TW200821808A - Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers - Google Patents

Abstract

A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to-air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred. from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.

Description

200821808 IX. Invention Description: [Related application] This application applies for the same inventor to file an application on April n, 2006. The US provisional patent application number is 6〇/791,242, entitled, by using the model. A multi-fluid heat exchange circuit connected to a group bus type heat exchanger ^ a method of cooling a plurality of heat sources in a computer, the priority right. The present invention is based on the U.S. Provisional Patent Application Serial No. 60/791,242, the entire disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION 1. The present invention relates generally to a method and apparatus for cooling a heat generating device, and more particularly to a method and system for cooling a heat generating device in a personal computer using a liquid cooling system. [Prior Art] In the field of electronic component cooling, it is a significant challenge to cool high-efficiency integrated circuits with high heat dissipation. Conventional cooling with heat pipes and rail cooling is not sufficient to cool wafers that have an increasing number of watts, including more than (10) watts. Electronic servers such as blade servers and frame servers are used for increasing numbers because we can achieve higher processor performance per cell. However, high-density integrated circuits also result in high heat densities, which are superior to conventional air cooling methods. The specific problem of cooling the integrated circuit in the personal computer is that more and more powerful integrated circuits are arranged in the same size or small personal chassis. When more powerful integrated circuits are developed, each has a heat-generating (four) increasing density, and the heat system generated by the individual integrated circuits continues to increase. In addition, such as _ processing 200821808 early 兀 same or small ten ten n more powerful and more abundant although the integrated circuit is added to: quantity. _==== every

Use 1 if:? The limited space in the human computer chassis, cooling the integrated circuit can be used for the traditional cooling of the hot film and the fan. (4) The system is sealed and sealed. The liquid cooling system presents an alternative method of traditional cooling solution. The circuit cooling solution is smaller than the air cooling solution. More efficient heat dissipation to the surroundings. It is necessary to cool the integrated circuit of the integrated circuit in the personal computer. It is necessary to cool the integrated circuit installed on the multi-t board of the personal computer to effectively cool the method. The present invention relates to cooling systems for transferring one or more heats such as central processing units (CPUs), chipsets, graphics processing units (6), physical processing units (PPUs), or other integrated circuits. The heat generated by the device is generated from one or more electronic component boards in the chassis of the personal computer to the surrounding cooling solution. In several embodiments, a fluid pump cooling system is used. The cooling system consists of two types of fluid circuits. First, one or more collection loops can be expanded in an array in which one or more heat generating devices can transfer heat to corresponding one or more heat exchange devices. The heat system generates the heat from the one or more heats, fine 7 200821808. The fluid is returned to the transfer cold plate via the elastic and non-pipe fittings by the collection of one or more heat exchange devices. 1 The fluid in the second fluid circuit collection loop in the cooling system is transferred to the two rows via the thermal interface, thereby removing the no-fine path. Wei # Return to the heat exchange device and continue the collection circuit (10) 彳 _

In the middle, it replaces the fluid pump to make the _catheter or conduction device: = in the circuit, the pump is difficult to pump - the pump continues to pump = and the fluid radiator - fluid to air heat exchange system ' and returns to the row. The heat transferred from the collection loop to the ship is transferred to the sink through r, the row = the fluid. The fluid is transferred from the fluid to the apparent heat-to-air heat exchange secret pump via heat. The collection loop or suppression loop can include a ET) loose wire, which is required to improve the thermal performance of the cold system. Although alternative configurations are also contemplated, the cooling module unit is most preferably placed downstream of the fluid-to-air, gas-to-heat exchange system to maximize system performance. The cooling system hub is a hot (four) row that transfers heat from the collection loop to the suppression loop. The surface flow (4) can be measured by dividing the money to break down the cold, capable-module-capable cooling system. The (four) circuit is pre- or subsequently attached to the unit, chip set and/or physical processing unit at the mouth of the central processing unit for easy installation at the hot bus level. One feature of the present invention is a cooling system that can cool one or more of the personal computers, and generate four sets. The 5H cooling system package - the personal computer chassis, is installed in the chassis of the personal computer. Or more boards, each board 200821808 includes one or more heat generating devices, a primary heat exchange system including a heat bus and a first fluid therethrough, wherein the heat bus is configured with one or More than one heat exchange device, one or more fluid cooling systems, each fluid cooling system includes at least one first heat exchange device and at least one second heat exchange device thermally coupled to the heat bus. Wherein each of the fluid cooling systems is thermally coupled to the corresponding one or more circuit boards such that each of the second heat exchange devices is thermally coupled to one of the heat generating devices on the corresponding one or more circuit boards, and wherein Each fluid cooling system includes a second fluid receiving heat transferred from each of the heat exchange devices of the corresponding one or more circuit boards via the second heat exchange device, and a thermal interface coupled to The heat bus of the fluid cooling system and the first heat exchange device to transfer heat between the first fluid and the second fluid. In another feature of the invention, it is stated that one or more of the personal computers can be cooled. The heat generation provides another cooling system that is deployed. The cooling system includes a human computer chassis, a primary hot parent replacement system, including a heat bus and a first fluid therethrough, wherein the primary heat exchange system is configured to transfer the maximum Heat capacity, a measurable plurality of circuit boards, removably mounted in the chassis of the personal computer, each circuit board containing one or more heat generating devices capable of generating heat output, wherein the main heat exchange secret heat capacity, mosquito The maximum number of boards that depend on the primary heat exchange system, and the measurable complex fluid cooling system' each fluid cooling system includes at least a first-to-heat exchange device and at least a second that can be removed to the heat bus a heat exchange device, wherein each fluid cooling system of the towel is removably coupled to the corresponding one or more circuit boards, such that each of the second heat exchange devices is removably coupled to the Corresponding to the heat production of one or more boards 9 200821808 - "There are two fluids in the lion's lion's water. For the above-mentioned cooling secret money, the cat is also added to the following. In the embodiment, each of the cold cooling (four)_ is a pumping scale. In other embodiments, each fluid cooling system comprises a heat pipe. In other embodiments, one or more fluid cooling systems are - pumping a fluid circuit, and one or more cooling circuits include a heat pipe. At least - the circuit board can be a motherboard. At least one circuit board can be removed and installed on the bottom of the personal computer. The removable circuit board can A graphics card, a physical processing card, or other accessory card containing one or more heat generating devices. The main heat exchange system is a H-closed fluid circuit. The main heat exchange system contains a - pump - The first-chest line is included in the first-envelope body loop towel. The main heat-exchange system also includes a fluid-to-air heat exchange system, and the fluid-to-air heat exchange system is included in the first-closed Fluid circuit towel. Each fluid cooling system forms a second closed fluid circuit. In some embodiments, each fluid cooling system includes a second pump, wherein the second pumping system is included in the second closed fluid circuit. In some embodiments, the second pumping system is integrated with the first heat exchange device. The first flow system is isolated from the second fluid. The heat bus is configured with a fluid passage through which the first fluid flows. In several embodiments, the fluid passageways are disposed opposite one another in a parallel path. In other embodiments, the fluid passageway is disposed in the winding path. In some embodiments, each of the second heat exchange devices is configured with a microchannel. The thermal interface layer also includes a thermal interface material for joining a first heat exchange device to the heat bus. Each of the first heat exchange devices includes a thermal interface geometry in contact with the thermal interface, and the thermal interface of each of the first heat exchange devices is independent of the thermal interface geometry of each of the other first heat exchange devices. The thermal interface geometry of each particular first heat exchange device can be configured based on the heat generated by one or more heat generating devices that are thermally coupled to the fluid cooling system corresponding to the particular first heat exchange device. The thermal interface geometry of each of the first heat exchange devices can be measured based on the heat generated by one or more heat generating devices that are thermally coupled to the fluid cooling system corresponding to the particular first heat exchange device. In some embodiments, the primary heat exchange system is configured in a fixed position within the personal computer chassis. A first heat exchanger of each fluid cooling system is secured to the heat bus, and the remainder of the fluid cooling system is configured to be resiliently placed within the personal computer chassis. Each of the first heat exchangers of each of the fluid cooling systems is secured to the corresponding heat generating device, and the remainder of the fluid cooling system is independent of the one or more circuit boards. In some embodiments, the heat sink platoon is segmented, each segment is coupled via a fluid line, and each segment is distributed throughout the personal computer. In some embodiments, the under-heat exchange system is included to remove heat output from one or more of the heat generating devices that exceed the maximum heat capacity of the primary heat exchange system. Other features and advantages of the present invention will be apparent from the Detailed Description of the embodiments. [Embodiment] This I-monthly example relates to a measurable and modular cooling system that generates heat generated by one or more heat generating devices in a personal computer. The hot house name includes, but is not limited to, one or more central processing units installed on the motherboard, the daughter card, and/or a charging card, and is used to manage the input of the central processing unit. / Output - Chipset, one or more of the heat produced by the 200821808 diagram processing unit 'and/or one or more physical processing units, or one or more heat generating devices of other integrated circuits. The cooling system can also be used to cool power electronics, and today it is oxidized semiconductor field-effect transistors (m〇sfets), switches, and other high-power electronic components that require cooling. Typically, the cooling system described herein can be applied to any electronic subsystem that includes a heat generating device to be cooled. For simplicity, being installed in the containment will be cold

The personal computer of the department - one or more heat generating devices - any subsystem, is called a personal computer card. The cooling system is configured to be measurable and modularized, so that the new personal electric needle containing the heat generating device can be added to the cooling system, and the other is already installed with a personal computer card. Changed with a new or upgraded PC card. The cold (four) system is equipped with a personal computer card by g& That is, the Hot Removal - PC Card requirement differs from the removal of another PC card from the heat and is still accommodated by the cooling system. fan. . . The one or more winds create a flow of air over the surface of the heat sink. The heat exchanger is preferably a counter flow radiator. The heat bus is acceptable for one month: multiple transfer cold plates. Each transfer cold plate is or is coated with a loading mechanism.社4^·丨,...a上μ# .丄 Main ^Hai The cooling system consists of two basic components. The _, the cooling system includes a suppression circuit comprising a fluid-to-air heat exchange system, a pump, and: a heat-flow 11-flow line including a fluid passage disposed therein. The fluid is hot to air = the system contains a heat sink, such as one or more radiators and one or more, = air flow. The composition of the suppression circuit is connected by a sealed, elastic or inelastic tube. 1 circuit with the second, the cooling system contains one or more collection circuits, each collection forced 12 200821808

a microchannel that contains one or more heat exchanges, a pump, and one or more heat exchange devices that are disposed in the fluid channel, such as a sealed seal. Cold plate (MCp). The pumping system in the ageing circuit and the collecting circuit is any conventional pump, including but not limited to electrical parameters and mechanical pumps. The components in each collection loop are connected by elastic tubular members. Alternatively, any device that transports fluid within the intimate contact can be used. In some embodiments, the inelastic tube is threaded into the collection circuit. The collection circuit is thermally coupled to the heat generating device by each of the heat exchange devices connected to the suppression circuit collecting circuit by the collecting scale transfer cold plate matched with the middle and middle circuit heat bus bars. A number of actual closures'-heat exchange systems are thermally coupled to the heat generating device. In other embodiments, there is a -to-many relationship, such as - the heat exchange device is connected to the multi-heat generating device, or the multi-heat exchange device is connected to - the heat generating device = a number of implementations, each collecting circuit system includes - the hot delivery county . In other embodiments, one or more collection loops contain more than one heat exchange device. In this example, the collection loop can be linked to one or more personal computer cards. In order to connect the heat exchange device to the heat generating device, a loading mechanism is used. Other Realities + ’ -, some or all of the money loop configuration uses a heat pipe that is connected to one or more heat generating devices and transfer cold plates. ^The double loop configuration promotes a permanent cooling circuit, the suppression circuit is installed with a computer chassis, and is installed at the bottom of the f-brain and is expanded via the use of a collection circuit, which can be cooled via the transfer The board transmits a plurality of central processing single 7L mouth map processing units, chipsets, and/or physical processing units to generate heat to the suppression loop. In some embodiments, the suppression circuit is fixed in position relative to the personal computer chassis, and each of the collection circuits is located in the elastic 13 200821808

It! is in the middle. In this way, regardless of whether the collection loop is added to the cooling system: and, along with the road or the personal computer card using the existing collection circuit, it can be easily installed in the chassis of the personal computer. Collection circuit flexibility 疋 stands can also accommodate a variety of sizes and configurations _ human computer card. The collection loop depends on the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ This module also consumes and recharges all of the +, so you can maintain or replace the defective collection or suppression loop. By means of an independent cooling circuit, the flow system can be optimized for corrosion resistance, material compatibility, age/_heterogeneity, and cold care. Also suitable for high volume manufacturing design. · The components are far more traditional than the traditional cold seals and light emitters. The closed circuit is closed, making the unit more straight.

The simple or direct operation of several components indirectly or indirectly allows the Liquid Cooling System (LCS) to be properly fitted to a computer chassis. In several embodiments, an in-line peltier or thermoelectric cooling module (TEC) is added to the collection loop or suppression loop or both. The thermoelectric cooling module includes a liquid side path installed to the cold side of the thermoelectric cooling module, and a heat dissipating fan mounted to the hot side of the thermoelectric cooling module. In some embodiments, the cooling system includes an electronic distribution plate. The electronic distribution board includes an input electronic socket, a serial output electronic socket, and a series-sensing electronic socket. The input electronic outlet accepts standard power input from a personal computer power supply. The series output electronics socket provides power and control signals to the pumps and fans used in the cooling system. In this way, the electronic connection system of the host computer 14 200821808 is supplied with power to all the sub-insertion faces of the cooling system to be corrected for the lying wire. Additional input examples include, but are not limited to, pump tachometer signals, labor moving n tachometer money, Hz temperature, device temperature (small central processing unit, crystal nozzle processing unit, and 7 or physical processing unit), ambient air Temperature, and other inputs from the cooled heat generating device. Fig. 1 is a side view showing an example of a cooling system 1 according to a first embodiment of the present invention. The cold section system 10 includes a human computer chassis housing 12 that can enclose a suppression circuit 16 and collection circuits 26, 36' 46, 56. Since the personal computer is known as a standard component such as a hard disk drive, a power supply, a board, and other conventional circuits, the figure is not shown for the sake of simplicity and is not discussed further. Each collection circuit 26, 36, 46, 56 is coupled to a heat generating device, such as physical processing unit 62, wafer set 66, graphics processing unit anvil, and central processing unit 7A. Each heat generating device is coupled to a printed circuit board (not shown) such as a motherboard, daughter board or PC expansion card. For purposes of discussion, each printed circuit board includes a single heat generating device, and each twisted circuit is coupled to a single heat generating device. It should be understood that each printed circuit board may include more than one heat generating device, and each of the collecting circuits may include more than one heat exchange device. Although Figure 1 shows the four collection loops, it should be understood that the cooling system 1〇 can also contain more than four collection loops. Typically, the largest N collection loop can be coupled to the suppression loop 16 and effectively cooled by it. The maximum number N can be determined in more detail below based on the heat dissipation capacity of the suppression circuit 16 and the amount of heat generated by the heat generating device connected to the collection circuit. The suppression circuit 16 includes a heat bus 24, a fluid to air heat exchange system, and a pump 2G. The fluid-to-air heat exchange pure 8 includes a radiator i8 and a beta wind plume 14. The pump 2G and the heat sink n 18 are coupled to the heat bus bar 24. Preferably, the pump 20 is a mechanical pump. Alternatively, the pump 2 is an electroosmotic fruit. However, the people of the scales know that #代丝的_泵. The radiator is a lighter with a microchannel and a densely placed fan. More preferably, the 'heatsink 18' is a U.S. patented towel reference number 6,988,535, which is incorporated herein by reference. Fan 14 includes one or more blowers that can create a flow of air across and/or through heat sink 18. It will be appreciated that the fluid flow in the suppression circuit 16 is the reverse of that shown in the first diagram. It should also be understood that the relative positions of the various components in the suppression loop 16 are merely illustrative. For example, pump 20 can be placed between the heat bus 24 output and the radiator 丨 8 input. The first collection circuit 26, the second collection circuit 36, the third collection circuit 46 and the fourth collection circuit 56 are each mounted and thermally coupled to the heat bus 24 of the suppression circuit ι6. The collection circuit 26 includes a heat exchange unit 32, a pump 30 and a transfer cold plate 28, each connected by a fluid line 34. The collection circuit 36 includes a heat exchange unit 42, a pump 4, and a transfer cold plate 38, each connected by one or more fluid lines 44. The collection circuit 46 includes a heat exchange unit 52, a pump 50 and a transfer cold plate 48, each connected by one or more fluid lines. The collection circuit 56 includes a heat exchange unit 62, a pump 60 and a transfer cold plate, each connected by one or more fluid lines 64. For purposes of discussion, only the configuration and operation of the collection loop 26 will be described hereinafter. Each of the other collection circuits 36, 牝, % is configured and operated similarly to the collection circuit 26. However, it should be understood that each collection loop can be independently configured, such as a different number of heat exchange devices, and that the general functionality of the cooling heat generating device is maintained substantially the same as 200821808. The collection circuit 26 is a fluid drawdown cooling circuit. The collection circuit % system contains a heat exchange unit 32 for each of the heat generating devices 64 on the corresponding personal computer card. Further preferably, the pump 30 is a mechanical pump. Alternatively, the pump 3 is a special pump. However, the skilled artisan understands that any type of pump can be envisioned instead. Preferably, the heat exchange device 32 is of the type of fluid microchannel heat exchanger described in U.S. Patent Application Serial No. 7,000,684, which is incorporated herein by reference. However, the skilled artisan understands that any type of fluid heat exchanger can be envisioned instead. Preferably, the transfer cold plate 28 is configured to maximize the microchannels that are exposed to the surface area of the fluid passing therethrough. As shown in Figure 1, the transfer cold plate 28 is directly coupled to the pump 3〇. In this configuration, one or more fluid lines 34 are fed to the transfer cold plate 28, which is cooled within the transfer cold plate 28, which is transferred from the transfer cold plate 28 to the pump 30, and the flow system From pump 30 is output to one or more fluid lines 34. Alternatively, the flow system is input to the pump 3〇 and is output from the transfer cold plate. This configuration is illustrated on March 30, 2007. The application is incorporated herein by reference in its entirety. In other embodiments, the transfer cold plate 28 and the pump 30 are not directly connected, but instead are connected by one or more fluid lines. In still other embodiments, the pump 3 is directly coupled to the heat exchange device. 32. Typically, there is a complete design flexibility that can be configured for a specific application. " The lower surface of the transfer cold plate 28 is thermally coupled to the upper surface of the heat busbar 24 via a thermal interface material (not shown). The interface material, preferably a compliant material, ";thermal grease, hot gasket, solder, or any _ heat conduction gap filler negative. Loading mechanism (not shown) is the wire to transfer the cold plate Μ to the heat Busbar 24. Any conventional mounting structure can be used, including but not limited to two or more pliers '- or more screws, one or more elastic clips, coffee machine's loading block, or Any other traditional retention agency, One or more combinations thereof. In this way, the transfer cold plate 28 is connected to the heat bus bar %. The heat bus bar 24 is preferably configured to be finally exposed to the fluid in one of the surface areas of the fluid of Tongna. Channels. Although Figure 1 shows the collection circuit 26 as comprising a single heat exchange device 32, it is contemplated that many alternative configurations indicate that the collection circuit contains one or more heat exchange devices. For example, two or more heat exchange devices may be In a series configuration, in this case, the fluid first flows into the first heat exchange device (10) and the fluid of the first heat exchange device is then input to the second heat exchange device. Alternatively, two or more helium exchange devices may be It is configured to be touched so that any fluid that arrives in the county is not passed in advance and is heated by another hot money device. In this way, the more it arrives in any parallel configuration of the heat exchange device, the more the frequency passes through the series rail switching device. It is cold. The alternative configuration H3G connects the pump 3() to the second heat exchange device by means of one or more fluid lines connected to the first heat exchange device' and the independent suture, (4). Another - alternative configuration towel, recording exchange The devices are arranged in series and in parallel in any combination. The transfer cold plate 28, the pump 30, the heat exchange device 32 and the fluid line 34 form a first closed circuit through which the fluid flows. The function of the collection circuit 26 captures the heat generated by the heat generating device 64. The heat exchange device 32 is thermally coupled to the heat exchange device 200821808. When the fluid flows through the first closed circuit to the heat exchange device 32, the heat system from the hot parent and the break 32 is transferred to the fluid.下表 32 32 下表 下表 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32 32

u, a not) is used to fix the heat exchange device 32 to the heat generating device, and any conventional loading mechanism can be used, including but not limited to one or more tongs, one or more lions, one Or a combination of shirts. The construction, loading of the barrier, or any other conventional retention mechanism, or a collection of circuits 26'' 46, 56, and the type of fluid used in the suppression circuit 16 are based on good quality. Alternatively, the fluid may be based on a combination of organic solutions including, but not limited to, propylene glycol, ethanol, and heterogeneous. It can still replace 1n as a pump coolant. The fluid used is also preferably H-degree and has anti-corrosion properties. - In the embodiment, depending on the cooling system and the heat production operation, the single-phase (10) is presented when the cooling circuit of the body cooling machine is circulated. In addition, in the actual _, the reader heats up to exhibit a two-phase ""' the towel's shaft is subjected to a phase shift from moisture to liquid or liquid/water vapor mixing. The heated flow system transfers the fluid passages in the cold plate 28 from the heat exchange unit 32. The heated system transfers the heated fluid from the fluid to the material that transfers the cold plate 28. The age-aged figure is said to provide an effective transfer between the transfer cold plate and the heat bus 24 so that heat can be transferred from the transfer cold plate to the heat bus 24 . 19 200821808 The heat sink and transfer cold plate physical dimensions of each collection circuit are designed, large, and both. When the clock rides on the chassis of the personal computer, the surface is solid and fixed, and the __ will be matched with the transfer cold plate to match the fixed surface width and fixed length of the upper surface. The multi-transfer cold plate system can be used to heat the Sw row length. The width of each transfer cold plate is substantially similar to the width of the heat bus bar, and the substantial phase transfers the cold plate from the transfer cold plate i. However, the length of each transfer cold plate from which the cold plate is transferred to the transfer cold plate may be different. One or more heat generating devices may be connected to each stage of the transfer plate according to the heat dissipation requirement of the collecting circuit. In particular, the more heat generated by one or more heat generating devices, the more heat is transferred to the (four) circuit. Thus, the more heat that is transferred to the collection loop, the more heat is transferred from the transfer cold plate to the surface flow. These are configured to eliminate the equivalent of a recording/collection loop that is configured with a larger length of transfer cold, thereby providing a larger thermal interface geometry between the transfer cold plate and the heat bus. These collection loops, which are configured to dissipate relatively small amounts of heat, are configured for smaller lengths = transfer cold plates. The age of each transfer cold plate determines the amount of heat that is normally measured as heat dissipation and transferred to the heat bus. The total heat dissipation rate of all transferred cold plates connected to the heat busbar shall not exceed the maximum heat dissipation rate of the heat busbars. In several embodiments, the maximum heat dissipation rate of the heat bus is a fixed characteristic of the cooling system. In other embodiments, the suppression loop can measure the increase in the maximum heat dissipation rate, such as by adding one or more radiators and/or fans to increase the heat dissipation capacity of the fluid to the air heat exchange system. In still another embodiment, one or more of the acclaimed conventional cooling systems included in the chassis of the personal computer, such as a standard air cooling system, are used to cool some or all of the heat of the heat sink 24 beyond the maximum heat dissipation rate of the heat sink 24 load. The acclaimed cooling system can also be used to cool one or more heat generating devices that are not coupled to the cooling system. "

Referring to Figure 1, the heat busbar 24, the heat sink 18, the pump 20 and the fluid line 22 form a second closed loop through which the fluid flows. The second closed loop is of the same fluid type as the first closed loop of the 4 series L 3 . The flow system in the second closed loop is independent of the fluid of the first closed loop. The second closed loop and the function of the liquid to air heat exchange system 8 transfer heat from the heat bus 24 to the surroundings. When the fluid flows through the fluid passages within the heat sink bus %, the age is from the heat sink. The heated flow system within the long heat busbar flows to the heat sink 18. When the heated body flows through the heat sink 18, the heat is transferred from the fluid to the material of the heat sink 18. Fan 14 can blow air over the surface of heat sink 18 so that heat can be transferred from the heat sink 18 to the surroundings. Preferably, the personal computer chassis 12 includes an inhalation σ and an exhaust port through which the empty milk can enter and exit the cooling system. The cooled flow system exiting the heat sink 18 flows back to the heat bus 24 . Figure 2 illustrates the removal of the heat busbar 24 in accordance with a parallel path. In the upper and lower parallel gated configuration, the fluid channel in the heat busbar extends from the entry point to the exit in the heat busbar 24. Parallel path configuration of points. The third figure shows the side view of the heat busbar 24 of the line Α_Α along the second figure. Although the fifth and third (four) five-passage channels, the hot H flow row can be configured with more than five or less fluid passages. As shown in Fig. 2, the single fluid line 22 is divided into the home line before entering the face 24, and the plurality of fluid lines that are turned away from the heat bus 24 are rejoined to form a single fluid line 22. In this configuration, the heat 21 200821808 = 4, the multi-input and output fluid lines are connected to the multi-fluid k-input. In the deuterated configuration, the single fluid line 22 is ugly. The single fluid line is divided into multiple channels in the heat bus 24 or a single fluid channel. It can also be flowable or the knife is any other configuration of the multi-fluid channel in the hot sink, "IL row 24. f : Figure 4 Figure 5 shows the heat bus arrangement according to a winding path. The fluid passages in the 'hot acid row 24' in the winding path configuration are wound from the population point to the - exit point in the heat bus bar 24, and the winding path is configured; _ 3rd _ shows - single population point and _ exit point, but it is also conceivable that multiple π and exit points. Again, the fluid channel can achieve a similar effect in any non-parallel configuration. Ming Wei, regardless of the relative position of each transfer cold joint to the heat sink row, the winding lay-up configuration is distributed (4) to the thermal gradient across all transferred cold plates that are joined to the heat bus. This provides the advantage of negating the order in which the cold plates are placed on the heat bus. It should be understood that it is also possible to replace the fluid path path configuration. Fig. 5 is a side view showing an example of a cooling system according to a second embodiment of the present invention. In addition to the heat busbar 24 of the cooling system 10 being replaced by a heat busbar 124, where each heat busbar 124 segment is joined by one or more fluid lines 122, and the collection circuit 56 is replaced by a collection circuit 156, the cooling system 10 is The same as the cooling system 10 of Fig. 1. The collection circuit 156 includes a transfer cold plate 158, a pump 160, and a heat exchange device 162 coupled by one or more fluid lines 164. The transfer cold plate 158 is thermally coupled to the heat bus segment 124 and the heat exchange device 162 is coupled to the heat generating device 170, such as the central portion of the personal computer 22 200821808. Collection loop 156 is configured and operates similar to collection loop 56 (Fig. j). The dispensing configuration of the cooling system 10 emphasizes an alternative method of joining the cooling system to a heat generating device that is distributed within the personal computer chassis 12, such as the location of the system motherboard to the location of the personal shame expansion card. The cooling system 1 of the second figure provides design flexibility by adapting various collection loop adaptive configurations to match the locations of the various heat generating devices. In contrast, the cooling system 1 of Fig. 6 is configured by a heat bus arrangement in which the heat busch segments are placed close to various heat distribution devices to provide design flexibility. The skilled artisan understands that the present cooling system is not limited to the components shown in Figures 1-6, but instead includes other components and devices. For example, although not shown in Figure 1, the cooling system 10 can also include a fluid reservoir that is coupled to one or more collection circuits, or a suppression circuit or both. The fluid reservoir is indicative of fluid loss due to infiltration over time. Alternatively, although the above embodiments of Figures 1 through 6 relate to liquid cooling systems, alternative cooling systems such as heat pipes and conducting devices may be used. The heat pipe is particularly effective when using the heat sink embodiment of the sixth picture segment. In this example, the heat busch segments are placed relatively close to the heat generating device, and the heat pipe is coupled to the heat generating device and the heat bus bar segment. It is also conceivable that the single cooling system can be configured with one or more pump collection circuits and one or more heat pipe collection circuits. In several embodiments, the cooling system is configured to cool the various heat generating devices contained within the chassis of the personal computer. In other implementations, the cooling system is configured to cool only the heat generating device, or only a single heat generating device, while the other heat generating devices are cooled by other or others. 23 200821808 In several embodiments, the modularity of the cooling system allows the collection circuit to be contained within one of the enclosures of the personal computer, via which the heat sink is dissipated from the collection circuit to a suppression loop outside the enclosure or inside the enclosure . The present invention has been described in terms of specific embodiments that incorporate the details of the principles of construction and operation of the invention. As such, the specific embodiment and its details are not expected. It will be apparent to those skilled in the art that the scope of the invention may be applied to the embodiments selected for illustration.

