200825938 ‘ 九、發明說明： • 【發明所屬之技術領域】 本發明係關於一種模組化混合介面積體電路卡，尤指 一種模組化混合介面積體電路卡，可與一標準介面卡輕合 5而成為一小型記憶卡，俾與一具有標準介面之裝置連接。 【先前技術】 與一般記憶體比較起來，由於快閃記憶體不需要電力 來維持已儲存的資料，故當電源關閉後，原本寫入的資料 10仍可保存於記憶體中，而且更具有小體積大容量的特性， 使快閃記憶體廣泛應用於許多可攜式的3C產品，如個人行 動助理（PDA)、無線行動通訊裝置（手機、PHS等）、數位相 機搭配使用之數位記憶卡（如CF、MMC、SD Card)、讀卡 機、订動碟、轉接卡等，都可見到快閃記憶體的應用。 15 一般而言，手持式裝置由於廠牌不同，其所使用的數 位兄憶卡的介面均不相同。例如：手機往往具有Μ— sd t; 介面，Canon的數位相機大部分為CF介面，少部分為81)介 面，而新力（Sony)的數位相機大部分為MS介面（Mem〇ry Stick)。各種手持式裝置由於設計不同，各具有不同的記憶 20體介面。一使用者為此往往需準備不同介面之記憶卡，此 不僅浪費使用者金錢，由於各記憶體介面不相$，亦增加 使用者使用日守的困擾。同日夺，_般快閃記憶體之積體電路 在封裝之後便已確定其記憶體介面而無法變t，因此不但 5 200825938 ==!限制’對於製造《而言，相同的快閃 體^在封裝後便無法轉用，會容易有存貨問題發生。 【發明内容】 5 本^ S之目的係在提供一種模組化混合介面積體+ 路卡及使用該積體雷玖丰^ 口，丨由積體包 憶卡可使用介面，而小：記憶卡，俾可增加小型記 依據本發明之―料核增加μ者便利性。 10 15 20 介面積體電路卡，包括,人电明係提出一種模組化混合 匕栝一多介面電路板、一 上；該非揮發二㈣器組設於該多介面電路板 〜豆、、。又於δ亥多介面電路板上並親接5 =制器，以由該控制器控制對非揮發性 ，該控制器依據該等介面接腳之訊號，以對該二 性記憶體執行讀/寫動作。 κ非揮么 人介面月之另一特色，本發明係提出一種模組化混 :稽^ 卡，包括—標準介面卡及—模组化混合介 内卡。該標準介面卡具有-標準介面之腳位及-h面接聊；該模組化混合介面積體電路卡包括一多介 板：：板Γ控制器及一非揮發性記憶體。該多介面電路 制=四、’其上分別設置有多種不同之介面接腳；該控 於;該多介面電路板上；該非揮發性記憶體組設 制電路板上並耦接至該控制器，以由該控制器控 +非揮备性記憶體之讀寫，該控制器依據該等介面接腳 6 200825938 之訊號，以對該非揮發性記惊 模組化混合積體電路卡經由該 面接腳而與該標準介面卡I馬合 具有標準介面之讀卡裝置連接 體執行讀/寫動作；其中，該 等介面接腳之一及該内部介 ，俾經由該標準介面卡與一 【實施方式】 請參考圖1係本發明一鲂^土與# ^ 一 今叔乃孕乂仫男施例之示意圖，如圖所 示，本發明之模組化混合介面積體電路卡包括一多介面電 路板110、一控制器12〇及一非揮發性記憶體13〇。 10 該多介面電路板H0具有四邊，其上分別設置有多種不 同之介面接腳。該等介面接腳包括Micr〇SD介面接腳丨4〇、 MmiSD介面接腳丨50、Mem〇ry Stkk介面接腳丨⑼、及 Pad介面接腳no。 該控制器120係組設於該多介面電路板11〇上。該控制 15為120分別具有與該等介面接腳對應的介面電路。亦即該控 制為120分別具有MicroSD介面電路、MiniSD介面電路、200825938 ' IX. Description of the invention: • Technical field of the invention The present invention relates to a modular hybrid medium-area circuit card, in particular to a modular hybrid medium-area circuit card, which can be lightly coupled to a standard interface card. In combination with 5, it becomes a small memory card that is connected to a device having a standard interface. [Prior Art] Compared with general memory, since the flash memory does not require power to maintain the stored data, when the power is turned off, the originally written data 10 can be stored in the memory, and is smaller. The large-capacity features make flash memory widely used in many portable 3C products, such as personal mobile assistants (PDAs), wireless mobile communication devices (mobile phones, PHS, etc.), digital video cards used with digital cameras ( For example, CF, MMC, SD Card, card reader, staple disc, adapter card, etc., can be seen in the application of flash memory. 15 In general, handheld devices use different interface cards because of the different labels. For example, mobile phones often have Μ-sd t; interface, Canon's digital camera is mostly CF interface, a small part is 81) interface, and Sony's digital camera is mostly MS interface (Mem〇ry Stick). Various handheld devices have different memory 20-body interfaces due to different designs. For this reason, a user often needs to prepare a memory card with different interfaces, which not only wastes the user's money, but also increases the user's use of the day-to-day trouble because the memory interfaces do not have the same amount. On the same day, the integrated circuit of _like flash memory has determined its memory interface after packaging and cannot change t, so not only 5 200825938 ==! Limit 'for manufacturing, the same flash body ^ Once packaged, it cannot be diverted, and inventory problems can easily occur. [Summary of the Invention] 5 The purpose of this S is to provide a modular mixed media area + road card and use the integrated Thunder Feng ^ mouth, the use of the integrated package recall card can use the interface, and small: memory The card and the cymbal can increase the convenience of the small-sized note according to the present invention. 