TW200826205A - Temperature controlling system of gas cabinet and operating method thereof - Google Patents

Temperature controlling system of gas cabinet and operating method thereof Download PDF

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Publication number
TW200826205A
TW200826205A TW95146206A TW95146206A TW200826205A TW 200826205 A TW200826205 A TW 200826205A TW 95146206 A TW95146206 A TW 95146206A TW 95146206 A TW95146206 A TW 95146206A TW 200826205 A TW200826205 A TW 200826205A
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Taiwan
Prior art keywords
gas
heating
temperature control
gas cabinet
cylinder
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TW95146206A
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Chinese (zh)
Inventor
Yung-Choy Wei
Chau-Ming Ho
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Powerchip Semiconductor Corp
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Priority to TW95146206A priority Critical patent/TW200826205A/en
Publication of TW200826205A publication Critical patent/TW200826205A/en

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Abstract

A temperature controlling system is provided. The system includes a gas cabinet, a heating/cooling apparatus, a controller, and a pressure sensor. At least one gas cylinder is placed inside the gas cabinet. The heating/cooling apparatus connects with the gas cabinet to regulate inside temperature of the gas cabinet. The controller connects to the heating/cooling apparatus. The pressure sensor loading on the outlet of the gas cylinder is coupled to the controller. According to signals generated by the pressure sensor, the controller modulates the heating/cooling apparatus. Hence, the inside temperature of the gas cabinet is regulated, and the gas cylinder is either heated or cooled.

Description

200826205 pt.ap773 22072twf.doc/g 九、發明說明: 【發明所屬之技術領域】 /本發明是有關於-種應用於半導體製程中的氣體輸送 系統,且特別是有關於一種具有加熱/冷卻裝置,以押 體鋼瓶溫度之氣櫃(Gas Cabinet)系統。 工1乳 【先前技術】200826205 pt.ap773 22072twf.doc/g IX. Description of the invention: [Technical field to which the invention pertains] / The present invention relates to a gas delivery system for use in a semiconductor process, and more particularly to a heating/cooling device , to the gas cabinet (Gas Cabinet) system. Work 1 milk [prior art]

在半導體製程中,幾乎每一種製程設備都需要各種 同的氣體。所以,半導體的製程設備都需要個別的1俨浐 送處理系統來傳輸所需要的製程氣體。氣體輸送系統^ 指的是氣體從氣體鋼瓶(Gas Cylinder)經過各種閥及配 件ϋ給各個製程機器。喊體輸送系統的規劃,也 隨著各種不同氣體間的特性,而有簡單到非f複雜的設計。 目前’半導雜程所f要的各種氣體供應,通常是儲 存在大小料的氣體鋼餘。氣體她都是被放置在—持 續排氣的氣櫃内,以防止氣體㈣。—般常用的氣體鋼瓶 為高壓鋼瓶,可依其填充的氣體特性分為氣態與液態鋼 升瓦。在半導體製程中常使用之氟化鶴(VI)(WF心、三氣化氣 (卿)、三氣化_α3)、二氣魏卿等氣體,由於 其本身的洛汽壓較低,在常溫中是以液體狀態(液態氣 填充儲存在氣體鋼瓶中。 、^態鋼瓶内部在工作壓力下為液態/氣態共存,鋼瓶内 之液感氣體精由鋼瓶本身與環境之_熱傳導使得液態基 發,形成氣態的蒸氣則為氣體的供應來源。隨著鋼瓶内液 ㈣體的液位下降,鋼瓶内部的壓力也會跟著改變。在環 5 200826205 pt.ap773 22072twf.doc/g =提供的熱量不足的情況下,鋼瓶内部的壓 應量的穩定需求,要賴足半*脰表程中對氣體供 態就需要吸收大量的孰能。妙態氣體變成氣 環境的熱量,效果十限然而’單 丨刀力限,亚且會造成壓力不穩定。 此,在使用這類的氣體時,必須於: f 鋼瓶,而促進氣體鋼瓶内能二:< σ σ熱氣體 氣體供應量。 之液喊體汽化’以提供穩定之 習:所採用的氣體鋼瓶加熱方式,主 =力、Ϊ部CDA加熱系統、以及底部電熱加”ί : 種直接加熱方式無法均句j式對液㈣骨立鋼瓶加熱。此 u Λ f 、、 …、 乙復住氣體鋼瓶,容易ra炎丄# 的接觸面積小,使得熱傳導效果不佳。=加Ϊ :方式容易造成鋼瓶内部的溫差增大,w t =乳冒因鋼瓶頂部的較低溫度而再次凝:成= 液^-旦鋼瓶内部形成液滴,會造成出 ^ :成 穩疋’並影響氣體供應量 ·^的昼力不 則需要消耗大量電力,容易 :::氣體;有自燃或是會二娜反::::1 為部 ”防麗水系統滅火’必須待其的 因此’以更謹慎的方式來處杜鮮殊^入仏造成危害’ 、理&些扣殊危險氣體是必要的。 6 200826205 pt.ap773 22072twf.doc/g 【發明内容】 有鑑於此,本發明的目的就是在提供一種氣樞溫度控 制系統,可以有效率地對氣魏麟行加熱或冷卻,使供 給氣體之壓力保持穩定。 ’、 本發明的再一目的是提供一種氣櫃溫度控制方法,可 以對氣體鋼瓶全面性加熱,並有效地解決氣體賴的問題。 本發明提出-種氣櫃溫度控制系統,此系統包括:内 部用於放魏體她之氣櫃本體、連錢櫃本體以調整氣 櫃本體内部溫度之加熱/冷卻裝置、連接加熱/冷卻裝置之 控制器、以及設置於氣體峨並倾至控制器之 ^力感測器。其中’控繼會根據壓力感測器的信號,控 制靖冷卻裝置以輕氣櫃本體㈣溫度,進而加熱或冷 钾氣體鋼瓶。 依照本發明的較佳實施例所述氣樞溫度控制系統,上 ,之加熱/冷料置包括:設置於氣櫃本體内部之第一機 :及^=櫃本體外部’並連接第—機組之第二機組、 、人及,連接乐—機組與第二機組的熱泵。其中,加埶/ 々卻敦置中的熱泵連接至上述之控制器。 ’、、、 依照本發明的較佳實施綱述^溫度控㈣统,上 =包括設置於壓力感測器與氣體鋼瓶的輸出口之間之再 '七、态,以及设置於氣櫃本體 測器。豆巾H丨^ 卩⑽接至控制器之氣體感 熱/冷卻裝置,據/體感測器的信號,控制加 丨衣:£ Κ周整乳櫃本體内部溫度。 依知、本發明的較佳實施例所述氣樞溫度控制系統,上 7 200826205 pt.ap773 22072twf.doc/g 述之氣體織’内料放之物料具純M 體,此種氣體在大氣塵力下以㈣ 哪3)、全氣丁二埽(C4F6)、或是氣 為二氣化氣 本發明之氣櫃溫度控㈣統具有力(2冷3中之―。 可以持_在氣_以熱風減加熱,控櫃=此 度。而且,控制器可根據鋼瓶出口的麼力感測哭溫 控制加熱/冷卻裝置,以調節氣櫃本體内部的it, 藉由加熱/冷卻裝置提高氣櫃本體 ^^鋼=卜’ 性t熱,能夠提供穩㈣氣體供應量。 之轧櫃Μ度控㈣統於氣體峨出 ^ 成以及後段冷凝的問題,有助於穩;;二 本發明再提出-種氣櫃溫度控制方法,此 上述之氣櫃溫度控制系統。氣櫃溫度控制系統包括3Γ邱 上櫃本體、連接氣櫃本體以調整氣櫃 制。„ 又17Α、/冷卻裝置、連接加熱/冷卻裝置之栌 力i、、;二及:置:咖岡瓶的輸出鳴接至控制器之i 哭的^ μ度控制方法藉由控制器根據壓力感測 制加熱/冷卻裝置以調整氣樞本體内部溫度, 進而加熱或冷卻氣體_瓦。 度 依照本發明的較佳實施例所述氣櫃溫度控制方法 度控制系統更包括設置於氣樞本體内部,並耦 之乳體感測器。當氣體感測器檢測到氣體有洩 漏守,猎由控制器控制加熱/冷卻裂置,降低氣櫃本體内部 200826205 pt.ap773 22072twf.doc/g 溫度’使氣體鋼瓶内之飽和壓力低於大氣壓力。 本毛月之氣櫃溫度控制方法,利用加熱/冷卻裝置可以 持續地錢_以缺觀加熱,職體舰進行全面性 熱1本發明11由控㈣根據壓力❹指的錢,控制加 '、、、/冷部裝置’以調整氣櫃本體内部的溫度。此外,當氣樞 本,内部的氣體感測器檢測到有氣體茂漏的情況發生,控 制器亦能夠將加熱/冷卻襄置切換到冷卻模式。當氣樞本體 内邛溫度降低時,氣體鋼瓶内的壓力也跟著降低,有利於 防止氣體持續、减。因此本發明能夠提供氣體鋼瓶全面性 的加熱方式,以穩定氣體供應量,並有助於防止氣體持 >矣漏的情形發生。 、 4為讓本發明之上述和其他目的、特徵和優點能更明顯 易It,下文特舉較佳實施例,並配合所附圖式,作詳細說 明如下。 、ϋ 【實施方式】 壯圖1為依照本發明實施例所繪示之氣櫃溫度控制系統 裂置圖。 請參照圖1,氣櫃溫度控制系統100包括氣櫃本體 1〇4、加熱/冷卻裝置106、控制器1〇8、壓力感測器n〇fc 再熱器112、以及氣體感測器114。 氣櫃本體104内部例如用於放置氣體鋼瓶。氣體 鋼瓶輸出口 102a連接至使用端116。加熱/冷卻裝置】= 例如連接至氣櫃本體104,以調整氣櫃本體】内部溫卢。 控制器108例如連接至加熱/冷卻裝置〗,以控制加 9 200826205 pt.ap773 22072twf.doc/g 冷郃裝置106為加熱或冷卻模式。 置於氣體鋼瓶輸出口 102a HJ:測器110例如設 112例如二:亚耦接至控制器' ⑽。再熱器In the semiconductor process, almost every process equipment requires a variety of gases. Therefore, semiconductor process equipment requires an individual processing system to transfer the required process gases. The gas delivery system ^ refers to the gas from the gas cylinder (Gas Cylinder) through various valves and fittings to each process machine. The planning of the body transport system, along with the characteristics of various gases, has a simple to non-f complex design. At present, the supply of various gases required for the semi-conducting process is usually the remainder of the gas steel stored in the size. The gas is placed in a gas cabinet that is continuously vented to prevent gas (4). The commonly used gas cylinders are high-pressure cylinders that can be classified into gaseous and liquid steel liters depending on the gas characteristics they are filled with. Fluorinated crane (VI) (WF heart, three gasification gas (Qing), three gasification _α3), two gas Weiqing and other gases commonly used in semiconductor manufacturing process, because of its low vapor pressure, at room temperature The medium is in a liquid state (liquid gas is filled and stored in a gas cylinder. The inside of the cylinder is in a liquid/gas state under working pressure, and the liquid gas in the cylinder is heated by the cylinder itself and the environment to make the liquid base. The formation of gaseous vapor is the source of gas supply. As the liquid level in the cylinder (four) body drops, the pressure inside the cylinder will also change. In the ring 5 200826205 pt.ap773 22072twf.doc / g = insufficient heat provided Under the circumstance, the stable demand of the pressure inside the cylinder depends on the supply of gas to the gas supply state in the semi-*脰 table. The wonderful gas becomes the heat of the gas environment, but the effect is limited. The force limit of the knife will cause the pressure to be unstable. Therefore, when using this kind of gas, it must be in: f cylinder, and promote the inner energy of the gas cylinder: < σ σ hot gas gas supply. Vaporization' to provide a stable habit : The gas cylinder used in the heating mode, the main = force, the crotch CDA heating system, and the bottom electric heating plus "ί : The direct heating method can not be evenly sentenced j to the liquid (four) bone cylinder heating. This u Λ f, ... B refills the gas cylinder, it is easy to rayan 丄# The contact area is small, so the heat conduction effect is not good. = Coronation: The method is easy to cause the temperature difference inside the cylinder to increase, wt = milk due to the lower temperature of the top of the cylinder and again Condensation: into = liquid ^ - Dan cylinders inside the formation of droplets, will cause ^: into a stable 'and affect the gas supply · ^ the power does not need to consume a lot of power, easy ::: gas; there is spontaneous combustion or Will Erna anti-::::1 for the Ministry of "anti-Lishui system fire extinguishing" must be treated to it, so in a more cautious way to come to Du Xianshu ^ into the 仏 to cause harm ', rational & some of the dangerous gas is necessary In view of the above, it is an object of the present invention to provide a temperature control system for a gas hub that can efficiently heat or cool a gas Weilin line to pressure the supply gas. Keep stable. ', this hair A further object of the present invention is to provide a gas cabinet temperature control method which can comprehensively heat a gas cylinder and effectively solve the problem of gas lag. The invention proposes a gas cabinet temperature control system, the system includes: internal for releasing Wei The body of the gas cabinet, the heating/cooling device for adjusting the internal temperature of the gas cabinet body, the controller for connecting the heating/cooling device, and the force sensor disposed on the gas gas and tilted to the controller. The control unit controls the temperature of the light cooling cabinet body (4) according to the signal of the pressure sensor, and then heats or cools the potassium gas cylinder. According to the preferred embodiment of the present invention, the air shaft temperature control system, The heating/cooling material comprises: a first machine disposed inside the gas cabinet body: and ^= outside the cabinet body and connecting the second unit of the first unit, the person, and the heat pump connecting the music unit and the second unit . Among them, the heat pump in the twisting / 々 敦 敦 is connected to the above controller. ',,, according to a preferred embodiment of the present invention, the temperature control (four) system, the upper = includes the re-seven state between the pressure sensor and the gas cylinder output port, and is set in the gas cabinet body measurement Device. Bean towel H丨^ 卩 (10) is connected to the controller's gas sensible heat/cooling device, according to the signal of the body sensor, control the 加 clothing: £ Κ week the internal temperature of the whole body. According to the air brake temperature control system of the preferred embodiment of the present invention, the material of the gas woven 'internal material is pure M body, and the gas is in the atmospheric dust. Under the force of (4) which 3), the whole gas Ding Erqi (C4F6), or the gas is the second gasification gas, the temperature control of the gas cabinet of the invention (four) is powerful (2 cold 3 medium - can hold _ in the gas _ The heating is reduced by hot air, and the control cabinet=this degree. Moreover, the controller can sense the crying temperature control heating/cooling device according to the force of the cylinder outlet to adjust the inside of the gas cabinet body, and raise the gas cabinet by heating/cooling device. The body ^^ steel = 卜's t heat, can provide a stable (four) gas supply. The rolling mill Μ degree control (four) is unified in the gas enthalpy and downstream condensation problems, help to stabilize; - Gas cabinet temperature control method, the above gas cabinet temperature control system. The gas cabinet temperature control system includes 3 cabinets on the upper cabinet, and the gas cabinet body is connected to adjust the gas cabinet system. „17 Α, / cooling device, connection heating / The power of the cooling device i,,; 2 and: set: the output of the Kaoka bottle is connected to the controller i The crying ^ μ degree control method adjusts the heating/cooling device according to the pressure sensing to adjust the internal temperature of the air shaft body, thereby heating or cooling the gas _ watt. The gas cabinet temperature according to the preferred embodiment of the present invention The control method control system further comprises a milk sensor disposed inside the airbag body and coupled to the body sensor. When the gas sensor detects that the gas leaks, the hunting controller controls the heating/cooling crack to reduce the gas cabinet body. Internal 200826205 pt.ap773 22072twf.doc/g Temperature 'so that the saturation pressure in the gas cylinder is lower than the atmospheric pressure. The temperature control method of the month of the month, using the heating / cooling device can continue to cost _ to the lack of heating, job The ship carries out comprehensive heat. 1 The invention is controlled by (4) according to the pressure of the pressure finger, and the control ', ,, / cold part device' is used to adjust the temperature inside the gas cabinet body. In addition, when the gas cylinder, the internal gas When the sensor detects a gas leak, the controller can also switch the heating/cooling device to the cooling mode. When the temperature in the air core is lowered, the pressure in the gas cylinder is also followed. The invention is advantageous in preventing the gas from continuing and decreasing. Therefore, the present invention can provide a comprehensive heating mode of the gas cylinder to stabilize the gas supply amount and help prevent the gas from being trapped. The above and other objects, features and advantages of the present invention will become more apparent from the following description. The gas cabinet temperature control system cracking diagram is shown. Referring to Figure 1, the gas cabinet temperature control system 100 includes a gas cabinet body 1〇4, a heating/cooling device 106, a controller 1〇8, and a pressure sensor n〇. Fc reheater 112, and gas sensor 114. The interior of the gas cabinet body 104 is used, for example, for placing a gas cylinder. The gas cylinder outlet 102a is connected to the use end 116. Heating/cooling device == For example, connected to the gas cabinet body 104 to adjust the gas cabinet body] internal temperature. The controller 108 is, for example, connected to a heating/cooling device to control the addition or cooling mode of the cold heading device 106 to 200826205 pt.ap773 22072twf.doc/g. Placed on the gas cylinder output port 102a HJ: The detector 110 is, for example, 112, for example, two sub-coupled to the controller '(10). Reheater

Li 器、114例如設置於氣櫃本體104内部,The Li device 114 is disposed, for example, inside the gas cabinet body 104.

亚耦接至控制器108。 II 件包二:如是持續排氣的氣櫃裝置,其基本構 ,包U於内部中央的支架(未繪示)。此 定The sub-coupling is connected to the controller 108. II Package 2: For the gas cabinet device with continuous exhaust, its basic structure, including U in the inner center of the bracket (not shown). This

m广 1Q2内部存放之氣體例如是具 之氣體。低蒸綠之氣體在大氣壓力下是以 如是三氟化氣、全氟丁二烯、或是氣化 加熱/冷卻裝置106例如是由第—機組施、第二機組 y6b、以及熱泵i〇6c所構成。第一機組1〇6&例如是室内 ,組,其設置於氣櫃本體1〇4内部。第二機組1〇汕例如是 至外機組,其設置於氣櫃本體1〇4外部,並與第一機組1〇6a 連接。熱泵106c例如是變頻熱泵,其同時連接第一機組 106a與第一機組i〇6b。控制器log連接至熱泵1〇6c。 士利用此加熱/冷卻裝置丨06使氣櫃本體丨〇4内部溫度上 升哙,使熱泵106c開始動作,以第二機組1〇6b回收室内, J汝疋辦么至或疋廠房所放出的熱能。然後,將第二機組 1〇6b所回收的熱能傳送到第一機組106a,利用固定通風排 氣加熱氣櫃本體104内部,以調整氣櫃本體1〇4内部環境 溫度。氣櫃本體104内部環境溫度上升,可使氣體鋼瓶1〇2 中的氣體達到飽合壓力,有助於氣體鋼瓶1〇2内的氣體從 10 200826205 pt.ap773 22072twf.doc/g 液態變成氣態。而且,採用間接性全面式加熱氣體鋼瓶 102,可以更有效率地加熱氣體鋼瓶。 而且,熱泵106c能夠將處於某一溫度的空間中的熱量, 轉移到另一溫度的空間。由於其加熱性能係數(c〇p)比一般電 熱尚約4倍,能源效率較習知之加熱系統高,亦可以將放出來 的冷能回收再使用。因此,加熱/冷卻裝置1〇6可以更有效率 地加熱氣櫃本體104内部,並減少能源的浪費。此外,氣櫃 本體1〇4 N部環境溫度不會超過桃,因此採用熱泵式的加 煞/冷部裝置1〇6可以提高氣櫃系統的安全性。 壓力感測器110例如設置於氣櫃本體1〇4内部,並耦 接至控制器108。控制器108接收壓力感測器11〇的信號, 亚根據來自壓力感測器11Q的信餘祕泵驗。亦即, 使用加熱/冷郃裝置1〇6加熱氣櫃本體1〇4内部時,藉由偵 魏體鋼瓶輸出口 1Q2a的壓力來控制熱泵lG6e的運轉,、 ,此调整第-機組1G6a的出風溫度,進而加熱或冷卻氣體 鋼瓶102。 f方面’當供應管路内的氣體氣相壓力大於或等於 ,和,汽壓力時,容易會有冷凝的現象產生。設置於壓力 1測Ί10與氣體鋼瓶輪出ϋ 102a之間的再熱器112,能 〜加官路中的溫度。藉由再熱器112加熱,有助於避免 之滴的產生’並減少官路後端發生冷凝的問題。 5雕氣"豆感測裔114可以偵測氣櫃本體104内部的是否有 。由於壓力感測器11〇連接至控制器1〇8,控制 〇 8籍由氣體感測1 114的信號,可控制加熱/冷卻裝置 200826205 pt.ap773 22072twf.doc/g 106。加熱/冷卻裝置l〇6可以對氣櫃本體内部進行加 熱或冷卻,進而調節氣體鋼瓶102的溫度。The gas stored inside the m wide 1Q2 is, for example, a gas. The low-vapor green gas is at atmospheric pressure such as trifluorocarbon gas, perfluorobutadiene, or gasification heating/cooling device 106, for example, by the first unit, the second unit y6b, and the heat pump i〇6c. Composition. The first unit 1〇6& is, for example, an indoor unit, which is disposed inside the cabinet body 1〇4. The second unit 1 is, for example, an external unit which is disposed outside the cabinet body 1〇4 and is connected to the first unit 1〇6a. The heat pump 106c is, for example, a variable frequency heat pump that simultaneously connects the first unit 106a with the first unit i〇6b. The controller log is connected to the heat pump 1〇6c. The heating/cooling device 丨06 is used to raise the internal temperature of the gas cabinet body 哙4, so that the heat pump 106c starts to operate, and the second unit 1〇6b recovers the indoor space, and the heat energy released by the factory or the factory building . Then, the heat energy recovered by the second unit 1〇6b is transferred to the first unit 106a, and the inside of the gas cabinet body 104 is heated by the fixed ventilation exhaust to adjust the internal ambient temperature of the cabinet body 1〇4. The internal temperature of the gas cabinet body 104 rises, and the gas in the gas cylinder 1〇2 can reach the saturation pressure, which helps the gas in the gas cylinder 1〇2 to change from a liquid state in the liquid state of the gas cylinder to the gaseous state. Moreover, the gas cylinder can be heated more efficiently by using an indirect comprehensive heating gas cylinder 102. Moreover, the heat pump 106c can transfer heat in a space at a certain temperature to a space of another temperature. Since the heating coefficient of performance (c〇p) is about 4 times higher than the general electric heat, the energy efficiency is higher than that of the conventional heating system, and the released cold energy can be recycled and reused. Therefore, the heating/cooling device 1〇6 can heat the inside of the cabinet body 104 more efficiently and reduce waste of energy. In addition, the ambient temperature of the 1〇4 N part of the gas cabinet body does not exceed the peach level, so the heat pump type enthalpy/cold unit 1〇6 can improve the safety of the gas cabinet system. The pressure sensor 110 is disposed, for example, inside the gas cabinet body 1〇4 and coupled to the controller 108. The controller 108 receives the signal from the pressure sensor 11A, based on the signal from the pressure sensor 11Q. That is, when the inside of the gas cabinet body 1〇4 is heated by the heating/cold cooling device 1〇6, the operation of the heat pump lG6e is controlled by the pressure of the detection body cylinder outlet port 1Q2a, and the adjustment of the first unit 1G6a is performed. The wind temperature, in turn, heats or cools the gas cylinder 102. In the aspect of f, when the gas phase pressure in the supply line is greater than or equal to, and, the vapor pressure, condensation tends to occur. The reheater 112, which is disposed between the pressure 1 and the gas cylinder wheel exit 102a, can be used to increase the temperature in the official road. Heating by the reheater 112 helps to avoid the generation of droplets' and reduces the problem of condensation at the rear end of the road. 5 carving gas " bean sensing 114 can detect whether there is inside the gas cabinet body 104. Since the pressure sensor 11 is connected to the controller 1〇8, the control unit 8 controls the heating/cooling device 200826205 pt.ap773 22072twf.doc/g 106 by the signal of the gas sensing 1 114. The heating/cooling device 16 can heat or cool the inside of the gas cabinet body to adjust the temperature of the gas cylinder 102.

承上述,具有如此結構之氣櫃溫度控制系統1〇〇,由 於控制器108可經由壓力感測器110的信號控制加熱/冷卻 t置106。因此,加熱/冷部裝置可以有效率地對氣櫃 本體104内部進行加熱或冷卻。特別是,加熱/冷卻裝置 106設置有第二機組i〇6b,能夠回收室内產生的熱能並加 以利用。因此,加熱/冷卻裝置1〇6可以提升氣櫃本體〗〇4 内部之加熱效率。而且,藉由調節氣櫃本體1〇4内部之溫 度,可以間接對氣體鋼瓶1〇2進行全面性加熱或冷卻,並 可以更進一步穩定氣體供應量。 接著說明本發明之氣櫃溫度控制方法。 明參知、圖1所示,當要供應氣體至使用端丨16時,打 開放置於氣櫃本體104内部的氣體鋼瓶1〇2的開關,使氣 盔經由氣體鋼瓶輸出口 102a、再熱器112、壓力感測器11〇 供應到使用端116。氣體鋼瓶1〇2内部存放之氣體例如是 具,較低蒸汽壓之氣體。因此,利用加熱/冷卻裝置1〇6控 制氣櫃本體1〇4 Θ部溫度,以加熱氣體鋼瓶,使氣體 鋼瓶102的内部氣體從液態變成氣態,而能夠提供製 需的氣體供應量。 然後’利用麈力感測器110偵測氣體鋼瓶輸出口 l〇2a 的氣體壓力。壓力11()將偵_壓力傳送至控制器 108。控制器1〇8將此壓力與標準值作比較,並根據比較結 果來控制加熱/冷卻裝置1G6,使加熱/冷卻裝置1%為加熱 200826205 pt.ap773 22072twf.doc/g 或冷卻模式。 舉例來說’當墨力感測器110所測得的氣體輸出壓力 值小於標準值時,控制器108使加熱/冷卻裝置1〇6切換為 加熱模式,以提高氣櫃本體104内部的溫度。氣櫃本體j〇4 ,部溫度提高,氣體鋼瓶1〇2的溫度亦跟著提高,有助於 氣體鋼瓶102内的氣體從液態變成氣態,而提高氣體輪出 量。當壓力感測器110所測得的氣體輪出壓力值大於 標準值時,則維持系統的現有運轉狀況。相反的,當壓力 感測器110所測得的氣體輸出壓力值大於標準值時,=制 器108使加熱/冷卻裝置106切換為冷卻模式,以降低氣櫃 本體104内部的溫度。氣櫃本體104内部溫度降低,氣骨1 鋼瓶102的溫度亦跟著降低,而減緩氣體鋼瓶1〇2内的^ 體從液態變成氣態,降低氣體輸出量。 * 、,另一方面,氣體感測器114設置於氣櫃本體1〇4内部, 並輕接至控制器。-旦氣體鋼瓶1()2中的氣體從管路 中外茂至氣櫃本體1Q4内部,可以立刻被氣體感測器114 所偵測到,以便進行適當的處置。控制器108藉由氣體感 測器114的信號,控制加熱/冷卻裝置1〇6,以調整太 體104内部溫度。 貝 舉例來說,當氣體感測器114偵測到氣櫃本體1〇4内 部有氣體洩漏,將信號傳給控制器1〇8。控制器]〇8控制 加熱/冷卻裝置1〇6,立刻切換為冷卻模式,卩降低氣本 體104内部溫度。氣櫃本體1Q4㈣環境溫度降低^體 鋼瓶102亦進行全面性冷卻,朗氣體鋼瓶1〇2内部之^ 200826205 pt.ap773 22072twf.doc/g 體飽和壓力會降至大氣厚六 在放卿/ 士々欣ί 下。由於氣體鋼瓶102内部 存放的乳脰在大乳壓力下是以液 由液態形成㈣,有助純錢簡續㈣。‘、“㈣ 壯罟述本考又明之氣樞溫度控制系統藉由加敎/冷卻 裝置,持續地在氣櫃内以埶 ,、、、/〜# 敎流#m n '、、、風排熱種間接式全面 ΓΙΙ= 有溫差小及熱交換面積大的特性。在 口μ肢鋼瓶時,能夠增加液態氣體 定的氣體供應量。而且,里、穩 出口之印七°又置於壓力感測器與氣體鋼瓶輸 糾Ϊ 有助於減少液_產生、解決後段冷 能,效率高’結合室外機組回收室内的熱能, 明夢心率“樞’並減少能源的浪f。因此,本發 熱〜= = = ’對氣體鋼瓶進行全面性加 令助灰如供^疋的氣體供應量。 本發明之氣櫃溫度控制方法蕻 系統,對氣卿銦询^ Γ 氣樞溫度控制 的麗力〜面性加熱。糾器«鋼瓶出口 體内itr=’控制加熱/冷卻裝置,以調整氣植本 部有氣°2_卜’ Μ體❹⑼貞_有氣櫃本體内 及肽洩漏,將k號傳給控制器。控 冷卻裝置切換成冷卻模式,以伟㈣:::以馬上將加熱/ 能夠蛆止^ ^ 0缞扰溫度降低,而 的安全。 持、_軸漏纽,轉護顯環境以及人員 雖然本發明已以較佳實施例揭露如上,然其並非用以 200826205 pt.ap773 22072twf.doc/g 限定本發明,任何熟習此技藝者,在不脫離本發明之精神 和範圍内,當可作些許之更動與潤飾,因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為依照本發明實施例所繪示之氣櫃溫度控制系統 裝置圖。 【主要元件符號說明】 100 :氣櫃溫度控制系統 102 :氣體鋼瓶 102a :氣體鋼瓶輸出口 104 :氣櫃本體 106 :加熱/冷卻裝置 106a、106b :機組 106c :熱泵 108 :控制器 110 ·壓力感測器 112 :再熱器 114 ·氣體感測器 116 :使用端In view of the above, the cabinet temperature control system 1 having such a configuration, since the controller 108 can control the heating/cooling t 106 via the signal of the pressure sensor 110. Therefore, the heating/cold device can efficiently heat or cool the inside of the gas cabinet body 104. In particular, the heating/cooling device 106 is provided with a second unit i〇6b capable of recovering and utilizing the heat energy generated in the room. Therefore, the heating/cooling device 1〇6 can increase the heating efficiency inside the gas cabinet body 〇4. Moreover, by adjusting the temperature inside the gas cabinet body 1〇4, the gas cylinder 1〇2 can be indirectly heated or cooled in a comprehensive manner, and the gas supply amount can be further stabilized. Next, the gas cabinet temperature control method of the present invention will be described. As shown in Fig. 1, when the gas is to be supplied to the end port 16, the switch of the gas cylinder 1〇2 placed inside the gas cabinet body 104 is opened, and the gas helmet is passed through the gas cylinder output port 102a and the reheater. 112. The pressure sensor 11 is supplied to the use end 116. The gas stored inside the gas cylinder 1〇2 is, for example, a gas with a lower vapor pressure. Therefore, the temperature of the gas cylinder body 1〇4 is controlled by the heating/cooling device 1〇6 to heat the gas cylinder, and the internal gas of the gas cylinder 102 is changed from a liquid state to a gaseous state, thereby providing a required gas supply amount. Then, the gas pressure of the gas cylinder output port l〇2a is detected by the force sensor 110. Pressure 11() transmits the detected pressure to controller 108. The controller 1〇8 compares this pressure with the standard value, and controls the heating/cooling device 1G6 based on the comparison result so that the heating/cooling device is 1% heated 200826205 pt.ap773 22072twf.doc/g or the cooling mode. For example, when the gas output pressure value measured by the ink force sensor 110 is less than the standard value, the controller 108 switches the heating/cooling device 1〇6 to the heating mode to increase the temperature inside the gas cabinet