TW200818532A - Water-cooled photovoltaic receiver and assembly method - Google Patents

Abstract

Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present invention disclose the design of a photovoltaic receiver and a low-pressure, low-flow-rate liquid cooler. Embodiment of the present invention also disclose a preferred low-cost and scalable manufacturing approach.

Description

200818532 IX. Invention Description: [Prior Art] Solar radiation is the most abundant energy on earth. However, so far, attempts to use solar power on a large scale have failed compared to the economic competition of most fossil fuel sources. One possible reason for this failure is that for a direct conversion under a solar flux, the solar flux is not strong enough to save costs. 0 The solar concentrator technique seeks to solve this problem. Solar radiation is the most easily manipulated and concentrated form of energy. Only moderate materials can be used to refract, diffract or reflect solar radiation to thousands of times the initial flux. Because of so many possible methods, many solar concentrator methods have been proposed. However, such conventional sun concentrator systems are too costly to compete substantially with all fossil fuels. One reason for this is the cost associated with solar receivers. Although the energy conversion material for the receiver may be expensive 'especially in the case of multiple junctions and high efficiency photovoltaic cells', the cost of installation, repair connections and die assembly can account for most of the cost of the entire receiver system. In addition, the receiver of the solar concentrator requires an effective cooling operation. Benefit cooling can add abnormal parasitic loads to the system and inefficient cooling can reduce energy conversion efficiency' and thus reduce output and output. In addition, the structure used to mount and maintain the solar receiver is materially dense. " =, there is a need in the technology for the connection of the sun concentrator (four) assembly _ ^ ^ image, these receiving crying assembly shows a higher simplicity and more "accepted - < material 4 The cost is lower than 124234.doc 200818532. It is better to scale according to the size and size, and better operational efficiency and utility. [Invention] The embodiment of the present invention relates to cost efficiency for collecting light. Design and manufacture of a solar-powered inexpensive photovoltaic power receiver or heat reservoir. An embodiment of the invention according to the invention discloses a photovoltaic power generation receiving crying-type (four) low flow rate liquid cooler and means for supporting the receiver f

The design of V. Embodiments of the present invention also disclose a preferred low cost and scalable method of manufacturing. An embodiment of a photovoltaic power receiver according to the present invention comprises a printed circuit board (PCB) having a plurality of conductive paths formed therethrough; and a diode in a substrate, the substrate - One of the conductive traces on the back side is in electrical communication with the diode and with a conductive trace on a surface of the printed circuit board. The trace provides a flat path for current and heat from the diode structure. The other conductor in the side of the pC plate opposite the surface is interspersed to conduct current and spread to conduct heat to the electrical insulator. An embodiment of a method for assembling a photovoltaic power generation receiver according to the present invention comprises: - cutting a solar cell into a block having a diode; forming a -PC plate in which a plurality of conductive paths pass through the (four) plate The back sides of the blocks are placed on the PC board in alignment with the underlying vias.

- One embodiment of a method for constraining - thermal expansion of a printed circuit (PC) board relative to an overlying diode structure in accordance with the present invention includes constraining the edge of the PC board and non-welding the p C board At least one of the areas on the side is pumped as part of the vacuum. 124234.doc 200818532 - An embodiment of a method of contacting a plurality of diode structures with germanium in accordance with the present invention, the method comprising simultaneously applying an electrical vacuum to at least a region after the diode structures. a port-part of a clamshell type according to the present invention - an embodiment - a part 'which contains - is configured to hold - a dipole junction · two hinged to the second part of the first part, the package 2 Wide group sorrow to hold a second vacuum chuck of a printed circuit board, complex:. The first portion is aligned with the second pu I ', the middle knives to close the bee body structure, aligned with the paperboard prior to the welding process, and the assembly according to the present invention - the photovoltaic power receiver The trial 1 = 2 will be - the substrate with a plurality of photovoltaic power generation areas - the second = soil # support member; the plurality of photovoltaic power generation areas are physically/knife separated by the common support member, the north grain, And contacting the patterned conductor of the separated die to the patterned conductor of the insulating substrate. An embodiment of a photovoltaic power receiver according to the present invention includes a divider separating the inlet nip from an outlet plenum, the receiver flowing through one of the dividers. At least one inertial coolant jet cold of the aperture - an embodiment of the apparatus according to the invention comprises: a first configuration in contact with the solar collector, and a receiver configured to receive solar energy 'the receiver is in contact with a rigid struts extending from a first portion of the first spur structure; a first cable having a first end connected to the first support structure and passing through the solar concentrator Extending to a second support structure in contact with the solar concentrator; and a second thin I24234.doc 200818532 lining up immediately adjacent to the second support rigid struts to receive one of the receivers 'It extends from the second building structure or a portion of the first structure to the receiver or one of the parts, the second cable being configured to be fixed. The present invention will be described in more detail below with reference to the accompanying drawings.

Embodiments in accordance with the present invention are directed to the design and honour of inexpensive photovoltaic power generation receivers or heat registers for cost effective solar energy conversion for concentrating light: a photovoltaic power generation receiver or species is disclosed in accordance with certain embodiments of the present invention. Low suspension flow rate liquid cooler and receiver standard hardware design. Embodiments of the present invention also disclose a preferred low cost and scalable method of manufacturing. A system for a solar concentrator These systems typically have several objects in accordance with the present invention to provide a cost efficient and manufacturable receiver system. Basic functions: • Mechanically support an array of photovoltaic cells or photovoltaic cells; • Cool the receiver or capture thermal energy into the working fluid; and • Provide effective electrical interconnections to prevent excessive resistive losses. θ is not in the case of a swelled solar concentrator and solar tracker device 1 〇 2: a receiver assembly according to the invention - an embodiment. The sun is selected to receive 1 04 to intercept the maximum amount of collected light. When the location. The gas and the receiver are held by at least one rigid struts 106 and can additionally carry coolant, electricity, reactants, broth 124234.doc 200818532 to support the receiver of the system, 4 with 7L pieces The function. This recipient is also held in a suitable position by, for example, viewing the Russian Empire. These elements: "One or more of the tensile elements are fixed. The tension of the piece makes the position of the receiver 1.4 stable. As used herein, the term, see Beijing can contain at least one of him 1

Pieces, steel cables, natural or synthetic ropes, and I ]]., fabrics, fiber-reinforced composites, reinforced ropes, 缵+ she "cut in the mouth, can be used in the corpse 1 In the case of the special 疋 施 f f Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Φ Any structural actual component that is slightly curled up can provide an alternative to a steel cable or one of a variety of conventional pressure-resistant members (such as angular extrusions, 1 ', I loose I piece, C type extrusion, rod, tube or rectangular rod). & In some embodiments, the force or length of the sling can be advanced for 5 weeks to adjust the position of the receiver relative to the concentrator. For example, the rigid element of the fulcrum 106 can provide the necessary reaction force to resist such pull. Stretch. In the embodiment shown in the figure, the reaction force is transmitted by the component 1Q6 to the strut adapter that is shielded by other devices in Fig. 1. In the symmetric configuration shown. ’. The moment generated by the reaction force can be substantially balanced to make the connection

The outside of the receiver assembly exaggerates I M W to a small distortion or twisting moment. The symmetrical arrangement of the concentrator and the receiving state also has the advantage of selecting the fish S, /, having the means for minimizing the interconnection and facilitating sharing of the device between the receiver assemblies. 2 shows a view of the receiver assembly of FIG. 1. Element 202 is the receiver main 124234.doc 10-200818532 body. Element 204 is a rigid struts that further provide conduits for electrical, signal, and coolant. Element 206 is a tensile member (such as a cable) for stabilizing the position of the receiver. Element 208 is an additional tensile member (such as a cable) that cooperates with 204 and 206 for receiving a positional stabilization. The 7L piece 2 1 0 is the effective area of the connector. This component typically can comprise a photovoltaic power generating component, an absorber, a photolysis cell, one or more optical components, and the like. Element 212 is a support structure for the concentrator. The jaw 214 is an optional tensile member (e.g., gauge) that substantially traverses the diameter of the collector. This lanyard provides additional dimensional control of the concentrator and actuates the lock mechanism 218 such that when the sling 214 is moved along its axis - a significant amount, the LOCK 218 can release the concentrator from its mount for maintenance. The function of these elements is to assist the receiver assembly 'however, such elements - such as support structure 216) are rigidly connected to the components of the receiver assembly (eg, as a 1-connector, in this figure it is Branch I structure 216 is shielded). Although it will support U冓2 (four) Μ--structure' but in fact it can contain many

The assembly of the L component (including the cover and the outer casing). Although the particular embodiment of Figure 2 connects the tensile member 2 structure 212 to the receiving crying n, L is attached to the support, this is not required by the present invention. In the case of the 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代 代The diagonal view part of the receiver assembly in 2 reveals the pole coupling, and she has some σσ and a heart 302. In each of #1 to 3, the strut coupler assembly performs many of the functions of the 124234.doc 200818532, which are externally coupled to the rigid strut. Element 304 is a (four) port that passes through to the adjacent end of the expandable collector shown in FIG. Element 306 is the positioning of a valve seat that supports adjustment of the ink force of one or both of the concentrators. The coolant flows through the conduits in the struts 3〇8 to the receiver, and the heated coolant exits the conduits through the conduits. The receiver module or struts may provide - or a plurality of tensile (four) connections to stabilize the receiver position and adjust the receiver position in some embodiments. In this embodiment, the context is directly connected to the main receiver housing indicated at 312. An element that is an intermediate between the collected light and the actual light energy conversion element = is schematically indicated at 314. This element may be reflective, diffractive or radioactive in each stage to perform its function. This component can only be used to enhance light energy conversion:. This... additionally gathers light or diffuses light. This component can convert the lighting, the lighting is more uniform, the angle depends on the smaller, less spectral and empty. The component can protect the conversion material (for example) in transportation, installation: ... mechanical damage and free from storms and Environmental factors (such as water, thirst condensation, oxygen, ozone, pollutants, dust, airborne particles, etc.) in the case of the cloth 'this element swings, expands or otherwise forces to _ also: internal. In some embodiments, this deployment is by applying a deflation control. In other embodiments, the deployment is controlled by a press, in which the deployment is maintained by the element in the aggregator, and in other embodiments, the deployment is removed by the self-concentrator. Work, k system. In the case of a different mechanical feature, the position of a device such as a pick and other mechanical clips is maintained. Other embodiments use features such as magnets and mechanical buckles to maintain the deployment position. Embodiments use a liquid i24234.doc 200818532 or gas pressure or both to deploy or maintain a deployment location. In some embodiments, the deployment location is adjusted by an active or passive approach. In some embodiments, the location of the component Swinging in a manner that is active or passive optical image stabilization. In some embodiments, by means of one or more of elastic (eg, bomb), damping (eg, damper), and inertia (eg, mass): less Partially controlling the revolution. In other embodiments, the rotation is at least partially controlled by a motor, solenoid, etc. In some embodiments, via a phenomenon that occurs due to misalignment (eg, via heating, irradiation to the sun) And the direct or indirect response of the gradients therein, etc.) control the rotation. Figure 4 shows the assembly and disassembly of the bridge without the support of the bridge (component 3〇2). There are many functions outside the mechanical branch of the pole. In the example of Figure 4, the sherulator consists of two main components 402 and a complete assembly, which is assembled in the column shown in Figure 1. The struts on the opposite sides provide a genius. Element 404 is independently spliced into two clusters. In other embodiments, the swellable fluid 单独 available separately can be used to provide service to the concentrator. 8 is connected to the cold side and the hot side of the cold ^ 〇 ^ ^ * interconnect. This seek provides service to the two concentrators. Go to 浐, product h. Feed the cold coolant to the branch and 412 will be relative The hotter coolant is discharged from the struts. Second, the fully conditioned expansion fluid is supplied to the concentrator branch to flow through the struts in a manner that bypasses the cup. In the case of the other, the 'expansion fluid rides on the other In the case of A, the expansion - or more may flow through the strut. In the embodiment, the flyout is in the body, and in the other part of the receiver, the outer rail of the receiver is withered. In other real 124234.doc 200818532 illusion while maintaining the aggregator Remove the 0 > section. It is necessary to perform the right valve assembly in one of the sections of the system. 4. Relatively frequent. 4. This alternative configuration may be provided in other embodiments in some embodiments to provide an expansion fluid. Expansion fluid. The regulator's wheel is transmitted to the valve to not fully regulate the pressure, in other implementations. In the example, the valve has more than one concentrator. That is, the valve can only be opened to open only to discharge

Some Κ% examples can use metering valves. Some embodiments may use a passive regulator to adjust the mixture of passive regulators. Some embodiments may use an on-off valve. . Other embodiments may use the active member 41 8 as a structural bolt. Element 42 is a structural bolt and a bearing surface. In this example, 420 is the pivot of the sun tracker hardware, which is also supported on face 422 either directly or via a washer. The tl piece 424 is a 〇-shaped ring that seals the coolant connection between 402 and 403.

Alternatively, a gasket, adhesive bond, tight mechanical tolerances, or pressure can be used to prevent excess coolant leakage. Port 426 is in direct fluid communication with one of the concentrators, and port 428 is in direct fluid communication with the other concentrators through port 41 。. In this embodiment, mechanical preload and sealant are used to minimize air leakage between 402 and 403. Other embodiments may use a Ο-shaped ring or gasket. The serpentine ring 430 seals against the pressure on the collector side of the valve on the face of the rotating member 434, which contains a port 432 through which fluid can pass. In this embodiment, 434 has gear teeth along its circumference for actuation. In other embodiments, the 4 3 4 can be driven from the center of the rotating element 4 3 4 via a geared motor, for example, by a motor or solenoid having a sufficiently high torque or 124234.doc -14-200818532. Element 436 provides a preload as appropriate. The expansion pressure can be low enough to eliminate this preload. Alternatively or in combination, the grease between the surfaces of elements 434, 403, and 446 can be provided (singly or in combination with a moderate pre-tension) to provide adequate sealing. Element 438 is a spur gear that is mounted to motor 440. In some embodiments, the spur gear can be a helical gear or a snail gear. In some embodiments, the motor is a brushless direct current (DC) motor. In other embodiments, the motor is a step motor. In other embodiments, the motor is a brushed Dc motor. In some embodiments, the motor is an alternating current (AC), universal or variable reluctance motor. In other embodiments, the motor is hydraulic or pneumatic. In some embodiments the 'motor is controlled by circuitry mounted to or near the branch (four) connector assembly. In other embodiments the motor is controlled by circuitry mounted to or near the main receiver housing. ί Some embodiments place the motor on the part of the concentrator assembly that receives the repair. The motor can be held in place by screws 422 or other components known in the art. Alternatively, the flip cover can inhibit the motor to eliminate 442. The w | 〇 ring 444 is mounted in the 凹槽 凹槽 groove in the bonnet 446 and seals the expansion fluid to prevent leakage. As previously described, alternative low pressure is known. The ~ sealing method is in the art where the nipple 448 is connected to the expansion fluid conduit. In this case, port 450 is discharged to ambient conditions. In a preferred embodiment, the ports are designed to prevent insects, dust and water from entering all of the concentrator locations, and 124234.doc 200818532 excessively restricts fluid flow. Too% receiver (1 〇 4, 2 〇 2, 1 ^ 1, soil 2 υ 2) has the function of converting collected light into electricity, enthalpy, and learning energy. In addition, this can be used to perform the following additional functions: • Detect and report sun tracking errors; • detect, report, and possibly adjust temperature; • detect and report module power performance; • Adjust the shape of the aggregator for maximum power efficiency. One of the present inventions is *you/fed + one, one piece is for cooperation with one or more receivers

Receiver branch used;): Marmot # » i F ~ Strut assembly supplies mechanical support and provides piping for one, one or more elements (including electrical, electronic signals, optics) Signal or Rf? signal, 'digit ## or analog signal); fluid connection (including connection for cooling liquid or heat transfer liquid such as daison salt or fen 1_hot fluid) 'refrigerant (eg ^, pull 'fluorine) Hydrogen and other fluorinated compounds, water, water 盥, _ , antifreeze, anti-corrosion agent, fungicide, de-bathing agent, chlorine, chloramine, etc., one or more of the temple Mixtures, chemical reactants, chemical products, multiphase flow (4), plates and droplet-containing immiscible fluids, bubbles, such as fluorinated coolants, ..., low reactivity fluids and small droplets therein Etc.; gas, for example, air, private, dry air, nitrogen, inert gas, gas, chemical reactants, chemical products, etc., containing steam for repairing and repairing the components of the rubber And solid & U body 'for example, chemical reaction Or products, anti-corrosion agents and the like. Some embodiments of the receiving fence according to the present invention are designed to have flexible features to facilitate installation and maintenance of the damage only to the severe load such as storms. 124234.doc 200818532 Printed circuit board function because the solar cell is in its The peak ν μ, the value of the power efficiency current usually produces ~0·5, so the 矽 solar cell usually + not u must be connected in series to obtain a higher output hair pressure. Non-矽 batteries or multiple connections..^ The pool can produce significantly higher voltages. However, series connections may still be beneficial 7 ^; reducing the need to carry large currents through the system. As used herein, the Pinnacle Puller Board (pCB) contains an insulator with a picture of the surface 5 to its surface, " The conductor can be initially entangled when bonded, and patterned by etching or removing the potential. In other embodiments, the patterning of the conductors can be performed after the singularity of the T. In some embodiments, the patterning can include three-dimensional operations such as dicing, bending, embossing, or squeezing. A number of different methods for connecting cells in series have been commercialized. However, the availability of high-performance full-wafer solar cells with moon-surface metallization (for example, 〇wei C〇lp^ Α·3〇〇 solar cells) creates a solar module that uses tandem processes and designs to manufacture tandem connections. Machine

