200813307 九、發明說明： 【發明所屬之技術領域】 本發明大體而言係關於覆地板物及其安裝，且更特定言 之，係關於可移除及可重新配置之地磚式覆地板物。 【先前技術】 在建築業界始終存在對於效率、經濟性及速度之要求。 建築業界之表面覆蓋部分亦具有成本逐步升高之挑戰，該 挑戰由與地板安裝及移除程序相關之勞動力、材料及時間 V ·起在對於耐久性及可替換#之要求為持續衝突之需求 的地板業界中，此種對於時間、勞動力及材料之浪費尤為 明顯。習知地板通常經由預塗膠水或塗膠水、聯鎖機構、 襯底系統而安裝於底層地板（sub floor)上。若想要地板耐 久且防滑’就需要將其牢固地安裝於底層地板上。然而， λ!牛口地固疋至该底層地板’安裝或移除該地板就愈困 難且代價愈高。 在S知的地板安裝之前，很多勞動力、時間及材料被浪 費在移除現存地板及使得受損底層地板恢復至用於安裝新 地板的理想狀況上。移除現存地板經常引起膠水殘餘物殘 留於該底層地板之頂端表面上。移除現存地板或殘餘的已 更化膠水之過程通常亦損壞該底層地板。當移除完成時， 品要名員外勞動力、時間及材料以將該新地板牢固地安裝至 该底層地板上。舊地板材料之浪費性拋棄及對新地板鋪設 所而之另一組水泥、黏著劑或襯底系統之重複使用亦會引 起不必要的環境成本。 117958.doc 200813307 經製成為具有或不具有離型紙（release paper)之自黏著 地磚在此項技術中為已知的，且可有助於消除安裝新地板 材料時膠水之再塗覆。亦已開發聯鎖地板系統，以藉由使 相鄰地磚聯鎖而完全消除塗覆膠水之必要。在此項技術中 已開發襯底系統以消除有缺陷的底層地板狀況且使得可將 新地板直接緊固至該等襯底系統上而非底層地板上。200813307 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates generally to flooring and its installation, and more particularly to removable and reconfigurable floor coverings. [Prior Art] There are always requirements for efficiency, economy and speed in the construction industry. The surface coverage of the construction industry also has the challenge of increasing costs, the labor, materials and time associated with the floor installation and removal process, and the need for durability and replaceability. In the flooring industry, this waste of time, labor and materials is particularly evident. Conventional flooring is typically mounted to a sub floor via pre-applied glue or glue, interlocking mechanisms, and substrate systems. If you want the floor to be durable and slip resistant, you need to mount it securely on the subfloor. However, λ! Niukou is fixed to the subfloor. The more difficult and costly it is to install or remove the floor. Prior to the installation of the floor in S, many labor, time and materials were wasted on the removal of the existing floor and the restoration of the damaged subfloor to the ideal condition for installing a new floor. Removing the existing floor often causes glue residue to remain on the top surface of the subfloor. The process of removing an existing floor or residual modified glue also typically damages the subfloor. When the removal is complete, the employee is required to work outside the labor, time and materials to securely mount the new floor to the subfloor. The wasteful disposal of old flooring materials and the reuse of another set of cement, adhesive or substrate systems for new flooring can also cause unnecessary environmental costs. 117958.doc 200813307 Self-adhesive tiles made with or without release paper are known in the art and can help eliminate the recoating of glue when installing new flooring materials. Interlocking floor systems have also been developed to completely eliminate the need to apply glue by interlocking adjacent tiles. Substrate systems have been developed in the art to eliminate defective subfloor conditions and allow new flooring to be fastened directly to the substrate systems rather than the subfloor.
舉例而言，美國專利第6，129,967號中揭示一用於在不使 用支撐黏著基板之條件下，將易碎瓷磚固定至一底層地板 之系統° —襯裏被使用以提供結構支撐，且存在一能量吸 收層，該能量吸收層允許地磚經受更大的磨損力而不破 裂。該襯裏附著至一底層地板，且該等地碑被置於該襯墊 及一抗衝擊陶瓷層内部且錨定至其上。 美國專利第6,694,689號揭示一模組地板系統，其利用一 自由鋪設支撐底板，其中裝設可替換的磨損表面地磚 (wear surface tile)。該底板置於一先前已存在之磨損地板 上方時可提供一水平地板表面’且可在該底板上部構造内 提供對地板之移除及替換。該複合底板結構容許獨立地暫 時將該等地碑中之每一者予以移位。 美國專利第4,654,244號揭示一包括兩層增強材料之活動 鋪設（loose-lay)地板結構，該兩層材料適於用在穩定及不 穩定底層地板上。地板之剛度係經由夾有一襯墊層之兩層 增強材料實現。表面層被置於該等增強層之外部7此種二 強被設計用來防止在滾壓負載下之翹曲、捲曲及凸起。 美國專利第6,751，917號揭示-在底部不具有黏著㈣層 117958.doc 200813307 之地板碑結構。各地磚之表面 n ^ u ^ ^ 日及底D卩層分別附接至具有 &敏性的軟質雙面膠帶之上表面及下 能由岩石、金屬或其 ' μ表面層可 面。养^ ^ H且周邊為光滑橫截 面稭由將一地磚之中間突起凸面 地碑之凸面邊緣上且使1在之黏者劑置於相鄰 碡…” 使一者在中間結合在-起而接合地 磚攸而不而要進行底部黏著。 美國專利第6,751，912號揭示一模έ 聯鎖地磚及地板系 碑經調適以純至另—聯鎖地磚。各地磚包括一 μ置面及兩個凸聯鎖邊及兩個凹聯鎖邊之本體…“ =機構經調適以允許該等模組式聯鎖地磚以交錯連: 在一起。 $ 美國專利第Μ〇2，159號揭示-捲起地磚系統。個別地磚 以一方式鎖定在-起而形成複數個不可f曲之地碑接合 點。地磚包括沿-軸線之一鉸鏈或摺線。該等鉸鏈允許多 ㈣碑表面沿該等軸線中之一者自任何方向捲起成一中空 官。所捲起之地板面板由複數個地磚面板組成。 美國專利第6,769,217號揭示—互連的可分離地板系統。 «統包括兩個或兩個以上之地板面板’該等地板面板包 括一頂端磨損表面及-與支撐結構接觸之底部表面。該等 面板具有至少二個邊緣且所有邊緣中均形成有凹座。該系 統亦包含-連接器’該連接器具有—基底及一自該基底垂 直延伸之突出件。自該基底延伸之突出件經形成而以可分 離的垂直連接之方式收納於該等面板之該等凹座中。 美國專利第M〇3,〇99號揭示-自黏著表面覆蓋物，其具 117958.doc 200813307 有-磨損表面及-在該磨損表面之下表面上之壓敏黏接層 及-安置於該黏接層上之障壁層。該表面覆蓋物在約1〇 _、M(TF下大體上無黏性。但在約2Q㈣、价下具有黏 性。在該黏接層中亦可採用一大體上無黏絲(n〇n_ 价inging)之黏著劑。該障壁層大體上包括非㈣性顆粒， 該等顆粒在安置於該黏接層上時具有至少約1〇 _的抗碰 撞性。製造該自黏著表面覆蓋物之方法包括塗覆一黏著劑 至一基板以形成具有黏著表面之黏接層，且塗覆一大體上 包含非黏著性顆粒之障壁層至該黏著表面以形成該表面覆 蓋物。該等顆粒當安置於該黏接層上時具有至少約ι〇 的抗碰撞性。 美國專利第M05，100號揭示一黏著性薄板帶，其為單面 或雙面壓敏黏著性的，可藉由在結合平面之方向上對一握 柄廣泛拉伸/拉動而再分開，其中該握柄具有至少為 CN之靜摩擦力。 ‘ Ο 美國公開專利申請案第20040129365號揭示—用於覆地 板物系統之預塗膠水襯底總成，其具有大體上剛性i襯 底。該襯底具有-上表面及一下表面，及安置於該上表面 上之塵敏黏接層及位於該黏接層上之釋放層。 前述先前技術之地板系統及方法中無—係完全令人滿 意。仍存在對於當黏著至一底層地板時耐久且H且在 不需要時間、勞動力、成本、工具或能量之額外投資的條 件下能夠容易i也安裝且移除之地板系統之需纟。另外，此 項技術中存在對於—種具有接近！ G Q %之徹底可移除率（亦 117958.doc 200813307 即，其將不損壞底層地板、不遺留顯著的膠水殘餘物，在 其移除過程中亦不會分層&受損）幻呆留其所有有利特徵 及原始黏著性以使得其在反覆安裝及移除之後可重新配置 或重新使用之地板系統之需求。同樣提供一種高效且徹底 亚且在過程中無移除膠水殘餘物及產生材料浪費之負擔的 地板安裝及替換方法係有益且為吾人所樂見的。而且：需 要在地板中提供濕氣釋放增強功能以作為一額外特徵，以 將累積於地磚接縫之中及之下的灰塵及污垢降至最少，且 釋放由於底層地板中之濕氣而積聚之壓力。另外；需要提 供一地板黏著方法，其在被接觸時不具有”黏性，，，不遺留 膠水殘餘物’防滑且適於地碑之長期及臨時安裝。此外， 需要提供一種地板解決方案，其可以自己動手（D〇_it_ Yourself) ”黏、剝、黏，，之方式輕易安裝、移除且再安裝， 以便該地板可由一未經培訓者完好地自一位置轉移至另一 位置，就像一件傢具。 【發明内容】 本舍明係關於作為地板碑、薄板或板材之結構改良的可 移除地板及表面覆蓋物，其包括地板磚、薄板及板材或具 有不同尺寸及形狀及表面類型之區域，該等表面類型包括 自聚氯乙焊、橡膠、油氈、聚合樹脂、增強樹脂、乙烯複 合物或其他彈性材料、地毯、石頭、陶瓷、金屬、玻璃、 纺織品、木材、其呈所要組合之複合物、其呈所要組合之 層板及其呈所要組合之層壓板製成之彼等，下文中其全部 稱作”地板區域、覆地板物或地板磚，，。 117958.doc •10- 200813307 择更特定3之，本發明提供一具有一雙背襯層（包含一塗 復=可重新配置之壓敏黏接層之發泡層）之覆地板物。 又月襯層允许僅略微施加壓力而將該覆地板物直接安裝 -曰地板表面，而不需膠水或襯底系統之任何額外塗 知’主μ的，此雙背襯層增強覆地板物可輕易自該底 層地板移除而無任何膠水殘餘物或對於該底層地板或地板 土板之任何損壞。另外，該同一覆地板物可被再次安裝而For example, U.S. Patent No. 6,129,967 discloses a system for securing frangible tiles to a subfloor without the use of a supporting adhesive substrate. The lining is used to provide structural support and there is a An energy absorbing layer that allows the tile to withstand greater wear without breaking. The liner is attached to a subfloor and the indicia are placed inside the liner and an impact resistant ceramic layer and anchored thereto. U.S. Patent No. 6,694,689 discloses a modular flooring system utilizing a freely laid support floor in which a replaceable wear surface tile is mounted. The floor panel provides a horizontal floor surface when placed over a previously existing worn floor and provides for removal and replacement of the floor within the floor structure. The composite floor structure allows for the temporary displacement of each of the monuments independently. U.S. Patent No. 4,654,244 discloses a loose-lay floor structure comprising two layers of reinforcing material suitable for use on a stable and unstable subfloor. The stiffness of the floor is achieved by two layers of reinforcing material sandwiched by a backing layer. The surface layer is placed on the outside of the reinforcing layers. 7 These two strengths are designed to prevent warpage, curling and bulging under rolling load. U.S. Patent No. 6,751,917 discloses a floor monument structure having no adhesive (four) layer 117958.doc 200813307 at the bottom. The surface of the bricks around the n ^ u ^ ^ day and the bottom D layer are attached to the upper surface of the soft double-sided tape with & sensitivity and can be covered by rock, metal or its 'μ surface layer. Raise ^ ^ H and the periphery is a smooth cross-section straw by placing the middle of a floor tile on the convex edge of the convex landmark and placing the adhesive agent in the adjacent 碡..." so that one is combined in the middle Bonding the floor tiles and not the bottom is to be adhered. U.S. Patent No. 6,751,912 discloses that the interlocking floor tiles and the floor tombstones are adapted to be pure to another interlocking floor tiles. The tiles in each area include a μ face and two protrusions. The interlocking edge and the body of the two concave interlocking edges..." = The mechanism is adapted to allow the modular interlocking tiles to be staggered: together. $ US Patent No. 2,159 Rev. - Roll up the floor tile system. Individual tiles are locked in one way to form a plurality of non-fable landmark joints. The floor tile includes a hinge or fold line along one of the - axes. The hinges allow the surface of the multi (four) monument to be rolled up in any direction along one of the axes into a hollow official. The rolled up floor panel consists of a plurality of floor tiles panels. U.S. Patent No. 6,769,217 discloses an interconnected separable flooring system. «The system includes two or more floor panels' These floor panels include a top wear surface and a bottom surface that is in contact with the support structure. The panels have at least two edges and recesses are formed in all of the edges. The system also includes a connector that has a base and a projection that extends perpendicularly from the base. The projections extending from the base are formed and received in the recesses of the panels in a separable vertical connection. U.S. Patent No. M3, No. 99 discloses a self-adhesive surface covering having 117958.doc 200813307 having a wear surface and a pressure sensitive adhesive layer on the lower surface of the wear surface and - disposed on the adhesive The barrier layer on the layer. The surface covering is substantially non-viscous at about 1 〇, M (TF, but has a viscosity at about 2Q (four), a price. A substantially non-sticky wire can also be used in the adhesive layer (n〇n_) The barrier layer generally comprises non-(tetra) particles having a collision resistance of at least about 1 在 when disposed on the adhesive layer. Method of making the self-adhesive surface covering The method includes applying an adhesive to a substrate to form an adhesive layer having an adhesive surface, and coating a barrier layer substantially comprising non-adhesive particles to the adhesive surface to form the surface covering. The adhesive layer has an impact resistance of at least about 1 〇. U.S. Patent No. M05,100 discloses an adhesive sheet strip which is single-sided or double-sided pressure-sensitive adhesive, which can be bonded to a flat surface. In the direction, a handle is widely stretched/pulled and then separated, wherein the handle has a static friction force of at least CN. Ο US Published Patent Application No. 20040129365 - Pre-coated glue lining for a flooring system a bottom assembly having a substantially rigid i-liner The substrate has an upper surface and a lower surface, and a dust-sensitive adhesive layer disposed on the upper surface and a release layer on the adhesive layer. The prior art flooring system and method are completely-free. Satisfactory. There is still a need for a floor system that can be easily installed and removed when it is durable to H and adheres to an underlying floor and requires no additional investment in time, labor, cost, tools or energy. In addition, there is a complete removability rate in the technology that has a closeness to ! GQ % (also 117958.doc 200813307 ie, it will not damage the subfloor, leaving no significant glue residue in the removal process) It also does not stratify & damage) the need to retain all its advantageous features and original adhesion to allow it to be reconfigured or reused after repeated installation and removal. Also provides an efficient and thorough The floor installation and replacement methods that do not remove the glue residue and the waste of material waste during the process are beneficial and enjoyable to us. Also: need to be in the floor Provides moisture release enhancement as an additional feature to minimize dust and dirt build up in and under the floor tile joints and release pressure build-up due to moisture in the subfloor. A floor bonding method that does not have "stickiness when contacted, and does not leave glue residue" non-slip and suitable for long-term and temporary installation of the monument. In addition, it is necessary to provide a floor solution that can be self-employed ( D〇_it_ Yourself) ” sticky, peeling, sticky, and easy to install, remove and reinstall, so that the floor can be transferred from one location to another without an untrained person, like a piece of furniture [Description of the Invention] The present invention relates to a removable floor and surface covering as a structural improvement of a floor monument, a sheet or a sheet, which includes a floor tile, a sheet and a sheet or an area having different sizes and shapes and surface types. These surface types include self-polyvinyl chloride, rubber, linoleum, polymeric resins, reinforced resins, ethylene composites or other elastomeric materials, carpets, stones, Porcelain, metal, glass, textile, wood, composites in the desired combination, laminates in the desired combination, and their laminates in the desired combination, hereinafter referred to as "floor area, Covering the floor or floor tiles,. 117958.doc • 10-200813307 To be more specific, the present invention provides a covering having a double backing layer comprising a coating layer of a pressure-sensitive adhesive layer of a reconfigurable pressure-sensitive adhesive layer. The monthly lining allows the floor covering to be directly applied to the floor surface with only a slight application of pressure, without the need for glue or any additional coating of the substrate system. The double backing layer enhances the floor covering. It is easily removed from the subfloor without any glue residue or any damage to the subfloor or floor slab. In addition, the same covering can be installed again.
2失去其原始黏性之有效性。因此，提供了 一種自黏著、 不夕味且Ί里_ (从稱為”黏、剝、黏"）之活動鋪設覆地板 物0 在個貫施例中，提供一包括一頂端表面或磨損層之覆 也板物，δ亥覆地板物通常具有一配置於該磨損層下方之背 7層。一#見墊層配置於該背襯層下方，其包括—最底部模 壓表面，該最底部模壓表面界定複數個通道，該等通道由 複數個槽脊區彼此分離。一具有一初始黏性的可重新配置 之壓敏黏接層被塗覆至該襯墊層之最底部表面上，以便該 襯墊層⑴黏著至一表面，藉此在施加壓力之後將該襯墊層 口疋於合適位置，但（ii)允許自該表面移除該襯墊層而不 使該初始黏性出現大量消減，以便該覆地板物可重新配置 於該底層地板上。 在另一實施例中，提供一包括一頂端表面或磨損層之覆 地板物。一經劃分之襯墊層位於該背襯層下方，其具有一 最底部模壓表面，該模壓表面界定複數個交又通道，該等 通道由複數個槽脊區彼此分離，其中該等槽脊區中之每一 H7958.doc 200813307 者包含-頂端表面。一具有—初始黏性的可重新配置之壓 敏黏接劑被塗覆至該等槽脊區之頂端表面上，以便該經劃 分之襯塾層⑴黏著至-表面，藉此在施加壓力之後將該概 墊層固定於合適位置，且（π)允許自該表面移除該概塾層 而不使該初始黏性發生大量消減，以便該覆地板物可重新 配置於該底層地板上。2 Loss of the effectiveness of its original viscosity. Therefore, it provides a self-adhesive, undamaged and Ί _ (from what is called "stick, peel, sticky") to lay the floor covering 0 in a uniform embodiment, providing a top surface or wear The lining of the layer also has a back 7 layer disposed under the wear layer. A #下垫 layer is disposed under the backing layer, and includes a bottommost molded surface, the bottommost portion The molded surface defines a plurality of channels separated from each other by a plurality of land regions. A reconfigurable pressure sensitive adhesive layer having an initial viscosity is applied to the bottommost surface of the backing layer so that The backing layer (1) is adhered to a surface whereby the backing layer is placed in place after application of pressure, but (ii) the backing layer is allowed to be removed from the surface without causing substantial Subtracting so that the overlying material can be reconfigured on the subfloor. In another embodiment, a covering comprising a top surface or a wear layer is provided. A divided backing layer is located below the backing layer, It has a bottommost molded surface The molded surface defines a plurality of intersecting channels, the channels being separated from each other by a plurality of land regions, wherein each of the land regions comprises a top surface. A reconfigured pressure sensitive adhesive is applied to the top surface of the land regions such that the divided backing layer (1) adheres to the surface, thereby securing the cushion layer to a suitable pressure after application of pressure Position, and (π) allows the profile layer to be removed from the surface without substantial reduction of the initial viscosity so that the overlay can be reconfigured on the subfloor.
亦提供-用於調整一覆地板物之表面輪廓之方法，其中 將-經劃A之襯墊層开嫩一自㈣、活動鋪践磚之一 底部表面上，以界定複數個可移除墊區段。為了補償—底 層地板上之凸起或凹坑’例如，一地板之一釘子或部分或 -孔或低窪點，將墊區段中之至少一者自其在覆地板物之 最底部表面之位置處移除，#此在該經劃分之槪塾層中形 成一適於接受且容納該凸起之空隙。 在另一用於調整一覆地板物之表面輪廓之方法中，在一 自黏著、活動鋪設地碑之—底部表面上形成-經劃分之襯 墊層’以界定複數個可移除墊區段。為了補償一底層地板 上之凸起或凹坑，例如，一地板之一釘子或部分或一孔或 低窪點，將墊區段中之至少一者自其在覆地板物之最底部 表面之位置處移除，藉此在該經劃分之襯墊層中形成一適 於接叉且容納該凸起之空隙，且被移除之墊區段被定位於 對應於底層地板中之凹坑之位置的該經劃分之襯墊層之一 部分上。 【實施方式】 吾人期望結合附圖閱讀此對於較佳實施例之描述，該等 117958.doc 12 200813307 發明之整個書面說明之部分。為了清晰及簡 -之目的，蝴圖未必根據比例繪製 特徵可以誇示比例< - 明φ，m 度上之示意形式展示。在說 及对生二水平”、”垂直”、"上”、”下”、”頂端'’及，，底部” 及其何生柯（諸如"水平地”、”向下，，、”向上，，等）之相對性 術語應解釋為意指如所描述或如所論述之圖式中所示之方 位=寻相對性術語係為描述之方便，且通常不意欲要求 …疋方位。包括"向内，，相對"向外·，、"縱向”相對”橫向” =類似詞之術語應被適當地㈣於彼此或相對於伸長轴 =或凝轉軸線或旋轉中心來加以解釋。有關附 術語，諸如"連接，，及"互連"，意指其中結構直 接或經由介入結構而間接被固定或附接至彼此之關係，以 ，及可移動或固^的附接或關係，除非另作明確說明。術語 可操作地連接”係一允許有關結構根據彼關係按需操作之 附接、叙接或連接。在申請專利範圍中，若使用了手段附 加功能（means·一·如⑷叫㈣，則意欲涵蓋由用於執行 所引用功能之書面描述或圖式明顯描述、建議或呈現之結 構，不僅包括結構均等物且包括等效結構。 、° 參看圖1至圖5’根據本發明之一第一實施例形成之一地 板區域10可至少部分地自以下覆地板物材料類型中之任— 者形成，該等材料類型包括（但不限於）聚氯乙烯、橡膠、 油耗、聚合樹脂、增強樹脂、乙稀複合物或其他彈性材 料、地毯、石頭、陶£、金屬、玻璃、紡織品、木材、发 呈所要組合之複合物、其呈所要組合之層板及其呈所要組 117958.doc 13 200813307 合之層壓板，在下文中並 τ具全部稱作”地板區域”。 地板區域10通常包人一 ^ 3 一自黏著、活動鋪設安裝之覆地板 物，其可具有多層或 ^ ^ 了為冋貝的，亦即天然石頭或木材， 其包括一上磨損表面 一内黏接層12，該内黏接層12將 上磨損表面11固定至一细敎 襯墊材料層13。藉由經固化或未經 固化之黏著劑的背襯塗層 、 曰而柘供另一黏接層1 4。更特定言 之上磨知表面11較佳由聚氯乙稀（PVC)、陶变、石頭或 ί Ο 其他合適表面材料形成，且視藉以製成其之特定材料而定 可具有不同寬度、厚度、穷声另、# ^…， ^ 在反汉遌琢形狀設計、色彩、圖 案、化學性質或組成。上磨指# 工足积表面1 1係由其上表面丨丨a(形 成地板區域1G之最上部磨損表面）及其下表面m(地板區域 1〇之最底部表面）界定。 概塾材料層13由其上表面13a及下表面13b界定。概塾材 料層13通常包含各種軟質、彈性材料，該等材料包括（作 不限於）可發泡聚合物，且尤其包括，諸如化學吹製之聚 虱乙烯塑料溶膠/有機溶膠、丙烯酸樹脂、橡膠發泡體、 聚胺基甲酸醋發泡體’諸如聚氣乙烯塑料溶膠、丙烯酸樹 脂之泡沫發泡體，諸如聚氯乙烯、聚乙烯、乙烯醋酸乙烯 酯、茂金屬聚烯烴、彈性體聚烯烴共聚物之熔製（melt processed)發泡體之發泡層。此外，亦可採用發泡或非發 泡之任何軟質、彈性或襯墊材料。襯墊材料層丨3之厚度通 常約為〇·1 mm至1.0 mm，通常較佳約為〇·2 mm。襯墊材料 層13提供了地板區域10與底層地板之間的均句分佈接觸。 此又顯著提高了地板區域10之平整黏著度，且增強地板區 117958.doc • 14- 200813307 域1 〇之吸音效果同時使得於製成地板上行走時將更舒適且 地板更具吸振性。 上磨損表面11經由一内黏接層12而黏著至襯墊材料層 13。内黏接層12將下表面ub黏接至襯墊材料層13之一最 〜 上部表面13a。通常將一可重新配置之壓敏黏接層14作為 • 一經固化或未經固化黏著劑之塗層而加以形成或塗覆，在 非常輕微之壓力下其就附著至該底層地板上，但允許提 / I 私除且重新配置地板區域1 〇而使其原始，，黏性，，大體不 X於音，且不會有膠水殘餘物或使底層地板分層。包含内 黏接層14之可重新配置之壓敏黏著劑可包括許多不可固化 或可固化之黏著劑，包括橡膠類型黏著劑、pvc類型黏著 劑、丙烯酸系黏著劑、電子束可固化丙烯酸系黏著劑、乙 酸乙稀S旨類型黏著劑、胺基甲酸酯類型黏著劑及其組合。 可重新配置之壓敏黏接層14之下表面14b必須提供足夠黏 著性質以在使用期間將地板區域1〇維持於合適位置，但亦 U 係可釋放的以便地板區域10可（在某些時候反覆）被移除及 重新配置。換g之，在施加一壓力之後，可重新配置之壓 敏黏接層14有利地以一將該襯墊層固定於合適位置之初始 黏性附著至一表面，但允許自該表面（例如，底層地板）移 除該襯墊層而不使其初始黏性發生大量消減。已發現一提 供合適結果之黏著劑係由經改質之丙烯酸酯製成，其黏度 為3000-5000 cps/25°C，密度為Hu g/cm3，且固化速度 大於10 M/min/Lamp (80 ，其中8〇0/〇為活性組份。 用於此特定黏著劑之塗佈方法可為反轉滾塗機、前向滾塗 117958.doc -15 - 200813307 機、刮漿刀、氣刀或其他類似塗佈裝置。當然，亦可結合 本發明使用如此項技術中熟知之不需固化之可重新配置之 壓敏黏著劑。 下表面13b黏著至經固化黏接層14之背襯塗層。在一個 貫施例中，塗覆於發泡層下表面131}上之可重新配置之壓 敏黏接層之標準為任何可固化黏著劑：其（1)經固化或交聯 處理；（2)具有足以將顆粒結合或固定至該黏著表面且維持 該背面層與該底層地板之接觸之初始黏性，（3)無黏絲且相 切辦顆粒滲透或壓縮；（4)平均厚度約為〇 〇3 rnm至〇 〇5 mm 但視所使用黏著劑而定可小於〇·〇3 mm或大於0.05 mm。襯墊材料層13可具有約〇5 mm至3〇 mm之厚度，但 可視所使用發泡材料而變化。該可重新配置之壓敏黏著劑 之厚度可按慣例確定，通常在0·01 mm至〇·3 mm之間，但 厚度較佳小於〇. 1 mm 〇 參看圖3及圖4，本發明之另一實施例包含一地板區域 20，该地板區域2〇包括一濕氣釋放通道層24。更特定言 之’地板區域20包含多個層，包括一磨損表面層2 1，其形 成可見之最上層且為接觸及磨損表面。磨損表面層係由 其上表面21a(其為樣本地板區域組件20之最上的接觸及磨 損表面）及其底部表面21b界定。一内黏接層22黏著至磨損 表面層21之下表面21b。磨損表面層幻較佳由聚氯乙烯 (VC)陶兗、石頭或其他合適表面材料形成，且視藉以 製成其之特定材料而定可具有不同寬度、厚度、密度及邊 緣形狀設計、色彩、圖案、化學性質或組成。磨損表面層 H7958.doc -16- 200813307 2 1通常經由一内黏接層22而應用至襯墊材料層23。内黏接 層22黏著至底部表面21b及表面23a(其為襯墊材料層23之 最上部表面）。 當概墊材料層23位於磨損表面層21下方時，其最底部部 刀界疋屬氣釋放通道層24。濕氣釋放通道層24包含位於複 • 數個槽或通道27之間且分離該複數個槽或通道27之複數個 槽脊區26 ’該等槽或通道27以規則間隔配置於地板區域2〇 ^ 之底部上。較佳藉由壓製或模壓襯墊材料層23之最底部表 回乂座細械史利料層2 3之部分而形成槽或通道2 7，同時使 襯墊材料層23之與槽或通道27相鄰之該等部分維持於或接 近於其原始厚度以界定槽脊區26而形成濕氣釋放通道層 24。另外，視模壓情況而定，槽脊區％亦可經壓縮以小於 其原始厚度。可重新配置之壓敏黏接層1仆經塗覆至襯墊 材料層23之下表面23b。在一個實施例中，（圖3)槽脊區％ 及通道27可在地板區域2〇之長度及寬度範圍内彼此平行延 (伸。在施加一壓力之後，可重新配置之壓敏黏接層14b有 利地以一將該襯墊層固定於合適位置之初始黏性黏著至一 表面，但允許自該表面（例如，底層地板）移除該襯墊層（亦 即’地磚）而不使初始黏性發生大量消減。 襯塾材料層23可包含軟質、彈性材料之任一者或組合， 該等材料包括（但不限於）可發泡聚合物或發泡體，諸如化 T吹製之聚氣乙烯塑料溶膠/有機溶膠、丙烯酸樹脂、橡 膠發泡體、聚胺基甲酸酯發泡體，諸如聚氣乙烯塑料溶 膠、丙烯酸樹脂之泡沫發泡體，諸如聚氯乙烯、聚乙烯、 H7958.doc 200813307 乙烯醋酸乙烯酯、茂金屬聚烯烴、彈性體聚烯烴共聚物之 I製發泡體’只要其在被根據本發明之一態樣壓縮或以其 它方式模壓之後易於產生形變。另外，亦可採用發泡或非 舍泡之任何軟質、彈性或襯墊材料。襯墊材料層23及槽脊 區26之厚度通常約為0·1 mm至1.0 mm，且通常較佳約為 〇·2 mm，其中襯墊材料層23之界定槽或通道”的彼等部分 具有一約為0.2 mm或小於0.2 mm之模壓厚度。 可重新配置之壓敏黏接層i 4b塗覆於濕氣釋放通道層24 之最底部表面上，且充當—可釋放膠水以蔣地板區域2〇固 疋於底層地板上之合適位置，同時有利地允許將地板區域 2〇移除、重新配置，且然後重鋪至該底層地板上。可重新 配置之壓敏黏接層14b可由橡膠類型黏著劑、丙烯酸系黏 著劑（包括電子束可固化丙烯酸系黏著劑）、乙酸乙烯酯類 型黏著劑、胺基曱酸酯類型黏著劑及其組合或此項技術中 熟知之任何其他可固化或不可固化的壓敏黏著劑形成。 濕氣釋放通道層24成型至該底層地板（其鋪設於該底層 地板上）且增強該地板區域附著於該底層地板上之表面張 力。忒成型抵抗水平或對角拉力及在底層地板上之移動。 由於提供通道27，最佳使用一平行於該襯墊材料層23上之 垂直結構襯裏之拉力而自底層地板移除地板區域20。地板 區域20保持完好且不可用一水平或對角拉力輕易移位。濕 氣釋放通道層24允許水分自其與該底層地板之接觸點蒸 ^有助於維持地板區域與該底層地板之黏著且維持地板 £域20之審美價值。此配置亦防止非所需顆粒積聚在地板 117958.doc -18 - 200813307 區域20處且汗損地板區域2()或損壞濕氣釋放通道層μ 底層地板之接觸點。 3 /、Μ 爹看圖5，以根據本發明形成之乙烯基地磚之形式提供 地板區域20之典型生產過程之流程圖。該生產過程遵循經 由擠壓、壓光或熱壓層的通常習知之製備地磚之方法。夂 :圖解4】’該過程可開始於一頂層，該頂層可為亦可包: 一印花設計的聚乙烯薄膜。然後根據圖解42所示之過程， 該聚氯乙烯薄膜經由熱層壓而擠製成地碑。圖解^所涉及 之過程開始於聚氯乙烯化合物，其與碳酸鈣混合且經二 BumberIy處理，且由—壓擠機擠製成地磚。然後該地:表 面可經模壓、冷卻及退火。然後將膠水塗覆至該地碑背 面。然後發泡層（本發明之該第一層）被組合至根據本發明 之地碑材料。圖解43展示併人該發泡層之過程。圖解们開 始於一可發泡材料化合物’其經由—Bumbedy處理、經^ 壓且切割以適合已製成之地磚材料。 如圖解41所涉及，繼該發泡體黏著至該地磚之背部上且 成型之後，該地磚之背部表面經平滑化，經模壓以產生槽 脊區26及通道27，且然後將黏著劑塗覆至該發泡層上，I 在某些實施例中接著以紫外光進行乾燥/固化。然後完成 該生產過程，且地磚已準備好進行包裝。 參看圖6至圖24，本發明之又一實施例提供對於襯墊層 之移除及再調整以適應底層地板中之不均勻。更特定古 之，地板區域50包含多個層，該等層包括磨損表面層52、 一背襯層54及一可分開之襯墊材料層56。磨損表面層52包 117958.doc -19- 200813307 括一最上部透明薄膜表面58，且通常包括一印花薄膜層 6〇，該印花薄膜層60形成可見的最上部層，該等最上部層 形成地板區域50之接觸及磨損部分。背襯層54可由聚氯乙 烯（PVC)、陶瓷、石頭或其他合適支撐材料形成，且可具 • 有不同寬度、厚度、密度及邊緣形狀設計。一内黏接層62 • 黏著至磨損表面層52之下層表面以黏著背襯層54之一最上 部表面，且另一内黏接層63( —可重新配置之壓敏黏接 f 層’諸如黏接層14b)經黏著至背襯層54之一底部表面以黏 著可分開襯墊材料層56之一最上部表面。内黏接層63有利 地以一初始黏性（繼施加壓力之後該初始黏性將可分開之 襯墊材料層56固定於合適位置）黏著至背襯層54之底部表 面，但允許可分開之襯墊材料層56自背襯層54之底部表面 移除而不使初始黏性產生大量消減。 可分開之襯墊材料層56包含複數個可移除墊區段70，亦 即襯墊材料層5 6經配置及構造以被分離或劃分為複數個單 () 獨且離散之區段。每一塾區段7〇經由劃線72(其允許自地 板區域50移除個別墊區段70(圖12))，亦即穿過襯墊材料56 •之厚度的交叉切割或切口之柵格，而自其相鄰墊區段分 離，以使得其能夠被劃分為複數個單獨且離散的墊區段。 每一墊區段70之最底部表面亦經壓製或模壓以界定位於複 數個槽或通道7 7 (該等通道7 7以規則間隔配置於地板區域 50之底部表面上）之間且分離該複數個槽或通道77之複數 個槽脊區76。詳言之，較佳藉由壓製或模壓該最底部表面 以壓縮可分開襯墊材料層56之部分而形成槽或通道77 ’且 117958.doc -20- 200813307 使可分開之襯墊材料層56之與槽或通道77相鄰之該等部分 維持於或接近於其原始厚度以界定槽脊區7 6而形成每一墊 區段70之最底部表面。可分開之襯墊材料層％可另外包含Also provided is a method for adjusting the surface profile of a floor covering, wherein the padding layer of the A layer is opened on a bottom surface of one of the movable paving bricks to define a plurality of removable mats. Section. In order to compensate - a bump or a dimple on the subfloor', for example, a nail or part of a floor or a hole or a low point, at least one of the pad sections from its position on the bottommost surface of the floor covering Removed, this creates a void in the divided layer that is adapted to receive and accommodate the protrusion. In another method for adjusting the surface profile of a floor covering, a -divided liner layer is formed on a bottom surface of a self-adhesive, active paving monument to define a plurality of removable pad segments . In order to compensate for a protrusion or a pit on a subfloor, for example, a nail or a portion or a hole or a low point of a floor, at least one of the pad segments is located from the bottommost surface of the floor covering Removing, thereby forming a void in the divided liner layer that is adapted to engage and receive the projection, and the removed pad section is positioned to correspond to the location of the dimple in the subfloor Part of the divided liner layer. [Embodiment] It is intended that the description of the preferred embodiments, such as the entire written description of the 117958.doc 12 200813307, be read in conjunction with the accompanying drawings. For the sake of clarity and simplicity, the butterfly is not necessarily drawn according to the scale. The feature can be exaggerated as a scaled representation of the scale < - φ, m degree. "Speaking of the second level", "vertical", "up", "down", "top" and ", bottom" and He Shengke (such as "horizontal", "downward,", The relative terms of "upward,", etc., are to be interpreted as meaning that the orientation as indicated in the drawings or as illustrated in the drawings, the relative terminology is convenient for the description, and is generally not intended to require a 疋 orientation. Including "inward, relative"outward,, "longitudinal"relative to "lateral" = similar terms should be appropriately (four) applied to each other or to the axis of elongation = or axis of convergence or center of rotation Explanation. The terminology, such as "connect," and "interconnect", means that the structure is indirectly fixed or attached to each other directly or via an intervening structure, and is removable or attached. Or relationship, unless otherwise stated. The term operatively connected "is an attachment, splicing or connection that allows the structure to be operated on demand according to the relationship. In the scope of the patent application, if a means of additional functions is used (means·1·(4) is called (4), then Structures that are clearly described, suggested, or presented by a written description or schema for performing the functions referred to, include not only structural equivalents but also equivalent structures., see FIGS. 1 through 5', in accordance with one of the present invention Embodiments Forming a floor area 10 can be formed, at least in part, from any of the following types of flooring materials, including but not limited to, polyvinyl chloride, rubber, fuel consumption, polymeric resins, reinforced resins, Ethylene composites or other elastic materials, carpets, stones, ceramics, metals, glass, textiles, wood, composites to be combined, the laminates to be combined and their desired groups 117958.doc 13 200813307 The laminates, hereinafter referred to as "floor areas", are generally referred to as "floor areas". The floor area 10 is usually covered by a self-adhesive, movablely laid floor covering. It may have a plurality of layers or mussels, that is, natural stone or wood, comprising an upper wear surface, an inner adhesive layer 12, which fixes the upper wear surface 11 to a fine lining. Pad material layer 13. The other adhesive layer 14 is supplied by a backing coating of a cured or uncured adhesive, and more specifically, the surface 11 is preferably made of polyvinyl chloride. (PVC), ceramic, stone or Ο Ο Other suitable surface materials are formed, and depending on the specific material from which they are made, they may have different widths, thicknesses, poor sounds, #^..., ^ in the shape of anti-Han Design, color, pattern, chemical properties or composition. Upper grinding finger #工足积面1 1 is composed of its upper surface 丨丨a (the uppermost wear surface forming the floor area 1G) and its lower surface m (floor area 1〇 The bottommost surface is defined. The outline material layer 13 is defined by its upper surface 13a and lower surface 13b. The outline material layer 13 generally comprises various soft, elastic materials including, without limitation, foamable polymers. And especially including, for example, chemically blown poly(ethylene) plastic dissolves /organosol, acrylic resin, rubber foam, polyurethane foam 'such as polystyrene plastisol, acrylic foam foam, such as polyvinyl chloride, polyethylene, ethylene vinyl acetate, Mao a foamed layer of a melted foam of a metal polyolefin or an elastomeric polyolefin copolymer. Further, any soft, elastic or cushioning material which is foamed or non-foamed may be used. The thickness of the crucible 3 is usually about 1·1 mm to 1.0 mm, and is usually preferably about 〇·2 mm. The gasket material layer 13 provides a uniform distribution contact between the floor region 10 and the subfloor. The flatness of the floor area 10 and the reinforced floor area 117958.doc • 14-200813307 The sound absorption effect of the field 1 makes it more comfortable to walk on the floor and absorbs the floor more. The upper wear surface 11 is adhered to the backing material layer 13 via an inner bonding layer 12. The inner bonding layer 12 bonds the lower surface ub to one of the uppermost surface 13a of the spacer material layer 13. A reconfigurable pressure sensitive adhesive layer 14 is typically formed or coated as a coating of a cured or uncured adhesive which adheres to the subfloor under very slight pressure, but allows Raise/I privately and reconfigure the floor area 1 to make it original, viscous, generally not audible, and without glue residue or layering the subfloor. The reconfigurable pressure sensitive adhesive comprising the inner adhesive layer 14 may comprise a plurality of non-curable or curable adhesives, including rubber type adhesives, pvc type adhesives, acrylic adhesives, electron beam curable acrylic adhesives. Agent, vinyl acetate type adhesive, urethane type adhesive and combinations thereof. The lower surface 14b of the reconfigurable pressure sensitive adhesive layer 14 must provide sufficient adhesive properties to maintain the floor area 1〇 in place during use, but also U can be releasable so that the floor area 10 can (at some point) Repeatedly) removed and reconfigured. In other words, after applying a pressure, the reconfigurable pressure sensitive adhesive layer 14 is advantageously adhered to a surface with an initial tack that secures the backing layer to a suitable location, but is allowed from the surface (eg, The subfloor) removes the liner layer without substantial reduction in its initial tack. Adhesives have been found to provide suitable results from modified acrylates having a viscosity of 3000-5000 cps/25 ° C, a density of Hu g/cm 3 , and a cure speed greater than 10 M/min/Lamp ( 80, wherein 8〇0/〇 is the active component. The coating method for the specific adhesive can be reverse roll coater, forward roll coating 117958.doc -15 - 200813307 machine, doctor blade, air knife Or other similar coating device. Of course, a reconfigurable pressure sensitive adhesive which is well known in the art and which does not require curing may be used in conjunction with the present invention. The lower surface 13b is adhered to the backing coating of the cured adhesive layer 14. In one embodiment, the standard of the reconfigurable pressure-sensitive adhesive layer applied to the lower surface 131 of the foam layer is any curable adhesive: (1) cured or cross-linked; 2) having an initial viscosity sufficient to bond or fix the particles to the adhesive surface and maintain contact of the back layer with the subfloor, (3) non-sticky and tangentially permeable or compressible; (4) average thickness about 〇〇3 rnm to 〇〇5 mm but may be less than 〇·〇3 mm depending on the adhesive used or The thickness of the gasket material layer 13 may have a thickness of about mm5 mm to 3 〇mm, but may vary depending on the foaming material used. The thickness of the reconfigurable pressure-sensitive adhesive may be determined by convention, usually Between 0·01 mm and 〇·3 mm, but the thickness is preferably less than 〇. 1 mm 〇 Referring to Figures 3 and 4, another embodiment of the present invention includes a floor area 20, which includes a wet The gas release channel layer 24. More specifically, the floor area 20 comprises a plurality of layers, including a wear surface layer 2 1, which forms the uppermost visible layer and is the contact and wear surface. The wear surface layer is formed by its upper surface 21a ( It is defined by the uppermost contact and wear surface of the sample floor area component 20 and its bottom surface 21b. An inner adhesive layer 22 is adhered to the lower surface 21b of the wear surface layer 21. The wear surface layer is preferably made of polyvinyl chloride ( VC) ceramic enamel, stone or other suitable surface material, and depending on the particular material from which it is made, may have different width, thickness, density and edge shape design, color, pattern, chemical properties or composition. Wear surface layer H7958 .doc -16- 20 0813307 2 1 is typically applied to the backing material layer 23 via an inner bonding layer 22. The inner bonding layer 22 is adhered to the bottom surface 21b and the surface 23a (which is the uppermost surface of the backing material layer 23). When the material layer 23 is located below the wear surface layer 21, its bottommost portion is the gas release channel layer 24. The moisture release channel layer 24 comprises between a plurality of grooves or channels 27 and separates the plurality of grooves or A plurality of land sections 26' of the passages 27 are disposed at regular intervals on the bottom of the floor area 2'. Preferably, the groove or channel 27 is formed by pressing or molding the portion of the bottommost surface of the backing material layer 23 of the backing material layer 23, while the groove material layer 23 is formed with the groove or channel 27. The adjacent portions are maintained at or near their original thickness to define the land region 26 to form the moisture release channel layer 24. Further, depending on the molding pressure, the land area % may also be compressed to be smaller than its original thickness. The reconfigurable pressure sensitive adhesive layer 1 is applied to the lower surface 23b of the liner material layer 23. In one embodiment, (Fig. 3) the land area % and the channel 27 may