TW200741929A - Device and method for embedded testing and test device for embedding in scribe line on wafer - Google Patents

Device and method for embedded testing and test device for embedding in scribe line on wafer

Info

Publication number
TW200741929A
TW200741929A TW095114660A TW95114660A TW200741929A TW 200741929 A TW200741929 A TW 200741929A TW 095114660 A TW095114660 A TW 095114660A TW 95114660 A TW95114660 A TW 95114660A TW 200741929 A TW200741929 A TW 200741929A
Authority
TW
Taiwan
Prior art keywords
testing
wafer
digitizer
embedded
scribe line
Prior art date
Application number
TW095114660A
Other languages
Chinese (zh)
Other versions
TWI303091B (en
Inventor
Ying-Lieh Chen
Lin-Kai Bu
Original Assignee
Himax Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Tech Ltd filed Critical Himax Tech Ltd
Priority to TW95114660A priority Critical patent/TWI303091B/en
Publication of TW200741929A publication Critical patent/TW200741929A/en
Application granted granted Critical
Publication of TWI303091B publication Critical patent/TWI303091B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A device and method for embedded testing and test device for embedding in scribe line on wafer are disclosed. The device is used for testing at least one IC on wafer. And the testing device is used for converting outputs of several IC chips into digital codes. The embedded testing device includes a digitizer and a testing platform. And the testing device which is embedded in scribe line on wafer includes a digitizer. The digitizer which is embedded in wafer is electrically connected with the output of the IC is used for translating the output value into the digital code. A testing platform which is electrically connected with the output of the digitizer is used for providing at least one testing pattern to the IC. Besides, a platform is used for receiving the digital code from the digitizer. After received the digital code, the platform also verified the digital code.
TW95114660A 2006-04-25 2006-04-25 Device and method for embedded test ing and test device for embedding in scribe line on wafer TWI303091B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95114660A TWI303091B (en) 2006-04-25 2006-04-25 Device and method for embedded test ing and test device for embedding in scribe line on wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95114660A TWI303091B (en) 2006-04-25 2006-04-25 Device and method for embedded test ing and test device for embedding in scribe line on wafer

Publications (2)

Publication Number Publication Date
TW200741929A true TW200741929A (en) 2007-11-01
TWI303091B TWI303091B (en) 2008-11-11

Family

ID=45070631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95114660A TWI303091B (en) 2006-04-25 2006-04-25 Device and method for embedded test ing and test device for embedding in scribe line on wafer

Country Status (1)

Country Link
TW (1) TWI303091B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395952B (en) * 2008-05-21 2013-05-11 Advantest Corp Testing wafer unit and test system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395952B (en) * 2008-05-21 2013-05-11 Advantest Corp Testing wafer unit and test system

Also Published As

Publication number Publication date
TWI303091B (en) 2008-11-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees