200814389 九、發明說明： 【發明所屬之技術領域】 分地印刷的揭起漆層從基質除去 、本i明關於一種在基質上製造一構造化的層序列的方 Τ’在該，質上設有互相間隔的第—電極。在第_方法步 ‘在各第冑極的一第一邊緣部段印上一接觸阻擋件， 在-隨後的第二個方法步驟中，印上一揭起漆層，該揭起 漆：從各接觸阻擋件起延伸經相鄰之第一電極之間的自由 面和區域-直到相鄰之第一電極的與該區域鄰界的第二邊 、彖區域為止，在—隨後的第三個方法步驟中將該基質整個 面積用至少-種至少單層的活性層印届J，該活性層由—低 枯度及易流動的層介質構成；在—隨後的第四個方法步驟 中’將該基質整個面積用一第一金屬層蓋<主，然後將該部 【先前技術】 該基質舉例而言可為形狀穩定的或可撓性的基質，亦 即平面元件，它由一種電絕緣材料構成。 將部分層以構造化及保持對齊的方式施到一基質上的 作業當構成相關之層的介質粘度低時就很困難，因為該低 钻度介質很容易不當地流動’而且，舉例而言，對齊標記 (Register Marken)或施到基質上的平面區域不能1置準 確地及/或尺寸準雄地呈現。該介質舉例而言可為漆、溶 劑或類似物’然而由於在一基質上的整個層構造（亦即該 構造化的層序列）的功能性及效率與個別之構造化的層及 5 200814389 其準確的平面尺寸很有關，因此迄今很難選擇一種層施覆 的習知途徑。 上述種類在一基質上製造構造化的層序列的方法見於 國際專利WO 200413922 A2。在此方法中，在基質上設第 電極後’將「揭起漆層」（Lift-Off-Lackschicht)直接 部分地印到第一電極之一上。 在WO 02/073712 A1提到一種將一基質構造化的方 _ 法其中在一第一方法步驟將一液滴施在該基質上，該液 滴由一第一有機或無機物質構成，由於其在基質上的特別 的表面張力，而以<3〇。的小接觸角度佔住一透鏡形的橫載 面廓形，在作一瘵鍍程序後，該透鏡形的橫載面廓形變成 %形廓形，具有一中心區域，其中第一材料大部分位在 外環部與Φ，&结 t, 而弟一材料一小部分位在被外環部段圍住的 中區域中。然後作一蝕刻過程，其中將中心區域的薄材 料膜從基質除去。 【發明内容】 、、本發明的目的在提供一種上述種類的方法，利用此方 可使侍將部分層以構造化及保持冑齊的$式施在一基質 上=作業的上述缺點用簡單手段除去，且用該方法，舉例 而3 ’可製造廉價的聚合物太陽能電池。 成^種目的依本發明係利用申請專範圍第1項的特點達 1第迅極之後及將該揭起漆層部分地印刷之前將一 6 200814389 接觸阻擒件印刷在各第— 緣部段上1揭 i i層印刷的方式使它從各接觸阻擋件延伸過相鄰之第一 電極之間的自由面積區域直到相鄰之第—電極之 : 區域的第二邊緣區域為止， 在该活性層乾燥後，將基質整個面積用第一金屬層蓋住， 且將揭起漆層從基質洗掉。 、、忒在基貝上互相間隔的第一電極可為薄層、厚層、膜 釀或類似物，接觸阻擋件可利用網版印刷製造。舉例:言，、 接=阻擋件也可用滾子印刷方法例如凹版印刷方法達二。 基貝可由一形狀穩定或可撓性材料構成，對應的材料也適 用於要施在基質上之部分揭起漆層及該至少一個至少單層 ^活性層。它們舉例而言也可㈣網版印刷、凹版印刷或 頒似者製造。如果舉{列而言要用本發明的方法製造太陽電 =，則該至少一活性層可為一半導體材料。該將基質整面 =住的第—金屬層舉例而言可設計成薄層形式，利用陰極 I 務化、真空蒸鍍或類似方式達成。 在本發明的方法，在該基質上部分地印刷的揭起漆層 、後可在基貞上没一第二金屬層，該第二金屬層構造 化的方式使得該第二金屬層將各第一金屬層經由相關的接 觸阻擋件以及在相鄰之第一電極之間接到該接觸止擔件上 1自由面積區域與相鄰之第一電極之接到該處的第二邊緣 區域連接成導電方式，與在此第一電極上所設的至少一個 至夕單的活性層以及設在其上涵蓋相同區域的金屬層相間 隔0 7 200814389 用此方式，利用該構造化的第二金屬層造成個別電池 的串聯，這些個別電池各由一第一電極、相關之第一金屬 層’以及位於其間的至少一活性層構成。如果該至少一活 性層為用於做聚合物太陽電池元件用的一半導體層，則利 用該串聯使個別電池的電壓累加。在聚合物太陽電池元件 的場合，可使用例如一種PE DOT/PSS〔聚（3,4_乙烯二氧 嚷吩）聚（丙乙稀績酸酯）〕的層及一 sc (半導體層）當 作活性層’其中，當然活性層不限於這些例子。 _ 依本發明也可在該部分地印刷的揭起漆層除去前，將 該第一金屬層在該部分地印刷的揭起漆層之間的區域設一 抵抗層，在此程序方式，在該基質上部分地印刷的抵抗層 除去後，可設一第二金屬層，該第二金屬層構造化的方式 使％該第一金屬層將各第一金屬層經由相關的接觸阻擋件 以及在相鄰之第一電極之間接到該接觸止擋件上的自由面 積與相鄰之第一電極之接到該處的第二邊緣區域連接 Φ 成^包方式，與在此第一電極上所設的至少一個至少單層 的活層以及設在其上涵蓋相同區域的金屬層相間隔。用 此方式，又造成個別電池的一種串聯電路。 要保護依本發明製造的層疊物，如果在第二金屬層施 土貝上之後至少施一盍層，則甚佳。此至少一蓋層可 利用一枯著劑層施在基質上，利用該至少一蓋層，可保護 該基質上形成之層疊物以防外來的機械性及/或化學 影響。 其他細節、特點及優點見於以下，在圖式中以示意方 8 200814389 • 式而非以實物尺寸顯示的方法（它用於在一基質上製造一 構造化的層序列）的說明。 【貫施方式】 圖1顯示-基質⑽，由—電絕緣材料構成。基質⑽ 可設計成形狀穩定之平坦面狀，或由一可挽性材料構成。 基質（10)在一主面（12)上設有一些第一電極（14)，它們 互相間隔，第一電極（14)可由薄層、厚層、金屬膜或類似 _ 物形成。 在一第一方法步驟中，在第一電極（14)的一第一邊緣 部段（16)上即上接觸阻擋件（18)。在接觸阻擋件（18)乾燥 後，部分地將一揭起漆層（20)印上去，它從各接觸阻擋件（18) 一直延伸到該相鄰的電極（4)之鄰界到該處的第二邊緣區域 (22)為止，且因此將相鄰之第一電極（14)之間一—亦即在該 各接觸位置（1 8)與相鄰之第一電極〇4)的朝向此位置的第二 _ 邊緣區域（22)之間的自由面積區域（24)蓋住。 在該部分的揭起漆層（20)乾燥後，將基質整面蓋以至 少一個至少單層的活性層（26)，它可由一低粘度易流動（因 此難以印刷）的介質構成。此介質可利用滾子、印刷或類 似物方式達成。該至少一個至少單層的活性層（26)乾燥後， 將基質（ίο)整面用一第一金屬層（28)蓋住。此金屬層（28)舉 例而言，可為一薄層，它利用陰極噴霧化、真空蒸鍍或類 似方式製造。 在施覆第一金屬層（28)之後的一方法步驟中，將該部 9 200814389 分地印刷的揭起漆層（20)隨著位於其上的金屬層（28)的面積 部段從基質（10)除去。這點在圖1中利用弧形括弧用箭頭（3〇) 不意表不，該部分地印刷的揭起漆層（2〇)係藉洗除而除去。 此，不但該部分印刷的揭起漆層（2〇)從基質（1〇)除去，而且 設在揭起漆層（20)上的該至少一個至少單層的活性層（26)以 第一金屬層（28)的部段也都除去。因此如此在基質（1〇)上留 下互相間隔的第一電極（14)。以及該至少一個至少單層的 活性層（26)之設在第一電極（14)上的面積部段、以及設在該 面和部段上的第一金屬層（28)、該金屬層在第一電極〇4)的 第一邊緣部段（16)被相關之接觸止擋件（18)界定，且向第一 包阻（14)的第二邊緣區域（22)一一對應於揭起漆層（2〇)__ 平坦地回復。 在該部分地印刷的揭起漆層（2〇)從基質（1〇)除去之後， 可在基質（10)上設一第二金屬層（32)，它構造化的方式使它 將各第一金屬層（28)經由相關的接觸阻擋件（18)以及相鄰之 第一電極（14)之間之接到該阻擋件的第二邊緣區域連接 成v私方式，而與該設在此第一電極（14)上的至少一個至 二單層的活性層（26)以及與活性層涵蓋相同面積的第一金 屬層㈣間隔開來。因此利用該構造化的第二金屬層幻造 成個別元件（34)的串聯，它們各由一第一電極（14)、該相關 ^至）一個至少單層的活性層（26)、以及設在活性層上的 第一金屬層（28)構成。 圖3顯示另一種本發明的方法，其中，在該部分地印 刷的揭起漆層（20)除去之前將金屬層（28)在該部分地印刷的 200814389 揭起漆層（20)之間的區域（36)設以一抵抗層（38)。然後將該 部分地印刷的揭起漆層（20)從基質（1〇)洗掉（亦即除去）， 這點在圖3中--如圖1中--利用弧形括弧用箭頭（3 0) 表示。該構造化的揭起漆層（20)溶掉後，造成層間構造， 如圖4所示。將該部分地印刷的揭起漆層（2〇)溶掉後，將 该仍留著的構造化的抵抗層（3 8)再除去，這點在圖4中用 弧形括弧以箭頭表示。在一隨後的方法步驟中，在基質（i 〇) 上一一如上文配合圖2所述者一一設一構造化的金屬層 (32)，俾造成個別元件（34)的串聯。 將該構造化的第二金屬層（32)施覆後，在基質（1〇)上利 用一粘著劑層（42)將至少一蓋層（44)(見圖2及圖3 )施覆。 在圖1，2及圖3,5中，同樣的元件各用相同圖號表示， 因此不需對所有的圖都將所有元件詳述。 【圖式簡單說明】 圖1係在一基質上一層序列的片段的側視圖， 圖2係在圖i的層狀物上做另外的方法步驟造成之層 疊物的片段的侧視圖， 圖3係一與圖1相似之另一 圖4係在圖3 圖5係依圖3 之與圖2相似的示圖。 之另一本發明之方法的側視圖200814389 IX. Description of the invention: [Technical field to which the invention pertains] The lacquer layer of the land-based printing is removed from the substrate, and the present invention relates to a method for fabricating a structured layer sequence on a substrate. There are first electrodes that are spaced apart from each other. In the first method step, a contact barrier is printed on a first edge section of each of the second poles, and in a subsequent second method step, a lacquer layer is applied, the lacquer is: Each of the contact barriers extends from a free face and region between adjacent first electrodes - up to a second side, a meandering region of the adjacent first electrode adjacent to the region, in the subsequent third In the method step, the entire area of the substrate is printed with at least one active layer of at least one layer, the active layer consisting of a low-dry and flowable layer medium; in the subsequent fourth method step The entire area of the substrate is covered with a first metal layer <main, then the portion [previously] the substrate may be, for example, a dimensionally stable or flexible substrate, i.e., a planar element, which is electrically insulated Material composition. The application of a portion of the layer to a substrate in a structured and dimensionally aligned manner is difficult when the viscosity of the medium comprising the associated layer is low because the low-diameter medium is susceptible to improper flow 'and, for example, The registration mark (Register Marken) or the flat area applied to the substrate cannot be accurately and/or dimensionally presented. The medium may for example be a lacquer, a solvent or the like 'however due to the functionality and efficiency of the entire layer construction on a substrate (ie the structured layer sequence) with individual structured layers and 5 200814389 The exact planar dimensions are very relevant, so it has hitherto been difficult to choose a conventional approach to layer application. A method for producing a structured layer sequence on a substrate of the above type is found in International Patent WO 200413922 A2. In this method, a "lifting paint layer" (Lift-Off-Lackschicht) is printed partially directly onto one of the first electrodes after the first electrode is placed on the substrate. In WO 02/073712 A1, a method for structuring a substrate is described in which a droplet is applied to the substrate in a first method step, the droplet being composed of a first organic or inorganic substance due to its A special surface tension on the substrate, with <3〇. The small contact angle occupies a lenticular cross-sectional profile. After a sputum plating process, the lenticular cross-sectional profile becomes a %-shaped profile with a central region, wherein the first material is mostly It is located at the outer ring portion and Φ, & t, and a small portion of the material is located in the middle region surrounded by the outer ring segment. An etching process is then performed in which the thin