200810927 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種標籤，尤指一種貼在背光模組上，以標 示異物位置之標籤。 【先前技術】 已知’目前製作薄膜液晶顯示器（TFT-LCD)的基板尺寸越 來越大，其製程線寬線距也越來越精細，在製造廠商高良率 高產量的要求下，必須在最短的時間内檢測出足以影響良率 的瑕疲。為了要降低成本，並同時使背光模組製程的流程更 為快速順暢，但仍有保持一定的品質，因此在任何製造階段 中’如何以最有效快速的低成本法，為當前研究之課題。 傳統的人工檢測，已經無法滿足製造廠對產品的高速高 品質要求。自動化光學檢測具有客觀衡量標準、縮短生產時 間、提高產品品質、可導入在多種製程中等優點，目前在 TFT-LCD製造過程中，使用自動光學檢查設備來確保生產的 產品品質是非常普遍的選擇。因為是非接觸式檢查，所以可 在中間工程檢查半成品，且因靈活性高，亦被導入在多種製 程中的檢查。 其中，面板是否污損或黑點，組裝後的寬度、顏色是否 正常’為影顯品質之重要因素，為使顯像品f為最好，在薄 膜貼合時，絕對要避免異物的存在。如何在最短的時間内完 成檢測並移除，都是提高生產良率與未來朝向高階背光模組 之重要課題。 為了提冋產率’使生產線流動順暢，檢測異物與移除異 5 200810927 =，兩们步驟。因此’當開啟光學檢測機測得異物時，不會 ，移去異物’乃需—種紀錄該異物位置之方法，以便接下 一 狄通铩不除去共物，以取代人力檢查及標 ° 【發明内容】200810927 IX. Description of the Invention: [Technical Field] The present invention relates to a label, and more particularly to a label attached to a backlight module to indicate the position of a foreign object. [Prior Art] It is known that the substrate size of the currently produced thin film liquid crystal display (TFT-LCD) is getting larger and larger, and the line width and the line pitch of the process line are becoming more and more fine. Under the requirement of high yield and high output of the manufacturer, it is necessary to In the shortest time, it is detected that it is enough to affect the yield. In order to reduce the cost and at the same time make the process of the backlight module process faster and smoother, but still maintain a certain quality, so in any manufacturing stage, how to use the most effective and fast low-cost method is the subject of current research. Traditional manual testing has been unable to meet the high-speed and high-quality requirements of the manufacturer. Automated optical inspection has the advantage of objective measurement, shortened production time, improved product quality, and can be imported into a variety of processes. Currently, in the TFT-LCD manufacturing process, automatic optical inspection equipment is used to ensure the quality of the products produced is a very common choice. Because it is a non-contact inspection, semi-finished products can be inspected in intermediate works, and because of its high flexibility, it is also imported into inspections in various processes. Among them, whether the panel is stained or black, whether the width and color after assembly are normal is an important factor for the quality of the image. In order to make the image f the best, it is absolutely necessary to avoid the presence of foreign matter when the film is bonded. How to complete detection and removal in the shortest time is an important issue to improve production yield and future high-order backlight modules. In order to improve the yield 'to make the production line flow smoothly, detect foreign matter and remove the difference 5 200810927 =, two steps. Therefore, when the optical detector is turned on, the foreign object is not removed, and the foreign matter is removed. It is necessary to record the position of the foreign object so that the next thing is not removed, instead of manpower inspection and labeling. SUMMARY OF INVENTION
述之缺I，本發明之主要目#，在於當光學檢測 機檢測得知背光模組表面或内部有異物存在時，為了使接下 來的機台可以迅速得知該異物的位置並標示，使後段加工更 為項暢’並取代人工，因此提供一種標示標籤，用以貼附於 該異物旁，以提供移除異物的機台定位。 為達上述之目的，本發明之標示標鐵製作方法，係包括： 提供一雙面經過離形處理之離形基材； 上 以靜電膜的光滑面吸附於該離形基材之第一離形面上 使離形基材與靜電膜接觸間形成一吸附力； 於靜電膜之背面成膜有一黏膠層，於黏膠層的表面上利 用印刷技術將顏料印刷形成有一印刷層，前述之印刷層的面 積不大於黏膠層面積，但以占黏膠層—半的面積為最佳。The main purpose of the present invention is that when the optical detector detects that there is foreign matter on the surface or inside of the backlight module, in order to enable the next machine to quickly know the position of the foreign object and mark it, The rear section is more versatile and replaces the manual, so a label is provided for attaching to the foreign object to provide the positioning of the machine for removing the foreign object. In order to achieve the above object, the method for manufacturing the labeling iron of the present invention comprises: providing a double-sided release-shaped release substrate; and adsorbing the first surface of the release substrate with a smooth surface of the electrostatic film; Forming an adsorption force between the contact substrate and the electrostatic film; forming an adhesive layer on the back surface of the electrostatic film, and printing the pigment on the surface of the adhesive layer to form a printed layer by using printing technology, the foregoing The area of the printed layer is not larger than the area of the adhesive layer, but the area of the adhesive layer is preferably half.
【實施方式】 茲有關本發明之技術内容及詳細說明，現配合圖式說明 如下： 田本發明為一種背光模組製造過程中，用以標示背光模組 上兴物位置之標籤，以便機器稍後依此標籤所標示位置進行 t =背光模組上的異物。如第一、二圖所示，本發明之標示 軚戴，係包括有：一離形基材10、一靜電膜20、一黏膠層利 及一印刷層40構成。其中，該離形基材1〇係由紙或塑膠薄 片所製成，該離形基材10之第一離形面lu及第二離形面 6 200810927 面均經離形處理。 該靜電膜20之一面上具有一光滑面2卜該光滑面以吸 附於上述第一離形面11A上，於靜面臈2〇之背面22上塗佈 該黏膠層30 ’該黏膠層30所塗佈面積與該靜電膜2〇之背 21面積相同。在本圖示中該靜電膜2〇為一軟性ρρτ塑膠$ 所製成。"貝 在上述之黏谬層30塗佈後，利用印刷技術將顏料印刷於 该黏膠層30表面上形成一印刷層40，該印刷層4〇所印刷面 積不大於黏膠層30面積，但以占黏膠層3〇 一半的面積為最 佳效果，以降低該靜電膜20與他物之黏著力。 、 當第-離形面11Α與該靜電膜2G之光滑面21接觸時， 此二者間將具有一吸附力。 請參閱第三圖所示，為本發明實際應用之實施例示音、 圖。如圖觀之，該離形基材Π)呈細長紙帶狀，其上連續附著 複數個圓形之靜電膜20,且該細長紙帶之離形基材1()捲收為 -整捲：捲筒13Α之形式，並固定於一機台之上方，而機台 另a捲同13Β在回收離形基材1〇。當背光模組5〇受光學檢測 摘％•知其上異4勿6〇之位置時，該背光模級μ受傳送帶移動 至離形基材ίο下方，該捲筒13Β捲收時，拉動離形基材1〇， 使該離形基材10之靜電膜20與背光模組50對應，在貼標機 7〇下壓:將該離形基材10上的靜電膜20貼附於異物60上或 ^以‘示忒異物60之位置，此時黏膠層30被印刷層40覆 =之面積不^與为光模組50產生黏著。在靜電膜20離開離 形基材1〇後，該捲筒13β會將無靜電模20之離形基材10捲 動回收_後，工作人可以順著印刷層的部位將靜電膜2〇 撕起。 7 200810927 ^該靜電膜20以黏膠層30與背光模組40黏著間的黏貼力 而大於靜電模20之光滑面21與離形基材間吸附的吸附力， 當該貼標機70下壓時，該靜電膜20才能黏著於背光模組50 上。 第四圖為本發明紙捲之局部放大示意圖，該離形基材10 • 為一帶狀的紙或塑膠薄片之任一種。在離形基材在捲收時， …該f膠層30將有部份的黏膠與離形基材1〇的第二離形面ηβ 黏著力須小於離形基材丨〇與靜電膜2〇之光滑面2丨間的吸附 • 力，在黏膠層與離形基材10之第二離形面11Β分離時， 該靜電膜20才不會被離形基材1〇之第二離形面黏走。 ^如第五圖所示，其為背光模組上之異物標示圖。該背光 模組50上之異物60經靜電膜2〇標示其位置，並稍後由儀器 或人力依該靜電膜20標示之位置將異物6〇移除，最後，再 以一除標元件80去掉靜電臈2〇，如第六圖a所示。因背光模 組50上之異物60已清理，故背光模組5〇上之靜電膜2〇 為不必要。其移除靜電膜20之方式如第六圖β所揭露，該靜 • ·電膜20乃以黏膠層30貼附於背光模組5〇上，此時，由於黏 膠層30僅局部塗佈，故為可局部抓起之薄膜，該薄膜受一除 標元件80下壓碰觸並移除之。該除標元件8〇之前端與靜電 膜20接觸處設置有一除標膠81，故該除標元件8〇下壓於靜 電膜20時，該靜電膜20可受該除標膠81黏起。值得注意的 疋，該靜電膜20與該背光模組5〇間亦以黏膠層3〇黏著之， 故該除標膠81與該靜電膜20間之黏著力，需小於該靜電膜 20與該背光模組50間之黏著力。 請參閱第七圖所示，為本發明之標示背光模組上異物位 置之標籤製作流程示意圖。本發明之標示標籤在製作時，先 8 200810927 進入步驟10J 行離形處理。 提供一離形基材10，並於離形基材10兩面進 接耆，進入步驟102，在前述的離形基材10的離形處 後’以靜電膜2。之表面靜電吸附於該離形基材1〇之任$ 面上、，使離形基材1G與靜電膜2()接觸間形成一吸附力。、 進入步驟103,在前述之離形基材1〇與靜電膜2〇 < ’於靜電膜2G之背面上塗佈—層黏膠層3()。 、 再進入步驟1〇4，在上述之黏膠層3〇塗佈後，於黏膠層 又面上印刷有一印刷I 4〇，該印刷I 4〇是將顏料利用印 刷技術印刷於黏膠層3G的表面上。而印刷層4Q的面積不大 於黏膠層30的面積’ α占黏膠層3〇的一半面積為最佳，以 減低該靜電膜2〇與他物之黏著力。 —，再進入步驟105,在印刷層4〇印製後，將離形基材1〇進 :捲收，在捲收時，該黏膠層3〇部份黏著於離形基材的 第：離形面11Β’使靜電膜2〇之光滑面21與該離形基材ι〇 第離开^面UA之間的黏著力需強於該黏膠層與離形基材 1 0之第二離形面1 1 Β間的黏著力。 上述僅為本發明之較佳實施例而已，並非用來限定本發 明實施範圍。即凡依本發明申請專利範圍所做的均等變化與 修飾，皆為本發明專利範圍所涵蓋。 9 200810927 t · 【圖式簡單說明】 第圖為本發明之離形基材與靜電膜分解示意圖。 第二圖為本發明之離形基材與靜電膜結合示意圖。 第二圖為本發明之實際應用之實施例示意圖。。 第四圖為本發明之離形基材捲收後之局部放大示意圖 • 第五圖為本發明之背光模組上之異物標示圖 第六圖A、B為本發明移除靜電膜動作示意圖。 第七圖為本發明之標示背光模組上異物位置之標義 k 示意圖。[Embodiment] The technical content and detailed description of the present invention are described below with reference to the following drawings: The invention is a label for marking the position of the backlight module in the backlight module manufacturing process, so that the machine is slightly Then, according to the position indicated by this label, t = foreign matter on the backlight module. As shown in the first and second figures, the label of the present invention comprises: a release substrate 10, an electrostatic film 20, an adhesive layer and a printed layer 40. Wherein, the release substrate 1 is made of paper or a plastic sheet, and the first release surface lu and the second release surface 6 200810927 of the release substrate 10 are subjected to a release treatment. One surface of the electrostatic film 20 has a smooth surface 2 to be adhered to the first release surface 11A, and the adhesive layer 30' is coated on the back surface 22 of the static surface 〇2〇. The coated area of 30 is the same as the area of the back 21 of the electrostatic film 2 . In the present illustration, the electrostatic film 2 is made of a soft ρρτ plastic $. "Bei, after coating the above-mentioned adhesive layer 30, printing a pigment on the surface of the adhesive layer 30 by using a printing technique to form a printing layer 40, the printing area of which is not larger than the area of the adhesive layer 