TW200801251A - Horizontal electroplating and electro-deposition method on a substrate - Google Patents
Horizontal electroplating and electro-deposition method on a substrateInfo
- Publication number
- TW200801251A TW200801251A TW95121500A TW95121500A TW200801251A TW 200801251 A TW200801251 A TW 200801251A TW 95121500 A TW95121500 A TW 95121500A TW 95121500 A TW95121500 A TW 95121500A TW 200801251 A TW200801251 A TW 200801251A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- electro
- electrode
- deposition method
- stop plates
- Prior art date
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
A horizontal electroplating and electro-deposition method on a substrate comprise a set of stop plates, a first electrode, a second electrode, a reuse system. When the substrate is positioned to a predetermined position. The stop plates encloses the substrate and the first electrode is arranged to be in contact with the substrate and the second electrode is positioned above the substrate. Then the electroplating or electro-deposition liquid is filled into the space enclosed by the stop plates and the liquid is recycled through the reuse system slowly. The present invention is suitable for color filter dyes, dyes, or conductive photo-resistance treatments.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95121500A TWI342346B (en) | 2006-06-15 | 2006-06-15 | Horizontal electroplating and electro-deposition method on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95121500A TWI342346B (en) | 2006-06-15 | 2006-06-15 | Horizontal electroplating and electro-deposition method on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200801251A true TW200801251A (en) | 2008-01-01 |
TWI342346B TWI342346B (en) | 2011-05-21 |
Family
ID=44764992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95121500A TWI342346B (en) | 2006-06-15 | 2006-06-15 | Horizontal electroplating and electro-deposition method on a substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI342346B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI460315B (en) * | 2012-10-26 | 2014-11-11 | Songtex Technology Company Ltd | Panel to panel horizontal continue plating line |
CN108342756A (en) * | 2017-01-24 | 2018-07-31 | 廖智良 | On multilager base plate horizontal plating electricity and electroless plating method |
CN109537035A (en) * | 2018-12-26 | 2019-03-29 | 安徽宏实自动化装备有限公司 | The Wafer electroplating device of piece leaf horizontal feed formula |
-
2006
- 2006-06-15 TW TW95121500A patent/TWI342346B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI460315B (en) * | 2012-10-26 | 2014-11-11 | Songtex Technology Company Ltd | Panel to panel horizontal continue plating line |
CN108342756A (en) * | 2017-01-24 | 2018-07-31 | 廖智良 | On multilager base plate horizontal plating electricity and electroless plating method |
CN109537035A (en) * | 2018-12-26 | 2019-03-29 | 安徽宏实自动化装备有限公司 | The Wafer electroplating device of piece leaf horizontal feed formula |
Also Published As
Publication number | Publication date |
---|---|
TWI342346B (en) | 2011-05-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |