TW200745974A - Selection method and system for virtual metrology prediction model for quality control in semiconductor manufacture - Google Patents
Selection method and system for virtual metrology prediction model for quality control in semiconductor manufactureInfo
- Publication number
- TW200745974A TW200745974A TW095120606A TW95120606A TW200745974A TW 200745974 A TW200745974 A TW 200745974A TW 095120606 A TW095120606 A TW 095120606A TW 95120606 A TW95120606 A TW 95120606A TW 200745974 A TW200745974 A TW 200745974A
- Authority
- TW
- Taiwan
- Prior art keywords
- virtual metrology
- prediction model
- quality control
- selection method
- semiconductor manufacture
- Prior art date
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A selection method for virtual metrology prediction model for quality control in semiconductor manufacture. Historical process data for a tool is first retrieved. The historical process data is analyzed to generate data groups with the tool been maintained. A plurality of virtual metrology prediction models are generated according to the data groups and are merged to a virtual metrology model management and selection system of a virtual metrology engine. The first process data after the tool is re-maintained and implements a process to a wafer. A best virtual metrology prediction model is selected according to the first process data to predict the wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120606A TW200745974A (en) | 2006-06-09 | 2006-06-09 | Selection method and system for virtual metrology prediction model for quality control in semiconductor manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095120606A TW200745974A (en) | 2006-06-09 | 2006-06-09 | Selection method and system for virtual metrology prediction model for quality control in semiconductor manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200745974A true TW200745974A (en) | 2007-12-16 |
Family
ID=57914559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095120606A TW200745974A (en) | 2006-06-09 | 2006-06-09 | Selection method and system for virtual metrology prediction model for quality control in semiconductor manufacture |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200745974A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101976045A (en) * | 2010-08-25 | 2011-02-16 | 江苏大学 | Panel quality virtual measurement method and system for TFT-LCD etching process |
US20110202160A1 (en) * | 2010-02-16 | 2011-08-18 | James Moyne | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
TWI399660B (en) * | 2008-07-09 | 2013-06-21 | Inotera Memories Inc | A method of detecting variance by regression model |
TWI412906B (en) * | 2010-04-13 | 2013-10-21 | Univ Nat Cheng Kung | Manufacturing execution system with virtual-metrology capabilities and manufacturing system including the same |
-
2006
- 2006-06-09 TW TW095120606A patent/TW200745974A/en unknown
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI399660B (en) * | 2008-07-09 | 2013-06-21 | Inotera Memories Inc | A method of detecting variance by regression model |
US20110202160A1 (en) * | 2010-02-16 | 2011-08-18 | James Moyne | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
CN102763048A (en) * | 2010-02-16 | 2012-10-31 | 应用材料公司 | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
US9002492B2 (en) * | 2010-02-16 | 2015-04-07 | Applied Materials, Inc. | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
TWI509550B (en) * | 2010-02-16 | 2015-11-21 | Applied Materials Inc | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
US9886009B2 (en) | 2010-02-16 | 2018-02-06 | Applied Materials, Inc. | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
US10409231B2 (en) | 2010-02-16 | 2019-09-10 | Applied Materials, Inc. | Methods and apparatuses for utilizing adaptive predictive algorithms and determining when to use the adaptive predictive algorithms for virtual metrology |
TWI412906B (en) * | 2010-04-13 | 2013-10-21 | Univ Nat Cheng Kung | Manufacturing execution system with virtual-metrology capabilities and manufacturing system including the same |
US8983644B2 (en) | 2010-04-13 | 2015-03-17 | National Cheng Kung University | Manufacturing execution system with virtual-metrology capabilities and manufacturing system including the same |
CN101976045A (en) * | 2010-08-25 | 2011-02-16 | 江苏大学 | Panel quality virtual measurement method and system for TFT-LCD etching process |
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