30, However, the area of 3 〇 of the adhesive layer is the best effect to reduce the adhesion of the electrostatic film 20 to other objects. When the first-departure surface 11Α is in contact with the smooth surface 21 of the electrostatic film 2G, there will be an adsorption force therebetween. Please refer to the third figure, which is a sound and diagram of an embodiment of the practical application of the present invention. As shown in the figure, the release substrate Π) is in the form of an elongated paper strip on which a plurality of circular electrostatic films 20 are continuously attached, and the release substrate 1 () of the elongated paper tape is wound into a full roll. The reel 13 is in the form of a crucible and is fixed on top of a machine table, and the machine is another a roll of 13 Β in the recovery of the release substrate. When the backlight module 5 is optically detected and the position is different, the backlight mode μ is moved by the conveyor belt to the bottom of the release substrate ίο, and the reel 13 is pulled and pulled away. The electrostatic substrate 20 of the release substrate 10 is pressed against the backlight module 50, and is pressed by the labeling machine 7: the electrostatic film 20 on the release substrate 10 is attached to the foreign matter 60. The upper or lower surface of the foreign body 60 is displayed. At this time, the area of the adhesive layer 30 covered by the printed layer 40 is not adhered to the optical module 50. After the electrostatic film 20 leaves the release substrate, the reel 13β will roll the release substrate 10 of the static-free mold 20, and then the worker can tear the electrostatic film 2 along the printed layer. Start. 7 200810927 ^ The electrostatic film 20 is greater than the adhesion between the smooth surface 21 of the electrostatic mold 20 and the release substrate by the adhesion between the adhesive layer 30 and the backlight module 40, when the labeler 70 is pressed down The electrostatic film 20 can be adhered to the backlight module 50. The fourth drawing is a partially enlarged schematic view of a paper roll of the present invention, and the release substrate 10 is any one of a strip of paper or a plastic sheet. When the release substrate is wound up, the adhesive layer 30 has a part of the adhesive and the second release surface ηβ of the release substrate 1〇 must be less than the release substrate and the electrostatic film. 2 光滑 smooth surface 2 的 adsorption force, when the adhesive layer is separated from the second release surface 11 离 of the release substrate 10, the electrostatic film 20 will not be the second of the release substrate Stick away from the shape. ^ As shown in the fifth figure, it is a foreign matter label on the backlight module. The foreign matter 60 on the backlight module 50 is marked by the electrostatic film 2 ,, and the foreign matter 6 〇 is removed by the instrument or the human body at the position indicated by the electrostatic film 20, and finally, the detachment component 80 is removed. Electrostatic 臈 2〇, as shown in Figure 6a. Since the foreign matter 60 on the backlight module 50 has been cleaned, the electrostatic film 2 on the backlight module 5 is unnecessary. The method for removing the electrostatic film 20 is as disclosed in FIG. 7 . The electrostatic film 20 is attached to the backlight module 5 by the adhesive layer 30. At this time, since the adhesive layer 30 is only partially coated. The cloth is a film that can be partially grasped, and the film is pressed and removed by a de-marking element 80. The descaling element 8 is provided with a descaling 81 at the contact of the front end with the electrostatic