10 15 20 The medium-area circuit card, including the human-electric system, proposes a modular hybrid multi-interface circuit board, and the upper non-volatile circuit board is disposed on the multi-interface circuit board. And on the δ hai multi-interface circuit board and a 5 = controller, to control the non-volatile by the controller, the controller according to the signal of the interface pins to perform reading on the bis-memory memory / Write action. Another feature of the κ non-sweeper interface month is that the present invention proposes a modular mix: a card, including a standard interface card and a modular hybrid media card. The standard interface card has a standard interface pin and a -h face chat; the modular mixed media area circuit card includes a multi-mode board: a board controller and a non-volatile memory. The multi-interface circuit system=4, 'a plurality of different interface pins are respectively disposed thereon; the control is on the multi-interface circuit board; the non-volatile memory group is disposed on the circuit board and coupled to the controller The controller reads and writes the non-swimming memory by the controller, and the controller according to the signal of the interface pin 6 200825938, to connect the non-volatile memory module to the hybrid integrated circuit card via the interface And the standard interface card I and the card reader device having a standard interface perform a read/write operation; wherein one of the interface pins and the internal interface are connected to the internal interface card Please refer to FIG. 1 , which is a schematic diagram of a male embodiment of the present invention. As shown in the figure, the modular mixed medium area circuit card of the present invention comprises a multi-interface circuit. The board 110, a controller 12A and a non-volatile memory 13A. 10 The multi-interface circuit board H0 has four sides on which a plurality of different interface pins are respectively disposed. The interface pins include a Micr〇SD interface pin 4丨, a MmiSD interface pin 50, a Mem〇ry Stkk interface pin (9), and a pad interface pin no. The controller 120 is disposed on the multi-interface circuit board 11A. The control 15 has 120 interface circuits corresponding to the interface pins, respectively. That is, the control is 120 with a MicroSD interface circuit and a MiniSD interface circuit, respectively.
Memory Stick介面電路及Flash Pad介面電路。 該非揮發性記憶體130組設於該多介面電路板11〇上 並耗接至該控制器丨2〇，以由該控制器120控制對非揮發性 20 s己憶體13 0之讀寫。 圖2係本發明一較佳實施例之使用示意圖。如圖所 示’本發明之模組化混合介面小型記憶卡，包括一模組化 混合介面積體電路卡及一標準介面卡210。 7 200825938 «亥‘準介面卡210其具有一標準介面之腳位230及一 内口卩；I曲接腳2 2 0。Tfi7該模組化混合介面積體電路卡包括一 夕’I面電路板1 1 〇、一控制器1 及一非揮發性記憶體1 %。 该多介面電路板110具有四邊，其上分別設置有四種 5不同之介面接腳（14〇、150、160、170)。該等介面接腳包 括MicroSD介面接腳140、MiniSD介面接腳15〇、Mem〇ry Stick介面接腳160、及Flash Pad介面接腳170。 5玄控制态120係組設於該多介面電路板1丨〇上。該非揮 發性記憶體130組設於該多介面電路板11〇上並耦接至該控 10制器120,以由該控制器12〇控制對非揮發性記憶體i %之讀 寫，該控制器120依據該等介面接腳（14〇、15〇、16〇、17〇) 之訊號，以對該非揮發性記憶體13〇執行讀/寫動作。該模 組化混合積體電路卡經由該等介面接腳（14〇、15〇、16〇、 170)之一及該内部介面接腳22〇而與該標準介面卡21〇耦 15合，俾經由该標準介面卡210與一具有標準介面之讀卡裝置 連接。 模組化/心合介面積體電路卡係以其一介面接腳（1 、 150、160、170)焊接於該標準介面卡21〇之内部介面接腳 230，而構成如圖3A所示之模組化混合介面小型記憶卡。 20模組化混合介面積體電路卡亦可以其一介面接腳（丨4〇、 150、160、170)可移除地連接於該標準介面卡21〇之内部介 面接腳230，而構成如圖3B所示之模組化混合介面小型記 憶卡。此時，該模組化混合介面積體電路卡為一公連接器， 而標準介面卡210為母連接器。 8 200825938 如圖2所示，當欲將本發明連接至一 MicroSD介面的讀 卡枝或手持式裝置時，該標準介面卡之標準介面230為 MicroSD介面，同時將該模組化混合介面積體電路卡之 MicroSD介面接腳14〇與該標準介面卡之内部介面接腳22〇 5連接士此该模組化混合積體電路卡經由MicroSD介面 接腳140及該内部介面接腳220而與該標準介面卡21〇耦 。，俾經由該標準介面卡210與一具有MicroSD標準介面之 讀卡機或手持式裝置連接。 如圖4所示，當欲將本發明連接至一 MiniSD介面的讀 ίο卡钱或手持式I置時，該標準介面卡之標準介面mo為 MimSD介面，同時將該模組化混合介面積體電路卡之 MmiSD "面接腳15〇與該標準介面卡之内部介面接腳π。 連接士此忒模組化混合積體電路卡經由MiniSD介面接 腳150及忒内部介面接腳22〇而與該標準介面卡η。耦合，俾 15 、二由°亥‘準71面卡210與一具有％比丨8]：)標準介面之讀卡機 或手持式裝置連接。 士如圖5所示’當欲將本發明連接至—s⑽介面 的項卡機或手持式I置時，該標準介面卡之標準介面， 為Memory Stlck介面，同時將該模組化混合介面積體電路 20卡之Mem〇ry Stick介面接腳16〇與該標準介面卡之内部介 面接腳220連接。如此，該模組化混合積體電路卡經由 Me則ry Stlck介面接腳丨6〇及該内部介面接腳22〇而與該標 準介面卡210耦合，俾經由該標準介面卡210盥一呈有 M_ryS献標準介面之讀卡機或手持式裝置連接/ 9 200825938 - 如圖6所示，當欲將本發明連接至一外部非揮發性記 • 憶體時，該標準介面卡之標準介面230為Flash Pad介面， 同時將該模組化混合介面積體電路卡之Flashpad介面.接腳 no與該標準介面卡之内部介面接腳22〇連接。如此，該模 5組化混合積體電路卡經由Flash Pad介面接腳170及該内部 介面接腳220而與該標準介面卡21〇耦合，俾經由該標準介 面卡210與一具有Flash ?“標準介面之外部非揮發性記憶 體連接，a亥控制态可藉由該Fiash pad介面接腳，以存取一 Γ 外部非揮發性記憶體。 1〇 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 又 【圖式簡單說明】 15 圖1係本發明一較佳實施例之模組化混合介面積體電 的示意圖。 卞 圖2係本發明-較佳實施例之模組化混合介面積體電 的使用示意圖。 卞 圖3A及3B係本發明_較佳實施例之模組化混合介面 20 記憶卡的示意圖。 主 圖4係本發明另—較佳實施例之模組化混合介 卡的使用示意圖。 $路 圖5係本發明再-較佳實施例之模組化混合介面積 卡的使用示意圖。 ％ 10 200825938 圖6係本發明又一較佳實施例之模組化混合介面積體電路 卡的使用示意圖。 【主要元件符號說明】 5 多介面電路板 110 控制器 120 非揮發性記憶體 130 MicroSD介面接腳 140 MiniSD介面接腳 150 Memory Stick介面接腳 160 Flash Pad介面接腳 170 標準介面卡 210 10 標準介面之腳位 230 内部介面接腳 220 f ί 11Memory Stick interface circuit and Flash Pad interface circuit. The non-volatile memory 130 is disposed on the multi-interface circuit board 11 耗 and is consuming to the controller 以 2 〇 to control the reading and writing of the non-volatile 20 s replies 130 by the controller 120. Figure 2 is a schematic illustration of the use of a preferred embodiment of the present invention. As shown in the figure, the modular hybrid interface small memory card of the present invention comprises a modular mixed-area circuit card and a standard interface card 210. 7 200825938 «Hai' interface card 210 has a standard interface pin 230 and an internal port; I crank pin 2 2 0. The Tfi7 modular mixed-area circuit card includes an I-on board, a controller 1 and a non-volatile memory of 1%. The multi-interface circuit board 110 has four sides on which four different interface pins (14, 150, 160, 170) are respectively disposed. The interface pins include a MicroSD interface pin 140, a MiniSD interface pin 15A, a Mem〇ry Stick interface pin 160, and a Flash Pad interface pin 170. 5 Xuan control state 120 series is set on the multi-interface circuit board 1 。. The non-volatile memory 130 is disposed on the multi-interface circuit board 11 and coupled to the controller 120 to control the reading and writing of the non-volatile memory i% by the controller 12 The device 120 performs a read/write operation on the non-volatile memory 13A according to the signals of the interface pins (14〇, 15〇, 16〇, 17〇). The modular hybrid integrated circuit card is coupled to the standard interface card 21 via one of the interface pins (14〇, 15〇, 16〇, 170) and the internal interface pin 22〇, The standard interface card 210 is connected to a card reading device having a standard interface. The modular/heart-to-body area circuit card is soldered to the internal interface pin 230 of the standard interface card 21 by an interface pin (1, 150, 160, 170) to form a mode as shown in FIG. 3A. Grouped mixed interface small memory card. The 20-module hybrid medium-area circuit card may also be removably connected to the internal interface pin 230 of the standard interface card 21 by an interface pin (丨4〇, 150, 160, 170). The modular mixed interface small memory card shown in 3B. At this time, the modular mixed-area circuit card is a male connector, and the standard interface card 210 is a female connector. 