Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powerchip Semiconductor CorpfiledCriticalPowerchip Semiconductor Corp
Priority to TW95127687ApriorityCriticalpatent/TWI301438B/en
Publication of TW200806426ApublicationCriticalpatent/TW200806426A/en
Application grantedgrantedCritical
Publication of TWI301438BpublicationCriticalpatent/TWI301438B/en
Disclosed is a polishing pad and fabrication method thereof. The polishing pad comprises a viewing window embedded in the polishing pad body, wherein the viewing window is chemically bonded with the polishing pad body. The fabrication method comprises placing an uncured polymer gel in a mold and then injecting a polishing pad material in the mold. During molding of the polishing pad, the polymer gel is cured and chemically bonded with the polishing pad.
TW95127687A2006-07-282006-07-28Polishing pad and fabrication method thereof
TWI301438B
(en)
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device