TW200807705A - Semiconductor optoelectronics devices - Google Patents

Semiconductor optoelectronics devices Download PDF

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TW200807705A
TW200807705A TW96122010A TW96122010A TW200807705A TW 200807705 A TW200807705 A TW 200807705A TW 96122010 A TW96122010 A TW 96122010A TW 96122010 A TW96122010 A TW 96122010A TW 200807705 A TW200807705 A TW 200807705A
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polymer
group
semiconductor device
refractive index
layer
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TW96122010A
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TWI473255B (en
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Juha T Rantala
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Silecs Oy
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Abstract

A semiconductor device comprising a semiconductor substrate with a plurality of photo-diodes arranged in the semiconductor substrate with interconnect layers defining apertures at the photo-diodes and a first polymer which fills the gaps such as to cover the photo-diodes. Further, layers of color filters are arranged on top the gap filling polymer layer opposite to the photo-diodes and a second polymer arranged on the interconnect layers covers and planarizes and passivates the color filter layers. On top of the planarizing polymer there is a plurality of micro-lenses opposite to the color filters, and a third polymer layer is deposited on the micro-lenses for passivating the micro-lenses. According to the invention the polymer materials are comprised of a siloxane polymer which gives thermally and mechanically stable, high index of refraction, dense dielectric films exhibiting high-cracking threshold, low pore volume and pore size.

Description

200807705 24699pif 九、發明說明: 【發明所屬之技術領域】 本發明涉及藉由利用新型聚合物來製造半導體裝置之 過程1詳言之,本發明提供新型半導體,其中利用官能化 梦烧單體之聚合物絲合她合物來製造互補式金氧半導 體(complementary metai oxide semic〇nduct〇r, CM〇s)影像 感應少—光層或電層。此外’本發明關注積體電路200807705 24699pif IX. OBJECTS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a process for fabricating a semiconductor device by using a novel polymer. In detail, the present invention provides a novel semiconductor in which polymerization of a functionalized monocyte is utilized. The compound is combined to form a complementary meta-oxide semiconductor (compoundary metai oxide semic〇nduct〇r, CM〇s) with less image sensing or optical layer or electric layer. Further, the present invention focuses on integrated circuits

以及光電裝置以及用於在製造其時處理新型聚合物材料的 方法。 【先前技術】 電子影像感應器在電子技術中之商業用途已在最近數 年中心劇i曰加。電子影像感應器可見於相機、手機中且用 於>飞車之新安全裝置(例如,用於估計車輛之間的距離、 積測未由鏡面暴露之盲點等)。許多半導體製造商將生產線 轉換為CMOS感應器生產以符合此需求。CM〇s感應器製 邊使用备鈾用於標準積體電路(integrated circuit,1C)製造 中之許多過程,且不需要大資本投資以生產當前技術水平 之裝置。 自下至上處理的製程中,光電二極體(phot odiode)建置 於石夕層中。標準介電質以及金屬電路建置於二極體上,以 轉移電流。直接配置在二極體上的光學透明材料為將 裝置表面且並經由彩色濾光⑽—fiI㈣而轉移至 光電二極體之光學透明㈣。透明的賴以及平坦化材 通常被置放於彩色濾w以及裝置之上。微透鏡建置於^ 6 200807705 24699pif 色濾光片上之平坦化膜層上,以改良裝置效能。最終,保 護層可能置放於透鏡上或者可將玻璃載片置放於透鏡陣列 之上,留下在透鏡與覆蓋物之間留下的氣隙(airgap)。大多 ,的CMOS感應器是使用減鋁法(subtractive以麵&疆)/化 學氣相沈積(chemical vapor deposition, CVD)氧化物金屬化 (oxide metallization)來建置以一層或多層金屬層。對於平坦 化膜層或微透鏡之製造,亦使用有機聚合物諸如聚醯亞胺 (polyimide)或酚醛清漆(novolac)材料,或有時可能使用矽 氧烧(siloxane)聚合物。 有機聚合物可根據其介電常數(didectric咖㈣被 分成兩個不同群組。非極性聚合物含有具有幾乎完全是共 價鍵之分子。由於非極性聚合物其主要由非極性的c_c鍵 組成,因此可僅使用密度以及化學組成來估計其介電常 數。極性聚合物不具有低損耗,但其含有不同負電性之原 子,而引起不對稱之電荷分布。因此極性聚合物具有較高 之介電彳貝耗以及介電常數,所述情況視評估其時之頻率以 及溫度而定。已為介電性質之目的而開發若干有機聚合 =二然而,由於此等膜層之低熱穩定性(thermalstaWlityf、 柔軟度(s〇ftness)以及與開發用於基於Si〇2介電質之傳統 技術製程的不相容性,上述膜層的可應雜為有限的。舉 例而言,有機聚合物不能在不損壞膜層的情況下進行化^ 機械研磨(chemical mechanical polishing,CMp)或乾式回: 刻處理。 口此些新近焦點已集中在基於倍半氧石夕院或石夕氧 200807705 24699pif 烧㈣sesqmoxane or siloxane, SSQ)或二氧化石夕命 及光學材料上。對於基於SS(3之材料,倍半氧# = 烧)為基本單元。倍半氧石夕燒或τ樹脂(T_resin)=二 驗式㈣〇3/2)n之有機·無機混合聚合物。此等材 見代表包含梯型結構,且石夕上含有置放於立方體頂點之八 H子(τ8立方體)的籠形結構可包、 nr其Ϊ ”Si之有機取代而具有在常見有機it 之k又良好的洛解度。有機取代物提供低密度以及低And optoelectronic devices and methods for treating new polymeric materials at the time of manufacture. [Prior Art] The commercial use of electronic image sensors in electronic technology has been increasing in recent years. Electronic image sensors can be found in cameras, cell phones, and in new safety devices for vehicles (for example, to estimate the distance between vehicles, to accumulate blind spots that are not exposed by mirrors, etc.). Many semiconductor manufacturers convert their production lines to CMOS sensor production to meet this need. CM〇s inductors use uranium for many processes in the manufacture of standard integrated circuits (1C) and do not require large capital investments to produce devices of the current state of the art. In the bottom-up process, the photodiode (phot odiode) is built in the stone layer. Standard dielectric and metal circuits are placed on the diode to transfer current. The optically transparent material disposed directly on the diode is optically transparent (4) that transfers the surface of the device and passes through the color filter (10)-fiI (four) to the photodiode. Transparent slabs and flattening materials are usually placed on the color filter w and on the device. The microlens is placed on a flattened film layer on the ^ 6 200807705 24699pif color filter to improve device performance. Finally, the protective layer may be placed on the lens or the glass slide may be placed over the lens array, leaving an air gap between the lens and the cover. Most of the CMOS inductors are constructed using one or more layers of metallization using a subtractive/chemical vapor deposition (CVD) oxide metallization. For the production of a planarized film layer or microlens, an organic polymer such as a polyimide or a novolac material is also used, or a siloxane polymer may sometimes be used. Organic polymers can be divided into two different groups according to their dielectric constants (didectric coffees). Non-polar polymers contain molecules with almost completely covalent bonds. Due to non-polar polymers, they are mainly composed of non-polar c_c bonds. Therefore, the dielectric constant can be estimated using only the density and the chemical composition. The polar polymer does not have low loss, but it contains atoms of different electronegativity, resulting in an asymmetric charge distribution. Therefore, the polar polymer has a higher dielectric Electric mussel consumption and dielectric constant, depending on the frequency and temperature at which time is evaluated. Several organic polymerizations have been developed for the purpose of dielectric properties = 2 However, due to the low thermal stability of these layers (thermalstaWlityf , softness (s〇ftness) and incompatibility with the development of conventional technology processes based on Si〇2 dielectric, the above-mentioned film layers may be limited. For example, organic polymers cannot Chemical mechanical polishing (CMp) or dry back: etching without damaging the film. The recent focus has been focused on sesquioxane-based Xiyuan or Shixi oxygen 200807705 24699pif burnt (four) sesqmoxane or siloxane, SSQ) or dioxide dioxide and light materials. For SS (3 material, sesquioxide # = burn) as the basic unit. sesquioxalate Burning or tau resin (T_resin) = two-test (4) 〇 3/2) n organic/inorganic hybrid polymer. These materials are represented by a ladder-like structure, and the cage structure containing the eight H sub (τ8 cube) placed on the apex of the cube can be wrapped, and the organic substitution of nr and its "Si" has the common organic k has good Loose resolution. Organic substitutes provide low density and low

常數的基質材料。基質材料之較低介電常數亦歸因 Si〇2 t ^ Si.〇 tb Si.R ,於微電子應狀基於倍半氧頻的材料終為氯_倍半 氧矽烷(hydrogen_silsesquioxane5 HSQ)以及甲基_倍半氧矽 烷(methyl_silseSqUi〇xane,。材 料由於CH3基團之較大尺寸而具有與聊相比之較低的 介電常數,其分別約2.8以及low,以及與Si_H相比之 Si-CH3鍵的較低極化性。然而,此等膜層之在可見光範圍 的折射率通常約介於Μ至L5之間,且通常小於16。 基於矽石一氧化矽之材料具有Si〇2之四面體基本結 構。矽石二氧化矽具有分子結構,其中每一 Si原子鍵結至 四個氧原子之分子結構。每一矽原子在氧原子之正四面體 的中G亦即其形成橋接交聯(bridging crosslink)。所有 純粹矽石二氧化矽具有緻密結構以及高化學穩定性以及極 佳熱穩定性。舉例而言,用於微電子技術中之非晶矽石二 200807705 24699pifConstant matrix material. The lower dielectric constant of the matrix material is also attributed to Si〇2 t ^ Si.〇tb Si.R , and the material based on the seso-oxygen frequency in the microelectronics is finally hydrogen_silsesquioxane5 HSQ and _ sesquioxane (methyl_silseSqUi〇xane, material has a lower dielectric constant compared to the larger size of the CH3 group, which is about 2.8 and lower, respectively, and Si- compared with Si_H The lower polarization of the CH3 bond. However, the refractive index of these layers in the visible range is usually between about Μ and L5, and is usually less than 16. The material based on vermiculite iridium oxide has Si 〇 2 Tetrahedral basic structure. Vermiculite ceria has a molecular structure in which each Si atom is bonded to a molecular structure of four oxygen atoms. Each helium atom is in the middle of the tetrahedron of the oxygen atom, that is, it forms a bridge. Bridging crosslink. All pure vermiculite ceria has a dense structure with high chemical stability and excellent thermal stability. For example, amorphous vermiculite used in microelectronics technology 200807705 24699pif

氧化矽膜具有2.1 g/cm3至2·2 g/cm3之密度。然而,歸因 於與Si-Ο鍵之咼極化性有關的介電常數之高頻率分散,其 介電常數亦很高,在4·〇至4·2之範圍中。因此,用降低k 值之含C有機基團(諸如ch3基團)替換一或多個Si-OSi 橋接基團為必要的。然而,歸因於位阻(sterjc hindrance), 此等有機單元減小橋接交聯度且增加在分子之間的自由體 積。因此,與四面體二氧化矽相比,其機械強度(楊氏模 數(Young’s modulus) <6 GPa)以及耐化學性減小。又,此 等基於甲基之矽酸鹽以及SSQ (亦即,MSQ)聚合物具有 相對低的破裂臨限值,通常為約1μιη或更小。 【發明内容】 本發明之一目標為提供一種與傳統積體電路(IC)製 f以及CMC)S影«應職用相容之新型高折射率的石夕 氧院聚合物(siloxane p〇lymer )。 目標為提供—種修飾(mc)dify)單體(_。黯)以 』方;f 型有機官能化分子(。rga,functionalized molecule) 个之第 ' 、乐二目為提供產生聚(有機石夕負人 ::之:组合物適合於製備具有極佳介電特性以= 聚合物來形成。 、㈢疋由以上所提及之 本發明之第五目標為將介電層提供於石夕以及玻璃晶圓 200807705 24699pif 將自以下說明書易見的此 已知介電_以及用於其製備=_ =目標連同其優於 述且主張之本發明完成。 彳法的優點由下文中所描 氧二^成二等:標,引入新型聚有機倍半 導體或光電裝置 衫且作為相絕緣膜用於半 直由之單體包含:至少兩個金屬原子, 美·輕在金屬原子上都顯示可水解取代 二二二二有機基團’其能夠減小聚合物之極化性' 广乂 ”“勿,而在聚合物形成奈米大小的孔隙度 (ροκ>ϋ)或由單體形狀所有㈣特性的組合。 之’金屬原子為發原子,且橋接基為線性恤㈣ 或/刀支(b職㈣之(二價)煙基以將兩個石夕原子鍵聯在一 起。此外,通常㈣子之-者含有三個可水解基團,且另 -石夕原子含扣個可水職_及_交職團、反應性 分裂基團或極化性減小有機基團(諸如烷基、烯基、炔基、 芳基、多環基團或含有機石夕基團(organic containing silicon group))。後者基團亦可完全或部分地氟化。 用於本發明中之别驅體的通式I為以下通式: 200807705 24699pif 其中: R]為可水解基團(諸如氫、鹵化物、烷氧基或醯氧基 gj (acyloxy group)); &為氫、有機交聯基團、反應性分裂基團或極化性減 小有機基團;且 &為橋接線性或分支之二價烴基。 在本發明之方法中,式I覆蓋兩個稍微不同種類之前 驅體,即對應於式I之第一初級前驅體,其中心代表氫。 第二種類之前驅體具有式j,其中&代表有機交聯基團、 反應性分裂基團或極化性減小有機基團或其組合。此等基 團由烷基、烯基、炔基、芳基、多環基團以及含有機矽基 團來表示。 根據&基團為氫之式的化合物可由矽氫化反應 (hydrosilylation reaction)來形成,其中三鹵石夕烧 (trihalosilane)以及二1¾石夕燒(dihalosilane)在存在八幾基銘 (cobalt octacarbonyl)之情況下反應,以形成具有良好產量 之 1,1,1,4,4-五 鹵-1,4-二破丁烧 (m4,4-pentahalol,4-disilabutane)中間物。此中間物例如 可由矽氫化作用來轉換,以替換在位置I之氫使得形成有 機官能化矽烷。若R2基團為反應性基團,則基團可在膜層 固化程序期間分解且留下交聯基團或極化性減小基團或^ 組合。 〆 本發明之聚合物藉由水解多矽烷單體之可水解基團或 本發明中所述聚合物之組合或本發明之分子與此項技術中 200807705 24699pif 1知刀子之組合且隨後由縮合聚合過程進_步聚合其來產 電膜 "才料例如可在包含(砍)晶圓之物件中用作光學介 3 5 Λ發明亦提供—制於形成具有4.G或更小(或更佳 介電常數以及在632.8麵波長範圍内大於The cerium oxide film has a density of 2.1 g/cm 3 to 2·2 g/cm 3 . However, due to the high frequency dispersion of the dielectric constant associated with the 咼 polarization of the Si-Ο bond, the dielectric constant is also high, ranging from 4·〇 to 4.2. Therefore, it is necessary to replace one or more Si-OSi bridging groups with a C-containing organic group (such as a ch3 group) which lowers the k value. However, due to sterjc hindrance, these organic units reduce the degree of bridging crosslink and increase the free volume between molecules. Therefore, the mechanical strength (Young's modulus < 6 GPa) and the chemical resistance are reduced as compared with the tetrahedral ceria. Again, such methyl-based silicates and SSQ (i.e., MSQ) polymers have relatively low rupture thresholds, typically about 1 μηη or less. SUMMARY OF THE INVENTION One object of the present invention is to provide a novel high refractive index cerebral oxygen polymer (siloxane p〇lymer) which is compatible with conventional integrated circuit (IC) and CMC)S. ). The goal is to provide a modified (mc) dify) monomer (_.黯) to the side; f-type organofunctionalized molecules (.rga, functionalized molecule) of the first ', Le two to provide the production of poly (organic stone) Xiyang:: The composition is suitable for the preparation of a polymer having excellent dielectric properties to form =. (3) The fifth objective of the present invention mentioned above is to provide a dielectric layer to Shi Xi and Glass wafers 200207705 24699pif This known dielectric, as readily apparent from the following description, and the invention for its preparation =_= target, together with its preferred embodiment, are completed. The advantages of the method are described below. ^成二等: standard, the introduction of a new polyorganic semiconductor or optoelectronic device shirt and as a phase insulating film for semi-straight monomers comprising: at least two metal atoms, the United States · light on the metal atom shows hydrolyzable substitution The 2222 organic group's ability to reduce the polarizability of the polymer 'widely' "not to form a nanometer-sized porosity (ροκ>ϋ) in the polymer or all (four) characteristics of the monomer shape Combination. The 'metal atom is an atom, and the bridge The base is a linear shirt (four) or / knife branch (b (four) (divalent) smoke base to bond two stone atoms together. In addition, usually (four) - contain three hydrolyzable groups, and another - Shi Xi atom contains a water-based _ and _ turnover group, reactive cleavage group or polarized reduced organic group (such as alkyl, alkenyl, alkynyl, aryl, polycyclic group or Containing an organic containing silicon group. The latter group may also be fully or partially fluorinated. Formula I used in the present invention is of the formula: 200807705 24699pif wherein: R] Is a hydrolyzable group (such as hydrogen, halide, alkoxy or acyloxy group); & is hydrogen, organic crosslinking group, reactive cleavage group or polarized reduced organic group And < is a bridged or branched divalent hydrocarbon group. In the method of the present invention, Formula I covers two slightly different types of precursors, i.e., corresponding to the first primary precursor of Formula I, the center of which represents hydrogen The second type of precursor has the formula j, wherein & represents an organic crosslinking group, a reactive cleavage group or a pole Reducing the organic group or a combination thereof. These groups are represented by an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a polycyclic group, and a group containing a oxime. The group according to the & The compound can be formed by a hydrosilylation reaction in which trihalosilane and dihalosilane are reacted in the presence of a cobalt octacarbonyl to form a good The intermediate of 1,1,1,4,4-pentafluoro-1,4-pentahalol (4-disilabutane) was produced. This intermediate can be converted, for example, by hydrogenation of hydrazine to replace the hydrogen at position I to form an organofunctional decane. If the R2 group is a reactive group, the group can decompose during the film layer curing process and leave a crosslinking group or a polarizing reducing group or combination. The polymer of the present invention is obtained by hydrolyzing a hydrolyzable group of a polydecane monomer or a combination of the polymers described in the present invention or a molecule of the present invention in combination with a technique of the above-mentioned technology in the art of 200807705 24699 pif 1 and then by condensation polymerization. The process proceeds to the step of polymerizing it to produce a film. For example, it can be used as an optical interface in articles containing (cut) wafers. 5 inventions are also provided - formed to have a thickness of 4.G or less (or Good dielectric constant and greater than 632.8 wavelength range

V.., 目於⑽)之折射率之薄膜的方法,其包含 ί:材iHt體Γ形成石夕氧烧材料,以薄層形式沈積石夕氧 k材枓且固化溥層以形成膜層。 大量優點由當前新型材料且由製造其之方法來獲得。 ^此,本發明提出對與光學介f聚合物有_現存^題之 解決方案。更特定言之,本發明提出對與折射率、⑽ 容性、機械雜(概以及硬度)、破«限仙及敎特性 現存問題之解決方案,《驗1C積體溫度。尤其 疋膜層亦適用於視需要與熱固化過程同時進行之光或幸s 射(較佳是紫外線㈣raviolet, uv)波長或電子束(e_beam^ 增強固化。 新型有機官能化分子可建置為能夠在基質中進一步反 應之此形式。此意謂分子之有機官能例如可經歷交聯、分 裂或兩者之組合(亦即,隨後進行之分裂以及交聯^應 本务明&供歸因於南父聯橋接基團密度之極佳耐化學 性以及非常低的化學吸附性能。 若R2基團為分裂基團,則仍導致非常小的孔隙尺寸 (pore size)(亦即’通常h5 nm或更小)。然而,根據創新 200807705 24699pif 本發明所形成之聚合物亦與諸如環糊精(Cycl〇(Jex杜in)之傳 統類型成孔劑(porogen)相容,所述傳統類型之成孔劑可用 於將在聚合物中形成多微孔(micr0_p0r0sity)且因此減小聚 合物之介電常數。 另一重要優點在於新型光學介電材料具有導致在半導 體基底構形上之極佳局域以及全域平坦度的極佳平坦化特 Γ 性,所述情況減小乃至完全消除在介電質以及氧化物概塾 沈積之後對化學機械平坦化之需要。 此外,新型材料具有極佳間隙填充特性。 粒子併入包含視需要具有官能基團之二石夕 1 文良與習㈣氧燒材料之折射率(約 達175乃至』▲已^之折射率(約叫,而可獲得在高 卢1、商入於间乾圍中之折射率,所述情況使得新型材料 尤其適合於CMOS相機應帛。 U柯枓 用於明提供一種光學介靖垸聚合物,盆適 用於屯成具有〶破裂臨 ,、週 熱穩定且機郝化〜 ㈣㈣及孔隙尺寸之 熱處理之後將lit射率_介電膜。聚合物在經受 間隙填充之非水且無石夕院醇⑽=王,千坦度以及 特性以及光學特柯。 、S,其具有極佳電 於最終固化溫度之、、1/合物製造之膜層即使經受高 及電特性上仍;最終固化之後其結構、機械以 介電聚合物,故其對;克服等特性優於習知光學 先予+導體裝置令改良裝置效能為關鍵白 t版整 200807705 24699pif 接下來,將借助於以下實施方式且參考許多工 更精密地檢查本發明。 貝4 【實施方式】 t發明提供-縣學介電聚合物,其包含在 3了石少一有機橋接基團之至少一多石夕垸單體單元。另 A圍石夕f子之—者亦含有-個有機交聯基團、反應性分裂 Γ'\ -斤有刚述物之組合(諸如烷基、烯基 基、多環基團或含有機石夕基團)。 方基、 個原子之一者包含兩個可水解基團,且另一者包含二 續石/氣ίΐΓ所述基團—旦經水解且聚合則能夠形錢 但最鏈基f ’諸如氫、鹵化物、燒氧基或酸氧基, 土馬氣、曱氧化物或乙氧化物基團或任何其組合。 用於本發明中之聚合作用之前驅體的通式I為以下:V.., a method of film having a refractive index of (10), comprising: forming a stone oxide composition of the material, forming a stone oxide composition in a thin layer, and solidifying the germanium layer to form a film layer . A number of advantages are obtained from current novel materials and by methods of making them. ^ This, the present invention proposes a solution to the problem with optical polymers. More specifically, the present invention proposes a solution to the existing problems of refractive index, (10) capacitiveness, mechanical miscellaneous (abbreviation and hardness), breaking and limiting characteristics, "test 1C integrated body temperature. In particular, the ruthenium film layer is also suitable for light or foreseeing (preferably ultraviolet (iv) raviolet, uv) wavelengths or electron beams (e_beam^ enhanced curing) as needed during the thermal curing process. New organofunctional molecules can be built to be able to This form of further reaction in the matrix. This means that the organic function of the molecule can, for example, undergo cross-linking, splitting, or a combination of the two (ie, subsequent splitting and cross-linking) The South Father's Union has excellent density and excellent chemical resistance and very low chemosorption properties. If the R2 group is a split group, it still results in a very small pore size (ie 'normal h5 nm or Smaller. However, the polymer formed according to the invention is also compatible with a conventional type of porogen such as cyclodextrin (Cycl® (Jex Duin), which is formed according to the innovation 200807705 24699pif. The agent can be used to form micropores in the polymer and thus reduce the dielectric constant of the polymer. Another important advantage is that the novel optical dielectric materials have excellent localities in the configuration of the semiconductor substrate. And the excellent planarization characteristics of the global flatness, which reduces or even completely eliminates the need for chemical mechanical planarization after dielectric and oxide deposition. In addition, the new material has excellent gap fill characteristics. The particle is incorporated into a refractive index (about 175 or even ▲ ▲ ▲ ▲ ▲ 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The refractive index that is incorporated into the intercropping circle makes the new material particularly suitable for CMOS cameras. U Kezhen is used to provide an optical mediator, and the pot is suitable for crucible rupture. Weekly heat stable and machine Haohua ~ (4) (4) and the pore size after the heat treatment will be the lit rate _ dielectric film. The polymer is subjected to gap filling non-water and no Shi Xiyuan alcohol (10) = king, thousand degrees and characteristics and Optical tec., S, which has excellent electrical properties at the final curing temperature, and the film layer made of the composite is subjected to high electrical and electrical properties; after final curing, its structure and mechanical properties are dielectric polymers. Overcome The characteristics are superior to the conventional optical pre-conductor + conductor device to improve the performance of the device as the key white t-version 200807705 24699pif Next, the present invention will be examined more precisely by means of the following embodiments and with reference to many works. The invention provides a county-level dielectric polymer comprising at least one more than one stone-stone monomer unit of a stone-free one organic bridging group, and another A-stone eve-f- of the group also contains an organic A group, a reactive splitter, has a combination of just-reported species (such as an alkyl group, an alkenyl group, a polycyclic group, or a zeolitic group). Hydrolyzable groups, and the other contains two consecutive stones / gas, the group - once hydrolyzed and polymerized, can form the money but the most chain f 'such as hydrogen, halide, alkoxy or acidoxy , terracotta, cerium oxide or ethoxylate groups or any combination thereof. The general formula I used for the pre-polymerization of the present invention is as follows:

发中 、 為可水解基圑; 機基圈2或有機交聯基團、反應性分裂基團、極化性減小有 基、多二所有前述物之組合,諸如烷基、烯基、炔基、芳 R辰基圈或含有機矽基團;且 c線性或分支之二價烴基。 交I為選自_化物、烧氧基、酿氧基之基團以及 200807705 24699pif 氫,I較佳為選自烷基、烯基、炔基以及芳基、多環基團 或含有機矽基團,且&較佳為選自線性以及分支之亞烷 (alkylen:)基、輯(aikenylene)基以及亞快(alkynylene)基, j及一‘脂環(bivalent alicyclic)基(多環基團)以及二價 芳方矢基,其都包括於二價烴基之定義中。 • 由實質上均聚以上式之單體,隨後固化以達成交聯 触#之11化組合物包含交聯有機$氧烧聚合物,亦即, 聚(有機矽氧烷),其可形成為薄膜。 如本文中所使用之“烯基,,包括直鏈以及分支之烯基 (諸如乙烯基以及丙烯基)。如本文中所使用之術語“炔 基包括直鏈以及分支之炔基(適當地為乙炔)。“芳基,, 意謂,取代或非取代的單、雙歧乡環狀絲碳環基;芳 基之貫例為苯基、萘基或五氟苯基丙基(pentafluorophenyl propyl)。本文中所使用之“多環,,基團包括金剛烷基 (adamantyl)三二甲基金剛烷基丙基(dimethyl adamantly ProPyl)、卜灰基(norb〇rnyl)或降g^norbornene)。更特定 言之,烷基、烯基或炔基可為線性或分支的。 烧基較佳含有1至18個碳原子,更佳含有1至個 碳原子,且尤其較佳含有丨至12個碳原子。烷基較佳在以 . 或Ρ位置處分支,具有一個或多個(較佳為兩個)Ci至 • Q烷基,尤其較佳鹵化(詳言之,部分或完全氟化或全氟 化(per-fluorinated))烷基、烯基或炔基。一些實例為非氟 化、部分氟化以及全氟化異丙基、第三丁基、丁·2•基、孓 甲基丁冬基以及1,2-二甲基丁_2_基。詳言之,丈完基為含有 200807705 24699pif 厌原子之低級烷基(lower alkyl),其視需要呈有選 以及齒素之1至3個取代基。甲基、乙基、正丙基: 、訂基、異丁基以及第三了基為尤其較佳的。 ^基較佳含有2至18個碳原子,更佳含有2至14個 石反,、,且尤其較佳含有2至12個碳原子。乙烯(亦即, 以雙鍵鍵結之兩個碳原子)基團較佳位於位置2或更言 ,八^刀子中之Sl原子有關。分支縣較佳在α或β位置 2执其具Λ一或多個(較佳為兩個)Cl至C6燒基、烯 ^,尤其較佳是氟化或全氟化之烧基、婦基或炔基。 *炔基較佳含有3至18個碳原子,更佳含有3至14個 石厌原子’且尤其較佳含有3至12個碳原子。乙块基(亦即, 以二鍵鍵結之兩個碳原子)基團較佳值於位置 分子中之Si原子有關。分支炔基較佳在 具有—或多個(較佳為兩個Μ至Q燒基、烯 土或炔基,尤其較佳是全氟化之院基、烯基或块基。 山二價脂環基可為多環脂族基,其包括由具有5至2〇 個碳原子之環狀結騎生的絲,諸如降 ^ ^ ^ ( ,tJ ^ (ada^ntylene) ) 〇 ^ (a咖e)”代表包含!至6個環(較佳是!至6個稠環㈣二 3其且=言二至5個稠環)之二價芳基(諸如伸苯基、 伸奈基以及蒽基(ant}iracenyl;))。 芳基較佳為苯基’其視需要在環上具有選自齒素、烷 固取代基;或蔡基,其視需要在環狀結 構上具有廷自鹵素、絲或婦基的i至η個取代基,取代 200807705 24699pif 基視需要減化的(包括全氟化或部分氟化)。 例:為金鴨、二甲基金職基丙基、降 代誠亦可視需要 «_ . . ^ ” 土烯基、炔基或芳基與矽原子隔開。 t之諸如:二® ?表11素(氯、氟、溴)、烧氧基(詳 二)、°" 乙氧基、丙氧基或丁氧基之CM。烷氧In the hair, is a hydrolyzable group; a mechanical base 2 or an organic crosslinking group, a reactive cleavage group, a reduced polarizing group, and a combination of all of the foregoing, such as an alkyl group, an alkenyl group, an alkyne a aryl group or a aryl group containing a fluorene group; and c is a linear or branched divalent hydrocarbon group. I is a group selected from the group consisting of a compound, an alkoxy group, an alkoxy group, and a hydrogen group of 200807705 24699 pif, and I is preferably selected from an alkyl group, an alkenyl group, an alkynyl group, and an aryl group, a polycyclic group or an organic group. The group, and & is preferably selected from the group consisting of linear and branched alkylen: aikenylene groups and alkynylene groups, j and a 'bivalent alicyclic group' (polycyclic group) And a divalent aromatic aryl group, which are all included in the definition of a divalent hydrocarbon group. • consisting of a monomer that substantially homopolymerizes the above formula, which is subsequently cured to achieve a cross-linking composition comprising a crosslinked organic $oxygenated polymer, that is, a poly(organosiloxane), which can be formed into film. "Alkenyl, as used herein, includes both straight-chain and branched alkenyl groups (such as ethenyl and propenyl). The term "alkynyl" as used herein includes both straight-chain and branched alkynyl groups (suitably Acetylene). "Aryl," means a substituted or unsubstituted mono- and bi-family cyclic carbocyclic group; the aryl group is phenyl, naphthyl or pentafluorophenyl propyl. As used herein, "polycyclic," includes adamantyl trimethyl dimethyl adamantly ProPyl, norb rnyl or g^norbornene. More specifically, the alkyl, alkenyl or alkynyl group may be linear or branched. The alkyl group preferably has 1 to 18 carbon atoms, more preferably 1 to carbon atoms, and particularly preferably contains fluorene to 12 carbon atoms. The alkyl group preferably branches at a position of . or oxime, having one or more (preferably two) Ci to Q alkyl groups, especially preferably halogenated (in detail, partially or fully fluorinated or perfluorinated) Per-fluorinated) an alkyl, alkenyl or alkynyl group. Some examples are non-fluorinated, partially fluorinated and perfluorinated isopropyl, tert-butyl, butyl-2, fluorenylmethylbutyryl and 1,2-dimethylbutan-2-yl. In particular, the base is a lower alkyl containing the 200807705 24699pif anatomical atom, which is optionally selected and one to three substituents of the dentate. Methyl, ethyl, n-propyl:, a base, an isobutyl group and a third group are particularly preferred. The base preferably contains 2 to 18 carbon atoms, more preferably 2 to 14 stone counters, and particularly preferably 2 to 12 carbon atoms. The group of ethylene (i.e., the two carbon atoms bonded by a double bond) is preferably located at position 2 or more, and the S atom of the octave is related. Preferably, the branch county has one or more (preferably two) Cl to C6 alkyl groups, an ene group, particularly preferably a fluorinated or perfluorinated base group, and a base group at the α or β position 2. Or alkynyl. The alkynyl group preferably has 3 to 18 carbon atoms, more preferably 3 to 14 stone atoms, and particularly preferably 3 to 12 carbon atoms. The group of the ethyl group (i.e., the two carbon atoms bonded by a double bond) is preferably related to the Si atom in the position molecule. The branched alkynyl group preferably has one or more (preferably two fluorene- to-alkyl, olefin or alkynyl groups, particularly preferably a perfluorinated, olefinic or alkyl group. The ring group may be a polycyclic aliphatic group including a wire which is caught by a ring-shaped knot having 5 to 2 carbon atoms, such as a ^ ^ ^ ( , tJ ^ (ada^ntylene) 〇 ^ (a coffee e)" represents a divalent aryl group containing up to 6 rings (preferably! to 6 fused rings (4) 2 3 and = 2 to 5 fused rings) (such as phenyl, thiophene and anthracene) (ant}iracenyl;)) The aryl group is preferably a phenyl group which optionally has a dentate or an alkane substituent selected from the ring; or a zeoliyl group which optionally has a halogen-based structure on the ring structure. i, n substituents of silk, silk or gynecyl, replacing 200807705 24699pif base as needed for reduction (including perfluorination or partial fluorination). Example: for golden duck, dimethyl fund base propyl, lower generation Depending on the need, «_ . . . . ^ " The olefinic, alkynyl or aryl group is separated from the ruthenium atom. t such as: bis? ? Table 11 (chloro, fluoro, bromo), alkoxy (detailed), °" ethoxy, propoxy or butoxy CM Alkoxy

iL :'在聚合(例如,縮合聚合)期間容易地 、、工刀衣而每隹開單體之任何其他基團。 2基通常代表具有式R4〇_之基團,其中R4如上所 :疋=基:燒氧基之院基殘基可為線性或分支的。通 :氧土包含具有1至6個碳原子之低級烧氧基(諸如 曱乳基、乙氧基以及第三丁氧基基團)。 醯^具,式R5CV,其中R5如上所界定代表燒 ;基:二意】乳基之咖基可具有與編中之相應 在揭露案之上下文中,有機基團取代基鹵素可為F、 π $或I原子且較佳為F或a。通常,本文中術語 素思謂氟、氣、溴或碘原子。 、 在式I之單體中,矽原子之間經由鍵聯劑基團(Iinker group)鍵聯至彼此。通常,鍵聯劑包含工至個(較佳約 1至約10個)碳原子。適當鍵聯劑基團&之實例包括亞 烷基、亞烯基以及亞炔基。“亞烷基,,基團通常具有式 (CHfr ’其中r為1至忉之整數。至少一單元-CH2-的氫 之一或之二者可由以下所提及取代基之任一者來取代: 200807705 24699pif 來說 中的至少一三鍵 键基團=於亞燒基殘基’其含有在烴主鏈中之 2一 右存若干雙鍵,顯難為共.厄的。相對 亞炔^ 1團含有在對應於亞烧基殘基之煙主鍵 二價鍵聯鬚射為未被取代缝取躺。取代基較 佳選自氧基、祕、Q,烧基、Ci_iq稀基、c㈣芳基、丙 稀基、環氧基、雜以及縣之群。尤其有趣㈣代物包 含用至少-絲(較佳低級絲或丨至4個碳原子)取代 之亞甲基。作為取代之結果,獲得分支鍵聯劑鏈。分支鍵 聯劑鏈(例如’ -CH(CH3)-)可整體含有與相應線性(例如, -CHWH2-) —樣多的碳原子,即使一些碳原子位於支鏈 中,如以下結合工作實例所展示。為了本發明起見,此等 为子可被s忍為兴構的(isomeric)’’ 。 、iL: 'Easily, during the polymerization (e.g., condensation polymerization), any other groups of the monomer are opened. The 2 group generally represents a group having the formula R4〇, wherein R4 is as defined above: 疋= group: The alkoxy group-based residue may be linear or branched. The oxonite contains a lower alkoxy group having 1 to 6 carbon atoms (such as a thiol group, an ethoxy group, and a third butoxy group).醯^,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, $ or I atom and preferably F or a. Generally, the terminology herein refers to a fluorine, gas, bromine or iodine atom. In the monomer of formula I, the ruthenium atoms are bonded to each other via a linker group (Iinker group). Typically, the linking agent comprises from one (preferably from about 1 to about 10) carbon atoms. Examples of suitable linking group & alkylene, alkenylene and alkynylene. "Alkylene," generally has the formula (CHfr 'where r is an integer from 1 to 。. One or both of the hydrogen of at least one unit -CH2- may be replaced by any of the substituents mentioned below : 200807705 24699pif In the case of at least one triple bond group = at the alkylene residue 'which contains a number of double bonds in the hydrocarbon backbone, which is difficult to co-exist. The group contains a divalent bond of a primary bond corresponding to a sub-alkyl residue to be an unsubstituted slit. The substituent is preferably selected from the group consisting of an oxy group, a secret group, a Q group, a thiol group, a Ci_iq group, and a c(tetra)aryl group. , acryl, epoxy, hetero, and group of counties. Particularly interesting (iv) substitutes contain a methylene group substituted with at least a silk (preferably lower filament or hydrazine to 4 carbon atoms). As a result of the substitution, a branch is obtained. a linker chain. A branching linker chain (eg, '-CH(CH3)-) can have as many carbon atoms as the corresponding linear (eg, -CHWH2-), even if some of the carbon atoms are in the branch, such as The following is shown in connection with the working examples. For the purposes of the present invention, these are sub-"isomeric"'s. ,

作為根據式I之特別較佳化合物的實例,可提及1_(三 氯矽烷基)-2-(甲基二氯矽烷基)乙烷 (l-(triclilorosilyl)-2-(methyldiclilorosilyl) ethane)以及 1-(甲 基二氣矽烷基)_1-(三氯矽烷基)乙烷 (l_(methyldichlorosilyl)-l-(trichlorosilyl) ethane)。 產 如上所提及,在根據本發明之方法的第一步驟中 生具有以下式之單體:As an example of a particularly preferred compound according to formula I, mention may be made of 1-(triclilorosilyl)-2-(methyldiclilorosilyl)ethane and 1-(Methyldichlorosilyl)-1-(trichlorosilyl)ethane (1-(methyldichlorosilyl)-l-(trichlorosilyl)ethane). Production As mentioned above, a monomer having the formula: is produced in the first step of the process according to the invention:

I 其中,&為可水解基團; 200807705 24699pif R2為氫;且 R3為橋接線性或分支之二價煙基 此單體以及類似基於矽烷之材料可 生,矽氫化反應在八羰基鈷作為催飞反應末產 ^ . ^ w勹1隹化劑之情況下進行。 _ t 或料任何_過渡金屬辛Wherein & is a hydrolyzable group; 200807705 24699pif R2 is hydrogen; and R3 is a bridged or branched divalent nicotine. This monomer and a similar decane-based material can be produced, and the rhodium hydrogenation reaction is promoted in octacarbonyl cobalt. The fly reaction is carried out in the case of ^ ^ 勹 隹 隹 隹. _ t or any _ transition metal xin

ΓΓΓΓΓ )催化劑之情況下所催化的新S f一 風化ί應^魏用作反應物。因此,為了以高產量產i 、w 丁楚 _ , 在存在八技基銘之情 化合物可與第二二域魏化合物反ΓΓΓΓΓ ) The new S f - catalyzed by the catalyst is used as a reactant. Therefore, in order to produce i, w Ding Chu _ in high yield, in the presence of eight techniques, the compound can be reversed with the second two domain Wei compound.

t所使社三自魏通常具有包含獨和叙反應 機基團以有助於矽氫化反應。 W 在實例1中制,其中乙烯基三氣魏與 所…地,藉由所揭露之方法,獲得具有高純度之 所要化β物,騎纽允許由&位置處併頌縣代絲 d備矽氧烷材料之隨後步驟將單體用作前驅體。 本發明提供一種光學介電矽氧烷聚合物,其適用於形 f熱^且機械穩定、高折射率、光學透明、高破裂臨限 心、始、集且低孔隙體積以及孔隙尺寸介電膜。聚合物在經 义…、處理之後產生具有極佳局域以及全域平坦度以及間隙 填充之無水以及矽烷醇的膜,其具有極佳電特性。由所發 明,聚合物f造之膜即使較高於最終固化溫度之溫度, 在最終固化之後其結構、機械以及電特性上保持不變。由 於所有此等特性優於習知低介電常數聚合物,故其對於克 200807705 24699pif 服在低介電常數膜整合至半導體裝置中的現存問題為關鍵 的。 + 1 °合成是基於水解以及縮合化學合成技術。聚合可 在溶融相或在液體介質中進行。而進行反應之溫度在約 20&C至約2〇(TC之範圍内,通常約25。〇至約16〇。〇,詳言 之j 80C至約15〇。〇。通常,聚合在周圍壓力下進行且最 大舰度由任何所使用溶劑之沸點來設定 。聚合可在回流條 I進仃。在無催化劑的情況下或藉由使用鹼性(或詳言 -)催化&彳來聚合瞬間單體(instant monomer)為可能 白勺c 二岫有機矽氧烷材料具有自500至1〇〇,〇〇〇 之 白=平均)分子量。分子量可在此範圍之下端(例如, 機石夕氧==1^或更佳自5GG至8,_g/mc>1)或有 ]〇nr^ 此範圍之上端(諸如自10,_至 混合更ί自15,w至5°,咖咖。1)的分子量。 八^ 乂低刀子里之聚合物有機矽氧烷材料與具有較高 刀子1之有機矽氧烷材料可為理想的。 ϋ 已發現適當聚合物組合物可藉由均聚 之鍵聯劑基團之式I的單體來# 、、泉〖生或刀支 具有式u其中 與具有式!(其中&代表分支二第一單體 體所獲得之組合物亦為可能的,第幻之第二單 耳比為95:5至5:95,詳言之^〇 ^體與弟二單體之莫 至20:80。此外,式j之單·至10:90,較佳80:20 式之早體亦可以任何比率與任何已知可 200807705 24699pif ^解夕氧力元或有機金屬(例如,鈦醇鹽(份肪匕爪aik〇xide)、 虱化鈦、锆醇鹽(zirconium alkoxide)、氯化鍅、鈕醇鹽 (、"画摄㈣心)、氯化纽、銘醇鹽(aluminum alkoxide) 或氯化銘(但不限於此等))單體共聚。 根據一較佳實施例,為了修飾特性,沈積於半導體裝 ^基底上之魏燒材料經加熱引舰—步之交聯,藉此獲 付在加熱之後具有小於1〇%、較佳小於5%、詳言之小於 2%之收縮率以及超過425。〇之熱穩定性的膜層。 、 根據特定實施例,膜層初低於約·。c之溫度旋塗 rrratmg)之後經㈣,且隨錢由在以低於4贼之溫 二S20分鐘的同時曝露至uv輻射來固化。固 化在足夠時間週期進行以使由具有以 之單元在位置R2處的有機取代基發生反應。卩體所何生 或f 熱處理之後能夠形成具有4·0 J更小(#5之3.5或更小)之介電常數,在63 長範圍内具有I·58或更大(詳言之⑽或更 率’具有5.0 Gpa或更大之揚氏模數,具有$ 、 ===更大之破裂臨限值的低介電膜4 ^ 使用夕私邮由聚合物形成之膜層 之溫度下,在半導體結構上保持穩定。wooc或更回 矽氧烧基質可以摻雜奈米粒子以作進 =粒子包括氧化物、半導體以及金屬奈米二•用; 合物^増如絲特性、料性《及機 200807705 24699pif 的。可藉由在奈米粒子表面上偶合化學基團以修飾奈米粒 子。此等化學偶合基團通常為所謂的矽烷偶合基團 (silane-coupling group),但不限於彼等。矽烷偶合元素例 如為氨基丙基三曱氧基矽烷(amin〇 pr〇pyl trimethoxysilane)、曱基丙烯醯氧基丙基三曱氧基矽烷 (methacryloxy propyl trimethoxysilane)或縮水甘油氧基丙 基二曱氧基石夕烧(glysidoxy propyl trimethoxysilane)以及具 有偶合至官能基之石夕烧殘基的其他類似基團。使用經偶合 處理奈米粒子之一優點在於其增強粒子至矽氧烷基質之溶 解度且亦可使得粒子能夠共價鍵結至石夕氧烧基質。偶合元 素之數目亦可在奈米粒子表面處改變。鍵聯劑之相對量可 為1或更高,且通常在表面具有一個以上的鍵聯劑分子以 保證至聚合物基質之足夠鍵結為較佳的。 通常,聚合物或共聚物以1至500重量份、較佳約5 至約100重量份、詳言之約10至約50重量份之奈米粒子 與100重量份之聚合物或共聚物來結合以形成含有奈米粒 子之組合物。 聚合物或共聚物可藉由混合(詳言之習知機械混合) 與奈米粒子結合。 以一些鍵(較佳化學鍵)形成於聚合物或共聚物與奈 米粒子之間的此方式結合聚合物或共聚物與奈米粒子亦^ 可能的。因此,使用具有能夠與奈米粒子起反應且在聚二 物或共聚物與奈米粒子之間形成鍵結之反應性基團的聚I 物或共聚物為可能的。使用如上所論述之具有矽烷偶合元 200807705 24699pif 素或基團U粒子亦為可_ 鍵結亦將增強組合物之機械牲μ丄过㈣刀之間的物理 +戍蛾4寸性、光學特性以及電特性。 -=㈣含伽化學鍵結之奈綠子以及 物之k合物,其中不同聚合物之混 ^ _ed C_ymer)。奈錄子鍵結至混合物3^;:= 物組份。 / ΧΚ σ 可(例如)藉由選自鹼性溶液或酸 火=解師hyd吻sis)、雷射卿aserdens;= 兩個以上此等方法之組合之群的方法來製造適 二用^發财之奈米粒子。誠,此清單決不限制本發 月之㈣,可使祕得到具有所要粒子大小之粒子的任何 方法。粒子大小(平均粒子大小)可在丨nm至若干微米 之範圍,又通常在光學以及1C應用中具有20随或更小 (詳言之約0.5mn朗18_)之粒子大小為較佳的。又, 粒子大小分布範圍較窄為較佳,但其非必需的。 待摻雜至有機矽氧烷基質之奈米粒子的典型材料包括 (但不限於)以下群: 金屬:Fe、Ag、Ni、Co、Cu、Ft、Bi、Si 以及金屬合 金0 金屬氧化物·· Ti02、ZnO、Ta205、Nb205、Sn02、Zr02、The sect of the company has a group containing a singular and sulphur reactor to aid in the hydrogenation reaction. W is prepared in the example 1, wherein the vinyl trigas and the ground are obtained by the disclosed method to obtain the desired β substance with high purity, and the riding is allowed to be prepared by the & The subsequent step of the oxoxane material uses the monomer as a precursor. The present invention provides an optical dielectric siloxane polymer suitable for use in the form of heat and mechanical stability, high refractive index, optical transparency, high fracture centering, initial, collection and low pore volume and pore size dielectric film . The polymer, after treatment, is processed to produce a film of water-free and stanol with excellent local and global flatness and gap filling, which has excellent electrical properties. It has been found that the film made of polymer f remains structurally, mechanically and electrically unchanged after final curing even at temperatures higher than the final curing temperature. Since all of these characteristics are superior to conventional low dielectric constant polymers, they are critical to the existing problems of the integration of low dielectric constant films into semiconductor devices for the PCT 200807705 24699pif. + 1 ° synthesis is based on hydrolysis and condensation chemical synthesis techniques. The polymerization can be carried out in a molten phase or in a liquid medium. The temperature at which the reaction is carried out is in the range of from about 20 & C to about 2 Torr (TC, usually about 25. 〇 to about 16 〇. 〇, in particular, j 80C to about 15 〇. 〇. Usually, polymerization is at ambient pressure The process is carried out and the maximum degree is set by the boiling point of any solvent used. The polymerization can be carried out in the reflux zone I. In the absence of a catalyst or by the use of basic (or in detail -) catalysis & The instant monomer is a possible c quinone organic siloxane material having a molecular weight of from 500 to 1 Å, 〇〇〇 white = average. The molecular weight may be at the lower end of the range (for example, Sedigree oxygen = 1 ^ or better from 5GG to 8, _g / mc > 1) or have 〇 nr ^ above the range (such as from 10, _ to mixed More from 15, w to 5 °, coffee. 1) molecular weight. It is desirable to have a polymer organic siloxane material in the lower knives and an organic decane material having a higher knives. ϋ It has been found that a suitable polymer composition can be obtained by homopolymerizing a monomer of formula I of the grouping agent group, a spring, or a knife having a formula u with a formula! (The composition obtained by the & represents the first monomer of the branch two is also possible, and the second single ear ratio of the second magic is 95:5 to 5:95, in detail, the body and the second brother In addition, the formula j to 10:90, preferably 80:20 type of early body can also be any ratio with any known can be 200807705 24699pif ^ Oxygen or organic metal ( For example, titanium alkoxide (aik〇xide), titanium telluride, zirconium alkoxide, barium chloride, butyl alkoxide (, " painting (four) heart), chloride, melamine Aluminium alkoxide or chlorinated (but not limited to) monomer copolymerization. According to a preferred embodiment, in order to modify the characteristics, the Wei-burned material deposited on the semiconductor substrate is heated to lead the ship. Cross-linking, whereby a film having a shrinkage of less than 1%, preferably less than 5%, in particular less than 2%, and a thermal stability of more than 425., after heating, is obtained. According to a particular embodiment, The film layer is initially lower than the temperature of about cc. After the spin coating of rrratmg) (4), and the money is exposed to uv spokes at a temperature of less than 4 thieves for S20 minutes. Cured. The curing is carried out for a sufficient period of time to react by the organic substituent having a unit at the position R2. Whether the carcass or the f heat treatment can form a dielectric constant having a size of 4·0 J (3.5 or less of #5), and having a length of I·58 or more in the range of 63 (more specifically, (10) or More rate 'with a Young's modulus of 5.0 Gpa or greater, a low dielectric film with a greater rupture threshold of $, === 4 ^ Using the temperature of the film formed by the polymer, Stable on the semiconductor structure. Woop or more oxy-fired substrate can be doped with nanoparticles to make progress = particles including oxides, semiconductors and metal nano-seconds; compounds such as silk properties, material properties And the machine 200807705 24699pif can modify the nanoparticle by coupling a chemical group on the surface of the nanoparticle. These chemical coupling groups are usually so-called silane-coupling groups, but not limited to The decane coupling element is, for example, amin〇pr〇pyl trimethoxysilane, methacryloxy propyl trimethoxysilane or glycidoxypropyl hydride. Glysidoxy propyl trimetho Xysilane) and other similar groups having a sulphur-burning residue coupled to a functional group. One advantage of using a coupled-treated nanoparticle is that it enhances the solubility of the particle to the oxiranyl group and also enables the particle to be covalently bonded. The number of coupling elements can also be changed at the surface of the nanoparticle. The relative amount of the linking agent can be 1 or higher, and usually has more than one bonding agent molecule on the surface to ensure Sufficient bonding of the polymer matrix is preferred. Typically, the polymer or copolymer is from 1 to 500 parts by weight, preferably from about 5 to about 100 parts by weight, in particular from about 10 to about 50 parts by weight of the nanoparticles. It is combined with 100 parts by weight of the polymer or copolymer to form a composition containing nano particles. The polymer or copolymer can be combined with the nanoparticles by mixing (in other words, mechanical mixing in detail). It is also possible to combine a polymer or a copolymer with a nanoparticle in such a manner that a polymer bond or a copolymer is formed between the polymer or the copolymer. Therefore, the use has the ability to react with the nanoparticle and to form a poly Object It is possible to form a bonded polyisomer or copolymer between the copolymer and the nanoparticle. The use of a decane coupling element of 200807705 24699pif or a group U particle as discussed above is also achievable. It will also enhance the physical properties of the composition, the physical properties of the moths, the optical properties, and the electrical properties. -= (4) The gamma-containing chemically bonded nephew and the k-complex, among which Mixed polymer _ed C_ymer). The natrix is bonded to the mixture 3^;:= component. / ΧΚ σ can be made, for example, by a method selected from the group consisting of an alkaline solution or an acid fire = dissolving hyd kiss sis), a laser siardens, and a combination of two or more of these methods. Nano particles. Honestly, this list does not limit (4) this month, and it will give you any way to get particles of the desired particle size. The particle size (average particle size) may range from 丨nm to several microns, and it is generally preferred to have a particle size of 20 or less (more specifically about 0.5 mn lang 18 Å) in optical and 1C applications. Further, it is preferable that the particle size distribution range is narrow, but it is not essential. Typical materials to be doped to organic siloxane alkyl nanoparticles include, but are not limited to, the following groups: Metals: Fe, Ag, Ni, Co, Cu, Ft, Bi, Si, and metal alloys 0 Metal oxides · Ti02, ZnO, Ta205, Nb205, Sn02, Zr02,

Mg02、Er2〇3 以及 Si〇2。 碳化物:SiC。 氮化物·· Si3N4、AIN以及TiN。 在美國公開專利申請案第2005/0170192號中論述適 200807705 24699pif 當奈米粒子材料,所述案之内容以引用的方式併入本文中。 奈米粒子通常以分散體(disperstions)之形式(“分散 液)使用。適當分政劑包括水、諸如醇以及烴之有機溶 劑以及其組合以及混合物。較佳溶劑之選擇通常視奈米粒 子之特性而定。@此,分散劑以及奈米粒子應經選擇使得 與形成良好分餘子之要翻容。舉例而言,鮮較佳pH 視晶體結構以及表面結構而定,但伽馬(gamma)氧化紹 粒子通常在酸性pH值約3_4之情況下良好分散,二氧化 石夕粒子通常在驗性pH值介於9_n之情況下容易地分散, ^氧化鈦粒子通常在pH值接近7之情況下良好分散。通 系’具有較小表面電荷之奈綠子可在触較小之溶劑中 地分散。因此,疏水粒子可在非水(無水)溶劑或具 性聽紙水紐巾分散,域雜子可在水溶 在此等奈米粒子溶劑分散體中,粒子表面亦 催化劑 反應 。此等偶合基之可水解部分尤其在作為水: 之水存在的情況下會與奈米粒子之表面自發地發生 、如上所提及,本發明亦提供製造積體電路梦 法。此等方法通常包含以下步驟: 在半導體基底上形成多個電晶體; 藉由以下步驟形成多層内連線: 沈積一層金屬層; 圖案化金屬層; 200807705 24699pif 沈積具有第-模數以及第—k值之第一介電材 料; 沈積具有高於第_材料之第一模數之第二模數 且具有低於第一材料之第-k值之k值的第二介電材料; 以及 圖案化第一介電材料以及第二介電材料,且將介 層窗(via)填充金屬材料沈積於圖案化區域中。 、,、根據本發卿於第—介電叙材料較料有财氧院 材料,其有具有鍵結至主鏈之第一有機取代基的重複 •Μ-0-Μ-0韻,材料具有自麵至⑽,簡 4’0 佳表現出—個或若干個以下特性: 4.0或更小之k值’或更佳為3 5或更小; :或更=折射率,或更佳為16或更大; 〇 ppm或更小之熱膨脹係 expansion, CTE);以及 mermal 4 GPa或更大之揚氏模數。 歸因於平坦化之極佳牲 先前步驟的情況下進行圖幸牛=在無化學機械平坦化之 度的桃或^了社解坦化來移除第二介電材料之總厚 有機矽氧烷材料可藉由在 質中聚合式I之單體以形二=罘;^谷劑所形成之液體介 將水解產物沈積於美麻 夕氧垸材料之水解產物, - :、、、薄層且固化薄層以形成具有 200807705 24699pif 〇.〇_至1〇_厚度之薄膜來沈積。 或者’有機石夕氧烷材料可 — 液體介質巾聚合式〗 $ _所形成之 c,a〇 ^ 鹽、氣化鈕、鋁醇鹽咬氣化 …1乳化鍅、鈕醇 ;a ^ ^ 现次虱化鋁(但不限於此等))單辦,以 形成匕έ矽氧烷材料或混合石夕氧^ 物,將水解絲— 齡屬㈣之水解產 α知於基底上作為薄層且固化薄 具有0·〇1μΐη至10μπι厚度之薄膜。 耳㈢场成Mg02, Er2〇3 and Si〇2. Carbide: SiC. Nitride · Si3N4, AIN and TiN. In the U.S. Patent Application Publication No. 2005/0170192, the disclosure of the entire disclosure of the disclosure of the entire disclosure of the disclosure of the disclosure of the disclosure of Nanoparticles are typically used in the form of dispersions ("dispersions". Suitable sub-agents include water, organic solvents such as alcohols and hydrocarbons, and combinations and mixtures thereof. Preferred solvents are generally selected as nanoparticles. Depending on the characteristics. @本, Dispersants and nanoparticles should be selected to make a good balance with the formation of a good fraction. For example, the fresh pH depends on the crystal structure and surface structure, but gamma The oxidized particles are usually well dispersed at an acidic pH of about 3 to 4, and the cerium dioxide particles are usually easily dispersed at an initial pH of 9 _ n. The titanium oxide particles are usually at a pH close to 7. It is well dispersed. The system has a small surface charge, and the green particles can be dispersed in a small solvent. Therefore, the hydrophobic particles can be dispersed in a non-aqueous (anhydrous) solvent or a scented water towel. The heterolium can be dissolved in the nanoparticle solvent dispersion in water, and the surface of the particle is also reacted with a catalyst. The hydrolyzable portion of the coupling group is especially in the presence of water as water: The invention occurs spontaneously, as mentioned above, and the invention also provides a method of fabricating an integrated circuit. These methods generally comprise the steps of: forming a plurality of transistors on a semiconductor substrate; forming a multilayer interconnect by the following steps: deposition a metal layer; a patterned metal layer; 200807705 24699pif depositing a first dielectric material having a first modulus and a kth value; depositing a second modulus having a first modulus higher than the first material and having a lower a second dielectric material having a k-value of a first-k value of the first material; and patterning the first dielectric material and the second dielectric material, and depositing a via-filled metal material in the patterned region According to the present invention, in the first-dielectric material, there is a material of the company, which has a repeating Μ-0-Μ-0 rhyme with a first organic substituent bonded to the main chain. Having a self-face to (10), a simple 4'0 exhibits one or several of the following characteristics: a k value of 4.0 or less or better than 3 5 or less; : or more = refractive index, or better 16 or greater; 〇ppm or less thermal expansion expansion, CTE); and merma l 4 GPa or greater Young's modulus. Due to the excellent steps of the flattening, the picture is carried out in the case of a peach or a chemical-free flattening. In addition to the total thickness of the second dielectric material, the organic siloxane material can be hydrolyzed by the liquid formed by polymerizing the monomer of the formula I in the form of a bismuth; The hydrolyzate, -:,,, thin layer and solidified thin layer to form a film having a thickness of 200,807,705, 24,699 pif 〇. 〇 to 1 〇 _. or 'organic oxalate material can be - liquid medium towel polymerization〗 $ _ formed by c, a 〇 ^ salt, gasification button, aluminum alkoxide bite gasification ... 1 emulsified 鍅, button alcohol; a ^ ^ current aluminum sulphide (but not limited to this)) The formation of a decane gas material or a mixture of oxalic acid is carried out, and the hydrolysis of the hydrolyzed silk-age genus (4) is known as a thin layer on the substrate and the thin film having a thickness of from 0.1 μm to 10 μm is cured. Ear (three) field

鑒於介電材料之一者包含根據本發明所述之材料,則 另-材料可為已知有機、錢或有機/無機材料,例如是以 上在描述導論部分中所論述之種類。 通常,有機矽氧烷材料為旋塗材料。 有機矽氧烷材料為有機-無機的且具有12 Ppm至3〇 PPm之熱膨脹係數。其可具有16或更小之折射率。 可結合以下工作實例來論述本發明之另外細節: 實例 實例1 1,1,1,4,4_五氯二矽丁烷(中間物) 广 SiCI3 + H2SiCI2In view of the fact that one of the dielectric materials comprises a material according to the invention, the further material may be a known organic, money or organic/inorganic material, such as the ones discussed in the introductory section. Typically, the organic siloxane material is a spin-on material. The organooxane material is organic-inorganic and has a coefficient of thermal expansion of from 12 Ppm to 3 〇 PPm. It may have a refractive index of 16 or less. Additional details of the invention can be discussed in conjunction with the following working examples: Example Example 1 1,1,1,4,4-pentachlorodioxane (intermediate) Wide SiCI3 + H2SiCI2

Co2(CO)e^ 〇°C...rVl5h CI3Su 、SiHCl2 乙烯三氯矽烧(68·8 g、426 mmol)以及八羰基銘(700 mg)被置放於100 mL的rb燒瓶中,且在冰浴中冷卻至 200807705 24699pif 〇°C。二氯石夕院(bp· 8°C、44·3 g、439 mmol)隨後冷凝進 入至燒瓶中。系統被允許在夜間加熱至室溫。在60。〇/8 mbar至62°C/8 mbar下蒸餾,而以93%的產量給出1,1,1,454- 五氯_1,4_二石夕丁烧(120.8 g、460 mmol)。 實例2 三(3,3,6,6,6_五氯-3,6-二矽己基)氯矽燒 (tris(3,3,6,6,6-pentachloro-3,6_disilahexy)chlorosilane) 3 CI3S,\^S(HC(2 + ClSif^)3Co2(CO)e^ 〇°C...rVl5h CI3Su , SiHCl2 Ethylene trichloropyrene (68·8 g, 426 mmol) and octacarbonyl (700 mg) were placed in a 100 mL rb flask, and Cool to 200807705 24699pif 〇 °C in an ice bath. Diclosure (bp·8°C, 44·3 g, 439 mmol) was then condensed into the flask. The system is allowed to heat to room temperature during the night. At 60. Distillation was carried out at 〇/8 mbar to 62 °C/8 mbar, while 1,1,1,454-pentachloro-1,4_2 石 丁 烧 (120.8 g, 460 mmol) was given at 93% yield. Example 2 Tris(3,3,6,6,6-pentachloro-3,6-dihexyl)chlorosilane (tris(3,3,6,6,6-pentachloro-3,6_disilahexy)chlorosilane) 3 CI3S, \^S(HC(2 + ClSif^)3

HgPtCle/[PA 110°C / 60min 〇I3SiHgPtCle/[PA 110°C / 60min 〇I3Si

11.00 g (0.076 mol)三乙烯氯矽烷繼之以2 ml之 1,1,1,4,4-五氯-1,4-二石夕丁院被添加至i〇〇 ml之容器。溶^ 被加熱至80°C,且添加I5 μί之10%的H2ptCl6/Ip:溶 觀測到較強放熱反應,並切斷加熱源。在保持溶液溫度低 於130。。之狀態下,於30分鐘期間緩慢添加剩二 1,1,1,4,4-^ ^ Ua,4,4-ia.l54.^^T^ 之總量為61.50 g (0.234 mo卜2.6%過量)。在添加之 再次開啟加熱源’且在1HTC下授拌溶液—小時 蒸餾溶液而得到擺g (66%)之三(3,3,m,6_五氯你 200807705 24699pif 一石夕己基)氯石夕烧。Β·ρ· 264°C/<0.5 mbar。 實例3 U,l,4,4,7,7,7-八氯-1,4,7-三矽庚烷 (1,1,1,4,4,7,7,7-octachloro_ 1,4,7_trisilaheptane) 。瞵_.SiCI3 1_6叫 CI3Siv^v^/N^SiCI3 2 90°c/12h ^ 乙烯三氯矽烷(16.8 g、104 mmol)被加熱至60°c且 添加100 gL之1〇%的H2PtCl6/IPA溶液。在20分鐘期間緩 慢添加 1,1,1,4,4-五氯-1,4-二矽丁烷(20.4 g、77.7 mmol), 使得溫度不超過10CTC。允許反應在l〇0〇c下進行12小時, 之後在115-130°C/<1 mbar時在真空下蒸餾其。產量為31.5 g (74.3 mmol > 96%) ° 實例4 1,1,1,4,4,7,7,7-八氣-1,4,7-三矽辛烷 (1,1,1,4,4,7,7,7_octachloro_ 1,4,7-trisilaoctane) cfeSisSfc/^s(Hcl ψ c^J^SiCI2 JjpptCl5/lPA Cl3Si 2 90°C;1.5h ^ 1,1,1,4,4_五氯-1,4-二矽丁烷(51.6g、196mmol)被加 200807705 24699pif 熱至80°C且添加20 gL之10%的H2PtCl6/IPA溶液。在20 分鐘期間緩慢添加乙烯甲基二氯矽烷(29.7 g、210 mmol),使得溫度不超過130°C。允許反應進行L5小時, 之後在90-102°C/<l mbar時在真空下蒸餾其。產量為70.2 g ( 174 mmol、89%) 〇 實例5至7 1,1,1,4,4-五 氯 _1,4_ 二 矽癸烧 (1,1,1,454_pentachloro-1,4_disiladecane) 1,1,1,4,4-五 氣-1,4-二破 十 二烧 (1,1,1,4,4-pentachloro 1,4-disiladodecane) 1,1,1,4,4- 五 氯 -i,4- 二石夕 十四烧 (1,1,1,4,4-pentachloro 1,4_disilatetrakaidecane)11.00 g (0.076 mol) of trivinyl chlorodecane followed by 2 ml of 1,1,1,4,4-pentachloro-1,4-diazepine was added to the container of i〇〇 ml. The solution was heated to 80 ° C, and 10% of H 2 ptCl 6 /Ip of I5 μί was added: a strong exothermic reaction was observed, and the heat source was cut off. Keep the solution temperature below 130. . In the state, the total amount of 1,1,1,4,4-^ ^ Ua,4,4-ia.l54.^^T^ is slowly added during the period of 30 minutes to be 61.50 g (0.234 mob 2.6%) excess). After the addition of the heating source is turned on again, and the solution is mixed under 1HTC-hour distillation solution to obtain the pendulum g (66%) of the three (3,3,m,6_pentachloro-200807705 24699pif-stone-hexyl) chlorite burn. Β·ρ· 264°C/<0.5 mbar. Example 3 U,l,4,4,7,7,7-octachloro-1,4,7-trioxane (1,1,1,4,4,7,7,7-octachloro_ 1,4 , 7_trisilaheptane).瞵_.SiCI3 1_6 is called CI3Siv^v^/N^SiCI3 2 90°c/12h ^ Ethylene trichlorodecane (16.8 g, 104 mmol) is heated to 60 ° C and 100 gL of 1% H2PtCl6/IPA is added Solution. 1,1,1,4,4-pentachloro-1,4-dioxane (20.4 g, 77.7 mmol) was slowly added over a period of 20 minutes so that the temperature did not exceed 10 CTC. The reaction was allowed to proceed for 12 hours at 10 °C, after which it was distilled under vacuum at 115-130 ° C / < 1 mbar. The yield was 31.5 g (74.3 mmol > 96%) ° Example 4 1,1,1,4,4,7,7,7-octane-1,4,7-trioxane (1,1,1 ,4,4,7,7,7_octachloro_ 1,4,7-trisilaoctane) cfeSisSfc/^s(Hcl ψ c^J^SiCI2 JjpptCl5/lPA Cl3Si 2 90°C; 1.5h ^ 1,1,1,4, 4_Pentachloro-1,4-dioxane (51.6g, 196mmol) was added to 200807705 24699pif to 80 ° C and 20 g of 10% H2PtCl6/IPA solution was added. Vinylmethyl group was slowly added during 20 minutes. Dichlorodecane (29.7 g, 210 mmol) such that the temperature does not exceed 130 ° C. The reaction is allowed to proceed for L5 hours, after which it is distilled under vacuum at 90-102 ° C / < 1 mbar. Yield 70.2 g ( 174 Ment, 89%) 〇Example 5 to 7 1,1,1,4,4-pentachloro_1,4_ dioxin (1,1,1,454_pentachloro-1,4_disiladecane) 1,1,1,4 , 4-penta-1,4-dipod 12 (1,1,1,4,4-pentachloro 1,4-disiladodecane) 1,1,1,4,4-pentachloro-i,4- Ershi Xi-14 (1,1,1,4,4-pentachloro 1,4_disilatetrakaidecane)

SiHCI2 H2PtCl6 / IPA 0j3sjs 11〇°C/1hSiHCI2 H2PtCl6 / IPA 0j3sjs 11〇°C/1h

Cl 、扣 ά 32 ml (21.53 g、0.256 mol) 1-己烯以及 2〇 吣之 IPta^iPA麟被添加至100 ml之容器。溶液被加熱至 8〇C ’且在f分鐘期間緩慢添加46.90 g(〇.l79m〇l)之 1,1^1,4,4-五虱-l,4-二矽丁烷。當觀測到放熱反應時,切斷 二=力;期間之溫度保持低於赋。在添加之後, -丄—士 隹11〇C下攪拌溶液一小時。之後, 错由瘵餾來純化產物。B 1〇〇。 ⑻调可由^^/〇.8和。產量5〇, j丨 辛烯或I癸烯來替換以分別產生 1,1 山4,4-五鼠·1 4-二石夕 + 一、]r k 7十一烷(b.P.131°C/0.7 mbar、88% 200807705 24699pif 的產量)以及1,1,1,4,4-五氯-1,4-二矽十四烧(b.p.l38°C/0e8 mbar、82% 的產量)。 實例8 1,1,1,4,4-五氯-7-苯基二石夕庚烧 (1,1,1,4,4,pentachloro,7_phenyl-1,4-disilaheptane)Cl, 扣 32 ml (21.53 g, 0.256 mol) 1-hexene and 2 〇 吣 IPta^iPA Lin was added to a 100 ml container. The solution was heated to 8 ° C ' and slowly added 46.90 g (〇.l79m〇l) of 1,1^1,4,4-penta-l,4-dioxane during f minutes. When an exothermic reaction is observed, the two = force is cut off; the temperature during the period remains below the assignment. After the addition, the solution was stirred for one hour at -10 °C. Thereafter, the product was purified by distillation. B 1〇〇. (8) Adjustable by ^^/〇.8 and. The yield was 5 〇, j octene or I decene was replaced to produce 1,1 s, 4, 4-, 5, 4, 4, and 2, rk 7 undecane (bP131 ° C/0.7, respectively) The yield of mbar, 88% 200807705 24699pif) and 1,1,1,4,4-pentachloro-1,4-dihydrotetradecene (bpl 38 ° C / 0e8 mbar, 82% yield). Example 8 1,1,1,4,4-Pentachloro-7-phenyldiazepine (1,1,1,4,4,pentachloro,7_phenyl-1,4-disilaheptane)

cl3Si〜f^Ocl3Si~f^O

18.77 g (0.159 mol)烯丙苯(aiiyibenzene)以及 50 pL 之HsPtCVIPA溶液被添加至100 ml之容器。溶液被加熱 至80 C,且在30分鐘期間缓慢添加41.85 g (0.159 mol) 之U,l,4,4-五氯-1,4-二矽丁烷。當觀測放熱反應時,切斷 加熱源。在添加期間之溫度保持低於l30〇c。在添加之後, 再次開啟加熱源,且在110°C下攪拌溶液一小時。之後, 藉由蒸餾來純化產物。Β·ρ· 137。<3/0.8 mbar。產量35.10 g (58%)〇 實例9 1’1,1,4,4-五氯_6義五氟笨基_ι,4_二石夕己烧18.77 g (0.159 mol) of aiiyibenzene and 50 pL of HsPtCVIPA solution were added to a 100 ml container. The solution was heated to 80 C and 41.85 g (0.159 mol) of U,l,4,4-pentachloro-1,4-dioxane was slowly added over 30 minutes. When the exothermic reaction is observed, the heat source is turned off. The temperature during the addition was kept below l30〇c. After the addition, the heating source was turned on again, and the solution was stirred at 110 ° C for one hour. Thereafter, the product is purified by distillation. Β·ρ· 137. <3/0.8 mbar. Yield 35.10 g (58%) 实例 Example 9 1'1,1,4,4-pentachloro-6 pentafluorophenyl_ι,4_二石夕己烧

(1,1,l,4,4-pentachloro-6-pentafluorophenyl-1,4-disilahexane) 200807705 24699pif 116.15 g(0.442 mol) 1,1,1,4,4-五氯-1,4-二矽丁烷被添 加至250 ml之容器,繼之加入loo pL之H2PtCl6/IPA溶液。 溶液被加熱至85°C,且在30分鐘期間緩慢添加85.80 g (0.442 mol)之五氟苯乙烯(pentafluorostyrene)。在添加之 後,溶液在100°c下被攪拌一小時且隨後被蒸餾。BP. 122°C/<1 mbar,產量 158.50 g (78%)。 實例10 1,1,1,4,4-五氯 _ι,4-二石夕-5-已烯 (1,1,1,4,4_pentachloro 1,4_disila_5_hexene) C[3Si 〇〇2(C〇)g 0pC/15h(1,1,l,4,4-pentachloro-6-pentafluorophenyl-1,4-disilahexane) 200807705 24699pif 116.15 g (0.442 mol) 1,1,1,4,4-pentachloro-1,4-dioxene Butane was added to a 250 ml vessel followed by loo pL in H2PtCl6/IPA solution. The solution was heated to 85 ° C and 85.80 g (0.442 mol) of pentafluorostyrene was slowly added over 30 minutes. After the addition, the solution was stirred at 100 ° C for one hour and then distilled. BP. 122 ° C / < 1 mbar, yield 158.50 g (78%). Example 10 1,1,1,4,4-pentachloro_ι,4-二石石-5-hexene (1,1,1,4,4_pentachloro 1,4_disila_5_hexene) C[3Si 〇〇2(C〇 )g 0pC/15h

Cl Cl 40.00 g (0.152 mol) 1,1,1,4,4-五氯-1,4-二石夕丁烧在 2000 ml之容器中溶解於1000 ml之1,4·二噁烷(i,4-dioxane) 中。溶液冷卻至〇°C,且乙炔灌入溶液使其起泡直至其飽 和。因此所獲得之溶液被緩慢加熱至室溫。惡烧經 蒸發且所獲得之粗U,M,4_五氯_丨,4_二矽_5•已烯藉由蒸 餘來純化。 實例11 1,1,1,4,4-五鼠-7-(3,5-二甲基金岡!1烧基)-1,4_二石夕庚:|:完 (1,1,M,4-pentachloro-7-(3,5-dimethyladamantyl)-1,4-disilah 31 200807705 24699pif eptane)Cl Cl 40.00 g (0.152 mol) 1,1,1,4,4-pentachloro-1,4-diazepine was dissolved in 1000 ml of 1,4·dioxane in a 2000 ml container (i , 4-dioxane). The solution was cooled to 〇 ° C and acetylene was poured into the solution to cause foaming until it was saturated. The solution thus obtained is slowly heated to room temperature. The cauterization was evaporated and the obtained crude U,M,4_pentachloro-indole, 4_diindole-5-hexene was purified by evaporation. Example 11 1,1,1,4,4-Five Rat-7-(3,5-Dimethyl Foundation! 1 alkyl)-1,4_二石夕::: End (1,1,M ,4-pentachloro-7-(3,5-dimethyladamantyl)-1,4-disilah 31 200807705 24699pif eptane)

81.71 g ( 0.336 mol ) 3,5_二甲基金剛烷基溴 (3,5-dimethyladamantlybromide)溶解於 5〇q mi 之戊烧中。 溶液由冰/丙酮浴冷卻至低於-lot。添加51e4〇 g (0.425 mol)烯丙基溴(aiiyibromide),繼之加入 410 mg 之 FeBr3。 溶液隨後在-20°C至l〇t:下被攪拌三小時,之後以氣相層 析-質譜法(gas chromatograph-mass spectrometry,GC-MS) 進行分析’其結果顯示一些未反應之原材料剩餘。添加420 mg之FeBr;3且額外攪拌溶液兩小時,之後GC-MS的結果 展示所有二甲基金剛烷基溴已反應。溶液被加熱至室溫且 以500 ml之水沖洗其兩次。收集有機層且蒸發戊烧。剩餘 材料溶解至7〇〇 mi之乙醇,且添加少量水,繼之加入25 g (〇·382 mol)金屬鋅。溶液隨後經加熱以回流,且攪拌其 15小時。在冷卻至室溫之後,過濾溶液。添加3〇〇 ml之 水’且藉由以500 ml戊烷沖洗兩次來萃取產物。戊烷層經 收集且以水沖洗一次。有機層經收集,以無水硫酸鎂乾燥 200807705 並將其過濾。戊烷經蒸發且剩餘粗丨_烯丙基_3,5_二甲基金 剛烧藉由蒸餾來純化,產量45.90 g( 67%)。1-烯丙基-3,5-二曱基金剛烷被移至100 ml之容器,繼之加入50 juL之 HJtCVIPA溶液。溶液被加熱至85°c且在3〇分鐘期間緩 慢添加 59.50 g (0.227 mol)之 ι,ι,ι,4,4-五氯_1,4_二矽丁 烷。在添加之後,溶液被加熱至l〇〇°c且攪拌其一小時。 因此獲得之產物隨後藉由蒸餾來純化,得到53.54 g( 51%) 產量,bp. 157-158°C / <0.5 mbar。 實例12 1,1,1,4,4-五氣-5,6-二曱基-1,4-二石夕 _6-庚稀 (1,1,1,4,4-pentachloro_5,6_dimethyl-1,4_disila-6_heptene)81.71 g (0.336 mol) 3,5-dimethyladamantyl bromide (3,5-dimethyladamantlybromide) was dissolved in 5 〇q mi. The solution was cooled from an ice/acetone bath to below -lot. 51e4〇 g (0.425 mol) of alliyibromide was added, followed by the addition of 410 mg of FeBr3. The solution was then stirred at -20 ° C to 10 ° C for three hours, after which it was analyzed by gas chromatograph-mass spectrometry (GC-MS). The results showed some unreacted raw materials remaining. . 420 mg of FeBr was added; 3 and the solution was stirred for an additional two hours, after which the results of GC-MS showed that all of the dimethyldetane bromide had reacted. The solution was warmed to room temperature and rinsed twice with 500 ml of water. The organic layer was collected and evaporated to dryness. The remaining material was dissolved in 7 〇〇 mi of ethanol, and a small amount of water was added, followed by the addition of 25 g (〇·382 mol) of metallic zinc. The solution was then heated to reflux and stirred for 15 hours. After cooling to room temperature, the solution was filtered. 3 〇〇 ml of water was added and the product was extracted by rinsing twice with 500 ml of pentane. The pentane layer was collected and rinsed once with water. The organic layer was collected, dried over anhydrous magnesium sulfate, and then filtered. The pentane was evaporated and the remaining crude 丨-allyl_3,5-dimethyl fund was purified by distillation to yield 45.90 g (67%). 1-Allyl-3,5-dioxanecone was transferred to a 100 ml vessel followed by 50 juL of HJtCVIPA solution. The solution was heated to 85 ° C and 59.50 g (0.227 mol) of ι, ι, ι, 4,4-pentachloro-1,4-dibutane was slowly added over a period of 3 Torr. After the addition, the solution was heated to 10 ° C and stirred for one hour. The product thus obtained was then purified by distillation to give 53.54 g (51%) yield, bp. 157-158 ° C / < 0.5 mbar. Example 12 1,1,1,4,4-penta-5,6-dimercapto-1,4-diazepine-6-glycol (1,1,1,4,4-pentachloro_5,6_dimethyl- 1,4_disila-6_heptene)

(Ph9P)aPd(0) 80口C/1h(Ph9P) aPd(0) 80 ports C/1h

49.85 g (0.190 mol) 1,1,1,4,4_五氯-1,4-二矽丁烷被添 加至100 ml之容器,繼之加入約20 mg-30 mg之四(三苯 膦)!巴(O)(tetrakis(triphenylphosphine)palladium(0))。溶液被 加熱至80°C,且在30分鐘期間緩慢添加13.10 g (0.192 mol)之異戊二烯(iso-prene)。在添加之後,溶液在1〇〇。匚 下被攪拌一小時且隨後經蒸餾。Bp· 96°C/ <1 mbar,產量 為 58.50 g (93%)。 若在80°C以H2PtCl6/IPA催化劑或在室溫以Co2(CO)8 200807705 24699pif 催化劑進行相同反應,則獲得α以及β取代異構體之1:1 危合物。 實例13 U,l,4,4-五氯-6-(5-降莰-2-烯)-1,4-二矽己烷 (1,1,1,4,4_pentachloro_6-(5 -norborn-2_ene)_ 1,4-disilahexane) CI3Si> 、SiHC【249.85 g (0.190 mol) 1,1,1,4,4_pentachloro-1,4-dioxane was added to a 100 ml vessel followed by about 20 mg to 30 mg of tetrakis (triphenylphosphine) )! (O) (tetrakis (triphenylphosphine) palladium (0)). The solution was heated to 80 ° C and 13.10 g (0.192 mol) of isoprene (iso-prene) was slowly added over 30 minutes. After the addition, the solution was at 1 Torr. The crucible was stirred for one hour and then distilled. Bp 96 ° C / < 1 mbar, yield 58.50 g (93%). If the same reaction is carried out with a H2PtCl6/IPA catalyst at 80 °C or with a Co2(CO)8 200807705 24699 pif catalyst at room temperature, a 1:1 hazardous compound of the alpha and beta substituted isomers is obtained. Example 13 U,l,4,4-Pentachloro-6-(5-norborn-2-ene)-1,4-dioxane (1,1,1,4,4_pentachloro_6-(5-norborn- 2_ene)_ 1,4-disilahexane) CI3Si>, SiHC [2

H^tCb/lPA 10CTC/1h ^ 22.63 g (0.086 mol) 1,1,1,4,4_五氯_1,4_二石夕丁烧被添 加至100 ml之容器,繼之加入70 pL之H2PtCl6/IPA溶液。 所獲得之溶液被加熱至85t,且隨後在30分鐘期間缓慢 添加10.81 g ( 0.090 m〇l)之5-乙烯基-2-降莰烯 (5-vinyl-2-norbornene)。在添加之後,溶液在1〇〇。(:下被攪 拌一小時,且隨後經蒸餾。Βρ· 140。(:/<1 mbar,產量為20.05 g (61%)。 實例14 9·非基二乙氧基梦烧(9_phenanthrenyl triethoxysilane)H^tCb/lPA 10CTC/1h ^ 22.63 g (0.086 mol) 1,1,1,4,4_pentachloro_1,4_二石丁丁烧 was added to a 100 ml container, followed by 70 pL H2PtCl6/IPA solution. The obtained solution was heated to 85 t, and then 10.81 g (0.090 m〇l) of 5-vinyl-2-norbornene was slowly added over 30 minutes. After the addition, the solution was at 1 Torr. (: The mixture was stirred for one hour, and then distilled. Βρ·140. (:/<1 mbar, yield: 20.05 g (61%). Example 14 9. Non-based ethoxylated triethoxysilane

Mg TEOSMg TEOS

THFTHF

Si(OEt)aSi(OEt)a

200807705 24699pif 5.33 g (0.219 mol)鎂以及少量碘被添加至1〇〇〇如 之谷姦,繼之加入56.38 g (〇·2ΐ9動丨)之9_溴菲 (9-bromophenanthrene)。196 ml ( 182·74 g,〇 877 m〇1)、之200807705 24699pif 5.33 g (0.219 mol) of magnesium and a small amount of iodine were added to 1 such as glutinous rape, followed by 56.38 g (〇·2ΐ9 丨) 9-bromophenanthrene. 196 ml ( 182.74 g, 877 877 m〇1),

Si(OEt)4被添加至谷态。添加200 mi之thj?,在彼情況之 後發生放熱反應。在溶液已冷卻之後,其經加熱以回流且 被攪拌整夜。 回流停止且300 ml之η-庚烷經添加。溶液被傾倒至另 一容器,且以200 ml之η-庚烷沖洗剩餘固體兩次。沖洗溶 液被添加至反應溶液。THF以及η_庚烷經蒸發,且剩餘材 料經瘵餾。Β·ρ· 175 C/ 0.7 mbar。產量為 52.63 g = 70%。 實例15 1_(9_菲基)-1,1,4,4,4-五甲氧基_丨,‘二矽丁烷 (1 -(9-phenanthrenyl)-15194?454.pentamethoxy-154-disilabutan e)Si(OEt)4 was added to the valley state. Adding 200 mi of thj?, an exothermic reaction occurs after that. After the solution had cooled, it was heated to reflux and stirred overnight. The reflux was stopped and 300 ml of η-heptane was added. The solution was poured into a separate container and the remaining solid was rinsed twice with 200 ml of η-heptane. The rinse solution is added to the reaction solution. THF and η-heptane were evaporated, and the remaining material was subjected to distillation. Β·ρ· 175 C/ 0.7 mbar. The yield was 52.63 g = 70%. Example 15 1_(9-phenanthryl)-1,1,4,4,4-pentamethoxy-oxime, 'di-butane (1-(9-phenanthrenyl)-15194?454.pentamethoxy-154-disilabutan e)

^Si(0Me)3 ^Si(0Me)3 OMe^Si(0Me)3 ^Si(0Me)3 OMe

Mg THFMg THF

MeOsMeOs

kS!^-SH〇Me N〇Me OMe 7·23 g (0.297 mol)鎂以及少量碘被添加至1000 ml 之容器,繼之加入56.38 g (0.219 mol)之9-溴菲。雙(三 曱氧石夕烧基)乙烧(bis(trimethoxysilyl)ethane) (237 g,0.876 35 200807705 24699pif 之THF。在幾分鐘 ’其經加熱以回流 励1)被添加至容器,繼之加入200 mj 内’發生放熱反應。在溶液已冷卻之後 且被擾掉整夜。 回流停止且300 ml之η-庚烷經添加。溶液被傾倒至另 一容器,且以200 ml之η-庚烷沖洗剩餘固體兩次。沖洗溶 液被添加至反應溶液。THF以及η-庚烷經蒸發,且剩餘材 料經蒸餾。Β·ρ· 190-205°C/<0.1 mbar。產量為 59·23 g = 65% 〇 實例16 3-(9-菲基)丙基三曱氧基石夕烧 (3-(9-phenanthrenyl)propyl trimethoxysilane)kS!^-SH〇Me N〇Me OMe 7·23 g (0.297 mol) of magnesium and a small amount of iodine were added to a 1000 ml vessel, followed by 56.38 g (0.219 mol) of 9-bromophenanthrene. Bis (trimethoxysilyl) ethane (237 g, 0.876 35 200807705 24699 pif of THF. In a few minutes ' it was heated to reflux 1) was added to the vessel, followed by An exothermic reaction occurred within 200 mj. After the solution has cooled and is disturbed overnight. The reflux was stopped and 300 ml of η-heptane was added. The solution was poured into a separate container and the remaining solid was rinsed twice with 200 ml of η-heptane. The rinse solution is added to the reaction solution. THF and η-heptane were evaporated, and the remaining material was distilled. Β·ρ· 190-205°C/<0.1 mbar. The yield was 59·23 g = 65% 实例 Example 16 3-(9-phenanthrenyl)propyl trimethoxysilane

36 200807705 24699pif36 200807705 24699pif

6·9〇 g (0.284 mol)之鎮粉以及少許蛾晶體被添加至 1000 ml之容器,繼之加入73.07 g ( 0.284 mol)之9_溴菲。 90 ml之THF經添加,在彼情況之後發生放熱反應。當溶 液已~部回室溫時,30 ml之THF經添加且溶液被加熱至 65。(:且被攪拌整夜。 、 允許溶液冷卻至5〇它,且34·42 g (〇·285 m〇1)之烯 丙基漠在分鐘顧轉絲液逐漸回紅料被逐滴 在〜、、加之後’在65c下攪拌溶液2小時。溶液冷卻 至室溫且大部分THF藉由直介教认 , 、工移除。700 ml之DCM經添 加且溶液移動至分離漏斗。以 Λ 7〇〇 ml之水沖洗溶液兩次。 200807705 24699pif 有機層經收集且以無水硫酸鎂乾燥。溶液經過濾,繼之將 溶劑蒸發。剩餘材料藉由蒸餾來純化。B p. lmi5t:/<〇.5 mbar。產量為 54.5 g (88%)。 烯丙基菲(allylphenanthrene) (41.59 g,〇·ΐ91 mol)被 添加至250 ml之圓底燒瓶,且加熱至9〇t:。添加%卟 之10%的H2PtCl6/IPA。開始HSiCl3之添加,且觀測放熱 反應。在40分鐘期間緩慢添加彳 則3。在添加之後,在赋下攪拌m時1量 HSlCl3藉由真空移除,且1〇〇 ml (97 g,〇 914 m〇i)之三 甲基原曱酸I旨(tnmethyi orth()f()rmate)經添加,繼之加入5〇 mg之BmPCl作為催化劑。溶液在7〇t:下被攪拌9〇小時, 且產物由蒸顧來純化。Β·ρ. 172t:/<Q.5mbar。產量為5〇g (基於烯丙基菲之量的74%)。 實例17 南折射率聚合物1 、 菲土一乙氧基石夕烧(15 g,44 mmol)、丙酮(22.5 g) = =·01Μ Η=1 (7·2 g ’ _ mmd)置放於 _ mL 之 rb W ’且回流23小時。揮發物在減壓下 =合物(n.84g)。聚合物在職A(、^^ 》私彻上。在_下軟供培_ baice)5刀4里’繼而在 哺範圍内為1 6680c:=,折射率在632.8 鈇而,取入仏,,· 介電常數在1 MHz下為3.5。 ♦ σ目對於彳轉有機溶綱錢性料侧化學 200807705 24699pif 品不具有極佳财化學性。 實例18 高折射率聚合物2 9-菲基二乙氧基石夕燒〇7 〇〇 g,〇 〇5㈣,由在丁册 中的9_溴菲、鎂與四乙氧基矽烷之間的格林納反應 (Grig丽dreaction)所製備)以及丙酮(i5〇〇g)經攪拌直 ' 至固肢溶解。隨後添力口稀硝酸(0·01Μ HN〇3,6.77 g,0.38 mol)。兩相(水相以及有機相)分離。系統回流直至溶液 變得清澈(約15分鐘)。縮水甘油氧基丙基三甲氧基石夕烧 (giycidyi〇xypropyltrimethoxysilane) (3 〇〇g,〇 〇1 m〇i)經 添加且燒航回流六小時。揮發物在旋轉蒸發器中蒸發直至 剩餘25.00 g之聚合物溶液。正丙基醋酸醋㈣沉敵) (32.50 g)」經添加,且再次繼續蒸發直至27g剩餘。接下 來,丙一醇-單甲趟·醋酸醋(pr〇pylene伽〇1励加咖邮 :ac_e,PGMEA) (3〇 g)經添加,且再次蒸發直至 24.84 g遠下作為黏性聚合物。非揮發物之量經量測為 69.24/〇。更夕PGMEA (8.89 g)經添加,使得固體含量為 約·。溶液在油浴令加熱(165。〇且回流4小^2= 鐘。在反應期間所形成之水與PGMEA —起在旋轉蒸發器 中被移除直至18 g剩餘。更多PGMEA (42 g)經添加, 以使溶液具有22.16%之固體含量。聚合物具有Mn/Mw = 1,953/2,080 g/m〇I ’上述結果是以相對於了册中單分散聚 苯乙烯標準由凝膠滲透層析儀 3〇 200807705 24699pif (glycidyloxypropyitrimethoxysilane,GPC)所量測之。 樣品製備:以上溶液(9.67g)以PGMEA (5·33 g)、 界面活性劑(來自BYK_Chemie之BYK-307,4 mg)以及 陽離子引發劑(cationic initiator) (Rhodorsil 2074,10 mg) 來配製。其以2,000 rpm之轉速旋塗於4,,晶圓上。膜層在 130°C下軟烘焙5分鐘,且在200°C下固化5分鐘。在固化 之後的膜厚度為310 nm,且折射率在632.8 nm下為1.66, 且介電常數在1 MHz下為3.4。膜層不會溶解於丙酮,其 顯示出交聯(cross-linking)已成功。同樣地,更濃縮之 PGMEA溶液(固體25%)經製備、旋塗且固化。膜層為 830 nm厚,且經由奈米壓痕(nan〇incientati〇n)所量測其具有 模數7.01 Gpa以及硬度0.41 GPa。 實例19 高折射率聚合物3 菲基)-1,1,4,4,4-五曱氧基],4_二矽丁烷(9.55§, 22.9 mmol )、9-# 基二乙氧基梦烧(9.02 g,26·5 mmol) 以及SLSI級丙酮(14.0g)置放於具有鐵氟龍塗佈磁性攪 拌棒之250 ml的rb燒瓶中。蒸餾水(6.0 g,333 mmol) 經添加且系統回流15分鐘。隨後,2滴稀釋HC1( 3.7 w-%) 滴入。在兩分鐘内’溶液變為均勻的,其顯示水解之進行。 溶於丙酮(16.0 g)之1_(9_菲基)-1,1,4,4,4-五甲氧基-1,4_ 二石夕丁烧(11.45 g,27.5 mmol)溶液經注入,繼之加入 0.01M HC1溶液(8.4 g,466 mmol)。允許反應以回流14 200807705 24699pif 小時。在回流之後,在真空下移除所有揮發物,得到如透 明無色固體之28.1 g乾燥聚合物。藉由熱重量分析法 (thermogravimetric analysis,TGA)量測,其在氬氣中直至 500°C具有熱穩定之特性(圖2)。 固體在正丁基醋酸酯(n-butyl acetate,NBA) ( 73.06 g, 260%)以及界面活性劑(56 mg’Byk-Chemle 之 BYK®-307) 中稀釋。或者’亦製備丙二酵单甲鍵醋酸g旨(pr〇Pylene glycol monomethyl ether acetate,PGMEA,240%)以及甲基 乙基酮(methyl ethyl ketone, MEK,400%)溶液。NBA 溶 液經由〇·2 μ鐵氟龍過濾器來過濾,且以3000 rpm之轉速 旋轉洗鑄於4”石夕晶圓上。在150°C下軟烘培5分鐘且在 200t:下軟烘焙5分鐘,繼之在n2環境中在400。〇下固化 15为鐘’以獲得具有在632·8 nm下之1.6511折射率以及 683 nm厚度之膜層。膜層之介電常數在1 MHz下為3.4。 具有最終厚度高達1850 nm之膜層經製備,且其不會表現 出破裂之特徵。膜層可與諸如丙酮之有機溶劑摩擦而不受 損壞。 實例20 南折射率聚合物4 _ 3 (9-菲基)丙基三曱氧基石夕烧(g,32.4 mmol)、 丙酉同(16·5 g)以及q qimHC1置放於100 ml的rb燒瓶中, 且:Ϊ、16小時。起初,溶液為乳白色,但在水解開始不久 即又得β破。當聚合進一步進行時,溶液再次變得稍微混 200807705 24699pif 濁。揮發物在減壓下藉由蒸發移除,得到白色無色粉末9 · 6 〇 g。經由TGA 1測,聚合物在氬氣下直至45〇。〇時呈穩定 (圖 3 )。 洗鑄溶液藉由在8.24 g甲基乙基嗣(4〇〇%)以及界面 活性劑(5mg,Byk_Chemie 之 byk、3〇7)中溶解 2 〇6g 聚合物’且㈣G.2 μ鐵氟龍過濾器來過濾、以製備。聚合 物以3000 rpm之轉速旋轉洗鱗於4”石夕晶圓上。在i赃下 軟烘培5分鐘,繼而在n2環境中在彻。c下固化工5分鐘, 以獲得具有在632.8 nm下之l671ijfMi R 0/ίΛ ^ Π 1·671折射率以及840 nm厚 度之膜層。膜層之介電常數在! MHz下為3 4。膜層不會 表現出破衣之。膜層可與諸如之 不夸指據。 實例21 高折射率聚合物5 9-菲基三乙氧基石夕烧(17 〇〇 g,〇 〇5 _,由在· 經獅直至固體溶解。隨後添加稀石肖 ^^腦3,6.77^.38111。1)。兩相(水相以及有 i 1錢回流直至溶液變得清激(約15分鐘)。 ,水甘油减丙基三甲氧基號(3.⑻g,謂咖 加且燒瓶回流六小時。揮發物在旋 §之+。物冷液。正丙基醋酸酯(32.50 g)娀添 口’且再次繼續蒸發直至27g剩餘。接下來,丙二醇單甲 42 200807705 24699pif 醚醋酸酯(30g)經添加,且再次蒸發直至24 84g留下作 為黏性聚合物。非揮發物之量經量測為69.24%。更多 PGMEA (8.89g)經添加,使得固體含量為約5〇%。溶液 在油浴中加熱(165。〇且回流4小時2〇分鐘。在反應期 間所形成之水與PGMEA —起在旋轉蒸發器中被移除直至 Μ g剩餘。更多PGMEA (42 g)經添加,以使溶液具有 22·16%之固體含量。聚合物具有Mn/Mw = 1,953/2,080 g/md,上述結果是以相對於THF中單分散聚苯乙烯標準 由GPC所量測之。 14%之PGMEA溶液經製備且固化催化劑(〇·3%,來 自Rhodia之Rhodorsil 2074)以及界面活性劑⑶·2%,來 自BYK_Chemie之ΒΥΚ307)經添加。材料旋塗於矽晶圓 上,且在200 C下固化5分鐘。膜層可以用丙酮來清洗, 而不受損壞,其顯示成功固化。由傅立葉轉換紅外光譜 (Fourier transform infrared spectroscopy,FTIR)可見,膜層 ^ 矽烷醇量非常低(位於3200 cnT1至3800 cnf1之寬波峰)。 若不使用固化催化劑,則膜層不會固化,而會被丙酉同 沖洗掉。又,FTIR中之矽烷醇峰值會很高。 實例22 聚合物5與金紅石(rutile)Ti〇2奈米粒子之混合物 備 衣 聚合物5之濃縮物與金紅石Ti〇2奈米粒子(來自 NanoGmm 之商品名稱 ‘ns〇l]〇i-5K,,以 5%溶於 Mek 43 200807705 24699pif 中)配製,使得聚合物/粒子質量比自3/1改變至1/3。界 面活性劑(來自BYK_Chemie之ΒΥΚ_307,0·2%)以及陽 離子引發劑(Rhodorsil 2074,0·3%)經添加至每一樣品。 其以2000 rpm之轉速旋塗於4,’矽晶圓上。膜層在130。〇下 軟烘焙5分鐘,且在2〇〇。〇下固化5分鐘。在表格丨中概 述膜厚度(Tx)以及折射率(RI),以及以PGMEA稀釋之參考 樣品形成厚度約400 nm之膜層。 表格1 : 材料 混合比率 130〇C/5 130〇C/5 200〇C/5 200〇C/5 S% w/w min之後 min之後 min之後 min之後 的Tx 的RI 的Tx 的RI 聚合物5 (ref·) - 424 1.67 409 1.66 3.5 聚合物5-Ή02 3-1 744 1.71 732 1.71 1.6 聚合物5 - Ti〇2 1-1 322 1·76 313 1.77 2.8 聚合物5-Ti〇2 1-3 177 1.85 170 1.86 4.0 如自表格1中可見,材料之RI會隨Ti02裝載遞增而 增加。亦可見收縮率不顯著改變。 實例23 =合物3與金紅石Ti〇2奈米粒子之混合物的製備 ♦ 5物3溶液(以17%溶於MEK中)以重量比介於 1-2的比例與貫例22中之相同5%的Ti〇2溶液混合。溶液 蒸發回約17%之固體含量。溶液以2〇〇〇rpm之轉速旋塗, 200807705 24699pif 隨之在150+200°C下軟烘焙5+5分鐘,且在300°C下固化 15分鐘。在表格2中顯示出結果。 表格2 : 材料 混合比率 150+200°C 150+200°C 300°C/15 300°C/15 S% w/w / 5+5 min / 5+5 min min 之後 min 之後 之後的Tx之後的RI 的Tx 的RI 聚合物 3 (ref·) · 846 1.66 822 1.65 2.8 聚合物 3 -Ti02 1-2 549 _ 511 1.85 7.0 如所見,在聚合物-金紅石Ti〇2奈米粒子為丨_2比率 下,膜層之折射率增加〇·2個單位。 實例24 聚合物5與銳鈦礦(anatase)Ti〇2奈米粒子之混合物的 製備 聚合物5以固體比率ι_ι以及i_3與銳鈦礦Ti〇2奈米 粒子(來自Sumitomo之商品名稱‘ZRM_001,,以12% 溶於MEK中)混合。膜層在2〇〇π下烘焙5分鐘。在表格 _ 3中列示結果。 45 200807705 24699pif 表格3 : 材料 混合比率 130〇C/5 130〇C/5 200〇C/5 200〇C/5 w/w min之後 min之後 min之後 min之後 聚合物5 (ref.) 聚合物5-Ή〇2 聚合物5-Ti02 Μ 1-3 的Tx 424 ΝΜ ΝΜ 的RI 1.67 ΝΜ ΝΜ 的Tx 409 910 591 的RI 1.66 1,73 1.80 s% 3.5 如在表格3中可見,膜層之折射率隨銳鈦礦Ώ〇 遞增而增加。 ’、 乂 所有高折射率之聚合物亦經測試用於具有丨(寬) χ4μηι (高)之溝槽的溝槽間隙填充。所有聚合物在叫環 ^中且在彻。(:下丨5分鐘之後展示極佳間隙填充 表現破裂。 耳亦發現與CMP (化學機械研磨)相容之所有高折射率 =聚合物1-5。已發現在以傳統氧化物CMp漿料㈣^ =CMP之前,首先在赋至·。c固倾層且隨後在 丄C至450 C下施加額外更高溫度固化之優點。當首先以 較低溫度’時,膜層僅部分地被固化(亦即,: 中)。歸因於賴,聚合物膜仍為輕“ 所述仏況在執行氧化物CMP過程時較佳。 上由使用氧電漿亦與回蝕過程相容。當施加氧電漿時: 理-引起任何反應指數改變、表面粗二= 46 200807705 24699pif 成。值得注意的是,習知高折射率有機聚合物不能在不損 壞膜層表面品質或不改變膜層光學特性的情況下進行 CMP及回蝕。 、可以上文提及之化學處理達到之新一代CMOS影像 感應為(圖1)亦存在三重要技術問題:裝置大小、速度 以及功率消耗、量子效率。 圖1之闡釋:10半導體基底;2〇光電二極體;3〇金 f線、層間介電質(mter-iayer dieiectric,ILD)以及金屬間介 電質(inter_metai dielectric, IMD) ·,40 彩色滹光片陣列芦· ㈣透鏡陣列;議填充高縱橫比㈣⑽論)光電=體 間隙之高折射率矽氧烷聚合物;2〇〇用於彩色濾光片平坦 化以及保護之高折射率矽氧烷聚合物;以及3〇〇保護微透 鏡之矽氧烷聚合物。 裝置大小:像素越小,相同面積上之像素數目越多(亦 即,改良之場因素(fleldfact〇r))。此可藉由減小透鏡大小、 二極體大小,較薄金屬化且塗覆多個金屬層來達成。 速度··縮短金屬線、改良導體^^對八丨且降低介電質 之k值將改良速度且減小功率消耗。 、 一里子效率··此為藉由使用將光帶進透鏡且將光傳輸至 一極體之新材料來改良效率之機會。 材料在彩色濾光片陣列之前沈積且以相對高之溫 六定其機械特性且與用於晶片構造巾之其他材料相 二光片沈積之後所沈積之材料必須以較低溫度 ’’、、c或以下溫度)完全固化。本發明之材料非常 47 200807705 24699pif 適合於在彩色濾光片陣列之上以及之下的應用。 、最大化量子效D射於魏上之歧㈣且 色濾光片且傳輸至裳置層中之二極體。目標為將到1 體之光的量最大化。舉例而言,直接在二極體上之匕二 要為透明的且傳輸最大量之光。圖1中材料100之側^6·9〇 g (0.284 mol) of municipal powder and a few moth crystals were added to a 1000 ml vessel, followed by 73.07 g (0.284 mol) of 9-bromophenanthrene. 90 ml of THF was added, and an exothermic reaction occurred after that. When the solution had returned to room temperature, 30 ml of THF was added and the solution was heated to 65. (: and was stirred all night., Allow the solution to cool to 5 〇 it, and 34.42 g (〇·285 m〇1) of allyl in the minute, turn the silk liquid gradually back to the red material is dripped in ~ After the addition, the solution was stirred for 2 hours at 65 c. The solution was cooled to room temperature and most of the THF was removed by direct mediation. 700 ml of DCM was added and the solution was moved to the separation funnel. The solution was rinsed twice with water of ML. 200807705 24699 pif The organic layer was collected and dried over anhydrous magnesium sulfate. The solution was filtered, and then solvent evaporated. The remaining material was purified by distillation. B p. lmi5t: / < 5 mbar. The yield was 54.5 g (88%). Allylphenanthrene (41.59 g, 〇·ΐ91 mol) was added to a 250 ml round bottom flask and heated to 9 〇t: Add %卟之10% H2PtCl6/IPA. The addition of HSiCl3 was started and the exothermic reaction was observed. The addition of hydrazine was slowly added during 40 minutes. After the addition, the amount of HSlCl3 was removed by vacuum when the stirring m was applied, and 1 〇〇 Methyl (97 g, 〇 914 m〇i) trimethyl ortho-acid I (tnmethyi orth () f () rmate) was added, followed by 5 mM of BmPCl was added as a catalyst. The solution was stirred at 7 Torr: 9 hr, and the product was purified by evaporation. Β·ρ. 172t: /<Q.5 mbar. Yield 5 〇g (based on 74% of the amount of allyl phenanthrene. Example 17 South refractive index polymer 1, phenanthrene-ethoxy ethoxylate (15 g, 44 mmol), acetone (22.5 g) = =·01Μ Η=1 (7 · 2 g ' _ mmd ) placed in _ mL of rb W ' and refluxed for 23 hours. Volatile under reduced pressure = compound (n.84g). Polymer in service A (, ^ ^ 》 privately. _ lower soft for training _ baice) 5 knives 4 miles 'then in the feeding range is 1 6680c:=, the refractive index is 632.8 鈇, and take 仏,, · The dielectric constant is 3.5 at 1 MHz. ♦ σ目For the 彳 有机 有机 有机 200 200 200 200 200 200 200 200 200 200 200 200 200 807 200 200 200 807 807 807 807 807 200 200 200 200 807 807 807 807 200 807 807 807 807 200 807 807 807 200 200 200 200 200 200 200 200 200 200 200 200 200 Prepared by the Grenner reaction between 9-bromophenanthrene, magnesium and tetraethoxydecane in the booklet, and acetone (i5〇〇g) by stirring until the solid limb dissolves. Subsequently, dilute nitric acid (0·01ΜHN〇3, 6.77 g, 0.38 mol) was added. The two phases (aqueous phase and organic phase) are separated. The system was refluxed until the solution became clear (about 15 minutes). Glycidyl xypropyltrimethoxysilane (3 〇〇g, 〇 〇 1 m〇i) was added and chilled for six hours. The volatiles were evaporated in a rotary evaporator until 25.00 g of polymer solution remained. N-propyl acetate vinegar (4) sinking) (32.50 g)" was added, and evaporation continued again until 27 g remained. Next, propanol-monomethylhydrazine-acetic acid vinegar (pr〇pylene galaxies 1 galvanic: ac_e, PGMEA) (3〇g) was added and evaporated again until 24.84 g as a viscous polymer . The amount of non-volatiles was measured to be 69.24 / 〇. Etoposide PGMEA (8.89 g) was added to give a solids content of about . The solution was heated in an oil bath (165 ° 〇 and refluxed for 4 hours ^ 2 = clock. The water formed during the reaction was removed from the PGMEA in the rotary evaporator until 18 g remained. More PGMEA (42 g) It is added so that the solution has a solid content of 22.16%. The polymer has Mn/Mw = 1,953/2,080 g/m〇I. The above results are infiltrated by the gel relative to the monodisperse polystyrene standard. The chromatograph was measured by 3〇200807705 24699pif (glycidyloxypropyitrimethoxysilane, GPC). Sample preparation: The above solution (9.67g) was PGMEA (5·33 g), surfactant (BYK-307 from BYK_Chemie, 4 mg) and Formulated with a cationic initiator (Rhodorsil 2074, 10 mg). It was spin-coated at 4 rpm on a wafer at 2,000 rpm. The film was soft baked at 130 ° C for 5 minutes at 200 ° C. The film was cured for 5 minutes. The film thickness after curing was 310 nm, and the refractive index was 1.66 at 632.8 nm, and the dielectric constant was 3.4 at 1 MHz. The film layer did not dissolve in acetone, which showed cross-linking ( Cross-linking) has been successful. Similarly, a more concentrated PGMEA solution (solids 25%) Prepared, spin coated and cured. The film layer was 830 nm thick and measured by nanoindentation (nan〇incientati〇n) with a modulus of 7.01 Gpa and a hardness of 0.41 GPa. Example 19 High refractive index polymer 3 Base)-1,1,4,4,4-pentamethoxy-, 4-dioxane (9.55§, 22.9 mmol), 9-# bis-ethoxylated (9.02 g, 26.5) Methyl) and SLSI grade acetone (14.0 g) were placed in a 250 ml rb flask with a Teflon coated magnetic stir bar. Distilled water (6.0 g, 333 mmol) was added and the system was refluxed for 15 min. Subsequently, 2 drops of diluted HC1 (3.7 w-%) were added dropwise. The solution became homogeneous within two minutes, which showed the progress of hydrolysis. A solution of 1_(9-phenanthryl)-1,1,4,4,4-pentamethoxy-1,4_bis-xanthene (11.45 g, 27.5 mmol) dissolved in acetone (16.0 g) was injected. This was followed by the addition of 0.01 M HCl solution (8.4 g, 466 mmol). Allow the reaction to reflux 14 200807705 24699 pif hours. After refluxing, all volatiles were removed in vacuo to yield 28.1 g of dry polymer as a colourless solid. It was thermally stabilized in argon up to 500 ° C by thermogravimetric analysis (TGA) (Fig. 2). The solid was diluted in n-butyl acetate (NBA) (73.06 g, 260%) and a surfactant (56 mg 'Byk-Chemle's BYK®-307). Alternatively, a solution of pr〇Pylene glycol monomethyl ether acetate (PGMEA, 240%) and methyl ethyl ketone (MEK, 400%) was also prepared. The NBA solution was filtered through a 〇·2 μ Teflon filter and spin-cast on a 4” Shi Xi wafer at 3000 rpm. Soft bake at 150 ° C for 5 minutes and soft bake at 200 t: 5 minutes, followed by curing in an n2 environment at 400. Under the crucible for 15 minutes to obtain a film having a refractive index of 1.6511 at 632·8 nm and a thickness of 683 nm. The dielectric constant of the film is at 1 MHz. 3.4. A film having a final thickness of up to 1850 nm is prepared and does not exhibit cracking characteristics. The film layer can be rubbed against organic solvents such as acetone without damage. Example 20 South Refractive Index Polymer 4 _ 3 (9-phenanthryl) propyl tridecyl oxide (g, 32.4 mmol), propionate (16. 5 g), and q qimHC1 were placed in a 100 ml rb flask, and: Ϊ, 16 hours. Initially, the solution was milky white, but β was broken shortly after the start of hydrolysis. When the polymerization proceeded further, the solution again became slightly mixed with 200,807,705, 24,699 pif turbid. The volatiles were removed by evaporation under reduced pressure to give a white colorless powder. · 6 〇g. The polymer is stable under argon up to 45 经由 by TGA 1. 3). The casting solution dissolves 2 〇 6g of polymer ' and (4) G. 2 μ of iron by 8.24 g of methyl ethyl hydrazine (4 %) and a surfactant (5 mg, byk, 3 〇 7 of Byk_Chemie) The fluorocarbon filter was filtered to prepare. The polymer was spin-washed on a 4" Shi Xi wafer at 3000 rpm. Soft bake for 5 minutes under i赃, then in the n2 environment. The curing was carried out for 5 minutes under c to obtain a film having a refractive index of l671ijfMi R 0 / ί Λ Π 1·671 at 632.8 nm and a thickness of 840 nm. The dielectric constant of the film layer is at! At 4 MHz, it is 3 4 . The film layer does not show rags. The film layer can be used without any exaggeration. Example 21 High refractive index polymer 5 9-phenanthryl triethoxylate (17 〇〇g, 〇〇5 _, dissolved in the lion until solids. Then add rare stone Xiao ^^ brain 3, 6.77^ .38111. 1). Two phases (aqueous phase and i 1 money reflux until the solution becomes clear (about 15 minutes)., water glycerol minus propyl trimethoxy number (3. (8) g, said coffee and the flask is refluxed for six hours. Volatile in Rotate § +. Cold liquid. N-propyl acetate (32.50 g) 娀 口 ' and continue evaporation again until 27 g remaining. Next, propylene glycol monomethyl 42 200807705 24699 pif ether acetate (30g) was added, and again Evaporation until 24 84 g remained as a viscous polymer. The amount of non-volatiles was measured to be 69.24%. More PGMEA (8.89 g) was added to give a solids content of about 5%. The solution was heated in an oil bath ( 165. and reflux for 4 hours and 2 minutes. The water formed during the reaction was removed from the PGMEA in the rotary evaporator until Μg remained. More PGMEA (42 g) was added to give the solution 22 • 16% solids content. The polymer has Mn/Mw = 1,953/2,080 g/md, and the above results are measured by GPC relative to the monodisperse polystyrene standard in THF. 14% of PGMEA solution Preparation and curing of the catalyst (〇·3%, Rhodorsil 2074 from Rhodia) and surfactant • 2%, from BYK_Chemie ΒΥΚ 307) was added. The material was spin-coated on a ruthenium wafer and cured at 200 C for 5 minutes. The film layer could be cleaned with acetone without damage and showed successful cure. Fourier transform infrared spectroscopy (FTIR) shows that the amount of stanol is very low (a wide peak at 3200 cnT1 to 3800 cnf1). If a curing catalyst is not used, the film will not cure and will be C. In addition, the peak value of stanol in FTIR is high. Example 22 Mixture of polymer 5 and rutile Ti〇2 nanoparticle Preparation of concentrate of polymer 5 and rutile Ti〇2 Nanoparticles (from the trade name 'ns〇l] 〇i-5K from NanoGmm, dissolved in 5% in Mek 43 200807705 24699pif) were formulated such that the polymer/particle mass ratio was changed from 3/1 to 1/3. A surfactant (from 307 of BYK_Chemie _307, 0.2%) and a cationic initiator (Rhodorsil 2074, 0.3%) were added to each sample. It was spin-coated on a 4 Å wafer at 2000 rpm. The film is at 130. Soft baking under the armpit The film thickness (Tx) and refractive index (RI) were summarized in Table 丨 for 5 minutes and at 2 。. The reference sample diluted with PGMEA was used to form a film layer having a thickness of about 400 nm. Table 1: Material mixing ratio 130〇C/5 130〇C/5 200〇C/5 200〇C/5 S% w/w min after min after min min after min Tx RI Tx RI polymer 5 (ref·) - 424 1.67 409 1.66 3.5 Polymer 5-Ή02 3-1 744 1.71 732 1.71 1.6 Polymer 5 - Ti〇2 1-1 322 1·76 313 1.77 2.8 Polymer 5-Ti〇2 1-3 177 1.85 170 1.86 4.0 As can be seen from Table 1, the RI of the material increases as the Ti02 load increases. It can also be seen that the shrinkage rate does not change significantly. Example 23 = Preparation of a mixture of Compound 3 and rutile Ti 2 Nanoparticles ♦ 5 Solution 3 (in 17% dissolved in MEK) in the same ratio as in Example 22 in a weight ratio of 1-2 Mix 5% Ti〇2 solution. The solution was evaporated back to a solids content of about 17%. The solution was spin-coated at 2 rpm, and 200807705 24699pif was then soft baked at 150+200 °C for 5+5 minutes and cured at 300 °C for 15 minutes. The results are shown in Table 2. Table 2: Material Mix Ratio 150+200°C 150+200°C 300°C/15 300°C/15 S% w/w / 5+5 min / 5+5 min min After min After Tx RI Tx RI Polymer 3 (ref·) · 846 1.66 822 1.65 2.8 Polymer 3 -Ti02 1-2 549 _ 511 1.85 7.0 As can be seen, the polymer-rutile Ti〇2 nanoparticles are 丨_2 At the ratio, the refractive index of the film layer is increased by 〇·2 units. Example 24 Preparation of a mixture of polymer 5 and anatase Ti 2 nanoparticles Polymer 5 was obtained at a solid ratio of ι_ι and i_3 with anatase Ti 2 nanoparticles (from Sumitomo under the trade name 'ZRM_001, , mixed with 12% in MEK). The film was baked at 2 〇〇 π for 5 minutes. List the results in Table _ 3. 45 200807705 24699pif Table 3: Material mixing ratio 130〇C/5 130〇C/5 200〇C/5 200〇C/5 w/w min after min after min min after polymer 5 (ref.) polymer 5 -Ή〇2 Polymer 5-Ti02 Μ 1-3 Tx 424 ΝΜ ΝΜ RI 1.67 ΝΜ ΝΜ Tx 409 910 591 RI 1.66 1,73 1.80 s% 3.5 As can be seen in Table 3, the refractive index of the film Increase with increasing anatase. ', 乂 All high refractive index polymers have also been tested for trench gap fills with trenches of 丨 (width) χ 4μηι (height). All polymers are in the ring ^ and are in the process. (: Excellent kinetics of gap filling after 5 minutes of squatting. Ears also found all high refractive index = 1-5 compatible with CMP (Chemical Mechanical Grinding). It has been found in conventional oxide CMp paste (4) ^ = Before CMP, the effect of additional higher temperature curing was first applied to the solid layer and then at 丄C to 450 C. When first at a lower temperature, the film was only partially cured ( That is,:)). Due to Lai, the polymer film is still light. "The above conditions are better when performing the oxide CMP process. The use of oxygen plasma is also compatible with the etch back process. When oxygen is applied When plasma: Reason - causes any change in reaction index, surface roughness II = 46 200807705 24699pif. It is worth noting that conventional high refractive index organic polymers cannot be used without damaging the surface quality of the film layer or changing the optical properties of the film layer. In the case of CMP and etch back. The new generation of CMOS image sensing that can be achieved by the chemical treatment mentioned above (Fig. 1) also has three important technical problems: device size, speed, power consumption, and quantum efficiency. Interpretation: 10 semiconductor substrates; 2 Photodiode; 3 f gold f-line, mter-iayer die- ties (ILD) and inter-metai dielectric (IMD) ·, 40 color enamel array re- (four) lens array; Filled with high aspect ratio (4) (10)) Photoelectric = bulk refractive index high refractive index siloxane polymer; 2 高 high refractive index siloxane polymer for color filter planarization and protection; and 3 〇〇 protection micro The lens of the helium oxide polymer. Device size: the smaller the pixel, the greater the number of pixels on the same area (ie, the improved field factor (fleldfact〇r)). This can be achieved by reducing the lens size, the diode Size, thinner metallization and coating of multiple metal layers to achieve. Speed · Shorten the metal wire, improve the conductor, and reduce the k value of the dielectric to improve the speed and reduce the power consumption. Efficiency · This is an opportunity to improve efficiency by using a new material that carries light into the lens and transmits the light to a polar body. The material is deposited before the color filter array and its mechanical properties are set at a relatively high temperature. And other materials used for wafer construction towels The material deposited after the deposition of the phase film must be fully cured at a lower temperature '', c or below). The material of the present invention is very strong. 47 200807705 24699pif Suitable for applications above and below color filter arrays Maximize the quantum effect D on the Wei (4) and the color filter and transmit it to the diode in the skirt layer. The goal is to maximize the amount of light to the body. For example, directly The second of the diodes is transparent and transmits the maximum amount of light. The side of the material 100 in Figure 1 ^

面由於折射而為光損失之來源,且減少反射至二極體G 光。簡易解決方案為沿側壁襯以反射塗層,但所述方式將 添加成本且將為非常難的。又,CVD金二、 ^減少光傳輸且最終在頂部因窄特徵而夹斷;1更 若材料100具有較用於形成緊接於其之壁的材料更^折 !严::最小化折射且更多光將被引導至二極體。因此: A屬化由形成用於先通道之側The surface is the source of light loss due to refraction and reduces reflection to the diode G light. A simple solution is to line the sidewall with a reflective coating, but the approach will add cost and will be very difficult. Moreover, the CVD gold II reduces the light transmission and eventually pinches off at the top due to the narrow features; 1 more if the material 100 has a more folded material than the material used to form the wall immediately adjacent thereto; strict: minimizes refraction and More light will be directed to the diode. Therefore: A generaization is formed by the side for the first channel

氧化物在⑽„m波長範圍内具有近似14 = CVD Π?道需要具有Μ.46之折射率以減少界面ϋ折 、 此基本上為將光傳輸至二極體之垂直波導。因 ^以具有高折射率之來自實例Μ之聚合物為基礎的 與鄰==,。2=。\。自此4,:膜且因此將在機械上 具有 低溫化,但其: 下所需之製程::=更“及 屬化縮,改良速度,因此通二置更小且金 办/ 慮先片以及透鏡之保護:在彩色濾光片陣列上之 48 200807705 24699pif 材料(圖1中2GG)為裝置效能之成本降低的另合。 來自實例18之聚合物使可見光可穿透又有效地阻。&曰 因此光保護彩色濾光片與二極體兩者以及作^ : 來自實例18之聚合物為極佳平坦化材料二鳟 層。聚合物亦匹配在彩色濾光片層盥撒# ^ 率,因此減少自膜層界面之反射。又層之間的折射 =被固化且’因此不引起對有機彩色:材: 【圖式簡單說明】 圖1展示CMOS影像感應器裝置 圖2展示高折射率聚合物3之熱解重旦1生剖面圖。 圖3展示高折射率聚合物4之熱解 圖4展示折射聚合物5 〇、 【主要场符號說明】 切圖。 20 30 40 50 10:半導體基底 光電二極體 =、層Γ:介電質以及金屬 衫色濾光片陣列層 貝 微透鏡陣列 10()填充高縱橫比光電二極體間 聚合物 體1隙之回折射率矽氣烷 2⑽用於彩色濾光片平 烷聚合物 化以及保邊之高折射率矽氣 300:保護微透鏡之石夕氧燒聚合物 49The oxide has approximately 14 = CVD in the (10) „m wavelength range. It is required to have a refractive index of Μ.46 to reduce interface collapse, which is basically a vertical waveguide that transmits light to the diode. The high refractive index of the polymer from the example Μ is based on the neighboring ==, .2 = .\. Since 4, the film and therefore will be mechanically low temperature, but its: the required process: = more "and the reduction of the genus, the speed of improvement, so the second set is smaller and the gold / care and lens protection: 48 200807705 24699pif material (2GG in Figure 1) on the color filter array for device performance The cost reduction is different. The polymer from Example 18 made visible light permeable and effectively blocked. &曰 Therefore, the photoprotective color filter and the diode are both as well as: The polymer from Example 18 is an excellent planarization material tantalum layer. The polymer also matches the color filter layer at the Caesar rate, thus reducing the reflection from the film interface. Refraction between layers = cured and 'so does not cause organic color: material: [Simple description of the diagram] Figure 1 shows a CMOS image sensor device Figure 2 shows a pyrolysis of a high refractive index polymer 3 . Figure 3 shows the pyrolysis of the high refractive index polymer 4. Figure 4 shows the refractive polymer 5 〇, [Key Field Symbol Description] Cutaway. 20 30 40 50 10: Semiconductor substrate photodiode =, layer germanium: dielectric and metal color filter array layer microlens array 10 () filled with high aspect ratio photodiode between polymer body 1 gap Refractive index 矽 alkane 2 (10) for color filter flattening polymerization and edge-retaining high refractive index helium 300: protection of microlens shixi oxygenated polymer 49

Claims (1)

200807705 24699pif 申請專利範圍: 1·一種半導體裝置,其包含·· 半導體基底; 夕個光電二極體,其配置於所述半導體基底中· 層 金屬線以及介電㈣,其麵述基紅作為内連線 二述内連線層界定在所述光電二極體處之孔徨; 第一聚合物’其填充間隙以覆蓋所述光電二^體. 片層,其相對於所述光電二極體配置於所 述間隙填充聚合物層上; 第二聚合物,其配置於所述内連線層上以 坦化且保護所述彩色濾光片層; 多個微透鏡,其相對於所述彩色濾光片 平坦化的第二聚合物上;以及 所、 微透合物層,其配置於所述微透鏡上以保護所述 其中至少一所述聚合物材料包含石夕氧燒聚合物。 、、_2.如巾請專娜圍第丨項所叙半導體裝置, 述二種聚合物材料之每—者為有機魏騎合物。- 3. 如申請專利範圍第1項所述之半導體襄置,1中裏 ==合物包含魏喊合物,·残^ f Sl-〇_Sl_以及·Si-(CH‘Si-基團,其中X為!或2的繁 數且y為介於1至2〇之間的整數。 一 4. 如中請專利範圍第3項所述之半導體裝置,盆中所 述三種聚合物皆包含魏綠合物,職錢綠^物具 50 200807705 24699pif 有-Si-O-Si-以及-Si_(CHx)y-Si·基團,其中x為1或2的整 數且y為介於1至20之間的整數。 正 5.如申請專利範圍第1至4項中任1所述之半導體 裝置,其中所述聚合物在632.8 nm或更高波長時具有大於 1.58之折射率。 /、 ;200807705 24699pif Patent Application Range: 1. A semiconductor device comprising: a semiconductor substrate; a photodiode disposed in the semiconductor substrate, a layer of metal lines and a dielectric (4), the surface of which is red Connecting the interconnecting layer to define an aperture at the photodiode; the first polymer 'fills the gap to cover the photodiode. The slice is opposite to the photodiode Disposed on the gap-filling polymer layer; a second polymer disposed on the interconnect layer to densify and protect the color filter layer; a plurality of microlenses relative to the color a second polymer on which the filter is flattened; and a micro-transparent layer disposed on the microlens to protect at least one of the polymer materials comprising a gas-oxygenated polymer. , _2. For the towel, please use the semiconductor device described in the article, and the two kinds of polymer materials are organic Weiqi compound. - 3. In the case of the semiconductor device described in the first paragraph of the patent application, 1 zhong == compound contains Wei shouting compound, · residual ^ f Sl-〇_Sl_ and · Si-(CH'Si-based a group, wherein X is a number of ! or 2 and y is an integer between 1 and 2 。. 4. The semiconductor device according to claim 3, wherein the three polymers in the basin are Containing Wei green compound, job money green ^ object 50 200807705 24699pif There are -Si-O-Si- and -Si_(CHx)y-Si· groups, where x is an integer of 1 or 2 and y is between 1 and 20 The semiconductor device according to any one of claims 1 to 4, wherein the polymer has a refractive index greater than 1.58 at a wavelength of 632.8 nm or higher. 6.如申請專利範圍第1至4項中任-項所述之半導體 裝置,其中所述聚合物在632.8 nm或更高波長時具有大於 1.65之折射率。 ’、 ; 7.如申請專利範圍第!至4項中任—酬述之半 裝置,其中所述聚合物在632.8 nm或更高波長時具有大於 1.60之折射率,以及具有4.0或更低之介電常數 8·如申請專利範圍第1至4項中任—項所述之雕 裝置,其中所述聚合物在632.8 nm或更高波長時具有大粗 1.60之折射率’以及具有3·5或更低之介電常數(1 ; 9·如申請專利範圍第1至4項中任一項所述之半導 裝置,其中所述聚合物在632.8 nm或更高波長時具有大於 1.60之折射率,以及具有高於4.0Gpa之揚氏模數'。 ; 10.如申請專利範圍第1項所述之半導體襄置,盆 述聚合物在180°c與450°c之間的溫度下被熱固化/、 11·如申請專利範圍第10項所述之半導體裝置,其中 所述聚合物藉由熱以及紫外線之組合來固化。 12·如申請專利範圍第10項所述之半導體裝置,其中 所述聚合物是先以熱固化’且隨後再以化學機械研磨^乍 一步處理。 51 200807705 24699pif 13. 如申請專利範圍第10項所述之半導體裝置,其中 所述聚合物是先以熱固化,且隨後再以乾式蝕刻電漿製程 進行I虫刻。 14. 如申請專利範圍第10至13項中任一項所述之半導 體裝置,其中所述聚合物經紫外線步驟處理。 15. 如申請專利範圍第10至13項中任一項所述之半導 體裝置,其中所述聚合物是先以熱固化,且隨後以化學機 械研磨作進一步處理,且隨後再受最終的熱或紫外線固化。 16. 如申請專利範圍第1項所述之半導體裝置,其中至 少一所述聚合物與彩色濾光片層或與微透鏡層在可見光波 長範圍内具有小於0.1之折射率差。 17. 如申請專利範圍第16項所述之半導體裝置,其中 至少一所述聚合物與彩色濾光片層或與微透鏡層在可見光 波長範圍内具有小於0.05之折射率差。 18. 如申請專利範圍第1項所述之半導體裝置,其中所 述第一聚合物具有較界定所述孔徑之所述材料高至少1% 之折射率。 19. 如申請專利範圍第18項所述之半導體裝置,其中 所述第一聚合物具有較界定所述孔徑之所述材料高至少 5%之折射率。 20. 如申請專利範圍第1項所述之半導體裝置,其中至 少一所述聚合物包含化學結構通式: 52 200807705 24699pif si -Si、 Ri^Si 反1 :t l為可水解基團; 有機基團或戶基團、反應性分裂基團、極化性減小 基、芳基、多=述物之組合,其包魏基、、块 夕^基團及含有機矽基團;且 3 ;、、、t接線性或分支 基或多環基團。刀支之-仏基*族基、聚芳族 Μ·如申明專利範圍第1項所述之 壯 述聚合物材料藉由加入奈米粒子而修飾之。衣置,其中所 聚合項所述之半導體裳置,其中 人,β 1伤之奈米粒子與10〇重量份 口物、、且口 Μ形成含奈米粒子之組合物。 切之永 聚合專利範圍第22項所述之半導體裝置,盆中 小口物疋以約5至〗⑽重 1 /、宁 聚合物組合,以形成 "'…4子/、100重量份之 24.如申請專利之組合物。 聚合物是簡叙半導财置,其中 物^入IV 重里知之奈米粒子與100重量份之 „由:主形成含奈米教子之組合物。 25·如申睛專利範圍第2J 所述奈米粒子為選自金屬、、&之半導體裝置,其中 物以及氮化物以及其混合物j合金、金屬氧化物、碳化6. The semiconductor device according to any one of claims 1 to 4 wherein the polymer has a refractive index greater than 1.65 at a wavelength of 632.8 nm or higher. ',; 7. If you apply for a patent scope! To a half-receiving device, wherein the polymer has a refractive index greater than 1.60 at a wavelength of 632.8 nm or higher, and a dielectric constant of 4.0 or lower. 8 as claimed in the patent application. The engraving apparatus of any one of the items, wherein the polymer has a refractive index of a large thick 1.60 at a wavelength of 632.8 nm or higher and a dielectric constant of 3.5 or less (1; 9; The semi-conductive device according to any one of claims 1 to 4, wherein the polymer has a refractive index greater than 1.60 at a wavelength of 632.8 nm or higher, and a Youngs with a height higher than 4.0 Gpa Modulus '. 10. The semiconductor device described in claim 1, the potted polymer is thermally cured at a temperature between 180 ° C and 450 ° C / 11 · as claimed in the patent scope The semiconductor device of claim 10, wherein the polymer is cured by a combination of heat and ultraviolet rays. The semiconductor device of claim 10, wherein the polymer is thermally cured first It is then treated by chemical mechanical polishing. 51 200807705 24699pi The semiconductor device according to claim 10, wherein the polymer is first thermally cured, and then subjected to a dry etching plasma process. The semiconductor device according to any one of the preceding claims, wherein the polymer is processed by the ultraviolet ray process. The semiconductor device according to any one of claims 10 to 13, wherein the polymer is first Thermally cured, and then further processed by chemical mechanical polishing, and then subjected to final heat or ultraviolet curing. 16. The semiconductor device according to claim 1, wherein at least one of the polymer and color filter The light sheet layer or the microlens layer has a refractive index difference of less than 0.1 in the visible light wavelength range. 17. The semiconductor device according to claim 16, wherein at least one of the polymer and the color filter layer or And a microlens layer having a refractive index difference of less than 0.05 in the visible light wavelength range. 18. The semiconductor device according to claim 1, wherein the first polymer has a boundary The semiconductor device of claim 18, wherein the first polymer has at least 5 higher than the material defining the aperture. The semiconductor device according to claim 1, wherein at least one of the polymers comprises a chemical structural formula: 52 200807705 24699pif si -Si, Ri^Si anti 1 : tl is hydrolyzable a group; an organic group or a group, a reactive cleavage group, a polarizing group, an aryl group, a combination of multiples, a group of a W-based group, a block group, and an organic group. And 3;,,, t telecommunication or branched or polycyclic groups. The scutellaria-mercapto group, polyaromatic Μ 如 如 如 如 如 如 如 如 如 如 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物 聚合物The device, wherein the semiconductor according to the polymerization item is placed, wherein the human, the β 1 injured nanoparticle and the 10 Å by weight of the mouthpiece, and the sputum form a composition containing the nanoparticle. In the semiconductor device according to Item 22 of the patent application, the small-sized substance in the pot is combined with about 5 to 10 (10) and the polymer is combined to form "'...4/100 parts by weight. Such as the patented composition. The polymer is a simple semi-conducting material, in which the material is incorporated into the IV nanoparticle and 100 parts by weight of the composition of the nano-teacher. The invention is as described in claim 2 The rice particles are semiconductor devices selected from the group consisting of metals, &<RTIgt;
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