TW200801904A - Vented computer chassis - Google Patents

Vented computer chassis

Info

Publication number
TW200801904A
TW200801904A TW095145717A TW95145717A TW200801904A TW 200801904 A TW200801904 A TW 200801904A TW 095145717 A TW095145717 A TW 095145717A TW 95145717 A TW95145717 A TW 95145717A TW 200801904 A TW200801904 A TW 200801904A
Authority
TW
Taiwan
Prior art keywords
air
chambers
computer chassis
chassis
vented
Prior art date
Application number
TW095145717A
Other languages
Chinese (zh)
Other versions
TWI388970B (en
Inventor
Barry A Wagner
Don Le
William P Tsu
Original Assignee
Nvidia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nvidia Corp filed Critical Nvidia Corp
Publication of TW200801904A publication Critical patent/TW200801904A/en
Application granted granted Critical
Publication of TWI388970B publication Critical patent/TWI388970B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention pertains to a computer chassis with airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition, The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.
TW095145717A 2005-12-09 2006-12-07 Vented computer chassis TWI388970B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/299,056 US7885062B2 (en) 2005-12-09 2005-12-09 Computer chassis with partitions for improved airflow

Publications (2)

Publication Number Publication Date
TW200801904A true TW200801904A (en) 2008-01-01
TWI388970B TWI388970B (en) 2013-03-11

Family

ID=38139045

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145717A TWI388970B (en) 2005-12-09 2006-12-07 Vented computer chassis

Country Status (3)

Country Link
US (1) US7885062B2 (en)
CN (1) CN1983114B (en)
TW (1) TWI388970B (en)

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CN107636562B (en) * 2015-08-21 2021-05-18 可赛尔内存股份有限公司 Forced and natural convection liquid cooling device for personal computer
US10143107B1 (en) * 2015-12-14 2018-11-27 EMC IP Holding Company LLC Altitude-based adaptive cooling of a computing device
CN205864936U (en) * 2016-07-11 2017-01-04 番禺得意精密电子工业有限公司 Radiating structure for electronic equipment
JP6891600B2 (en) * 2017-03-31 2021-06-18 富士通株式会社 Information processing device
TWI652981B (en) * 2018-03-19 2019-03-01 緯穎科技服務股份有限公司 Host system and its heat sink and separation mechanism
US10709036B2 (en) * 2018-09-11 2020-07-07 Quanta Computer Inc. Removable PSU dedicated tunnel for air flow mechanism
CN109634391B (en) * 2018-12-20 2022-08-16 威创集团股份有限公司 Heat dissipation device
US10459498B1 (en) * 2019-01-06 2019-10-29 Corsair Memory, Inc. Heat dissipation in a three chamber chassis of a personal computer
EP3912441A1 (en) * 2019-01-18 2021-11-24 BITZER Electronics A/S Heat transfer assembly and power electronics device
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US10645832B1 (en) 2019-05-02 2020-05-05 Apple Inc. Computer tower architecture
US11812585B2 (en) * 2020-12-22 2023-11-07 Cisco Technology, Inc. Rack-mountable heat-exchanger for modular electronic systems
CN214122874U (en) * 2021-01-28 2021-09-03 益德电子科技（杭州）有限公司 Air-cooling heat dissipation structure of computer mainframe
CN113012727B (en) * 2021-03-18 2022-07-08 山东英信计算机技术有限公司 Hard disk cooling device and server
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Also Published As

Publication number Publication date
TWI388970B (en) 2013-03-11
CN1983114A (en) 2007-06-20
US7885062B2 (en) 2011-02-08
CN1983114B (en) 2013-03-20
US20070133167A1 (en) 2007-06-14

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