extend parallel to each other over the length and width of the floor area 2〇. After a pressure is applied, the reconfigurable pressure sensitive adhesive layer 14b advantageously adheres to a surface initially adhered to a suitable location of the liner layer, but allows removal of the liner layer (i.e., 'floor tile) from the surface (eg, the subfloor) without initial The viscous material undergoes a large amount of mitigation. The lining material layer 23 may comprise any one or combination of soft, elastic materials including, but not limited to, a foamable polymer or foam, such as a T-blown poly. Ethylene plastisol/organosol, acrylic resin, rubber foam, polyurethane foam, such as polystyrene plastisol, acrylic foam foam, such as polyvinyl chloride, polyethylene, H7958 .doc 200813307 A foam of ethylene vinyl acetate, metallocene polyolefin, elastomeric polyolefin copolymer 'as long as it is susceptible to deformation after being compressed or otherwise molded according to one aspect of the invention. Any soft, elastic or cushioning material, either foamed or non-woven, may be used. The thickness of the backing material layer 23 and the land region 26 is typically from about 0.1 mm to about 1.0 mm, and is generally preferably about 〇. 2 mm, wherein the portions of the channel material layer 23 defining the grooves or channels have a molded thickness of about 0.2 mm or less. The reconfigurable pressure-sensitive adhesive layer i 4b is applied to moisture Releases the bottommost surface of the channel layer 24 and acts as a releasable glue to secure the Jiang floor area 2 to a suitable location on the subfloor while advantageously allowing the floor area 2〇 to be removed, reconfigured, and then heavy Laminated to the subfloor. The reconfigurable pressure sensitive adhesive layer 14b may be a rubber type adhesive, an acrylic adhesive (including an electron beam curable acrylic adhesive), a vinyl acetate type adhesive, an amine phthalic acid An ester type adhesive and combinations thereof or any other curable or non-curable pressure sensitive adhesive well known in the art are formed. A moisture release channel layer 24 is formed to the subfloor (which is laid on the subfloor) and is reinforced The The surface tension of the panel region attached to the subfloor. The formation resists horizontal or diagonal tension and movement on the subfloor. Due to the provision of the channel 27, a vertical structural lining parallel to the layer of liner material 23 is preferably used. The pulling force removes the floor area 20 from the subfloor. The floor area 20 remains intact and is not easily displaceable by a horizontal or diagonal pull. The moisture release passage layer 24 allows moisture to be vaporized from its point of contact with the subfloor. Helps maintain the adhesion of the floor area to the subfloor and maintain the aesthetic value of the floor area 20. This configuration also prevents unwanted particles from accumulating on the floor 117958.doc -18 - 200813307 area 20 and sweat floor area 2 () Or damage the contact point of the moisture release channel layer μ subfloor. 3 /, Μ Looking at Figure 5, a flow diagram of a typical production process for the floor region 20 in the form of a vinyl tile formed in accordance with the present invention. The production process follows the conventionally known method of preparing tiles using extruded, calendered or hot pressed layers.夂:Illustration 4]' The process can start with a top layer, which can also be packaged: a printed polyethylene film. The polyvinyl chloride film is then extruded into a monument by thermal lamination according to the procedure illustrated in Scheme 42. The process involved in the diagram begins with a polyvinyl chloride compound which is mixed with calcium carbonate and treated with two BumberIy and extruded into a floor tile by a press. Then the ground: the surface can be molded, cooled and annealed. The glue is then applied to the back of the monument. The foamed layer (the first layer of the invention) is then combined into a monument material according to the invention. Diagram 43 shows the process of joining the foam layer. The illustrations begin with a foamable material compound which is processed, compressed and cut via a -Bumbedy to suit the finished floor tile material. As described in the solution 41, after the foam adheres to the back of the tile and is formed, the back surface of the tile is smoothed, molded to produce the land region 26 and the channel 27, and then the adhesive is coated. To the foam layer, I is then dried/cured in some embodiments with ultraviolet light. The production process is then completed and the tiles are ready for packaging. Referring to Figures 6 through 24, yet another embodiment of the present invention provides for the removal and readjustment of the liner layer to accommodate unevenness in the subfloor. More specifically, the floor region 50 includes a plurality of layers including a wear surface layer 52, a backing layer 54, and a detachable gasket material layer 56. The wear surface layer 52 package 117958.doc -19- 200813307 includes an uppermost transparent film surface 58 and typically includes a printed film layer 6 that forms the uppermost layer that is visible, the uppermost layer forming the floor Contact and wear parts of area 50. The backing layer 54 can be formed from polyvinyl chloride (PVC), ceramic, stone or other suitable support material and can be of different width, thickness, density and edge shape design. An inner adhesive layer 62 • adheres to the underlying surface of the wear surface layer 52 to adhere to one of the uppermost surfaces of the backing layer 54 and another inner adhesive layer 63 (a reconfigurable pressure sensitive adhesive f layer) such as The adhesive layer 14b) is adhered to the bottom surface of one of the backing layers 54 to adhere to the uppermost surface of one of the detachable gasket material layers 56. The inner bonding layer 63 is advantageously adhered to the bottom surface of the backing layer 54 with an initial tack (which is fixed in place after the application of pressure to the detachable backing material layer 56), but allows for detachable The backing material layer 56 is removed from the bottom surface of the backing layer 54 without causing substantial reduction in initial tack. The detachable pad material layer 56 includes a plurality of removable pad segments 70, i.e., the pad material layer 56 is configured and configured to be separated or divided into a plurality of single and discrete segments. Each of the turns 7 is routed through a scribe line 72 (which allows the individual pad segments 70 (Fig. 12) to be removed from the floor region 50), i.e., a cross-cut or slit grid through the thickness of the pad material 56. And separated from its adjacent pad segments so that it can be divided into a plurality of individual and discrete pad segments. The bottommost surface of each pad section 70 is also pressed or molded to define a plurality of grooves or channels 7 7 (the channels 7 7 are regularly spaced apart from the bottom surface of the floor region 50) and separate the plurality A plurality of land regions 76 of slots or channels 77. In particular, the grooves or channels 77' are preferably formed by pressing or molding the bottommost surface to compress portions of the layer of detachable gasket material 56 and 117958.doc -20-200813307 detachable liner material layer 56 The portions adjacent to the slots or channels 77 are maintained at or near their original thickness to define the land regions 76 to form the bottommost surface of each pad segment 70. Separable pad material layer % can additionally be included
Ο 一可重新配置之壓敏黏接層80，該黏接層8〇大體類似於塗 覆於每一墊區段70之最底部表面之可重新配置之壓敏黏接 層14b(圖10)。視過程情況而定，可重新配置之壓敏黏接層 80可塗覆於槽脊區26之底部表面，如圖8至圖以中所示， 或其可塗覆於襯墊層56之整個底部表面，包括界定通道77 之底部之表面。可重新配置之壓敏黏接層δ〇有利地以一初 始黏性（繼施加壓力之後該初始黏性將每一墊區段7 〇固定 於合適位置）黏著至-底層地板表面，但允許自該底層地 板之表面移除墊區段7G中之任_者或多者而不使初始黏性 產生大量消減（圖12、13、14及圖16)。 可分開之襯墊材料層56可包含軟質、彈性材料中之任一 者或組合’該等材料包括(但不限於)可發泡聚合物或發泡 體，諸如化學吹製之聚氣乙稀塑料溶膠/有機溶膠、丙稀 酸樹脂、橡膠發泡體、聚胺基甲酸醋發泡冑，諸如聚氣乙 烯塑料溶膠、丙烯酸樹脂之泡珠發泡體，諸如聚氯乙烯、 聚乙稀、乙稀醋酸乙嫌舷、戈人 — " 戍孟屬聚烯烴、彈性體聚烯烴 共聚物之溶製發泡體。另外，亦可採用發泡或非發泡之任 可孝貝5單ϋ或襯墊材料。可分開之概塾材料層％及槽脊 ::之厚度通吊、、々為〇·5 _至3·0 _，其中可分開襯墊材 6之界定槽或通道77的彼等部分具有—約為lmm或小 於1 mm之模壓厚度。 H7958.doc 21 200813307 可重新配置之壓敏黏接層80塗覆於可分開襯墊材料層56 之最底部表面上且通常係可固化，且充當一可釋放膠水以 將地板區域50固定於底層地板上之合適位置，同時有利地 允許將地板區域50(或一或多個墊區段7〇)移除、重新配 置，且重鋪至底層地板上。可重新配置之壓敏黏接層8〇可 由橡膠類型黏著劑、丙烯酸系黏著劑（包括電子束可固化 丙烯酸系黏著劑）、乙酸乙烯酯類型黏著劑、胺基甲酸酯 類型黏著劑及其組合或此項技術中熟知之任何其他可固化 或不可固化壓敏黏著劑肜成^ 地板區域50可以以下方式應用至一底層地板85。參看圖 11至圖24，藉由首先以與底層地板以之頂端表面間隔相對 之關係配置可为開之襯墊材料層56而將地板區域應用於 底層地板85。一旦處於此位置，將地板區域5〇朝向底層地 板85之頂端表面移動，直至黏接層8〇與該底層地板嚙合。 若^底層地板85不均勻，亦即，在將由地板區域$ 〇覆蓋之 底層地板表面内存在凹坑87(圖21及圖22)及凸起9g(圖加 圖24)，則可將一或多個墊區段7G移除及/或彼此上下堆疊 以補償底層地板之不均勻表面特徵。當然，將自地板區域 50^除墊區段7〇以在其背部表面上形成—補償空隙^，以 補償自底層地板85之表面突出之凸起％。或者，可將來自 同一或任何其他地板區域5G之墊區段7()或作為獨立包裝提 ^之墊區段70應用於地板區域5〇之背部表面上的其他塾區 奴7〇之上方’以補償形成於底層地板85之表面中之凹坑 87(圖 17、18、19及圖 20)。 H7958.doc -22- 200813307 更特疋口之，可自背襯層5 4剝離一或多個個別墊區段 7〇(圖12、13及14)，藉此產生一由與可分開襯墊材料層％ 之彼區域相鄰的周圍剩餘墊區段7〇界定之空隙92。待移除 之墊區段70之數目將對應於容納底層地板85之表面上之待 • 補償凸起90所需之表面區域量（圖23及24)。另外，所移除 • 墊區段70可經彼此上下堆疊以在可分開之襯墊材料層56之 任一區域中增加厚度，以補償位於底層地板85上之相應凹 坑87。 Γ & ” U王解’个發明絕非僅限於本文所揭示及所圖示之特定 構k 而疋包含在申請專利範圍之範疇内之任何修改或等 效物。 【圖式簡單說明】 圖1為根據本發明之不具有濕氣釋放通道之覆地板物之 透視圖； 4圖2為根據本發明之不具有濕氣釋放通道之覆地板物之 Q 橫截面圖； 圖3為根據本發明之具有濕氣釋放通道之覆地板物之透 視圖； 、圖4為根據本發明之具有濕氣釋放通道之覆地板物之橫 截面圖； 回為根據本發明之一典型生產過程之流程圖； 圖6為根據本發明形成之覆地板物之一替代實施例之透 視圖； 圖7為圖6中所示之覆地板物之底部透視圖； 117958.doc -23 · 200813307 圖8為圖7中所示之覆地板物之角落部分之分離放大圖； 图為圖7中所示之覆地板物之一部分之橫截面圖；一根 據本發明之替代實施例形成之覆地板物； 圖丨〇為圖7、8及9中所示之覆地板物之分離放大圖，其 ’ 展不根據本發明之個別墊區段、槽脊區及通道； • 圖11為展示根據本發明形成之覆地板物之最底部表面上 的塾區'^又之頂端表面之分離透視圖； () 圖12及圖13為類似於圖11之分離透視圖，其展示自該覆 地板物移除墊區段； 圖14為握持一根據本發明形成之一墊區段之工人之手部 的一部分之透視圖； 圖15為將根據本發明形成之覆地板物應用至一底層地板 之分離說明； 圖1 6為一覆地板物之分離角落部分之透視圖，其展示將 第墊區段應用於一第二墊區段之頂端上以增加彼區域 () 中覆地板物之厚度； 圖1 7為根據本發明形成之一覆地板物之底部透視圖，其 - 展不墊區段已被移除以容納底層地板上之凸起之邊緣條 帶； /、 圖18為根據本發明形成之覆地板物之底部之透視圖，其 展7^ 一藉由選擇性移除墊區段而形成以便容納底層地板上 之一凸起之中央空隙及已添加額外墊區段以補償底層地板 中之不均或凹坑之覆地板物底部之部分； 圖19為根據本發明形成之覆地板物之底部之透視圖，其 117958.doc •24- 200813307 展示一角落墊區段被移除以容納底層地板上之凸起及一具 有雙重墊區段以補償底層地板中相應凹坑之角落； 圖20為根據本發明形成之覆地板物之一角落部分之分離 透視圖’其展示一地板區域之底部部分上之墊區段的雙重 厚度’其用以補償底層地板中之凹坑； 圖2 1及圖22為根據本發明形成之一對並列地板磚之橫截可 A reconfigurable pressure sensitive adhesive layer 80 that is substantially similar to the reconfigurable pressure sensitive adhesive layer 14b applied to the bottommost surface of each pad segment 70 (Fig. 10) . Depending on the process, the reconfigurable pressure sensitive adhesive layer 80 can be applied to the bottom surface of the land region 26, as shown in Figures 8 through, or it can be applied to the entire liner layer 56. The bottom surface includes a surface defining the bottom of the channel 77. The reconfigurable pressure-sensitive adhesive layer δ〇 is advantageously adhered to the sub-floor surface with an initial viscosity (the initial viscosity adheres to each pad section 7 合适 in place after application of pressure), but allows The surface of the subfloor removes any or more of the pad segments 7G without causing substantial reduction in initial viscosity (Figures 12, 13, 14 and Figure 16). The detachable gasket material layer 56 can comprise any one or combination of soft, elastomeric materials including, but not limited to, a foamable polymer or foam, such as chemically blown polyethylene. A plastisol/organosol, an acrylic resin, a rubber foam, a polyurethane foam, such as a polyethylene plastisol, an acrylic foam, such as polyvinyl chloride, polyethylene, Ethyl acetate B is suspected to be on the side, and Geman- " 戍 属 is a polyolefin, elastomer foam copolymer foam. In addition, it is also possible to use foamed or non-foamed thieves 5 single crepe or cushioning material. Separable material layer % and ridge:: the thickness of the sling, 々 〇 5 _ to 3 · 0 _, wherein the partitioning of the spacer 6 or the portion of the channel 77 has - A molded thickness of about 1 mm or less. H7958.doc 21 200813307 A reconfigurable pressure sensitive adhesive layer 80 is applied to the bottommost surface of the detachable gasket material layer 56 and is typically curable and acts as a releasable glue to secure the floor region 50 to the bottom layer. A suitable location on the floor, while advantageously allowing the floor area 50 (or one or more pad sections 7A) to be removed, reconfigured, and re-paved onto the subfloor. The reconfigurable pressure-sensitive adhesive layer 8 can be a rubber type adhesive, an acrylic adhesive (including an electron beam curable acrylic adhesive), a vinyl acetate type adhesive, a urethane type adhesive, and Any other curable or non-curable pressure sensitive adhesive composition or combination known in the art can be applied to a subfloor 85 in the following manner. Referring to Figures 11 through 24, the floor region is applied to the subfloor 85 by first configuring the permeable liner material layer 56 in a spaced relationship with the top surface of the subfloor. Once in this position, the floor area 5〇 is moved toward the top surface of the bottom floor panel 85 until the adhesive layer 8〇 engages the subfloor. If the subfloor 85 is not