film of the central region is removed from the substrate. SUMMARY OF THE INVENTION The object of the present invention is to provide a method of the above kind, by which a portion of a layer of a waiter can be applied to a substrate in a structured and held manner. Removal, and using this method, for example, 3' can produce inexpensive polymer solar cells. According to the invention, a 6 200814389 contact barrier is printed on each of the first edge portions after the first feature of the first item of the application is applied to the first rapid change and before the lacquer layer is partially printed. The first layer is ii layer printed in such a manner that it extends from each contact barrier through a free area region between adjacent first electrodes up to the adjacent first electrode: the second edge region of the region, in the active layer After drying, the entire area of the substrate is covered with a first metal layer and the lacquer layer is removed from the substrate. The first electrode spaced apart from each other on the base may be a thin layer, a thick layer, a film or the like, and the contact stopper may be manufactured by screen printing. For example, the splicing method can also be achieved by a roller printing method such as a gravure printing method. The base may be constructed of a dimensionally stable or flexible material, and the corresponding material is also suitable for the portion of the lacquer layer to be applied to the substrate and the at least one at least one active layer. They can also be, for example, (4) screen printing, gravure printing or creator manufacturing. If solar cell power is to be produced by the method of the present invention, the at least one active layer may be a semiconductor material. The first metal layer of the substrate as a whole can be designed, for example, in the form of a thin layer, which is achieved by cathodic treatment, vacuum evaporation or the like. In the method of the present invention, the lacquer layer partially printed on the substrate may be followed by a second metal layer on the substrate, the second metal layer being structured in such a manner that the second metal layer will be a metal layer is electrically connected via an associated contact barrier and a region of free area on the contact stop between the adjacent first electrodes and a second edge region of the adjacent first electrode connected thereto In a manner, at least one active layer disposed on the first electrode and a metal layer disposed on the same region are spaced apart from each other. 0 7 200814389 In this manner, the second metal layer is constructed by using the second metal layer The individual cells are connected in series, each of which consists of a first electrode, an associated first metal layer 'and at least one active layer therebetween. If the at least one active layer is a semiconductor layer for use in a polymer solar cell component, the series is used to accumulate the voltages of the individual cells. In the case of a polymer solar cell element, for example, a layer of PE DOT/PSS [poly(3,4-ethylenedioxyphene) poly(ethyl acrylate)] and a sc (semiconductor layer) can be used. As the active layer 'of course, the active layer is not limited to these examples. According to the invention, before the partially printed lacquer layer is removed, the first metal layer is provided with a resist layer in the region between the partially printed lacquer layers, in this manner, After the partially printed resist layer on the substrate is removed, a second metal layer can be provided, the second metal layer being structured in such a manner that the first metal layer passes the first metal layer via the associated contact barrier and a free area between the adjacent first electrodes connected to the contact stop and a second edge region of the adjacent first electrode connected thereto is formed in a manner of being packaged on the first electrode At least one living layer of at least one single layer and a metal layer provided on the same area are spaced apart. In this way, a series circuit of individual batteries is created. To protect the laminate made in accordance with the present invention, it is preferred if at least one layer is applied after the second metal layer is applied to the soil. The at least one cap layer can be applied to the substrate by a layer of a depleting agent with which the laminate formed on the substrate can be protected from external mechanical and/or chemical influences. Further details, features and advantages are found in the following description of the method in which the schematic is shown in Figure 8 200814389 instead of the physical dimensions (which is used to fabricate a structured layer sequence on a substrate). [Commonly applied method] Fig. 1 shows a matrix (10) composed of an electrically insulating material. The substrate (10) can be designed as a flat, stable shape or a pliable material. The substrate (10) is provided on a main surface (12) with a plurality of first electrodes (14) spaced apart from each other, and the first electrode (14) may be formed of a thin layer, a thick layer, a metal film or the like. In a first method step, the blocking member (18) is contacted on a first edge section (16) of the first electrode (14). After the contact barrier (18) is dried, a lift-up lacquer layer (20) is partially printed, extending from each contact barrier (18) to the adjacent boundary of the adjacent electrode (4) thereto. The second edge region (22), and thus the orientation between the adjacent first electrodes (14), that is, at the respective contact positions (18) and the adjacent first electrodes 〇4) The free area area (24) between the second_edge areas (22) of the position is covered. After the portion of the lacquer layer (20) has dried, the substrate is overlaid with at least one at least one active layer (26) which may be comprised of a low viscosity, flowable (and therefore difficult to print) medium. This media can be achieved by means of rollers, printing or the like. After the at least one active layer (26) of at least one of the layers is dried, the entire surface of the substrate is covered with a first metal layer (28). The metal layer (28) may, for example, be a thin layer which is fabricated by cathodic atomization, vacuum evaporation or the like. In a method step after applying the first metal layer (28), the lacquer layer (20) printed on the portion 9 200814389 is printed from the substrate along the area of the metal layer (28) located thereon (10) Remove. This is not shown in Figure 1 by the use of curved brackets (3〇), and the partially printed lacquer layer (2〇) is removed by washing. Thus, not only the partially printed lacquer layer (2 〇) is removed from the substrate (1 〇), but the at least one at least one active layer (26) provided on the lacquer layer (20) is first The sections of the metal layer (28) are also removed. Thus, the first electrodes (14) spaced apart from one another are left on the substrate (1〇). And an area section of the at least one active layer (26) of at least one layer disposed on the first electrode (14), and a first metal layer (28) disposed on the surface and the segment, the metal layer being The first edge section (16) of the first electrode 〇4) is delimited by the associated contact stop (18) and corresponds one-to-one to the second edge region (22) of the first containment (14) Paint layer (2〇)__ Flat return. After the partially printed lacquer layer (2〇) is removed from the substrate (1〇), a second metal layer (32) may be disposed on the substrate (10) in a structured manner such that it will be a metal layer (28) is connected to the second edge region of the barrier member via an associated contact barrier (18) and an adjacent first electrode (14) in a private manner, and is disposed therewith The active layer (26) of at least one to two monolayers on the first electrode (14) and the first metal layer (four) covering the same area as the active layer are spaced apart. Thus, the second metal layer of the structuring is used to create a series connection of individual elements (34) each consisting of a first electrode (14), the associated active layer (26) of at least a single layer, and The first metal layer (28) on the active layer is formed. Figure 3 shows another method of the invention in which a metal layer (28) is lifted between the partially printed 200814389 lacquer layer (20) prior to removal of the partially printed lacquer layer (20). The zone (36) is provided with a resist layer (38). The partially printed lacquer layer (20) is then washed away (ie removed) from the substrate (1), as shown in Figure 3 - as in Figure 1 - with curved brackets with arrows (3) 0) indicates. The structured lacquer layer (20) dissolves, resulting in an interlaminar structure, as shown in FIG. After the partially printed lacquer layer (2 〇) is dissolved, the remaining structured resist layer (38) is removed again, as indicated by the arrows in Fig. 4 by arcs. In a subsequent method step, a structured metal layer (32) is provided on the substrate (i 〇) as described above in conjunction with Figure 2, which causes the individual elements (34) to be connected in series. After applying the structured second metal layer (32), at least one cap layer (44) (see FIGS. 2 and 3) is applied to the substrate (1) using an adhesive layer (42). . In Figures 1, 2 and 3, 5, the same elements are denoted by the same reference numerals, and therefore it is not necessary to have all the elements in detail for all the figures. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side view of a fragment of a sequence on a substrate, Figure 2 is a side view of a fragment of the laminate caused by additional method steps on the layer of Figure i, Figure 3 Another Figure 4, which is similar to Figure 1, is shown in Figure 3 and Figure 5 is a view similar to Figure 2 of Figure 3. Side view of another method of the invention
【主要元件符號說明】 11 200814389[Main component symbol description] 11 200814389
(10) 基質 (12) 主面 (14) 電極 (16) 第一邊緣部段 (區域） (18) 接觸阻擂件 (20) 揭起漆層 (22) 第二邊緣部段 (區域） (24) 自由面積區域 (26) 活性層 (28) 金屬層 (30) 箭頭 (32) 第二金屬層 (34) 元件 (36) 區域 (38) 抵抗層 (42) 粘著劑層 (44) 蓋層 12(10) Substrate (12) Main surface (14) Electrode (16) First edge section (area) (18) Contact barrier (20) Lifting lacquer layer (22) Second edge section (area) ( 24) Free area area (26) Active layer (28) Metal layer (30) Arrow (32) Second metal layer (34) Element (36) Area (38) Resistance layer (42) Adhesive layer (44) Cover Layer 12