200819789 九、發明說明： 【發明所屬之技術領域】 本發明係為提供微透鏡陣列之全新製程技術，尤指一種 利用金屬熔融且經固化後產生之圓弧曲面來製作微透鏡陣列 之方法。主要係運用錫球熱熔產生微圓弧曲面固化後的特性 來提高微透鏡陣列製程之可靠度，進而利用塑膠成型技術達 到大量且快速生產之目的，同時兼具節省生產成本之優點及 功效。 【先前技術】 按，光學的發展一直都是以幾何光學為理論基礎，大部 分的光學元件皆是以研磨為主要加工手段，元件表面的主要 形狀大抵是平面或是球面。近年來由於半導體產業之蓬勃發 展，同時帶動許多高科技產業產品問世，而這些高科技產業 產品除了功能上要求外，元件微小化亦屬其設計追求的目標 之一。微機電系統(Micro-Electro-Mechanical-System，MEMiS：) 為目前世界各國投入大量人物力研發之一種微小化技術，利 用這項技術所製作出尺寸微小的結構，已被廣泛應用在生物 醫學、光學感測與通訊元件等方面。 其中，微光學元件的各種應用概有微透鏡陣列(Micr〇lens Array)、光閥、光栅、複合微透鏡等，本發明主要係針對微透 200819789 鏡陣列光學元件之成型技術進行研討及研發。 一般微透鏡陣列光學元件在光學產品的應用概如CCD系 統、液晶顯示器、數位相機、投影機、喷墨印表機喷嘴、雷 射讀寫頭、行動電話、傳真機、攝影機等，皆必須藉助微透 鏡陣列光學元件方能發揮其功效。而目前常見之折射式微透 鏡種類，依照透鏡鏡面弧度及鏡面形狀又可分類為：平面鏡 微透鏡(Planar Micro Lens)、兩面凸微透鏡(BiC0nvex)、兩面凹 微透鏡(Biconcave)、非球面微透鏡(Aspheric Micro Lens)、平 凸被透鏡(Plano Convex Micro Lens)、平凹微透鏡(piano C〇ncave Micro Lens)、圓柱型微透鏡(Cylindrical Micr〇lens)、 六角型陣列(Hexagonal Micro Lens Array)等。 其次，分析近年來微透鏡陣列之母模成型的方法大致上 有： (a)熱熔回流法 熱炼回流法是微透鏡製作的最主要方法，其製程方法 如第一圖所示，使用微影技術令光源Ai照射光罩A2，將 光罩A2下方之光阻A3製成圓柱型陣列A31，然後加熱至 光阻熔點，使光阻熔化再利用光阻之表面張力與内聚力的 關係，使圓柱光阻變成如圖所示之圓形外型的微透鏡陣列 A32，再以光阻做為遮罩進行蝕刻，使半球狀外型結構轉 移至基板上。這種方法雖具有製作方法簡單、價格較低之 200819789 優勢，但相對亦存在有：微透鏡的形狀有控制上的困難、 相鄰間的微透鏡需要有較大的間格才不至於黏在一起產 生架橋現象（Bridging)’因此熱炫回流法的填滿率也相對 降低等問題及缺點。 (b)點膠滴置式 其製程方法如第二圖所示，主要係將溶融光阻m置 於外部具加熱H肪之容n B2内，再以電腦B3發射脈 衝訊號B31控制一使用壓電陶究材料製成的微嘴射器 B4，使光阻B1經由喷射器B4，而讓光阻液滴βιι喷射在 利用加熱器加熱的基板B5上，噴射在基板B5上的 ，阻B12會與基板B5因表面張力而形成球面狀，該方法 實際上與回流法她。但制這種方法時，其基板與液滴 材料的表面張力是很重要的，故液滴材料的黏滯係數盘基 板的溫度都必須受到良好的控制，故生產人員在製程中必 須投入高粒意力，相對造造輕的不便。 (C)灰階光罩式 其I私方法如第三圖所示，首先以特殊射線C1照射 刪玻璃材料C2，使咖玻璃材料C2形成不同透光 度及灰佈的光^C3圖形，再利用光罩Ο對光阻以 I使紐表面喊小圓弧面，最後經糊成型即製成 透鏡C5。由於光崎光強度具有敏祕與選擇性，因此 200819789 可以製作微小圓弧面。但影響灰階光罩製程技術的參數有 很多，其中光阻敏感度與選擇比是考量的重點，故為得到 -外形、輪廓符合要求之光學元件，就必須知道光阻的高 度、表面躲婦定靖條件、縣條件、顯祕件之相 對關係，條件限制及要求亦相對較高。 (d)準分子雷射拖拉法 準刀子雷射為脈波式雷射，適合加工塑膠材料。藉由 CNC系統控制工件與光罩平台的相對運動，並配合雷射 重複率、能量密度、透鏡的數值孔徑的設定及適當形狀的 光罩即可產生近似圓弧曲面的微透鏡陣列；若欲製作 3D加工件’則可由運動型態控制與光罩形狀設計。 (e)折射率梯度型離子交換法 利用透鏡H折射率依—定之梯度分佈，使光通過 日禮生偏折’而造成聚焦效果。利用離子交換法製作折射 率梯度型微透!鱗财法依摻_騎射率絲板折射 率之差異而有所不同。摻雜物質由擴散入基板中形成折射 率分佈。 (f)微影印刷PMMA成長法 (承甲基丙稀酸甲酯，p〇ly methyl methacrylate)是 由MMA單體所組成之冑分子。由於分子鏈決定冑分子許多 物则寸性’如·缺度、玻璃轉換溫度、溶解料。故此法 200819789 係利用高能光束（質子束、深紫外光)將PMMA的分子鏈打 斷，使其分子量減少，然後浸沒在單體的蒸氣中，斷裂的分 子鍵會和單體重新結合，使其被照射區域的體積膨脹，表面 增大足以形成透鏡。 然而，上述幾種方法無論是熱熔法、灰階光罩或是點膠 滴入法都必須透過樹脂熟化、軟烤與硬烤等過程，這過程的 勿/、化+雙化都將造成微透鏡體積的變形，使得微圓孤曲 面更難以㈣。再者，PMMA目紐宜，但此法不具有再利 用功能；且由於PMMA浸泡於單體溶液需時四至五天，使製 作時程過長，此缺點更為顯著。 【發明内容】 爰是，本發明主要係針對微透鏡之微圓弧曲面與基板 特性，發展出—套能有效且射的㈣技術，並藉由這項 _能製作出合乎要求的微透鏡模仁，進驗過賴、熱 壓或射出成型光學元件，達到製程簡單化、微小化、大量 生產且高精確性的目標，同時兼具節省生產成本之優點及 功效。 ,本發明係提供-種微透鏡陣列光學元件之成型技 術，该成型技術包含以下步驟·· ⑴在基板上製作微孔陣列：在基板上加工成型適 200819789 讀孔，基板的微孔外徑必須與錫球相對應，令微孔深度 大約為錫球的半徑； & (2) 將錫球置入微孔中； (3) 加熱使錫球熔化··將排列好的錫球經過加熱熔 化，使炫融狀錫料附著在基板微孔内，且頂面形成凸出之 圓弧曲面； ⑷表面沉積導電層：在基板與冷卻固化之錫球表 面上沉積一導電層； ⑸電鑄翻製模仁：將沉積好導電層的錫球陣列電 鑄翻製成模仁； $⑻生趙透鏡_光學元件·· #電賴仁完成並 組震在模具上後，即可透過_加工方法來生產微透鏡陣 列光學元件。 據上所述之一種微透鏡陣列光學元件之成型技術，其 中，該基板之材料可係為矽基板。 據上所述之一種微透鏡陣列光學元件之成型技術，其 中，該基板之材料可係為金屬材料。 據上所述之一種微透鏡陣列光學元件之成型技術，其 中，該基板之材料可係為陶瓷材料。 200819789 據上所述之一種微透鏡陣列光學元件之成型技術，其 t，該微孔陣列可係以蝕刻方式加工成型。 據上所述之-種微透鏡陣列光學元件之成型技術，其 中，該微孔陣列可係以機械方式加工成型。 據上所述之一種微透鏡陣列光學元件之成型技術，其 中，該微孔陣列可係以雷射方式加工成型。 據上所述之-種微透鏡陣列光學元件之成型技術，其 中’錫球之直徑可係介於5〜20〇μηι之間者。 據上所述之-麵透鏡陣列光學元件之成型技術，其 中’微孔之孔徑可係介於5〜細师之間，且微孔之深度 係約為錫球之半徑者。 利用本發明所成型之微圓弧曲面，—旦液態錫料冷卻 疑固以後即已定昏且其他後製程序料會改變該為圓弧 曲面之幾何狀態，因此，卿本發贿製成之微透鏡不需 另錄正係數進行補償，不僅可賴微透鏡模仁之製作工 時’及提升其精密度，更可進一步達致製程簡單化、微小 化、大量生產且高精確度之目的，_兼具節省生產成本 之優點及功效。 【實施方式】 關於本發明微透鏡陣列光學元件之成型技術，兹舉—基本 11 200819789 式於下文進行詳細說 製作步驟並搭配若干可行實施例配合圖 明，供鈞上深入了解並認同本發明。 所、求百先請參閱第四、五圖所示，本發明之基本製作步驟如下 Γ、 ❾ 第一步驟：在基板上製作微孔陣列；在基板上加 工成型適量均勻度高之微孔，其中， 基板10的微孔101孔徑必須與錫球2〇相 對應，微孔101之孔徑與錫球2〇之直徑 係介於5〜200μπι之間，且控制令微孔1〇1 深度大約為錫球2〇的半徑； 第二步驟：將财置入微孔中；由於微孔1〇1之深度 約為錫球20半徑，因此錫球20會略高出 基板10表面呈浮凸狀； 第•加熱使錫球熔化；將排列好的錫球2〇經 過加熱熔化，使熔融狀錫料附著在基板1〇 之微孔101 R，頂面形成凸出之圓孤曲 面，其中，言亥凸出之圓弧曲面係受到熔融 狀錫料之表面張力影響而產生； 第竭·表面沉積導電層；在基板1〇與冷卻固化 之錫球20表面上沉積一導電層30，以利 12 200819789 往後電鑄模仁； 第五步驟：電鑄翻製模仁；將沉積好導電層3〇的錫 球陣列電軸製賴仁4G，該模仁4〇表 面將形成與錫球陣列相對應之凹孔4〇1陣 列； 第六步驟：生產微透鏡陣列光學元件；#電鱗模仁完 成亚組4在模具上以後，即可透過塑膠加 工方法（例如射出成型、熱壓…等方法） 來生產微透鏡陣列光學元件5〇。 *藉以上成型技術，首先製成微圓弧曲面之幾何狀態不受後 貝衣私〜及改文之基板’再彻基板崎即可製得高可靠度 之模仁，接下諸可_轉加工綠快速生趙透鏡陣列光 學讀’不僅可簡化為透鏡陣列光學树之製程，更兼具縮短 工時、提升產能、節省生產成本等優點及功效。此外，由於本 發明之圓藝©主要係由錫猶融後再經冷卻固化形成，故使 (J顆粒的錫球便此製做出越小的圓弧狀微透鏡，且圓孤的 曲率可由錫球餘、基板孔徑、與孔徑深度來加以控制， 俾可生產*合業界需求之不同圓弧曲率之微透鏡陣列光學元 件’具鬲度產業利用價值。 第六圖係本發_絲板為紐之制觀示意圖，其包 13 200819789 含之步驟如下·· 第一步驟：以矽基板為基材12，並以蝕刻方式製作均勻 度南之微孔121陣列，其中，基板12的微孔 121孔徑必須與錫球相對應，微孔121之孔徑 與錫球之直徑係介於5〜200μιη之間，且控制令 微孔121深度大約為錫球20的半徑； 第一步驟：將錫球置入微孔中；由於微孔121之深度約為 錫球20半徑，因此錫球2〇會略高出基板表面 呈浮凸狀； 第三步驟··加熱使錫球熔化；將排列好的鍚球2〇經過加 熱熔化，使熔融狀錫料附著在基板12之微孔 121内，頂面形成凸出之圓弧曲面，其中，該 凸出之圓弧曲面係受到熔融狀錫料之表面張 力影響而產生； < 第四步驟：表面沉積導電層；在基板12與冷卻固化之锡 ，20表面上沉積—導電層3{)，以利往後電禱 才果4—， 第五步驟：輯翻製模仁，·將沉積好導電層3〇的錫球陣 列電鑄翻製成模仁40’該模仁4〇表面將形成 與錫球陣列相對應之凹孔401陣列； 14 200819789 第六步驟：生產微透鏡陣列光學元件；當電鑄模仁完成並 組裝在模具上以後，即可透過塑膠加工方法 (例如射出成型、熱壓…等方法）來生產微透 鏡陣列光學元件5〇。 、再者，如上述實施例第一步驟所述，當本發明係以石夕基板 為基材時’係搭配彻賴方式切基板上成·孔陣列； 淮本發明之微孔陣列加工方式並非受限於钱刻方式而已，實 際上，軸刻方式係可置換以機械方式或雷射方式加工成型微 孔_—(由於此部分係屬加工方式之等效置換，故圖面省略， 、）且一種加工成型方式皆可達致相同訴求及效果。 #圖係本發明以金屬板為基材之成型技術示意圖，其包 含之步驟如下： 第為·以金屬板為基材14，並以飿刻方式製作均勻 度高之微孔141 _，其中，基板14的微孔 141孔徑必須與錫球2〇相對應，微孔141之孔 徑與錫球20之直徑係介於5〜2〇〇μιη之間，且 控制令微孔141深度大約為錫球2〇的半徑； 第二步驟：將錫球置入微孔中；由於微孔141之深度約為 錫球20半徑，因此錫球2〇會略高出基板14 表面呈浮凸狀； 15 200819789 第三步驟··加熱使錫球熔化；將排列好的錫球2〇經過加 熱熔化，使炫融狀錫料附著在基板14之微孔 141内，頂面形成凸出之圓弧曲面，其中，該 凸出之圓弧曲面係受到熔融狀錫料之表面張 力影響而產生； 第四步驟：表面沉積導電層；在基板14與冷卻固化之錫200819789 IX. Description of the Invention: [Technical Field] The present invention is a novel process technology for providing a microlens array, and more particularly to a method for fabricating a microlens array by using a curved surface formed by melting a metal and being solidified. The main purpose is to improve the reliability of the microlens array process by using the hot melt of the solder ball to produce the micro-arc surface, and then use the plastic molding technology to achieve a large number of rapid production, and at the same time, it has the advantages and effects of saving production cost. [Prior Art] According to the development of optics, the development of optics has always been based on geometric optics. Most of the optical components are based on grinding. The main shape of the surface of the component is generally flat or spherical. In recent years, due to the vigorous development of the semiconductor industry and the advent of many high-tech industrial products, in addition to functional requirements, these high-tech industrial products are also one of the goals of their design. Micro-Electro-Mechanical-System (MEMiS:) is a miniaturized technology developed by many countries in the world. It has been widely used in biomedicine by using this technology to produce small-sized structures. Optical sensing and communication components. Among them, various applications of micro-optical components include microlens arrays, light valves, gratings, composite microlenses, etc. The present invention mainly relates to the research and development of micro-transparent 200819789 mirror array optical components. General microlens array optical components in optical applications such as CCD systems, liquid crystal displays, digital cameras, projectors, inkjet printer nozzles, laser read/write heads, mobile phones, fax machines, cameras, etc., must rely on Microlens array optics can perform their functions. At present, the types of refractive microlenses commonly used can be classified into: Planar Micro Lens, BiC0nvex, Biconcave, and aspherical microlenses according to the lens curvature and mirror shape. (Aspheric Micro Lens), Plano Convex Micro Lens, piano C〇ncave Micro Lens, Cylindrical Micr〇lens, Hexagonal Micro Lens Array Wait. Secondly, the methods for analyzing the master molding of microlens arrays in recent years are as follows: (a) Hot melt reflow method The hot reflow method is the most important method for microlens fabrication. The process method is as shown in the first figure. The shadow technology causes the light source Ai to illuminate the mask A2, and the photoresist A3 under the mask A2 is made into a cylindrical array A31, and then heated to the melting point of the photoresist to melt the photoresist and reuse the relationship between the surface tension of the photoresist and the cohesive force. The cylindrical photoresist becomes a circular outer shape microlens array A32 as shown in the figure, and is etched by using the photoresist as a mask to transfer the hemispherical outer structure to the substrate. Although this method has the advantages of simple manufacturing method and low price of 200819789, there are relative problems: the shape of the microlens has difficulty in control, and the adjacent microlens needs a larger space to adhere to it. Together, the bridging phenomenon is generated, so the filling rate of the resilience reflow method is relatively low, and the like. (b) The dispensing method of the dispensing method is as shown in the second figure. The main method is to place the molten photoresist m in the externally heated volume n B2, and then use the computer B3 to emit a pulse signal B31 to control the use of piezoelectric. The micro-nozzle B4 made of ceramic material causes the photoresist B1 to pass through the ejector B4, and the photoresist droplet β1 is sprayed on the substrate B5 heated by the heater, and sprayed on the substrate B5, and the resistance B12 will be The substrate B5 is formed into a spherical shape due to the surface tension, and the method is actually performed by the reflux method. However, when this method is used, the surface tension of the substrate and the droplet material is very important, so the viscosity coefficient of the droplet material must be well controlled, so the production personnel must put high particles in the process. Intentionality is relatively inconvenient to create. (C) Gray-scale mask type I private method, as shown in the third figure, firstly, the glass material C2 is irradiated with a special ray C1, so that the coffee glass material C2 forms a light transmittance of different light and gray cloth, and then Using a mask, the photoresist is shattered by a small arc surface by I, and finally the lens C5 is formed by paste molding. Since the light intensity of the light is sensitive and selective, the 200819789 can make tiny arc surfaces. However, there are many parameters affecting the gray-scale reticle process technology. Among them, the photoresist sensitivity and the selection ratio are the key points. Therefore, in order to obtain the optical components with the shape and contour conforming to the requirements, it is necessary to know the height of the photoresist and the surface escort. The relative relationship between Dingjing conditions, county conditions, and secret parts, and the conditions and requirements are relatively high. (d) Excimer laser drag method The quasi-knife laser is a pulsed laser, suitable for processing plastic materials. By controlling the relative motion of the workpiece and the reticle stage by the CNC system, and matching the laser repetition rate, the energy density, the numerical aperture setting of the lens, and the reticle of the appropriate shape, a microlens array with an approximately circular curved surface can be generated; Making 3D workpieces can be controlled by motion type and reticle shape. (e) Refractive index gradient type ion exchange method The refractive index of the refractive index of the lens H is used to cause the light to pass through the deflection of the solar eclipse to cause a focusing effect. The ion exchange method is used to produce a refractive index gradient type micro-transparent method; the scale method differs depending on the difference in the refractive index of the ray-ratio plate. The dopant species is diffused into the substrate to form a refractive index profile. (f) lithography printing PMMA growth method (p〇ly methyl methacrylate) is a ruthenium molecule composed of MMA monomers. Since the molecular chain determines many of the molecules of the ruthenium, such as lack of degree, glass transition temperature, dissolved material. Therefore, this method 200819789 uses a high-energy beam (proton beam, deep ultraviolet light) to break the molecular chain of PMMA, reduce its molecular weight, and then immerse it in the vapor of the monomer, and the broken molecular bond will recombine with the monomer, making it The volume of the illuminated area expands and the surface increases enough to form a lens. However, the above several methods, whether it is a hot melt method, a gray scale mask or a dispensing method, must pass through a process of resin curing, soft baking and hard baking, and the process of the process will not cause / / chemical + double The deformation of the microlens volume makes the microcircular curved surface more difficult (4). Furthermore, PMMA is suitable, but this method does not have a re-use function; and since the PMMA is immersed in the monomer solution for four to five days, the manufacturing time is too long, and this disadvantage is more remarkable. SUMMARY OF THE INVENTION In view of the above, the present invention mainly develops a micro-arc surface and a substrate characteristic of a microlens, and develops a (four) technique capable of being effective and shooting, and can produce a desired microlens mode by using this method. Ren, inspecting, hot pressing or injection molding optical components, to achieve the goal of simplification, miniaturization, mass production and high precision, and at the same time has the advantages and effects of saving production costs. The present invention provides a molding technique for a microlens array optical element, the molding technique comprising the following steps: (1) fabricating a micropore array on a substrate: processing a well-formed 200819789 read hole on the substrate, the micropore outer diameter of the substrate must be Corresponding to the solder ball, the depth of the micropore is approximately the radius of the solder ball; & (2) placing the solder ball into the micropore; (3) heating to melt the solder ball··heating and arranging the aligned solder balls , the dazzling molten tin is adhered to the micropores of the substrate, and the top surface forms a convex curved surface; (4) depositing a conductive layer on the surface: depositing a conductive layer on the surface of the substrate and the cooled and solidified solder ball; (5) electroforming Molding: The electro-casting of the solder ball array of the conductive layer is made into a mold; $(8) 生赵透镜_optical component··#Electric ray is completed and shaken on the mold, then it can pass through _ processing method To produce microlens array optics. According to the molding technique of the microlens array optical element described above, the material of the substrate may be a tantalum substrate. According to the molding technique of the microlens array optical element described above, the material of the substrate may be a metal material. According to the molding technique of the microlens array optical element described above, the material of the substrate may be a ceramic material. 200819789 According to a molding technique of a microlens array optical element described above, the microwell array can be formed by etching. According to the molding technique of the microlens array optical element described above, the microwell array can be mechanically formed. According to the molding technique of the microlens array optical element described above, the microwell array can be formed by laser processing. According to the molding technique of the microlens array optical element described above, the diameter of the 'tin ball can be between 5 and 20 〇μηι. According to the forming technique of the face lens array optical element described above, the aperture of the 'micro hole can be between 5 and 5, and the depth of the micro hole is about the radius of the solder ball. By using the micro-arc surface formed by the invention, the liquid tin material is cooled after being suspected of cooling, and other post-processing materials change the geometric state of the arc-shaped surface, so The microlens does not need to record the positive coefficient to compensate, not only depends on the manufacturing time of the micro lens mold, and enhances its precision, but also can further achieve the purpose of simplifying the process, miniaturization, mass production and high precision. Both have the advantages and effects of saving production costs. [Embodiment] Regarding the molding technique of the microlens array optical element of the present invention, the present invention will be described in detail below with reference to a number of possible embodiments, and the present invention will be further understood and recognized. Please refer to the fourth and fifth figures. The basic fabrication steps of the present invention are as follows: ❾ First step: making a micro-hole array on the substrate; processing a suitable amount of micropores with a high degree of uniformity on the substrate, The aperture of the micro-hole 101 of the substrate 10 must correspond to the solder ball 2〇, and the diameter of the micro-hole 101 and the diameter of the solder ball 2〇 are between 5 and 200 μm, and the depth of the micro-hole 1〇1 is controlled to be approximately The radius of the solder ball 2 ;; the second step: placing the money into the micropore; since the depth of the micro hole 1〇1 is about the radius of the solder ball 20, the solder ball 20 will be slightly higher than the surface of the substrate 10 to be embossed; The second heating melts the solder ball; the aligned solder balls are heated and melted, so that the molten tin material adheres to the micropores 101 R of the substrate 1 , and the top surface forms a convex round orbital surface, wherein The convex arc surface is generated by the surface tension of the molten tin; the first surface is deposited with a conductive layer; a conductive layer 30 is deposited on the surface of the substrate 1 and the cooled and solidified solder ball 20 to benefit 12 200819789 Electroforming the mold in the future; the fifth step: electroforming the mold core; will sink A good conductive layer 3 锡 solder ball array electric shaft made of Lai Ren 4G, the surface of the mold core 4 将 will form an array of concave holes 4 〇 1 corresponding to the solder ball array; sixth step: production of microlens array optical components; After the electric scale mold core completes the sub-group 4 on the mold, the microlens array optical element 5 can be produced through a plastic processing method (for example, injection molding, hot pressing, etc.). * By the above molding technology, the geometrical state of the micro-arc surface is first made to be free from the back of the shell and the substrate of the modified text can be made with high reliability. The processing green fast-growing Zhao lens array optical reading 'can not only be simplified into the lens array optical tree process, but also has the advantages and functions of shortening the working hours, increasing the production capacity, and saving the production cost. In addition, since the round art of the present invention is mainly formed by tin and then cooled and solidified, it is possible to make the smaller spherical arc-shaped microlens of the solder ball of J particles, and the curvature of the round orphan can be The tin ball balance, the substrate aperture, and the aperture depth are controlled to produce a microlens array optical component with different arc curvatures that meets the needs of the industry. The utility model has the value of industrial use. The sixth figure is the hair _ silk plate is The schematic diagram of the system of the New Zealand, the package 13 200819789 includes the following steps: · The first step: using the germanium substrate as the substrate 12, and forming an array of uniformity south micropores 121 by etching, wherein the micropores 121 of the substrate 12 The aperture must correspond to the solder ball, and the aperture of the microhole 121 and the diameter of the solder ball are between 5 and 200 μm, and the depth of the microhole 121 is controlled to be approximately the radius of the solder ball 20; the first step: placing the solder ball Into the micropores; since the depth of the micropores 121 is about the radius of