200823543 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種光源組件及其製法，更詳而言 之，係關於一種透過反射部之設置，控制該光源件所提供 之光源的出光角度，以增加出光效率之光源組件及其製法。 【先前技術】 按，不同於白熾燈發熱的發光原理，發光二極體（Lgh200823543 IX. Description of the Invention: [Technical Field] The present invention relates to a light source assembly and a method of fabricating the same, and more particularly to a light-transmitting light source provided by a light source member Angle, a light source assembly that increases light extraction efficiency and its method of manufacture. [Prior Art] Press, different from the principle of illumination of incandescent lamps, LEDs (Lgh
Emitting Diode ; LED )之發光原理主要是施加電流在可發 光物質（活性發光層）上，以達到發光效果，所以發光二極 體被稱^令光源（coldlight)。由於發光二極體具有高耐 久〖生可中長、輕巧、耗電量低等優點，且不含水銀等有 告物貝’因此，也使應帛LED的固態照明成為未來全球照 明產業及半導體產業的重要研發目標。常見之應用方向則 2如包括白光照日月、指示燈、車用訊號燈與照明燈、手電 筒以及LED月光柄組、投影機光源、與户外顯示器等之 _顯示器應用。 現7之务光一極體之相關技術，如本國專利公開號第 200534498號之衷刹安「v 專利木「發光二極體的封裝結構」、公告 號第1244783號之專剝安「& t ^ u心寻利案「發光二極體反射蓋製造方法」、 公開號第200514214觫+宙r 「 4逮之專利案「一種光電組件」及公告 號第00417937號之直制盘「 <專利案「二極體側面型背景光源板」， 其皆揭露由單一弈源/生^々 __ 艽原件（如發光二極體晶片或發光二極體） 一:、、、’:光單兀’因& ’若需將點光源形成面光源，則需於 母一光源件製作成為發料元後，再—進行㈣式之排 5 19950 200823543 列組合方可達成，實費工費時於製程上；此外，由於該些 技術中所使用之結合方式（如將發光二極體晶片或發光二 極體設置於導電元件或印刷電路板上）皆為使用表面黏著 技術（SMT)，因此，其工作溫度都必需維持在大於26〇艺， 故其所使用之元件（如反射體、反射基座）皆必需採用玻璃 轉換溫度（TG)較高之材質（如PA9T)，然而，因玻璃轉換溫 -度較高之材質的成本較高’故會存有高原物料成本之問題。 ^ # 職是，如何提供一種能夠簡化製程並降低原物料成本 且兼具高出光效率的光源組件及其製法，實為此領域中亟 待解決之問題。 【發明内容】 供一 的出The light-emitting principle of Emitting Diode (LED) is mainly to apply a current on the luminescent material (active luminescent layer) to achieve the illuminating effect, so the illuminating diode is called a cold light. Because the light-emitting diode has high durability, it can be medium-length, light, and low in power consumption, and it does not contain mercury. It also makes solid-state lighting of LEDs become the future global lighting industry and semiconductor. Important research and development goals of the industry. Common application directions are as follows: including white light, sun and moon, indicator lights, vehicle signal lights and lights, flashlights, LED moonlight handle sets, projector light sources, and outdoor displays. The related technology of the current light-polar one, such as the national patent publication No. 200534498, the "V patent wood "light-emitting diode package structure", the bulletin number 1244783, the special stripping "& t ^ u心寻利" "Light-emitting diode reflector manufacturing method", Publication No. 200514214觫+宙r "4 arrested patent case "an optoelectronic component" and bulletin No. 00417937" The "diode side-type background light source panel", which is disclosed by a single source / raw ^ __ 艽 original (such as a light-emitting diode chip or a light-emitting diode)::,,,,,,,,,, 'Because & 'If you need to form a point source to form a surface source, you need to make a source element after the source is made, then proceed to - (4) row 5 19950 200823543 column combination can be achieved, the actual cost is in the process In addition, since the bonding methods used in the technologies (such as placing a light-emitting diode wafer or a light-emitting diode on a conductive member or a printed circuit board) are all using surface mount technology (SMT), The operating temperature must be maintained at more than 26 〇, The components used (such as reflectors and reflective pedestals) must be made of a material with a high glass transition temperature (TG) (such as PA9T). However, the cost of materials with higher temperature conversion is higher. There will be problems with the cost of highland materials. ^ #职是, how to provide a light source assembly that can simplify the process and reduce the cost of raw materials, and has high light-emitting efficiency, and its manufacturing method, is a problem to be solved in this field. [Summary of the Invention]