24 200821808 [Simplified description of the drawings] Fig. 1 is a side view showing an example of a cooling system according to a first embodiment of the present invention. The 2nd IU brothers cut off the heat bus according to the parallel path configuration, up-down. Fig. 3 is a side view showing the heat busbar cut-off side shown in Fig. 2. Figure 4 illustrates the heat bus removal, up-down diagram, configured in accordance with a winding path. Figure 5 is a side view showing an example of a cooling system in accordance with a second embodiment of the present invention. The invention is described with respect to the several figures. Where appropriate and only one or more of the figures are disclosed, the same reference numerals will be used to refer to the same elements. [Main component symbol description]

81〇, 1〇〇 22 24 34, 44, 54, 64 fluid to air heat exchange system cooling system single fluid line heat bus 122, 164 fluid line 25

Claims (1)

200821808 X. Patent application scope: 1. A cooling system 'for cooling one or more heat generating devices in a personal computer, the cooling system comprising: a·-a personal computer chassis; b· mounted in the chassis of the personal computer One or more circuit boards, each circuit board comprising one or more heat generating devices; c. a primary heat exchange system comprising a heat bus and a first fluid passing through the heat bus, wherein the heat bus arrangement Thermally bonding with one or more first heat exchange devices; d. one or more fluid cooling systems, each fluid cooling system comprising at least one first heat exchange device thermally coupled to the heat bus and at least one a heat exchange device, wherein each fluid cooling system is thermally coupled to one or more circuit boards such that each second heat exchange device is thermally coupled to one of the heat generating devices on the corresponding one or more circuit boards In addition, each of the fluid cooling systems includes a second fluid that is transferred from the respective heat exchange devices corresponding to the one or more circuit boards via the second heat exchange device. And e.-hot" face, coupled to the heat bus of each fluid cooling system and the first heat exchange device to transfer heat between the first fluid and the second fluid. The cooling secret of the third item, the fluid cooling system of the towel is used to make the fruit circulation circuit. 3. The cooling system of claim 1 wherein each fluid cooling system comprises a heat pipe. Cooling secrets of the scope of the third item, one or more of which are 2008/2008. The fluid cooling system comprises a pumping fluid circuit, and the fluid cooling system comprises a heat pipe. 5. Cooling as claimed in the patent application The system wherein the road board comprises a motherboard. 6. A cooling system according to the patent application scope, wherein the board is removably mounted in the chassis of the personal computer. 7. The cooling system of claim 6, wherein the removable circuit board comprises a - card, a physical processing card, or other accessory card containing more heat generating means. S / 8. The cooling system of claim i, wherein the primary heat exchange system forms a first closed fluid circuit. 9. The cooling system of claim 8, wherein the primary exchange system further comprises a pump, wherein the first pump system is included in the first closed fluid circuit. 9 items of cooling secrets, wherein the main heat exchange system further comprises a fluid-to-gas heat exchange line, and the fluid-to-air heat-replacement system is included in the first closed fluid circuit. η·If applying for a special secret 1 side cooling secret, the fluid cooling system of the towel forms a second closed fluid circuit. 12. The cooling system of claim i, wherein each fluid cooling system further comprises a second pump, wherein the second The pumping system is included in the second closed fluid circuit. 13. The cooling system of claim 12, wherein the second pumping system is integrated with the younger heat exchange device. 27 200821808 14. The cooling system of the present invention, wherein the first flow system is physically isolated from the second fluid. The cooling system of claim 1, wherein the heat bus is configured to flow the first fluid. The cooling system of claim 15, wherein the fluid passages are disposed opposite each other in a parallel path. Π. The cooling system of claim 15 of the patent, wherein The fluid passage is disposed in a winding path. 18. The cooling system of claim 1, wherein each of the second heat exchange devices is configured with a microchannel. I9. The cooling system of claim 8 The thermal interface layer of the towel further comprises a thermal interface material connected to each of the first heat exchange devices to the miscellaneous. ▲ 20. The cooling system of claim 1, wherein each of the first heat exchange devices comprises The thermal interface geometry in contact with the thermal interface, the age of each first heat exchange device is independent of the thermal interface geometry of each of the other first heat exchange devices. 21. A cooling system as claimed in claim 2 Configuring the heat of each particular first heat exchange device based on heat generated by one or more heat generating devices that are thermally coupled to the fluid cooling system of the particular first heat exchange device 22. The cooling system of claim 1, wherein each of the specific first hot-family changing devices comprises a thermal interface geometry in contact with the thermal interface, which can be coupled to the corresponding first heat exchange according to the heat The heat generated by the one or more heat generating devices of the fluid cooling system 28 200821808 is used to measure the thermal interface geometry of each of the second heat exchange devices. The cooling system of claim 1 of the patent scope, Wherein the primary heat exchange system is disposed in the personal wire (10) - the position of the target. ' 24. The cooling system of claim 23, wherein the first heat exchange of each fluid cooling system is ambiguous to The fluid cooling system is configured to be misplaced in the chassis of the personal computer. A cooling system of claim 1, wherein each of the first heat exchangers of each fluid cooling system is fixed to the corresponding heat generating device, and the remaining portion of the fluid system is associated with the one or more Board independent. 