uniform, that is, there are pits 87 (Figs. 21 and 22) and projections 9g (Fig. 24) in the surface of the subfloor to be covered by the floor area $ 则, then one or The plurality of pad segments 7G are removed and/or stacked one on top of the other to compensate for uneven surface features of the subfloor. Of course, the pad portion 7 is removed from the floor area to form a compensation gap ^ on the back surface thereof to compensate for the % of protrusions protruding from the surface of the subfloor 85. Alternatively, the pad section 7() from the same or any other floor area 5G or the pad section 70 as a separate package can be applied to the top of the other area on the back surface of the floor area 5' The pits 87 (Figs. 17, 18, 19 and 20) formed in the surface of the subfloor 85 are compensated. H7958.doc -22- 200813307 More specifically, one or more individual pad segments 7〇 (Figs. 12, 13 and 14) can be peeled off from the backing layer 5 4, thereby creating a separable liner The gaps 92 defined by the remaining pad segments 7 that are adjacent to each other in the region of the material layer %. The number of pad segments 70 to be removed will correspond to the amount of surface area required to accommodate the compensation projections 90 on the surface of the subfloor 85 (Figs. 23 and 24). Additionally, the removed pad segments 70 can be stacked one on another to add thickness in any of the detachable pad material layers 56 to compensate for corresponding recesses 87 on the subfloor 85. Γ & ” U Wang Jie's invention is in no way limited to the specific constructions disclosed and illustrated herein, and any modifications or equivalents are included in the scope of the patent application. 1 is a perspective view of a floor covering according to the present invention without a moisture release passage; 4 is a cross-sectional view of a Q according to the present invention without a moisture release passage; FIG. 3 is a view of the present invention. A perspective view of a floor covering having a moisture release passage; and Figure 4 is a cross-sectional view of a floor covering having a moisture release passage according to the present invention; a flow chart of a typical production process according to the present invention; Figure 6 is a perspective view of an alternative embodiment of a floor covering formed in accordance with the present invention; Figure 7 is a bottom perspective view of the floor covering shown in Figure 6; 117958.doc -23 · 200813307 Figure 8 is Figure 7 A cross-sectional view of a portion of the floor covering shown in FIG. 7; a cross-sectional view of a portion of the covering material shown in FIG. 7; a covering material formed in accordance with an alternative embodiment of the present invention; Covering as shown in Figures 7, 8 and 9 Separate enlarged view of the panel, which does not show individual pad segments, land regions and channels in accordance with the present invention; • Figure 11 is a view showing the crotch region on the bottommost surface of the floor covering formed in accordance with the present invention. Separate perspective view of the top surface; (Figures 12 and 13 are separate perspective views similar to Fig. 11 showing the removal of the pad section from the overlying material; Figure 14 is a view of one of the grips formed in accordance with the present invention; A perspective view of a portion of the hand of the worker of the pad section; Figure 15 is a perspective view of the application of the floor covering formed in accordance with the present invention to a subfloor; Figure 16 is a perspective view of a separate corner portion of a floor covering , the method of applying a pad section to the top end of a second pad section to increase the thickness of the floor covering in the area (FIG. 17) is a bottom perspective view of forming a floor covering according to the present invention, The non-pad section has been removed to accommodate the raised edge strips on the subfloor; /, Figure 18 is a perspective view of the bottom of the floor covering formed in accordance with the present invention. Selectively removing the pad section to form to accommodate the subfloor a raised central void and a portion of the underlying floor having an additional pad section added to compensate for unevenness or dents in the subfloor; FIG. 19 is a perspective view of the bottom of the underlay formed in accordance with the present invention, 117958.doc •24-200813307 shows a corner pad section removed to accommodate the raised features on the subfloor and a double pad section to compensate for the corners of the corresponding pits in the subfloor; Figure 20 is formed in accordance with the present invention; A separate perspective view of a corner portion of a floor covering that exhibits a double thickness of a pad section on a bottom portion of a floor region to compensate for pits in the subfloor; FIGS. 21 and 22 are The invention forms one of the cross-sections of the side-by-side floor tiles
面圖，其中該等地板磚中之一者的一部分安放於底層地板 中的一凹座之上；及 圖23及圖24為根據本發明形成之地板磚之橫截面圖，其 中該地板磚之一部分安放於底層地板中的/凸起之上。 【主要元件符號說明】 10 地板區域 11 上磨損表面 11a 上表面 lib 下表面 12 内黏接層 13 襯墊材料層 13a 上表面 13b 下表面 14 黏接層 20 地板區域 21 磨損表面層 21a 上表面 21b 底部表面 Ο 117958.doc -25- 200813307 22 内黏接層 23 槪塾材料層 23a 表面 23b 下表面 24 濕氣釋放通道層 26 槽脊區 27 通道 41，42, 43 圖解 r f\ d υ 地板區域 52 磨損表面層 54 背襯層 56 襯墊材料層 60 印花薄膜層 62 内黏接層 63 内黏接層 70 墊區段 72 劃線 76 槽脊區 ΊΊ 槽或通道 80 可重新配置之壓敏黏接層 85 底層地板 87 凹坑 90 凸起 92 空隙 117958.doc -26-a side view in which a portion of one of the floor tiles is placed over a recess in the subfloor; and Figures 23 and 24 are cross-sectional views of a floor tile formed in accordance with the present invention, wherein the floor tile Part of it is placed on the / bulge in the subfloor. [Main component symbol description] 10 Floor area 11 Upper wear surface 11a Upper surface lib Lower surface 12 Inner adhesive layer 13 Liner material layer 13a Upper surface 13b Lower surface 14 Adhesive layer 20 Floor area 21 Wear surface layer 21a Upper surface 21b Bottom surface Ο 117958.doc -25- 200813307 22 Inner bonding layer 23 槪塾 Material layer 23a Surface 23b Lower surface 24 Moisture release channel layer 26 Slot area 27 Channels 41, 42, 43 Illustration rf\d 地板 Floor area 52 Worn surface layer 54 backing layer 56 backing material layer 60 printed film layer 62 inner bonding layer 63 inner bonding layer 70 pad section 72 scribe line 76 land area ΊΊ groove or channel 80 reconfigurable pressure sensitive bonding Layer 85 Subfloor 87 Pit 90 Bump 92 Void 117958.doc -26-