The Ray ' ^ process and design are designed to provide exceptionally good heat transfer and low series lightning resistance *, , ^ - resistance for the effective conversion of poly wood to % light, or other batteries can be installed in a similar manner (such as three connections) A battery that is metallized on the front or front surface, but requires additional connection to the top electrode and to the top electrode. 4 I. According to one embodiment of the present invention, the wafer or wafer is diced in a rectangular grid and the surface of the die is mounted on the top surface of the printed circuit board by dry material. In an alternative embodiment, such as by high speed machining, small straight miscut, 124234.doc 200818532, jet cutting, bead blasting, Λ 17^- |>, . + ^ ^ 1 water (4) and Other techniques known in the art for cutting brittle materials, /, I, are cut by straight lines or cut into alternative shapes via portions of a curved wafer or wafer. According to a particular embodiment, the process of dividing the wafer into individual dies and then mounting the granules onto a printed circuit board (PCB) occurs without tedious and time consuming alignment steps. In other words, individual dies are mounted directly to the PCB after cutting. This can be done, for example, by using a roll of makeup to directly perform a cut on the shared surface (such as a 'vacuum grip), and then move the PCB to follow in the next or immediately following step. Occurs by the contact of the supported crystal grains. According to one embodiment, a conductive via is formed in the PCB such that the die, as used herein, is a printed circuit board that is bonded to an electrically insulating substrate that is patterned to establish at least one conductive surface of the electrical connection. Two preferred embodiments of the printed circuit board are conventional two- or four-layer printed circuit boards having a plastic insulator or a layer having a high thermal conductivity, an oxide, an aluminum oxide, a tantalum oxide, etc. , two or three layers of printed circuit. The back side is aligned to contact the conductive solder paste overlying the vias. Heat and current flow through the solar cell to the back of the cell to metallize and flow through the solder to the top copper layer of the PCB. At the top copper layer, there is sufficient conductive material to pass the resistance and heat ρ and prevent a voltage drop or temperature drop, respectively. The steel on the top surface therefore dissipates heat and current and provides a series electrical attachment of the grains. The copper traces on the top surface may also have an array of plated through holes that conduct electricity and heat from the top surface of the board to the back side copper. Alternatively, the thermal conductivity of the printed circuit board insulator provides the function of transferring heat to the back side. The backside copper, if present, further distributes the heat over a wide area and provides electrical connection 124234.doc -18 - 200818532. If the back copper is electrically connected to the circuit, the bottom copper is electrically isolated from the conductive material (including: the dielectric material coolant on the surface of the 5). If the back steel touches, the plate or the liquid body coolant is electrically insulated' Thus maintaining a low thermal resistance. Then, it is not necessary to have a liquid printed circuit via a terminal, a hole, or a connector printed circuit board. (4): "From the printed circuit board." I know of other such components. ... The printed circuit board can also contain additional circuitry. The printed circuit board τ according to the consistent embodiment of the present invention includes one or more discrete components, for example, a diode (especially a canister, a ρ-pole), and a battery. Crystals, resistors, transistors, crystals, ceramics, thermistors, thermocouples and varistors. The printed circuit board according to the present embodiment of the present invention may also include one or more integrated circuits, such as a microcontroller, a microprocessor, a programmable logic device, an analog-to-digital converter, an operational amplifier, and a comparator. , digital clocks, Ethernet transmitters, receivers and transceivers, RS485 transmitters, receivers and transceivers, radios (eg '802.11 or other) transmitters, receivers and receivers, current loop transmitters, Receiver and transceiver, differential power, receiver and transceiver, optical connector and absolute or differential pressure sensor. & A printed circuit board in accordance with an embodiment of the present invention may also include one or more circuits that perform a particular function, such as battery voltage and current sensors, total voltage and current sensors, temperature sensors (eg, a circuit, a resistor, a thermistor, a diode, a capacitor, a thermocouple, etc., to provide a signal to adjust the temperature of the 124234.doc -19-200818532 to the actuator, the circuit for adjusting the temperature and Actuators, digital orphan circuits, analog monitoring circuits, digital network connection circuits, circuits for detecting or measuring misdirected or non-equalized illumination using voltages or currents from a plurality of solar cell dies, Another circuit that uses a misdirected sensor (eg, a light sensor, a photonic crystal, a photodiode (piN, a conventional photodiode, etc. or a non-power-loaded solar cell grain temperature sensor) is used.

U - Other examples of circuits that may be present on a circuit board in accordance with an embodiment of the present invention for performing a special task include, but are not limited to, a circuit for converting an output to another DC voltage (sink to this) Converter), a circuit for converting the Dc output to AC dust (DC inverter), a circuit for synchronizing the ac output waveform, 'Rc timing circuit, a circuit for (4) leakage current into the coolant' A circuit for detecting leakage current into the outer casing for conducting a circuit for leaking coolant from the heat exchanger for providing a signal to other circuits or actuators that control the position of the pointing or receiver Circuitry 'to control the position of the concentrator or the position of the receiver and to actuate... to control the focusing characteristics of the receiver, in particular to provide:: the tiger adjusts the expansion dust of the expandable concentrator The circuit of the actuator, the circuit and the actuator that uses the expansion pressure of the expandable concentrator to detect the critical fault circuit 'circuit and actuator for handling critical faults, Use ^ to critical faults and A circuit that electronically reports such faults (eg, polling, when a fault occurs, or periodically). In other embodiments of the invention, one or more of these electronic functions may be separated or printed in a pole assembly that is mounted in the receiver or installed in a service 124234.doc -20-200818532 to the receiver. Executed on the board. The advantages of using multiple printed circuit boards include the ability to replace supporting electronic components without replacing expensive photovoltaic panels, and the ability to optimize the economics of photovoltaic cells and other electronic components by t, reliability, and performance, respectively. The ability to share functionality between multiple receivers (eg, using some circuitry to service two or more receivers and thereby reducing cost, assembly Y part count, etc.). Embodiment of Printed Circuit Board and Wafer Grain Assembly Figure 5 shows a schematic view of a connector having only a terminal and a protective diode in accordance with an embodiment of the present invention. Each square represents a cut sun i pool block. The configuration of the dies corresponds to the configuration on the printed circuit board. In the embodiment of Figure 5, each square represents a cut portion of a back metallized solar cell. There are 56 individual die sections, of which: 4 are connected in series and the two corner blocks are connected in parallel to balance the current (if the illumination is slightly towards the center to reach the peak). Alternatively, the four corner blocks can be used as part of the power circuit or as a separate circuit for detecting the misdirected direction of the solar receiver. The module's nominal output voltage is ~24 V to 30 V. Fig. 6 shows a picture of a solar cell' in which a cut mark is indicated by a thick broken line. The size is in millimeters. Because of the discontinuity of the metallization pattern, it is generally not possible to arbitrarily adjust the grain size without incurring loss of efficiency. Select a substantially square • 曰曰 grain to minimize the number of saw cuts in order to obtain the target voltage. Magnifying the rows and rows of the farthest crystals away from the center grain to accommodate illumination towards the cell ~ peaking and moderate misdirecting by the aggregator results in minimization of performance degradation of 124234.doc 200818532. = Several alternative methods to handle non-uniform illumination distribution. For example, the actual IL is more; the pattern is cut so that the light flux that falls on each cell is equal. Alternatively, you can use I to connect multiple cutting cells so that the combined flux on the die group is essentially... or 'reuse the optical technology to redistribute light, for example, secondary and tertiary Optical components, imaging and non-imaging optics, ribs m ^ _ ^ and 4 components, and any combination of techniques. : In some embodiments, the grain geometry is circular. Other examples are advantageous. The area between the circles or the axis is symmetrically cut in an axisymmetric shape. From:: to FIG. 7D shows a cross-sectional example of a printed circuit board according to an embodiment of the present invention. Figure 7A shows the holes in the mask that are not broken. In other embodiments, the temple holes may be extremely elongated strips or the like to provide optimal electrical, mechanical, and thermal cooperation with the die. “The solder (four) board design roughly corresponds to the solder mask design, but can be (for example) ^: two fills the solder on the genus battery required to make the corner into a circle = u (four) board or fill the excess or not filled with solder mask The cover holes are independently tuned to optimize the final tan shape and to improve the stenciling process and template life. Also: by adding a suitable solder mask to the back of the solar cell: ^: 烊枓 Flow 'however' this practice increases the possible unadjusted assembly and processing steps. Show the holes in the printed circuit board. Each hole has copper to be an effective heat and current conduit through the printed f-plate. A large number of holes are intended to reduce the thermal resistance from the moon to the moon and reduce the change in the surface temperature of the solar cell. Other embodiments eliminate this array of holes by providing sufficient heat flux through the dielectric material of the printed circuit 124234.doc -22 - 200818532. Ideally, each hole of the ore is a occlusive material to fill the pores. If the hole is filled or 'available solder or sealed _ material', then the rectangular solder mask pad is shown, and the more solid shape is used to supply the solar cell. Figure 7C shows the top of the printed circuit board and the S π is not the same as the design of the Α-300. The top copper traces have substantially the same width and thickness for high concentration factor. The trace effectively conducts electricity. Alternatively, the relative width of the traces may be squared so that the back side of the solar cell is: and the conductance is more equal to the copper on the top surface of the printed circuit board: the tantalum line establishes the series connection of the crystal grains Part and will be from the battery, 4 is more evenly distributed to the path. Figure: D shows the copper layer at the bottom of the printed circuit board. Moreover, the traces are overlaid on the entire back side of the board, and there is only an interruption to establish isolation and connectivity between the dies. In other embodiments, there may be no lunar copper or backside copper electrically isolated from the solar cell. In some embodiments, a top view of the assembled die on the printed circuit board shown in Figure 7 can be formed in the inner layer of the printed circuit board as is known in the art. The weld area is aligned with the metallization of the back side of the solar cell. The alignment of the die with the traces on the board is important. In the case where the solder resist material is not placed on the back side of the solar cell 2, the surface tension of the solder does not provide a good self-centering force. The best is to ensure that the die is precisely positioned when it first contacts the solder paste. a 124234.doc -23 - 200818532 Figure 9 shows an example embodiment of a cross section of a fabricated panel. Heat and current flow from the rounded die through the copper traces and through the solder. & through the passage, the steel on the lunar surface, which is liquid-cooled via an electrical insulator that provides good heat transfer. Alternatively, heat is transferred via a high thermal conductivity insulator (in addition to or in place of a plurality of vias). In some embodiments, the back side of the printed circuit board is electrically isolated from the front side and is in direct contact with a modified, heat transfer coolant. In one of these embodiments

In the case of a fall, the face can be electrically connected to the ground. In other embodiments, the back side can be electrically connected to a low bias to inhibit corrosion or fouling. The optically transparent cover and coolant pressure from the back can create undue stress or strain on the printed circuit board and photovoltaic power generation assembly. In some embodiments of the invention, an optically transparent element or assembly that abuts or is joined to the front side of the photovoltaic power generation assembly can help the assembly resist internal pressure. This component can be adjacent to a photovoltaic material, conductor, insulator or electronic component that is mounted to the front surface or to the surface of the copper or to the printed circuit board insulator itself. The element can abut any part of the front surface at a plurality of points, over a plurality of areas, or on the unfolded surface, and the abutting surface of the transparent element contains geometric features to perform the positioning. These features can be cast, stamped, deposited or processed into transparent elements in some embodiments. In other embodiments, all or part of the tamper assembly: knife: cast or bent in place. In other embodiments, a clearing agent (e.g., epoxy) is used to join the transparent elements in place. In some embodiments, the transparent element further provides the function of redirecting light to the active area of the 124234.doc -24-200818532 green power generation assembly to increase efficiency. This transparent element redistributes the illumination further or refracting to improve the uniformity of illumination or the balance of illumination on different grains. The transparent element may further provide spectral dispersion through refractive index or via diffraction to enhance the effect of different spectral optimizations in the spatial position of the photovoltaic power generation assembly. Some regions of the 7C component may be It functions from a metallized surface, a multilayer optical coating, total internal reflection, and the like. ' Ο This element - the embodiment contains at least one hologram or diffraction while providing this # optical function - ^ 2 4 parts can be dusted, printed, engraved or deposited in transparent components In this example, the diffractive element can be generated via patterning (eg, hunting or implantation by ions or particles, implantation, sputum, etc.). SI茔A π π丄, chemical anti-α can be further known in the art (including soft lithography etching, rubber stamping, conventional lithography etching, etc.) such transparent elements can be further provided, for example, in processing, c Protection against damage (wind) μ %~ Progress k for blocking or sealing of moisture, bag, milk, etc., and can provide features for aligning or aligning the external optical τ yak. Can be provided for receiving: clothing assembly and for maintenance or replacement °, convenient for more flying sounds. This 7M cattle surface can have - anti-reflection or eve ... & layer or early layer or multilayer An optical coating to enhance or create the optical function of the element. And additionally or otherwise 'may use a non-contiguous photovoltaic power generation assembly as described above - or a plurality of other optical components. Rigidly ~ such components. Yuan # 1 + ten π, ^ 4 70 pieces or deployable parts can be fixed or reversible. These elements can be passively provided by 124234.doc -25- 200818532 or by active control. A solar energy conversion is not for the light of the power generation, #, Applications such as the articulation & 70-piece operation of image stabilization optics may also be useful. The vacuum assisted assembly and alignment fixture embodiment is intended to include previously cut or broken wafers. As well as the complete wafer, the limit is one thousand for its size larger than the size of the wafer block that will be used in the module, referred to herein as the die.

The wafer is usually cut on the weak tape of the early use in the field. The tape can be easily removed by using the UV-ray or the 0 ± w 77 m heat-selective tape. Unfortunately, this sound A± g rh y is designed to be expensive consumer products and does not contribute to subsequent installations on printed circuit boards. Moreover, the process of accurately aligning the wafers in the cutter without the alignment tool can be easily spent more time than the actual cutting operation. Only 1 D, Cut Figure 10A and Figure 10B respectively show the plan and cross-section of the person ", < Bay example, the class name, yoshi π,,,,,,,,,,,, Promote cutting in the case of a sexual cutting tape

The fast and accurate S on the cutting machine is 0 日 and the position of the die on the printed circuit board. Demonstrated - wafer cutting and printed circuit board alignment fixture alignment aids, shared straights % 4, dead gamma * hold, use real source or inflator, and one individual vacuum port per die . i The fixture optionally contains a mount on the wafer traversing device to avoid having to perform an excessive (four) alignment operation on each wafer. This fine-and repeatable precision positioner (for example, the movement of balls, pins, _ and holes along the edge or mechanical movement; θ / -V, 4 〇 /,, 丄 "plates and / or pins") During the cutting process, the true chuck assembly is accurately held at the appropriate position. The vacuum chuck is held by the force 124234.doc '26- 200818532 (for example, 'spring tension) Gravity, open, straight 1):: 乂Electric force, friction work 4) Retained in the proper position. Vacuum chuck assembly (individual or 曰 曰, 叮蜀 叮蜀 曰曰囫 曰曰囫 cutting mounting bracket combined) Providing a simple alignment of the crystal mouth with respect to the chuck via a solid movable or retractable pin, a rounded tilting plate, and/or the like. A plus-part...to- The wafer 'is stabilized by the vacuum port under the area between the ground and the solid. The circle is said to be made of an elastic material (such as nitrile, buna, buckwheat, fluorinated elastomer). Etc.) Reduced by making a vacuum cleaner II. At least one vacuum port is located at each

#母家斤 Keep the grain below. Use more than one vacuum porting element per U to "rut" because it provides more uniform and 'solid grain holding while preventing grain warping. Perform post-wafer processing at the appropriate time in the sequence (eg , welding k-shield or welded bumps. Example + pile" For example and 1 2 3 4 5, it is preferred to apply a weld ~ cover ' before cutting and the solder bumps can be performed before or after cutting. :: Multi-die modules can be made from one wafer by a plurality of discrete or separable vacuums: after multiple regions of the solar cell, rather than across the entire wafer: chuck. Similarly, the vacuum chuck can be used on a sub-area of the wafer. Or, one to ten" use routing and retain" or "scratch, •27-1 and snaP)" technology to configure a printed circuit board on a panel 3 W, thus a vacuum At the same time, it provides a plurality of plates of quasi-stones. S g H, 4 (9) boards are placed in the sun. After welding, this

Separate from each other. J 5 In addition, the same vacuum source or 124234.doc 200818532 inflator can be used for multiple wafers and multiple printed circuit boards. This configuration is especially suitable for, for example, non-transport furnace special application configurations, zinc 々k + W w1. Batch reflow operation in an external line or hot air heater The wafer alignment feature reduces the built-in alignment tolerances in wafer beading. ν „ As this helps, once the wafer or its die is partially handled, the solid _ in the proper position of the wafer alignment feature no longer has to be on the chuck: the wafer can be clamped Load the disc into the vacuum tray before or after loading into the mounting bracket. After 4, 4, in order to prepare for the dry-cut solar cell, the printed circuit board allows the solder paste and possibly the adhesive to be printed or otherwise In order to speed up this (4), the board J can be used for the printed circuit board. For example, the electric (4) has the mechanical characteristics that point to the characteristics of the vacuum loss: the month (the position and the hole of the appropriate size, Precisely route the edges, etc.) = Solder the die to the printed circuit board 'The board is placed substantially straight down: on day 4' or vice versa. When the grain and the tin-tin f are the only substantial lateral movements along the metal The long axis movement of the electrode (:: in). This placement can be performed by holding, moving or aligning the guiding device in the chuck, articulating the line, or placing the circuit by hand. All the cookware and optical reference marks and garments of the mechanical guides I Shisi combines and automates. If the board contains a strong enough adhesive or the solder paste is sufficiently viscous, it may be placed in the 4 k, 4 AP, which has been gradually released from the air to the vacuum. After removing the true: non-containing strong enough adhesive or solder paste is not enough, it may be necessary to operate the vacuum chuck during the reflow operation. If so, 124234.doc -28 - 200818532 f can be used to return to the furnace temperature It is important to design the vacuum chuck for the material. In general, the polysulfide and some fluorinated elastomers are good for vacuum coils: = in reflow soldering in conveyor chain reflow ovens and other furnaces It is not convenient to empty the two during the procedure. It is useful to quickly disconnect the vacuum from the valve or the external valve, but in other respects, the valves must be able to withstand the temperature of the reflow oven. Care should be taken (4) Free printed circuit board During the welding procedure (4) For this purpose, rigid mechanical baffles and clamps can be used. It is possible to solder additional electronic components to each side of the printed circuit board before or after the tandem cell die, with the following restrictions: Correct Design a vacuum chuck, The problem associated with the simultaneous soldering of all components is that if a vacuum chuck is used, then the usual need for lubricity may be beneficial in conjunction with reflow soldering; Additional cost and assembly steps.

