況中,每一相將含有大於約8〇重量%之各別樹脂。在 其他情況中,摻合物將形成大小為約〇1至約5〇微米之分離 的不同結構域,在其他情形中,該等結構域將為約〇1至約 20微米。結構域大小指代顯微法所展示之最長線性尺寸。 相分離摻合物可完全不可混溶或可展示部分可混溶性但必 須表現為(至少在固體狀態中)摻合物展示兩個或兩個以上 不同聚合相。 PAEK對PEIS之比可為導致具有改良性能(亦即,視最終 用途應用而比單獨的每一樹脂好或差)之摻合物的任何 118322.doc -48- 200832839 值。重量份之比可視最終用途應用及待改良之所要性能而 為1:99至99:1。比之範圍亦可為15:85至85:15或甚至25:75 至75:25。視應用而定,比亦可為40:60至60:40。熟練技工 將瞭解,改變PAEK對PEIS之比可視所要結果而到達所陳述 之範圍内的任何實數。 可藉由改變成份之比而調整之最終摻合物的性能包括熱 變形溫度及承載能力。舉例而言,在一實施例中,聚醚醯 亞胺颯樹脂可以對於改變(亦即,藉由增加而改良)PAEK摻 合物在其自身之個別組份上之承載能力為有效的任何量而 存在。在一些情況中,PAEK可以整個混合物之約30至約70 重量%之量而存在,而PEIS之量可為約70至約30重量%,其 中該等重量百分比係相對於PAEK與PEIS之組合重量而言 的。 在一些實施例中,相分離聚合物摻合物將具有大於或等 於約170°C之熱變形溫度(HDT),其係藉由使用ASTM方法 D5418於3.2 mm之桿上在0.46 Mpa(66 psi)下量測的。在其 他情況中,0.46 MPA(66 psi)下之HDT將大於或等於200°C。 在其他情況中,PAEK-PEIS之承載能力將以維卡溫度展 示,如ASTM方法D1525所量測在50牛頓(N)下為大於或等於 約 200°C。 在其他情況中,相分離聚合物摻合物之承載能力將由大 於或等於約200兆帕斯卡(MPa)之撓曲模數展示,該模數係 (例如)藉由八8丁]\4方法〇5418於3.2 111111之桿上在200°〇量測。 可藉由以熔融狀態混合適量PAEK與適量PEIS而製造相 118322.doc -49- 200832839 分離聚合物摻合物。可以熟練技工已知的將導致相分離摻 合物之任何方法混合兩組份。該等方法包括擠壓、燒結等 等。 Γ、 當使用於本文中時,術語’’聚芳醚酮(ΡΑΕΚ)Π包含含有主 要藉由酮及醚基團以不同序列鍵聯之芳環(通常為苯基環) 之若干聚合物類型。ΡΑΕΚ樹脂之實例包括聚醚酮類 (ΡΕΚ)、聚醚醚酮類(PEEK)、聚醚酮醚酮酮類(ΡΕΚΕΚΚ)及 聚醚酮酮類(PEKK)及含有該等基團之共聚物以及其摻合 物。PAEK聚合物可包含含有任何序列之芳環(通常為苯基 環)、酮基及醚基之單體單元。可存在低含量(例如小於10 莫耳%)之額外鍵聯基團,只要其不根本地改變PAEK樹脂之 性能。 舉例而言’可在相分離換合物中使用而結晶’具有南於 300°C之熔點的若干聚芳醚酮。此等結晶聚芳醚酮之實例以 結構 XXVI、XXVII、XXVIII、XXIX及 XXX 而展示。(Formula XXIII) 118322.doc -47- 200832839 In some of the alkoxyalkyl polyether oximines, the amine group of one of the oxoxane polyether oxime copolymers may contain about 2 Torr. /. An amine-terminated organic oxime of about 〇 耳 χχ χχ π and an organic diamine of from about 50 to about 8 〇 mol % of the formula 在ιχ in some of the decane copolymers, the oxane component contains About 25 to about 4 〇 耳 ° /. Amine or terminal anhydride organic oxane. C. High Tg phase separated polymer blend. Also disclosed herein are phase separated polymer ruthenium containing a mixture of the following: a) polyaryletherketone (ρΑΕκ) ·· polyaryletherketone, polyaryl ketone, selected from the group consisting of: Polyether ketone and polyetheretherketone; and combinations thereof with a polyether sulfite wind (Ρ Ε IS) having a aryl hard group-containing bond greater than or equal to 50 mol%. Phase separation means that hydrazine and hydrazine 18 are present in the hybrid as separate chemical entities, which can be distinguished by using standard analytical techniques such as microscopy, differential scanning calorimetry or dynamic mechanical analysis to demonstrate at least two differences. A polymeric phase (one of which comprises an anthracene resin and one of which comprises a PEIS resin). In some cases, each phase will contain greater than about 8% by weight of the respective resin. In other instances, the blend will form separate domains having a size ranging from about 1 to about 5 microns, and in other cases, the domains will be from about 1 to about 20 microns. The domain size refers to the longest linear dimension exhibited by the microscopic method. The phase separation blend may be completely immiscible or may exhibit partial miscibility but must manifest (at least in the solid state) that the blend exhibits two or more different polymeric phases. The ratio of PAEK to PEIS can be any value of 118,322.doc -48 - 200832839 resulting in a blend having improved properties (i.e., better or worse than each resin alone depending on the end use application). The parts by weight may range from 1:99 to 99:1 depending on the end use application and the desired properties to be improved. The range can be from 15:85 to 85:15 or even from 25:75 to 75:25. Depending on the application, the ratio can range from 40:60 to 60:40. The skilled artisan will appreciate that changing the PAEK to PEIS ratio can achieve any real number within the stated range, depending on the desired result. The properties of the final blend that can be adjusted by varying the ratio of ingredients include heat distortion temperature and load carrying capacity. For example, in one embodiment, the polyether oxime oxime resin can be any amount effective to modify (i.e., improve by increasing) the carrying capacity of the PAEK blend on its own individual component. And exist. In some cases, the PAEK may be present in an amount from about 30 to about 70% by weight of the total mixture, and the amount of PEIS may be from about 70 to about 30% by weight, wherein the weight percentages are relative to the combined weight of PAEK and PEIS. In terms of. In some embodiments, the phase separated polymer blend will have a heat distortion temperature (HDT) greater than or equal to about 170 ° C by using ASTM method D5418 on a 3.2 mm rod at 0.46 MPa (66 psi). ) measured under. In other cases, the HDT at 0.46 MPA (66 psi) will be greater than or equal to 200 °C. In other cases, the carrying capacity of the PAEK-PEIS will be exhibited in Vicat temperature, as measured by ASTM Method D1525, at 50 Newtons (N), greater than or equal to about 200 °C. In other cases, the load carrying capacity of the phase separated polymer blend will be exhibited by a flexural modulus greater than or equal to about 200 megapascals (MPa), which is, for example, by an eight 8 deg] method. 5418 was measured at 200 ° 于 on a rod of 3.2 111111. The polymer blend can be isolated by making a suitable amount of PAEK in a molten state with an appropriate amount of PEIS to produce a phase 118322.doc -49 - 200832839. The two components, which are known to the skilled artisan to result in phase separation of the blend, can be combined. These methods include extrusion, sintering, and the like. Γ, as used herein, the term 'polyaryletherketone(ΡΑΕΚ)Π contains several polymer types containing an aromatic ring (usually a phenyl ring) bonded primarily by ketone and ether groups in different sequences. . Examples of the oxime resin include polyether ketones (poly), polyether ether ketones (PEEK), polyether ketone ether ketone ketones (oxime), and polyether ketone ketones (PEKK) and copolymers containing the same. And blends thereof. The PAEK polymer may comprise monomer units containing any sequence of aromatic rings (typically phenyl rings), keto groups and ether groups. Additional linkage groups may be present at low levels (e.g., less than 10 mole percent) as long as they do not fundamentally alter the properties of the PAEK resin. For example, it can be used in a phase separation compound to crystallize a number of polyaryletherketones having a melting point of about 300 °C. Examples of such crystalline polyaryletherketones are shown by structures XXVI, XXVII, XXVIII, XXIX and XXX.

u (XXVII) 118322.doc -50. (XXIX) (XXVIII) 200832839 〇1 IL_ 了 (XXX) 適於在本文中使用之結晶聚芳_酮之其他實例一般可以 含有下式(XXXI)之重複單元為特徵: (XXXI) Ο 其中Ar為獨立地選自伸苯基、聯伸二苯或伸萘基之二價芳 基,L獨立地為-〇-、&lt;(〇)_、_〇_A卜c(〇)_、_s_、_s〇2 或直 接鍵且h為具有值〇至約10之整數。 熟練技工將知曉存在針對聚芳醚酮之形成及性能的發展 良好及主體充分之專利及其他文獻。舉例而言,早期著作 中之一些(諸如美國專利第3,065,205號)涉及芳族二醯基鹵 化物與諸如二苯醚的未經取代之芳族化合物之親電子芳族 取代(例如,弗瑞德_克來福特催化)反應。此類別之演化在 美國專利第4,175,175號中達成,其展示可(例如)藉由活性u (XXVII) 118322.doc -50. (XXIX) (XXVIII) 200832839 〇1 IL_ (XXX) Other examples of crystalline polyaryl-ketones suitable for use herein may generally contain repeating units of the following formula (XXXI) Characterizing: (XXXI) Ο wherein Ar is a divalent aryl group independently selected from the group consisting of phenyl, terphenyl or anthranyl, and L is independently -〇-, &lt;(〇)_, _〇_A Buc(〇)_, _s_, _s〇2 or a direct bond and h is an integer having a value 〇 to about 10. Skilled artisans will be aware of the existence of well-understood patents and other literature on the formation and performance of polyaryletherketones. For example, some of the earlier works (such as U.S. Patent No. 3,065,205) are directed to the electrophilic aromatic substitution of an aromatic dimercapto halide with an unsubstituted aromatic compound such as diphenyl ether (for example, Fred _ Klein Ford catalyzes the reaction. The evolution of this category is achieved in U.S. Patent No. 4,175,175, the disclosure of which is, for example, by

UU

芳族二鹵化物與芳族二醇或其鹽之親核性芳族取代反應而 形成寬廣範圍之樹脂。 製備聚芳酮之一該方法包含加熱雙酚(常以其雙酚鹽反 應)與二齒類苯化合物(或者,在其他情況中為_酚化合物) 之大體上等莫耳之混合物。在其他情況中,可使用此等化 合物之混合物。舉例而言,氫醌可與諸如二氯二苯曱酮或 二氣二苯甲酮之二_基芳酮反應以形成聚芳醚酮。在其他 情形中,諸如二羥基二苯曱酮之二羥基芳酮可與諸如二氯 苯之芳基二鹵化物聚合以形成PAEK樹脂。在其他情況中, 118322.doc -51 - 200832839 可使諸如二羥基二苯醚之二羥基芳醚與諸如二氟二苯甲酮 之二鹵基芳酮反應。在其他變化中,可使諸如二羥基聯苯 或氫驅之不具有醚鍵的二羥基化合物與可具有醚鍵及酮鍵 兩者之二i基化合物(例如雙二氯苯基)二笨甲酮)反應。 在其他情況中,可使二芳醚羧酸或羧酸_化物聚合以形成 聚芳醚_。該等化合物之實例為二苯醚羧酸、二苯醚羧酸 氯化物、苯氧基-笨氧基苯曱酸或其混合物。在其他情況 p 中,二羧酸或二羧酸鹵化物可與二芳醚縮合,例如異酞醯 氯化物或對酞醯氣化物(或其混合物)可與二苯醚反應,以形 成PAEK樹脂。 該製程描述於(例如)美國專利第4,176,222號中。該製程 包έ在100至400 C之溫度範圍中加熱⑴以下各物之大體上 等莫耳之混合物:(a)雙酚;及化…二齒苯型化合物及/或 (b.ii)鹵盼,其中在一鹵苯型化合物或鹵紛中,鹵素原子藉 由其鄰位或對位之-C☆基團而活化,連同碳酸納或重碳酸 〇 鈉與第二鹼金屬碳酸鹽或重碳酸鹽之混合物,該第二鹼金 屬碳酸鹽或重碳酸鹽之驗金屬具有高於納之原子數目,該 第二鹼金屬碳酸鹽或重碳酸鹽之量使得對於每克鈉原子存 在〇·〇〇ι至0.2克該驗金屬原子之高出的原子數目,驗金屬碳 酸鹽或重碳酸鹽之總量使得對於存在之每一盼基存在至少 驗孟屬原子,且在此之後將聚合物自驗金屬齒化物分離。 然而,如(例如)美國專利第4,396,755號中所描述,亦可 根據裝転裝備其他聚芳_酮。在該等製程中,諸如⑷二幾 酉夂’(b)一價芳基及單芳族二幾酸及⑷⑷與(b)之組合的反 118322.doc -52- 200832839 應物在氟烷磺酸(尤其是三氟曱烷磺酸)存在之情況下反廣。 如(例如)美國專利第4,398,020號中所描述,可根據製程 製備額外聚芳醚酮,其中芳族二醯基化合物與芳族化合物 及單酿基_化物聚合。 聚芳醚酮可具有大於或等於約〇·4至約5·〇 dl/g之對比多占 度,如在25°C量測於濃硫酸中。PAEK之重量平均分子量 (Mw)可為約5,000至約bo’ooo g/m〇le。在其他情況中,Mw 可為約 10,000至約 80,000 g/m〇le。 第二樹脂組份為聚醚醯亞胺砜(PEIS)樹脂。在使用於本 文中時,PEIS包含具有通式(VII)之結構單元,其中大於或 等於約50莫耳%之聚合物鍵具有芳碾基且The aromatic dihalide reacts with a nucleophilic aromatic substitution of an aromatic diol or a salt thereof to form a wide range of resins. One of the methods for preparing polyaryl ketones comprises heating a mixture of bisphenol (often reacted with its bisphenolate) with a substantially equimolar mixture of a bidentate benzene compound (or, in other cases, a phenol compound). In other cases, mixtures of such compounds can be used. For example, hydroquinone can be reacted with a di-aryl ketone such as dichlorobenzophenone or dibenzophenone to form a polyaryletherketone. In other cases, a dihydroxyaryl ketone such as dihydroxydibenzophenone can be polymerized with an aryl dihalide such as dichlorobenzene to form a PAEK resin. In other cases, 118322.doc -51 - 200832839 can react a dihydroxy aryl ether such as dihydroxydiphenyl ether with a dihaloaryl ketone such as difluorobenzophenone. In other variations, a dihydroxy compound having no ether bond such as dihydroxybiphenyl or hydrogen flooding may be combined with a di-i-based compound (for example, di-dichlorophenyl) which may have both an ether bond and a ketone bond. Ketone) reaction. In other cases, the diaryl ether carboxylic acid or carboxylic acid compound can be polymerized to form a polyarylene ether. Examples of such compounds are diphenyl ether carboxylic acid, diphenyl ether carboxylic acid chloride, phenoxy-p-oxybenzoic acid or mixtures thereof. In other cases p, the dicarboxylic acid or dicarboxylic acid halide may be condensed with a diaryl ether, for example, an isoindole chloride or a parafluorene (or a mixture thereof) may be reacted with the diphenyl ether to form a PAEK resin. . This process is described, for example, in U.S. Patent No. 4,176,222. The process packs, in the temperature range of 100 to 400 C, heats (1) a substantially equimolar mixture of the following: (a) bisphenol; and ... bidentate benzene type compound and / or (b.ii) halogen It is expected that in a monohalophenotype compound or a halogen, a halogen atom is activated by its ortho or para-C☆ group, together with sodium carbonate or sodium bicarbonate and a second alkali metal carbonate or heavy a mixture of carbonates having a higher number of atoms than the nano alkali metal carbonate or bicarbonate, the second alkali metal carbonate or bicarbonate being present such that 每·〇 is present per gram of sodium atom 〇ι to 0.2 g of the number of atoms above the metal atom, the total amount of metal carbonate or bicarbonate is such that at least each of the desired groups is present, and at least the molecule is present, and thereafter the polymer is self-generated Metal tooth separation is examined. However, other polyaryl-ketones may also be provided according to the mounting, as described in, for example, U.S. Patent No. 4,396,755. In these processes, such as (4) two 酉夂 '(b) monovalent aryl and monoaromatic bisacids and (4) combination of (4) and (b) of the reverse 118322.doc -52-200832839 should be in the fluoroalkane The presence of an acid (especially trifluoromethanesulfonic acid) is counterproductive. Additional polyaryletherketones can be prepared according to the process, as described, for example, in U.S. Patent No. 4,398,020, in which an aromatic dimercapto compound is polymerized with an aromatic compound and a mono-branched compound. The polyaryletherketone may have a comparative multi-span of greater than or equal to about 〇4 to about 5·〇 dl/g, as measured in concentrated sulfuric acid at 25 °C. The weight average molecular weight (Mw) of the PAEK may range from about 5,000 to about about bo'ooo g/m〇le. In other cases, Mw can range from about 10,000 to about 80,000 g/m〇le. The second resin component is a polyether sulfoxide (PEIS) resin. As used herein, PEIS comprises a structural unit having the formula (VII) wherein greater than or equal to about 50 mole % of the polymer bond has an aromatic milling group and

」a (VII)a (VII)

或更特定言 (VIII)之四價芳基,諸如, :受限制之四價連接子,只要該連 之合成或使用。合適連接子包括 約50個碳原子的經取代或未經取 ^環及多環基團;(b)具有1至約30 取代,直鏈或分枝鏈,飽和或不 &gt;較佳連接子包括(但不限於)式 118322.doc -53- (VIII) 200832839 双观 5 ? Ο 其中w在一些實施例中為由下列各物組成之群中選出之二 價基:-S〇2-、-〇-、-s-、-C(〇)·、CyH2y_(y為具有值 1至5之 整數)及其鹵化衍生物,包栝全氟伸烷基,或式-〇_!)_〇-之 基。基D可包含雙酚化合物之殘基。舉例而言,D可為式ιχ 所示之分子中之任一者。 H,ΌΓ, ΟOr, more particularly, a tetravalent aryl group of (VIII), such as: a restricted tetravalent linker, as long as the link is synthesized or used. Suitable linkers include substituted or unsubstituted ring and polycyclic groups of about 50 carbon atoms; (b) having from 1 to about 30, straight or branched chains, saturated or not &gt; preferred linkers Including, but not limited to, the formula 118322.doc -53- (VIII) 200832839 Double view 5 ? Ο where w is, in some embodiments, a divalent group selected from the group consisting of: -S〇2-, -〇-, -s-, -C(〇)·, CyH2y_ (y is an integer having a value of 1 to 5) and a halogenated derivative thereof, which is a perfluoroalkylene group, or a formula -〇_!)_〇 - The basis. The group D may comprise a residue of a bisphenol compound. For example, D can be any of the molecules shown by the formula ιχ. H, ΌΓ, Ο

H3C Br Br CH;H3C Br Br CH;

’W-或-〇_D_〇-基之二價鍵可位於3,3,、3,^、 亦可使用前述化合物 (IX) 4,3’或4,4,位置 之混合物。為獲得優良熔融 穩定性 H8322.doc -54- 200832839 無苯甲基質子之基團常為較佳的。其中w為舞之基團特 別重要,因為其為一將芳砜鍵引入聚砜醚醯亞胺樹脂之方 法。 在使用於本文中時,術語,,聚合物鍵,,或,,一聚合物鍵,,定義 為形成聚合物之至少兩個單體之反應產物,其中該等單體 中之至少一者為二酐或化學等效物,且其中第二單體為至 ,)個一胺或化學等效物。聚合物包含於100莫耳%之該等 鍵上。具有50莫耳%芳砜鍵之聚合物(例如)其鍵之一半(以 莫耳計)將包含具有至少一芳砜基的二酐或二胺衍生之鍵。 用作對-0-D-0-基團之前驅體的合適二羥基取代之芳族 烴亦包括式(X)之芳族烴:The divalent bond of the 'W- or -〇_D_〇-yl group may be at 3,3, 3,^, or a mixture of the above compounds (IX) 4, 3' or 4, 4 may be used. For good melt stability H8322.doc -54- 200832839 Groups without benzylic protons are often preferred. Where w is a dance group is particularly important because it is a method of introducing a sulfone bond into a polysulfone ether quinone imide resin. As used herein, the term, polymer bond, or, a polymer bond, is defined as the reaction product of at least two monomers forming a polymer, wherein at least one of the monomers is A dianhydride or a chemical equivalent, and wherein the second monomer is a to one amine or a chemical equivalent. The polymer is contained on 100% of the bonds. A polymer having a 50 mol% aryl sulfone bond, for example, one half of its bond (in terms of moles) will comprise a dianhydride or diamine derived bond having at least one aryl sulfone group. Suitable dihydroxy-substituted aromatic hydrocarbons for use as precursors to the -0-D-0- group also include aromatic hydrocarbons of formula (X):

其中每一 R7獨立地為氫、氯、溴、烷氧基、芳氧基或Ci3〇 單價烴或烴基,且R8及R9獨立地為氫、芳基、烷基氟基或 Cl-3G烴基。 可用作對基團之前驅體的二羥基取代之芳族烴 包括以名稱或式而揭示於美國專利第2,991,273號、第 2,999,835號 '第 3,028,365號、第 3,148,172號、第 3,153,008 號、第3,271,367號、第3,271,368號及第4,217,438號中之芳 族烴。可使用之二羥基取代之芳族烴的特定實例包括(但不 限於)雙(4-羥苯基)砜、雙(4-羥苯基)硫化物、雙(4-羥苯基) H8322.doc -55- 200832839 醚、雙(4-羥苯基)亞砜、丨,‘二羥基苯、4,4,_氧基二酚、2,2_ 雙(4-羥苯基)六氟丙烷、4,4’-(3,3,5-三曱基亞環己基)聯苯二 酚,4,4’-雙(3,5-二曱基)聯苯二酚'1,1-雙(4-羥基_3-甲基苯 基)環己烧;4,4-雙(4-羥苯基)庚烷;2,4,_二羥基二苯基甲 烷,雙(2-羥苯基)甲烷;雙(4_羥苯基)曱烷;雙(4_羥基_5-硝基苯基)甲烷;雙(4-羥基_2,6-二曱基_3_甲氧苯基)甲烷; Μ-雙(4-羥苯基)乙烷;丨,2_雙(4-羥苯基)乙烷;込卜雙羥 基-2-氣苯基)乙烷;2,2-雙(3-苯基-4-羥苯基)丙烷;2,2-雙(4-羥基-3-甲基苯基)丙烷;2,2_雙(4_羥基_3_乙基苯基)丙烷; 2.2- 雙(4-羥基-3-異丙基苯基)丙烷;2,2-雙(4-羥基-3,5-二甲 基苯基)丙烷;3,5,3’,5’_四氯_4,4,_二羥苯基)丙烷;雙(4_羥 苯基)環己基甲烷;2,2-雙(4-羥苯基苯丙烷;2,4,_二羥 苯基礙;二羥基萘;2,6-二羥基萘;氫醌;間苯二酚;Cl-3 烷基取代間苯二酚;甲基間苯二酚、丨,仁二羥基甲基苯; 2.2- 雙(4-羥苯基)丁烷;2,2-雙(4-羥苯基)_2_甲基丁烷;丨,^ 雙(4-經苯基)環己烷;4,4,-二羥基二苯基;2_(3_甲基_4_羥 苯基-2-(4-羥苯基)丙烷;2-(3,5-二曱基-4-羥苯基)-2-(4-羥 本基)丙烧;2-(3 -甲基-4-經苯基)-2-(3,5_二甲基-4-經苯基) 丙烷;雙(3,5_二甲基苯基-4-羥苯基)曱烷;込^雙^^二甲 基苯基-4-羥苯基)乙烷;2,2-雙(3,5-二甲基苯基_4_羥苯基) 丙烷;2,4-雙(3,5-二甲基苯基-4-羥苯基)-2_甲基丁烷;3,3_ 雙(3,5-二甲基苯基羥苯基)戊烷;1,1_雙(3,5_二曱基苯基 -4-經苯基)環戊烷;^-雙(3,5_二甲基苯基_4_羥苯基)環己 烷;雙(3,5-二甲基-4-羥苯基)亞砜、雙(3,5_二曱基羥苯 118322.doc -56- 200832839 土)風及雙(3,5- 一曱基本基-4-經苯基)硫化物。亦可使用包 含前述二羥基取代之芳族烴中之任一者的混合物。 在一特定實施例中,包含具有砜鍵的雙酚之二羥基取代 方知k為重要的’因為此為將芳石風鍵引入聚礙鍵酿亞胺 树月曰之另一途徑。在其他情況中,無苯曱基質子之雙酚化 否物可為較佳的以製成具有優良溶融穩定性之聚醚醯亞胺 石風0 在式(VII)中’ R基為二胺基化合物或化學等效物之殘 基,其包括(但不限於)經取代或未經取代之二價有機基,諸 如:(a)具有約6至約24個碳原子之芳族烴基及其鹵化衍生 物,(b)具有約2至約20個碳原子之直鏈或分枝鏈伸烷基;(c) 具有約3至約24個碳原子之環伸烷基或(句通式之二價 基Each of R7 is independently hydrogen, chlorine, bromine, alkoxy, aryloxy or Ci3〇 monovalent hydrocarbon or hydrocarbyl group, and R8 and R9 are independently hydrogen, aryl, alkylfluoro or Cl-3G hydrocarbyl. Dihydroxy-substituted aromatic hydrocarbons useful as precursors to the group include those disclosed in U.S. Patent Nos. 2,991,273, 2,999,835, 3,028,365, 3,148,172, 3, by name or formula. Aromatic hydrocarbons of Nos. 153,008, 3,271,367, 3,271,368 and 4,217,438. Specific examples of dihydroxy-substituted aromatic hydrocarbons that may be used include, but are not limited to, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxyphenyl)sulfide, bis(4-hydroxyphenyl)H8322. Doc -55- 200832839 Ether, bis(4-hydroxyphenyl) sulfoxide, hydrazine, 'dihydroxybenzene, 4,4,-oxydiphenol, 2,2-bis(4-hydroxyphenyl)hexafluoropropane, 4,4'-(3,3,5-tridecylcyclohexylene)biphenol, 4,4'-bis(3,5-dimercapto)biphenol-2',1-double ( 4-hydroxy-3-methylphenyl)cyclohexane; 4,4-bis(4-hydroxyphenyl)heptane; 2,4,-dihydroxydiphenylmethane, bis(2-hydroxyphenyl) Methane; bis(4-hydroxyphenyl)decane; bis(4-hydroxy-5-nitrophenyl)methane; bis(4-hydroxy-2,6-diamidino-3-methoxyphenyl)methane ; Μ-bis(4-hydroxyphenyl)ethane; hydrazine, 2_bis(4-hydroxyphenyl)ethane; bis-dihydroxy-2-phenylphenyl)ethane; 2,2-double (3 -phenyl-4-hydroxyphenyl)propane; 2,2-bis(4-hydroxy-3-methylphenyl)propane; 2,2-bis(4-hydroxy-3-methylphenyl)propane; 2.2-bis(4-hydroxy-3-isopropylphenyl)propane; 2,2-bis(4-hydroxy-3,5-dimethyl Phenyl)propane; 3,5,3',5'-tetrachloro-4,4,-dihydroxyphenyl)propane; bis(4-hydroxyphenyl)cyclohexylmethane; 2,2-bis(4- Hydroxyphenyl phenylpropane; 2,4,-dihydroxyphenyl; dihydroxynaphthalene; 2,6-dihydroxynaphthalene; hydroquinone; resorcinol; Cl-3 alkyl-substituted resorcinol; methyl Resorcinol, hydrazine, aryl dihydroxymethyl benzene; 2.2-bis(4-hydroxyphenyl)butane; 2,2-bis(4-hydroxyphenyl)_2-methylbutane; 丨, ^ double (4-phenyl)cyclohexane; 4,4,-dihydroxydiphenyl; 2-(3-methyl-4-hydroxyphenyl-2-(4-hydroxyphenyl)propane; 2-(3 ,5-dimercapto-4-hydroxyphenyl)-2-(4-hydroxyphenyl)propane; 2-(3-methyl-4-phenyl)-2-(3,5-dimethyl 4-(phenyl)propane; bis(3,5-dimethylphenyl-4-hydroxyphenyl)decane; 込^ bis(^-dimethylphenyl-4-hydroxyphenyl)ethane 2,2-bis(3,5-dimethylphenyl-4-hydroxyphenyl)propane; 2,4-bis(3,5-dimethylphenyl-4-hydroxyphenyl)-2_ Methylbutane; 3,3_bis(3,5-dimethylphenylhydroxyphenyl)pentane; 1,1_bis(3,5-didecylphenyl-4-phenyl)cyclopentane Alkane; ^-bis(3,5-dimethylphenyl-4-hydroxyphenyl) Cyclohexane; bis(3,5-dimethyl-4-hydroxyphenyl) sulfoxide, bis(3,5-didecylhydroxybenzene 118322.doc -56-200832839) wind and double (3, 5-Anthracenyl-4-phenyl-sulfide. A mixture comprising any of the aforementioned dihydroxy-substituted aromatic hydrocarbons may also be used. In a particular embodiment, the dihydroxy group containing a bisphenol having a sulfone bond is known to be important as 'because this is another way of introducing an aryl stone bond into the occludin. In other cases, the bisphenol-free benzoate-free bisphenol-derived material may be preferred to produce a polyether sulfite-like wind having excellent solubility stability. In the formula (VII), the R-based group is a diamine. a residue of a base compound or chemical equivalent, including but not limited to a substituted or unsubstituted divalent organic group such as: (a) an aromatic hydrocarbon group having from about 6 to about 24 carbon atoms and a halogenated derivative, (b) a linear or branched alkyl group having from about 2 to about 20 carbon atoms; (c) a cycloalkyl group having from about 3 to about 24 carbon atoms or (sentence formula Divalent base

(XI) 其中Q包括(但不限於)由下列各物組成之群中選出之二價 ϋ 基· S02 _0_、_S_、-c(〇l·、CyH2y-(y為具有值 i 至約 5之 整數)及其*化衍生物,包括全氟伸烷基。在特定實施例 中,R本質上無苯甲基氫。可自化學結構推斷苯甲基質子之 存在。 在-些特定實施例中,合適芳族二胺包含間苯二胺;對 苯二胺;間苯二胺與對苯二胺之混合物;異構甲基及5_ 甲基-4’6-二乙基伸苯基_二胺或其混合物;雙&amp;胺基苯 基)-2,2-丙烷;雙(2_氯_4_胺基_3,5_二乙基苯基)甲烷,4,4,_ 118322.doc -57. 200832839 二胺基聯苯’ 3,4 ^二胺基聯苯’ 4,4 ^二胺基二本鱗(有時稱 作4,4’-二胺基二苯醚),3,4、二胺基二苯基醚,3,3’-二胺基 二苯基醚,4,4匕二胺基二苯砜,3,4匕二胺基二苯砜,3,3、 二胺基二苯砜,4,4’-二胺基二苯硫化物;3,4f-二胺基二苯 硫化物;4,4’·二胺基二苯酮,3,4’-二胺基二苯酮,4,4’-二胺 基二苯甲烷(通常稱作4,4»-亞甲基雙苯胺);4,4’-雙(4-胺基 苯氧基)聯苯,4,4’-雙(3-胺基苯氧基)聯苯,1,5-二胺基萘; 3,3-二曱基聯苯胺;3,3-二曱氧基聯苯胺;聯苯胺;間二曱 苯二胺;雙(胺基苯氧基)苐,雙(胺基苯氧基)苯,1,3-雙(3-胺基苯氧基)苯,1,3-雙(4-胺基苯氧基)苯,i,4-雙(4-胺基苯 氧基)苯,雙(胺基苯氧基)苯砜,雙(4-(4-胺基苯氧基)苯基) 砜,雙(4-(3-胺基苯氧基)苯基)砜,二胺基苯甲醯苯胺,3,3,_ 二胺基二苯甲酮,4,4’-二胺基二苯甲酮,2,2,-雙(4-(4-胺基 苯氧基)苯基)丙烷,2,2-雙[4-(4-胺基苯氧基)苯基]六氟丙 烧’ 4,4’-雙(胺基苯基)六氟丙烷,丨,3_二胺基_4-異丙苯;丨,2_ 雙(3-胺基苯氧基)乙烧;2,4-雙(β-胺基—第三丁基)甲苯;雙 (對-β-曱基-鄰-胺基苯基)苯;雙(對_β_胺基-第三丁基苯基) 鱗及2,4-曱笨二胺。亦可使用兩種或兩種以上二胺之混合 物。一胺基二苯颯(DDS)、雙(胺基苯氧基苯基)砜(BAps) 及其混合物為較佳芳族二胺。 本文描述之熱塑聚砜醚醯亞胺可由包含以下各物之反應 物衍生:一或多種芳族二胺或其化學等效衍生物及一或多 種方族四羧酸環二酐(在下文中有時稱作芳族二酐)、芳族四 羧酸或其能夠形成環酐或進行預成型聚異醯亞胺之熱/催 118322.doc •58- 200832839 化重排之何生物。另外,包含芳族二胺及芳族二酐之反應 物中之—者或另—者的至少—部分,或每-者之至少一部 分包含-芳石風鍵以使得至少5 G莫耳%之生成聚合物鍵含有 至少-芳砜基。在特定實施例中,包含芳族二胺及芳族二 酐之反應物中之一者或另一者的全部,或每一者具有至少 一砜鍵。反應物聚合以形成包含環醯亞胺鍵及砜鍵之聚合 物0 务族一酐之說明性實例包括: 4’4_雙(3,4-_竣基苯氧基)二苯硬二酐; 4.4- 雙(2,3-二缓基苯氧基)二苯硬二酐; 4-(2,3-二羧基苯氧基)_4,_(3,4_二羧基苯氧基)二苯砜二酐 及其混合物。 其他有用芳族二酐包含: 2.2- 雙(4-(3,4-二羧基苯氧基)苯基)丙烷二酐; 4,4f-雙(3,4·二羧基苯氧基)二苯醚二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯硫醚二酐; 4,4’-雙(3,4-二羧基苯氧基)二苯甲酮二酐; 2.2- 雙[4-(2,3-二羧基苯氧基)苯基]丙烷二酐; 4,4f-雙(2,3-二羧基苯氧基)二苯醚二酐; 4.4- 雙(2,3-一魏基苯氧基)二苯硫趟二酐; 4,4、雙(2,3-二羧基苯氧基)二苯甲酮二酐; 2-[4-(3,4-一竣基苯氧基)苯基][4-(2,3-二致基苯氧基) 苯基]丙烧二if ; 4 - (2,3-二羧基苯氡基)_4,_(3,4_二羧基苯氧基)二苯醚二 118322.doc -59- 200832839 酐; 4-(2,3-二羧基苯氧基)-4’-(3,4-二羧基苯氧基)二苯硫醚二 酐; 4-(2,3-二魏基苯氧基)-4’-(3,4-二魏基苯氧基)二苯甲酮二 酐; 14,5,8-萘四魏酸二酐; 3.4.3、 4·_二苯甲酮四羧酸二酐; 2,3,3’,4’-二苯甲酮四羧 酸二酐; Ο 3,4,3、4’-氧雙苯二曱酸酐;2,3,3,,4,-氧雙苯二甲酸酐; 3,3’,4,4'-聯苯四羧酸二酐; 2.3.3、 4^聯苯四羧酸二酐; 2,3,2’,3f-聯苯四魏酸二酐;苯四曱酸二酐; 3.4.3、 4’-二苯砜四羧酸 二酐; 2,3,3·,4、二苯砜四羧酸二酐; I4-雙(3,4-二羧基苯氧基)苯二酐;及, Q 2,2_雙(3,4·二羧基苯基)六氟丙烷二酐。亦涵蓋具有自包 含兩種或兩種以上二酐之混合物而衍生之結構單元的聚碾 醚醢亞胺。 在其他情況中,聚砜醚醯亞胺具有大於或等於約5〇莫耳 %之由芳族醚酐(其為氧雙苯二甲酸酐)衍生的醯亞胺鍵,在 一替代實施例中,聚颯醚醯亞胺具有約60莫耳%至約1〇〇莫 耳%之氧雙苯二甲酸酐衍生之醯亞胺鍵。在一替代實施例 中,約70莫耳%至約99莫耳%之醯亞胺鍵為氧雙苯二曱酸酐 或化學專效物所衍生。 118322.doc -60- 200832839 術語π氧雙苯二甲酸酐”意謂式(χΠ)之氧錐 虱又本二甲酸酐(XI) wherein Q includes, but is not limited to, a divalent thiol group selected from the group consisting of: S02 _0_, _S_, -c (〇l·, CyH2y- (y is a value i to about 5) Integer) and its derivatives, including perfluoroalkylene. In a particular embodiment, R is essentially free of benzyl hydrogen. The presence of benzyl protons can be inferred from the chemical structure. In some specific embodiments Suitable aromatic diamines comprise m-phenylenediamine; p-phenylenediamine; a mixture of m-phenylenediamine and p-phenylenediamine; isomeric methyl and 5-methyl-4'6-diethylphenylene-diamine Or a mixture thereof; bis &amp;aminophenyl)-2,2-propane; bis(2-chloro-4-ylamino-3,5-diethylphenyl)methane, 4,4, _ 118322.doc -57. 200832839 Diaminobiphenyl '3,4 ^diaminobiphenyl ' 4,4 ^diaminodiamine scale (sometimes referred to as 4,4'-diaminodiphenyl ether), 3, 4. Diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4 guanidine diamino phenyl sulfone, 3,4 guanidine diamino phenyl sulfone, 3, 3, 2 Aminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide; 3,4f-diaminodiphenyl sulfide; 4,4'-diaminobenzophenone, 3,4'- Diaminobenzophenone, 4,4'-diaminodiphenylmethane (commonly referred to as 4,4»-methylenediphenylamine); 4,4'-bis(4-aminophenoxy) linkage Benzene, 4,4'-bis(3-aminophenoxy)biphenyl, 1,5-diaminonaphthalene; 3,3-dimercaptobenzidine; 3,3-dimethoxyoxybenzidine; Benzidine; m-diphenylene diamine; bis(aminophenoxy)anthracene, bis(aminophenoxy)benzene, 1,3-bis(3-aminophenoxy)benzene, 1,3- Bis(4-aminophenoxy)benzene, i,4-bis(4-aminophenoxy)benzene, bis(aminophenoxy)phenylsulfone, bis(4-(4-aminophenoxy) Phenyl) sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, diaminobenzilide, 3,3,-diaminobenzophenone, 4,4' -diaminobenzophenone, 2,2,-bis(4-(4-aminophenoxy)phenyl)propane, 2,2-bis[4-(4-aminophenoxy)benzene Hexafluoropropanol '4,4'-bis(aminophenyl)hexafluoropropane, anthracene, 3-diamino-4-diisopropylbenzene; anthracene, 2_bis(3-aminophenoxy) Ethylene; 2,4-bis(β-amino-t-butyl)toluene; bis(p-β-mercapto-o-aminophenyl)benzene; (p-_β-amino-t-butylphenyl) scales and 2,4-indole diamine. A mixture of two or more kinds of diamines may also be used. Monoaminodiphenyl hydrazine (DDS), bis(aminophenoxyphenyl)sulfone (BAps) and mixtures thereof are preferred aromatic diamines. The thermoplastic polysulfone ether iminoimides described herein may be derived from reactants comprising one or more aromatic diamines or chemically equivalent derivatives thereof and one or more of the tetracarboxylic acid cyclic dianhydrides (hereinafter Sometimes referred to as an aromatic dianhydride, an aromatic tetracarboxylic acid or a heat/recovery capable of forming a cyclic anhydride or a preformed polyisoximide 118322.doc • 58- 200832839. Further, at least a portion, or at least a portion of each of the reactants comprising the aromatic diamine and the aromatic dianhydride comprises - an aryl rock bond to cause polymerization of at least 5 G mole % The physical bond contains at least an aryl sulfone group. In a particular embodiment, all or each of the reactants comprising the aromatic diamine and the aromatic dianhydride have at least one sulfone linkage. Illustrative examples of the polymerization of the reactants to form a polymer comprising a cycloheximide bond and a sulfone bond include: 4'4_bis(3,4--mercaptophenoxy)diphenyl succinic anhydride 4.4-bis(2,3-disulfophenoxy)diphenyl succinic anhydride; 4-(2,3-dicarboxyphenoxy)_4,_(3,4-dicarboxyphenoxy)di Phenyl sulfone dianhydride and mixtures thereof. Other useful aromatic dianhydrides include: 2.2-bis(4-(3,4-dicarboxyphenoxy)phenyl)propane dianhydride; 4,4f-bis(3,4.dicarboxyphenoxy)diphenyl Ether dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide dianhydride; 4,4'-bis(3,4-dicarboxyphenoxy)benzophenone Anhydride; 2.2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride; 4,4f-bis(2,3-dicarboxyphenoxy)diphenyl ether dianhydride; 4.4- Bis(2,3-propylphenoxy)diphenylsulfonium dianhydride; 4,4,bis(2,3-dicarboxyphenoxy)benzophenone dianhydride; 2-[4-(3 , 4-monodecylphenoxy)phenyl][4-(2,3-diphenyloxy)phenyl]propandialdehyde; 4 - (2,3-dicarboxybenzoinyl)-4 , _(3,4-dicarboxyphenoxy)diphenyl ether II 118322.doc -59- 200832839 Anhydride; 4-(2,3-dicarboxyphenoxy)-4'-(3,4-dicarboxyl Phenoxy)diphenyl sulfide dianhydride; 4-(2,3-diweiphenoxy)-4'-(3,4-diweiphenoxy)benzophenone dianhydride; 5,8-naphthalenetetracarboxylic acid dianhydride; 3.4.3, 4·_benzophenone tetracarboxylic dianhydride; 2,3,3',4'-benzophenonetetracarboxylic dianhydride; Ο 3 , 4 , 3,4'-oxybisphthalic anhydride; 2,3,3,,4,-oxyphthalic anhydride; 3,3',4,4'-biphenyltetracarboxylic dianhydride; 2.3. 3, 4^biphenyltetracarboxylic dianhydride; 2,3,2',3f-biphenyltetrazine dianhydride; benzenetetracarboxylic dianhydride; 3.4.3, 4'-diphenyl sulfone tetracarboxylic acid Anhydride; 2,3,3·,4, diphenylsulfone tetracarboxylic dianhydride; I4-bis(3,4-dicarboxyphenoxy)phthalic anhydride; and, Q 2,2_bis (3,4 · Dicarboxyphenyl) hexafluoropropane dianhydride. Also included are polyfluorenated quinone imines having structural units derived from a mixture comprising two or more dianhydrides. In other instances, the polysulfone ether iodide has greater than or equal to about 5 mole % of the quinone imine bond derived from an aromatic ether anhydride which is oxy phthalic anhydride, in an alternate embodiment The polyethylidene iodide has from about 60 mole % to about 1 mole % of an oxydiphthalic anhydride derived quinone bond. In an alternate embodiment, from about 70 mole percent to about 99 mole percent of the quinone imine linkage is derived from oxy bisphthalic anhydride or a chemical specific. 118322.doc -60- 200832839 The term "π-oxyphthalic anhydride" means an oxygen cone of the formula (χΠ) and a dicarboxylic anhydride.

(XII) 及其如下文所定義之衍生物。 式(XII)之氧雙本一甲酸酐包括44’-氧等贫_ 刊又本一甲酸酐、(XII) and derivatives thereof as defined below. The oxygen double-formic acid anhydride of the formula (XII) includes a 44'-oxygen or the like, and a mono-anhydride,

Ο 3,4’-氧雙苯二甲酸酐、3,3,_氧雙苯二甲酸酐及其任何混合 物。舉例而言,含有大於或等於約5〇莫耳%之由氧雙苯二 甲酸酐衍生的醯亞胺鍵之聚砜醚醯亞胺可由式&quot;〖Η)之 4,4^氧雙苯二甲酸酐結構單元衍生。Ο 3,4'-Oxyphthalic anhydride, 3,3,-oxy phthalic anhydride, and any mixture thereof. For example, a polysulfone ether quinone imine having an oxime imine bond derived from oxy phthalic anhydride of greater than or equal to about 5 〇 mol% may be a 4, 4 oxy bisbenzene of the formula &quot;Η; Dicarboxylic anhydride structural unit derived.

(XIII) 如上文所提,可使用氧雙苯二甲酸酐之衍生物來製造聚 砜醚醯亞胺。可在醯亞胺形成反應中起氧雙苯二甲酸酐之 化學等效物作用的衍生之酐基之實例包括式(XIV)之氧雙 苯二曱酸酐衍生物(XIII) As mentioned above, a derivative of oxy phthalic anhydride can be used to produce a polysulfone ether imine. Examples of the derived anhydride group which can function as a chemical equivalent of oxy phthalic anhydride in the quinone imine formation reaction include an oxybisphthalic anhydride derivative of the formula (XIV).

其中式VII之心及反2可為以下任一者:氫;烷基;芳基。 與R2可相同或不同以製造氧雙苯二曱酸酐酸、氧雙苯二甲 酸酐酯及氧雙苯二甲酸酐酸酯。 本文中之聚硬醚醯亞胺可包括具有兩個衍生酐基的氡雙 118322.doc -61 - 200832839 苯二甲酸酐衍生物所衍生之醯亞胺鍵,(例如)其中氧雙苯二 甲酸酐衍生物具有式(XV) II 0 0 (XV) 其中式(XV)之R!、R2、R3及R4可為以下任一者:氫;烧基·Wherein the core of formula VII and the inverse 2 may be any of the following: hydrogen; alkyl; aryl. It may be the same as or different from R2 to produce oxydiphthalic anhydride acid, oxydiphthalic acid anhydride and oxy phthalic anhydride. The polyetheretherimine herein may include a quinone bond derived from a phthalic anhydride derivative having two derivatized anhydride groups, 118322.doc-61 - 200832839 phthalic anhydride derivative, for example, wherein oxybisphthalate The anhydride derivative has the formula (XV) II 0 0 (XV) wherein R!, R2, R3 and R4 of the formula (XV) may be any of the following: hydrogen;

芳基。R!、R2、R3及R4可相同或不同以製造氧雙苯二甲酸 (oxydiphthalic acid)、氧雙苯二甲酸酉旨(oxydiphthalic ⑽叫 及氧雙苯二甲酸酯(oxydiphthalic acid ester)。 亦涵蓋聚颯醚醯亞胺之共聚物,其包括由以上所列具有 兩個、三個或三個以上不同二酐之氧雙苯二甲酸酐之混合 物與大約等莫耳量的具有可撓鍵之有機二胺之亞胺化反應 所衍生的結構單元。另外,亦涵蓋具有大於或等於約5〇莫 耳%之由上文所定義之包括其衍生物的氧雙苯二甲酸肝所 衍生之醯亞胺鍵,及高達約50莫耳%之不同於氧雙苯二甲 酸酐的替代二酐之共聚物。即,在一些情況中,將需要製 造除具有大於或等於約50莫耳%之由氧雙苯二甲酸酐衍生 之鍵外亦包括由不同於氧雙苯二甲酸酐之芳族二酐(諸如 雙酚A二酐(BPADA)、二砜二酐、二苯甲酮二酐、雙(苯氧 羱基苯基)六氟丙烷二酐、雙酚二酐、苯四甲酸二軒 (PMDA)、聯苯二酐、硫二酐、磺酸基二酐及其混合物)所 衍生之醯亞胺鍵的共聚物。 在另一實施例中,如上文所定義之二酐與具有砜鍵之芳 二胺反應。在一實施例中,聚砜醚醯亞胺包括由式(χνι) 118322.doc -62- (XVI) 200832839 之芳基二胺基碾衍生之結構單元。 H2N—Ar ^S02—Ar~NH2 其中ΑΓ可為含有單一或多個環之芳基物質。若干芳環可(例 如)絰由醚鍵、砜鍵或一個以上砜鍵而鍵聯在一起。芳環亦 可為稠合的。 在替代實施例中,f基二胺基砜之胺基可為砜鍵之間位 或對位,(例如)如式(XVII) Γ 〇Aryl. R!, R2, R3 and R4 may be the same or different to produce oxydiphthalic acid, oxydiphthalic (10) and oxydiphthalic acid ester. A copolymer comprising poly(decyl ether quinone) comprising a mixture of oxy phthalic anhydride having two, three or more different dianhydrides as listed above and having approximately a molar amount of a flexible bond a structural unit derived from an imidization reaction of an organic diamine. Further, it is also encompassed by having oxydiphthalic acid including a derivative thereof as defined above having greater than or equal to about 5 mole %. a quinone imine bond, and up to about 50 mole % of a copolymer of an alternative dianhydride different from oxy phthalic anhydride. That is, in some cases, it will be desirable to manufacture in addition to having greater than or equal to about 50 mole percent. The bond derived from oxy phthalic anhydride also includes an aromatic dianhydride different from oxy phthalic anhydride (such as bisphenol A dianhydride (BPADA), disulfone dianhydride, benzophenone dianhydride, Bis(phenoxynonylphenyl)hexafluoropropane dianhydride, bisphenol dianhydride, benzene a copolymer of quinone imine bonds derived from dicarboxylic acid (PMDA), biphenyl dianhydride, sulphur dianhydride, sulfonic dianhydride, and mixtures thereof. In another embodiment, a dianhydride as defined above Reaction with an aryl diamine having a sulfone linkage. In one embodiment, the polysulfone ether quinone imine comprises a structural unit derived from an aryldiamine group of the formula (χνι) 118322.doc-62-(XVI) 200832839. H2N—Ar ^S02—Ar~NH2 wherein fluorene may be an aryl group containing a single or multiple rings. Several aromatic rings may be bonded, for example, by an ether bond, a sulfone bond or more than one sulfone bond. The ring may also be fused. In an alternative embodiment, the amine group of the f-diamino sulfone may be a meta or para position between the sulfone bonds, for example as in formula (XVII) Γ 〇

SOoSOo

NH〇 η2ν (XVII) 芳私一胺包括(但不限於)(例如)二胺基二苯砜(DDS)及雙 (月女基苯氧基苯基)砜(BAPS)。可使用上文所描述之氧雙苯 一甲酸酐以藉由與芳基二胺基砜之反應形成聚醯亞胺鍵從 而製造聚硬醚酿亞胺。 在一些實施例中,可由芳族二酐單體(或芳族雙(醚酐)單 體)與有機二胺單體之反應來製備聚颯醚醯亞胺樹脂,其中 兩個單體以本質上等莫耳之量而存在,或其中一單體以相 對於另一單體之不超過約20%的莫耳超額量,且較佳地小 於約10%之莫耳超額量存在於反應混合物中,或其中一單 體以不超過約5%之莫耳超額量而存在於反應混合物中。在 其他情況中,單體將以變動小於1%之莫耳超額量的量而存 在。 可使用諸如甲胺之烷基伯胺作為鏈終止劑。亦可使用第 一單胺以對聚砜醚醯亞胺進行封端或鏈終止(例如)從而控 118322.doc -63- 200832839 制分子量。在^實施财,$_單胺包㈣ 其說明性實例包含苯胺、環苯胺、全氟 早胺, 其類似物。芳族第一單胺 土 女、奈胺及 弟早胺可具有與芳環結合之額外官At 基:諸如(但不限於)芳基、烧基、芳基絲、魏、西旨1 醯:基其函素、“烧基或芳基、烧基喊基‘ 芳基酮基。附著之官台t Α π處k 考之s此基不應妨礙芳族第一單胺 醚醯亞胺分子量之官能。入、sf J t風 s犯合適早胺化合物列於美國專利第 6,919,422號中。 β寻〜弟 Ο Ο 亦可使用係包含一環肝其夕^ -土之方基的方族二羧酸酐來控制 聚醢亞胺颯十之分子量。說明性實例包含苯二甲酸酐、妳 取代之苯二甲酸軒(諸如氯苯二甲酸酐)及其類似物。該等酐 類物質可具有與芳環結合之額外官能基,其說明性實例包 含上文關於芳族第一單胺而描述之官能基。 在二&amp;况中,具有低含量之異亞烧鍵的聚颯醚醯亞胺 可為所要的。咸信在一些PAEK.合物中,異亞烷鍵之存在 可促進可混溶性,此可降低高溫下之承載能力且為不合需 要的。具有含異亞烷之聚合物的可混溶pEEK摻合物描述於 (例如)美國專利第5,〇79,3〇9號及第5,171,796號中。在一些 月、兄中低含里之亞異烧基可意謂小於30莫耳%之聚石風驗 酿亞胺鍵將含有亞異烷基,在其他情況中,聚颯醚醯亞胺 鍵將含有小於20莫耳%之亞異烷基。在其他情況中,小於 1〇莫耳%之亞異烷基將存在於聚砜醚醯亞胺鍵中。NH〇 η2ν (XVII) Aromatic amines include, but are not limited to, for example, diaminodiphenyl sulfone (DDS) and bis(indolylphenoxyphenyl) sulfone (BAPS). The polyoxyether brewing imine can be produced by using the oxydiphenyl anhydride described above to form a polyamidene bond by reaction with an aryldiamine sulfone. In some embodiments, a poly(decyl ether imino) resin can be prepared by reacting an aromatic dianhydride monomer (or an aromatic bis(ether anhydride) monomer) with an organic diamine monomer, wherein the two monomers are in essence Exist in the amount of the molar amount, or one of the monomers is present in the reaction mixture in a molar excess of no more than about 20% molar excess, and preferably less than about 10%, relative to the other monomer. One or one of the monomers is present in the reaction mixture in a molar excess of no more than about 5%. In other cases, the monomer will be present in an amount that is less than 1% of the molar excess. A primary alkylamine such as methylamine can be used as the chain terminator. The first monoamine can also be used to cap or chain terminate the polysulfone ether imine (for example) to control the molecular weight of 118322.doc -63 - 200832839. In the implementation, $_monoamine package (iv) illustrative examples thereof include aniline, cycloaniline, perfluoro early amine, analogs thereof. The aromatic first monoamine female, natriuretic and early amine may have additional official At groups bonded to the aromatic ring: such as, but not limited to, aryl, alkyl, aryl, wei, xi, 1 醯: Basic element, "alkyl or aryl, alkyl aryl" aryl ketone group. Attached to the official table t Α π k test s this base should not hinder the molecular weight of the aromatic first monoamine ether imine The function of the sf J t wind s is suitable for the early amine compound listed in U.S. Patent No. 6,919,422. β 寻 Ο Ο Ο Ο 亦可 can also use the family of dicarboxylic acid containing a ring of liver and its base An acid anhydride is used to control the molecular weight of the polyimine oxime. Illustrative examples include phthalic anhydride, hydrazine-substituted phthalic acid (such as chlorophthalic anhydride) and the like. The anhydrides may have an aromatic Additional functional groups to which the ring is bonded, illustrative examples of which include the functional groups described above with respect to the aromatic first monoamine. In the second &amp; condition, polyethylidene iodide having a low content of iso-firing bonds may be In some PAEK. compounds, the presence of iso-alkylene bonds promotes miscibility, which reduces the high temperature. Carrying capacity and being undesirable. Miscible pEEK blends having a polymer containing an isoalkylene are described, for example, in U.S. Patent Nos. 5,79,3,9 and 5,171,796. In some months, the sub-alkali group in the lower middle of the brother may mean that less than 30 mol% of the polyglycolic imine bond will contain an isoalkylene group, and in other cases, polyetheretherimine The bond will contain less than 20 mole % of the iso-isoalkyl group. In other cases, less than 1 mole % of the iso-isoalkyl group will be present in the polysulfone ether oxime bond.

