TW200742761A - Slurry and method for chemical mechanical polishing - Google Patents

Slurry and method for chemical mechanical polishing

Info

Publication number
TW200742761A
TW200742761A TW096102175A TW96102175A TW200742761A TW 200742761 A TW200742761 A TW 200742761A TW 096102175 A TW096102175 A TW 096102175A TW 96102175 A TW96102175 A TW 96102175A TW 200742761 A TW200742761 A TW 200742761A
Authority
TW
Taiwan
Prior art keywords
slurry
mechanical polishing
chemical mechanical
viscosity
cps
Prior art date
Application number
TW096102175A
Other languages
Chinese (zh)
Other versions
TWI350306B (en
Inventor
Yong-Soo Choi
Jae-Gon Choi
Gyu-Hyun Kim
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW200742761A publication Critical patent/TW200742761A/en
Application granted granted Critical
Publication of TWI350306B publication Critical patent/TWI350306B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Geology (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A chemical mechanical polishing slurry, contains an abrasive dispersed in deionized water and an organic viscosity modifier added to adjust the viscosity of the slurry to within a range of 0.5 to 3.2 cps.
TW096102175A 2006-05-12 2007-01-19 Slurry and method for chemical mechanical polishing TWI350306B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20060043128 2006-05-12
KR1020060062212A KR100842742B1 (en) 2006-05-12 2006-07-03 Slurry and method for chemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW200742761A true TW200742761A (en) 2007-11-16
TWI350306B TWI350306B (en) 2011-10-11

Family

ID=38897873

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102175A TWI350306B (en) 2006-05-12 2007-01-19 Slurry and method for chemical mechanical polishing

Country Status (3)

Country Link
KR (1) KR100842742B1 (en)
CN (2) CN101070453A (en)
TW (1) TWI350306B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110120342A (en) * 2019-05-10 2019-08-13 珠海格力电器股份有限公司 Semiconductor technology, the production method of semiconductor devices and semiconductor devices
CN115724590A (en) * 2021-08-31 2023-03-03 广东艾檬电子科技有限公司 Mask structure, etching method and glass structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768401B2 (en) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry

Also Published As

Publication number Publication date
CN102618172A (en) 2012-08-01
KR20070109753A (en) 2007-11-15
CN101070453A (en) 2007-11-14
KR100842742B1 (en) 2008-07-01
TWI350306B (en) 2011-10-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees