TW200741551A - Method for simulating dissipation temperature of heat sink - Google Patents

Method for simulating dissipation temperature of heat sink

Info

Publication number
TW200741551A
TW200741551A TW095115016A TW95115016A TW200741551A TW 200741551 A TW200741551 A TW 200741551A TW 095115016 A TW095115016 A TW 095115016A TW 95115016 A TW95115016 A TW 95115016A TW 200741551 A TW200741551 A TW 200741551A
Authority
TW
Taiwan
Prior art keywords
heat sink
temperature
simulating
heat
dissipation temperature
Prior art date
Application number
TW095115016A
Other languages
Chinese (zh)
Inventor
Paul Wang
Original Assignee
Mitac Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Int Corp filed Critical Mitac Int Corp
Priority to TW095115016A priority Critical patent/TW200741551A/en
Publication of TW200741551A publication Critical patent/TW200741551A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a method for simulating dissipation temperature of heat sink, which includes configuring a heat sink with at least a sub-thermal resistance in accordance with its shape and structure; summing up the sub-thermal resistances to obtain a total thermal resistance; multiplying the total thermal resistance with a maximal heat capacity radiated from the heat source to obtain temperature of a heat source; and adding the temperature of the heat source by a default inlet temperature of surrounding gas that enters the heat sink so as to obtain a simulation dissipation temperature of the heat sink.
TW095115016A 2006-04-27 2006-04-27 Method for simulating dissipation temperature of heat sink TW200741551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095115016A TW200741551A (en) 2006-04-27 2006-04-27 Method for simulating dissipation temperature of heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095115016A TW200741551A (en) 2006-04-27 2006-04-27 Method for simulating dissipation temperature of heat sink

Publications (1)

Publication Number Publication Date
TW200741551A true TW200741551A (en) 2007-11-01

Family

ID=57914047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115016A TW200741551A (en) 2006-04-27 2006-04-27 Method for simulating dissipation temperature of heat sink

Country Status (1)

Country Link
TW (1) TW200741551A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349519A (en) * 2013-08-05 2015-02-11 鸿富锦精密工业（深圳）有限公司 Electric heating piece assembly and circuit board test device using electric heating piece assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104349519A (en) * 2013-08-05 2015-02-11 鸿富锦精密工业（深圳）有限公司 Electric heating piece assembly and circuit board test device using electric heating piece assembly

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