Force ΠΓ = avoiding the tortuosity caused by thermal expansion mismatch and examples of mechanical applications = the use of steel or other relatively low temperature aluminum * r knowledge, the use of materials with a small rate of thermal expansion (such as oxygen Hold: _ or oxidized brush circuit board insulator) 'will grain size i:': increase the strain by limiting the accumulation, and pre-add the I7 brush or mechanically constrained printed circuit board during the splicing. Among these technologies, the latter two are more expensive than the traditional ones. ΪΓ Because the special details are usually higher than the h: level or higher cost. The low thermal expansion material is expensive for the road board material. Low (four) Kenting j has other advantages, such as j good intrinsic heat transfer, the superior i24234.d〇 ( -29- 200818532 points offset its higher price. The higher price of the material can also be eliminated by eliminating the disk on the board The cost associated with the introduction of the thermal path in the substrate is offset by the cost of reducing the grain size for additional ore cuts and relatively more damaged grain surfaces. 0 can be heated by using reusable fixtures or special applications. To impose mechanical constraints. This fixture is also Using such a vacuum plate having a grain loss * linear distortion is of the cool plate - the precise configurations Pan shell or out point of the layer structure, which

The printed circuit board and wafer die in C are accurately positioned in the center of the fixture in three dimensions. Embodiments of Electrical Insulation of Modules The cooled back side of the board has a live electrical connection of up to tens of volts relative to each other and up to hundreds or thousands of volts relative to the ground. ^The coolant is electrically conductive (for example, groundwater or self-hydrophobic water), and the backside copper can be electrically insulated from the coolant by using a thin dielectric layer that is impermeable to the coolant and coolant impurities or additives and is inert to the materials. , as shown in Figure 9. This dielectric does not excessively resist heat transfer from copper to coolant. Fortunately, a relatively thin film of dielectric (e.g., < 丨 to 100 μπι) is resistant to the electrical power experienced in a typical solar module. The dielectric layer may alternatively be a thin layer of dielectric heat transfer liquid or heat transfer grease, gel, epoxy or solid that is isolated from the primary coolant by a low thermal resistance separator. The cost and complexity of this secondary cooling liquid can be adjusted if the primary coolant is particularly corrosive (10), brine) and the temperature is relatively high (eg, boiling)' or if metals such as lead, indium, gallium, and the like The possibility of immersion into the water source is unacceptable, for example, if hot water is used for domestic purposes and irrigation 124234.doc -30- 200818532. Separator or other printed circuit board reinforcements may also be necessary if high coolant pressure or pressure spikes must be tolerated. / As previously described, one embodiment of this electrical insulator is a printed circuit board insulator of sufficient thermal conductivity. Since suitable materials are generally brittle, the dielectric shell may have cracks and pinholes during its useful life. These cracks may not directly compromise electrical insulation, but when wetted with coolant, the cracks provide ion channels that can leak current and result in a shortened service life or possible electrical safety hazard. To prevent the coolant from reaching the dielectric, a ductile or flexible surface with low thermal impedance can be applied to the printed circuit board dielectric. Since steel has outstanding thermal performance and service life in many related cold agents (for example, water, as the case may have additives such as pH control agents, buffers, decay button inhibitors, and the like), the preferred material is a copper layer. . In some embodiments, the copper may be plated with, for example, gold or other metals for additional protection. Embodiments of the cooling system from the point of view of system design, it is necessary to place high-intensity solar radiation on the photovoltaic power generation battery' because this reduces the amount of expensive photovoltaic power generation material in the system, and reaches a certain level, this can be Increase the conversion efficiency of the battery =. However, the portion of the incident sunlight that is not converted into electricity by the photovoltaic power generation cell is absorbed and converted into heat. Since the electrical conversion efficiency of a conventional photovoltaic power generation cell decreases as the temperature increases, it is required that the system include a heat exchanger that can remove heat from the battery: the temperature of the battery is kept as low as possible. In fact, in the case of extremely high solar intensities, system survival requires efficient heat removal. The key to effective heat removal is to keep the distance that heat must flow through as small as 124234.doc 200818532. This results in a heat exchanger having a small physical size. The printed circuit board or the back side of the divider may have features of pins, channels or other geometric features well known in the art to enhance heat transfer, but these features add significantly to the cost of the module. - A substantially flat plate or a substantially flat insulating back surface of a printed circuit board is used in accordance with an embodiment of the present invention. The self-leveling plate of the self-leveling plate can be enhanced by any combination of eddy current, forced convection, nuclear boiling and film boiling. In order to reduce the total receiver module cost and the cost of the pumping system and its operation, it may be necessary to cool the solar module with the lowest possible flow rate and pressure drop. Typically, a highly disturbing flow is used to extract the hot liquid from the wall out of order via the entirety of the liquid. Most liquid heat exchangers used for solar cooling use cold officials, which require high Reynolds numbers (Reyn〇ids ν to benefit from the transfer of hot liquid from the wall based on (iv). When the number is improved, the pressure drop is increased. If the Reynolds number is constant and the channel diameter is increased, the required flow rate is increased. - An alternative immersion jet or medium in accordance with the present invention is also called , the perforated plate, the splitter or the separator) to produce a cold liquid to the surface of the habitual value 彡 too m conveyed and when implemented, the Reynolds number and flow rate are much smaller than originally Since the transmission of eddy currents. The cold liquid is fed to the person by a pressure differential. The inlet plenum is opened by a divider and an outlet inflation portion, which are referred to herein as: preferably a plurality of holes. Two = = Adjusted according to the coolant flow rate to ensure that the water is filled from the inlet to fill the hole. This cooling method is also commonly referred to as 124234.doc -32 - 200818532 for "Jet Impact" cooling. In such jet impingement cooling, 1/8 to 8 times the pitch of the orifice to be A 或 or the center of mind: the surface is located at a distance from the head of the showerhead and the surface to be cooled can be substantially flat: Pinch 2 to 〇〇 double. The flow in the direction of the hole of the shower is one to make a curve, so that the jet of the jet causes the flow of hot water to be zero or otherwise tortoise. Or fill the inlet from the inflator to the outlet ~ This temple seals the outer edge of the shower head. Small 'is not existed: there is a possibility that the self-power module removes heat with the same possibility, but uses the method of shooting (four) (four) ^ low, his method is simple, low pressure drop and low formation;: in most of its area heat The transfer is optimal, and the "short flow path jet impact with a number of south W stresses allows for a high heat transfer system J=! The heat exchanger utilizes an array of liquid or gas jets impinging on the surface to act on the fluid and the surface Transfer heat. According to the - actual, 'body is removed from the back of the photovoltaic power module, the hot liquid is cold, soil, M shot k can be formed using holes (nozzles) in the perforated plate, after moving into the perforated plate The plenum flows through the nozzle and impinges on the surface of the temple, σ卩. The jet can be submerged (that is, the jet emerges from the nozzle into the surrounding area of the same liquid), so that the array is equally executed regardless of its relative Orientation of gravity. After the stage passes through the perforated plate and impinges on the cooling surface, the overall flow passes through the slot leaving the exchanger to the side of the jet array. In the embodiment of the receiver - the coolant outlet is below the inlet, Therefore only It is necessary to measure the hammer on one side of the heat exchanger 124234.doc -33 - 200818532. Keep the return flow in the input flow hood, which protects the load input: the flow line acts as a protection w input "agent line is not overflow receiver" Any solar radiation on the side of the module, 彖, can be placed on the insulation frame 0' to provide additional protection against stray solar radiation. :: Maximum heat transfer between the coolant and the cooling surface. The distance between the jet nozzles and the cooling surface should be approximately equal to the length of the jet flow. For a given jet geometry and flow rate, it has been shown that the ideal distance between the jet and the cold surface is in the range of 55 times the jet diameter. See 黯tin, m- job stransferbeiween n^pmgmg gas jets and solid surfaces'*, Advances in heat I, Vol. 13 'pages 1 to 60, may be noted, when properly scaling the Reynolds number and the Prandtl number (PrandtlNumber The gas and liquid jet impact performance is predicted to be similar. One embodiment of the receiver heat exchanger comprises a showerhead made of a thin metal plate which has been repeatedly punched into a plurality of holes and which are made into a leak-proof sheet metal case, can, by means of spotting, finger-stacking or welding or the like. Or other envelopes that provide for the mounting of printed circuit boards and solar modules, as well as inlet and outlet coolant lines. Another preferred embodiment of the showerhead is a similar physical configuration of the showerhead with a box or cylinder, wherein the cartridge or the cylinder is injection molded or cast into a high temperature resistant plastic by a suitable filler or a metal such as zinc and di gold. , ρΕτ, PEEK, PPS, PVF, PTFE, acetal or polyoxyl). In other embodiments, materials having a lower operating temperature may be used, particularly where the temperature of the coolant is suitably maintained low and the plastic material itself is shielded from the concentrated solar radiation by occlusion = I24234.doc -34 - 200818532 Materials include nylon, =,,, ethylene, and, and two other materials known in the art of injection molding. It can be used for low cost, dimensional stability, strength, long-term phase with coolant, and UV energy (if unshielded). Or go and conceal these materials according to the direct, reflective or concentrated sun. 4, the coating, the dust layer or other jets from the outlet of the array close to the array undergoes a higher velocity than the jet exiting the exit region (the flow velocity of the main body is lower), which may affect the heat transfer. The jet rushes < g 3 sex. The enthalpy outflow speed can be low by the system, which is attributed to the higher dust drop necessary to drive the flow. The difference in force required to drive out the flow results in a change in the force on the jet array. “The pressure drop across the jet nozzle is not significantly greater than the right-handed.” The coolant flow distribution in the barrier may be uneven. Moreover, even if it is more than the eve of the night, the seventh & ... and change the mouth, the slave's fork flow can lead to a higher heat transfer coefficient, but because of the photovoltaic power generation ^ ^ ^ ^ ^ ^ ^ ^ ^... The current generated by the weakest battery is limited to the current, so the heat transfer coefficient does not result in low efficiency. "" Figure 12A shows an assembly view of a jet impingement cold cooling example as mounted to one of the struts (d). Element 12 〇 2 is the main body of the chiller assembly, which is ejected from plastic, formed, cast from metal or plastic, or processed or formed from metal or plastic by some other means. A component 1206 is external to the plate, and a cooling jet is internally impacted thereon. As shown, the component is made of a ceramic substrate and the edges are scribed and: segmented into 124234.doc -35 - 200818532 final form. In alternative embodiments, the components may be formed by other methods (e.g., by laser cutting) and/or may be of different materials (e.g., fiberglass and epoxy circuit boards). The active area of the receiver is depicted by element 1208. Here, the energy from the solar collector falls on the photovoltaic array and can be cooled by jet impingement: to remove excess heat. An optically transparent cover that may also be an element of this embodiment is not depicted; the cover may be used to press the plate 1206 through the attachment aperture 1210 or by other members (e.g., clamps) against the body 1202. Element 1212 is the optional attachment point for the receiver module cable (same as component 3丨2 of Figure 3). Figure 12A shows an exploded view of the embodiment of Figure 12A. The struts 丨2〇4 have been removed to expose the 〇-shaped ring 1214 and the 环-shaped ring recess 1 2 1 2 of the interface of the seal and the rod heat exchanger. The hole 丨2丨6 received as a struts is used to attach the struts to the body of the heat exchanger. The plate 12〇6 of Fig. 12 has been removed to expose the perforated plate 122, which should normally be pressed into the body of the heat exchanger and against the projections 12 18 .

The flange feature 1 222 provides stiffness to the perforated plate and provides an interference fit between the flange and the heat exchanger body without the risk of fluctuating the perforated plate itself. The fit between the flange 1 222 and the heat exchanger body also seals the edges of the perforated plates to ensure that most of the flow passes through the holes in the plates. Embodiments of the heat exchanger may have a body cast perforated plate or a perforated plate welded or bonded to a suitable location. The advantage of using a compression seal is the ability to remove a multi-well plate (e.g., replace or repair a plate). The advantage of manufacturing a panel that is separate from the outer casing body is the ability to independently optimize the choice of panel and casing material and the ability to repair or replace the panel. Alternatively, the repair of the panel can be performed via the access door or cover in the housing shown in the figure. Element 1224 depicts the g-out portion through which the coolant exits the jet array and enters the outlet plenum 1 226. Element 1228 is a sealing surface between the cooling plate η% (see FIG. 12A) and the body of the heat exchanger; the sealing can be via the use of a gasket, a Ο-ring, a chemical bond (eg, an RTV polyoxygen sealant) or Other components are reached. The plates may alternatively be held in slots or features molded or machined into the outer casing or by a variety of other techniques known in the art. Figure 13A shows a side view of an embodiment of a jet impingement cooler, and Figure 13B shows a bottom view of the same embodiment. In both figures, the two lines indicated by η(d) depict the symbolic path of the flow through the heat exchanger. Select the path shown to illustrate the operation of the device and the paths do not indicate the exact flow pattern (ie, 'X port flow may be full, so that different fluid particles passing through the same point in the inlet tube can stand upright through the perforated plate Different holes in the middle). The flow begins at the right end of the figure UA in the inlet tube 13〇6 of the strut; the flow then enters the inflator above the perforated plate 1308. The flow then passes through the aperture in the manifold, impinges on the cooling surface 131() and then flows to the right, where it exits the array, enters the lip 1312 and enters the outlet plenum 1314. Since then, 'flow through the struts outlet pipe' to leave the system. In some embodiments of the jet impingement cooler, the jet nozzle extends out of the perforated plate surface 'allowing an optimum distance between the nozzle outlet and the cooling surface while still maintaining a large space between the surface of the perforated plate and the cooling surface 124234.doc -37- 200818532 1) Since the perforated plate is no longer simple, the surface of the perforated plate is rigid and rigid (this is important for the pressure drop distance on the perforated plate). 2) Between the slab and the cooling plate 2) For the perforated plate made of metal, the stamping of the structure of the outer surface of the α, 44αι ^ 瑕 thousand surface provides a chance to process the material, thereby adding/adding the part 3) The lower outflow of coolant due to the coolant of the endangered downtime array due to the larger outflow area. The advantage is attributed to the more uniform injection speed/pressure difference generated in the column of the drive outflow. Therefore, the heat transfer change on the jet array is also reduced in the array. Speed 4) The entrainment of the nozzle through the surface of the perforated plate, and the "thumbs around the cold agent to the jet", "," remove the process Efficiency (remove more heat per unit of fluid via heat _ twitching). σ 5) where the perforated plate is not an integral part of the heat exchanger casing, and the increased spacing between the perforated plate and the cooling surface allows for the side of the array 1 to support the side of the panel The space of the shelf is allowed to simultaneously allow the slot to have a sufficient height to cool the area and enter the outlet plenum. Then the 射 leave the jet impact array. The small struts can be used to help support the perforated plate to prevent hot spots from appearing on the surface of the crotch under the struts that must be small; the thermal conductivity of the material that is used to make the chill plate. The struts can be formed simultaneously with the above-described extended jet nozzles by means of a plastic injection molding and metal forming process. The maximum displacement of the 疋 疋 在 在 文 文 文 文 文 文 文 文 文 文 文 文 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 最大 。 124 124 124 124 124 124 124 124 124 124 124 124 124 124 124 124 124 Therefore, the maximum allowable displacement of the coolant required to flow through the nozzle is reduced by a distance of - eighty-one - one of the knives, which may reduce the thickness of the perforated plate by a factor of two. A pillar at the center allows the thickness of the panel to be reduced by a factor of two - all other conditions being equal. It is desirable to place additional struts so that the number of struts of the largest unreceived old body nozzles... "allows as far as possible from the jets, struts to avoid interference with heat transfer. (Figure Μ shows the perforated plate 14 〇 2 Embodiments containing a nozzle (in this case a hole) i4_ and a % edge holder 1406 'insulation frame just against the pressure on the plate to assist the support plate. In an alternative embodiment, the insulation frame is to the cooling plate instead of the porous The positive insulation σ can be made of a heat-conducting material and can be joined to the cold heading plate or an integral part of the cooling plate by a low thermal resistance joint. In any of these conditions, the insulating frame can be provided. The enhanced heat transfer and the effect of the support of the perforated plate may alternatively be by a suitable f-curve, mesh, punch = sheet 4 (especially for example copper and its alloys having good thermal conductivity and inertness) Executing. h Figure 15 shows a perforated plate body with an extended nozzle, with element 1504 being two...] Element 1 502 is a nozzle extending from the plate at noon 04. At the bottom of the figure