body 104. The gas cabinet body j〇4, the temperature of the part is increased, and the temperature of the gas cylinder 1〇2 is also increased, which helps the gas in the gas cylinder 102 to change from a liquid state to a gas state, thereby increasing the gas rotation amount. When the gas wheel pressure value measured by the pressure sensor 110 is greater than the standard value, the existing operating condition of the system is maintained. Conversely, when the gas output pressure value measured by the pressure sensor 110 is greater than the standard value, the controller 108 switches the heating/cooling device 106 to the cooling mode to lower the temperature inside the gas cabinet body 104. The internal temperature of the gas cabinet body 104 is lowered, and the temperature of the gas cylinder 1 cylinder 102 is also lowered, and the gas inside the gas cylinder 1 〇 2 is slowed from a liquid state to a gaseous state to reduce the gas output. *, on the other hand, the gas sensor 114 is disposed inside the gas cabinet body 1〇4 and is lightly connected to the controller. Once the gas in the gas cylinder 1 () 2 is externally piped to the inside of the gas cabinet body 1Q4, it can be immediately detected by the gas sensor 114 for proper disposal. The controller 108 controls the heating/cooling device 1〇6 by the signal of the gas sensor 114 to adjust the internal temperature of the body 104. For example, when the gas sensor 114 detects a gas leak inside the gas cabinet body 〇4, the signal is transmitted to the controller 1〇8. The controller 〇8 controls the heating/cooling device 1〇6 and immediately switches to the cooling mode to lower the internal temperature of the gas body 104. Gas cabinet body 1Q4 (four) ambient temperature reduction ^ body cylinder 102 is also fully cooled, Lang gas cylinder 1 〇 2 inside ^ 200826205 pt.ap773 22072twf.doc / g body saturation pressure will drop to atmospheric thickness six in the Qing / Gentry Xin 下. Since the chyle stored inside the gas cylinder 102 is formed by a liquid under a large milk pressure (4), it helps the pure money to be simplified (4). ', (4) Zhuang 罟 本 本 本 本 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气 气Indirect comprehensive ΓΙΙ = small temperature difference and large heat exchange area. In the mouth of the limb cylinder, it can increase the gas supply of liquid gas. Moreover, the printing of the inner and the stable outlet is placed in the pressure sensing. Correction and gas cylinders can help reduce liquid _ generation, solve the cold energy in the back section, and high efficiency. Combined with the outdoor unit to recover the heat energy in the room, the dream heart rate "hustle" and reduce the energy wave. Therefore, the heat generation ~= = = ' is a comprehensive supply of gas cylinders to assist the supply of gas such as gas. The gas cabinet temperature control method of the present invention 蕻 system, the Lili~face heating of the gas cylinder indium 询 Γ air temperature control. The corrector «cylinder outlet body itr=' control heating/cooling device to adjust the gas planting part of the gas °2_卜' Μ body ❹ (9) 贞 _ have gas cabinet body and peptide leakage, the k number is transmitted to the controller. Control the cooling device to switch to the cooling mode, with Wei (4)::: to immediately heat / able to stop ^ ^ 0 缞 disturb temperature reduction, and safe. Although the present invention has been disclosed in the preferred embodiment as above, it is not limited to 200826205 pt.ap773 22072twf.doc/g, and anyone skilled in the art, The scope of protection of the present invention is defined by the scope of the appended claims, unless otherwise claimed. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram of a gas cabinet temperature control system in accordance with an embodiment of the present invention. [Main component symbol description] 100: gas cabinet temperature control system 102: gas cylinder 102a: gas cylinder output port 104: gas cabinet body 106: heating/cooling device 106a, 106b: unit 106c: heat pump 108: controller 110 Detector 112: reheater 114 · gas sensor 116: use end

Claims (1)