聚石風醚醯亞胺可具有約0.1至約10克每分鐘(g/min)之熔 融指數’如由美國材料試驗學會(AStm)D1238於340-425°C 118322.doc -64 - 200832839 量測。在一實施例中,聚砜醚醯亞胺樹脂具有約10,000至 約150,000克每莫耳(§/111〇1幻之重量平均分子量(^〜),如使 用聚苯乙烯標準藉由凝膠滲透層析而量測。在另一實施例 中,聚砜醚醯亞胺具有20,000至60,000 g/mole之Mw。一些 聚鱗醯亞胺之實例列於ASTM D5205 &quot;StandardThe polysalt ether iodide may have a melt index of from about 0.1 to about 10 grams per minute (g/min) as measured by the American Society for Testing and Materials (AStm) D1238 at 340-425 ° C 118322.doc -64 - 200832839 Measurement. In one embodiment, the polysulfone ether quinone imide resin has a weight average molecular weight (^~) of from about 10,000 to about 150,000 grams per mole (§/111〇1 phantom, such as penetration by gel using polystyrene standards) In another embodiment, the polysulfone ether imine has an Mw of 20,000 to 60,000 g/mole. Some examples of polysinoin are listed in ASTM D5205 &quot;Standard

Classification System for Polyetherimide(PEI) Materials&quot; 中。Classification System for Polyetherimide (PEI) Materials&quot;

ϋ 在 i丨月況中(尤其當薄膜及纖維之形成為所要的時),組 合物應本質上無諸如玻璃、碳、陶瓷或金屬纖維之纖維強 化物。本質上無在一些情況中意謂整個組合物的小於5重量 °/〇。在其他情況中,組合物應具有小於1重量%之存在之纖 維強化物。 在其他情況中,具有在冷卻時逐漸獲得某一結晶度之組 合物為有用的。此在諸如纖維及薄膜的具有較高表面積之 物品中可更為重要,料物品將歸因於其較高表面積而迅 ,冷卻且可能不會達到對於獲得最佳性能所必要之充分結 晶性:在-些情況中’結晶性之形成反映於結晶溫度㈣, 其可错由諸如差示掃描熱量測定(Dsc)之方法(例如,咖m ΓΓΓΓ測。可量測結晶之最大速率的溫度作為 可需要呈;如在_min之冷卻速率的情況下), :: 二 約24°。咖。在其他情況η例如 和酿之杈慢冷卻速率),大於或等於約 (」 可為所要的。 υ之釔晶溫度 在一些情況中,組合物脾且 物將具有至少兩個不同破璃轉移溫 H8322.doc -65- 200832839 度(Tg) ’ 一來自PAEK樹脂或部分可混溶之PAEK摻合物的第 一 Tg及與聚砜醚醯亞胺樹脂或該樹脂居支配地位之混合物 相關聯的第二Tg。可藉由諸如DSC或動態機械分析法 (DMA)之任一習知方法來量測此等玻璃轉移溫度(丁幻。在一 些情況中,第一U可為約12〇至約2〇〇°C且第二Tg可為約240 至約350°C。在其他情況中,具有約28〇至約35(rCi甚至更 咼的第一 Tg可為有用的。在一些情況中,視摻合物之特定 树爿曰、分子S及組成而定,Tg可不同或者轉移可部分重疊。 在另一實施例中,聚砜醚醯亞胺PEAK摻合物在380°C將 具有約200帕斯卡秒至約1〇,〇〇〇帕斯卡秒(pa_s)之熔融黏 度,如藉由ASTM方法D3835使用毛細管流變儀以1〇〇至 loooo i/sec之剪切速率而量測。在38(rc具有約2〇〇帕斯卡 秒至約10,000帕斯卡秒之熔融黏度的樹脂摻合物將允許組 合物更易於藉由使用熔融加工技術而形成為物品。在其他 情況中,約200至約5,000 Pa_s之較低熔融黏度將為有用的。 I) 熔融加工之另一態樣(尤其在本文所述之PAEK-聚砜醚醯 亞胺組合物所需之高溫下)為組合物之熔融黏度在模製或 擠壓過程期間不經受過度改變。一量測熔融穩定性之方法 為使用平行板流變儀檢查黏度在例如38(rc之處理溫度下 隨時間之改變。在一些情況中,在保持於適當溫度歷時大 於或等於約1 0分鐘之後應保留初始黏度之大於或等於約 50%。在其他情況中,歷時至少約1〇分鐘之熔融黏度改變 應小於初始值之約35%。可在熔融組合物且使其平均之後i 至5刀鐘里測初始熔融黏度值。在向樣本施加熱之後通常於 118322.doc -66· 200832839 量測(記錄)黏度之前等待1 -5分鐘以確保樣本完全熔融且平 均。量測熔融黏度與時間之關係的合適方法為(例如)astm 方法D4440。注意可以泊(P)或帕斯卡秒(pa_s)來報告熔融黏 度;1 Pa-s = 10 P。 C. 共聚醚醯亞胺 有用聚合物亦可包括具有大於或等於約2l8〇c之玻璃轉 移溫度的共聚醚醯亞胺之共聚物,該共聚醚醯亞胺包含式 ⑴及(II)之結構單元: Ο组 In the case of the month (especially when film and fiber formation are desired), the composition should be essentially free of fiber reinforcements such as glass, carbon, ceramic or metal fibers. Essentially, in some cases it means less than 5 wt/〇 of the entire composition. In other instances, the composition should have less than 1% by weight of the fiber reinforcement present. In other cases, it is useful to have a composition that gradually gains a certain degree of crystallinity upon cooling. This may be more important in articles with higher surface areas such as fibers and films, which will be attributed to their higher surface area, cool, and may not achieve sufficient crystallinity necessary for optimum performance: In some cases, the formation of 'crystallinity' is reflected in the crystallization temperature (4), which can be erroneously determined by a method such as differential scanning calorimetry (Dsc) (for example, the temperature of the maximum rate of crystallization can be measured as Need to be presented; as in the case of a cooling rate of _min), :: 2 about 24°. coffee. In other cases η, for example, and the slow cooling rate of the brewing, greater than or equal to about (" may be desirable. 钇 钇 温度 温度 在 在 在 在 在 在 在 一些 一些 一些 组合 组合 组合 组合 组合 组合 组合 组合 组合 组合 组合 组合H8322.doc -65- 200832839 degrees (Tg) ' a first Tg from a PAEK resin or a partially miscible PAEK blend and associated with a polysulfone ether quinone imine resin or a mixture of the resins Second Tg. These glass transition temperatures can be measured by any conventional method such as DSC or Dynamic Mechanical Analysis (DMA). In some cases, the first U can be from about 12 Torr to about 2 〇〇 ° C and the second Tg may be from about 240 to about 350 ° C. In other cases, having a first Tg of about 28 〇 to about 35 (rCi or even more 可 may be useful. In some cases, Depending on the particular tree 爿曰, molecule S and composition of the blend, the Tg may be different or the transfer may partially overlap. In another embodiment, the polysulfone ether quinone imine PEAK blend will have about 380 ° C. 200 Pascal seconds to about 1 〇, 熔融 Pascal seconds (pa_s) melt viscosity, as by ASTM method D3835 The capillary rheometer is measured at a shear rate of 1 Torr to loooo i/sec. A resin blend at 38 (rc having a melt viscosity of about 2 〇〇 Pascal seconds to about 10,000 Pascal seconds will allow the composition to be more It is easy to form into articles by using melt processing techniques. In other cases, a lower melt viscosity of from about 200 to about 5,000 Pa_s would be useful. I) Another aspect of melt processing (especially PAEK described herein) - The high temperature required for the polysulfone ether quinone imine composition) is such that the melt viscosity of the composition is not subject to excessive changes during the molding or extrusion process. A method for measuring melt stability is to use a parallel plate rheometer The viscosity changes over time at, for example, 38 (the processing temperature of rc. In some cases, the initial viscosity should be retained greater than or equal to about 50% after being held at the appropriate temperature for greater than or equal to about 10 minutes. In other cases The change in melt viscosity for at least about 1 minute should be less than about 35% of the initial value. The initial melt viscosity value can be measured after melting the composition and averaging it from i to 5 knives. 118322.doc -66· 200832839 Wait 1-5 minutes before measuring (recording) viscosity to ensure that the sample is completely melted and averaged. A suitable method for measuring the relationship between melt viscosity and time is (for example) astm method D4440. Note that it can be moored ( P) or Pascal seconds (pa_s) to report the melt viscosity; 1 Pa-s = 10 P. C. The copolyether sulfimine useful polymer may also include a copolyether having a glass transition temperature of greater than or equal to about 21.8 cm. a copolymer of imines comprising the structural units of the formulae (1) and (II): Ο

Ο 及視情況,式(III)之結構單元:Ο and depending on the situation, the structural unit of formula (III):

其中R1包含未經取代之C6_22二價芳族烴或包含鹵素或烷基 取代基或該等取代基之混合物的經取代之c6-22二價芳族 118322.doc -67- 200832839 烴;或通式(ιν)之二價基:Wherein R1 comprises an unsubstituted C6_22 divalent aromatic hydrocarbon or a substituted c6-22 divalent aromatic 118322.doc-67-200832839 hydrocarbon comprising a halogen or alkyl substituent or a mixture of such substituents; The divalent group of the formula (ιν):

(IV) 其中關於該芳環之未指定位置異構體為Q之間位或對位,且 Q為共Ί貝鍵、-C(CH3)2或由式(V)組成之群中選出之成員: (V) \\ I Γ _〇-,各,一c一 ,—S— ,—c— 5(IV) wherein the undesired positional isomer of the aromatic ring is Q or the para position, and Q is a co-mussel bond, -C(CH3)2 or a group consisting of formula (V) Members: (V) \\ I Γ _〇-, each, one c one, —S—, —c— 5

II I 〇 0 cf3 及伸烷基或亞烷基,其具有式’CyHh,其中y為具有值1至約 5之整數,且R2為二價芳基;式⑴之單元與式(η)之單元之 重量比在約99.9:0.1與約25:75之範圍中。以BruneUe等人之 名義於2005年2月l日頒佈的題為,,CQPOLYETl·lERI]V[IDESπ 之美國專利弟6,849,706號(其全文如充分陳述一般以引用 的方式倂入本文中)中更充分地討論具有此等元素之共聚 物。 〇 Ε·對摻合物之其他添加物 除了摻合物之聚合物組份,可添加其他有益組合物以產 生改良製品。熟練技工將瞭解可向聚合物添加寬廣範圍之 成份以改良一或多個製造或效能性能。 在一些情況中,可向本發明之聚合物添加金屬氧化物。 在一些情況中,金屬氧化物可藉由減少熱釋放及增加至峰 值熱釋放之時間而進一步改良耐燃性_效能。二氧化鈦 為重要的。其他金屬氧化物包括氧化辞、三氧化二棚、氧 化錄、氧化鐵及過渡金屬氧化物。在一些情況中,白色之 118322.doc -68- 200832839 金屬氧化物可為所要的。金屬氧化物可單獨使用戋與其 金屬氧化物組合使用。可以任何有效量使用金屬氧化物 在一些情況中為聚合物掺合物之自0·01至約20重量〇/〇。 其他有用添加物包括煙霧抑制劑,諸如金屬硼酸鹽(例 如,硼酸辞)、鹼金屬或鹼土金屬硼酸或其他硼酸鹽。另外, 含硼化合物之其他如硼酸、硼酸酯、氧化硼或硼之其他氧 化合物可為有用的。另外,可使用其他阻燃添加物,諸如 磷酸芳基酯及溴化芳族化合物,包括含有由溴化芳基化合 物製成之鍵的聚合物。齒化芳族化合物之實例為溴化苯氧 基樹脂、i化聚苯乙晞、i化醯亞胺、溴化聚碳酸酯、溴 化環氧樹脂及其混合物。 亦可使用例如磷酸酯、磺酸鹽及鹵化芳族化合物之習知 阻燃添加物。亦可使用此等阻燃物之任一者或全部之混合 物。_化芳族化合物之實例為溴化苯氧基樹脂、_化聚苯 乙烯、齒化醯亞胺、溴化聚碳酸酯、溴化環氧樹脂及其混 合物。磺酸鹽之實例為全氟丁烷磺酸鉀、甲苯磺酸鈉、苯 磺酸鈉、二氣苯磺酸鈉、二苯砜磺酸鉀及曱烷磺酸鈉。在 些h況中’驗及驗土金屬之石黃酸鹽為較佳的。鱗酸g旨阻 燃物之實例為磷酸三芳基酯、磷酸三曱苯酯、磷酸三苯酯、 雙酚A苯基二磷酸酯、間苯二酚苯基二填酸酯、苯基-雙 -(3,5,5’-磷酸三曱基己酯)、磷酸乙基二苯酯、雙(2-乙基己 基l·對-磷酸甲苯_、雙(2-乙基己基)_磷酸苯酯、磷酸三壬 基笨酉旨、石粦酸本基曱基氫_、二(十二烧基)_對-石粦酸甲苯 酯、鹵化磷酸三苯酯、磷酸二丁基苯酯、2 —磷酸氯乙基二 H8322.doc -69- 200832839 笨酉曰雙(2,5,5’-二甲基己基)麟酸對甲苯酯、2-碟酸乙基己 基二苯酯、磷酸二苯基氫酯、間苯二酚二磷酸酯及其類似 物。在一些情況中,可能需要具有本質上無_素原子,尤 其溴及氯之阻燃組合物。本質上無鹵素原子意謂在一些實 施例中,組合物具有以組合物之重量計小於約3%之齒素, 且在其他實施例中以組合物之重量計小於約1%含有鹵素 原子。卣素原子之量可由普通化學分析判定。組合物亦可 〇 視情況包括以組合物之重量計0.01至約5.0%含氣聚合物之 量的含氟聚合物。可以對於向樹脂組合物提供抗滴性能為 有放的任何里使用含氟聚合物。合適含氟聚合物及用於製 仏4等含氟聚合物之方法的一些可能實例陳述於(例如)美 國專利第3,671,487號、第3,723,373號及第3,383,092號中。 合適含氟聚合物包括包含由一或多個氟化α_烯烴單體所衍 生之結構單元的均聚物及共聚物。術語,,氟化α-烯烴單體,, 意謂包括至少一氟原子取代基之心烯烴單體。合適氟化心 Q 烯烴單體中之一些包括(例如)諸如cf2=cf2、chf=cf2、 CHfCF2及CHfCHF之氟乙烯及諸如CF3CF=CF2、 cf3cf=chf、cf3ch=cf2、Cf3CH=CH2、CF3CF=CHF、 chf2ch=chf及 cf3cf=ch2之氟丙烯。 合適氟化α-烯烴共聚物中之一些包括包含由兩個或兩個 以上氟化α-烯烴單體所衍生之結構單元之共聚物(例如,聚 (四氟乙烯-六氟乙烯))及包含由一或多個氟化單體及可與 氟化單體共聚的一或多個非氟化單烯鍵式不飽和單體所衍 生之結構單元之共聚物(例如聚(四氟乙烯·伸乙基-丙烯)共 118322.doc -70- 200832839 聚物)。合適非氟化單烯鍵式不飽和單體包括(例如)諸如乙 稀丙稀丁烯之α稀垣單體,諸如甲基丙婦酸甲醋、丙 烯酸丁酯之丙烯酸酯單體及其類似物,其中聚(四氟乙烯) 均聚物(PTFE)為較佳的。 4 ΰ物可it步§有填料及強化物,例如纖維玻璃、磨 製玻璃、玻璃微珠、石卒Η β甘# , λ, τ片及其類似物。可添加諸如滑石、II I 〇0 cf3 and an alkylene or alkylene group having the formula 'CyHh, wherein y is an integer having a value of from 1 to about 5, and R 2 is a divalent aryl group; a unit of the formula (1) and a formula (η) The weight ratio of the units is in the range of about 99.9:0.1 and about 25:75. In the name of Brune Ue et al., issued on February 1, 2005, CQPOLYETl·lERI]V [IDESπ, US Patent No. 6,849,706 (the full text of which is incorporated herein by reference in its entirety) Copolymers having such elements are fully discussed.添加 Ε·Additional Additives to Blends In addition to the polymer component of the blend, other benefit compositions may be added to produce improved articles. Skilled artisans will appreciate that a wide range of ingredients can be added to the polymer to improve one or more manufacturing or performance properties. In some cases, a metal oxide can be added to the polymer of the present invention. In some cases, metal oxides can further improve flame resistance by reducing heat release and increasing the time to peak heat release. Titanium dioxide is important. Other metal oxides include oxidized, oxidized, oxidized, iron oxide, and transition metal oxides. In some cases, white 118322.doc -68-200832839 metal oxides may be desirable. Metal oxides can be used alone in combination with their metal oxides. The metal oxide can be used in any effective amount, in some cases from 0. 01 to about 20 weight 〇/〇 of the polymer blend. Other useful additives include aerosol inhibitors such as metal borate (e.g., boric acid), alkali metal or alkaline earth metal boric acid or other borate salts. In addition, other oxygen-containing compounds such as boric acid, boric acid ester, boron oxide or boron may be useful as the boron-containing compound. In addition, other flame retardant additives may be used, such as aryl phosphates and brominated aromatic compounds, including polymers containing bonds made from brominated aryl compounds. Examples of the toothed aromatic compound are brominated phenoxy resin, i-polystyrene, imide, brominated polycarbonate, brominated epoxy, and mixtures thereof. Conventional flame retardant additives such as phosphates, sulfonates and halogenated aromatic compounds can also be used. Mixtures of any or all of these flame retardants can also be used. Examples of the aromatic compound are a brominated phenoxy resin, a polyphenylene styrene, a dentate quinone imide, a brominated polycarbonate, a brominated epoxy resin, and a mixture thereof. Examples of the sulfonate are potassium perfluorobutane sulfonate, sodium toluene sulfonate, sodium benzene sulfonate, sodium dibenzene sulfonate, potassium diphenyl sulfone sulfonate and sodium decane sulfonate. In some cases, the metallite salt of the soil tester is preferred. Examples of sulphuric acid-based flame retardants are triaryl phosphate, tridecyl phenyl phosphate, triphenyl phosphate, bisphenol A phenyl diphosphate, resorcinol phenyl di-perlate, phenyl-double -(3,5,5'-tridecylhexyl phosphate), ethyl diphenyl phosphate, bis(2-ethylhexyl l·p-toluene phosphate, bis(2-ethylhexyl)-phosphate benzene Ester, tris-phosphonium phosphate, rhodamine-based fluorenyl-hydrogen_, bis(d-decyl)-p-toluene toluene, halogenated triphenyl phosphate, dibutylphenyl phosphate, 2 - chloroethyl phosphate II H8322.doc -69- 200832839 Alum (2,5,5'-dimethylhexyl) linolenic acid p-tolyl ester, 2-disc ethylhexyl diphenyl ester, diphenyl phosphate Base hydrogen esters, resorcinol diphosphates and the like. In some cases, flame retardant compositions having essentially no atomic atoms, especially bromine and chlorine, may be required. Essentially halogen free atoms are meant to be In embodiments, the composition has less than about 3% dentate by weight of the composition, and in other embodiments less than about 1% by weight of the composition contains a halogen atom. It is judged by ordinary chemical analysis. The composition may also include, in the case of a fluoropolymer, an amount of from 0.01 to about 5.0% by weight of the composition of the gas-containing polymer, depending on the case, which may be provided for providing the resin composition with anti-drip properties. Fluoropolymers are used in any of the following. Some possible examples of suitable fluoropolymers and methods for making fluoropolymers such as ruthenium 4 are disclosed in, for example, U.S. Patent Nos. 3,671,487, 3,723,373 and 3,383,092. Suitable fluoropolymers include homopolymers and copolymers comprising structural units derived from one or more fluorinated alpha olefin monomers. The term, fluorinated alpha olefin monomer, is meant to include At least one fluorine atom substituent oxene monomer. Some of the suitable fluorinated Q olefin monomers include, for example, fluoroethylene such as cf2 = cf2, chf = cf2, CHfCF2 and CHfCHF and such as CF3CF = CF2, cf3cf = Fluoropropene of chf, cf3ch=cf2, Cf3CH=CH2, CF3CF=CHF, chf2ch=chf and cf3cf=ch2. Some of the suitable fluorinated alpha-olefin copolymers include two or more fluorinated alpha-olefins Copolymerization of structural units derived from monomers (eg, poly(tetrafluoroethylene-hexafluoroethylene)) and comprising one or more non-fluorinated monoethylenically unsaturated monomers copolymerized with one or more fluorinated monomers and copolymerizable with fluorinated monomers Copolymers of derived structural units (e.g., poly(tetrafluoroethylene·extended ethyl-propylene) total 118322.doc -70-200832839). Suitable non-fluorinated monoethylenically unsaturated monomers include, for example, such as Ethylene propylene oxide, such as methacrylic acid methyl vinegar, butyl acrylate acrylate monomer and the like, wherein poly(tetrafluoroethylene) homopolymer (PTFE) is Good. 4 ΰ 可 § § § There are fillers and reinforcements, such as fiber glass, ground glass, glass beads, stone Η β Gan #, λ, τ tablets and their analogues. Can add such as talc,