How does the Hi extension nozzle allow a small distance between the nozzle outlet and the cooling surface (10)? At the same time, the magnification of the side view is smaller, and the larger distance between the orifice plate and the cooling surface, //, is enlarged. & s i & r and have ...,,,. The flow of the moon in the jet 1 506 leaving the nozzle 15 〇 4 has a ▼, the same degree as the flow out of the array, as depicted in Route 1 508. "τ There are two embodiments of the insulating frame and the extending nozzle. The component I24234.doc •39- 200818532 】6 02 presses the surface of the mountain seal against the inside of the heat exchanger body, and the component is cut into the body of the heat exchanger The protruding part and the mm part are fixed to fix the positioning of the perforated plate. Element 1606 Daypiece 608 is an insulating frame. f Figure I 7A shows one of the perforated plates used in the jet impingement heat exchanger instead of the silver example 'where the flow wears The tube (element 17〇2) at the center of the plate returns to the symbol of the fluid particles passing through one of the extended nozzles 1706, impacting on the cooling surface (see:) and then exiting the jet array through the tube Route 1 704 depicts the flow. In this embodiment The air can flow out of the system by the outlet pipe from the pointing-side (or preferably, as far as possible away). Once the air has passed through the perforated plate to the downstream side of the plate, the heat exchanger can be pointed straight up. The outlet tube is redirected and the remaining air on the low pressure side of the perforated plate will exit at the tube through tube 1 720. This embodiment provides the advantage that as long as there is a check valve that prevents reverse flow through heat exchange 'And the exit officer is between horizontal and vertical (allowing the horizon of the sun to traverse the horizon), the & leak in the coolant circuit outside the heat exchanger is not possible to take all the coolant from the heat exchanger body. At least All of the coolant below the plane of the outlet tube will remain in the heat exchanger. This residual coolant provides fail-safe time that can be turned off when the solar collector system is shut down due to permanent damage due to a coolant loss accident. 5) 1 7 B is not similar to the embodiment of the porous plate of the same Ί § 夕 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 ' ' 但 ' ' ' ' ' 。 。 At the center of the perforated plate, at the outlet tube 17〇8, 124234.doc -40-200818532 and the channels can be made large enough to prevent any of the surface tension channels in the presence of air in the system. The symbolic route 1712 of the fluid particles shows one of the teeth over the squirt, the particle trajectory impacting on the cooling surface (not shown) and then up through the return channel, ultimately reaching the outlet tube 1708. Release of this embodiment The method of air is the same as that used in the embodiment of Figure 17A, but the presence of the passage helps to quickly remove any air bubbles from the system. The behavior of the coolant loss accident is substantially the same as the embodiment of Figure 17A. The channels in this embodiment provide additional stiffness to the multiwell plate. However, the pocket formed by the passage around the nozzle requires that the flow in the exchanger be sharply deflected before passing through the nozzle. Such sharp turns can produce a non-uniform distribution of the flow through the nozzle. This phenomenon can be mitigated by designing the pore diameter and flow rate such that the pressure drop across the perforated plate is significantly greater than the dynamic pressure of the flow into the plenum above the perforated plate. The pattern of the nozzles in the perforated plate of Fig. 17B is rectangular, and the pattern of holes in the other embodiments shown is already triangular. The pattern of nozzles in the perforated plate can be varied as needed to accommodate requirements such as packaging. Alternatively, the density of the nozzles in the perforated plate can be adjusted to accommodate the pattern of heat transfer from the cooling plate. Alternatively, the pore size distribution, nozzle to plate distance, etc. can be varied to produce the desired heat flux distribution. Embodiments of the jet impingement cooler described herein may have the following features. The expected cooling area can be from 1 〇 cm to 15 cm in diameter. The nozzle diameter is expected to be in the range of 0.5 mm to 2.0 mm. The nozzle exit to the cooling surface is expected to have a nozzle diameter of 4 to 12 times. The inter-nozzle spacing is expected to be 5 mm to 20 mm. The expected flow rate can range from 234 8 to 8 liters of coolant per minute to 124 234.doc -41 - 200818532 to remove heat from i kW to 3 kw. The expected heat transfer coefficient of the cooler can range from 0. 25 to 4 W7 (Kcm2). Since the orifice in the shower head may block or the plug can accumulate especially on the surface to be cooled, it is preferred (for example) that there are openings or holes in the second or second part or by providing partial disassembly and re-installation in this field. The assembly and promotion of the cleaning and maintenance of the receiver assembly in this field. This provision is complicated by the fact that it must be operated at high temperatures and a wide temperature range (including freezing temperatures without any liquid or vapor leakage). A receiver that provides access to such a service is configured as a two-part 〇-ring or sealed-ring assembly. If the part is injection molded from plastic, the area that is at least close to the 〇-ring or the sealing rim can be reinforced with a material with a low thermal screw (such as ^ metal, fiberglass, Kevlar fiber or carbon fiber). Seal or circumferential seal. For a 0-ring, the circumferential seal appears to have the advantage of low cost and convenience. By way of example, one embodiment of the receiver assembly includes two short cylindrical segments as shown in FIG. Printed circuit boards, electrical, electronic, and receiver modules are mounted and fluidly connected to a cylinder. Alternatively, the cylinder has an end cap and possibly a knurling feature' and an injection forming snail, text or bayonet release fitting f that cooperates with complementary features on the other cylinder. In one embodiment, the 'two of the cylinders' hold the 0-ring in the 0-ring groove (preferably under a weak tension along the outside of the cylinder). Next, the repair and inspection of the heat exchanger requires only a cylindrical shape." Partially flipped or a few flips of the cover may be followed by removal of the injection molded or sheet metal showerhead type. The anti-seal is reliable and relatively tolerant of dimensional error and creep, 124234.doc -42- 200818532 The reliability of the seal can be compromised by excessive swelling or thermal screwing of the housing of the receiver assembly. The cost of the 0-ring tends to be higher than other sealing options such as gaskets. An alternative embodiment uses a gasket-type face seal (such as a cap seal:: instead of a 〇-ring. Cap method or permission for a project for wide temperature service: a good commercial benefit of metal and plastic cover' However, the designer or the creator must ensure that there is sufficient preload on the rim to prevent the snail from becoming snail and the leakage after the viscoelastic relaxation. The method of moving the teeth depends on the coolant inlet pipe and the outlet pipe. Again, the embodiment on the same side. The system can normally be operated in a closed circuit. However, if air enters the coolant line (for example, during construction or during 隹1U), the system will have to be emptied to ensure that all The heat exchanger operates at maximum efficiency. The manner in which the evacuation procedure is performed is to turn the system over so that the inlet is in the L' porous, and the remaining air on the upstream side moves to the far end of the jet array, leaving the inlet and Forced to pass through the perforated plate to the downstream of the heat exchanger, the system is turned over so that the remaining air on the downstream side of the upper plate and the perforated plate is driven toward the outlet and out of the exchanger. : The system of one embodiment of a heat exchanger in Xi comprises the parallel connection

索 V EE rate, 曰,. This configuration results in a higher mass flow rate through the system: 彳 The pressure drop in the cooling system will decrease compared to the series configuration. /V Φ)Ι tV 'it only passes through a heat exchange before changing to crying, back to the secondary heat exchanger or storage tank, and the brothers flatten the flow also resulting in a lower peak temperature. In the form of a storage tank /, the coolant can flow through the system at night to exclude the daytime storage of 124234.doc -43 - 200818532 :, 'live in the atmosphere and supply coolant to the gathering... between the officials. Parallel connection of the heat exchanger also ensures that: the exchange of crying, - the gas does not pass before the departure of the system, any air in the middle of the second ~ the lower sink of the king of the smashing valve can be included in the dispute..., σ . Has a discharge to the cooling system. ^In order to prevent air to (4) and return to the receiver struts "A and 18B show the embodiment of the struts, the remaining function; the integration of the coolant from the receiver head to the receiver head And the flow in Figure 18A 'coolant tube (10) is combined with its side 1 804. This design is compatible with the construction of &amp;, 'see,,'. Squeeze of private or extrudable metal alloys In the figure, the structure of the structure carries some of the key access ports and outlets. 6. This design is compatible with injection molding as a part that can be paired to form a finished total shell. Figure 19 shows a more detailed embodiment of a strut assembly with additional features necessary for a functional solar harvesting system. The coolant inlet tube 19〇2 and the outlet side are combined with the windings, sides, 1910 and 1912, which reflect the necessary positive and negative power, signal and ground lines carried to the receiver head. The coolant tube can be made of plastic, composite or metal material. In the case where the coolant tube of the strut is made of a non-conductive material, a grounding wire is required. The ground wire must remain separate from the positive and negative power lines because the PV array can operate away from the ground potential; in the case of coolant vapor leaks or other faults, the ground wire will prevent the entire system from reaching dangerous high currents. -44 - 200818532 bit. Element 1914 of Figure 19 depicts the joint between the strut and the receiver head assembly. :: Mechanical and fluid connections to the end. The component DM is shown to be connected to the electronic portion of the receiving head. The component 1918 displays the possible attachment points of the tensioning cable for holding the receiver head in place. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; . Therefore, the present invention is not limited to the specific application of the female φRg jin, but is limited only by the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows the design of an embodiment of a finisher system for use in the case of an expanded solar concentrator. 2 shows a view of details of a receiver system in accordance with an embodiment of the present invention. That is, Fig. 3 shows a diagonal view of the receiver system of Fig. 2, and a material is removed to expose the struts of the embodiment according to the present invention. 2 Figure 4 shows the assembly drawing of the splicing mechanism of the shackle. The figure shows an exploded view of the strut coupling mechanism shown in FIG. Figure 5 is a simplified schematic diagram of an embodiment of a solar module power circuit in accordance with an embodiment of the present invention. Figure 6 shows a simplified schematic of one embodiment of a solar cell cutting pattern. Figure 7A shows a detailed view of a printed t-layer W paste and mask regions in accordance with an embodiment of the present invention. Dry matter 124234.doc 200818532 Figure 7B shows a detailed view in accordance with the present invention. Figure 7C shows a detailed view of a layer of a printed circuit board that is not in accordance with an embodiment of the present invention. Figure 7D shows a detailed view of the present layer. Figure 8 shows a top plan view of a fabricated die in accordance with the present invention. Figure 9 shows a simplified cross section of an assembled solar cell die and printed circuit board in accordance with a consistent embodiment of the present invention.曰曰拉和=至图1〇B shows a wafer dicing and printed circuit board alignment fixture w and a cross-sectional view in accordance with an embodiment of the present invention. The map is not based on this _ piece. The element of the showerhead heat exchanger of the month - Figure 1 2 A shows the assembly drawing of the device according to the present invention. Alternative Example Showerhead Heat Exchange Figure 12B shows an exploded view of a component of a heat exchanger design in accordance with the present invention. The i-containing - alternative lotus head head map = alternative shower head heat exchange _ gauge, and indicates no water Flow path. Figure 3B shows an alternative shower screen and indicates the water flow path. A view of an embodiment of an insulating plate using a carrier splitter or a perforated plate #, an inertial jet of a raw coolant, is shown in the bottom view of the main casing 14A to 14C. Hole pattern top steel slab of one of the printed circuit boards of the embodiment of the printed circuit board on the printed circuit board of the package 124234.doc -46 - 200818532 Figure! 5 A to (10) shows the splitter perforated plate - an alternative embodiment In the view, the extension nozzle is formed or cast in the plate to enhance jet impingement while providing a relatively unobstructed path for the exhaust stream. One of the two perforated plates replaces Figure I6 which shows a view of the embodiment of the insulating frame and the extended nozzle. 7 A shows the shower head plundering and crying _ 妙贝... 乂 ° ° 之 alternative to the example, where the fluid leaves the jet array from the center rather than from the edge. Figure 1 7 Β show lotus lotus head 孰 拖 drag In addition, an alternative embodiment of the mouth change, wherein the flow is collected in the center tube, the sound of the sound of the white 八 々 、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Just have extra cable The struts. _ H18B is shown to be provided with rigid struts with extra power, which support the manufacture via injection molding. Figures i9A to 19C show that 嶒+ σσ &gt; capture 1/, yes, and see is more complicated Configuration, installation to the top of the receiving person and providing a rigid struts with a female stretch support cable [main meta-symbol description] 102 too concentrator and sun tracking 104 solar receiver 106 rigid struts 202 receiver 204 rigid support Rod 206 Stretching member 208 Extra tensile member 210 Effective area device for receiver I24234.doc -47 - 200818532 212 214 216 218 302 304 306 308 310 3 12 314 402 403 404 406 408 410 412 414 418 420 422 424 426 Support structure cable / tensile member support structure latch mechanism struts coupling assembly expansion port positioning struts pipe main receiver housing components main components main components expansion fluid valve vv Ό