26. The cooling system of claim S1, wherein the heat bus is divided, the segments are connected via a fluid line, and each segment is distributed throughout the personal computer chassis. 27. A cooling system for cooling one or more heat generating devices in a personal computer, the cooling system comprising: a. - a personal computer chassis; b. a primary heat exchange system including a heat bus and passing the heat a first fluid of the bus bar, wherein the heat bus bar is used to transfer the maximum heat capacity; c. a plurality of measurable circuit boards are removably mounted in the chassis of the personal computer. One or more heat generating devices of the heat output 'determining the maximum number of boards connected to the main heat exchange system based on the maximum heat capacity of the primary heat exchange system; and d• a plurality of measurable fluid cooling systems, each The fluid cooling system includes at least one first heat exchange device and at least one second heat exchange device removably coupled to the heat bus bar 29 200821808, wherein each fluid cooling system is removably coupled to a corresponding one or more a plurality of circuit boards, wherein each of the second heat exchange devices is removably coupled to one of the heat generating devices on the one or more circuit boards, and Each of the fluid cooling systems includes a second stream 28 therethrough, such as the cooling system of claim 27, wherein each of the heat generating devices on the removable circuit board is thermally coupled to the second heat exchange device The cooling system of claim 28, wherein the heat bus is thermally coupled to each of the first heat exchange devices. 30. The cooling system of claim 29, wherein each fluid cooling system comprises the second fluid to receive transfer from each of the heat generating devices of the corresponding one or more circuit boards via the second heat exchange device hot. 31. The cooling system of claim 30, further comprising a thermal interface coupled to the heat bus and the first heat exchange device to transfer heat between the first fluid and the second fluid. 32. The cooling system of claim 27, wherein each fluid cooling system comprises a pumping fluid circuit. 33. The cooling system of claim 27, wherein each fluid cooling system comprises a heat pipe. 34. The cooling system of claim 27, wherein one or more of the fluid cooling systems comprise a pumping fluid circuit and one or more of the fluid cooling systems comprise a heat pipe. The cooling system of claim 27, wherein at least one of the circuit boards comprises a motherboard. 36. The cooling system of claim 27, further comprising a fixed circuit board mounted in the chassis of the personal computer and thermally coupled to one of the fluid cooling systems. ^ 37 'A cooling system as claimed in claim 27, wherein one or more of the removable circuit board comprises a edge card, a physical processing card, or other accessory card containing one or more heat generating devices . 38. The cooling system of claim 27, wherein the primary heat master switching system forms a first closed fluid circuit. 39. The cooling system of claim 38, wherein the primary thermal switching system further comprises a first pump, wherein the first pumping system is included in the first closed fluid circuit. 40. The cooling system of claim 39, wherein the primary heat master switching system further comprises a fluid to air heat exchange system, wherein the fluid to air heat exchange system is included in the first closed fluid circuit. 41. The cooling system of claim 27, wherein each fluid cooling system forms a second closed fluid circuit. 42. The cooling system of claim 41, wherein each fluid cooling system further comprises a second pump, wherein the second pumping system is contained in the second closed fluid circuit. 43. A cooling system as claimed in the patent application, wherein the second pump is integrated with the first heat exchange device. 44. The cooling system of claim 27, wherein the first stream 31 200821808 is physically isolated from the second fluid. Itr 45. For example, she applies the cooling system of item 27, and the heat sink lining configures the fluid passage through which the first fluid flows. 46. The cooling system of claim 45, wherein the fluid passages are disposed opposite each other in a parallel-path pinch. 47. If the system is dedicated to the cold (four) system of the item & item, the fluid channel is disposed in a winding path. 48. The cooling system of claim 27, wherein each of the second heat exchange devices is configured with a microchannel. 49. The cooling system of claim 27, wherein the thermal interface layer comprises an interface-to-thermal interface geometry, the thermal interface of each of the first heat exchange devices (four) and each of the other first heat exchange devices The thermal interface geometry has nothing to do with it. 50. The cooling system of claim 2, wherein the specific first is configured based on heat generated by one or more heat generating devices thermally coupled to the fluid cooling secret of the particular first heat exchange device. The thermal interface geometry of the heat exchange device. 51. The cooling system of claim 27, wherein each of the specific first hot-parent replacement devices comprises a thermal interface geometry in contact with the thermal interface, the thermal connection to the corresponding first heat exchange device The heat generated by one or more heat generating devices of the fluid cooling system measures the thermal interface geometry of each of the first heat exchange devices. 52. The cooling system of claim 27, wherein the primary hot parent changing system is disposed in a fixed position within the chassis of the personal computer. 32. The cooling system of claim 52, wherein the first heat exchanger of each fluid cooling system is fixed to the heat bus, and the remaining portion of the fluid cooling system is configured to be resiliently placed on the person Inside the computer chassis. 5. The cooling system of claim 27, wherein the heat bus is divided, the segments are joined via a fluid line, and each segment is distributed throughout the personal computer chassis. (55. The cooling system of claim 27, further comprising a primary heat exchange system configured to remove heat output from the one or more heat generating devices that exceed a maximum heat capacity of the primary heat exchange system.