Ο 矽灰石、雲母、高嶺土或微晶高嶺石黏土、矽石、石英及 重曰曰石之礦4匆。亦彳以有效量的諸如碳纖維及碳奈米管、 至屬纖維、金屬粉末、導電碳及包括奈米級強化物之其他 添加物之無機填料對組合物進行改質。可使用熟練技工已 头可‘電之其他填料以使本發明之連接器提供遮蔽。 其他添加物包括諸如亞磷酸鹽、亞膦酸二酯及位阻酚之 抗氧化劑。包括亞磷酸三芳基酯及磷酸芳基酯之含磷穩定 劑為重要的有用添加物。亦可使用含雙官能磷之化合物。 具有大於或等於約300之分子量的穩定劑為較佳的。在其他 中〃、有大於或荨於約5 0 0之分子量的含麟穩定劑為有 用的。含磷穩定劑通常以調配物之0.05-0.5重量%而存在於 組合物中。著色劑以及光穩定劑及UV吸附劑亦可存在於摻 合物中。亦涵蓋助流劑及脫模化合物。脫模劑之實例為烷 基缓酸醋’例如異戊四醇四硬脂酸酯、甘油三硬脂酸酯及 乙一®予一硬脂酸酯。脫模劑通常以調配物之0.05-0.5重量% 而存在於組合物中。較佳脫模劑將具有通常大於約3〇〇之較 回刀子ϊ以防止脫模劑在熔融處理期間自熔融聚合物混合 物的損失。 H8322.doc -71 - 200832839 、用於根據本發明之物品中的聚合物摻合物亦可包括各種 添加物,諸如晶核生成、澄清、硬度及/或結晶速率劑。此 等劑以習知方式且以習知量而使用。 3·用於製造根據本發明之摻合物之方法 #用於根據本發明之物品中的聚合物摻合物可與前述成份 藉由多種方法而摻合,該等方法涉及具有調配物中所要的 任何額外添加物之材料之精細混雜。較佳程序包括熔融摻 〇 纟’但溶液摻合亦為可能。由於熔融摻合裝備在商用聚合 物處理叹&amp;中之可用性,因此炼融處理方法—般為較佳 的,亥等溶融處理方法中所使用之裝備之說明性實例包 括·共旋轉及對旋轉擠壓冑、單螺桿擠壓冑、共捏合機、 盤式充填處理裔及各種其他類型之擠壓裝備。較佳地最小 化當則製程中溶融之溫度以避免樹脂之過度降解。在一些 實施例中,經溶融處理之組合物經由模中之小出口孔而離 開諸如擠壓機之處理裝備,且溶融樹脂之所得股線藉由將 〇 該等股線穿過水浴而得以冷卻。可將冷卻之股線切碎及/或 模製為任何合宜形狀(亦即顆粒)以用於封裝、進—步處理或 為了最終用途生產之簡易性。 可藉由多種熔融摻合技術來製備本文討論之摻合物。具 有良好心合螺桿之真空通風單螺桿或雙螺桿擠壓機的使用 為較佳的。一般而言,該擠壓機應運轉於之熔融處理溫度 比,'、、塑塑膝之Tg网約1〇〇 c至約15〇。〇。彳使用個別饋料器 或作為混合物於擠壓機之進料口共同饋入成份之混合物°。 在-些情況中(例如在兩種或兩種以上樹脂之播合物中),首 118322.doc -72- 200832839 先在第-次擠壓中擠壓成份之一部分且接著在第二次_ 中添加=合物之剩餘部分可為有利的。首先將著色劑預化 。為;辰纟ΙΜ炱將其與樹脂組合物之剩餘部#混合可為 有用的。在其他情形中,自播遂機進料口進一步下游地添 加混合物之部分可為有益的。在擠屢之後,在將聚合物炫 體切碎或分割為適當大小之顆粒用於下一製造步驟之前對 其進打絞合及冷卻。較佳顆粒為大約1/16至1/8英时長,但 熟練技工將瞭解任何顆粒大小將為適合的。㈣㈣㈣ 化之熱塑樹脂以移除水且將其模製為本發明之物品。於約 135。。至約15(TC乾燥約4至約8小時為較㈣,但乾燥時間 將隨樹脂類型而變化。射出成形較佳地使用合適溫度、壓 力及夾持以產生具有光澤表面之物品。用於模製之熔融溫 度將為樹脂之Tg以上的約1〇吖至約赋。油熱模對於較 心之樹脂為較佳的’模製溫度可在自約坑至㈣代之 範圍内’其至約17代之溫度為較佳的。熟練技 Ο 工將瞭解,可使用此等化合及模製條件之許多變化來製造 本發明之組合物及物品。 亦可將根據本發明之聚合物摻合物成形或製造為彈性薄 f:·塗層、薄片、條帶、帶、條及其類似物。可藉由此項 :術中已知的任何方法來製造本發明之彈性薄膜 薄片,包括吹泡製程起泡職雙㈣向技術,諸 2集起泡、雙重起泡及拉幅成框)、鑄擠、射 熱成形製程、擠壓塗覆製程、型面擠出及薄片擠壓製程。 熟練技工熟知壓縮&amp; &quot; ^,其中將聚合物摻合物置放於模 118322.doc -73- 200832839 Γ4 4 ash of limestone, mica, kaolin or microcrystalline kaolinite clay, vermiculite, quartz and heavy meteorite. The composition is also modified with an effective amount of an inorganic filler such as carbon fiber and carbon nanotubes, genus fibers, metal powder, conductive carbon, and other additives including nanoscale reinforcements. Other fillers that are skilled in the art can be used to provide shielding for the connector of the present invention. Other additives include antioxidants such as phosphites, phosphite diesters and hindered phenols. Phosphorus-containing stabilizers including triaryl phosphites and aryl phosphates are important useful additives. Compounds containing difunctional phosphorus can also be used. Stabilizers having a molecular weight greater than or equal to about 300 are preferred. It is useful to use a lining stabilizer having a molecular weight greater than or equal to about 50,000 in other intermediates. The phosphorus-containing stabilizer is usually present in the composition in an amount of from 0.05 to 0.5% by weight of the formulation. Colorants as well as light stabilizers and UV adsorbents may also be present in the blend. Glidants and mold release compounds are also included. Examples of the release agent are alkyl oleic acid acetonate such as pentaerythritol tetrastearate, glyceryl tristearate and ethyl sulphate monostearate. The release agent is typically present in the composition at 0.05 to 0.5% by weight of the formulation. Preferably, the release agent will have a relatively large amount of knives, typically greater than about 3 Torr, to prevent loss of the release polymer from the molten polymer mixture during the melt processing. H8322.doc -71 - 200832839, polymer blends for use in articles according to the invention may also include various additives such as nucleation, clarification, hardness and/or crystallization rate agents. These agents are used in a conventional manner and in a conventional amount. 3. Method for the manufacture of a blend according to the invention #The polymer blend used in the article according to the invention may be blended with the aforementioned ingredients by a plurality of methods, the methods involved in having a formulation A fine mix of materials for any additional additives. Preferred procedures include melt doping 纟' but solution blending is also possible. Because of the availability of melt blending equipment in commercial polymer processing, the smelting process is generally preferred, and illustrative examples of equipment used in the melt processing methods include co-rotation and counter-rotation. Extrusion crucibles, single-screw extrusion crucibles, co-kneaders, disc-filling treatments, and various other types of extrusion equipment. It is preferred to minimize the temperature of the melt during the process to avoid excessive degradation of the resin. In some embodiments, the melt treated composition exits processing equipment such as an extruder through a small exit orifice in the mold, and the resulting strand of molten resin is cooled by passing the strands through a water bath . The cooled strands can be chopped and/or molded into any suitable shape (i.e., granules) for ease of packaging, further processing, or for end use production. The blends discussed herein can be prepared by a variety of melt blending techniques. The use of a vacuum-ventilated single-screw or twin-screw extruder with a good-fit screw is preferred. In general, the extruder should be operated at a melt processing temperature ratio of ', and the plastic TK net is about 1 〇〇 c to about 15 〇. Hey.共同 Use a separate feeder or as a mixture to feed the mixture of ingredients in the feed port of the extruder. In some cases (for example, in a mixture of two or more resins), the first 118322.doc -72-200832839 first squeezes one part of the component in the first extrusion and then the second time_ It may be advantageous to add the remainder of the compound. The colorant is first pre-formed. It may be useful to mix it with the remainder of the resin composition. In other cases, it may be beneficial to add a portion of the mixture further downstream of the feed opening of the rake machine. After the extrusion, the polymer bristles are chopped or divided into appropriately sized granules which are stranded and cooled prior to use in the next manufacturing step. Preferred particles are from about 1/16 to 1/8 inch length, but the skilled artisan will appreciate that any particle size will be suitable. (d) (iv) (iv) A thermoplastic resin to remove water and mold it into the article of the present invention. About 135. . To about 15 (TC drying for about 4 to about 8 hours is more than (4), but the drying time will vary depending on the type of resin. Injection molding preferably uses suitable temperature, pressure and clamping to produce an article with a glossy surface. The melting temperature will be from about 1 Torr to about the Tg of the resin. The oil hot mold is preferred for the core resin. The molding temperature can range from about pit to (four) generation to about Temperatures of the 17th generation are preferred. It will be appreciated by those skilled in the art that many variations of such compounds and molding conditions can be used to make the compositions and articles of the present invention. Polymer blends in accordance with the present invention can also be used. Formed or manufactured as an elastic thin f: · coating, sheet, strip, tape, strip and the like. The elastic film sheet of the present invention can be produced by any method known in the art, including a blowing process Foaming double (four) to technology, two sets of foaming, double foaming and tentering frame), casting, hot forming process, extrusion coating process, profile extrusion and sheet extrusion process. The skilled artisan is well aware of compression &amp;&quot; ^, in which the polymer blend is placed in the mold 118322.doc -73- 200832839 Γ

U 穴中或與波狀金屬表面接觸。接著將藉由(心__以 之熱及/或麼力施加至聚合物摻合物達到給定時間、遂力及 溫度,其中該等條件視摻合物之性質而為可變化的。來自 模製工具之壓力迫使聚合物推合物填充整個模穴。一旦經 模製之物品經冷卻,即可藉由推出機構之辅助而將其自^ 移除。在製程完成後,聚合物摻合物即已採取模穴或波狀 金屬表面之形式。料Visamara之美國專利第4,698,〇〇ι號 揭不執行壓縮模製之方法。 射出成形為製造非加強型熱塑零件之最普遍方法,且亦 普遍用於短纖維加強型熱塑複合物。可使用射出成形以產 生根據本發明之物品。射出成形為一製程,其中在加熱腔 室中將係對於製造物品為必要之量之數倍的量之聚合物播 合物加熱為黏性液體且接著在麼力下將其射入模穴中。聚 合物摻合物在模穴中仍處於高麼下直至其冷卻且接著被移 除為止。射出成形及射出成形裝置進一步詳細地討論於頒 予Hujick之美國專利第3,915,6〇8號、頒予之第 3,3〇2,243號及頒予Lameris之第⑵七州號中。射出成形一 叙用於諸如 &gt;气車及消費型產品之大體積應用。循環時間在 20與60秒之間變化。射出成形亦產生高可重複近淨形零 件。圍繞插入物、孔洞及核心材料之模製的能力為另一優 ^熟練技卫將知曉射出成形是否為產生根據本發明之二 定物品的最佳特定處理方法。 堃為用於中空熱塑產品之產生之技術。吹塑涉及將根 康本么明之熱塑聚合物之擠製管置放於模中及對管之内部 H8322.doc -74- 200832839 施加充足氣壓以使管之外部符合模穴之内表面。美國專利 第5,5 5 1,860號進一步詳細地描述執行吹塑以產生製品之方 法。吹塑不限於產生中空物件。舉例而言,可藉由吹成一 單元且接著將該單元切為兩半從而產生兩個外殼來製造,,外 殼π。簡單吹製氣泡薄膜製程亦得以描述,(例如)描述於In the U hole or in contact with the corrugated metal surface. It will then be applied to the polymer blend by means of a heat and/or force to achieve a given time, force and temperature, wherein the conditions are variable depending on the nature of the blend. The pressure of the molding tool forces the polymer conjugate to fill the entire cavity. Once the molded article is cooled, it can be removed by the aid of the ejection mechanism. After the process is completed, the polymer is blended. The material has been in the form of a cavity or a corrugated metal surface. The method of compression molding is not disclosed in U.S. Patent No. 4,698, the entire disclosure of which is incorporated herein by reference. Also commonly used in short fiber reinforced thermoplastic composites. Injection molding can be used to produce articles according to the present invention. Injection molding is a process in which the heating chamber is several times the amount necessary to manufacture the article. The amount of polymer admixture is heated to a viscous liquid and then injected into the cavity under force. The polymer blend remains high in the cavity until it cools and is then removed Injection molding and injection The forming apparatus is discussed in further detail in U.S. Patent Nos. 3,915,6,8, issued to Hujick, issued No. 3,3,2,243, and to the No. 2 (2) issued to Lameris. &gt; Large volume applications for gas and consumer products. The cycle time varies between 20 and 60 seconds. Injection molding also produces highly repeatable near-net shape parts. The ability to mold around inserts, holes and core materials is Another skilled skill will know whether injection molding is the best specific treatment for producing a second item according to the present invention. 堃 is a technique for the production of hollow thermoplastic products. Blowing involves the roots of Genkun The extruded tube of thermoplastic polymer is placed in the mold and sufficient air pressure is applied to the interior of the tube H8322.doc-74-200832839 to conform the exterior of the tube to the inner surface of the cavity. U.S. Patent No. 5,5 5 1,860 The method of performing blow molding to produce an article is described in further detail. Blow molding is not limited to producing a hollow article. For example, it can be manufactured by blowing a unit and then cutting the unit into two halves to produce two outer casings, Shell π. Single-bubble blown film process also been described (for example) described in

Encyclopedia of Chemical Technology,Kirk_〇thmer,第三 版,John Wiley &amp; Sons,紐約,1981,第 16 卷第 41心417頁 及第18卷第191-192頁中。 定向薄膜可經由吹製薄膜擠壓或藉由使用習知拉伸技術 而在熱變形溫度附近拉伸鑄造或壓延薄膜來製備。舉例而 口,可使用從向拉伸細放儀用於多軸向同時拉伸;可使用 χ-y方向拉伸縮放儀以在平面x-y方向上同時或順序地拉 伸。亦可使用具有連續單軸拉伸部分之裝備(諸如一機器, 其裝備有用於以機器方向拉伸之差速滾輪之部分及用於以 橫向方向拉伸之拉幅框架部分)以達成單軸及雙軸拉伸。 熱塑模製系統包括用於熱塑板塊之擠壓的熱塑擠壓模, 該板塊藉由用於改變經擠壓之板塊之不同部分中的擠壓材 料之厚度之可調模閘部件(亦即,動態模設定)而形成輪廓。 熱塑擠壓模具有用於將經擠壓之熱塑板塊自熱塑擠壓模切 割之修剪器。可為真空或壓縮模之複數個熱塑模各安裝於 諸如旋轉平臺之可移動平臺上以一次將一模移至一位置以 收納自熱塑擠壓模修剪之熱塑板塊。模製零件以可變厚度 而由自擠壓模饋入、仍為熱的熱塑材料之熱板塊形成。複 數個模安裝至平臺以將一模饋入一裝載位置以收納來自擠 118322.doc -75- 200832839 壓杈之熱塑板塊且將第二模饋入釋放位置以將形成的零件 自杈移除。平室可為往復式或旋轉平臺且允許每一模製零 件在另-模製零件收納熱塑板塊的同時被冷卻。熱塑模製 製程被提供為具有以下步驟:選擇熱塑擠壓模,其根據調 整熱塑積壓模以改變擠壓板塊之不同部分中通過其之擠壓 材料之厚度的裝置而設定。將熱塑材料加熱至流體狀態且 、、、工由所遠熱塑权(其已得以調整用於改變擠麼板塊之不同 部分中的擠屬材料之厚度)對其進行擠壓,將具有可變厚度 之擠壓熱塑板塊修剪為預定大小,及將熱的熱塑材料之每 一修剪板塊引導至熱成形模上,及模製模中之預定零件以 使侍杈製零件以可變厚度而由在材料之擠壓期間被加熱的 材料之板塊形成。射出成形、熱成形、播壓塗覆、型面擠 出及薄片擠μ製程描述於(例如)Plasties編_13 _Encyclopedia of Chemical Technology, Kirk_〇thmer, Third Edition, John Wiley &amp; Sons, New York, 1981, Vol. 16, No. 41, p. 417 and vol. 18, pp. 191-192. The oriented film can be prepared by extrusion of a blown film or by drawing a cast or calendered film near a heat distortion temperature using conventional stretching techniques. For example, a multi-axial simultaneous stretching can be used from a tensioning applicator; the pantograph can be stretched in the χ-y direction to simultaneously or sequentially stretch in the plane x-y direction. It is also possible to use equipment having a continuous uniaxially stretched portion (such as a machine equipped with a portion for a differential roller that is stretched in the machine direction and a tenter frame portion for stretching in the transverse direction) to achieve a single axis And biaxial stretching. The thermoplastic molding system includes a thermoplastic extrusion die for extrusion of a thermoplastic panel, the panel having an adjustable die member for varying the thickness of the extruded material in different portions of the extruded panel ( That is, the dynamic mode is set to form a contour. The thermoplastic extrusion die has a trimmer for cutting the extruded thermoplastic sheet from a thermoplastic extrusion die. A plurality of thermoplastic molds, which may be vacuum or compression molds, are each mounted on a movable platform such as a rotary table to move the mold to a position at a time to accommodate the thermoplastic panels trimmed from the thermoplastic extrusion die. The molded part is formed in a variable thickness from a hot plate of a thermoplastic material that is fed from the extrusion die and is still hot. A plurality of dies are mounted to the platform to feed a mold into a loading position to receive the thermoplastic slab from the squeezing 118322.doc -75 - 200832839 and feed the second mold into the release position to automatically remove the formed part . The flat chamber can be a reciprocating or rotating platform and allows each molded part to be cooled while the other molded part receives the thermoplastic sheet. The thermoplastic molding process is provided with the step of selecting a thermoplastic extrusion die that is set according to a device that adjusts the thermoplastic laminate to vary the thickness of the extruded material through the different portions of the extruded panel. Heating the thermoplastic material to a fluid state and, by means of a far thermoplastic (which has been adapted to vary the thickness of the extruded material in different portions of the extruded panel), it will have The variable thickness extruded thermoplastic panel is trimmed to a predetermined size, and each trimmed panel of the hot thermoplastic material is directed onto the thermoforming mold, and the predetermined part in the molded mold is used to vary the thickness of the waiter component It is formed by a plate of material that is heated during extrusion of the material. Injection molding, thermoforming, pressure coating, profile extrusion and sheet extrusion are described in, for example, Plasties _13 _

Processes ^ Seymour S. Schwartz and Sidney H. Goodman . Van Nostrand Reinhold Company,紐約,1982,第 527 563 頁、第632-647頁及第596_6〇2頁中。 可使用真空模製以產生根據本發明之成形製品。根據此 方法’藉由鐵框或其他設備(其裝配至使得處理較為容易之 夾具)固定根據式!之聚合材料之薄片,且接著將其引入一裝 置其中聚合材料之薄片藉由配置於上部及下部位置之陶 兗加熱器或導線加熱器而加熱。薄片在加熱時開始熔融。 在- ^生薄片之垂陷之後繼續加熱時,薄片拉伸於框架 中。在觀測到該拉伸後,即可對薄片進行模製,盆且有均 勾厚度且無皺紋或其他缺陷。在此時,將薄片框架自加熱 H8322.doc -76- 200832839 裝置取出,將其緊鄰於模定位,且於丨大氣壓力之減壓下對 其進行真空模製,因此可獲得所要的模製成形物品。其後, 可以空氣或喷水冷卻物品且將物品自模取出。 根據壓力模製,將經加熱或以其他方式變得易於處理之 溥片置放於模上,對薄片施加壓力使得薄片經由壓力之施 加而呈現模之形狀。 〇 Ο 亦可使用沖印模製處理來製造包含根據式Σ之樹脂的製 品。舉例而言,將擠壓模中成形之式I之聚合物片配合至垂 直壓力機且接著於自5至500 kg/cmsup2(較佳地自1〇至2〇 kg/cm.sup.2)之壓力下經熱模製,因此可獲得所要的成形物 品。接著以空氣或喷水冷卻模且將物品自模取出。在此模 製中’壓製時間通常為至少15秒,且一般為自15至4〇秒。 為了改良表面特性,在兩階段M力條件下執行模製為較 佳。在第一階段,將聚合物材料保持於自1(^2〇kg/cm sup.2 之,力下! 5至40秒。接著為至少5秒之自扣至5〇 卿2 之第二階段壓力’因此可產生具有優良表面光滑度之模製 物扣田使用根據式!具有較差流動性之含無機填料之熱塑 樹脂時,此方法可為較佳的。 ’、 產用射出成形之熟知製程而使用具有式1之樹脂來 “。射出成形為以壓力將樹脂射入模穴中的情況。 射出遷力通常自v / 目〇至140kg/cm.sup.2且較佳地自…至^ kg/cm.sup.2。 熟練技工將瞭解,可藉由此項技術中已知之任何方 由本文所揭示之聚合物摻合物製成的製品製為任何所要的 118322.doc -77- 200832839 笔連接器。此望游d ^ ^ '狀可為簡單的或為多壁形狀用於複雜最 終用途應用。太 攸雜取 連接器在-此情、兄田中二聚合物換合物可形成於其中之電 、1人_ +由與各種最終用途應用(其中使用高 相^聯之/能模穴約束。該等最終用途包括汽 . f列子)。續等物σ艮°°服務、電子、照明及醫學(僅舉幾個 設備、引整蕾:之實例包括(但不限於)電腦連接器、配電 : „備引I m諸如電視及電話之通信設備、醫學 自又備、引擎零件、汽車 干 °備、電動馬物tl 插座、照明控制設 類似物,包括二二、:裝備、通信裝備、電腦及其 括於搭扣配合連接器中模製之設備。Processes ^ Seymour S. Schwartz and Sidney H. Goodman. Van Nostrand Reinhold Company, New York, 1982, pp. 527 563, pp. 632-647 and 596_6. Vacuum molding can be used to produce a shaped article according to the present invention. According to this method, the formula is fixed by an iron frame or other device (which is assembled to a jig that makes handling easier)! A sheet of polymeric material is then introduced into a device wherein the sheets of polymeric material are heated by a ceramic heater or wire heater disposed in the upper and lower positions. The flakes begin to melt upon heating. The sheet is stretched in the frame while heating is continued after the collapse of the sheet. After the stretching is observed, the sheet can be molded with a uniform thickness and no wrinkles or other defects. At this time, the sheet frame is taken out from the apparatus of heat H8322.doc -76-200832839, positioned in close proximity to the mold, and vacuum molded under reduced pressure of barium atmospheric pressure, so that the desired molding can be obtained. article. Thereafter, the article can be cooled by air or water spray and the article can be taken out of the mold. According to the pressure molding, a sheet which is heated or otherwise easily handled is placed on the mold, and pressure is applied to the sheet so that the sheet is subjected to the application of pressure to assume the shape of the mold. 〇 亦可 It is also possible to use a stamping process to manufacture a product containing a resin according to the formula. By way of example, the polymer sheet of the formula I formed in the extrusion die is fitted to a vertical press and then from 5 to 500 kg/cmsup2 (preferably from 1 to 2 kg/cm.sup.2) The heat is molded under the pressure, so that the desired shaped article can be obtained. The mold is then cooled with air or water spray and the article is taken out of the mold. In this molding, the pressing time is usually at least 15 seconds, and is generally from 15 to 4 seconds. In order to improve the surface characteristics, it is preferable to perform molding under a two-stage M force condition. In the first stage, the polymer material is maintained at 1 (^2〇kg/cm sup.2, force! 5 to 40 seconds. Then at least 5 seconds to buckle to the second stage of 5〇卿2 The pressure 'is therefore a molded article with excellent surface smoothness. It is preferred to use a thermoplastic resin containing inorganic fillers with poor fluidity. ', Well-known for injection molding The process uses a resin having the formula 1 to "form out to form a resin into the cavity by pressure. The injection force is usually from v / mesh to 140 kg / cm.sup. 2 and preferably from ... to ^ kg/cm.sup.2. The skilled artisan will appreciate that articles made from the polymer blends disclosed herein by any of the techniques known in the art can be made into any desired 118322.doc-77- 200832839 Pen connector. This lookout d ^ ^ ' shape can be used for simple or multi-wall shapes for complex end-use applications. Too much miscellaneous connectors can be formed in this case. In which the electricity, 1 person _ + by various end-use applications (where the use of high-phase / joint cavity / energy cavity constraints These end uses include steam. f.). Continued σ 艮 ° service, electronics, lighting and medicine (to name a few devices, lining: examples include (but not limited to) computer connectors, power distribution: „Exporting I m such as television and telephone communication equipment, medical self-preparation, engine parts, car dry preparation, electric horse tl socket, lighting control set analog, including 22, equipment, communication equipment, computer and It is enclosed in a device that is molded in a snap-fit connector.

根據本發明,以I m I 以不同於組成連接器之下伏聚合物摻合 的組合物塗覆製造之電連 口 明之塗層應包括孰練技工表面。根據本發 之油漆、薄片、薄膜等等已知的所有塗層,包括所有類型 連接器可(例如)藉由使用諸如電漿沈積、濺鍍、真空沈積 〇 二之標準製程而金屬化。根據本發明可向物品進 〇後早層或多層塗層從而賦予諸如導電性、電磁 蔽、抗劃傷性、抗紫外光性、美學要求等等之額外性能。 二術語&quot;油漆&quot;意謂包括具有約_。 、疋σ之自約⑺⑽至約25()_之厚度的油漆、 漆及聚合物塗層。熟練技工將瞭解,根據本發明可使用任 =度之塗層,且厚度之特定範圍(諸…nm或甚至 -50 nm)僅為可用於本發明所涵蓋之最終用途中之一此 的塗層(其中塗層包含油漆、金屬及聚合物)之厚度之代:。 I18322.doc -78- 200832839 本發明亦針對包含根據式i之樹脂之薄片及薄膜,其覆蓋 物品之表面中之一或多者的全部或一些。 叮使用各種方法來產生在其一表面上具有油漆塗層之製 成聚合物物品,該物品由包含根據式I之聚醚醯亞胺之摻合 物的組合物製造。根據此等方法之一典型實例,在成形物 品之表面之全部或部分上塗覆底塗劑或錨塗劑且其接著經 乾燥從而形成塗層。覆蓋成形物品之一或多個表面之全部 或部分的確切方法對於本發明並不重要。舉例而言,可經 由仏準塗覆技術而塗覆塗層,諸如使用滾塗機而進行之滾 塗、藉由使用喷搶而進行之喷塗(在具有或不具有底塗劑之 先前塗層的情況下)、浸塗、刷塗或淋塗。對於經塗覆之成 形物品之商用或大規模產品而言,使用喷搶之方法為有效 的。洋言之’較佳使用藉由使用機器人而塗覆之方法。 本文揭示之所有專利、專利申請案及其他公開案的全文 如充分陳述一般以引用的方式倂入本文中。 實例 在無進一步詳細闡述之情況下,咸信熟練技工可藉由使 用本文之描述而製作並使用本發明。以下實例被包括在内 以向熟習用於實踐所主張之發明之技術者提供額外指導。 此等實例經提供為工作之代表且有助於本發明之教示。因 此’此等實例不欲以任何方式限制本發明之範疇。除非在 下文中另行規定,否則所有部分以重量計。 實例1 對於實例1-9 H8322.doc -79- 200832839In accordance with the present invention, a coating having an I m I coated with a composition other than the composition of the polymer blended underneath the connector should include a skilled surface. All coatings known in the art of paints, sheets, films, and the like, including all types of connectors, can be metallized, for example, by using standard processes such as plasma deposition, sputtering, vacuum deposition. In accordance with the present invention, an early or multilayer coating can be applied to the article to impart additional properties such as electrical conductivity, electromagnetic shielding, scratch resistance, UV resistance, aesthetics, and the like. The second term &quot;paint&quot; is meant to include having about _. , 疋σ of paint, paint and polymer coatings from about (7) (10) to about 25 () thick. Skilled artisans will appreciate that any degree of coating can be used in accordance with the present invention, and that a particular range of thickness (... nm or even -50 nm) is only one of the coatings that can be used in one of the end uses covered by the present invention. The thickness of the coating (where the coating contains paint, metal and polymer): The present invention is also directed to sheets and films comprising a resin according to formula i which cover all or some of one or more of the surfaces of the article. Various methods are used to produce a finished polymeric article having a paint coating on one surface thereof, the article being made from a composition comprising a blend of polyetherimine according to formula I. According to a typical example of such methods, a primer or anchor coating is applied to all or part of the surface of the shaped article and it is then dried to form a coating. The exact method of covering all or part of one or more surfaces of a shaped article is not critical to the invention. For example, the coating can be applied via a quasi-coating technique, such as roll coating using a roll coater, spraying by using a spray (previously applied with or without a primer) In the case of a layer), dip coating, brushing or shower coating. For commercial or large-scale products of coated shaped articles, the use of spray blasting methods is effective. Yangyan's preferably uses a method of coating by using a robot. The full text of all patents, patent applications, and other publications disclosed herein is hereby incorporated by reference. EXAMPLES Without further elaboration, the skilled artisan can make and use the invention by using the description herein. The following examples are included to provide additional guidance to those skilled in the art of practicing the claimed invention. These examples are provided as representative of the work and contribute to the teachings of the present invention. Therefore, such examples are not intended to limit the scope of the invention in any way. All parts are by weight unless otherwise stated below. Example 1 For Example 1-9 H8322.doc -79- 200832839

使用ASTM測試方法量測一些性能。在測試之前以50%之 相對濕度對所有模製樣本調節至少48小時。按照ASTM D256在室溫下於3.2 mm厚之桿上量測反向缺口衝擊性值。 按照ASTM D648在3.2 mm厚之桿上於0.46 MPa(66 psi)量測 熱變形溫度(HDT)。按照ASTM方法D638在3.2 mm之類型I 之桿上量測抗張性能。按照ASTM方法D790在3.2 mm之桿 上量測撓曲性能。按照ASTM方法D1 525於50 N量測維卡溫 度。按照ASTM方法D3418但使用不同加熱與冷卻速率而執 ^ 行差示掃描熱量測定(DSC)。以20°C/min將樣本加熱至350°C 且以20或80°C/min將其冷卻以記錄峰值結晶溫度(Tc)。以1 赫之振盪頻率以3°C /min之加熱速率在3.2 mm之桿上撓曲地 執行動態機械分析法(DMA)。按照ASTM方法D54 18在自約 30至約300°C下執行DMA測試。按照ASTM方法D3835使用 1x10 mm之模於380°C在毛細管流變儀上量測隨剪切速率變 化之黏度。在使用平行板流變儀以10弧度/min進行測試之 前於150°C乾燥摻合物之顆粒歷時至少3小時。量測380°C下Some properties were measured using the ASTM test method. All molded samples were conditioned for at least 48 hours at 50% relative humidity prior to testing. The reverse notched impact value was measured on a 3.2 mm thick rod at room temperature according to ASTM D256. The heat distortion temperature (HDT) was measured at 0.46 MPa (66 psi) on a 3.2 mm thick rod in accordance with ASTM D648. Tensile properties were measured on a 3.2 mm type I rod in accordance with ASTM method D638. Flexural properties were measured on a 3.2 mm rod in accordance with ASTM method D790. The Vicat temperature was measured at 50 N according to ASTM method D1 525. Differential Scanning Calorimetry (DSC) was performed according to ASTM method D3418 but using different heating and cooling rates. The sample was heated to 350 ° C at 20 ° C/min and cooled at 20 or 80 ° C/min to record the peak crystallization temperature (Tc). Dynamic mechanical analysis (DMA) was performed flexibly on a 3.2 mm rod at an oscillation frequency of 1 Hz at a heating rate of 3 °C /min. The DMA test was performed in accordance with ASTM method D54 18 at from about 30 to about 300 °C. The viscosity as a function of shear rate was measured on a capillary rheometer at 380 ° C according to ASTM method D3835 using a 1 x 10 mm mold. The pellets of the blend were dried at 150 ° C for at least 3 hours prior to testing at 10 radians/min using a parallel plate rheometer. Measuring at 380 ° C

Lj 熔融黏度隨時間之改變。 可藉由此項技術中已知的若干技術(例如,ASTM方法 D343 18)而量測玻璃轉移溫度(Tg)。在量測Tg中,可使用不 同加熱速率,例如自5至30°C每分鐘或在其他情況中自10至 20°C每分鐘。 材料 PCE為含有約60重量%之間苯二酸酯與對苯二酸酯基團 的1:1混合物及剩餘物BPA碳酸酯基團之BPA共聚碳酸酯, 118322.doc -80- 200832839 其Mw〜2 8,3 00且具有約175°C之Tg。 PSEI-1為藉由4,4’-氧雙苯二甲酸酐(ODPA)與約等莫耳量 之4,4’-二胺基二苯砜(DDS)之反應而製成之聚颯醚醯亞 胺,其Mw〜33,000且具有約310°C之Tg。 PSEI-2為藉由約8〇莫耳%之4,4!-氧雙苯二甲酸酐(〇dPA) 與約20莫耳%之雙酚a二酐(BPADA)之混合物與約等莫耳 里的4,4 - 一胺基二苯;&amp;風(DDS)之反應而製成之聚硬趟醯亞 胺共聚物,其Mw〜28,000且具有約280°C之Tg。 PSEI-3為藉由雙酚A二酐(BPADA)與約等莫耳量之4,4,- 一胺基二苯硬(DDS)之反應而製成之聚;&amp;風鱗醯亞胺,其Lj melt viscosity changes with time. The glass transition temperature (Tg) can be measured by several techniques known in the art (e.g., ASTM method D343 18). In measuring the Tg, different heating rates can be used, for example, from 5 to 30 ° C per minute or in other cases from 10 to 20 ° C per minute. The material PCE is a BPA copolycarbonate containing about 6% by weight of a 1:1 mixture of a phthalate and a terephthalate group and a residue BPA carbonate group, 118322.doc -80 - 200832839, its Mw ~2 8,3 00 and has a Tg of about 175 °C. PSEI-1 is a polyether ether prepared by the reaction of 4,4'-oxybisphthalic anhydride (ODPA) with about 4 parts of 4'-diaminodiphenyl sulfone (DDS). The quinone imine has a Mw of ~33,000 and a Tg of about 310 °C. PSEI-2 is a mixture of 4,4!-oxybisphthalic anhydride (〇dPA) and about 20 mol% of bisphenol a dianhydride (BPADA) by about 8 moles of molybdenum. A polyhard iminoimide copolymer prepared by reacting 4,4-diaminobiphenyl; &amp; wind (DDS) having a Mw of 28,000 and having a Tg of about 280 °C. PSEI-3 is a polycondensate prepared by the reaction of bisphenol A dianhydride (BPADA) with about 4,4,-aminodiphenyl hard (DDS). ,its

Mw〜34,000且具有約247°C之Tg。 PSEI-4為藉由雙酚a二鈉鹽與等莫耳量之1H-異吲哚_ 1,3(2H)·二酮、2,2,-(磺醯二-4,1-伸苯基)雙[4-氯-(9CI)之反 應而製成之聚硬醚醯亞胺,其以^¥〜5〇,〇〇〇且具有約265。〇之Mw ~ 34,000 and has a Tg of about 247 °C. PSEI-4 is a bisphenol a disodium salt and an equivalent molar amount of 1H-isoindole-1,3(2H)·dione, 2,2,-(sulfonate-2,1-benzene) A poly-hard ether quinone imine prepared by the reaction of bis[4-chloro-(9CI), which has a weight of about 265. 〇之

Tg 〇 使用表1中規定之組合物來製備本發明之調配物丨_9。將 所有組份之量表達為以重量計之份每百份樹脂(ph〇,其中 總樹脂重ϊ包括穩定劑(若存在以異酞醯基及對酞醯基二 酸氣化物與雙酚A在鹼及三乙胺相轉移觸媒存在之情況下 的一相(一氯甲烷/水)反應來製備聚碳酸酯(pcE)共聚物。此 類型之合成的合成細節可於(例如)美國專利第5,52丨,258號 第13行第15-45列中找到。所得聚酯碳酸酯共聚物具有6〇% 之酯單元(為間苯二酸酯與對苯二酸酯單元之ι:ι重量/重量 此口物)及4G%之基於雙紛A的碳酸g旨單^。在油漆震遺器 118322.doc _ 81 _ 200832839 中將表1所規定之成份混合至一起且在2_5英吋之真空通風 單螺桿擠壓機上以80-90 rpm於575-640QF對其進行擠壓。對 所得摻合物進行粒化且在射出成形為5 X 7 X 1/8英忖之板 之前於275°F將顆粒乾燥4小時。將模製機器設定為675cF之 熔融溫度及275QF之模製溫度。在模製時對每一樣本執行對 2〇°光澤、CIEL*值及外觀之判定。根據ASTmd523使用青 瓦標準而量測二十度光澤。如R. McDonald (ed.),&quot;ColourTg 〇 The composition specified in Table 1 was used to prepare the formulation 丨_9 of the present invention. The amount of all components is expressed as parts by weight per hundred parts of resin (ph〇, where the total resin weight includes stabilizers (if isodecyl and p-nonyl diacids are present with bisphenol A) A polycarbonate (PCE) copolymer is prepared by reacting a single phase (chloroform/water) in the presence of a base and a triethylamine phase transfer catalyst. The synthetic details of this type of synthesis can be found, for example, in US patents. No. 5, 52, 258, line 13, column 15-45. The resulting polyestercarbonate copolymer has 6% by weight of ester units (as isophthalate and terephthalate units: Ig weight/weight of this mouth) and 4G% of the double-based A-based carbonated g. The ingredients specified in Table 1 are mixed together in the paint shaker 118322.doc _ 81 _ 200832839 and at 2_5 English The kiln was vacuum extruded on a single screw extruder at 80-90 rpm at 575-640 QF. The resulting blend was granulated and before injection molding into a 5 X 7 X 1/8 inch plate. The granules were dried for 4 hours at 275 ° F. The molding machine was set to a melt temperature of 675 cF and a molding temperature of 275 QF. For each sample during molding Row pair 2〇 ° gloss determined CIEL * value, and appearance of the green tile according ASTmd523 using standard gloss as measured twenty R. McDonald (ed.), &Quot;.. Colour

Physics for Industry,Second Edition,,The Society of Dyers and Colourists,Bradford,UK(1997)中所描述而量測cie 亮 度(L*)值。外觀指代對模製零件的色彩及半透明度/不透明 度之主觀目視檢查。The cie brightness (L*) value is measured as described in Physics for Industry, Second Edition, The Society of Dyers and Colourists, Bradford, UK (1997). Appearance refers to subjective visual inspection of the color and translucency/opacity of molded parts.

實例2Example 2

U 使用上文所述之技術中之一或多者將上文的本發明之調 配物1、2、3、4及5射出成形為電連接器插塞、插孔及殼層 部件之形狀。 實例3 將根據表1之調配物6、7、8及9而製成之材料射出成形至 118322.doc -82 - 200832839 電連接器插塞、插孔及殼層部件之形狀的模穴中。 實例4 對於調配物10-3 1,使用ASTM測試方法量測性能。按照 ASTM D1238使用6.7 Kg之重量於295°C對經乾燥之顆粒執 行熔融流動速率(MFR)。在測試之前以50%之相對濕度對所 有模製樣本調節至少48小時。按照ASTM D256在室溫下於 3 ·2 mm厚之桿上量測缺口衝擊性值。按照ASTM D64 8在3 ·2 mm厚之桿上於1·82 MPa(264 psi)量測熱變形溫度(HDT)。 (Λ 使用ASTM方法D3763在102 X 3.2 mm之盤碟上於23°C量測 雙軸或儀測衝擊,峰值衝擊能量得以報告。按照ASTM方法 D638在3.2 mm之類型I之桿上量測抗張性能。按照ASTM方 法D790在3.2 mm之桿上量測撓曲性能。使用ASTM方法 D543在3.2 mm之桿上量測耐溶解性。按照ASTM方法D1003 於2.0 mm量測透射百分率(%T)及渾濁百分率(%H)。如藉由 列於FAR 25.853中之方法所量測,使用Ohio StateU. The above-described formulations 1, 2, 3, 4 and 5 of the present invention are injection molded into the shape of electrical connector plugs, sockets and shell members using one or more of the techniques described above. Example 3 Materials made according to Formulations 6, 7, 8, and 9 of Table 1 were injection molded into the cavity of the shape of the plug connector, the socket and the shell member of 118322.doc -82 - 200832839. Example 4 For Formulation 10-3 1, performance was measured using the ASTM test method. The melt flow rate (MFR) was applied to the dried pellets according to ASTM D1238 using a weight of 6.7 Kg at 295 °C. All molded samples were conditioned for at least 48 hours at 50% relative humidity prior to testing. The notched impact value was measured on a rod of 3 · 2 mm thick at room temperature according to ASTM D256. The heat distortion temperature (HDT) was measured at 1.82 MPa (264 psi) on a 3 · 2 mm thick rod in accordance with ASTM D64 8 . (Λ The peak impact energy is reported using a ASTM method D3763 on a 102 X 3.2 mm disc at 23 ° C. The peak impact energy is reported. The resistance is measured on a 3.2 mm type I rod according to ASTM method D638. Tensile properties were measured on a 3.2 mm rod according to ASTM method D790. Solubility resistance was measured on a 3.2 mm rod using ASTM method D543. Percent transmission was measured at 2.0 mm according to ASTM method D1003 (%T) And percentage of turbidity (%H). As measured by the method listed in FAR 25.853, use Ohio State

University(OSU)之熱釋放速率裝置於15·2 χ 15·2 cm之板上 〇 9 進行熱釋放測試。以kW-min/m2(千瓦特分鐘每平方公尺)為 單位量測兩分鐘之熱釋放。以kW/m2(千瓦特每平方公尺) 為單位量測峰值熱釋放。亦以分鐘為單位量測至峰值熱釋 放之時間。熱釋放測試方法亦描述於&quot;Aircraft MaterialsThe University (OSU) heat release rate device was tested for heat release on a 15·2 χ 15·2 cm plate 〇 9 . The two-minute heat release was measured in units of kW-min/m2 (kilowatt minutes per square meter). The peak heat release is measured in units of kW/m2 (kilowatts per square meter). The time to peak pyrolysis is also measured in minutes. The heat release test method is also described in &quot;Aircraft Materials

Fire Test Handbook,,DOT/FAA/AR-OO/12,第 5 章,,HeatFire Test Handbook,, DOT/FAA/AR-OO/12, Chapter 5,, Heat

Release Test for Cabin Materials” 中。 材料 此等調配物中所使用之間苯二酚酯聚碳酸酯(ITR)樹脂 118322.doc -83- 200832839 為由異酞醯基與對酞醯氯化物之1:1混合物與間苯二酚、雙 酚A(BPA)及奴醯氯之縮合製成之聚合物。ITR聚合物藉由 酯鍵與碳酸酯鍵之近似莫耳比而命名。ITR9010具有 莫耳之間苯一酚酯鍵、8莫耳%之間苯二酚碳酸酯鍵及約 10莫耳。/〇之BPA碳酸酯鍵。Tg = 131。〇 PEI = ULTEM 1000聚醚醯亞胺,藉由雙酚A二酐與大約 等莫耳量之間苯二胺之反應製成,來自GEplastics。 PEI-矽氧烷為藉由間苯二胺、BpA_二酐與平均含有約 個聚矽氧原子之雙-胺基丙基官能甲基矽氧烷之亞胺化反 應製成之聚醚醯亞胺二甲基矽氧烷共聚物。其具有約“重 里/〇之矽氧烷含量及如凝膠滲透層析而量測約24,〇⑽之 Μη 〇 PC為來自 GE Plastics之ΒΡΑ聚碳酸酯,LEXAN 130。 藉由在2.5英吋之單螺桿、真空通風擠壓機中對以間苯二 酚為主之聚酯碳酸酯樹脂與聚醚醯亞胺及聚矽氧聚醯亞胺 共聚物樹脂之混合物所進行的擠壓而製備摻合物。除另行 標註,否則以總組合物之重量%列出組合物。將擠壓機設 定為約285至340°C。在真空下以約9〇 rpm使摻合物運轉。 將擠出物冷卻、粒化且於12(rc乾燥。使用3〇秒之循環時間 於320-360 C之設定溫度及120°C之模製溫度將測試樣本射 出成形。對物品塗以UV保護塗層。 表2之調配物10及1丨表明在PEI/聚矽氧聚醯亞胺共聚物 摻合物中’以間苯二酚酯聚碳酸酯(ITR9 010)對PC之替代如 何給出兩分鐘及總熱釋放之極大減小。注意間苯二酚酯聚 118322.doc -84- 200832839 碳酸酯之添加亦可提高流率(在此情況中MFR=熔融流動速 率g/10 min,量測於29 5 °C)且改良斷裂處之伸長率。 表2 〇 調配物 10 11 PEI 76 76 ITR9010 10 20 PEl·矽氧烷 4 4 PC 10 0 Ti〇2 3 3 熱釋放 2 分鐘(kW-min/m2) 10 12 峰值(kWm2) 34 29 至峰值之時間(Min) 4.60 4.50 295〇C 之 MFR 3.0 3.6 撓曲模數Kpsi 464 462 撓曲強度Kpsi 22.1 22.4 抗張強度(Y)Kpsi 14.8 15.0 %伸長(B) 39 50 HDT 264 psi°C 163 164 能量最大負載ft-lbs 54 56 缺口衝擊性ft-lbs/in 1.4 1.3 表3展示具有各種量之間苯二酚酯聚碳酸酯及1至4%之 聚矽氧聚醯亞胺共聚物的一系列PEI摻合物。調配物12-18 均展示非常低之兩分鐘熱釋放及較低峰值熱釋放。樣本均 展示指示良好熔融流動的較高MFR。在所有實例中HDT大 於150°C。該等調配物亦均具有2400 Kpsi(2760 Mpa)之撓曲 118322.doc -85- 200832839 模數。亦注意即使具有較低含量之聚醚醯亞胺(例如,聚鱗 酉亞胺少於總摻合物之一半的調配物1 5及1 7 ),仍可達成極 低熱釋放值。在此組調配物中,12-18具有3.0份每百份(phr) 二氧化鈦且0.1 phr之亞磷酸三芳基酯存在。 表3 調配物 12 13 14 15 16 17 18 PEI ITR9010 PEI-矽氧烷 56.5 42.5 1.0 78.0 20.0 2.0 63.0 35.0 2.0 48.0 50.0 2.0 69.5 27.5 3.0 46.0 50.0 4.0 76.0 20.0 4.0 所有摻合物具有3 phr Ti〇2 &amp; 0.1 phr亞磷酸三芳基酯 表4中之調配物19及20展示Ti〇2之添加對於減少熱釋放 及增加至峰值熱之時間的有益效應。注意實例19及2〇均可 具有極佳熱釋放性能,調配物20可具有稍低之峰值熱釋放 值及較長的至峰值熱之時間,此展示金屬氧化物添加物之 有益效應。 表4 調配物 19 20 21 22 23 24 25 PEI 67.5 67.5 68 58 19.15 18.40 17.65 ITR9010 30.0 30.0 20 30 80.0 80.0 80.0 PEl·矽氧烷 2.5 2.5 2 2 0.75 1.50 2.25 PC 10 10 亞磷酸三芳基酯 0.1 0.1 0.1 Ti〇2 0.0 3.0 3 3 熱釋放 2 分鐘(kW-min/m2) 16 12 17 15 23 18 18 峰值(kW/m2) 31 29 29 35 39 40 X yj 40 至峰值之時間(Min) 3.87 4.69 3.21 4.34 3.74 3.34 3.64 註釋 泡沫 泡沫 泡沫 破〉查 碳;查 碳&gt;查 118322.doc -86 - 200832839 調配物 19 20 21 22 23 24 25 295°C 之 MFR 3.1 3.0 2.6 4.0 13.9 14.8 14.5 撓曲模數Kpsi 467 470 465 485 399 395 393 撓曲強度Kpsi 23.3 22.9 22.3 21.9 19.3 19.4 19.3 抗張強度(Y)Kpsi 14.3 14.0 13.8 13.3 12.4 12.4 12.3 %伸長(B) 52 86 82 100 40 45 46 HDT264 psi°C 169 169 169 161 133 134 133 能量最大負載ft-lbs 54 57 55 58 50.7 50.6 52.9 缺口衝擊性ft-lbs/in 0.9 1.0 1.2 1.3 2.7 2.5 2.6 2.0 111111之%透射率 74.3 72.4 72.5 2.0 111111之%渾濁度 5.9 6.6 5.8 表4中亦展示調配物21及22。此等摻合物將間苯二酚酯聚 碳酸酯、聚醚醯亞胺及聚矽氧聚醯亞胺共聚物與額外非芳 基化聚碳酸酯,雙酚A聚碳酸酯(PC)組合。此等摻合物可展 示150°C以上之HDT、&gt;390 Kpsi(2691 Mpa)之撓曲模數連同 非常低之兩分鐘及峰值熱釋放值。 表4中亦展示調配物23、24及25。此等摻合物具有較高的 I 間苯二酚酯聚碳酸酯含量。即使具有較低PEI矽氧烷含量及 較低PEI含量,摻合物仍可表明如較低熱釋放值及較長的至 峰值熱釋放之時間所展示的改良之耐燃性。此等摻合物可 具有如較高MFR連同較高模數及強度所展示之極佳流動。 所有實例中之斷裂處抗張伸長率可高於25%。注意在2.0 mm 處,透射百分率可高於70%,同時渾濁度可較低,在此等 三組份聚合物摻合物中甚至在10%以下。缺口衝擊性強度 高於 2.0 ft-lbs/in。 表5中展示調配物26、27及28。此等摻合物具有大約相等 118322.doc -87- 200832839 含量之間苯二酚酯聚碳酸酯與PEI。即使具有較低PEI矽氧 烷含量(0.75至2.25重量%),摻合物仍可表明較低熱釋放 值。摻合物可具有由較高MFR連同較高模數(&gt;390 Kpsi)及 強度所展示之良好流動。所有實例中之斷裂處抗張伸長率 可高於25%。注意在2.0 mm處,透射百分率高於60%,同時 渾濁度較低,在此等聚合物摻合物中在10%以下。 表5 實例 26 27 28 29 30 31 PEI 49.15 48.40 47.65 79.15 78.40 77.70 ITR9010 50.0 50.0 50.0 20.0 20.0 20.0 PEI矽氧烷 0.75 1.50 2.25 0.75 1.50 2.25 亞磷酸三芳基酯 0.1 0.1 0.1 0.1 0.1 0.1 熱釋放 2 分鐘(kW-min/m2) 14 12 13 13 10 9 峰值(kW/m2) 36 31 33 29 27 26 至峰值之時間(Min) 3.94 4.26 4.62 2.70 2.91 4.69 泡珠 泡沫 泡沐 泡沫 泡珠 泡珠 註釋 碳 &gt;查 碳渣 碳渣 碳渣 碳渣 碳渣 295°C 之 MFR 6.7 6.9 7.0 2.1 2.1 2.3 撓曲模數Kpsi 441 430 433 467 473 473 撓曲強度Kpsi 22.1 21.7 21.8 23.9 24.4 24.2 抗張強度(Y)Kpsi 13.9 13.7 14.1 16.0 15.8 15.7 %伸長(B) 38 54 80 95 72 28 HDT 264 psi °C 155 151 151 171 176 175 能量最大負載ft-lbs f 61.1 53.1 59.6 58.3 57.1 62.2 缺口衝擊性ft-lbs/in 1.4 1.6 1.5 1.0 1.0 1.2 2.0 mmi%透射 73.0 72.4 68.8 72.1 70.1 66.4 2.0 111111之%渾濁度 2.5 3.1 5.8 2.5 4.0 7.0 118322.doc -88 - 200832839 表5中亦展示調配物29-3 1。此等摻合物具有較低量之間 苯二酚酯聚碳酸酯。具有非常低之PEI矽氧烷含量(0.75至 2.25重量%),摻合物仍可表明較低熱釋放值及較少的至峰 值熱釋放之時間。摻合物可展示對於熔融處理應用有用之 流動連同較高模數(&gt;390 Kpsi)及強度。所有實例中之斷裂 處抗張伸長率高於25%。注意在2.0 mm處,透射百分率可 高於60%,同時渾濁度可較低,在此等聚合物掺合物中在 10%以下。 ◎ 實例5 使用ASTM測試方法量測性能。按照ASTMD1238使用6.7 Kg之重量於295°C對經乾燥之顆粒執行熔融流動速率 (MFR”在測試之前以50%之相對濕度對所有模製樣本調節 至少48小時。按照ASTM D256在室溫下於3.2 mm厚之桿上 量測缺口衝擊性值。按照人8丁乂0648在3.2 111111厚之桿上於 1.82 MPa(264 psi)量測熱變形溫度(HDT)。按照ASTM方法 D638在3·2 mm之類型I之桿上量測抗張性能。按照ASTM方 〇 法D790在3.2 mm之桿上量測撓曲性能。 如藉由列於FAR 25.853中之方法所量測,使用Ohio State University(OSU)之熱釋放速率裝置於15·2 x 15.2 cm之薄片 上以2.0 mm之厚度進行熱釋放測試。以kW-min/m2(千瓦特 分鐘每平方公尺)為單位量測兩分鐘之熱釋放。以kW/m2(千 瓦特每平方公尺)為單位量測峰值熱釋放。亦以分鐘為單位 量測至最大熱釋放之時間。熱釋放測試方法亦描述於 ,’Aircraft Materials Fire Test Handbook,* DOT/FAA/AR-00/12 ’ 118322.doc -89- 200832839 第 5 章 ’’Heat Release Test for Cabin Materials” 中。 材料 此等實例中所使用之間苯二酚酯聚碳酸酯(ITR)樹脂為 由異酞醯基與對酞醯氯化物之1:1混合物與間苯二紛、雙齡 A(BPA)及碳醯氯之縮合製成之聚合物。ITR聚合物藉由酉旨 鍵與碳酸酯鍵之近似莫耳比而命名。ITR9010具有約82莫耳 %之間苯二酚酯鍵、8莫耳%之間苯二酚碳酸酯鍵及約1〇莫 耳%之丑卩八碳酸酯鍵。Tg= 131°C PEI-矽氧烷為藉由間苯二 胺、BPA-二酐與平均含有約10個聚矽氧原子之雙_胺基丙基 吕能甲基聚石夕乳之亞胺化反應製成之聚鱗醯亞胺二甲基石夕 氧烷共聚物。其具有約34重量%之矽氧烷含量及如凝膠滲 透層析而量測約24,000之Μη。 PSU為由雙紛Α與二氯二苯颯之反應製成,且作為 UDEL1700由Solvay Co.售出之聚颯。 PES為由二羥基苯砜與二氯二苯砜之反應製成,且作為 ULTRASON E由BASF Co·售出之聚醚砜。 注意,根據此實例之摻合物具有在化合期間添加之3份每 百份(phr)二氧化鈦(Ti〇2)。藉由在25英吋之單螺桿、真空 通風擠壓機中對以間苯二酚為主之聚醋碳酸醋樹脂與聚砜 或聚醚砜及聚矽氧聚醯亞胺共聚物樹脂之混合物所進行的 擠壓而製備摻合物。除另行標註,否則以總組合物之重量 %列出組合物。將擠壓機設定為約285至34〇。〇。在真空下以 約9〇rpm使摻合物運轉。將擠出物冷卻、粒化且於12〇它乾 燥。使用30秒之循環時間於32〇_36(rc之設定溫度及12〇它之 118322.doc 200832839 模製溫度將測試樣本射出成形。表6之調配物32展示間苯二 酚酯聚碳酸酯(ITR9010)、聚砜(PSu)及聚矽氧聚醯亞胺共聚 物(PEI-矽氧烷)之摻合物,其可給出兩分鐘及峰值熱釋放之 極大減小。可將兩分鐘熱釋放自63 kW-min/m2減小至47 kW-min/m2。亦可將峰值熱釋放自120 kW/m2減小至75 kW/m2。亦可將至峰值熱釋放之時間自2.56分鐘增加至3.72 分鐘,延遲熱釋放到達最大強度之時間。調配物33展示聚 砜與聚醚砜(PES)以及ITR9010及聚矽氧聚醯亞胺之摻合 f :. 物,其亦可具有改良之熱釋放性能及改良之流動。 表6 實例* 32 33 34 PSu 62.5 31.25 62.5 PES 0 31.25 0 PEI矽氧烷 2.5 2.5 2.5 ITR9010 35 35 35 熱釋放 2 分鐘(kW-min/m2) 47 57 31 峰值(kW/m2) 75 75 65 至峰值之時間(Min) 3.72 2.91 3.74 外觀 泡沫碳渣 泡沫碳渣 泡沫碳渣 295°C g/l〇 min之MFR 13.8 11.9 10.9 具有3 phr Ti02之*摻合物 實例6 表6,調配物34展示具有間苯二酚酯聚碳酸酯(ITR9010) 及2.5重量%之聚矽氧聚醯亞胺共聚物的聚醚砜(PES)摻合 物。調配物34可根據FAR/OSU測試而經燃燒,且產生用作 火焰蔓延之障壁的泡沫碳渣。其亦可具有較低熱釋放值、 118322.doc -91- 200832839 較長的至峰值熱釋放之時間且用作火焰蔓延之更有效障 后奢〇 實例7 表7中之調配物35及36展示PSu或PES與較高含量(60重量 %)之間苯二酚酯聚碳酸酯共聚物之摻合物。摻合物可展示 較低兩分鐘熱釋放值及較低峰值熱釋放值。當燃燒樣本 時,產生用作火焰蔓延之障壁的泡沫碳渣。實例35及36亦 展示較高熔融流動,令人驚奇的是其在FAR/OSU測試期間 不燒毁或自火焰流走。摻合物亦可展示較高撓曲模數(2300 Kpsi或2070 MPa)及較高撓曲強度(215 Kpsi或103.5 Mpa)以 及較高(250%)斷裂處伸長率。 表7 實例* 35 36 PSu 37.5 0 PES 0 37.5 PEI矽氧烷 2.5 2.5 ITR9010 60 60 熱釋放 2 分鐘(kW-min/m2) 59 39 峰值(kW/m2) 70 58 至峰值之時間(Min) 2.65 2.40 外觀 泡沫碳渣 泡沫碳逢 295°C g/l〇 min之MFR 17.7 13.9 撓曲模數Kpsi 382 399 撓曲強度Kpsi 17.6 18.3 抗張強度(Y)Kpsi 11.0 11.7 抗張模數Kpsi 372 383 118322.doc -92- 200832839 實例* 35 36 %伸長(B) 89 110 HDT 264 psi°C 134 132 缺口衝擊性ft-lbs/in 2.6 3.5 具有3 phr Ti02之*摻合物 實例8 藉由在2.5英吋之單螺桿、真空通風擠壓機中對熔融矽石 之混合物所進行的擠壓而製備PSEI-3與PSEI-4樹脂之摻合 f' 物。除另行標註,否則以總組合物之重量%列出組合物。 將擠壓機設定為約350至400°C。在真空下以約90 rpm使摻 合物運轉。將擠出物冷卻、粒化且於120°C乾燥。使用30秒 之循環時間於385-400°C之設定溫度及175°C之模製溫度將 測試樣本射出成形。 使用ASTM測試方法量測性能。按照ASTMD1238使用6.7 Kg之重量於367°C對經乾燥之顆粒執行熔融流動速率 (MFR) 〇在測試之前以50%之相對濕度對所有模製樣本調節 C 至少48小時。按照ASTM D25 6在室溫下於3.2 mm厚之桿上 量測缺口衝擊性值。按照人8丁]^0648在3.2 111111厚之桿上於 0.46 MPa(66 psi)量測熱變形溫度(HDT)。按照ASTM方法 D638在3.2 mm之類型I之桿上量測抗張性能。按照ASTM方 法D790在3.2 mm之桿上量測撓曲性能。按照ASTM方法 D2990在3.2 mm之類型I之桿上量測抗張潛變性能。 表8展示經填充及未經填充之PSEI-3及PSEI-4系統之良 好的抗張及撓曲性能。如於調配物37及38所見,可藉由添 118322.doc -93- 200832839 加熔融矽石而增強撓曲及抗張性能。表9展示PSEI-3及 PSEI-4系統相較於PEI(Ultem 1000)增強之抗潛變性。在 150°C,PSEI系統展現比PEI系統高之抗潛變性。在所有溫 度,PSEI-4在測試後100小時展示比PEI及PSEI-3系統更佳 之抗潛變性(亦即,較低%應變)。經填充之PSEI系統37及38 展示比未經填充之PSEI系統更高之抗潛變性。 表8 Γ 調配物 PSEI-3 37 PSEI-4 38 PSEI-3 100 88 0 0 PSEI-4 0 0 100 88 熔融矽石 0 12 0 12 367°C 之 MFR 1.7 1.1 5.5 0.6 撓曲模數Kpsi 450 542 460 548 撓曲強度Kpsi 22.4 23.2 24.0 24.1 抗張強度(Y)Kpsi 13.8 12.8 13.0 14.1 %伸長(B) 6.0 6.7 4.0 4.1 HDT 66 psi °C 237 233 248 256 缺口衝擊性ft-lbs/in 1.30 0.52 0.82 0.59 表9· PEI及PSEI調配物之抗潛變性 118322.doc -94- 200832839 樣本 溫度(°C) %填料 (pph) 應力(MPa) 100 Hrs之 %應變 PEI 150 0 10 0.63 PSEI-3 150 0 10 0.528 PSEI-3 178 0 10 0.640 37 178 13.6 10 0.439 PSEI-4 150 0 10 0.395 PSEI-4 178 0 10 0.456 PSEI-4 200 0 10 0.549 38 178 13.6 10 0.339 38 200 13.6 10 0.477 ^、 雖然已參考較佳實施例描述本發明,但熟習此項技術者 應瞭解,在不脫離本發明之範疇的情況下可進行各種改變 且可以等效物替代本發明之元件。另外,在不脫離本發明 之本質範疇的情況下可進行許多修改以使特定情況或材料 適應於本發明之教示。因此,意欲使本發明不限於經揭示 為所涵蓋用於執行本發明之最佳模式的特定實施例,而是 本發明將包括在附加申請專利範圍内之所有實施例。 Ο 118322.doc 95·Release Test for Cabin Materials". Materials used in these formulations are the resorcinol ester polycarbonate (ITR) resin 118322.doc -83- 200832839 which is composed of isodecyl and palladium chloride. : 1 a mixture of a mixture of resorcinol, bisphenol A (BPA) and sulphur chloride. The ITR polymer is named by the approximate molar ratio of the ester bond to the carbonate bond. ITR9010 has a molar Between benzene phenolate bond, 8 mol% of benzenediol carbonate bond and about 10 mol. / BPA carbonate bond. Tg = 131. 〇 PEI = ULTEM 1000 polyether phthalimide, borrowed Made from the reaction of bisphenol A dianhydride with about the same molar amount of phenylenediamine from GEplastics. PEI-nonane is based on m-phenylenediamine, BpA-dianhydride and an average of about one polyoxyl a polyether quinone dimethyl methoxy olefin copolymer prepared by imidization of an atomic bis-aminopropyl functional methyl methoxy oxane having a "heavy / oxime oxane content and The gel was subjected to gel permeation chromatography to measure about 24, and 〇(10) of Μ 〇 PC was ΒΡΑ polycarbonate from GE Plastics, LEXAN 130. A mixture of a resorcinol-based polyester carbonate resin and a polyether phthalimide and a polyoxymethylene phthalimide copolymer resin in a 2.5-inch single-screw, vacuum-ventilated extruder The extrusion was carried out to prepare a blend. The compositions are listed as % by weight of the total composition, unless otherwise noted. The extruder was set to approximately 285 to 340 °C. The blend was run at about 9 rpm under vacuum. The extrudate was cooled, granulated and dried at 12 (rc drying. The test sample was injection molded using a cycle time of 3 sec. at a set temperature of 320-360 C and a molding temperature of 120 ° C. UV protection of the article Coatings. Formulations 10 and 1 of Table 2 indicate how the substitution of PC with resorcinol ester polycarbonate (ITR9 010) is given in the PEI/polyoxymethylene polyimide copolymer blend. Two minutes and a significant reduction in total heat release. Note that resorcinol ester polymerization 118322.doc -84- 200832839 The addition of carbonate can also increase the flow rate (in this case MFR = melt flow rate g/10 min, amount Measured at 29 5 ° C) and improved elongation at break. Table 2 〇 Formulation 10 11 PEI 76 76 ITR9010 10 20 PEl·矽 Oxygen 4 4 PC 10 0 Ti〇2 3 3 Heat release 2 minutes (kW- Min/m2) 10 12 peak (kWm2) 34 29 to peak time (Min) 4.60 4.50 295〇C MFR 3.0 3.6 Flexing modulus Kpsi 464 462 Flexural strength Kpsi 22.1 22.4 Tensile strength (Y) Kpsi 14.8 15.0 % elongation (B) 39 50 HDT 264 psi°C 163 164 Maximum energy load ft-lbs 54 56 Notched impact ft-lbs/in 1.4 1.3 Table 3 shows A series of PEI blends with various amounts of succinyl acrylate polycarbonate and 1 to 4% polyoxy oxy phthalimide copolymer. Formulations 12-18 all exhibited very low two minute heat release and Lower peak heat release. Samples all showed higher MFR indicating good melt flow. HDT was greater than 150 ° C in all examples. The formulations also had a deflection of 2400 Kpsi (2760 Mpa) 118322.doc -85- 200832839 Modulus. It is also noted that very low heat release can be achieved even with lower levels of polyetherimine (for example, polysqualimimine less than one and a half of the total blend of formulations 15 and 17) In this formulation, 12-18 had 3.0 parts per hundred (phr) of titanium dioxide and 0.1 phr of triaryl phosphite was present. Table 3 Formulation 12 13 14 15 16 17 18 PEI ITR9010 PEI-矽 Oxygen Alkane 56.5 42.5 1.0 78.0 20.0 2.0 63.0 35.0 2.0 48.0 50.0 2.0 69.5 27.5 3.0 46.0 50.0 4.0 76.0 20.0 4.0 All blends with 3 phr Ti〇2 & 0.1 phr triaryl phosphite Formulations 19 and 20 in Table 4 Shows the benefits of the addition of Ti〇2 for reducing heat release and increasing time to peak heat should. Note that Examples 19 and 2 can have excellent heat release properties, and Formulation 20 can have a slightly lower peak heat release value and a longer to peak heat time, which demonstrates the beneficial effects of metal oxide additions. Table 4 Formulations 19 20 21 22 23 24 25 PEI 67.5 67.5 68 58 19.15 18.40 17.65 ITR9010 30.0 30.0 20 30 80.0 80.0 80.0 PEl·oxane 2.5 2.5 2 2 0.75 1.50 2.25 PC 10 10 Triaryl phosphite 0.1 0.1 0.1 Ti〇2 0.0 3.0 3 3 Heat release 2 minutes (kW-min/m2) 16 12 17 15 23 18 18 Peak (kW/m2) 31 29 29 35 39 40 X yj 40 Time to peak (Min) 3.87 4.69 3.21 4.34 3.74 3.34 3.64 Comment Foam Foam Bubble Breaking > Checking Carbon; Checking Carbon &gt; Checking 118322.doc -86 - 200832839 Formulation 19 20 21 22 23 24 25 MFR 3.1 of 295 ° C 3.0 3.0 2.6 4.0 13.9 14.8 14.5 Flexural Modulus Kpsi 467 470 465 485 399 395 393 Flexural strength Kpsi 23.3 22.9 22.3 21.9 19.3 19.4 19.3 Tensile strength (Y) Kpsi 14.3 14.0 13.8 13.3 12.4 12.4 12.3 % elongation (B) 52 86 82 100 40 45 46 HDT264 psi°C 169 169 169 161 133 134 133 Maximum energy load ft-lbs 54 57 55 58 50.7 50.6 52.9 Notched impact ft-lbs/in 0.9 1.0 1.2 1.3 2.7 2.5 2.6 2.0 111111% transmittance 74.3 72.4 72.5 2.0 111111% turbidity 5.9 6.6 5.8 Table 4 Also show formulations 21 and 22. These blends combine resorcinol ester polycarbonate, polyether quinone imine and polydecyloxypolyimine copolymer with additional non-arylated polycarbonate, bisphenol A polycarbonate (PC) . These blends exhibit a flexural modulus of HDT, &gt;390 Kpsi (2691 Mpa) above 150 °C along with very low two minute and peak heat release values. Formulations 23, 24 and 25 are also shown in Table 4. These blends have a higher I resorcinol ester polycarbonate content. Even with a lower PEI oxime content and a lower PEI content, the blend can exhibit improved flame resistance as demonstrated by lower heat release values and longer to peak heat release times. Such blends can have excellent flow as exhibited by higher MFRs along with higher modulus and strength. The tensile elongation at break of all examples can be higher than 25%. Note that at 2.0 mm, the percent transmission can be above 70%, while the turbidity can be lower, even below 10% in these three component polymer blends. The notched impact strength is above 2.0 ft-lbs/in. Formulations 26, 27 and 28 are shown in Table 5. These blends have an equivalent of 118322.doc -87 - 200832839 content between the benzenediol ester polycarbonate and PEI. Even with a lower PEI oxime content (0.75 to 2.25 wt%), the blend can still indicate a lower heat release value. The blend may have a good flow exhibited by a higher MFR along with a higher modulus (&gt;390 Kpsi) and strength. The tensile elongation at break of all examples can be higher than 25%. Note that at 2.0 mm, the percent transmission is above 60%, while the turbidity is lower, below 10% in these polymer blends. Table 5 Example 26 27 28 29 30 31 PEI 49.15 48.40 47.65 79.15 78.40 77.70 ITR9010 50.0 50.0 50.0 20.0 20.0 20.0 PEI oxane 0.75 1.50 2.25 0.75 1.50 2.25 Triaryl phosphite 0.1 0.1 0.1 0.1 0.1 0.1 Heat release for 2 minutes (kW -min/m2) 14 12 13 13 10 9 Peak (kW/m2) 36 31 33 29 27 26 Time to peak (Min) 3.94 4.26 4.62 2.70 2.91 4.69 Foam foam foam foam beads Beads annotation carbon &gt; Check carbon residue carbon residue carbon residue carbon residue carbon residue 295 ° C MFR 6.7 6.9 7.0 2.1 2.1 2.3 flexural modulus Kpsi 441 430 433 467 473 473 flexural strength Kpsi 22.1 21.7 21.8 23.9 24.4 24.2 tensile strength (Y) Kpsi 13.9 13.7 14.1 16.0 15.8 15.7 % elongation (B) 38 54 80 95 72 28 HDT 264 psi °C 155 151 151 171 176 175 Maximum energy load ft-lbs f 61.1 53.1 59.6 58.3 57.1 62.2 Notched impact ft-lbs/in 1.4 1.6 1.5 1.0 1.0 1.2 2.0 mmi% transmission 73.0 72.4 68.8 72.1 70.1 66.4 2.0 111111 % turbidity 2.5 3.1 5.8 2.5 4.0 7.0 118322.doc -88 - 200832839 Formulation 29-3 1 is also shown in Table 5. These blends have a lower amount of meta- succinyl ester polycarbonate. With a very low PEI oxime content (0.75 to 2.25 wt%), the blend can still indicate lower heat release values and less time to peak heat release. The blend can exhibit flow useful for melt processing applications along with higher modulus (&gt;390 Kpsi) and strength. The tensile elongation at break in all of the examples was higher than 25%. Note that at 2.0 mm, the percent transmission can be above 60%, while the turbidity can be lower, below 10% in these polymer blends. ◎ Example 5 The performance was measured using the ASTM test method. The melt flow rate (MFR) was applied to the dried pellets according to ASTM D1238 using a weight of 6.7 Kg at 295 ° C. All molded samples were conditioned at 50% relative humidity for at least 48 hours prior to testing. According to ASTM D256 at room temperature The notched impact value was measured on a 3.2 mm thick rod. The heat distortion temperature (HDT) was measured at 1.82 MPa (264 psi) on a 3.2 111111 thick rod according to 8 乂 0648. According to ASTM method D638 at 3·2 Tensile properties were measured on a rod of type I of mm. Flexural properties were measured on a 3.2 mm rod according to ASTM method D790. As measured by the method listed in FAR 25.853, use Ohio State University ( The OSU) heat release rate device is tested for heat release at a thickness of 2.0 mm on a 15·2 x 15.2 cm sheet. The heat is measured in kW-min/m2 (kilowatt minutes per square meter) for two minutes. Release. The peak heat release is measured in kW/m2 (kilowatts per square meter). The maximum heat release time is also measured in minutes. The heat release test method is also described in 'Aircraft Materials Fire Test Handbook'. ,* DOT/FAA/AR-00/12 ' 118322.doc -89- 2 00832839 Chapter 5 ''Heat Release Test for Cabin Materials'. Materials used in these examples are the metaxyl phenolate polycarbonate (ITR) resin from isoindole and palladium chloride 1: A polymer prepared by the condensation of a mixture with meta-phenylene, double-aged A (BPA) and carbonium chloride. The ITR polymer is named by the approximate molar ratio of the bond to the carbonate bond. The ITR9010 has about 82. Molar% between the benzenediol ester bond, 8 mol% of the benzenediol carbonate bond and about 1 〇 mol% of the ugly octacarbonate bond. Tg = 131 ° C PEI-decane Polyfluorinated imine dimethyl sulphate prepared by imidization of m-phenylenediamine, BPA-dianhydride and bis-aminopropyl rivenyl polyphosphate containing an average of about 10 polyfluorene oxygen atoms An oxoxane copolymer having a decane content of about 34% by weight and a Μη of about 24,000 as measured by gel permeation chromatography. PSU is produced by the reaction of bismuth and dichlorodiphenyl hydrazine, and It is a polyfluorene sold by Solvay Co. as UDEL 1700. PES is produced by the reaction of dihydroxy phenyl sulfone and dichlorodiphenyl sulfone, and sold as ULTRASON E by BASF Co. Ether sulfone Note that blends according to this example having the 3 parts per hundred parts (phr) titanium dioxide (Ti〇2) was added during the compounds. Mixture of resorcinol-based polyester vinegar resin with polysulfone or polyether sulfone and polyoxymethylene phthalimide copolymer resin in a 25-inch single-screw, vacuum-ventilated extruder The extrusion was carried out to prepare a blend. The compositions are listed as % by weight of the total composition unless otherwise noted. Set the extruder to approximately 285 to 34 inches. Hey. The blend was run at about 9 rpm under vacuum. The extrudate was cooled, granulated and dried at 12 Torr. The test sample was injection molded using a 30 second cycle time at 32 〇 _36 (set temperature of rc and 12 〇 118322.doc 200832839 molding temperature. Formulation 32 of Table 6 shows resorcinol ester polycarbonate ( A blend of ITR9010), polysulfone (PSu) and polyoxyphthalocyanine copolymer (PEI-oxime) which gives a two minute minute and a very large reduction in peak heat release. The release is reduced from 63 kW-min/m2 to 47 kW-min/m2. The peak heat release can also be reduced from 120 kW/m2 to 75 kW/m2. The peak heat release time can also be increased from 2.56 minutes. By 3.72 minutes, the time during which the heat release reaches the maximum intensity is delayed. Formulation 33 shows the blending of polysulfone with polyethersulfone (PES) and ITR9010 and polyoxymethylene iodide f:. Heat release performance and improved flow. Table 6 Example* 32 33 34 PSu 62.5 31.25 62.5 PES 0 31.25 0 PEI oxime 2.5 2.5 2.5 ITR9010 35 35 35 Heat release 2 minutes (kW-min/m2) 47 57 31 Peak ( kW/m2) 75 75 65 to peak time (Min) 3.72 2.91 3.74 Appearance foam carbon residue foam carbon residue foam carbon residue 2 MFR of 85 ° C g / l 〇 min 13.8 11.9 10.9 blend with 3 phr Ti02 Example 6 Table 6, Formulation 34 shows resorcinol ester polycarbonate (ITR9010) and 2.5% by weight of polyfluorene Polyethersulfone (PES) blend of oxymethylene iminone copolymer. Formulation 34 can be burned according to the FAR/OSU test and produces foamed carbon slag for use as a barrier to flame propagation. It can also have a lower Heat release value, 118322.doc -91- 200832839 Longer to peak heat release time and used as a more effective barrier to flame spread. Example 7 Formulations 35 and 36 in Table 7 show PSU or PES and higher a blend of the content (60% by weight) of the benzenediol ester polycarbonate copolymer. The blend can exhibit a lower two minute heat release value and a lower peak heat release value. The foamed carbon residue of the flame-spreading barrier. Examples 35 and 36 also show higher melt flow, surprisingly not burning or flowing away from the flame during the FAR/OSU test. The blend can also exhibit higher deflection Modulus (2300 Kpsi or 2070 MPa) and higher flexural strength (215 Kpsi or 103.5 Mpa) and higher (25 0%) Elongation at break. Table 7 Example* 35 36 PSu 37.5 0 PES 0 37.5 PEI oxime 2.5 2.5 ITR9010 60 60 Heat release 2 minutes (kW-min/m2) 59 39 Peak (kW/m2) 70 58 Time to peak (Min) 2.65 2.40 Appearance foam Carbon residue foam Carbon at 295°C g/l〇min MFR 17.7 13.9 Flexural modulus Kpsi 382 399 Flexural strength Kpsi 17.6 18.3 Tensile strength (Y) Kpsi 11.0 11.7 Tensile modulus Kpsi 372 383 118322.doc -92- 200832839 Example* 35 36% elongation (B) 89 110 HDT 264 psi°C 134 132 Notched impact ft-lbs/in 2.6 3.5 with 3 phr Ti02* blending Example 8 A blend of fEI-3 and PSEI-4 resin was prepared by extrusion of a mixture of molten vermiculite in a 2.5 inch single screw, vacuum ventilator. The compositions are listed as % by weight of the total composition unless otherwise noted. The extruder was set to about 350 to 400 °C. The blend was run at about 90 rpm under vacuum. The extrudate was cooled, granulated and dried at 120 °C. The test sample was injection molded using a 30 second cycle time at a set temperature of 385-400 ° C and a molding temperature of 175 ° C. Performance was measured using the ASTM test method. The melt flow rate (MFR) was applied to the dried pellets at 367 ° C using a weight of 6.7 Kg according to ASTM D1238. All molded samples were adjusted for C for at least 48 hours prior to testing at 50% relative humidity. The notched impact value was measured on a 3.2 mm thick rod at room temperature according to ASTM D25 6. The heat distortion temperature (HDT) was measured at 0.46 MPa (66 psi) on a 3.2 111111 thick rod according to the person 8 □]^0648. Tensile properties were measured on a 3.2 mm type I rod in accordance with ASTM method D638. Flexural properties were measured on a 3.2 mm rod according to ASTM method D790. The tensile latent properties were measured on a 3.2 mm type I rod according to ASTM method D2990. Table 8 shows the good tensile and flexural properties of the filled and unfilled PSEI-3 and PSEI-4 systems. As seen in formulations 37 and 38, flexural and tensile properties can be enhanced by the addition of molten vermiculite to 118322.doc -93-200832839. Table 9 shows the enhanced anti-potential denaturation of the PSEI-3 and PSEI-4 systems compared to PEI (Ultem 1000). At 150 ° C, the PSEI system exhibits higher resistance to latent densities than the PEI system. At all temperatures, PSEI-4 exhibited better resistance to latent denaturation (i.e., lower % strain) than the PEI and PSEI-3 systems at 100 hours after testing. The filled PSEI systems 37 and 38 exhibited higher resistance to latent densities than the unfilled PSEI system. Table 8 调 Formulation PSEI-3 37 PSEI-4 38 PSEI-3 100 88 0 0 PSEI-4 0 0 100 88 Molten vermiculite 0 12 0 12 MFR of 367 ° C 1.7 1.1 5.5 0.6 Flexural modulus Kpsi 450 542 460 548 Flexural strength Kpsi 22.4 23.2 24.0 24.1 Tensile strength (Y) Kpsi 13.8 12.8 13.0 14.1 % elongation (B) 6.0 6.7 4.0 4.1 HDT 66 psi °C 237 233 248 256 Notched impact ft-lbs/in 1.30 0.52 0.82 0.59 Table 9. Anti-latent degeneration of PEI and PSEI formulations 118322.doc -94- 200832839 Sample temperature (°C) % Filler (pph) Stress (MPa) 100 Hrs% strain PEI 150 0 10 0.63 PSEI-3 150 0 10 0.528 PSEI-3 178 0 10 0.640 37 178 13.6 10 0.439 PSEI-4 150 0 10 0.395 PSEI-4 178 0 10 0.456 PSEI-4 200 0 10 0.549 38 178 13.6 10 0.339 38 200 13.6 10 0.477 ^, although reference has been made The present invention is described in the preferred embodiments, and it is understood by those skilled in the art that various changes can be made without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the scope of the invention. Therefore, the invention is not intended to be limited to the specific embodiments disclosed, and the invention is intended to cover the invention. Ο 118322.doc 95·

Claims (1)

200832839 十、申請專利範圍: 種電連接器,其包含組成一電模組之至少一插塞及至 ^ 插孔’及一包含聚合物或聚合物之摻合物的可選殼 層邛件,該或該等聚合物係自由下列各物組成之群中選 出··幻包含一或多種聚醚醯亞胺之聚合物之不可混溶摻合 物σ亥等聚合物具有一個以上之玻璃轉移溫度,其中該 水醚騃亞胺具有一大於攝氏217度之玻璃轉移溫度;…包 否一或多種聚醚醯亞胺之聚合物之可混溶摻合物,該等 聚合物具有一大於攝氏180度之單一玻璃轉移溫度;或幻 具有一大於攝氏247度之玻璃轉移溫度的單一聚醚醯亞 2·如凊求項1之電連接器,其中該聚醚醯亞胺具有在約〇·4 與〇·85之間的氫原子對碳原子比。 3·如明求項1之電連接器,其中該聚_醯亞胺本質上無苯甲 基質子。 4 ·如明求項1之電連接器,其包含聚合物之不可混溶摻合 物,該等聚合物具有一個以上之玻璃轉移溫度,且其中 非聚醚醯亞胺聚合物具有一大於約攝氏18〇度之玻璃轉 移溫度。 5.如請求項1之電連接器,其包含聚合物之可混溶摻合物, 該等聚合物具有一大於攝氏2〇〇度之單一玻璃轉移溫度。 6·如睛求項1之電連接器,其包含具有一大於攝氏度之 玻璃轉移溫度的單一聚醚醯亞胺聚合物。 7 ·如明求項1之電連接器,其包含自由聚颯、聚醚石風、聚苯 118322.doc 200832839 喊石風及其混合物組成 , g丘取仏 出之弟一樹脂、包含聚矽 之第二樹脂及包含以間苯二酚為主的芳基聚醋 ::曰之第三樹脂之—摻合物,其中大於或等於莫耳%之 方:聚_為自間苯二_衍生之芳基醋鍵。 月求員7之电連接器’其中該聚矽氧共聚物係自由下列 ,物、且成之群中選出··聚醯亞胺矽氧烷、聚醚醯亞胺矽 氧、元I it酿亞胺石風石夕氧烧、聚碳酸酉旨石夕氧烧、聚醋碳 (Λ Μ曰矽氧烷、聚砜矽氧烷、聚醚砜矽氧烷、聚苯醚砜矽 氧烷及其混合物。 9.如請求項7之電連接器,其中該聚石夕氧共聚物含量為該聚 合物摻合物之0.1至約10.0重量%。 ίο.如請求項7之電連接器,其中該聚矽氧共聚物具有5至約 70重量。/〇之矽氧烷含量。 11·如請求項7之電連接器,其中該等聚砜、聚醚砜、聚苯醚 砜及其混合物具有小於或等於〇85之氫原子對碳原子比。 〇 I2·如請求項1之電連接器,其進一步包含以該聚合物摻合物 之重量計佔0.1至20重量%之一或多種金屬氧化物。 1 3 .如請求項7之電連接器,其中該以間苯二酚為主之芳基聚 酉旨具有以下所示之結構:200832839 X. Patent application scope: An electrical connector comprising at least one plug and a jack constituting an electric module and an optional shell element comprising a polymer or polymer blend, Or the polymer is free from the group consisting of: the immiscible blend of one or more polymers comprising polyether sulfimine, such as a polymer having more than one glass transition temperature, Wherein the water ether imine has a glass transition temperature greater than 217 degrees Celsius; ... a miscible blend of polymers of one or more polyether quinones having a temperature greater than 180 degrees Celsius a single glass transition temperature; or a single polyether having a glass transition temperature greater than 247 degrees Celsius, such as the electrical connector of claim 1, wherein the polyether sulfimine has a relationship of about 〇·4 The ratio of hydrogen atoms to carbon atoms between 〇·85. 3. The electrical connector of claim 1, wherein the poly-imine is substantially free of a benzoic matrix. 4. The electrical connector of claim 1, comprising an immiscible blend of polymers having more than one glass transition temperature, and wherein the non-polyetherimine polymer has a greater than about Glass transition temperature of 18 degrees Celsius. 5. The electrical connector of claim 1 comprising a polymer miscible blend having a single glass transition temperature greater than 2 degrees Celsius. 6. The electrical connector of claim 1, comprising a single polyetherimine polymer having a glass transition temperature greater than one degree Celsius. 7 · The electrical connector of claim 1, which comprises free polyfluorene, polyether stone, polyphenyl 118322.doc 200832839, called stone wind and its mixture, g 丘 取 之 之 一 一 一 树脂 、 、 、 a second resin and a mixture comprising a resorcinol-based aryl polyacetate: a third resin of ruthenium, wherein the ratio is greater than or equal to the mole %: poly _ is derived from meta-benzene benzene The aryl vinegar bond. The electric connector of the month 7 is in which the polyoxy-copolymer is free from the following, and the selected ones are selected from the group consisting of polyethylenimine, polyether oxime, and oxygen. Imine stone fengxi oxygen burning, polycarbonate 石 石 oxygen burning, poly vinegar carbon (Λ Μ曰矽 、, polysulfone oxirane, polyether sulfone oxirane, polyphenylene ether sulfone oxirane and 9. The electrical connector of claim 7, wherein the polyoxo copolymer content is from 0.1 to about 10.0% by weight of the polymer blend. ίο. The electrical connector of claim 7, wherein The polyoxynoxy copolymer has a siloxane content of from 5 to about 70% by weight. 11. The electrical connector of claim 7, wherein the polysulfone, polyether sulfone, polyphenylene ether sulfone, and mixtures thereof have a hydrogen atom to carbon atom ratio of less than or equal to 〇85. 〇I2. The electrical connector of claim 1, further comprising one or more metal oxides in an amount of from 0.1 to 20% by weight based on the weight of the polymer blend The electrical connector of claim 7, wherein the resorcinol-based aryl group has the structure shown below: 其中R*C1M2烷基、c0-C24芳基、烷基芳基、烷氧基或齒 118322.doc 200832839 素中之至少一者;且广 η為〇_4且m為至少約8。 14.如匕請求項7之電連接器,其中該以間苯二㈣主之聚_ 月曰為含有具有以下所示之結構之碳酸酯鍵的共聚物:And wherein at least one of R*C1M2 alkyl, c0-C24 aryl, alkylaryl, alkoxy or dentate 118322.doc 200832839; and η is 〇_4 and m is at least about 8. 14. The electrical connector of claim 7, wherein the poly(n-(tetra) main poly- _ 曰 is a copolymer containing a carbonate bond having the structure shown below: 其中R為C^2烷基、CpC24芳基、烷基芳基、烷氧基或 素中之至少一者,η為0-4,R5為至少一個二價有機基, m 為約4_150且ρ為約2-200。 15·如請求項14之電連接器,其中R5係衍生自雙酚化合物。 16·如請求項1之電連接器,其中該不可混溶、相分離之聚合 物摻合物包含以下各物之混合物:a)自包含聚芳醚_、聚 Ο 芳基酮1、聚鱗酮及聚鱗鱗自同之群中之一或多者中選出之 第一樹脂組份;及b)包含至少一種聚砜醚醯亞胺之第二樹 脂組份,該至少一種聚颯醚醯亞胺具有大於或等於5〇莫 耳%之含有至少一芳颯基的鍵。 17·如請求項16之電連接器,其中該聚颯醚醯亞胺含有芳砜 鍵及芳醚鍵,以使得該聚砜醚醯亞胺之至少50莫耳%的重 複單元含有至少一芳醚鍵、至少一芳砜鍵及至少兩個芳 醯亞胺鍵。 18·如請求項16之電連接器,其中該等聚砜醚醯亞胺鍵之至 少50莫耳%係衍生自氧雙苯二甲酸酐或其化學等效物。 118322.doc 200832839 19. 如請求項16之電連接器,其中聚砜醚醯亞胺鍵之小於3〇 莫耳%係衍生自含有亞異烷基之二胺或二酐。 20. 如晴求項1之電連接器,其中成形物品具有大於或等於 170 C之熱變形溫度(HDT),該溫度係按照ASTM方法D648 在66 psi(0.46 Mpa)下於一 3·2 mm樣本上量測。 2 1 ·如請求項16之電連接器,其中該聚砜醚醯亞胺佔該整個 成形物品之3 0至約70重量%。 22·如請求項16之電連接器,其中該成形物品具有小於5重量 %之纖維強化物。 23. 如請求項16之電連接器,其中該成形物品具有在2〇〇〇c下 大於約200 Mpa之模數,該模數係藉由ASTM D5418於一 3.2 mm樣本上量測。 24. 如請求項16之電連接器,其中該成形物品具有自2〇〇至 10,000帕斯卡秒之熔融黏度,其係藉由ASTM方法D3835 於380°C下量測。 25. 如請求項16之電連接器,其中該成形物品具有在380°C下 10分鐘之後自其初始值改變不超過35%之熔融黏度。 26·如請求項16之電連接器,其中該聚砜醚醯亞胺本質上無 苯曱基質子。 27.如請求項16之電連接器,其中該一或多種聚芳醚酮、聚 芳基酮、聚鱗酮及聚具有一自300°C至380°C之結晶 熔點。 28·如請求項16之電連接器,其中該聚颯醚醯亞胺具有一自 250°C至350°C之玻璃轉移溫度(Tg)。 118322.doc 200832839 29· ^請求項i之電連接器,其具有如藉由astm方法D54u 量測得之至少兩個不同玻璃轉移溫度,其中第一玻璃轉 移溫度俦、自12G°CS2GG°C且第二玻璃轉移溫度係自25『c 至 350°C。 30. 如請求項1之電連接器,其包含自由聚醯亞胺、聚喊醯亞 胺、聚醚醯亞胺砜及其混合物組成之群中選出之第一樹 脂、包含聚矽氧共聚物之第二樹脂及包含以間苯二酚為 主的芳基聚酯樹脂之第三樹脂之一摻合物,其中大於或 等於50莫耳%之該等芳基聚酯鍵為衍生自間苯二酚之芳 基酯鍵。 31. 如凊求項30之電連接器,其中該聚矽氧共聚物為自由下 列各物組成之群中選出之一或多者:聚醯亞胺矽氧烷、 聚醚醯亞胺矽氧烷、聚醚醯亞胺砜矽氧烷、聚碳酸酯矽 氧烷、聚酯碳酸酯矽氧烷、聚砜矽氧烷、聚醚砜矽氧烷 及聚苯醚砜矽氧烷。 32·如請求項30之電連接器,其中該聚矽氧共聚物含量為該 聚合物摻合物之0.1至約1〇.〇重量%。 33.如請求項30之電連接器,其中該聚矽氧共聚物具有5至7〇 重量%之矽氧烷含量。 34·如請求項30之電連接器,其中該等聚醯亞胺、聚醚醯亞 胺、聚醚醯亞胺礙及其混合物具有小於或等於〇·75之氫原 子對碳原子比。 35·如請求項30之電連接器,其進一步包含以該聚合物摻合 物之重量計佔0.1至20重量%之一或多種金屬氧化物。 118322.doc 200832839 36.如請求項3〇之電連接器,其中該以間苯二酚為主之芳基 聚®旨具有以下所示之結構:Wherein R is at least one of C^2 alkyl, CpC24 aryl, alkylaryl, alkoxy or saccharin, η is 0-4, R5 is at least one divalent organic group, m is about 4-150 and ρ It is about 2-200. 15. The electrical connector of claim 14, wherein the R5 is derived from a bisphenol compound. The electrical connector of claim 1, wherein the immiscible, phase-separable polymer blend comprises a mixture of the following: a) self-contained polyarylene ether, polyarylene aryl ketone 1, polyscale a first resin component selected from one or more of a ketone and a polyscale scale; and b) a second resin component comprising at least one polysulfone ether quinone imine, the at least one polyethyl ether oxime The imine has a bond containing at least one aryl fluorenyl group of greater than or equal to 5 〇 mol%. 17. The electrical connector of claim 16, wherein the polyethylenimine contains an aryl sulfone bond and an aryl ether bond such that at least 50 mole percent of the repeating unit of the polysulfone ether sulfimine contains at least one aromatic An ether bond, at least one aryl sulfone bond, and at least two aryl imine bonds. 18. The electrical connector of claim 16, wherein at least 50 mole percent of the polysulfone ether quinone imine linkages are derived from oxy phthalic anhydride or a chemical equivalent thereof. 19. The electrical connector of claim 16, wherein less than 3 moles of polysulfone ether oxime bond is derived from a diamine or dianhydride containing an isoalkylene group. 20. The electrical connector of claim 1, wherein the shaped article has a heat distortion temperature (HDT) greater than or equal to 170 C, which is in accordance with ASTM method D648 at 66 psi (0.46 Mpa) at a 3.2 cm Measure on the sample. The electrical connector of claim 16, wherein the polysulfone ether iodide comprises from 30 to about 70% by weight of the entire shaped article. 22. The electrical connector of claim 16, wherein the shaped article has less than 5% by weight of fiber reinforcement. 23. The electrical connector of claim 16, wherein the shaped article has a modulus greater than about 200 MPa at 2 〇〇〇c, the modulus being measured on a 3.2 mm sample by ASTM D5418. 24. The electrical connector of claim 16, wherein the shaped article has a melt viscosity from 2 Torr to 10,000 Pascal seconds, which is measured at 380 ° C by ASTM method D3835. 25. The electrical connector of claim 16, wherein the shaped article has a melt viscosity that does not change by more than 35% from its initial value after 10 minutes at 380 °C. The electrical connector of claim 16, wherein the polysulfone ether imine is substantially free of a benzoquinone matrix. 27. The electrical connector of claim 16, wherein the one or more polyaryletherketones, polyaryl ketones, polyketones, and polys have a crystalline melting point from 300 ° C to 380 ° C. 28. The electrical connector of claim 16, wherein the polyethylenimine has a glass transition temperature (Tg) from 250 °C to 350 °C. 118322.doc 200832839 29· ^ Electrical connector of claim i having at least two different glass transition temperatures as measured by the astm method D54u, wherein the first glass transition temperature 俦, from 12G ° CS 2 GG ° C and The second glass transition temperature is from 25 "c to 350 °C. 30. The electrical connector of claim 1, comprising a first resin selected from the group consisting of free polyimine, polydecyl imine, polyether sulfoxide, and mixtures thereof, comprising a polyoxyloxy copolymer a second resin and a blend of a third resin comprising a resorcinol-based aryl polyester resin, wherein greater than or equal to 50 mol% of the aryl polyester bonds are derived from meta-benzene An aryl ester bond of a diphenol. 31. The electrical connector of claim 30, wherein the polyoxynoxy copolymer is one or more selected from the group consisting of: polyfluorene iodide, polyether oxime, oxygen Alkanes, polyether oxime sulfoxide oxiranes, polycarbonate siloxanes, polyester carbonate oxiranes, polysulfone oxanes, polyether sulfone siloxanes, and polyphenylene ether sulfone oxiranes. 32. The electrical connector of claim 30, wherein the polyoxymethylene copolymer content is from 0.1 to about 1% by weight of the polymer blend. 33. The electrical connector of claim 30, wherein the polyoxynoxy copolymer has a decane content of from 5 to 7% by weight. 34. The electrical connector of claim 30, wherein the polyimine, polyetherimine, polyetherimine, and mixtures thereof have a hydrogen to carbon ratio of less than or equal to 〇75. 35. The electrical connector of claim 30, further comprising from 0.1 to 20% by weight, based on the weight of the polymer blend, of one or more metal oxides. The electrical connector of claim 3, wherein the resorcinol-based aryl poly® has the structure shown below: ,其中R為cN12烷基、C0_C24芳基、烷基芳基、烷氧基或函 素中之至少一者,Wherein R is at least one of cN12 alkyl, C0_C24 aryl, alkylaryl, alkoxy or a lignin, η為0-4且m為至少約8。 37·如請求項30之電連接器,其中該以間苯二酚為主之聚酯 樹脂為含有具有以下所示之結構之碳酸酯鍵的共聚物:η is 0-4 and m is at least about 8. 37. The electrical connector of claim 30, wherein the resorcinol-based polyester resin is a copolymer comprising a carbonate bond having the structure shown below: 〇 其中R為Ci — u烷基、C^C:24芳基、烷基芳基、烷氧基或鹵 素中之至少一者’ η為0-4,R5為至少一個二價有機基,m 為約4-150且p為約2-200。 3 8 ·如睛求項3 7之電連接器’其中R5係衍生自雙齡化合物。 3 9 _如請求項1之電連接器,其中該聚醚醯亞胺係由以下各物 製成 (a)自由下列各物組成之群中選出之芳二酐··雙酚a二 酐、氧雙苯二甲酸酐、苯四甲酸二酐、雙苯二甲酸酐、 石黃醯基二酐、硫二酐、二苯甲酮二酐及其混合物;及, 118322.doc 200832839 (b)自由下列各物組成之群中選出之芳二胺:間苯二 胺、對苯二胺、二胺基二苯砜、二胺基二苯醚、雙胺基 苯氧基苯、雙胺基苯氧基聯苯、雙胺基苯基苯基砜、二 月女基 '一本硫及其混合物。 40·如請求項1之電連接器,其中該成形物品包含具有一至少 約21 8t:之玻璃轉移溫度的共聚醚醯亞胺,該共聚醚醯亞 胺包含式(I)及(II)之結構單元:〇 wherein R is at least one of Ci—ualkyl, C^C:24 aryl, alkylaryl, alkoxy or halogen′ η is 0-4, and R 5 is at least one divalent organic group, m It is about 4-150 and p is about 2-200. 3 8 · Electrical connection of the item 7 7 wherein R5 is derived from a compound of two ages. The electrical connector of claim 1, wherein the polyether oxime is made of the following: (a) an arsenic anhydride selected from the group consisting of: bisphenol a dianhydride, Oxidative phthalic anhydride, pyromellitic dianhydride, phthalic anhydride, sulphate dianhydride, sulphur dianhydride, benzophenone dianhydride, and mixtures thereof; and, 118,322.doc 200832839 (b) Free An aromatic diamine selected from the group consisting of m-phenylenediamine, p-phenylenediamine, diaminodiphenyl sulfone, diaminodiphenyl ether, bisaminophenoxybenzene, bisaminophenoxy linkage Benzene, bisaminophenyl phenyl sulfone, February sulfonate, and a mixture thereof. 40. The electrical connector of claim 1 wherein the shaped article comprises a copolyetherimine having a glass transition temperature of at least about 21 8t: the copolyetherimine comprising formulas (I) and (II) Structural units: 及視情況,式(III)之結構單元:And, depending on the situation, the structural unit of formula (III): Ο 其中R1包含未經取代之C:6-22二價芳族烴或包含鹵素或烷 基取代基或該等取代基之混合物的經取代之c6 22二價芳 族煙;或通式(IV)之二價基:Ο wherein R1 comprises unsubstituted C: 6-22 divalent aromatic hydrocarbon or substituted c6 22 divalent aromatic cigarette comprising a halogen or alkyl substituent or a mixture of such substituents; or formula (IV) Bivalent base: 118322.doc 200832839 其中關於务環之未定位置異構體為Q之ρ i &lt;間位或對位,且Q 為共價鍵或自由式(V)組成之群中選出 屮 &lt; 成員: 0 II -S— II 0 (V) 0 II -c- 及具有式CyH2y之伸烷基或亞烷基,其中 /、Ty為一自1至5包括 Ο 端點之整數,且R2為二價芳基;式⑴之單元與式(I〗)之單 元之重量比在約99.9:0.1與約25:75之範圍内。 41·如請求項40之電連接器,其包含具有一大於225。〇之以之 共聚醚醯亞胺。 42·如請求項40之電連接器,其包含共聚醚醯亞胺,該共聚 醚醯亞胺包含該式(III)之結構單元。 43·如請求項40之電連接器,其中…係衍生自由下列各物組 成之群中選出之至少一種二胺:間苯二胺、對苯基胺、 2-甲基-4,6-二乙基-1,3_苯二胺、5-甲基-4,6-二乙基 Q 苯二胺、雙(4_胺基苯基)_2,2_丙烷、雙(2-氯-4-胺基-3,5_ 二乙基苯基)甲烷、4,4,-二胺基聯苯、3,4,-二胺基聯苯、 4,4匕二胺基二苯醚、3,4’-二胺基二苯醚、4,4,-二胺基二苯 砜、3,4’-二胺基二苯砜、4,4,-二胺基二苯酮、3,4,-二胺基 二苯酮、2,4-曱苯二胺及其混合物。 44.如請求項4〇之電連接器,其中R2係衍生自式(VI)之至少一 個經二羥基取代之芳族烴: HO—D—〇H 其中D具有式(VII)之結構: 118322.doc 200832839 (VII) 其中Α1表示芳基; Γ Ο 一 — (Y1)m I (R3)p I (Y1)m ^ A1 I A 1 t tz S A — E包含含硫鍵,硫化物、亞砜、砜;含磷鍵,氧鱗基、 膦醯基;醚鍵;羰基;三級氮基;含矽鍵,發院、硬烧 氧基;環脂族基;亞環戊基、3,3,5-三甲基亞環戊基、亞 環己基、3,3-二甲基亞環己基、3,3,5-三甲基亞環己基、 甲基亞環己基、2-[2.2.1]_聯亞環庚基、亞新戊基、亞環 十五基、亞ί衣十一^烧基、亞金剛烧基;伸烧基或亞烧基, 該基視情況可為連接至含一羥基取代基的一或多個芳基 之一或多個稠環之部分;不飽和亞烷基;或藉由不同於 伸烧基或亞烷基且自由下列各者組成之群中選出之部分 連接的兩個或兩個以上伸烷基或亞烷基··芳族鍵;三級 氮鍵;醚鍵;羰基鍵;含矽鍵,矽烷、矽烷氧基;含硫 鍵,硫化物、亞颯、颯;含磷鍵,氧膦基及膦醯基; R3包含氫;單價烴基、烯基、烯丙基、烷基、芳基、 芳烧基、烷芳基或環烷基; Υ1在每次出現時係獨立地自由下列各物組成之群中選 出.無機原子,鹵素;無機基,硝基;有機基,單價烴 基、烯基、烯丙基、烷基、芳基、芳烷基、烷芳基、環 烷基及烷氧基; 、 字母&quot;m&quot;表示自零且包括零至V之可供取代用的位置 數目的任一整數; 118322.doc 200832839 字母V,表示一自零且包括零至E之可供取代用的位置 數目的整數; 字母”t&quot;表示一至少等於一之整數; 子母S表不一專於零或'一之整數;且, ’’U&quot;表示包括零之任一整數。 45.如請求項40之電連接器,其中式(Ι)、(π)及(111)之每一者 中的R2結構單元為相同的。 46·如請求項40之電連接器,其中式(Ι)、(π)及(ΙΠ)中之至少 兩者中的R2結構單元之至少一部分不相同。 47·如請求項40之電連接器,其中R2係衍生自由下列各物組 成之群中選出之至少一種經二羥基取代之芳族烴: 4,4’-(亞環戊基)聯苯二酚;4,4,-(3,3,5-三甲基亞環戊基) 聯本一紛,4,4’-(亞環己基)聯苯二盼;4,4’- (3,3 -二甲基亞 環己基)聯苯二酚;4,4’-(3,3,5-三甲基亞環己基)聯苯二 酚;4,4’-(甲基亞環己基)聯苯二酚;4,4,_雙(3,5_二甲基) 聯笨一齡,1,1-雙(4-經基-3-甲基苯基)環己烧;4,4_雙(4-經苯基)庚烧;2,4’-二經基二苯基甲燒;雙d里苯基)甲 烧;雙(4-經苯基)甲烧;雙(4 —經基_5_硝基苯基)甲院;雙 (4-羥基-2,6-二曱基-3-甲氧苯基)甲烷;151_雙(4_羥苯基) 乙烷,1,2-雙(4-羥苯基)乙烷;1,1_雙(4_羥基_2_氯苯基) 乙烷;2,2-雙(4-羥苯基)丙烷;2,2-雙(3-苯基-4-羥苯基) 丙烧,2,2-雙(4-經基-3-曱基苯基)丙院;2,2-雙(4-經基 乙基笨基)丙烧;2,2-雙(4-經基-3-異丙基苯基)丙烧;2,2-雙(4_經基-3,5 -一甲基苯基)丙烧;(3,5,3,,5’ -四氯-4,4’-二 118322.doc -10- 200832839 羥苯基)丙烷;雙(4-羥苯基)環己基曱烷;2,2-雙(4_羥苯 基)_1_苯丙烷;2,4,-二羥苯基砜;二羥基萘,2,6-二羥基 萘;氫醌;間苯二酚;Cw烷基取代之間苯二酚;2,2_雙 -(4-羥苯基)丁烷;2,2-雙-(4_羥苯基)_2·曱基丁烷;匕^雙 -(4-經苯基)環己烷;雙_(4_羥苯基);雙_(4-羥苯基)硫; 2-(3-曱基-4-羥苯基)-2-(4-羥苯基)丙烷;2-(3,5-二甲基-4-羥苯基)-2-(4-羥苯基)丙烷;2-(3-甲基-4-羥苯基)-2-(3,5_ 二甲基-4-羥苯基)丙烷;雙_(3,5-二甲基苯基羥苯基)曱 烷;1,1-雙-(3,5-二甲基苯基羥苯基)乙烷;2,2-雙-(3,5_ 二甲基苯基-4-羥苯基)丙烷;2,4-雙气3,5-二甲基苯基_4_ 羥苯基)-2-甲基丁烷;3,3_雙_(3,5_二甲基苯基-4_羥苯基) 戊烷;1,1-雙-(3,5·二甲基苯基_4_羥苯基)環戊烷;^一雙 -(3,5-二甲基苯基-4-羥苯基)環己烷;雙_(3,5_二甲基苯基 -4-羥苯基)硫,3-(4-羥苯基三甲基茚滿_5_醇,丨_(4_ 羥苯基)-1,3,3-三曱基茚滿_5_醇,2,2,2,,2,-四氫-3,3,3,,3、 四甲基-螺二[1H_ 茚]-6,6· -二醇。 48.如請求項40之電連接器,其中R2係衍生自由式(Ιχ)之經二 羥基取代之芳族烴及式(X)之經二羥基取代之芳族烴組成 之群中選出的至少一種經二羥基取代之芳族烴:118322.doc 200832839 wherein the undetermined positional isomer of the ring is Q ρ i &lt; meta or para, and Q is a covalent bond or a free (V) group selected 屮 &lt; member: 0 II -S - II 0 (V) 0 II -c- and an alkyl or alkylene group having the formula CyH2y, wherein /, Ty is an integer from 1 to 5 including Ο end points, and R2 is a divalent aromatic group The weight ratio of the unit of formula (1) to the unit of formula (I) is in the range of about 99.9:0.1 and about 25:75. 41. The electrical connector of claim 40, which comprises having a greater than 225. It is a combination of polyether oximine. 42. The electrical connector of claim 40, which comprises a copolyether quinone imine comprising the structural unit of formula (III). 43. The electrical connector of claim 40, wherein the ... is derived from at least one diamine selected from the group consisting of m-phenylenediamine, p-phenylamine, 2-methyl-4,6-di Ethyl-1,3-phenylenediamine, 5-methyl-4,6-diethyl Q phenylenediamine, bis(4-aminophenyl)_2,2-propane, bis(2-chloro-4) -amino-3,5-diethylphenyl)methane, 4,4,-diaminobiphenyl, 3,4,-diaminobiphenyl, 4,4 guanidine diaminodiphenyl ether, 3, 4'-diaminodiphenyl ether, 4,4,-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 4,4,-diaminobenzophenone, 3,4, - Diaminobenzophenone, 2,4-nonylphenylenediamine and mixtures thereof. 44. The electrical connector of claim 4, wherein R2 is derived from at least one dihydroxy-substituted aromatic hydrocarbon of formula (VI): HO—D—〇H wherein D has the structure of formula (VII): 118322 .doc 200832839 (VII) wherein Α1 represents an aryl group; Γ Ο a —(Y1)m I (R3)p I (Y1)m ^ A1 IA 1 t tz SA — E contains a sulfur-containing bond, a sulfide, a sulfoxide, Sulfone; phosphorus-containing bond, oxetyl group, phosphinium group; ether bond; carbonyl; tertiary nitrogen group; fluorene-containing bond, hair, hard-burning oxy; cycloaliphatic group; cyclopentylene, 3, 3, 5-trimethylcyclopentylene, cyclohexylene, 3,3-dimethylcyclohexylene, 3,3,5-trimethylcyclohexylene, methylcyclohexylene, 2-[2.2.1 ]_联亚环庚基, 亚新戊基, 亚环十五基, 雅衣衣11^烧基, 亚金刚烧基; extension base or sub-alkyl, the base case can be connected to a moiety of one or more fused rings of one or more aryl groups of a monohydroxy substituent; an unsaturated alkylene group; or selected from the group consisting of a pendant or alkylene group and free of each of the following: Partially linked two or more alkyl or sub-alkyl Alkyl··aromatic bond; tertiary nitrogen bond; ether bond; carbonyl bond; ruthenium bond, decane, decyloxy; sulfur-containing bond, sulfide, ruthenium, osmium; phosphorus-containing bond, phosphinyl group and phosphine Sulfhydryl; R3 comprises hydrogen; monovalent hydrocarbon, alkenyl, allyl, alkyl, aryl, arylalkyl, alkaryl or cycloalkyl; Υ1 is independently free of each of the following at each occurrence Selected from the group. Inorganic atom, halogen; inorganic group, nitro; organic group, monovalent hydrocarbon group, alkenyl group, allyl group, alkyl group, aryl group, aralkyl group, alkylaryl group, cycloalkyl group and alkoxy group; , the letter &quot;m&quot; represents any integer from zero and includes zero to V for the number of positions available for replacement; 118322.doc 200832839 The letter V, indicating a self-zero and including zero to E alternative position The number of integers; the letter "t&quot; means an integer at least equal to one; the child S table is not an integer that is specific to zero or 'one; and, ''U&quot; means any integer including zero. 45. An electrical connector of 40, wherein the R2 structural unit in each of the formulas (Ι), (π), and (111) is a phase 46. The electrical connector of claim 40, wherein at least a portion of the R2 structural units of at least two of the formulas (Ι), (π), and (ΙΠ) are different. 47. a connector wherein R2 is derived from at least one dihydroxy-substituted aromatic hydrocarbon selected from the group consisting of: 4,4'-(cyclopentylene)biphenyl; 4,4,-( 3,3,5-trimethylcyclopentylene), a 4,4'-(cyclohexylene)biphenyl dip; 4,4'-(3,3-dimethylcyclohexylene Biphenyldiphenol; 4,4'-(3,3,5-trimethylcyclohexylene)biphenol; 4,4'-(methylcyclohexylene)biphenyl; 4,4 , _bis(3,5-dimethyl) phenyl group, 1,1-bis(4-carbyl-3-methylphenyl)cyclohexene; 4,4_bis (4-phenyl) ), 2,4'-di-diphenyldiphenylmethane; double d-phenyl)methane; bis(4-phenyl)carbazide; bis(4-cysyl-5-nitrobenzene) A); bis(4-hydroxy-2,6-diamidino-3-methoxyphenyl)methane; 151_bis(4-hydroxyphenyl)ethane, 1,2-bis(4-hydroxyl Phenyl) ethane; 1,1_bis(4-hydroxy-2-chlorophenyl) Ethane; 2,2-bis(4-hydroxyphenyl)propane; 2,2-bis(3-phenyl-4-hydroxyphenyl)propane, 2,2-bis(4-carbyl-3- Nonylphenyl) propane; 2,2-bis(4-transethylethyl)propyl; 2,2-bis(4-yl-3-isopropylphenyl)propane; 2-bis(4-cysyl-3,5-monomethylphenyl)propane; (3,5,3,5'-tetrachloro-4,4'-di 118322.doc -10- 200832839 hydroxy Phenyl)propane; bis(4-hydroxyphenyl)cyclohexyldecane; 2,2-bis(4-hydroxyphenyl)-1-phenylpropane; 2,4,-dihydroxyphenylsulfone; dihydroxynaphthalene, 2,6-dihydroxynaphthalene; hydroquinone; resorcinol; Cw alkyl substituted resorcinol; 2,2_bis-(4-hydroxyphenyl)butane; 2,2-bis-(4 _hydroxyphenyl)_2·decylbutane; 匕^bis-(4-phenyl)cyclohexane; bis-(4-hydroxyphenyl); bis-(4-hydroxyphenyl)sulfide; (3-mercapto-4-hydroxyphenyl)-2-(4-hydroxyphenyl)propane; 2-(3,5-dimethyl-4-hydroxyphenyl)-2-(4-hydroxyphenyl) Propane; 2-(3-methyl-4-hydroxyphenyl)-2-(3,5-dimethyl-4-hydroxyphenyl)propane; bis-(3,5-dimethylphenylhydroxybenzene) 1, decane; 1,1-bis-(3,5-dimethylphenylhydroxyphenyl)ethane; 2,2-bis-( 3,5-Dimethylphenyl-4-hydroxyphenyl)propane; 2,4-bis 3,5-dimethylphenyl-4-hydroxyphenyl)-2-methylbutane; 3,3_ Bis-(3,5-dimethylphenyl-4-hydroxyphenyl)pentane; 1,1-bis-(3,5-dimethylphenyl-4-hydroxyphenyl)cyclopentane; a bis-(3,5-dimethylphenyl-4-hydroxyphenyl)cyclohexane; bis-(3,5-dimethylphenyl-4-hydroxyphenyl)sulfide, 3-(4- Hydroxyphenyl trimethylindan _5-alcohol, 丨_(4-hydroxyphenyl)-1,3,3-trimethyl fluorenyl-5-ol, 2,2,2,,2,-tetrahydrogen -3,3,3,,3, tetramethyl-spirobis[1H_ 茚]-6,6-diol. 48. The electrical connector of claim 40, wherein the R2 is at least one selected from the group consisting of a dihydroxy-substituted aromatic hydrocarbon of the formula (X) and a dihydroxy-substituted aromatic hydrocarbon of the formula (X). A dihydroxy substituted aromatic hydrocarbon: ζ1 ζ1 118322.doc 11 200832839 氯、演或匕^單價烴基或烴氧 其限制條件為至少一 Z1為氣或 其中每一 R5獨立地為氫 基’每一 Z1為氫、氯或溴 溴;Ζ1 ζ1 118322.doc 11 200832839 Chlorine, hydrazine or hydrazine monovalent hydrocarbon group or hydrocarbon oxygen, the limiting condition is that at least one Z1 is gas or each of R5 is independently hydrogen group 'each Z1 is hydrogen, chlorine or bromine; 其中每一 R5獨立地為如前文所 引又所疋義,且1^及Rh獨立地為 氫或C 1 _30煙基。 49.如請求項40之電連接器, 50·如請求項40之電連接器, 終止劑之結構單元。 5 1 ·如請求項5 0之電連接器, 物組成之群中選出之至少 鹵烷、氯烷、芳基鹵化2 (XVIII)之氯化物: 其中R2係衍生自雙紛A。 其進一步包含衍生自至少一鏈 其中該鏈終止劑為自由下列各 一未經取代或經取代之成員: 勿、芳基氯化物及式(XVII)及Each of R5 is independently as defined above, and 1^ and Rh are independently hydrogen or C1_30. 49. The electrical connector of claim 40, 50. The electrical connector of claim 40, the structural unit of the terminator. 5 1 · The electrical connector of claim 50, at least the halogenated halane, chloroalkane, aryl halide 2 (XVIII) chloride selected from the group consisting of: wherein R 2 is derived from a double A. It further comprises a derivative derived from at least one chain wherein the chain terminator is free of the following unsubstituted or substituted members: hexyl chloride and formula (XVII) and (XVII) (XVIII)(XVII) (XVIII) 其中該氯取代基係位於3·或4_位置,且Z3AZ4包含經取代 或未經取代之烷基或芳基。 118322.doc -12- 200832839 52. 如請求項50之電連接器,其中該鏈終止劑為自由下列各 物組成之群中選出之至少一成員:單氯二苯甲酮、單氯 二苯砜;單氯酞醯亞胺;4-氯甲基酞醯亞胺、4-氯 丁基酞醯亞胺、4-氯-N-十八基酞醯亞胺、3-氯甲基酞 醯亞胺、3-氣丁基酜醯亞胺、3_氯_N_十八基酞醯亞 胺、4-氯-N-苯基酜醯亞胺、3-氯苯基酞醯亞胺;單取 代之雙-酞醯亞胺;單氯雙酞醯亞胺基苯;1-[Ν-(4-氯酞醯 亞胺基)]-3-(Ν-酞醯亞胺基)苯;氯酞醯亞胺 基)]-3-(N-駄醯亞胺基)苯;單氯雙酜醢亞胺基二苯硬、單 氯雙酞醯亞胺基二苯酮、單氯雙酞醯亞胺基苯醚; 4-[N-(4-氯酞醯亞胺基)]苯基-4,-(N-酞醯亞胺基)苯醚; 4-[N-(3 -氯酞醯亞胺基)苯基]-4,-(N-酞醯亞胺基)苯醚及 衍生自3,4^二胺基二苯騎之後兩種化合物的相應異構體。 53. 如請求項40之電連接器,其中式I之單元與式1〗之單元的 重量比係在約99:1與約25:75之範圍内。 54. 如請求項40之電連接器,其具有在〇·455 MPa下至少205°C 的熱變形溫度。 55. 如請求項40之電連接器’其具有如藉由ASTM方法D648 所量測的在0.455 MPa下至少210°C之熱變形溫度。 5 6·如請求項40之電連接器,其具有如藉由ASTM方法D3763 所量測的至多30°C之脆性與延性狀態之間的轉移溫度。 5 7 ·如請求項1之電連接器,其中該聚醚醯亞胺具有在約 20, 〇〇〇與約80,000之間的範圍内之重量平均分子量,其係 藉由凝膠滲透層析相對於聚苯乙烯標準而測定。 118322.doc -13- 200832839 58· —種包含單一聚醚醯亞胺之電連接器,其中成形物品之 一或多個表面中的全部或部分係經一覆蓋材料塗覆,其 中該覆蓋材料具有與該成形物品不同之組成,且其中該 成形物品包含具有一大於攝氏247度之玻璃轉移溫度的 單一聚醚醯亞胺。 59.如請求項1之電連接器,其包含聚合物之摻合物,其中該 成形物品之一或多個表面中之全部或部分係經一覆蓋材Wherein the chloro substituent is at the 3 or 4 position and Z3AZ4 comprises a substituted or unsubstituted alkyl or aryl group. The electrical connector of claim 50, wherein the chain terminator is at least one member selected from the group consisting of: monochlorobenzophenone, monochlorodiphenyl sulfone ; monochloroimine; 4-chloromethyl quinone imine, 4-chlorobutyl quinone imine, 4-chloro-N-octadecyl imine, 3-chloromethyl fluorene Amine, 3-oxobutylimine, 3-chloro-N-octadecyl imine, 4-chloro-N-phenylimine, 3-chlorophenylimine; single Substituted bis-indenylamine; monochlorobisindole imidobenzene; 1-[indole-(4-chloroindenido)]-3-(indenyl-indenyl)benzene; chlorine酞醯imino)]-3-(N-nonimino)benzene; monochlorobiguanide diphenyl hard, monochlorobiguanide benzophenone, monochlorobiguanide Iminophenyl ether; 4-[N-(4-chloroindenido)]phenyl-4,-(N-nonimino)phenyl ether; 4-[N-(3-chloroindole)醯imino)phenyl]-4,-(N-nonimino)phenyl ether and the corresponding isomers of the two compounds derived from 3,4 diaminodiphenyl. 53. The electrical connector of claim 40, wherein the weight ratio of the unit of formula I to the unit of formula 1 is in the range of about 99:1 and about 25:75. 54. The electrical connector of claim 40, which has a heat distortion temperature of at least 205 ° C at 〇·455 MPa. 55. The electrical connector of claim 40 having a heat distortion temperature of at least 210 ° C at 0.455 MPa as measured by ASTM method D648. 5 6. The electrical connector of claim 40 having a transition temperature between a brittleness and a ductile state of at most 30 °C as measured by ASTM method D3763. The electrical connector of claim 1, wherein the polyetherimine has a weight average molecular weight in a range between about 20, 〇〇〇 and about 80,000, which is relative by gel permeation chromatography. Determined according to polystyrene standards. 118322.doc -13- 200832839 58 - An electrical connector comprising a single polyether quinone, wherein all or part of one or more surfaces of the shaped article is coated with a cover material, wherein the cover material has A composition different from the shaped article, and wherein the shaped article comprises a single polyetherimine having a glass transition temperature greater than 247 degrees Celsius. 59. The electrical connector of claim 1 comprising a blend of polymers, wherein all or a portion of one or more surfaces of the shaped article are passed through a cover sheet 料塗覆,其中该覆盍材料具有與該成形物品不同之組 成,且其中該成形物品包含聚合物之摻合物,該等聚合 物含有至少一具有一大於攝氏217度之玻璃轉移溫度的 聚醚醯亞胺。 60·如請求項丨之電連接器,其中該電連接器包含以下各物之 樹脂摻合物:a)自由下列各物組成之群中選出之第一樹 脂:聚砜、聚醚砜、聚苯醚砜及其混合物;b)包含聚矽氧 共聚物之第二樹脂;c)包含以間苯二酚為主的芳基聚§旨樹 脂之第三樹脂,其中大於或等於5〇莫耳%之芳基聚酯鍵為 何生自間苯二酚之芳基酯鍵,以及d)包含自由下列各物組 成之群中選出之-或多種樹脂之第四樹脂:聚芳鍵、聚 碳酸酯、聚酯碳酸酯、聚芳酯、聚醯胺及聚酯。 月长員1之電連接器,其中該成形物品包含自由聚鱗酿 亞胺組成之群中選出之單相非晶形樹脂摻合物及包含聚 酯及聚醚醯亞胺的單相摻合物。 進一步包含含有至少 62·如請求項1中任一項之電連接器, 一硼原子之化合物。 118322.doc -14- 200832839 63·如請求項1中任一項之電連接器,其具有如藉由FAR 25.853所量測的小於約60 1&lt;:1\\^111丨11/1112之兩分鐘峰值熱釋 放0 64·如請求項1中任一項之電連接器,其具有如藉由FAr 25· 853所量測的小於約80 kW/m2之總熱釋放。Coating, wherein the covering material has a different composition than the shaped article, and wherein the shaped article comprises a blend of polymers comprising at least one polymer having a glass transition temperature greater than 217 degrees Celsius Ether quinone imine. 60. The electrical connector of claim 1, wherein the electrical connector comprises a resin blend of: a) a first resin selected from the group consisting of polysulfone, polyethersulfone, poly a phenyl ether sulfone and a mixture thereof; b) a second resin comprising a polyoxyloxy copolymer; c) a third resin comprising a resorcinol-based aryl-based resin, wherein greater than or equal to 5 Torr The reason why the % aryl polyester bond is derived from the aryl ester bond of resorcinol, and d) the fourth resin selected from the group consisting of: or a plurality of resins: polyaryl bond, polycarbonate , polyester carbonate, polyarylate, polyamine and polyester. The electrical connector of the Moonman 1, wherein the shaped article comprises a single-phase amorphous resin blend selected from the group consisting of free polysquaria, and a single phase blend comprising polyester and polyetherimine . Further included is a compound containing at least 62. The electrical connector of any one of claim 1, a boron atom. The electrical connector of any one of claims 1 to 2 having less than about 60 1 &lt;:1\\^111丨11/1112 as measured by FAR 25.853 Minute peak heat release 0. 64. The electrical connector of any of claim 1 having a total heat release of less than about 80 kW/m2 as measured by FAr 25·853. 65.如請求項i中任一項之電連接器,其中該成形物品包含聚 合物摻合物,該聚合物摻合物具有如藉由ASTM D63 8所 量測的大於或等於約50%之斷裂抗張伸長率。 66·如請求項丨中任一項之電連接器,其中阻燃聚合物摻合物 具有如藉由ASTM D790所量測的大於或等於約3〇〇 KPsi(2〇7〇 Mpa)之撓曲模數。 67·如明求項丨中任一項之電連接器,其中該成形物品係自由 下歹】各物組成之群中選出:薄片、薄膜、多層薄片、纖 、、隹薄膜、多層薄膜、模製零件、擠壓型面、塗覆部件 及發泡體。 具有至少 69_如請求項 具有至少 7 0 ·如請求項 具有至少 7 1 ·如請求項 具有至少 7 2 ·如請求項 1中任一項之電連接器,其中該電連接器包含 一為218°C或以上之Tg之材料。 1中任一項之電連接器,其中該電連接器包含 一為219°C或以上之Tg之材料。 1中任-項之電連接H,其巾該電連接器包含 一為220°C或以上之Tg之材料。 1中任-項之電連接器,其中該電連接器包含 為221 °C或以上 之Tg之材料 1中任一項之電連接器,甘丄 其中該電連接器包含 118322.doc -15- 200832839 具有至少 7 3 ·如請求項 具有至少 7 4 ·如請求項 具有至少 7 5 ·如請求項 具有至少 7 6 ·如請求項 具有至少 7 7 ·如請求項 具有至少 7 8 ·如請求項 具有至少 7 9 ·如請求項 具有至少 8 0 ·如請求項 具有至少 8 1.如請求項 具有至少 8 2 ·如請求項 具有至少 8 3 ·如請求項 具有至少 84.如請求項 一為222°C或以上之Tg之材料。1中任-項之電連接器’其中該電連接 一為223°C或以上之Tg之材料。 1中任-項之電連接器’其中該電連接 一為224°C或以上之Tg之材料。 1中任-項之電連接器’其中該電連接 一為225°c或以上之Tg之材料。 1中任一項之電連接器’其中該電連接 一為230°C或以上之Tg之材料。 1中任一項之電連接器’其中該電連接 一為235°C或以上之Tg之材料。1中任一項之電連接器,其中該電連接 一為240°C或以上之Tg之材料。 1中任一項之電連接器’其中該電連接 一為245°C或以上之Tg之材料。 1中任一項之電連接器’其中該電連接 一為250°c或以上之Tg之材料。1中任一項之電連接器,其中該電連接 一為255°C或以上之Tg之材料。 1中任一項之電連接器,其中該電連接 一為260°C或以上之Tg之材料。 1中任一項之電連接器,其中該電連接 一為265°C或以上之Tg之材料。 1中任一項之電連接器,其中該電連接 器包含一 裔包含一 器包含一 裔包含'一 裔包含'一 器包含一 器包含一 器包含一 器包含一 器包含 器包含 器包含 118322.doc -16- 200832839 具有至少一為270°C或以上之Tg之材料。 Μ.如請求们中任一項之電連接器,其中該電連接器包含一 具有至少一為275°C或以上之Tg之材料。 月求項1中任一項之電連接器,其中該電連接器包含一 具有至少一為300°C或以上之Tg之材料。 月求項1中任一項之電連接器,其中該電連接器包含一 具有至少一為350C或以上之Tg之材料。 88·如凊求項1中任-項之電連接器,其中該電連接器包含一 具有至少一在約225°C與250°c之間的Tg之材料。 89.如睛求項丨中任一項之電連接器,其中該電連接器包含一 具有至少一在約250。(:與275。(:之間的丁§之材料。 9〇·如明求項1中任一項之電連接器,其中該電連接器包含一 具有至少一在約275°C與300°C之間的Tg之材料。 9 1 ·如請灰jg,^ , 負1中任一項之電連接器,其中該電連接器包含一 具有至少一在約300°C與350°C之間的Tg之材料。 118322.doc 17- 200832839 七、指定代表圖: (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: (無) ϋ 118322.docThe electrical connector of any of claim 1 wherein the shaped article comprises a polymer blend having greater than or equal to about 50% as measured by ASTM D63 8 Break tensile elongation. 66. The electrical connector of any of the preceding claims, wherein the flame retardant polymer blend has a deflection of greater than or equal to about 3 〇〇 KPsi (2〇7〇Mpa) as measured by ASTM D790. The number of curves. 67. The electrical connector of any one of the items of the present invention, wherein the shaped article is freely smashed, selected from the group consisting of: a sheet, a film, a multilayer sheet, a fiber, a ruthenium film, a multilayer film, a mold Parts, extruded profiles, coated parts and foams. Having at least 69_if the request item has at least 7 0 · If the request item has at least 7 1 · If the request item has at least 7 2 · The electrical connector of any one of claim 1 wherein the electrical connector comprises a 218 Tg material of °C or above. The electrical connector of any of the preceding claims, wherein the electrical connector comprises a material having a Tg of 219 ° C or more. The electrical connection of any one of the items 1 is the material of the electrical connector comprising a Tg of 220 ° C or above. The electrical connector of any of the items, wherein the electrical connector comprises an electrical connector of any one of materials 1 of Tg of 221 ° C or more, wherein the electrical connector comprises 118322.doc -15- 200832839 has at least 7 3 · as requested item has at least 7 4 · as requested item has at least 7 5 · as requested item has at least 7 6 · as requested item has at least 7 7 · as requested item has at least 7 8 · as requested item has At least 7 9 · If the request item has at least 8 0 · If the request item has at least 8 1. If the request item has at least 8 2 · If the request item has at least 8 3 · If the request item has at least 84. If the request item has at least 84. Material of T or more Tg. An electrical connector of any one of the items wherein the electrical connection is a material of Tg of 223 ° C or more. An electrical connector of any one of the items wherein the electrical connection is a material of Tg of 224 ° C or more. An electrical connector of any one of the items wherein the electrical connection is a material of Tg of 225 ° C or more. The electrical connector of any one of the above, wherein the electrical connection is a material of Tg of 230 ° C or above. The electrical connector of any one of the above, wherein the electrical connection is a material of Tg of 235 ° C or more. The electrical connector of any of the preceding claims, wherein the electrical connection is a material of Tg of 240 ° C or more. The electrical connector of any one of the above, wherein the electrical connection is a material of Tg of 245 ° C or above. The electrical connector of any one of the above, wherein the electrical connection is a material of Tg of 250 ° C or more. The electrical connector of any of the preceding claims, wherein the electrical connection is a material having a Tg of 255 ° C or more. The electrical connector of any of the preceding claims, wherein the electrical connection is a material having a Tg of 260 ° C or above. The electrical connector of any of the preceding claims, wherein the electrical connection is a material of Tg of 265 ° C or above. The electrical connector of any one of the preceding claims, wherein the electrical connector comprises a genus comprising a device comprising a genus containing a genus containing a device comprising a device comprising a device comprising a device comprising a device comprising a device comprising 118322 .doc -16- 200832839 A material having at least one Tg of 270 ° C or more. The electrical connector of any of the claims, wherein the electrical connector comprises a material having at least one Tg of 275 ° C or more. The electrical connector of any of the preceding claims, wherein the electrical connector comprises a material having at least one Tg of 300 ° C or more. The electrical connector of any of the preceding claims, wherein the electrical connector comprises a material having at least one Tg of 350 C or more. 88. The electrical connector of any of clause 1, wherein the electrical connector comprises a material having at least one Tg between about 225 ° C and 250 ° C. The electrical connector of any of the preceding claims, wherein the electrical connector comprises one having at least one at about 250. The electrical connector of any one of the preceding claims, wherein the electrical connector comprises at least one of at about 275 ° C and 300 °. The material of the Tg between C. 9 1 · The electrical connector of any one of ng, j, minus 1, wherein the electrical connector comprises at least one between about 300 ° C and 350 ° C The material of Tg. 118322.doc 17- 200832839 VII. Designated representative map: (1) The representative representative of the case is: (none) (2) The symbol of the symbol of the representative figure is simple: 8. If there is a chemical formula in this case, please Reveal the chemical formula that best shows the characteristics of the invention: (none) ϋ 118322.doc
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