P Structural bolts Structural bolts and bearing surfaces / screws 〇 ring

V 124234.doc -48 - 200818532 428 π 430 〇 ring 432 V 434 rotating element 436 element 438 spur gear 440 motor 442 screw 444 〇 ring 446 bonnet 448 threaded socket 450 port 1202 main body of the cooler assembly 1204 strut 1206 External plate 1208 Effective area of the receiver 1210 Attachment hole 1212 0-ring groove 1214 〇-ring 1216 1218 Projection 1220 Perforated plate 1222 Flange 1224 Projection 124234.doc -49- 200818532 1226 Outlet plenum 1228 Sealing surface 1302 Line 1304 Line 1306 Inlet Tube 1308 Perforated Plate 1310 Cooling Surface 13 12 Lip 13 14 Outlet Inflator 1316 Strut Outlet Tube 1402 Perforated Plate 1404 Nozzle / Hole 1406 Insulation Rack 1502 Perforated Plate Body 1504 Nozzle 1506 Jet 1508 Route 1510 Cooling Surface 1602 sealing surface 1604 reinforcement 1606 extension nozzle 1608 insulation frame 1702 tube 1704 symbolic path 124234.doc -50- 200818532 1 706 extension nozzle 1708 outlet tube 1710 channel 1712 symbolic route 1 802 coolant tube 1 804 tube cable 1 8 06 inlet and outlet pipes 1 808 Structural cable carrying part 1902 Coolant inlet pipe 1 904 Coolant outlet pipe 1906 Cable 1 908 Cable 1910 Cable 1912 Cable 1914 Connector 1916 Path 1918 Attachment point h Distance Η Height 124234.doc

Claims (1)

200818532 X. Patent Application Range · 1 · A photovoltaic power generation receiver, comprising: a printed circuit board (PCB) having a plurality of conductive paths formed therethrough; and a pole body 'in a substrate One of the conductive traces on one of the back sides of the substrate is in electrical communication with the diode and with one of the conductive traces on one surface of the printed circuit board, the trace providing a parallel path for current and heat from the diode structure Another conductor present in a side of the pc board opposite the surface is interspersed to conduct current and spread to conduct heat to an electrical insulator. 2. A receiver as claimed in claim 1, wherein the conductive trace on the pc board is configured to provide electrical connection in series with one of a plurality of diode structures. 3. A method of assembling a photovoltaic power generation receiver, the method comprising: cutting a solar cell into a block having a diode; forming a PC board, wherein a plurality of conductive paths pass through the Pc board; The back side of the block is placed on the PC board in alignment with the underlying vias. 4. A method of constraining thermal expansion of a printed circuit (PC) board relative to an overlying diode structure, comprising: constraining an edge of the PC board and at least one region on a non-welded side of the PC board The suction is part of the vacuum. 5. A method of contacting a plurality of diode structures with a supporting printed circuit board, the method comprising simultaneously applying a portion of the vacuum to at least one region behind the diode structures. 6. The method of claim 5, further comprising positioning the printed circuit board with a mechanical guide at 124234.doc 200818532 prior to the soldering step of the diode structure. 7. A clamshell holder, The method comprises: a first portion comprising a first vacuum chuck; and a second knife configured to hold one of the diode structures hinged to the first portion 5 - a portion comprising a configuration to hold a The printed circuit board has a vacuum chuck, and the first part is assembled with the second part to close the clamshell. The 8. a photovoltaic power generation receiver will have a plurality of photovoltaic power generation. The zone is shared by the support member; the pole body structure is aligned with respect to the pc board prior to the soldering process. The method includes: one of the substrates of the domain is disposed on the front side of the plurality of photovoltaic power generation regions to be physically separated into the crystal grains supported by the common member; and the back surface of the separated crystal grains is bonded to an insulating substrate The figure is in contact with the conductor. 9. The method of claim 8, wherein the separated dies are in contact with the common support by a vacuum force. 10. The method of claim 8, wherein the separated dies are in contact with the common support by an electrostatic force. The method of claim 8, wherein the separated die is in contact with the common support by an adhesive force. The method of claim 8, wherein the separated grains are maintained in contact with a true outer structure. Inflammation 124234.doc 200818532] 3. The method of claim 8, wherein the T-days of the backside of the V-electrode are in contact without manual alignment. / Μ · · A photovoltaic power receiver, 苴 ^ ^ ^ 匕 5 1 to make an inlet inflator 盥 屮 屮 Γ Γ Γ 屮 屮 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该At least one inertial coolant jet is cooled. 15.::=14 photovoltaic power receiver, wherein the divider comprises a group U such that the inertial cooling jet flows from the inlet plenum to the first set of sections of the surface a flow hole, and the separator further comprises a second generation of throttles that are configured to flow away from the heated surface to the exiting σ inflator, such as the photovoltaic power generation receiver of claim 14, wherein The divider includes a first set of orifices configured to flow the inertial cooling jet from the inlet plenum to the heated surface and the separator further includes at one of the centers of the separator and is configured Having the jet exit the heated surface to the second orifice of the outlet plenum. 17. Apparatus comprising: - a first support structure in contact with a solar collector; a receiver Configuring to receive the sun from the aggregator The receiver is in contact with a rigid struts extending from a first portion of the first support structure; a first fluorowire having a first end immediately adjacent the first support structure and extending through the solar concentrator a second support structure in contact with the solar concentrator; and a second cable of the second support structure or the portion of the second support structure extending from the second support structure or the 124234.doc 200818532 The 忒 receiver or the rigid struts are immediately adjacent to a portion of the receiver, - the _ _ 绕 经 经 经 经 绕 绕 绕 绕 绕 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4 further includes a photovoltaic power generation element, an absorber or a photolysis battery. 1 9. The device of claim 7, wherein the rain, J note and h are configured to provide power and electrical signals and And a conduit for a coolant. The apparatus of claim 17, further comprising: a third building structure in contact with a first-speaker-too-aggregator and coupled via a light-weight element To the first support structure · a first The receiver is configured to receive a solar lunar raft from a second concentrator of the At 目4, the second receiver being in contact with a second rigid struts extending from a first portion of the first λ-second support structure a third cable having a first ridge of the third support structure of the Tight Mountain/妾口海 and passing through the second solar concentrator ^ _ 1A to the contact with the second solar collector a fourth supporting structure; and a fourth cable, which is connected to the second supporting structure from the part of the fourth supporting structure from the first tooth, the mouth or the second brother The second degree is configured to stabilize the position of the second receiving crying/partial portion of the fourth slow cable sigh. I24234.doc