繁於上述習知技術之缺失，本發明之主要目的在於提 種光源組件及其製法，以控制料 光角度，進而增加出光效率。 之光源 本，明之另一目的在於提供一種光源組件及其製 以簡化製程並降低原物料成本。 為達上述主要及另 ^ ^ 的，+¾、明所提供之光源組 # A t ’係佈設有供接置電源之線路;光源件， 〉'二發光二極體裸晶粒組成，並設置於該基板上， 且與該基板之線路電性連接，用以、土 源後’提供光源；反射件，俜;：土板之線路接置電 曰兮士係對應该光源件設有中空部， 基;:上射部’並對應該光源件設置於該 控制該光源件所提:之源後’透過該反射部 原的出光角度，俾增加出光效 19950 6 200823543 率；以及保護件，係形成於該反射件之中空部内，用以保 護該光源件。 ’ 於本發明之較佳實施例，該基板係為印刷電路板 (PCB)、玻纖覆銅板（FR4)以及金屬基板（metal_sub)之其中 一者；該發光二極體裸晶粒係包括：二歐姆電極，係與該 基板之線路電性連接，用以於該基板之線路接置電源後， -傳輸該電源；以及發光活性層，係與該歐姆電極電性連接， 鲁用以於該基板之線路接置電源後，接收該歐姆電極所傳輸 之電源，並提供光源；該發光二極體裸晶粒之二歐姆電極 係分別透過導線與該基板之線路電性連接；該反射件之材 貝係為結晶性或非結晶性之塑化材料；該中空部係為穿 孔；該反射部係為斜面結構；該保護件係為膠材成型者。 ，為達上述主要及另一目的，本發明所提供之光源組件 =製法，係包括：製備佈設有供接置電源之線路之基板； 又置由至^ 一發光二極體裸晶粒組成之光源件於該基板上 •並電性連接該光源件與該基板之線路；對應絲源件 •反2^牛於該基板上，其中，該反射件係對應該光源件設有 中二邛，且邊中空部之周緣係具反射部；以及形成保護件 於该反射件之中空部内。 於本發明之較佳實施例，該基板係為印刷電路板 (PCB)、玻纖覆銅板（FR4)以及金屬基板（metal_sub)之其中 者，忒鲞光一極體裸晶粒係包括：二歐姆電極，係與該 基板，線路電性連接’用以於該基板之輯接置電源後， 傳輸该電源；以及發光活性層，係與該歐姆電極電性連接， 19950 7 200823543 用以於該基板之線路接置電源後，接收該歐姆電極所傳輸 之電源，並提供光源；該發光二極體裸晶粒之二歐姆電極 係分別透過導線與該基板之線路電性連接；該反射件之材 質係為結晶性或非結晶性之塑化材料；該反射件係透過低 工作溫度之膠合（glue adhesion)方式設置於該基板上；該中 空部係為穿孔；該反射部係為斜面結構；該保護件係為膠 -材成型者；該保護件係透過為灌入膠材或壓鑄璆材反 _射件之中空部，並待成型後形成。 …反 相較於習知技術，本發明之光源組件及其製法主要係 透過上揭具中空部以及反射部之反射件對應光源件設置於 基板上，以於該基板之線路接置電源後，令該光源件 源觸發後所提供之光源透過該反射部控制該光源件所提供 之光源的出光角度，俾增加出光效率，故可達到上述之^In view of the above-mentioned shortcomings of the prior art, the main object of the present invention is to provide a light source assembly and a method for manufacturing the same to control the light angle and thereby increase the light extraction efficiency. The light source of the present invention is to provide a light source assembly and its manufacture to simplify the process and reduce the cost of raw materials. In order to achieve the above main and other ^ ^, +3⁄4, the light source group # A t ' provided by the Ming is provided with a line for connecting the power supply; the light source part, 〉 'two light-emitting diodes bare die composition, and set On the substrate, and electrically connected to the circuit of the substrate, for providing a light source after the earth source; reflecting member, 俜;: the line of the earth plate is connected to the electric gentleman, and the light source member is provided with a hollow portion , base;: the upper portion 'and the light source member is disposed after the source of the light source member is controlled to pass the original light exiting angle of the reflection portion, and the light efficiency is increased by the rate of 19950 6 200823543; and the protective member is Formed in the hollow portion of the reflector to protect the light source member. In a preferred embodiment of the present invention, the substrate is one of a printed circuit board (PCB), a glass fiber clad laminate (FR4), and a metal substrate (metal_sub); the LED die includes: The ohmic electrode is electrically connected to the circuit of the substrate, and is configured to: after the power of the substrate is connected to the power source, to transmit the power source; and the luminescent active layer is electrically connected to the ohmic electrode, and is used for After the circuit of the substrate is connected to the power source, receiving the power source transmitted by the ohmic electrode, and providing a light source; the two ohmic electrodes of the bare die of the light emitting diode are respectively electrically connected to the circuit of the substrate through the wire; the reflecting member The shellfish is a crystalline or amorphous plasticized material; the hollow portion is a perforation; the reflecting portion is a beveled structure; and the protective member is a rubber molded body. For the above-mentioned main and other purposes, the light source component provided by the present invention is a manufacturing method comprising: preparing a substrate provided with a circuit for connecting a power source; and further comprising a thin die of a light emitting diode. The light source member is electrically connected to the circuit of the light source member and the substrate; the corresponding wire source member is reversed on the substrate, wherein the reflective member is provided with a middle beam corresponding to the light source member. And a peripheral portion of the hollow portion is provided with a reflecting portion; and a protective member is formed in the hollow portion of the reflecting member. In a preferred embodiment of the present invention, the substrate is one of a printed circuit board (PCB), a glass fiber clad laminate (FR4), and a metal substrate (metal_sub), and the dimmed one-pole bare die includes: two ohms. The electrode is electrically connected to the substrate, and is used to transmit the power source after the power is connected to the substrate; and the luminescent active layer is electrically connected to the ohmic electrode, and the substrate is used for the substrate in 19950 7 200823543. After the line is connected to the power source, the power source transmitted by the ohmic electrode is received, and a light source is provided; the two ohmic electrodes of the bare die of the light emitting diode are electrically connected to the circuit of the substrate through the wire; the material of the reflector a plasticized material that is crystalline or amorphous; the reflective member is disposed on the substrate by a glue adhesion method at a low working temperature; the hollow portion is a perforated; the reflecting portion is a bevel structure; The protective member is a rubber-material former; the protective member is formed by being filled into the hollow portion of the rubber material or the die-casting material, and is formed after being formed. In contrast, the light source assembly of the present invention and the manufacturing method thereof are mainly disposed on the substrate through the reflector of the hollow portion of the upper strip and the reflecting portion of the reflecting portion, so that after the line of the substrate is connected to the power source, The light source provided after the source of the light source device is triggered to control the light exiting angle of the light source provided by the light source member through the reflecting portion, and the light emitting efficiency is increased, so that the above-mentioned