the solder balls 20, the solder balls 2 〇 will be slightly higher than the surface of the substrate is embossed; the third step · heating to melt the solder balls; The ball 2 is heated and melted to adhere the molten tin In the micro-hole 121 of the substrate 12, the top surface forms a convex arc-shaped curved surface, wherein the convex curved surface is affected by the surface tension of the molten tin; < Fourth step: depositing a conductive layer on the surface On the substrate 12 and the cooled and solidified tin, the surface of the 20 is deposited - the conductive layer 3 {), in order to facilitate the subsequent prayer 4 -, the fifth step: the mold is turned over, the conductive layer will be deposited 3 The solder ball array is electroformed into a mold core 40'. The surface of the mold core 4 will form an array of recessed holes 401 corresponding to the solder ball array; 14 200819789 The sixth step: producing a microlens array optical element; After completion and assembly on the mold, the microlens array optical element 5 can be produced by a plastic processing method such as injection molding, hot pressing, or the like. Furthermore, as described in the first step of the above embodiment, when the present invention is based on the Shixi substrate, the substrate is formed into a hole array by means of a thorough method; the micropore array processing method of the invention is not It is limited to the method of engraving. In fact, the axial engraving method can replace the micro-holes processed by mechanical or laser processing. _ (Because this part is equivalent to the replacement of the processing method, the drawing is omitted, ,) And a processing and forming method can achieve the same appeal and effect. #图图 The schematic diagram of the molding technology of the metal plate as the base material of the present invention comprises the following steps: First, the metal plate is used as the substrate 14, and the micropores 141 having a high uniformity are formed by engraving, wherein The pore size of the micropores 141 of the substrate 14 must correspond to the solder balls 2, and the diameter of the micro holes 141 and the diameter of the solder balls 20 are between 5 and 2 μm, and the depth of the micro holes 141 is controlled to be approximately solder balls. The radius of 2〇; the second step: placing the solder ball into the micropore; since the depth of the microhole 141 is about the radius of the solder ball 20, the solder ball 2〇 is slightly higher than the surface of the substrate 14 is embossed; 15 200819789 The third step is: heating to melt the solder ball; the aligned solder balls 2〇 are heated and melted, so that the dazzling tin material adheres to the micro holes 141 of the substrate 14, and the top surface forms a convex arc surface, wherein The convex arc surface is generated by the surface tension of the molten tin; the fourth step: depositing a conductive layer on the surface; and cooling the solidified tin on the substrate 14
球20表面上沉積—導電層3()，以利往後電轉 模仁； 第五步驟·輯翻製模仁；將沉積好導電層⑽的錫球陣 列電鑄翻製成模仁40,該模仁4〇表面將形成 與錫球陣列相對應之凹孔401陣列； 第六步驟：生產微魏_光學树；#電翻仁完成並 組褒在模具上以後，即可透過塑膠加工方法 (例如射出成型、熱璧...等方法)來生產微透 鏡陣列光學元件5〇。 丹百，如上述實施例 士 力娜呵延，富本發明係以金屬板 為基材時，係搭配__方式 滅 惟上成雌孔陣列； 林月之舰陣列加工方式並非受限於飯刻 際上’該蝕刻方式係可置換 工 ，男 概方式切財^工成型汽 陣列（齡此部分蘭加工方式之等效置換，故圖面省略’ 16 200819789 不予贅不），且三種加工成型方式皆可達致相同訴求及效果。 第八圖係本發明以陶瓷材料為基材之成型技術示意圖，其 包含之步驟如下： ^ 一 •以陶瓷材料為基材16，並以蝕刻方式製作均 勻度高之微孔161陣列，其中，基板16的微 孔161孔徑必須與錫球2〇相對應，微孔161 之孔徑與錫球20之直徑係介於5〜2〇〇μπι之 間，且控制令微孔161深度大約為錫球20的 半徑； 第為·將錫球置入微孔中；由於微孔161之深度約為 錫球20半徑，因此錫球2〇會略高出基板16 表面呈浮凸狀； 弟^墙.加熱使錫球溶化；將排列好的錫球2〇經過加 熱炫化’使溶融狀錫料附著在基板16之微孔 ⑹内’頂面形成凸出之圓弧曲面，其中，該 凸出之圓弧曲面係受到炫融狀錫料之表面張 力影響而產生； 第四乂顿：表面沉積導電声· 、 、、θ ,在基板16與冷卻固化之錫 球20表面上沉積一導電層3〇，以利往後輯 模仁； 17 200819789 第五步驟：輯翻製模仁；將沉積好導電層3Q的錫球陣 列電鑄翻製成模仁4〇，該模仁40表面將形成 與錫球陣列相對應之凹孔401陣列； 弟六步驟：生趙透鏡_光學元件；t輯模仁完成並 組I在杈具上以後，即可透過塑膠加工方法 (例如射出成型、熱壓···等方法）來生產微透 鏡陣列光學元件5〇。 再者，如上述實施例第一步驟所述，當本發明係以陶究材 科為基材時，係搭配_侧方式在喊材料上成型微孔陣 列，:，本發明之微孔_加工方式並非受限於糊方式而 * &綱方式係可置換峨械方核雷射方式加工 成型微孔陣列（由於此部分係屬加工方式之等效置換，故圖面 名略，不«示）’且三種加工成型方式皆可達致相同訴求及 效果。 經由上述朗可知本翻之成雜術灿下優點及功效： 1、 微透鏡_精確度^由於本翻_闕球來形成 微透鏡陣狀面’再加上錫球具有凝固定型後，即無法改 =其圓弧曲面幾何狀態之特性，因此不需另尋修正係數加以補 ^ 貝即可製造生產高精確度之微透鏡陣列。 2、 微透鏡陣顺小化：由於顆粒越小的錫球可製造直徑 18 200819789 越小的圓弧狀透鏡，故透過錫球直徑、基板之微孔孔徑、形狀 及深度等數據，即可控制微透鏡之尺寸及圓弧曲率，進而可以 製造符合市場機制之微小化微透鏡。 3、 微透鏡可快速量產：本發明先製成模仁以後即搭配塑 膠加工方法來生產微透鏡陣列光學元件，故可達致縮減工時、 提升產能及快速量產之目的及訴求。 4、 降低成本：由於本發明之成型技術兼具縮減工時、提 升產能及快速量產之優點，因此相對具有降低製造成本之功 效。 紅觀上述，本發明之製程的確能提供一種可快速生產微透 鏡陣列光學件之成型技術，兼麵減讀、提升產能及有效 即省生產成本衫項優點及功效而具有產業高度利用價值，以 其整體製程及特徵而言，既未f見諸於同類產品中，中請前亦 未見么開’誠已符合專槪之法定要件，爰依法提出發明專利 申請。 ^惟以上所述者，僅為本發明之較佳實施例，當不能以此限 疋^發明實施之範圍，即大凡依本發明申請專利範圍及創作說 曰内谷所作之等效變化與修飾，皆應仍屬發明作專利涵苗之 範圍内。 | 【圖式簡單說明】 19 200819789 第一圖係以熱熔回流法製作微透鏡陣列示意圖。 第二圖係以點膠滴置式製作微透鏡陣列示意圖。 第三圖係以灰階光罩式製作微透鏡陣列示意圖。 第四圖係本發明微透鏡陣列光學元件之製作流程方塊圖。 第五圖係本發明微透鏡陣列光學元件之技術流程示意圖。Depositing a conductive layer 3() on the surface of the ball 20 to facilitate subsequent electromoulding of the mold; a fifth step of remanufacturing the mold core; electroforming the solder ball array deposited with the conductive layer (10) into a mold core 40, The surface of the mold core 4 will form an array of concave holes 401 corresponding to the array of solder balls; the sixth step: producing micro Wei - optical tree; #电翻仁 finished and assembled on the mold, then through the plastic processing method ( For example, injection molding, heat treatment, etc.) are used to produce the microlens array optical element 5〇. Dan Bai, as in the above embodiment, Shi Li Na, Yan Fu, the invention is based on the metal plate as the base material, with the __ way to destroy the array of female holes; Lin Yuezhi ship array processing is not limited to rice In the engraving, the etching method is a replaceable worker, and the male model cuts the wealth of the forming steam array (the equivalent replacement of the blue processing method in this part of the age, so the drawing is omitted] 16 200819789 does not give it, and three processing The molding method can achieve the same appeal and effect. The eighth figure is a schematic diagram of the molding technology of the ceramic material as the base material of the present invention, and the steps thereof are as follows: ^ A ceramic substrate is used as the substrate 16, and an array of micropores 161 having a high uniformity is formed by etching, wherein The aperture of the microhole 161 of the substrate 16 must correspond to the solder ball 2〇. The aperture of the microhole 161 and the diameter of the solder ball 20 are between 5 and 2 〇〇μπι, and the depth of the microhole 161 is controlled to be about the solder ball. The radius of 20; the first · the tin ball into the micro-hole; because the depth of the micro-hole 161 is about the radius of the solder ball 20, the solder ball 2 〇 will be slightly higher than the surface of the substrate 16 is embossed; Heating to melt the solder ball; arranging the arranged solder balls 2〇 by heating to make the molten tin adhere to the micropores (6) of the substrate 16 to form a convex arc surface, wherein the protruding The arc surface is affected by the surface tension of the glazed tin material; the fourth layer: the surface deposits conductive sounds ·, , θ, and a conductive layer is deposited on the surface of the substrate 16 and the cooled and solidified solder ball 20 , Eli back to the mold; 17 200819789 The fifth step: a series of molds; The solder ball array deposited with the conductive layer 3Q is electroformed into a mold core 4, and the surface of the mold core 40 will form an array of concave holes 401 corresponding to the solder ball array; the sixth step: the Zhao lens _ optical element; After the mold is completed and the group I is placed on the cookware, the microlens array optical element 5 can be produced by a plastic processing method (for example, injection molding, hot pressing, etc.). Furthermore, as described in the first step of the above embodiment, when the present invention is based on a ceramics substrate, the microporous array is formed on the shouting material in a side-by-side manner:: micropore_processing of the present invention The method is not limited to