film 20. Therefore, when the descaling element 8 is pressed down on the electrostatic film 20, the electrostatic film 20 can be adhered by the descaling 81. It is noted that the electrostatic film 20 and the backlight module 5 are also adhered by the adhesive layer 3, so that the adhesion between the standard 81 and the electrostatic film 20 is smaller than the electrostatic film 20 and The adhesion between the backlight modules 50. Please refer to the seventh figure, which is a schematic diagram of the labeling process of the foreign object position on the backlight module of the present invention. In the production of the label of the present invention, the first 8 200810927 enters step 10J for the release treatment. A release substrate 10 is provided, and the crucible is introduced on both sides of the release substrate 10, and the process proceeds to step 102 where the electrostatic film 2 is disposed after the release of the release substrate 10 described above. The surface is electrostatically adsorbed on the surface of the release substrate 1 to form an adsorption force between the contact substrate 1G and the electrostatic film 2 (). And proceeding to step 103, applying a layer of adhesive layer 3 () on the back surface of the electrostatic film 2G on the release substrate 1〇 and the electrostatic film 2〇. And proceeding to step 1〇4, after coating the adhesive layer 3〇, printing a printing I 4〇 on the adhesive layer, the printing I 4〇 printing the pigment on the adhesive layer by using printing technology On the surface of 3G. The area of the printed layer 4Q is not more than that of the area of the adhesive layer 30, which is preferably half of the area of the adhesive layer 3, to reduce the adhesion of the electrostatic film 2 to other objects. Then, proceeding to step 105, after the printing layer 4 is printed, the release substrate 1 is plucked into: during the winding, the adhesive layer 3 is partially adhered to the release substrate: The release surface 11Β' is such that the adhesion between the smooth surface 21 of the electrostatic film 2 and the release surface UA of the release substrate is stronger than the second of the adhesive layer and the release substrate 10 The adhesion between the 1 1 离. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention. 9 200810927 t · [Simple description of the drawings] The figure is a schematic view of the decomposition of the release substrate and the electrostatic film of the present invention. The second figure is a schematic view of the combination of the release substrate and the electrostatic film of the present invention. The second figure is a schematic diagram of an embodiment of the practical application of the present invention. . The fourth figure is a partially enlarged schematic view of the release substrate after the invention is taken up. The fifth figure is a foreign matter indication diagram on the backlight module of the present invention. The sixth figure A and B are schematic views of the action of removing the electrostatic film according to the present invention. The seventh figure is a schematic diagram of the definition k of the foreign object position on the backlight module of the present invention.
I 【主要元件符號說明】 10離形基材 11A第一離形面 11B第二離形面 20靜電膜 21光滑面 p 22背面 30黏膠層 40印刷層 50背光模組 60異物 7 0貼標機 80除標元件 81除標膠 101〜105步驟I [Description of main component symbols] 10 release substrate 11A first release surface 11B second release surface 20 electrostatic film 21 smooth surface p 22 back surface 30 adhesive layer 40 printing layer 50 backlight module 60 foreign matter 7 0 labeling Machine 80 de-marking component 81 in addition to the standard glue 101~105 steps