200820001 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種總線系統，特別係關於一種用於電 子設備之總線系統。 【先前技術】 電腦等電子設備之各個部件係藉由一條公共資訊通路 連接起來，這條公共資訊通路稱為總線，訊號可藉由該總線 在複數部件之間傳輸。目前之總線通常由銅或其他導電金屬 材質製成。 如圖1所示，一種習知總線系統20，其由複數印刷銅線 21組成，可應用於電腦主板22上各芯片之互連。該電腦主 板22上直接集成有一芯片23及一插槽以，兩者藉由複數印 刷銅線21相互連接，另一芯片乃插接於該插槽以中，從 而實現芯片23與芯片25之間之訊號傳輸。為防止印刷銅線 21相互貼合造成短路及相互之間之電磁干擾，通常設置有複 數絕緣層26使該複數印刷銅線21相互隔離並定位。 然’隨著電子產業之迅速發展，各種芯片之帶寬、速率 均大幅度增加，連接這些以之總線之帶寬及傳輸速率也必 、、要j 提ff* i_以銅等導電金屬材質製成之總線顯然難以 滿足这些要求，只能藉由增加總線數量來滿足帶寬與傳輸速 率之要求，㈣必將使得電路之料更加複雜，且使整個 =主板之小魏變得_。另，習知總線雖蚊位於絕緣 :中’但減難以消除總線間之電磁干擾，訊號傳輸品質較 、’而且由於習知總、㈣統採關等導電金屬材質製成，而 6 200820001 廷些材質均存在一定阻抗，電訊號藉由其傳輸時必然會產生 熱量從而影響相應元器件之工作穩定性，並造成一定之能量 損耗。 【發明内容】 有鐾於此^供一種具有南傳輸速率、高傳輸品質以 及能量損耗較少之總線系統實為必要。 、 、、一種總線系統，其為電子設備内各芯片之間之資訊通 ,j，其包括複數光纖和複數光發射器、複數光接收器，每一 心片連接至少一光纖，每一光纖與芯片之接口處設置有一光 發射器及一光接收器。 、+相幸乂於驾知技術，該總線系統以光作為資訊之物理載體 並藉由光纖傳輸，而光纖之數據傳輸速率要遠高於銅線之數 據傳輸速率，因此用光纖取代f知電子設備内連接各個芯片 之印刷銅線’可大幅度提高該電子設備之數據處理性能。 另’光訊號在光纖中傳輸，不存在電磁干擾現象，從而使訊 就具有較高之傳輸品f，而且’光訊號在光纖内傳輸時，因 ^阻產生之能量損失要遠小於電訊號在印刷銅線上傳輸因 =在=阻而發熱造成之能量損失，故採用該總線系統還可減 乂電腦内部之能量損失，同時不會產生影響元 性之熱量。 德疋 【實施方式】 明之總線系統作 下面將結合附圖和複數實施例對本發 進一步之詳細說明。 一種總線系 請參閱圖2及圖3，本發明具體實施例提供 7 200820001 統50/’其可用於電子設備内各芯片間之訊號傳輸。下面以該 總線系統50於電腦内之應用為例說明該總線系統與各芯^ 之連接方式。該總線系統5G包括複數光纖51、複數光=射 器52及複數光接收器53。電腦主板6〇集成有—語音片 61、存儲芯片62及一插板64。該語音芯片61、存儲芯片 插板64藉由複數光纖51相互相接，每一光纖51與語 音忍片61及存儲芯片62之接口處分別設置有一光發射器幻 及一光接收器53。該插板64與光纖51之接口處為一系&插 孔641，每一插孔641中容置有—光發射器52及一光接收器 53，將顯示芯片63之插腳631插接于該插孔641中，並: 光發射器52及光接收器53才目連，可將該顯示芯片63與插 ^ 64相連°由此實現該顯示芯片63與語音芯片61及存儲 芯片62之互連。該光發射器52及光接收器53均包括兩引 腳（圖未示），其中一引腳與芯片相連接，另一引腳與電腦 主板6〇之接地層或電源層相連。該總線系統5G還包括-光 路^換7〇件54,本實施例中為—分光棱鏡，其可使顯示忍片200820001 IX. Description of the Invention: [Technical Field] The present invention relates to a bus system, and more particularly to a bus system for an electronic device. [Prior Art] The components of an electronic device such as a computer are connected by a common information path called a bus through which signals can be transmitted between a plurality of components. Current buses are typically made of copper or other conductive metal. As shown in FIG. 1, a conventional bus system 20, which is composed of a plurality of printed copper wires 21, can be applied to the interconnection of chips on the computer motherboard 22. A chip 23 and a slot are directly integrated on the computer motherboard 22, and the two are connected to each other by a plurality of printed copper wires 21, and the other chip is inserted into the slot, thereby realizing the chip 23 and the chip 25. Signal transmission. In order to prevent the printed copper wires 21 from sticking to each other to cause short-circuit and electromagnetic interference with each other, a plurality of insulating layers 26 are usually provided to isolate and position the plurality of printed copper wires 21 from each other. However, with the rapid development of the electronics industry, the bandwidth and speed of various chips have increased substantially. The bandwidth and transmission rate of these buses will also be required to be ff* i_ made of conductive metal such as copper. The bus is obviously difficult to meet these requirements, and only by increasing the number of buses to meet the bandwidth and transmission rate requirements, (4) will make the circuit material more complicated, and make the whole = motherboard small Wei become _. In addition, the known bus is located in the insulation: in the 'but it is difficult to eliminate the electromagnetic interference between the bus, the signal transmission quality is better, 'and because of the general knowledge, (four) unified mining and other conductive metal materials, and 6 200820001 There is a certain impedance in the material, and the electrical signal will inevitably generate heat when it is transmitted, which affects the working stability of the corresponding components and causes a certain energy loss. SUMMARY OF THE INVENTION It is necessary to provide a bus system having a south transmission rate, a high transmission quality, and a small energy loss. And a bus system, which is an information communication between chips in the electronic device, j, comprising a plurality of optical fibers and a plurality of optical transmitters, a plurality of optical receivers, each of which is connected to at least one optical fiber, each optical fiber and chip A light emitter and a light receiver are disposed at the interface. +, fortunately, knowing the technology, the bus system uses light as the physical carrier of information and transmits by optical fiber, and the data transmission rate of the optical fiber is much higher than the data transmission rate of the copper wire, so the optical fiber is replaced by the optical fiber. The printed copper wire connecting the individual chips in the device can greatly improve the data processing performance of the electronic device. In addition, the optical signal is transmitted in the optical fiber, and there is no electromagnetic interference phenomenon, so that the signal has a higher transmission product f, and when the optical signal is transmitted in the optical fiber, the energy loss due to the resistance is much smaller than that of the electrical signal. The transmission of the copper wire is caused by the energy loss caused by the heat generated in the = resistance, so the use of the bus system can also reduce the energy loss inside the computer, and at the same time does not affect the heat of the elemental. The present invention will be further described in detail below with reference to the accompanying drawings and the embodiments. A bus system Referring to FIG. 2 and FIG. 3, a specific embodiment of the present invention provides 7 200820001 system 50/' which can be used for signal transmission between chips in an electronic device. The following is an example of the application of the bus system 50 in a computer to illustrate the connection between the bus system and each core. The bus system 5G includes a plurality of optical fibers 51, a plurality of optical signals = an emitter 52, and a plurality of optical receivers 53. The computer motherboard 6 is integrated with a voice sheet 61, a memory chip 62, and a card 64. The voice chip 61 and the memory chip card 64 are connected to each other by a plurality of optical fibers 51. A light emitter and a light receiver 53 are respectively disposed at the interface between each of the optical fibers 51 and the voice chip 61 and the memory chip 62. The interface between the board 64 and the optical fiber 51 is a system & jack 641. Each jack 641 is provided with a light emitter 52 and a light receiver 53, and the pin 631 of the display chip 63 is inserted into the jack 631. In the jack 641, the optical transmitter 52 and the optical receiver 53 are connected to each other, and the display chip 63 can be connected to the plug 64. Thus, the display chip 63 and the voice chip 61 and the memory chip 62 are mutually connected. even. The light emitter 52 and the light receiver 53 each include two pins (not shown), one of which is connected to the chip and the other of which is connected to the ground plane or power plane of the computer motherboard 6. The bus system 5G further includes an optical path switching element 54, which in this embodiment is a dichroic prism, which can display the display film
Hi出之光訊號經該光路轉換元件54後分解為兩個相同之 光汛唬再分別輸入語音芯片61及存儲芯片62。 可以理解，總線系統5〇可連接之芯片並不限於語音芯 片61存儲芯片62、顯示芯片63，其還可為其他使電腦實 現不同功能之芯片，如錄音芯片等。 光纖51用於傳輸光訊號’其可為單模光纖或多模光纖。 光發射器52用於接收從各芯片輸出之電訊號，並將其 轉換為相應之光訊號’再藉由光纖51進行傳輸。該光發射 8 200820001 器 52 可為 LED (Light Emitting Diode，發光二極體）、OLED (Organic Light Emitting Diode，有機發光二極體）或 LD(Laser Diode ’錯射二極體）。電訊號轉換為光訊號之機制為：當南 電平訊號輸入時，光發射器52被點亮；當低電平訊號輸入 時，光發射器52將不發光，藉由光發射器52之亮滅，可產 生與電訊號相對應之光訊號。 光接收器53用於接收從光纖51傳入之光訊號，並將其 轉換為相應之電訊號，再輸入各芯片。該光接收器53可為 光電二極體或光電電晶體。光訊號轉換為電訊號之機制為： 藉由光接收器53之感光作用，將有光狀態轉換為高電平， 無光狀態轉換為低電平。 下面以語音芯片61與顯示芯片63間之資訊傳輸為例說 明該總線系統50之傳輸機制為：當顯示芯片63輸出電訊號 時，該電訊號會經過顯示芯片63與光纖51接口處之光發射 器52轉換為光訊號，接著經光纖51傳輸至語音芯片61與 光纖51之接口處，並被該接口處之光接收器53還原為電訊 號，再輸入該語音芯片61中。 由於光纖51之數據傳輸速率遠高於銅線之數據傳輸速 率，因此採用該光纖系統50對電腦内之各芯片進行連接， 可大幅度提高電腦之數據處理性能。此外，當光訊號在光纖 51上傳輸時，相鄰光纖51之間不會產生電磁干擾，故傳輸 訊號之品質較佳，且光訊號在光纖51上傳輸時，因光阻產 生之能量損失要遠小於電訊號在印刷銅線上傳輸因存在電 阻而發熱造成之能量損失，故採用該總線系統50還可減少 9 200820001 電腦内部之能量損耗。 另，由於該總線系統50採用光纖51作為訊號傳輸載 Μ，而光纖51相互之間無電磁干擾，且光纖51相互接觸時 也不會發生短路現象，故該總線系統5〇在電腦主板6〇上可 緊密排列’從而使電腦主板60小型化。並且，光纖51之主 要材質為塑膠及玻璃’要輕于同等長度之銅線，故採用該總 線系統50也可使電腦主板60之重量大幅度減小。 故本發明無需對習知電腦主板之電路設計作巨大改 變，只需用光纖51替代其中之銅線，也無需改變芯片之内 部結構，只需在芯片與光纖51之接口處設置有多對光發射 益52及光接收器53即可使習知電腦性能得到較大之改善。 可以理解，該總線系統不但可用於電腦内各芯片之間之 互連，也可應用於手機等其他電子設備内部各芯片之間之互 連，藉由用光纖替代習知技術中連接各芯片之印刷銅線，並 ，每-光纖與^接口處成對設置—光發射器及—光接收 态，可大幅度提高該電子設備之數據處理能力。 綜上所述’本發明符合發料利要件，爰依法提出專利 申=。惟’以上所述者僅為本發明之較佳實施方式，本發明 之範圍並不以上述實施例為限，舉凡熟習本案技藝之人士浐 依本發明之精神所狀等效㈣或變化，皆應= 請專利範圍第内。 【圖式簡單說明】 圖1係習知總線系統對電腦各芯片之連接示音圖。 圖2係本發明總線系統具體實施方式對電腦各 200820001 芯片之連接示意圖。 圖3係圖2所示相配合之顯示芯片與插板之分解示意 ®j。 【主要元件符號說明】 (本發明） 總線糸統 50 光發射器 52 光路轉換元件 54 語音芯片 61 顯示芯片 63 插腳 631 (習知） 總線糸統 20 電腦主板 22 插槽 24 光纖 51 光接收器 53 電腦主板 60 存儲芯片 62 插板 64 插孔 641 印刷銅線 21 芯片 23、25 絕緣層 26 11The optical signal from Hi is decomposed into two identical apertures via the optical path conversion element 54 and input to the speech chip 61 and the memory chip 62, respectively. It can be understood that the bus system 5 is not limited to the voice chip 61, the memory chip 62, and the display chip 63. It can also be other chips that enable the computer to perform different functions, such as a recording chip. The optical fiber 51 is used to transmit optical signals' which may be single mode fibers or multimode fibers. The optical transmitter 52 is configured to receive the electrical signals output from the respective chips and convert them into corresponding optical signals, which are then transmitted by the optical fibers 51. The light emission 8 200820001 device 52 can be an LED (Light Emitting Diode), an OLED (Organic Light Emitting Diode), or an LD (Laser Diode). The mechanism for converting the electrical signal into an optical signal is: when the south level signal is input, the light emitter 52 is illuminated; when the low level signal is input, the light emitter 52 will not emit light, and the light emitter 52 is bright. Off, the optical signal corresponding to the electrical signal can be generated. The optical receiver 53 is configured to receive the optical signal incoming from the optical fiber 51 and convert it into a corresponding electrical signal, and then input the chips. The photoreceiver 53 can be a photodiode or a phototransistor. The mechanism for converting the optical signal into the electrical signal is: by the photosensitive action of the light receiver 53, the light state is converted to a high level, and the lightless state is converted to a low level. The transmission mechanism between the voice chip 61 and the display chip 63 is taken as an example to illustrate that the transmission mechanism of the bus system 50 is: when the display chip 63 outputs an electrical signal, the electrical signal passes through the light emission at the interface between the display chip 63 and the optical fiber 51. The device 52 converts the optical signal into an optical signal, and then transmits it to the interface between the voice chip 61 and the optical fiber 51 via the optical fiber 51, and is restored to an electrical signal by the optical receiver 53 at the interface, and then input into the voice chip 61. Since the data transmission rate of the optical fiber 51 is much higher than the data transmission rate of the copper wire, the fiber system 50 is used to connect the chips in the computer, which can greatly improve the data processing performance of the computer. In addition, when the optical signal is transmitted on the optical fiber 51, electromagnetic interference does not occur between the adjacent optical fibers 51, so the quality of the transmission signal is better, and when the optical signal is transmitted on the optical fiber 51, the energy loss due to the photoresist is required. Far less than the energy loss caused by the heat generated by the electrical signal transmitted on the printed copper wire due to the presence of resistance, the use of the bus system 50 can also reduce the energy loss inside the computer of 200820001. In addition, since the bus system 50 uses the optical fiber 51 as the signal transmission carrier, and the optical fibers 51 have no electromagnetic interference with each other, and the optical fibers 51 do not contact each other, the short circuit phenomenon does not occur, so the bus system 5 is on the computer motherboard 6〇. The top can be closely arranged to make the computer motherboard 60 miniaturized. Moreover, the main material of the optical fiber 51 is plastic and glass 'lighter than the copper wire of the same length, so the weight of the computer motherboard 60 can be greatly reduced by using the bus system 50. Therefore, the present invention does not need to change the circuit design of the conventional computer motherboard, and only needs to replace the copper wire with the optical fiber 51, and does not need to change the internal structure of the chip, and only needs to set a plurality of pairs of light at the interface between the chip and the optical fiber 51. The transmission of the benefit 52 and the light receiver 53 can greatly improve the performance of the conventional computer. It can be understood that the bus system can be used not only for interconnection between chips in a computer, but also for interconnection between chips in other electronic devices such as mobile phones, by using optical fibers instead of connecting the chips in the prior art. Printing copper wire, and each pair of optical fiber and ^ interface in the pair - light emitter and - light receiving state, can greatly improve the data processing capabilities of the electronic device. In summary, the invention conforms to the requirements of the issue of the issue, and the patent is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be equivalent (four) or changed according to the spirit of the present invention. Should = Please be within the scope of the patent. [Simple description of the drawing] Fig. 1 is a diagram showing the connection of the conventional bus system to each chip of the computer. FIG. 2 is a schematic diagram showing the connection between the specific implementation of the bus system of the present invention for each computer 200020001 chip. FIG. 3 is an exploded view of the display chip and the interposer shown in FIG. [Main component symbol description] (Invention) Bus system 50 Optical transmitter 52 Optical path conversion element 54 Voice chip 61 Display chip 63 Pin 631 (General) Bus system 20 Computer motherboard 22 Slot 24 Optical fiber 51 Optical receiver 53 Computer motherboard 60 memory chip 62 board 64 socket 641 printed copper wire 21 chip 23, 25 insulation 26 11