TW200814280A - Power supply layout for integrated circuit - Google Patents

Abstract

A component placed in an integrated circuit reduces the electro-magnetic interference, the noise interference, the EM, the IR drop and the cost due to producing printed circuit boards and increases the reliability of chips based on a stack structure. In the stack structure, a metal layer is stacked under a power ring, and another one is stacked under a ground ring. Hence, there is a great stack capacitance produced in the stack structure.

Description

200814280 IX. Description of the Invention: [Technical Field] The present invention relates to an integrated circuit, a power supply connection line of a special body circuit, and a preparation method thereof. In the era of fierce competition, products not only require the speed of product launch, but also the quality of products, so the power supply reliability (p_reliability) design of integrated circuits is relatively important. . Because the reliability of the integrated circuit affects the yield and life of the product, it affects the quality of the product and customer satisfaction. The current power and design of the current rhyme circuit can be divided into three types, namely the power supply ring (P_mg), and the power supply. With (ρ_ and power network (four) gift return). The power supply ring is the whole (10) of the integrated circuit.:, and because it is connected to the voltage source and supplies all currents of the circuit, the _ unit current is high, and the relative metal width is 疋, see the S, the power supply is Responsible for carrying current to every corner of the circuit' because the power supply belt resistor consumes current, so the width of the power supply belt is relatively wide to be able to consume current; the power_ function is to take current from the power supply belt and supply it to the integrated circuit. The local unit component (Std(10)), because the cut flow: large, the metal line width is not thick, but in order to have a ^ / melon, the distance of the source _ should be dense and uniform.

There are four factors of D and 2: ?#, which are voltage drop (IR int〇Pf); 〇^ ^(EM) ? 1 ^ ^ ^ (EMI) ^ ^ ^ ^ (Noise ererence-- Schematic diagram of the integrated circuit of the conventional technology. Product 200814280 The body circuit 1 includes a first power supply ring no, a first grounding ring 12〇2: a grounding ring 122, a connecting hole 15, a first power supply belt i3〇, a first: f 132, the second power supply belt 134 and the fourth power supply belt 136. Gong', the layer, the sub-connection at the different material joints will be connected with the connection hole 15. Electric =, 疋 through the connection hole 15 and the first-power ring cutting, The first grounding ring 12, or the second grounding ring 122 is connected. Because the two different potentials are gold==Γ', the general integrated circuit will generate a parasitic capacitance Qide between the metal layer side:: side, such as The second figure shows that, one eight = parasitic f capacity is proportional to the length of the two gold plates and the plate is beneficial to the layer distance • into the inverse *, the general power ring or ground ring because the side of the metal layer = (7), And it is fixed 'so only by increasing the length of the metal layer (= or the junction is shorter than the distance between the metal layers _ to increase the parasitic capacitance ^ the parasitic capacitance cslde limited The reason is that the parasitic ray is out of the metal layer side area to be the main source of the capacitor board. [Invention] The present invention is an integrated circuit power supply connection line and its preparation method, respectively, in the power supply A metal layer is attached under the ring and the grounding ring, so that the equivalent lightning capacity in the power supply ring and the metal layer, the grounding ring and the entire metal door layer _ the ship ring, and the Baogu 's and the circuit are soared = 2 power supply slant, noise interference, I resistance value of road melon, low cost of printed circuit board for carrying current of k 幵 体 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 木 木 木 木 木 木 木 木 木 木 木The method comprises a power ring, a grounding ring, a plurality of = Lu Fu 200814280, a plurality of power pads, a metal layer and a plurality of layers: a second soldering cymbal, a plurality of layers, a gold, a direct two, and a ground ring Attaching a metal source ring, or transmitting it to the grounding ring of the life of the circuit, to transmit the positive voltage to the grounding ring of the circuit operation, to supply the integrated electric line directly Wire-bonding the wire to the portion of the gold portion directly The connecting hole is connected to the connecting portion. The metal changing layer is transmitted through the partial connecting hole and the metal changing layer; the second line; the source line is connected to the connecting portion, and is connected between the mother and the power ring and the grounding ring. [Embodiment] The second picture of Ming Mai is shown in the figure, which is a schematic diagram of the engraving + bus bar. The integrated circuit 2 contains at least one object L25, a plurality of power pads 28ail夂28b. (gr〇Und Pad) 27. A plurality of metal-changing layers 28a and 28b and a plurality of metal wires and 2%. The holes 25 are used as a connection between different metal layers. Changing the metal 2B is to use the connection hole 25 as a transmission between different metal layers = beam. The gold secret 29a is directly connected to the above-mentioned electric pad = 3 2 m and is directly connected to the above-mentioned ground pad 27. The upper metal ring is a power ring 210 and a first ground ring k (g ship ndnng) 22G'. These metal rings are power bus bars (power us for power supply (p power supply) 〇wersupply) The current supplied to the internal circuit of the integrated circuit enables the integrated circuit to operate. Each power supply is connected to the first power supply ring 200814280 210 through its corresponding metal and wire. A positive voltage is applied to the first power supply ring 210, and each of the ground pads 27 is connected through the corresponding metal wire 29b' and the metal wire 29b by the connection hole 25. The metal layers 28a and 28b are connected to the first grounding ring 22A and provide a negative voltage to the first grounding ring 22〇, so that the current supplied by the power supply can be further transferred to the integrated body. Inside the circuit, where this is called VDD, and the negative power is called vss.

Thus, the first power supply ring 210 and the first grounding ring 22 are in parallel with each other. Therefore, please refer to the fourth figure, which is generated by the power supply and grounding (4) of the present invention. The second: the electric rc power grounding ring - the group of electricity valley '. The relationship between the parasitic capacitance Cside is as follows: · side D2 The value of m: - changes with the height τ, long sound l and ::: 'that is, the value of the parasitic capacitance cslde is proportional to the high:::, and the distance D2 is inversely proportional. Height ^ and length The thickness of the ground ring 220. The length L is the length of the first::: "220. The distance between the distance D2 and the electric #2 〇-the grounding ring 220 is 210 times longer than the electric 屌 。. You are the figure - the middle moment is away from D1, and Therefore, only the first power supply ring 21 () = the power supply bus structure, so that the grounding ring 2 of the integrated body is very limited, so the send/read of each 210 and the ground ring of the present invention are finely stepped respectively. The metal layer is provided, and the additional metal layer is respectively spaced apart from the grounding ring 220 of the 200814280, as shown in the third figure. Therefore, the integrated circuit 2 of the present invention is further Further, the power supply ring 212 and the second grounding ring 222 are included. The gold system attached to the first power supply is the second grounding ring 222, and the metal layer attached to the first grounding ring is the second power supply and the ring 212. The second power supply ring and the grounding ring 222 are also separated by a distance. /, Le - Moreover, the above-mentioned power pad 26 can be connected not only to the first power ring 21 () through its corresponding all-one 29a, but also Through the metal wire 29a, or / and all belong to the 妗, kill, the certificate 4 7 t should be replaced by the whole heart), the two genus through the connection hole 25 The junction layer 28a is connected to the second power supply ring 212. The grounding ring 220 can be connected to the grounding ring 220 by connecting the metal-changing layer 28 connected to the U-line 2% through the corresponding metal line. Therefore, the 'integrated circuit 2 can be made up of the electric rotating pad %, in the 匕, the corresponding metal wire to the emperor 29a ^ ^;; t « i ground = input ί electric house to the second power supply ring 212. The integrated circuit 2 can be The first 'through the corresponding metal wire 29b, the wheel is negatively charged repeatedly" and the metal layer 28b is changed to input the outside of the line, and the connection hole u receives a negative voltage to the first ground ring 22A. The electric four-figure of the structure is not the same as the stacking ring 210 of the present invention: the grounding corresponds to and is parallel to each other 'therefore the first-power supply line, so the 筮_十衣222 also corresponds to each other and is flattened to each other-琶A 200814280 two parasitic capacitance cslde is also formed between the source ring 212 and the second ground ring 222. Since the second power supply ring 212 and the second grounding power θ are attached to the first grounding ring 22〇 and the first power supply metal layer, the first power supply ring 21〇 corresponds to the second “〃” and corresponds to each other. Parallel, so the first - power supply ring = will form a "parasitic capacitance cP]ate. Similarly, the second power supply ring 212 also corresponds to each other and is mutually symmetrical. Therefore, a relationship between the ground 220 and the second power supply ring 222 is also formed as follows: and

WxL

C plate ε χ 跖 where the value of 'parasitic capacitance ^ is the width %

The value of the change 'also (four) raw capacitance ' is proportional to the value of =^, and is opposite to the distance s, and the degree I ^ is 2 degrees of the second power supply ring 212 and the first ground ring source ring. The length L is the length of the first power ring 21 (), the #t - the ground ring 220, and the second ground ring 222 = the distance between the buckle, the brother f ring 21 〇 and the second ground ring 222, and the 2 brothers 2 2 Ο "two power supply ring 2" 2 between the spacing, and is: =: long. In addition, the height τ is also the thickness of the second power ring 212, the distance Μ is also the second power ring 21 :=, the distance between 222. E. a grounding ring 222: grounding ring 2 qing separately attached - metal double capacitor c magnetic system for the parasitic capacitance c 堆 形成 formed by the stack capacitor Γ know, the sum of plate 7 Uside And change with the change of::Cplate and Cside, and the degree of visibility is proportional to the length, and the distance m and the spacing s are inverse length 1 200814280 + D2

Stack one 2 X £ X

The source loop 210, the second power loop I, the second < 220, and the second ground loop 222 are stacked on top of each other. The receiver should provide the current required for the operation of the integrated circuit 2 (4). The structure of the power bus is used as the second:: pick: and, rhyme, two:: the path of the transmission, can not be uniformly transmitted = the inner corner of the body circuit 2. Therefore, the product! It is also the transmission function of the tape, and the structure of the power supply can be used to truly connect the integrated circuits to each corner. The current current transmission wheel = the fifth picture shown in the figure, which is the schematic diagram of the power supply sink and the power supply belt. The integrated circuit and the circuit contain a number of power supply belts, which are used in the production of the integrated body: 2, and the following: ί package = device. The power strip can be connected to the above-mentioned power ring or grounding ring through a metal-changing layer 2 hole 5 to form a uniform transmission power supply. Every corner of the shape, .罔. Promote 1,, ~- to the body of the body circuit 2 ^1 source band is the first - power band attack, the second (four) 〇 and the second power band 232 is a set of power bands, and phase = flat = source The belt 234 and the fourth power strip 236 are another set of power strips, and the first power strip 230, the second electric ", the second power strip 234 and the fourth power source in the two sets of power strips The belt 23 has a source ring 210, and the first interface ^ 乐 222 intersects each other (4) the source ring 212 and the second ground ring 200814280 source net 5 brothers brother - power belt 23 ° system through the connection hole 25 by the first electric ^ Up to the second black through the two opposite sides of the second power supply ring 212, the connecting ground ring 222 ' first through the metal exchange layer 28b ϋ. Γ-t ground ring 22G corresponding ends, and then connected to the second The grounding strap ——the source strap 234 is torn through the connecting hole 25 and the metal changing layer, is connected to the end of the second power ring 212, and is interleaved with the G and the second power strip 232, and the first power strip

The deer H is connected to the mountain hole 25, and then passes through the other end of the second power supply ring 212, and the other end is connected to the other end corresponding to the first power supply ring 210; =, the band 236 is transmitted through the connection hole 25. The corresponding ends of the second grounding ring 22G are connected to the other end corresponding to the second grounding ring 222 by the first: _ 222. And the first t-integrated circuit 2 can be further stepped under the first metal ring 210 == ring 220, respectively, using an additional multi-layer metal layer to achieve the "performance" of the sentence, that is, the integrated circuit 2 The metal system inside can be designed according to the needs of the manufacturer. The more the number of metal layers, the larger the parasitic capacitance generated by the table, as shown in the sixth figure. The degree and product of #§fL interference (nGlseinterf_ee) The capacitance value in the body circuit is related to the magnitude of the capacitance. Therefore, when the stack a generated by the integrated circuit 2 is larger, the anti-missing device (4) of the integrated circuit 2 and the first power supply ring in the integrated circuit 2 are provided. The distance between the 21 〇 and the power supply source can also be used to suppress the interference of electromagnetic waves. The stack generated by the integrated circuit 2 can be: from 20pf to 200Pf ' or greater than 2〇〇pf, Therefore, it can be regarded as an inner 8: in the form of an integrated circuit 2 - a large capacitor used to suppress electromagnetic interference. If 12 200814280 2 2 Er 2 is integrated into the printed circuit board (5), the circuit b〇ard, Π 13 ) Can be mixed with η ( ρ « « η + , named "brush supply circuit board supply voltage source and The ground is too large: the large capacitance of electromagnetic interference 'to reduce the production of printed circuit boards' Capacitor ', can greatly reduce the resistance value of the power supply bus flow path, so the voltage drop effect in the 版 迅 迅 迅 2, and the current can be improved even if the current of each gold can be uniformly dispersed The problem of uneven density (Electr〇migrati〇n, EM) in the integrated circuit 2. The electrician can continue to stack the metal layer under the second grounding ring 222 as needed. In order to achieve a high capacitance value in the % limb circuit, the advantage provided by the invention is that the L-rings respectively formed under the power ring and the grounding ring to form a stacked material are provided, the advantage is that the two groups of metals The ring will generate a disturbance capacitor to increase the integrated circuit to prevent electromagnetic interference and noise. ☆ This month's other advantage is that the equivalent of the integrated circuit is not the same as the manufacturer. The width of the hybrid (four) ring or ground ring, The user's f _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The capacitor for suppressing electromagnetic interference is used to save cost. The re-expected advantage of the present invention is that the power supply sink 13 of the stack structure can make the power supply bus flow path _ the problem of voltage drop in the good integrated circuit The value of the value is lower than that provided by the invention. The advantage is that the flow row uses the metal exchange layer, the connection hole, and the power supply ring between the two power supply and the power supply between the ground ring and the grounding ring. The electric current of the stacked structure can be uniformly dispersed, and the current body _= required to improve the current density. The metal layer attached to the flow row can be adjusted only by referring to the figure of the power supply of the stacked structure. To limit the person. However, the above 3 is ^ = ' 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌 剌A brief description of the drawings included in the present invention] f - the schematic diagram of the integrated circuit of the dragon technology; the schematic diagram of the equivalent capacitance of the flow and the flow row; Fig.; θ, the inside of the integrated circuit of the turtle The equivalent of the power busbar of the stacking structure of the power supply (4) The equivalent power of the power busbar of the stacking structure of the valley: the power supply busbar of the integrated circuit of the inner valley of the valley is combined with the power supply (not thinking; and 14 200814280 A schematic cross-sectional view of an equivalent capacitance of a power bus of a stacked structure of the present invention. [Main component symbol description]

Integrated circuit 1, 2 first power ring 110, 210 second power ring 112, 212 first ground ring 120, 220 second ground ring 122, 222 first power band 130, 230 second power band 132, 232 third power band 134, 234 fourth power band 136, 236 connection hole 15, 25 power pad 26 ground pad 27 metal layer 28a, 28b metal wire 29a, 29b 15

Claims (1)

200814280 X. Patent application scope: 1. A power supply connection line is applied to an integrated circuit package, including: • a first power supply ring and a first grounding ring, the first power supply ring and the first The grounding ring is respectively provided with at least one metal layer at a distance from each other; a plurality of metal wires are directly connected to the first power ring and the first ground ring for transmitting a positive voltage to the first power ring. Or transmitting a negative voltage to the first grounding ring; φ a plurality of power supply pads directly connected to the portions of the metal wires for providing the positive voltage; and a plurality of ground pads directly connected The portions of the metal lines are used to provide the negative voltage. 2. The power supply connection line according to claim 1, wherein the metal layer attached to the first power ring is a second ground ring, and the metal is attached under the first ground ring. The layer is a second power ring. Φ 3. The power supply connection line of claim 2, wherein the first power ring and the second ground ring are stacked, the first ground ring and the second power ring are stacked to form a stack structure. 4. The power supply connection line according to claim 1, further comprising: a plurality of connection holes; a plurality of metal exchange layers connected to the portions of the metal wires through the connection holes; and A plurality of power strips are connected between the first power ring, the first ground ring and the metal layers through the connecting holes and the plurality of layers of the 200814280 metal layer. 5. The power supply connection line of claim 4, wherein the power supply lines are interlaced and connected to each other through the connection holes. 6. The power supply connection line as described in claim 4, wherein some of the power supply belts are parallel to each other. 7. The power supply connection line of claim 4, wherein the first power ring, the first ground ring, the metal layers, and the power strips form a grid network. 8. The method for preparing a power supply connection line in a circuit, comprising: forming a first power ring and a first ground ring; respectively corresponding to the first power ring and the first ground ring Forming at least one metal layer at a pitch; providing a plurality of metal wires respectively connected to the first power ring, the first ground ring and the metal layers; providing a plurality of power supply pads for respectively connecting to the a first power ring and a portion of the metal layers; and a plurality of ground pads for respectively connecting the metal layers of the first ground ring and the other portion. 9. The method of claim 3, wherein the metal layer attached to the power supply ring is a second grounding ring, and the grounding ring is under the grounding ring. The metal layer attached is a second power ring. The method of the power supply connection line in the preparation circuit of the method of claim 8, further comprising: providing a plurality of connection holes; providing a plurality of metal exchange layers for transmitting the portion The connection holes are connected to the metal wires; and a plurality of pairs of power supply lines are provided to pass through the metal exchange layers and the portion of the connection holes, and are connected to the first power ring, the first ground ring and the metal layers. between. 11. The method of claim 1, wherein the pair of power supply straps are interlaced with each other and are connected to each other through the connection holes. 12. The method of claim 1, wherein each of the pair of power strips is parallel to the other of the power strips. 13. The method of claim 1, wherein the first power ring, the first ground ring, the metal layers, and the power strips are formed between the power supply lines in the integrated circuit of claim 10; A grid of networks. 18