200826205 pt.ap773 22072twf.doc/g 十、申請專利範圍: 1. 一種氣櫃溫度控制系統,包括: 一氣櫃本體,其内部用於放置至少一氣體鋼瓶; 一加熱/冷卻裝置,連接該氣櫃本體,用以調整該氣櫃 本體内部溫度; 一控制器,連接該加熱/冷卻裝置;以及 一壓力感測器,設置於該氣體鋼瓶的一輸出口,並耦 接至該控制器,該控制器根據該壓力感測器的信號,控制 r 、 該加熱/冷卻裝置以調整該氣櫃本體内部溫度,以加熱或冷 卻該氣體鋼瓶。 2. 如申請專利範圍第1項所述之氣櫃溫度控制系統, 其中該加熱/冷卻裝置包括: 一第一機組,設置於該氣櫃本體内部; 一第二機組,設置於該氣櫃本體外部,並連接該第一 機組;以及 一熱泵,連接該第一機組與該第二機組。 (_ 3.如申請專利範圍第2項所述之氣櫃溫度控制系統, 其中該控制器,連接該熱泵。 4. 如申請專利範圍第1項所述之氣櫃溫度控制系統, 更包括再熱器,設置於該壓力感測器與該氣體鋼瓶的該輸 出口之間。 5. 如申請專利範圍第1項所述之氣櫃溫度控制系統, 更包括: 一氣體感測器,設置於該氣櫃本體内部,並耦接至該 16 200826205 pt.ap773 22072twf.d〇c/g =置:氣體感測器的信號,控制該加熱/ 哀虱櫃本體内部溫度。 6 ·如申睛專利篇图 其中該氣體鋼瓶㈣# ^^ 溫度控制系統, 氣體。 、存放在大氣壓力下為液態之低蒸汽壓 7·如申4專利範圍第 其中該低蒸汽壓氣f為^所述之乳樞溫度控制系統, 其中之一。 且為—虱化亂、王鼠丁二烯或氟化鎢(VI) 櫃夭氣檀溫度控制方法,適用於一氣櫃系統,該氣 連接該氣櫃本内/,用並於用 1 置= 熱/冷卻襄置;連接3 本體内部溫度的一加 該氣體鋼瓶的—t出口熱ΪΓ裝置的一控制器;設置於 器,該方法包括 ,至該控制器的—壓力感測 置以調整該氣樞本體内部溫度,以加熱或冷卻該氣 其中:亥專利範圍第8項所述之氣樞溫度控制方法, 钟制=系統更包括設置於該氣樞本體内部,並轉接至 該氣體感測器檢測到氣體有 月旦内七皿度,使該氣體鋼瓶内之氣體壓力低於大氣壓力。 申請專利範圍第8項所述之氣植溫度控制方 决’”中該氣體鋼瓶用於存放在大氣壓力下為液態之低蒸 17 200826205 pt.ap/ / J 22072twf.doc/g 汽壓氣體。 11.如申請專利範圍第10項所述之氣櫃溫度控制方 法,其中該低蒸汽壓氣體為三氟化氯、全氟丁二烯或氟化 鎢(VI)其中之一。200826205 pt.ap773 22072twf.doc/g X. Patent application scope: 1. A gas cabinet temperature control system, comprising: a gas cabinet body for placing at least one gas cylinder therein; a heating/cooling device connecting the gas cabinet a body for adjusting an internal temperature of the gas cabinet body; a controller connecting the heating/cooling device; and a pressure sensor disposed at an output port of the gas cylinder and coupled to the controller, the control According to the signal of the pressure sensor, the heating/cooling device is controlled to adjust the internal temperature of the gas cabinet body to heat or cool the gas cylinder. 2. The gas cabinet temperature control system according to claim 1, wherein the heating/cooling device comprises: a first unit disposed inside the gas cabinet body; and a second unit disposed on the gas cabinet body Externally, and connected to the first unit; and a heat pump connecting the first unit and the second unit. (_ 3. The gas cabinet temperature control system according to claim 2, wherein the controller is connected to the heat pump. 4. The gas cabinet temperature control system according to claim 1 of the patent application, further includes The heat exchanger is disposed between the pressure sensor and the outlet of the gas cylinder. 5. The gas cabinet temperature control system according to claim 1, further comprising: a gas sensor disposed at The inside of the gas cabinet body is coupled to the 16 200826205 pt.ap773 22072twf.d〇c/g = set: the signal of the gas sensor, controlling the heating / mourning the internal temperature of the cabinet body. The gas cylinder (4)# ^^ temperature control system, gas. The low vapor pressure stored in the liquid state under atmospheric pressure 7 · The patent range of the patent 4, wherein the low vapor pressure f is the milk core temperature Control system, one of which is - 虱 乱 、, Wang 丁 butadiene or tungsten fluoride (VI) cabinet 夭 夭 檀 temperature control method, suitable for a gas cabinet system, the gas is connected to the gas cabinet / Use 1 set = heat / cooling set; connect 3 copies a controller for the internal temperature of the gas cylinder to be added to the -t outlet enthalpy device of the gas cylinder; the method includes: the pressure sensing to the controller is set to adjust the internal temperature of the air shaft body to heat Or cooling the gas, wherein: the air temperature control method according to item 8 of the patent scope, the clock system=the system further comprises being disposed inside the airbag body, and is transferred to the gas sensor to detect that the gas has a moon The gas pressure in the gas cylinder is lower than the atmospheric pressure in seven degrees. The gas cylinder temperature control method described in item 8 of the patent application is for storing the low steam in the liquid state under atmospheric pressure. 17 200826205 pt.ap / / J 22072twf.doc / g gas pressure gas. 11. The gas cabinet temperature control method according to claim 10, wherein the low vapor pressure gas is chlorine trifluoride or perfluorocarbon One of a diene or tungsten fluoride (VI). 1818
TW95146206A 2006-12-11 2006-12-11 Temperature controlling system of gas cabinet and operating method thereof TW200826205A (en)

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