Cl:丄此外，於本發明之光源組件之製法中，係可透過 ·:，： =特性，在低溫下將該反射件膠合於該基板 籲亡$而間化製程並降低原物料成本，故可達到上述之另 '一目的。 ~ 【實施方式】 以下係藉由特定的具體實例說明本發明之實施方 i解人士可由本說明書所揭示之内容輕易地 =其他優點與功效。本發明亦可藉由其他不同 夂：:例加以施行或應用’本說明書中的各項細節亦可 :::::點與應用’在不悻離本發明之精神下進行各種 19950 8 200823543 請參閲第1及2圖，其係為本發明光源組件之實施例 外觀立體及剖面示意圖。如圖所示，該光源組件1係包括 基板10、光源件11、反射件及保護件13。 以下即對本發明之光源組件1之上揭各物件，分別進 行詳細說明： 該基板10，係佈設有供接置電源之線路。於本實施例 中’該基板10係為印刷電路板（PCB)、玻纖覆銅板（FR4) I或金屬基板（metal-sub)等，且其表面上至少佈設有供接置 電源之線路，需予以說明的是，該線路係為此領域中之通 ，知識，故於圖中，未予表示，此外，本實施例之線路的 最佳實施方式，係依據該光源件u之設置位置以及尺寸大 小進行佈設，以供該光源件u便於與該線路電性連接。 該光源件11，係由至少二發光二極體裸晶粒11〇組 成，並設置於該基板10上，且與該基板10之線路電性連 接，用以於該基板10之線路接置電源後，提供光源。於本 實施例中，該發光二極體裸晶粒110係包括：二歐姆電極， 係與該基板10之線路電性連接，用以於該基板1〇之線路 接置電源後，傳輸該電源；以及發光活性層，係與該歐姆 電極電性連接，用以於該基板1G之線路接置電源後，接收 該歐姆電極所傳輸之電源，並提供光源，其中，該發光二 極體裸晶粒11G之二歐姆電極係分別透過導線與該基板w 之線路電性連接，且該發光活性層㈣相接之？型發光層 (WnGaN)以及N型發光層（N_InGaN)。需予以說明的是，曰 錢光二極體裸晶粒11G之歐姆電極、發光活性層以及導 19950 200823543 線之電性連接方式係為此領 未予表示。 之通吊知識，故於圖中， 而本實施例係如圖中所；、 110為例進行示意，於實際者於’^三發光二極體裸晶粒 11〇之數量係可依實際需：：：捋’ 5亥發光二極體裸晶粒 源）進行增減，但應至少為二光源強纟的要求或為節約能 該發光二極體裸晶粒110:二^體裸晶粒110,此外， 配置，並非以太杏置亦可依實際需求進行 本貫施例之圖中所示者為限。 δ亥反射件12，係對靡兮永 且哕中件11設有中空部12〇， 且》亥U m之周緣係具反射部121 π設置於_1()上’_ 件 後，透過該反_丨2! _射# n 《糾接置电源 先角度俾增加出光效率。於本實施例中，該反出 之材質係為結晶性或非結晶性之塑 之塑化材料係例如為ppA等 姓日 ，、中、、、口日日性 iAPC^ABS PP. 4非、、，口日日性之塑化材料係例如 >為 c ABS、PP 或 PMMA 等 該反射部⑵係為斜面結構。U12G係為穿孔； 用以Π::、13,係形成於該反射件12之中空部120内， …Μ光源件11。於本實施例巾 膠材成型者。 又1干U係為 再明翏閱第3圖，本發明所揭之光 用者依實際需求採用多組之光源組…進行任= 以作為例如液晶面板(LCDP叫之背光模組咖灿咖口 削_)或其他顯示器之光源模組或其他照明裝置之光源 19950 10 200823543 等。 月ί閱第4 A至4D圖，其係為本發明光源組件之製 法實施例製作流程圖。如第4八圖所示，該光源組件之製 法係先衣m史有供接置電源之線路之基板1G。於本實施 例中，5亥基板ίο係、為印刷電路板(pcb)、玻纖覆銅板㈣句 或金屬基板(inetal_sub)等，且其表面上至少佈設有供接置 電源之線路’需予以說明的是’該線路係為此領域中之通 .常知識，故於圖中，未予表示。 接縯如第4B圖所示’設置由至少二發光二極體裸晶 孝、、且成之光源件11於該基板10上並電性連接該光源 件11與遠基板10之線路。於本實施例中，該發光二極體 裸明粒11G係、包括.二歐姆電極’係與該基板w之線路電 性連接，用以於該基板1G之線路接置電源後，傳輸該電 源；以及發光活性層，係與該歐姆電極電性連接，用以於 該基板1G之線路接置f源後，接收該歐姆電極所傳輸之電 「原、’亚提供光源’其中，該發光二極體裸晶粒110之二歐 姆電極係分別透過導線與該基板10之線路電性連接，且該 發光活性層係為相接之p型發光層（p_InGaN)以及N型發 ^队祕必）。需予以說明的是，該發光二極體裸隸 π =姆電極 '發総性層以及導線之電性連接方式係 為此領域中之通常知識，故於圖中，未予表示。 中所2實施例係如圖中所示’係如同前揭之光源組件1 於；·二二：光二極體裸晶粒110為例進行示意’但 u h ’該發光二極體裸晶粒11〇之數量以及設置 19950 11 200823543 位置係可依實際需求作調整 者為限。 並非以本實施例之圖中所示 :广弟4C圖所示’對應該光源件"設置反射件Η H)上’其中’該反射件12係對應該光源件n 空部no,且該中空部12G之周緣係具反射部i2i。 於本貫施财’該反射件12之㈣料結晶 之塑化材料，其中，結晶性之塑化材料係例如為ppA等， _非結晶性之塑化材料係例如為PC、ABs、pp《pmma等； 該中空部12G係為穿孔；該反射部121係為斜面結構。 需予以說明的是，該反射件12係具有較低之玻璃轉 換溫度（TG)(如PP之TG係大於12〇。〇，因此，若將本發 明之反射件12實施A PP時，於本實施例中，{堇需透過工 作溫度小於i20t：之膠合（glue adhesi〇n)方式即可將該反 射件12設置於該基板1 〇上。 接續如第4D圖所示，形成保護件13於該反射件12 •之中空部120内。於本實施财，該保護件13係透過為灌 入膠材或壓鑄膠材於該反射件12之中空部12〇，並待成型 後形成。 θ 承上述，經由第4A至4D圖之製法即可完成該光源組 件倘若需進一步將該光源組件〗製作為例如液晶面板 之背光模組等，則必需依實際需求作進一步地組裝、加工 等程序。 综上所述，本發明之光源組件及其製法主要係透過上 揭具中空部以及反射部之反射件對應光源件設置於基板 19950 12 200823543 μ ΓΓ該基板之線路接置㈣後，令該錢件經電源觸 二作供之先源透過該反射部（斜面結構）控制該光源件 提供之光源的出光角度’俾增加出光效率，換具話說， 本發明係將點光源透過反射件之作用，產生面光源，以供 作為顯示器或照明設備之光源。 此外，於本發明之光源組件之製4中，何透過該反 射件之材質特性（如ΡΡ之TG為大於12(rc)，以在工作溫 鲁度小於120 C之壤境下，即可將該反射件透過簡易之膠合 方式結合於該基板上，相較於習知技術者，並不需如習知 技術中使用表面黏著技術（SMT)之結合方式（工作溫度大 =260C) ’而相對地造成反射件必需使用玻璃轉換溫度較 高，成本亦較高之材質，故本發明係可簡化製程並降低原 物料成本。 上述實施例僅例示性說明本發明之原理及其功效，而 2用於限制本發明。任何熟習此項技藝之人士均可在不違 _月本發明之精神及範疇下，對上述實施例進行修飾與改 變。因此，本發明之權利保護範圍，應如後述之申請專利 範圍所列。 【圖式簡單說明】 第1圖係為本發明光源組件之實施例外觀立體示意 圖； 第2圖係為本發明光源組件之實施例剖面示意圖； 第3圖係為本發明光源組件之實際應用範例；以及 第4 A至4D圖係為本發明光源組件之製法實施例製作 13 19950 200823543 流程圖。 【主要元件符號說明】 1 光源組件 10 基板 11 光源件 110 發光二極體裸晶粒 12 反射件 120 中空部 ) 121 反射部 13 係:護件 14 19950Cl: 丄 In addition, in the method of fabricating the light source assembly of the present invention, the reflective member can be glued to the substrate at a low temperature by using the::,:= characteristic, and the process cost is reduced, thereby reducing the cost of the raw material. The above-mentioned other purpose can be achieved. [Embodiment] The following is a description of the embodiments of the present invention by way of specific specific examples. Those skilled in the art can easily <RTIgt; The invention may also be implemented or applied by other different methods: the details of the specification may be:::::points and applications' are carried out without departing from the spirit of the invention. 19950 8 200823543 1 and 2 are schematic perspective views and cross-sectional views of an embodiment of a light source assembly of the present invention. As shown, the light source unit 1 includes a substrate 10, a light source member 11, a reflecting member, and a protective member 13. Hereinafter, each object is uncovered on the light source unit 1 of the present invention, and the substrate 10 is provided with a circuit for connecting a power source. In the present embodiment, the substrate 10 is a printed circuit board (PCB), a glass fiber clad laminate (FR4) I or a metal substrate, and at least a circuit for connecting a power source is disposed on the surface. It should be noted that the circuit is a communication in the field, and is not shown in the figure. In addition, the preferred embodiment of the circuit of the present embodiment is based on the position of the light source member u and The size is arranged for the light source member u to be electrically connected to the line. The light source member 11 is composed of at least two LEDs 11 〇 and is disposed on the substrate 10 and electrically connected to the circuit of the substrate 10 for connecting the power of the circuit of the substrate 10 . After that, a light source is provided. In this embodiment, the LED die 110 includes a two-ohmic electrode electrically connected to the circuit of the substrate 10 for transmitting the power after the circuit of the substrate is connected to the power supply. And a light-emitting active layer electrically connected to the ohmic electrode for receiving a power source of the substrate 1G, receiving a power source transmitted by the ohmic electrode, and providing a light source, wherein the light-emitting diode is bare The two ohmic electrodes of the granule 11G are electrically connected to the line of the substrate w through the wires, and the luminescent active layer (four) is connected to each other? A light-emitting layer (WnGaN) and an N-type light emitting layer (N_InGaN). It should be noted that the ohmic electrode, the luminescent active layer and the electrical connection of the illuminating active layer of the Qianguang diode bare die 11G are not indicated for this purpose. The knowledge of the hanging, so in the figure, and this embodiment is shown in the figure; 110 as an example to illustrate, in the actual number of '^ three-emitting diode bare die 11〇 can be based on actual needs :::捋5 5 illuminate diode bare die source) increase or decrease, but should be at least the requirement of two light source to be strong or to save energy of the light-emitting diode bare die 110: two-body bare die 110. In addition, the configuration is not limited to the one shown in the figure of the present application. The δ hai reflector 12 is provided with a hollow portion 12 靡兮 for the 靡兮 哕 哕 哕 哕 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 》 》 》 》 》 》 》 U U U U U U U U U U U U Anti_丨2! _射# n "Rectify the power supply first angle 俾 to increase the light efficiency. In the present embodiment, the material of the reversed material is a crystalline or amorphous plastic plastic material, such as ppA, etc., Japanese, Japanese, and Japanese, iAPC^ABS PP. The plasticizing material of the mouth is, for example, a reflecting portion (2) such as c ABS, PP or PMMA, which has a bevel structure. The U12G is a perforation; the Π::, 13 is formed in the hollow portion 120 of the reflector 12, ... the light source member 11. In the present embodiment, the rubber material is molded. Another dry U system is shown in Fig. 3. The light user disclosed in the present invention uses a plurality of sets of light source groups according to actual needs... for any liquid crystal panel (LCDP called backlight module coffee maker) Oral cutting _) or other display light source module or other lighting device light source 19950 10 200823543 and so on. 4A to 4D are flowcharts showing the fabrication of the light source module of the present invention. As shown in Fig. 4, the method of manufacturing the light source unit is to have a substrate 1G for wiring the power supply. In this embodiment, the 5H substrate is a printed circuit board (PCB), a glass fiber clad copper plate (four) sentence or a metal substrate (inetal_sub), and at least a circuit for connecting a power supply is disposed on the surface. It is stated that 'the line is a common knowledge in this field, so it is not shown in the figure. As shown in Fig. 4B, the wiring of the light source member 11 and the remote substrate 10 is electrically connected to the substrate 10 by at least two light-emitting diodes. In this embodiment, the light-emitting diode bare-grain 11G system, including the two-ohmic electrode' is electrically connected to the circuit of the substrate w, and is used to transmit the power after the circuit of the substrate 1G is connected to the power source. And the illuminating active layer is electrically connected to the ohmic electrode, and is configured to receive the electric source “original, 'sub-providing light source” transmitted by the ohmic electrode after the line of the substrate 1G is connected to the f source, wherein the illuminating light The two ohmic electrodes of the bare body die 110 are electrically connected to the circuit of the substrate 10 through the wires, and the luminescent active layer is a p-type luminescent layer (p_InGaN) and an N-type fascinating layer. It should be noted that the light-emitting diode bare π=m electrode' hairline layer and the electrical connection mode of the wire are common knowledge in the field, so it is not shown in the figure. 2 Embodiments are shown in the figure as in the light source assembly 1 of the prior art; 2: photodiode bare die 110 is taken as an example to illustrate 'but uh' the bare die of the light-emitting diode 11 Quantity and setting 19950 11 200823543 Location can be adjusted according to actual needs It is not limited to the one shown in the figure of this embodiment: the corresponding light source member "reflecting member Η H) is shown on the 4C diagram of the broad brother 4C, and the reflecting member 12 is corresponding to the light source member n No, and the periphery of the hollow portion 12G is provided with a reflecting portion i2i. The plastic material of the (four) material crystal of the reflecting member 12 is, for example, a crystalline plasticizing material such as ppA or the like, _ The crystalline plasticizing material is, for example, PC, ABs, pp "pmma, etc.; the hollow portion 12G is a perforation; the reflecting portion 121 is a bevel structure. It should be noted that the reflecting member 12 has a lower structure. The glass transition temperature (TG) (for example, the TG system of PP is greater than 12 〇. Therefore, when the reflector 12 of the present invention is subjected to A PP , in the present embodiment, {the need to pass through the working temperature is less than i20t: the glue The reflecting member 12 can be disposed on the substrate 1 in a manner of (glue adhesi〇n). As shown in Fig. 4D, the protective member 13 is formed in the hollow portion 120 of the reflecting member 12. The protective member 13 is permeable to the hollow portion 12 of the reflecting member 12 by being filled with a glue or a die-cast adhesive. After the type is formed, θ can be completed by the method of 4A to 4D, and if the light source component is further fabricated into a backlight module such as a liquid crystal panel, it must be further assembled according to actual needs. In summary, the light source assembly of the present invention and the manufacturing method thereof are mainly disposed on the substrate through the hollow portion of the upper strip and the reflecting member corresponding to the reflecting portion, and the light source member is disposed on the substrate of the substrate 19950 12 200823543 μ ΓΓ (4) After that, the money source is supplied to the source through the reflection portion (the inclined structure) to control the light exit angle of the light source provided by the light source member to increase the light output efficiency. In other words, the present invention transmits the point light source through The role of the reflector creates a surface source for use as a light source for the display or illumination device. In addition, in the manufacturing method 4 of the light source module of the present invention, the material characteristics of the reflecting member (for example, the TG of the ΡΡ is greater than 12 (rc), in the case where the working temperature is less than 120 C, the The reflector is bonded to the substrate by simple gluing. Compared with the prior art, it is not necessary to use the surface adhesion technology (SMT) combination method (operating temperature is large = 260C). The invention is required to use a material having a high glass transition temperature and a high cost, so that the present invention can simplify the process and reduce the cost of raw materials. The above embodiments merely exemplify the principle and function of the present invention, and The present invention can be modified and changed without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as described later. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the appearance of an embodiment of a light source assembly of the present invention; FIG. 2 is a schematic cross-sectional view showing an embodiment of a light source assembly of the present invention; It is a practical application example of the light source component of the present invention; and 4A to 4D are the flow chart of the manufacturing method of the light source component of the present invention. 13 19950 200823543 Flowchart. [Main component symbol description] 1 Light source component 10 Substrate 11 Light source component 110 Light-emitting diode bare die 12 Reflector 120 hollow part 121 Reflector 13 Series: Protector 14 19950