TW200743167A - Semiconductor test circuit structure and method of testing semiconductor circuit - Google Patents
Semiconductor test circuit structure and method of testing semiconductor circuitInfo
- Publication number
- TW200743167A TW200743167A TW095115934A TW95115934A TW200743167A TW 200743167 A TW200743167 A TW 200743167A TW 095115934 A TW095115934 A TW 095115934A TW 95115934 A TW95115934 A TW 95115934A TW 200743167 A TW200743167 A TW 200743167A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor
- circuit
- circuit structure
- test circuit
- testing
- Prior art date
Links
Abstract
The invention relates to a test circuit structure and a method for monitoring openings and shorts of conductive wires formed in a semiconductor manufacturing process. The test circuit structure has a circuit environment like twist conductive lines, combed-shape conductive lines or conductive line arrays, isolation, and/or semi-isolation areas to effectively monitor opening or shorts in a semiconductor circuit having a similar circuit environment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115934A TWI288452B (en) | 2006-05-04 | 2006-05-04 | Semiconductor test circuit structure and method of testing semiconductor circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95115934A TWI288452B (en) | 2006-05-04 | 2006-05-04 | Semiconductor test circuit structure and method of testing semiconductor circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI288452B TWI288452B (en) | 2007-10-11 |
TW200743167A true TW200743167A (en) | 2007-11-16 |
Family
ID=39203024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95115934A TWI288452B (en) | 2006-05-04 | 2006-05-04 | Semiconductor test circuit structure and method of testing semiconductor circuit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI288452B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367323A (en) * | 2012-03-31 | 2013-10-23 | 中芯国际集成电路制造(上海)有限公司 | Detection layout structure and detection method |
TWI722509B (en) * | 2018-11-20 | 2021-03-21 | 南亞科技股份有限公司 | Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device |
TWI826263B (en) * | 2022-12-04 | 2023-12-11 | 南亞科技股份有限公司 | Test element group for metal routing layer and manufacturing method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10381278B2 (en) * | 2017-09-14 | 2019-08-13 | Powertech Technology Inc. | Testing method of packaging process and packaging structure |
-
2006
- 2006-05-04 TW TW95115934A patent/TWI288452B/en active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367323A (en) * | 2012-03-31 | 2013-10-23 | 中芯国际集成电路制造(上海)有限公司 | Detection layout structure and detection method |
CN103367323B (en) * | 2012-03-31 | 2015-12-16 | 中芯国际集成电路制造(上海)有限公司 | Detect domain structure and detection method |
TWI722509B (en) * | 2018-11-20 | 2021-03-21 | 南亞科技股份有限公司 | Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device |
US11164800B2 (en) | 2018-11-20 | 2021-11-02 | Nanya Technology Corporation | Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device |
TWI826263B (en) * | 2022-12-04 | 2023-12-11 | 南亞科技股份有限公司 | Test element group for metal routing layer and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI288452B (en) | 2007-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201144836A (en) | Method for testing through-silicon-via and the circuit thereof | |
TW200717677A (en) | Semiconductor apparatus testing arrangement and semiconductor apparatus testing method | |
TW200625587A (en) | Semiconductor structure comprising a stress sensitive element and method of measuring a stress in a semiconductor structure | |
TW200618244A (en) | Semiconductor device and manufacturing method of the same | |
TW200718305A (en) | Lead pin, circuit, semiconductor device, and method of forming lead pin | |
TW200739972A (en) | Light-emitting device and method for manufacturing the same | |
WO2010008959A3 (en) | Dc test resource sharing for electronic device testing | |
TW200727458A (en) | Programmable resistive RAM and manufacturing method | |
WO2006121529A3 (en) | Method and apparatus for incorporating block redundancy in a memory array | |
TW200729411A (en) | Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same | |
TW200739086A (en) | Space transformer, manufacturing method of the space transformer and probe card having the space transformer | |
TW200617553A (en) | Array substrate and method of manufacturing the same | |
TW200729400A (en) | Method and structure of forming an interconnect including a dielectric cap having a tensile stress | |
ZA200904524B (en) | Electrical measuring device, method and computer program product | |
WO2007109460A3 (en) | Method for distinguishing a first group of wires from other wires of a multi-wire cable, test connector for use in this method and a kit comprising such a multiwire cable and test connector | |
GB2486357A (en) | Semiconductor device having a copper plug | |
TW200743167A (en) | Semiconductor test circuit structure and method of testing semiconductor circuit | |
EP1918989A4 (en) | Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure | |
TWI373116B (en) | Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire | |
TW200734650A (en) | Probe card | |
TW200709316A (en) | Substrate and testing method thereof | |
TW200746238A (en) | Method and apparatus for indicating directionality in integrated circuit manufacturing | |
WO2007112137A3 (en) | Electrical connector devices and methods of employing same | |
AT503172B8 (en) | ELECTRICAL INSTALLATION ARRANGEMENT, AND METHOD FOR OPERATING AN ELECTRICAL INSTALLATION ARRANGEMENT | |
EP2028502A4 (en) | Semiconductor defect analysis device, defect analysis method, and defect analysis program |