200830348 ^233 ltwf. doc/π 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種承載片與試片的製備方法，且特 別是有關於一種穿透式電子顯微鏡之試片的承载片與穿^ ' 式電子顯微鏡之試片的製備方法。 、 【先前技術】 在VLSI元件的損壞分析(faiiure analysis)中，定點^ ❿ 面的截面分析已被視為一種有效的技術，而掃描式電子顯 微鏡(scanning electron microscopes，SEM)為一種觀察戴面 的工具，然由於其對於高密度元件之解析度較差，因而在 半導體製程逐漸進入ULSI的階段，SEM逐漸被穿透式電 子喊微鏡取代(transmission electron microscopy，TEM)。為 解決產量與元件可靠度問題，藉由穿透式電子顯微鏡進行 損害分析的使用愈來愈廣泛。 隨著穿透式電子顯微鏡的應用，使電子穿透所需試片 的製備成為一個重要的課題，以下介紹一些習知技術中常 ⑩ 見的與聚焦離子束(focused ion beam，FIB)相關的試片製備 方法。 第一種試片的製備方法為，先在聚焦離子束機台中， 對半導體晶圓上欲觀察的區域，以鉑金屬覆蓋加以保護， 當有特定之觀察目標時，則需先作標記。接著，利用手磨 (hand polishing)的方式移除欲觀察的區域以外的區域，使 試片的厚度在20至50 /zm之間。然後，將試片黏附於銅 環(copper grid)上。使用聚焦離子束將試片磨(milling)成厚 4 200830348 〜…一2331twf.doc/n 度約0·1 /zm的薄片。然而，由於上述第一種試片的製備 方法中使用手磨，除了相當耗時之外，且不易控制研磨厚 度，而容易對試片造成傷害。此外，因為試片是黏附於鋼 環上，所以一次只能觀察一片試片。200830348 ^233 ltwf. doc/π IX. Description of the Invention: [Technical Field] The present invention relates to a method for preparing a carrier sheet and a test sheet, and more particularly to a test piece for a transmission electron microscope A method of preparing a test piece of a carrier sheet and a through-electron microscope. [Prior Art] In the faiiure analysis of VLSI components, cross-sectional analysis of fixed-point surfaces has been regarded as an effective technique, and scanning electron microscopes (SEM) is an observation surface. The tool, however, has a poor resolution for high-density components, so the SEM is gradually replaced by a transmission electron microscopy (TEM) as the semiconductor process gradually enters the ULSI stage. In order to solve the problem of yield and component reliability, the use of damage analysis by transmission electron microscopy is becoming more and more extensive. With the application of transmissive electron microscopy, the preparation of test strips required for electron penetration has become an important issue. The following is a description of some focused techniques related to focused ion beam (FIB). Tablet preparation method. The first test piece is prepared by first protecting the area to be observed on the semiconductor wafer with a platinum metal cover in a focused ion beam machine. When there is a specific observation target, it needs to be marked first. Next, the area outside the area to be observed is removed by hand polishing so that the thickness of the test piece is between 20 and 50 /zm. Then, the test piece was attached to a copper grid. The test piece was milled into a thickness of 4 200830348 ~... a 2331 twf.doc / n piece of about 0 · 1 / zm using a focused ion beam. However, since the hand-grinding is used in the preparation method of the above-mentioned first test piece, in addition to being time-consuming, it is difficult to control the thickness of the polishing, and it is easy to cause damage to the test piece. In addition, since the test piece is attached to the steel ring, only one test piece can be observed at a time.
第二種試片的製備方法為，先在聚焦離子束機台中， 對半導體晶圓上欲觀察的區域，以鉑金屬覆蓋加以保護， 當有特定之觀察目標時，則需先作標記。接著，直接使用 聚焦離子束將試片磨成厚度約Q1 的薄片 '然後，離 線(offline)使用取出系統⑽〇ut system)將試片取出放到銅 網(copper mesh)中的碳膜上。然而，碳膜會影嚮到試片成 分分析的結果，且有礙於試片進行高解析度的成像。此外， 碳膜上的試片難以回到聚焦離子束機台中，再次以聚焦離 子束進行厚度的調整。 … 第二種試片的製備方法為所有操作步驟在聚焦離子束 機台中同位(in-situ)進行。首先，在聚焦離子束機二中，對 半導體晶圓上欲觀察的區域，以銘金屬覆蓋加以^護，當 有特定之觀察目標時，則需先作標記。接著，直接以聚^ 離子束對半導體晶圓進行粗磨(roughmimng)。然後，^言^ 片黏附到探針(probe)上，再將試片從半導體晶圓、上切下= 接下來’將試片黏_銅環上’再將試片從探針上切下。 之後’將試片細磨(fine milling)至厚度約〇1 的片。 然而，從半導體晶®上取出試片時，容易使得試片產生損 傷。此外’由於第三種試片的製備方法的操 心 因此試片製作的失敗率也較高。 、度权同 5 200830348, ^,^,331 twf. doc/u 【發明内容】 種承載片，有 ^鑑於此’本發日_目的就是在提供-助於衣備穿透式電子顯微鏡的試片。 ^發明的再—目的是提供—種穿透式電子頻 片的鳴進行撕度的成像及成分分析。 鏡的試片’承載片包括金屬片，金屬片具有缺The second test piece is prepared by first protecting the area to be observed on the semiconductor wafer with a platinum metal cover in a focused ion beam machine. When there is a specific observation target, it needs to be marked first. Next, the test piece was directly ground to a sheet having a thickness of about Q1 using a focused ion beam. Then, the test piece was taken out and placed on a carbon film in a copper mesh by using a take-up system (10). However, the carbon film affects the results of the component analysis of the test piece and hinders the high-resolution imaging of the test piece. In addition, it is difficult for the test piece on the carbon film to return to the focused ion beam machine, and the thickness of the focused ion beam is adjusted again. The second test piece was prepared by performing all the steps in the in-situ in the focused ion beam machine. First, in the focused ion beam machine 2, the area to be observed on the semiconductor wafer is covered with a metal cover, and when there is a specific observation target, it needs to be marked first. Next, the semiconductor wafer is directly roughened with a poly-ion beam. Then, the ^^^ film is attached to the probe, and then the test piece is cut from the semiconductor wafer, and then the test piece is stuck on the copper ring and the test piece is cut from the probe. . Thereafter, the test piece was finely milled to a sheet having a thickness of about 〇1. However, when the test piece is taken out from the semiconductor wafer®, the test piece is easily damaged. Further, the failure rate of the test piece production was also high due to the handling of the preparation method of the third test piece. , the right to the same as 5 200830348, ^, ^, 331 twf. doc / u [Summary of the content] kind of carrier sheet, there are ^ in view of this 'this is the day of the purpose is to provide - help the clothing through the transmission electron microscope test sheet. The re-invention of the invention is to provide imaging and compositional analysis of the torsion of a transmissive electronic frequency chip. The test piece of the mirror 'the carrier piece includes a metal piece, and the metal piece has a defect
伯凹;f曰缺口位於金屬片之一侧，而凹槽位於缺口的邊緣。 依照本發明的-較佳實施例所述，在上述之承 中，金屬片的材料包括銅。 依照本發明的一較佳實施例所述，在上述之承载片 中，金屬片的形狀包括半圓形。 依照本發明的一較佳實施例所述，在上述之承载片 中，缺口位於半圓形的弦部。 依照本發明的一較佳實施例所述，在上述之承载片 中’更包括至少一層吸附膜，配置於凹槽中的金屬片上。 依照本發明的一較佳實施例所述，在上述之承载片 中’吸附膜的材料包括碳。 本發明提出一種穿透式電子顯微鏡之試片的製備方 法，首先提供承載片，包括金屬片與至少一層吸附膜，金 屬片具有缺口與至少一個凹槽，缺口位於金屬片之一側， 而凹槽位於缺口的邊緣，且吸附膜配置於凹槽中的金屬片 上。接著，從樣本取得試片，試片包栝觀察部與非觀察部。 然後’將試片的非觀察部放置於凹槽中的吸附膜上，且試 6 200830348 」331tw£doc/n 片的觀察部凸出於缺口的邊緣。 依照本發明的-較佳實施例所述，在上述之穿透式電 子顯微鏡之試片的製備方法中，在將試片的非觀察部放置 於凹槽中的吸附膜上之後，更包括於凹槽中形成黏著物， 以將试片黏附於吸附膜上。 依照本發明的一較佳實施例所述，在上述之穿透式電 製備方法中，黏著物的形成方法包括使 鲁 用ΧΚ…、離子束機台進行一個沈積製程。 依照本發明的一較佳實施例所述，在上述之穿透式電 ==:方法中’黏著物的材料包括聚焦離 依照本發明的—較佳實施例所述，在上述之穿透式電 試片的製備方法中，從樣本取得試片的方法， I先於樣本上欲觀察的部分上沈積—層保護層。接著，使 聚焦離子束將倾層巾欲觀察的部分切割下來。 •子二較佳實施例所述’在上述之穿透式電 子束機台所提供的材料。 冊匕括水焦離 依照本發明的—較佳實施例所述’在上述之穿透式電 觀試片的製備方法中，當欲觀察的部分為特定之 保冰從樣本取得試片的方法更包括先於欲覆蓋之 祭目標的位址。 心我出％疋之規 依照本發明的—較佳實施饌述，在上述之穿透式電 7 」331twf.doc/n 200830348 子顯微鏡之試片的製備方法中，將試片的非觀察部放置於 凹槽中的吸附膜上的方法包括使用取出系統。 依照本發明的_較佳實施例所述，在上述之穿透式電 子顯微鏡之試片的製備方法中，取出系統包括使用玻璃針 移動試片。 依照本發明的一較佳實施例所述，在上述之穿透式電 Γ貢微鏡找片的製備綠巾，凹槽_成方法包括使用 ♦焦離子束移除部份金屬片。 依照本發明的一較佳實施例所述，在上述之穿透式電 用的製備方法中，吸附膜的形成方法包括使 _子束機台進行—個沈積製程。 依照本發日㈣_較佳實闕所述 依^柄明的―較佳實 子=試片的製備方法中，樣本上= ，的材料二 ，微鏡之⑽㈣電 依照本判的—難實 it括+η形。 子顯微鏡之試片的製備方缺在亡述之牙透式電 基於上述，由於本發明所提出的：：半圓形的弦部。 可以將穿透式電子顯微鏡 @ 上具有凹槽， 片•此外’本發明所提二限載於;= 8 200830348 .“233 ltwf.doc/n 試片2此可以提高損壞分析的速度並降低操作成本。 另方面，本發明所提出的穿透式電子顯 ^製備方法，黏附於承载片上的試片具有相 列方 L因此有助於觀察的進行。此外，由於試片的觀察部是 的邊緣，因此能糊地進行高解析度的成像及 t刀析。另外，因為試片是黏附在承載片上，所以可以 重新回到聚鱗子束機台t賴㈣厚度進行調整。The concave is located on one side of the metal sheet, and the groove is located at the edge of the notch. In accordance with a preferred embodiment of the present invention, in the above, the material of the metal sheet comprises copper. According to a preferred embodiment of the present invention, in the above-mentioned carrier sheet, the shape of the metal piece includes a semicircular shape. In accordance with a preferred embodiment of the present invention, in the carrier sheet described above, the notch is located in a semi-circular chord. According to a preferred embodiment of the present invention, in the above-mentioned carrier sheet, at least one adsorption film is further disposed on the metal piece in the groove. According to a preferred embodiment of the present invention, the material of the adsorption film in the above-mentioned carrier sheet comprises carbon. The invention provides a preparation method of a test piece for a transmission electron microscope, which firstly provides a carrier sheet comprising a metal sheet and at least one adsorption film, the metal sheet having a notch and at least one groove, the notch being located on one side of the metal piece, and concave The groove is located at the edge of the notch, and the adsorption film is disposed on the metal piece in the groove. Next, a test piece is obtained from the sample, and the test piece includes an observation unit and a non-observation unit. Then, the non-observed portion of the test piece was placed on the adsorption film in the groove, and the observation portion of the test piece of the test piece protruded from the edge of the notch. According to the preferred embodiment of the present invention, in the preparation method of the test piece of the above-mentioned transmission electron microscope, after the non-observation portion of the test piece is placed on the adsorption film in the groove, it is further included in An adhesive is formed in the groove to adhere the test piece to the adsorption film. According to a preferred embodiment of the present invention, in the above-described transmissive electric preparation method, the method of forming the adhesive includes performing a deposition process by using an ion beam machine. In accordance with a preferred embodiment of the present invention, in the above-described method of transmissive electric ==: 'the material of the adhesive comprises focusing away from the preferred embodiment according to the present invention, in the above-described transmissive type In the method for preparing an electrical test strip, a method of obtaining a test piece from a sample, I deposits a protective layer on the portion to be observed on the sample. Next, the focused ion beam is cut to the portion of the layered towel to be observed. • The material provided in the above-described transmissive electron beam machine as described in the preferred embodiment. The present invention relates to a method for producing a penetrating electro-optical test piece according to the present invention, wherein the portion to be observed is a specific method for obtaining a test piece from a sample. It also includes the address of the target that is to be covered before the sacrifice. According to the preferred embodiment of the present invention, in the preparation method of the above-mentioned test piece of the penetrating electric 7 331 twf.doc/n 200830348 submicroscope, the non-observation part of the test piece is used. The method of placing on the adsorbent film in the recess includes using a take-out system. In accordance with a preferred embodiment of the present invention, in the method of preparing a test piece of the above-described transmissive electron microscope, the take-out system includes moving the test piece using a glass needle. In accordance with a preferred embodiment of the present invention, in the preparation of the green towel by the penetrating electro-optical micromirror, the method of forming a groove includes removing a portion of the metal piece using a 焦 ion beam. According to a preferred embodiment of the present invention, in the above-described method for producing a penetrating power, the method for forming an adsorption film includes performing a deposition process on the beam processor. According to the preparation method of the "preferred real child = test piece according to the description of the present invention (4) _ better, the material on the sample =, the second material of the micromirror (10) (four) is in accordance with the judgment - difficult It includes +η shape. The preparation of the test piece of the sub-microscope is missing from the above-mentioned tooth-operated electric power. Based on the above, the present invention proposes: a semi-circular chord. It is possible to have a groove on the transmission electron microscope @, and the sheet is further limited to the following: (= 8 200830348 . "233 ltwf.doc/n Test strip 2 This can improve the speed of damage analysis and reduce the operation In another aspect, the penetrating electronic display preparation method of the present invention, the test piece adhered to the carrier sheet has a phase side L, thereby facilitating the observation. Further, since the observation portion of the test piece is the edge Therefore, high-resolution imaging and t-knife can be performed in a paste. In addition, since the test piece is adhered to the carrier sheet, it can be returned to the thickness of the poly-splitter beam machine to adjust.
，得—提的是，由於在凹射的金屬片上形成吸附 ，，因此能增加試片料載片之__力，以避免試片 在承載片上紅偏移或從承削上祕，若祕吸附 形成黏著物，麟再次提高試片與承載片之間的黏附力。 為讓本發明社述和其他目的、特徵和伽能更明顯 易懂’下文特舉較佳實施例’並配合所關式，作詳細說 明如下。 【實施方式】 圖1所齋示為本發明-實施例之承載片的示意圖。圖 2所繪示為圖1框示處的放大圖。 請同時务照圖1及圖2，承載片觸適用於承载穿透 式電子顯微鏡的試片。承載片100包括金屬片1〇2，金屬 片102具有缺口 104與至少一個凹槽1〇6，缺口 1〇4位於 金屬片102之一侧，而凹槽i〇6位於缺口 1〇4的邊緣，用 以容納穿透式電子顯微鏡的試片。在圖1中，凹槽'1〇6的 數量是以20個為例，但並不用以限制本發明。 金屬片102的材料例如是銅。金屬片1〇2的形狀例如 9 200830348 ^2331twf.doc/n 疋牛圓形，叩釈^ iU〇徂於平圓形的弦部。雖热隹丰實施 例中:金屬片1G2的形狀為半圓形，然而於此技術領域具 有通常知識者可依照實際的需求，對金屬片辦的形狀進 行不同的設計與調整。 此外，可於凹槽106中的金屬片102上配置吸附膜 108。吸附膜1〇8的材料例如是碳。吸附膜1〇8的形成方法 例如是使用聚餘子束機台進行—個沈積製㈣形成之。 上述承载片100的製造方法例如是先提供一金屬片 102。金屬片102例如是由金屬環對半切割而得。接著，移 ^缺口 104邊緣之部分金屬片搬，以形成凹槽刚的圖 二。部分金屬片1G2的移除方法例如是使用聚焦離子束機 口的聚焦離子束進行移除。然後，於凹槽106中的金屬片 2上形成吸_應，以吸附後續放置於吸麵刪上的 式片。 ^上述實施例可知’承載片簡上具有凹槽106，可 以將穿透式電子顯微鏡之試片侷限於凹槽1〇6中，有助於 =片的製備。此外’當承載片上具有多個凹槽1〇6時， 圖3所繪示為本發明一實施例之穿 方法的流程圖。圖4所綠示為== j式電子顯微鏡之試片的上視圖。圖5崎示為本發 施例之穿透式電子顯微鏡之試片的側_。圖6所 、、曰不為將穿透式電子賴鏡之試片放置㈣〗之凹槽中的 200830348 1^z.33 ltwf.doc/n 示意圖。 請同時參關1、圖2及圖3，進行步驟漏，提供 承載片100’包括金屬# 1〇2與吸附膜顺，金屬片具有缺 口 104與至少一個凹槽106,缺π 106位於金屬片102之 一側’而凹槽106位於缺口 1〇4的邊緣，且吸附膜⑽配 置於凹槽106中的金屬片搬上。其中，承載片之各 ，件的材料與形成方法，已於圖〗與圖2所介紹的實施例It is mentioned that, due to the formation of adsorption on the concave metal sheet, the force of the test piece carrier can be increased to avoid red offset of the test piece on the carrier sheet or secret from the bearing. Adsorption to form an adhesive, Lin once again improves the adhesion between the test piece and the carrier. In order to make the present invention and other objects, features, and gamma more apparent, the following description of the preferred embodiments will be described in detail below. [Embodiment] FIG. 1 is a schematic view showing a carrier sheet according to the present invention. 2 is an enlarged view of the frame of FIG. 1. Please also take care of Figure 1 and Figure 2, the carrier is suitable for the test piece carrying the transmission electron microscope. The carrier sheet 100 includes a metal sheet 1 2, the metal sheet 102 has a notch 104 and at least one groove 1〇6, the notch 1〇4 is located on one side of the metal piece 102, and the groove i〇6 is located at the edge of the notch 1〇4 a test piece for accommodating a transmission electron microscope. In Fig. 1, the number of grooves '1〇6 is exemplified by 20, but is not intended to limit the present invention. The material of the metal piece 102 is, for example, copper. The shape of the metal piece 1〇2 is, for example, 9 200830348 ^2331twf.doc/n The yak is round, and the 叩釈^ iU is in a flat circular chord. Although the shape of the sheet metal 1G2 is semi-circular, the general knowledge in this technical field can be differently designed and adjusted according to actual needs. Further, the adsorption film 108 may be disposed on the metal piece 102 in the groove 106. The material of the adsorption film 1〇8 is, for example, carbon. The formation method of the adsorption film 1 8 is formed, for example, by using a poly-rich beam machine to perform a deposition process (4). The manufacturing method of the carrier sheet 100 is, for example, first providing a metal piece 102. The metal piece 102 is obtained, for example, by cutting a metal ring in half. Next, a portion of the metal piece that has been moved to the edge of the notch 104 is moved to form the second of the groove. The method of removing part of the metal piece 1G2 is, for example, removal using a focused ion beam of a focused ion beam machine. Then, a suction is formed on the metal piece 2 in the groove 106 to adsorb the pattern which is subsequently placed on the suction surface. The above embodiment shows that the carrier sheet has a recess 106 which can be used to confine the test piece of the transmission electron microscope to the groove 1〇6 to facilitate the preparation of the sheet. Further, when the carrier sheet has a plurality of grooves 1〇6, FIG. 3 is a flow chart showing a method of wearing the embodiment of the present invention. Green in Fig. 4 is a top view of a test piece of the == j type electron microscope. Fig. 5 shows the side of the test piece of the transmission electron microscope of the present embodiment. Fig. 6 is a schematic diagram of 200830348 1^z.33 ltwf.doc/n in the groove of the transmissive electronic microscope. Please refer to the first, FIG. 2 and FIG. 3 to perform the step leakage, and provide the carrier sheet 100' including the metal #1〇2 and the adsorption film, the metal sheet has the notch 104 and at least one groove 106, and the π 106 is located in the metal piece. One side of the '102' is located at the edge of the notch 1〇4, and the adsorption film (10) is disposed on the metal piece in the groove 106. Wherein, the material of the carrier sheet, the material of the member and the forming method thereof have been described in the embodiment of FIG. 2 and FIG.
中進行詳細說明，於此不再贅述。 接著明同日守參照圖3、圖4及圖5，進行步驟§i〇2， ，樣本11〇取得试片112 ’試片包括觀察部112&與非觀察 部112b。樣本例如是用以作為損壞分析對象的半導體晶 圓。k樣本110取得試片112的方法例如是纽樣本上欲 硯察的部分上沈龍護層114，接著使用聚鱗子束將保 濩層114中奴觀祭的部分切割下來。其中，保護層IN的 材料例如是聚焦離子束機台所提供的材料，如齡屬。保 護層114的形成方法例如是錢聚焦離子束機台進行一個 ，積製^得之。在另—實施例中，#欲觀察的部分為特 定之，察目標時，從樣本1ig取得試>；m的方法可先於 欲覆蓋=保護層114區域外之兩側及上下形成標記，以定 義出特定之觀察目標的位址，再對倾層114進行切割而 "然後，請同時參照圖卜圖3及圖6,進行步驟§刚， 將试片112的非觀察部i12b放置於凹槽1〇6巾的吸附膜 108上，且試片112的觀察部U2a凸出於缺口 的邊緣。 11 200830348 X χ*τ ^331twf.d〇c/n 將試片112自樣本110中取出，並將試片112的非觀察部 112b放置於凹槽ι〇6中的吸附膜1〇8上的方法例如是使用 玻璃針移動试片112的取出系統。 之後，請繼續參照圖3及圖6，可選擇性地進行步驟 S106，在將試片112的非觀察部112b放置於凹槽中 的吸附膜108上之後，於凹槽1〇6中形成黏著物116，以 ^試片m黏附於吸附膜應上。黏著物116的材料例如 參 *聚焦離子束機台所提供的材料，如鈾金屬。黏著物μ 的形成方法例如是使用聚焦離子束機台進行一個沈積 而形成之。 ' 一雖然在上述實施例中，步驟S100是先於步驟S102進 仃，但並不用以限制本發明。在另一實施例中，也可先進 行步驟S102，再進行步驟sl〇〇，或者是步驟si〇〇與步驟 S102同時進行。 基於上述實施例，黏附於承载片100上的試片112具 有相同的排列方向，因此有助於對試片m的觀察。 鲁此外i試片112的觀察部U2a凸出於缺口 104的邊 f11此穿透式電子顯纖的電子能直接穿親片112的 觀祭部112a，能順利地進行高解析度的成像及成分分析。 糾，因為試片m是黏附在承载片11〇上，所 =夠以聚焦離子束機台對試片m的厚度再次進行調 值得-提的是，由於吸附膜刚與黏著物116皆能择 加试片112與承載片100之間的黏附力，因此可以避免^ 12 200830348 yDU4 ^2331twf.doc/n 片ϋ在承載片100上產生偏移或是從承载片100上脫落。 4上所述，本發明至少具有下列優點： 1·本發明所提出之承載片有助於試片的製備。 2.使用本發明所提出之承载片能提高損壞分析的 並降低操作成本。 & 3.依恥本發明所提出之穿透式電子顯微鏡之試片的製 備方法，試片具有相同的排列方向，有助於對試片的觀察。The detailed description is given here, and will not be described here. Next, with reference to Fig. 3, Fig. 4 and Fig. 5, step §i〇2 is performed, and sample 11〇 obtains test piece 112'. The test piece includes observation unit 112& and non-observation unit 112b. The sample is, for example, a semiconductor crystal used as a damage analysis object. The k-sample 110 method of obtaining the test piece 112 is, for example, a portion of the sinker layer 114 to be observed on the sample, and then the portion of the slave layer in the layer 114 is cut using the cluster of scales. The material of the protective layer IN is, for example, a material provided by a focused ion beam machine, such as a genus. The method of forming the protective layer 114 is, for example, a money-focused ion beam machine, which is integrated. In another embodiment, the part to be observed is specific, and when the target is inspected, the method of obtaining the test from the sample 1g may be preceded by forming a mark on both sides and the upper and lower sides of the area to be covered = the protective layer 114. The address of the specific observation target is defined, and the tilt layer 114 is cut again. Then, please refer to FIG. 3 and FIG. 6 simultaneously, and step § is just performed, and the non-observation portion i12b of the test piece 112 is placed. The groove 1 is on the adsorption film 108 of the towel, and the observation portion U2a of the test piece 112 protrudes from the edge of the notch. 11 200830348 X χ *τ ^331twf.d〇c/n The test piece 112 is taken out from the sample 110, and the non-observation portion 112b of the test piece 112 is placed on the adsorption film 1〇8 in the groove 〇6 The method is, for example, a removal system for moving the test strip 112 using a glass needle. Thereafter, referring to FIG. 3 and FIG. 6, the step S106 can be selectively performed to form the adhesion in the groove 1〇6 after the non-observation portion 112b of the test piece 112 is placed on the adsorption film 108 in the groove. The object 116 is adhered to the adsorption film by the test piece m. The material of the adhesive 116 is, for example, a material provided by a focused ion beam machine, such as uranium metal. The formation method of the adhesive μ is formed, for example, by performing deposition using a focused ion beam machine. 'Although in the above embodiment, step S100 is preceded by step S102, but is not intended to limit the present invention. In another embodiment, step S102 may be advanced, step s1〇〇 may be performed, or step si 〇〇 may be performed simultaneously with step S102. Based on the above embodiment, the test pieces 112 adhered to the carrier sheet 100 have the same arrangement direction, thereby contributing to the observation of the test piece m. The observation portion U2a of the test piece 112 of Lu is protruded from the side f11 of the notch 104. The electrons of the transmissive electronic display can directly pass through the observation portion 112a of the parent piece 112, and the high-resolution imaging and composition can be smoothly performed. analysis. Correction, because the test piece m is adhered to the carrier sheet 11 所, which is enough to adjust the thickness of the test piece m by the focused ion beam machine again, and it is worth mentioning that both the adsorption film and the adhesive 116 can be selected. The adhesion between the test piece 112 and the carrier sheet 100 is increased, so that it is possible to prevent the wafer from being offset on the carrier sheet 100 or falling off the carrier sheet 100. As described above, the present invention has at least the following advantages: 1. The carrier sheet proposed by the present invention contributes to the preparation of the test piece. 2. The use of the carrier sheet of the present invention can improve damage analysis and reduce operating costs. & 3. According to the preparation method of the test piece of the transmission electron microscope proposed by the present invention, the test pieces have the same arrangement direction and contribute to the observation of the test piece.
4·使用本發明所提出之穿透式電子顯微鏡之試片的製 備方法，能順利地進行高解析度的成像及成分分析。 、5.由本發明所提出之穿透式電子顯微鏡之試片的製備 方去所製備的試片，能夠隨時以聚焦離子束機台對試片的 厚度再次進行調整。 ,6·因為在本發明所提出之穿透式電子顯微鏡之試片的 製備方法所製備的試片中，試片與承載片之間具有很強的 黏附力’所以可以避免試片在承載片上產生偏移或是脫落。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限疋本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1所繪示為本發明一實施例之承載片的示意圖。 圖2所繪示為圖1框示處的放大圖。 圖3所繪示為本發明一實施例之穿透式電子顯微鏡之 試片的製備方法的流程圖。 13 200830348mi 7 ^233 ltwf.doc/n 圖4所繪示為本發明一實施例之穿透式電子顯微鏡之 試片的上視圖。 圖5所繪示為本發明一實施例之穿透式電子顯微鏡之 試片的侧視圖。 圖6所繪示為將穿透式電子顯微鏡之試片放置於圖1 之凹槽中的示意圖。 【主要元件符號說明】 100 :承載片 ❿ 102 :金屬片 104 :缺口 106 :凹槽 108 :吸附膜 110 ··樣本 112 :試片 112a :觀察部 112b:非觀察部 φ 114 :保護層 116 :黏著物 S100、S102、S104、S106 :步驟標號 144. Using the preparation method of the test piece of the transmission electron microscope proposed by the present invention, high-resolution imaging and component analysis can be smoothly performed. 5. Preparation of the test piece of the transmission electron microscope proposed by the present invention The test piece prepared by the present invention can be adjusted again at any time by the focused ion beam machine. 6. Because of the strong adhesion between the test piece and the carrier sheet in the test piece prepared by the method for preparing the test piece of the transmission electron microscope proposed by the present invention, it is possible to avoid the test piece on the carrier sheet. Produce an offset or fall off. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a carrier sheet according to an embodiment of the present invention. FIG. 2 is an enlarged view of the block of FIG. 1. Fig. 3 is a flow chart showing a method of preparing a test piece of a transmission electron microscope according to an embodiment of the present invention. 13 200830348mi 7 ^ 233 ltwf.doc/n FIG. 4 is a top view of a test piece of a transmission electron microscope according to an embodiment of the present invention. Fig. 5 is a side elevational view showing a test piece of a transmission electron microscope according to an embodiment of the present invention. Figure 6 is a schematic view showing the placement of a test piece of a transmission electron microscope in the groove of Figure 1. [Description of main component symbols] 100: Carrier sheet 102: Metal sheet 104: Notch 106: Groove 108: Adsorption film 110 · Sample 112: Test piece 112a: Observation portion 112b: Non-observation portion φ 114: Protective layer 116: Adhesive S100, S102, S104, S106: step number 14