the paste method and the * & mode is a replaceable mechanical nuclear laser processing micro-hole array (because this part is an equivalent replacement of the processing method, the surface name is omitted, not )] And all three processing methods can achieve the same appeal and effect. Through the above-mentioned Lang Kezhi, the advantages and effects of the technique can be turned into: 1. Microlens _ Accuracy ^ Because the 翻 阙 ball to form the microlens array surface 'plus the tin ball has a fixed shape, it can not Change = the characteristics of the geometric state of the arc surface, so you can create a high precision microlens array without the need to find the correction factor. 2, the microlens array is smaller: the smaller the particle size of the solder ball can produce the diameter of 18 200819789, the smaller the arc lens, so through the diameter of the solder ball, the micropore diameter, shape and depth of the substrate, etc., can be controlled The size of the microlens and the curvature of the arc make it possible to manufacture miniaturized microlenses that conform to the market mechanism. 3. The microlens can be mass-produced quickly: the invention first produces the microlens array optical component with the plastic processing method after the mold core is formed, so that the purpose and appeal of reducing the working time, increasing the production capacity and mass production can be achieved. 4. Cost reduction: Since the molding technology of the present invention has the advantages of reducing man-hours, increasing productivity, and mass production, it has a relatively low cost of manufacturing. In view of the above, the process of the present invention can provide a molding technology capable of rapidly producing microlens array optical components, and has the advantages of high-efficiency use, such as reducing the reading, improving the production capacity, and effectively reducing the production cost of the shirt. In terms of its overall process and characteristics, it has not been seen in similar products, and it has not been seen before. It has met the statutory requirements of the special, and has filed an invention patent application according to law. However, the above is only the preferred embodiment of the present invention, and it is not limited to the scope of the invention, that is, the equivalent variation and modification of the patent application scope and creation of the invention. , should still be within the scope of the invention for patent culling. [Simple description of the diagram] 19 200819789 The first diagram is a schematic diagram of a microlens array fabricated by hot melt reflow. The second figure is a schematic diagram of a microlens array fabricated by dispensing. The third figure is a schematic diagram of a microlens array fabricated by a gray scale mask. The fourth figure is a block diagram showing the manufacturing process of the microlens array optical element of the present invention. The fifth figure is a schematic diagram of the technical flow of the microlens array optical element of the present invention.
Ο 第圖係本發明微透鏡陣列光學元件之成型技術實施例一。 第七圖係本發明微透鏡陣列光學元件之成型技術實施例二。 第八圖係本發明微透鏡陣列光學元件之成型技術實施例三。 【主要元件符號說明】 101 —微孔 121—微孔 141—微孔 161—微孔 30 導電層 401-—凹孔 10-一基材 12 一—矽基板基材 14-一金屬板基材 16 一一陶瓷材料基材 20'一錫球 40-—模仁 50 一一微透鏡陣列光學元件 20Ο The first embodiment is a first embodiment of the molding technique of the microlens array optical element of the present invention. The seventh figure is a second embodiment of the molding technique of the microlens array optical element of the present invention. The eighth figure is a third embodiment of the molding technique of the microlens array optical element of the present invention. [Description of main components] 101 - micropores 121 - micropores 141 - micropores 161 - micropores 30 conductive layer 401 - recessed holes 10 - a substrate 12 - a substrate substrate 14 - a metal plate substrate 16 One ceramic material substrate 20'-tin ball 40--mould 50 50-microlens array optical element 20