8 200825938 As shown in FIG. 2, when the present invention is to be connected to a micro SD interface card reader or handheld device, the standard interface 230 of the standard interface card is a MicroSD interface, and the modular mixed media area is The microSD interface pin 14 of the circuit card is connected to the internal interface pin 22〇5 of the standard interface card. The modular hybrid integrated circuit card is connected to the internal interface pin 220 via the MicroSD interface pin 140 and the internal interface pin 220. The standard interface card 21 is decoupled. The standard interface card 210 is connected to a card reader or handheld device having a MicroSD standard interface. As shown in FIG. 4, when the present invention is to be connected to a MiniSD interface of a MiniSD interface, the standard interface mo of the standard interface card is a MimSD interface, and the modular mixed medium area is simultaneously The MmiSD "face pin 15 of the circuit card is connected to the internal interface pin of the standard interface card. The connector integrated circuit card is connected to the standard interface card η via the MiniSD interface pin 150 and the internal interface pin 22〇. Coupling, 俾 15 , 2 is connected by a card reader or a handheld device with a standard interface between the 亥 ‘ 面 面 面 210 210 210 210 210 210 210. As shown in Figure 5, when the card is to be connected to the -s(10) interface card card or handheld I, the standard interface of the standard interface card is the Memory Stlck interface, and the modular mixed area is also The Mem〇ry Stick interface pin 16 of the body circuit 20 card is connected to the internal interface pin 220 of the standard interface card. In this manner, the modular hybrid integrated circuit card is coupled to the standard interface card 210 via the Me ry Stlck interface pin 6丨 and the internal interface pin 22〇, and is displayed via the standard interface card 210. M_ryS standard interface card reader or handheld device connection / 9 200825938 - As shown in Figure 6, when the invention is to be connected to an external non-volatile memory, the standard interface 230 of the standard interface card is The Flash Pad interface also connects the Flashpad interface of the modular mixed-area circuit card. The pin no is connected to the internal interface pin 22 of the standard interface card. In this manner, the modulo 5-group hybrid integrated circuit card is coupled to the standard interface card 21 via the Flash Pad interface pin 170 and the internal interface pin 220, and via the standard interface card 210 and a flash? The external non-volatile memory of the interface is connected to the external non-volatile memory by the Fiash pad interface pin. The above embodiments are merely examples for convenience of explanation. The scope of the claims should be based on the scope of the patent application, and is not limited to the above embodiments. [FIG. 1] FIG. 1 is a modular hybrid medium according to a preferred embodiment of the present invention. 2 is a schematic diagram of the use of the modular mixed-area body power of the present invention - FIG. 3A and 3B are the modular hybrid interface 20 of the present invention. Schematic diagram of a memory card. Figure 4 is a schematic diagram of the use of a modular hybrid card in accordance with another preferred embodiment of the present invention. Figure 5 is a schematic hybrid area card of a further preferred embodiment of the present invention. Use the schematic. 10 200825938 FIG. 6 is a schematic diagram of the use of a modular hybrid medium area circuit card according to still another preferred embodiment of the present invention. [Main component symbol description] 5 multi-interface circuit board 110 controller 120 non-volatile memory 130 MicroSD interface Pin 140 MiniSD interface pin 150 Memory Stick interface pin 160 Flash Pad interface pin 170 Standard interface card 210 10 Standard interface pin 230 Internal interface pin 220 f ί 11