TW200802574A - Method of minimizing delamination of a layer - Google Patents
Method of minimizing delamination of a layerInfo
- Publication number
- TW200802574A TW200802574A TW096109431A TW96109431A TW200802574A TW 200802574 A TW200802574 A TW 200802574A TW 096109431 A TW096109431 A TW 096109431A TW 96109431 A TW96109431 A TW 96109431A TW 200802574 A TW200802574 A TW 200802574A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- corner
- angle
- slanted edge
- degrees
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
A method of minimizing delamination of a layer (14, 16, or 18), the method includes providing a semiconductor substrate (12), forming a first layer (14) over the semiconductor substrate, wherein the first layer has a first corner (20) and the first corner has a first angle of approximately 90 degrees; forming a second layer (16) over the first layer, wherein the second layer has a second corner (20) and the second corner has a second angle of approximately 90 degrees, and modifying the first and second corners to form a first slanted edge (50, 60, or 70) of the second layer, wherein the first slanted edge and the second slanted edge are continuous with each other and the first slanted edge forms a third angle with respect to the semiconductor substrate, wherein the third angle is less than 30 degrees.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2006/004034 WO2007107176A1 (en) | 2006-03-17 | 2006-03-17 | Method of reducing risk of delamination of a layer of a semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200802574A true TW200802574A (en) | 2008-01-01 |
Family
ID=37499349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096109431A TW200802574A (en) | 2006-03-17 | 2007-03-19 | Method of minimizing delamination of a layer |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200802574A (en) |
WO (1) | WO2007107176A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110875241A (en) * | 2018-08-29 | 2020-03-10 | 台湾积体电路制造股份有限公司 | Method for forming a semiconductor-on-insulator (SOI) substrate |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2213415A1 (en) * | 2009-01-29 | 2010-08-04 | S.O.I. TEC Silicon | Device for polishing the edge of a semiconductor substrate |
JP7018873B2 (en) | 2016-05-27 | 2022-02-14 | 浜松ホトニクス株式会社 | Fabry-Perot Interference Filter Manufacturing Method |
JP6341959B2 (en) | 2016-05-27 | 2018-06-13 | 浜松ホトニクス株式会社 | Manufacturing method of Fabry-Perot interference filter |
CN109477958A (en) * | 2016-08-24 | 2019-03-15 | 浜松光子学株式会社 | Fabry-Perot interference optical filter |
KR102299845B1 (en) * | 2016-08-24 | 2021-09-09 | 하마마츠 포토닉스 가부시키가이샤 | Fabry-Perot interference filter |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59188921A (en) * | 1983-04-12 | 1984-10-26 | Nec Corp | Manufacture of dielectric isolation substrate |
JP2001044147A (en) * | 1999-08-04 | 2001-02-16 | Mitsubishi Materials Silicon Corp | Method of forming beveled surface of semiconductor wafer |
US6328641B1 (en) * | 2000-02-01 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for polishing an outer edge ring on a semiconductor wafer |
KR100789205B1 (en) * | 2000-03-29 | 2007-12-31 | 신에쯔 한도타이 가부시키가이샤 | Production method for silicon wafer and soi wafer, and soi wafer |
US6936546B2 (en) * | 2002-04-26 | 2005-08-30 | Accretech Usa, Inc. | Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
DE10220647C1 (en) * | 2002-05-08 | 2003-08-21 | Infineon Technologies Ag | Semiconductor wafer peripheral edge shaping method has material removed from peripheral edge of wafer until surface layer applied to inner part of one of its major surfaces is reached |
JP2006093402A (en) * | 2004-09-24 | 2006-04-06 | Fujitsu Ltd | Method for manufacturing semiconductor device |
-
2006
- 2006-03-17 WO PCT/EP2006/004034 patent/WO2007107176A1/en active Application Filing
-
2007
- 2007-03-19 TW TW096109431A patent/TW200802574A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110875241A (en) * | 2018-08-29 | 2020-03-10 | 台湾积体电路制造股份有限公司 | Method for forming a semiconductor-on-insulator (SOI) substrate |
TWI754161B (en) * | 2018-08-29 | 2022-02-01 | 台灣積體電路製造股份有限公司 | A semiconductor-on-insulator (soi) substrate and method for forming the same |
CN110875241B (en) * | 2018-08-29 | 2023-09-19 | 台湾积体电路制造股份有限公司 | Method for forming a semiconductor-on-insulator (SOI) substrate |
Also Published As
Publication number | Publication date |
---|---|
WO2007107176A1 (en) | 2007-09-27 |
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