TW200743422A - High-speed signal transmission structure having parallely disposed and serially connected vias - Google Patents

High-speed signal transmission structure having parallely disposed and serially connected vias

Info

Publication number
TW200743422A
TW200743422A TW095117087A TW95117087A TW200743422A TW 200743422 A TW200743422 A TW 200743422A TW 095117087 A TW095117087 A TW 095117087A TW 95117087 A TW95117087 A TW 95117087A TW 200743422 A TW200743422 A TW 200743422A
Authority
TW
Taiwan
Prior art keywords
signal transmission
circuit board
serially connected
speed signal
vias
Prior art date
Application number
TW095117087A
Other languages
Chinese (zh)
Other versions
TWI291316B (en
Inventor
Yen-Hao Chen
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW95117087A priority Critical patent/TWI291316B/en
Publication of TW200743422A publication Critical patent/TW200743422A/en
Application granted granted Critical
Publication of TWI291316B publication Critical patent/TWI291316B/en

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A high-speed signal transmission structure having parallelly disposed and serially connected vias is disclosed. The structure is applicable to a multi-layered circuit board such as a high-speed digital circuit board for forming a high-speed signal transmission circuit on the high-speed digital circuit board. The structure includes a pair of parallelly disposed and serially connected vias for connecting an upper conductive circuit installed on an upper layer of the multi-layered circuit board and a lower conductive circuit installed on a lower layer of the multi-layered circuit board. Compared with the prior art, an open stub formed by the remaining portion of the vias has become shorter, thereby reducing a resonant effect affecting the quality of signal transmission.
TW95117087A 2006-05-15 2006-05-15 High-speed signal transmission structure having parallely disposed and serially connected vias TWI291316B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95117087A TWI291316B (en) 2006-05-15 2006-05-15 High-speed signal transmission structure having parallely disposed and serially connected vias

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95117087A TWI291316B (en) 2006-05-15 2006-05-15 High-speed signal transmission structure having parallely disposed and serially connected vias

Publications (2)

Publication Number Publication Date
TW200743422A true TW200743422A (en) 2007-11-16
TWI291316B TWI291316B (en) 2007-12-11

Family

ID=39460501

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95117087A TWI291316B (en) 2006-05-15 2006-05-15 High-speed signal transmission structure having parallely disposed and serially connected vias

Country Status (1)

Country Link
TW (1) TWI291316B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103841755A (en) * 2012-11-26 2014-06-04 鸿富锦精密工业（深圳）有限公司 Method for reducing via stub and printing circuit board designed by using the method
CN107846780A (en) * 2017-11-01 2018-03-27 郑州云海信息技术有限公司 A kind of method of the cabling in pcb board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8432821B2 (en) 2008-10-02 2013-04-30 Qualcomm Incorporated Method and apparatus for cooperation strategy selection in a wireless communication system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103841755A (en) * 2012-11-26 2014-06-04 鸿富锦精密工业（深圳）有限公司 Method for reducing via stub and printing circuit board designed by using the method
CN107846780A (en) * 2017-11-01 2018-03-27 郑州云海信息技术有限公司 A kind of method of the cabling in pcb board
CN107846780B (en) * 2017-11-01 2020-06-16 苏州浪潮智能科技有限公司 Method for wiring in PCB

Also Published As

Publication number Publication date
TWI291316B (en) 2007-12-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees