TW200743167A - Semiconductor test circuit structure and method of testing semiconductor circuit - Google Patents

Semiconductor test circuit structure and method of testing semiconductor circuit

Info

Publication number
TW200743167A
TW200743167A TW095115934A TW95115934A TW200743167A TW 200743167 A TW200743167 A TW 200743167A TW 095115934 A TW095115934 A TW 095115934A TW 95115934 A TW95115934 A TW 95115934A TW 200743167 A TW200743167 A TW 200743167A
Authority
TW
Taiwan
Prior art keywords
semiconductor
circuit
circuit structure
test circuit
testing
Prior art date
Application number
TW095115934A
Other languages
Chinese (zh)
Other versions
TWI288452B (en
Inventor
Chien-Chang Huang
Yi-Nan Chen
Ping Hsu
Original Assignee
Nanya Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanya Technology Corp filed Critical Nanya Technology Corp
Priority to TW95115934A priority Critical patent/TWI288452B/en
Application granted granted Critical
Publication of TWI288452B publication Critical patent/TWI288452B/en
Publication of TW200743167A publication Critical patent/TW200743167A/en

Links

Abstract

The invention relates to a test circuit structure and a method for monitoring openings and shorts of conductive wires formed in a semiconductor manufacturing process. The test circuit structure has a circuit environment like twist conductive lines, combed-shape conductive lines or conductive line arrays, isolation, and/or semi-isolation areas to effectively monitor opening or shorts in a semiconductor circuit having a similar circuit environment.
TW95115934A 2006-05-04 2006-05-04 Semiconductor test circuit structure and method of testing semiconductor circuit TWI288452B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95115934A TWI288452B (en) 2006-05-04 2006-05-04 Semiconductor test circuit structure and method of testing semiconductor circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95115934A TWI288452B (en) 2006-05-04 2006-05-04 Semiconductor test circuit structure and method of testing semiconductor circuit

Publications (2)

Publication Number Publication Date
TWI288452B TWI288452B (en) 2007-10-11
TW200743167A true TW200743167A (en) 2007-11-16

Family

ID=39203024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95115934A TWI288452B (en) 2006-05-04 2006-05-04 Semiconductor test circuit structure and method of testing semiconductor circuit

Country Status (1)

Country Link
TW (1) TWI288452B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367323A (en) * 2012-03-31 2013-10-23 中芯国际集成电路制造(上海)有限公司 Detection layout structure and detection method
TWI722509B (en) * 2018-11-20 2021-03-21 南亞科技股份有限公司 Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device
TWI826263B (en) * 2022-12-04 2023-12-11 南亞科技股份有限公司 Test element group for metal routing layer and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10381278B2 (en) * 2017-09-14 2019-08-13 Powertech Technology Inc. Testing method of packaging process and packaging structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103367323A (en) * 2012-03-31 2013-10-23 中芯国际集成电路制造(上海)有限公司 Detection layout structure and detection method
CN103367323B (en) * 2012-03-31 2015-12-16 中芯国际集成电路制造(上海)有限公司 Detect domain structure and detection method
TWI722509B (en) * 2018-11-20 2021-03-21 南亞科技股份有限公司 Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device
US11164800B2 (en) 2018-11-20 2021-11-02 Nanya Technology Corporation Test structure, semiconductor device and method for obtaining fabricating information in semiconductor device
TWI826263B (en) * 2022-12-04 2023-12-11 南亞科技股份有限公司 Test element group for metal routing layer and manufacturing method thereof

Also Published As

Publication number Publication date
TWI288452B (en) 2007-10-11

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